TWI667948B - Circuit board drilling target and method of cutting and increasing production capacity - Google Patents

Abstract

本發明係為「電路板鑽靶及裁磨提升產能之方法」，該電路板於同一設備中，利用先後進行鑽靶、裁磨與第二次鑽靶，來達成提升產能之目的。過程中除了能將NG板排除，最後也能將電路板分成標準收板、漲收板或縮收板進行分類，完全符合製程所需。 The present invention is a "method for drilling a target and cutting the production capacity of the circuit board". The circuit board is used in the same equipment, and uses the drilling target, the cutting and the second drilling target successively to achieve the purpose of increasing the production capacity. In addition to the NG board can be eliminated in the process, the board can be divided into standard closing board, rising board or shrinking board for classification, which is completely in line with the process requirements.

Description

電路板鑽靶及裁磨提升產能之方法 Circuit board drilling target and method of cutting and increasing production capacity

本發明「電路板鑽靶及裁磨提升產能之方法」，涉及一種電路板之加工方法，特別是得以達到提升產能之技術領域者。 The invention relates to a method for processing a circuit board to drill a target and cutting a production capacity, and relates to a method for processing a circuit board, in particular to a technical field capable of achieving an increase in production capacity.

印刷電路板泛見於各種電子產品中，舉凡電腦、手機、電視、冷氣......，幾乎無所不在。電路板製造過程需要經過許多道繁瑣的加工程序，由於現今電子產品越來越輕薄短小，對於電路板的精密度與準確性標準也不斷提高。電路板在進行加工時，為了確知位置，都會利用設置多種靶位以便進行定位，傳統加工方式在進行靶位設置時需利用多種機台進行靶位之鑽孔，業者需不斷的搬移電路板到各機台，費時費工，徒增成本，產能也因此無法提升。 Printed circuit boards are widely found in a variety of electronic products, such as computers, mobile phones, televisions, air-conditioning ..., almost everywhere. The board manufacturing process requires a lot of cumbersome processing procedures. As today's electronic products are becoming lighter and thinner, the standards for precision and accuracy of circuit boards are also increasing. When the board is processed, in order to know the position, a variety of target positions are used for positioning. In the conventional processing method, a plurality of machines are required to perform drilling of the target position when the target position is set, and the operator needs to continuously move the circuit board to Each machine is time-consuming and labor-intensive, and the cost is increased. As a result, the production capacity cannot be improved.

發明人有鑑於習知缺失，遂特以研創成本案，期能藉本案之提出，俾改進現有缺失，期使電路板之產能得以有效提升，間接讓成本更降低，以提升競爭力。 In view of the lack of knowledge, the inventor has been able to use the case to improve the existing defects, so that the production capacity of the circuit board can be effectively improved, and the cost can be further reduced to enhance competitiveness.

有鑑於習知電路板為了鑽靶工序導致產能受 限之缺失，本發明「電路板鑽靶及裁磨提升產能之方法」，其主要目的在於：提供一種鑽靶及裁磨的新流程，其能有效提升產能，間接使成本降低。 In view of the fact that the conventional circuit board has a capacity to be drilled in order to drill the target process. In the absence of the limitation, the main purpose of the present invention is to provide a new process for drilling targets and cutting, which can effectively increase the production capacity and indirectly reduce the cost.

為達上述目的，本發明具體之內容為：該電路板鑽靶及裁磨提升產能之方法，主要係使電路板於同一設備中，利用先後進行鑽靶、裁磨與第二次鑽靶，來達成提升產能之目的。過程中除了能將NG板排除，最後也能將電路板分成標準收板、漲收板或縮收板進行分類，完全符合所需。 In order to achieve the above object, the specific content of the present invention is as follows: the method for drilling the target and cutting the production capacity of the circuit board is mainly to make the circuit board in the same equipment, and use the drilling target, the cutting and the second drilling target successively. To achieve the purpose of increasing production capacity. In addition to the NG board can be eliminated in the process, the board can be divided into standard closing board, rising board or shrinking board for classification, which is completely in line with the requirements.

較佳的，本案整體之方法流程依序包括：入板、鑽靶、送板、CCD定位、裁磨各緣邊、磨圓角、清洗、製作記號、刻字、測厚、轉向、收板、第二次鑽靶及輸送，最後依電路板狀態區分成標準收板、漲收板與縮收板。 Preferably, the overall method flow of the present case includes: entering the board, drilling the target, feeding the board, positioning the CCD, cutting the edges, grinding the rounded corners, cleaning, making marks, lettering, measuring thickness, turning, closing, The second drilling target and conveying, and finally divided into standard closing board, rising board and shrinking board according to the state of the circuit board.

較佳的，前述該收板流程，另可將不合格之NG板以NG收板流程送出。 Preferably, in the above-mentioned closing process, the unqualified NG board can be sent out in the NG closing process.

10‧‧‧入板 10‧‧‧ into the board

11‧‧‧鑽靶 11‧‧‧Drill target

12‧‧‧送板 12‧‧‧Send board

13‧‧‧CCD定位 13‧‧‧CCD positioning

14‧‧‧裁磨各緣邊 14‧‧‧Making the edges

15‧‧‧磨圓角 15‧‧‧ grinding rounded corners

16‧‧‧清洗 16‧‧‧ Cleaning

17‧‧‧製作記號 17‧‧‧ Making marks

18‧‧‧刻字 18‧‧‧ lettering

19‧‧‧測厚 19‧‧‧Measurement thickness

20‧‧‧轉向 20‧‧‧ Turn

21‧‧‧收板 21‧‧‧

210‧‧‧NG收板 210‧‧‧NG closing

22‧‧‧第二次鑽靶 22‧‧‧Second drill target

23‧‧‧輸送 23‧‧‧Transport

241‧‧‧標準收板 241‧‧‧ standard closing

242‧‧‧漲收板 242‧‧ ‧ increase board

243‧‧‧縮收板 243‧‧‧Retraction board

9‧‧‧電路板 9‧‧‧Circuit board

91‧‧‧第一靶孔 91‧‧‧First target hole

92‧‧‧記號 92‧‧‧ mark

93‧‧‧記號 93‧‧‧ mark

94‧‧‧第二靶孔 94‧‧‧second target hole

第一圖：係為本發明前半段之流程方塊圖。 The first figure is a block diagram of the first half of the invention.

第二圖：係為本發明後半段之流程方塊圖。 The second figure is a block diagram of the process in the latter half of the invention.

茲謹就本發明「電路板鑽靶及裁磨提升產能之方法」之結構組成，及其所產生之功效，配合圖式，舉一本案之較佳實施例詳細說明如下：請參閱第一圖與第二圖所示，本案電路板鑽靶 及裁磨提升產能之方法，其流程依序包括：入板10、鑽靶11、送板12、CCD定位13、裁磨各緣邊14、磨圓角15、清洗16、製作記號17、刻字18、測厚19、轉向20、收板21、第二次鑽靶22及輸送23，最後依電路板狀態區分成標準收板241、漲收板242與縮收板243三種類別。其中，該鑽靶11流程，係在電路板9上利用X-RAY鑽靶機鑽出三個第一靶孔91利用這三個第一靶孔91即能獲知電路板9為正、反面與位置；至於該CCD定位13，係以CCD進行電路板9的位置定位；而裁磨各緣邊14，係在就電路板9的四個緣邊，利用裁板磨邊機每次裁磨對應的其中兩邊，磨完後經轉向90度再磨另外兩邊；而該磨圓角15，係就電路板9的四個端角利用磨圓角機由尖角磨成圓角，以降低危險性；該清洗16程序，係就電路板9裁磨後之粉塵予以清洗；該製作記號17程序，係於電路板9之邊緣藉由記號機製作出內凹之記號92，提供後續辨識用；該刻字18程序，係在電路板9上利用刻字機設置記號93，以提供後續分類辨識之用；該測厚19流程，係利用雷射測厚機進行測量；經轉向20流程將電路板9轉向180度，進入該收板21程序，若為不合格之電路板9則送出至NG收板210堆疊；如為合格之電路板9再利用另一X-RAY鑽靶機進行第二次鑽靶22，此時鑽出四個第二靶孔94，而後向後端輸送23，並依據規則分類，包括有標準收板241、漲收板242與縮收板243。 The structure of the "Method for drilling a target and cutting the production capacity of the circuit board" of the present invention, and the effect thereof, together with the drawings, a preferred embodiment of the present invention is described in detail as follows: Please refer to the first figure. As shown in the second figure, the circuit board drill target in this case And the method of cutting and increasing the production capacity, the process includes: entering the board 10, drilling the target 11, feeding the board 12, CCD positioning 13, cutting the edge 14 of the edge, grinding the round 15, cleaning 16, making the mark 17, lettering 18. The thickness 19, the steering 20, the closing plate 21, the second drilling target 22 and the conveying 23 are finally classified into three categories: a standard closing plate 241, a rising plate 242 and a retracting plate 243 according to the state of the circuit board. The process of the drill target 11 is to drill three first target holes 91 on the circuit board 9 by using an X-RAY drill target machine. The three first target holes 91 can be used to know that the circuit board 9 is positive and negative. Position; as for the CCD positioning 13, the positioning of the circuit board 9 is performed by the CCD; and the rims 14 are cut, and the four edges of the circuit board 9 are cut by the trimming machine each time. On both sides, after grinding, the other two sides are rotated by 90 degrees; and the rounded corners 15 are rounded by sharp corners on the four end angles of the circuit board 9 to reduce the risk. The cleaning 16 program cleans the dust after the cutting of the circuit board 9; the manufacturing of the marking 17 is performed on the edge of the circuit board 9 by the marking mechanism to make a concave mark 92 for subsequent identification; The lettering 18 program is set on the circuit board 9 by using a cutting plotter 93 to provide subsequent classification identification; the thickness measurement 19 process is performed by a laser thickness gauge; the circuit board 9 is turned by the steering 20 process 180 degrees, enter the process of closing the board 21, if it is a failed circuit board 9, it is sent to the NG board 210 stack; For the qualified circuit board 9, another X-RAY drill target machine is used to perform the second drilling target 22, at which time four second target holes 94 are drilled, and then the rear end is transported 23, and classified according to rules, including standards. The plate 241, the rising plate 242 and the retracting plate 243 are closed.

經由前述流程，單一電路板9連續進料加工與選別後，本案可完成NG收板210、標準收板241、漲收板242與縮收板243四種分類，能方便後續製程。 Through the foregoing process, after continuous feeding processing and sorting of a single circuit board 9, the present invention can complete four classifications of the NG receiving board 210, the standard closing board 241, the rising board 242 and the shrinking board 243, which can facilitate subsequent processes.

綜上所述，本發明「電路板鑽靶及裁磨提升產能之方法」，依現行專利法規定，未有不能取得專利之情事。本案在產業上確實得以利用，於申請前未曾見於刊物或公開使用，且非為公眾所知悉之技術。再者，本案有效解決先前技術中長期存在的問題並達成相關使用者與消費者長期的需求，得佐證本發明並非能輕易完成。本案完全符合專利法規定之「產業利用性」、「新穎性」與「進步性」等要件，爰依法提請專利，懇請 鈞局詳查，並儘早為准予專利之審定，以保護申請人之智慧財產權，俾勵創新。 In summary, the present invention "the method of drilling a target and cutting the production capacity of the circuit board" has not been patented according to the current patent law. The case was indeed exploited in the industry and was not seen in the publication or publicly used before the application, and is not a technology known to the public. Furthermore, the present invention effectively solves the long-standing problems in the prior art and achieves long-term needs of related users and consumers, and it is corroborated that the present invention is not easily accomplished. The case is in full compliance with the requirements of "industry useability", "novelty" and "progressiveness" as stipulated in the Patent Law. The patents are submitted in accordance with the law, and the Bureau is invited to conduct a detailed investigation and to approve the patent as soon as possible to protect the wisdom of the applicant. Property rights, encourage innovation.

本發明雖藉由前述實施例來描述，但仍可變化其形態與細節，於不脫離本發明之精神而達成，並由熟悉此項技藝之人士可了解。前述本案之較佳實施例，僅係藉本案原理可以具體實施的方式之一，但並不以此為限制，應依後附之申請專利範圍所界定為準。 The present invention has been described by way of example only, and it is to be understood by those skilled in the art. The preferred embodiment of the present invention is only one of the ways in which the present invention can be implemented in a specific manner, but is not limited thereto, and should be defined in the scope of the appended patent application.

Claims (1)

一種電路板鑽靶及裁磨提升產能之方法，係令電路板依序進行下述步驟：鑽靶步驟，利用一X-RAY鑽靶機就該電路板鑽出三個第一靶孔；CCD定位步驟，係以CCD進行該電路板的位置定位；裁磨步驟，利用一裁板磨邊機就該電路板各緣邊進行裁磨；磨圓角步驟，係就該電路板的四個端角利用磨圓角機由尖角磨成圓角；清洗步驟，係就該電路板進行清洗；製作記號步驟，係就電路板之邊緣藉由記號機製作出記號；刻字步驟，係在該電路板上利用刻字機設置記號；測厚步驟，係利用雷射測厚機進行測量；轉向步驟，將該電路板轉向；收板步驟，若為不合格之電路板則送出至NG收板堆疊；第二次鑽靶步驟，利用另一X-RAY鑽靶機就該電路板鑽出四個第二靶孔；輸送步驟，依據規則分類，包括有標準收板、漲收板與縮收板三種分類。 A circuit board drilling target and a method for cutting and increasing production capacity, the circuit board is sequentially subjected to the following steps: drilling a target step, using an X-RAY drilling target machine to drill three first target holes on the circuit board; CCD The positioning step is to position the circuit board by CCD; the cutting step uses a panel edging machine to cut the edges of the circuit board; the grinding rounding step is performed on the four ends of the circuit board. The corner is grounded by a sharp angle machine by a sharp angle; the cleaning step is to clean the circuit board; the marking step is made by marking the edge of the circuit board; the lettering step is in the circuit The board uses a cutting plotter to set the mark; the thickness measuring step is performed by using a laser thickness measuring machine; the turning step is to turn the circuit board; the receiving step is sent to the NG collecting board stack if it is a defective circuit board; The second drilling target step, using the other X-RAY drilling target machine to drill four second target holes on the circuit board; the conveying step is classified according to rules, including standard closing, increasing and reducing plates classification.