TWI677691B - Electronic component detection method and device, and carrier disk used in the detection method - Google Patents
Electronic component detection method and device, and carrier disk used in the detection method Download PDFInfo
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- TWI677691B TWI677691B TW106121666A TW106121666A TWI677691B TW I677691 B TWI677691 B TW I677691B TW 106121666 A TW106121666 A TW 106121666A TW 106121666 A TW106121666 A TW 106121666A TW I677691 B TWI677691 B TW I677691B
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- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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- G01R31/26—Testing of individual semiconductor devices
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Abstract
本發明提供一種電子元件檢測方法、裝置及使用於該檢測方法之載盤，該檢測方法包括：一搬送步驟，使一載盤以間歇性旋轉流路搬送一載槽內的一待測元件至一檢測區域；一擋抵步驟，該待測元件停留在該檢測區域時，使一擋抵件由間歇性旋轉流路外移入該載槽內至該待測元件之一本體部上方的位置；一檢測步驟，使複數支探針元件向上碰觸並頂升該待測元件至該本體部抵接在該擋抵件下方，以對待測元件進行檢測。 The invention provides an electronic component detection method and device, and a carrier disk used in the detection method. The detection method includes: a transporting step, which causes a carrier disk to transport an element to be tested in a carrier tank to an intermittent rotating flow path to A detection area; a blocking step, when the device under test stays in the detection area, moving a blocking member from the intermittent rotating flow path into the loading slot to a position above a body portion of the device under test; In a detection step, a plurality of probe elements are brought into contact with and lifted up the component to be tested until the main body part abuts under the blocking member to detect the component to be tested.
Description
本發明係有關於一種檢測方法、裝置及使用於該檢測方法之載盤，尤指一種對在間歇性旋轉流路內被搬送之電子元件進行檢測之電子元件檢測方法、裝置及使用於該檢測方法之載盤。 The present invention relates to a detection method and device, and a carrier disk used in the detection method, in particular to an electronic component detection method and device for detecting electronic components carried in an intermittent rotating flow path, and an electronic component detection method and device used in the detection Method tray.
習知電子元件如發光二極體(LED)或被動元件等，在產出後通常會進行物理特性之檢測，以進行分類與包裝；專利號第I447060號「工件搬運裝置」已揭露一種電子元件檢測裝置，具備有平台底座，和旋轉自如配置在平台底座上且於外圍部設有複數之工件收納孔的搬運平台，及經由分離供應部連結於搬運平台，可將工件供應至搬運平台之工件收納孔內的線性進料器；其中，線性進料器、分離供應部、工件收納孔的上面由平台罩蓋覆蓋著；此外，於搬運平台的外圍部，沿著間歇旋轉方向依下述順序設有第1檢查部、第2檢查部；工件具有長方體形狀並於上面具有發光面的本體以及從本體朝長度方向的前方及後方突出作為電極的引線端子；搬運平台旋轉搬運工件到達第1檢查部，搬運平台就會停止，此時，於引線端子之正下方位置的平台底座內，設有垂直方向進退自如的探針，利用控制部的作用使探針朝引線端子前進，以抵接著引線端子的狀態將工件往上推，使工件的上面成為抵接在第1檢查部罩蓋之下面的狀態後就停止往上推，對工件的特性進行測定之後，探針就向下退出，並再繼續使搬運平台間歇旋轉搬運工件至第2檢查部。 Known electronic components such as light-emitting diodes (LEDs) or passive components are usually tested for physical characteristics after classification for classification and packaging; Patent No. I447060 "Work Handling Device" has disclosed an electronic component The detection device is provided with a platform base, a transfer platform rotatably arranged on the platform base, and a plurality of workpiece storage holes provided on the periphery, and a connection platform connected to the transfer platform via a separate supply unit, which can supply the workpiece to the workpiece of the transfer platform. The linear feeder in the storage hole; the upper surface of the linear feeder, the separation supply unit, and the workpiece storage hole are covered by the platform cover; in addition, the peripheral portion of the conveying platform is in the following order along the intermittent rotation direction A first inspection unit and a second inspection unit are provided; the body has a rectangular parallelepiped shape and has a light-emitting surface on the upper side; and lead terminals protruding from the body toward the front and rear in the longitudinal direction as electrodes; the conveying platform rotates and conveys the work to the first inspection , The transport platform will stop. At this time, in the platform base directly below the lead terminal, a vertical direction is provided. The free probe advances the probe toward the lead terminal by the action of the control unit, and pushes the workpiece up in a state of abutting the lead terminal, so that the upper surface of the workpiece is in contact with the lower surface of the cover of the first inspection portion. After it stopped pushing up and measured the characteristics of the workpiece, the probe retracted downward and continued to rotate the transport platform to transport the workpiece intermittently to the second inspection section.
前述電子元件檢測裝置僅適用於檢測具有平整發光面的電子元件，若電子元件之上面凸設有以透鏡(Lens)為主之發光部，當電子元件被探針往上推時，電子元件凸設之發光部無法與罩蓋之下面貼平，造成電子元件之水平高度會歪斜不正，導致檢測值有所偏差，且凸設之發光部亦容易因擠壓產生破損；故專利號第I559989號「物品分類裝置及其運轉方法」另揭露一種電子元件檢測裝置，包括：零件給料器，對齊並供給LED晶片；運送機構，自零件給料器接受LED晶片，將其吸附固持並自供給位置通過檢查位置朝排出位置運送之；檢查裝置，沿運送機構運送路徑設置，以檢查位置檢查LED晶片之電性特性與光學特性；其中，LED晶片之水平上表面上凸設有發光部，在檢查中LED晶片被探針往上推時，LED晶片上表面凸設之發光部可移入固定位置之側導件的鏤孔中，使LED晶片之上表面抵接在固定位置之側導件的下表面，如此具有凸設之發光部的電子元件在收納部內被探針往上推時，可維持在固定之水平高度且凸設之發光部亦不易產生破損。 The aforementioned electronic component detection device is only suitable for detecting an electronic component having a flat light emitting surface. If an electronic component with a lens (Lens) as a main part is convexly arranged on the electronic component, when the electronic component is pushed up by the probe, the electronic component is convex. The light-emitting part provided cannot be flat with the underside of the cover, which causes the horizontal height of the electronic component to be skewed, resulting in deviations in the detection value, and the convex light-emitting part is also prone to damage due to extrusion; therefore, patent number I559989 "Article classification device and its operation method" also discloses an electronic component detection device, which includes: a component feeder that aligns and supplies LED chips; a transport mechanism that receives the LED chip from the component feeder, holds and holds it, and passes inspection from the supply position The position is to be transported toward the discharge position. The inspection device is arranged along the transport path of the transport mechanism to check the electrical and optical characteristics of the LED chip at the inspection position. Among them, a light emitting part is convexly arranged on the horizontal upper surface of the LED chip, and the LED is being inspected during the inspection. When the chip is pushed up by the probe, the light-emitting part protruding on the upper surface of the LED chip can be moved into the perforation of the side guide of the fixed position to make the LED crystal The upper surface of the sheet abuts the lower surface of the side guide at a fixed position, so that when the electronic component having the convex light-emitting part is pushed up by the probe in the storage part, it can be maintained at a fixed level and the convex light-emitting The parts are also less prone to breakage.
習知第I447060號專利在檢測具有凸出發光部之電子元件時，無法得到精確之檢測值且電子元件之發光部容易產生破損進而影響檢測進行；習知第I559989號專利雖可對具有凸出發光部之電子元件進行檢測，但如LED發光二極體之電子元件在製造過程中皆會有些許黏膠殘留，在檢查中電子元件被上推抵接於側導件時，電子元件容易沾黏於側導件上，導致電子元件一部分在側導件的鏤孔中，另一部分在運送機構之收納部內，使電子元件在檢查後轉送至下一站時，因側導件係保持在固定位置，而運送機構係相對於側導件位移，故造成電子元件產生破損進而影響檢測進行；故如何有效地對電子元件進行檢測成為有待研究的課題。 When the conventional patent No. I447060 is used to detect an electronic component having a protruding light-emitting portion, accurate detection values cannot be obtained and the light-emitting portion of the electronic component is prone to damage and affects the detection; although the conventional patent No. I559989 can The electronic components of the light-emitting part are inspected, but the electronic components such as LED light-emitting diodes will have a small amount of adhesive residue during the manufacturing process. When the electronic components are pushed up against the side guide during inspection, the electronic components are liable to stick. Adhesion to the side guide causes part of the electronic component in the side hole of the side guide, and the other part is in the storage section of the transport mechanism. When the electronic component is transferred to the next station after the inspection, the side guide is kept fixed. Position, and the conveying mechanism is displaced relative to the side guide, which causes damage to the electronic components and affects the detection; therefore, how to effectively detect the electronic components has become a subject to be studied.
爰是，本發明的目的，在於提供一種可有效地對電子元件進行檢測之電子元件檢測方法。 That is, an object of the present invention is to provide an electronic component detection method capable of effectively detecting an electronic component.
本發明的另一目的，在於提供一種使用本發明目的所提供之電子元件檢測方法的電子元件檢測裝置。 Another object of the present invention is to provide an electronic component detection device using the electronic component detection method provided by the object of the present invention.
本發明的又一目的，在於提供一種可有效地對電子元件進行檢測之電子元件檢測裝置。 Another object of the present invention is to provide an electronic component detection device capable of effectively detecting electronic components.
本發明的又再一目的，在於提供一種使用本發明目的所提供之電子元件檢測方法的載盤。 Yet another object of the present invention is to provide a carrier disk using the electronic component detection method provided by the object of the present invention.
依據本發明目的之電子元件檢測方法，包括：一搬送步驟，使一載盤以間歇性旋轉流路搬送一載槽內的一待測元件至一檢測區域；一擋抵步驟，使一擋抵件由間歇性旋轉流路外移入該載槽內至該待測元件之一本體部上方的位置；一檢測步驟，使複數支探針元件向上碰觸並頂升該待測元件至該本體部抵接在該擋抵件下方，以對待測元件進行檢測。 An electronic component detection method according to the purpose of the present invention includes: a conveying step, which causes a carrier disc to convey an element to be tested in a carrier groove to a detection area in an intermittent rotating flow path; and a resisting step, which causes a resisting The pieces are moved from the intermittent rotating flow path into the loading slot to a position above one of the body parts of the device under test; a detection step makes a plurality of probe elements touch upward and lift up the device under test to the body part It is abutted under the blocking member to detect the component to be tested.
依據本發明另一目的之電子元件檢測裝置，包括用以執行所述電子元件檢測方法的裝置，該裝置包括：一載盤、一擋抵裝置與一探針裝置。 An electronic component detection device according to another object of the present invention includes a device for performing the electronic component detection method. The device includes a carrier plate, a blocking device, and a probe device.
依據本發明又一目的之電子元件檢測裝置，包括：一載盤，具有周緣環列佈設等間距凹設之複數個載槽，其形成間歇性旋轉流路以搬送載槽內之待測元件至一檢測區域進行檢測；該檢測區域設有一探針裝置，其設有複數支探針元件；一擋抵裝置，設於該載盤之旁側，該擋抵裝置設有一擋抵件，在待測元件被搬送經該檢測區域時，該擋抵件可選擇性地由間歇性旋轉流路外移入至該待測元件之一本體部上方的位置；該複數支探針元件可向上碰觸並頂升該待測元件至該本體部抵接在該擋抵件下方，以對該待測元件進行檢測。 An electronic component detection device according to another object of the present invention includes: a carrier plate having a plurality of carrier grooves arranged at equal intervals and recessed in a peripheral ring, which forms an intermittent rotating flow path to transport the components to be tested in the carrier groove to A detection area is used for detection; a detection device is provided in the detection area, which is provided with a plurality of probe elements; an abutment device is provided on the side of the carrier disk, and the abutment device is provided with an abutment member. When the test element is transported through the detection area, the blocking member can be selectively moved from the intermittent rotating flow path to a position above one of the body parts of the test element; the plurality of probe elements can be touched upwards and Lift up the DUT until the body part abuts under the blocking member to test the DUT.
依據本發明又再一目的之載盤，使用於所述電子元件檢測方法，該載盤具有周緣環列佈設等間距凹設之複數個載槽，該載槽設有一容置區與一位於該容置區上方之收光區，兩者間設有一連通口使該容置區與該收光區相互連通，該連通口設有一擋抵部在該容置區與該收光區之間。 According to yet another object of the present invention, a carrier disk is used in the electronic component detection method. The carrier disk has a plurality of carrier grooves arranged at an equal interval and recessed in a circumferential ring. The carrier groove is provided with an accommodating area and A light-receiving area above the accommodating area. A communication port is provided between the two to allow the accommodating area and the light-receiving area to communicate with each other. The communication port is provided with a blocking portion between the accommodating area and the light-receiving area. .
本發明實施例之載盤、電子元件檢測方法及裝置，待測元件在第一載盤之載槽內以擋抵部擋抵在待測元件之本體部內側之兩邊角上方；在待測元件被第一載盤以間歇性旋轉流路搬送至檢測區域時，擋抵裝置具有讓位口之擋抵件可在不碰觸發光部之情況下由間歇性旋轉流路外水平地移入載槽內，並停留在待測元件之本體部外側之兩邊角上方；在待測元件被探針元件向上頂升時，擋抵件與擋抵部可分別擋抵在本體部之四個邊角上，使待測元件維持在與底面保持一間距之固定水平高度上進行檢測，能有效地檢測待測元件。 In the carrier disk, the electronic component detection method and the device of the embodiment of the present invention, the component to be tested is blocked by the blocking portion above the two corners on the inner side of the body portion of the component to be tested in the loading slot of the first carrier plate; When being transported by the first carrier disc to the detection area in an intermittent rotating flow path, the blocking part of the blocking device having a yielding opening can be horizontally moved into the loading slot from outside the intermittent rotating flow path without touching the triggering light section. Inside and stay above the two corners on the outer side of the body part of the component under test; when the component under test is lifted up by the probe element, the blocking part and the blocking part can be blocked on the four corners of the body part respectively , So that the component under test is maintained at a fixed level with a distance from the bottom surface for detection, which can effectively detect the component under test.
A‧‧‧檢測台面 A‧‧‧testing table
A1‧‧‧輸送槽道 A1‧‧‧ Conveying channel
B‧‧‧第一載盤 B‧‧‧First Carrier
B1‧‧‧載槽 B1‧‧‧carrying trough
B1’‧‧‧載槽 B1’‧‧‧ Loading trough
B11‧‧‧容置區 B11‧‧‧accommodation area
B111‧‧‧負壓吸孔 B111‧‧‧Negative pressure suction hole
B112‧‧‧第一導引部 B112‧‧‧First Guide
B12‧‧‧收光區 B12‧‧‧Receiving area
B13‧‧‧連通口 B13‧‧‧Connecting port
B131‧‧‧擋抵部 B131‧‧‧Blocker
B132‧‧‧凹入面 B132‧‧‧ concave surface
B133‧‧‧第二導引部 B133‧‧‧Second Guide
B2‧‧‧限位件 B2‧‧‧ limit piece
B21‧‧‧槽道 B21‧‧‧Slot
B3‧‧‧檢測區域 B3‧‧‧ Detection Area
B31‧‧‧積分球 B31‧‧‧pointing ball
B32‧‧‧探針裝置 B32‧‧‧probe device
B321‧‧‧探針元件 B321‧‧‧Probe element
B4‧‧‧共通排出管 B4‧‧‧Common discharge pipe
C‧‧‧擋抵裝置 C‧‧‧ blocking device
C1‧‧‧驅動模組 C1‧‧‧Drive Module
C11‧‧‧固定座 C11‧‧‧Fixed
C12‧‧‧支撐架 C12‧‧‧Support
C121‧‧‧第一支撐部 C121‧‧‧First support
C122‧‧‧第二支撐部 C122‧‧‧Second support
C123‧‧‧第一彈性件 C123‧‧‧The first elastic piece
C124‧‧‧第二彈性件 C124‧‧‧Second elastic member
C125‧‧‧嵌孔 C125‧‧‧cavity
C126‧‧‧樞孔 C126‧‧‧ Pivot
C127‧‧‧位置檢知器 C127‧‧‧Position detector
C13‧‧‧電磁元件 C13‧‧‧Electromagnetic components
C131‧‧‧穿孔 C131‧‧‧perforation
C132‧‧‧驅動件 C132‧‧‧Driver
C133‧‧‧受磁件 C133‧‧‧Magnetic
C134‧‧‧緩衝件 C134‧‧‧Buffer
C135‧‧‧感應片 C135‧‧‧Sensor
C136‧‧‧抵推件 C136‧‧‧Rejected
C14‧‧‧固定件 C14‧‧‧Fixed parts
C2‧‧‧移動模組 C2‧‧‧Mobile Module
C21‧‧‧固定塊 C21‧‧‧Fixed block
C211‧‧‧嵌孔 C211‧‧‧cavity
C212‧‧‧止位件 C212‧‧‧stop
C213‧‧‧容槽 C213‧‧‧container
C22‧‧‧第三彈性件 C22‧‧‧The third elastic member
C23‧‧‧移動塊 C23‧‧‧moving block
C231‧‧‧容槽 C231‧‧‧container
C24‧‧‧擋抵件 C24‧‧‧Blocking pieces
C241‧‧‧斜面 C241‧‧‧ bevel
C242‧‧‧讓位口 C242‧‧‧ give way
C242’‧‧‧讓位口 C242’‧‧‧ give way
D‧‧‧第二載盤 D‧‧‧second carrier
D1‧‧‧載槽 D1‧‧‧ Loading trough
D2‧‧‧限位件 D2‧‧‧ limit piece
D3‧‧‧排出通道 D3‧‧‧Exhaust channel
E‧‧‧連接單元 E‧‧‧Connecting unit
L‧‧‧中心線 L‧‧‧ Centerline
W‧‧‧待測元件 W‧‧‧DUT
W1‧‧‧本體部 W1‧‧‧Body
W2‧‧‧發光部 W2‧‧‧Lighting Department
圖1係本發明實施例中電子元件檢測裝置之立體示意圖。 FIG. 1 is a schematic perspective view of an electronic component detection device in an embodiment of the present invention.
圖2係本發明實施例中第一載盤與待測元件之部分立體示意圖。 FIG. 2 is a partial perspective view of a first carrier plate and a component under test in the embodiment of the present invention.
圖3係本發明實施例中圖2之仰視示意圖。 FIG. 3 is a schematic bottom view of FIG. 2 in the embodiment of the present invention.
圖4係本發明實施例中擋抵裝置之立體示意圖。 FIG. 4 is a schematic perspective view of the blocking device in the embodiment of the present invention.
圖5係本發明實施例中擋抵裝置、第一載盤、光學積分球、探針裝置位置關係之示意圖。 FIG. 5 is a schematic diagram showing the positional relationship of the blocking device, the first carrier disk, the optical integrating sphere, and the probe device in the embodiment of the present invention.
圖6係本發明實施例中擋抵件移入載槽之示意圖。 FIG. 6 is a schematic diagram of the blocking member moving into the loading slot in the embodiment of the present invention.
圖7係本發明實施例中擋抵件移出載槽之示意圖。 FIG. 7 is a schematic diagram of the blocking member moving out of the loading slot in the embodiment of the present invention.
圖8係本發明實施例中圖6之A-A剖面示意圖(待測元件受探針元件頂升抵接在擋抵件與擋抵部下方)。 FIG. 8 is a schematic cross-sectional view taken along the line A-A of FIG. 6 in the embodiment of the present invention (the component under test is abutted by the probe element and abuts against the blocking member and the blocking portion).
圖9係本發明另一實施例中擋抵件移入載槽之示意圖。 FIG. 9 is a schematic diagram of the blocking member moving into the loading slot in another embodiment of the present invention.
圖10係本發明另一實施例中圖9之B-B剖面示意圖(待測元件受探針元件頂升抵接在擋抵件下方)。 FIG. 10 is a schematic cross-sectional view taken along the line B-B of FIG. 9 in another embodiment of the present invention (the component under test is lifted and abutted by the probe element and abuts against the blocking member).
請參閱圖1，本發明實施例之電子元件檢測方法可以如圖所示之使用在以LED發光二極體為電子元件的電子元件檢測裝置來作說明，該裝置設有包括：一檢測台面A，設有輸送槽道A1輸送由振動送料機(圖未示)整列傳送的待測元件W；一第一載盤B，設於該檢測台面A上，並以一第一間歇性旋轉流路進行待測元件W搬送，周緣環列佈設等間距且設有朝外開口之載槽B1，環列佈設之載槽B1外周設有限位件B2，以防止旋轉搬送的待測元件W受離心力拋出；該限位件B2上設有一與載槽B1連通之槽道B21；該第一載盤B形成一順時針的第一間歇性旋轉流路並承收自輸送槽道A1輸入的待測元件W，該第一間歇性旋轉流路依序搬送待測元件W經一檢測區域B3與一共通排出管B4；一擋抵裝置C，設於該第一載盤B之旁側且相鄰於該檢測區域B3，該擋抵裝置C設有一驅動模組C1與一移動模組C2；一第二載盤D，設於該檢測台面A上，並以一第二間歇性旋轉流路進行搬送，周緣環列佈設等間距且設有朝外開口之載槽D1，環列佈設之載槽D1外周設有限位件D2，以防止旋轉搬送的待測元件W受離心力拋出；該第二載盤D形成一順時針的第二間歇性旋轉流路以進行待測元件W搬送，並與該第一載盤B鄰近；該第二間歇性旋轉流路上的各載槽D1分別各自對應設有排出通道D3； 該第一載盤B、第二載盤D間以一連接單元E形成搬送流路的連接，其可為一通道或以吸附搬送方式傳遞待測元件W於第一載盤B之載槽B1及第二載盤D之載槽D1間的傳送機構；第一載盤B、第二載盤D、連接單元E同設在該水平檢測台面A上；第一間歇性旋轉流路以該連接單元E為界分成前段與後段，該檢測區域B3與擋抵裝置C設於第一間歇性旋轉流路之前段，該共通排出管B4設於第一間歇性旋轉流路之後段，如此可避開第一間歇性旋轉流路前段上各種檢測區域或裝置的干涉；第一載盤B進行搬送的第一間歇性旋轉流路在連接單元E處形成二個相分叉的流路，當待測元件W經檢測區域B3進行檢測的結果為屬於落料頻率較高的待測元件W時，該待測元件W被搬送到達該連接單元E處時，將由第一載盤B的第一間歇性旋轉流路自水平徑向排出，並進入連接單元E，再以水平徑向進入第二載盤D的第二間歇性旋轉流路的載槽D1被搬送，並依檢測結果被排入預設的載槽D1分別各自對應的排出通道D3，以排出第二載盤D的第二間歇性旋轉流路；當待測元件W經檢測區域B3進行檢測的結果為屬於落料頻率較低的待測元件W時，該待測元件W被搬送到達該連接單元E處時，將續循第一載盤B的第一間歇性旋轉流路被搬送越過連接單元E，而到達共通排出管B4，並由共通排出管B4排出第一載盤B的第一間歇性旋轉流路。 Please refer to FIG. 1. The electronic component detection method according to the embodiment of the present invention can be described as shown in an electronic component detection device using an LED light emitting diode as an electronic component. The device is provided with: a detection table A A conveying channel A1 is provided for conveying the components to be tested W which are conveyed in a row by a vibrating feeder (not shown); a first carrier plate B is set on the detection table A, and a first intermittent rotating flow path is provided. Carry the component W to be tested, and equidistantly arrange the loading grooves B1 on the periphery and open outwards. The loading groove B1 arranged on the circle is provided with a stopper B2 on the outer periphery to prevent the component W to be rotated from being thrown by centrifugal force. The stopper B2 is provided with a channel B21 communicating with the carrier slot B1. The first carrier plate B forms a clockwise first intermittent rotating flow path and receives the test input from the transport channel A1. Component W, the first intermittent rotating flow path sequentially conveys the component to be tested W through a detection area B3 and a common discharge pipe B4; a blocking device C is provided beside and adjacent to the first carrier plate B In the detection area B3, the blocking device C is provided with a driving module C1 and a mobile module C2; Two carrier disks D are arranged on the detection table A and are transported by a second intermittent rotating flow path. The peripheral grooves are arranged at equal intervals and provided with outward openings. A limiter D2 is provided on the outer periphery to prevent the component W to be transferred during rotation from being thrown off by the centrifugal force; the second carrier plate D forms a clockwise second intermittent rotating flow path for transferring the component to be measured W, and communicates with the component W The first carrier disk B is adjacent to each other; each of the carrier grooves D1 on the second intermittent rotating flow path is respectively provided with a discharge channel D3; The first carrier disk B and the second carrier disk D are connected by a connection unit E to form a transport flow path. The transport channel can be a channel or a suction transfer method for transferring the component to be tested W to the carrier groove B1 of the first carrier disk B. The transmission mechanism between the loading slot D1 of the second loading plate D and the second loading plate D; the first loading plate B, the second loading plate D, and the connection unit E are also provided on the horizontal detection table A; the first intermittent rotating flow path is connected by the connection The unit E is divided into a front section and a rear section. The detection area B3 and the blocking device C are provided at the front section of the first intermittent rotating flow path, and the common discharge pipe B4 is provided at the rear section of the first intermittent rotating flow path. Open the interference of various detection areas or devices on the front section of the first intermittent rotating flow path; the first intermittent rotating flow path carried by the first carrier B forms two phase-branched flow paths at the connection unit E. When the test result of the test element W through the detection area B3 belongs to the test element W having a high blanking frequency, when the test element W is transported to the connection unit E, the first interval of the first carrier B will be transmitted. The horizontal rotating flow path is discharged from the horizontal and radial direction, and enters the connection unit E, and then enters horizontally and radially. The carrier grooves D1 of the second intermittent rotating flow path of the two carrier disks D are transported and discharged into the respective discharge channels D3 corresponding to the predetermined carrier grooves D1 according to the detection results, so as to eject the second carrier disks D. Intermittent rotating flow path; when the test result of the component W to be tested via the detection area B3 belongs to the component W having a low blanking frequency, the component W to be tested is transported to the connection unit E, and will continue. The first intermittent rotating flow path following the first carrier B is conveyed over the connection unit E, reaches the common discharge pipe B4, and is discharged from the first intermittent rotation flow path of the first carrier B through the common discharge pipe B4.
請參閱圖2、3，待測元件W設有一呈立體矩形之本體部W1與一由該本體部W1上方凸設之發光部W2；第一載盤B之載槽B1設有一容置區B11與一位於該容置區B11上方之收光區B12，兩者間設有一連通口B13使該容置區B11與該收光區B12可相互連通；待測元件W在載槽B1內以本體部W1在容置區B11且發光部W2在收光區B12之位置關係受第一載盤B搬送，此時待測元件W與載槽B1具有相同之中心線L；容置區B11具有呈矩形之側 邊，在容置區B11之內側設有一負壓吸孔B111可吸附待測元件W之本體部W1，容置區B11外側開口處之兩旁側各設有一第一導引部B112可使本體部W1容易進入容置區B11；收光區B12係由載盤B之上表面由弧形周緣朝載槽B1之中心線L方向向下傾斜至連通口B13所形成，使收光區B12呈上方開口大，下方靠近連通口B13處開口小之束縮狀，有助於收集由發光部W2發射之光線；連通口B13設有一擋抵部B131在容置區B11與收光區B12之間，該擋抵部B131係由連通口B13內側周緣朝中心線L方向延伸，使連通口B13在容置區B11上方形成束縮之頸口；連通口B13之內側設有一弧形凹入面B132可閃避發光部W2，使擋抵部B131可擋抵在本體部W1內側兩邊角上方；連通口B13外側開口處之兩旁側各設有一第二導引部B133可使發光部W2容易進入收光區B12；第二載盤D之構造與第一載盤B相同，在此不多加贅述。 Please refer to FIGS. 2 and 3, the component W to be tested is provided with a three-dimensional rectangular body portion W1 and a light-emitting portion W2 protruding from above the body portion W1; the loading slot B1 of the first carrier plate B is provided with an accommodation area B11 And a light receiving area B12 located above the accommodating area B11, a communication port B13 is provided between the two so that the accommodating area B11 and the light absorbing area B12 can communicate with each other; The positional relationship between the body portion W1 in the accommodating area B11 and the light emitting portion W2 in the light receiving area B12 is carried by the first carrier plate B. At this time, the component W to be tested and the carrier groove B1 have the same centerline L; the accommodating area B11 has Rectangular side A negative pressure suction hole B111 is provided inside the accommodating area B11 to adsorb the body portion W1 of the component W to be measured, and a first guide portion B112 is provided on each side of the opening outside the accommodating area B11 to enable the body portion. W1 is easy to enter the accommodating area B11; the light receiving area B12 is formed by the upper surface of the carrier disk B being inclined downward from the arc-shaped peripheral edge toward the center line L of the loading slot B1 to the communication opening B13, so that the light receiving area B12 is upward. The opening is large, and the narrow opening at the bottom near the communication port B13 helps to collect the light emitted by the light emitting part W2. The communication port B13 is provided with a blocking part B131 between the accommodation area B11 and the light receiving area B12. The blocking portion B131 extends from the inner periphery of the communication opening B13 toward the center line L, so that the communication opening B13 forms a constricted neck opening above the accommodation area B11. An arc-shaped concave surface B132 is provided on the inner side of the communication opening B13. Dodge the light-emitting portion W2, so that the blocking portion B131 can block above the two inner corners of the main body portion W1; each of the two sides of the outside opening of the communication port B13 is provided with a second guide portion B133, so that the light-emitting portion W2 can easily enter the light receiving area B12; The structure of the second carrier disc D is the same as that of the first carrier disc B, and details are not described herein.
請參閱圖1、4、5，擋抵裝置C之驅動模組C1設有包括：一固定座C11，設於限位件B2上；一支撐架C12，設於該固定座C11上，該支撐架C12設有一第一支撐部C121與一第二支撐部C122；該第一支撐部C121與固定座C11相連，第一支撐部C121之兩端分別設有一第一彈性件C123與一第二彈性件C124，兩者皆為金屬材質之片狀物，其各開設有一鏤空之嵌孔C125；該第二支撐部C122與第一支撐部C121垂直，第二支撐部C122上設有一鏤空之樞孔C126與一例如近接開關之位置檢知器C127；一電磁元件C13，設於第二支撐部C122上，其上設有鏤空之穿孔C131，供一驅動件C132穿經；該驅動件C132為一桿狀體，兩端分別穿入第一彈性件C123與第二彈性件C124之嵌孔C125，並各以一固定件C14將驅動件C132之兩端固定於第一彈性件C123與第二彈性件C124上；驅動件C132一端設有一板狀受磁件C133，位於電磁元件C13與第一彈性件C123之間， 驅動件C132之另一端在朝向移動模組C2之方向上依序設有一板狀緩衝件C134、一感應片C135與一抵推件C136；該緩衝件C134設於固定件C14與第二支撐部C122之間，可防止在驅動件C132位移時固定件C14直接碰觸第二支撐部C122；該感應片C135夾設於第二彈性件C124與該抵推件C136之間，可對應接近或遠離位置檢知器C127以檢知驅動件C132之位置；電磁元件C13可因通電而產生磁力以吸引受磁件C133，受電磁元件C13吸引之受磁件C133可連動驅動件C132朝移動模組C2方向位移，使第一彈性件C123與第二彈性件C124因驅動件C132之位置改變而朝向移動模組C2方向稍為傾斜變形。 Please refer to FIGS. 1, 4, and 5. The driving module C1 of the blocking device C is provided with: a fixed base C11 provided on the limiter B2; a support frame C12 provided on the fixed base C11, and the support The frame C12 is provided with a first support portion C121 and a second support portion C122. The first support portion C121 is connected to the fixing base C11, and a first elastic member C123 and a second elasticity are respectively provided at two ends of the first support portion C121. Piece C124, both of which are sheet metal materials, each of which is provided with a hollow insertion hole C125; the second support portion C122 is perpendicular to the first support portion C121, and a second support portion C122 is provided with a hollow pivot hole C126 and a position detector C127 such as a proximity switch; an electromagnetic component C13 is provided on the second support portion C122, and a hollow perforation C131 is provided on it for a drive member C132 to pass through; the drive member C132 is a Both ends of the rod-shaped body penetrate into the insertion holes C125 of the first elastic member C123 and the second elastic member C124, and each of the two ends of the driving member C132 is fixed to the first elastic member C123 and the second elastic member by a fixing member C14. A piece of magnetic receiving member C133 is provided at one end of the driving member C132. Between the elastic member C123, The other end of the driving member C132 is sequentially provided with a plate-shaped cushioning member C134, an induction piece C135, and an abutting member C136 in a direction toward the moving module C2. The cushioning member C134 is provided on the fixing member C14 and the second supporting portion. Between C122, it is possible to prevent the fixing member C14 from directly contacting the second supporting portion C122 when the driving member C132 is displaced; the induction piece C135 is sandwiched between the second elastic member C124 and the pushing member C136, and can be approached or separated from correspondingly. The position detector C127 detects the position of the driving member C132. The electromagnetic component C13 can generate magnetic force to attract the magnetic member C133 due to the current. The magnetic member C133 attracted by the electromagnetic component C13 can link the driving member C132 toward the mobile module C2. The direction displacement causes the first elastic member C123 and the second elastic member C124 to be slightly inclined and deformed toward the moving module C2 due to the change of the position of the driving member C132.
請參閱圖1、4、5，擋抵裝置C之移動模組C2，設有包括：一固定塊C21，設於限位件B2上，該固定塊C21上開設有一嵌孔C211，供一桿狀止位件C212之一端固設；固定塊C21在朝向驅動模組C1之端面上設有一容槽C213，供一例如彈簧之第三彈性件C22的一端容置，且該止位件C212之另一端穿入該第三彈性件C22；一移動塊C23，設有一容槽C231，供第三彈性件C22之另一端容置，使被夾設於固定塊C21與移動塊C23之間的第三彈性件C22可推動移動塊C23貼靠於驅動模組C1之抵推件C136；一擋抵件C24，設於移動塊C23之下方，在待測元件W被搬送至檢測區域B3時，該擋抵件C24可經由槽道B21選擇性地由第一間歇性旋轉流路外移入或移出載槽B1；擋抵件C24呈長條狀，一端與移動塊C23相連結，另一端設有一由上而下高度遞減之斜面C241，並在該斜面C241之末端設有一弧形凹入之讓位口C242；擋抵件C24在靠近固定塊C21處設有一擋銷C243，可防止在拆卸驅動模組C1時，失去抵推件C136反向抵推 之移動塊C23因第三彈性件C22之推動而連動擋抵件C24射出槽道B21外；在驅動模組C1之驅動件C132朝移動模組C2方向位移時，其上之抵推件C136抵推移動塊C23使第三彈性件C22受到壓縮，受抵推之移動塊C23連動擋抵件C24具有讓位口C242之一端由第一間歇性旋轉流路外以以水平方向移入載槽B1內，並停留在待測元件W之本體部W1上方的位置，擋抵件C24之讓位口C242可閃避待測元件W之發光部W2(圖6)；在電磁元件C13解除對受磁件C133之吸引時，移動塊C23因第三彈性件C22之彈性回復力使擋抵件C24具有讓位口C242之一端以水平方向移出載槽B1(圖7)；其中，在第三彈性件C22彈性疲乏或電磁元件C13之移動行程變大…等特殊情況下，止位件C212可擋止移動塊C23，防止移動塊C23連動擋抵件C24過度的伸入載槽B1內導致待測元件W破損。 Please refer to Figs. 1, 4, and 5. The mobile module C2 of the blocking device C is provided with a fixing block C21 provided on the limiting member B2. The fixing block C21 is provided with an embedded hole C211 for a rod. One end of the stopper C212 is fixed; the fixing block C21 is provided with a receiving slot C213 on the end face facing the drive module C1 for receiving one end of a third elastic member C22 such as a spring, and the stopper C212 The other end penetrates into the third elastic member C22; a moving block C23 is provided with a receiving slot C231 for the other end of the third elastic member C22 to be sandwiched between the fixed block C21 and the moving block C23. The three elastic members C22 can push the moving block C23 against the pushing member C136 of the driving module C1; a blocking member C24 is provided below the moving block C23. When the component W to be tested is transferred to the detection area B3, the The blocking piece C24 can be selectively moved into or out of the loading slot B1 from the outside of the first intermittent rotating flow path through the channel B21. The blocking piece C24 is in a long shape, one end is connected to the moving block C23, and the other end is provided with a An inclined surface C241 having a decreasing height from top to bottom, and an arc-shaped recessed concession opening C242 is provided at the end of the inclined surface C241; Close to the fixing block is provided with a stop pin C21 C243, upon removal of the driver module can be prevented C1, loss of contact resisting reverse pusher C136 The moving block C23 is pushed out by the third elastic member C22 and the blocking member C24 is shot out of the channel B21. When the driving member C132 of the driving module C1 is displaced in the direction of the moving module C2, the above-mentioned pushing member C136 resists. Pushing the moving block C23 causes the third elastic member C22 to be compressed. The pushed moving block C23 is linked to the blocking member C24 and has one way end C242. One end is moved from the first intermittent rotating flow path into the loading slot B1 in a horizontal direction. And stay at a position above the main body portion W1 of the component W to be tested, and the yielding port C242 of the blocking member C24 can evade the light emitting portion W2 of the component W to be tested (FIG. 6); the electromagnetic component C13 releases the magnetic receiving member C133 At the time of attraction, the moving block C23 caused one end of the blocking member C24 to give way to the loading slot B1 (FIG. 7) in the horizontal direction due to the elastic restoring force of the third elastic member C22; Fatigue or the moving stroke of the electromagnetic component C13 becomes larger ... In special cases, the stopper C212 can stop the moving block C23, preventing the moving block C23 from interlocking with the blocking member C24 to protrude into the loading slot B1 and cause the component W to be damaged. .
請參閱圖5、8，載槽B1內之待測元件W在檢測區域B3(圖1)內以一光學積分球B31與一探針裝置B32進行檢測，在檢測待測元件W時，擋抵件C24具有讓位口C242之一端由第一間歇性旋轉流路外移入載槽B1內並停留在待測元件W之本體部W1上方的位置；探針裝置B32以複數支探針元件B321向上碰觸待測元件W之電極(圖未示)並向上頂升待測元件W，使本體部W1抵接在擋抵件C24與擋抵部B131下方，擋抵件C24擋抵在本體部W1朝向載槽B1外側之兩邊角上，而擋抵部B131擋抵在本體部W1朝向載槽B1內側之另外兩邊角上；在探針元件B321碰觸待測元件W之電極使其發光部W2發光後，待測元件W將維持在與底面保持一間距之固定水平高度上以光學積分球B31檢測光學特性。 Please refer to Figs. 5 and 8. In the detection area B3 (Fig. 1), the component to be tested W in the loading slot B1 is tested by an optical integrating sphere B31 and a probe device B32. When the component W to be tested is detected, Piece C24 has one end of the concession port C242 moved from the first intermittent rotating flow path into the loading slot B1 and stayed above the body portion W1 of the component W to be measured; the probe device B32 faces upward with a plurality of probe components B321 Touch the electrode (not shown) of the component W to be tested and lift up the component W to be tested, so that the main body portion W1 abuts under the blocking member C24 and the blocking portion B131, and the blocking member C24 blocks against the main body portion W1. The two corners facing toward the outer side of the loading slot B1, and the blocking portion B131 blocking the other two corners of the body portion W1 facing the inner side of the loading slot B1; the probe element B321 touches the electrode of the device under test W to cause the light emitting portion W2 After emitting light, the component to be measured W will be maintained at a fixed level with a distance from the bottom surface, and the optical characteristics will be detected by the optical integrating sphere B31.
本發明實施例之電子元件檢測方法在實施上，包括以下步驟： 一搬送步驟，使第一載盤B以第一間歇性旋轉流路搬送載槽B1內的待測元件W途經檢測區域B3；一擋抵步驟，待測元件W停留在檢測區域B3時，使擋抵件C24由間歇性旋轉流路外移入載槽B1內，並停留在待測元件W之本體部W1上方的位置；一檢測步驟，使複數支探針元件B321向上碰觸並頂升待測元件W受擋抵件C24與擋抵部B131擋抵，使待測元件W維持在與底面保持一間距之固定水平高度上進行檢測，並在進行檢測後使複數支探針元件B321向下移動且擋抵件C24移出載槽B1。 The implementation of the electronic component detection method of the embodiment of the present invention includes the following steps: A transfer step causes the first carrier plate B to transport the component W to be tested in the load tank B1 through the detection area B3 in a first intermittent rotating flow path; a blocking step, when the component W to be tested stays in the detection area B3, The blocking member C24 is moved into the loading slot B1 from the intermittent rotating flow path, and stays at a position above the body portion W1 of the component W to be measured. A detection step causes a plurality of probe elements B321 to touch upward and lift up The measuring element W is blocked by the resisting piece C24 and the resisting portion B131, so that the component W to be tested is maintained at a fixed level with a distance from the bottom surface for testing, and a plurality of probe elements B321 are directed downward after the testing is performed. The moving and blocking member C24 moves out of the loading slot B1.
本發明實施例之載盤、電子元件檢測方法及裝置，待測元件W在第一載盤B之載槽B1內以擋抵部B131擋抵在待測元件W之本體部W1內側之兩邊角上方；在待測元件W被第一載盤B以間歇性旋轉流路搬送至檢測區域B3時，擋抵裝置C具有讓位口C242之擋抵件C24可在不碰觸發光部W2之情況下由間歇性旋轉流路外水平地移入載槽B1內，並停留在待測元件W之本體部W1外側之兩邊角上方；在待測元件W被探針元件B321向上頂升時，擋抵件C24與擋抵部B131可分別擋抵在本體部W1之四個邊角上，使待測元件W維持在與底面保持一間距之固定水平高度上進行檢測，能有效地檢測待測元件W。 In the carrier disk, the electronic component detection method and the device of the embodiment of the present invention, the component W to be tested is blocked by the blocking portion B131 in the loading slot B1 of the first carrier B to the two corners inside the body portion W1 of the component W to be tested. Above; when the component to be tested W is transported to the detection area B3 by the first carrier B in an intermittent rotating flow path, the blocking device C has a blocking member C24 that gives way to the opening C242, without touching the triggering light portion W2. The bottom is moved horizontally into the loading slot B1 from the outside of the intermittent rotating flow path, and stays above the two corners outside the body portion W1 of the component W to be tested; when the component W to be tested is lifted upward by the probe element B321, it blocks The pieces C24 and the blocking portion B131 can block the four corners of the main body portion W1, respectively, so that the component W to be tested can be detected at a fixed level at a distance from the bottom surface, and the component W can be effectively detected. .
請參閱圖9、10，本發明另一實施例之載槽B1’無設有擋抵部B131(圖3)，而使具有較寬深之讓位口C242’的擋抵件C24’伸入載槽B1’內直接擋抵在本體部W1之兩個側邊上。 Please refer to FIG. 9 and FIG. 10, the loading slot B1 ′ of another embodiment of the present invention is not provided with a blocking portion B131 (FIG. 3), and the blocking member C24 ′ having a wide and deep yielding opening C242 ′ is extended into The inside of the loading slot B1 ′ is directly abutted on two sides of the main body portion W1.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。 However, the above are only the preferred embodiments of the present invention. When the scope of implementation of the present invention cannot be limited by this, that is, the simple equivalent changes and modifications made according to the scope of the patent application and the description of the invention, All are still within the scope of the invention patent.
Claims (14)
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| Application Number | Priority Date | Filing Date | Title |
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| TW106121666A TWI677691B (en) | 2017-06-28 | 2017-06-28 | Electronic component detection method and device, and carrier disk used in the detection method |
| CN201810162492.2A CN109143013A (en) | 2017-06-28 | 2018-02-26 | Electronic component detection method and device and carrier disc used for detection method |
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| TW106121666A TWI677691B (en) | 2017-06-28 | 2017-06-28 | Electronic component detection method and device, and carrier disk used in the detection method |
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| TWI677691B true TWI677691B (en) | 2019-11-21 |
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| TW202031576A (en) * | 2019-02-15 | 2020-09-01 | 萬潤科技股份有限公司 | Material-discharging method and device especially monitoring the discharge of electronic components during test-and-screening |
| TWI710410B (en) * | 2019-06-19 | 2020-11-21 | 萬潤科技股份有限公司 | Electronic component classification method and device |
| TWI741715B (en) * | 2020-08-03 | 2021-10-01 | 矽品精密工業股份有限公司 | Carrier device |
| TWI775181B (en) * | 2020-10-16 | 2022-08-21 | 萬潤科技股份有限公司 | Conveyor and electronic component testing equipment |
| TWI807303B (en) * | 2021-04-14 | 2023-07-01 | 萬潤科技股份有限公司 | Carrier tape cleaning method and device |
| TWI805218B (en) * | 2022-02-10 | 2023-06-11 | 萬潤科技股份有限公司 | Electronic component testing device, test board structure, and test board manufacturing method |
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| TWI546829B (en) * | 2013-10-01 | 2016-08-21 | All Ring Tech Co Ltd | Coil package method and device |
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| US4179032A (en) * | 1978-09-11 | 1979-12-18 | Western Electric Co., Inc. | Methods of and apparatus for conveying, orienting, testing and sorting articles |
| TW331982U (en) * | 1997-08-22 | 1998-05-11 | Ganlong Automation Ind Co Ltd | Spot-gluing machine for roller grooves |
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| TW201905473A (en) | 2019-02-01 |
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