TWI672467B - Light-emitting unit - Google Patents
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- TWI672467B TWI672467B TW107134385A TW107134385A TWI672467B TW I672467 B TWI672467 B TW I672467B TW 107134385 A TW107134385 A TW 107134385A TW 107134385 A TW107134385 A TW 107134385A TW I672467 B TWI672467 B TW I672467B
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Abstract
一種發光單元，其包含：一基板、一光學透鏡及一發光晶片。基板具有一環狀凹槽，基板設置有一卡合結構，卡合結構位於環狀凹槽中。光學透鏡設置於基板，光學透鏡具有一凹穴及一輔助卡合件，輔助卡合件內凹形成有一卡合槽，輔助卡合件位於環狀凹槽中，而卡合結構位於卡合槽中。發光晶片設置於基板，且發光晶片位於凹穴中。其中，卡合結構與卡合槽之間形成有一預留空間。 A light emitting unit comprises: a substrate, an optical lens and a light emitting chip. The substrate has an annular groove, and the substrate is provided with an engaging structure, and the engaging structure is located in the annular groove. The optical lens is disposed on the substrate, the optical lens has a recess and an auxiliary engaging member, and the auxiliary engaging member is concavely formed with an engaging groove, the auxiliary engaging member is located in the annular groove, and the engaging structure is located in the engaging groove in. The luminescent wafer is disposed on the substrate, and the luminescent wafer is located in the recess. Wherein, a reserved space is formed between the engaging structure and the engaging groove.
Description
本發明涉及一種發光單元，特別是一種具有透鏡的發光單元。 The invention relates to a lighting unit, in particular to a lighting unit having a lens.
現有具有透鏡的發光二極體單元，其所具有的透鏡與發光二極體兩者之間的相對位置，在組裝上如果有些許的偏差，則發光二極體單元將可能產生出非預期的光形。是以，對於相關生產業者而言，在生產製造具有透鏡的發光二極體單元時，如何使透鏡及發光二極體能位於正確的位置，成為了重要的課題之一。 In the conventional light-emitting diode unit having a lens, the relative position between the lens and the light-emitting diode has a slight deviation in assembly, and the light-emitting diode unit may generate unexpected Light shape. Therefore, it has become an important issue for related manufacturers to how to position the lens and the light-emitting diode at the correct position when manufacturing a light-emitting diode unit having a lens.
緣此，本發明人乃潛心研究並配合學理的運用，而提出一種設計合理且有效改善上述問題的本發明。 Accordingly, the inventors have diligently studied and cooperated with the application of the theory, and proposed a present invention which is rational in design and effective in improving the above problems.
本發明的主要目的在於提供一種發光單元，用以改善現有技術中，具有透鏡的發光二極體單元，於生產製造過程中，容易發生透鏡與發光二極體兩者未設置於預定的正確位置，而使得發光單元產生不預期的光形的問題。 The main object of the present invention is to provide a light-emitting unit for improving the prior art light-emitting diode unit having a lens. In the manufacturing process, it is easy for the lens and the light-emitting diode to be disposed at a predetermined correct position. The problem that the light-emitting unit produces an unexpected light shape.
為了實現上述目的，本發明提供一種發光單元，其包含：一基板、一光學透鏡及一發光晶片。基板具有一環狀凹槽，基板設置有一卡合結構，卡合結構位於環狀凹槽中。光學透鏡設置於基板，光學透鏡具有一凹穴及一輔助卡合件，輔助卡合件內凹形成有一卡合槽，輔助卡合件位於環狀凹槽中，而卡合結構位於卡合槽中。發光晶片設置於基板，且發光晶片位於凹穴中。其中，卡合結構與卡合槽之間形成有一預留空間。 In order to achieve the above object, the present invention provides a light emitting unit comprising: a substrate, an optical lens, and a light emitting chip. The substrate has an annular groove, and the substrate is provided with an engaging structure, and the engaging structure is located in the annular groove. The optical lens is disposed on the substrate, the optical lens has a recess and an auxiliary engaging member, and the auxiliary engaging member is concavely formed with an engaging groove, the auxiliary engaging member is located in the annular groove, and the engaging structure is located in the engaging groove in. The luminescent wafer is disposed on the substrate, and the luminescent wafer is located in the recess. Wherein, a reserved space is formed between the engaging structure and the engaging groove.
在一個可選的實施例中，發光晶片設置於基板的一承載面，卡合槽的一頂面與承載面齊平或低於承載面。 In an alternative embodiment, the illuminating wafer is disposed on a bearing surface of the substrate, and a top surface of the engaging groove is flush with or lower than the bearing surface.
在一個可選的實施例中，發光單元還包含有一輔助透鏡，輔助透鏡設置於基板，且輔助透鏡位於凹穴中；輔助透鏡具有一容槽，發光晶片位於容槽中。 In an optional embodiment, the light emitting unit further includes an auxiliary lens disposed on the substrate, and the auxiliary lens is located in the cavity; the auxiliary lens has a cavity, and the light emitting chip is located in the cavity.
在一個可選的實施例中，發光單元更包含有一膠體，膠體用以使卡合結構與形成卡合槽的壁面相黏合，且部份的膠體能容置於預留空間。 In an optional embodiment, the illuminating unit further comprises a colloid for bonding the engaging structure to the wall surface forming the engaging groove, and a part of the colloid can be accommodated in the reserved space.
在一個可選的實施例中，輔助卡合件與光學透鏡一體成型地設置。 In an alternative embodiment, the auxiliary snaps are integrally formed with the optical lens.
在一個可選的實施例中，卡合結構具有一第一台階部及一第二台階部，第一台階部形成於環狀凹槽的底部，第二台階部形成於第一台階部遠離環狀凹槽的底部的一端。 In an optional embodiment, the engaging structure has a first step portion and a second step portion, the first step portion is formed at the bottom of the annular groove, and the second step portion is formed at the first step portion away from the ring One end of the bottom of the groove.
在一個可選的實施例中，卡合槽區分有一第一容槽及一第二容槽，第一容槽能容置第一台階部，第二容槽能容置第二台階部。 In an optional embodiment, the engaging groove is divided into a first receiving groove and a second receiving groove. The first receiving groove can accommodate the first step portion, and the second receiving groove can accommodate the second step portion.
在一個可選的實施例中，第一台階部的最大寬度小於環狀凹槽的寬度，且第二台階部的最大寬度小於第一台階部的最小寬度。 In an alternative embodiment, the maximum width of the first step portion is less than the width of the annular groove, and the maximum width of the second step portion is less than the minimum width of the first step portion.
在一個可選的實施例中，第二容槽與第二台階部之間形成有預留空間。 In an optional embodiment, a reserved space is formed between the second pocket and the second step.
為了實現上述目的，本發明還提供一種發光單元，其包含：一基板、一光學透鏡及一發光晶片。基板具有一卡合槽，卡合槽為環狀，卡合槽區分有一第一容槽及一第二容槽。光學透鏡設置於基板，光學透鏡具有一凹穴及一卡合結構，卡合結構位於卡合槽中，卡合結構具有一第一台階部及一第二台階部，第一台階部由光學透鏡面對基板的一側向外延伸形成，第二台階部由第一台階部向外延伸形成；其中，第一容槽能容置第一台階部，第二容槽能容置第二台階部。發光晶片設置於基板，且發光晶片位於凹 穴中。其中，第二容槽與第二台階部之間形成有一預留空間。 In order to achieve the above object, the present invention further provides a light emitting unit comprising: a substrate, an optical lens and a light emitting chip. The base plate has an engaging groove, and the engaging groove is annular. The engaging groove is divided into a first receiving groove and a second receiving groove. The optical lens is disposed on the substrate, the optical lens has a recess and an engaging structure, and the engaging structure is located in the engaging groove, the engaging structure has a first step portion and a second step portion, and the first step portion is formed by the optical lens The second step portion is formed to extend outwardly from the first step portion; wherein the first receiving portion can accommodate the first step portion, and the second receiving portion can accommodate the second step portion . The illuminating chip is disposed on the substrate, and the illuminating chip is located in the concave In the hole. A reserved space is formed between the second pocket and the second step.
在一個可選的實施例中，發光單元還包含有一輔助透鏡，輔助透鏡設置於基板，且輔助透鏡位於凹穴中；輔助透鏡具有一容槽，發光晶片位於容槽中。 In an optional embodiment, the light emitting unit further includes an auxiliary lens disposed on the substrate, and the auxiliary lens is located in the cavity; the auxiliary lens has a cavity, and the light emitting chip is located in the cavity.
在一個可選的實施例中，發光單元更包含有一膠體，膠體用以使卡合結構與形成卡合槽的壁面相黏合，且部份的膠體能容置於預留空間。 In an optional embodiment, the illuminating unit further comprises a colloid for bonding the engaging structure to the wall surface forming the engaging groove, and a part of the colloid can be accommodated in the reserved space.
在一個可選的實施例中，卡合結構與光學透鏡一體成型地設置。 In an alternative embodiment, the snap-fit structure is integrally formed with the optical lens.
在一個可選的實施例中，第一台階部的最大寬度小於卡合槽的寬度，且第二台階部的最大寬度小於第一台階部的最小寬度。 In an optional embodiment, the maximum width of the first step portion is smaller than the width of the engaging groove, and the maximum width of the second step portion is smaller than the minimum width of the first step portion.
本發明的有益效果可以在於：透過環狀凹槽、卡合結構及卡合槽的相互配合，可以使光學透鏡正確地設置於基板上預定的位置，從而可使發光單元發出預定的光形，據以達到提升生產良率的功效。 The beneficial effects of the present invention may be that the optical lens can be correctly disposed on a predetermined position on the substrate through the mutual cooperation of the annular groove, the engaging structure and the engaging groove, so that the light emitting unit can emit a predetermined light shape. According to the effect of improving production yield.
為使能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與附圖，然而所附圖式僅提供參考與說明用，並非用來對本發明加以限制者。 For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.
100‧‧‧發光單元 100‧‧‧Lighting unit
10‧‧‧基板 10‧‧‧Substrate
10a‧‧‧承載面 10a‧‧‧ bearing surface
101‧‧‧環狀凹槽 101‧‧‧ annular groove
101a‧‧‧底部 101a‧‧‧ bottom
101b‧‧‧側壁 101b‧‧‧ sidewall
101c‧‧‧側壁 101c‧‧‧ side wall
102‧‧‧卡合結構 102‧‧‧Clamping structure
102a‧‧‧端面 102a‧‧‧ end face
1021‧‧‧第一台階部 1021‧‧‧First step
1022‧‧‧第二台階部 1022‧‧‧second step
1022a‧‧‧端面 1022a‧‧‧ end face
11‧‧‧光學透鏡 11‧‧‧ optical lens
11a‧‧‧連接面 11a‧‧‧ Connection surface
11b‧‧‧出光面 11b‧‧‧Glossy
111‧‧‧凹穴 111‧‧‧ recess
111a‧‧‧端面 111a‧‧‧ end face
112‧‧‧輔助卡合件 112‧‧‧Auxiliary card fittings
1121‧‧‧卡合槽 1121‧‧‧ snap groove
11211‧‧‧第一容槽 11211‧‧‧first slot
11212‧‧‧第二容槽 11212‧‧‧Second cavity
1121a‧‧‧端面 1121a‧‧‧ end face
12‧‧‧發光晶片 12‧‧‧Lighting chip
12a‧‧‧出光面 12a‧‧‧Glossy
13‧‧‧膠體 13‧‧‧ colloid
14‧‧‧輔助透鏡 14‧‧‧Auxiliary lens
141‧‧‧容槽 141‧‧‧ 容容
15‧‧‧透光膠 15‧‧‧Translucent adhesive
16‧‧‧遮光件 16‧‧‧Lighting parts
200‧‧‧發光單元 200‧‧‧Lighting unit
20‧‧‧基板 20‧‧‧Substrate
20a‧‧‧承載面 20a‧‧‧ bearing surface
201‧‧‧卡合槽 201‧‧‧ snap groove
2011‧‧‧第一容槽 2011‧‧‧The first capacity
2012‧‧‧第二容槽 2012‧‧‧Second Cassette
21‧‧‧光學透鏡 21‧‧‧ optical lens
21a‧‧‧連接面 21a‧‧‧ Connection surface
21b‧‧‧出光面 21b‧‧‧Glossy
211‧‧‧凹穴 211‧‧‧ recesses
211a‧‧‧端面 211a‧‧‧ end face
212‧‧‧卡合結構 212‧‧‧Snap structure
2121‧‧‧第一台階部 2121‧‧‧First step
2122‧‧‧第二台階部 2122‧‧‧second step
2122a‧‧‧端面 2122a‧‧‧ end face
22‧‧‧發光晶片 22‧‧‧Lighting chip
22a‧‧‧出光面 22a‧‧‧Glossy
23‧‧‧輔助透鏡 23‧‧‧Auxiliary lens
231‧‧‧容槽 231‧‧‧ 容容
A1‧‧‧安裝區域 A1‧‧‧Installation area
C‧‧‧光軸 C‧‧‧ optical axis
D1、D4、D6、D8‧‧‧深度 D1, D4, D6, D8‧‧ depth
D2‧‧‧長度 D2‧‧‧ length
D3、D5、D7‧‧‧高度 D3, D5, D7‧‧‧ height
SP‧‧‧預留空間 SP‧‧‧ reserved space
W1~W9‧‧‧寬度 W1~W9‧‧‧Width
圖1為本發明的發光單元的立體示意圖。 1 is a schematic perspective view of a light emitting unit of the present invention.
圖2為本發明的發光單元的第一實施例的立體分解示意圖。 2 is a perspective exploded view of the first embodiment of the light emitting unit of the present invention.
圖3為本發明的發光單元的第一實施例的剖面分解示意圖。 3 is a cross-sectional, exploded view of the first embodiment of the light emitting unit of the present invention.
圖4為本發明的發光單元的第一實施例的組裝剖面示意圖。 4 is a schematic cross-sectional view showing the assembly of the first embodiment of the light emitting unit of the present invention.
圖5為本發明的發光單元的第二實施例的立體分解示意圖。 FIG. 5 is a perspective exploded view of a second embodiment of a light emitting unit of the present invention.
圖6為本發明的發光單元的第二實施例的剖面分解示意圖。 Figure 6 is a cross-sectional, exploded view of a second embodiment of the light emitting unit of the present invention.
圖7為本發明的發光單元的第二實施例的組裝剖面示意圖。 Figure 7 is a schematic cross-sectional view showing the assembly of the second embodiment of the light-emitting unit of the present invention.
圖8為圖7的局部放大示意圖。 Figure 8 is a partially enlarged schematic view of Figure 7.
圖9為本發明的發光單元的第三實施例的組裝剖面示意圖。 Figure 9 is a schematic cross-sectional view showing the assembly of a third embodiment of the light-emitting unit of the present invention.
圖10為本發明的發光單元的第四實施例的組裝剖面示意圖。 Figure 10 is a schematic cross-sectional view showing the assembly of a fourth embodiment of the light-emitting unit of the present invention.
圖11為本發明的發光單元的第五實施例的立體分解示意圖。 Figure 11 is a perspective exploded view of a fifth embodiment of the light emitting unit of the present invention.
圖12為本發明的發光單元的第五實施例的剖面分解示意圖。 Figure 12 is a cross-sectional, exploded view showing a fifth embodiment of the light emitting unit of the present invention.
圖13為本發明的發光單元的第五實施例的組裝剖面示意圖。 Figure 13 is a cross-sectional view showing the assembly of a fifth embodiment of the light-emitting unit of the present invention.
圖14為本發明的發光單元的第六實施例的組裝剖面示意圖。 Figure 14 is a cross-sectional view showing the assembly of a sixth embodiment of the light-emitting unit of the present invention.
請一併參閱圖1至圖4，圖1為本發明的發光單元的立體示意圖；圖2為本發明的發光單元的立體分解示意圖；圖3為本發明的發光單元的剖面分解示意圖；圖4為本發明的發光單元的剖面組裝示意圖。如圖所示，發光單元100至少包含一基板10、一光學透鏡11及一發光晶片12。 1 is a perspective view of a light emitting unit of the present invention; FIG. 2 is a perspective exploded view of the light emitting unit of the present invention; FIG. 3 is a schematic exploded view of the light emitting unit of the present invention; The schematic diagram of the cross-sectional assembly of the light-emitting unit of the present invention. As shown in the figure, the light emitting unit 100 includes at least a substrate 10, an optical lens 11 and an illuminating wafer 12.
如圖2及圖3所示，基板10的一側定義為一承載面10a，基板10由所述承載面10a向內凹設形成有一環狀凹槽101，而基板10被環狀凹槽101區隔形成有一安裝區域A1，所述安裝區域A1被環狀凹槽101所圍繞。於本實施例圖中，是以環狀凹槽101呈現為圓形為例，但環狀凹槽101的外型不以圓形為限，其可依據需求變化，例如可以是橢圓形、矩形等。 As shown in FIG. 2 and FIG. 3, one side of the substrate 10 is defined as a bearing surface 10a. The substrate 10 is recessed inwardly from the bearing surface 10a to form an annular groove 101, and the substrate 10 is formed by an annular groove 101. The partition is formed with a mounting area A1 surrounded by the annular groove 101. In the embodiment of the present invention, the annular groove 101 is represented by a circular shape, but the outer shape of the annular groove 101 is not limited to a circular shape, and may be changed according to requirements, for example, an ellipse or a rectangle. Wait.
基板10設置有一卡合結構102，卡合結構102位於環狀凹槽101中，且卡合結構102是不凸出於環狀凹槽101外，即，卡合結構102是不高於承載面10a。卡合結構102的外型例如可以是環狀長方體，但不以此為限，其外型亦可依據需求變化。在實際應用中，卡合結構102可以是與基板10一體成型地設置；在特殊的應用中，卡合結構102也可以是透過二次加工的方式形成於環狀凹槽101中。其中，卡合結構102與形成環狀凹槽101的兩個彼此相對的側壁101b、101c(如圖2所示)之間是具有間隙。 The substrate 10 is provided with an engaging structure 102. The engaging structure 102 is located in the annular groove 101, and the engaging structure 102 does not protrude from the annular groove 101, that is, the engaging structure 102 is not higher than the bearing surface. 10a. The outer shape of the engaging structure 102 can be, for example, an annular rectangular parallelepiped, but not limited thereto, and the outer shape thereof can also be changed according to requirements. In practical applications, the engaging structure 102 may be integrally formed with the substrate 10; in a special application, the engaging structure 102 may also be formed in the annular groove 101 by means of secondary processing. Therein, there is a gap between the engaging structure 102 and the two mutually opposite side walls 101b, 101c (shown in FIG. 2) forming the annular groove 101.
光學透鏡11具有一連接面11a及一出光面11b。光學透鏡11由連接面11a的一側內凹形成有一凹穴111。關於凹穴111的外型及容積，可以依據發光晶片12的外型及尺寸設計，於此不 加以限制。光學透鏡11的出光面11b可以類似為半球面，而光學透鏡11具有聚光的功能。在部分未示出的實施例中，光學透鏡11亦可配合基板10形狀設計為方形凸透鏡狀。 The optical lens 11 has a connecting surface 11a and a light emitting surface 11b. The optical lens 11 is recessed by a side of the connecting surface 11a to form a recess 111. The shape and volume of the cavity 111 can be designed according to the shape and size of the light-emitting chip 12, Limit it. The light-emitting surface 11b of the optical lens 11 can be similar to a hemispherical surface, and the optical lens 11 has a function of collecting light. In an embodiment not shown in part, the optical lens 11 can also be designed in the shape of a square convex lens in cooperation with the shape of the substrate 10.
光學透鏡11由連接面11a的一側凸出形成有一輔助卡合件112，輔助卡合件112為環狀結構，且輔助卡合件112的外型大致對應於環狀凹槽101的外型。於本實施例中，是以輔助卡合件112與光學透鏡11一體成型地設置為例，但不以此為限，輔助卡合件112與光學透鏡11也可以是非一體成型地設置(如圖10所示)。輔助卡合件112的一側內凹形成有一卡合槽1121；所述卡合槽1121的外型大致對應於卡合結構102的外型，而所述卡合槽1121能容置卡合結構102的全部。 The optical lens 11 is protruded from one side of the connecting surface 11a to form an auxiliary engaging member 112. The auxiliary engaging member 112 has an annular structure, and the outer shape of the auxiliary engaging member 112 substantially corresponds to the outer shape of the annular groove 101. . In the present embodiment, the auxiliary engaging member 112 and the optical lens 11 are integrally formed as an example, but not limited thereto, the auxiliary engaging member 112 and the optical lens 11 may also be non-integrally formed (as shown in the figure). 10)). One side of the auxiliary engaging member 112 is concavely formed with an engaging groove 1121; the outer shape of the engaging groove 1121 substantially corresponds to the outer shape of the engaging structure 102, and the engaging groove 1121 can accommodate the engaging structure. All of 102.
請參閱圖4，其顯示為本發明的發光單元組合剖面示意圖。光學透鏡11設置於基板10上，且連接面11a(如圖3所示)的部份是抵靠於基板10的承載面10a。發光晶片12設置於基板10的承載面10a，且發光晶片12對應位於光學透鏡11的凹穴111中，而發光晶片12所發出的光束，將通過光學透鏡11向外射出。在部分實施例中，發光晶片12的出光面12a(如圖3所示)，可以是貼附凹穴111的端面111a(如圖3所示)，如此，發光晶片12大致沿光學透鏡11的光軸C射出的光束，將能直接進入光學透鏡11，從而可提升發光晶片12所發出的光束的利用率，特別是大致沿光學透鏡11的光軸C所射出的光束的利用率。 Please refer to FIG. 4, which is a cross-sectional view showing the combination of the light emitting unit of the present invention. The optical lens 11 is disposed on the substrate 10, and a portion of the connection surface 11a (shown in FIG. 3) is abutted against the bearing surface 10a of the substrate 10. The light-emitting chip 12 is disposed on the carrying surface 10a of the substrate 10, and the light-emitting chip 12 is correspondingly located in the recess 111 of the optical lens 11, and the light beam emitted from the light-emitting chip 12 will be emitted outward through the optical lens 11. In some embodiments, the light-emitting surface 12a of the light-emitting chip 12 (shown in FIG. 3) may be an end surface 111a (shown in FIG. 3) to which the recess 111 is attached. Thus, the light-emitting chip 12 is substantially along the optical lens 11. The light beam emitted from the optical axis C will be able to directly enter the optical lens 11, so that the utilization of the light beam emitted from the light-emitting chip 12, particularly the light beam emitted substantially along the optical axis C of the optical lens 11, can be improved.
關於發光晶片12的種類可以是依據需求選擇，舉例來說，發光晶片12所發出的光束可以是紫外光，其波長峰值可以是380奈米以下。在實際應用中也可以是採用350奈米的UV晶片，當然發光晶片12不以此為限，亦可採用有色光或紅外光晶片。另外本實施例中光學透鏡11能使發光晶片12所發出的光束可向光學透鏡11的光軸C集中，因此光學透鏡11可以是凸透鏡。但在本發明中光學透鏡11的類型是可以依據需求變化，不以凸透鏡 為限。 The type of the light-emitting chip 12 may be selected according to requirements. For example, the light beam emitted from the light-emitting chip 12 may be ultraviolet light, and the wavelength peak thereof may be 380 nm or less. In practical applications, a 350 nm UV wafer can also be used. Of course, the light emitting chip 12 is not limited thereto, and a colored light or infrared light wafer can also be used. Further, in the present embodiment, the optical lens 11 can concentrate the light beam emitted from the light-emitting chip 12 toward the optical axis C of the optical lens 11, and thus the optical lens 11 can be a convex lens. However, in the present invention, the type of the optical lens 11 can be changed according to requirements, and is not a convex lens. Limited.
在部分的實施例中凹穴111的容積是大致等於發光晶片12的尺寸，而發光晶片12能完全地容置於凹穴111中。於本實施例圖4中，是以發光晶片12的出光面12a大致貼合於形成凹穴111的端面111a，而發光晶片12與形成凹穴111的端面111a之間未具有間隙為例，但不以此為限。實際應用時，也可以是使發光晶片12與形成凹穴111的端面之間形成有預留的間隙。 In some embodiments the volume of the pocket 111 is substantially equal to the size of the luminescent wafer 12, and the luminescent wafer 12 can be completely received in the pocket 111. In the fourth embodiment of the present embodiment, the light-emitting surface 12a of the light-emitting wafer 12 is substantially attached to the end surface 111a of the recess 111, and the gap between the light-emitting wafer 12 and the end surface 111a forming the recess 111 is not shown, but Not limited to this. In practical applications, a gap may be formed between the light-emitting wafer 12 and the end surface on which the recess 111 is formed.
光學透鏡11設置於基板10上時，輔助卡合件112對應埋設於環狀凹槽101中，而卡合結構102對應設置於卡合槽1121，且卡合結構102及卡合槽1121是完全地埋設於基板10中；亦即，卡合槽1121的端面1121a是低於基板10的承載面10a。在另一實施例中，卡合槽1121的端面1121a也可以是與承載面10a齊平。 When the optical lens 11 is disposed on the substrate 10, the auxiliary engaging member 112 is correspondingly embedded in the annular groove 101, and the engaging structure 102 is correspondingly disposed on the engaging groove 1121, and the engaging structure 102 and the engaging groove 1121 are completely The ground surface is embedded in the substrate 10; that is, the end surface 1121a of the engaging groove 1121 is lower than the bearing surface 10a of the substrate 10. In another embodiment, the end surface 1121a of the engaging groove 1121 may also be flush with the bearing surface 10a.
依上所述，當光學透鏡11設置於基板10上時，光學透鏡11及基板10兩者之間，可以是透過彼此相互卡合的卡合結構102及卡合槽1121，而達到相互固定的效果；亦即，光學透鏡11及基板10彼此間可以是透過卡合結構102及卡合槽1121而相互卡合固定。 As described above, when the optical lens 11 is disposed on the substrate 10, the optical lens 11 and the substrate 10 may be mutually fixed by the engaging structure 102 and the engaging groove 1121 that are engaged with each other. The effect is that the optical lens 11 and the substrate 10 can be engaged with each other by the engagement structure 102 and the engagement groove 1121.
在實際應用中，還可以是於光學透鏡11及基板10的適當位置填充膠體，以輔助加強光學透鏡11與基板10彼此間的連接強度。舉例來說，可以是於輔助卡合件112與形成環狀凹槽101的側壁之間填充有膠體(圖未示)；或者，也可以是於卡合結構102與形成卡合槽1121的側壁之間填充膠體(圖未示)；當然，也可以是同時於輔助卡合件112與形成環狀凹槽101的側壁之間，及卡合結構102與形成卡合槽1121的側壁之間填充有膠體。在具體的實施中，可以是依據膠體的設置位置，對應使環狀凹槽101、卡合槽1121或兩者的容積，略大於相對應的輔助卡合件112及卡合結構102。 In practical applications, the colloid may be filled at appropriate positions of the optical lens 11 and the substrate 10 to assist in enhancing the connection strength between the optical lens 11 and the substrate 10. For example, a colloid (not shown) may be filled between the auxiliary engaging member 112 and the side wall forming the annular groove 101; or, the engaging structure 102 and the side wall forming the engaging groove 1121 may be used. A colloid (not shown) is filled between; of course, it may be filled between the auxiliary engaging member 112 and the side wall forming the annular groove 101, and between the engaging structure 102 and the side wall forming the engaging groove 1121. There is a gel. In a specific implementation, the volume of the annular groove 101, the engaging groove 1121 or both may be slightly larger than the corresponding auxiliary engaging member 112 and the engaging structure 102 according to the position of the colloid.
如圖3所示，在具體的實施中，環狀凹槽101的寬度W1與輔助卡合件112的寬度W2比，可以是介於1：0.95至1：1。在輔助卡合件112的寬度W2不及於環狀凹槽101的寬度W1的0.95倍的實施例中，環狀凹槽101與輔助卡合件112之間可能會存在有過大的間隙，從而可能影響兩者之間的連接強度。 As shown in FIG. 3, in a specific implementation, the width W1 of the annular groove 101 and the width W2 of the auxiliary engaging member 112 may be between 1:0.95 and 1:1. In the embodiment in which the width W2 of the auxiliary engaging member 112 is less than 0.95 times the width W1 of the annular groove 101, there may be an excessive gap between the annular groove 101 and the auxiliary engaging member 112, so that Affect the strength of the connection between the two.
在於卡合結構102及形成卡合槽1121的側壁之間填充膠體(圖未示)，以使卡合結構102與基板10相互固定的實施例中，光學透鏡11固定設置於基板10上時，卡合結構102與卡合槽1121之間可以是形成有一預留空間SP，所述預留空間SP是用來容置膠體。在實際安裝的過程中，在將光學透鏡11安裝於基板10前，可以是先於卡合結構102遠離環狀凹槽101的底部的一端面102a上設置黏膠，而後再將光學透鏡11安裝於基板10上，光學透鏡11安裝於基板10後，黏膠將會對應位於所述預留空間SP中，而後透過相關的固化作業，以使黏膠固化為膠體後，膠體將可黏著光學透鏡11與基板10，從而輔助加強光學透鏡11與基板10之間的連接強度。如圖3所示，在具體的實施中，環狀凹槽101的深度D2與輔助卡合件112的長度D1比，可以是介於1：0.5至1：0.95；如此，將可確保預留空間SP具有足夠的容積容納膠體。 In the embodiment in which the engaging structure 102 and the side wall forming the engaging groove 1121 are filled with a colloid (not shown) to fix the engaging structure 102 and the substrate 10 to each other, when the optical lens 11 is fixedly disposed on the substrate 10, A reserved space SP may be formed between the engaging structure 102 and the engaging groove 1121, and the reserved space SP is used for accommodating the colloid. In the actual installation process, before the optical lens 11 is mounted on the substrate 10, the adhesive may be disposed on an end surface 102a of the bottom of the annular structure 101 before the engaging structure 102, and then the optical lens 11 is installed. After the optical lens 11 is mounted on the substrate 10, the adhesive will be correspondingly located in the reserved space SP, and then passed through the relevant curing operation, so that the adhesive will be adhered to the optical lens after the adhesive is cured into a colloid. 11 and the substrate 10, thereby assisting in strengthening the connection strength between the optical lens 11 and the substrate 10. As shown in FIG. 3, in a specific implementation, the depth D2 of the annular groove 101 and the length D1 of the auxiliary engaging member 112 may be between 1:0.5 and 1:0.95; thus, the reservation is ensured. The space SP has a sufficient volume to accommodate the colloid.
另外，當填充於卡合槽1121與卡合結構102之間的膠體，因環境高溫而發生膨脹的現象時，膠體膨脹後的至少一部能被容置於預留空間SP；亦即，預留空間SP還可用來容置膨脹後的部分膠體。是以，透過預留空間SP的設計，可以避免因為膠體膨脹，而可能破壞光學透鏡11與基板10之間的連結強度的問題。 In addition, when the colloid filled between the engaging groove 1121 and the engaging structure 102 expands due to high ambient temperature, at least one portion of the colloid after being expanded can be accommodated in the reserved space SP; that is, The space SP can also be used to accommodate some of the expanded colloid. Therefore, by designing the reserved space SP, it is possible to avoid the problem that the strength of the connection between the optical lens 11 and the substrate 10 may be broken due to the expansion of the colloid.
特別說明的是，如圖4所示，由於環狀凹槽101及卡合槽1121皆位於基板10的承載面10a下方，且發光晶片12是設置於承載面10a上，因此，發光晶片12所發出的光束，將不容易照射到填充於環狀凹槽101或是卡合槽1121中的膠體，如此，將可大 幅提升膠體的使用壽命。換言之，膠體若設置於容易被發光晶片12所發出的光束照射的位置，膠體的老化速度，將明顯快於未被發光晶片12所照射的膠體的老化速度，特別是在發光晶片12能發出紫外光的實施例中，若膠體長期被紫外光照射，其老化速度將明顯加速。 Specifically, as shown in FIG. 4, since the annular groove 101 and the engaging groove 1121 are both located under the bearing surface 10a of the substrate 10, and the light-emitting chip 12 is disposed on the bearing surface 10a, the light-emitting chip 12 is The emitted light beam will not easily illuminate the colloid filled in the annular groove 101 or the engaging groove 1121, so that it will be large Increases the life of the gel. In other words, if the colloid is disposed at a position where it is easily irradiated by the light beam emitted from the light-emitting chip 12, the aging speed of the colloid will be significantly faster than the aging speed of the colloid not irradiated by the light-emitting wafer 12, particularly in the luminescent wafer 12 capable of emitting ultraviolet light. In the embodiment of light, if the colloid is irradiated with ultraviolet light for a long time, the aging speed will be significantly accelerated.
另外，由於環狀凹槽101及卡合槽1121皆位於基板10的承載面10a下方，因此，卡合結構102及用以使光學透鏡11與基板10相互黏合的膠體，將不會阻擋或是影響發光晶片12所發出的光束通過光學透鏡11向外射出。 In addition, since the annular groove 101 and the engaging groove 1121 are located under the bearing surface 10a of the substrate 10, the engaging structure 102 and the colloid for bonding the optical lens 11 and the substrate 10 to each other will not block or The light beam emitted by the light-emitting wafer 12 is emitted outward through the optical lens 11.
需說明的是，上述本發明的發光單元100，透過環狀凹槽101、卡合結構102及卡合槽1121的設計，將可使光學透鏡11及發光晶片12正確地設置於基板10上預定的位置，進而可使發光晶片12所發出的光束通過光學透鏡11後產生預定的光形。換言之，若光學透鏡11設置於基板10上的位置及發光晶片12設置於基板10上的位置，兩者並未設置於預定的位置時，發光單元100所產生的光形，將可能與預期的光形不同。 It should be noted that, in the above-mentioned light-emitting unit 100 of the present invention, through the design of the annular groove 101, the engaging structure 102 and the engaging groove 1121, the optical lens 11 and the light-emitting chip 12 can be correctly disposed on the substrate 10. The position, in turn, allows the light beam emitted by the luminescent wafer 12 to pass through the optical lens 11 to produce a predetermined light shape. In other words, if the position of the optical lens 11 on the substrate 10 and the position where the light-emitting chip 12 is disposed on the substrate 10 are not disposed at predetermined positions, the light shape generated by the light-emitting unit 100 may be expected. The light shape is different.
是以，上述本發明的發光單元100，透過環狀凹槽101、卡合結構102及卡合槽1121的設計，不但可以使光學透鏡11及發光晶片12正確地設置於基板10上的預定位置，從而可使發光單元100能產生預期的光形，還可以讓用以黏著光學透鏡11及基板10的膠體，不易被發光晶片12所發出的光束直接照射，而使膠體具有較長的使用壽命。 Therefore, the light-emitting unit 100 of the present invention transmits through the annular groove 101, the engaging structure 102, and the engaging groove 1121, so that the optical lens 11 and the light-emitting chip 12 can be accurately placed at a predetermined position on the substrate 10. Therefore, the light-emitting unit 100 can produce the desired light shape, and the glue for adhering the optical lens 11 and the substrate 10 can be directly irradiated by the light beam emitted from the light-emitting chip 12, so that the gel has a long service life. .
上述本發明的發光單元的製作步驟可以是包含：一基板成型步驟：於基板的承載面，向內凹設形成環狀凹槽及卡合結構；其中，所述卡合結構位於所述環狀凹槽中，且卡合結構不凸出承載面；其中，所述環狀凹槽區隔所述承載面有一安裝區域，所述 安裝區域被所述環狀凹槽所圍繞；一發光晶片固定步驟：將發光晶片固定設置於所述安裝區域，並使發光晶片與基板電性連接；一光學透鏡固定步驟：使光學透鏡的輔助卡合件固定設置於環狀凹槽中，並使卡合結構對應位於輔助卡合件的卡合槽中，據以使光學透鏡固定於基板的承載面；其中，發光晶片對應設置於光學透鏡的凹穴中，而發光晶片所發出的光束，能通過光學透鏡向外射出；其中，卡合結構與卡合槽之間形成有預留空間。 The manufacturing step of the light-emitting unit of the present invention may include: a substrate forming step of forming an annular groove and a snapping structure inwardly on the bearing surface of the substrate; wherein the engaging structure is located in the ring shape In the groove, and the engaging structure does not protrude from the bearing surface; wherein the annular groove has a mounting area separated by the bearing surface, The mounting area is surrounded by the annular groove; an illuminating wafer fixing step: fixing the illuminating wafer to the mounting area and electrically connecting the illuminating wafer to the substrate; and an optical lens fixing step: assisting the optical lens The engaging member is fixedly disposed in the annular groove, and the engaging structure is correspondingly located in the engaging groove of the auxiliary engaging member, so that the optical lens is fixed to the bearing surface of the substrate; wherein the light emitting chip is correspondingly disposed on the optical lens In the recess, the light beam emitted by the light-emitting chip can be emitted outward through the optical lens; wherein a reserved space is formed between the engaging structure and the engaging groove.
上述各步驟中所述及的構件，請參閱前述實施例所述，於此不再贅述。在不同的製作步驟中，於光學透鏡固定步驟前還可以包含有一點膠步驟：將黏膠設置於卡合結構遠離環狀凹槽的底部的端面；在光學透鏡固定步驟中，所述黏膠將對應位於預留空間中；於光學透鏡固定步驟後，還可以包含有一固化步驟：對所述黏膠照射預定的光束，以使黏膠固化為膠體。 For the components described in the above steps, please refer to the foregoing embodiments, and details are not described herein again. In a different manufacturing step, before the optical lens fixing step, a glue step may be included: the adhesive is disposed on the end surface of the engaging structure away from the bottom of the annular groove; in the optical lens fixing step, the adhesive Correspondingly located in the reserved space; after the optical lens fixing step, a curing step may also be included: the predetermined beam is irradiated to the adhesive to cure the adhesive into a colloid.
請一併參閱圖5至圖8，其為本發明的發光單元的第二實施例的示意圖。如圖所示，本實施例與前述實施例最大差異在於：發光單元100還可以是包含有一輔助透鏡14；卡合結構102可以是具有一第一台階部1021及一第二台階部1022。於以下說明中，僅針對輔助透鏡14、第一台階部1021及第二台階部1022進行詳細說明，其餘構件的詳細說明請參閱前述實施例，以下將不再贅述。 Please refer to FIG. 5 to FIG. 8 together, which are schematic diagrams of a second embodiment of the light emitting unit of the present invention. As shown in the figure, the maximum difference between the embodiment and the foregoing embodiment is that the light-emitting unit 100 further includes an auxiliary lens 14; the engaging structure 102 may have a first step portion 1021 and a second step portion 1022. In the following description, only the auxiliary lens 14, the first step portion 1021, and the second step portion 1022 will be described in detail. For the detailed description of the remaining components, refer to the foregoing embodiment, and details are not described herein again.
特別強調的是，雖然本實施例的圖式，是以發光單元100同時具有輔助透鏡14，且卡合結構102具有第一台階部1021及第二台階部1022為例，但發光單元100實際可實施的方式，非限定於同時具有輔助透鏡14、第一台階部1021及第二台階部 1022，在不同的實施例中，發光單元100也可以是僅具有輔助透鏡14，而不具有第一台階部1021及第二台階部1022，或者，發光單元100亦可以是僅具有第一台階部1021及第二台階部1022，但不具有輔助透鏡14。 It is particularly emphasized that although the drawing of the present embodiment is such that the light emitting unit 100 has the auxiliary lens 14 at the same time, and the engaging structure 102 has the first step portion 1021 and the second step portion 1022 as an example, the light emitting unit 100 may actually The manner of implementation is not limited to having the auxiliary lens 14, the first step portion 1021 and the second step portion at the same time. 1022, in different embodiments, the light emitting unit 100 may have only the auxiliary lens 14 without the first step portion 1021 and the second step portion 1022, or the light emitting unit 100 may have only the first step portion. 1021 and second step portion 1022, but without auxiliary lens 14.
輔助透鏡14設置於基板10的承載面10a，且輔助透鏡14位於安裝區域A1中，亦即，輔助透鏡14是被環狀凹槽101環繞。輔助透鏡14的一側內凹形成有一容槽141，所述容槽141用以設置發光晶片12。於本實施例圖中，是以容槽141貫穿輔助透鏡14為例，但不以此為限，在不同的應用中，容槽141也可以是不貫穿輔助透鏡14設置。 The auxiliary lens 14 is disposed on the bearing surface 10a of the substrate 10, and the auxiliary lens 14 is located in the mounting area A1, that is, the auxiliary lens 14 is surrounded by the annular groove 101. One side of the auxiliary lens 14 is concavely formed with a cavity 141 for arranging the light-emitting chip 12. In the embodiment of the present invention, the auxiliary groove 14 is inserted through the auxiliary lens 14 as an example. However, the groove 141 may not be disposed through the auxiliary lens 14 in different applications.
輔助透鏡14能與光學透鏡11相互配合，以使發光單元100產生不同的預定光形。也就是說，本實施例的發光單元100除了可以直接通過改變光學透鏡11的外型，來改變發光單元100所產生的光形外，還可以透過輔助透鏡14來改變發光單元100所產生的光形。 The auxiliary lens 14 can cooperate with the optical lens 11 to cause the light emitting unit 100 to produce different predetermined light shapes. That is to say, the light-emitting unit 100 of the present embodiment can change the light shape generated by the light-emitting unit 100 by changing the appearance of the optical lens 11, and can also change the light generated by the light-emitting unit 100 through the auxiliary lens 14. shape.
另外，輔助透鏡14也可以是用來改變發光晶片12所發出的光束進入光學透鏡11的光路，據以使發光晶片12所發出的光束，能更向光學透鏡11的光軸C集中。舉例來說，在發光晶片12所發出的側向光(大致沿圖7中所示座標軸+Y軸、-Y軸方向射出的光束)的光通量，大於發光晶片12所發出的正向光(大致沿圖7中所示座標軸+Z軸、-Z軸方向射出的光束)的光通量的實施例中，發光晶片12所發出的側向光，可以是通過輔助透鏡14的導引，而向光學透鏡11的光軸靠近，藉此，將可使發光晶片12所發出的光束，能更集中於光學透鏡11的光軸。 Further, the auxiliary lens 14 may be an optical path for changing the light beam emitted from the light-emitting chip 12 into the optical lens 11, so that the light beam emitted from the light-emitting chip 12 can be concentrated toward the optical axis C of the optical lens 11. For example, the luminous flux emitted by the light-emitting wafer 12 (substantially along the coordinate axis +Y-axis, -Y-axis direction shown in FIG. 7) is greater than the forward light emitted by the light-emitting chip 12 (roughly In the embodiment of the luminous flux of the light beam emitted along the coordinate axis +Z axis and the -Z axis direction shown in FIG. 7, the lateral light emitted by the light emitting chip 12 may be guided by the auxiliary lens 14 to the optical lens. The optical axis of 11 is close to each other, whereby the light beam emitted from the light-emitting wafer 12 can be more concentrated on the optical axis of the optical lens 11.
在使輔助透鏡14的容槽141貫穿輔助透鏡14的實施例中，可以是讓發光晶片12的出光面12a(如圖6所示)，貼附凹穴111的端面111a，如此，發光晶片12大致沿光學透鏡11的光軸C射出的光束，將能直接進入光學透鏡11，而不會經過輔助透鏡 14，從而可提升發光晶片12所發出的光束的利用率，特別是大致沿光學透鏡11的光軸C所射出的光束的利用率。 In the embodiment in which the cavity 141 of the auxiliary lens 14 is inserted through the auxiliary lens 14, the light-emitting surface 12a of the light-emitting chip 12 (as shown in FIG. 6) may be attached to the end surface 111a of the cavity 111. Thus, the light-emitting chip 12 A light beam that is emitted substantially along the optical axis C of the optical lens 11 will be able to directly enter the optical lens 11 without passing through the auxiliary lens. 14. Thereby, the utilization of the light beam emitted from the light-emitting chip 12, particularly the light beam emitted substantially along the optical axis C of the optical lens 11, can be improved.
在具體實施中，輔助透鏡14與光學透鏡11可以是由相同的材質所製成，而輔助透鏡14及光學透鏡11可以是具有大致相同的折射率，但不以此為限。輔助透鏡14與光學透鏡11也可以是由不同的材質所製成，而兩者具有不相同的折射率；具有不同折射率的輔助透鏡14及光學透鏡11，可以是配合輔助透鏡14的外型及凹穴111的外型，使發光單元100產生預定的光形。 In an embodiment, the auxiliary lens 14 and the optical lens 11 may be made of the same material, and the auxiliary lens 14 and the optical lens 11 may have substantially the same refractive index, but not limited thereto. The auxiliary lens 14 and the optical lens 11 may also be made of different materials, and the two have different refractive indexes; the auxiliary lens 14 and the optical lens 11 having different refractive indexes may be the shape of the auxiliary lens 14 And the appearance of the recess 111 causes the light emitting unit 100 to generate a predetermined light shape.
如圖6所示，在具體實施中，環狀凹槽101的寬度W1與輔助卡合件112的寬度W2比，可以是介於1：0.95至1：1。在輔助卡合件112的寬度W2不及於環狀凹槽101的寬度W1的0.95倍的實施例中，環狀凹槽101與輔助卡合件112之間可能會存在有過大的間隙，從而可能影響兩者之間的連接強度。 As shown in FIG. 6, in a specific implementation, the width W1 of the annular groove 101 and the width W2 of the auxiliary engaging member 112 may be between 1:0.95 and 1:1. In the embodiment in which the width W2 of the auxiliary engaging member 112 is less than 0.95 times the width W1 of the annular groove 101, there may be an excessive gap between the annular groove 101 and the auxiliary engaging member 112, so that Affect the strength of the connection between the two.
在具體實施中，環狀凹槽101的深度D2與輔助卡合件112的長度D1比，可以是介於1：0.5至1：0.95。若輔助卡合件112的長度D1不及於環狀凹槽101的深度D2的0.5倍，於生產製造過程中，為了使光學透鏡11與基板10相互固定時，卡合槽1121能對應位於承載面10a的下方，可能導致第二容槽11212的深度太淺，進而可能使得光學透鏡11的製造困難。 In a specific implementation, the depth D2 of the annular groove 101 and the length D1 of the auxiliary engaging member 112 may be between 1:0.5 and 1:0.95. If the length D1 of the auxiliary engaging member 112 is less than 0.5 times the depth D2 of the annular groove 101, in order to fix the optical lens 11 and the substrate 10 to each other during the manufacturing process, the engaging groove 1121 can be correspondingly located on the bearing surface. Below the 10a, the depth of the second pocket 11212 may be too shallow, which may make the manufacture of the optical lens 11 difficult.
如圖5及圖6所示，卡合結構102具有的第一台階部1021可以是由環狀凹槽101的底部101a向承載面10a方向延伸形成，而第二台階部1022則是由第一台階部1021遠離環狀凹槽101的底部101a的一端，向承載面10a的方向延伸形成，且第一台階部1021的最大寬度W3小於環狀凹槽101的寬度W1，第二台階部1022的最大寬度W4小於第一台階部1021的最小寬度W3，亦即，第一台階部1021及第二台階部1022大致呈現為階梯狀結構。卡合槽1121區分有一第一容槽11211及一第二容槽11212，第一容槽11211能容置第一台階部1021，第二容槽11212能容置 第二台階部1022。於本實施例中，是以第一台階部1021及第二台階部1022分別為長方立柱結構為例，但不以此為限，在不同的實施例中，第一台階部1021及第二台階部1022也可以是截圓錐體、截角錐體等。 As shown in FIG. 5 and FIG. 6, the first step portion 1021 of the engaging structure 102 may be formed by extending from the bottom portion 101a of the annular groove 101 toward the bearing surface 10a, and the second step portion 1022 is first. The step portion 1021 is away from one end of the bottom portion 101a of the annular groove 101, and is formed to extend in the direction of the bearing surface 10a, and the maximum width W3 of the first step portion 1021 is smaller than the width W1 of the annular groove 101, and the second step portion 1022 is The maximum width W4 is smaller than the minimum width W3 of the first step portion 1021, that is, the first step portion 1021 and the second step portion 1022 are substantially in a stepped configuration. The engaging groove 1121 is divided into a first receiving slot 11211 and a second receiving slot 11212. The first receiving slot 11211 can accommodate the first step portion 1021, and the second receiving slot 11212 can be received. The second step portion 1022. In this embodiment, the first step portion 1021 and the second step portion 1022 are each a rectangular column structure, but not limited thereto. In different embodiments, the first step portion 1021 and the second portion are different. The step portion 1022 may also be a truncated cone, a truncated cone, or the like.
如圖7及圖8所示，當光學透鏡11設置於基板10上時，第一台階部1021是對應容置於第一容槽11211，而第二台階部1022是對應容置於第二容槽11212，且第二容槽11212與第二台階部1022之間形成有預留空間SP。在將光學透鏡11安裝於基板10的過程中，可以是先於第二台階部1022遠離第一台階部1021的端面1022a(如圖6所示)設置黏膠，再將光學透鏡11設置於基板10上，黏膠則將對應位於預留空間SP中，而後再透過相關的固化作業，以使黏膠固化為膠體13，如此，將可透過膠體13以加強光學透鏡11與基板10兩者間的連接強度。特別說明的是，發光單元100也可以是不設置有膠體13，而光學透鏡11與基板10將僅通過卡合結構102及卡合槽1121以彼此相互固定。 As shown in FIG. 7 and FIG. 8 , when the optical lens 11 is disposed on the substrate 10 , the first step portion 1021 is correspondingly received in the first cavity 11211 , and the second step portion 1022 is correspondingly disposed in the second cavity. A groove 11212 is formed, and a reserved space SP is formed between the second cavity 11212 and the second step portion 1022. In the process of mounting the optical lens 11 on the substrate 10, the adhesive may be disposed before the second step portion 1022 away from the end surface 1022a of the first step portion 1021 (as shown in FIG. 6), and then the optical lens 11 is disposed on the substrate. On the 10th, the adhesive will be correspondingly located in the reserved space SP, and then passed through the relevant curing operation to cure the adhesive into the colloid 13, so that the colloid 13 will be permeable to strengthen the optical lens 11 and the substrate 10. Connection strength. In particular, the light-emitting unit 100 may not be provided with the colloid 13 , and the optical lens 11 and the substrate 10 will be fixed to each other only by the engaging structure 102 and the engaging groove 1121 .
如圖6所示，在具體的實施中，第二台階部1022的高度D3與第二容槽11212的深度D4比，可以是介於0.33：1至0.5：1，如此，將可確保預留空間SP能有足夠的空間容置膠體13。 As shown in FIG. 6, in a specific implementation, the height D3 of the second step portion 1022 and the depth D4 of the second pocket 11212 may be between 0.33:1 and 0.5:1, so that the reservation is ensured. The space SP can have enough space to accommodate the colloid 13.
在第二台階部1022的高度D3為第二容槽11212的深度D4的0.6倍以上的實施例中，可能會發生預留空間SP沒有足夠的空間容置受熱膨脹的膠體13，進而可能發生膠體13擠壓形成卡合槽1121的側壁或是卡合結構102，導致發光單元100產生的光形受影響的問題。 In the embodiment in which the height D3 of the second step portion 1022 is 0.6 times or more the depth D4 of the second pocket 11212, it may happen that the reserved space SP does not have enough space to accommodate the colloid 13 which is thermally expanded, and thus colloid may occur. 13 is pressed to form the side wall of the engaging groove 1121 or the engaging structure 102, resulting in a problem that the light shape generated by the light emitting unit 100 is affected.
在第二台階部1022的的高度D3不及於第二容槽11212的深度D4的0.33倍的實施例中，在光學透鏡11安裝於基板10的過程中，被設置於第二台階部1022的端面上的黏膠，可能會因為第二台階部1022的的高度D3太短，而溢流至第一台階部1021與形成卡合槽1121的側壁之間，如此，黏膠固化為膠體後，將 可能影響發光單元100所產生的光形。 In the embodiment in which the height D3 of the second step portion 1022 is less than 0.33 times the depth D4 of the second pocket 11212, the end surface of the second step portion 1022 is disposed in the process of mounting the optical lens 11 on the substrate 10. The upper adhesive may overflow between the first step portion 1021 and the side wall forming the engaging groove 1121 because the height D3 of the second step portion 1022 is too short, so that after the adhesive is cured into a colloid, It may affect the light shape produced by the light emitting unit 100.
在具體的實施中，第二台階部1022的寬度W4與第二容槽11212的寬度W5比，可以是介於0.98：1至1：1。在第二台階部1022的寬度W4不及於第二容槽11212的寬度W5的0.98倍的實施例中，將可能發生第二台階部1022與第二容槽11212彼此間對位卡合的精準度，從而影響發光單元100所產生的光形。 In a specific implementation, the width W4 of the second step portion 1022 is greater than the width W5 of the second pocket 11212, and may be between 0.98:1 and 1:1. In the embodiment in which the width W4 of the second step portion 1022 is less than 0.98 times the width W5 of the second pocket 11212, the accuracy of the alignment between the second step portion 1022 and the second pocket 11212 may occur. , thereby affecting the light shape produced by the light emitting unit 100.
在具體的實施中，第一台階部1021的高度D5與第一容槽11211的深度D6比，可以是介於1：0.9至1：0.95。在第一台階部1021的高度D5不及於第一容槽11211的深度D6的0.9倍的實施例中，光學透鏡11安裝於基板10上時，可能發生第一台階部1021與形成第一容槽11211的側壁之間所存在的間隙過大，從而影響光學透鏡11與基板10之間的連接強度的問題。 In a specific implementation, the height D5 of the first step portion 1021 and the depth D6 of the first pocket 11211 may be between 1:0.9 and 1:0.95. In the embodiment in which the height D5 of the first step portion 1021 is less than 0.9 times the depth D6 of the first pocket 11211, when the optical lens 11 is mounted on the substrate 10, the first step portion 1021 and the formation of the first pocket may occur. The gap existing between the side walls of 11211 is excessively large, thereby affecting the problem of the connection strength between the optical lens 11 and the substrate 10.
在具體的實施中，第一台階部1021的寬度W3與第一容槽11211的寬度W6比，可以是介於0.95：1至1：1。在第一台階部1021的寬度W3不及於第一容槽11211的寬度W6的0.95倍的實施例中，在光學透鏡11安裝於基板10的過程中，被設置於第二台階部1022的端面上的黏膠，可能會溢流至第一台階部1021與形成卡合槽1121的側壁之間，如此，由黏膠固化後的膠體將可能影響發光單元100所產生的光形。 In a specific implementation, the width W3 of the first step portion 1021 is greater than the width W6 of the first pocket 11211, and may be between 0.95:1 and 1:1. In the embodiment in which the width W3 of the first step portion 1021 is less than 0.95 times the width W6 of the first pocket 11211, the optical lens 11 is disposed on the end surface of the second step portion 1022 during the mounting of the optical lens 11 on the substrate 10. The adhesive may overflow between the first step portion 1021 and the side wall forming the engaging groove 1121. Thus, the colloid cured by the adhesive may affect the light shape generated by the light emitting unit 100.
透過上述第一台階部1021及第二台階部1022的設計，將可更精確地控制光學透鏡11設置於基板10上的位置，進而更精確地控制發光單元100所產生的光形。 Through the design of the first step portion 1021 and the second step portion 1022 described above, the position where the optical lens 11 is disposed on the substrate 10 can be more precisely controlled, thereby more precisely controlling the light shape generated by the light emitting unit 100.
上述實施例的製作步驟可以是包含：一基板成型步驟：於基板的承載面，向內凹設形成環狀凹槽及卡合結構；其中，所述卡合結構位於所述環狀凹槽中，且卡合結構不凸出承載面；其中，所述環狀凹槽區隔所述承載面有一安裝區域，所述 安裝區域被所述環狀凹槽所圍繞；其中，所述卡合結構具有第一台階部及第二台階部，第一台階部由環狀凹槽的底部向外延伸形成，第二台階部由第一台階部向遠離環狀凹槽的底部的方向延伸形成；一發光晶片固定步驟：將發光晶片固定設置於所述安裝區域，並使發光晶片與基板電性連接；一光學透鏡固定步驟：使光學透鏡的輔助卡合件固定設置於環狀凹槽中，並使卡合結構對應位於輔助卡合件的卡合槽中，據以使光學透鏡固定於基板的承載面；其中，發光晶片對應設置於光學透鏡的凹穴中，而發光晶片所發出的光束，能通過光學透鏡向外射出；其中，卡合槽具有第一容槽及第二容槽，第一台階部及第二台階部對應設置於第一容槽及第二容槽中，且第二台階部與第二容槽之間形成有預留空間。 The manufacturing step of the above embodiment may include: a substrate forming step of: forming an annular groove and a snapping structure inwardly on the bearing surface of the substrate; wherein the engaging structure is located in the annular groove And the engaging structure does not protrude from the bearing surface; wherein the annular groove has a mounting area separated by the bearing surface, The mounting area is surrounded by the annular groove; wherein the engaging structure has a first step portion and a second step portion, the first step portion is formed by extending outward from the bottom of the annular groove, and the second step portion is formed Forming the first step portion away from the bottom of the annular groove; an illuminating wafer fixing step: fixing the illuminating wafer to the mounting area, and electrically connecting the illuminating wafer to the substrate; and an optical lens fixing step : fixing the auxiliary engaging member of the optical lens in the annular groove, and positioning the engaging structure in the engaging groove of the auxiliary engaging member, so that the optical lens is fixed on the bearing surface of the substrate; wherein, the light is emitted The wafer is correspondingly disposed in the recess of the optical lens, and the light beam emitted by the light emitting chip can be emitted outward through the optical lens; wherein the engaging groove has a first cavity and a second cavity, the first step and the second The step portion is correspondingly disposed in the first receiving groove and the second receiving groove, and a reserved space is formed between the second step portion and the second receiving groove.
上述各步驟中所述及的構件，請參閱前述實施例所述，於此不再贅述。在不同的製作步驟中，於光學透鏡固定步驟前還可以包含有一點膠步驟：將黏膠設置於第二台階部遠離第一台階部的端面；在光學透鏡固定步驟中，所述黏膠將對應位於預留空間中；於光學透鏡固定步驟後，還可以包含有一固化步驟：對所述黏膠照射預定的光束，以使黏膠固化為膠體。 For the components described in the above steps, please refer to the foregoing embodiments, and details are not described herein again. In a different manufacturing step, before the optical lens fixing step, a glue step may be further included: the adhesive is disposed on the end surface of the second step portion away from the first step portion; in the optical lens fixing step, the adhesive will be Correspondingly located in the reserved space; after the optical lens fixing step, a curing step may be further included: irradiating the adhesive with a predetermined beam to cure the adhesive into a colloid.
請參閱圖9，其為本發明的發光單元的第三實施例的剖面示意圖。如圖所示，本實施例與前述實施例最大差異在於：輔助透鏡14與形成凹穴111的端面111a之間可以是形成有一容置空間 (圖為標示)，所述容置空間填充有透光膠15，而輔助透鏡14可以是透過透光膠15與形成凹穴111的端面111a相互連接。其中，透光膠15的折射率可以是與光學透鏡11的折射率或是輔助透鏡14的折射率相同。 Please refer to FIG. 9, which is a cross-sectional view showing a third embodiment of the light emitting unit of the present invention. As shown in the figure, the biggest difference between this embodiment and the foregoing embodiment is that an accommodating space may be formed between the auxiliary lens 14 and the end surface 111a forming the recess 111. (The figure is labeled), the accommodating space is filled with the light-transmitting glue 15, and the auxiliary lens 14 may be connected to the end surface 111a forming the recess 111 through the light-transmitting glue 15. The refractive index of the light transmissive glue 15 may be the same as the refractive index of the optical lens 11 or the refractive index of the auxiliary lens 14.
特別說明的是，在不同的實施例中，透光膠15也可以是填充於輔助透鏡14的環側壁與凹穴111的環側壁之間，也就是說，輔助透鏡14與光學透鏡11的連接，是通過位於輔助透鏡14的環側壁與凹穴111的環側壁之間的透光膠15，而輔助透鏡14與形成凹穴111的端面111a之間的容置空間，則是用來容置被輔助透鏡14及光學透鏡11擠壓而逸出的透光膠15。 In particular, in different embodiments, the light transmissive glue 15 may also be filled between the ring side wall of the auxiliary lens 14 and the ring side wall of the recess 111, that is, the connection of the auxiliary lens 14 and the optical lens 11. The light-transmitting glue 15 is disposed between the side wall of the ring of the auxiliary lens 14 and the side wall of the recess 111, and the accommodating space between the auxiliary lens 14 and the end surface 111a of the recess 111 is used for accommodating. The light transmissive glue 15 that is pressed by the auxiliary lens 14 and the optical lens 11 to escape.
請參閱圖10，其為本發明的發光單元的第四實施例的剖面示意圖。如圖所示，本實施例與前述實施例最大差異在於：輔助卡合件112與光學透鏡11非一體成型地設置，且輔助卡合件112與光學透鏡11之間設置有一遮光件16，所述遮光件16能阻止發光晶片12所發出的光束，進入輔助卡合件112，如此，將可確保發光晶片12所發出的光束，不會照射到位於環狀凹槽101或是卡合槽1121中的膠體13，而可延長位於環狀凹槽101或是卡合槽1121中的膠體13的使用壽命。在另一實施例中，輔助卡合件112與光學透鏡11之間也可以是不設置有遮光件16，而輔助卡合件112可以是直接為不透光結構，如此，亦可達到上述提升膠體13的使用壽命的效果。另外，所述遮光件16也可以是置換為一反射件，從而將欲進入卡合結構102中的光束，反射回光學透鏡11中；反射件例如可以是塗佈形成於卡合結構102與光學透鏡11之間的層狀結構，但不以此為限。 Please refer to FIG. 10, which is a cross-sectional view showing a fourth embodiment of the light emitting unit of the present invention. As shown in the figure, the maximum difference between the embodiment and the foregoing embodiment is that the auxiliary engaging member 112 is not integrally formed with the optical lens 11 , and a light shielding member 16 is disposed between the auxiliary engaging member 112 and the optical lens 11 . The light-shielding member 16 can block the light beam emitted from the light-emitting chip 12 and enter the auxiliary engaging member 112. Thus, the light beam emitted from the light-emitting chip 12 can be ensured without being irradiated to the annular groove 101 or the engaging groove 1121. The colloid 13 in the middle can extend the service life of the colloid 13 located in the annular groove 101 or the engaging groove 1121. In another embodiment, the auxiliary engaging member 112 and the optical lens 11 may not be provided with the light shielding member 16, and the auxiliary engaging member 112 may be directly opaque, so that the lifting may be achieved. The effect of the service life of the colloid 13. In addition, the light blocking member 16 may also be replaced by a reflecting member to reflect the light beam to enter the engaging structure 102 back into the optical lens 11; the reflecting member may be coated and formed on the engaging structure 102 and the optical, for example. The layered structure between the lenses 11 is not limited thereto.
請一併參閱圖11至圖13，其為本發明的發光單元的第五實施例的示意圖。如圖所述，發光單元200包含一基板20、一光學透鏡21及一發光晶片22。 Please refer to FIG. 11 to FIG. 13 together, which is a schematic diagram of a fifth embodiment of the light emitting unit of the present invention. As shown in the figure, the light emitting unit 200 includes a substrate 20, an optical lens 21, and a light emitting chip 22.
基板20的一側定義為一承載面20a，基板20由所述承載面 20a向內凹設形成有一卡合槽201，卡合槽201為環狀，而基板20被卡合槽201區隔形成有一安裝區域A1，所述安裝區域A1被卡合槽201所圍繞。於本實施例圖中，是以卡合槽201呈現為圓形環狀為例，但卡合槽201的外型不以圓形為限，其可依據需求變化，例如可以是橢圓形環狀、矩形環狀等。 One side of the substrate 20 is defined as a bearing surface 20a from which the substrate 20 is An engaging groove 201 is formed in the recessed portion 20a. The engaging groove 201 is annular, and the base plate 20 is partitioned by the engaging groove 201 to form a mounting area A1. The mounting area A1 is surrounded by the engaging groove 201. In the embodiment of the present invention, the engagement groove 201 is represented by a circular ring shape, but the shape of the engagement groove 201 is not limited to a circle, and may be changed according to requirements, for example, an elliptical ring shape. , rectangular ring, etc.
光學透鏡21具有一連接面21a及一出光面21b。光學透鏡21由連接面21a的一側內凹形成有一凹穴211。關於凹穴211的外型及容積，可以依據發光晶片22的外型及尺寸設計，於此不加以限制。光學透鏡21的出光面21b可以類似為半球面，而光學透鏡21具有聚光的功能。 The optical lens 21 has a connecting surface 21a and a light emitting surface 21b. The optical lens 21 is recessed by a side of the connecting surface 21a to form a recess 211. The shape and volume of the recess 211 can be designed according to the shape and size of the light-emitting chip 22, and is not limited herein. The light-emitting surface 21b of the optical lens 21 can be similar to a hemispherical surface, and the optical lens 21 has a function of collecting light.
卡合結構212具有一第一台階部2121及一第二台階部2122，第一台階部2121由光學透鏡21的連接面21a延伸形成，第二台階部2122由第一台階部2121向遠離連接面21a延伸形成，且第二台階部2122的寬度小於第一台階部2121的寬度。其中，第一台階部2121及第二台階部2122皆分別呈現為圓環立柱狀，但其外型、尺寸等幾何關係不以圖中所示為限，可依據需求變化。在不同的應用中，第一台階部2121及第二台階部2122也可以是分別呈現為橢圓環立柱狀、方形環立柱狀等。於本實施例中，是以卡合結構212與光學透鏡21一體成型地設置為例，但不以此為限，在不同的應用中，卡合結構212也可以是不與光學透鏡21一體成形地設置。 The engaging structure 212 has a first step portion 2121 and a second step portion 2122. The first step portion 2121 is formed by the connecting surface 21a of the optical lens 21, and the second step portion 2122 is separated from the connecting surface by the first step portion 2121. The 21a is formed to extend, and the width of the second step portion 2122 is smaller than the width of the first step portion 2121. The first step portion 2121 and the second step portion 2122 are respectively formed in a circular column shape, but the geometrical relationship such as the appearance and the size is not limited to the one shown in the figure, and may be changed according to requirements. In different applications, the first step portion 2121 and the second step portion 2122 may each have an elliptical ring column shape, a square ring column shape, or the like. In the present embodiment, the engaging structure 212 is integrally formed with the optical lens 21 as an example, but not limited thereto. In different applications, the engaging structure 212 may not be integrally formed with the optical lens 21. Ground setting.
如圖11及圖12所示，卡合槽201區分有一第一容槽2011及一第二容槽2012，第一容槽2011的寬度W7大於第二容槽2012的寬度W8，而第一容槽2011用以容置第一台階部2121，第二容槽2012則用以容置第二台階部2122。第一容槽2011及第二容槽2012分別為圓環狀，但不以此為限；在不同的應用中，第一容槽2011及第二容槽2012也可以是分別呈現為橢圓環狀、方形環狀等。 As shown in FIG. 11 and FIG. 12, the engaging groove 201 is divided into a first receiving groove 2011 and a second receiving groove 2012. The width W7 of the first receiving groove 2011 is greater than the width W8 of the second receiving groove 2012, and the first capacity is The slot 2011 is for receiving the first step portion 2121. The second slot portion 2012 is for receiving the second step portion 2122. The first pocket 2011 and the second pocket 2012 are respectively annular, but not limited thereto; in different applications, the first pocket 2011 and the second pocket 2012 may also be elliptical rings respectively. , square ring and so on.
如圖13所示，光學透鏡21設置於基板20上，且連接面21a(如圖12所示)的部份是抵靠於基板20的承載面20a。發光晶片22設置於基板20的承載面20a，且發光晶片22對應位於光學透鏡21的凹穴211中，而發光晶片22所發出的光束，將通過光學透鏡21向外射出。其中，發光晶片22的出光面22a(如圖12所示)，可以是貼附凹穴211的端面211a(如圖12所示)，如此，發光晶片22大致沿光學透鏡21的光軸C射出的光束，將能直接進入光學透鏡21，從而可提升發光晶片22所發出的光束的利用率，特別是大致沿光學透鏡21的光軸C所射出的光束的利用率。關於發光晶片22的種類可以是依據需求選擇，舉例來說，發光晶片22所發出的光束，其波長峰值可以是在350奈米至370奈米之間。於本實施例中光學透鏡21能使發光晶片22所發出的光束，向光學透鏡21的光軸C集中，而光學透鏡21可以是凸透鏡，但光學透鏡21的類型，可以是依據需求變化，不以凸透鏡為限。 As shown in FIG. 13, the optical lens 21 is disposed on the substrate 20, and a portion of the connection surface 21a (shown in FIG. 12) abuts against the bearing surface 20a of the substrate 20. The light-emitting chip 22 is disposed on the carrying surface 20a of the substrate 20, and the light-emitting chip 22 is correspondingly located in the recess 211 of the optical lens 21, and the light beam emitted by the light-emitting chip 22 will be emitted outward through the optical lens 21. The light-emitting surface 22a of the light-emitting chip 22 (shown in FIG. 12) may be an end surface 211a (shown in FIG. 12) to which the recess 211 is attached. Thus, the light-emitting chip 22 is emitted substantially along the optical axis C of the optical lens 21. The light beam will be able to directly enter the optical lens 21, thereby improving the utilization of the light beam emitted by the light-emitting chip 22, particularly the light beam emitted substantially along the optical axis C of the optical lens 21. The type of the illuminating wafer 22 may be selected according to requirements. For example, the light beam emitted from the luminescent wafer 22 may have a wavelength peak between 350 nm and 370 nm. In the present embodiment, the optical lens 21 can concentrate the light beam emitted by the light-emitting chip 22 toward the optical axis C of the optical lens 21, and the optical lens 21 can be a convex lens, but the type of the optical lens 21 can be changed according to requirements, Limited to the convex lens.
其中，凹穴211的容積是大致等於發光晶片22的尺寸，而發光晶片22能完全地容置於凹穴211中。於本實施例圖12中，是以發光晶片22的出光面22a大致貼合於形成凹穴211的端面211a，而發光晶片22與形成凹穴211的端面211a之間未具有間隙為例，但不以此為限，實際應用時，也可以是使發光晶片22與形成凹穴211的端面211a之間形成有預留的間隙。 Wherein, the volume of the recess 211 is substantially equal to the size of the luminescent wafer 22, and the luminescent wafer 22 can be completely accommodated in the recess 211. In FIG. 12 of the present embodiment, the light-emitting surface 22a of the light-emitting wafer 22 is substantially bonded to the end surface 211a of the recess 211, and the gap between the light-emitting wafer 22 and the end surface 211a forming the recess 211 is not shown, but Not limited thereto, in practice, a gap may be formed between the light-emitting wafer 22 and the end surface 211a where the recess 211 is formed.
卡合結構212對應位於卡合槽201中，而第一台階部2121對應容置於第一容槽2011，第二台階部2122對應容置於第二容槽2012，且第二台階部2122的端面2122a與形成第二容槽2012的部分側壁之間形成有一預留空間SP。其中，光學透鏡21設置於基板20時，卡合結構212是完全地設置於卡合槽201中，而卡合結構212是不外露於承載面20a。 The engaging portion 212 is correspondingly disposed in the engaging groove 201, and the first step portion 2121 is correspondingly received in the first receiving groove 2011, the second step portion 2122 is correspondingly received in the second receiving groove 2012, and the second step portion 2122 is A reserved space SP is formed between the end surface 2122a and a portion of the side wall forming the second pocket 2012. When the optical lens 21 is disposed on the substrate 20, the engaging structure 212 is completely disposed in the engaging groove 201, and the engaging structure 212 is not exposed on the bearing surface 20a.
透過上述第一台階部2121、第二台階部2122、第一容槽2011及第二容槽2012的相互配合，可以使光學透鏡21正確地安裝於 基板20上的預定位置，從而可以使發光晶片22與光學透鏡21彼此設置於正確的預定位置上，進而可使發光單元200產生預期的光形。 Through the mutual cooperation of the first step portion 2121, the second step portion 2122, the first pocket 2011 and the second pocket 2012, the optical lens 21 can be correctly mounted on the optical lens 21 The predetermined position on the substrate 20 allows the illuminating wafer 22 and the optical lens 21 to be placed at the correct predetermined positions, thereby allowing the illuminating unit 200 to produce a desired light shape.
在不同的實施例中，可以是於預留空間SP中填充膠體，以使光學透鏡21能與基板20相互固定，從而可以使光學透鏡21與基板20彼此間更好地相互固定。 In various embodiments, the colloid may be filled in the reserved space SP so that the optical lens 21 can be fixed to the substrate 20, so that the optical lens 21 and the substrate 20 can be better fixed to each other.
值得一提的是，在卡合結構212與光學透鏡21為非一體成型地設置的實施例中，卡合結構212可以是不透光結構，例如是由不透光材質所製成。如此，發光晶片22所發出的光束，將不容易通過光學透鏡21的反射或折射，而進入卡合結構212中，進而照射設置於預留空間SP中的膠體，導致膠體發生快速老化的問題。 It is worth mentioning that in the embodiment in which the engaging structure 212 and the optical lens 21 are not integrally formed, the engaging structure 212 may be an opaque structure, for example, made of an opaque material. Thus, the light beam emitted from the light-emitting chip 22 will not easily pass through the reflection or refraction of the optical lens 21, and enter the engaging structure 212, thereby illuminating the colloid disposed in the reserved space SP, causing a problem of rapid aging of the colloid.
在卡合結構212與光學透鏡21非一體成型的實施例中，也可以是於卡合結構212與光學透鏡21之間設置有一遮光件，藉此，完全阻隔光束進入卡合結構212中。另外，遮光件也可以是置換為一反射件，用以將欲進入卡合結構212的光束反射回光學透鏡21中；反射件例如可以是塗佈形成於卡合結構212與光學透鏡21之間的層狀結構，但不以此為限。 In the embodiment in which the engaging structure 212 is not integrally formed with the optical lens 21, a light blocking member may be disposed between the engaging structure 212 and the optical lens 21, thereby completely blocking the light beam from entering the engaging structure 212. In addition, the light blocking member may also be replaced by a reflecting member for reflecting the light beam entering the engaging structure 212 back into the optical lens 21; the reflecting member may be formed by coating between the engaging structure 212 and the optical lens 21, for example. Layered structure, but not limited to this.
如圖12所示，在具體實施中，第二台階部2122的長度與第二容槽2012的深度比，可以是介於0.33：1至0.5：1。如此，將可確保預留空間SP能有足夠的空間容置膠體13。 As shown in FIG. 12, in a specific implementation, the ratio of the length of the second step portion 2122 to the depth of the second pocket 2012 may be between 0.33:1 and 0.5:1. In this way, it will be ensured that the reserved space SP has enough space to accommodate the colloid 13.
在具體實施中，第二台階部2122的寬度W9與第二容槽2012的寬度W8比，可以是介於0.98：1至1：1。在第二台階部2122的寬度W9不及於第二容槽2012的寬度W8的0.98倍的實施例中，將可能發生第二台階部2122與第二容槽2012彼此間對位卡合的精準度，從而影響發光單元200所產生的光形。 In a specific implementation, the width W9 of the second step portion 2122 is greater than the width W8 of the second pocket 2012, and may be between 0.98:1 and 1:1. In the embodiment in which the width W9 of the second step portion 2122 is less than 0.98 times the width W8 of the second pocket 2012, the accuracy of the alignment between the second step portion 2122 and the second pocket 2012 may occur. , thereby affecting the light shape produced by the light emitting unit 200.
在具體實施中，第一台階部2121的高度D7與第一容槽2011的深度D8比，可以是介於1：0.9至1：0.95。在第一台階部2121 的高度D7不及於第一容槽2011的深度D8的0.9倍的實施例中，光學透鏡21安裝於基板20上時，可能發生第一台階部2121與形成第一容槽2011的側壁之間所存在的間隙過大，從而影響光學透鏡21與基板20之間的連接強度的問題。 In a specific implementation, the height D7 of the first step portion 2121 is greater than the depth D8 of the first pocket 2011, and may be between 1:0.9 and 1:0.95. In the first step portion 2121 In the embodiment in which the height D7 is less than 0.9 times the depth D8 of the first pocket 2011, when the optical lens 21 is mounted on the substrate 20, a gap between the first step portion 2121. and the sidewall forming the first pocket 2011 may occur. The gap existing is too large, thereby affecting the problem of the strength of the connection between the optical lens 21 and the substrate 20.
在具體實施中，第一台階部2121的寬度與第一容槽2011的寬度比，可以是介於0.95：1至1：1。 In a specific implementation, the width of the first step portion 2121 and the width of the first pocket 2011 may be between 0.95:1 and 1:1.
請參閱圖14，其為本發明的發光單元的第六實施例的示意圖。如圖所示，本實施例與前述實施例最大不同之處在於：發光單元200還可以是具有一輔助透鏡23，輔助透鏡23具有一容槽231，容槽231貫穿輔助透鏡23設置。輔助透鏡23設置於基板20的承載面20a，輔助透鏡23對應位於光學透鏡21的凹穴211中，而發光晶片22位於容槽231中。於本實施例圖中，是以容槽231貫穿輔助透鏡23為例，但不以此為限，在不同的應用中，容槽231也可以是不貫穿輔助透鏡23設置。 Please refer to FIG. 14, which is a schematic diagram of a sixth embodiment of a lighting unit of the present invention. As shown in the figure, the embodiment is different from the previous embodiment in that the light-emitting unit 200 further has an auxiliary lens 23, and the auxiliary lens 23 has a cavity 231 through which the cavity 231 is disposed. The auxiliary lens 23 is disposed on the bearing surface 20a of the substrate 20, the auxiliary lens 23 is correspondingly located in the recess 211 of the optical lens 21, and the light-emitting wafer 22 is located in the cavity 231. In the embodiment of the present invention, the auxiliary lens 23 is inserted through the auxiliary lens 23 as an example. However, the container 231 may not be disposed through the auxiliary lens 23 in different applications.
輔助透鏡23用以改變發光晶片所發出的光束的光路，舉例來說，發光晶片22所發出的光束，可以是包含一正向光及一側向光，且側向光的光通量大於正向光的光通量，而輔助透鏡23可以是用以使發光晶片22所發出的側向光轉向為正向光，藉此，將可有效地縮小發光單元200的發光角度，而使發光單元200所發出的光束更集中於光學透鏡21的光軸C。也就說明，輔助透鏡23能與光學透鏡21相互配合，據以導引發光晶片22所發出的光束，從而使發光單元200能產生特定的光形。在實際實施中，可以是使輔助透鏡23的折射率與光學透鏡21的折射率相同，據以可提升輔助透鏡23的光束使用效率。 The auxiliary lens 23 is used to change the optical path of the light beam emitted by the light emitting chip. For example, the light beam emitted by the light emitting chip 22 may include a forward light and a side light, and the light flux of the lateral light is greater than the forward light. The auxiliary lens 23 can be used to divert the lateral light emitted by the light-emitting chip 22 into forward light, whereby the light-emitting angle of the light-emitting unit 200 can be effectively reduced, and the light-emitting unit 200 emits The light beam is more concentrated on the optical axis C of the optical lens 21. It is also explained that the auxiliary lens 23 can cooperate with the optical lens 21 to guide the light beam emitted from the light-emitting chip 22, thereby enabling the light-emitting unit 200 to generate a specific light shape. In actual implementation, the refractive index of the auxiliary lens 23 may be made the same as the refractive index of the optical lens 21, whereby the light beam use efficiency of the auxiliary lens 23 can be improved.
在具體實施中，輔助透鏡23與光學透鏡21可以是由相同的材質所製成，而輔助透鏡23及光學透鏡21可以是具有大致相同的折射率，但不以此為限。輔助透鏡23與光學透鏡21也可以是由不同的材質所製成，而兩者具有不相同的折射率；具有不同折 射率的輔助透鏡23及光學透鏡21，可以是配合輔助透鏡23的外型及凹穴211的外型，使發光單元200產生預定的光形。 In an embodiment, the auxiliary lens 23 and the optical lens 21 may be made of the same material, and the auxiliary lens 23 and the optical lens 21 may have substantially the same refractive index, but not limited thereto. The auxiliary lens 23 and the optical lens 21 may also be made of different materials, and the two have different refractive indexes; The auxiliary lens 23 and the optical lens 21 of the luminosity may be shaped to match the outer shape of the auxiliary lens 23 and the shape of the recess 211, so that the light-emitting unit 200 generates a predetermined light shape.
在不同的實施例中，輔助透鏡23與形成凹穴211的端面211a之間可以是填充有透光膠，而輔助透鏡23則能通過透光膠與光學透鏡21相互固定。其中，透光膠的折射率可以是與輔助透鏡23及光學透鏡21相同，藉此，可提升發光晶片22所發出的光束的使用效率。 In different embodiments, the auxiliary lens 23 and the end surface 211a forming the recess 211 may be filled with a light-transmitting glue, and the auxiliary lens 23 may be fixed to the optical lens 21 by the light-transmitting glue. The refractive index of the light transmissive glue may be the same as that of the auxiliary lens 23 and the optical lens 21, whereby the use efficiency of the light beam emitted from the light emitting chip 22 can be improved.
以上所述僅為本發明的較佳可行實施例，非因此侷限本發明的專利範圍，故舉凡運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的保護範圍內。 The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by using the present specification and the contents of the drawings are included in the protection scope of the present invention. .
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107134385A TWI672467B (en) | 2018-09-28 | 2018-09-28 | Light-emitting unit |
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| TW107134385A TWI672467B (en) | 2018-09-28 | 2018-09-28 | Light-emitting unit |
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| TW202012836A TW202012836A (en) | 2020-04-01 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI313072B (en) * | 2005-10-18 | 2009-08-01 | Young Lighting Technology Corporatio | Light emitting diode package |
| TWI476967B (en) * | 2012-04-16 | 2015-03-11 | Advanced Optoelectronic Tech | Led module |
| TWI548126B (en) * | 2014-04-11 | 2016-09-01 | 隆達電子股份有限公司 | Solid-state light emitting device |
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2018
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI313072B (en) * | 2005-10-18 | 2009-08-01 | Young Lighting Technology Corporatio | Light emitting diode package |
| TWI476967B (en) * | 2012-04-16 | 2015-03-11 | Advanced Optoelectronic Tech | Led module |
| TWI548126B (en) * | 2014-04-11 | 2016-09-01 | 隆達電子股份有限公司 | Solid-state light emitting device |
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