TWI683581B - Headphone structure capable of extending and improving resonance - Google Patents

Headphone structure capable of extending and improving resonance Download PDF

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Publication number
TWI683581B
TWI683581B TW107142760A TW107142760A TWI683581B TW I683581 B TWI683581 B TW I683581B TW 107142760 A TW107142760 A TW 107142760A TW 107142760 A TW107142760 A TW 107142760A TW I683581 B TWI683581 B TW I683581B
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Taiwan
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cover
main body
earphone structure
fixing member
space
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TW107142760A
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Chinese (zh)
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TW202021373A (en
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韓泰生
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艾維克科技股份有限公司
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Abstract

本發明提供一種可延伸並提升共振之耳機結構，包括有一主體及及一蓋體及一罩體，該主體具有一容置部及設置有一單體喇叭，且該主體於容置部貫穿有複數主導音孔及複數側導音孔，另該蓋體與該主體間形成有一後腔空間，而該罩體形成有一後腔延伸空間連通所述側導音孔及後腔空間，，藉此，所述耳機結構可透過其後腔延伸空間連通後腔空間而降低空氣阻尼，以達到使單體喇叭衝程位移提升且降低空氣抑制聲音之功效者。 The invention provides an earphone structure capable of extending and enhancing resonance, comprising a main body, a cover body and a cover body, the main body has an accommodating part and a single speaker, and the main body has pluralities penetrating through the accommodating part A main sound hole and a plurality of side sound guide holes, and a rear cavity space is formed between the cover body and the main body, and the cover body forms a rear cavity extension space communicating with the side sound guide holes and the rear cavity space, thereby, The earphone structure can communicate with the rear cavity space through the rear cavity extension space to reduce the air damping, so as to achieve the effect of increasing the stroke displacement of the single speaker and reducing the air suppression sound.

Description

可延伸並提升共振之耳機結構 Headphone structure capable of extending and improving resonance

本發明係有關於一種可延伸並提升共振之耳機結構。 The invention relates to an earphone structure that can extend and enhance resonance.

按，隨著科技的進步下，人們越來越習慣利用如手機、平板電腦等行動裝置收聽音樂或觀看影片，而為了讓使用者在不干擾他人的環境下收聽音樂或觀看影片，耳機儼然已成為個人行動裝置的必要配件，而目前市面上的耳機主要區分有耳罩式耳機、耳掛式耳機及耳塞(道)式耳機，而目前一般耳機主要結構包括有外殼及單體及前罩體，而其中單體係設置於所述外殼內，而前罩體則設置於外殼一側且用以貼附耳部，一般而言，單體的直徑越大，耳機的性能越出色，而在上述的各種耳機之中則以耳罩式耳機的驅動單元的直徑最大，耳塞式耳機和入耳式耳機的驅動單元的直徑最小，另外，耳機內之容腔空間也是性能之重點之一，而目前耳機主要是利用外殼之容腔空間來讓單體產生振幅且使聲音反射，但耳機在設計上因有外型及體積上之限制，所以外殼之容腔空間尺寸有限且使空氣對單體壓縮阻力大，相對造成單體振幅衝程位移幅度小且空氣對聲音之抑制增加，也因此無法傳遞最完整之音效及聽覺感受。 With the advancement of technology, people are more and more accustomed to using mobile devices such as mobile phones and tablets to listen to music or watch videos. In order to allow users to listen to music or watch videos without interfering with others, headphones have become Become a necessary accessory for personal mobile devices, and the earphones currently on the market are mainly divided into over-ear earphones, ear-hook earphones and earplug (channel) earphones, and the current main structure of general earphones includes a shell and a single body and a front cover , And the single system is set in the shell, and the front cover is set on the side of the shell and is used to attach the ear. In general, the larger the diameter of the monomer, the better the performance of the headset. Among the various earphones, the diameter of the driving unit of the earmuff earphone is the largest, the diameter of the driving unit of the earbud earphone and the in-ear earphone is the smallest. In addition, the volume of the cavity in the earphone is also one of the key performance points. The main purpose is to use the space of the housing to allow the monomer to generate amplitude and reflect the sound, but the design of the earphone has limitations in appearance and volume, so the space of the housing in the housing is limited in size and allows air to compress resistance to the monomer Large, relatively small amplitude displacement displacement of the amplitude of the monomer and air suppression of sound increase, so it can not deliver the most complete sound effects and auditory experience.

故，如何將上述缺失問題加以改進，乃為本案創作人所欲解決之技術困難點之所在。 Therefore, how to improve the above-mentioned missing problems is the technical difficulty of the creator of this case.

爰此，為有效解決上述之問題，本發明之主要目的在提供一種降低空氣阻尼，以使單體衝程位移提升且降低空氣抑制聲音之可延伸並提升共振之耳機結構。 Secondly, in order to effectively solve the above-mentioned problems, the main object of the present invention is to provide an earphone structure which can reduce the air damping, so as to increase the displacement of the single stroke and reduce the air suppression sound, which can be extended and enhance the resonance.

根據本發明之目的，本發明提供一種可延伸並提升共振之耳機結構，該耳機結構係包括有一主體及一蓋體及一罩體，其中所述主體於一側邊位置處形成有一容置部，該容置部內設置有一單體喇叭，且該主體於容置部內形成有複數主導音孔，並該主體於容置部外側邊位置處形成有複數側導音孔，而該蓋體係設置於所述主體後側邊位置處，且該蓋體與該主體間形成有一後腔空間連通所述側導音孔，另該罩體具有相互連接之一外環部及一內環部組設所述主體前側，又該罩體於內環部間形成有一前腔空間及外環部及內環部間形成有一後腔延伸空間，該後腔延伸空間係連通所述側導音孔及後腔空間，，藉此，所述耳機結構可透過其後腔延伸空間連通後腔空間而降低空氣阻尼，以達到使單體喇叭衝程位移提升且降低空氣抑制聲音之功效者。 According to the purpose of the present invention, the present invention provides an earphone structure that can extend and enhance resonance. The earphone structure includes a main body, a cover, and a cover, wherein the main body has an accommodating portion formed at one side , A single speaker is arranged in the accommodating part, and the main body is formed with a plurality of main sound holes in the accommodating part, and the main body is formed with a plurality of side sound guide holes at the outer side of the accommodating part, and the cover system is provided At the position of the rear side of the main body, a back cavity space is formed between the cover body and the main body to communicate with the side sound guide hole, and the cover body has an outer ring portion and an inner ring portion connected to each other The front side of the main body, and the cover body forms a front cavity space between the inner ring portion and a rear cavity extension space between the outer ring portion and the inner ring portion, the rear cavity extension space communicates with the side sound guide hole and the rear Cavity space, whereby the earphone structure can communicate with the rear cavity space through its rear cavity extension space to reduce air damping, so as to achieve the effect of increasing the stroke displacement of the single speaker and reducing the air suppression sound.

根據本發明耳機結構之一實施例，其中所述主體於兩側邊分別形成有至少一罩卡部及一蓋卡部。 According to an embodiment of the earphone structure of the present invention, the main body is formed with at least one cover card portion and a cover card portion on both sides.

根據本發明耳機結構之一實施例，其中所述主導音孔係形成於所述容置部內且相對應於所述單體喇叭，而該等側導音孔係間隔環繞形成於所述容置部外。 According to an embodiment of the earphone structure of the present invention, wherein the main sound hole is formed in the accommodating portion and corresponds to the single speaker, and the side sound holes are formed in the accommodating space at intervals Outside the ministry.

根據本發明耳機結構之一實施例，其中所述內環部端緣形成 有一內環卡部，而該外環部端緣形成有一外環卡部，並該內環卡部與外環卡部係與罩卡部相互組設且固定該罩體於主體前側。 According to an embodiment of the earphone structure of the present invention, wherein the end edge of the inner ring is formed An inner ring clamping portion is formed, and an outer ring clamping portion is formed at an end edge of the outer ring portion, and the inner ring clamping portion and the outer ring clamping portion are mutually assembled with the cover clamping portion and fix the cover body to the front side of the main body.

根據本發明耳機結構之一實施例，其中所述蓋體端緣係與該蓋卡部相互組設且固定於主體後側。 According to an embodiment of the earphone structure of the present invention, the end edge of the cover body and the cover card portion are mutually assembled and fixed to the rear side of the main body.

根據本發明耳機結構之一實施例，其中所述主體係由一前固定件及一後固定件所組成。 According to an embodiment of the earphone structure of the present invention, the main system is composed of a front fixing member and a rear fixing member.

根據本發明耳機結構之一實施例，其中所述前固定件一側邊形成有所述罩卡部，並該前固定件相對罩卡部另一側位置處形成有複數凸部，及該前固定件貫穿有所述側導音孔。 According to an embodiment of the earphone structure of the present invention, wherein the front fixing member is formed with a cover clamping portion on one side, and the front fixing member is formed with a plurality of convex portions at a position opposite to the other side of the cover clamping portion, and the front The fixing member penetrates the side sound guide hole.

根據本發明耳機結構之一實施例，其中所述後固定件一側邊形成有所述容置部及所述蓋卡部，並該後固定件貫穿有複數孔洞及所述側導音孔。 According to an embodiment of the earphone structure of the present invention, the accommodating portion and the cover card portion are formed on one side of the rear fixing member, and the rear fixing member penetrates a plurality of holes and the side sound guide holes.

1‧‧‧耳機結構 1‧‧‧Headphone structure

2‧‧‧主體 2‧‧‧Main

21‧‧‧容置部 21‧‧‧Accommodation Department

22‧‧‧單體喇叭 22‧‧‧Single speaker

23‧‧‧主導音孔 23‧‧‧ dominant sound hole

24‧‧‧側導音孔 24‧‧‧Side sound hole

25‧‧‧罩卡部 25‧‧‧ Cover Card Department

26‧‧‧蓋卡部 26‧‧‧ Cover Card Department

27‧‧‧前固定件 27‧‧‧Front fixing

271‧‧‧凸部 271‧‧‧Convex

28‧‧‧後固定件 28‧‧‧Post fixing

281‧‧‧孔洞 281‧‧‧hole

3‧‧‧蓋體 3‧‧‧cover

31‧‧‧後腔空間 31‧‧‧Back space

4‧‧‧罩體 4‧‧‧ Cover

41‧‧‧外環部 41‧‧‧Outer Ring Department

411‧‧‧外環卡部 411‧‧‧Outer Ring Card Department

42‧‧‧內環部 42‧‧‧Inner Ring

421‧‧‧內環卡部 421‧‧‧Inner Ring Card Department

43‧‧‧前腔空間 43‧‧‧Front cavity space

44‧‧‧後腔延伸空間 44‧‧‧Extended space of back cavity

第1圖係本發明耳機結構之立體組合示意圖。 Figure 1 is a three-dimensional schematic diagram of the earphone structure of the present invention.

第2圖係本發明耳機結構之立體分解示意圖。 FIG. 2 is a three-dimensional exploded view of the earphone structure of the present invention.

第3圖係本發明耳機結構之立體剖視示意圖。 FIG. 3 is a schematic cross-sectional schematic view of the earphone structure of the present invention.

第4圖係本發明耳機結構之另一角度平面剖視示意圖。 FIG. 4 is a schematic cross-sectional schematic view of another angle of the earphone structure of the present invention.

第5圖係本發明耳機結構之實施示意圖。 Fig. 5 is a schematic diagram of the implementation of the earphone structure of the present invention.

第6圖係本發明耳機結構之另一立體分解示意圖。 FIG. 6 is another schematic exploded view of the earphone structure of the present invention.

第7圖係本發明耳機結構之又一立體分解示意圖。 FIG. 7 is another schematic exploded view of the earphone structure of the present invention.

請參閱第1圖至第4圖所示，係為本發明耳機結構之立體組合示意圖及立體分解示意圖及立體剖視示意圖及另一角度平面剖視示意圖，由圖中可清楚看出，其中所述耳機結構1係包括有一主體2及一蓋體3及一罩體4，其中所述主體2於後側邊位置處凸出形成有一容置部21，且該主體2於容置部21內設置有一單體喇叭22，又該主體2貫穿有複數主導音孔23及複數側導音孔24，所述主導音孔23係形成於所述容置部21內且相對應於所述單體喇叭22，而該等側導音孔24係間隔環繞形成於所述容置部21外，另該主體2於前側邊及後側邊分別形成有至少一罩卡部25及至少一蓋卡部26。 Please refer to FIGS. 1 to 4 for the stereo combination schematic diagram, the stereo exploded schematic diagram and the stereo cross-sectional schematic diagram of the earphone structure of the present invention, and the schematic cross-sectional schematic diagram at another angle. The earphone structure 1 includes a main body 2, a cover 3 and a cover 4, wherein the main body 2 protrudes at the rear side to form an accommodating portion 21, and the main body 2 is inside the accommodating portion 21 A single speaker 22 is provided, and the main body 2 penetrates a plurality of main sound holes 23 and a plurality of side sound guide holes 24. The main sound holes 23 are formed in the accommodating portion 21 and correspond to the monomer The speaker 22, and the side sound guide holes 24 are formed around the accommodating portion 21 at intervals, and the main body 2 is formed with at least one cover card portion 25 and at least one cover card on the front side and the rear side respectively部26.

其中該蓋體3係設置於所述主體2後側且與該主體2間形成有一後腔空間31，該後腔空間31係連通所述側導音孔24，又該蓋體3端緣係與該蓋卡部26相互組設且固定於主體2後側。 The cover 3 is disposed on the rear side of the main body 2 and forms a rear cavity space 31 with the main body 2, the rear cavity space 31 communicates with the side sound guide hole 24, and the end edge of the cover 3 is connected The cover part 26 is mutually assembled and fixed to the rear side of the main body 2.

其中該罩體4係設置於所述主體2前側邊位置處，該罩體4係可為塑膠射出或真空成形或熱壓成形，其材質可為橡膠、矽膠、塑膠、泡棉、皮革或織品組成物等材質所成形，且該罩體4具有一外環部41及一內環部42，並該罩體4於所述內環部42間形成有一前腔空間43，又該罩體4於該外環部41與該內環部42係相互連接且之間形成有一後腔延伸空間44，該後腔延伸空間44相對連通所述側導音孔24，且該內環部42端緣形成有一內環卡部421，而該外環部41端緣形成有一外環卡部411，並該內環卡部421與外環卡部411係與罩卡部25相互組設且固定該罩體4於主體2前側。 The cover 4 is disposed at the front side of the main body 2. The cover 4 can be plastic injection or vacuum forming or hot pressing, and the material can be rubber, silicone, plastic, foam, leather or The fabric composition and other materials are formed, and the cover body 4 has an outer ring portion 41 and an inner ring portion 42, and the cover body 4 forms a front cavity space 43 between the inner ring portions 42, and the cover body 4 A rear cavity extending space 44 is formed between the outer ring portion 41 and the inner ring portion 42, the rear cavity extending space 44 relatively communicates with the side sound guide hole 24, and the end of the inner ring portion 42 An inner ring clamping portion 421 is formed at the edge, and an outer ring clamping portion 411 is formed at the end edge of the outer ring portion 41, and the inner ring clamping portion 421 and the outer ring clamping portion 411 and the cover clamping portion 25 are mutually assembled and fixed The cover 4 is on the front side of the main body 2.

再請同時參閱前述附圖及第5圖所示，係為本發明耳機結構之實施示意圖，其中所述耳機結構1之後腔空間31係連通所述側導音孔24及連通所述後腔延伸空間44，使該耳機結構1可增加其整體之腔體空間，而在該腔體空間增加之同時，可使該耳機結構1內之空氣壓縮阻力變小，而當該單體喇叭22收到音源且產生振動時，可有效提升該單體喇叭22之衝程位移，更同時在該腔體空間增加之狀況下，該耳機結構1內之空氣可減少對聲音之抑制，進而達到該耳機結構1可有效傳遞最完整之音效及聽覺感受之功效者。 Please also refer to the aforementioned drawings and FIG. 5 for an implementation schematic diagram of the earphone structure of the present invention, wherein the rear cavity space 31 of the earphone structure 1 communicates with the side sound guide hole 24 and extends with the rear cavity The space 44 allows the earphone structure 1 to increase its overall cavity space, and at the same time as the cavity space increases, the air compression resistance in the earphone structure 1 can be reduced, and when the single speaker 22 receives When the sound source generates vibration, it can effectively increase the stroke displacement of the single speaker 22, and at the same time, under the condition that the cavity space increases, the air in the earphone structure 1 can reduce the suppression of sound, and then reach the earphone structure 1 Those who can effectively deliver the most complete sound effects and hearing experience.

再請同時參閱前述附圖及第6圖及第7圖所示，係為本發明耳機結構之另一立體分解示意圖及又一立體分解示意圖，其中所述耳機結構1之主體2係可由一前固定件27及一後固定件28所組成，其中所述前固定件27一側邊形成有所述罩卡部25，並該前固定件27相對罩卡部25另一側位置處形成有複數凸部271，及該前固定件27貫穿有所述側導音孔24，而該後固定件28一側邊形成有所述容置部21及所述蓋卡部26，並該後固定件28貫穿有複數孔洞281及所述側導音孔24，其中所述前固定件27係設置所述後固定件28之前側，且該前固定件27之凸部271係與該後固定件28之孔洞281相互組設，及該前固定件27之側導音孔24係與後固定件28之側導音孔24相互連通設置，而該罩體4係設置於所述前固定件27前側邊位置處，且由該後腔延伸空間44相對連通所述側導音孔24，並該內環卡部421與外環卡部411係與罩卡部25相互組設且固定該罩體4於主體2前側，另該蓋體3係設置於所述後固定件28後側且與該後固定件28間形成有所述後腔 空間31，該後腔空間31係連通所述側導音孔24，又該蓋體3端緣係與該蓋卡部26相互組設且固定於主體2後側，以使該後腔延伸空間44連通所述側導音孔24及後腔空間31，使該耳機結構1可增加其整體之腔體空間，而在該腔體空間增加之同時，可使該耳機結構1內之空氣壓縮阻力變小，而當該單體喇叭22收到音源且產生振動時，可有效提升該單體喇叭22之衝程位移，更同時在該腔體空間增加之狀況下，該耳機結構1內之空氣可減少對聲音之抑制，進而達到該耳機結構1可有效傳遞最完整之音效及聽覺感受之功效者。 Please also refer to the aforementioned drawings and the figures 6 and 7 at the same time, which is another three-dimensional exploded schematic diagram and another three-dimensional exploded schematic diagram of the earphone structure of the present invention, wherein the main body 2 of the earphone structure 1 can be The fixing member 27 and a rear fixing member 28 are formed, wherein the front fixing member 27 is formed with the cover clamping portion 25 on one side, and the front fixing member 27 is formed with a plurality of positions on the other side of the cover clamping portion 25 The convex portion 271 and the front fixing member 27 penetrate the side sound guide hole 24, and the rear fixing member 28 is formed with the accommodating portion 21 and the cover card portion 26 on one side, and the rear fixing member 28 has a plurality of holes 281 and the side sound guide holes 24, wherein the front fixing member 27 is provided on the front side of the rear fixing member 28, and the convex portion 271 of the front fixing member 27 is connected to the rear fixing member 28 The holes 281 are arranged with each other, and the side sound guide holes 24 of the front fixing member 27 and the side sound guide holes 24 of the rear fixing member 28 are in communication with each other, and the cover 4 is provided in front of the front fixing member 27 At the side, and the rear cavity extending space 44 relatively communicates with the side sound guide hole 24, and the inner ring clamping portion 421 and the outer ring clamping portion 411 and the cover clamping portion 25 are mutually assembled and fix the cover body 4 On the front side of the main body 2, the cover 3 is disposed on the rear side of the rear fixing member 28 and forms the rear cavity with the rear fixing member 28 The space 31, the rear cavity space 31 communicates with the side sound-guiding hole 24, and the end edge of the cover body 3 and the cover card portion 26 are mutually assembled and fixed to the rear side of the main body 2, so that the rear cavity extends space 44 communicates with the side sound guide hole 24 and the rear cavity space 31, so that the earphone structure 1 can increase its overall cavity space, and as the cavity space increases, the air compression resistance in the earphone structure 1 can be made Becomes smaller, and when the single speaker 22 receives a sound source and generates vibration, it can effectively increase the stroke displacement of the single speaker 22, and at the same time, the air in the earphone structure 1 can increase under the condition that the cavity space increases The suppression of sound is reduced to achieve the effect that the earphone structure 1 can effectively transmit the most complete sound effect and auditory experience.

再請同時參閱前述附圖及第7圖所示，係為本發明耳機結構1之又一立體分解示意圖，其中所述前固定件27另可與該罩體4相互一體雙料射出成形，使該前固定件27之側導音孔24係與後固定件28之側導音孔24相互連通設置，另該蓋體3係設置於所述後固定件28後側且與該後固定件28間形成有所述後腔空間31，該後腔空間31係連通所述側導音孔24，以使該後腔延伸空間44連通所述側導音孔24及後腔空間31，進而達到該耳機結構1可有效傳遞最完整之音效及聽覺感受之功效者。 Please also refer to the foregoing drawings and FIG. 7 for another three-dimensional exploded schematic view of the earphone structure 1 of the present invention, wherein the front fixing member 27 and the cover body 4 can also be integrally injection molded with each other to make the The side sound-guiding holes 24 of the front fixing member 27 and the side sound-guiding holes 24 of the rear fixing member 28 are communicated with each other, and the cover 3 is arranged behind the rear fixing member 28 and between the rear fixing member 28 The rear cavity space 31 is formed, and the rear cavity space 31 communicates with the side sound guide hole 24 so that the rear cavity extension space 44 communicates with the side sound guide hole 24 and the rear cavity space 31 to further reach the earphone Structure 1 can effectively deliver the most complete sound effect and the effect of hearing experience.

需陳明者，以上所述僅為本案之較佳實施例，並非用以限制本發明，若依本發明之構想所作之改變，在不脫離本發明精神範圍內，例如：對於構形或佈置型態加以變換，對於各種變化，修飾與應用，所產生等效作用，均應包含於本案之權利範圍內，合予陳明。 To be clear, the above is only the preferred embodiment of this case, not intended to limit the present invention. If the changes made according to the concept of the present invention do not deviate from the spirit of the present invention, for example: for configuration or arrangement The form is transformed, and the equivalent effects of various changes, modifications and applications should be included in the scope of the rights of this case, and it should be given to Chen Ming.

1‧‧‧耳機結構 1‧‧‧Headphone structure

2‧‧‧主體 2‧‧‧Main

21‧‧‧容置部 21‧‧‧Accommodation Department

22‧‧‧單體喇叭 22‧‧‧Single speaker

23‧‧‧主導音孔 23‧‧‧ dominant sound hole

24‧‧‧側導音孔 24‧‧‧Side sound hole

25‧‧‧罩卡部 25‧‧‧ Cover Card Department

26‧‧‧蓋卡部 26‧‧‧ Cover Card Department

3‧‧‧蓋體 3‧‧‧cover

31‧‧‧後腔空間 31‧‧‧Back space

4‧‧‧罩體 4‧‧‧ Cover

41‧‧‧外環部 41‧‧‧Outer Ring Department

411‧‧‧外環卡部 411‧‧‧Outer Ring Card Department

42‧‧‧內環部 42‧‧‧Inner Ring

421‧‧‧內環卡部 421‧‧‧Inner Ring Card Department

43‧‧‧前腔空間 43‧‧‧Front cavity space

44‧‧‧後腔延伸空間 44‧‧‧Extended space of back cavity

Claims (8)

一種可延伸並提升共振之耳機結構，係包括：一主體，該主體一側邊形成有一容置部，該容置部內設置有一單體喇叭，並該主體貫穿有至少一主導音孔及至少一側導音孔；一蓋體，該蓋體係設置於所述主體後側且與該主體間形成有一後腔空間，該後腔空間連通所述側導音孔；一罩體，該罩體係設置於所述主體前側，並該罩體具有相互連接之一外環部及一內環部，且該罩體於內環部間形成有一前腔空間，並該外環部與該內環部間形成有一後腔延伸空間連通所述側導音孔及後腔延伸空間。 An earphone structure capable of extending and enhancing resonance includes: a main body, an accommodating portion is formed on one side of the main body, a single speaker is provided in the accommodating portion, and the main body penetrates at least one dominant sound hole and at least one Side sound hole; a cover body, the cover system is provided on the rear side of the main body and a rear cavity space is formed with the main body, the rear cavity space communicates with the side sound guide hole; a cover body, the cover system is provided On the front side of the main body, the cover body has an outer ring portion and an inner ring portion connected to each other, and the cover body forms a front cavity space between the inner ring portions, and between the outer ring portion and the inner ring portion A rear cavity extension space is formed to communicate with the side sound guide hole and the rear cavity extension space. 如申請專利範圍第1項所述之可延伸並提升共振之耳機結構，其中所述主體於兩側邊分別形成有至少一罩卡部及至少一蓋卡部。 The earphone structure that can extend and enhance resonance as described in Item 1 of the patent application scope, wherein the main body is formed with at least one cover card portion and at least one cover card portion on both sides. 如申請專利範圍第1項所述之可延伸並提升共振之耳機結構，其中所述主導音孔係形成於所述容置部內且相對應於所述單體喇叭，而該等側導音孔係間隔環繞形成於所述容置部外。 An earphone structure that can extend and enhance resonance as described in item 1 of the patent scope, wherein the dominant sound hole is formed in the accommodating portion and corresponds to the single speaker, and the side sound holes A series is formed around the accommodating part around the space. 如申請專利範圍第2項所述之可延伸並提升共振之耳機結構，其中所述內環部端緣形成有一內環卡部，而該外環部端緣形成有一外環卡部，並該內環卡部與外環卡部係與罩卡部相互組設且固定該罩體於主體前側。 An earphone structure that can extend and enhance resonance as described in item 2 of the patent application scope, wherein an inner ring clamping portion is formed at the end edge of the inner ring portion, and an outer ring clamping portion is formed at the end edge of the outer ring portion, and the The inner ring clamping portion and the outer ring clamping portion are mutually assembled with the cover clamping portion and fix the cover body to the front side of the main body. 如申請專利範圍第2項所述之可延伸並提升共振之耳機結構，其中所述蓋體端緣係與該蓋卡部相互組設且固定於主體後側，並該後腔空間係連通所述側導音孔。 The earphone structure that can extend and enhance resonance as described in item 2 of the patent application scope, wherein the end edge of the cover body and the cover card portion are mutually assembled and fixed to the rear side of the main body, and the rear cavity space is connected to the Describe the side sound hole. 如申請專利範圍第2項所述之可延伸並提升共振之耳機結構，其中所述主體係由一前固定件及一後固定件所組成。 The earphone structure that can extend and enhance resonance as described in item 2 of the patent application scope, wherein the main system is composed of a front fixing member and a rear fixing member. 如申請專利範圍第6項所述之可延伸並提升共振之耳機結構，其中所述前固定件一側邊形成有所述罩卡部，並該前固定件相對罩卡部另一側位置處形成有複數凸部，及該前固定件貫穿有所述側導音孔。 The earphone structure capable of extending and enhancing resonance as described in Item 6 of the patent application scope, wherein the front fixing member is formed with the cover clamping portion on one side, and the front fixing member is located at a position opposite to the other side of the cover clamping portion A plurality of convex portions are formed, and the front fixing member penetrates the side sound guide hole. 如申請專利範圍第6項所述之可延伸並提升共振之耳機結構，其中所述後固定件一側邊形成有所述容置部及所述蓋卡部，並該後固定件貫穿有複數孔洞及所述側導音孔。 The earphone structure capable of extending and enhancing resonance as described in Item 6 of the patent application scope, wherein the accommodating portion and the cover card portion are formed on one side of the rear fixing member, and a plurality of the rear fixing member penetrates The hole and the side sound guide hole.
TW107142760A 2018-11-29 2018-11-29 Headphone structure capable of extending and improving resonance TWI683581B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103313162A (en) * 2013-06-26 2013-09-18 青岛歌尔声学科技有限公司 Dual-speaker headphone
CN203423786U (en) * 2013-08-26 2014-02-05 郁志曰 Earphone with front damping baffle plate
TWI528839B (en) * 2013-06-03 2016-04-01 Jian-Quan Pan Multi-channel headphones for changing sound fields
TWM525597U (en) * 2015-12-14 2016-07-11 Tian-Lai Huang Multi-track stereo earphone structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI528839B (en) * 2013-06-03 2016-04-01 Jian-Quan Pan Multi-channel headphones for changing sound fields
CN103313162A (en) * 2013-06-26 2013-09-18 青岛歌尔声学科技有限公司 Dual-speaker headphone
CN203423786U (en) * 2013-08-26 2014-02-05 郁志曰 Earphone with front damping baffle plate
TWM525597U (en) * 2015-12-14 2016-07-11 Tian-Lai Huang Multi-track stereo earphone structure

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