TWI661206B - Printed circuit board for electrical testing - Google Patents
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Abstract
一種測試用電路板，係將其高頻探針結構設計成包含套管、探針及導線之結構，使該高頻探針結構之探針長度小於低頻探針構造之探針長度，俾於傳輸高頻之輸入訊號時，得以令訊號阻抗匹配一致。 A test circuit board is designed with a high-frequency probe structure including a sleeve, a probe, and a wire, so that the probe length of the high-frequency probe structure is shorter than that of the low-frequency probe structure. When transmitting high-frequency input signals, the signal impedance can be matched uniformly.
Description
本發明係有關一種電性檢測裝置，尤指一種用於電性檢測之電路板。 The invention relates to an electrical detection device, in particular to a circuit board for electrical detection.
習知探針卡包含複數相互排列之探針，各探針係對應該待測晶片上的電性接點，並使各探針接觸晶片的訊號接點，以測試晶片之電路是否正常。 The conventional probe card includes a plurality of probes arranged on each other, and each probe corresponds to an electrical contact on a chip to be tested, and each probe contacts a signal contact of the chip to test whether the circuit of the chip is normal.
隨著數位科技的進步，待測晶片的運算速度與每秒的訊號傳輸量亦日益增大，使探針卡所產生之測試訊號之頻率需滿足該待測晶片所需之高頻訊號的傳輸量需求。 With the advancement of digital technology, the computing speed of the chip under test and the amount of signal transmission per second are increasing, so that the frequency of the test signal generated by the probe card must meet the transmission of high frequency signals required by the chip under test. Volume demand.
如第1圖所示，習知探針卡1包含兩組偵測組10,10’用於同時檢測兩組待測晶片，且各該偵測組10,10’係具有訊號輸入探針結構11,11’與訊號輸出探針結構12,12’。 As shown in Fig. 1, the conventional probe card 1 includes two sets of detection groups 10, 10 'for detecting two sets of chips to be tested at the same time, and each of the detection groups 10, 10' has a signal input probe structure. 11,11 'and signal output probe structure 12,12'.
惟，習知探針卡1於測試兩組晶片時，由於右側之偵測組10’之訊號輸入探針結構11’明顯長於左側之偵測組10之訊號輸入探針結構11，造成高頻訊號傳輸阻抗無法匹配之問題。 However, when the conventional probe card 1 tests two sets of chips, the signal input probe structure 11 'of the detection group 10' on the right is significantly longer than the signal input probe structure 11 of the detection group 10 on the left, resulting in high frequency The signal transmission impedance cannot be matched.
因此，如何克服上述習知技術的種種問題，實已成目前亟欲解決的課題。 Therefore, how to overcome the problems of the above-mentioned conventional technologies has become an issue that is urgently sought to be solved at present.
鑑於上述習知技術之種種缺失，本發明揭示一種測試用電路板，係包括：一電路板本體，係定義有相鄰設置之第一偵測組及第二偵測組，用以檢測兩組待測裝置；複數第一探針結構，係設於該第一偵測組，並包含有複數探針，用以傳輸高頻之輸入訊號；複數第二探針結構，係設於該第一偵測組，並包含有複數探針，用以傳輸低頻之輸入訊號，其中，該第一探針結構之探針長度小於該第二探針結構之探針長度；複數第三探針結構，係設於該第一偵測組，並包含有複數探針，用以傳輸高頻及低頻之輸出訊號，其中，該第三探針結構之探針長度小於該第二探針結構之探針長度；複數第四探針結構，係設於該第二偵測組，並包含有複數探針，用以傳輸高頻及低頻之輸入訊號；以及複數第五探針結構，係設於該第二偵測組，並包含有複數探針，用以傳輸高頻及低頻之輸出訊號，其中，該第四探針結構之探針長度小於該第五探針結構之探針長度。 In view of the above-mentioned shortcomings in the conventional technologies, the present invention discloses a circuit board for testing, which includes: a circuit board body, which defines a first detection group and a second detection group arranged adjacently, for detecting two groups Device under test; a plurality of first probe structures are provided in the first detection group and include a plurality of probes for transmitting high-frequency input signals; a plurality of second probe structures are provided in the first The detection group includes a plurality of probes for transmitting low-frequency input signals, wherein a probe length of the first probe structure is shorter than a probe length of the second probe structure; a plurality of third probe structures, It is located in the first detection group and includes a plurality of probes for transmitting high-frequency and low-frequency output signals. The probe length of the third probe structure is shorter than that of the second probe structure. Length; a plurality of fourth probe structures are provided in the second detection group and include a plurality of probes for transmitting high frequency and low frequency input signals; and a plurality of fifth probe structures are provided in the first Two detection groups, including multiple probes for transmitting high frequencies The low-frequency output signal, wherein the length of the probe fourth probe structure is smaller than the length of the probe structure of the fifth probe.
前述之測試用電路板中，該第一探針結構之探針長度與該第四探針結構之探針長度大致相同。 In the aforementioned test circuit board, the probe length of the first probe structure and the probe length of the fourth probe structure are substantially the same.
前述之測試用電路板中，該第一探針結構包含有一具有相對第一側與第二側之套管、插設於該第一側上之該探針、及插設於該第二側上之導線，其中，該套管例如為金屬管，該導線係為同軸線，其包含複數不同外徑且相互穿設之線體，例如該導線包含相互穿設之第一線體、第二線體及第三線體，該第三線體係位於該套管外，且該第二線 體係伸出該第三線體並位於該套管中，而該第一線體係伸出該第二線體並位於該套管中，該導線之端部(第一線體)與該探針之端部相疊合。另該複數第一探針結構之間係利用一銅片電性連接相鄰之該第一探針結構之套管，以進行接地。此外，該第一探針結構之探針包含一針本體及一包覆部分該針本體之外層部，且該針本體包含有埋設於該外層部之中間部、自該中間部延伸出該外層部且位於該套管內之針末端部、以及相對該針末端部且延伸出該外層部之針尖端部，其中，該針本體之針尖端部之末端係埋設於探針座，該針尖端部之尖端係凸伸出該探針座，用以接觸待測裝置之訊號輸入接點。 In the aforementioned test circuit board, the first probe structure includes a sleeve having opposite first and second sides, the probe inserted on the first side, and inserted on the second side. The conductor is, for example, a metal tube, and the conductor is a coaxial wire, which includes a plurality of wire bodies with different outer diameters and passing through each other. For example, the wire includes a first wire body and a second wire running through each other. A wire body and a third wire body, the third wire system is located outside the sleeve, and the second wire system The system extends out of the third wire body and is located in the sleeve, and the first wire system extends out of the second wire body and is located in the sleeve. The end of the wire (the first wire body) and the probe The ends overlap. In addition, the plurality of first probe structures are electrically connected to the bushings of the adjacent first probe structures by using a copper sheet for grounding. In addition, the probe of the first probe structure includes a needle body and a covering portion of the outer layer portion of the needle body, and the needle body includes a middle portion buried in the outer layer portion, and the outer layer extends from the middle portion. A needle tip portion located inside the cannula, and a needle tip portion opposite the needle tip portion and extending out of the outer layer portion, wherein a tip of the needle tip portion of the needle body is buried in a probe base, and the needle tip The tip of the part protrudes from the probe base to contact the signal input contact of the device under test.
前述之測試用電路板中，該第一探針結構及第二探針結構係相鄰設置且用以將測試機台之測試訊號傳送至一待測裝置之訊號輸入接點，該第三探針結構用以連接該待測裝置之訊號輸出接點，以將測試訊號回傳至測試機台，該第四探針結構用以將測試機台之測試訊號傳送至另一待測裝置之訊號輸入接點，該第五探針結構用以連接該另一待測裝置之訊號輸出接點，以將測試訊號回傳至測試機台。 In the aforementioned test circuit board, the first probe structure and the second probe structure are arranged adjacently and used to transmit a test signal of a test machine to a signal input contact of a device under test. The pin structure is used to connect the signal output contact of the device under test to return the test signal to the test machine. The fourth probe structure is used to send the test signal of the test machine to the signal of another device under test. Input contact, the fifth probe structure is used to connect the signal output contact of the other device under test to return the test signal to the test machine.
前述之測試用電路板中，復包括設於該電路板本體之第一探針座及第二探針座，其中，該第一、第二及第三探針結構係結合至該第一探針座，該第四及第五探針結構係結合至該第二探針座。 The aforementioned test circuit board further includes a first probe base and a second probe base provided on the circuit board body, wherein the first, second, and third probe structures are coupled to the first probe base. The needle base, the fourth and fifth probe structures are coupled to the second probe base.
由上可知，本發明之測試用電路板，主要係將其中一偵測組(第一偵測組)之高頻探針結構(第一探針結構)設 計成包含套管、探針及導線之結構，使該第一探針結構之構造不同於該第二探針結構中之低頻探針之構造，且令該第一探針結構之探針本體與該第四探針結構中之高頻探針之長度大致相同，故於同時測試兩組待測裝置時，將高頻訊號輸入至該第一探針結構與該第四探針結構中之高頻探針，兩者之間的訊號阻抗匹配一致，進而提升檢測精準度。 It can be known from the above that the test circuit board of the present invention is mainly a high-frequency probe structure (first probe structure) of one detection group (first detection group). The structure including the sleeve, the probe, and the wire makes the structure of the first probe structure different from that of the low-frequency probe in the second probe structure, and makes the probe body of the first probe structure The length of the high-frequency probe in the fourth probe structure is approximately the same. Therefore, when testing two sets of devices under test at the same time, a high-frequency signal is input to the first probe structure and the fourth probe structure. High-frequency probe, the signal impedance matching between the two is consistent, thereby improving the detection accuracy.
1‧‧‧探針卡 1‧‧‧ Probe Card
10,10’‧‧‧偵測組 10,10’‧‧‧ Detection Team
11,11’‧‧‧訊號輸入探針結構 11,11’‧‧‧Signal input probe structure
12,12’‧‧‧訊號輸出探針結構 12,12’‧‧‧Signal output probe structure
2‧‧‧測試用電路板 2‧‧‧Test circuit board
2a‧‧‧第一偵測組 2a‧‧‧First Detection Team
2b‧‧‧第二偵測組 2b‧‧‧Second Detection Team
20‧‧‧電路板本體 20‧‧‧Circuit board body
200a‧‧‧第一探針座 200a‧‧‧The first probe seat
200b‧‧‧第二探針座 200b‧‧‧Second Probe Block
21‧‧‧第一探針結構 21‧‧‧first probe structure
210‧‧‧套管 210‧‧‧ Casing
210a‧‧‧第一側 210a‧‧‧first side
210b‧‧‧第二側 210b‧‧‧Second side
211‧‧‧探針 211‧‧‧ Probe
211a‧‧‧針本體 211a‧‧‧ Needle body
211b‧‧‧外層部 211b‧‧‧Outer Department
2111a‧‧‧針尖端部 2111a‧‧‧ Needle tip
2111b‧‧‧中間部 2111b‧‧‧Middle
2111c‧‧‧針末端部 2111c‧‧‧ Needle tip
212‧‧‧導線 212‧‧‧conductor
212a‧‧‧第一線體 212a‧‧‧First Line
212b‧‧‧第二線體 212b‧‧‧Second line body
212c‧‧‧第三線體 212c‧‧‧ Third thread
22‧‧‧第二探針結構 22‧‧‧Second Probe Structure
23‧‧‧第三探針結構 23‧‧‧ third probe structure
24‧‧‧第四探針結構 24‧‧‧ Fourth probe structure
25‧‧‧第五探針結構 25‧‧‧ fifth probe structure
L‧‧‧分隔線 L‧‧‧ divider
第1圖係為習知探針卡之側視示意圖；第2圖係為本發明之測試用電路板之側視示意圖；以及第3圖係為第2圖之局部放大透視示意圖。 Figure 1 is a schematic side view of a conventional probe card; Figure 2 is a schematic side view of a test circuit board of the present invention; and Figure 3 is a partially enlarged perspective view of Figure 2.
以下藉由特定的具體實施例說明本發明之實施方式，熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。 The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
須知，本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本發明可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本發明所能產生之功效及所能達成之目的下，均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時，本說明書中所引用之如“上”、“第一”、“第二”、“第三”、“第四”及“一”等之用語，亦僅為便於敘述之明瞭，而非用以限定本發明可實施之範 圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本發明可實施之範疇。 It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The limited conditions are not technically significant. Any modification of the structure, change of the proportional relationship, or adjustment of the size should still fall within the scope of this invention without affecting the effects and goals that can be achieved by the present invention. The technical content disclosed by the invention can be covered. At the same time, the terms such as "upper", "first", "second", "third", "fourth", and "one" cited in this specification are only for the convenience of description, and are not To limit the scope of the invention The changes or adjustments of the relative relationship shall be regarded as the scope in which the present invention can be implemented without substantially changing the technical content.
請參閱第2圖，係為本發明之測試用電路板2之示意圖，係包括：一電路板本體20，且該電路板本體20定義有相鄰設置之第一偵測組2a及第二偵測組2b，用以檢測兩組待測裝置；以及複數探針結構，係設於該第一偵測組2a及第二偵測組2b。 Please refer to FIG. 2, which is a schematic diagram of the test circuit board 2 according to the present invention, which includes: a circuit board body 20, and the circuit board body 20 defines a first detection group 2 a and a second detection device disposed adjacently. The test group 2b is used to detect two groups of devices to be tested; and a plurality of probe structures are provided in the first detection group 2a and the second detection group 2b.
於本實施例中，該測試用電路板2係可為用於測試晶圓/晶片之探針卡(Probe card)或用於測試封裝件之測試載板(Load board)等可供測試機台使用之電路板。 In this embodiment, the test circuit board 2 may be a test machine such as a probe card for testing wafers / wafers or a load board for testing packages. Used circuit board.
於本實施例中，如第2圖之右側，該第一偵測組2a包含有複數第一探針結構21、複數第二探針結構22與複數第三探針結構23；該第二偵測組2b包含有複數第四探針結構24與複數第五探針結構25。 In this embodiment, as shown on the right side of FIG. 2, the first detection group 2 a includes a plurality of first probe structures 21, a plurality of second probe structures 22, and a plurality of third probe structures 23; The test group 2b includes a plurality of fourth probe structures 24 and a plurality of fifth probe structures 25.
於本實施例中，設於該第一偵測組2a之該第一探針結構21、第二探針結構22與第三探針結構23係結合至該電路板本體之第一探針座200a，設於該第二偵測組2b之該第四探針結構24與該第五探針結構25係結合至該電路板本體之第二探針座200b，其中，該第一探針座200a及第二探針座200b例如為樹脂之絕緣材所構成。 In this embodiment, the first probe structure 21, the second probe structure 22, and the third probe structure 23 provided in the first detection group 2a are coupled to the first probe base of the circuit board body. 200a, the fourth probe structure 24 and the fifth probe structure 25 provided in the second detection group 2b are coupled to the second probe base 200b of the circuit board body, wherein the first probe base 200a and the second probe holder 200b are made of, for example, a resin insulating material.
該第一偵測組2a之該第一探針結構21及第二探針結構22係相鄰設置且用以將測試機台之測試訊號傳送至一待測裝置之訊號輸入接點，該第三探針結構23用以連接該待測裝置之訊號輸出接點，以將測試訊號回傳至測試機 台；另該第二偵測組2b之該第四探針結構24用以將測試機台之測試訊號傳送至另一待測裝置之訊號輸入接點，該第五探針結構25用以連接該另一待測裝置之訊號輸出接點，以將測試訊號回傳至測試機台，俾供該測試用電路板2可藉由該第一偵測組2a及該第二偵測組2b同時檢測兩待測裝置。 The first probe structure 21 and the second probe structure 22 of the first detection group 2a are arranged adjacently and used to transmit a test signal of a test machine to a signal input contact of a device under test. The three-probe structure 23 is used to connect the signal output contacts of the device under test to return the test signal to the test machine. The fourth probe structure 24 of the second detection group 2b is used to transmit the test signal of the test machine to the signal input contact of another device under test, and the fifth probe structure 25 is used to connect The signal output contact of the other device under test to return the test signal to the test machine, so that the test circuit board 2 can use the first detection group 2a and the second detection group 2b at the same time. Test two devices under test.
於本實施例中，該第一偵測組2a之第一探針結構21及第二探針結構22之接點端(針尖)與該第二偵測組2b之第五探針結構25之接點端係靠近該第一偵測組2a與該第二偵測組2b之分隔線L，且該第一偵測組2a之該第三探針結構23之接點端與該第二偵測組2b之該第四探針結構24之接點端係遠離該分隔線L。 In this embodiment, the contact ends (tips) of the first probe structure 21 and the second probe structure 22 of the first detection group 2a and the fifth probe structure 25 of the second detection group 2b The contact end is close to the separation line L of the first detection group 2a and the second detection group 2b, and the contact end of the third probe structure 23 of the first detection group 2a and the second detection group The contact end of the fourth probe structure 24 of the measurement group 2b is far from the separation line L.
進一步言，所述之第一探針結構21係為高頻探針結構，用以傳輸高頻訊號，其設於該電路板本體20上，並包含一具有相對第一側210a與第二側210b之套管210、插設於該套管210第一側210a上之探針211、及插設於該套管210第二側210b上之導線212，且該導線212與該探針211係接合於該套管210中。 Further, the first probe structure 21 is a high-frequency probe structure for transmitting high-frequency signals. The first probe structure 21 is disposed on the circuit board body 20 and includes a first side 210a and a second side opposite to each other. A sleeve 210 of 210b, a probe 211 inserted on the first side 210a of the sleeve 210, and a lead 212 inserted on the second side 210b of the sleeve 210, and the lead 212 and the probe 211 are Engaged in the sleeve 210.
於本實施例中，該套管210係為金屬管，如銅管，其外徑R為285mm，且其內部填充有絕緣材。此外，於相鄰之複數第一探針結構21間可利用一銅片電性連接該些第一探針結構21之套管210，以進行接地。 In this embodiment, the sleeve 210 is a metal pipe, such as a copper pipe, and has an outer diameter R of 285 mm, and the inside thereof is filled with an insulating material. In addition, a copper sheet can be used to electrically connect the sleeves 210 of the first probe structures 21 between the adjacent first probe structures 21 for grounding.
請同時配合參閱第3圖，該探針211包含一針本體211a及一包覆部分該針本體之外層部211b，該外層部211b 係為絕緣材質所製成者，且該針本體211a包含有埋設於該外層部211b之中間部2111b、自該中間部2111b延伸出該外層部211b且位於該套管210內之針末端部2111c、以及相對該針末端部2111c且延伸出該外層部211b之針尖端部2111a，其中，該針本體211a之針尖端部2111a之末端係埋設於第一探針座200a，該針尖端部2111a之尖端係凸伸出該第一探針座200a，用以接觸待測裝置之訊號輸入接點。 Please refer to FIG. 3 at the same time. The probe 211 includes a needle body 211a and a covering portion of the needle body outer layer portion 211b and the outer layer portion 211b. The needle body 211a includes an intermediate portion 2111b buried in the outer layer portion 211b, a needle end portion 2111c extending from the intermediate portion 2111b to the outer layer portion 211b and located in the sleeve 210. And a needle tip portion 2111a opposite to the needle tip portion 2111c and extending out of the outer layer portion 211b, wherein the tip of the needle tip portion 2111a of the needle body 211a is buried in the first probe holder 200a, and the needle tip portion 2111a The tip protrudes from the first probe base 200a to contact the signal input contact of the device under test.
又，該導線212係為同軸線，其包含不同外徑之線體，如一第一線體(芯線體)212a、一第二線體(中線體)212b及一第三線體(外線體)212c，且依據外徑之大小依序相互緊配合穿設。具體地，該第三線體212c(為絕緣材)係位於該套管210外，且該第二線體212b(為絕緣材)之其中一端部係伸出該第三線體212c並位於該套管210中，而該第一線體212a(為金屬材)之其中一端部係伸出該第二線體212b並位於該套管210中。 In addition, the wire 212 is a coaxial wire, and includes wires with different outer diameters, such as a first wire (core wire) 212a, a second wire (center wire) 212b, and a third wire (outer wire). 212c, and closely fit each other according to the size of the outer diameter in order. Specifically, the third wire body 212c (which is an insulating material) is located outside the sleeve 210, and one end portion of the second wire body 212b (which is an insulating material) extends beyond the third wire body 212c and is located in the sleeve 210, and one end of the first wire body 212 a (which is a metal material) extends out of the second wire body 212 b and is located in the sleeve 210.
另外，該導線212之端部(即該第一線體212a位於該套管210內之端部)與該探針211之端部(即該針本體211a之針末端部2111c)係相互疊合，使該導線212與該探針211電性接合於該套管210中。 In addition, an end portion of the wire 212 (that is, an end portion of the first wire body 212a located in the sleeve 210) and an end portion of the probe 211 (that is, a needle end portion 2111c of the needle body 211a) are overlapped with each other. The lead wire 212 and the probe 211 are electrically connected to the sleeve 210.
於本實施例中，該第二探針結構22、第三探針結構23、第四探針結構24、第五探針結構25係為針狀之探針，且其中間部分係埋於該第一探針座200a及第二探針座200b內，其中，該第二探針結構22係為低頻探針(用以傳送低頻訊號)，複數該第三至第五探針結構23,24,25各包含有至少一高頻探針(用以傳送高頻訊號)與至少一低頻探針(用以傳送低頻訊號)。 In this embodiment, the second probe structure 22, the third probe structure 23, the fourth probe structure 24, and the fifth probe structure 25 are needle-like probes, and the middle part is buried in the probe. Inside the first probe holder 200a and the second probe holder 200b, the second probe structure 22 is a low-frequency probe (for transmitting low-frequency signals), and the third to fifth probe structures 23, 24 Each of 25 includes at least one high-frequency probe (for transmitting high-frequency signals) and at least one low-frequency probe (for transmitting low-frequency signals).
再者，用以將測試機台之測試訊號傳送至待測裝置之訊號輸入接點之該第一探針結構21之探針211之針本體211a長度與該第四探針結構24之探針長度大致相同；另該第二探針結構22之探針長度與第五探針結構25之探針長度大致相同，且該第一探針結構21之探針211之針本體211a長度小於該第二探針結構22之探針長度。 Furthermore, the length of the needle body 211a of the probe 211 of the first probe structure 21 and the probe of the fourth probe structure 24 are used to transmit the test signal of the test machine to the signal input contact of the device under test and the probe of the fourth probe structure 24 The length of the second probe structure 22 is substantially the same as the length of the probe of the fifth probe structure 25, and the length of the needle body 211a of the probe 211 of the first probe structure 21 is shorter than that of the first probe structure 21. Probe length of the two probe structures 22.
因此，本發明之測試用電路板2係將其中一偵測組(第一偵測組2a)之高頻探針結構(第一探針結構21)設計成包含套管210、探針211及導線212之結構，使該第一探針結構21之構造不同於該第二探針結構22中之低頻探針之構造，且令該第一探針結構21之探針211之針本體211a與該第四探針結構24中之高頻探針之長度大致相同，故於同時測試兩組待測裝置時，若將高頻訊號輸入至該第一探針結構21與該第四探針結構24中之高頻探針，兩者之間的訊號阻抗匹配一致，進而提升檢測精準度。 Therefore, the test circuit board 2 of the present invention is a high-frequency probe structure (first probe structure 21) of one of the detection groups (first detection group 2a) is designed to include a sleeve 210, a probe 211, and The structure of the lead 212 makes the structure of the first probe structure 21 different from that of the low-frequency probe in the second probe structure 22, and makes the needle body 211a of the probe 211 of the first probe structure 21 and The length of the high-frequency probes in the fourth probe structure 24 is substantially the same. Therefore, when testing two sets of devices under test at the same time, if a high-frequency signal is input to the first probe structure 21 and the fourth probe structure The high-frequency probe in 24 has the same signal impedance matching between the two, which improves the detection accuracy.
上述實施例係用以例示性說明本發明之原理及其功效，而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下，對上述實施例進行修改。因此本發明之權利保護範圍，應如後述之申請專利範圍所列。 The above embodiments are used to exemplify the principle of the present invention and its effects, but not to limit the present invention. Anyone skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.
Claims (9)
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| TW107102037A TWI661206B (en) | 2018-01-19 | 2018-01-19 | Printed circuit board for electrical testing |
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| TW107102037A TWI661206B (en) | 2018-01-19 | 2018-01-19 | Printed circuit board for electrical testing |
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| TWI661206B true TWI661206B (en) | 2019-06-01 |
| TW201932856A TW201932856A (en) | 2019-08-16 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040140822A1 (en) * | 1999-02-25 | 2004-07-22 | Formfactor, Inc. | Integrated circuit tester with high bandwidth probe assembly |
| CN1816751A (en) * | 2003-07-01 | 2006-08-09 | 佛姆法克特股份有限公司 | Apparatus and method for electromechanical testing and validation of probe cards |
| TW200842368A (en) * | 2007-04-27 | 2008-11-01 | Microelectonics Technology Inc | Probe card with electrical shielding structure |
| CN203688750U (en) * | 2013-12-25 | 2014-07-02 | 深圳市中兴新宇软电路有限公司 | Test device for FPC |
| CN104345186A (en) * | 2013-07-23 | 2015-02-11 | 旺矽科技股份有限公司 | High-frequency probe card for detecting photoelectric element |
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- 2018-01-19 TW TW107102037A patent/TWI661206B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040140822A1 (en) * | 1999-02-25 | 2004-07-22 | Formfactor, Inc. | Integrated circuit tester with high bandwidth probe assembly |
| CN1816751A (en) * | 2003-07-01 | 2006-08-09 | 佛姆法克特股份有限公司 | Apparatus and method for electromechanical testing and validation of probe cards |
| TW200842368A (en) * | 2007-04-27 | 2008-11-01 | Microelectonics Technology Inc | Probe card with electrical shielding structure |
| CN104345186A (en) * | 2013-07-23 | 2015-02-11 | 旺矽科技股份有限公司 | High-frequency probe card for detecting photoelectric element |
| CN203688750U (en) * | 2013-12-25 | 2014-07-02 | 深圳市中兴新宇软电路有限公司 | Test device for FPC |
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