TWI668602B - Electronic device - Google Patents
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- TWI668602B TWI668602B TW107130456A TW107130456A TWI668602B TW I668602 B TWI668602 B TW I668602B TW 107130456 A TW107130456 A TW 107130456A TW 107130456 A TW107130456 A TW 107130456A TW I668602 B TWI668602 B TW I668602B
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Abstract
一種電子裝置，包括本體、第一外殼件、可變形結構、第一熱致相變件及第一熱源。第一外殼件配置於本體的外側。可變形結構連接本體與第一外殼件。第一熱致相變件至少包覆部分可變形結構。第一熱源熱耦合於第一熱致相變件。當第一熱致相變件的溫度低於第一溫度時，第一熱致相變件固持可變形結構，而維持第一外殼件與本體之間的相對位置。當第一熱致相變件被第一熱源加熱而使溫度大於或等於第一溫度時，第一熱致相變件軟化，被第一熱致相變件所包覆的可變形結構適於被調整，以改變第一外殼件與本體之間的相對位置。An electronic device includes a body, a first outer casing member, a deformable structure, a first thermally induced phase change member, and a first heat source. The first outer casing member is disposed on an outer side of the body. The deformable structure connects the body to the first outer casing member. The first thermally induced phase change member covers at least a portion of the deformable structure. The first heat source is thermally coupled to the first thermally induced phase change member. When the temperature of the first thermally induced phase change member is lower than the first temperature, the first thermally induced phase change member holds the deformable structure while maintaining the relative position between the first outer casing member and the body. When the first thermally induced phase change member is heated by the first heat source such that the temperature is greater than or equal to the first temperature, the first thermally induced phase change member is softened, and the deformable structure covered by the first thermally induced phase change member is adapted Adjusted to change the relative position between the first outer casing member and the body.
Description
本發明是有關於一種電子裝置，且特別是有關於一種可匹配使用者用於操作電子裝置的部位之尺寸或/及外形的電子裝置。The present invention relates to an electronic device, and more particularly to an electronic device that can match the size or/and shape of a portion of a user for operating the electronic device.
隨著資訊科技的蓬勃發展，用於人機溝通的硬體媒介，例如觸控面板、鍵盤、滑鼠及觸控筆等，更是不斷地推陳出新。近年來，在電競市場不斷地擴張下，帶動了許多周邊硬體產業的蓬勃發展，其中滑鼠的選用更是許多電競玩家在電競賽事中脫穎而出的致勝關鍵之一。With the rapid development of information technology, hardware media for human-computer communication, such as touch panels, keyboards, mice and styluses, are constantly being introduced. In recent years, the continuous expansion of the e-sports market has led to the vigorous development of many peripheral hardware industries. The selection of the mouse is one of the keys to success for many e-sports players to stand out in the e-sports competition.
目前，市面上的滑鼠品牌、種類繁多，且市場主流仍以功能性為設計導向居多。然而，隨著人們使用資訊設備的時間增加，長時間的操作滑鼠易造成手部的損傷，例如：腕隧道症候群（俗稱滑鼠手）。因此，如何提升滑鼠的操作舒適性已逐漸成為各廠所亟欲解決的問題。At present, there are many brands of mouse brands on the market, and the market mainstream is still dominated by functional design. However, as people spend more time using information devices, long-term operation of the mouse is likely to cause hand injuries, such as: carpal tunnel syndrome (commonly known as the mouse hand). Therefore, how to improve the operating comfort of the mouse has gradually become a problem that every factory wants to solve.
本發明提供一種電子裝置，其可匹配使用者在操作電子裝置的部位(例如是手部)的尺寸或/及外形。The present invention provides an electronic device that matches the size or/or shape of a user's location (e.g., a hand) in operating the electronic device.
本發明的電子裝置，包括本體、第一外殼件、可變形結構、第一熱致相變件以及第一熱源。第一外殼件配置於本體的外側。可變形結構連接本體與第一外殼件。第一熱致相變件至少包覆部分可變形結構。第一熱源熱耦合於第一熱致相變件。當第一熱致相變件的溫度低於第一溫度時，第一熱致相變件固持可變形結構，而維持第一外殼件與本體之間的相對位置。當第一熱致相變件被第一熱源加熱而使溫度大於或等於第一溫度時，第一熱致相變件軟化，被第一熱致相變件所包覆的可變形結構適於被調整，以改變第一外殼件與本體之間的相對位置。The electronic device of the present invention includes a body, a first outer casing member, a deformable structure, a first thermally induced phase change member, and a first heat source. The first outer casing member is disposed on an outer side of the body. The deformable structure connects the body to the first outer casing member. The first thermally induced phase change member covers at least a portion of the deformable structure. The first heat source is thermally coupled to the first thermally induced phase change member. When the temperature of the first thermally induced phase change member is lower than the first temperature, the first thermally induced phase change member holds the deformable structure while maintaining the relative position between the first outer casing member and the body. When the first thermally induced phase change member is heated by the first heat source such that the temperature is greater than or equal to the first temperature, the first thermally induced phase change member is softened, and the deformable structure covered by the first thermally induced phase change member is adapted Adjusted to change the relative position between the first outer casing member and the body.
在本發明的一實施例中，上述的電子裝置的可變形結構包括彈簧。In an embodiment of the invention, the deformable structure of the electronic device includes a spring.
在本發明的一實施例中，上述的電子裝置的可變形結構包括彼此樞接的兩連桿。In an embodiment of the invention, the deformable structure of the electronic device includes two links that are pivotally connected to each other.
在本發明的一實施例中，上述的電子裝置的可變形結構包括可伸縮套管。In an embodiment of the invention, the deformable structure of the electronic device includes a telescopic sleeve.
在本發明的一實施例中，上述的電子裝置的第一外殼件包括外露的表面層、鋪設於表面層內側的第二熱致相變件及熱耦合於第二熱致相變件的第二熱源。當第二熱致相變件被第二熱源加熱使溫度大於或等於第二溫度時，第二熱致相變件適於被變形，以改變表面層的起伏輪廓。In an embodiment of the invention, the first outer casing member of the electronic device includes an exposed surface layer, a second thermally induced phase change member disposed on the inner side of the surface layer, and a second thermally coupled phase change member. Two heat sources. The second thermally induced phase change member is adapted to be deformed to change the undulating profile of the surface layer when the second thermally induced phase change member is heated by the second heat source such that the temperature is greater than or equal to the second temperature.
在本發明的一實施例中，上述的電子裝置的第二熱源包括相變化放熱層。具有第二熱致相變件的第一外殼件包括開孔及可移除地配置於開孔的密封件。開孔連通於相變化放熱層。相變化放熱層適於接觸空氣而發生相變化。In an embodiment of the invention, the second heat source of the electronic device includes a phase change heat release layer. The first outer casing member having the second thermally induced phase change member includes an opening and a seal removably disposed in the opening. The opening is connected to the phase change heat release layer. The phase change heat release layer is adapted to contact the air to undergo a phase change.
在本發明的一實施例中，上述的電子裝置的第二熱致相變件的第二溫度小於或等於第一熱致相變件的第一溫度。In an embodiment of the invention, the second temperature of the second thermally induced phase change member of the electronic device is less than or equal to the first temperature of the first thermally induced phase change member.
在本發明的一實施例中，上述的電子裝置的第二熱致相變件設置在第二熱源與表面層之間。In an embodiment of the invention, the second thermally induced phase change member of the electronic device is disposed between the second heat source and the surface layer.
在本發明的一實施例中，上述的電子裝置的第二熱源熱耦合於第一熱源。In an embodiment of the invention, the second heat source of the electronic device is thermally coupled to the first heat source.
在本發明的一實施例中，上述的電子裝置包括滑鼠或遊戲控制器。In an embodiment of the invention, the electronic device includes a mouse or a game controller.
基於上述，本發明之一實施例的電子裝置，透過連接於本體與外殼件之間的可變形結構，調整本體與外殼件之間的相對位置，以匹配使用者在操作電子裝置的部位（例如是手部）的尺寸或/及外形，並將可變形結構利用熱致相變件予以固定，可增加終端使用者的操作彈性，進而提升電子裝置的操作舒適度。Based on the above, an electronic device according to an embodiment of the present invention adjusts a relative position between the body and the outer casing member through a deformable structure connected between the main body and the outer casing member to match a position of the user operating the electronic device (for example, It is the size or/and shape of the hand), and the deformable structure is fixed by the thermally induced phase change member, which can increase the operational flexibility of the end user, thereby improving the operational comfort of the electronic device.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.
現將詳細地參考本發明的示範性實施例，示範性實施例的實例說明於所附圖式中。只要有可能，相同元件符號在圖式和描述中用來表示相同或相似部分。Reference will now be made in detail to the exemplary embodiments embodiments Wherever possible, the same element symbols are used in the drawings and the description
圖1為本發明之第一實施例的電子裝置10的示意圖。圖2為本發明之第一實施例的電子裝置10的分解示意圖。特別是，為清楚呈現起見，圖2省略了滾輪、部分按鈕及部分殼體的繪示。請參照圖1，在本實施例中，電子裝置10例如是（有線或無線）滑鼠，適用於慣用左手或慣用右手進行操作的使用者。然而，本發明不以此為限，根據其他的實施例，電子裝置也可以是遊戲控制器（gamepad）。值得一提的是，本實施例的電子裝置10在生產端出貨後仍保有其尺寸或/及外形的可調節功能，使終端消費者在購回後可以針對個人的慣用操作部位進行匹配。因此，本實施例的電子裝置10能在客戶端為不同年齡層的使用者提供最佳的操作舒適度。1 is a schematic diagram of an electronic device 10 in accordance with a first embodiment of the present invention. 2 is an exploded perspective view of the electronic device 10 of the first embodiment of the present invention. In particular, for clarity of presentation, Figure 2 omits the depiction of the scroll wheel, partial button, and partial housing. Referring to FIG. 1, in the embodiment, the electronic device 10 is, for example, a (wired or wireless) mouse, and is suitable for a user who is left-handed or right-handed. However, the present invention is not limited thereto. According to other embodiments, the electronic device may also be a gamepad. It is worth mentioning that the electronic device 10 of the embodiment still retains its adjustable size and/or shape after being shipped from the production end, so that the terminal consumer can match the customary operation parts of the individual after the purchase. Therefore, the electronic device 10 of the present embodiment can provide optimal operation comfort for users of different age groups at the client.
請參照圖2，在本實施例中，電子裝置10包括本體100及多個外殼件200，多個外殼件200配置於本體100的外側。舉例而言，在本實施例中，本體100具有頂面100t、分別連接於頂面100t的第一側面100a、第二側面100b及第三側面100c，第一側面100a與第二側面100b例如是指相對的兩面，但相對關係不以此為限制。Referring to FIG. 2 , in the embodiment, the electronic device 10 includes a body 100 and a plurality of outer casing members 200 , and the plurality of outer casing members 200 are disposed outside the body 100 . For example, in the embodiment, the body 100 has a top surface 100t, and a first side 100a, a second side 100b, and a third side 100c respectively connected to the top surface 100t. The first side 100a and the second side 100b are, for example, Refers to the opposite sides, but the relative relationship is not limited.
這些外殼件200可包括配置於本體100的第一側面100a外的第一外殼件210、並列配置於本體100的頂面100t外的第二外殼件220與第三外殼件230、配置於本體100的第二側面100b外的第四外殼件240及配置於本體100的第三側面100c外的第五外殼件250，但本發明不以此為限。The outer casing member 200 may include a first outer casing member 210 disposed outside the first side surface 100a of the body 100, a second outer casing member 220 and a third outer casing member 230 disposed side by side of the top surface 100t of the body 100, and disposed on the body 100. The fourth outer casing member 240 outside the second side surface 100b and the fifth outer casing member 250 disposed outside the third side surface 100c of the body 100, but the invention is not limited thereto.
舉例而言，在本實施例中，第一外殼件210適於靠抵使用者的手掌心。第二外殼件220可為滑鼠的右鍵，適於讓慣用右手的使用者利用中指進行操作。第三外殼件230可為滑鼠的左鍵，適於讓慣用右手的使用者利用食指進行操作。第四外殼件240可包括另一組功能設定鍵，適於讓慣用右手的使用者利用無名指或小指進行操作。第五外殼件250可包括一組功能設定鍵，適於讓慣用右手的使用者利用拇指進行操作，但本發明不以此為限。For example, in the present embodiment, the first outer casing member 210 is adapted to abut against the palm of the user's hand. The second outer casing member 220 can be a right button of the mouse and is adapted for the right-handed user to operate with the middle finger. The third outer casing member 230 can be a left button of the mouse and is adapted for the right-handed user to operate with the index finger. The fourth housing member 240 can include another set of function setting keys adapted to allow a right-handed user to operate with a ring finger or a little finger. The fifth housing member 250 can include a set of function setting keys adapted to allow a right-handed user to operate with the thumb, but the invention is not limited thereto.
圖3為本發明之第一實施例的電子裝置的本體100、多個可變形結構310~350及第一熱致相變件400的示意圖。圖4為本發明之第一實施例的電子裝置10的可變形結構310的剖面示意圖。特別是，圖4可對應於圖3的剖線B-B’，且為清楚呈現起見，圖3省略了圖2之第一熱源500的繪示。3 is a schematic diagram of the body 100, the plurality of deformable structures 310-350, and the first thermally induced phase change member 400 of the electronic device according to the first embodiment of the present invention. 4 is a cross-sectional view showing a deformable structure 310 of the electronic device 10 of the first embodiment of the present invention. In particular, Figure 4 may correspond to the section line B-B' of Figure 3, and for clarity of presentation, Figure 3 omits the depiction of the first heat source 500 of Figure 2.
請參照圖3及圖4，在本實施例中，電子裝置10更包括多個可變形結構310、320、330、340、350。每一可變形結構310、320、330、340、350具有套管301，可在第一方向D1、第二方向D2或第三方向D3上延伸且配置於本體100。特別是，在本實施例中，套管301的延伸方向可實質上定義出每一可變形結構310、320、330、340、350的作動方向。在本實施例中，第一方向D1實質上可垂直於第二方向D2，而第三方向D3實質上可垂直於第一方向D1及第二方向D2。上述方向的定義僅是舉例說明，本發明並不加以限制。Referring to FIG. 3 and FIG. 4 , in the embodiment, the electronic device 10 further includes a plurality of deformable structures 310 , 320 , 330 , 340 , and 350 . Each of the deformable structures 310, 320, 330, 340, 350 has a sleeve 301 that can extend in the first direction D1, the second direction D2, or the third direction D3 and is disposed on the body 100. In particular, in the present embodiment, the direction in which the sleeve 301 extends may substantially define the direction of actuation of each of the deformable structures 310, 320, 330, 340, 350. In this embodiment, the first direction D1 may be substantially perpendicular to the second direction D2, and the third direction D3 may be substantially perpendicular to the first direction D1 and the second direction D2. The above definitions are merely illustrative and the invention is not limited.
在本實施例中，每一可變形結構310、320、330、340、350更包括彈簧302及活塞連桿組303，其中彈簧302設置於套管301內。套管301具有開孔301a，活塞連桿組303經由開孔301a穿設於套管301。活塞連桿組303具有位於套管301內的活塞部303a，與彈簧302的端部302a互相抵靠。詳細而言，在本實施例中，彈簧302可在第一方向D1、第二方向D2或第三方向D3上伸長或收縮。也就是說，與彈簧302互相抵靠的活塞連桿組303也可在第一方向D1、第二方向D2或第三方向D3上移動，但本發明不以此為限。In the present embodiment, each deformable structure 310, 320, 330, 340, 350 further includes a spring 302 and a piston link set 303, wherein the spring 302 is disposed within the sleeve 301. The sleeve 301 has an opening 301a through which the piston rod set 303 is passed through the opening 301a. The piston rod set 303 has a piston portion 303a located within the sleeve 301 that abuts against the end 302a of the spring 302. In detail, in the present embodiment, the spring 302 may be elongated or contracted in the first direction D1, the second direction D2, or the third direction D3. That is to say, the piston rod set 303 that abuts against the spring 302 can also move in the first direction D1, the second direction D2 or the third direction D3, but the invention is not limited thereto.
請參照圖2及圖3，在本實施例中，每一可變形結構310、320、330、340、350連接於本體100及對應的一個外殼件200之間。舉例而言，在本實施例中，第一外殼件210透過兩個可變形結構310與本體100連接。第二外殼件220透過一個可變形結構320與本體100連接。第三外殼件230透過一個可變形結構330與本體100連接。第四外殼件240透過兩個可變形結構340與本體100連接。第五外殼件250透過兩個可變形結構350與本體100連接。然而，本發明不以此為限，根據其他的實施例，電子裝置的外殼件可依據尺寸大小及配置關係來決定所對應的可變形結構的連接數量。Referring to FIG. 2 and FIG. 3 , in the embodiment, each deformable structure 310 , 320 , 330 , 340 , 350 is connected between the body 100 and a corresponding one of the outer casing members 200 . For example, in the present embodiment, the first outer casing member 210 is coupled to the body 100 through two deformable structures 310. The second outer casing member 220 is coupled to the body 100 through a deformable structure 320. The third outer casing member 230 is coupled to the body 100 through a deformable structure 330. The fourth outer casing member 240 is coupled to the body 100 through two deformable structures 340. The fifth outer casing member 250 is coupled to the body 100 through two deformable structures 350. However, the present invention is not limited thereto. According to other embodiments, the outer casing member of the electronic device can determine the number of connections of the corresponding deformable structure according to the size and the arrangement relationship.
詳細而言，在本實施例中，第一外殼件210可相對於本體100在第二方向D2上移動。第二外殼件220及第三外殼件230可相對於本體100在第三方向D3上移動。第四外殼件240及第五外殼件250可相對於本體100在第一方向D1上移動。也就是說，在本實施例中，電子裝置10可藉由多個可變形結構310、320、330、340、350，調整對應的多個外殼體200與本體100的相對位置。In detail, in the present embodiment, the first outer casing member 210 is movable relative to the body 100 in the second direction D2. The second outer casing member 220 and the third outer casing member 230 are movable relative to the body 100 in the third direction D3. The fourth outer casing member 240 and the fifth outer casing member 250 are movable relative to the body 100 in the first direction D1. That is to say, in the embodiment, the electronic device 10 can adjust the relative positions of the corresponding plurality of outer casings 200 and the body 100 by using the plurality of deformable structures 310, 320, 330, 340, and 350.
圖5為本發明之第二實施例的可變形結構310A的剖面示意圖。圖6為本發明之第三實施例的可變形結構310B的剖面示意圖。圖7為本發明之第四實施例的可變形結構310C的剖面示意圖。Figure 5 is a cross-sectional view showing a deformable structure 310A of a second embodiment of the present invention. Figure 6 is a cross-sectional view showing a deformable structure 310B of a third embodiment of the present invention. Figure 7 is a cross-sectional view showing a deformable structure 310C of a fourth embodiment of the present invention.
請參照圖5，本發明之第二實施例的可變形結構310A與圖4之第一實施例的可變形結構310的差異在於：可變形結構310A以套管302A取代圖4之可變形結構310的彈簧302。在本實施例中，套管302A的管徑DA2小於套管301A的管徑DA1，且套管302A穿設於套管301A，以形成可伸縮套管。Referring to FIG. 5, the deformable structure 310A of the second embodiment of the present invention is different from the deformable structure 310 of the first embodiment of FIG. 4 in that the deformable structure 310A replaces the deformable structure 310 of FIG. 4 with a sleeve 302A. Spring 302. In the present embodiment, the diameter DAR2 of the sleeve 302A is smaller than the diameter DA1 of the sleeve 301A, and the sleeve 302A is bored through the sleeve 301A to form a telescopic sleeve.
請參照圖6，本發明之第三實施例的可變形結構310B與圖4之第一實施例的可變形結構310的差異在於：可變形結構310B以彼此樞接的兩連桿302B、303B取代圖4之可變形結構310的彈簧302及活塞連桿組303。特別是，在本實施例中，可變形結構310B之連桿303B的作動方向是上述方向（例如：第一方向D1、第二方向D2或第三方向D3）中至少兩個方向的組合。Referring to FIG. 6, the deformable structure 310B of the third embodiment of the present invention is different from the deformable structure 310 of the first embodiment of FIG. 4 in that the deformable structure 310B is replaced by two links 302B and 303B pivotally connected to each other. The spring 302 of the deformable structure 310 of FIG. 4 and the piston rod set 303. In particular, in the present embodiment, the actuation direction of the link 303B of the deformable structure 310B is a combination of at least two of the above directions (for example, the first direction D1, the second direction D2, or the third direction D3).
請參照圖7，本發明之第四實施例的可變形結構310C與圖6之第三實施例的可變形結構310B的差異在於：可變形結構310C以連桿組302C取代圖6之可變形結構310B的連桿302B。如此一來，可變形結構310C的連桿303C可以相似於圖4之可變形結構310的活塞連桿組303及圖5之可變形結構310A的活塞連桿組303A在單一方向（例如：第一方向D1、第二方向D2或第三方向D3）上作動。需說明的是，在上述連桿的實施例中，本案並不限制連桿的連接方式，只要可改變外殼件200與本體100之間的相對位置的連桿結構即可。Referring to FIG. 7, the deformable structure 310C of the fourth embodiment of the present invention is different from the deformable structure 310B of the third embodiment of FIG. 6 in that the deformable structure 310C replaces the deformable structure of FIG. 6 with the link set 302C. Link 302B of 310B. As such, the link 303C of the deformable structure 310C can be similar to the piston link set 303 of the deformable structure 310 of FIG. 4 and the piston link set 303A of the deformable structure 310A of FIG. 5 in a single direction (eg, first Actuate in direction D1, second direction D2 or third direction D3). It should be noted that, in the embodiment of the above-mentioned connecting rod, the connection manner of the connecting rod is not limited in this case as long as the connecting rod structure which can change the relative position between the outer casing member 200 and the body 100 can be used.
請參照圖3，在本實施例中，每一可變形結構310、320、330、340、350的套管301還具有開孔301b，以暴露出部分的彈簧302。然而，本發明不以此為限，根據另一實施例，套管301也可具有相對的兩開孔301b。根據又一實施例，套管301可不具有開孔301b。Referring to FIG. 3, in the present embodiment, the sleeve 301 of each deformable structure 310, 320, 330, 340, 350 further has an opening 301b to expose a portion of the spring 302. However, the invention is not limited thereto. According to another embodiment, the sleeve 301 may also have two opposite openings 301b. According to yet another embodiment, the sleeve 301 may not have an opening 301b.
電子裝置10更包括第一熱致相變件400，其至少包覆部分可變形結構310、320、330、340、350。在本實施例中，第一熱致相變件400填充於本體100內，且填入每一可變形結構310、320、330、340、350的開孔301b，以包覆每一可變形結構310、320、330、340、350的彈簧302。然而，本發明不以此為限，根據其他的實施例，第一熱致相變件400可直接填充於可變形結構310、320、330、340、350的套管301內。The electronic device 10 further includes a first thermally induced phase change member 400 that covers at least a portion of the deformable structure 310, 320, 330, 340, 350. In the present embodiment, the first thermally induced phase change member 400 is filled in the body 100 and filled into the opening 301b of each deformable structure 310, 320, 330, 340, 350 to cover each deformable structure. Springs 302 of 310, 320, 330, 340, 350. However, the present invention is not limited thereto. According to other embodiments, the first thermally induced phase change member 400 may be directly filled in the sleeve 301 of the deformable structure 310, 320, 330, 340, 350.
在本實施例中，第一熱致相變件400具有第一溫度T1，其中當第一熱致相變件400的溫度低於第一溫度T1時，第一熱致相變件400固持可變形結構310、320、330、340、350，以維持多個外殼件200與本體100之間的相對位置。舉例而言，在本實施例中，第一熱致相變件400的材質，例如是油泥（滑石粉62%、凡士林30%、工業用蠟8%）或其他適合的熱致形變材料，且第一溫度T1可以是介於攝氏40度至攝氏60度之間的溫度，但本發明不以此為限。In this embodiment, the first thermally induced phase change member 400 has a first temperature T1, wherein when the temperature of the first thermally induced phase change member 400 is lower than the first temperature T1, the first thermally induced phase change member 400 is retained. The deformed structures 310, 320, 330, 340, 350 are configured to maintain a relative position between the plurality of outer casing members 200 and the body 100. For example, in the present embodiment, the material of the first thermally induced phase change member 400 is, for example, sludge (62% talc, 30% petroleum jelly, 8% industrial wax) or other suitable heat-induced deformation material, and The first temperature T1 may be a temperature between 40 degrees Celsius and 60 degrees Celsius, but the invention is not limited thereto.
請參照圖2及圖3，在本實施例中，電子裝置10更包括第一熱源500，熱耦合於第一熱致相變件400。舉例而言，在本實施例中，第一熱源500可以是微加熱電路或其他適合的微加熱器（micro heater），設置於本體100的頂面100t，且基於熱傳導性能的考量，本體100的材質可以是金屬。然而，本發明不限於此，根據其他的實施例，第一熱源500也可設置於本體100的第一側面100a、第二側面100b、第三側面100c或上述的組合。舉例而言，在本實施例中，第一熱源500可經由（有線）滑鼠與資訊設備的連接介面（例如：USB、PS/2）取得所需的電力，無須搭配額外的供電系統。然而，本發明不限於此，在其他實施例中，例如是應用於無線滑鼠，第一熱源500也可由無線滑鼠的供電系統（例如電池）取得所需的電力。Referring to FIG. 2 and FIG. 3 , in the embodiment, the electronic device 10 further includes a first heat source 500 thermally coupled to the first thermally induced phase change member 400 . For example, in the embodiment, the first heat source 500 may be a micro heating circuit or other suitable micro heater, disposed on the top surface 100t of the body 100, and based on thermal conductivity performance considerations, the body 100 The material can be metal. However, the present invention is not limited thereto. According to other embodiments, the first heat source 500 may also be disposed on the first side 100a, the second side 100b, the third side 100c of the body 100, or a combination thereof. For example, in this embodiment, the first heat source 500 can obtain the required power via a connection interface (eg, USB, PS/2) of the (wired) mouse and the information device, without an additional power supply system. However, the present invention is not limited thereto, and in other embodiments, for example, applied to a wireless mouse, the first heat source 500 can also obtain the required power from a wireless mouse's power supply system (e.g., a battery).
在本實施例中，當第一熱致相變件400被第一熱源500加熱而使溫度大於或等於第一溫度T1時，第一熱致相變件400軟化。此時，被第一熱致相變件400所包覆的可變形結構310、320、330、340、350適於被調整，以改變多個外殼件200與本體100之間的相對位置。也就是說，本實施例的電子裝置10（即滑鼠）可讓使用者自行透過調整多個外殼件200與本體100的相對位置，以匹配使用者在操作電子裝置的部位（例如是手部）的尺寸或/及外形，並將可變形結構310、320、330、340、350利用第一熱致相變件400予以固定，可增加終端使用者的操作彈性，進而提升電子裝置的操作舒適度。以下將針對此一匹配過程進行說明。In the present embodiment, when the first thermally induced phase change member 400 is heated by the first heat source 500 such that the temperature is greater than or equal to the first temperature T1, the first thermally induced phase change member 400 softens. At this time, the deformable structures 310, 320, 330, 340, 350 covered by the first thermally induced phase change member 400 are adapted to be adjusted to change the relative position between the plurality of outer casing members 200 and the body 100. In other words, the electronic device 10 (ie, the mouse) of the embodiment allows the user to adjust the relative positions of the plurality of outer casing members 200 and the body 100 to match the position of the user in operating the electronic device (for example, the hand). The size or/and the shape, and the deformable structure 310, 320, 330, 340, 350 are fixed by the first thermally induced phase change member 400, which can increase the operational flexibility of the end user, thereby improving the operation comfort of the electronic device. degree. This matching process will be described below.
圖8A至圖8D為本發明之第一實施例的電子裝置10於匹配使用者在操作電子裝置的部位的流程剖面示意圖。特別是，圖8A至圖8D可對應於圖3的剖線B-B’。為清楚呈現起見，圖8A至圖8D僅繪示出電子裝置10的可變形結構310及第一熱致相變件400。8A to 8D are schematic cross-sectional views showing the flow of the electronic device 10 according to the first embodiment of the present invention in a position where the user is operating the electronic device. In particular, Figures 8A through 8D may correspond to the line B-B' of Figure 3. For clarity of presentation, FIGS. 8A-8D depict only the deformable structure 310 of the electronic device 10 and the first thermally induced phase change member 400.
請參照圖8A，此時，可變形結構310及第一熱致相變件400的溫度小於第一溫度T1，例如是室溫。可變形結構310的彈簧302及活塞連桿組303因第一熱致相變件400S呈現固化狀態而無法作動。Referring to FIG. 8A, at this time, the temperature of the deformable structure 310 and the first thermally induced phase change member 400 is less than the first temperature T1, such as room temperature. The spring 302 and the piston rod set 303 of the deformable structure 310 are incapable of being actuated by the first thermally induced phase change member 400S being in a cured state.
請參照圖8B，當使用者開啟主體手型匹配的功能時，第一熱源500開始作動並持續加熱第一熱致相變件400，使第一熱致相變件400的溫度大於或等於第一溫度T1。此時，軟化的第一熱致相變件400L無法固持可變形結構310的彈簧302於收縮狀態，因此彈簧302可朝單一方向（即第二方向D2）進行伸展，連帶使活塞連桿組303朝第二方向D2移動至位置P1。Referring to FIG. 8B, when the user turns on the function of the main body type matching, the first heat source 500 starts to operate and continuously heats the first thermally induced phase change member 400, so that the temperature of the first thermally induced phase change member 400 is greater than or equal to the first A temperature T1. At this time, the softened first thermally induced phase change member 400L cannot hold the spring 302 of the deformable structure 310 in the contracted state, so the spring 302 can be extended in a single direction (ie, the second direction D2), and the piston rod set 303 is coupled. Moves to the position P1 in the second direction D2.
請參照圖8C，在活塞連桿組303移動至圖8B中的位置P1後，此時，連接於活塞連桿組303的外殼件200移動至符合使用者的手部（未繪示）的位置。接著，關閉第一熱源500，使第一熱致相變件400降溫。舉例而言，在本實施例中，第一熱致相變件400藉由與外在環境（例如：室溫環境）的熱平衡達到降溫的效果，但本發明不以此為限，根據其他的實施例，第一熱源500可包括熱電致冷模組（thermoelectric cooling module），以達到快速降溫的效果。Referring to FIG. 8C, after the piston rod set 303 is moved to the position P1 in FIG. 8B, at this time, the outer casing member 200 connected to the piston rod set 303 is moved to a position conforming to the user's hand (not shown). . Next, the first heat source 500 is turned off to cool the first thermally induced phase change member 400. For example, in the present embodiment, the first thermally induced phase change member 400 achieves the effect of cooling by thermal equilibrium with an external environment (for example, a room temperature environment), but the present invention is not limited thereto, and according to other In an embodiment, the first heat source 500 may include a thermoelectric cooling module to achieve a rapid cooling effect.
請參照圖8D，在第一熱致相變件400的溫度下降至小於第一溫度T1後，此時，呈現固化狀態的第一熱致相變件400S可固持可變形結構310的彈簧302及活塞連桿組303，以維持外殼件200與本體100之間的相對位置。如此一來，電子裝置10的外殼件200可維持在匹配使用者用以操作電子裝置10之部位（例如是手部）的尺寸或/及外形的位置上。需說明的是，上述匹配過程是以第一實施例為例進行說明，而此匹配過程也適用於其他的實施例，在此不多加贅述。Referring to FIG. 8D, after the temperature of the first thermally induced phase change member 400 drops to less than the first temperature T1, at this time, the first thermally induced phase change member 400S exhibiting a cured state can hold the spring 302 of the deformable structure 310 and The piston rod set 303 maintains the relative position between the outer casing member 200 and the body 100. As such, the outer casing member 200 of the electronic device 10 can be maintained in a position that matches the size or/and shape of the portion of the user (eg, the hand) that the electronic device 10 is used to operate. It should be noted that the foregoing matching process is described by taking the first embodiment as an example, and the matching process is also applicable to other embodiments, and details are not described herein.
圖9A為本發明之第一實施例的第一外殼件210的剖面示意圖。圖9B至圖9D為本發明之第一實施例的第一外殼件210於匹配使用者在操作電子裝置的部位的流程剖面示意圖。特別是，圖9A至圖9D可對應於圖2的剖線A-A’。Figure 9A is a cross-sectional view showing the first outer casing member 210 of the first embodiment of the present invention. 9B to FIG. 9D are schematic cross-sectional views showing the first outer casing member 210 of the first embodiment of the present invention in matching the position of the user in operating the electronic device. In particular, Figures 9A through 9D may correspond to the line A-A' of Figure 2 .
請參照圖9A，在本實施例中，第一外殼件210可包括外露的表面層201、第二熱致相變件202、第二熱源203及殼體204。第二熱致相變件202設置於表面層201與殼體204之間。第二熱致相變件202鋪設於表面層201的內側。第二熱源203熱耦合於第二熱致相變件202。然而，本發明不限於此，根據其他的實施例，多個外殼件200的第二外殼件220、第三外殼件230、第四外殼件240、第五外殼件250或上述的組合也可包括表面層201、第二熱致相變件202及第二熱源203。在本實施例中，表面層201的材質，例如是親膚材料，但本發明不以此為限。Referring to FIG. 9A , in the embodiment, the first outer casing member 210 may include an exposed surface layer 201 , a second thermally induced phase change member 202 , a second heat source 203 , and a casing 204 . The second thermally induced phase change member 202 is disposed between the surface layer 201 and the housing 204. The second thermally induced phase change member 202 is laid on the inner side of the surface layer 201. The second heat source 203 is thermally coupled to the second thermally induced phase change member 202. However, the present invention is not limited thereto, and according to other embodiments, the second outer casing member 220, the third outer casing member 230, the fourth outer casing member 240, the fifth outer casing member 250, or a combination thereof, of the plurality of outer casing members 200 may also include The surface layer 201, the second thermally induced phase change member 202, and the second heat source 203. In the present embodiment, the material of the surface layer 201 is, for example, a skin-friendly material, but the invention is not limited thereto.
在本實施例中，第二熱致相變件202具有第二溫度T2，第二溫度T2可以是介於攝氏40度至攝氏50度之間的溫度。舉例而言，在本實施例中，第二熱致相變件202的第二溫度T2可小於第一熱致相變件400的第一溫度T1，以預防使用者在進行匹配時因操作部位（例如是）貼合外殼件200而遭燙傷，但本發明不以此為限，根據其他的實施例，第二熱致相變件202的第二溫度T2也可等於第一熱致相變件400的第一溫度T1。In the present embodiment, the second thermally induced phase change member 202 has a second temperature T2, and the second temperature T2 may be a temperature between 40 degrees Celsius and 50 degrees Celsius. For example, in this embodiment, the second temperature T2 of the second thermally induced phase change member 202 may be smaller than the first temperature T1 of the first thermally induced phase change member 400 to prevent the user from performing the matching due to the operation portion. For example, the outer casing member 200 is burned, but the invention is not limited thereto. According to other embodiments, the second temperature T2 of the second thermally induced phase change member 202 may also be equal to the first thermally induced phase transition. The first temperature T1 of the piece 400.
在本實施例中，第二熱致相變件202的材質與第一熱致相變件400的材質不同。然而，本發明不以此為限，根據其他的實施例，第二熱致相變件202的材質與第一熱致相變件400的材質可相同。In this embodiment, the material of the second thermally induced phase change member 202 is different from the material of the first thermally induced phase change member 400. However, the present invention is not limited thereto. According to other embodiments, the material of the second thermally induced phase change member 202 may be the same as the material of the first thermally induced phase change member 400.
在本實施例中，第二熱致相變件202可設置於第二熱源203與表面層201之間，以預防使用者用以操作電子裝置10的部位（例如是手部）在進行匹配時因操作部位貼合外殼件200而遭第二熱源203所釋放的熱能燙傷。然而，本發明不限於此，根據其他的實施例，第二熱源203也可設置在表面層201與第二熱致相變件202之間。此外，在本實施例中，第二熱致相變件202的材質，例如是油泥（滑石粉62%、凡士林30%、工業用蠟8%）或其他適合的熱致形變材料。In this embodiment, the second thermally induced phase change member 202 can be disposed between the second heat source 203 and the surface layer 201 to prevent the user from operating the electronic device 10 (for example, the hand) when performing matching. The thermal energy released by the second heat source 203 is burned because the operating portion is attached to the outer casing member 200. However, the present invention is not limited thereto, and according to other embodiments, the second heat source 203 may also be disposed between the surface layer 201 and the second thermally induced phase change member 202. Further, in the present embodiment, the material of the second thermally induced phase change member 202 is, for example, sludge (62% talc, 30% petroleum jelly, 8% industrial wax) or other suitable heat-induced deformation material.
在本實施例中，第二熱源203可包括相變化放熱層203A，設置於殼體204與第二熱致相變件202之間。舉例而言，在本實施例中，第一外殼件210的殼體204具有多個開孔204a，以暴露出部分的相變化放熱層203A，使相變化放熱層203A適於接觸空氣而發生相變化（phase transition）。在本實施例中，相變化放熱層203A的材質可以是相變石蠟、ABnH2O或其他一次性使用的相變材料，但本發明不以此為限。In this embodiment, the second heat source 203 may include a phase change heat release layer 203A disposed between the housing 204 and the second thermally induced phase change member 202. For example, in the present embodiment, the housing 204 of the first outer casing member 210 has a plurality of openings 204a to expose a portion of the phase change heat release layer 203A, so that the phase change heat release layer 203A is adapted to contact the air to cause phase Phase transition. In this embodiment, the material of the phase change heat release layer 203A may be phase change paraffin, ABnH 2 O or other single-use phase change materials, but the invention is not limited thereto.
在本實施例中，第一外殼件210更包括密封件205，可移除地配置於殼體204上遠離相變化放熱層203A的一側面204b上，並密封多個開孔204a，以防止相變化放熱層203A經由殼體204的多個開孔204a接觸到空氣而發生相變化，但本發明不以此為限。舉例而言，在本實施例中，密封件205的材質可以是彈性膠材或其他適於移除的密封材料。In this embodiment, the first outer casing member 210 further includes a sealing member 205, which is removably disposed on the casing 204 away from a side surface 204b of the phase change heat releasing layer 203A, and seals the plurality of opening holes 204a to prevent the phase. The change heat release layer 203A is phase-changed by contacting the air through the plurality of openings 204a of the housing 204, but the invention is not limited thereto. For example, in the embodiment, the material of the sealing member 205 may be an elastic rubber material or other sealing material suitable for removal.
在本實施例中，當第二熱致相變件202被第二熱源203（即相變化放熱層203A）加熱使溫度大於或等於第二溫度T2時，第二熱致相變件202軟化且適於被變形，以使表面層201的起伏輪廓匹配使用者用以操作電子裝置10的部位（例如是手部）的外形。以下將針對此一匹配過程進行說明。In the present embodiment, when the second thermally induced phase change member 202 is heated by the second heat source 203 (ie, the phase change heat release layer 203A) so that the temperature is greater than or equal to the second temperature T2, the second thermally induced phase change member 202 softens and It is adapted to be deformed such that the undulating profile of the surface layer 201 matches the contour of the location (eg, the hand) that the user uses to operate the electronic device 10. This matching process will be described below.
請參照圖9B，當使用者欲進行操作部位的外形匹配時，可將覆蓋於殼體204之多個開孔204a的密封件205移除。此時，呈現第一相態（即初始相態）的相變化放熱層203A-P1經由殼體204的多個開孔204a與空氣接觸而發生相變化。呈現固化狀態的第二熱致相變件202S的溫度受相變化放熱層203A-PA於相變化過程中所施放的熱能加熱而升高。Referring to FIG. 9B, when the user desires to match the shape of the operating portion, the sealing member 205 covering the plurality of openings 204a of the housing 204 can be removed. At this time, the phase change heat release layers 203A-P1 exhibiting the first phase state (ie, the initial phase state) are phase-changed by contact with air through the plurality of openings 204a of the casing 204. The temperature of the second thermally induced phase change member 202S exhibiting a solidified state is increased by the heat energy of the phase change heat release layer 203A-PA applied during the phase change.
請參照圖9C，在第二熱致相變件202的溫度被加熱至大於或等於第二溫度T2後，呈現液態的第二熱致相變件202L受使用者的操作部位（例如是手部）所施以的外力F1、F2擠壓而產生形變，使表面層201變形至位置P2而產生匹配於使用者之操作部位（例如是手部的手指或手掌）的外形的起伏輪廓。Referring to FIG. 9C, after the temperature of the second thermally induced phase change member 202 is heated to be greater than or equal to the second temperature T2, the second thermally induced phase change member 202L exhibiting a liquid state is subjected to a user's operating portion (eg, a hand portion). The applied external forces F1, F2 are deformed to deform, and the surface layer 201 is deformed to the position P2 to produce an undulating contour that matches the shape of the user's operating portion (for example, the finger or palm of the hand).
在呈現第二相態的相變化放熱層203A-P2的放熱反應（即相變化反應）結束後，呈現液態的第二熱致相變件202L的溫度逐漸降低。舉例而言，在本實施例中，第二熱致相變件202L藉由與外在環境（例如：室溫環境）的熱平衡達到降溫的效果，但本發明不以此為限，根據其他的實施例，第一外殼件210可包括熱電致冷模組（thermoelectric cooling module），以達到快速降溫的效果。After the end of the exothermic reaction (i.e., phase change reaction) of the phase change exothermic layers 203A-P2 exhibiting the second phase, the temperature of the second thermally induced phase change member 202L exhibiting a liquid state gradually decreases. For example, in the embodiment, the second thermally induced phase change member 202L achieves the effect of cooling by thermal equilibrium with an external environment (for example, a room temperature environment), but the invention is not limited thereto, and according to other In an embodiment, the first outer casing member 210 may include a thermoelectric cooling module to achieve a rapid cooling effect.
請參照圖9D，在第二熱致相變件202的溫度降低至小於第二溫度T2後，呈現固化狀態的第二熱致相變件202S可固定表面層201的起伏輪廓，以匹配使用者的操作部位（例如是手部的手指或手掌）的外形。Referring to FIG. 9D, after the temperature of the second thermally induced phase change member 202 is lowered to be less than the second temperature T2, the second thermally induced phase change member 202S exhibiting a cured state can fix the undulating profile of the surface layer 201 to match the user. The shape of the operating part (for example, the finger or palm of the hand).
因此，本實施例的電子裝置10可進行兩階段的變形。在第一階段中，使用者可透過改變外殼件200相對於本體100的位置，而調整電子裝置10的整體尺寸，使電子裝置10變大或變小以符合男性大人、女性大人或是小孩等不同手掌大小的需求。在第二階段中，使用者可透過改變外殼件200的外表面輪廓來匹配使用者的手部(例如手指或手掌)的細部輪廓，而達到客製化的效果。Therefore, the electronic device 10 of the present embodiment can perform two-stage deformation. In the first stage, the user can adjust the overall size of the electronic device 10 by changing the position of the outer casing member 200 relative to the body 100, so that the electronic device 10 becomes larger or smaller to conform to a male adult, a female adult or a child. Different palm size requirements. In the second phase, the user can achieve a customized effect by changing the contour of the outer surface of the outer casing member 200 to match the contour of the user's hand (such as a finger or palm).
圖10為本發明之第五實施例的第一外殼件210A的剖面示意圖。請參照圖2、圖3及圖10，本發明之第五實施例的第一外殼件210A與圖9A之第一實施例的第一外殼件210的差異在於：第一外殼件210A不具有密封件205。第一外殼件210A的殼體204不具有開孔204a，且可變形結構310的活塞連桿組303連接至第一外殼件210A的第二熱源203。Figure 10 is a cross-sectional view showing the first outer casing member 210A of the fifth embodiment of the present invention. Referring to FIG. 2, FIG. 3 and FIG. 10, the first outer casing member 210A of the fifth embodiment of the present invention is different from the first outer casing member 210 of the first embodiment of FIG. 9A in that the first outer casing member 210A does not have a seal. Piece 205. The housing 204 of the first outer casing member 210A does not have an opening 204a, and the piston rod set 303 of the deformable structure 310 is coupled to the second heat source 203 of the first outer casing member 210A.
在本實施例中，第二熱源203熱耦合於第一熱源500。舉例而言，本體100及可變形結構310的材質可以是導熱性較佳的材料，例如銅、鋁或其他適合的導熱材料，而第二熱源203可經由本體100及可變形結構310與第一熱源500熱耦合，但本發明不以此為限。也就是說，在本實施例中，用於加熱第二熱致相變件202的熱能可由第一熱源500提供。相較於第一實施例的相變化放熱層203A僅為一次性使用的相變材料，本實施例的第二熱致相變件202可重複性地受第二熱源203加熱，使其起伏輪廓匹配使用者的操作部位（例如是手部）的外形。In the present embodiment, the second heat source 203 is thermally coupled to the first heat source 500. For example, the material of the body 100 and the deformable structure 310 may be a material with better thermal conductivity, such as copper, aluminum or other suitable heat conductive material, and the second heat source 203 may be connected to the first through the body 100 and the deformable structure 310. The heat source 500 is thermally coupled, but the invention is not limited thereto. That is, in the present embodiment, the thermal energy for heating the second thermally induced phase change member 202 may be provided by the first heat source 500. Compared with the phase change heat release layer 203A of the first embodiment, which is only a single-use phase change material, the second heat-induced phase change member 202 of the present embodiment can be repeatedly heated by the second heat source 203 to make its undulating profile. Matches the shape of the user's operating site (eg, the hand).
綜上所述，本發明之一實施例的電子裝置，透過連接於本體與外殼件之間的可變形結構，調整本體與外殼件之間的相對位置，以匹配使用者在操作電子裝置的部位（例如是手部）的尺寸或/及外形，並將可變形結構利用熱致相變件予以固定，可增加終端使用者的操作彈性，進而提升電子裝置的操作舒適度。In summary, the electronic device according to an embodiment of the present invention adjusts the relative position between the body and the outer casing member through a deformable structure connected between the body and the outer casing member to match the position of the user in operating the electronic device. The size or/and shape of the hand (for example, the hand), and the deformable structure is fixed by the thermally induced phase change member, which can increase the operational flexibility of the end user, thereby improving the operational comfort of the electronic device.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
10‧‧‧電子裝置10‧‧‧Electronic devices
100‧‧‧本體 100‧‧‧ body
100a‧‧‧第一側面 100a‧‧‧ first side
100b‧‧‧第二側面 100b‧‧‧ second side
100c‧‧‧第三側面 100c‧‧‧ third side
100t‧‧‧頂面 100t‧‧‧ top surface
200‧‧‧外殼件 200‧‧‧Sheet parts
201‧‧‧表面層 201‧‧‧ surface layer
202、202L、202S‧‧‧第二熱致相變件 202, 202L, 202S‧‧‧ second thermally induced phase change parts
203‧‧‧第二熱源 203‧‧‧second heat source
203A、203A-P1、203A-P2‧‧‧相變化放熱層 203A, 203A-P1, 203A-P2‧‧‧ phase change heat release layer
204‧‧‧殼體 204‧‧‧Shell
204a‧‧‧開孔 204a‧‧‧Opening
204b‧‧‧側面 204b‧‧‧ side
205‧‧‧密封件 205‧‧‧Seal
210、210A‧‧‧第一外殼件 210, 210A‧‧‧ first housing parts
220‧‧‧第二外殼件 220‧‧‧Second outer casing parts
230‧‧‧第三外殼件 230‧‧‧ Third outer casing
240‧‧‧第四外殼件 240‧‧‧Four outer casing parts
250‧‧‧第五外殼件 250‧‧‧5th outer casing
310 ~ 350、310A ~ 310C‧‧‧可變形結構 310 ~ 350, 310A ~ 310C‧‧‧ deformable structure
301、301A ~ 301C、302A‧‧‧套管 301, 301A ~ 301C, 302A‧‧‧ casing
301a、301b‧‧‧開孔 301a, 301b‧‧‧ openings
302‧‧‧彈簧 302‧‧‧ Spring
302a‧‧‧端部 302a‧‧‧End
302B、303B、303C‧‧‧連桿 302B, 303B, 303C‧‧‧ linkage
302C‧‧‧連桿組 302C‧‧‧ linkage group
303、303A‧‧‧活塞連桿組 303, 303A‧‧‧Piston connecting rod set
303a‧‧‧活塞部 303a‧‧‧Piston Department
400、400S、400L‧‧‧第一熱致相變件 400, 400S, 400L‧‧‧ first thermally induced phase change parts
500‧‧‧第一熱源 500‧‧‧First heat source
D1‧‧‧第一方向 D1‧‧‧ first direction
D2‧‧‧第二方向 D2‧‧‧ second direction
D3‧‧‧第三方向 D3‧‧‧ third direction
DA1、DA2‧‧‧管徑 DA1, DA2‧‧‧ pipe diameter
F1、F2‧‧‧外力 F1, F2‧‧‧ external force
P1、P2‧‧‧位置 P1, P2‧‧‧ position
T1‧‧‧第一溫度 T1‧‧‧ first temperature
T2‧‧‧第二溫度 T2‧‧‧second temperature
A-A’、B-B’‧‧‧剖線 A-A’, B-B’‧‧‧ cut line
圖1為本發明之第一實施例的電子裝置的示意圖。 圖2為本發明之第一實施例的電子裝置的分解示意圖。 圖3為本發明之第一實施例的電子裝置的本體、可變形結構及第一熱致相變件的示意圖。 圖4為本發明之第一實施例的可變形結構的剖面示意圖。 圖5為本發明之第二實施例的可變形結構的剖面示意圖。 圖6為本發明之第三實施例的可變形結構的剖面示意圖。 圖7為本發明之第四實施例的可變形結構的剖面示意圖。 圖8A至圖8D為本發明之第一實施例的電子裝置於匹配使用者在操作電子裝置的部位的流程剖面示意圖。 圖9A為本發明之第一實施例的第一外殼件的剖面示意圖。 圖9B至圖9D為本發明之第一實施例的第一外殼件於匹配使用者在操作電子裝置的部位的流程剖面示意圖。 圖10為本發明之第五實施例的第一外殼件的剖面示意圖。1 is a schematic view of an electronic device according to a first embodiment of the present invention. 2 is an exploded perspective view of an electronic device according to a first embodiment of the present invention. 3 is a schematic diagram of a body, a deformable structure, and a first thermally induced phase change member of an electronic device according to a first embodiment of the present invention. Figure 4 is a cross-sectional view showing a deformable structure of a first embodiment of the present invention. Figure 5 is a cross-sectional view showing a deformable structure of a second embodiment of the present invention. Figure 6 is a cross-sectional view showing a deformable structure of a third embodiment of the present invention. Figure 7 is a cross-sectional view showing a deformable structure of a fourth embodiment of the present invention. 8A to 8D are schematic cross-sectional views showing the flow of an electronic device according to a first embodiment of the present invention in a position where a user is operated to operate the electronic device. Figure 9A is a cross-sectional view showing the first outer casing member of the first embodiment of the present invention. 9B to FIG. 9D are schematic cross-sectional views showing the flow of the first outer casing member in the position where the user is operating the electronic device according to the first embodiment of the present invention. Figure 10 is a cross-sectional view showing the first outer casing member of the fifth embodiment of the present invention.
Claims (10)
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| TW107130456A TWI668602B (en) | 2018-08-31 | 2018-08-31 | Electronic device |
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| CN112612367A (en) * | 2021-01-05 | 2021-04-06 | 丁丹 | Mistaken touch preventing mouse convenient to clean |
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| US7575807B1 (en) * | 2004-05-28 | 2009-08-18 | Hrl Laboratories, Llc | Hybrid active deformable material structure |
| EP2315186A2 (en) * | 2009-10-26 | 2011-04-27 | Lg Electronics Inc. | Mobile terminal with flexible body for inputting a signal upon bending said body |
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