TWI656437B - Heat-dissipating fins assembly - Google Patents
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- TWI656437B TWI656437B TW101119814A TW101119814A TWI656437B TW I656437 B TWI656437 B TW I656437B TW 101119814 A TW101119814 A TW 101119814A TW 101119814 A TW101119814 A TW 101119814A TW I656437 B TWI656437 B TW I656437B
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Abstract
一種散熱片組，包括多個散熱片，兩相鄰之散熱片間具有一散熱流道，而散熱片具有一片體及設於片體之一流體導引結構，流體導引結構具有一第一周緣及一第二周緣，其中第一周緣的長度大於第二周緣的長度。 A heat sink assembly comprising a plurality of heat sinks, a heat dissipation flow path between two adjacent heat sinks, and a heat sink having a body and a fluid guiding structure disposed on the body, the fluid guiding structure having a first a circumference and a second circumference, wherein the length of the first circumference is greater than the length of the second circumference.
Description
本發明涉及一種散熱片組，特別是一種具有流體導引結構之散熱片組。 The present invention relates to a heat sink assembly, and more particularly to a heat sink assembly having a fluid guiding structure.
近年來，隨著電腦科技的突飛猛進，電腦之運作速度不斷地提高，連帶地電腦主機內之電子元件(Electronic Element)的發熱功率(Heat Generation Rate)亦不斷地攀升。為了預防電腦主機內部之電子元件過熱，而導致電子元件發生暫時性或永久性的失效，如何對電腦內部的電子元件提供足夠的散熱效能相形重要。 In recent years, with the rapid advancement of computer technology, the operating speed of computers has continued to increase, and the heat generation rate of electronic components (Electronic Elements) in the computer mainframe has continued to rise. In order to prevent the electronic components inside the computer host from overheating, which causes temporary or permanent failure of the electronic components, it is important to provide sufficient heat dissipation performance for the electronic components inside the computer.
舉例來說，在電腦系統中，例如是中央處理器(Center Process Unit,CPU)、北橋晶片(North Bridge Chip)、南橋晶片(South Bridge Chip)或是其他發熱源會配設於一主機板(Mother Board)上，而習知技術為了能移除主機板上之在高速運作時所產生的熱能，通常會在這些發熱源上配置散熱模組，以對發熱源進行散熱。 For example, in a computer system, for example, a central processing unit (CPU), a North Bridge Chip, a South Bridge Chip, or other heat source may be disposed on a motherboard ( On the Mother Board, in order to remove the heat generated on the motherboard during high-speed operation, a heat dissipation module is usually disposed on these heat sources to dissipate heat from the heat source.
本發明之目的在提供一種散熱片組，其能大幅地增加工作流體與散熱模組之接觸面積，且能提升工作流體移除熱量之訴律，進而有效地對一發熱源進行散熱。 The object of the present invention is to provide a heat sink group which can greatly increase the contact area between the working fluid and the heat dissipation module, and can improve the law of heat removal of the working fluid, thereby effectively dissipating heat from a heat source.
本發明提供一種散熱片組，以藉由一散熱流體對一發熱源進行散熱，該散熱片組包括多個第一散熱片，各該第一散熱片具有一第一片體以及設於該第一片體之至少一流體導引結構，該流體導引結構具有一第一周緣以及一第二周緣，其中該第一周緣的長度大於該第二周緣的長度。 The present invention provides a heat sink assembly for dissipating heat from a heat source by a heat dissipating fluid, the heat sink group including a plurality of first heat sinks, each of the first heat sinks having a first body and being disposed on the first heat sink At least one fluid guiding structure of the body, the fluid guiding structure having a first circumference and a second circumference, wherein the length of the first circumference is greater than the length of the second circumference.
在本發明之一實施例中，該第一周緣與該第二周緣為曲面結構，且該第一周緣的曲率大於該第二周緣的曲率。 In an embodiment of the invention, the first circumference and the second circumference are curved structures, and the curvature of the first circumference is greater than the curvature of the second circumference.
在本發明之一實施例中，該第一周緣係較該第二周緣鄰近該發熱源。 In an embodiment of the invention, the first circumference is adjacent to the heat source than the second circumference.
在本發明之一實施例中，該流體導引結構更具有一導流槽，該導流槽具有一第一導流槽壁以及一第二導流槽壁，該第一導流槽壁與該第一周緣相對應，該第二導流槽壁與該第二周緣相對應，該第一導流槽壁的長度大於該第二導流槽壁的長度。 In an embodiment of the present invention, the fluid guiding structure further has a guiding groove, the guiding groove has a first guiding groove wall and a second guiding groove wall, and the first guiding groove wall and Corresponding to the first circumference, the second guiding groove wall corresponds to the second circumference, and the length of the first guiding groove wall is greater than the length of the second guiding groove wall.
在本發明之一實施例中，該導流槽為一鏤空結構。 In an embodiment of the invention, the flow guiding groove is a hollow structure.
在本發明之一實施例中，該第一周緣以及該第二周緣係該流體導引結構的外圍導引結構，該第一導流槽壁以及該第二導流槽壁係該流體導引結構的內圍導引結構。 In an embodiment of the invention, the first circumference and the second circumference are peripheral guiding structures of the fluid guiding structure, and the first guiding groove wall and the second guiding groove wall are the fluid guiding The inner circumference guiding structure of the guiding structure.
在本發明之一實施例中，該第一周緣與該第二周緣係非連續地與該第一片體相接。 In an embodiment of the invention, the first circumference and the second circumference are non-continuously in contact with the first sheet.
在本發明之一實施例中，各該第一散熱片更具有至少一第一鏤空部，該第一鏤空部設於該第一片體與該流體導引結構之間，且部分該第一周緣以及部分該第二周緣分別與該第一片體相接。 In an embodiment of the present invention, each of the first fins further has at least one first hollow portion, the first hollow portion is disposed between the first sheet and the fluid guiding structure, and a portion of the first The circumference and a portion of the second circumference are respectively in contact with the first sheet.
在本發明之一實施例中，該流體導引結構為一翼狀結構或是類翼狀結構。 In an embodiment of the invention, the fluid guiding structure is a wing-like structure or a wing-like structure.
在本發明之一實施例中，該第一周緣之一端與該第二周緣之一端相接，並構成一鈍狀結構，該第一周緣之另一端與該第二周緣之另一端相接，並構成一尖狀結構。 In an embodiment of the invention, one end of the first circumference is in contact with one end of the second circumference, and constitutes a blunt structure, and the other end of the first circumference is opposite to the other end of the second circumference Connected and formed a pointed structure.
在本發明之一實施例中，各該第一散熱片之該第一片體設有一第一缺 槽，且該第一缺槽兩側分別設有該流體導引結構。 In an embodiment of the present invention, the first body of each of the first heat sinks is provided with a first defect a groove, and the fluid guiding structure is respectively disposed on two sides of the first notch.
在本發明之一實施例中，該鈍狀結構係鄰近該入口第一缺槽。 In an embodiment of the invention, the blunt structure is adjacent to the first vacant slot of the inlet.
在本發明之一實施例中，該第一缺槽為一入口缺槽，而該散熱流體自該入口缺槽流入該散熱片組，並分別朝向該入口缺槽兩側之該些流體導引結構流動。 In an embodiment of the invention, the first notch is an inlet slot, and the heat dissipation fluid flows from the inlet slot into the heat sink group, and respectively guides the fluids on both sides of the inlet slot Structure flow.
在本發明之一實施例中，各該第一散熱片以該第一缺槽為中心之一對稱片體。 In an embodiment of the invention, each of the first fins is symmetrically centered on the first slot.
在本發明之一實施例中，各該第一散熱片之該第一片體更設有一第一基部，各該第一散熱片之該第一基部係彼此相貼合，且與該發熱源相接。 In an embodiment of the present invention, the first body of each of the first heat sinks further includes a first base, and the first bases of the first heat sinks are attached to each other, and the heat source is Docked.
在本發明之一實施例中，各該第一散熱片之該第一片體更設有至少一第一凸點，該第一凸點抵接於與其相鄰之該第一散熱片，而兩相鄰之該些第一散熱片間構成一散熱流道。 In an embodiment of the present invention, the first body of each of the first heat sinks further includes at least one first bump, the first bump abutting the first heat sink adjacent thereto, and A heat dissipation flow path is formed between the two adjacent first heat dissipation fins.
在本發明之一實施例中，散熱片組更包括多個第二散熱片，該些第一散熱片與該些第二散熱片彼此交錯排列，各該第二散熱片具有一第二片體以及設於該第二片體之至少一第二鏤空部。 In an embodiment of the present invention, the heat sink group further includes a plurality of second heat sinks, the first heat sinks and the second heat sinks are staggered with each other, and each of the second heat sinks has a second body. And at least one second hollow portion disposed on the second sheet.
在本發明之一實施例中，該些第二鏤空部係排列於該第二片體，而構成一柵狀結構。 In an embodiment of the invention, the second hollow portions are arranged on the second sheet to form a grid structure.
在本發明之一實施例中，各該第二散熱片之該第二片體設有一第二缺槽，且該第二缺槽兩側分別設有該第二鏤空部。 In an embodiment of the present invention, the second sheet of each of the second fins is provided with a second notch, and the second hollow portion is respectively disposed on two sides of the second notch.
在本發明之一實施例中，各該第二散熱片以該第二缺槽為中心之一對稱片體。 In an embodiment of the invention, each of the second fins is symmetrically centered on the second slot.
在本發明之一實施例中，該第一鏤空部於該第二散熱片之投影區域係 與部分該第二片體以及其兩側之部分該些第二鏤空部重疊，該第二鏤空部於該第一散熱片之投影區域係與部分該第一片體以及其兩側之部分該些第一鏤空部重疊。 In an embodiment of the invention, the first hollow portion is in a projection area of the second heat sink And a portion of the second sheet body and a portion of the two sides thereof overlap with the second hollow portion, wherein the second hollow portion is in a projection area of the first heat sink and a part of the first sheet body and a portion thereof These first hollows overlap.
在本發明之一實施例中，該第二鏤空部與部分該流體導引結構重疊。 In an embodiment of the invention, the second hollow portion overlaps a portion of the fluid guiding structure.
在本發明之一實施例中，各該第二散熱片之該第二片體更設有一第二基部，各該第二散熱片之該第二基部係與相鄰之該第一散熱片之底部相貼合，並與該發熱源相接。 In an embodiment of the present invention, the second body of each of the second heat sinks further includes a second base, and the second base of each of the second heat sinks is adjacent to the first heat sink. The bottom is fitted and connected to the heat source.
在本發明之一實施例中，各該第二散熱片之該第二片體更設有至少一第二凸點，該第二凸點抵接於與其相鄰之該第一散熱片，而兩相鄰之該第一散熱片與該第二散熱片間構成一散熱流道。 In an embodiment of the present invention, the second body of each of the second heat sinks further includes at least one second bump, the second bump abutting the first heat sink adjacent thereto, and A heat dissipation flow path is formed between the two adjacent first heat sinks and the second heat sink.
在本發明之一實施例中，該導流槽係以沖壓成型之方式成型於該第一片體。 In an embodiment of the invention, the flow guiding groove is formed in the first sheet by press forming.
在本發明之一實施例中，該導流槽為一環狀溝槽，其凸出於該第一片體之表面，以位於兩相鄰第一散熱片之間。 In an embodiment of the invention, the flow guiding groove is an annular groove protruding from the surface of the first piece to be located between two adjacent first fins.
在本發明之一實施例中，該導流槽為一凸出槽體，其凸出於該第一片體之表面，以位於兩相鄰第一散熱片之間。 In an embodiment of the invention, the flow guiding groove is a protruding groove body protruding from the surface of the first piece to be located between two adjacent first heat sinks.
基於上述，本發明之散熱片組係於散熱片之片體上設計一流體導引結構，其中該流體導引結構具有一第一周緣以及一第二周緣，其中該第一周緣的長度大於該第二周緣的長度，而第一周緣例如是較第二周緣接近發熱源。因此，流入散熱片組之散熱流體在流經該流體導引結構時，由於第一周緣的長度大於該第二周緣的長度，且第一周緣例如是較第二周緣接近發熱源，依據白努力定律，流經第一周緣之散熱流體速度會大於流經第二周 緣之散熱流體速度，因此流經本發明之散熱流體能有效地移除發熱源傳導至散熱片組之熱量。 Based on the above, the heat sink assembly of the present invention is designed with a fluid guiding structure on the sheet of the heat sink, wherein the fluid guiding structure has a first circumference and a second circumference, wherein the length of the first circumference Greater than the length of the second perimeter, and the first perimeter is, for example, closer to the source of heat than the second perimeter. Therefore, when the heat dissipation fluid flowing into the heat sink group flows through the fluid guiding structure, since the length of the first circumference is greater than the length of the second circumference, and the first circumference is, for example, closer to the heat source than the second circumference, White effort law, the speed of the heat transfer fluid flowing through the first circumference will be greater than the second week The heat dissipation fluid velocity, therefore, the heat dissipation fluid flowing through the present invention can effectively remove the heat that the heat source conducts to the heat sink group.
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，以下配合所附圖式進行詳細說明。 The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt;
圖1繪示本發明一實施例之電子裝置的示意圖，圖2繪示圖1之電子裝置其散熱模組的放大示意圖，圖3A繪示圖2之散熱模組其散熱片組與導流蓋體的分解圖，而圖3B繪示圖3A之散熱模組其散熱片組與導流蓋體的組合圖。請同時參考圖1、圖2、圖3A以及圖3B，本實施之電子裝置1包括一散熱模組10、一發熱源20以及一電路板30，其中發熱源20是配置於電路板30，散熱模組10則是藉由一散熱流體F來對發熱源20進行散熱。散熱模組10包括一散熱片組100、至少一流體驅動機構200以及一導流蓋體300，本實施例係以二流體驅動機構200為例。在本實施例中，散熱片組100係沿一配置路徑L1配置於發熱源20上，配置路徑L1例如是垂直於發熱源20之頂面，而二流體驅動機構200例如是分別配設於散熱片組100之兩側，關於流體驅動機構200之數量以及流體驅動機構200配設於散熱片組100之位置，本文在此並不作任何限制。此外，導流蓋體300例如是蓋合於散熱片組100之頂部。關於導流蓋體300之相關描述，本文將於下文中再做詳細說明。 1 is a schematic diagram of an electronic device according to an embodiment of the present invention, FIG. 2 is an enlarged schematic view of a heat dissipation module of the electronic device of FIG. 1 , and FIG. 3A is a schematic view of the heat dissipation module of the heat dissipation module of FIG. FIG. 3B is a combination diagram of the heat sink group and the flow guiding cover of the heat dissipation module of FIG. 3A. Referring to FIG. 1 , FIG. 2 , FIG. 3A and FIG. 3B , the electronic device 1 of the present embodiment includes a heat dissipation module 10 , a heat source 20 , and a circuit board 30 . The heat source 20 is disposed on the circuit board 30 and dissipates heat. The module 10 heats the heat source 20 by a heat dissipating fluid F. The heat dissipation module 10 includes a heat sink assembly 100, at least one fluid drive mechanism 200, and a flow guide cover 300. This embodiment uses a two-fluid drive mechanism 200 as an example. In the present embodiment, the heat sink group 100 is disposed on the heat source 20 along a configuration path L1. The arrangement path L1 is, for example, perpendicular to the top surface of the heat source 20, and the two fluid drive mechanism 200 is respectively disposed on the heat sink. The two sides of the chip set 100 are not limited herein with respect to the number of the fluid driving mechanisms 200 and the position of the fluid driving mechanism 200 disposed on the heat sink group 100. Further, the flow guiding cover 300 is, for example, covered on the top of the heat sink group 100. A related description of the diversion cover 300 will be described in detail below.
圖4A繪示圖2之散熱片組其一第一散熱片的示意圖，圖4B繪示圖2之散熱片組其一第二散熱片的示意圖，圖4C繪示圖4A之第一散熱片與圖4B之第二散熱片相互疊合後的示意圖，圖5繪示圖4A之第一散熱片其流 體導引結構的放大示意圖，而圖6繪示圖4A之第一散熱片與圖4B之第二散熱片相互疊合後的立體示意圖，其中圖4C中之斜線部分係第一散熱片未與第二散熱片重疊之區域。請再同時參考圖4A、圖4B、圖4C、圖5以及圖6，本實施例之散熱片組100可包括多個第一散熱片110以及多個第二散熱片120，這些第一散熱片110與這些第二散熱片120沿一組裝路徑L2彼此交錯排列，而兩相鄰之第一散熱片110與第二散熱片120間即構成一散熱流道。其中，本實施例之組裝路徑L2係不垂直於發熱源20之頂面，而是平行於發熱源20之頂面，亦即組裝路徑L2是與上述之配置路徑L1相互垂直。此外，兩相鄰之這些第一散熱片110與這些第二散熱片120的側邊例如為散熱流道之出口O，而散熱片組100之頂部例如為散熱流道之入口I。在本實施例中，流體驅動機構200例如是設於散熱流道之出口O，並藉由產生強制對流來將經散熱流道之入口I流入散熱片組100的散熱流體F自散熱流道之出口O導引出，進而移除由發熱源20傳導至散熱片組100之熱量。 4A is a schematic view of a first heat sink of the heat sink of FIG. 2, FIG. 4B is a schematic view of a second heat sink of the heat sink of FIG. 2, and FIG. 4C is a first heat sink of FIG. 4B is a schematic view of the second heat sink stacked on each other, and FIG. 5 is a flow diagram of the first heat sink of FIG. 4A FIG. 6 is a schematic perspective view showing the first heat sink of FIG. 4A and the second heat sink of FIG. 4B being overlapped with each other, wherein the oblique portion in FIG. 4C is a first heat sink. The area where the second heat sink overlaps. Referring to FIG. 4A, FIG. 4B, FIG. 4C, FIG. 5 and FIG. 6 simultaneously, the heat sink group 100 of the present embodiment may include a plurality of first heat sinks 110 and a plurality of second heat sinks 120, and the first heat sinks The second heat sink 120 is staggered with each other along an assembly path L2, and a heat dissipation flow path is formed between the two adjacent first heat sinks 110 and the second heat sink 120. The assembly path L2 of the present embodiment is not perpendicular to the top surface of the heat source 20, but is parallel to the top surface of the heat source 20, that is, the assembly path L2 is perpendicular to the arrangement path L1 described above. In addition, the two adjacent first fins 110 and the side edges of the second fins 120 are, for example, the exit O of the heat dissipation channel, and the top of the heat sink group 100 is, for example, the inlet I of the heat dissipation channel. In the present embodiment, the fluid drive mechanism 200 is disposed at the outlet O of the heat dissipation flow path, and generates a forced convection to flow the heat transfer fluid F from the inlet I of the heat dissipation flow path into the heat dissipation flow path of the heat dissipation fin group 100. The outlet O is directed to remove heat that is conducted by the heat source 20 to the fin set 100.
在本實施例中，流體驅動機構200例如是一風扇組，而散熱流體F例如是散熱氣流，風扇組例如是由一風扇210以及一導流罩體220所組成，而導流罩體220之一端係與散熱流道之出口O相接，導流罩體220之另一端係與風扇210相接。其中，風扇210可藉由導流罩體220之輔助以順利地將已完成熱交換作業之散熱流體F導出散熱片組100。此外，藉由導流罩體220之輔助亦可以將自散熱流道出口O抽取出之散熱流體F導引至其他發熱源處，以對其他發熱源進行散熱。當然，在其他實施例中，風扇210亦可以設置於散熱流道之出口O，以直接地自散熱流道出口O以導引經散 熱流道入口I流入散熱片組100之流體，而無須導流罩體220之輔助，本文在此並不針對流體驅動機構200之組成做任何限制。另外，流體驅動機構200亦可以設置於散熱流道之入口I處，同樣藉由強制對流的方式來移除由發熱源20傳導至散熱片組100之熱量，本文在此亦不針對流體驅動機構200於散熱片組100上之配設位置做任何限制。 In the present embodiment, the fluid driving mechanism 200 is, for example, a fan group, and the heat dissipating fluid F is, for example, a heat dissipating air flow. The fan group is composed of, for example, a fan 210 and a flow guiding cover 220, and the flow guiding cover 220 is One end is connected to the outlet O of the heat dissipation channel, and the other end of the flow guiding body 220 is connected to the fan 210. The fan 210 can be guided by the flow guiding cover 220 to smoothly discharge the heat dissipation fluid F that has completed the heat exchange operation to the heat sink group 100. In addition, the heat dissipation fluid F extracted from the heat dissipation channel outlet O can be guided to other heat sources by the auxiliary of the flow guiding body 220 to dissipate heat from other heat sources. Of course, in other embodiments, the fan 210 may also be disposed at the outlet O of the heat dissipation channel to directly drain from the heat dissipation channel exit O to guide the dispersion. The hot runner inlet I flows into the fluid of the fin stack 100 without the aid of the shroud 220, and is not intended to limit the composition of the fluid drive mechanism 200 herein. In addition, the fluid drive mechanism 200 can also be disposed at the inlet I of the heat dissipation channel, and the heat conducted by the heat source 20 to the heat sink group 100 can also be removed by forced convection, which is not directed to the fluid drive mechanism herein. 200 is placed at any limit on the arrangement position on the heat sink group 100.
下文中，本實施例將針對第一散熱片110以及第二散熱片120之設計作詳細說明。在本實施例中，第一散熱片110例如是由一第一片體112、設於第一片體112之至少一流體導引結構114以及至少一第一鏤空部116，其中設於第一片體112之流體導引結構114係以二個為例，流體導引結構114例如為一翼狀結構，而第一鏤空部116是設於第一片體112與流體導引結構114之間，且這些第一鏤空部116又例如與上述之散熱流道相通。詳細地說，本實施例可藉由第一鏤空部116之設計來於第一片體112上成型出流體導引結構114，並於流體導引結構114上定義出一第一周緣114’以及一第二周緣114”，而由於第一鏤空部116的設計，僅部分第一周緣114’以及部分第二周緣114”與第一片體112相接，即第一周緣114’與第二周緣114”係非連續地與第一片體112相接。基於第一周緣114’與第二周緣114”係非連續地與第一片體112相接，因此流體導引結構114亦可以類翼狀結構來表示。 Hereinafter, the design of the first heat sink 110 and the second heat sink 120 will be described in detail in this embodiment. In this embodiment, the first heat sink 110 is, for example, a first body 112, at least one fluid guiding structure 114 disposed on the first body 112, and at least one first hollow portion 116. The fluid guiding structure 114 of the sheet body 112 is exemplified by two. The fluid guiding structure 114 is, for example, a wing-like structure, and the first hollow portion 116 is disposed between the first sheet body 112 and the fluid guiding structure 114. And these first hollow portions 116 are, for example, in communication with the above-mentioned heat dissipation channels. In detail, in this embodiment, the fluid guiding structure 114 is formed on the first body 112 by the design of the first hollow portion 116, and a first circumference 114' is defined on the fluid guiding structure 114. And a second peripheral edge 114", and due to the design of the first hollow portion 116, only a portion of the first peripheral edge 114' and a portion of the second peripheral edge 114" are in contact with the first sheet 112, ie, the first peripheral edge 114' and The second peripheral edge 114" is non-continuously in contact with the first body 112. The fluid guiding structure 114 is non-continuously coupled to the first body 112 based on the first peripheral edge 114' and the second peripheral edge 114". It can also be represented by a wing-like structure.
進一步地說，第一周緣114’之設置位置係較第二周緣114”之設置位置鄰近發熱源20，第一周緣114’與第二周緣114”例如是曲面結構，第一周緣114’的曲率大於第二周緣114”的曲率，且第一周緣114’的長度大於第二周緣114”的長度。在本實施例中，第一周緣114’之一端與第二周緣114”之一 端相接，並構成一鈍狀結構S1，第一周緣114’之另一端與第二周緣114”之另一端相接，並構成一尖狀結構S2，進而讓流體導引結構114例如是呈現翼狀結構之形式。 Further, the first peripheral edge 114' is disposed adjacent to the heat source 20 than the second circumferential edge 114". The first perimeter 114' and the second perimeter 114" are, for example, curved structures, the first perimeter 114 The curvature of 'the curvature is greater than the curvature of the second perimeter 114', and the length of the first perimeter 114' is greater than the length of the second perimeter 114". In the present embodiment, one of the first peripheral edge 114' and one of the second peripheral edge 114" The ends are connected to each other and form a blunt structure S1. The other end of the first peripheral edge 114' is in contact with the other end of the second peripheral edge 114" and constitutes a pointed structure S2, thereby allowing the fluid guiding structure 114 to be, for example, Presents the form of a wing structure.
由於本實施例之流體導引結構114例如是呈現翼狀結構，第一周緣114’的長度大於該第二周緣114”的長度，且第一周緣114’例如是較第二周緣114”接近發熱源20，依據白努力定律，流經第一周緣114’的散熱流體F因為行徑路線比較長，因此流經第一周緣114’之散熱流體速度會大於流經第二周緣114”之散熱流體速度。如此一來，流經第一周緣114’與發熱源20間之散熱流體F即能更迅速地讓已完成熱交換作業之散熱流體F更快速地自散熱片組100流出。 Since the fluid guiding structure 114 of the present embodiment is, for example, a wing-like structure, the length of the first circumference 114' is greater than the length of the second circumference 114", and the first circumference 114' is, for example, a second circumference 114" Close to the heat source 20, according to the white effort law, the heat dissipation fluid F flowing through the first circumference 114' is long because the path of the heat dissipation fluid flowing through the first circumference 114' is greater than the flow rate through the second circumference 114" The heat dissipation fluid velocity, in this way, the heat dissipation fluid F flowing between the first peripheral edge 114' and the heat source 20 can more quickly allow the heat dissipation fluid F that has completed the heat exchange operation to flow out from the heat sink group 100 more quickly. .
此外，為能讓散熱流體F能更有效地且更快速地移除發熱源20傳導至散熱片組100之熱量，本實施例更可於流體導引結構114設置一導流槽114a，本實施例之導流槽114a例如是鏤空結構，其與上述之散熱流道相通。 導流槽114a具有一第一導流槽壁114a’以及一第二導流槽壁114a”，第一導流槽壁114a’係與第一周緣114’相對應，第二導流槽壁114a”係與該第二周緣114”相對應。亦即，上述第一周緣114’以及第二周緣114”例如是流體導引結構114的外圍導引結構，而第一導流槽壁114a’以及第二導流槽壁114a”例如是流體導引結構114的內圍導引結構。與第一周緣114’與第二周緣114”相同，第一導流槽壁114a’與第二導流槽壁114a”亦例如是曲面結構，第一導流槽壁114a’的曲率大於第二導流槽壁114a”的曲率，第一導流槽壁114a’的長度係大於第二導流槽壁114a”的長度。 In addition, in order to enable the heat dissipating fluid F to remove heat from the heat source 20 to the heat sink group 100 more effectively and quickly, the present embodiment can further provide a flow guiding groove 114a in the fluid guiding structure 114. The guide groove 114a is, for example, a hollow structure that communicates with the above-described heat dissipation flow path. The guiding groove 114a has a first guiding groove wall 114a' and a second guiding groove wall 114a". The first guiding groove wall 114a' corresponds to the first peripheral edge 114', and the second guiding groove wall 114a" corresponds to the second peripheral edge 114". That is, the first peripheral edge 114' and the second peripheral edge 114" are, for example, peripheral guiding structures of the fluid guiding structure 114, and the first guiding groove wall 114a 'and the second guide groove wall 114a' is, for example, an inner circumferential guiding structure of the fluid guiding structure 114. Like the first peripheral edge 114' and the second peripheral edge 114", the first guiding groove wall 114a' and the second The guide groove wall 114a" is also a curved structure, for example, the curvature of the first guide groove wall 114a' is greater than the curvature of the second guide groove wall 114a", and the length of the first guide groove wall 114a' is greater than the second flow The length of the groove wall 114a".
同樣地，依據白努力定律，流經第一導流槽壁114a’之散熱流體速度會 大於流經第二導流槽壁114a”之散熱流體速度，因此流經本實施例之散熱流體F能有效地移除發熱源20傳導至散熱片組100之熱量，尤其是流經第一導流槽壁114a’之散熱流體F，更是能迅速地移除發熱源20傳導至散熱片組100之熱量。如此一來，在流體驅動機構200產生強制對流之後，流經流體導引結構114之散熱流體F即能同時藉由內圍導引結構以及外圍導引結構的輔助來更有效且更快速地將發熱源20傳導至散熱片組100之熱量移除。 當然，在適當的環境下，亦可僅藉由自然對流的方式，在加上本實施例之流體導引結構114的輔助來進行散熱作業。 Similarly, according to the white effort law, the velocity of the heat transfer fluid flowing through the first deflector wall 114a' will It is greater than the heat dissipation fluid velocity flowing through the second guide channel wall 114a". Therefore, the heat dissipation fluid F flowing through the embodiment can effectively remove the heat conducted by the heat source 20 to the heat sink group 100, especially through the first flow. The heat dissipating fluid F of the groove wall 114a' can quickly remove the heat that the heat source 20 conducts to the heat sink group 100. Thus, after the fluid drive mechanism 200 generates forced convection, it flows through the fluid guiding structure 114. The heat dissipating fluid F can simultaneously remove heat from the heat source 20 to the fin set 100 more efficiently and more quickly by the aid of the inner guiding structure and the peripheral guiding structure. Of course, in a proper environment, the heat dissipation operation can be performed by the aid of the fluid guiding structure 114 of the present embodiment only by natural convection.
在其他實施例中，導流槽114a除了可以以上述之鏤空結構來實現之外，導流槽114a亦可以沖壓成型之方式成型於該第一片體。進一步地說，其他適當實施例之導流槽114a可以為一環狀溝槽，其係凸出於第一片體112之表面，而位於兩相鄰第一散熱片110與第二散熱片120之間。當然，導流槽114a亦可為一凸出槽體，其凸出於第一片體112之表面，以位於兩相鄰第一散熱片110與第二散熱片120之間。凡於第一片體112上成型出本實施例之導流槽114a皆屬本發明之精神與範疇，本文在此並不做任何限制。 In other embodiments, the flow guiding groove 114a can be formed by the above-mentioned hollow structure, and the flow guiding groove 114a can also be formed into the first piece by press molding. Further, the guide groove 114a of other suitable embodiments may be an annular groove protruding from the surface of the first body 112 and located adjacent to the first heat sink 110 and the second heat sink 120. between. Of course, the guiding groove 114a can also be a protruding groove body protruding from the surface of the first piece 112 to be located between the two adjacent first fins 110 and the second fins 120. The formation of the guide groove 114a of the present embodiment on the first body 112 is within the spirit and scope of the present invention, and is not limited herein.
承上所述，為讓散熱流體F能順暢地流經流體導引結構114，本實施例係於第一片體112之中間部分設置一第一缺槽112a，而第一缺槽112a兩側分別設有一流體導引結構114，其中上述鈍狀結構S1例如是較尖狀結構S2鄰近第一缺槽112a，而第一散熱片110例如是以第一缺槽112a為中心之一對稱片體。相似地，每一個第二散熱片120具有一第二片體122以及設於第二片體122之至少一第二鏤空部124，這些第二鏤空部124例如是排列於第二片體122，並構成一柵狀結構，且這些第二鏤空部124又例如與上述之 散熱流道相通。此外，第二散熱片120之第二片體122同樣設有一第二缺槽122a，且第二缺槽122a兩側分別設有這些第二鏤空部124。這些第二鏤空部124亦以第二缺槽122a為中心對應排列，即本實施例之第二散熱片120同樣為一對稱片體。上述第一缺槽112a以及第二缺槽122a可為一入口缺槽，而散熱流體F即能順暢地自入口缺槽流入該散熱片組100，並分別朝向入口缺槽兩側之流體導引結構114流動，進而進行熱量移除作業。 As described above, in order to allow the heat dissipating fluid F to smoothly flow through the fluid guiding structure 114, in this embodiment, a first notch 112a is disposed in the middle portion of the first piece 112, and both sides of the first notch 112a are provided. A fluid guiding structure 114 is respectively disposed, wherein the blunt structure S1 is, for example, a relatively pointed structure S2 adjacent to the first vacant groove 112a, and the first heat sink 110 is, for example, a symmetrical sheet centered on the first vacant groove 112a. . Similarly, each of the second heat sinks 120 has a second body 122 and at least one second hollow portion 124 disposed on the second body 122. The second hollow portions 124 are arranged, for example, on the second body 122. And forming a grid structure, and these second hollow portions 124 are, for example, the above The heat dissipation channels are connected. In addition, the second body 122 of the second heat sink 120 is also provided with a second notch 122a, and the second hollow portions 124 are respectively disposed on two sides of the second notch 122a. The second hollow portions 124 are also arranged centering on the second cutouts 122a, that is, the second heat dissipation fins 120 of the embodiment are also a symmetric sheet. The first notch 112a and the second notch 122a may be an inlet notch, and the heat dissipating fluid F can smoothly flow into the fin group 100 from the inlet notch, and respectively guide the fluid toward the sides of the inlet notch. The structure 114 flows to perform a heat removal operation.
另一方面，第一散熱片110其第一鏤空部116於第二散熱片120之投影區域係與部分第二片體122以及其兩側之部分第二鏤空部124重疊，而第二散熱片120其第二鏤空部124於第一散熱片110之投影區域係與部分第一片體112以及其兩側之部分第一鏤空部116重疊，第二鏤空部124亦與部分流體導引結構114重疊。亦即，這些第一散熱片110與這些第二散熱片120上之鏤空部係彼此部分地重疊排列。在上述部分重疊排列的情況下，自入口缺槽流入散熱片組100之散熱流體F會直接流入第一散熱片110與第二散熱片120間之散熱流道，亦或是在直接受到第一散熱片110與第二散熱片120的片體分流後再合流入散熱流道。 On the other hand, the first heat sink 110 has a first hollow portion 116 overlapping the projection area of the second heat sink 120 with a portion of the second sheet 122 and a portion of the second hollow portion 124 on both sides thereof, and the second heat sink The second hollow portion 124 of the second hollow portion 124 overlaps with a portion of the first sheet body 112 and a portion of the first hollow portion 116 on both sides thereof, and the second hollow portion 124 is also associated with the partial fluid guiding structure 114. overlapping. That is, the first heat sinks 110 and the hollow portions on the second heat sinks 120 are partially overlapped with each other. In the case where the above-mentioned partial overlapping arrangement, the heat dissipation fluid F flowing from the inlet notch into the heat sink group 100 directly flows into the heat dissipation flow path between the first heat sink 110 and the second heat sink 120, or is directly subjected to the first The heat sink 110 and the sheet of the second heat sink 120 are shunted and then flow into the heat dissipation channel.
其中，由於本實施例之散熱流道又與第一散熱片110以及第二散熱片120上之鏤空部相通，因此流經散熱流道之散熱流體F又會被分流入第一散熱片110或是第二散熱片120上之鏤空部，亦或是被分流入第一散熱片110之導流槽114a，並不斷地再被強迫分流或合流。在上述散熱流體F被不斷地分流或合流之過程中，散熱流體F會與第一散熱片110以及第二散熱片120之間有著較大的接觸面積，因此散熱流體F可大量地移除發熱源20傳導至散熱片組100之熱量，本實施例即有著散熱效率較佳之熱交換作業， 進而能有效地移除發熱源20傳導至散熱片組100之熱量。 Wherein, since the heat dissipation flow path of the embodiment is in communication with the hollow portion of the first heat sink 110 and the second heat sink 120, the heat dissipation fluid F flowing through the heat dissipation flow path is further divided into the first heat sink 110 or It is a hollow portion on the second heat sink 120, or is divided into the flow guiding groove 114a of the first heat sink 110, and is continuously forced to be shunted or merged. During the process in which the heat dissipating fluid F is continuously shunted or merged, the heat dissipating fluid F has a large contact area with the first fins 110 and the second fins 120, so that the heat dissipating fluid F can remove a large amount of heat. The source 20 is conducted to the heat of the heat sink group 100. In this embodiment, the heat exchange operation with better heat dissipation efficiency is provided. Further, the heat that the heat source 20 conducts to the heat sink group 100 can be effectively removed.
值得一提的是，在本實施例之散熱片組100中，由於流體導引結構114之設計能驅使散熱流體F更迅速地流動，以更有效地移除發熱源20傳導至散熱片組100之熱量，因此在上述散熱流體F可大量地移除發熱源20傳導至散熱片組100之熱量的情況下或是其他熱量移除作業中，本發明之設計更顯得重要。亦即，藉由本實施例之流體導引結構114之設計能驅使已完成熱交換作業之散熱流體F更快速地自散熱片組100流出，進而讓剛進入散熱片組100之散熱流體F或是其他溫度較低之散熱流體F來進行熱交換作業。如此一來，在單位時間內，散熱流體F自散熱片組100所移除之熱量即能大幅提升，散熱片組100即有較佳之散熱效率。 It is worth mentioning that in the heat sink assembly 100 of the present embodiment, since the fluid guiding structure 114 is designed to drive the heat radiating fluid F to flow more rapidly, the heat source 20 is more effectively removed and conducted to the heat sink group 100. The heat of the present invention is more important in the case where the above-described heat-dissipating fluid F can largely remove heat from the heat source 20 to the heat sink group 100 or other heat removal operations. That is, the design of the fluid guiding structure 114 of the present embodiment can drive the heat dissipating fluid F that has completed the heat exchange operation to flow out from the fin group 100 more quickly, thereby allowing the heat dissipating fluid F just entering the fin group 100 or Other lower temperature heat transfer fluids F perform heat exchange operations. In this way, the heat removed by the heat dissipating fluid F from the heat sink group 100 can be greatly improved in a unit time, and the heat sink group 100 has better heat dissipation efficiency.
此外，為使散熱片組100與發熱源20間有良好的接觸關係，以讓發熱源20所產生之熱量能有效地傳導至散熱片組100上，每一個第一散熱片110之第一片體112更設有一第一基部112b，每一個第二散熱片120之第二片體122更設有一第二基部122b，這些彼此交錯排列之第一散熱片110與第二散熱片120其第一基部112b與第二基部122b係相互貼合，並與發熱源20相接。當然，在其他實施例中，彼此交錯排列之第一散熱片110與第二散熱片120亦能配設於一散熱基板上，以藉由散熱基板來與發熱源20接觸。凡藉由直接或間接的方式來讓散熱片組100與發熱源20接觸皆屬本發明之精神與範疇，本文在此並不做任何限制。 In addition, in order to ensure a good contact relationship between the heat sink group 100 and the heat source 20, the heat generated by the heat source 20 can be efficiently conducted to the heat sink group 100, and the first film of each of the first heat sinks 110 The body 112 is further provided with a first base portion 112b. The second body 122 of each second heat sink 120 is further provided with a second base portion 122b. The first heat sink 110 and the second heat sink 120 are staggered first. The base portion 112b and the second base portion 122b are in contact with each other and are in contact with the heat source 20. Of course, in other embodiments, the first heat dissipation fins 110 and the second heat dissipation fins 120 that are staggered with each other can also be disposed on a heat dissipation substrate to contact the heat source 20 by the heat dissipation substrate. Any contact between the heat sink group 100 and the heat source 20 by direct or indirect means is within the spirit and scope of the present invention, and is not limited herein.
在本實施例中，由於散熱流體F例如是散熱氣流，散熱片組100例如是由多個第一散熱片110以及多個第二散熱片120交錯排列所組成，且這些彼此交錯排列之第一散熱片110與第二散熱片120其第一基部112b與第 二基部122b係相互貼合，因此為使第一散熱片110與第二散熱片120之間有適當之間隙以構成散熱流道，每一個第一散熱片110其第一片體112之頂部可設置至少一第一凸點112c，每一個第二散熱片120其第二片體122之頂部可設置至少一第二凸點122c，第一凸點112c抵接於與其相鄰之第二散熱片120，第二凸點122c抵接於與其相鄰之第一散熱片110，而藉由第一凸點112c與第二凸點122c的設置即可控制兩相鄰之第一散熱片110與第二散熱片120間之距離，進而構成一散熱效率佳之流道。其中，由於本實施例例如是藉由凸點設置來間隔出適當距離之散熱流道，而導流蓋體300可蓋合於散熱片組100之頂部以固定第一散熱片110與第二散熱片120之頂端位置，進而讓第一散熱片110與第二散熱片120之間的散熱流道能維持一預設寬度，以使散熱片組100有著較佳之散熱效率。 In this embodiment, since the heat dissipating fluid F is, for example, a heat dissipating airflow, the fin group 100 is composed of, for example, a plurality of first fins 110 and a plurality of second fins 120 staggered, and the first ones are staggered. The heat sink 110 and the second heat sink 120 have their first base 112b and the first The two base portions 122b are attached to each other. Therefore, in order to make a proper gap between the first heat dissipation fins 110 and the second heat dissipation fins 120 to form a heat dissipation flow path, each of the first heat dissipation fins 110 may have a top portion of the first wafer 112. At least one first bump 112c is disposed. Each of the second heat sinks 120 may have at least one second bump 122c disposed on the top of the second body 122. The first bump 112c abuts the second heat sink adjacent thereto. 120, the second bump 122c is in contact with the first heat sink 110 adjacent thereto, and the first bumps 110 and the first adjacent fins 110 can be controlled by the arrangement of the first bumps 112c and the second bumps 122c. The distance between the two heat sinks 120 further constitutes a flow path with good heat dissipation efficiency. In this embodiment, for example, the heat dissipation channel is disposed at an appropriate distance by the bump setting, and the flow guiding cover 300 can be covered on the top of the heat sink group 100 to fix the first heat sink 110 and the second heat dissipation. The top end of the sheet 120 allows the heat dissipation flow path between the first heat sink 110 and the second heat sink 120 to maintain a predetermined width, so that the heat sink group 100 has better heat dissipation efficiency.
另外，在其他的實施例中，亦可沿著組裝路徑L2於散熱片組100之兩側分別設置一無任何孔洞或縫隙結構之散熱片，其可為一單純的平板，以使流入散熱片組100之散熱流體F僅會自散熱流道之出口O流出，而不會自第一散熱片110與第二散熱片120之鏤空部流出。 In addition, in other embodiments, a heat sink without any holes or gap structures may be disposed on both sides of the heat sink group 100 along the assembly path L2, which may be a simple flat plate to allow the heat sink to flow into the heat sink. The heat dissipating fluid F of the group 100 will only flow out from the outlet O of the heat dissipating channel without flowing out from the hollow portions of the first fins 110 and the second fins 120.
在上述實施例中，散熱流體F係以散熱氣流為例，而散熱片組100係以多個第一散熱片110與多個第二散熱片120之組合為例，但本發明並不以此為限。詳細地說，散熱片組係可僅由多個第一散熱片110所組成組合，以藉由第一散熱片110上之流體導引結構114來驅使散熱流體F更迅速地流動，以有效地移除發熱源20傳導至散熱片組100之熱量。此外，上述實施例第一散熱片110與第二散熱片120之間係具有一預設間隔，以構成供散熱氣流流通之散熱流道，而在其他的實施例中，散熱流體F可以是散熱 液體，而這些第一散熱片110與這些第二散熱片120例如可沿組裝路徑L2彼此相貼合，即這些第一散熱片110與這些第二散熱片120可經由壓合技術來成形一塊狀體，由於第一散熱片110與第二散熱片120上之鏤空部係彼此部分地重疊，而形成一鏤空部排列。因此，在設計適當的散熱流道入口及散熱流道出口來與此鏤空部排列相接以構成另一型式的散熱流道之後，散熱流體F即可藉由流經此散熱流道來對發熱源20進行散熱。在散熱流體F為散熱液體之實施方式中，流體驅動機構200即可為一渦輪組，以有效地驅使散熱液體之流動。 In the above embodiment, the heat dissipating fluid F is exemplified by a heat dissipating air flow, and the heat sink group 100 is exemplified by a combination of the plurality of first heat dissipating fins 110 and the plurality of second heat dissipating fins 120, but the present invention does not Limited. In detail, the heat sink assembly may be composed of only a plurality of first heat sinks 110 to drive the heat dissipation fluid F to flow more quickly by the fluid guiding structure 114 on the first heat sink 110 to effectively The heat that the heat source 20 conducts to the heat sink set 100 is removed. In addition, in the above embodiment, the first heat sink 110 and the second heat sink 120 have a predetermined interval to form a heat dissipation flow path for the heat dissipation airflow, and in other embodiments, the heat dissipation fluid F may be heat dissipation. The first heat sink 110 and the second heat sinks 120 can be attached to each other along the assembly path L2, that is, the first heat sinks 110 and the second heat sinks 120 can be formed by a pressing technique. The hollow body 110 and the hollow portion on the second heat sink 120 partially overlap each other to form a hollow portion arrangement. Therefore, after designing an appropriate heat dissipation channel inlet and a heat dissipation channel outlet to be in contact with the hollow portion to form another type of heat dissipation channel, the heat dissipation fluid F can be heated by flowing through the heat dissipation channel. The source 20 performs heat dissipation. In the embodiment in which the heat dissipating fluid F is a heat dissipating liquid, the fluid driving mechanism 200 can be a turbine group to effectively drive the flow of the heat dissipating liquid.
再者，圖1所繪示之電子裝置1係以一顯示板卡為例。然，任何配設有本發明之散熱片組，以對發熱源進行散熱之電子裝置皆屬本發明之精神與範疇，本文在此並不作任何限制。 Moreover, the electronic device 1 illustrated in FIG. 1 is exemplified by a display card. However, any electronic device equipped with the heat sink assembly of the present invention for dissipating heat from the heat source is within the spirit and scope of the present invention, and is not limited herein.
綜上所述，本發明之散熱片組係於散熱片之片體上設計一流體導引結構，其中流體導引結構具有一第一周緣以及一第二周緣，其中第一周緣的長度大於第二周緣的長度，而第一周緣例如是較第二周緣接近發熱源。因此，流入散熱片組之散熱流體在流經該流體導引結構時，由於第一周緣的長度大於該第二周緣的長度，且第一周緣例如是較第二周緣接近發熱源，依據白努力定律，流經第一周緣之散熱流體速度會大於流經第二周緣之散熱流體速度，因此已完成熱交換作業之散熱流體會更快速地自散熱片組流出，進而讓剛進入散熱片組之散熱流體或是其他溫度較低之散熱流體來進行熱交換作業。如此一來，在單位時間內，散熱流體自散熱片組所移除之熱量即能大幅提升，本發明之散熱片組即有較佳之散熱效率。 In summary, the heat sink assembly of the present invention is designed with a fluid guiding structure on the sheet of the heat sink, wherein the fluid guiding structure has a first circumference and a second circumference, wherein the length of the first circumference Greater than the length of the second perimeter, and the first perimeter is, for example, closer to the source of heat than the second perimeter. Therefore, when the heat dissipation fluid flowing into the heat sink group flows through the fluid guiding structure, since the length of the first circumference is greater than the length of the second circumference, and the first circumference is, for example, closer to the heat source than the second circumference, According to the white effort law, the heat transfer fluid flowing through the first circumference will be faster than the heat transfer fluid flowing through the second circumference, so that the heat transfer fluid that has completed the heat exchange operation will flow out from the heat sink group more quickly, so that the heat sink is just entering. The heat transfer fluid of the film set or other lower temperature heat transfer fluid is used for heat exchange work. In this way, the heat removed by the heat dissipating fluid from the heat sink group can be greatly improved in a unit time, and the heat sink group of the present invention has better heat dissipation efficiency.
雖然本發明已揭露數個實施例如上，然其並非用以限定本發明，任何 其所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作任意之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the invention has been disclosed in several embodiments, it is not intended to limit the invention, any It is to be understood that the scope of the present invention is defined by the scope of the appended claims.
1‧‧‧電子裝置 1‧‧‧Electronic device
10‧‧‧散熱模組 10‧‧‧ Thermal Module
20‧‧‧發熱源 20‧‧‧heat source
30‧‧‧電路板 30‧‧‧ boards
100‧‧‧散熱片組 100‧‧‧ Heat sink set
110‧‧‧第一散熱片 110‧‧‧First heat sink
112‧‧‧第一片體 112‧‧‧ first body
112a‧‧‧第一缺槽 112a‧‧‧First missing slot
112b‧‧‧第一基部 112b‧‧‧ first base
112c‧‧‧第一凸點 112c‧‧‧ first bump
114‧‧‧流體導引結構 114‧‧‧ Fluid guiding structure
114’‧‧‧第一周緣 114’‧‧‧First Week
114”‧‧‧第二周緣 114"‧‧‧second circumference
114a‧‧‧導流槽 114a‧‧‧Drainage trough
114a’‧‧‧第一導流槽壁 114a’‧‧‧First diversion wall
114a”‧‧‧第二導流槽壁 114a”‧‧‧Second diversion wall
116‧‧‧第一鏤空部 116‧‧‧The first time department
120‧‧‧第二散熱片 120‧‧‧second heat sink
l22‧‧‧第二片體 L22‧‧‧Second body
122a‧‧‧第二缺槽 122a‧‧‧The second missing slot
122b‧‧‧第二基部 122b‧‧‧second base
122c‧‧‧第二凸點 122c‧‧‧second bump
124‧‧‧第二鏤空部 124‧‧‧ Second Shortage Department
200‧‧‧流體驅動機構 200‧‧‧ fluid drive mechanism
210‧‧‧風扇 210‧‧‧fan
220‧‧‧導流罩體 220‧‧‧Guide hood
300‧‧‧導流蓋體 300‧‧‧drain cover
F‧‧‧散熱流體 F‧‧‧heating fluid
I‧‧‧散熱流道之入口 I‧‧‧ Entrance to the cooling runner
L1‧‧‧配置路徑 L1‧‧‧ configuration path
L2‧‧‧組裝路徑 L2‧‧‧ Assembly path
O‧‧‧散熱流道之出口 O‧‧‧Exhaust channel for heat dissipation
S1‧‧‧鈍狀結構 S1‧‧‧ blunt structure
S2‧‧‧尖狀結構 S2‧‧‧ pointed structure
圖1繪示本發明一實施例之電子裝置的示意圖。 FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the invention.
圖2繪示圖1之電子裝置其散熱模組的放大示意圖。 2 is an enlarged schematic view of a heat dissipation module of the electronic device of FIG. 1.
圖3A繪示圖2之散熱模組其散熱片組與導流蓋體的分解圖。 3A is an exploded view of the heat sink assembly and the flow guide cover of the heat dissipation module of FIG. 2.
圖3B繪示圖3A之散熱模組其散熱片組與導流蓋體的組合圖。 FIG. 3B is a combination diagram of the heat sink group and the flow guiding cover of the heat dissipation module of FIG. 3A.
圖4A繪示圖2之散熱片組其一第一散熱片的示意圖。 4A is a schematic view of a first heat sink of the heat sink assembly of FIG. 2.
圖4B繪示圖2之散熱片組其一第二散熱片的示意圖。 4B is a schematic view showing a second heat sink of the heat sink group of FIG. 2.
圖4C繪示圖4A之第一散熱片與圖4B之第二散熱片相互疊合後的示意圖。 4C is a schematic view showing the first heat sink of FIG. 4A and the second heat sink of FIG. 4B overlapping each other.
圖5繪示圖4A之第一散熱片其流體導引結構的放大示意圖。 FIG. 5 is an enlarged schematic view showing the fluid guiding structure of the first heat sink of FIG. 4A.
圖6繪示圖4A之第一散熱片與圖4B之第二散熱片相互疊合後的立體示意圖。 6 is a perspective view showing the first heat sink of FIG. 4A and the second heat sink of FIG. 4B overlapping each other.
Claims (15)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101119814A TWI656437B (en) | 2012-06-01 | 2012-06-01 | Heat-dissipating fins assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101119814A TWI656437B (en) | 2012-06-01 | 2012-06-01 | Heat-dissipating fins assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201351106A TW201351106A (en) | 2013-12-16 |
| TWI656437B true TWI656437B (en) | 2019-04-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101119814A TWI656437B (en) | 2012-06-01 | 2012-06-01 | Heat-dissipating fins assembly |
Country Status (1)
| Country | Link |
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| TW (1) | TWI656437B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6371200B1 (en) * | 1999-11-18 | 2002-04-16 | The United States Of America As Represented By The Secretary Of The Navy | Perforated heat sink |
| TW200826815A (en) * | 2006-12-01 | 2008-06-16 | Foxconn Tech Co Ltd | Heat dissipating device |
| US20110139429A1 (en) * | 2009-12-11 | 2011-06-16 | General Electric Company | Shaped heat sinks to optimize flow |
| TW201124691A (en) * | 2010-01-11 | 2011-07-16 | Hon Hai Prec Ind Co Ltd | Heat dissipation device |
-
2012
- 2012-06-01 TW TW101119814A patent/TWI656437B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6371200B1 (en) * | 1999-11-18 | 2002-04-16 | The United States Of America As Represented By The Secretary Of The Navy | Perforated heat sink |
| TW200826815A (en) * | 2006-12-01 | 2008-06-16 | Foxconn Tech Co Ltd | Heat dissipating device |
| US20110139429A1 (en) * | 2009-12-11 | 2011-06-16 | General Electric Company | Shaped heat sinks to optimize flow |
| TW201124691A (en) * | 2010-01-11 | 2011-07-16 | Hon Hai Prec Ind Co Ltd | Heat dissipation device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201351106A (en) | 2013-12-16 |
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