TWI661760B - Plug mechanism and electronic device - Google Patents
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- TWI661760B TWI661760B TW106136893A TW106136893A TWI661760B TW I661760 B TWI661760 B TW I661760B TW 106136893 A TW106136893 A TW 106136893A TW 106136893 A TW106136893 A TW 106136893A TW I661760 B TWI661760 B TW I661760B
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Abstract
本發明提供一種插拔機構，用以將一電子元件與一散熱模組連接。前述插拔機構包括一導引元件和一承載件，其中導引元件具有一第一導槽，且承載件具有一第一凸出部。前述第一凸出部可滑動地設置於第一導槽中。當第一凸出部位於第一導槽中之一第一位置時，電子元件之一表面接觸散熱模組。當第一凸出部由第一位置沿第一導槽移動至一第二位置時，電子元件之前述表面相對於散熱模組傾斜。 The invention provides a plugging mechanism for connecting an electronic component to a heat dissipation module. The insertion mechanism includes a guiding member and a carrier, wherein the guiding member has a first guiding groove, and the carrying member has a first protruding portion. The first protruding portion is slidably disposed in the first guiding groove. When the first protruding portion is located at a first position in the first guiding groove, one surface of the electronic component contacts the heat dissipation module. When the first protruding portion is moved from the first position along the first guiding groove to a second position, the aforementioned surface of the electronic component is inclined with respect to the heat dissipation module.
Description
本發明係有關於一種電子裝置。更具體地來說，本發明有關於一種具有插拔機構的電子裝置。 The present invention relates to an electronic device. More particularly, the present invention relates to an electronic device having a plug mechanism.
一般而言，電子元件在運作時會產生熱能，而為了使前述電子元件能穩定的狀態下運作，必須使用散熱模組來將產生的熱能帶走，以使電子元件保持在低溫，避免其過熱而無法運作。然而，為了使電子元件能與散熱模組緊密結合，通常會使用鎖固元件(例如螺絲)來將電子元件固定，如此一來，當電子元件需維修或替換時，將需要進行繁複的拆裝步驟。因此，如何解決前述問題始成一重要之課題。 In general, electronic components generate thermal energy during operation, and in order to operate the aforementioned electronic components in a stable state, a heat dissipation module must be used to carry the generated thermal energy away, so that the electronic components are kept at a low temperature to avoid overheating. It can't work. However, in order to make the electronic components tightly coupled with the heat dissipation module, the locking components (such as screws) are usually used to fix the electronic components, so that when the electronic components need to be repaired or replaced, complicated assembly and disassembly will be required. step. Therefore, how to solve the above problems has become an important issue.
為了解決上述習知之問題點，本發明提供一種插拔機構，用以將一電子元件與一散熱模組連接。前述插拔機構包括一導引元件和一承載件，其中導引元件具有一第一導槽，且承載件具有一第一凸出部。前述第一凸出部可滑動地設置於第一導槽中。當第一凸出部位於第一導槽中之一第一位置時，電子元件之一表面接觸散熱模組。當第一凸出部由第一位置沿第一導槽移動至一第二位置時，電子元件之前述表面相對於散 熱模組傾斜。 In order to solve the above problems, the present invention provides a plugging mechanism for connecting an electronic component to a heat dissipation module. The insertion mechanism includes a guiding member and a carrier, wherein the guiding member has a first guiding groove, and the carrying member has a first protruding portion. The first protruding portion is slidably disposed in the first guiding groove. When the first protruding portion is located at a first position in the first guiding groove, one surface of the electronic component contacts the heat dissipation module. When the first protrusion moves from the first position along the first guide groove to a second position, the aforementioned surface of the electronic component is opposite to the dispersion The thermal module is tilted.
本發明一實施例中，前述第一導槽具有一第一限位部，形成於第一導槽之內壁上。 In an embodiment of the invention, the first guiding groove has a first limiting portion formed on an inner wall of the first guiding groove.
本發明一實施例中，前述第一導槽具有一L字形結構。 In an embodiment of the invention, the first guiding groove has an L-shaped structure.
本發明一實施例中，當第一凸出部由第一位置移動至第二位置時，第一凸出部係沿一第一方向移動，且當第一凸出部由第二位置移動至一第三位置時，第一凸出部係沿一第二方向移動，其中第一方向大致垂直於第二方向。 In an embodiment of the invention, when the first protruding portion is moved from the first position to the second position, the first protruding portion moves in a first direction, and when the first protruding portion moves from the second position to the second position In a third position, the first projection moves in a second direction, wherein the first direction is substantially perpendicular to the second direction.
本發明一實施例中，前述導引元件更具有一第二導槽，且承載件更具有一第二凸出部，可滑動地設置於第二導槽中。 In an embodiment of the invention, the guiding element further has a second guiding groove, and the carrying member further has a second protruding portion slidably disposed in the second guiding groove.
本發明一實施例中，前述第二導槽具有一長條形結構，且其長軸方向大致平行於第二方向。 In an embodiment of the invention, the second guiding groove has an elongated structure, and a longitudinal direction thereof is substantially parallel to the second direction.
本發明一實施例中，前述第二導槽具有一第二限位部，形成於第二導槽之內壁上。 In an embodiment of the invention, the second guiding groove has a second limiting portion formed on the inner wall of the second guiding groove.
本發明一實施例中，前述第一位置與第二導槽之間的距離小於第三位置與第二導槽之間的距離。 In an embodiment of the invention, the distance between the first position and the second guiding slot is smaller than the distance between the third position and the second guiding slot.
本發明一實施例中，前述承載件更包括一開口和一擋止部，分別設置於該承載件的相反側。 In an embodiment of the invention, the carrier further includes an opening and a stopping portion respectively disposed on opposite sides of the carrier.
本發明一實施例中，當該電子元件之該表面相對於該散熱模組傾斜時，該表面和該散熱模組之間形成2~10度的夾角。 In an embodiment of the invention, when the surface of the electronic component is inclined relative to the heat dissipation module, an angle of 2 to 10 degrees is formed between the surface and the heat dissipation module.
本發明一實施例中，前述導引元件和該承載件包 括橡膠或塑膠。 In an embodiment of the invention, the guiding element and the carrier package Includes rubber or plastic.
本發明更提供一種電子裝置，包括前述插拔機構、一散熱模組、以及一連接器。當第一凸出部位於第一位置或第二位置時，電子元件與連接器電性連接。 The invention further provides an electronic device comprising the plugging mechanism, a heat dissipating module, and a connector. When the first protrusion is in the first position or the second position, the electronic component is electrically connected to the connector.
本發明一實施例中，前述第一導槽具有一L字形結構，當第一凸出部由第一位置移動至第二位置時，第一凸出部係沿一第一方向移動，且當第一凸出部由該第二位置移動至一第三位置時，第一凸出部係沿一第二方向移動，且電子元件與連接器分離，其中第一方向大致垂直於該第二方向。 In an embodiment of the invention, the first guiding groove has an L-shaped structure, and when the first protruding portion is moved from the first position to the second position, the first protruding portion moves along a first direction, and when When the first protruding portion is moved from the second position to the third position, the first protruding portion moves in a second direction, and the electronic component is separated from the connector, wherein the first direction is substantially perpendicular to the second direction .
本發明一實施例中，前述散熱模組包括複數個散熱鰭片。 In an embodiment of the invention, the heat dissipation module includes a plurality of heat dissipation fins.
本發明一實施例中，前述散熱模組更包括一軟性導熱片，設置於散熱鰭片和電子元件之間。 In an embodiment of the invention, the heat dissipation module further includes a flexible heat conductive sheet disposed between the heat dissipation fin and the electronic component.
10‧‧‧插拔機構 10‧‧‧plugging mechanism
20‧‧‧連接器 20‧‧‧Connector
30‧‧‧散熱模組 30‧‧‧ Thermal Module
31‧‧‧軟性導熱片 31‧‧‧Soft thermal sheet
32‧‧‧導熱板 32‧‧‧heat conducting plate
33‧‧‧散熱鰭片 33‧‧‧Heat fins
100‧‧‧承載件 100‧‧‧ Carrying parts
110‧‧‧底板 110‧‧‧floor
111‧‧‧第一側邊 111‧‧‧First side
112‧‧‧第二側邊 112‧‧‧Second side
113‧‧‧第三側邊 113‧‧‧ third side
114‧‧‧第四側邊 114‧‧‧ fourth side
120‧‧‧側壁 120‧‧‧ side wall
130‧‧‧擋止部 130‧‧‧stops
140‧‧‧延伸部 140‧‧‧Extension
150‧‧‧第一凸出部 150‧‧‧First bulge
160‧‧‧第二凸出部 160‧‧‧second bulge
170‧‧‧開口 170‧‧‧ openings
200‧‧‧導引元件 200‧‧‧ guiding elements
210‧‧‧第一導槽 210‧‧‧First guide channel
211‧‧‧第一段部 211‧‧‧First Section
211a‧‧‧第一限位部 211a‧‧‧First Limitation Department
212‧‧‧第二段部 212‧‧‧The second paragraph
220‧‧‧第二導槽 220‧‧‧Second guiding channel
221‧‧‧第二限位部 221‧‧‧Second Limitation
230‧‧‧頂面 230‧‧‧ top surface
C‧‧‧電子元件 C‧‧‧Electronic components
C1‧‧‧表面 C1‧‧‧ surface
E‧‧‧電子裝置 E‧‧‧Electronic device
E1‧‧‧連接孔 E1‧‧‧ connection hole
E2‧‧‧穿孔 E2‧‧‧ perforation
第1A圖係表示本發明一實施例之電子裝置示意圖。 Fig. 1A is a schematic view showing an electronic device according to an embodiment of the present invention.
第1B圖係表示電子裝置於另一視角的示意圖。 Figure 1B is a schematic diagram showing the electronic device in another perspective.
第2A、2B圖係表示本發明一實施例中之插拔機構的***圖。 2A and 2B are views showing an exploded view of the plugging mechanism in an embodiment of the present invention.
第3A圖係表示本發明一實施例中，電子元件的表面貼附於散熱模組的示意圖。 Fig. 3A is a schematic view showing the surface of an electronic component attached to a heat dissipation module in an embodiment of the invention.
第3B圖係表示本發明一實施例中，第一凸出部位於第一導槽之第一位置的示意圖。 Figure 3B is a schematic view showing the first projection in the first position of the first guide groove in an embodiment of the present invention.
第4A圖係表示本發明一實施例中，電子元件的表面相對 於散熱模組傾斜的示意圖。 Figure 4A shows an embodiment of the invention in which the surface of the electronic component is relatively Schematic diagram of the tilt of the heat sink module.
第4B圖係表示本發明一實施例中，第一凸出部沿第一導槽朝第一方向移動的示意圖。 Fig. 4B is a schematic view showing the first projection moving in the first direction along the first guide groove in an embodiment of the invention.
第5A圖係表示本發明一實施例中，電子元件自連接器分離的示意圖。 Fig. 5A is a view showing the separation of electronic components from the connector in an embodiment of the present invention.
第5B圖係表示本發明一實施例中，第一凸出部移動至第一導槽之第二位置的示意圖。 Figure 5B is a schematic view showing the movement of the first projection to the second position of the first guide groove in an embodiment of the present invention.
第6圖係表示本發明另一實施例中之插拔機構的***圖。 Figure 6 is an exploded view showing the plugging mechanism in another embodiment of the present invention.
以下說明本發明實施例之插拔機構和具有前述插拔機構的電子裝置。然而，可輕易了解本發明實施例提供許多合適的發明概念而可實施於廣泛的各種特定背景。所揭示的特定實施例僅僅用於說明以特定方法使用本發明，並非用以侷限本發明的範圍。 The plugging mechanism of the embodiment of the present invention and the electronic device having the above plugging mechanism will be described below. However, it will be readily understood that the embodiments of the present invention are susceptible to many specific embodiments of the invention and can The specific embodiments disclosed are merely illustrative of the invention, and are not intended to limit the scope of the invention.
除非另外定義，在此使用的全部用語(包括技術及科學用語)具有與此篇揭露所屬之一般技藝者所通常理解的相同涵義。能理解的是這些用語，例如在通常使用的字典中定義的用語，應被解讀成具有一與相關技術及本揭露的背景或上下文一致的意思，而不應以一理想化或過度正式的方式解讀，除非在此特別定義。 Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning meaning It will be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the context or context of the present disclosure, and should not be in an idealized or overly formal manner. Interpretation, unless specifically defined herein.
首先請參閱第1A、1B圖，本發明一實施例之插拔機構10係裝設於一電子裝置E內部，以使一電子元件C可以藉由可拆卸的方式與電子裝置E連接。在電子元件C與電子裝置E連接後，使用者可通過電子裝置E後方的連接孔E1將外部設備連接至電子裝置E，使電子元件C可通過連接孔E1輸 出訊號至前述外部設備、或自前述外部設備接收訊號。前述電子元件C可為模組化電腦(computer-on-module,COM)，例如電腦卡(Compute Card)，而前述電子裝置E則可為工業用個人電腦(Industrial Personal Computer,IPC)。 The first embodiment of the present invention is shown in FIG. After the electronic component C is connected to the electronic device E, the user can connect the external device to the electronic device E through the connection hole E1 at the rear of the electronic device E, so that the electronic component C can be transmitted through the connection hole E1. The signal is sent to or received from the external device. The electronic component C may be a computer-on-module (COM), such as a computer card (Compute Card), and the electronic device E may be an Industrial Personal Computer (IPC).
如第2A、2B圖所示，插拔機構10主要包括一承載件100和兩個導引元件200。其中，承載件100包括一底板110、兩個側壁120、至少一擋止部130、一延伸部140、兩個第一凸出部150、兩個第二凸出部160、以及一開口170。 As shown in FIGS. 2A and 2B, the insertion mechanism 10 mainly includes a carrier 100 and two guiding members 200. The carrier 100 includes a bottom plate 110, two side walls 120, at least one stopping portion 130, an extending portion 140, two first protruding portions 150, two second protruding portions 160, and an opening 170.
前述底板110大致為一矩形結構，並具有一第一側邊111、一第二側邊112、一第三側邊113和一第四側邊114。第一側邊111相反於第二側邊112，且前述兩個導引元件200分別鄰近第一側邊111和第二側邊112。第三側邊113和第四側邊114連接第一側邊111和第二側邊112，且第三側邊113相反於第四側邊114。 The bottom plate 110 has a substantially rectangular structure and has a first side 111, a second side 112, a third side 113 and a fourth side 114. The first side 111 is opposite to the second side 112, and the two guiding elements 200 are adjacent to the first side 111 and the second side 112, respectively. The third side 113 and the fourth side 114 connect the first side 111 and the second side 112, and the third side 113 is opposite to the fourth side 114.
承載件100的兩個側壁120分別連接第一側邊111和第二側邊112，並具有對應電子元件C之外型的內凹結構，且開口170形成於第三側邊113處。前述電子元件C可穿過開口170並沿著側壁120的內凹結構朝向第四側邊114滑動，進而被承載件100所承載。應注意的是，擋止部130連接底板110的第四側邊114，且其位置對應於前述內凹結構。因此，當電子元件C沿著側壁120的內凹結構滑動至一預定位置時，會被擋止部130所阻擋，藉此可避免電子元件C自第四側邊114滑出而撞擊電子裝置E內的其他元件。再者，藉由側壁120的內凹結構，可防止電子元件C和承載件100在Y軸方向和Z軸 方向上產生相對位移。 The two side walls 120 of the carrier 100 are respectively connected to the first side 111 and the second side 112, and have a concave structure corresponding to the outer shape of the electronic component C, and the opening 170 is formed at the third side 113. The aforementioned electronic component C can pass through the opening 170 and slide along the concave structure of the sidewall 120 toward the fourth side 114 to be carried by the carrier 100. It should be noted that the stop portion 130 is coupled to the fourth side edge 114 of the bottom plate 110 and has a position corresponding to the aforementioned concave structure. Therefore, when the electronic component C slides along the concave structure of the sidewall 120 to a predetermined position, it is blocked by the stopper 130, thereby preventing the electronic component C from sliding out of the fourth side 114 and striking the electronic device E. Other components within. Moreover, by the concave structure of the side wall 120, the electronic component C and the carrier 100 can be prevented from being in the Y-axis direction and the Z-axis. Relative displacement occurs in the direction.
請繼續參閱第2A、2B圖，延伸部140連接第三側邊113，並朝向遠離第三側邊113的方向延伸。第一凸出部150和第二凸出部160則設置於第一側邊111和第二側邊112上，且第一凸出部150鄰近第三側邊113，第二凸出部160鄰近第四側邊114。 Continuing to refer to FIGS. 2A and 2B , the extension 140 is coupled to the third side 113 and extends away from the third side 113 . The first protruding portion 150 and the second protruding portion 160 are disposed on the first side edge 111 and the second side edge 112, and the first protruding portion 150 is adjacent to the third side edge 113, and the second protruding portion 160 is adjacent to the first protruding portion 150. The fourth side 114.
導引元件200具有一第一導槽210和一第二導槽220，前述第一凸出部150可進入第一導槽210中並沿第一導槽210滑動，且前述第二凸出部160可進入第二導槽220中並沿第二導槽220滑動。 The guiding element 200 has a first guiding slot 210 and a second guiding slot 220. The first protruding portion 150 can enter the first guiding slot 210 and slide along the first guiding slot 210, and the second protruding portion The 160 can enter the second guide slot 220 and slide along the second guide slot 220.
第一導槽210具有一L字形結構，包括一第一段部211和一第二段部212，兩者沿一第一方向排列，且第一段部211與導引元件200之頂面230之間的距離小於第二段部212與導引元件200之頂面230之間的距離。第二段部212的長軸方向平行於一第二方向，且第一方向大致垂直於第二方向。此外，第一導槽210於第一段部211的壁面上更具有一第一限位部211a。 The first guiding slot 210 has an L-shaped structure, and includes a first segment 211 and a second segment 212, which are arranged along a first direction, and the first segment 211 and the top surface 230 of the guiding component 200 The distance between them is less than the distance between the second section 212 and the top surface 230 of the guiding element 200. The long axis direction of the second segment 212 is parallel to a second direction, and the first direction is substantially perpendicular to the second direction. In addition, the first guiding groove 210 further has a first limiting portion 211a on the wall surface of the first segment portion 211.
第二導槽220具有一長條形結構，且其長軸方向亦平行於前述第二方向。第二導槽220與導引元件200之頂面230之間的距離與第一段部211與導引元件200之頂面213之間的距離大致相同，且第二導槽220內部壁面上亦具有一第二限位部221。 The second guiding groove 220 has an elongated structure, and its long axis direction is also parallel to the aforementioned second direction. The distance between the second guiding slot 220 and the top surface 230 of the guiding component 200 is substantially the same as the distance between the first segment 211 and the top surface 213 of the guiding component 200, and the inner wall of the second guiding slot 220 is also There is a second limiting portion 221 .
以下說明前述插拔機構10的移動方式。首先請一併參閱第1A、3A、3B圖，當電子元件C設置於承載件100上， 且第一凸出部150位於第一導槽210的第一位置時，第一凸出部150會容置於第一段部211中，且第一凸出部150和第二凸出部160可分別被第一限位部211a和第二限位部221所固定。電子元件C與電子裝置E中的連接器20電性連接，且電子元件C的表面C1將緊貼電子裝置E中的散熱模組30，使其產生的熱能可經由散熱模組30發散。 The manner of movement of the aforementioned insertion and removal mechanism 10 will be described below. First, please refer to the drawings 1A, 3A, and 3B. When the electronic component C is disposed on the carrier 100, When the first protruding portion 150 is located at the first position of the first guiding groove 210, the first protruding portion 150 is received in the first segment portion 211, and the first protruding portion 150 and the second protruding portion 160 are The first limiting portion 211a and the second limiting portion 221 are respectively fixed. The electronic component C is electrically connected to the connector 20 of the electronic device E, and the surface C1 of the electronic component C will be in close contact with the heat dissipation module 30 of the electronic device E, so that the thermal energy generated by the electronic component C can be dissipated through the heat dissipation module 30.
具體而言，散熱模組30可包括一軟性導熱片31、一導熱板32、以及複數個散熱鰭片33，其中軟性導熱片31設置於電子元件C和導熱板32之間，且導熱板32設置於軟性導熱片31和散熱鰭片33之間。當第一凸出部150位於第一導槽210的第一位置時，電子元件C的表面C1會接觸軟性導熱片31。由於軟性導熱片31具有可撓性，因此可確保兩者之間不具有間隙，電子元件C產生的熱能可均勻地傳送至散熱鰭片33。 Specifically, the heat dissipation module 30 can include a flexible heat conductive sheet 31 , a heat conductive plate 32 , and a plurality of heat dissipation fins 33 , wherein the flexible heat conductive sheet 31 is disposed between the electronic component C and the heat conductive plate 32 , and the heat conductive plate 32 It is disposed between the flexible thermal conductive sheet 31 and the heat dissipation fins 33. When the first projection 150 is located at the first position of the first guide groove 210, the surface C1 of the electronic component C contacts the flexible thermal conductive sheet 31. Since the flexible thermally conductive sheet 31 has flexibility, it is ensured that there is no gap between the two, and the thermal energy generated by the electronic component C can be uniformly transmitted to the heat dissipation fins 33.
如第1A、4A、4B圖所示，當使用者欲維修或替換電子元件C時，可施力朝向-Z軸方向推動由電子裝置E前方穿孔E2穿出的延伸部140。此時，第一凸出部150會沿著第一段部211滑動，並由第一位置沿第一方向移動至一第二位置。 As shown in FIGS. 1A, 4A, and 4B, when the user wants to repair or replace the electronic component C, the extension portion 140 that is passed through the front hole E2 of the electronic device E can be urged toward the -Z-axis direction. At this time, the first protruding portion 150 slides along the first segment portion 211 and moves from the first position to the first position in the first direction.
在前述移動過程中，承載件100和電子元件C會繞第二凸出部160旋轉，因此電子元件C的表面C1將自散熱模組30分離且相對於散熱模組30傾斜，並在表面C1和散熱模組30之間形成一夾角。舉例而言，前述夾角可介於2-10度(例如2-5度)。 During the foregoing movement, the carrier 100 and the electronic component C are rotated around the second protrusion 160, so the surface C1 of the electronic component C is separated from the heat dissipation module 30 and inclined with respect to the heat dissipation module 30, and is on the surface C1. An angle is formed between the heat dissipation module 30 and the heat dissipation module 30. For example, the aforementioned angle may be between 2-10 degrees (eg, 2-5 degrees).
此外，前述軟性導熱片31具有黏著力，且較佳的是，在與電子元件C接觸的面上的黏著力相異於在與導熱板32接觸的面上的黏著力。具體而言，軟性導熱片31在與電子元件C接觸的面上的黏著力遠小於與導熱板32接觸的面上的黏著力，因此，可確保導熱片31和導熱板32的接觸，更可避免軟性導熱片31自導熱板32剝離，使電子元件C的表面C1可以從散熱模組30的導熱片31分離。 Further, the aforementioned flexible thermally conductive sheet 31 has an adhesive force, and it is preferable that the adhesive force on the surface in contact with the electronic component C is different from the adhesive force on the surface in contact with the heat conduction plate 32. Specifically, the adhesion of the flexible thermally conductive sheet 31 on the surface in contact with the electronic component C is much smaller than the adhesion on the surface in contact with the thermal conductive plate 32, and therefore, the contact between the thermally conductive sheet 31 and the thermally conductive plate 32 can be ensured, and The flexible thermally conductive sheet 31 is prevented from being peeled off from the heat conducting plate 32, so that the surface C1 of the electronic component C can be separated from the thermally conductive sheet 31 of the heat dissipation module 30.
接著，如第5A、5B圖所示，使用者可施力朝向X軸方向推動承載件100的延伸部140，第一凸出部150會沿著第二段部212滑動，並由第二位置沿第二方向移動至一第三位置，且第二凸出部160同樣將沿第二導槽220滑動。如此一來，電子元件C可與連接器20分離，使用者可輕易地從承載件100上取出電子元件C。 Next, as shown in FIGS. 5A and 5B, the user can urge the extension portion 140 of the carrier 100 toward the X-axis direction, and the first protrusion 150 slides along the second segment 212 and is rotated by the second position. Moving in a second direction to a third position, and the second protrusion 160 will also slide along the second channel 220. As a result, the electronic component C can be separated from the connector 20, and the user can easily take out the electronic component C from the carrier 100.
當使用者欲使電子元件C與電子裝置E連接時，僅需依前述步驟的相反步驟推動承載件100的延伸部140，即可使電子元件C與連接器20電性連接並接觸散熱模組30。 When the user wants to connect the electronic component C to the electronic device E, the electronic component C and the connector 20 can be electrically connected to the thermal module by pushing the extension portion 140 of the carrier 100 in the reverse step of the foregoing steps. 30.
需特別說明的是，於本實施例中，承載件100和導引元件200可包括橡膠或塑膠，例如聚碳酸酯(polycarbonate,PC)、丙烯腈-丁二烯-苯乙烯共聚物(Acrylonitrile Butadiene Styrene,ABS)、或其組合，藉以避免第一、第二凸出部150、160沿第一、第二導槽210、220滑動時產生刮屑而導致承載件100無法移動或電子裝置E中其他元件損壞的情形。 It should be particularly noted that in the present embodiment, the carrier 100 and the guiding member 200 may comprise rubber or plastic, such as polycarbonate (PC), acrylonitrile-butadiene-styrene (Acrylonitrile Butadiene). Styrene, ABS), or a combination thereof, to prevent the first and second protrusions 150, 160 from generating scraping debris when sliding along the first and second guiding grooves 210, 220, thereby causing the carrier 100 to be unable to move or in the electronic device E Other components are damaged.
請參閱第6圖，於本發明另一實施例中，承載件100上的第一凸出部150和第二凸出部160亦具有沿第二方向 延伸的長條狀結構。如此一來，可增加第一凸出部150和第二凸出部160的強度，避免滑動或移動時發生斷裂。 Referring to FIG. 6 , in another embodiment of the present invention, the first protrusion 150 and the second protrusion 160 on the carrier 100 also have a second direction. Extended strip structure. In this way, the strength of the first protruding portion 150 and the second protruding portion 160 can be increased to avoid breakage when sliding or moving.
綜上所述，本發明提供一種插拔機構，包括一導引元件和一承載件，其中導引元件具有一第一導槽，且承載件具有一第一凸出部。前述第一凸出部可滑動地設置於第一導槽中。當第一凸出部位於第一導槽中之一第一位置時，電子裝置之一表面接觸散熱模組。當第一凸出部由第一位置沿第一導槽移動至一第二位置時，電子裝置之前述表面相對於散熱模組傾斜。藉由前述結構，可方便使用者快速地設置或移除電子元件，並使其確實地與散熱模組和連接器連接，而不需要拆裝額外的鎖固元件。 In summary, the present invention provides a plugging mechanism including a guiding member and a carrier member, wherein the guiding member has a first guiding groove, and the carrier has a first protruding portion. The first protruding portion is slidably disposed in the first guiding groove. When the first protruding portion is located at a first position in the first guiding groove, one surface of the electronic device contacts the heat dissipation module. When the first protruding portion moves from the first position along the first guiding groove to a second position, the aforementioned surface of the electronic device is inclined with respect to the heat dissipation module. With the foregoing structure, it is convenient for the user to quickly set or remove the electronic component and connect it to the heat dissipation module and the connector without disassembling the additional locking component.
雖然本發明的實施例及其優點已揭露如上，但應該瞭解的是，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作更動、替代與潤飾。此外，本發明之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟，任何所屬技術領域中具有通常知識者可從本發明揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟，只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本發明使用。因此，本發明之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外，每一申請專利範圍構成個別的實施例，且本發明之保護範圍也包括各個申請專利範圍及實施例的組合。 Although the embodiments of the present invention and its advantages are disclosed above, it should be understood that those skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. In addition, the scope of the present invention is not limited to the processes, machines, manufacture, compositions, devices, methods, and steps in the specific embodiments described in the specification. Any one of ordinary skill in the art can. The processes, machines, fabrications, compositions, devices, methods, and procedures that are presently or in the future are understood to be used in accordance with the present invention as long as they can perform substantially the same function or achieve substantially the same results in the embodiments described herein. Accordingly, the scope of the invention includes the above-described processes, machines, manufactures, compositions, devices, methods, and steps. In addition, the scope of each of the claims constitutes an individual embodiment, and the scope of the invention also includes the combination of the scope of the application and the embodiments.
雖然本發明以前述數個較佳實施例揭露如上，然 其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可做些許之更動與潤飾。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。此外，每個申請專利範圍建構成一獨立的實施例，且各種申請專利範圍及實施例之組合皆介於本發明之範圍內。 Although the present invention has been disclosed above in the foregoing several preferred embodiments, It is not intended to limit the invention. Those skilled in the art having the ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. In addition, each patent application scope is constructed as a separate embodiment, and various combinations of patents and combinations of embodiments are within the scope of the invention.
Claims (15)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106136893A TWI661760B (en) | 2017-10-26 | 2017-10-26 | Plug mechanism and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106136893A TWI661760B (en) | 2017-10-26 | 2017-10-26 | Plug mechanism and electronic device |
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| TW201918141A TW201918141A (en) | 2019-05-01 |
| TWI661760B true TWI661760B (en) | 2019-06-01 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM326725U (en) * | 2007-07-23 | 2008-02-01 | Wieson Technologies Co Ltd | Connector structure for vehicle |
| CN104679174A (en) * | 2013-11-26 | 2015-06-03 | 纬创资通股份有限公司 | Electronic device with function of replacing element |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM326725U (en) * | 2007-07-23 | 2008-02-01 | Wieson Technologies Co Ltd | Connector structure for vehicle |
| CN104679174A (en) * | 2013-11-26 | 2015-06-03 | 纬创资通股份有限公司 | Electronic device with function of replacing element |
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