TWI662376B - Exposure device, exposure method, and article manufacturing method - Google Patents
Exposure device, exposure method, and article manufacturing method Download PDFInfo
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- TWI662376B TWI662376B TW106119299A TW106119299A TWI662376B TW I662376 B TWI662376 B TW I662376B TW 106119299 A TW106119299 A TW 106119299A TW 106119299 A TW106119299 A TW 106119299A TW I662376 B TWI662376 B TW I662376B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70558—Dose control, i.e. achievement of a desired dose
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- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
提供一種在曝光量的均勻化方面有利的曝光裝 置。 Provided is an exposure device that is advantageous in terms of uniformity of the exposure amount.
一種曝光裝置，在使基板(W)和原版 (R)移動的同時，將基板(W)針對每個被攝區域進行掃描曝光，前述曝光裝置具有：對將被攝區域曝光的曝光光進行整形的整形部(117)；調整曝光光的光量分佈的照明部(114)；以及，控制整形部(117)及照明部(114)的控制部(170)；其中，控制部(170)控制照明部(114)，以使在被攝區域內在非掃描方向上分離的第一區域以及第二區域各自的累計曝光量分佈相等，並控制整形部(117)，以使被攝區域中的掃描方向的累計曝光量均勻。 An exposure device that scans and exposes the substrate (W) for each shooting area while moving the substrate (W) and the original plate (R). The exposure device includes: shaping the exposure light that exposes the shooting area. A shaping unit (117); a lighting unit (114) that adjusts the light amount distribution of the exposure light; and a control unit (170) that controls the shaping unit (117) and the lighting unit (114); wherein the control unit (170) controls the lighting Section (114) to equalize the cumulative exposure distributions of the first and second areas separated in the non-scanning direction within the subject area, and control the shaping section (117) so that the scanning direction in the subject area The cumulative exposure is even.
Description
本發明涉及曝光裝置、曝光方法、及物品製造方法。 The present invention relates to an exposure apparatus, an exposure method, and an article manufacturing method.
在作為液晶顯示裝置等的製造工程之一的光刻工程中，使用在使原版以及基板同步地移動的同時，經由投影光學系統將原版的圖案轉印到基板上的曝光區域的掃描型曝光裝置(掃描器)。進而，近年來，為了使掃描器能對應隨著基板的大型化的曝光區域的大面積化，開發了將曝光區域分割成多個單位曝光區域(被攝區域)，並將對應各被攝區域的圖案的像依序曝光的方法。在該方法中，進行使在與掃描方向正交的方向上鄰接的被攝區域的一部分相接合而曝光的接合曝光。 In a photolithography process, which is one of manufacturing processes of a liquid crystal display device and the like, a scanning type exposure apparatus is used in which an original plate and a substrate are moved synchronously and a pattern of the original plate is transferred to an exposure area on the substrate via a projection optical system. (scanner). Furthermore, in recent years, in order to allow the scanner to cope with an increase in the area of the exposure area as the substrate becomes larger, a development has been developed to divide the exposure area into a plurality of unit exposure areas (photographed areas) and to correspond to each of the photographed areas. Method of sequential exposure of patterned images. In this method, a bonding exposure is performed in which a part of a subject area adjacent to a direction orthogonal to the scanning direction is bonded and exposed.
相接合的部分(接合部)由於鄰接的被攝區域的一部分相互重疊，所以曝光量比接合部以外的部分還大，圖案的線寬在接合部和其以外的部分變得不均勻。作為使接合部和其以外的部分的曝光量均勻的曝光裝置，專利文獻1公開了藉由設置於光源與原版之間的遮光板來調節接合部的曝光量的曝光裝置。 The portions (joining portions) that are joined to each other overlap each other, so that the exposure amount is greater than that of the portions other than the joining portions, and the line width of the pattern becomes uneven at the joining portions and other portions. As an exposure device that makes the exposure amount of the joint portion and other portions uniform, Patent Document 1 discloses an exposure device that adjusts the exposure amount of the joint portion by a light shielding plate provided between the light source and the original plate.
專利文獻1：日本專利第3711586號公報 Patent Document 1: Japanese Patent No. 3711586
在掃描器中，例如藉由能夠調整狹縫寬度的狹縫狀的照射區域(照明光)將被攝區域曝光。藉由調整狹縫寬度，能夠使由照明光進行被攝區域的掃描曝光時的被攝區域內的各位置的累計曝光量的分佈均勻。然而，在上述專利文獻1中，在調整掃描方向上的狹縫寬度而變更照射區域的情況下，非掃描方向上的各位置的累計曝光量的分佈，與未調整狹縫寬度的情況下的累計曝光量的分佈會有所不同。因此，可能難以使被攝區域內的累計曝光量的分佈均勻。 In a scanner, for example, a subject area is exposed by a slit-shaped irradiation area (illumination light) capable of adjusting a slit width. By adjusting the slit width, it is possible to make the distribution of the cumulative exposure amount at each position in the photographed area uniform when the photographed area is scanned and exposed by the illumination light. However, in the above-mentioned Patent Document 1, when the slit area in the scanning direction is adjusted to change the irradiation area, the distribution of the cumulative exposure amount at each position in the non-scanning direction is the same as that in the case where the slit width is not adjusted. The distribution of cumulative exposures will vary. Therefore, it may be difficult to make the distribution of the cumulative exposure amount in the subject area uniform.
本發明的目的在於例如提供一種在曝光量的均勻化的點上有利的曝光裝置。 An object of the present invention is to provide, for example, an exposure device that is advantageous at a point where the exposure amount is uniformized.
為了解決上述課題，本發明的一個方面的曝光裝置是在使基板和原版移動的同時，將基板針對每個被攝區域進行掃描曝光的曝光裝置，該曝光裝置，具有：將曝光被攝區域的曝光光進行整形的整形部；調整曝光光的光量分佈的照明部；以及控制整形部及照明部的控制部；其中，控制部係控制照明部以使在被攝區域內在非掃描方 向上分離的第一區域以及第二區域各自的累計的曝光量分佈相等，並控制整形部以使被攝區域中的掃描方向的累計曝光量均勻。 In order to solve the above-mentioned problem, an exposure apparatus according to one aspect of the present invention is an exposure apparatus that scans and exposes a substrate for each shooting area while moving the substrate and the original plate. The exposure device includes: A shaping section that shapes the exposure light; a lighting section that adjusts the light amount distribution of the exposure light; and a control section that controls the shaping section and the lighting section; wherein the control section controls the lighting section so that the The cumulative exposure amount distribution of each of the first region and the second region is equal, and the shaping section is controlled so that the cumulative exposure amount in the scanning direction in the photographed region is uniform.
根據本發明，例如能夠提供一種在曝光量的均勻化的點上有利的曝光裝置。 According to the present invention, for example, it is possible to provide an exposure device that is advantageous at a point where the exposure amount is uniformized.
100‧‧‧曝光裝置 100‧‧‧ exposure device
110‧‧‧照明光學系統 110‧‧‧lighting optical system
120‧‧‧投影光學系統 120‧‧‧ projection optical system
130‧‧‧光罩載置台 130‧‧‧Photomask mounting table
140‧‧‧基板載置台 140‧‧‧ substrate mounting table
150‧‧‧照度感測器 150‧‧‧illumination sensor
160‧‧‧遮光葉片機構(遮光部) 160‧‧‧Light-shielding blade mechanism (light-shielding section)
161、162‧‧‧遮光葉片 161, 162‧‧‧ shade blades
170‧‧‧控制部 170‧‧‧Control Department
111‧‧‧光源 111‧‧‧light source
112‧‧‧橢圓鏡 112‧‧‧ Elliptical Mirror
113‧‧‧第一聚光鏡 113‧‧‧The first condenser
114‧‧‧複眼透鏡(照明部) 114‧‧‧Fly-eye lens (lighting section)
115‧‧‧第二聚光鏡 115‧‧‧Second condenser
116‧‧‧平面鏡 116‧‧‧ flat mirror
117‧‧‧可變狹縫機構(整形部) 117‧‧‧Variable slit mechanism (shaping department)
118‧‧‧成像光學系統 118‧‧‧ Imaging Optical System
171‧‧‧照度分佈調整裝置 171‧‧‧illuminance distribution adjustment device
172‧‧‧光源點亮部 172‧‧‧Light source lighting section
173‧‧‧複眼透鏡驅動部 173‧‧‧Fly-eye lens driver
1141~1144‧‧‧柱狀透鏡 1141 ~ 1144‧‧‧ cylindrical lens
155‧‧‧遮光葉片驅動裝置 155‧‧‧Shading blade driving device
R‧‧‧光罩(掩模、原版) R‧‧‧Photomask (mask, original)
W‧‧‧基板 W‧‧‧ substrate
[圖1]是表示第一實施形態所涉及的曝光裝置的結構的概略圖。 FIG. 1 is a schematic diagram showing a configuration of an exposure apparatus according to a first embodiment.
[圖2]是說明照度分佈補正部的特徵以及投影區域的形狀的圖。 [Fig. 2] Fig. 2 is a diagram illustrating a feature of an illuminance distribution correction section and a shape of a projection region.
[圖3]是說明調整可變狹縫機構的開口形狀的機構的圖。 FIG. 3 is a diagram illustrating a mechanism for adjusting the opening shape of the variable slit mechanism.
[圖4]是表示進行通常曝光的情況下的投影區域的圖。 [Fig. 4] Fig. 4 is a diagram showing a projection area in a case where normal exposure is performed.
[圖5]是表示進行接合曝光的情況下的第一次掃描曝光時的遮光的樣子的圖。 [Fig. 5] Fig. 5 is a diagram illustrating a state of light blocking during the first scanning exposure in the case of performing joint exposure.
[圖6]是表示進行接合曝光的情況下的第二次掃描曝光時的遮光的樣子的圖。 FIG. 6 is a diagram showing a state of light blocking during a second scanning exposure in the case of performing a joint exposure.
[圖7]是表示投影區域和投影區域內的接合寬度的關係、以及投影區域內的累計照度的分佈的圖形。 FIG. 7 is a graph showing the relationship between the projection area and the joint width in the projection area, and the distribution of the cumulative illuminance in the projection area.
[圖8]是表示以均勻的照度分佈對投影區域進行照明，如圖5以及圖6所示遮光並進行接合曝光的情況下的曝光量的圖形。 [Fig. 8] Fig. 8 is a graph showing an exposure amount when the projection area is illuminated with a uniform illuminance distribution, as shown in Figs. 5 and 6, and a joint exposure is performed.
[圖9]是表示在以圖7的(B)的照度分佈對投影區域進行照明的情況下，調整掃描方向的照度分佈，如圖5以及圖6所示遮光並進行接合曝光的情況下的曝光量的圖形。 [Fig. 9] Fig. 9 shows a case where the projection area is illuminated with the illuminance distribution of Fig. 7 (B), and the illuminance distribution in the scanning direction is adjusted, as shown in Figs. 5 and 6, and the joint exposure is performed. Graphic of exposure.
[圖10]是表示在以圖7的(C)的照度分佈對投影區域進行照明的情況下，如圖5以及圖6所示遮光並進行接合曝光的情況下的曝光量的圖形。 FIG. 10 is a graph showing the exposure amount when the projection area is illuminated with the illuminance distribution of FIG. 7 (C), as shown in FIGS. 5 and 6, and the joint exposure is performed.
[圖11]是表示在光軸方向上驅動柱狀透鏡的情況下的曝光量的分佈的圖形。 11 is a graph showing a distribution of an exposure amount when a lenticular lens is driven in the optical axis direction.
[圖12]是表示第一實施形態的接合曝光的工程的流程圖。 12 is a flowchart showing a process of bonding exposure in the first embodiment.
[圖13]是在第二實施形態所涉及的曝光裝置中所包含的照明光學系統的XY平面圖。 13 is an XY plan view of an illumination optical system included in the exposure apparatus according to the second embodiment.
[圖14]是表示投影區域和投影區域內的接合寬度的關係、以及投影區域內的累計照度的分佈的圖形。 14 is a graph showing a relationship between a projection area and a joint width in the projection area, and a distribution of a cumulative illuminance in the projection area.
[圖15]是表示進行通常曝光的情況下的投影區域、以及進行接合曝光的情況下的遮光的樣子的圖。 15 is a diagram showing a state of light-shielding when a normal exposure is performed and a joint exposure is performed.
[圖16]是表示以均勻的照度分佈對投影區域進行照明並進行接合曝光後的情況下的曝光量的分佈的圖形。 FIG. 16 is a graph showing the distribution of the exposure amount when the projection area is illuminated with a uniform illuminance distribution and joint exposure is performed.
[圖17]是表示第二實施形態的接合曝光的工程的流程圖。 17 is a flowchart showing a process of bonding exposure in the second embodiment.
以下，參照圖式等，說明具體實施形態。 Hereinafter, specific embodiments will be described with reference to the drawings and the like.
圖1的(A)是表示本發明的第一實施形態所涉及的曝光裝置的結構的概略圖。圖1的(B)是在本發明的第一實施形態所涉及的曝光裝置中所包含的照明光學系統的XY平面圖。曝光裝置100例如可以使用於液晶顯示裝置、有機EL裝置等平板的製造工程中的光刻工程。特別是在本實施形態中，曝光裝置100設為藉由步進掃描方式，將形成於光罩(遮罩)R的圖案的像轉印(曝光)到基板W上的掃描型投影曝光裝置。曝光裝置100具有：照明光學系統110、投影光學系統120、光罩載置台130、基板載置台140、照度感測器150、遮光葉片機構(遮光部)160、以及控制部170。此外，在圖1以下的各圖中，將在與作為鉛直方向的Z軸垂直的平面內曝光時的光罩R以及基板W的掃描方向設為Y軸，將與Y軸正交的非掃描方向設為X軸。另外，基板W是例如以玻璃材料製，表面塗覆有感光劑(光阻)的被處理基板。進而，光罩R是例如以玻璃材料製，形成有應轉印到基板W的圖案(細微的凹凸圖案)的原版。 FIG. 1 (A) is a schematic diagram showing a configuration of an exposure apparatus according to a first embodiment of the present invention. FIG. 1B is an XY plan view of an illumination optical system included in the exposure apparatus according to the first embodiment of the present invention. The exposure device 100 can be used, for example, in a photolithography process in a manufacturing process of a flat plate such as a liquid crystal display device or an organic EL device. In particular, in this embodiment, the exposure apparatus 100 is a scanning projection exposure apparatus that transfers (exposes) an image of a pattern formed on a photomask (mask) R onto a substrate W by a step-and-scan method. The exposure apparatus 100 includes an illumination optical system 110, a projection optical system 120, a mask mounting table 130, a substrate mounting table 140, an illuminance sensor 150, a light blocking blade mechanism (light blocking section) 160, and a control section 170. In each of the figures below and in FIG. 1, the scanning direction of the mask R and the substrate W when exposed in a plane perpendicular to the Z axis that is the vertical direction is set to the Y axis, and the non-scanning orthogonal to the Y axis is set. The direction is set to the X axis. The substrate W is a substrate to be processed made of, for example, a glass material and the surface of which is coated with a photosensitizer (photoresist). Further, the photomask R is, for example, an original plate made of a glass material and formed with a pattern (fine uneven pattern) to be transferred to the substrate W.
照明光學系統110具備將曝光光的光量分佈進行調整的照明部和將曝光光進行整形的整形部。照明光 學系統110例如包括：光源111、橢圓鏡112、第一聚光鏡113、複眼透鏡(照明部)114、第二聚光鏡115、平面鏡116、可變狹縫機構(整形部)117、成像光學系統118。另外，藉由從與控制部170連接的照度分佈調整裝置171向光源點亮部172以及複眼透鏡驅動部173的指令，來調整照明光學系統110對光罩R(基板W)照明的照度。 The illumination optical system 110 includes an illumination section that adjusts the light amount distribution of the exposure light, and a shaping section that shapes the exposure light. The illumination optical system 110 includes, for example, a light source 111, an elliptical mirror 112, a first condenser lens 113, a fly-eye lens (illumination section) 114, a second condenser mirror 115, a flat mirror 116, a variable slit mechanism (shaping section) 117, and an imaging optical system 118 . In addition, the illuminance of the illumination optical system 110 to illuminate the mask R (substrate W) is adjusted by a command from the illuminance distribution adjustment device 171 connected to the control unit 170 to the light source lighting unit 172 and the fly-eye lens driving unit 173.
作為光源111，例如能夠使用Hg燈，但有時也使用i線、h線、g線等Hg燈的輸出波長的一部分。光源111的發光部配置於橢圓鏡112的第一焦點。將從光源111發出的光束藉由橢圓鏡112聚光到橢圓鏡112的第二焦點面F。 As the light source 111, for example, an Hg lamp can be used, but a part of the output wavelength of an Hg lamp such as an i-line, an h-line, or a g-line may be used. The light emitting portion of the light source 111 is disposed at a first focus of the elliptical mirror 112. The light beam emitted from the light source 111 is condensed by the elliptical mirror 112 to the second focal plane F of the elliptical mirror 112.
在圖1中，將光源111的發光部設為球體，用實線表示來自球體的中心點的光線，用虛線表示從球體表面的Y軸方向的頂點(左側以及右側)發出的光線。從光源111的發光部的中心點發出的光線在橢圓鏡112的反射面中央反射之後，在橢圓鏡112的第二焦點面F聚光為一點。相對於此，從光源111的發光部的左側頂點發出的光線在橢圓鏡112的反射面左端反射之後，在橢圓鏡112的第二焦點面F的後方聚光為一點。另外，從光源111的發光部的右側頂點發出的光線在橢圓鏡112的反射面左端反射之後，在橢圓鏡112的第二焦點面F的前方聚光為一點。因此，在橢圓鏡112的第二焦點面F，從光源111的發光部的左側頂點發出的光線和從右側頂點發出的光線擴 展並聚光。 In FIG. 1, the light-emitting portion of the light source 111 is a sphere, and the light rays from the center point of the sphere are represented by a solid line, and the light rays emitted from the vertices (left and right) in the Y-axis direction of the surface of the sphere are represented by dashed lines. After the light emitted from the center point of the light emitting portion of the light source 111 is reflected at the center of the reflecting surface of the elliptical mirror 112, it is condensed to one point on the second focal plane F of the elliptical mirror 112. On the other hand, after the light emitted from the left vertex of the light emitting portion of the light source 111 is reflected at the left end of the reflection surface of the elliptical mirror 112, it is condensed to one point behind the second focal plane F of the elliptical mirror 112. In addition, the light emitted from the right vertex of the light emitting portion of the light source 111 is reflected at the left end of the reflecting surface of the elliptical mirror 112 and then is condensed to one point in front of the second focal plane F of the elliptical mirror 112. Therefore, on the second focal plane F of the elliptical mirror 112, the light emitted from the left vertex of the light emitting section of the light source 111 and the light emitted from the right vertex are expanded and condensed.
第一聚光鏡113使藉由橢圓鏡112在第二焦點面F擴展並聚光的光束的像，在複眼透鏡114的入射面放大並成像。複眼透鏡114例如是包括：柱狀透鏡1141~1144、照度分佈補正部1145的光學元件。如圖1的(A)以及照明光學系統110的XY平面圖即圖1的(B)所示，柱狀透鏡1141、1143在YZ平面內具有曲率，柱狀透鏡1142、1144在XY平面內具有曲率。從複眼透鏡114出去的光束在YZ平面內和XY平面內會有不同的NA。 The first condenser lens 113 magnifies and images an image of a light beam that is expanded and condensed on the second focal plane F by the elliptical mirror 112 on the incident surface of the fly-eye lens 114. The fly-eye lens 114 is, for example, an optical element including a lenticular lens 1141 to 1144 and an illuminance distribution correction unit 1145. As shown in FIG. 1 (A) and the XY plan view of the illumination optical system 110, as shown in FIG. 1 (B), the lenticular lenses 1141, 1143 have curvature in the YZ plane, and the lenticular lenses 1142, 1144 have curvature in the XY plane. . The light beam exiting the fly-eye lens 114 will have different NAs in the YZ plane and the XY plane.
可變狹縫機構117配置成從複眼透鏡114射出，並入射到光罩R以及基板W的光束的光路狀。從複眼透鏡114射出的光束經由第二聚光鏡115而被平面鏡116反射之後，對可變狹縫機構117進行照明。此時，第二聚光鏡115對可變狹縫機構117進行科勒照明，複眼透鏡114的光束的出射面、和配置有可變狹縫機構117的面在光學上處於瞳面和像面的關係。在科勒照明中，通過從瞳面射出的NA來決定像面的照明範圍的大小。柱狀透鏡1141和柱狀透鏡1143決定可變狹縫機構117上的Y方向的照射區域，柱狀透鏡1142和柱狀透鏡1144決定可變狹縫機構117上的X方向的照射區域。 The variable slit mechanism 117 is arranged in a light path shape of a light beam emitted from the fly-eye lens 114 and incident on the mask R and the substrate W. After the light beam emitted from the fly-eye lens 114 is reflected by the plane mirror 116 via the second condenser 115, the variable slit mechanism 117 is illuminated. At this time, the second condenser 115 performs Kohler illumination on the variable slit mechanism 117, and the exit surface of the light beam of the fly-eye lens 114 and the surface on which the variable slit mechanism 117 is arranged are optically in a relationship of a pupil plane and an image plane. In Kohler illumination, the size of the illumination range of the image plane is determined by the NA emitted from the pupil plane. The lenticular lens 1141 and the lenticular lens 1143 determine the irradiation area in the Y direction on the variable slit mechanism 117, and the lenticular lens 1142 and the lenticular lens 1144 determine the irradiation area in the X direction on the variable slit mechanism 117.
圖2的(A)是說明照度分佈補正部1145的特徵的圖。為從-Y方向觀察的圖，為了說明，縱向並排地示出柱狀透鏡1142和照度分佈補正部1145。光束通過 照度分佈補正部1145經由柱狀透鏡1141射入柱狀透鏡1142。柱狀透鏡1142包括柱狀透鏡1142a~1142c，照度分佈補正部1145具有與柱狀透鏡1142a~1142c分別對應並在X方向上被分成三個的透射率分佈。 FIG. 2A is a diagram illustrating the characteristics of the illuminance distribution correction unit 1145. The figure is viewed from the -Y direction, and for illustration, the lenticular lens 1142 and the illuminance distribution correction section 1145 are shown side by side in the vertical direction. The light beam enters the lenticular lens 1142 through the lenticular lens 1141 through the illuminance distribution correction unit 1145. The lenticular lens 1142 includes lenticular lenses 1142a to 1142c, and the illuminance distribution correction section 1145 has a transmittance distribution corresponding to the lenticular lenses 1142a to 1142c and divided into three in the X direction.
例如，照度分佈補正部1145的各個被劃分的區域具有透射率從區域的X方向中心到周邊逐漸增加的傾向。在本實施形態中，以在X方向上的長矩形形狀對配置有可變狹縫機構117的面進行照明。照度分佈補正部1145藉由與在光軸方向(Y方向)上調整位置的柱狀透鏡1142的組合，將X方向的光強度分佈補正為預定的分佈。 For example, each divided region of the illuminance distribution correction unit 1145 has a tendency that the transmittance gradually increases from the X-direction center of the region to the periphery. In the present embodiment, the surface on which the variable slit mechanism 117 is arranged is illuminated in a long rectangular shape in the X direction. The illuminance distribution correction unit 1145 corrects the light intensity distribution in the X direction to a predetermined distribution in combination with the lenticular lens 1142 that adjusts the position in the optical axis direction (Y direction).
照度分佈調整裝置171根據控制部170的指示，向透鏡驅動部1730發出指令，在光軸方向(Y方向)上驅動柱狀透鏡1142，並且向光源點亮部172發出指令，調整光源111的輸出。在變更柱狀透鏡1142和柱狀透鏡1144的間隔後，可變狹縫機構117上的照射區域的X方向的照度分佈(曝光量分佈)發生變化。 The illuminance distribution adjustment device 171 issues an instruction to the lens driving unit 1730 according to an instruction from the control unit 170, drives the lenticular lens 1142 in the optical axis direction (Y direction), and issues an instruction to the light source lighting unit 172 to adjust the output of the light source 111 . When the distance between the lenticular lens 1142 and the lenticular lens 1144 is changed, the illuminance distribution (exposure amount distribution) in the X direction of the irradiation area on the variable slit mechanism 117 changes.
可變狹縫機構117如圖1的(B)所示，具有在X方向上的長圓弧形狀的開口，通過可變狹縫機構117的光束藉由成像光學系統118在光罩R面上成像，形成圓弧形狀的照明區域。 As shown in FIG. 1 (B), the variable slit mechanism 117 has a long arc-shaped opening in the X direction, and the light beam passing through the variable slit mechanism 117 is on the mask R surface through the imaging optical system 118. Imaging to form an arc-shaped illuminated area.
投影光學系統120包括平面鏡121、凹面鏡122、凸面鏡123、平面鏡124，使形成在光罩R面上的圖案的像在基板W上成像，形成圖2的(B)所示的圓弧形 狀的投影區域(被攝區域)PA。 The projection optical system 120 includes a flat mirror 121, a concave mirror 122, a convex mirror 123, and a flat mirror 124, and forms an image of a pattern formed on the R surface of the mask on the substrate W to form a circular arc-shaped projection as shown in FIG. 2 (B). Area (photographed area) PA.
照度感測器150例如是在與基板W的表面相同的高度具有針孔開口的光量感測器，藉由驅動基板載置台140，測定圓弧形狀的投影區域PA內(被攝區域內)的Y方向、以及X方向的多個點的照度分佈。 The illuminance sensor 150 is, for example, a light amount sensor having a pinhole opening at the same height as the surface of the substrate W. The substrate mounting table 140 is driven to measure the inside of the arc-shaped projection area PA (in the subject area). Illumination distribution at a plurality of points in the Y direction and the X direction.
遮光葉片機構160能夠在掃描方向上進退，在進行接合曝光時，藉由對曝光光進行遮光來調整圓弧形狀的投影區域PA的形狀。在此，接合曝光是指，使在與掃描方向(Y方向)正交的方向(X方向)上鄰接的被攝區域的一部分相接合而曝光。將相接合的部分稱為接合區域。 The light-shielding blade mechanism 160 can advance and retreat in the scanning direction. When performing joint exposure, the shape of the arc-shaped projection area PA can be adjusted by shielding the exposure light. Here, the joint exposure means that a part of the subject area adjacent to each other in a direction (X direction) orthogonal to the scanning direction (Y direction) is joined and exposed. The joined part is called a joining area.
控制部170使保持有光罩R的光罩載置台130、和保持有基板W的基板載置台140同步地在Y方向上掃描曝光，將光罩R上的圖案轉印到塗佈有感光材料的基板W上。 The control unit 170 synchronously scans and exposes the mask mounting table 130 holding the mask R and the substrate mounting table 140 holding the substrate W in the Y direction, and transfers the pattern on the mask R to the photosensitive material coated thereon. On the substrate W.
圖3是說明調整可變狹縫機構117的開口的形狀的機構的圖。可變狹縫機構117藉由固定遮光部1170和驅動遮光部117a~117q形成圓弧形狀的開口。可變狹縫驅動裝置154藉由控制部170的指令使驅動遮光部117a~117q驅動，調整圓弧形狀的開口的Y方向的狹縫寬度Wa~Wq。藉此，來整形曝光光。 FIG. 3 is a diagram illustrating a mechanism for adjusting the shape of the opening of the variable slit mechanism 117. The variable slit mechanism 117 forms an arc-shaped opening by fixing the light shielding portion 1170 and driving the light shielding portions 117a to 117q. The variable slit driving device 154 drives the driving light-shielding sections 117 a to 117 q according to a command from the control section 170 to adjust the slit widths Wa to Wq in the Y direction of the arc-shaped opening. With this, the exposure light is shaped.
圖4~6是說明遮光葉片機構160的構造、和被遮光的圓弧形狀的投影區域PA的關係的圖。遮光葉片機構160具有兩個遮光葉片161以及162，遮光葉片驅動 裝置155藉由控制部170的指令分別使兩個遮光葉片161、162在Y方向以及X方向上驅動。 4 to 6 are diagrams illustrating the relationship between the structure of the light-shielding blade mechanism 160 and the light-shielded arc-shaped projection area PA. The light-shielding blade mechanism 160 has two light-shielding blades 161 and 162, and the light-shielding blade driving device 155 drives the two light-shielding blades 161 and 162 in the Y direction and the X direction, respectively, according to a command from the control unit 170.
圖4是進行通常曝光的情況，控制部170使兩個遮光葉片161、以及162退避到圓弧形狀的投影區域PA的外側的位置。投影區域PA在-X方向的一端和+方向的另一端分別包括接合區域d1以及d2。 FIG. 4 shows a case where normal exposure is performed. The control unit 170 retracts the two light-shielding blades 161 and 162 to a position outside the arc-shaped projection area PA. One end of the projection area PA in the −X direction and the other end of the + direction include the bonding areas d 1 and d 2, respectively .
圖5是表示進行接合曝光的情況下的第一次掃描曝光時的遮光的樣子的圖。控制部170使遮光葉片161移動到投影區域PA內，將投影區域PA分割為接合區域d1、接合區域以外的非接合區域d10。 FIG. 5 is a view showing a state of light blocking during the first scanning exposure in the case of performing the joint exposure. The control unit 170 moves the light shielding blade 161 into the projection area PA, and divides the projection area PA into a bonding area d 1 and a non-bonding area d 10 other than the bonding area.
圖6是表示進行接合曝光的情況下的第二次掃描曝光時的遮光的樣子的圖。控制部170使遮光葉片162移動到投影區域PA內，將投影區域PA分割為接合區域d2、非接合區域d20。 FIG. 6 is a diagram illustrating a state of light blocking during the second scanning exposure in the case of performing the joint exposure. The control unit 170 moves the light-shielding blade 162 into the projection area PA, and divides the projection area PA into a joint area d 2 and a non-joint area d 20 .
以上是本實施形態所涉及的曝光裝置的結構。接下來，使用圖7~圖10，說明在具備可變狹縫機構117的曝光裝置100中進行接合曝光時可能產生的曝光不均。 The above is the configuration of the exposure apparatus according to this embodiment. Next, using FIG. 7 to FIG. 10, exposure unevenness that may occur when performing joint exposure in the exposure apparatus 100 including the variable slit mechanism 117 will be described.
圖7的(A)~(C)是表示投影區域PA和投影區域PA內的接合寬度的關係、以及投影區域PA內的累計照度的圖形。此外，之後為了簡化說明，將投影區域PA的形狀設為矩形。圖7的(A)~(C)的左邊的圖形是在從-Y方向觀察投影區域PA的情況下，將橫軸設為X位置、將縱軸設為Y方向的累計照度(累計曝光量)的 圖形(非掃描方向的曝光量分佈)。另一方面，圖7的(A)~(C)的右邊的圖形是在從+X方向觀察投影區域PA的情況下，將橫軸設為Y位置、將縱軸設為X方向的累計照度的圖形(掃描方向的曝光量分佈)。 FIGS. 7A to 7C are graphs showing the relationship between the projection area PA and the joint width in the projection area PA, and the cumulative illuminance in the projection area PA. In order to simplify the description, the shape of the projection area PA is rectangular. The graphs on the left of (A) to (C) in FIG. 7 show the cumulative illuminance (cumulative exposure) with the horizontal axis at the X position and the vertical axis at the Y direction when the projection area PA is viewed from the -Y direction. ) (Exposure distribution in the non-scanning direction). On the other hand, in the graphs on the right of (A) to (C) of FIG. 7, when the projection area PA is viewed from the + X direction, the horizontal axis is set to the Y position and the vertical axis is set to the cumulative illuminance in the X direction. Pattern (exposure distribution in the scanning direction).
圖7的(A)所示的圖形是以均勻的照度分佈對投影區域PA進行照明的情況，投影區域PA內的累計照度不論從-Y方向觀察還是從+X方向觀察都維持一定。圖7的(B)所示的圖形是以具有在+X方向上向右上升的Y方向的累計照度，並使X方向的累計照度不管Y方向如何都維持一定的照度分佈對投影區域PA進行照明的情況下的圖形。在從-Y方向觀察時，Y方向的累計照度會隨著向+X方向前進而有變強的傾向(左邊的圖形)，在從+X方向觀察時，X方向的累計照度不管Y位置如何都維持一定。圖7的(C)所示的圖形是以具有在+Y方向上向右上升的X方向的累計照度，並使Y方向的累計照度不管X方向如何都維持一定的照度分佈對投影區域PA進行照明的情況的圖形。在從-Y方向觀察時，Y方向的累計照度不管X方向如何都維持一定，在從+X方向觀察時，X方向的累計照度會隨著向+Y方向前進而有變強的傾向。 The graph shown in (A) of FIG. 7 is a case where the projection area PA is illuminated with a uniform illuminance distribution. The cumulative illuminance in the projection area PA remains constant regardless of whether it is viewed from the −Y direction or the + X direction. The graph shown in (B) of FIG. 7 is to project the projection area PA with a cumulative illuminance in the Y direction that rises to the right in the + X direction and maintain a constant illuminance distribution regardless of the Y direction. Graphics in the case of lighting. When viewed from the -Y direction, the cumulative illuminance in the Y direction tends to become stronger as it moves toward the + X direction (the figure on the left). When viewed from the + X direction, the cumulative illuminance in the X direction does not matter what the Y position is Both remain constant. The graph shown in (C) of FIG. 7 performs the projection area PA with the cumulative illuminance in the X direction that rises to the right in the + Y direction and maintains a constant illuminance distribution regardless of the X direction. Graphic of the lighting situation. When viewed from the -Y direction, the cumulative illuminance in the Y direction remains constant regardless of the X direction. When viewed from the + X direction, the cumulative illuminance in the X direction tends to become stronger as it progresses in the + Y direction.
圖8的(A)~(C)是表示以圖7的(A)的照度分佈對投影區域PA進行照明，並如圖5以及圖6所示遮光並進行接合曝光的情況下的，將橫軸設為X位置時的Y方向的累計曝光量(累計照度)的圖形。圖8的 (A)表示如圖5所示遮光地進行掃描曝光的情況下的曝光量，圖8的(B)表示如圖6所示遮光地進行掃描曝光的情況下的曝光量，圖8的(C)表示將第一次和第二次的曝光量合計起來的曝光量。 (A) to (C) of FIG. 8 show a case where the projection area PA is illuminated with the illuminance distribution of (A) of FIG. 7, and is shielded from light as shown in FIG. 5 and FIG. 6 to perform joint exposure. A graph of the cumulative exposure amount (cumulative illuminance) in the Y direction when the axis is set to the X position. (A) of FIG. 8 shows the exposure amount when scanning exposure is performed with light-shielding as shown in FIG. 5, and FIG. 8 (B) shows the exposure amount when scanning exposure is performed with light-shielding as shown in FIG. 6. (C) represents the exposure amount by adding the first and second exposure amounts together.
在以圖7的(A)的照度分佈進行曝光時，控制部170使可變狹縫驅動裝置154對驅動遮光部117a~117q進行驅動，將圓弧形狀的開口的Y方向的狹縫寬度Wa~Wq全部調整為相等的寬度。另外，如果使接合區域d1和d2在X方向上的大小相等的話，則在將第一次的累計照度(圖8的(A))和第二次的累計照度(圖8的(B))加起來時，如圖8的(C)所示，成為相對X位置為均勻的累計照度。 When the exposure is performed with the illuminance distribution in FIG. 7 (A), the control unit 170 causes the variable slit driving device 154 to drive the driving light-shielding portions 117a to 117q, and the slit width Wa in the Y direction of the arc-shaped opening ~ Wq is all adjusted to equal width. In addition, if the sizes of the joint regions d 1 and d 2 in the X direction are made equal, the first cumulative illuminance ((A) in FIG. 8) and the second cumulative illuminance ((B in FIG. 8) )) When added up, as shown in FIG. 8 (C), the cumulative illuminance becomes uniform with respect to the X position.
圖9的(A)~(C)是表示在以圖7的(B)的照度分佈對投影區域PA進行照明的情況下，調整非掃描方向的照度分佈，並如圖5以及圖6所示遮光並進行接合曝光的情況下的非掃描方向的照度分佈的圖形。圖9的(A)表示如圖5所示遮光並進行掃描曝光的情況下的曝光量，圖9的(B)表示如圖6所示遮光並進行掃描曝光的情況下的曝光量，圖9的(C)表示將第一次和第二次的曝光量合計起來的曝光量。 (A) to (C) of FIG. 9 show that when the projection area PA is illuminated with the illuminance distribution of (B) of FIG. 7, the illuminance distribution in the non-scanning direction is adjusted, as shown in FIGS. 5 and 6. A pattern of the illuminance distribution in the non-scanning direction when the light is shielded and the joint exposure is performed. (A) of FIG. 9 shows the exposure amount in the case of shading and scanning exposure as shown in FIG. 5, and FIG. 9 (B) shows the exposure amount in the case of shading and scanning exposure as shown in FIG. 6, and FIG. 9 (C) represents the exposure amount by adding the first and second exposure amounts together.
在以圖7的(B)的照度分佈對投影區域PA進行照明的情況下，在進行接合曝光之前，使非掃描方向的照度分佈均勻。即，藉由控制部170的指令使可變狹縫驅動裝置154將驅動遮光部117a~117q驅動，調整圓弧 形狀的開口的Y方向的狹縫寬度Wa~Wq。因為圖7的(B)的照度分佈具有在+X方向上向右上升的Y方向的累計照度，所以使-X方向的一端的狹縫寬度大、+X方向的另一端的狹縫寬度小。此時，接合區域d1比圖8的(A)的情況還寬，接合區域d2比圖8的(B)的情況還窄。其結果，在將第一次的累計照度和第二次的累計照度加起來時，如圖9的(C)所示，非掃描方向的照度分佈變得不均勻。 When the projection area PA is illuminated with the illuminance distribution in FIG. 7 (B), the illuminance distribution in the non-scanning direction is made uniform before the joint exposure is performed. That is, the variable slit driving device 154 drives the driving light-shielding sections 117a to 117q under the instruction of the control section 170, and adjusts the slit widths Wa to Wq in the Y direction of the arc-shaped opening. Since the illuminance distribution in (B) of FIG. 7 has a cumulative illuminance in the Y direction which rises to the right in the + X direction, the slit width at one end in the -X direction is made larger and the slit width at the other end in the + X direction is made smaller . At this time, the bonding region d 1 is wider than the case of FIG. 8 (A), and the bonding region d 2 is narrower than the case of FIG. 8 (B). As a result, when the first cumulative illuminance and the second cumulative illuminance are added, as shown in (C) of FIG. 9, the illuminance distribution in the non-scanning direction becomes uneven.
該不均勻的投影區域被分成三個區域。即，在非接合區域d20和接合區域d1被雙重曝光的部分、在接合區域d1和接合區域d2被雙重曝光的部分、以及僅在接合區域d1被曝光的部分。 The uneven projection area is divided into three areas. That is, a portion that is double-exposed in the non-joined region d 20 and the bonded region d 1 , a portion that is double-exposed in the bonded region d 1 and the bonded region d 2 , and a portion that is exposed only in the bonded region d 1 .
另外，圖10的(A)~(C)是表示在以圖7的(C)的照度分佈對投影區域PA進行照明的情況下，如圖5以及圖6所示遮光並進行接合曝光的情況下的非掃描方向的照度分佈的圖形。圖10的(A)表示如圖5所示遮光並進行掃描曝光的情況下的曝光量，圖10的(B)表示如圖6所示遮光並進行掃描曝光的情況下的曝光量，圖10的(C)表示將第一次和第二次的曝光量合計起來的曝光量。 In addition, (A) to (C) of FIG. 10 show a case where the projection area PA is illuminated with the illuminance distribution of (C) of FIG. 7, as shown in FIGS. 5 and 6, and the joint exposure is performed. Graph of illuminance distribution in the non-scanning direction. (A) of FIG. 10 shows the exposure amount in the case of shading and scanning exposure as shown in FIG. 5, and FIG. 10 (B) shows the exposure amount in the case of shading and scanning exposure as shown in FIG. 6, and FIG. 10 (C) represents the exposure amount by adding the first and second exposure amounts together.
在以圖7的(C)的照度分佈對投影區域PA進行照明的情況下，因為非掃描方向的照度分佈均勻，所以在進行接合曝光之前的狹縫寬度Wa~Wq全部相等。此時，接合區域d1以及d2的X方向的大小相等。但是，圖 7的(C)的照度分佈在從+X方向觀察時，因為X方向的累計照度在+Y方向上向右上升，所以基於第一次掃描曝光的曝光量會如圖10的(A)所示，在藉由接合區域d1曝光的區域中在+X方向上會呈現弧線形的增加傾向。另外，基於第二次掃描曝光的曝光量如圖10的(B)所示，在藉由接合區域d2曝光的區域中在+X方向上會呈現弧線形的減少傾向。其結果，在將第一次的累計照度和第二次的累計照度加起來時，如圖10的(C)所示，非掃描方向的照度分佈變得不均勻。 When the projection area PA is illuminated with the illuminance distribution in FIG. 7 (C), since the illuminance distribution in the non-scanning direction is uniform, the slit widths Wa to Wq before the joint exposure are all equal. At this time, the sizes in the X direction of the bonding regions d 1 and d 2 are equal. However, when the illuminance distribution in (C) of FIG. 7 is viewed from the + X direction, since the cumulative illuminance in the X direction rises to the right in the + Y direction, the exposure amount based on the first scan exposure will be as shown in FIG. 10 ( As shown in A), in the area exposed by the bonding area d 1, an arc-shaped increase tendency appears in the + X direction. Further, based on the exposure amount of the second scanning exposure as shown in (B) 10 is shown, by joining in the region of the exposed region d 2 in the + X direction will show a decreasing tendency of the arc-shaped. As a result, when the first cumulative illuminance and the second cumulative illuminance are added, as shown in FIG. 10 (C), the illuminance distribution in the non-scanning direction becomes uneven.
如以上所述，在投影區域PA內的照度分佈不均勻的情況下，即便使用可變狹縫機構117來調整使得非掃描方向的照度分佈均勻，在通過遮光的掃描曝光進行接合曝光時，非掃描方向的照度分佈也會變得不均勻。根據本實施形態，能夠在藉由可變狹縫機構117使掃描方向(Y方向)的累計曝光量均勻化的同時，藉由接合曝光使X方向的照度均勻化。以下為具體的方法。 As described above, when the illuminance distribution in the projection area PA is uneven, even if the variable slit mechanism 117 is used to adjust the illuminance distribution in the non-scanning direction to be uniform. The illuminance distribution in the scanning direction also becomes uneven. According to this embodiment, it is possible to uniformize the cumulative exposure amount in the scanning direction (Y direction) by the variable slit mechanism 117 and to uniformize the illuminance in the X direction by the joint exposure. The following is the specific method.
圖11的(A)以及(B)表示在光軸方向(Y方向)上驅動柱狀透鏡1142的情況下的投影區域PA內的曝光量的分佈。例如，在使柱狀透鏡1142的位置從圖7的(A)所示的呈現均勻的照度分佈的位置開始沿著光軸在-Y方向上移動時，呈現如圖11的(A)的凹形的照度分佈。在+Y方向上移動時，呈現如圖11的(B)的凸形的照度分佈。 (A) and (B) of FIG. 11 show the distribution of the exposure amount in the projection area PA when the lenticular lens 1142 is driven in the optical axis direction (Y direction). For example, when the position of the lenticular lens 1142 is shifted in the -Y direction along the optical axis from the position showing a uniform illuminance distribution shown in (A) of FIG. 7, a concave as shown in (A) of FIG. 11 is presented. Shaped illumination distribution. When moving in the + Y direction, a convex illuminance distribution as shown in FIG. 11 (B) is presented.
這樣，照度分佈調整裝置171能夠向透鏡驅 動部173發出指令，在光軸方向(Y方向)上驅動複眼透鏡114內的柱狀透鏡1142，使投影區域PA內的非掃描方向的曝光量分佈按照二次曲線狀變化。 In this way, the illuminance distribution adjusting device 171 can instruct the lens driving unit 173 to drive the lenticular lens 1142 in the fly-eye lens 114 in the optical axis direction (Y direction), so that the exposure amount distribution in the non-scanning direction in the projection area PA follows Quadratic curve change.
說明在以圖7的(B)的照度分佈對投影區域PA進行照明的情況下調整照度分佈的曲率成份使照度分佈均勻化。在該情況下，照度分佈調整裝置171個別地補正投影區域PA內的接合區域d1以及d2的累計照度。 When the projection area PA is illuminated with the illuminance distribution of FIG. 7 (B), the curvature component of the illuminance distribution is adjusted to make the illuminance distribution uniform. In this case, the illuminance distribution adjustment device 171 individually corrects the integrated illuminance of the bonding areas d 1 and d 2 in the projection area PA.
首先，在補正接合區域d1的累計照度的情況下，控制部170如圖4所示使兩個遮光葉片161、162退避到投影區域PA的外側，使接合區域d1內的狹縫寬度Wb以及Wc一致為預定的寬度。照度分佈調整裝置171使柱狀透鏡1142在+Y方向上移動，使接合區域d1的累計照度平坦化，並且調整光源111的輸出，將接合區域d1的累計照度補正為預定的值。 First, when the cumulative illuminance of the joining area d 1 is corrected, the control unit 170 retracts the two light-shielding blades 161 and 162 to the outside of the projection area PA as shown in FIG. 4, and sets the slit width Wb in the joining area d 1 as shown in FIG. 4. And Wc is consistent with a predetermined width. The illuminance distribution adjusting device 171 moves the lenticular lens 1142 in the + Y direction to flatten the integrated illuminance of the bonding area d 1 , and adjusts the output of the light source 111 to correct the integrated illuminance of the bonding area d 1 to a predetermined value.
接下來，在補正接合區域d2的累計照度的情況下，控制部170如圖4所示使兩個遮光葉片161、162退避到投影區域PA的外側，使接合區域d2內的狹縫寬度Wo以及Wp一致為預定的寬度。照度分佈調整裝置171使柱狀透鏡1142在-Y方向上移動，使接合區域d2的累計照度平坦化，並且調整光源111的輸出，將接合區域d2的累計照度補正為預定的值。 Next, when the cumulative illuminance of the joining area d 2 is corrected, the control unit 170 retracts the two light-shielding blades 161 and 162 to the outside of the projection area PA as shown in FIG. 4, and sets the slit width in the joining area d 2 as shown in FIG. 4. Wo and Wp are consistent with a predetermined width. The illuminance distribution adjustment device 171 moves the lenticular lens 1142 in the -Y direction to flatten the cumulative illuminance of the bonding area d 2 , and adjusts the output of the light source 111 to correct the cumulative illuminance of the bonding area d 2 to a predetermined value.
藉由如以上的方式進行調整，將第一次的累計照度和第二次的累計照度加起來的接合區域中的照度分佈在X方向上變得均勻。 By performing the adjustment as described above, the illuminance distribution in the joint area where the first cumulative illuminance and the second cumulative illuminance are added becomes uniform in the X direction.
說明在以圖7的(C)的照度分佈對投影區域PA進行照明的情況下利用照度分佈的曲率成份的調整的照度分佈均勻化。與圖7的(B)的照度分佈的補正一樣，個別地補正接合區域d1以及d2的累計照度。 When the projection area PA is illuminated with the illuminance distribution of FIG. 7 (C), the illuminance distribution uniformized by the adjustment of the curvature component of the illuminance distribution will be described. Similar to the correction of the illuminance distribution in (B) of FIG. 7, the integrated illuminances of the joint areas d 1 and d 2 are individually corrected.
首先，在補正接合區域d1的累計照度的情況下，控制部170在如圖5所示將遮光葉片161驅動到投影區域PA的狀態下，使接合區域d1內的狹縫寬度Wb以及Wc一致為預定的寬度。此時，投影區域PA內的接合區域d1的累計照度如圖10的(A)所示呈現弧線形的增加傾向。 First, when the cumulative illuminance of the joining area d 1 is corrected, the control unit 170 sets the slit widths Wb and Wc in the joining area d 1 in a state where the light shielding blade 161 is driven to the projection area PA as shown in FIG. 5. Consistent for a predetermined width. At this time, as shown in FIG. 10 (A), the cumulative illuminance of the bonding area d 1 in the projection area PA has a tendency to increase in an arc shape.
照度分佈調整裝置171使柱狀透鏡1142在-Y方向(或者+Y方向)上移動，使接合區域d1的累計照度的斜率成為線性，並且調整光源111的輸出，將接合區域d1的累計照度補正為預定的值。 The illuminance distribution adjusting device 171 moves the lenticular lens 1142 in the -Y direction (or + Y direction), makes the slope of the cumulative illuminance of the bonding area d 1 linear, and adjusts the output of the light source 111 to integrate the total of the bonding area d 1 The illuminance is corrected to a predetermined value.
接下來，在補正接合區域d2的累計照度的情況下，控制部170如圖6所示將遮光葉片162驅動到投影區域PA的狀態下，使接合區域d2內的狹縫寬度Wo、Wp一致為預定的寬度。此時，投影區域PA內的接合區域d2的累計照度如圖10的(B)所示呈現弧線形的減少傾向。 Next, when the integrated illuminance of the joining area d 2 is corrected, the control unit 170 sets the slit widths Wo, Wp in the joining area d 2 in a state where the light shielding blade 162 is driven to the projection area PA as shown in FIG. 6. Consistent for a predetermined width. At this time, as shown in FIG. 10 (B), the cumulative illuminance of the bonding area d 2 in the projection area PA shows an arc-shaped decreasing tendency.
照度分佈調整裝置171使柱狀透鏡1142在-Y方向(或者+Y方向)上移動，使接合區域d2的累計照度的斜率成為線性，並且調整光源111的輸出，將接合區域d2的累計照度補正為預定的值。 The illuminance distribution adjusting device 171 moves the lenticular lens 1142 in the -Y direction (or + Y direction), makes the slope of the cumulative illuminance of the bonding area d 2 linear, and adjusts the output of the light source 111 to integrate the integration of the bonding area d 2 The illuminance is corrected to a predetermined value.
藉由如以上的調整，將第一次的累計照度和 第二次的累計照度加起來的接合區域中的照度分佈在X方向上變得均勻。 By the adjustment as described above, the illuminance distribution in the joint area where the first cumulative illuminance and the second cumulative illuminance are added becomes uniform in the X direction.
此外，在上述中，在以圖7的(B)的照度分佈進行照明的情況下，調整曝光量，以使接合區域中的曝光量均勻化而在合計時在接合區域和非接合區域中變得均勻。然而，也可以設為調整接合區域中的曝光量的斜率，使其在合計時變得均勻。另外，在以圖7的(C)的X方向的照度分佈進行照明的情況下，也可以設為使接合區域的曝光量均勻化，使其在合計時變得均勻。 In addition, in the above, when the illumination is performed with the illuminance distribution of FIG. 7 (B), the exposure amount is adjusted so that the exposure amount in the bonded area becomes uniform and changes in the bonded area and the non-bonded area at a total time. Get even. However, it is also possible to adjust the slope of the exposure amount in the bonding area so that the total time becomes uniform. In addition, when the illumination is performed with the illuminance distribution in the X direction in FIG. 7 (C), the exposure amount of the bonding area may be made uniform to make the total time uniform.
圖12是表示本實施形態的接合曝光的工程的流程圖。藉由執行來自控制部170的指令。將接合曝光分成工程S11~S17的第一次掃描曝光、和工程S21~S27的第二次掃描曝光。 FIG. 12 is a flowchart showing a process of bonding exposure in the present embodiment. The instruction from the control unit 170 is executed. The joint exposure is divided into the first scanning exposure of processes S11 to S17 and the second scanning exposure of processes S21 to S27.
在工程S11中，控制部170向遮光葉片驅動裝置155發出指令，如圖5所示將遮光葉片161驅動到投影區域PA內。在工程S12中，控制部170向可變狹縫驅動裝置171發出指令，對驅動遮光部117b、117c驅動以使接合區域d1內的狹縫寬度Wb、Wc一致為預定的寬度。在工程S13中，控制部170驅動基板載置台140，藉由照度感測器150來測定接合區域d1內的掃描方向(Y方向)的累計照度。 In the process S11, the control unit 170 issues an instruction to the light-shielding blade driving device 155, and drives the light-shielding blade 161 into the projection area PA as shown in FIG. Engineering S12, the control unit 170 instructs the drive apparatus 171 to variable slit, driving the light shielding portions 117b, 117c to drive the engagement region in a slit width d Wb, Wc is consistent with a predetermined width. Engineering S13, the control unit 170 drives the substrate mounting table 140, an illuminance sensor 150 is determined by the engagement direction in the scanning region d 1 (Y direction) cumulative illuminance.
在工程S14中，控制部170向照度分佈調整裝置171發出指令，將接合區域d1內的掃描方向的累計照度調整為預定的值。在工程S15中，控制部170驅動基 板載置台140，藉由照度感測器150測定非接合區域d10內的掃描方向的累計照度。在工程S16中，控制部170向可變狹縫驅動裝置171發出指令，調整非接合區域d10內的狹縫寬度Wd~Wq，將非接合區域d10內的掃描方向的累計照度調整為預定的值。在工程S17中，控制部170驅動基板載置台140，使基板W配置於預定的位置之後，進行第一次掃描曝光。 Engineering S14, the control unit 170 to the illuminance distribution adjusting means 171 instructs the scanning direction engaging cumulative illuminance in the area d 1 is adjusted to a predetermined value. Engineering S15, the control unit 170 drives the substrate mounting table 140, an illuminance sensor 150 measured by the accumulated non-bonded region d illuminance in the scanning direction 10. Engineering S16, the control unit 170 instructs the drive apparatus 171 to variable slit, adjusting the slit within the non-bonded region 10 of the width d Wd ~ Wq, accumulated in the scanning direction of the illumination area 10 d engaging the non-adjusted to a predetermined Value. In process S17, the control unit 170 drives the substrate mounting table 140 to place the substrate W at a predetermined position, and then performs the first scanning exposure.
在工程S21中，控制部170向遮光葉片驅動裝置155發出指令，如圖6所示將遮光葉片162驅動到投影區域PA內。在工程S22中，控制部170向可變狹縫驅動裝置171發出指令，對驅動遮光部117o、117p驅動，以使接合區域d2內的狹縫寬度Wo、Wp一致為預定的寬度。在工程S23中，控制部170驅動基板載置台140，藉由照度感測器150來測定接合區域d2內的掃描方向的累計照度。 In the process S21, the control unit 170 issues an instruction to the light-shielding blade driving device 155, and drives the light-shielding blade 162 into the projection area PA as shown in FIG. In the process S22, the control unit 170 issues a command to the variable slit driving device 171, and drives the driving light-shielding units 117o and 117p so that the slit widths Wo and Wp in the joint region d 2 are uniform to a predetermined width. In process S23, the control unit 170 drives the substrate mounting table 140 and measures the integrated illuminance in the scanning direction in the bonding area d 2 by the illuminance sensor 150.
在工程S24中，控制部170向照度分佈調整裝置171發出指令，將接合區域d2內的掃描方向的累計照度調整為預定的值。在工程S25中，控制部170驅動基板載置台140，藉由照度感測器150測定非接合區域d20內的掃描方向的累計照度。在工程S26中，控制部170向可變狹縫驅動裝置171發出指令，調整非接合區域d20內的狹縫寬度Wa~Wn，將非接合區域d20內的掃描方向的累計照度調整為預定的值。在工程S27中，控制部170驅動基板載置台140，使基板W配置到預定的位置之後，進 行第二次掃描曝光。 In process S24, the control unit 170 issues an instruction to the illuminance distribution adjustment device 171 to adjust the accumulated illuminance in the scanning direction in the bonding area d 2 to a predetermined value. Engineering S25, the control unit 170 drives the substrate mounting table 140, an illuminance sensor 150 measured by the accumulated non-bonded region d illuminance in the scanning direction 20. Engineering S26, the control unit 170 instructs the drive apparatus 171 to variable slit, adjusting the slit within the non-bonded region 20 of the width d Wa ~ Wn, the total non-joint region d illuminance in the scanning direction 20 is adjusted to a predetermined Value. In process S27, the control unit 170 drives the substrate mounting table 140 to arrange the substrate W to a predetermined position, and then performs a second scanning exposure.
如以上前述，本實施形態的曝光裝置能夠在藉由可變狹縫機構117使掃描方向(Y方向)的照度均勻化的同時，藉由接合曝光使X方向的照度均勻化。根據本實施形態，能夠提供在曝光量的均勻化的點上有利的曝光裝置。 As described above, the exposure apparatus of this embodiment can uniformize the illuminance in the scanning direction (Y direction) by the variable slit mechanism 117 and uniformize the illuminance in the X direction by bonding exposure. According to this embodiment, it is possible to provide an exposure apparatus that is advantageous in terms of the uniformity of the exposure amount.
圖13是在本發明的第二實施形態所涉及的曝光裝置中包含的照明光學系統210的XY平面圖。對與第一實施形態同樣的結構附加相同的符號，並省略說明。照明光學系統210具有兩個光源211、212、兩個橢圓鏡213、214、合成鏡215、兩個前側聚光鏡216、217、以及後側聚光鏡218。 FIG. 13 is an XY plan view of the illumination optical system 210 included in the exposure apparatus according to the second embodiment of the present invention. The same components as those in the first embodiment are assigned the same reference numerals, and descriptions thereof are omitted. The illumination optical system 210 includes two light sources 211 and 212, two elliptical mirrors 213 and 214, a composite mirror 215, two front-side condensers 216 and 217, and a rear-side condenser 218.
光源211的發光部配置於橢圓鏡213的第一焦點，從光源211發出的光束由橢圓鏡213反射之後，被合成鏡215偏向而聚光到橢圓鏡213的第二焦點面F1。同樣地，光源212的發光部配置於橢圓鏡214的第一焦點，從光源212發出的光束由橢圓鏡214反射之後，被合成鏡215偏向而聚光到橢圓鏡214的第二焦點面F2。 The light emitting portion of the light source 211 is disposed at the first focus of the elliptical mirror 213. After the light beam emitted from the light source 211 is reflected by the elliptical mirror 213, it is deflected by the combining mirror 215 and condensed onto the second focal plane F1 of the elliptical mirror 213. Similarly, the light emitting portion of the light source 212 is disposed at the first focus of the elliptical mirror 214. After the light beam emitted from the light source 212 is reflected by the elliptical mirror 214, it is deflected by the combining mirror 215 and condensed onto the second focal plane F2 of the elliptical mirror 214.
前側聚光鏡216或者前側聚光鏡217分別與後側聚光鏡218一起發揮與第一實施形態的第一聚光鏡113等同的作用。前側聚光鏡216和後側聚光鏡218使由橢圓鏡213聚光到第二焦點面F1的具有擴展的光束的 像，放大並成像於複眼透鏡114的入射面。同樣地，前側聚光鏡217和後側聚光鏡218使由橢圓鏡214聚光到第二焦點面F2的具有擴展的光束的像放大並成像於複眼透鏡114的入射面。 The front condenser 216 or the front condenser 217 and the rear condenser 218 each perform the same function as the first condenser 113 of the first embodiment. The front condenser 216 and the rear condenser 218 magnify and form an image of the expanded light beam focused by the elliptical mirror 213 onto the second focal plane F1 on the incident surface of the fly-eye lens 114. Similarly, the front condenser 217 and the rear condenser 218 magnify and form an image of the expanded light beam focused by the elliptical mirror 214 to the second focal plane F2 on the incident surface of the fly-eye lens 114.
在複眼透鏡114的入射面，由從光源211發出的光束所形成的像的位置和由從光源212發出的光束所形成的像的位置重合而成為一個像。在後側聚光鏡218的入射瞳P上，偏離中心地配置有前側聚光鏡216的出射瞳、前側聚光鏡217的出射瞳。此時，後側聚光鏡218的入射瞳P面相對複眼透鏡114的入射面，在光學上為瞳面和像面的關係，相對複眼透鏡114的出射面在光學上為共軛的關係。因此，後側聚光鏡218利用相對入射瞳P面偏離中心所形成的光源211、212的光束，對複眼透鏡114的入射面進行科勒照明。 On the incident surface of the fly-eye lens 114, the position of the image formed by the light beam emitted from the light source 211 and the position of the image formed by the light beam emitted from the light source 212 overlap to form an image. An exit pupil of the front condenser 216 and an exit pupil of the front condenser 217 are arranged off-center on the entrance pupil P of the rear condenser 218. At this time, the entrance pupil P plane of the rear condenser 218 is optically related to the pupil plane and the image plane with respect to the entrance plane of the fly-eye lens 114, and the exit plane of the fly-eye lens 114 is optically conjugated. Therefore, the rear condenser 218 uses the light beams 211 and 212 formed off-center with respect to the plane P of the incident pupil to perform Kohler illumination on the incident surface of the fly-eye lens 114.
圖14的(A)~(E)是表示投影區域PA和投影區域PA內的接合寬度的關係、以及投影區域PA內的累計照度的圖形。圖14的(A)~(E)的左邊的圖形是非掃描方向的照度分佈。另一方面，圖14的(A)~(E)的右邊的圖形是掃描方向的照度分佈。 14A to 14E are graphs showing the relationship between the projection area PA and the joint width in the projection area PA, and the cumulative illuminance in the projection area PA. The graphs on the left of (A) to (E) in FIG. 14 are illuminance distributions in the non-scanning direction. On the other hand, the graphs to the right of (A) to (E) in FIG. 14 are illuminance distributions in the scanning direction.
圖14的(A)、(B)表示僅使圖13所示的兩個光源之中，使單個光源點亮的情況下的投影區域PA內的掃描方向的累計照度。在用來自偏離中心的複數光源的光束對複眼透鏡114的入射面進行科勒照明、並且使用複眼透鏡114對照射面進行科勒照明的照明光學系統中， 在僅用單個光源進行照明的情況下，照射面的照度分佈成為傾斜的分佈。 FIGS. 14A and 14B show the cumulative illuminance in the scanning direction in the projection area PA when only a single light source is turned on among the two light sources shown in FIG. 13. In an illumination optical system that uses a light beam from a plurality of off-center light sources to illuminate the incident surface of the fly-eye lens 114 and uses the fly-eye lens 114 to illuminate the irradiated surface, when only a single light source is used for illumination, The illuminance distribution of a surface becomes a sloped distribution.
圖14的(A)表示僅使光源211發光的情況，投影區域PA內的掃描方向的累計照度具有向右下降的傾向。圖14的(B)表示僅使光源212發光的情況，投影區域PA內的掃描方向的累計照度具有向右上升的傾向。 FIG. 14A shows a case where only the light source 211 is made to emit light, and the cumulative illuminance in the scanning direction in the projection area PA tends to decrease to the right. FIG. 14B shows a case where only the light source 212 is made to emit light, and the cumulative illuminance in the scanning direction in the projection area PA tends to rise to the right.
圖14的(C)、(D)是使兩個光源同時點亮的情況，用一點鏈線表示藉由光源211所得到的累計照度，用虛線表示藉由光源212所得到的累計照度。圖14的(C)是光源211和光源212的輸出相等的情況，藉由兩個光源得到的累計照度如實線所示為平坦的分佈。圖14的(D)是將光源211的輸出設定為大於光源212的輸出的情況，藉由兩個光源得到的累計照度如實線所示為向右下降的分佈。 (C) and (D) of FIG. 14 are the cases where two light sources are turned on at the same time. The accumulated illuminance obtained by the light source 211 is indicated by a dot chain line, and the accumulated illuminance obtained by the light source 212 is indicated by a dotted line. (C) of FIG. 14 is a case where the outputs of the light source 211 and the light source 212 are equal, and the cumulative illuminance obtained by the two light sources is a flat distribution as shown by the solid line. (D) of FIG. 14 is a case where the output of the light source 211 is set to be greater than the output of the light source 212, and the cumulative illuminance obtained by the two light sources is a distribution falling to the right as shown by the solid line.
這樣，本實施形態的照明光學系統能夠藉由兩個光源的輸出平衡，使照射面的照度分佈按照一次曲線狀作變化。 In this way, the illumination optical system of this embodiment can change the illuminance distribution of the irradiation surface according to a linear curve by the output balance of the two light sources.
因此，在投影區域PA內的非掃描方向的照度分佈呈圖7的(B)所示的向右上升的狀態的情況下，藉由調整兩個光源的輸出平衡，能夠使包括接合區域d1、d2的整個區域的累計照度的分佈平坦化。 Therefore, in a case where the illuminance distribution in the non-scanning direction in the projection area PA is rising to the right as shown in FIG. 7 (B), by adjusting the output balance of the two light sources, the joint area d 1 can be adjusted. , the distribution of the entire region 2 d of the cumulative illuminance planarized.
另一方面，圖14的(E)表示投影區域PA內的非掃描方向的照度分佈具有山形形狀(曲率成份)、並 且分佈的頂點向右側偏移(線性成份)的狀態。在該情況下，照度分佈調整裝置171將投影區域PA內的掃描方向的累計照度的分佈分成曲率成份和線性成份，分別獨立地調整。 On the other hand, FIG. 14 (E) shows a state where the illuminance distribution in the non-scanning direction in the projection area PA has a mountain shape (curvature component), and the apex of the distribution is shifted to the right (linear component). In this case, the illuminance distribution adjustment device 171 divides the distribution of the cumulative illuminance in the scanning direction in the projection area PA into a curvature component and a linear component, and adjusts them independently.
照度分佈調整裝置171向透鏡驅動部173發出指令，藉由使柱狀透鏡1142移動來使曝光量分佈按照二次曲線狀變化，從而補正。進而，向光源點亮部172發出指令，通過光源211以及212的輸出平衡來使累計照度的分佈線性地變化，從而補正。 The illuminance distribution adjustment device 171 issues a command to the lens driving unit 173 to move the lenticular lens 1142 to change the exposure amount distribution in a quadratic curve shape, thereby correcting it. Furthermore, a command is issued to the light source lighting unit 172, and the distribution of the integrated illuminance is linearly changed by the output balance of the light sources 211 and 212 to correct it.
這樣，本實施形態的照明光學系統210通過獨立地補正累計照度的分佈的曲率成份以及線性成份，能夠使接合區域d1、d2的累計照度的分佈同時平坦化。 As described above, the illumination optical system 210 of the present embodiment can simultaneously correct the distribution of the cumulative illuminance and the linear component of the cumulative illuminance distribution so that the distributions of the cumulative illuminance of the joint regions d 1 and d 2 can be flattened simultaneously.
接下來，使用圖15~圖17，說明使用具備本實施形態的照明光學系統210的曝光裝置來接合三個被攝區域的情況。 Next, a description will be given of a case where three exposure areas are joined using an exposure apparatus including the illumination optical system 210 of the present embodiment, with reference to FIGS. 15 to 17.
圖15的(A)以及(B)是表示進行通常曝光的情況下的投影區域PA、以及進行接合曝光的情況下的遮光的樣子的圖。在圖15的(A)所示的通常曝光時，控制部170使兩個遮光葉片161、以及162退避到圓弧形狀的投影區域PA的外側的位置。 FIGS. 15A and 15B are diagrams showing the state of light-shielding in the projection area PA in the case of normal exposure and in the case of joint exposure. During the normal exposure shown in FIG. 15A, the control unit 170 retracts the two light-shielding blades 161 and 162 to a position outside the arc-shaped projection area PA.
投影區域PA的接合區域設置於-X方向的一端和處於+方向的另一端。三個被攝區域藉由三次掃描曝光而被接合。在第一次掃描曝光時，在-X方向的一端設置接合區域d1來進行曝光，在第二次掃描曝光時，在+X 方向的另一端設置接合區域d21，並在-X方向的另一端設置接合區域d22來進行曝光。在第三次掃描曝光時，在+X方向的另一端設置接合區域d3來進行曝光。接合區域d1與接合區域d21重疊，接合區域d3與接合區域d22重疊。在使用本實施形態的照明光學系統210時，能夠將投影區域PA的兩端的接合區域d21以及d21的累計曝光量同時調整為預定的分佈。 The joint area of the projection area PA is provided at one end in the −X direction and the other end in the + direction. The three subject areas are joined by three scanning exposures. In the first scanning exposure, a bonding area d 1 is set at one end in the -X direction for exposure, and in the second scanning exposure, a bonding area d 21 is set at the other end in the + X direction, and The other end is provided with a bonding area d 22 for exposure. In the third scanning exposure, a bonding area d 3 is provided at the other end in the + X direction to perform exposure. The bonding region d 1 overlaps the bonding region d 21 , and the bonding region d 3 overlaps the bonding region d 22 . When the illumination optical system 210 of this embodiment is used, the cumulative exposure amounts of the bonding areas d 21 and d 21 at both ends of the projection area PA can be simultaneously adjusted to a predetermined distribution.
圖15的(B)是表示第二次掃描曝光時的遮光的樣子的圖。控制部170將遮光葉片162、以及161移動到投影區域PA內，將投影區域PA分割為接合區域d21、接合區域d22、非接合區域d20。在第一次掃描曝光時，與圖5同樣地遮光，在第三次掃描曝光時，與圖6同樣地遮光。 FIG. 15 (B) is a diagram showing how light is blocked during the second scanning exposure. The control unit 170 moves the light shielding blades 162 and 161 into the projection area PA, and divides the projection area PA into a bonding area d 21 , a bonding area d 22 , and a non-bonding area d 20 . In the first scanning exposure, the light is shielded in the same manner as in FIG. 5, and in the third scanning exposure, the light is shielded in the same manner as in FIG. 6.
圖16的(A)~(D)是表示如圖7的(A)所示以均勻的照度分佈對投影區域PA進行照明，並如圖5、圖6以及圖15的(B)所示遮光地進行接合曝光的情況下的，將橫軸設為X位置時的Y方向的累計曝光量(累計照度)的圖形。圖16的(A)表示如圖5所示遮光的情況下的曝光量，圖16的(B)表示如圖15的(B)所示遮光的情況下的曝光量，圖16(C)表示如圖6所示遮光的情況下的曝光量，圖16的(D)表示分別合計起來的曝光量。如圖16的(D)所示，能夠藉由接合曝光，對X位置得到均勻的累計照度。 (A) to (D) of FIG. 16 show that the projection area PA is illuminated with a uniform illuminance distribution as shown in (A) of FIG. 7, and is shielded from light as shown in (B) of FIG. 5, FIG. 6, and FIG. 15. In a case where the joint exposure is performed on the ground, a graph of the cumulative exposure amount (cumulative illuminance) in the Y direction when the horizontal axis is set to the X position. FIG. 16 (A) shows the exposure amount in the case of light-shielding as shown in FIG. 5, FIG. 16 (B) shows the exposure amount in the case of light-shielding as shown in FIG. 15 (B), and FIG. 16 (C) shows The exposure amount in the case of light-shielding is shown in FIG. 6, and (D) in FIG. 16 represents the exposure amounts added up respectively. As shown in (D) of FIG. 16, it is possible to obtain a uniform cumulative illuminance at the X position by bonding exposure.
圖17是表示通過使用本實施形態的投影光學 系統210的曝光裝置進行接合曝光的工程的流程圖。各工程藉由來自控制部170的指令被執行。接合曝光被分成工程S31的第一次掃描曝光、工程S32~S37的第二次掃描曝光、以及工程S38的第三次掃描曝光。第一次掃描曝光的工程S31與第一實施形態的工程S11~S17相同，第三次掃描曝光的工程S38與第一實施形態的工程S21~S27相同。 Fig. 17 is a flowchart showing a process of performing a joint exposure by using the exposure apparatus of the projection optical system 210 of this embodiment. Each process is executed by a command from the control unit 170. The joint exposure is divided into the first scanning exposure of the process S31, the second scanning exposure of the processes S32 to S37, and the third scanning exposure of the process S38. The process S31 for the first scanning exposure is the same as the processes S11 to S17 of the first embodiment, and the process S38 for the third scanning exposure is the same as the processes S21 to S27 of the first embodiment.
首先，在工程S31中，進行第一次掃描曝光。接下來，在工程S32中，控制部170向遮光葉片驅動裝置155發出指令，如圖15的(B)所示，將遮光葉片161、以及162驅動到投影區域PA內。在工程S33中，控制部170向可變狹縫驅動裝置171發出指令，對驅動遮光部117o、117p驅動，以使接合區域d21內的狹縫寬度Wo、Wp一致為預定的寬度。同時，控制部170向可變狹縫驅動裝置171發出指令，對驅動遮光部117b、117c驅動，以使接合區域d22內的狹縫寬度Wb、Wc一致為預定的寬度。 First, in process S31, the first scanning exposure is performed. Next, in the process S32, the control unit 170 issues a command to the light-shielding blade driving device 155, and drives the light-shielding blades 161 and 162 into the projection area PA as shown in FIG. 15 (B). In the process S33, the control unit 170 issues a command to the variable slit driving device 171, and drives the driving light-shielding units 117o and 117p so that the slit widths Wo and Wp in the joint area d 21 coincide with each other to a predetermined width. At the same time, the control unit 170 issues a command to the variable slit driving device 171 to drive the driving light-shielding units 117b and 117c so that the slit widths Wb and Wc in the joint area d 22 are uniform to a predetermined width.
在工程S34中，控制部170驅動基板載置台140，藉由照度感測器7測定接合區域d21、d22內的掃描方向的累計照度。在工程S35中，控制部170向照度分佈調整裝置171發出指令，將接合區域d21、d22內的掃描方向的累計照度調整為預定的值。 In process S34, the control unit 170 drives the substrate mounting table 140 and measures the integrated illuminance in the scanning direction in the bonding areas d 21 and d 22 by the illuminance sensor 7. In process S35, the control unit 170 issues an instruction to the illuminance distribution adjustment device 171 to adjust the cumulative illuminance in the scanning direction in the bonding areas d 21 and d 22 to a predetermined value.
此時，照度分佈調整裝置171為了調整不同的位置的兩個接合區域d21、d22內的掃描方向的累計照 度，將投影區域PA內的掃描方向的累計照度的分佈，分成曲率成份和線性成份而分別獨立地調整。 At this time, in order to adjust the cumulative illuminance in the scanning direction in the two joint regions d 21 and d 22 at different positions, the illuminance distribution adjusting device 171 divides the cumulative illuminance distribution in the scanning direction in the projection area PA into a curvature component and a linearity. The ingredients are adjusted independently.
在工程S36中，控制部170驅動基板載置台140，藉由照度感測器7測定非接合區域d20內的掃描方向的累計照度。在工程S37中，控制部170向可變狹縫驅動裝置171發出指令，調整非接合區域d20內的狹縫寬度Wd~Wn，將非接合區域d20內的掃描方向的累計照度調整為預定的值，進行第二次掃描曝光。在工程S38中，進行第三次掃描曝光。 Engineering S36, the control unit 170 drives the substrate mounting table 140, the non-engaging region 7 was measured by the illuminance sensor d cumulative illuminance in the scanning direction 20. Engineering S37, the control unit 170 instructs the drive apparatus 171 to variable slit, adjusting the slit within the non-bonded region 20 of the width d Wd ~ Wn, the total non-joint region d illuminance in the scanning direction 20 is adjusted to a predetermined Value for the second scan exposure. In the process S38, the third scanning exposure is performed.
此外，在S31、以及S38中所進行的調整可以與第一實施形態相同，但也可以如工程S35那樣分成曲率成份和線性成份而分別獨立地調整。如以上所述，藉由本實施形態，即使在接合兩個以上的區域的情況下也能夠得到與第一實施形態同樣的效果。 In addition, the adjustments performed in S31 and S38 may be the same as those in the first embodiment, but may be adjusted separately and separately into a curvature component and a linear component as in the process S35. As described above, according to this embodiment, the same effect as that of the first embodiment can be obtained even when two or more regions are joined.
此外，在上述實施形態中，遮光葉片機構160構成於基板W的正上方，但也可以構成於作為光學上共軛的位置的可變狹縫機構117、或者光罩R的正上方或正下方的曝光光的光路上。進而，也可以配置於與光罩R以及基板W在光學上共軛的位置的附近。另外，除了上述實施形態以外，也可以變更構成複眼透鏡114的柱狀透鏡1141和柱狀透鏡1143的間隔，而能夠補正可變狹縫機構117上的照射區域的Y方向的照度分佈。 In addition, in the above-mentioned embodiment, the light-shielding blade mechanism 160 is formed directly above the substrate W, but it may also be formed directly above or below the variable slit mechanism 117 which is an optically conjugated position. Exposure light on the light path. Furthermore, it may be arrange | positioned near the position optically conjugated with the mask R and the board | substrate W. In addition to the above embodiment, the interval between the lenticular lens 1141 and the lenticular lens 1143 constituting the fly-eye lens 114 may be changed to correct the illuminance distribution in the Y direction of the irradiation area on the variable slit mechanism 117.
在第二實施形態中示出了由兩個光源構成的照明系統，但也可以構成三個以上的光源，在該情況下， 至少兩個光源在與照明區域PA的掃描方向正交的方向上偏離中心的狀態下，對複眼透鏡114的入射面進行科勒照明。進而，也可以在使可變狹縫機構117的掃描方向的寬度維持一定的狀態下，藉由照度分佈調整裝置171將接合區域、非接合區域內的掃描方向的累計照度調整為預定的值。 The second embodiment shows an illumination system composed of two light sources, but three or more light sources may be configured. In this case, at least two light sources are in a direction orthogonal to the scanning direction of the illumination area PA. The off-center state is subjected to Kohler illumination on the incident surface of the fly-eye lens 114. Furthermore, the illuminance distribution adjusting device 171 may be used to adjust the cumulative illuminance in the scanning direction in the bonded area and the non-bonded area to a predetermined value while the width of the variable slit mechanism 117 in the scanning direction is maintained constant.
本實施形態所涉及的物品的製造方法例如適用於製造半導體設備等微型設備、具有細微構造的元件等物品。本實施形態的物品的製造方法包括對塗佈於基板的感光劑使用上述曝光裝置來形成潛像圖案的工程(對基板進行曝光的工程)、和使在上述工程中形成了潛像圖案的基板顯影的工程。進而，上述製造方法包括其它公知的工程(氧化、成膜、蒸鍍、摻雜、平坦化、蝕刻、光阻剝離、切割、黏接、封裝等)。本實施形態的物品的製造方法與從前的方法相比，在物品的性能、品質、生產率、生產成本中的至少一個方面是有利的。 The method for manufacturing an article according to this embodiment is suitable for manufacturing, for example, articles such as micro-devices such as semiconductor devices and components having fine structures. The method for manufacturing an article according to this embodiment includes a process of forming a latent image pattern (the process of exposing a substrate) to a photosensitive agent applied to a substrate using the exposure apparatus described above, and a substrate on which a latent image pattern is formed in the process. Development works. Furthermore, the above-mentioned manufacturing method includes other known processes (oxidation, film formation, vapor deposition, doping, planarization, etching, photoresist peeling, dicing, adhesion, packaging, etc.). Compared with the conventional method, the manufacturing method of the article of this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of an article.
以上說明了本發明的優選的實施形態，但本發明不限定於這些實施形態，能夠在其要旨的範圍內進行各種變形以及變更。 As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to these embodiment, Various deformation | transformation and change are possible within the range of the summary.
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| TWI221628B (en) * | 2000-08-25 | 2004-10-01 | Canon Kk | Illumination system and method, exposure apparatus using the same, and liquid crystal display device manufacturing method using the same |
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| WO1999054922A1 (en) * | 1998-04-22 | 1999-10-28 | Nikon Corporation | Exposure method and exposure system |
| WO2000028380A1 (en) * | 1998-11-06 | 2000-05-18 | Nikon Corporation | Exposure method and exposure apparatus |
| JP2000286188A (en) * | 1999-03-31 | 2000-10-13 | Nikon Corp | Projection aligner, substrate history-retaining apparatus, and storage medium with substrate history retention program stored therein |
| JP2001313250A (en) * | 2000-02-25 | 2001-11-09 | Nikon Corp | Aligner, its adjusting method, and method for fabricating device using aligner |
| JP2004325872A (en) * | 2003-04-25 | 2004-11-18 | Fuji Photo Film Co Ltd | Exposure apparatus and exposure method |
| JP2004335864A (en) * | 2003-05-09 | 2004-11-25 | Nikon Corp | Aligner and exposure method |
| JP5184808B2 (en) * | 2007-04-03 | 2013-04-17 | Ｎｓｋテクノロジー株式会社 | Exposure method and exposure apparatus |
| JP2013238670A (en) * | 2012-05-11 | 2013-11-28 | Canon Inc | Exposure apparatus, exposure method, method for manufacturing device, and aperture plate |
| JP6015930B2 (en) * | 2012-12-07 | 2016-10-26 | 株式会社ニコン | Exposure method, exposure apparatus, and device manufacturing method |
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