TWI668397B - Condensing system - Google Patents
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- TWI668397B TWI668397B TW107141943A TW107141943A TWI668397B TW I668397 B TWI668397 B TW I668397B TW 107141943 A TW107141943 A TW 107141943A TW 107141943 A TW107141943 A TW 107141943A TW I668397 B TWI668397 B TW I668397B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D5/00—Condensation of vapours; Recovering volatile solvents by condensation
- B01D5/0003—Condensation of vapours; Recovering volatile solvents by condensation by using heat-exchange surfaces for indirect contact between gases or vapours and the cooling medium
- B01D5/0012—Vertical tubes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28B—STEAM OR VAPOUR CONDENSERS
- F28B1/00—Condensers in which the steam or vapour is separate from the cooling medium by walls, e.g. surface condenser
- F28B1/06—Condensers in which the steam or vapour is separate from the cooling medium by walls, e.g. surface condenser using air or other gas as the cooling medium
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D5/00—Condensation of vapours; Recovering volatile solvents by condensation
- B01D5/0033—Other features
- B01D5/0051—Regulation processes; Control systems, e.g. valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28B—STEAM OR VAPOUR CONDENSERS
- F28B11/00—Controlling arrangements with features specially adapted for condensers
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Abstract
一種冷凝系統，用以產生冷凝層於待測物的表面上。冷凝系統包含氣流產生裝置以及流道裝置。氣流產生裝置用以產生冷凝氣流。冷凝氣流具有露點溫度，露點溫度高於待測物的表面的溫度。流道裝置連通氣流產生裝置，冷凝氣流由氣流產生裝置流入流道裝置中。流道裝置包含均流模組。均流模組靠近氣流產生裝置，並配置以接收冷凝氣流，均流模組包含至少一個均流板，每一均流板具有至少一第一孔洞。 A condensation system is used to generate a condensation layer on the surface of the object to be measured. The condensing system includes an air flow generating device and a flow channel device. The airflow generating device is used to generate condensed airflow. The condensed airflow has a dew point temperature, which is higher than the surface temperature of the object to be measured. The flow path device communicates with the air flow generation device, and the condensed air flow flows into the flow path device from the air flow generation device. The flow channel device includes a flow distribution module. The current sharing module is close to the airflow generating device and configured to receive the condensed airflow. The current sharing module includes at least one current sharing plate, and each of the current sharing plates has at least one first hole.
Description
本揭露有關於一種冷凝系統，尤其是一種用於在待側物表面形成冷凝層的冷凝系統。 The present disclosure relates to a condensing system, in particular to a condensing system for forming a condensing layer on the surface of the object to be sided.
為了在物體表面產生冷凝層，必須將物體置於低溫密閉腔體中進行降溫。接著，將降溫後的物體取出，放置於高濕度的氣體中。高濕度氣體的氣溫降低後，氣體中包含的蒸氣將會凝結於物體的表面上並形成凝結冷凝層。 In order to create a condensation layer on the surface of the object, the object must be placed in a low-temperature closed cavity for cooling. Next, remove the cooled object and place it in a high-humidity gas. After the temperature of the high-humidity gas is reduced, the vapor contained in the gas will condense on the surface of the object and form a condensed condensation layer.
上述做法的缺點在於，物體必須進出密閉腔體，難以進行自動化。且製造密閉腔體成本較高，腔體內的低溫環境亦須費時達成。因此如何能找出一種能簡單、迅速又低成本的方式在物體表面產生冷凝層，為本領域的重要問題之一。 The disadvantage of the above method is that objects must enter and exit the closed cavity, which is difficult to automate. In addition, the cost of manufacturing the closed cavity is relatively high, and the low temperature environment in the cavity must be achieved in a time-consuming manner. Therefore, how to find a simple, rapid and low-cost way to produce a condensation layer on the surface of an object is one of the important problems in the field.
根據本揭露一些實施方式，一種用以產生冷凝層於待測物的表面上的冷凝系統包含氣流產生裝置以及流道裝置。氣流產生裝置用以產生冷凝氣流。冷凝氣流具有露點溫度，露點溫度高於待測物的表面的溫度。流道裝置連通氣流產生裝置，冷凝氣流由氣流產生裝置流入流道裝置中。流道裝置 包含均流模組。均流模組靠近氣流產生裝置，並配置以接收冷凝氣流，均流模組包含至少一個均流板，每一均流板具有至少一第一孔洞。 According to some embodiments of the present disclosure, a condensing system for generating a condensing layer on a surface of a test object includes an airflow generating device and a flow channel device. The airflow generating device is used to generate condensed airflow. The condensed airflow has a dew point temperature, which is higher than the surface temperature of the object to be measured. The flow path device communicates with the air flow generation device, and the condensed air flow flows into the flow path device from the air flow generation device. Runner device Contains current sharing module. The current sharing module is close to the airflow generating device and configured to receive the condensed airflow. The current sharing module includes at least one current sharing plate, and each of the current sharing plates has at least one first hole.
根據本揭露一些實施方式，一種用以產生冷凝層於待測物的表面上的冷凝系統包含氣流產生裝置以及流道裝置。氣流產生裝置用以產生冷凝氣流。冷凝氣流具有露點溫度，露點溫度高於待測物的表面的溫度。流道裝置包含流道本體以及至少一個均流板。均流板平行設置於流道本體中，並配置以接收冷凝氣流。每一均流板具有至少一第一孔洞。 According to some embodiments of the present disclosure, a condensing system for generating a condensing layer on a surface of a test object includes an airflow generating device and a flow channel device. The airflow generating device is used to generate condensed airflow. The condensed airflow has a dew point temperature, which is higher than the surface temperature of the object to be measured. The flow channel device includes a flow channel body and at least one equalizing plate. The equalizing plates are arranged in parallel in the flow channel body and are configured to receive the condensed air flow. Each current sharing plate has at least one first hole.
在一些實施方式中，均流模組更包含阻隔件。阻隔件設置於均流板中之一者相對於氣流產生裝置之一側，且阻隔件在均流板中之該者上的投影部分地覆蓋住第一孔洞。 In some embodiments, the current sharing module further includes a barrier. The blocking member is disposed on one side of one of the equalizing plates relative to the airflow generating device, and the projection of the blocking member on the one of the equalizing plates partially covers the first hole.
在一些實施方式中，流道裝置更包含整流模組。整流模組位於均流模組相對於氣流產生裝置的一側，並配置以接收經過均流模組的冷凝氣流，整流模組包含整流板，整流板具有至少一第二孔洞，且整流板的厚度大於均流板之任一者的厚度。 In some embodiments, the flow channel device further includes a rectifier module. The rectifier module is located on the side of the current sharing module relative to the airflow generating device, and is configured to receive the condensed airflow passing through the current sharing module. The rectifier module includes a rectifier plate, the rectifier plate has at least one second hole, and the rectifier plate has The thickness is greater than the thickness of any of the current sharing plates.
在一些實施方式中，氣流產生裝置進一步包進氣口、加熱器、加濕器、溫濕度控制氣、出氣口以及風機。進氣口配置以供環境氣流進入。加熱器連通進氣口，並配置以升溫環境氣流，而產生第一氣流。加濕器連通加熱器，並配置以加濕第一氣流，而產生第二氣流。溫溼度控制器，連通加濕器，並配置以根據待測物的表面的溫度以控制第二氣流的溫度及濕度，而產生冷凝氣流。出氣口，連通於溫溼度控制器與流道 裝置之間。風機設置於進風口或出風口，並配置以強制傳送冷凝氣流。 In some embodiments, the airflow generating device further includes an air inlet, a heater, a humidifier, temperature and humidity control air, an air outlet, and a fan. The air inlet is configured for ambient air flow to enter. The heater communicates with the air inlet and is configured to raise the ambient airflow to produce the first airflow. The humidifier communicates with the heater and is configured to humidify the first airflow to generate the second airflow. The temperature and humidity controller is connected to the humidifier, and is configured to control the temperature and humidity of the second air flow according to the temperature of the surface of the object to be generated, thereby generating a condensed air flow. The air outlet is connected to the temperature and humidity controller and the flow channel Between devices. The fan is installed at the air inlet or air outlet, and is configured to force the delivery of condensed airflow.
在一些實施方式中，均流板的數量為複數個，且均流板越遠離氣流產生裝置者的第一孔洞的數量越多。 In some embodiments, the number of equalizing plates is plural, and the more the equalizing plates are away from the airflow generating device, the greater the number of first holes.
在一些實施方式中，均流板的數量為複數個，且均流板越遠離氣流產生裝置者的第一孔洞的孔徑越小。 In some embodiments, the number of equalizing plates is plural, and the farther the equalizing plates are from the first hole of the airflow generating device, the smaller the hole diameter.
在一些實施方式中，均流板的數量為複數個，且均流板越遠離氣流產生裝置者的第一孔洞的總面積越大。 In some embodiments, the number of equalizing plates is plural, and the greater the total area of the first holes of the equalizing plates away from the airflow generating device.
綜上所述，本揭露提出的冷凝系統可以控制冷凝氣流的諸多特性，來促使待測物的表面上形成品質良好的冷凝層。舉例而言，冷凝系統可以透過氣流產生裝置來控制冷凝氣流的溫度以及濕度(進一步決定冷凝氣流的露點溫度)，並可透過流道裝置來控制冷凝氣流的風速、風速均勻性以及方向性。 In summary, the condensing system proposed in this disclosure can control many characteristics of the condensing airflow to promote the formation of a good-quality condensing layer on the surface of the test object. For example, the condensing system can control the temperature and humidity of the condensing airflow through the airflow generating device (further determining the dew point temperature of the condensing airflow), and can control the wind speed, uniformity and directionality of the condensing airflow through the flow path device.
1-1、2-2、3-3‧‧‧線段 1-1, 2-2, 3-3 ‧‧‧ line
20‧‧‧環境氣流 20‧‧‧Ambient airflow
30‧‧‧第一氣流 30‧‧‧ First airflow
40‧‧‧第二氣流 40‧‧‧Second Airflow
50‧‧‧冷凝氣流 50‧‧‧Condensing airflow
60‧‧‧均勻冷凝氣流 60‧‧‧Uniform condensing airflow
60a、60b‧‧‧氣流 60a, 60b‧‧‧ Airflow
70‧‧‧定向冷凝氣流 70‧‧‧Directional condensing airflow
100、300、400‧‧‧冷凝系統 100, 300, 400 ‧‧‧ condensing system
110‧‧‧氣流產生裝置 110‧‧‧Airflow generator
110a‧‧‧進氣口 110a‧‧‧Air inlet
110b‧‧‧出氣口 110b‧‧‧ Outlet
111‧‧‧加熱器 111‧‧‧heater
112‧‧‧加濕器 112‧‧‧Humidifier
113‧‧‧溫濕控制器 113‧‧‧Temperature and humidity controller
114‧‧‧風機 114‧‧‧Fan
120‧‧‧流道裝置 120‧‧‧Flower device
121‧‧‧均流模組 121‧‧‧ Current sharing module
1211、1213、1214、1215‧‧‧均流板 1211, 1213, 1214, 1215
1212‧‧‧阻隔件 1212‧‧‧Ball
1211a、1213a、1214a、1215a、1221a‧‧‧孔洞 1211a, 1213a, 1214a, 1215a, 1221a ‧‧‧ hole
122‧‧‧整流模組 122‧‧‧Rectifier module
1221‧‧‧整流板 1221‧‧‧rectifier board
123‧‧‧流道本體 123‧‧‧Flower body
123a‧‧‧入口端 123a‧‧‧entry end
123b‧‧‧出口端 123b‧‧‧Exit
130‧‧‧風管 130‧‧‧Air duct
200‧‧‧待測物 200‧‧‧Object to be tested
210‧‧‧表面 210‧‧‧Surface
220‧‧‧冷凝層 220‧‧‧Condensation layer
Ri、Rf、R1、R2、R3、R4‧‧‧孔徑 Ri, Rf, R1, R2, R3, R4‧Aperture
t‧‧‧厚度 t‧‧‧thickness
第1A圖繪示依據本揭露一實施方式之冷凝系統的立體圖。 FIG. 1A is a perspective view of a condensation system according to an embodiment of the present disclosure.
第1B圖繪示第1A圖中沿著線段1-1的剖面圖。 FIG. 1B illustrates a cross-sectional view along line 1-1 in FIG. 1A.
第2A圖繪示本揭露另一實施方式之冷凝系統的立體圖。 FIG. 2A is a perspective view of a condensation system according to another embodiment of the disclosure.
第2B圖繪示第2A圖中沿著線段2-2的剖面圖。 FIG. 2B shows a cross-sectional view along line 2-2 in FIG. 2A.
第3A圖繪示本揭露另一實施方式之冷凝系統的立體圖。 FIG. 3A is a perspective view of a condensation system according to another embodiment of the disclosure.
第3B圖繪示第3A圖中沿著線段3-3的剖面圖。 FIG. 3B illustrates a cross-sectional view along line 3-3 in FIG. 3A.
以下將以圖式揭露本發明之複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本發明。也就是說，在本發明部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。並且，除非有其他表示，在不同圖式中相同之元件符號可視為相對應的元件。這些圖式之繪示是為了清楚表達這些實施方式中各元件之間的連接關係，並非繪示各元件的實際尺寸。 In the following, a plurality of embodiments of the present invention will be disclosed in the form of diagrams. For the sake of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in some embodiments of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventional structures and elements will be shown in a simple schematic manner in the drawings. Moreover, unless otherwise indicated, the same element symbol in different drawings may be regarded as a corresponding element. The drawing in these drawings is for clearly expressing the connection relationship between the elements in these embodiments, not the actual size of the elements.
請參照第1A圖，其繪示依據本揭露一實施方式之冷凝系統100的立體圖。如第1A圖所示，冷凝系統100係用以在待測物200的表面210上形成一層冷凝層220。冷凝系統100包含氣流產生裝置110以及流道裝置120。 Please refer to FIG. 1A, which is a perspective view of a condensation system 100 according to an embodiment of the present disclosure. As shown in FIG. 1A, the condensation system 100 is used to form a condensation layer 220 on the surface 210 of the object to be measured 200. The condensation system 100 includes an air flow generating device 110 and a flow channel device 120.
氣流產生裝置110用以產生冷凝氣流50，冷凝氣流50的露點溫度高於待測物200的表面210的溫度。流道裝置120連通氣流產生裝置110，使得冷凝氣流50由氣流產生裝置110流入流道裝置120中。 The airflow generating device 110 is used to generate a condensed airflow 50 whose dew point temperature is higher than the temperature of the surface 210 of the object to be measured 200. The flow path device 120 communicates with the air flow generation device 110 so that the condensed airflow 50 flows into the flow path device 120 from the air flow generation device 110.
流道裝置120包含均流模組121，且靠近氣流產生裝置110，並配置以接收冷凝氣流50。均流模組121包含均流板1211、阻隔件1212以及均流板1213，且均流板1211包含孔洞1211a，均流板1213包含孔洞1213a。於一實施例中，流道裝置120更包含整流模組122，其位於均流模組121相對於氣流產生裝置110的另一側，並配置以接收經過均流模組121的均 勻冷凝氣流60。整流模組122包含整流板1221，且整流板1221具有多個孔洞1221a。 The flow channel device 120 includes a flow equalization module 121 and is close to the airflow generating device 110 and configured to receive the condensed airflow 50. The current sharing module 121 includes a current sharing plate 1211, a blocking member 1212 and a current sharing plate 1213, and the current sharing plate 1211 includes holes 1211a, and the current sharing plate 1213 includes holes 1213a. In an embodiment, the flow channel device 120 further includes a rectifier module 122, which is located on the other side of the current distribution module 121 relative to the airflow generation device 110, and is configured to receive the average flow passing through the current distribution module 121. 均Condensed airflow 60. The rectifier module 122 includes a rectifier plate 1221, and the rectifier plate 1221 has a plurality of holes 1221a.
如第1A圖所示，氣流產生裝置110具有進氣口110a以及出氣口110b。進氣口110a配置以供環境氣流20進入氣流產生裝置110中。氣流產生裝置110係配置以改變環境氣流20的溫度以及濕度。也就是說，環境氣流20被氣流產生裝置110轉變為冷凝氣流50。最後，冷凝氣流50經由氣流產生裝置110的出氣口110b離開氣流產生裝置110。 As shown in FIG. 1A, the airflow generating device 110 has an air inlet 110a and an air outlet 110b. The air inlet 110a is configured for the ambient airflow 20 to enter the airflow generating device 110. The airflow generating device 110 is configured to change the temperature and humidity of the ambient airflow 20. That is, the ambient airflow 20 is converted into the condensed airflow 50 by the airflow generating device 110. Finally, the condensed airflow 50 leaves the airflow generation device 110 via the air outlet 110b of the airflow generation device 110.
如第1A圖所示，氣流產生裝置110內部還包含有風機114。在本實施方式中，風機114設置於靠近出氣口110b的一端。在其他實施方式中，風機114可設置於靠近進氣口110a的一端。風機114配置以提供氣壓差，迫使環境氣流20進入氣流產生裝置110中，並迫使冷凝氣流50從氣流產生裝置110傳送到流道裝置120。也就是說，風機114係配置以確保氣流產生裝置110能持續由外部環境吸入環境氣流20並傳送出冷凝氣流50。 As shown in FIG. 1A, the airflow generating device 110 further includes a fan 114. In this embodiment, the fan 114 is provided at the end close to the air outlet 110b. In other embodiments, the fan 114 may be disposed at an end near the air inlet 110a. The fan 114 is configured to provide a pressure difference, force the ambient airflow 20 into the airflow generating device 110, and force the condensed airflow 50 from the airflow generating device 110 to the flow channel device 120. In other words, the fan 114 is configured to ensure that the airflow generating device 110 can continue to draw in the ambient airflow 20 from the external environment and deliver the condensed airflow 50.
如第1A圖所示，氣流產生裝置110內部可以包含多種改變環境氣流20的溫度以及濕度的元件。舉例而言，在本實施方式中，氣流產生裝置110內部包含有加熱器111、加濕器112以及溫濕控制器113。 As shown in FIG. 1A, the airflow generating device 110 may include various elements that change the temperature and humidity of the ambient airflow 20. For example, in the present embodiment, the airflow generating device 110 includes a heater 111, a humidifier 112, and a temperature and humidity controller 113.
在本實施方式中，環境氣流20進入氣流產生裝置110內部後，會依序經過加熱器111、加濕器112以及溫濕控制器113。但在其他實施方式中，加熱器111、加濕器112以及溫濕控制器113的順序係可調換的，第1A圖僅舉例出其中一種實 施方式，本揭露並不應以此為限。 In this embodiment, after the ambient airflow 20 enters the interior of the airflow generating device 110, it will pass through the heater 111, the humidifier 112, and the temperature and humidity controller 113 in this order. However, in other embodiments, the order of the heater 111, the humidifier 112, and the temperature and humidity controller 113 can be exchanged, and FIG. 1A illustrates only one of them. This method should not be limited to this disclosure.
如第1A圖所示，加熱器111連通進氣口110a，並配置以升溫環境氣流20。環境氣流20經過加熱器111後轉變為第一氣流30。第一氣流30的溫度高於環境氣流20的溫度。 As shown in FIG. 1A, the heater 111 communicates with the air inlet 110a and is arranged to raise the ambient airflow 20. The ambient airflow 20 is transformed into the first airflow 30 after passing through the heater 111. The temperature of the first airflow 30 is higher than the temperature of the ambient airflow 20.
如第1A圖所示，加濕器112連通加熱器111，並配置以加濕第一氣流30。第一氣流30經過加濕器112後轉變為第二氣流40。第二氣流40的溼度高於第一氣流30的溼度。 As shown in FIG. 1A, the humidifier 112 communicates with the heater 111 and is configured to humidify the first airflow 30. After passing through the humidifier 112, the first airflow 30 is transformed into the second airflow 40. The humidity of the second airflow 40 is higher than the humidity of the first airflow 30.
如第1A圖所示，溫濕控制器113連通加濕器112，並配置以調整第二氣流40的溫度以及濕度。第二氣流40經過溫濕控制器113後轉變為冷凝氣流50。溫濕控制器113會決定冷凝氣流50最終的溫度以及濕度。在本實施方式中，溫濕控制器113可稍微降低第二氣流40的溫度以及濕度，使得冷凝氣流50的溫度以及濕度略為低於第二氣流40的溫度以及濕度。 As shown in FIG. 1A, the temperature and humidity controller 113 communicates with the humidifier 112 and is configured to adjust the temperature and humidity of the second airflow 40. After passing through the temperature and humidity controller 113, the second air flow 40 is transformed into a condensed air flow 50. The temperature and humidity controller 113 determines the final temperature and humidity of the condensed air flow 50. In this embodiment, the temperature and humidity controller 113 may slightly reduce the temperature and humidity of the second airflow 40 so that the temperature and humidity of the condensed airflow 50 are slightly lower than the temperature and humidity of the second airflow 40.
在一些實施方式中，可依據待測物200的表面210的溫度來決定冷凝氣流50的溫度以及濕度。舉例而言，為了在待測物200的表面210上形成冷凝層220，調整冷凝氣流50的溫度以及濕度而使得冷凝氣流50的露點溫度高於待測物200的表面210的溫度。當冷凝氣流50接觸待測物200的表面210時，則會被冷卻而產生冷凝層220。 In some embodiments, the temperature and humidity of the condensed airflow 50 may be determined according to the temperature of the surface 210 of the object to be tested 200. For example, in order to form the condensation layer 220 on the surface 210 of the object to be measured 200, the temperature and humidity of the condensed airflow 50 are adjusted so that the dew point temperature of the condensed airflow 50 is higher than the temperature of the surface 210 of the object to be measured 200. When the condensed airflow 50 contacts the surface 210 of the object under test 200, it is cooled and a condensed layer 220 is generated.
在一些實施方式中，藉由加熱器111、加濕器112以及溫濕控制器113的組合，能夠準確的控制由氣流產生裝置110所產生的冷凝氣流50的露點溫度。舉例而言，使用者可先決定目標溫度以及目標濕度，並使用加熱器111將環境氣流20 轉變為具有接近該目標溫度之第一氣流30，接著再使用加濕器112將第一氣流30轉變為具有接近該目標濕度之第二氣流40，最後再透過溫濕控制器113對第二氣流40進行微調，以便將第二氣流40轉變為具有目標溫度以及目標濕度的冷凝氣流50。 In some embodiments, the combination of the heater 111, the humidifier 112, and the temperature and humidity controller 113 can accurately control the dew point temperature of the condensed airflow 50 generated by the airflow generation device 110. For example, the user may first determine the target temperature and target humidity, and use the heater 111 to The first airflow 30 having a temperature close to the target temperature is converted, and then the first airflow 30 is converted into a second airflow 40 having a humidity close to the target humidity using the humidifier 112, and then the second airflow is passed through the temperature and humidity controller 113 40 is fine-tuned to convert the second air flow 40 into a condensed air flow 50 having a target temperature and target humidity.
具體而言，請參考以下表一，其列出一個實施方式中環境氣流20、第一氣流30、第二氣流40以及冷凝氣流50的溫度以及濕度的比對表。 Specifically, please refer to Table 1 below, which lists a comparison table of the temperature and humidity of the ambient airflow 20, the first airflow 30, the second airflow 40, and the condensed airflow 50 in one embodiment.
如表一所示，第一氣流30的溫度高於環境氣流20的溫度；第二氣流40的溼度高於第一氣流30的溼度；而冷凝氣流50的溫度以及濕度略為低於第二氣流40的溫度以及濕度。 As shown in Table 1, the temperature of the first airflow 30 is higher than the temperature of the ambient airflow 20; the humidity of the second airflow 40 is higher than that of the first airflow 30; and the temperature and humidity of the condensing airflow 50 are slightly lower than that of the second airflow 40 Temperature and humidity.
接下來請回到第1A圖，氣流產生裝置110產生之冷凝氣流50被傳輸至流道裝置120中。在本實施方式中，氣流產生裝置110與流道裝置120之間由風管130連通，使得冷凝氣流50離開氣流產生裝置110後經由風管130流入流道裝置120中。 Next, please return to FIG. 1A, the condensed airflow 50 generated by the airflow generating device 110 is transmitted to the flow channel device 120. In this embodiment, the airflow generating device 110 and the flow path device 120 are communicated by the air duct 130 so that the condensed airflow 50 leaves the airflow generating device 110 and flows into the flow path device 120 via the air duct 130.
如第1A圖所示，流道裝置120具有流道本體123，而流道本體123具有入口端123a以及出口端123b。入口端123a接收由自氣流產生裝置110所產生的冷凝氣流50。冷凝氣流50進入流道裝置120後依序經過其內的均流模組121以及整流模組122。均流模組121接收冷凝氣流50並將其轉換為均勻冷凝氣流60。整流模組122接收均勻冷凝氣流60，並將其轉換為定向冷凝氣流70。定向冷凝氣流70由出口端123b離開流道裝置120並噴射至待測物200的表面210。 As shown in FIG. 1A, the flow channel device 120 has a flow channel body 123, and the flow channel body 123 has an inlet end 123a and an outlet end 123b. The inlet end 123a receives the condensed airflow 50 generated by the self-airflow generating device 110. The condensed airflow 50 enters the flow channel device 120 and passes through the flow equalization module 121 and the rectification module 122 in sequence. The equalizing module 121 receives the condensing airflow 50 and converts it into a uniform condensing airflow 60. The rectifier module 122 receives the uniform condensing airflow 60 and converts it into a directional condensing airflow 70. The directional condensed gas flow 70 leaves the flow channel device 120 from the outlet end 123b and is sprayed onto the surface 210 of the object to be measured 200.
在此請一併參考第1B圖，其繪示第1A圖中沿著線段1-1的剖面圖。如第1A圖以及第1B圖所示，流道裝置120的入口端123a具有孔徑Ri，均流板1211的孔洞1211a具有孔徑R1，均流板1213的孔洞1213a具有孔徑R2，而整流板1221的孔洞1221a具有孔徑Rf。 Please refer to FIG. 1B, which shows a cross-sectional view along line 1-1 in FIG. 1A. As shown in FIGS. 1A and 1B, the inlet end 123a of the flow channel device 120 has an aperture Ri, the hole 1211a of the equalizing plate 1211 has an aperture R1, the hole 1213a of the equalizing plate 1213 has an aperture R2, and the The hole 1221a has an aperture Rf.
在本實施方式中，較靠近氣流產生裝置110的均流板1211的孔洞1211a的數量為一個，較遠離氣流產生裝置110的均流板1213的孔洞1213a的數量為五個。也就是說，越靠近整流模組122的均流板的孔洞的數量就越多。此外，較靠近氣流產生裝置110的均流板1211的孔洞1211a的孔徑R1大於較遠離氣流產生裝置110的均流板1213的孔洞1213a的孔徑R2。以上設置能夠使得冷凝氣流50經過均流模組121後轉換為均勻冷凝氣流60，原理將於下文中解釋。 In this embodiment, the number of holes 1211a closer to the current distribution plate 1211 of the airflow generating device 110 is one, and the number of holes 1213a farther from the current distribution plate 1213 of the airflow generating device 110 is five. In other words, the closer to the rectifier module 122, the greater the number of holes of the current sharing plate. In addition, the hole diameter R1 of the hole 1211 a closer to the flow distribution plate 1211 of the airflow generating device 110 is larger than the hole diameter R2 of the hole 1213 a farther from the flow distribution plate 1213 of the airflow generating device 110. The above arrangement can make the condensed airflow 50 pass through the equalization module 121 and be converted into a uniform condensed airflow 60. The principle will be explained below.
如第1A圖以及第1B圖所示，冷凝氣流50經過均流板1211後，流速以及氣流分布被改變，在此將其標示為氣流60a。氣流60a被孔徑R1拘束於較小的範圍內，因此速度較快， 但風速分布集中於中央處。 As shown in FIGS. 1A and 1B, after the condensed airflow 50 passes through the equalizing plate 1211, the flow velocity and the airflow distribution are changed, and here it is indicated as the airflow 60a. The airflow 60a is restricted to a smaller range by the aperture R1, so the speed is faster, But the wind speed distribution is concentrated in the center.
接著氣流60a抵達至阻隔件1212，並且流速以及氣流分布又進一步的被改變，在此將其標示為氣流60b。阻隔件1212在均流板1211上的投影覆蓋住孔洞1211a的部分範圍，因此氣流60a會碰撞至阻隔件1212並改變方向。也就是說，與氣流60a相比，氣流60b的流速變慢，風速的分布變廣。在本實施方式中，阻隔件1212為十字形，但本揭露並不以此為限。 Then the airflow 60a reaches the barrier 1212, and the flow velocity and the airflow distribution are further changed, here it is marked as the airflow 60b. The projection of the blocking member 1212 on the equalizing plate 1211 covers a part of the range of the hole 1211a, so the airflow 60a will collide with the blocking member 1212 and change direction. That is, the flow velocity of the airflow 60b becomes slower than that of the airflow 60a, and the distribution of the wind speed becomes wider. In this embodiment, the barrier 1212 is cross-shaped, but the disclosure is not limited thereto.
接著，氣流60b經過均流板1213，其流速以及氣流分布被改變而變成均勻冷凝氣流60。具體而言，由於孔洞1213a均勻的分布於均流板1213上，使均勻冷凝氣流60平均由均流板1213的每個孔洞1213a流出，並且每道均勻冷凝氣流60的速度亦接近一致。 Next, the airflow 60b passes through the equalizing plate 1213, and its flow velocity and airflow distribution are changed to become a uniformly condensed airflow 60. Specifically, since the holes 1213a are uniformly distributed on the equalizing plate 1213, the uniform condensing airflow 60 flows out from each hole 1213a of the equalizing plate 1213 on average, and the speed of each uniform condensing airflow 60 is also nearly uniform.
在本實施方式中，均流板1211上的孔洞1211a的面積小於均流板1213上的所有孔洞1213a的總面積。也就是說，比較遠離氣流產生裝置110的均流板1213的開放面積(總開口面積)較大，依據白努力定律可以得知，與通過均流板1211的氣流60a相比，通過均流板1213的均勻冷凝氣流60流速較緩慢且均勻。緩慢且均勻的氣流特性有助於冷凝系統100在待測物200上形成均勻平坦的冷凝層220。 In this embodiment, the area of the holes 1211a on the flow equalizing plate 1211 is smaller than the total area of all the holes 1213a on the flow equalizing plate 1213. In other words, the open area (total opening area) of the flow distribution plate 1213 farther away from the air flow generation device 110 is larger, and according to the white effort law, it can be known that the flow distribution plate 1213 passes through the flow distribution plate as compared with the air flow 60a passing through the flow distribution plate 1211. The flow rate of the uniform condensing airflow 60 of 1213 is relatively slow and uniform. The slow and uniform airflow characteristics help the condensation system 100 form a uniform and flat condensation layer 220 on the object to be measured 200.
如第1A圖以及第1B圖所示，在接觸至待測物200前，均勻冷凝氣流60還通過整流模組122，進一步改善均勻冷凝氣流60的方向性，使其成為定向冷凝氣流70。 As shown in FIGS. 1A and 1B, before contacting the object to be measured 200, the uniformly condensed airflow 60 also passes through the rectifier module 122 to further improve the directionality of the uniformly condensed airflow 60, making it a directional condensed airflow 70.
在本實施方式中，整流模組122的整流板1221的 厚度t大於均流板1211、阻隔件1212以及均流板1213各別的厚度。也就是說，可以將整流板1221中的孔洞1221a視為各別獨立的小管。均勻冷凝氣流60進入孔洞1221a後的行進方向受到限制，而使得離開孔洞1221a後變為方向一致的定向冷凝氣流70。 In this embodiment, the rectifier plate 1221 of the rectifier module 122 The thickness t is greater than the respective thicknesses of the flow equalizing plate 1211, the barrier 1212, and the flow equalizing plate 1213. In other words, the holes 1221a in the rectifying plate 1221 can be regarded as independent small tubes. The direction of travel of the uniform condensing airflow 60 after entering the hole 1221a is restricted, so that after leaving the hole 1221a, it becomes a directional condensing airflow 70 in the same direction.
在本實施方式中，均流板1211與阻隔件1212之間的間距、阻隔件1212與均流板1213之間的間距以及均流板1213與整流板1221之間的間距看似彼此相等，但實際上並不以此為限。也就是說，上述的間距可為彼此相異。 In this embodiment, the spacing between the current equalizing plate 1211 and the blocking member 1212, the spacing between the blocking member 1212 and the equalizing plate 1213, and the spacing between the current sharing plate 1213 and the rectifying plate 1221 appear to be equal to each other, but Actually, it is not limited to this. That is to say, the above-mentioned pitches may be different from each other.
應了解，第1A圖以及第1B圖中所繪示的流道裝置120僅為舉例，本領域人士可依據前述所呈現之設計原理來進行更動。舉例而言，本實施方式的流道裝置120中包含兩個均流板(1211、1213)，但在其他實施方式中可以包含三個、四個甚至更多的均流板。 It should be understood that the flow channel devices 120 shown in FIGS. 1A and 1B are merely examples, and those skilled in the art can make changes according to the design principles presented above. For example, the flow channel device 120 of this embodiment includes two flow distribution plates (1211, 1213), but in other embodiments, three, four, or more flow distribution plates may be included.
具體而言，請參考第2A圖以及第2B圖。第2A圖繪示本揭露另一實施方式之冷凝系統300的立體圖。第2B圖繪示第2A圖中沿著線段2-2的剖面圖。冷凝系統300與冷凝系統100的差異在於，冷凝系統300的流道裝置120包含有三個均流板1211、1213、1214。也就是說，冷凝系統300的流道裝置120更進一步包含了均流板1214，其具有十三個孔洞1214a。 Specifically, please refer to Figure 2A and Figure 2B. FIG. 2A is a perspective view of a condensation system 300 according to another embodiment of the present disclosure. FIG. 2B shows a cross-sectional view along line 2-2 in FIG. 2A. The difference between the condensation system 300 and the condensation system 100 is that the flow channel device 120 of the condensation system 300 includes three equalizing plates 1211, 1213, and 1214. That is to say, the flow channel device 120 of the condensation system 300 further includes a flow equalizing plate 1214, which has thirteen holes 1214a.
也就是說，相較於均流板1211以及均流板1213，均流板1214的孔洞1214a的數量較多、孔洞1214a的孔徑R3較小且所有孔洞1214a的總面積較大。藉由在流道裝置120中設置均流板1214，能夠更進一步的降低通過均流板1214的氣流 (可參考第1B圖)的流速並增加風速均勻度，以適於實務需求。 That is to say, compared with the current distribution plate 1211 and the current distribution plate 1213, the number of the holes 1214a of the current distribution plate 1214 is larger, the diameter R3 of the holes 1214a is smaller, and the total area of all the holes 1214a is larger. By distributing the flow distribution plate 1214 in the flow channel device 120, the airflow passing through the flow distribution plate 1214 can be further reduced (Refer to Figure 1B) The flow rate and increase the uniformity of wind speed to suit practical needs.
接下來請參考第3A圖以及第3B圖。第3A圖繪示本揭露另一實施方式之冷凝系統400的立體圖。第3B圖繪示第3A圖中沿著線段3-3的剖面圖。冷凝系統400與冷凝系統300的差異在於，冷凝系統400的流道裝置120包含有四個均流板1211、1213、1214、1215。也就是說，冷凝系統400的流道裝置120更進一步包含了均流板1215，其具有多個(舉例而言，169個)孔洞1215a。 Next, please refer to Figure 3A and Figure 3B. FIG. 3A is a perspective view of a condensation system 400 according to another embodiment of the present disclosure. FIG. 3B illustrates a cross-sectional view along line 3-3 in FIG. 3A. The difference between the condensation system 400 and the condensation system 300 is that the flow channel device 120 of the condensation system 400 includes four equalizing plates 1211, 1213, 1214, and 1215. That is to say, the flow channel device 120 of the condensation system 400 further includes a flow distribution plate 1215, which has a plurality of (for example, 169) holes 1215a.
也就是說，相較於均流板1211、均流板1213以及均流板1214，均流板1215的孔洞1215a的數量較多、孔洞1215a的孔徑R4較小且所有孔洞1215a的總面積較大。藉由在流道裝置120中設置均流板1215，能夠更進一步的降低通過均流板1215的氣流(可參考第1B圖)的流速並增加風速均勻度，以適於實務需求。 In other words, compared with the current distribution plate 1211, the current distribution plate 1213, and the current distribution plate 1214, the number of holes 1215a of the current distribution plate 1215 is greater, the diameter R4 of the holes 1215a is smaller, and the total area of all holes 1215a is larger . By distributing the flow distribution plate 1215 in the flow channel device 120, the flow velocity of the airflow (refer to FIG. 1B) passing through the flow distribution plate 1215 can be further reduced and the uniformity of the wind speed can be increased to suit practical requirements.
綜上所述，本揭露提出的冷凝系統可以控制冷凝氣流的諸多特性，來促使待測物的表面上形成品質良好的冷凝層。舉例而言，冷凝系統可以透過氣流產生裝置來控制冷凝氣流的溫度以及濕度(進一步決定冷凝氣流的露點溫度)，並可透過流道裝置來控制冷凝氣流的風速、風速均勻性以及方向性。 In summary, the condensing system proposed in this disclosure can control many characteristics of the condensing airflow to promote the formation of a good-quality condensing layer on the surface of the test object. For example, the condensing system can control the temperature and humidity of the condensing airflow through the airflow generating device (further determining the dew point temperature of the condensing airflow), and can control the wind speed, uniformity and directionality of the condensing airflow through the flow path device.
本揭露已由範例及上述實施方式描述，應了解本發明並不限於所揭露之實施方式。相反的，本發明涵蓋多種更動及近似之佈置(如，此領域中之通常技藝者所能明顯得知者)。因此，附加之請求項應依據最寬之解釋以涵蓋所有此類更動及近似佈置。 This disclosure has been described by examples and the above embodiments, and it should be understood that the present invention is not limited to the disclosed embodiments. On the contrary, the present invention covers a variety of altered and approximate arrangements (e.g., as would be apparent to those of ordinary skill in the art). Therefore, the additional request should be based on the widest interpretation to cover all such changes and approximate arrangements.
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- 2019-11-11 KR KR1020190143338A patent/KR102227940B1/en active IP Right Grant
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20200062029A (en) | 2020-06-03 |
| US11300491B2 (en) | 2022-04-12 |
| JP6855549B2 (en) | 2021-04-07 |
| KR102227940B1 (en) | 2021-03-17 |
| TW202020383A (en) | 2020-06-01 |
| JP2020082076A (en) | 2020-06-04 |
| US20200166445A1 (en) | 2020-05-28 |
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