TWI678816B - 發光元件封裝基座結構 - Google Patents
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Abstract
一種發光元件封裝結構,包括承載基座、發光晶片、透光單元以及擋壁。承載基座具有承載面以及圍繞承載面的外表面。發光晶片配置於承載面,並電性連接於承載基座。透光單元配置於承載基座,且透光單元具有至少一貫穿孔。擋壁配置於承載基座與透光單元之間並圍繞發光晶片,擋壁、透光單元與承載基座之間形成密閉容置空間。發光晶片位於密閉容置空間內,且擋壁具有遠離密閉容置空間的側面。側面與外表面之間具有間距,貫穿孔對應於側面與外表面之間。
Description
本發明是有關於一種封裝基座結構,尤其是有關於一種發光元件的封裝基座結構。
一般的發光元件都需要經封裝後形成單個顆粒後,再應用到各個不同的領域上,例如是顯示或是照明等領域,其中以發光二極體的封裝基座結構為目前市場的主流。在發光二極體封裝基座結構的製程中,會使用黏著膠(例如是低揮發率膠材或紫外光固化膠)來進行元件與元件之間的接合,但封裝基座結構的黏著膠經常因為發光二極體的發光特性而產生嚴重劣化的情形,舉例而言,紫外光發光二極體封裝結構由於紫外光發光二極體的波長較短且能量強,導致黏著膠嚴重劣化。
有鑑於此,針對紫外光發光二極體的封裝結構製程,通常會採用高揮發性黏著膠來避免膠材嚴重劣化的問題,然而,高揮發性黏著膠於加熱固化後容易產生揮發氣體,因此經常發生揮發氣體溢入封裝結構密閉容置空間內的問題。如何針對上述問題進行改善,實為本領域相關人員所關注的焦點。
本發明提供一種發光元件封裝基座結構,有效防止揮發氣體進入密閉容置空間,進而保持封裝基座的真空狀態。
本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。
為達上述目的,本發明所提供一種發光元件封裝結構,包括承載基座、發光晶片、透光單元以及擋壁。承載基座具有承載面以及圍繞承載面的外表面。發光晶片配置於承載面,並電性連接於承載基座。透光單元配置於承載基座,且透光單元具有至少一貫穿孔。擋壁配置於承載基座與透光單元之間並圍繞發光晶片,擋壁、透光單元與承載基座之間形成密閉容置空間。發光晶片位於密閉容置空間內,且擋壁具有遠離密閉容置空間的側面,側面與外表面之間具有間距,貫穿孔對應於側面與外表面之間。
在本發明的一實施例中,上述之承載基座包括基板以及支撐壁。基板包括承載面。支撐壁配置於基板的承載面並圍繞發光晶片,支撐壁包括外表面以及與外表面鄰接的連接面,連接面朝向透光單元,且擋壁配置於連接面與透光單元之間。
在本發明的一實施例中,上述之基板的材料包括氮化鋁或氧化鋁。
在本發明的一實施例中,上述之支撐壁的材質為反射材料。
在本發明的一實施例中,上述之承載基座為一體成型。
在本發明的一實施例中,上述之透光單元包括彼此相連接的透鏡部與平板部,透鏡部對應於發光晶片,平板部圍繞透鏡部,擋壁位於承載基座與平板部之間,至少一貫穿孔位於平板部。
在本發明的一實施例中,上述之透光單元的至少一貫穿孔的數量為多個,這些貫穿孔圍繞透鏡部。
在本發明的一實施例中,上述之透鏡部包括凸透鏡或凹透鏡。
在本發明的一實施例中,上述之發光元件封裝結構更包括膠材。膠材配置於承載基座、透光單元與擋壁的側面之間,透光單元透過膠材黏合於承載基座。
在本發明的一實施例中,上述之發光晶片包括短波紫外光發光二極體。
本發明實施例之發光元件封裝基座結構,其透光單元具有貫穿孔以及在承載基座與透光單元之間配置有擋壁,在這樣的結構設計之下,於發光元件封裝基座結構的製作過程中,膠材因加熱固化的所產生的揮發氣體會被擋壁阻擋而不會溢入密閉容置空間內,確保密閉容置空間的真空狀態,且揮發氣體進一步通過透光單元的貫穿孔排出,有效解決習知封裝基座結構所產生揮發氣體溢入密閉容置空間內的問題。
為讓本發明之上述和其他目的、特徵和優點能更明顯易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說明如下。
請參照圖1至圖3,圖1為本發明實施例之發光元件封裝基座的剖面示意圖。圖2為圖1所示之封裝基座11與擋壁14的俯視示意圖。圖3為圖1所示之透光單元13的俯視示意圖。如圖1至圖3所示,本實施例之發光元件封裝基座1包括承載基座11、發光晶片12、透光單元13以及擋壁14。承載基座11具有承載面113以及圍繞承載面113的外表面114。發光晶片12配置於該承載面113,且發光晶片12電性連接於承載基座11,在本實例中,發光晶片12例如是波長在410nm以下的短波紫外光發光二極體,但本發明並不以此為限。透光單元13配置於承載基座11,且透光單元13具有至少一貫穿孔130。擋壁14配置於承載座11與透光單元13之間並圍繞發光晶片12。在本實施例中,擋壁14、透光單元13與承載座11之間形成密閉容置空間100,發光晶片12位於密閉容置空間100內,且擋壁14具有遠離密閉容置空間100的側面141。擋壁14的側面141與承載基座11的外表面114之間具有間距G,透光單元13的貫穿孔130位置介於擋壁14的側面141與承載基座11的外表面114之間。
以下再針對本發明實施例之發光元件封裝基座結構的細部結構做進一步的描述。
如圖1與圖2所示,本實施例之承載基座11包括基板111以及支撐壁112。基板111包括上述之承載面113,也就是說,發光晶片12配置於基板111上。支撐壁112配置於基板111的承載面113上並圍繞發光晶片12。支撐壁112包括上述之外表面114以及與外表面114鄰接的連接面115。支撐壁112的連接面115朝向透光單元13,且擋壁14配置於連接面115與透光單元13之間。具體而言,支撐壁112更包括與外表面114相對的內表面116,連接面115鄰接於外表面114與內表面116之間,擋壁14更具有靠近密閉容置空間100且與側面141彼此相對的側面142,在本實施例中,擋壁14連接於支撐壁112的連接面115上,且擋壁14的側面142與支撐壁112的內表面116例如是共平面,但本發明並不加以限定擋壁14的配置位置,在擋壁14的側面141與支撐壁112的外表面114之間具有間距G的原則下,擋壁14可以配置在連接面115上的任一位置。
本實施例之基板111的材料例如是氮化鋁或氧化鋁,但本發明並不以此為限。本實施例之支撐壁112的材質是具有反射光線功效的反射材料,例如是與基板111材料相同的氮化鋁或氧化鋁,但本發明並不以此為限。需特別說明的是,在本實施例中,承載基座11例如是由基板111與支撐壁112所組成,但本發明並不以此為限,在其它的實施例中,承載基座11例如是一體成型。值得一提的是,在本實施例中,承載基座11與擋壁14例如是兩個不同的元件彼此連接,但本發明並不以此為限,在其它的實施例中,承載基座11與擋壁14例如是一體成型,意即,擋壁14的材質可使用與承載基座11相同的氮化鋁或氧化鋁,但本發明並不加以限定擋壁14的使用材質。
如圖1與圖3所示,本實施例之透光單元13包括彼此相連接的透鏡部131與平板部132。透光單元13的透鏡部131對應於發光晶片12,在本實施例中,透鏡部131例如是凸透鏡,但本發明並不以此為限,在一實施例中,透鏡部131例如是凹透鏡,在又一實施例中,透鏡部131例如是平板透鏡。平板部132圍繞透鏡部131,擋壁14位於承載基座11與平板部132之間,具體而言,擋壁14位於支撐壁112的連接面115與平板部132之間,且擋壁14抵靠於平板部132,進而於平板部132、擋壁14的側面142以及支撐壁112的連接面115之間形成凹槽O,此空間O與透光單元13的貫穿孔130彼此連通。此外,在本實施例中,透光單元13的貫穿孔130的數量為多個,本實施例之貫穿孔130以12個為例進行說,但本發明並不加以限定貫穿孔130的數量,貫穿孔的數量可視實際情況的需求而有所增減。這些貫穿孔130中任相鄰兩個貫穿孔130的距離例如是相等或不相等,且這些貫穿孔130以圍繞透鏡部131的方式進行配置。
如圖1所示,本實施例之發光元件封裝結構1更包括膠材15。膠材15配置於承載基座11、透光單元13與擋壁14之間,具體而言,膠材15位於支撐壁112的連接面115、透光單元13的平板部132以及擋壁14的側面141之間。透光單元13透過膠材15黏合於承載基座11,也就是透光單元13的平板部132透過膠材15黏合於支撐壁112的連接面115上。
如圖1所示,本實施例之承載基座11更包括第一導電接墊16與第二導電接墊17,發光晶片12具有第一電性連接端121與第二電性連接端122。在本實施例中,發光晶片12的第一電性連接端121與第二電性連接端122彼此相對,且第一電性連接端121設有一電極(圖未示),用以與承載基座11的第一導電接墊16電性連接,而第二電性連接端122設有另一電極(圖未示),用以與承載基座11的第二導電接墊17電性連接。具體而言,第二電性連接端122例如是透過電導線18與第二導電接墊17完成電性連接。需特別說明的是,上述發光晶片12與承載基座11之間電性連接的結構僅為本發明的其中之一實施例,本發明並不以此為限。
請參照圖4A與圖4B,圖4A為本實施例之透光單元13與承載基座11的組裝示意圖。圖4B為圖4A所示之透光單元13與承載基座11的組裝完成示意圖。如圖4A所示,於真空環境下,藉由膠材15將透光單元13的平板部132黏著於承載基座11的支撐壁112的連接面115,當透光單元13黏著於承載基座11後,如圖4B所示,透光單元13覆蓋發光晶片12,且透光單元13的透鏡部131對應於發光晶片12,並進而於承載基座11與透光單元13之間形成密閉容置空間100,而擋壁14位於支撐壁112的連接面115與透光單元13的平板部132之間,且擋壁14抵靠於透光單元13平板部132。此時,膠材15受到透光單元15與承載基座11的擠壓產生形變而分別往第一方向D1與第二方向D2延伸,也就是膠材15分別延伸於透光單元13的貫穿孔130與凹槽O內(由擋壁14的側面141、透光單元13的平板部132、支撐壁112的連接面115圍繞而形成) 。接著進行加熱以固化膠材15,膠材15因受熱揮發而使膠材15體積逐漸收縮,如圖1所示,加熱固化後的膠材15位於支撐壁112的連接面115、透光單元13的平板部132以及擋壁14的側面141之間,而不會殘留於透光單元13的貫穿孔130內,此外,膠材15因加熱所產生的揮發氣體會經由透光單元13的貫穿孔130以及凹槽O的開口排出,不會溢入密閉容置空間100內,以確保密閉容置空間100的真空狀態。
綜上所述,本發明實施例之發光元件封裝基座結構,其透光單元具有貫穿孔以及在承載基座與透光單元之間配置有擋壁,在這樣的結構設計之下,於發光元件封裝基座結構的製作過程中,膠材因加熱固化的所產生的揮發氣體會被擋壁阻擋而不會溢入密閉容置空間內,且揮發氣體進一步通過透光單元的貫穿孔排出,以確保密閉容置空間的真空狀態,有效解決習知封裝基座結構所產生揮發氣體溢入密閉容置空間內的問題。
雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明,本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。
1‧‧‧發光元件封裝基座
11‧‧‧承載基座
12‧‧‧發光晶片
13‧‧‧透光單元
14‧‧‧擋壁
15‧‧‧膠材
16‧‧‧第一導電接墊
17‧‧‧第二導電接墊
18‧‧‧電導線
100‧‧‧密閉容置空間
111‧‧‧基板
112‧‧‧支撐壁
113‧‧‧承載面
114‧‧‧外表面
115‧‧‧連接面
116‧‧‧內表面
121‧‧‧第一電性連接端
122‧‧‧第二電性連接端
130‧‧‧貫穿孔
131‧‧‧透鏡部
132‧‧‧平板部
141、142‧‧‧側面
D1‧‧‧第一方向
D2‧‧‧第二方向
G‧‧‧間距
O‧‧‧凹槽
圖1為本發明實施例之發光元件封裝基座的剖面示意圖。 圖2為圖1所示之封裝基座與擋壁的俯視示意圖。 圖3為圖1所示之透光單元的俯視示意圖。 圖4A為本實施例之透光單元與承載基座的組裝示意圖。 圖4B為圖4A所示之透光單元與承載基座的組裝完成示意圖。
Claims (9)
- 一種發光元件封裝結構,包括:一承載基座,具有一承載面以及一圍繞該承載面的外表面;一發光晶片,配置於該承載面,並電性連接於該承載基座;一透光單元,配置於該承載基座,該透光單元包括彼此相連接的一透鏡部與一平板部,且該平板部具有至少一貫穿孔;一擋壁,配置於該承載基座與該透光單元之間並圍繞該發光晶片,該擋壁抵靠於該平板部及該承載基座,該擋壁、該透光單元與該承載基座之間形成一密閉容置空間,該發光晶片位於該密閉容置空間內,且該擋壁具有一遠離該密閉容置空間的側面,該側面與該外表面之間具有一間距,藉以在該承載基座、該平板部與該擋壁的該側面之間形成一凹槽,該平板部的該至少一貫穿孔對應於該側面與該外表面之間以連通該凹槽;以及一膠材,設置於該凹槽,且該透光單元透過該膠材黏合於該承載基座。
- 如申請專利範圍第1項所述之發光元件封裝結構,其中該承載基座包括:一基板,包括該承載面;以及一支撐壁,配置於該基板的該承載面並圍繞該發光晶片,該支撐壁包括該外表面以及一與該外表面鄰接的連接面,該連接面朝向該透光單元,且該擋壁抵靠於該連接面與該透光單元的該平板部之間。
- 如申請專利範圍第2項所述之發光元件封裝結構,其中該基板的材料包括氮化鋁或氧化鋁。
- 如申請專利範圍第2項所述之發光元件封裝結構,其中該支撐壁的材質為一反射材料。
- 如申請專利範圍第1項所述之發光元件封裝結構,其中該承載基座為一體成型。
- 如申請專利範圍第1項所述之發光元件封裝結構,其中該透鏡部對應於該發光晶片,該平板部圍繞該透鏡部。
- 如申請專利範圍第6項所述之發光元件封裝結構,其中該透光單元的該至少一貫穿孔的數量為多個,該些貫穿孔圍繞該透鏡部。
- 如申請專利範圍第6項所述之發光元件封裝結構,其中該透鏡部包括一凸透鏡或凹透鏡。
- 如申請專利範圍第1項所述之發光元件封裝結構,其中該發光晶片包括一短波紫外光發光二極體。
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CN201710058714.1A CN108336205A (zh) | 2017-01-20 | 2017-01-23 | 发光元件封装基座结构 |
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