TWI659649B - Camera module - Google Patents
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Abstract
本發明提供一種攝像模組，包括一稜鏡底座、一稜鏡驅動機構、一稜鏡單元、一鏡頭單元、以及一感光元件。稜鏡底座包括一金屬構件、至少一第一導線層、以及設置於金屬構件和第一導線層之間之一第一絕緣層。稜鏡驅動機構與第一導線層電性連接。稜鏡單元連接稜鏡驅動機構，且稜鏡驅動機構可驅動稜鏡單元相對於稜鏡底座旋轉。感光元件可捕捉被稜鏡單元反射並通過鏡頭單元之光線。 The invention provides a camera module, which includes a base, a drive mechanism, a unit, a lens unit, and a photosensitive element. The base includes a metal member, at least one first wire layer, and a first insulating layer disposed between the metal member and the first wire layer. The driving mechanism is electrically connected to the first wire layer. The 稜鏡 unit is connected to a 稜鏡 drive mechanism, and the 稜鏡 drive mechanism can drive the 稜鏡 unit to rotate relative to the 稜鏡 base. The light sensing element captures light reflected by the unit and passing through the lens unit.
Description
本發明係有關於一種攝像模組。更具體地來說，本發明有關於一種具有稜鏡組件的攝像模組。 The invention relates to a camera module. More specifically, the present invention relates to a camera module having a tritium component.
隨著科技的發展，現今許多電子裝置(例如智慧型手機或數位相機)皆具有照相或錄影的功能。這些電子裝置的使用越來越普遍，並朝著便利和輕薄化的設計方向進行發展，以提供使用者更多的選擇。 With the development of technology, many electronic devices (such as smart phones or digital cameras) now have the function of taking pictures or videos. The use of these electronic devices is becoming more and more common, and they are moving towards the design of convenience and thinness to provide users with more choices.
前述具有照相或錄影功能之電子裝置通常設有一驅動模組，以驅動一或多個光學鏡片組沿著一光軸進行移動，進而達到自動對焦(autofocus)且/或變焦(zoom)的功能。光線可穿過前述光學鏡片組在一感光元件上成像。 The aforementioned electronic device with a camera or video function is usually provided with a driving module to drive one or more optical lens groups to move along an optical axis, thereby achieving the functions of autofocus and / or zoom. Light can pass through the aforementioned optical lens group to form an image on a photosensitive element.
然而，由於前述輕薄化的設計，在電子裝置中設置與驅動模組電性連接的電路板或線路並不容易，因此，如何解決前述問題始成一重要之課題。 However, due to the aforementioned thin and light design, it is not easy to provide a circuit board or a circuit electrically connected to the driving module in the electronic device. Therefore, how to solve the foregoing problem becomes an important issue.
為了解決上述習知之問題點，本發明提供一種攝像模組，包括一稜鏡底座、一稜鏡驅動機構、一稜鏡單元、一鏡頭單元、以及一感光元件。稜鏡底座包括一金屬構件、至少一第一 導線層、以及設置於金屬構件和第一導線層之間之一第一絕緣層。稜鏡驅動機構與第一導線層電性連接。稜鏡單元連接稜鏡驅動機構，且稜鏡驅動機構可驅動稜鏡單元相對於稜鏡底座旋轉。感光元件可捕捉被稜鏡單元反射並通過鏡頭單元之光線。 In order to solve the conventional problems, the present invention provides a camera module, which includes a base, a drive mechanism, a unit, a lens unit, and a photosensitive element.稜鏡 The base includes a metal member, at least one first A wire layer, and a first insulating layer disposed between the metal member and the first wire layer. The driving mechanism is electrically connected to the first wire layer. The 稜鏡 unit is connected to a 稜鏡 drive mechanism, and the 稜鏡 drive mechanism can drive the 稜鏡 unit to rotate relative to the 稜鏡 base. The light sensing element captures light reflected by the unit and passing through the lens unit.
本發明一實施例中，前述金屬構件之厚度大於第一絕緣層和第一導線層之厚度總和。 In an embodiment of the present invention, the thickness of the aforementioned metal member is greater than the sum of the thicknesses of the first insulating layer and the first wire layer.
本發明一實施例中，前述金屬構件之厚度介於0.10mm~0.35mm。 In an embodiment of the present invention, the thickness of the aforementioned metal member is between 0.10 mm and 0.35 mm.
本發明一實施例中，前述第一導線層係藉由模塑互聯物件之方式形成於第一絕緣層上。 In an embodiment of the present invention, the first conductive layer is formed on the first insulating layer by molding an interconnection object.
本發明一實施例中，前述第一導線層係藉由鍍膜之方式形成於第一絕緣層上。 In an embodiment of the present invention, the first wire layer is formed on the first insulating layer by a plating method.
本發明一實施例中，前述金屬構件和第一導線層具有相同的熱膨脹係數。 In an embodiment of the present invention, the aforementioned metal member and the first wire layer have the same thermal expansion coefficient.
本發明一實施例中，前述稜鏡底座更包括至少一第二導線層以及一第二絕緣層，其中第二絕緣層設置於第二導線層和金屬構件之間，且金屬構件設置於第一絕緣層和第二絕緣層之間。 In an embodiment of the present invention, the aforementioned base further includes at least a second wire layer and a second insulation layer, wherein the second insulation layer is disposed between the second wire layer and the metal member, and the metal member is disposed on the first Between the insulating layer and the second insulating layer.
本發明一實施例中，前述金屬構件之厚度大於第二絕緣層和第二導線層之厚度總和。 In an embodiment of the present invention, the thickness of the aforementioned metal member is greater than the sum of the thicknesses of the second insulating layer and the second wire layer.
本發明更提供一種攝像模組，包括一稜鏡驅動機構、一稜鏡單元、連接稜鏡驅動機構和稜鏡單元之一彈性元件、 一鏡頭單元、以及一感光元件。彈性元件包括一金屬基底、電性連接稜鏡驅動機構之至少一第一金屬線路、以及設置於金屬基底和第一金屬線路之間之一第一絕緣元件。感光元件可捕捉被稜鏡單元反射並通過鏡頭單元之光線。 The invention further provides a camera module, which includes a driving mechanism, a driving unit, an elastic element connecting the driving mechanism and the driving unit, A lens unit and a photosensitive element. The elastic element includes a metal substrate, at least one first metal circuit electrically connected to the driving mechanism, and a first insulation element disposed between the metal substrate and the first metal circuit. The light sensing element captures light reflected by the unit and passing through the lens unit.
本發明一實施例中，前述金屬基底之厚度大於第一絕緣元件和第一金屬線路之厚度總和。 In an embodiment of the present invention, the thickness of the foregoing metal substrate is greater than the sum of the thicknesses of the first insulating element and the first metal line.
本發明一實施例中，前述金屬基底之厚度介於0.02mm~0.35mm。 In one embodiment of the present invention, the thickness of the aforementioned metal substrate is between 0.02 mm and 0.35 mm.
本發明一實施例中，前述第一金屬線路係藉由模塑互聯物件之方式形成於第一絕緣元件上。 In an embodiment of the present invention, the aforementioned first metal circuit is formed on the first insulating element by molding an interconnection object.
本發明一實施例中，前述第一金屬線路係藉由鍍膜之方式形成於第一絕緣元件上。 In an embodiment of the present invention, the aforementioned first metal circuit is formed on the first insulating element by a coating method.
本發明一實施例中，前述金屬基底和第一金屬線路具有相同的熱膨脹係數。 In an embodiment of the present invention, the aforementioned metal substrate and the first metal circuit have the same thermal expansion coefficient.
本發明一實施例中，前述彈性元件更包括複數個第一金屬線路，形成於第一絕緣元件上，其中該些第一金屬線路彼此電性獨立。 In an embodiment of the present invention, the aforementioned elastic element further includes a plurality of first metal lines formed on the first insulating element, wherein the first metal lines are electrically independent of each other.
本發明一實施例中，前述稜鏡驅動機構包括一框架和一稜鏡承載座，彈性元件連接前述框件和稜鏡承載座，並包括連接框架之一第一固定部、連接稜鏡承載座之一第二固定部、以及連接第一固定部和第二固定部的弦線部。其中，弦線部上設置有複數個彼此電性獨立的第一金屬線路。 In an embodiment of the present invention, the cymbal driving mechanism includes a frame and a cymbal bearing base, and the elastic element connects the frame member and the cymbal bearing base, and includes a first fixing portion connecting the frame and the cymbal bearing base. One of the second fixing portion, and a string portion connecting the first fixing portion and the second fixing portion. The string part is provided with a plurality of first metal lines that are electrically independent of each other.
本發明一實施例中，前述彈性元件更包括一第二絕緣元件和至少一第二金屬線路，其中第二絕緣元件設置於第二金屬線路和金屬基底之間，且金屬基底設置於第一絕緣元件和第二絕緣元件之間。 In an embodiment of the present invention, the aforementioned elastic element further includes a second insulating element and at least one second metal circuit, wherein the second insulating element is disposed between the second metal circuit and the metal substrate, and the metal substrate is disposed on the first insulation. Between the element and the second insulating element.
本發明一實施例中，前述彈性元件更包括複數個第二金屬線路，形成於第二絕緣元件上，其中該些第二金屬線路彼此電性獨立。 In an embodiment of the present invention, the aforementioned elastic element further includes a plurality of second metal lines formed on the second insulating element, wherein the second metal lines are electrically independent of each other.
本發明一實施例中，前述鏡頭驅動機構包括一框架和一稜鏡承載座，彈性元件連接前述框件和稜鏡承載座，並包括連接框架之一第一固定部、連接稜鏡承載座之一第二固定部、以及連接第一固定部和第二固定部的弦線部。其中，弦線部上設置有複數個彼此電性獨立的第二金屬線路。 According to an embodiment of the present invention, the lens driving mechanism includes a frame and a cymbal mount, and the elastic element connects the frame member and the cymbal mount, and includes a first fixing portion of the connection frame and a cymbal mount. A second fixing portion and a string portion connecting the first fixing portion and the second fixing portion. Wherein, the string part is provided with a plurality of second metal lines which are electrically independent from each other.
10‧‧‧攝像模組 10‧‧‧ Camera Module
20‧‧‧電子裝置 20‧‧‧Electronic device
1100‧‧‧稜鏡單元 1100‧‧‧ 稜鏡 unit
1200‧‧‧彈性元件 1200‧‧‧Elastic element
1201‧‧‧第一固定部 1201‧‧‧First fixed part
1202‧‧‧第二固定部 1202‧‧‧Second Fixing Section
1203‧‧‧弦線部 1203‧‧‧ String section
1210‧‧‧金屬基底 1210‧‧‧ metal substrate
1220‧‧‧第一絕緣元件 1220‧‧‧First insulation element
1230‧‧‧第一金屬線路 1230‧‧‧First Metal Circuit
1240‧‧‧第二絕緣元件 1240‧‧‧Second insulation element
1250‧‧‧第二金屬線路 1250‧‧‧Second Metal Line
1300‧‧‧稜鏡承載座 1300‧‧‧ 稜鏡 bearing seat
1400‧‧‧第一電磁驅動組件 1400‧‧‧The first electromagnetic drive module
1500‧‧‧框架 1500‧‧‧Frame
1510‧‧‧孔洞 1510‧‧‧ Hole
1600‧‧‧第二電磁驅動組件 1600‧‧‧Second electromagnetic drive assembly
1700‧‧‧位置偵測器 1700‧‧‧Position Detector
1800‧‧‧稜鏡底座 1800‧‧‧ 稜鏡 Base
1810‧‧‧金屬構件 1810‧‧‧Metal components
1820‧‧‧第一絕緣層 1820‧‧‧First insulation layer
1830‧‧‧第一導線層 1830‧‧‧First wire layer
1840‧‧‧第二絕緣層 1840‧‧‧Second insulation layer
1850‧‧‧第二導線層 1850‧‧‧Second wire layer
2100‧‧‧鏡頭單元 2100‧‧‧lens unit
2200‧‧‧鏡頭承載座 2200‧‧‧ lens mount
2300‧‧‧框體 2300‧‧‧Frame
2310‧‧‧中空部 2310‧‧‧Hollow
2400‧‧‧簧片 2400‧‧‧ reed
2500‧‧‧線圈 2500‧‧‧coil
2600‧‧‧磁性元件 2600‧‧‧Magnetic element
C‧‧‧殼體 C‧‧‧shell
L‧‧‧光線 L‧‧‧light
M1‧‧‧鏡頭組件 M1‧‧‧ lens assembly
M2‧‧‧稜鏡組件 M2‧‧‧ 稜鏡 components
O‧‧‧開口 O‧‧‧ opening
R‧‧‧容置空間 R‧‧‧ accommodation space
S‧‧‧感光元件 S‧‧‧photosensitive element
第1圖係表示本發明一實施例之電子裝置示意圖。 FIG. 1 is a schematic diagram showing an electronic device according to an embodiment of the present invention.
第2圖係表示本發明一實施例之攝像模組示意圖。 FIG. 2 is a schematic diagram of a camera module according to an embodiment of the present invention.
第3圖係表示本發明一實施例中之稜鏡組件的***圖。 FIG. 3 is an exploded view showing a cymbal assembly in an embodiment of the present invention.
第4A圖係表示本發明一實施例中之彈性元件的示意圖。 FIG. 4A is a schematic diagram showing an elastic element in an embodiment of the present invention.
第4B圖係表示第4A圖中沿A-A方向的剖視圖。 Fig. 4B is a sectional view taken along the A-A direction in Fig. 4A.
第5圖係表示本發明另一實施例中之彈性元件的示意圖。 FIG. 5 is a schematic diagram showing an elastic element in another embodiment of the present invention.
第6A圖係表示本發明一實施例中之稜鏡底座的剖視圖。 FIG. 6A is a cross-sectional view showing a base of a salamander in an embodiment of the present invention.
第6B圖係表示本發明另一實施例中之稜鏡底座的剖視圖。 Fig. 6B is a cross-sectional view showing a base of a salamander in another embodiment of the present invention.
以下說明本發明實施例之攝像模組。然而，可輕易了解本發明實施例提供許多合適的發明概念而可實施於廣泛的各種特定背景。所揭示的特定實施例僅僅用於說明以特定方法使用本發明，並非用以侷限本發明的範圍。 The camera module according to the embodiment of the present invention will be described below. However, it can be easily understood that the embodiments of the present invention provide many suitable inventive concepts and can be implemented in a wide variety of specific backgrounds. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific method, and are not intended to limit the scope of the present invention.
除非另外定義，在此使用的全部用語(包括技術及科學用語)具有與此篇揭露所屬之一般技藝者所通常理解的相同涵義。能理解的是這些用語，例如在通常使用的字典中定義的用語，應被解讀成具有一與相關技術及本揭露的背景或上下文一致的意思，而不應以一理想化或過度正式的方式解讀，除非在此特別定義。 Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by ordinary artisans to whom this disclosure belongs. It is understandable that these terms, such as those defined in commonly used dictionaries, should be interpreted to have a meaning consistent with the relevant technology and the background or context of this disclosure, and should not be in an idealized or overly formal manner. Interpreted, unless specifically defined here.
首先請參閱第1圖，本發明一實施例之攝像模組10可裝設於一電子裝置20內，用以照相或攝影，其中前述電子裝置20例如可為智慧型手機或是數位相機。在照相或攝影時，攝像模組10可接收光線並成像，前述成像可傳送至設置於電子裝置20中的處理器(未圖示)，並藉由前述處理器進行影像的後處理。 First, referring to FIG. 1, a camera module 10 according to an embodiment of the present invention may be installed in an electronic device 20 for taking pictures or photographs. The electronic device 20 may be a smart phone or a digital camera, for example. When photographing or photographing, the camera module 10 can receive light and form an image, and the aforementioned image can be transmitted to a processor (not shown) provided in the electronic device 20, and the image can be post-processed by the aforementioned processor.
請參閱第2圖，前述攝像模組10包括有一殼體C、一鏡頭組件M1、一稜鏡組件M2、以及一感光元件S。殼體C之內部形成有一容置空間R，且其壁面上形成有與容置空間R連通的開口O。鏡頭組件M1、稜鏡組件M2和感光元件S設置於容置空間R中，鏡頭組件M1位於稜鏡組件M2和感光元件S之間，且前述開口O形成於稜鏡組件M2旁。 Referring to FIG. 2, the aforementioned camera module 10 includes a casing C, a lens assembly M1, a stacker assembly M2, and a photosensitive element S. An accommodating space R is formed inside the casing C, and an opening O is formed on a wall surface thereof to communicate with the accommodating space R. The lens assembly M1, the cymbal assembly M2, and the photosensitive element S are disposed in the accommodating space R. The lens assembly M1 is located between the cymbal assembly M2 and the photosensitive element S, and the aforementioned opening O is formed beside the cymbal assembly M2.
當光線L沿Y軸方向穿過開口O並進入攝像模組10的容置空間R時，稜鏡組件M2可反射前述光線L，且被反射後的光線L將大致沿Z軸方向穿過鏡頭組件M1並抵達感光元件S。具體來說，感光元件S可捕捉被稜鏡組件M2之稜鏡單元1100反射，且穿過鏡頭組件M1之鏡頭單元2100的光線。 When the light L passes through the opening O in the Y-axis direction and enters the accommodating space R of the camera module 10, the unit M2 can reflect the aforementioned light L, and the reflected light L will pass through the lens in the Z-axis direction. The component M1 reaches the photosensitive element S. Specifically, the light sensing element S can capture light reflected by the unit 1100 of the unit M2 and passing through the lens unit 2100 of the lens unit M1.
如第2圖所示，前述鏡頭組件M1主要包括一鏡頭單元2100以及一鏡頭驅動機構，其中鏡頭驅動機構係用以驅動前述鏡頭單元2100相對於感光元件S移動。舉例而言，前述鏡頭驅動機構可包括一鏡頭承載座2200、一框體2300、兩個簧片2400、至少一線圈2500、以及至少一磁性元件2600。 As shown in FIG. 2, the lens assembly M1 mainly includes a lens unit 2100 and a lens driving mechanism. The lens driving mechanism is used to drive the lens unit 2100 to move relative to the photosensitive element S. For example, the aforementioned lens driving mechanism may include a lens carrier 2200, a frame 2300, two reeds 2400, at least one coil 2500, and at least one magnetic element 2600.
鏡頭單元2100固定於鏡頭承載座2200中。前述兩個簧片2400連接鏡頭承載座2200和框體2300，並分別位於鏡頭承載座2200的相反側，以使鏡頭承載座2200可活動地懸吊於框體2300的中空部2310中。線圈2500和磁性元件2600分別設置於鏡頭承載座2200和框體2300上，且彼此相互對應。當電流流入線圈2500時，線圈2500和磁性元件2600之間會產生電磁感應，鏡頭承載座2200以及設置於鏡頭承載座2200上的鏡頭單元2100可被驅動而相對於感光元件S移動。 The lens unit 2100 is fixed in the lens carrier 2200. The two reeds 2400 are connected to the lens holder 2200 and the frame 2300, and are located on opposite sides of the lens holder 2200, respectively, so that the lens holder 2200 can be suspendably suspended in the hollow portion 2310 of the frame 2300. The coil 2500 and the magnetic element 2600 are respectively disposed on the lens carrier 2200 and the frame 2300, and correspond to each other. When a current flows into the coil 2500, electromagnetic induction is generated between the coil 2500 and the magnetic element 2600. The lens carrier 2200 and the lens unit 2100 provided on the lens carrier 2200 can be driven to move relative to the photosensitive element S.
第3圖係表示稜鏡組件M2的***圖。如第3圖所示，於本實施例中，稜鏡組件M2主要包括一稜鏡單元1100和一稜鏡驅動機構，其中稜鏡驅動機構包括一彈性元件1200、一稜鏡承載座1300、複數個第一電磁驅動組件1400、一框架1500、複數個第二 電磁驅動組件1600、複數個位置偵測器1700、以及一稜鏡底座1800。 FIG. 3 is an exploded view of the erbium module M2. As shown in FIG. 3, in this embodiment, the cymbal assembly M2 mainly includes a cymbal unit 1100 and a cymbal drive mechanism, where the cymbal drive mechanism includes an elastic element 1200, a cymbal bearing base 1300, First electromagnetic drive assemblies 1400, a frame 1500, a plurality of second The electromagnetic driving assembly 1600, a plurality of position detectors 1700, and a stack base 1800.
請一併參閱第3、4A圖，彈性元件1200可包括至少一第一固定部1201、至少一第二固定部1202、以及至少一弦線部1203。第一固定部1201固定於框架1500上，且弦線部1203連接前述第一固定部1201和第二固定部1202。稜鏡單元1100和稜鏡承載座1300分別固定於第二固定部1202的相反面上。換言之，稜鏡單元1100和前述稜鏡承載座1300是藉由彈性元件1200彼此相連。 Please refer to FIGS. 3 and 4A together. The elastic element 1200 may include at least one first fixing portion 1201, at least one second fixing portion 1202, and at least one string portion 1203. The first fixing portion 1201 is fixed to the frame 1500, and the string portion 1203 connects the aforementioned first fixing portion 1201 and the second fixing portion 1202. The cymbal unit 1100 and the cymbal carrier 1300 are respectively fixed on opposite sides of the second fixing portion 1202. In other words, the cymbal unit 1100 and the aforementioned cymbal carrier 1300 are connected to each other by the elastic element 1200.
第4B圖係表示第4A圖中沿A-A方向之剖視圖。如第4A、4B圖所示，前述彈性元件1200可包括一金屬基底1210、一第一絕緣元件1220、以及至少一第一金屬線路1230。其中，第一絕緣元件1220設置於金屬基底1210和第一金屬線路1230之間。 Fig. 4B is a sectional view taken along the direction A-A in Fig. 4A. As shown in FIGS. 4A and 4B, the aforementioned elastic element 1200 may include a metal substrate 1210, a first insulating element 1220, and at least one first metal line 1230. The first insulating element 1220 is disposed between the metal substrate 1210 and the first metal line 1230.
金屬基底1210的厚度係大於第一絕緣元件1220和第一金屬線路1230的厚度總和，例如可介於0.02mm至0.35mm。金屬基底1210和第一金屬線路1230可具有相同的熱膨脹係數，因此在彈性元件1200受熱時，金屬基底1210和第一金屬線路1230之間不會產生相對位移。 The thickness of the metal base 1210 is greater than the sum of the thicknesses of the first insulating element 1220 and the first metal line 1230, and may be, for example, between 0.02 mm and 0.35 mm. The metal substrate 1210 and the first metal circuit 1230 may have the same coefficient of thermal expansion. Therefore, when the elastic element 1200 is heated, there is no relative displacement between the metal substrate 1210 and the first metal circuit 1230.
需特別說明的是，彈性元件1200上可具有複數個第一金屬線路1230，且這些第一金屬線路1230彼此分離且電性獨立。這些第一金屬線路1230可從第一固定部1201穿過弦線部1203延伸至第二固定部1202，且每個第一金屬線路1230設置於第一固定部1201和第二固定部1202上的端部係用以與其他元件(例如第 二電磁驅動組件1600)電性連接。 It should be particularly noted that the elastic element 1200 may have a plurality of first metal lines 1230, and these first metal lines 1230 are separated from each other and electrically independent. These first metal lines 1230 may extend from the first fixing portion 1201 through the string portion 1203 to the second fixing portion 1202, and each of the first metal lines 1230 is disposed on the first fixing portion 1201 and the second fixing portion 1202. The end is used to connect with other components (such as The two electromagnetic driving components 1600) are electrically connected.
前述彼此分離且電性獨立的第一金屬線路1230可穿過同一個弦線部1203。亦即，每個弦線部1203上將設置有複數個彼此分離且電性獨立的第一金屬線路1230。 The aforementioned first metal lines 1230 that are separated from each other and electrically independent may pass through the same chord line portion 1203. That is, each string part 1203 is provided with a plurality of first metal lines 1230 separated from each other and electrically independent.
請參閱第5圖，於另一實施例中，彈性元件1200更可包括一第二絕緣元件1240、以及至少一第二金屬線路1250。金屬基底1210設置於第一絕緣元件1220和第二絕緣元件1240之間，且第二絕緣元件1240設置於金屬基底1210和第二金屬線路1250之間。 Referring to FIG. 5, in another embodiment, the elastic element 1200 may further include a second insulating element 1240 and at least one second metal circuit 1250. The metal substrate 1210 is disposed between the first insulating element 1220 and the second insulating element 1240, and the second insulating element 1240 is disposed between the metal substrate 1210 and the second metal line 1250.
同樣的，金屬基底1210的厚度係大於第二絕緣元件1240和第二金屬線路1250的厚度總和。金屬基底1210和第二金屬線路1250可具有相同的熱膨脹係數，因此在彈性元件1200受熱時，金屬基底1210和第二金屬線路1250之間不會產生相對位移。當第二絕緣元件1240上設置有複數個第二金屬線路1250時，這些第二金屬線路1250可彼此分離且電性獨立，並可採取與第4A圖中之第一金屬線路1230類似的配置。 Similarly, the thickness of the metal substrate 1210 is greater than the sum of the thicknesses of the second insulating element 1240 and the second metal line 1250. The metal substrate 1210 and the second metal circuit 1250 may have the same coefficient of thermal expansion. Therefore, when the elastic element 1200 is heated, there is no relative displacement between the metal substrate 1210 and the second metal circuit 1250. When a plurality of second metal lines 1250 are provided on the second insulation element 1240, these second metal lines 1250 can be separated from each other and electrically independent, and can adopt a configuration similar to the first metal line 1230 in FIG. 4A.
由於彈性元件1200上佈設了彼此電性獨立的第一金屬線路1230及第二金屬線路1250，因此即使需要利用彈性元件1200進行兩個或兩個以上的導電行為時，也不必將彈性元件1200分割，進而可保持彈性元件1200的完整，有利於彈性元件1200的安裝。此外，由於彈性元件1200可保持完整，故可使稜鏡承載座1300受到平均的彈性力，進而使稜鏡驅動機構驅動之旋轉角度更 加精準。再者，相較於被分割的彈性元件，前述完整的彈性元件1200之固定面積較大，因此可避免彈性元件1200因攝像模組10碰撞而從框架1500、稜鏡單元1100或稜鏡承載座1300分離。 Since the first metal circuit 1230 and the second metal circuit 1250 which are electrically independent of each other are arranged on the elastic element 1200, even if it is necessary to use the elastic element 1200 for two or more conductive actions, it is not necessary to divide the elastic element 1200. Therefore, the integrity of the elastic element 1200 can be maintained, which facilitates the installation of the elastic element 1200. In addition, since the elastic element 1200 can be kept intact, the cymbal bearing base 1300 can be subjected to an average elastic force, thereby making the rotation angle driven by the cymbal drive mechanism more Add precision. In addition, compared with the divided elastic element, the fixed area of the complete elastic element 1200 is larger, so that the elastic element 1200 can be prevented from colliding with the camera module 10 from the frame 1500, the 稜鏡 unit 1100, or the 稜鏡 bearing seat. 1300 separation.
第一金屬線路1230和第二金屬線路1250可透過模塑互聯物件(Molded Interconnect Device,MID)之方式分別形成於第一絕緣元件1220和第二絕緣元件1240上，例如透過雷射直接成型(Laser Direct Structuring,LDS)、微體積化製程技術(Microscopic Integrated Processing Technology,MIPTEC)、雷射誘導金屬化技術(Laser Induced Metallization,LIM)、雷射印刷重組技術(Laser Restructuring Print,LRP)、氣懸膠噴印製程(Aerosol Jet Process)、或雙料射出(Two-shot molding method)。於一些實施例中，第一金屬線路1230和第二金屬線路1250亦可透過鍍膜方式分別形成於第一絕緣元件1220和第二絕緣元件1240上。 The first metal circuit 1230 and the second metal circuit 1250 can be formed on the first insulation element 1220 and the second insulation element 1240 respectively by means of a Molded Interconnect Device (MID), for example, directly formed by laser (Laser Direct Structuring (LDS), Microscopic Integrated Processing Technology (MIPTEC), Laser Induced Metallization (LIM), Laser Restructuring Print (LRP), air suspension adhesive Aerosol Jet Process, or Two-shot molding method. In some embodiments, the first metal circuit 1230 and the second metal circuit 1250 can also be formed on the first insulating element 1220 and the second insulating element 1240 by coating.
請回到第2、3圖，第一電磁驅動組件1400固定於稜鏡承載座1300上並圍繞前述稜鏡承載座1300，且第二電磁驅動組件1600固定於稜鏡底座1800上、穿過框架1500上的孔洞1510並對應於前述第一電磁驅動組件1400。 Please return to FIGS. 2 and 3, the first electromagnetic driving component 1400 is fixed on the cymbal support base 1300 and surrounds the aforementioned cymbal support base 1300, and the second electromagnetic driving component 1600 is fixed on the cymbal base 1800 and passes through the frame The hole 1510 on 1500 corresponds to the aforementioned first electromagnetic drive assembly 1400.
藉由前述第一電磁驅動組件1400和第二電磁驅動組件1600之間的電磁感應，稜鏡承載座1300以及與稜鏡承載座1300連接的稜鏡單元1100可被驅動而相對於框架1500旋轉。舉例而言，於本實施例中，第一電磁驅動組件1400可包括至少一磁鐵，而第二電磁驅動組件1600則可為驅動線圈。 Through the electromagnetic induction between the first electromagnetic driving component 1400 and the second electromagnetic driving component 1600, the cymbal carrier 1300 and the cymbal unit 1100 connected to the cymbal carrier 1300 can be driven to rotate relative to the frame 1500. For example, in this embodiment, the first electromagnetic driving component 1400 may include at least one magnet, and the second electromagnetic driving component 1600 may be a driving coil.
當電流通入驅動線圈(第二電磁驅動組件1600)時，驅動線圈和磁鐵之間將產生電磁感應，如此一來即可帶動稜鏡承載座1300及稜鏡單元1100相對於框架1500繞X軸方向及/或Y軸方向旋轉，藉以微調光線L抵達感光元件S的位置。 When a current is passed into the driving coil (the second electromagnetic driving assembly 1600), electromagnetic induction will be generated between the driving coil and the magnet. In this way, the 稜鏡 bearing base 1300 and the 稜鏡 unit 1100 can be driven around the X axis with respect to the frame 1500. Rotate in the direction and / or the Y-axis direction to fine-tune the light L to reach the position of the photosensitive element S.
於一些實施例中，第一電磁驅動組件1400可為驅動線圈，而第二電磁驅動組件1600可為磁鐵。 In some embodiments, the first electromagnetic driving component 1400 may be a driving coil, and the second electromagnetic driving component 1600 may be a magnet.
請繼續參閱第2、3圖，稜鏡底座1800固定於殼體C上，且框架1500和位置偵測器1700固定於稜鏡底座1800上。位置偵測器1700可穿過框架1500上的孔洞1510，並藉由偵測第一電磁驅動組件1400的位置來獲得稜鏡單元1100的旋轉角度。 Please continue to refer to FIGS. 2 and 3. The base 1800 is fixed on the housing C, and the frame 1500 and the position detector 1700 are fixed on the base 1800. The position detector 1700 can pass through the hole 1510 on the frame 1500, and obtain the rotation angle of the unit 1100 by detecting the position of the first electromagnetic driving component 1400.
舉例而言，前述位置偵測器1700可為霍爾效應感測器(Hall Sensor)、磁阻效應感測器(Magnetoresistance Effect Sensor,MR Sensor)、巨磁阻效應感測器(Giant Magnetoresistance Effect Sensor,GMR Sensor)、穿隧磁阻效應感測器(Tunneling Magnetoresistance Effect Sensor,TMR Sensor)、或磁通量感測器(Fluxgate)。 For example, the aforementioned position detector 1700 may be a Hall sensor, a Magnetoresistance Effect Sensor (MR Sensor), or a Giant Magnetoresistance Effect Sensor. , GMR Sensor), Tunneling Magnetoresistance Effect Sensor (TMR Sensor), or magnetic flux sensor (Fluxgate).
請參閱第6A圖，於本實施例中，稜鏡底座1800係由三層結構所構成，包括一金屬構件1810、一第一絕緣層1820、以及至少一第一導線層1830，其中第一絕緣層1820設置於金屬構件1810和第一導線層1830之間。第一導線層1830例如可與前述稜鏡驅動機構中的第二電磁驅動組件1600和位置偵測器1700電性連接，以傳輸訊號及供給電力。 Please refer to FIG. 6A. In this embodiment, the base 1800 is composed of a three-layer structure, and includes a metal member 1810, a first insulating layer 1820, and at least a first wire layer 1830. The layer 1820 is disposed between the metal member 1810 and the first wire layer 1830. The first wire layer 1830 can be electrically connected to the second electromagnetic driving component 1600 and the position detector 1700 in the aforementioned drive mechanism, for example, to transmit signals and supply power.
金屬構件1810的厚度係大於第一絕緣層1820和第一導線層1830的厚度總和，例如可介於0.10mm至0.35mm，且金屬構件1810和第一導線層1830可具有相同的熱膨脹係數。 The thickness of the metal member 1810 is greater than the sum of the thicknesses of the first insulating layer 1820 and the first wire layer 1830, for example, may be between 0.10 mm and 0.35 mm, and the metal member 1810 and the first wire layer 1830 may have the same thermal expansion coefficient.
請參閱第6B圖，於本發明另一實施例中，稜鏡底座1800係由五層結構所構成，包括一金屬構件1810、一第一絕緣層1820、以及至少一第一導線層1830、一第二絕緣層1840、以及至少一第二導線層1850。第一絕緣層1820設置於金屬構件1810和第一導線層1830之間，金屬構件1810設置於第一絕緣層1820和第二絕緣層1840，且第二絕緣層1840設置於金屬構件1810和第二導線層1850之間。 Please refer to FIG. 6B. In another embodiment of the present invention, the base 1800 is composed of a five-layer structure, including a metal member 1810, a first insulating layer 1820, and at least a first wire layer 1830, a The second insulating layer 1840 and at least one second wire layer 1850. The first insulating layer 1820 is disposed between the metal member 1810 and the first wire layer 1830, the metal member 1810 is disposed between the first insulating layer 1820 and the second insulating layer 1840, and the second insulating layer 1840 is disposed between the metal member 1810 and the second Between the wire layers 1850.
金屬構件1810的厚度係大於第一絕緣層1820和第一導線層1830的厚度總和，且大於第二絕緣層1840和第二導線層1850的厚度總和，例如可介於0.10mm至0.35mm。金屬構件1810、第一導線層1830和第二導線層1850可具有相同的熱膨脹係數。 The thickness of the metal member 1810 is greater than the sum of the thicknesses of the first insulating layer 1820 and the first wire layer 1830, and is greater than the sum of the thicknesses of the second insulating layer 1840 and the second wire layer 1850. For example, the thickness can be between 0.10 mm and 0.35 mm. The metal member 1810, the first wire layer 1830, and the second wire layer 1850 may have the same coefficient of thermal expansion.
同樣的，第一導線層1830和第二導線層1850可透過模塑互聯物件之方式分別形成於第一絕緣層1820和第二絕緣層1840上，例如透過雷射直接成型、微體積化製程技術、雷射誘導金屬化技術、雷射印刷重組技術、氣懸膠噴印製程、或雙料射出。於一些實施例中，第一導線層1830和第二導線層1850亦可透過鍍膜方式分別形成於第一絕緣層1820和第二絕緣層1840上。 Similarly, the first wire layer 1830 and the second wire layer 1850 can be formed on the first insulating layer 1820 and the second insulating layer 1840 respectively by molding interconnecting objects, for example, by laser direct molding and microvolume process technology. , Laser induced metallization technology, laser printing recombination technology, air suspension adhesive printing process, or dual injection. In some embodiments, the first wiring layer 1830 and the second wiring layer 1850 can also be formed on the first insulating layer 1820 and the second insulating layer 1840 by coating.
由於稜鏡底座1800具有前述結構，因此稜鏡組件M2中不需額外設置電路軟板或印刷電路板，或是在具有塑膠的底座 中埋設線路，因此可達到簡化製程、縮小體積、提高平面度及強度的功效。 Since the 稜鏡 base 1800 has the aforementioned structure, there is no need to additionally provide a flexible circuit board or a printed circuit board in the 稜鏡 base M2, or a plastic base The circuit is buried in the middle, so it can achieve the effects of simplifying the process, reducing the volume, and improving the flatness and strength.
綜上所述，本發明提供一種攝像模組，其中稜鏡組件中的彈性元件可佈設複數條彼此電性獨立的金屬線路，使彈性元件之外觀可保持完整。再者，稜鏡組件中的稜鏡底座可在金屬構件上佈設導線層，使攝像模組具有足夠的硬度以防止碰撞。 In summary, the present invention provides a camera module, in which the elastic element in the cymbal assembly can be provided with a plurality of metal lines that are electrically independent of each other, so that the appearance of the elastic element can be maintained intact. Furthermore, the cymbal base in the cymbal assembly can be provided with a wire layer on the metal member, so that the camera module has sufficient hardness to prevent collision.
雖然本發明的實施例及其優點已揭露如上，但應該瞭解的是，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作更動、替代與潤飾。此外，本發明之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟，任何所屬技術領域中具有通常知識者可從本發明揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟，只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本發明使用。因此，本發明之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外，每一申請專利範圍構成個別的實施例，且本發明之保護範圍也包括各個申請專利範圍及實施例的組合。 Although the embodiments of the present invention and its advantages have been disclosed as above, it should be understood that any person with ordinary knowledge in the technical field can make changes, substitutions and decorations without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufactures, material compositions, devices, methods and steps in the specific embodiments described in the description. Any person with ordinary knowledge in the technical field may disclose the content from the present invention. To understand the current or future development of processes, machines, manufacturing, material composition, devices, methods and steps, as long as they can implement substantially the same functions or achieve approximately the same results in the embodiments described herein, they can be used according to the present invention. Therefore, the protection scope of the present invention includes the above-mentioned processes, machines, manufacturing, material composition, devices, methods, and steps. In addition, each patent application scope constitutes a separate embodiment, and the protection scope of the present invention also includes a combination of each patent application scope and embodiment.
雖然本發明以前述數個較佳實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可做些許之更動與潤飾。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。此 外，每個申請專利範圍建構成一獨立的實施例，且各種申請專利範圍及實施例之組合皆介於本發明之範圍內。 Although the present invention is disclosed in the foregoing several preferred embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make some modifications and retouching without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the appended patent application. this In addition, each patent application scope is constituted as a separate embodiment, and the combination of various patent application scopes and embodiments is within the scope of the present invention.
Claims (20)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017075589A JP2017198979A (en) | 2016-04-08 | 2017-04-05 | Camera module |
| CN201710224747.9A CN107277313B (en) | 2016-04-08 | 2017-04-07 | Camera module |
| US15/482,112 US10269859B2 (en) | 2016-04-08 | 2017-04-07 | Camera module |
| CN201720362645.9U CN206728129U (en) | 2016-04-08 | 2017-04-07 | Camera module |
| US16/296,748 US10700119B2 (en) | 2016-04-08 | 2019-03-08 | Camera module with reflecting member and reflecting member driving assembly for driving reflecting member |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662320096P | 2016-04-08 | 2016-04-08 | |
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| TW201737691A TW201737691A (en) | 2017-10-16 |
| TWI659649B true TWI659649B (en) | 2019-05-11 |
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| TW106108887A TWI620975B (en) | 2016-04-08 | 2017-03-17 | Camera module |
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| TW106108887A TWI620975B (en) | 2016-04-08 | 2017-03-17 | Camera module |
| TW106108890A TWI626501B (en) | 2016-04-08 | 2017-03-17 | Camera module |
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| CN109799591B (en) * | 2017-11-16 | 2022-10-28 | 台湾东电化股份有限公司 | Optical assembly driving mechanism |
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| US6356396B1 (en) * | 2000-02-01 | 2002-03-12 | Raytheon Company | Optical system having a generalized torus optical corrector |
| US20030107661A1 (en) * | 2001-07-20 | 2003-06-12 | Pahr Per Olaf | Double sampling active pixel sensor with double sampling temperature sensor |
| US20080186397A1 (en) * | 2004-07-26 | 2008-08-07 | Samsung Electronics Co., Ltd. | Mobile Phone Camera Module With Optical Zoom |
| US20080290435A1 (en) * | 2007-05-21 | 2008-11-27 | Micron Technology, Inc. | Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methods |
| US20110096419A1 (en) * | 2008-06-17 | 2011-04-28 | Konica Minolta Opto, Inc. | Lens driving device and camera unit |
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| WO2010043078A1 (en) * | 2008-10-14 | 2010-04-22 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Multi-drive mechanism lens actuator |
| JP5079049B2 (en) * | 2009-11-17 | 2012-11-21 | 台湾東電化股▲ふん▼有限公司 | Lens drive device |
| TW201126224A (en) * | 2010-01-28 | 2011-08-01 | Hysonic Co Ltd | Compact image photographing device |
| TWI435109B (en) * | 2011-11-15 | 2014-04-21 | Tdk Taiwan Corp | Elastic supporting structure and optical image stabilizer having the elastic supporting structure |
| CN202334715U (en) * | 2011-11-15 | 2012-07-11 | 台湾东电化股份有限公司 | Elastic support structure for optical image vibration prevention device and optical image vibration prevention device |
| JP6583601B2 (en) * | 2014-08-06 | 2019-10-02 | ミツミ電機株式会社 | Lens holder driving device and camera-equipped mobile terminal |
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- 2017-03-17 TW TW106108889A patent/TWI659649B/en active
- 2017-03-17 TW TW106108887A patent/TWI620975B/en active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6356396B1 (en) * | 2000-02-01 | 2002-03-12 | Raytheon Company | Optical system having a generalized torus optical corrector |
| US20030107661A1 (en) * | 2001-07-20 | 2003-06-12 | Pahr Per Olaf | Double sampling active pixel sensor with double sampling temperature sensor |
| US20080186397A1 (en) * | 2004-07-26 | 2008-08-07 | Samsung Electronics Co., Ltd. | Mobile Phone Camera Module With Optical Zoom |
| US20080290435A1 (en) * | 2007-05-21 | 2008-11-27 | Micron Technology, Inc. | Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methods |
| US20110096419A1 (en) * | 2008-06-17 | 2011-04-28 | Konica Minolta Opto, Inc. | Lens driving device and camera unit |
| US20140333784A1 (en) * | 2013-05-10 | 2014-11-13 | Tdk Taiwan Corp. | Optical Image Stabilizer |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201736928A (en) | 2017-10-16 |
| TW201736936A (en) | 2017-10-16 |
| TWI626501B (en) | 2018-06-11 |
| TWI620975B (en) | 2018-04-11 |
| TW201737691A (en) | 2017-10-16 |
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