TWI672082B - Working device and its application equipment - Google Patents
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Abstract
一種作業裝置，其承載機構係以第一承置器承載一具膠膜之載框模組，置料機構係以第一置料器及第二置料器分別承置第一元件及第二元件，移料機構係以第一移料器將第一置料器之第一元件移入貼置於載框模組之膠膜上，並以第二移料器將第二置料器之第二元件移載蓋置於第一元件上且貼置於膠膜，滾抵機構係以第一滾抵件於膠膜之底面依預設作動時序位移，以滾壓膠膜確實貼合第一元件及第二元件，達到一貫自動化上料作業及提高生產效能之實用效益。 An operating device whose bearing mechanism uses a first holder to carry a frame carrier module with an adhesive film, and the feeding mechanism uses a first feeder and a second feeder to respectively hold a first component and a second component. Components, the material transfer mechanism uses the first material transfer device to move the first component of the first material loader onto the adhesive film placed on the carrier module, and the second material transfer device moves the The two-component transfer cover is placed on the first component and affixed to the adhesive film, and the rolling contact mechanism uses the first rolling contact member to be displaced on the bottom surface of the adhesive film according to a preset operating sequence, and the rolling adhesive film is firmly attached to the first film. The components and the second components achieve the practical benefits of consistent automatic loading operations and improved production efficiency.
Description
本發明係提供一種移料機構之移料器於具膠膜之載框模組執行至少一第一元件之上料作業、下料料業或上下料作業時，搭配滾抵機構之第一滾抵件於膠膜之底面執行滾壓或頂推動作，使膠膜確實貼合或易於剝離第一元件，進而一貫自動化作業及提高生產效能之作業裝置。 The invention provides a material transfer mechanism of a material transfer mechanism, which performs a loading operation of at least one first component, a material loading industry, or a material loading operation on a carrier frame module with an adhesive film. It is an operating device that performs rolling or pushing action on the bottom surface of the adhesive film, so that the adhesive film does fit or easily peel off the first component, and then the operation is always automated and the production efficiency is improved.
在現今，電子元件係依製作所需而會歷經不同製程，例如濺鍍製程，係以濺鍍處理裝置於電子元件之濺鍍區形成一薄膜；請參閱第1圖，該電子元件11係於表面劃分濺鍍區111及非濺鍍區112，業者係以人工作業將複數個電子元件11逐一貼置於一載框模組12之膠膜121上定位，然為避免電子元件11之非濺鍍區112於濺鍍作業中鍍上薄膜，業者再以人工作業逐一於電子元件11之非濺鍍區112蓋置一外蓋13，並令外蓋13貼置於載框模組12之膠膜121定位，再將一具電子元件11及外蓋13之載框模組12搬運至濺鍍處理裝置(圖未示出)，該濺鍍處理裝置即對電子元件11裸露於外之濺鍍區111執行濺鍍作業，使電子元件11之濺鍍區111鍍上薄膜，於完成濺鍍作業後，業者再以人工作業於載框模組12之膠膜121上一一剝離取下外蓋13及已濺鍍之電子元件11，並將外蓋13及已濺鍍之電子元件11各別收置於不同收料器(圖未示出)；惟，由於一批次待濺鍍之電子元件11往往上百顆，甚至上千顆，業者以人工作業方式進行電子元件11及外蓋13之上料作業及下料作業，亦必須將外蓋13準確蓋置於電子元件11之非濺鍍區112，外蓋13之蓋合位置的過與不及均會影響濺鍍品質，以致人工作業緩慢耗時而增加成本，更無法提 高生產效能；再者，人工作業方式易因貼置疏失而令電子元件11及外蓋13無法完全貼合於載框模組12之膠膜121，導致電子元件11及外蓋13係與膠膜121之間具有空隙，以致貼合不實，易發生電子元件11及外蓋13脫落或電子元件11之非濺鍍區112不慎鍍膜之問題，進而影響濺鍍作業之濺鍍品質。 At present, electronic components are subjected to different processes according to the production requirements, such as a sputtering process. A thin film is formed in a sputtering area of an electronic component by a sputtering processing device; see FIG. 1. The electronic component 11 is The surface is divided into a sputtered area 111 and a non-sputtered area 112. The operator manually positions a plurality of electronic components 11 on the adhesive film 121 of a carrier frame module 12, one by one, to avoid the non-spattering of the electronic components 11. The plating area 112 is coated with a thin film during the sputtering operation, and the industry covers the non-sputtering area 112 of the electronic component 11 one by one by manual operations, and the outer cover 13 is attached to the glue of the carrier frame module 12. The film 121 is positioned, and then a carrier frame module 12 with the electronic component 11 and the outer cover 13 is transported to a sputtering processing device (not shown in the figure). The sputtering processing device is the sputtering for exposing the electronic component 11 to the outside. The area 111 performs a sputtering operation, and a thin film is applied to the sputtering area 111 of the electronic component 11. After the sputtering operation is completed, the industry manually removes the outer cover one by one from the adhesive film 121 of the carrier module 12 and removes the outer cover. 13 and the sputtered electronic component 11 and separate the cover 13 and the sputtered electronic component 11 Different receivers (not shown); however, since a batch of electronic components 11 to be sputtered often has hundreds or even thousands, the operators manually perform the operations on the electronic components 11 and the outer cover 13 In the blanking operation and the blanking operation, the outer cover 13 must be accurately placed in the non-sputtering area 112 of the electronic component 11. Over and under the cover position of the outer cover 13 will affect the sputtering quality, resulting in slow manual operation. Increase costs sometimes, not to mention High production efficiency; furthermore, the manual operation method is apt to cause the electronic component 11 and the outer cover 13 to fail to fully adhere to the adhesive film 121 of the carrier frame module 12 due to negligent placement, resulting in the electronic component 11 and the outer cover 13 being bonded to the adhesive. There is a gap between the films 121, so that the bonding is not true, and the electronic component 11 and the outer cover 13 fall off or the non-sputtered area 112 of the electronic component 11 is accidentally coated, which further affects the sputtering quality of the sputtering operation.
本發明之目的一，係提供一種作業裝置，其承載機構係以第一承置器承載一具膠膜之載框模組，置料機構係以第一置料器承置至少一第一元件，移料機構係以第一移料器將第一置料器之第一元件移入貼置於載框模組之膠膜上，並以第二移料器將第二置料器之第二元件移載蓋置於第一元件上且貼置於膠膜，滾抵機構係以第一滾抵件於膠膜之底面依預設作動時序位移，以滾壓或頂推膠膜貼合或剝離第一元件，進而一貫自動化執行預設作業(例如上料作業、下料作業或上下料作業)，達到提高生產效能之實用效益。 A first object of the present invention is to provide an operating device. The carrying mechanism is configured to carry a frame carrier module with an adhesive film by a first holder, and the loading mechanism is used to support at least one first element by the first holder. The material transfer mechanism uses a first material feeder to move the first component of the first material feeder into the adhesive film attached to the carrier frame module, and a second material feeder to the second material feeder of the second The component transfer cover is placed on the first component and affixed to the adhesive film. The rolling contact mechanism is to use the first rolling contact member to be displaced on the bottom surface of the adhesive film according to a preset operating sequence, and to roll or push the adhesive film to attach or The first component is stripped, and a preset operation (such as loading operation, unloading operation, or unloading operation) is performed automatically and consistently, thereby achieving practical benefits of improving production efficiency.
本發明之目的二，係提供一種作業裝置，其中，該滾抵機構係以第一滾抵件於載框模組之膠膜底面作第一方向滾壓位移，以使膠膜確實完全貼合第一元件，進而防止第一元件脫落，達到提升作業品質之實用效益。 The second object of the present invention is to provide a working device, wherein the rolling contact mechanism is a first direction of rolling displacement on the bottom surface of the film of the carrier module by the first rolling contact member, so that the film is completely fit. The first component, thereby preventing the first component from falling off, achieves the practical benefit of improving the quality of the operation.
本發明之目的三，係提供一種作業裝置，其中，該滾抵機構係以第一滾抵件於載框模組之膠膜底面作第一方向滾壓位移，以使膠膜確實完全貼合第一元件，當第一元件為電子元件而執行濺鍍作業時，可有效避免電子元件底面之非濺鍍區濺鍍薄膜，達到提升作業品質之實用效益。 The third object of the present invention is to provide a working device, wherein the rolling contact mechanism is a first direction of rolling displacement on the bottom surface of the film of the carrier frame module to make the film completely fit. The first component, when the first component is an electronic component and performs a sputtering operation, can effectively prevent the thin film from being sputtered in the non-sputtered area on the bottom surface of the electronic component, thereby achieving practical benefits of improving the quality of the operation.
本發明之目的四，係提供一種作業裝置，其中，該滾抵機構係以第一滾抵件於載框模組之膠膜底面作第二方向頂升位移，以頂推第一元件易於剝離膠膜，而供第一移料器迅速取料及縮減下料作業時間，達到提升下料作業便利性之實用效益。 The fourth object of the present invention is to provide an operating device, wherein the rolling contact mechanism is a second rolling direction of the first rolling contact member on the bottom surface of the film carrier frame module to lift and displace in order to push the first element to be easily peeled. Adhesive film, which can be used by the first transferer to quickly take out the material and reduce the time of the material-discharging operation, so as to improve the practical benefit of the convenience of the material-discharging operation.
本發明之目的五，係提供一種應用作業裝置之作業 設備，其包含機台、作業裝置、處理裝置及中央控制裝置，該作業裝置係配置於機台上，並設有承載機構、置料機構、移料機構及滾抵機構，以執行至少一第一元件之預設作業，該處理裝置係配置於機台上，並設有至少一處理器，以對第一元件執行預設處理作業，該中央控制裝置係用以控制及整合各裝置作動，以執行自動化作業，達到提升作業效能之實用效益。 A fifth object of the present invention is to provide an operation using an operation device. The equipment includes a machine, an operating device, a processing device, and a central control device. The operating device is arranged on the machine and is provided with a bearing mechanism, a material placing mechanism, a material moving mechanism, and a rolling mechanism to execute at least one first A preset operation of a component. The processing device is arranged on the machine and is provided with at least one processor to perform a preset processing operation on the first component. The central control device is used to control and integrate the operations of various devices. In order to carry out automated operations, to achieve practical benefits to improve operational efficiency.
〔習知〕 [Learning]
11‧‧‧電子元件 11‧‧‧Electronic components
111‧‧‧濺鍍區 111‧‧‧Sputter area
112‧‧‧非濺鍍區 112‧‧‧Non-sputter area
12‧‧‧載框模組 12‧‧‧Frame carrier module
121‧‧‧膠膜 121‧‧‧ Adhesive film
13‧‧‧外蓋 13‧‧‧ Cover
〔本發明〕 〔this invention〕
20‧‧‧作業裝置 20‧‧‧Working device
21‧‧‧承載機構 21‧‧‧bearing institution
211‧‧‧第一承置器 211‧‧‧first holder
212‧‧‧載框模組 212‧‧‧Frame carrier module
2121‧‧‧膠膜 2121‧‧‧ Adhesive film
213‧‧‧第二承置器 213‧‧‧Second holder
22‧‧‧置料機構 22‧‧‧Feeding mechanism
221‧‧‧第一置料器 221‧‧‧The first feeder
222‧‧‧電子元件 222‧‧‧Electronic components
223‧‧‧第一載送器 223‧‧‧ the first carrier
224‧‧‧第二置料器 224‧‧‧Second feeder
225‧‧‧第三置料器 225‧‧‧ third feeder
226‧‧‧外蓋 226‧‧‧ Cover
227‧‧‧第四置料器 227‧‧‧Fourth feeder
228‧‧‧第二載送器 228‧‧‧Second carrier
23‧‧‧移料機構 23‧‧‧ material transfer mechanism
231‧‧‧第一移料器 231‧‧‧The first feeder
232‧‧‧第二移料器 232‧‧‧Second feeder
233‧‧‧第一驅動單元 233‧‧‧first drive unit
234‧‧‧第三移料器 234‧‧‧third feeder
235‧‧‧第四移料器 235‧‧‧Fourth transfer device
236‧‧‧第二驅動單元 236‧‧‧Second drive unit
24‧‧‧滾抵機構 24‧‧‧Road Arrival Agency
241‧‧‧第一滾抵件 241‧‧‧First Rolling Part
242‧‧‧第一運送器 242‧‧‧The first conveyor
243‧‧‧第二滾抵件 243‧‧‧Second Rollover
244‧‧‧第二運送器 244‧‧‧Second Conveyor
25‧‧‧檢知機構 25‧‧‧Inspection agency
251‧‧‧第一檢知器 251‧‧‧first detector
252‧‧‧第二檢知器 252‧‧‧Second detector
26‧‧‧搬運機構 26‧‧‧Transportation agency
261‧‧‧搬運器 261‧‧‧Porter
262‧‧‧搬運驅動源 262‧‧‧Transport drive source
31‧‧‧機台 31‧‧‧machine
32‧‧‧濺鍍處理裝置 32‧‧‧Sputtering treatment device
第1圖：習知電子元件、外蓋及載框模組之示意圖。 Fig. 1: Schematic diagram of conventional electronic components, cover and carrier module.
第2圖：本發明作業裝置第一實施例之配置圖。 Fig. 2: Configuration diagram of the first embodiment of the working device of the present invention.
第3圖：本發明作業裝置第一實施例之局部示意圖。 Fig. 3: Partial schematic view of the first embodiment of the working device of the present invention.
第4圖：係作業裝置第一實施例與濺鍍處理裝置之配置圖。 FIG. 4 is a configuration diagram of the first embodiment of the working device and the sputtering processing device.
第5圖：係作業裝置第一實施例之使用示意圖(一)。 Fig. 5 is a schematic diagram (1) of the use of the first embodiment of the working device.
第6圖：係作業裝置第一實施例之使用示意圖(二)。 Fig. 6 is a schematic diagram of the use of the first embodiment of the working device (2).
第7圖：係作業裝置第一實施例之使用示意圖(三)。 Fig. 7 is a schematic diagram of the use of the first embodiment of the working device (3).
第8圖：係作業裝置第一實施例之使用示意圖(四)。 Fig. 8 is a schematic diagram (four) of using the first embodiment of the working device.
第9圖：係作業裝置第一實施例之使用示意圖(五)。 Fig. 9 is a schematic diagram (fifth) of use of the first embodiment of the working device.
第10圖：係作業裝置第一實施例之使用示意圖(六)。 Fig. 10 is a schematic diagram of the use of the first embodiment of the working device (6).
第11圖：本發明作業裝置第二實施例之配置圖。 FIG. 11 is a configuration diagram of the second embodiment of the working device of the present invention.
第12圖：本發明作業裝置第二實施例之局部示意圖。 FIG. 12 is a partial schematic diagram of the second embodiment of the working device of the present invention.
第13圖：係作業裝置第二實施例與濺鍍處理裝置之配置圖。 FIG. 13 is a configuration diagram of the second embodiment of the working device and the sputtering processing device.
為使 貴審查委員對本發明作更進一步之瞭解，茲舉一較佳實施例並配合圖式，詳述如後：請參閱第2、3圖，係本發明作業裝置20之第一實施例，其包含承載機構21、置料機構22、移料機構23及滾抵機構24，該承載機構21係設有至少一第一承置器211，以承置至少一具膠膜2121之載框模組212，更進一步，該第一承置器211係為固定式承座、輸送皮帶輪組或輸送托 板，例如該固定承座係定點承置該載框模組212，例如該輸送皮帶輪組或輸送托板係於第一位置及第二位置間往復輸送該載框模組212，該第一承置器211之型態依作業需求而有不同，並不以本發明所揭露之型態為限，於本實施例中，該承載機構21係設有一為輸送皮帶輪組且呈第三方向(如Y方向)配置之第一承置器211，該第一承置器211係於第一位置承置一具膠膜2121之載框模組212，並於第一位置及第二位置間往復輸送載框模組212；該置料機構22係設有至少一第一置料器221，以容納至少一第一元件(如電子元件)，更進一步，該第一置料器221係容納待作業第一元件或已作業第一元件，用以供料或供收料，例如作業裝置20係以第一置料器221容納待作業第一元件，並於第一元件完成預設處理作業(如濺鍍作業)後，再將已作業第一元件收置於第一置料器221，若第一元件需搭配一第二元件(如外蓋)執行預設處理作業，該置料機構22係設置至少一供應第二元件之第二置料器，以及至少一收置第二元件之第三置料器，又該置料機構22可另外設置一第四置料器，以收置已作業之第一元件；因此，置料器之數量及配置位置係依據作業需求而有不同，並不以本發明所揭露之實施例為限，於本實施例中，該置料機構22之第一置料器221係為料盤，以容納複數個待作業且為電子元件222之第一元件，並置放於一為輸送皮帶輪組之第一載送器223的第三位置處供料，當第一置料器221於收置複數個已作業之電子元件222後，該第一載送器223則將具已作業電子元件222之第一置料器221由第三位置輸送至第四位置出料，另該置料機構22係設置第二置料器224及第三置料器225，該第二置料器224係為振動供料器或供料盤，該第三置料器225係為收料盤或收料箱，於本實施例中，該第二置料器224係為振動供料器，以輸出複數個為外蓋226之第二元件，該第三置料器225係為收料箱，以收置複數個外蓋226；該移料機構23係設有至少一 第一移料器231，以於第一置料器221及載框模組212之膠膜2121間移載至少一第一元件，於本實施例中，係設有第一移料器231及第二移料器232，並由至少一第一驅動單元233驅動第一移料器231及第二移料器232分別獨立作第一、二、三方向(如X、Z、Y方向)位移，令第一移料器231於第一置料器221及載框模組212間移載待作業之電子元件222及已作業之電子元件222，該第二移料器232係於第二置料器224、第三置料器225及載框模組212間移載待使用之外蓋226及已使用之外蓋226；該滾抵機構24係設有至少一第一滾抵件241，以於載框模組212之膠膜2121底面依預設作動時序位移，以滾壓或頂推膠膜2121貼合或剝離第一元件，於本實施例中，該滾抵機構24係於承載機構21處設有一為滾輪之第一滾抵件241，該第一滾抵件241並由一第一運送器242運送作第一、二、三方向位移，以滾壓及頂推膠膜2121；該作業裝置20更包含檢知機構25，該檢知機構25係設有至少一第一檢知器251，以檢知該載框模組212上之第一元件，更進一步，該第一檢知器251係獨立配置或裝配於移料機構23，該檢知機構25另設有至少一第二檢知器252，以檢知該移料機構23移載之第二元件，於本實施例中，係於移料機構23之第一移料器231裝配一為CCD之第一檢知器251，以由上向下取像該載框模組212上之電子元件222，另於第二置料器224與承載機構21間設置一為CCD之第二檢知器252，以由下向上取像移料機構23之第二移料器232移載之外蓋226。 In order to make your reviewing committee further understand the present invention, a preferred embodiment will be given in conjunction with the drawings, as detailed below: Please refer to Figs. 2 and 3, which are the first embodiment of the working device 20 of the present invention. It includes a bearing mechanism 21, a material placing mechanism 22, a material moving mechanism 23, and a rolling mechanism 24. The bearing mechanism 21 is provided with at least a first holder 211 to receive at least one carrier frame mold with a film 2121. Group 212, further, the first holder 211 is a fixed holder, a conveyer belt pulley set or a conveyer bracket Plate, for example, the fixed seat is used to receive the carrier frame module 212 at a fixed point. For example, the conveyor belt wheel set or the carrier plate is transported to and from the first position and the second position. The shape of the positioner 211 is different according to the operation requirements, and is not limited to the shape disclosed in the present invention. In this embodiment, the load bearing mechanism 21 is provided with a belt pulley set and is in a third direction (such as Y direction) configured first holder 211. The first holder 211 receives a frame module 212 with a film 2121 at a first position, and reciprocates between the first position and the second position. Frame-loading module 212; the loading mechanism 22 is provided with at least a first feeder 221 to accommodate at least a first component (such as an electronic component), and further, the first feeder 221 is configured to accommodate a work to be performed The first component or the first component that has been operated is used for feeding or receiving. For example, the operation device 20 uses the first feeder 221 to accommodate the first component to be operated, and completes the preset processing operation on the first component (such as (Sputtering operation), the first component that has been operated is placed in the first feeder 221, if the first component needs A second component (such as an outer cover) is assigned to perform a preset processing operation. The feeding mechanism 22 is provided with at least a second feeder for supplying the second component and at least a third feeder for receiving the second component. In addition, the material feeding mechanism 22 may be additionally provided with a fourth material feeder to receive the first component that has been operated; therefore, the number and position of the material feeders are different according to operation requirements, and the invention is not based on the present invention. The disclosed embodiments are limited. In this embodiment, the first feeder 221 of the loading mechanism 22 is a tray to accommodate a plurality of first components that are to be operated and are electronic components 222. One is to feed the material at the third position of the first carrier 223 of the belt pulley set. After the first carrier 221 receives a plurality of operated electronic components 222, the first carrier 223 will be provided with The first feeder 221 of the operated electronic component 222 is conveyed from the third position to the fourth position, and the feeding mechanism 22 is provided with a second feeder 224 and a third feeder 225. The second feeder The feeder 224 is a vibration feeder or a feeding tray, and the third feeder 225 is a receiving tray or a receiving box. In this embodiment, the second feeder 224 is a vibrating feeder to output a plurality of second elements as the outer cover 226, and the third feeder 225 is a receiving box to receive a plurality of Outer cover 226; the material transfer mechanism 23 is provided with at least one The first feeder 231 is used to transfer at least one first component between the first feeder 221 and the adhesive film 2121 of the frame carrier module 212. In this embodiment, the first feeder 231 and The second transfer device 232, and the first transfer device 231 and the second transfer device 232 are driven by at least one first drive unit 233 to independently perform first, second, and third directions (such as X, Z, and Y directions) for displacement. To make the first feeder 231 transfer the electronic component 222 to be operated and the operated electronic component 222 between the first feeder 221 and the frame carrier module 212, and the second feeder 232 is connected to the second container The outer cover 226 and the used outer cover 226 are transferred between the feeder 224, the third feeder 225, and the carrier frame module 212. The rolling contact mechanism 24 is provided with at least a first rolling contact member 241. The bottom surface of the adhesive film 2121 of the carrier frame module 212 is displaced according to a preset operation sequence, and the first component is attached or peeled by rolling or pushing the adhesive film 2121. In this embodiment, the rolling contact mechanism 24 is attached to the bearing The mechanism 21 is provided with a first rolling contact member 241 which is a roller. The first rolling contact member 241 is transported by a first carrier 242 for first, second, and third directions of displacement to roll and push the glue. 2121; The operation device 20 further includes a detection mechanism 25. The detection mechanism 25 is provided with at least a first detector 251 to detect a first element on the frame-carrying module 212. Furthermore, the first A detector 251 is independently configured or assembled on the material transfer mechanism 23, and the detection mechanism 25 is further provided with at least a second detector 252 to detect the second component transferred by the material transfer mechanism 23. In the embodiment, the first transferer 231 attached to the transfer mechanism 23 is equipped with a first detector 251 that is a CCD to take an image of the electronic component 222 on the carrier module 212 from top to bottom. A second detector 252, which is a CCD, is disposed between the second stocker 224 and the carrier mechanism 21, so that the second cover 226 of the image transfer mechanism 23 is taken from the bottom to the top.
請參閱第4圖，係本發明作業裝置20第一實施例應用於作業設備的示意圖，該作業設備包含機台31、作業裝置20、處理裝置及中央控制裝置(圖未示出)，該處理裝置係配置於機台31上，並設有至少一處理器，以對第一元件執行預設處理作業，該中央控制裝置係用以控制及整合各裝置作動，以執行 自動化作業，於本實施例中，該作業設備係為濺鍍作業設備，該處理裝置係為一具濺鍍器之濺鍍處理裝置32，並裝配於機台31上，且位於作業裝置20之側方，以對電子元件222執行濺鍍處理作業，由於濺鍍處理裝置32非本案之技術特徵，故在此不予贅述；該作業裝置20係配置於機台31上，並設有承載機構21、置料機構22、移料機構23及滾抵機構24，以執行至少一第一元件之預設作業，該作業裝置20更包含搬運機構26，該搬運機構26係設置至少一搬運器261，以於承載機構21搬運該載框模組212，更進一步，該搬運器261係設置搬運皮帶輪組以輸送載框模組212，或設置至少一推取件，令推取件於承載機構21及搬運器261間移入或移出載框模組212，該搬運器261並由搬運驅動源262驅動作至少一方向位移，於本實施例中，該搬運器261係設置搬運皮帶輪組以作Y方向輸送載框模組212，該搬運驅動源262則驅動該搬運器261於承載機構21及濺鍍處理裝置32之間作X方向位移搬運該載框模組212。 Please refer to FIG. 4, which is a schematic diagram of a first embodiment of the working device 20 of the present invention applied to a working device. The working device includes a machine 31, a working device 20, a processing device, and a central control device (not shown). The device is arranged on the machine 31 and is provided with at least one processor to perform a preset processing operation on the first component. The central control device is used to control and integrate the actions of various devices to execute Automated operation. In this embodiment, the operation equipment is a sputtering operation equipment, and the processing device is a sputtering treatment device 32 with a sputtering device, which is assembled on the machine 31 and located on the operation device 20 On the side, to perform a sputtering process on the electronic component 222, since the sputtering process device 32 is not a technical feature of this case, it will not be repeated here; the operation device 20 is arranged on the machine 31 and is provided with a bearing mechanism 21. The material placing mechanism 22, the material moving mechanism 23, and the rolling contact mechanism 24 to perform a preset operation of at least one first component. The operation device 20 further includes a carrying mechanism 26. The carrying mechanism 26 is provided with at least one carrier 261. For the carrier mechanism 21 to carry the carrier frame module 212, further, the carrier 261 is provided with a transport pulley set to transport the carrier frame module 212, or at least one pusher is provided to make the pusher on the carrier 21 The carrier frame module 212 is moved into or out of the carrier 261. The carrier 261 is driven by a carrier driving source 262 for displacement in at least one direction. In this embodiment, the carrier 261 is provided with a carrier pulley set for the Y direction. Conveying frame module 212 The carrier driving source 262 drives the carrier 261 to move the carrier frame module 212 between the carrier mechanism 21 and the sputtering processing device 32 in the X direction.
請參閱第5圖，該作業裝置20之承載機構21係以第一承置器211將一具膠膜2121之載框模組212由第一位置輸送至第二位置，並位於滾抵機構24之上方，該置料機構22係以第一載送器223輸送具複數個待濺鍍電子元件222之第一置料器221作Y方向位移至移料機構23之下方，該移料機構23係以第一驅動單元233驅動第一移料器231作X-Y-Z方向位移而於置料機構22之第一置料器221取出待濺鍍之電子元件222，並移載至承載機構21處，且移入該載框模組212之膠膜2121，接著該滾抵機構24係以第一運送器242驅動第一滾抵件241作Z方向位移接觸載框模組212之膠膜2121底面，再驅動第一滾抵件241作X方向位移而滾壓膠膜2121，使膠膜2121確實完全貼合電子元件222，並排出膠膜2121與電子元件222間之空氣，於 完成貼置電子元件222後，由於第一檢知器251裝配於移料機構23之第一驅動單元233，而利用第一驅動單元233帶動第一檢知器251作X方向位移，以取像檢知膠膜2121上之待濺鍍電子元件222的貼合位置及角度等。 Please refer to FIG. 5. The supporting mechanism 21 of the operating device 20 uses a first holder 211 to convey a carrier frame module 212 with an adhesive film 2121 from a first position to a second position, and is located at the rolling contact mechanism 24. Above, the feeding mechanism 22 is moved in the Y direction by the first feeder 221 of the first carrier 223 conveyor with a plurality of electronic components 222 to be sputtered below the feeding mechanism 23. The feeding mechanism 23 The first drive unit 233 drives the first transfer device 231 for displacement in the XYZ direction, takes out the electronic component 222 to be sputtered from the first transfer device 221 of the loading mechanism 22, and transfers the electronic component 222 to the loading mechanism 21, and The plastic film 2121 of the frame carrier module 212 is moved in, and then the rolling contact mechanism 24 drives the first rolling member 241 by the first carrier 242 to make a Z-direction displacement contact with the bottom surface of the film 2121 of the frame carrier module 212, and then drives The first rolling contact member 241 is displaced in the X direction to roll the adhesive film 2121, so that the adhesive film 2121 completely fits the electronic component 222, and exhausts the air between the adhesive film 2121 and the electronic component 222. After the placement of the electronic components 222 is completed, since the first detector 251 is mounted on the first driving unit 233 of the material transfer mechanism 23, the first driving unit 233 is used to drive the first detector 251 to perform X-direction displacement to take an image The bonding position and angle of the electronic component 222 to be sputtered on the adhesive film 2121 are detected.
請參閱第6圖，於移料機構23之第一驅動單元233帶動第一檢知器251完成檢知作業後，該移料機構23之第一驅動單元233即驅動第一移料器231作X-Y-Z方向位移至置料機構22之第一置料器221取出下一待濺鍍之電子元件222；該移料機構23之第一驅動單元233並驅動第二移料器232作X-Y-Z方向位移於該置料機構22之第二置料器224取出待使用之外蓋226，第二移料器232係帶動待使用之外蓋226通過第二檢知器252，第二檢知器252即取像檢知待使用外蓋226之擺置角度，於完成檢知作業，第二移料器232係將待使用之外蓋226移載至承載機構21處，並將外蓋226蓋置於電子元件222之非濺鍍區，且貼置於載框模組212之膠膜2121，令電子元件222之濺鍍區裸露於外，接著該滾抵機構24係以第一運送器242驅動第一滾抵件241作Z方向位移接觸載框模組212之膠膜2121底面，再驅動第一滾抵件241作X方向位移而滾壓膠膜2121，使膠膜2121確實完全貼合外蓋226，並排出膠膜2121與外蓋226間之空氣。 Please refer to FIG. 6. After the first drive unit 233 of the transfer mechanism 23 drives the first detector 251 to complete the detection operation, the first drive unit 233 of the transfer mechanism 23 drives the first transfer unit 231 to XYZ direction displacement to the first material feeder 221 of the material placement mechanism 22 takes out the next electronic component 222 to be sputtered; the first drive unit 233 of the material movement mechanism 23 and drives the second material dispenser 232 for XYZ direction displacement in The second feeder 224 of the loading mechanism 22 takes out the outer cover 226 to be used, and the second feeder 232 drives the outer cover 226 to be used to pass the second detector 252, and the second detector 252 is immediately taken out. Like checking the placement angle of the outer cover 226 to be used, upon completion of the inspection operation, the second feeder 232 transfers the outer cover 226 to be used to the carrying mechanism 21, and places the outer cover 226 cover on the electronic The non-sputtered area of the component 222, and the adhesive film 2121 attached to the carrier module 212, so that the sputtered area of the electronic component 222 is exposed, and then the rolling mechanism 24 drives the first conveyor 242 to drive the first The rolling element 241 contacts the bottom surface of the adhesive film 2121 of the carrier frame module 212 for Z-direction displacement, and then drives the first rolling element 241 for X-direction displacement and 2121 film pressure, so that 2121 does completely cover film cover 226, and exhaust air 226 of the film 2121 and the outer cover.
請參閱第7圖，於載框模組212完成貼置複數個待濺鍍之電子元件222及複數個外蓋226後，該承載機構21係以第一承置器211將一具有待濺鍍電子元件222及外蓋226之載框模組212輸送至搬運機構26之搬運器261，該搬運機構26係以搬運驅動源262驅動該搬運器261作X方向位移將載框模組212由承載機構21輸送至濺鍍處理裝置32，使濺鍍處理裝置32對待濺鍍電子元件222之濺鍍區執行濺鍍處理作業，由於待濺鍍電子元件222之非濺鍍區已由外 蓋226確實蓋合及膠膜2121確實貼合，而可有效避免電子元件222之非濺鍍區濺鍍薄膜，達到提升作業品質之實用效益。 Please refer to FIG. 7, after the carrier frame module 212 finishes placing a plurality of electronic components 222 and a plurality of outer covers 226 to be sputtered, the carrier mechanism 21 uses a first holder 211 to place a The carrier frame module 212 of the electronic component 222 and the outer cover 226 is transported to the carrier 261 of the carrier mechanism 26. The carrier mechanism 261 drives the carrier 261 with a carrier driving source 262 for X-direction displacement to carry the carrier module 212. The mechanism 21 is transported to the sputtering processing device 32, so that the sputtering processing device 32 performs the sputtering processing operation on the sputtering area of the electronic component 222 to be sputtered. The cover 226 is indeed covered and the adhesive film 2121 is indeed attached, which can effectively prevent the thin film from being sputtered in the non-sputtered area of the electronic component 222 and achieve practical benefits of improving the quality of the operation.
請參閱第7、8、9、10圖，於完成濺鍍作業後，該搬運機構26係以搬運驅動源262驅動該搬運器261作X方向反向位移將一具已濺鍍電子元件222之載框模組212由濺鍍處理裝置32輸送至承載機構21，並移入承載機構21之第一承置器211，該第一承置器211係將載框模組212輸送至滾抵機構24之上方，接著該滾抵機構24係以第一運送器242驅動第一滾抵件241作Z方向向上位移頂推已濺鍍之電子元件222及外蓋226剝離該載框模組212之膠膜2121，而供移料機構23之第二移料器232易於在載框模組212取出已使用之外蓋226，並將外蓋226移載至第三置料器225收置，以及供第一移料器231易於在載框模組212取出已濺鍍之電子元件222，由於該置料機構22之第一置料器221係為空盤，第一移料器231係將已濺鍍之電子元件222移載至第一置料器221收置，該置料機構22之第一載送器223則輸出一具複數個已濺鍍電子元件222之第一置料器221，進而完成一貫自動化上下料作業，達到提升作業品質之實用效益。 Please refer to Figures 7, 8, 9, and 10. After the sputtering operation is completed, the transport mechanism 26 drives the carrier 261 with a transport drive source 262 for X-direction reverse displacement to transfer a sputtered electronic component 222. The frame carrier module 212 is transported to the supporting mechanism 21 by the sputtering processing device 32, and is moved into the first holder 211 of the carrier mechanism 21. The first carrier 211 transports the frame carrier module 212 to the rolling mechanism 24. Above, then the rolling contact mechanism 24 drives the first rolling contact member 241 by the first carrier 242 to move upward in the Z direction to push the sputtered electronic components 222 and the outer cover 226 to peel off the glue of the carrier frame module 212. Film 2121, and the second transfer device 232 of the transfer mechanism 23 is easy to take out the used outer cover 226 from the carrier frame module 212 and transfer the outer cover 226 to the third feeder 225 for storage, and The first feeder 231 is easy to take out the sputtered electronic components 222 from the frame carrier module 212. Since the first feeder 221 of the loading mechanism 22 is an empty tray, the first feeder 231 is The plated electronic components 222 are transferred to the first feeder 221 for storage, and the first carrier 223 of the feeder 22 outputs a plurality of sputtered electricity. The first set 222 of the feeder member 221, thereby completing the automatic loading and unloading operations always satisfied the practical benefits of the job quality improvement.
請參閱第11、12圖，本發明作業裝置20之第二實施例與第一實施例之差異在於該承載機構21除了設置第一承置器211外，並增設一第二承置器213，第二承置器213係承置至少一具已作業第一元件之載框模組212，於本實施例中，係增設一為輸送皮帶輪組且呈第三方向(如Y方向)配置之第二承置器213，第二承置器213係承置具已作業電子元件222之載框模組212；該置料機構22除了設置第一置料器221、第二置料器224及第三置料器225外，並增設一第四置料器227，而收置已作業之第一元件，並以第二載送器228輸送第四置料器227位移，於本實施例中，該第四置料 器227係為空的料盤，以容納複數個為已作業電子元件222之第一元件，並置放於一為輸送皮帶輪組之第二載送器228；該移料機構23之第一移料器231係於第一置料器221及第一承置器211上之載框模組212間移載待作業之電子元件222，該第二移料器232係於第二置料器224及第一承置器211上之載框模組212間移載待使用之外蓋226，該移料機構23另設有第三移料器234及第四移料器235，並由至少一第二驅動單元236驅動第三移料器234及第四移料器235作第一、二、三方向位移，令該第三移料器234於第三置料器225及第二承置器213上之載框模組212間移載已使用之外蓋226，並令第四移料器235於第四置料器227及第二承置器213上之載框模組212間移載已作業之電子元件222；該滾抵機構24除了以第一滾抵件241滾壓位於第一承置器211處之載框模組212的膠膜2121貼合第一元件，另增設有至少一第二滾抵件243，以於第二承置器213之載框模組212的膠膜2121底面依預設作動時序位移，以頂推第一元件剝離膠膜2121，於本實施例中，係於承載機構21之第二承置器213處設置一為滾輪之第二滾抵件243，該第二滾抵件243並由一第二運送器244運送作第一、二、三方向位移，以頂推位於第二承置器213處之載框模組212的膠膜2121底面，使電子元件222易於剝離膠膜2121。 Please refer to FIGS. 11 and 12. The difference between the second embodiment and the first embodiment of the working device 20 of the present invention is that the carrier mechanism 21 is provided with a second holder 213 in addition to the first holder 211. The second holder 213 is used to receive at least one carrier frame module 212 that has been operated with the first element. In this embodiment, a second belt conveyor module is arranged in the third direction (such as the Y direction). The two holders 213 and the second holder 213 are the carrier frame modules 212 with the operated electronic components 222; in addition to the placing mechanism 22, the first placing device 221, the second placing device 224, and the first Outside the three feeders 225, a fourth feeder 227 is added to receive the first component that has been operated, and the fourth carrier 227 is transported by the second carrier 228 for displacement. In this embodiment, The fourth stock The feeder 227 is an empty tray to accommodate a plurality of first components that have been operated electronic components 222, and is placed on a second carrier 228 that is a conveying belt pulley group; the first transfer of the transfer mechanism 23 The loader 231 is used to transfer the electronic components 222 to be operated between the loader module 212 on the first loader 221 and the first supporter 211. The second loader 232 is connected to the second loader 224 and The outer frame 226 to be used is transferred between the frame loading modules 212 on the first holder 211. The transfer mechanism 23 is further provided with a third transfer device 234 and a fourth transfer device 235. The two driving units 236 drive the third feeder 234 and the fourth feeder 235 to perform first, second and third direction displacement, so that the third feeder 234 is positioned on the third feeder 225 and the second holder 213. The used outer cover 226 is transferred between the frame loading modules 212 above, and the fourth transfer device 235 is transferred between the fourth loading device 227 and the loading frame modules 212 on the second support 213. The operating electronic component 222; the rolling contact mechanism 24 besides the first rolling contact member 241 rolling the adhesive film 2121 of the carrier frame module 212 located at the first holder 211 to adhere the first component, and at least one additional second The rolling member 243 is used to shift the bottom surface of the adhesive film 2121 of the frame holder module 212 of the second holder 213 according to a preset operation timing, so as to push the first component peeling adhesive film 2121. In this embodiment, it is based on A second rolling contact member 243 as a roller is disposed at the second supporter 213 of the bearing mechanism 21, and the second rolling contact member 243 is transported by a second carrier 244 for first, second, and third direction displacement, Pushing the bottom surface of the adhesive film 2121 of the frame carrier module 212 located at the second holder 213 makes the electronic component 222 easy to peel off the adhesive film 2121.
請參閱第13圖，係本發明作業裝置20第二實施例應用於作業設備的示意圖，該作業設備包含機台31、作業裝置20、處理裝置及中央控制裝置(圖未示出)，該處理裝置係配置於機台31上，並設有至少一處理器，以對第一元件執行預設處理作業，該中央控制裝置係用以控制及整合各裝置作動，以執行自動化作業，於本實施例中，該作業設備係為濺鍍作業設備，該處理裝置係為一具濺鍍器之濺鍍處理裝置32，並裝配於機台31上，且位於作業裝置20之側方，以對電子元件222執行 濺鍍處理作業，該作業裝置20係配置於機台31上，並設有承載機構21、置料機構22、移料機構23及滾抵機構24，以執行至少一第一元件之預設作業，該作業裝置20之搬運機構26係以搬運驅動源262驅動該搬運器261於承載機構21之第一承置器211、第二承置器213及濺鍍處理裝置32之間作X方向位移而搬運該載框模組212。 Please refer to FIG. 13, which is a schematic diagram of a second embodiment of the working device 20 of the present invention applied to a working device. The working device includes a machine 31, a working device 20, a processing device, and a central control device (not shown). The device is arranged on the machine 31 and is provided with at least one processor to perform a preset processing operation on the first component. The central control device is used to control and integrate the actions of various devices to perform automatic operations. In this implementation, In the example, the operation equipment is a sputtering operation equipment, and the processing device is a sputtering processing device 32 with a sputtering device, and is mounted on the machine 31 and is located on the side of the operation device 20 to Element 222 executes For the sputtering process, the operation device 20 is arranged on the machine 31 and is provided with a bearing mechanism 21, a material placing mechanism 22, a material moving mechanism 23, and a rolling mechanism 24 to perform a preset operation of at least one first component. The conveying mechanism 26 of the operating device 20 drives the conveyer 261 with a conveying driving source 262 to make an X-direction displacement between the first holder 211, the second holder 213, and the sputtering processing device 32 of the carrying mechanism 21. And the carrier frame module 212 is carried.
Claims (10)
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| TWI786848B (en) * | 2021-09-24 | 2022-12-11 | 陽程科技股份有限公司 | Sheet separating device and sheet separating method |
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