TWI664510B - Force sensing device and force array sensing module and force sensing element thereof - Google Patents
Force sensing device and force array sensing module and force sensing element thereof Download PDFInfo
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Abstract
一種力感應裝置，包括一力陣列感應模組、一基板、至少一凸起部以及一保護層。力陣列感應模組具有至少一力感應元件。基板用以抵靠力陣列感應模組。至少一凸起部與至少一力感應元件的位置相對應。保護層至少覆蓋力陣列感應模組及基板之周圍。 A force sensing device includes a force array sensing module, a substrate, at least one raised portion, and a protective layer. The force array sensing module has at least one force sensing element. The substrate is used to abut the force array sensing module. The at least one raised portion corresponds to a position of the at least one force sensing element. The protective layer covers at least the periphery of the force array sensing module and the substrate.
Description
本發明是有關於一種感應元件，且特別是有關於一種力感應裝置、力陣列感應模組及其力感應元件。 The invention relates to a sensing element, and in particular to a force sensing device, a force array sensing module, and a force sensing element thereof.
力感應元件主要是偵測使元件產生應變的外力。力陣列感應技術可用於辨識元件受壓時的壓力分佈、幾何梯度等變化。此外，在機械手臂加工系統中，透過機械手臂與人的協同運作，可提升複雜度高或需要高度彈性之製程的工作效率，但也提高操作人員的危險性。因此，如何規範機械手臂的運動範圍，並設計可供人員與機械手臂互動的操作模式，以避免高速運動的機械手臂對操作人員可能造成的傷害，實為重要。 The force-sensing element mainly detects the external force that causes the element to generate strain. Force array sensing technology can be used to identify changes in pressure distribution, geometric gradients, etc. when a component is under pressure. In addition, in the robotic arm processing system, through the coordinated operation of the robotic arm and humans, the work efficiency of processes with high complexity or high flexibility can be improved, but also the danger of the operator. Therefore, how to regulate the movement range of the robot arm and design an operation mode that can be used for interaction between the robot and the robot arm to avoid possible injuries to the operator caused by the robot arm moving at high speed.
本發明係有關於一種力感應裝置、力陣列感應模組及其力感應元件，用以偵測施加於力感應元件的外力或壓力分布，並可透過設置於機械手臂上或機械手臂周圍的力感應裝置來偵測是否發生一觸碰訊號或做為人機操作介面，並且力感應裝置 可於觸碰發生時藉由發出一力感應訊號至機械手臂，以控制機械手臂停止或啟動機械手臂。 The invention relates to a force sensing device, a force array sensing module and a force sensing element for detecting an external force or pressure distribution applied to the force sensing element, and can pass through a force provided on or around the robot arm. Sensing device to detect if a touch signal occurs or as a man-machine interface, and force sensing device When the touch occurs, it can send a force sensing signal to the robot arm to control the robot arm to stop or start the robot arm.
根據本發明之一方面，提出一種力感應裝置，包括一力陣列感應模組、一基板、至少一凸起部以及一保護層。力陣列感應模組具有至少一力感應元件。基板用以抵靠力陣列感應模組。至少一凸起部與至少一力感應元件的位置相對應。保護層至少覆蓋力陣列感應模組及基板之周圍，其中至少一凸起部設置於基板及保護層中之至少一者上。 According to an aspect of the present invention, a force sensing device is provided, which includes a force array sensing module, a substrate, at least one raised portion, and a protective layer. The force array sensing module has at least one force sensing element. The substrate is used to abut the force array sensing module. The at least one raised portion corresponds to a position of the at least one force sensing element. The protective layer covers at least the periphery of the force array sensing module and the substrate, and at least one raised portion is disposed on at least one of the substrate and the protective layer.
根據本發明之一方面，提出一種力感應元件，包括二膜層、二電極層、至少一感應層以及至少一間隙層。此二膜層具有相對的一第一內表面與一第二內表面。二電極層分別設置於第一內表面與第二內表面上，且此二電極層之間相隔一間隙。至少一感應層設置於二電極層之至少一者上。至少一間隙層設置於二膜層之間，以使二電極層之間保持間隙。 According to an aspect of the present invention, a force sensing element is provided, which includes a two-film layer, a two-electrode layer, at least one sensing layer, and at least one gap layer. The two film layers have a first inner surface and a second inner surface opposite to each other. The two electrode layers are respectively disposed on the first inner surface and the second inner surface, and a gap is separated between the two electrode layers. At least one sensing layer is disposed on at least one of the two electrode layers. At least one gap layer is disposed between the two film layers to maintain a gap between the two electrode layers.
根據本發明之一方面，提出一種力陣列感應模組，包括多個力感應元件，其中此些力感應元件共用該二薄膜，並以陣列形式排列；以及一封膠層，設置於二膜層之間，用以密封此些力感應元件。 According to an aspect of the present invention, a force-array sensing module is provided, including a plurality of force-sensing elements, wherein the force-sensing elements share the two films and are arranged in an array; and an adhesive layer is disposed on the two-film layer. To seal these force-sensing elements.
為了對本發明之上述及其他方面有更佳的瞭解，下文特舉實施例，並配合所附圖式詳細說明如下： In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are described in detail below in conjunction with the accompanying drawings:
100‧‧‧力感應裝置 100‧‧‧ Force sensing device
101‧‧‧機械手臂 101‧‧‧ robot arm
102‧‧‧端部 102‧‧‧ tip
104‧‧‧活動式支架 104‧‧‧ movable bracket
106‧‧‧工具 106‧‧‧Tools
110‧‧‧力陣列感應模組 110‧‧‧ Force Array Sensor Module
111‧‧‧訊號出線端 111‧‧‧Signal Outlet
112‧‧‧基板 112‧‧‧ substrate
113、117‧‧‧凸起部 113, 117‧‧‧ raised
114‧‧‧保護層 114‧‧‧ protective layer
115‧‧‧凹槽 115‧‧‧ groove
116‧‧‧開口 116‧‧‧ opening
120‧‧‧力感應元件 120‧‧‧ Force sensing element
121、122‧‧‧膜層 121, 122‧‧‧ film
1211‧‧‧第一內表面 1211‧‧‧First inner surface
1221‧‧‧第二內表面 1221‧‧‧Second inner surface
123、124‧‧‧電極層 123, 124‧‧‧ electrode layer
125‧‧‧感應層 125‧‧‧ induction layer
1251、1252‧‧‧壓敏材料 1251, 1252‧‧‧‧ pressure-sensitive materials
1253‧‧‧導電物質 1253‧‧‧Conductive substance
126‧‧‧間隙層 126‧‧‧ Interstitial layer
1261、1262‧‧‧間隙材料 1261, 1262‧‧‧Gap material
130‧‧‧封膠層 130‧‧‧sealing layer
142‧‧‧法蘭片接頭 142‧‧‧ flange connector
143‧‧‧電路控制單元 143‧‧‧Circuit control unit
G‧‧‧間隙 G‧‧‧ Clearance
H‧‧‧高度 H‧‧‧ height
S1、S2‧‧‧側面 S1, S2‧‧‧ side
S3‧‧‧底面 S3‧‧‧ Underside
T1、T2‧‧‧開槽 T1, T2‧‧‧Slotted
第1A圖繪示依照本發明一實施例之力感應裝置的示意圖。 FIG. 1A is a schematic diagram of a force sensing device according to an embodiment of the present invention.
第1B圖繪示第1A圖之力感應裝置沿著A-A線的剖面示意圖。 FIG. 1B is a schematic cross-sectional view of the force sensing device of FIG. 1A along the A-A line.
第1C圖分別繪示依照本發明一實施例之力感應元件的示意圖。 FIG. 1C is a schematic diagram of a force sensing element according to an embodiment of the present invention.
第2圖分別繪示依照本發明一實施例之力陣列感應模組的示意圖。 FIG. 2 is a schematic diagram of a force array sensing module according to an embodiment of the present invention.
第3圖分別繪示依照本發明一實施例之力陣列感應模組的示意圖。 FIG. 3 is a schematic diagram of a force array sensing module according to an embodiment of the present invention.
第4A圖繪示依照本發明一實施例之力感應裝置的示意圖。 FIG. 4A is a schematic diagram of a force sensing device according to an embodiment of the present invention.
第4B圖繪示依照本發明另一實施例之力感應裝置的示意圖。 FIG. 4B is a schematic diagram of a force sensing device according to another embodiment of the present invention.
第5圖繪示依照本發明一實施例之力感應裝置裝設在機械手臂上的示意圖第6圖繪示依照本發明一實施例之力感應裝置組裝於機械手臂周圍的示意圖。 FIG. 5 is a schematic diagram of a force sensing device installed on a robot arm according to an embodiment of the present invention. FIG. 6 is a schematic diagram of a force sensing device assembled around a robot arm according to an embodiment of the present invention.
第7圖繪示依照本發明一實施例之力陣列感應模組組裝於具有凹槽之基板上的示意圖。 FIG. 7 is a schematic diagram of assembling a force array sensing module on a substrate having a groove according to an embodiment of the present invention.
以下係提出實施例進行詳細說明，實施例僅用以作為範例說明，並非用以限縮本發明欲保護之範圍。以下是以相同/類似的符號表示相同/類似的元件做說明。 The following is a detailed description of an embodiment. The embodiments are only used as examples and are not intended to limit the scope of the present invention. The following uses the same / similar symbols to indicate the same / similar components for explanation.
請參照第1A及1B圖，依照本發明一實施例之力感應裝置100包括一力陣列感應模組110、一基板112、至少一凸起 部113以及一保護層114。基板112用以抵靠壓力陣列感測模組110。力陣列感應模組110具有至少一力感測元件120。至少一凸起部113設置於基板112上，用以抵靠於至少一力感測元件120的下方。本實施例僅示例性地繪示四個凸起部113以及七個力感測元件120，其中，凸起部113與力感測元件120的數量可相同或不相同，且凸起部113的位置與力感測元件120的位置可上下對應或上下交錯排列，例如，每一個凸起部113對應位於力感測元件120的正下方，或者，每一個凸起部113對應位於至少兩個力感測元件120的正下方，或者，每一個凸起部113對應位於兩相鄰的力感測元件120之間的下方，本發明對此不加以限制。 1A and 1B, a force sensing device 100 according to an embodiment of the present invention includes a force array sensing module 110, a substrate 112, and at least one protrusion. 部 113 and a protective layer 114. The substrate 112 is used to abut the pressure array sensing module 110. The force array sensing module 110 has at least one force sensing element 120. The at least one protruding portion 113 is disposed on the substrate 112 and is configured to abut against the underside of the at least one force sensing element 120. This embodiment only exemplarily shows four raised portions 113 and seven force sensing elements 120. The number of the raised portions 113 and the force sensing elements 120 may be the same or different, and the The position and the position of the force-sensing element 120 may correspond up and down or staggered. For example, each convex portion 113 is located directly below the force-sensing element 120, or each convex portion 113 is located at least two forces. The sensing element 120 is directly below, or each convex portion 113 is correspondingly positioned below between two adjacent force sensing elements 120, which is not limited in the present invention.
當使用者按壓的位置正對凸起部113的位置時，位於凸起部113上方的力感測元件120相對於周圍的力感測元件120承受較大的下壓力，因而可增加按壓的靈敏度。或者，使用者按壓的位置位於兩相鄰的凸起部113之間時，位於凸起部113之間的力感測元件120相對於周圍的力感測元件120具有較大的變形量，同樣可增加按壓的靈敏度。當然，使用者可同時按壓位於多個凸起部113上方的多個力感測元件120，以使多個力感測元件120同時導通。同時，力感應裝置100還可將按壓訊號傳送到外部的處理單元(圖未繪示)，以供辨識力感應裝置100受壓時的力分佈或梯度等，進而分析受力面積或形狀。 When the position pressed by the user is opposite to the position of the protruding portion 113, the force sensing element 120 located above the protruding portion 113 undergoes a large downforce relative to the surrounding force sensing elements 120, so the sensitivity of the pressing can be increased . Alternatively, when the position pressed by the user is between two adjacent protruding portions 113, the force sensing element 120 located between the protruding portions 113 has a larger amount of deformation relative to the surrounding force sensing elements 120. Can increase the sensitivity of compression. Certainly, the user can simultaneously press the plurality of force sensing elements 120 located above the plurality of protruding portions 113 to make the plurality of force sensing elements 120 simultaneously conductive. At the same time, the force-sensing device 100 can also transmit the pressing signal to an external processing unit (not shown) for identifying the force distribution or gradient of the force-sensing device 100 when it is compressed, and then analyze the force area or shape.
此外，保護層114之材質例如為矽膠或橡膠之類的防水材料，以熱塑成型的方式加熱至軟化並以氣壓差或抽真空的 方式包覆在力感應裝置100之周圍。在一實施例中，保護層114例如至少覆蓋力陣列感應模組110上方、基板112的至少二側面S1、S2與基板112的一底面S3，保護層114可避免水氣或濕氣進入力陣列感應模組110內，以避免影響力感測元件120的電性特性。 In addition, the material of the protective layer 114 is, for example, a waterproof material such as silicone or rubber, which is heated to be softened by a thermoplastic molding method and is formed by a pressure difference or a vacuum. The method is wrapped around the force sensing device 100. In one embodiment, the protective layer 114 covers at least the force array sensing module 110, at least two sides S1, S2 of the substrate 112, and a bottom surface S3 of the substrate 112. The protective layer 114 can prevent water or moisture from entering the force array. Inside the sensing module 110 to avoid affecting the electrical characteristics of the force sensing element 120.
請參照第1C圖，依照本發明一實施例之力感應元件120包括二膜層121、122、二電極層123、124、至少一感應層125以及至少一間隙層126。此二膜層121、122具有相對的一第一內表面1211與一第二內表面1221。二電極層123、124分別設置於第一內表面1211與第二內表面1221上，且此二電極層123、124之間相隔一間隙。至少一感應層125設置於二電極層123、124之至少一者上。至少一間隙層126設置於二膜層121、122之間，以使二電極層123、124之間保持預定間隙，例如保持間隙G在10微米~100微米之間，例如30微米左右或更低。 Referring to FIG. 1C, the force sensing element 120 according to an embodiment of the present invention includes two film layers 121, 122, two electrode layers 123, 124, at least one sensing layer 125, and at least one gap layer 126. The two film layers 121 and 122 have a first inner surface 1211 and a second inner surface 1221 opposite to each other. The two electrode layers 123 and 124 are respectively disposed on the first inner surface 1211 and the second inner surface 1221, and a gap is formed between the two electrode layers 123 and 124. At least one sensing layer 125 is disposed on at least one of the two electrode layers 123 and 124. At least one gap layer 126 is disposed between the two film layers 121 and 122 so that a predetermined gap is maintained between the two electrode layers 123 and 124, for example, the gap G is maintained between 10 μm and 100 μm, for example, about 30 μm or less .
在一實施例中，膜層可為軟性基板，電極層例如為銅之類的金屬或其他高導電材料，電極層可分別製作而形成於二膜層121、122的第一內表面1211與第二內表面1221上。感應層125例如以塗佈或印刷的方式形成於二電極層123、124上或其中一電極層上。在一實施例中，感應層125例如包括二壓敏材料(Pressure Sensitive Material)1251、1252，分別覆蓋於二電極層123、124上。壓敏材料於常態下藉由間隙層126保持適當的間隙G而不導電，一旦壓敏材料受到壓力時，二電極層123、124之間的距離變短，且位於壓敏材料1251、1252內的導電物質1253受壓而相互接觸，以形成一導電通路於二電極層123、124之間。 因此，壓敏材料1251、1252也因為內部形成導電通路而改變導電性。在一實施例中，當壓力不斷增加，壓敏材料1251、1252內的導電通路也會增加，而使得壓敏材料1251、1252的導電性更好。 In one embodiment, the film layer may be a flexible substrate. The electrode layer is, for example, a metal such as copper or other highly conductive materials. The electrode layer may be fabricated separately and formed on the first inner surfaces 1211 and the first film surface of the two film layers 121 and 122. Two inner surfaces 1221. The sensing layer 125 is formed on the two electrode layers 123 and 124 or on one of the electrode layers, for example, by coating or printing. In one embodiment, the sensing layer 125 includes, for example, two pressure sensitive materials 1251 and 1252, and covers the two electrode layers 123 and 124, respectively. Under normal conditions, the pressure-sensitive material maintains an appropriate gap G by the gap layer 126 and does not conduct electricity. Once the pressure-sensitive material is stressed, the distance between the two electrode layers 123 and 124 becomes shorter and lies within the pressure-sensitive material 1251 and 1252 The conductive materials 1253 are pressed to contact each other to form a conductive path between the two electrode layers 123 and 124. Therefore, the pressure-sensitive materials 1251 and 1252 also change the conductivity due to the formation of conductive paths inside. In an embodiment, when the pressure is continuously increased, the conductive paths in the pressure-sensitive materials 1251 and 1252 are also increased, so that the conductivity of the pressure-sensitive materials 1251 and 1252 is better.
在一實施例中，位於壓敏材料1251、1252內的導電物質1253例如為碳黑(carbon black)粉末或金屬粉末，可與高分子聚合物混合而均勻分布於壓敏材料1251、1252中。在一實施例中，壓敏材料1251、1252可藉由內部電阻值、感應電容值或感應電感值的改變而改變導電性，其材質例如選自壓阻材料、電容感應材料、電感材料或壓電材料等，本發明對此不加以限制。 In one embodiment, the conductive material 1253 located in the pressure-sensitive material 1251 and 1252 is, for example, a carbon black powder or a metal powder, which can be mixed with a high molecular polymer and uniformly distributed in the pressure-sensitive material 1251 and 1252. In an embodiment, the pressure-sensitive material 1251, 1252 can change the conductivity by changing the internal resistance value, the induced capacitance value, or the induced inductance value. The material is selected from piezoresistive materials, capacitive induction materials, inductive materials, or Electrical materials and the like are not limited in the present invention.
在一實施例中，設置於二膜層121、122之間的間隙層126可為單一層的間隙材料或由二層堆疊接合的二間隙材料1261、1262組合而成。在未組合之前，二間隙材料1261、1262分別設置於二壓敏材料1251、1252上，且分隔於二壓敏材料1251、1252之間，接著，上下的二膜層121、122經由二間隙材料1261、1262堆疊接合，並保持預定的間隙於二電極層123、124之間。同樣地，當力感應元件120只有單一層的間隙材料時，上下的二膜層121、122也能經由單一層的間隙材料接合，並保持預定的間隙於二電極層123、124之間。當上下的二膜層121、122組合之後，間隙材料1261、1262可將二電極層123、124及感應層126分隔於二膜層121、122之間。在一實施例中，間隙材料1261、1262可為感光型間隙材料，其高度及寬度可透過曝光、顯影及烘烤等步驟得到精確的控制。在一實施例中，間隙層126的高度(即間隙G)例如在10微米~100微米之間，例如30微米或更低。 In one embodiment, the gap layer 126 disposed between the two film layers 121 and 122 may be a single-layer gap material or a combination of two gap materials 1261 and 1262 that are stacked and joined by two layers. Before being combined, the two gap materials 1261 and 1262 are respectively disposed on the two pressure-sensitive materials 1251 and 1252 and separated between the two pressure-sensitive materials 1251 and 1252. Then, the upper and lower two film layers 121 and 122 pass through the two gap materials 1261 and 1262 are stacked and bonded, and a predetermined gap is maintained between the two electrode layers 123 and 124. Similarly, when the force sensing element 120 has only a single layer of gap material, the upper and lower two film layers 121 and 122 can also be joined through the single layer of gap material and maintain a predetermined gap between the two electrode layers 123 and 124. After the upper and lower two film layers 121 and 122 are combined, the gap materials 1261 and 1262 can separate the two electrode layers 123 and 124 and the sensing layer 126 between the two film layers 121 and 122. In one embodiment, the gap materials 1261 and 1262 may be photosensitive gap materials, and the height and width of the gap materials 1261 and 1262 can be accurately controlled through steps such as exposure, development, and baking. In one embodiment, the height of the gap layer 126 (ie, the gap G) is, for example, between 10 μm and 100 μm, such as 30 μm or less.
請參照第2圖，依照本發明一實施例之力陣列感應模組110包括至少一力感應元件120以及一封膠層130。本實施例僅示例性地繪示二個力感應元件120，其中力感應元件120共用二膜層121、122，並以一維陣列或二維陣列形式排列於二膜層121、122之間。此外，封膠層130設置於二膜層121、122之間，用以密封此些力感應元件120。封膠層130的高度H例如在50微米~300微米之間，例如100微米或更低。另外，力感應元件120透過間隙層126分隔，以確保各個力感應元件120的二電極層123、124之間的間隙保持一致，以使各個力感應元件120具有一致的電性特性。有關力感應元件120，請參照上述實施例之說明，在此不再贅述。封膠層130可避免水氣或濕氣進入力感應元件120內，以避免影響力感應元件120的電性特性。 Referring to FIG. 2, a force array sensing module 110 according to an embodiment of the present invention includes at least one force sensing element 120 and an adhesive layer 130. This embodiment only illustrates two force sensing elements 120 by way of example. The force sensing elements 120 share the two film layers 121 and 122 and are arranged between the two film layers 121 and 122 in a one-dimensional array or a two-dimensional array. In addition, the sealant layer 130 is disposed between the two film layers 121 and 122 to seal the force sensing elements 120. The height H of the sealant layer 130 is, for example, between 50 μm and 300 μm, for example, 100 μm or less. In addition, the force sensing elements 120 are separated by a gap layer 126 to ensure that the gaps between the two electrode layers 123 and 124 of each force sensing element 120 are consistent, so that each force sensing element 120 has consistent electrical characteristics. Regarding the force-sensing element 120, please refer to the description of the above embodiment, which is not repeated here. The sealant layer 130 can prevent moisture or moisture from entering the force sensing element 120 to avoid affecting the electrical characteristics of the force sensing element 120.
請參照第3圖，在一實施例中，力陣列感應模組110不限定應用於平面基板上，亦可應用於其他外型(例如圓弧形)的基板上。當力陣列感應模組110呈彎曲狀時，各個力感應元件120的二電極層123、124之間的間隙仍可透過間隙層126保持一致，可避免彎曲程度過大而影響力感應元件120的電性特性。 Referring to FIG. 3, in one embodiment, the force array sensing module 110 is not limited to being applied to a flat substrate, and may also be applied to other substrates (such as a circular arc). When the force-array sensing module 110 is curved, the gaps between the two electrode layers 123 and 124 of each force-sensing element 120 can still be kept consistent through the gap layer 126, which can avoid excessive bending to affect the electricity of the force-sensing element 120. Sexual properties.
請參照第1B圖，凸起部113例如與基板112一體成形而成為基板112的一部分，也就是說，透過移除基板112部分材料而形成凹口，而未移除的凸出部分即為凸起部113。接著，請參照第4A圖，在一實施例中，凸起部113例如為塗布或貼附在平面基板112上的一表面結構層，也就是說，凸起部113可與基板112結合而達到抵接於力陣列感應模組110與基板112之間的功效。 Please refer to FIG. 1B. For example, the protruding portion 113 is integrally formed with the substrate 112 and becomes a part of the substrate 112. That is, a recess is formed by removing a part of the material of the substrate 112, and the unremoved protruding portion is a protrusion.起 部 113。 From the 113. Next, referring to FIG. 4A, in an embodiment, the raised portion 113 is, for example, a surface structure layer coated or attached on the planar substrate 112, that is, the raised portion 113 can be combined with the substrate 112 to achieve The abutting effect is between the force array sensing module 110 and the substrate 112.
接著，在另一實施例中，除了設置凸起部113在力陣列感應模組110的下方之外，亦可設置凸起部117於力陣列感應模組110的上方。請參照第4B圖，凸起部117例如與保護層114一體成形而成為保護層114的一部分，或者，凸起部117為塗布或貼附在保護層114上的一表面結構層，其抵接於力陣列感應模組110的上方，功能與凸起部113相同。凸起部117可與凸起部113配合使用，可使力陣列感應模組110的上方與下方分別抵接凸起部117與凸起部113，然而，凸起部117與凸起部113亦可個別使用，本發明對此不加以限制。 Then, in another embodiment, in addition to providing the convex portion 113 below the force array sensing module 110, a convex portion 117 may also be disposed above the force array sensing module 110. Referring to FIG. 4B, the protruding portion 117 is integrally formed with the protective layer 114 to form a part of the protective layer 114, or the protruding portion 117 is a surface structural layer coated or adhered to the protective layer 114, which abuts Above the force array sensing module 110, the function is the same as the convex portion 113. The convex portion 117 can be used in cooperation with the convex portion 113, so that the upper and lower sides of the force array sensing module 110 can abut the convex portion 117 and the convex portion 113, respectively. However, the convex portion 117 and the convex portion 113 also It can be used individually, and the present invention is not limited thereto.
請參照第5圖，在一實施例中，基板112例如由兩片可相對結合的半圓形板材所組成，組合後的基板112具有一中空圓柱形，且具有至少一出線口，以做為連接至力陣列感應模組110之訊號線(圖未繪示)的出口。此外，上述實施例的二力陣列感應模組110可分別設置在半圓形板材上，並透過訊號線(圖未繪示)連接至一處理模組。在一實施例中，組合後的基板112可固設在機械手臂101上，並藉由設置於基板112上的力陣列感應模組110來偵測是否發生碰撞的情形，或以力陣列感應模組110做為人機操作介面，以供使用者對機械手臂101進行直覺式教導並記錄機械手臂101的移動軌跡。 Referring to FIG. 5, in an embodiment, the substrate 112 is composed of, for example, two semi-circular plates that can be combined with each other. The combined substrate 112 has a hollow cylindrical shape and at least one outlet. It is an outlet of a signal line (not shown) connected to the force array sensing module 110. In addition, the two-force array sensing module 110 of the above embodiment may be respectively disposed on a semi-circular plate and connected to a processing module through a signal line (not shown). In one embodiment, the combined substrate 112 may be fixed on the robot arm 101, and a force array sensing module 110 disposed on the substrate 112 may be used to detect whether a collision occurs, or a force array sensing module may be used. The group 110 serves as a man-machine operation interface for users to intuitively teach the robot arm 101 and record the movement track of the robot arm 101.
請參照第5圖，在一實施例中，機械手臂101的端部102例如設有一法蘭片接頭142、一電路控制單元143以及一力感應裝置100。力感應裝置100的中空圓柱形的基板112與電路控制單元143可藉由螺絲固定在法蘭片接頭142上，且電路控制單元143可套設在力感應裝置100的基板112的上部外圍，中空圓柱形 的基板112的下部外圍可設有力陣列感應模組110，以做為人機操作介面。力感應裝置100例如以環狀形式裝設於一機械手臂末端(即端部102)。此外，電路控制單元143設置於中空圓柱形的基板112的上部且可透過訊號線連接至力感應裝置100，用以接收力感應訊號，以偵測是否發生碰撞的情形，或切換至人機操作模式以接收操作人員輸入的指令。 Referring to FIG. 5, in an embodiment, the end portion 102 of the robot arm 101 is provided with, for example, a flange piece connector 142, a circuit control unit 143, and a force sensing device 100. The hollow cylindrical base plate 112 and the circuit control unit 143 of the force sensing device 100 can be fixed to the flange piece joint 142 by screws, and the circuit control unit 143 can be sleeved on the upper periphery of the base plate 112 of the force sensing device 100 and hollow. Cylindrical A force array sensing module 110 may be provided on the lower periphery of the base plate 112 as a man-machine operation interface. The force sensing device 100 is, for example, mounted on the end of a robot arm (ie, the end portion 102) in a ring shape. In addition, the circuit control unit 143 is disposed on the upper portion of the hollow cylindrical substrate 112 and can be connected to the force sensing device 100 through a signal line to receive the force sensing signal to detect whether a collision occurs or switch to human-machine operation. Mode to receive instructions from the operator.
請參照第6圖，在一實施例中，至少一力感應裝置100可組裝於機械手臂101周圍。有關力感應裝置100，請參照上述實施例之說明，在此不再贅述。本實施例僅示例性地繪示五個力感應裝置100。各個力感應裝置100例如藉由活動式支架104固定在機械手臂101的端部102上，並圍繞在機械手臂101的端部102的周圍。力感應裝置100可透過有線方式連接至一集線盤，再經由集線盤的傳輸線連接至外部的處理模組。當然，力感測裝置100亦可透過無線通訊方式與外部的處理模組進行訊號傳輸，本發明對此不加以限制。此外，機械手臂101的端部102上設有一工具106，例如是夾具、焊接工具、鑽孔工具或切割工具等，當機械手臂101活動時，可藉由力感應裝置100來偵測是否發生碰撞的情形。因此，可預防外力碰撞或避免高速運動的機械手臂101對操作人員可能造成的傷害。請參照第6圖，在一實施例中，力感應裝置100亦可裝設在一機械手臂表面，例如上、下活動臂表面及/或支撐座表面等任一表面。 Referring to FIG. 6, in one embodiment, at least one force sensing device 100 can be assembled around the robot arm 101. Regarding the force sensing device 100, please refer to the description of the above embodiment, which is not repeated here. This embodiment only illustrates five force sensing devices 100 by way of example. Each of the force sensing devices 100 is fixed to the end portion 102 of the robot arm 101 by a movable bracket 104, for example, and surrounds the end portion 102 of the robot arm 101. The force-sensing device 100 can be connected to a hub via a wired method, and then connected to an external processing module via a transmission line of the hub. Of course, the force sensing device 100 can also perform signal transmission with an external processing module through a wireless communication method, which is not limited in the present invention. In addition, a tool 106 is provided on the end 102 of the robot arm 101, such as a jig, a welding tool, a drilling tool, or a cutting tool. When the robot arm 101 moves, the force sensing device 100 can be used to detect whether a collision has occurred. Situation. Therefore, it is possible to prevent an external force from colliding or to avoid possible injuries to the operator caused by the robot arm 101 moving at high speed. Referring to FIG. 6, in an embodiment, the force sensing device 100 can also be installed on a surface of a robot arm, such as any surface of the upper and lower movable arm surfaces and / or the surface of a support base.
請參照第7圖，依照本發明一實施例之力陣列感應模組110例如具有一訊號出線端111，為了避免訊號出線端111彎折時產生的應變力影響力感應元件120的電性特性，訊號出線端 111之兩側例如具有二開槽T1、T2，此二開槽T1、T2可使訊號出線端111與力感應元件120所在的區域分隔，以減少力感應元件120的訊號受到應力干擾。此外，基板112包括一凹槽115，此凹槽115用以容納訊號出線端111，使訊號出線端111的高度低於力陣列感應模組110所承靠的基板112表面的高度。如此，彎折至凹槽115中的訊號出線端111不會影響力感應元件120的電性特性。 Referring to FIG. 7, the force array sensing module 110 according to an embodiment of the present invention has, for example, a signal output terminal 111. In order to avoid the strain generated when the signal output terminal 111 is bent, the electrical properties of the force sensing element 120 are affected. Characteristics, signal outlet For example, two sides of 111 have two slots T1 and T2. The two slots T1 and T2 can separate the signal output end 111 from the area where the force sensing element 120 is located, so as to reduce the stress of the signal of the force sensing element 120. In addition, the substrate 112 includes a groove 115 for receiving the signal output end 111 so that the height of the signal output end 111 is lower than the height of the surface of the substrate 112 on which the force array sensing module 110 bears. In this way, the signal output end 111 bent into the groove 115 does not affect the electrical characteristics of the force sensing element 120.
此外，在一實施例中，凹槽115底部具有一開口116(即出線口)，訊號出線端111可經由開口116通過基板112而連接至訊號線，或訊號線可經由開口116通過基板112而連接至訊號出線端111。 In addition, in an embodiment, the bottom of the groove 115 has an opening 116 (ie, a cable outlet). The signal outlet 111 can be connected to the signal line through the substrate 116 through the opening 116, or the signal line can pass through the substrate through the opening 116. 112 and connected to the signal outlet 111.
本發明上述實施例所揭露之力感應元件及應用其之力陣列感應模組及力感應裝置，用以偵測施加於力感應元件的外力或壓力分布，並可透過設置於機械手臂上或機械手臂周圍的力感應裝置來偵測是否發生一觸碰訊號或以力陣列感應模組做為人機操作介面，並且力感應裝置可於觸碰發生時藉由發出一力感應訊號至機械手臂，以控制機械手臂停止或啟動機械手臂。根據上述的說明，本發明可應用在觸覺感應相關的電子裝置上，包括機械手臂之人機操作介面、智能皮膚、電子皮膚、防碰撞預警系統以及觸覺感測陣列等領域，應用範圍廣且實用性佳。 The force sensing element disclosed in the above embodiments of the present invention, the force array sensing module and the force sensing device using the force sensing element are used to detect the external force or pressure distribution applied to the force sensing element, and can be provided on the robot arm or the machine through The force sensing device around the arm detects whether a touch signal occurs or a force array sensing module is used as the man-machine operation interface, and the force sensing device can send a force sensing signal to the robot arm when a touch occurs, To control the robotic arm to stop or start the robotic arm. According to the above description, the present invention can be applied to haptic sensing-related electronic devices, including human-machine operating interfaces of robotic arms, intelligent skins, electronic skins, anti-collision warning systems, and haptic sensing arrays. Good sex.
綜上所述，雖然本發明已以實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In summary, although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.
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