TWI657304B - Electronic device and heat drift preventing camera module thereof - Google Patents

Electronic device and heat drift preventing camera module thereof Download PDF

Info

Publication number
TWI657304B
TWI657304B TW106137673A TW106137673A TWI657304B TW I657304 B TWI657304 B TW I657304B TW 106137673 A TW106137673 A TW 106137673A TW 106137673 A TW106137673 A TW 106137673A TW I657304 B TWI657304 B TW I657304B
Authority
TW
Taiwan
Prior art keywords
heat
fixing
item
circuit board
lens
Prior art date
Application number
TW106137673A
Other languages
Chinese (zh)
Other versions
TW201918773A (en
Inventor
陳威錚
張津愷
Original Assignee
群光電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 群光電子股份有限公司 filed Critical 群光電子股份有限公司
Priority to TW106137673A priority Critical patent/TWI657304B/en
Application granted granted Critical
Publication of TWI657304B publication Critical patent/TWI657304B/en
Publication of TW201918773A publication Critical patent/TW201918773A/en

Links

Landscapes

  • Studio Devices (AREA)

Abstract

一種防熱飄移鏡頭模組應用於一電子裝置之一電路板。防熱飄移鏡頭模組包括一防熱飄移座體、一第一卡固件、一鏡筒、一鏡片和一感光件。防熱飄移座體設於電路板上,防熱飄移座體是由防止熱膨脹的材質所製成,其包括一殼體和一第一卡固槽。殼體和電路板之間形成一容納空間。第一卡固槽連接殼體。第一卡固件卡固第一卡固槽。鏡筒卡固第一卡固件。鏡片連接於鏡筒之內。感光件連接電路板,並且位於容納空間內以及位於鏡片下方。A heat-resistant drift lens module is applied to a circuit board of an electronic device. The heat-resistant drift lens module includes a heat-resistant drift mount, a first card holder, a lens barrel, a lens, and a photosensitive member. The heat-resistant drift base is disposed on the circuit board. The heat-resistant drift base is made of a material that prevents thermal expansion. The heat-resistant drift base includes a housing and a first clamping groove. A receiving space is formed between the casing and the circuit board. The first fixing groove is connected to the casing. The first card firmware fixes the first card fixing slot. The lens barrel fixes the first card firmware. The lens is connected inside the lens barrel. The photosensitive member is connected to the circuit board and is located in the accommodation space and under the lens.

Description

電子裝置及其防熱飄移鏡頭模組Electronic device and heat-resistant drift lens module

本發明係關於一種防熱飄移鏡頭模組,特別是一種可以防止殼體受熱變形而造成鏡片的焦距飄移的防熱飄移鏡頭模組。 The invention relates to a heat-resistant drift lens module, in particular to a heat-resistant drift lens module which can prevent the focal length of a lens from shifting due to thermal deformation of the housing.

現在市面上販售的智慧型手機皆具有鏡頭模組,其可供使用者隨時拍攝照片或影片,而對使用者帶來極大的方便性。一般的鏡頭模組是設置在電路板上,鏡頭模組具有鏡頭座、鏡片和感光元件。鏡頭座具有座體和管體,座體的底部連接電路板,管體連接座體。鏡片設於管體之內。感光元件位於座體內部並連接電路板,且感光元件和鏡片之間具有一定焦 距離。在攝影時,鏡片會將光線傳送到定焦距離上的感光元件,而讓光線清楚得在感光元件上成像。 Smartphones currently on the market all have a lens module, which allows users to take photos or videos at any time, which brings great convenience to users. A general lens module is disposed on a circuit board, and the lens module includes a lens holder, a lens, and a photosensitive element. The lens holder has a base body and a tube body, the bottom of the base body is connected to the circuit board, and the tube body is connected to the base body. The lens is set inside the tube body. The photosensitive element is located inside the base and connected to the circuit board, and there is a certain focus between the photosensitive element and the lens distance. When photographing, the lens transmits light to the photosensitive element at a fixed focal distance, so that the light is clearly imaged on the photosensitive element.

然而,若是使用者頻繁得操作智慧型手機的各種軟體(例如拍攝軟體或遊戲軟體),則很容易讓電路板以及感光元件散發大量熱能。散發的熱能會傳導至鏡頭座,而讓鏡頭座受熱膨脹;如此一來,受熱而體積改變的鏡頭座會影響鏡片和感光元件和之間的距離,使得鏡片的焦距飄移(即為熱飄移之現象),而導致拍攝的影像品質劣化。 However, if the user frequently operates various software (such as shooting software or game software) of the smart phone, it is easy for the circuit board and the photosensitive element to emit a large amount of heat energy. The emitted thermal energy will be transmitted to the lens holder, which will cause the lens holder to expand due to heat. In this way, the lens holder that changes its volume when heated will affect the distance between the lens and the photosensitive element, causing the focal length of the lens to drift (that is, Phenomenon), and the quality of the captured image deteriorates.

因此,有必要提供一種可以防止殼體受熱變形而造成鏡片的焦距飄移的鏡頭模組。 Therefore, it is necessary to provide a lens module that can prevent the focal length of the lens from being shifted due to thermal deformation of the housing.

本發明之主要目的係在提供一種可以防止殼體受熱變形而造成鏡片的焦距飄移的防熱飄移鏡頭模組。 The main object of the present invention is to provide a heat-resistant drift lens module which can prevent the focal length of the lens from being shifted due to heat deformation of the housing.

為達成上述之目的,本發明之一種防熱飄移鏡頭模組應用於一電子裝置之一電路板。防熱飄移鏡頭模組包括一防熱飄移座體、一第一卡固件、一鏡筒、一鏡片和一感光件。防熱飄移座體設於電路板上,防熱飄移座體是由防止熱膨脹的材質所製成,其包括一殼體和一第一卡固槽。殼體和電路板之間形成一容納空 間。第一卡固槽連接殼體。第一卡固件卡固第一卡固槽。鏡筒卡固第一卡固件。鏡片連接於鏡筒之內。感光件連接電路板,並且位於容納空間內以及位於鏡片下方。 To achieve the above object, a heat-resistant drift lens module of the present invention is applied to a circuit board of an electronic device. The heat-resistant drift lens module includes a heat-resistant drift mount, a first card holder, a lens barrel, a lens, and a photosensitive member. The heat-resistant drift base is disposed on the circuit board. The heat-resistant drift base is made of a material that prevents thermal expansion. The heat-resistant drift base includes a housing and a first clamping groove. A receiving space is formed between the housing and the circuit board between. The first fixing groove is connected to the casing. The first card firmware fixes the first card fixing slot. The lens barrel fixes the first card firmware. The lens is connected inside the lens barrel. The photosensitive member is connected to the circuit board and is located in the accommodation space and under the lens.

根據本發明之一實施例,其中殼體更包括一頂壁和複數側壁。頂壁連接複數側壁,且頂壁、複數側壁以及電路板之間形成一容納空間。 According to an embodiment of the present invention, the housing further includes a top wall and a plurality of side walls. The top wall is connected to the plurality of side walls, and an accommodation space is formed between the top wall, the plurality of side walls, and the circuit board.

根據本發明之一實施例,其中殼體更包括一開口,開口設於頂壁,第一卡固槽環繞開口。 According to an embodiment of the present invention, the housing further includes an opening, the opening is disposed on the top wall, and the first fixing groove surrounds the opening.

根據本發明之一實施例,防熱飄移鏡頭模組更包括至少一第二卡固件,且防熱飄移座體更包括至少一第二卡固槽。至少一第二卡固槽設於其中一側壁,且至少一第二卡固槽和至少一第二卡固件互相卡固。 According to an embodiment of the present invention, the heat-resistant drift lens module further includes at least one second fixing member, and the heat-resistant drift mount further includes at least one second fixing slot. At least one second fixing groove is disposed on one of the side walls, and at least one second fixing groove and at least one second fixing member are fastened to each other.

根據本發明之一實施例,其中第一卡固件更包括一螺紋部和一卡固環,且鏡筒更包括一對應螺紋部。螺紋部卡固對應螺紋部。卡固環卡固第一卡固槽。 According to an embodiment of the present invention, the first fastener further includes a threaded portion and a retaining ring, and the lens barrel further includes a corresponding threaded portion. The threaded portion is clamped corresponding to the threaded portion. The retaining ring engages the first retaining groove.

根據本發明之一實施例,其中至少一第二卡固件更包括一卡固塊,卡固塊卡固至少一第二卡固槽。 According to an embodiment of the present invention, the at least one second card firmware further includes a card fixing block, and the card fixing block fixes at least one second card fixing slot.

根據本發明之一實施例,防熱飄移鏡頭模組更包括至少一卡固桿,且至少一第二卡固件更包括一通孔。至少一卡固桿穿過電路板且卡固至少一第二卡固件之通孔。 According to an embodiment of the present invention, the heat-resistant drift lens module further includes at least one fixing rod, and the at least one second fixing member further includes a through hole. At least one fixing rod passes through the circuit board and fixes at least one through hole of the second fixing member.

根據本發明之一實施例,其中卡固環和第一卡固槽之間的卡固關係,以及卡固塊和至少一第二卡固槽之間的卡固關係,是藉由一嵌件成型製程而形成。 According to an embodiment of the present invention, the clamping relationship between the clamping ring and the first clamping groove, and the clamping relationship between the clamping block and at least one second clamping groove are provided by an insert Forming process.

根據本發明之一實施例,其中卡固環和第一卡固槽之間的卡固關係,以及卡固塊和至少一第二卡固槽之間的卡固關係,是藉由點膠固定而形成。 According to an embodiment of the present invention, the fixing relationship between the fixing ring and the first fixing groove, and the fixing relationship between the fixing block and the at least one second fixing groove are fixed by dispensing. And formed.

根據本發明之一實施例,其中製成防熱飄移座體的材質是陶瓷或碳纖維。 According to an embodiment of the present invention, the material of the heat-resistant drift base is ceramic or carbon fiber.

根據本發明之一實施例,其中第一卡固件和至少一第二卡固件的材質是塑膠。 According to an embodiment of the invention, a material of the first card firmware and at least one second card firmware is plastic.

本發明之另一主要目的係在提供一種可以防止殼體受熱變形而造成鏡片的焦距飄移的電子裝置。 Another main object of the present invention is to provide an electronic device which can prevent the focal length of the lens from shifting due to heat deformation of the housing.

為達成上述之目的,本發明之電子裝置包括一電路板和一防熱飄移鏡頭模組。防熱飄移鏡頭模組包括一防熱飄移座體、一第一卡固件、一鏡筒、一鏡片和一感光件。防熱飄移座體設於 電路板上,防熱飄移座體是由防止熱膨脹的材質所製成,其包括一殼體和一第一卡固槽。殼體和電路板之間形成一容納空間。第一卡固槽連接殼體。第一卡固件卡固第一卡固槽。鏡筒卡固第一卡固件。鏡片連接於鏡筒之內。感光件連接電路板,並且位於容納空間內以及位於鏡片下方。 To achieve the above-mentioned object, the electronic device of the present invention includes a circuit board and a heat-resistant drift lens module. The heat-resistant drift lens module includes a heat-resistant drift mount, a first card holder, a lens barrel, a lens, and a photosensitive member. Heat-resistant drift base The circuit board has a heat-resistant drift base made of a material that prevents thermal expansion, and includes a housing and a first retaining groove. A receiving space is formed between the casing and the circuit board. The first fixing groove is connected to the casing. The first card firmware fixes the first card fixing slot. The lens barrel fixes the first card firmware. The lens is connected inside the lens barrel. The photosensitive member is connected to the circuit board and is located in the accommodation space and under the lens.

1‧‧‧防熱飄移鏡頭模組 1‧‧‧ Heat-resistant drift lens module

10‧‧‧防熱飄移座體 10‧‧‧ Heat-resistant drift base

11‧‧‧殼體 11‧‧‧shell

111‧‧‧頂壁 111‧‧‧ top wall

112‧‧‧側壁 112‧‧‧ sidewall

113‧‧‧開口 113‧‧‧ opening

114‧‧‧容納空間 114‧‧‧accommodating space

12‧‧‧第一卡固槽 12‧‧‧The first card fixing slot

13‧‧‧第二卡固槽 13‧‧‧Second card fixing slot

20‧‧‧第一卡固件 20‧‧‧The first card firmware

21‧‧‧螺紋部 21‧‧‧Thread

22‧‧‧卡固環 22‧‧‧Cargo Ring

30‧‧‧第二卡固件 30‧‧‧second card firmware

31‧‧‧卡固塊 31‧‧‧Fixed block

32‧‧‧通孔 32‧‧‧through hole

40‧‧‧鏡筒 40‧‧‧ lens barrel

41‧‧‧對應螺紋部 41‧‧‧ Corresponding thread

50‧‧‧鏡片 50‧‧‧ Lenses

60‧‧‧感光件 60‧‧‧Photosensitive

70‧‧‧卡固桿 70‧‧‧ Clamping rod

100‧‧‧電子裝置 100‧‧‧ electronic device

110‧‧‧電路板 110‧‧‧Circuit board

圖1係本發明之一實施例之電子裝置之示意圖。 FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present invention.

圖2係本發明之一實施例之電路板上的防熱飄移鏡頭模組之示意圖。 FIG. 2 is a schematic diagram of a heat-resistant drift lens module on a circuit board according to an embodiment of the present invention.

圖3係本發明之一實施例之電路板上的防熱飄移鏡頭模組之剖面圖。 3 is a cross-sectional view of a heat-resistant drift lens module on a circuit board according to an embodiment of the present invention.

圖4係本發明之一實施例之防熱飄移座體、第一卡固件和第二卡固件之立體分解圖。 FIG. 4 is an exploded perspective view of a heat-resistant drift base, a first card holder and a second card holder according to an embodiment of the present invention.

為能讓 貴審查委員能更瞭解本發明之技術內容,特舉較佳具體實施例說明如下。 In order to make your reviewing committee better understand the technical content of the present invention, specific preferred embodiments are described below.

以下請一併參考圖1至圖4關於本發明之電子裝置和防熱飄移鏡頭模組。圖1係本發明之一實施例之電子裝置之示意圖;圖2係本發明之一實施例之電路板上的防熱飄移鏡頭模組之示意圖;圖3係本發明之一實施例之電路板上的防熱飄移鏡頭模組之剖面圖;圖4係本發明之一實施例之防熱飄移座體、第一卡固件和第二卡固件之立體分解圖。 In the following, please refer to FIG. 1 to FIG. 4 together regarding the electronic device and the thermal drift lens module of the present invention. FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present invention; FIG. 2 is a schematic diagram of a heat-resistant drift lens module on a circuit board according to an embodiment of the present invention; and FIG. 3 is a circuit board according to an embodiment of the present invention FIG. 4 is an exploded perspective view of a thermal drift prevention base, a first card firmware, and a second card firmware according to an embodiment of the present invention.

如圖1至圖3所示,在本發明之一實施例之中,電子裝置100例如為一智慧型手機,但其種類並不以此為限,其也可以為平板電腦或其他具有攝影功能的裝置。電子裝置100包括一電路板110和一防熱飄移鏡頭模組1。電路板100用以設置電子裝置100之內部電子元件。防熱飄移鏡頭模組1是具有防止熱飄移功能的鏡頭模組,其用以攝影並且可以防止受熱變形而造成焦距飄移的熱飄移問題。防熱飄移鏡頭模組1設於電路板110上,防熱飄移鏡頭模組1包括一防熱飄移座體10、一第一卡固件20、二個第二卡固件30、一鏡筒40、一鏡片50、一感光件60和二個卡固桿70。但是第二卡固件30和卡固桿70的數量並不以二個為限,其數量可以依照設計需求而改變為一個。 As shown in FIG. 1 to FIG. 3, in an embodiment of the present invention, the electronic device 100 is, for example, a smart phone, but the type is not limited to this. It can also be a tablet computer or other cameras with functions. installation. The electronic device 100 includes a circuit board 110 and a heat-resistant drift lens module 1. The circuit board 100 is used to set internal electronic components of the electronic device 100. The thermal drift prevention lens module 1 is a lens module with a thermal drift prevention function, which is used for photography and can prevent the thermal drift problem caused by the focal length drift caused by thermal deformation. The heat-resistant drift lens module 1 is disposed on the circuit board 110. The heat-resistant drift lens module 1 includes a heat-resistant drift mount 10, a first card holder 20, two second card holders 30, a lens barrel 40, and a lens 50. A photosensitive member 60 and two fixing levers 70. However, the number of the second fixing member 30 and the fixing rod 70 is not limited to two, and the number may be changed to one according to design requirements.

在本發明之一實施例之中,如圖2至圖4所示,防熱飄移座體10可以防止受熱而造成體積改變,防熱飄移座體10設於電路板110上。防熱飄移座體10包括一殼體11、一第一卡固槽12和二個第二卡固槽13。防熱飄移座體10是由防止熱膨脹的一材質所製成,例如熱性線膨脹係數趨近於零的陶瓷或碳纖維,熱性線膨脹係數趨近於零的該些材質在溫度升高情況下,幾乎不發生任何體積變化,因此可以防止受熱而造成體積改變;然而,防熱飄移座體10的材質並不以陶瓷或碳纖維為限,其亦可為其他熱性線膨脹係數低的材質。殼體11包括一頂壁111、四個側壁112和一開口113;但是側壁112的數量並不以四個為限,其可依照設計需求而增減。頂壁111連接四個側壁112,且頂壁111、四個側壁112以及電路板110之間形成一容納空間114,容納空間114用以容納感光件60。開口113設於頂壁111,開口113用以供外部光線通過而發射至容納空間114內的感光件60。第一卡固槽12連接殼體11並環繞開口113,第一卡固槽12是一環形的凹槽,其用以卡固第一卡固件20。二個第二卡固槽13分別設於互相相對的二個側壁112上,且二個第二卡固槽13用以分別和二個第二卡固件30互相卡 固。但是第二卡固槽13的數量並不以二個為限,其可配合第二卡固件30的數量而變更為一個。 In one embodiment of the present invention, as shown in FIG. 2 to FIG. 4, the thermal drift prevention base 10 can prevent the volume change caused by heat. The thermal drift prevention base 10 is disposed on the circuit board 110. The heat-resistant drift base 10 includes a casing 11, a first fixing groove 12 and two second fixing grooves 13. The thermal drift prevention base 10 is made of a material that prevents thermal expansion, such as ceramics or carbon fibers whose thermal linear expansion coefficient is close to zero, and those materials whose thermal linear expansion coefficient is close to zero almost increase under temperature. There is no volume change, so it can prevent volume change due to heat; however, the material of the heat-resistant drift base 10 is not limited to ceramic or carbon fiber, and it can also be other materials with low thermal linear expansion coefficient. The housing 11 includes a top wall 111, four side walls 112, and an opening 113; however, the number of the side walls 112 is not limited to four, and can be increased or decreased according to design requirements. The top wall 111 is connected to the four side walls 112, and a receiving space 114 is formed between the top wall 111, the four side walls 112, and the circuit board 110. The receiving space 114 is used to receive the photosensitive member 60. The opening 113 is provided on the top wall 111, and the opening 113 is used for the external light to pass through and be emitted to the photosensitive member 60 in the accommodation space 114. The first fixing groove 12 is connected to the casing 11 and surrounds the opening 113. The first fixing groove 12 is an annular groove for fixing the first fixing member 20. The two second fixing grooves 13 are respectively provided on two side walls 112 opposite to each other, and the two second fixing grooves 13 are used for locking with the two second fixing members 30 respectively. solid. However, the number of the second card fixing slots 13 is not limited to two, and it can be changed to one according to the number of the second card fixing members 30.

在本發明之一實施例之中,如圖2至圖4所示,第一卡固件20是一環形結構,第一卡固件20的材質是塑膠;透過塑膠射出製程,由可塑性高的塑膠材質製成的第一卡固件20可以被製作成具有細緻的卡固結構(例如螺紋或是環型卡固片),以卡固住鏡筒40和第一卡固槽12。第一卡固件20包括一螺紋部21和一卡固環22。螺紋部21位於第一卡固件20之環形結構的內側表面,螺紋部21用以卡固鏡筒40。卡固環22位於第一卡固件20之環形結構的外側表面,卡固環22卡固第一卡固槽12,且卡固環22和第一卡固槽12之間的卡固關係是藉由嵌件成型製程而形成。值得一提的是,前述之卡固環22和第一卡固槽12之間的卡固關係不以嵌件成型為限,也可透過點膠的方式加以固定。 In an embodiment of the present invention, as shown in FIG. 2 to FIG. 4, the first card holder 20 is a ring structure, and the material of the first card holder 20 is plastic; through a plastic injection process, a plastic material with high plasticity is used. The finished first fixing member 20 can be made into a detailed fixing structure (such as a screw or a ring-shaped fixing piece) to hold the lens barrel 40 and the first fixing groove 12. The first fastener 20 includes a threaded portion 21 and a retaining ring 22. The screw portion 21 is located on the inner surface of the annular structure of the first fastening member 20. The screw portion 21 is used to fix the lens barrel 40. The retaining ring 22 is located on the outer surface of the annular structure of the first retaining member 20. The retaining ring 22 engages the first retaining groove 12. The retaining relationship between the retaining ring 22 and the first retaining groove 12 is obtained by borrowing. Formed by insert molding process. It is worth mentioning that the above-mentioned clamping relationship between the clamping ring 22 and the first clamping groove 12 is not limited to insert molding, and can also be fixed by means of dispensing.

在本發明之一實施例之中,如圖2至圖4所示,二個第二卡固件30用以配合二個卡固桿70,而使防熱飄移座體10和電路板110穩固得互相結合。各個第二卡固件30的材質是塑膠;透過塑膠射出製程,由可塑性高的塑膠材質製成的第二卡固件30可以被製作成具有細緻的卡固結構(例如通孔或是長方型卡固塊)。各個第二卡 固件30包括一長方型的卡固塊31和一通孔32。二個第二卡固件30之卡固塊31分別卡固長方形的二個第二卡固槽13;各個卡固塊31和各個第二卡固槽13之間的卡固關係,是藉由嵌件成型製程而形成。二個卡固桿70例如為螺絲或釘子,二個卡固桿70穿過電路板110且分別卡固二個第二卡固件30之通孔32。因此,藉由卡固桿70和通孔32之間的卡固關係,以及第二卡固槽13和卡固塊31之間的卡固關係,可使防熱飄移座體10和電路板110穩固得互相結合。值得一提的是,前述之卡固塊31和第二卡固槽13之間的卡固關係,也可透過點膠的方式加以固定。 In an embodiment of the present invention, as shown in FIGS. 2 to 4, the two second fixing members 30 are used to cooperate with the two fixing rods 70, so that the heat-resistant drift base 10 and the circuit board 110 are fixed to each other Combined. The material of each second card fastener 30 is plastic; through the plastic injection process, the second card fastener 30 made of highly plastic plastic material can be made into a detailed locking structure (such as a through hole or a rectangular card) Solid block). Each second card The firmware 30 includes a rectangular fixing block 31 and a through hole 32. The two fixing blocks 31 of the two second fixing members 30 respectively fix the two second fixing slots 13 of a rectangular shape; the locking relationship between each fixing block 31 and each of the second fixing slots 13 is by embedding. Formed during the molding process. The two fixing rods 70 are, for example, screws or nails. The two fixing rods 70 pass through the circuit board 110 and respectively fix the through holes 32 of the two second fixing members 30. Therefore, by the clamping relationship between the clamping rod 70 and the through hole 32, and the clamping relationship between the second clamping groove 13 and the clamping block 31, the thermal drift prevention base 10 and the circuit board 110 can be stabilized. Have to be combined with each other. It is worth mentioning that the clamping relationship between the aforementioned clamping block 31 and the second clamping groove 13 can also be fixed by means of dispensing.

在本發明之一實施例之中,鏡筒40用以卡固鏡片50並且和第一卡固件20互相結合。鏡筒40呈現為一管狀結構,鏡筒40包括一對應螺紋部41,對應螺紋部41位於鏡筒40之管狀結構的外側表面,對應螺紋部41卡固第一卡固件20之螺紋部21。鏡片50連接於鏡筒40之管狀結構之內,鏡片50用以供外部的光線通過,並且可將光線聚焦至容納空間114內的感光件60上。感光件60連接電路板110,並且位於容納空間114內以及位於鏡片50下方。感光件60與鏡片50之間具有一定焦距離。感光件60用以接 收鏡片50傳來的聚焦之光線;藉由感光件60與鏡片50之間的定焦距離,鏡片50傳來的聚焦之光線會在感光件60上清楚得成像。 In one embodiment of the present invention, the lens barrel 40 is used for fixing the lens 50 and is combined with the first fixing member 20. The lens barrel 40 has a tubular structure. The lens barrel 40 includes a corresponding threaded portion 41. The corresponding threaded portion 41 is located on the outer surface of the tubular structure of the lens barrel 40. The corresponding threaded portion 41 secures the threaded portion 21 of the first fastener 20. The lens 50 is connected to the tubular structure of the lens barrel 40. The lens 50 is used for external light to pass through and can focus the light onto the photosensitive member 60 in the accommodation space 114. The photosensitive member 60 is connected to the circuit board 110 and is located in the receiving space 114 and below the lens 50. There is a certain focal distance between the photosensitive member 60 and the lens 50. Photosensitive member 60 is used to connect Focused light transmitted from the receiving lens 50; with the fixed focus distance between the photosensitive member 60 and the lens 50, the focused light transmitted from the lens 50 will be clearly imaged on the photosensitive member 60.

如圖2至圖4所示,,防熱飄移座體10是由防止熱膨脹、熱性線膨脹係數趨近於零的材質所製成,然而該些材質通常較為堅硬,實務上較難以製作成結構精緻的卡固結構(例如螺紋),但仍可製作成結構簡易的卡固槽之結構,例如第一卡固槽12以及二個第二卡固槽13。第一卡固件20和二個第二卡固件30則是用可塑性高的塑膠所製成,其可被製作成細緻的卡固結構(例如螺紋、卡固片、卡固塊或通孔等等)。藉由嵌件成型製程,具有細緻的卡固結構的第一卡固件20和二個第二卡固件30可以分別和第一卡固槽12以及二個第二卡固槽13互相結合。如此一來,互相結合的防熱飄移座體10、第一卡固件20和二個第二卡固件30具有防止熱飄移的功能,並也具有細緻的卡固結構以進一步和鏡筒40以及電路板110互相結合。 As shown in FIG. 2 to FIG. 4, the thermal drift prevention base 10 is made of a material that prevents thermal expansion and has a coefficient of linear thermal expansion that is close to zero. However, these materials are usually hard and difficult to make exquisite structures in practice. A locking structure (such as a thread), but it can still be made into a structure with a simple structure, such as a first locking groove 12 and two second locking grooves 13. The first fixing member 20 and the two second fixing members 30 are made of highly plastic plastic, which can be made into a detailed fixing structure (such as a thread, a fixing piece, a fixing block or a through hole, etc.) ). Through the insert molding process, the first fixing member 20 and the two second fixing members 30 having the detailed fixing structure can be combined with the first fixing slot 12 and the two second fixing slots 13 respectively. In this way, the combined heat-resistant drift base 10, the first card holder 20, and the two second card holders 30 have a function of preventing heat drift, and also have a detailed locking structure to further interact with the lens barrel 40 and the circuit board. 110 combined with each other.

如圖1至圖4所示,當使用者頻繁得操作電子裝置100,使得電子裝置100之電路板110以及感光元件60散發熱能時,熱能會先傳導給防熱飄移座體10。由於防熱飄移座體10是由防止熱膨脹、熱性線膨脹係數趨近於零的材質所製成,因此防熱飄移座體10幾乎 不發生任何體積變化。另外,防熱飄移座體10、第一卡固件20和二個第二卡固件30是獨立的元件,防熱飄移座體10、第一卡固件20和二個第二卡固件30是靠著各自的卡固結構而互相結合;而且防熱飄移座體10之第一卡固槽12以及二個第二卡固槽13、第一卡固件20之螺紋部21和卡固環22,和二個第二卡固件30之卡固塊31的表面並非完全光滑,該些元件的表面上仍會有極細微的凹凸不平的空隙;因此,當防熱飄移座體10之第一卡固槽12以及二個第二卡固槽13、第一卡固件20之螺紋部21和卡固環22,和二個第二卡固件30之卡固塊31互相結合時,該些元件的凹凸不平的表面會彼此貼合並讓少許空氣位於凹凸不平的空隙裡,而該些空氣會有效阻礙熱量傳遞;也就是說,傳導給防熱飄移座體10的熱能會難以進一步得傳遞給第一卡固件20、二個第二卡固件30和鏡筒40。因此,即使第一卡固件20、二個第二卡固件30和鏡筒40並不是以防止熱膨脹得材質所製成,第一卡固件20、二個第二卡固件30和鏡筒40也不會受到電路板110和感光元件60散發熱能影響。因此,當電路板110和感光元件60散發熱能時,防熱飄移座體10、第一卡固件20、二個第二卡固件30和鏡筒40都不會受到熱能影 響,也不會改變體積,如此一來即可防止受熱變形而造成焦距飄移的熱飄移問題。 As shown in FIG. 1 to FIG. 4, when a user frequently operates the electronic device 100 so that the circuit board 110 and the photosensitive element 60 of the electronic device 100 dissipate heat energy, the heat energy is first transmitted to the heat-resistant drift base 10. Since the thermal drift prevention base 10 is made of a material that prevents thermal expansion and the thermal linear expansion coefficient approaches zero, the thermal drift prevention base 10 is almost No volume change occurred. In addition, the heat-resistant drift base 10, the first card holder 20, and the two second card holders 30 are independent components, and the heat-resistant drift base 10, the first card holder 20, and the two second card holders 30 are against each other. The fastening structure is combined with each other; moreover, the first retaining groove 12 and two second retaining grooves 13 of the heat-resistant drift base 10, the threaded portion 21 and the retaining ring 22 of the first retaining member 20, and two second retaining grooves 22 The surface of the fixing block 31 of the fixing member 30 is not completely smooth, and there will still be extremely fine uneven spaces on the surface of these components; therefore, when the first fixing groove 12 and the second When the two fixing grooves 13, the threaded portion 21 and the fixing ring 22 of the first fixing member 20 and the fixing blocks 31 of the two second fixing members 30 are combined with each other, the uneven surfaces of these components will be attached to each other. Let a little air be in the uneven space, and the air will effectively hinder the heat transfer; that is, the heat energy transmitted to the heat-resistant drift base 10 will be difficult to further transfer to the first card holder 20 and the two second cards. Firmware 30 and lens barrel 40. Therefore, even if the first card holder 20, the two second card holders 30, and the lens barrel 40 are not made of a material that prevents thermal expansion, the first card holder 20, the two second card holders 30, and the lens barrel 40 are not made. It is affected by the heat generated by the circuit board 110 and the photosensitive element 60. Therefore, when the circuit board 110 and the photosensitive element 60 dissipate heat, the thermal drift prevention base 10, the first fixing member 20, the two second fixing members 30, and the lens barrel 40 are not affected by the thermal energy. It will not change the volume, so that it can prevent the thermal drift problem caused by the focal length drift caused by thermal deformation.

藉由本發明之電子裝置100及其防熱飄移鏡頭模組1之結構,可防止受熱變形而造成焦距飄移的熱飄移問題,以便使用者安心得拍攝出清晰的照片或影片。 With the structure of the electronic device 100 and the heat-resistant drift lens module 1 of the present invention, the thermal drift problem caused by the focal length drift caused by thermal deformation can be prevented, so that users can take clear pictures or videos with peace of mind.

需注意的是,上述僅為實施例,而非限制於實施例。譬如此不脫離本發明基本架構者,皆應為本專利所主張之權利範圍,而應以專利申請範圍為準。 It should be noted that the above are merely examples, and are not limited to the examples. For example, those who do not depart from the basic structure of the present invention should be the scope of the rights claimed by the patent, and the scope of the patent application shall prevail.

Claims (20)

一種防熱飄移鏡頭模組,應用於一電子裝置之一電路板,該防熱飄移鏡頭模組包括:一防熱飄移座體,設於該電路板上,該防熱飄移座體是由防止熱膨脹的一材質所製成,該防熱飄移座體包括:一殼體,其中該殼體和該電路板之間形成一容納空間,該殼體更包括複數側壁;一第一卡固槽,連接該殼體;以及至少一第二卡固槽,設於其中一側壁;一第一卡固件,卡固該第一卡固槽;至少一第二卡固件,和該至少一第二卡固槽互相卡固;一鏡筒,卡固該第一卡固件;一鏡片,連接於該鏡筒之內;以及一感光件,連接該電路板,並且位於該容納空間內以及位於該鏡片下方。A heat-resistant drift lens module is applied to a circuit board of an electronic device. The heat-resistant drift lens module includes: a heat-resistant drift mount provided on the circuit board. The heat-resistant drift mount is made of a material that prevents thermal expansion. The heat-resistant drift base is made of: a shell, wherein a receiving space is formed between the shell and the circuit board, the shell further includes a plurality of side walls; a first fixing groove is connected to the shell; And at least one second fixing groove provided on one of the side walls; a first fixing member for fixing the first fixing groove; at least one second fixing member and the at least one second fixing groove; A lens barrel is used to fix the first fastener; a lens is connected to the lens barrel; and a photosensitive member is connected to the circuit board and is located in the accommodating space and below the lens. 如申請專利範圍第1項所述之防熱飄移鏡頭模組,其中該殼體更包括一頂壁;該頂壁連接該複數側壁,且該頂壁、該複數側壁以及該電路板之間形成一容納空間。The heat-resistant drift lens module according to item 1 of the patent application scope, wherein the housing further includes a top wall; the top wall is connected to the plurality of side walls, and a gap is formed between the top wall, the plurality of side walls, and the circuit board. Accommodate space. 如申請專利範圍第2項所述之防熱飄移鏡頭模組,其中該殼體更包括一開口,該開口設於該頂壁,該第一卡固槽環繞該開口。The heat-resistant drift lens module according to item 2 of the patent application scope, wherein the housing further includes an opening, the opening is provided on the top wall, and the first fixing groove surrounds the opening. 如申請專利範圍第3項所述之防熱飄移鏡頭模組,其中該第一卡固件更包括一螺紋部和一卡固環,且該鏡筒更包括一對應螺紋部;該螺紋部卡固該對應螺紋部;該卡固環卡固該第一卡固槽。The heat-resistant drift lens module according to item 3 of the scope of patent application, wherein the first fastener further includes a threaded portion and a retaining ring, and the lens barrel further includes a corresponding threaded portion; Corresponding to the thread portion; the retaining ring is used for retaining the first retaining groove. 如申請專利範圍第3項所述之防熱飄移鏡頭模組,其中該至少一第二卡固件更包括一卡固塊,該卡固塊卡固該至少一第二卡固槽。The heat-resistant drift lens module according to item 3 of the scope of patent application, wherein the at least one second card firmware further includes a card fixing block, and the card fixing block fixes the at least one second card fixing slot. 如申請專利範圍第3項所述之防熱飄移鏡頭模組,更包括至少一卡固桿,且該至少一第二卡固件更包括一通孔;該至少一卡固桿穿過該電路板且卡固該至少一第二卡固件之該通孔。The heat-resistant drift lens module described in item 3 of the patent application scope further includes at least one fixing rod, and the at least one second fixing member further includes a through hole; the at least one fixing rod passes through the circuit board and the card Fixing the through hole of the at least one second card firmware. 如申請專利範圍第4項所述之防熱飄移鏡頭模組,其中該卡固環和該第一卡固槽之間的卡固關係,以及該卡固塊和該至少一第二卡固槽之間的卡固關係,是藉由一嵌件成型製程而形成。The heat-resistant drift lens module according to item 4 of the scope of the patent application, wherein the locking relationship between the retaining ring and the first retaining groove, and between the retaining block and the at least one second retaining groove The clamping relationship between them is formed by an insert molding process. 如申請專利範圍第4項所述之防熱飄移鏡頭模組,其中該卡固環和該第一卡固槽之間的卡固關係,以及該卡固塊和該至少一第二卡固槽之間的卡固關係,是藉由點膠固定而形成。The heat-resistant drift lens module according to item 4 of the scope of the patent application, wherein the locking relationship between the retaining ring and the first retaining groove, and between the retaining block and the at least one second retaining groove The clamping relationship between them is formed by dispensing and fixing. 如申請專利範圍第7項所述之防熱飄移鏡頭模組,其中製成該防熱飄移座體的該材質是陶瓷或碳纖維。The heat-resistant drift lens module according to item 7 of the scope of the patent application, wherein the material used to make the heat-resistant drift mount is ceramic or carbon fiber. 如申請專利範圍第3項所述之防熱飄移鏡頭模組,其中該第一卡固件和該至少一第二卡固件的材質是塑膠。The heat-resistant drift lens module according to item 3 of the scope of patent application, wherein the material of the first card firmware and the at least one second card firmware is plastic. 一種電子裝置,包括:一電路板;以及一防熱飄移鏡頭模組,包括:一防熱飄移座體,設於該電路板上,該防熱飄移座體是由防止熱膨脹的一材質所製成,該防熱飄移座體包括:一殼體,其中該殼體和該電路板之間形成一容納空間,該殼體更包括複數側壁;一第一卡固槽,連接該殼體;以及至少一第二卡固槽,設於其中一側壁;一第一卡固件,卡固該第一卡固槽;至少一第二卡固件,和該至少一第二卡固槽互相卡固;一鏡筒,卡固該第一卡固件;一鏡片,連接於該鏡筒之內;以及一感光件,連接該電路板,並且位於該容納空間內以及位於該鏡片下方。An electronic device includes: a circuit board; and a heat-resistant drift lens module, including: a heat-resistant drift mount provided on the circuit board, the heat-resistant drift mount made of a material that prevents thermal expansion, the The heat-resistant drift base includes: a casing, wherein an accommodation space is formed between the casing and the circuit board, the casing further includes a plurality of side walls; a first fixing groove connected to the casing; and at least one second A fixing slot is provided on one of the side walls; a first fixing member for fixing the first fixing slot; at least one second fixing member and the at least one second fixing slot are fixed to each other; a lens barrel and a fixing member; A first lens is fixed; a lens is connected in the lens barrel; and a photosensitive member is connected to the circuit board and is located in the accommodating space and below the lens. 如申請專利範圍第11項所述之電子裝置,其中該殼體更包括一頂壁;該頂壁連接該複數側壁,且該頂壁、該複數側壁以及該電路板之間形成一容納空間。The electronic device according to item 11 of the patent application scope, wherein the housing further includes a top wall; the top wall is connected to the plurality of side walls, and a receiving space is formed between the top wall, the plurality of side walls and the circuit board. 如申請專利範圍第12項所述之電子裝置,其中該殼體更包括一開口,該開口設於該頂壁,該第一卡固槽環繞該開口。The electronic device according to item 12 of the application, wherein the housing further includes an opening, the opening is provided on the top wall, and the first fixing groove surrounds the opening. 如申請專利範圍第13項所述之電子裝置,其中該第一卡固件更包括一螺紋部和一卡固環,且該鏡筒更包括一對應螺紋部;該螺紋部卡固該對應螺紋部;該卡固環卡固該第一卡固槽。The electronic device according to item 13 of the scope of patent application, wherein the first fastener further includes a threaded portion and a retaining ring, and the lens barrel further includes a corresponding threaded portion; the threaded portion secures the corresponding threaded portion. ; The retaining ring is used for retaining the first retaining groove. 如申請專利範圍第13項所述之電子裝置,其中該至少一第二卡固件更包括一卡固塊,該卡固塊卡固該至少一第二卡固槽。The electronic device according to item 13 of the scope of patent application, wherein the at least one second card firmware further includes a card fixing block, and the card fixing block fixes the at least one second card fixing slot. 如申請專利範圍第13項所述之電子裝置,其中該防熱飄移鏡頭模組更包括至少一卡固桿,且該至少一第二卡固件更包括一通孔;該至少一卡固桿穿過該電路板且卡固該至少一第二卡固件之該通孔。The electronic device according to item 13 of the patent application scope, wherein the heat-resistant drift lens module further includes at least one fixing rod, and the at least one second fixing member further includes a through hole; the at least one fixing rod passes through the The circuit board fixes the through hole of the at least one second card firmware. 如申請專利範圍第14項所述之電子裝置,其中該卡固環和該第一卡固槽之間的卡固關係,以及該卡固塊和該至少一第二卡固槽之間的卡固關係,是藉由一嵌件成型製程而形成。The electronic device according to item 14 of the scope of patent application, wherein the clamping relationship between the retaining ring and the first retaining groove, and the card between the retaining block and the at least one second retaining groove The solid relationship is formed by an insert molding process. 利範圍第14項所述之電子裝置,其中該卡固環和該第一卡固槽之間的卡固關係,以及該卡固塊和該至少一第二卡固槽之間的卡固關係,是藉由點膠固定而形成。The electronic device according to item 14, wherein the locking relationship between the retaining ring and the first retaining groove, and the retaining relationship between the retaining block and the at least one second retaining groove Is formed by dispensing and fixing. 如申請專利範圍第18項所述之電子裝置,其中製成該防熱飄移座體的該材質是陶瓷或碳纖維。The electronic device according to item 18 of the scope of patent application, wherein the material for making the heat-resistant drift base is ceramic or carbon fiber. 如申請專利範圍第19項所述之電子裝置,其中該第一卡固件和該至少一第二卡固件的材質是塑膠。The electronic device according to item 19 of the scope of patent application, wherein a material of the first card firmware and the at least one second card firmware is plastic.
TW106137673A 2017-10-31 2017-10-31 Electronic device and heat drift preventing camera module thereof TWI657304B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW106137673A TWI657304B (en) 2017-10-31 2017-10-31 Electronic device and heat drift preventing camera module thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW106137673A TWI657304B (en) 2017-10-31 2017-10-31 Electronic device and heat drift preventing camera module thereof

Publications (2)

Publication Number Publication Date
TWI657304B true TWI657304B (en) 2019-04-21
TW201918773A TW201918773A (en) 2019-05-16

Family

ID=66996120

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106137673A TWI657304B (en) 2017-10-31 2017-10-31 Electronic device and heat drift preventing camera module thereof

Country Status (1)

Country Link
TW (1) TWI657304B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI834946B (en) * 2021-01-22 2024-03-11 大陸商玉晶光電(廈門)有限公司 Lens barrel and imaging module applying the same

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040166763A1 (en) * 2002-08-14 2004-08-26 Kenji Hanada Manufacturing method of solid-state image sensing device
EP1564587A1 (en) * 2004-02-04 2005-08-17 Sony Corporation Method for producing mold for use in duplicating light diffusion sheet, light diffusion sheet and method for producing the same, and screen
TW200720813A (en) * 2005-11-25 2007-06-01 Hon Hai Prec Ind Co Ltd Portable electron apparatus having a digital camera
TW200915849A (en) * 2007-09-21 2009-04-01 Hon Hai Prec Ind Co Ltd Portable electronic device with camera module
CN1847969B (en) * 2005-04-15 2010-05-26 鸿富锦精密工业(深圳)有限公司 Two-sectional focuser
CN102540637A (en) * 2010-12-24 2012-07-04 鸿富锦精密工业(深圳)有限公司 Voice coil motor, camera module with voice coil motor and portable electronic device
JP2012185209A (en) * 2011-03-03 2012-09-27 Canon Inc Imaging device
TW201518841A (en) * 2013-11-08 2015-05-16 Htc Corp Camera assembly and electronic device
TWM539074U (en) * 2016-08-30 2017-04-01 Powergate Optical Inc Welding-spot-free electromagnetically driven lens module

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040166763A1 (en) * 2002-08-14 2004-08-26 Kenji Hanada Manufacturing method of solid-state image sensing device
EP1564587A1 (en) * 2004-02-04 2005-08-17 Sony Corporation Method for producing mold for use in duplicating light diffusion sheet, light diffusion sheet and method for producing the same, and screen
CN1847969B (en) * 2005-04-15 2010-05-26 鸿富锦精密工业(深圳)有限公司 Two-sectional focuser
TW200720813A (en) * 2005-11-25 2007-06-01 Hon Hai Prec Ind Co Ltd Portable electron apparatus having a digital camera
TW200915849A (en) * 2007-09-21 2009-04-01 Hon Hai Prec Ind Co Ltd Portable electronic device with camera module
CN102540637A (en) * 2010-12-24 2012-07-04 鸿富锦精密工业(深圳)有限公司 Voice coil motor, camera module with voice coil motor and portable electronic device
JP2012185209A (en) * 2011-03-03 2012-09-27 Canon Inc Imaging device
TW201518841A (en) * 2013-11-08 2015-05-16 Htc Corp Camera assembly and electronic device
TWM539074U (en) * 2016-08-30 2017-04-01 Powergate Optical Inc Welding-spot-free electromagnetically driven lens module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI834946B (en) * 2021-01-22 2024-03-11 大陸商玉晶光電(廈門)有限公司 Lens barrel and imaging module applying the same

Also Published As

Publication number Publication date
TW201918773A (en) 2019-05-16

Similar Documents

Publication Publication Date Title
US20200292779A1 (en) Imaging lens module and electronic device
US7929231B2 (en) Lens module and camera module having same
US10942422B2 (en) Camera module and electronic device
US11604325B2 (en) Imaging lens module with plastic barrel and electronic device including same module
US20090237537A1 (en) Digital camera
KR20140135909A (en) Camera module assembly
CN111751957B (en) Imaging lens module and electronic device
JP6529276B2 (en) Imaging device
US7382556B2 (en) Lens module
US7787198B1 (en) Lens barrel assembly
TWI657304B (en) Electronic device and heat drift preventing camera module thereof
US11693205B2 (en) Plastic lens barrel, camera module and electronic device
TWI749328B (en) Miniature camera module
CN114706185B (en) Imaging lens using metal fixing ring, camera module and electronic device
JP2018010268A (en) Lens module
JP6329603B2 (en) Lens module
JP6983212B2 (en) Dome camera
US11435500B2 (en) Optical lens assembly and electronic device
US8792043B2 (en) Focus-fixed camera module
US11156795B2 (en) Lens module
CN109765667B (en) Electronic device and heat drift prevention lens module thereof
TW201202778A (en) Lens barrel and lens module having same
TW201118448A (en) Lens module and camera module having same
TWI639880B (en) Lens structure and method for correcting thermal drift
JP2020086444A (en) Lens module