TWI661176B - 三次元測定裝置、三次元測定方法及基板之製造方法 - Google Patents

三次元測定裝置、三次元測定方法及基板之製造方法 Download PDF

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Publication number
TWI661176B
TWI661176B TW103132648A TW103132648A TWI661176B TW I661176 B TWI661176 B TW I661176B TW 103132648 A TW103132648 A TW 103132648A TW 103132648 A TW103132648 A TW 103132648A TW I661176 B TWI661176 B TW I661176B
Authority
TW
Taiwan
Prior art keywords
measurement
height
unit
dimensional shape
image
Prior art date
Application number
TW103132648A
Other languages
English (en)
Chinese (zh)
Other versions
TW201520511A (zh
Inventor
杉浦崇正
Original Assignee
日商重機自動化系統有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商重機自動化系統有限公司 filed Critical 日商重機自動化系統有限公司
Publication of TW201520511A publication Critical patent/TW201520511A/zh
Application granted granted Critical
Publication of TWI661176B publication Critical patent/TWI661176B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2504—Calibration devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/04—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness specially adapted for measuring length or width of objects while moving
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B30/00—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images
    • G02B30/50—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Analysis (AREA)
TW103132648A 2013-09-30 2014-09-22 三次元測定裝置、三次元測定方法及基板之製造方法 TWI661176B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-205182 2013-09-30
JP2013205182A JP6198312B2 (ja) 2013-09-30 2013-09-30 ３次元測定装置、３次元測定方法および基板の製造方法

Publications (2)

Publication Number Publication Date
TW201520511A TW201520511A (zh) 2015-06-01
TWI661176B true TWI661176B (zh) 2019-06-01

Family

ID=52791145

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103132648A TWI661176B (zh) 2013-09-30 2014-09-22 三次元測定裝置、三次元測定方法及基板之製造方法

Country Status (4)

Country Link
JP (1) JP6198312B2 (ja)
KR (1) KR102224699B1 (ja)
CN (1) CN104515477B (ja)
TW (1) TWI661176B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6682809B2 (ja) * 2015-11-09 2020-04-15 大日本印刷株式会社 検査システムおよび検査方法
JP6831478B2 (ja) * 2017-12-07 2021-02-24 ヤマハ発動機株式会社 被実装物作業装置
JP7118776B2 (ja) * 2018-06-29 2022-08-16 キヤノン株式会社 撮像装置、画像処理方法、画像処理プログラムおよび記録媒体
JP7246943B2 (ja) * 2019-01-24 2023-03-28 キヤノン株式会社 画像処理方法、画像処理装置、画像処理システム、撮像装置、プログラム、および、記憶媒体
WO2022244367A1 (ja) * 2021-05-21 2022-11-24 株式会社 レイマック 非接触血管解析方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6072899A (en) * 1997-01-23 2000-06-06 Hitachi, Ltd. Method and device of inspecting three-dimensional shape defect
TWI296324B (ja) * 2005-10-20 2008-05-01 Omron Tateisi Electronics Co
US7808644B2 (en) * 2005-03-24 2010-10-05 Obe Ohnmacht & Baumgartner Gmbh & Co. Kg Device for optically measuring the shapes of objects and surfaces
JP2010237034A (ja) * 2009-03-31 2010-10-21 Sony Corp 外観検査用照明装置および外観検査装置
TWI396823B (zh) * 2009-01-20 2013-05-21 Ckd Corp 三維測量裝置
US20130201488A1 (en) * 2012-02-03 2013-08-08 Takaoka Electric Mfg. Co., Ltd. Three-dimensional shape measuring apparatus
JP2013186100A (ja) * 2012-03-12 2013-09-19 Hitachi Ltd 形状検査方法およびその装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7019826B2 (en) * 2003-03-20 2006-03-28 Agilent Technologies, Inc. Optical inspection system, apparatus and method for reconstructing three-dimensional images for printed circuit board and electronics manufacturing inspection
KR101155816B1 (ko) * 2005-06-17 2012-06-12 오므론 가부시키가이샤 3차원 계측을 행하는 화상 처리 장치 및 화상 처리 방법
JP5159594B2 (ja) * 2008-12-24 2013-03-06 キヤノン株式会社 画像形成装置
JP5170154B2 (ja) * 2010-04-26 2013-03-27 オムロン株式会社 形状計測装置およびキャリブレーション方法
JP5482411B2 (ja) * 2010-04-30 2014-05-07 ソニー株式会社 立体形状測定装置、検査装置及び立体形状測定用調整方法
JP5721072B2 (ja) * 2011-03-31 2015-05-20 Ｊｕｋｉオートメーションシステムズ株式会社 部品実装装置、情報処理装置、位置検出方法及び基板製造方法
JP6124237B2 (ja) * 2012-01-31 2017-05-10 Ｊｕｋｉオートメーションシステムズ株式会社 検査装置、検査方法及び基板の製造方法
JP5984284B2 (ja) * 2012-02-28 2016-09-06 Ｊｕｋｉオートメーションシステムズ株式会社 部品実装装置及び基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6072899A (en) * 1997-01-23 2000-06-06 Hitachi, Ltd. Method and device of inspecting three-dimensional shape defect
US7808644B2 (en) * 2005-03-24 2010-10-05 Obe Ohnmacht & Baumgartner Gmbh & Co. Kg Device for optically measuring the shapes of objects and surfaces
TWI296324B (ja) * 2005-10-20 2008-05-01 Omron Tateisi Electronics Co
TWI396823B (zh) * 2009-01-20 2013-05-21 Ckd Corp 三維測量裝置
JP2010237034A (ja) * 2009-03-31 2010-10-21 Sony Corp 外観検査用照明装置および外観検査装置
US20130201488A1 (en) * 2012-02-03 2013-08-08 Takaoka Electric Mfg. Co., Ltd. Three-dimensional shape measuring apparatus
JP2013186100A (ja) * 2012-03-12 2013-09-19 Hitachi Ltd 形状検査方法およびその装置

Also Published As

Publication number Publication date
CN104515477B (zh) 2019-03-08
JP6198312B2 (ja) 2017-09-20
CN104515477A (zh) 2015-04-15
JP2015068779A (ja) 2015-04-13
TW201520511A (zh) 2015-06-01
KR20150037545A (ko) 2015-04-08
KR102224699B1 (ko) 2021-03-05

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