TWI653099B - Wiping mechanism and wafer residue cleaning device using the same - Google Patents
Wiping mechanism and wafer residue cleaning device using the same Download PDFInfo
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- TWI653099B TWI653099B TW105114525A TW105114525A TWI653099B TW I653099 B TWI653099 B TW I653099B TW 105114525 A TW105114525 A TW 105114525A TW 105114525 A TW105114525 A TW 105114525A TW I653099 B TWI653099 B TW I653099B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
本發明提供一種擦拭機構及使用該擦拭機構之晶圓殘膠清潔裝置,該擦拭機構,包括:一第一壓抵組件,可受驅動作上下位移,該第一壓抵組件設有微調及連動該第一壓抵組件之一移擦頭在X軸向、Y軸向的兩側水平高度的調整組件;一拭材組件,其上繞設有帶狀拭材;該第一壓抵組件設於一壓抵座架上,該拭材組件與該壓抵座架連動,該壓抵座架上該第一壓抵組件及一第二壓抵組件形成一壓抵模組並設於一固定座,其中,該第一壓抵組件設有熱源,該第二壓抵組件與第一壓抵組件構造相同但未設有熱源;該第一壓抵組件可受驅動以該移擦頭壓抵該拭材抵於待施作工件表面進行清潔。 The invention provides a wiping mechanism and a wafer residue cleaning device using the wiping mechanism. The wiping mechanism includes a first pressing member which can be driven to move up and down. The first pressing member is provided with fine adjustment and linkage. One of the first pressing components is an adjusting component for adjusting the horizontal height of the wiper head on both sides in the X-axis direction and the Y-axis direction; a wiping material component on which a strip-shaped wiping material is wound; On a pressing seat, the wiping material component is linked with the pressing seat, and the first pressing member and a second pressing member on the pressing seat form a pressing module and are arranged on a fixed A seat, wherein the first pressing component is provided with a heat source, the second pressing component has the same structure as the first pressing component but is not provided with a heat source; the first pressing component can be driven to press against the wiper head The wiper is cleaned against the surface of the workpiece to be applied.
Description
本發明係有關於一種擦拭機構及使用該擦拭機構之晶圓殘膠清潔裝置,尤指一種可針對個別晶粒進行殘膠清除的擦拭機構及使用該擦拭機構之晶圓殘膠清潔裝置 The invention relates to a wiping mechanism and a wafer residue cleaning device using the same, and more particularly to a wiping mechanism capable of removing residual glue for individual crystal grains and a wafer residue cleaning device using the wiping mechanism.
按,一般晶圓加工製程中常使用黏膠進行噴塗或沾點在晶粒或其周緣上,這些黏膠通常在完成製程後會留在晶粒上,有些則必須作清除否則會影響下一製程的進行,而無論以任何溶劑進行清潔,黏膠都很難完全被清除;先前技術在進行清潔時,皆會採取對整片晶圓作擦拭的操作,以使整片晶圓的表面的殘膠被清除。 According to the general wafer processing process, adhesive is often used for spraying or dipping on the die or its periphery. These adhesives usually remain on the die after the process is completed, and some must be removed, otherwise it will affect the next process. It is difficult to completely remove the adhesive regardless of cleaning with any solvent. In the previous technology, the entire wafer was wiped to remove the residual surface The glue is cleared.
先前技術中對整片晶圓作擦拭的操作僅能適用於晶圓表面具有大片殘膠的狀況,且僅適用於2D的晶圓;由於現今晶圓製程已發展至3D的製程,往往在晶圓已完成切割出晶粒後,仍必須作晶粒間的塗膠,因此許多時後殘膠的發生不會是一大片,而是僅會殘留在某些個別晶粒,則作整片晶圓的清潔難以針對個別晶粒作有效清潔。 The wiping operation of the entire wafer in the prior art can only be applied to the situation where the wafer surface has a large amount of adhesive residue, and it is only applicable to 2D wafers. Since the wafer process has developed to a 3D process, it is often used in After the circle has been cut out of the grains, it is still necessary to apply glue between the grains, so many times the occurrence of residual glue will not be a large piece, but will only remain on some individual grains. Circle cleaning is difficult to effectively clean individual crystal grains.
爰是,本發明的目的,在於提供一種可針對個別晶粒進行殘膠清潔的擦拭機構。 That is, the object of the present invention is to provide a wiping mechanism which can clean the residual glue for individual crystal grains.
本發明的另一目的,在於提供一種使用所述擦拭機構的晶圓殘膠清潔裝置。 Another object of the present invention is to provide a wafer residue cleaning device using the wiping mechanism.
依據本發明目的之擦拭機構,包括:一第一壓抵組件,可受驅動作上下位移,該第一壓抵組件設有微調及連動該第一壓抵組件之一移擦頭在X軸向、Y軸向的兩側水平高度的調整組件;一拭材組件,其上繞設有帶狀拭材;該第一壓抵組件設於一壓抵座架上,該拭材組件與該壓抵座架連動,該壓抵座架上該第一壓抵組件及一第二壓抵組件形成一壓抵模組並設於一固定座,其中,該第一壓抵組件設有熱源,該第二壓抵組件與第一壓抵組件構造相同但未設有熱源;該第一壓抵組件可受驅動以該移擦頭壓抵該拭材抵於待施作工件表面進行清潔。 The wiping mechanism according to the purpose of the present invention includes: a first pressing member that can be driven to move up and down. The first pressing member is provided with a fine-tuning and interlocking movement head of one of the first pressing members in the X axis direction. A component for adjusting the horizontal height on both sides of the Y-axis; a wiper component on which a strip-shaped wiper is wound; the first pressing component is provided on a pressing seat, and the wiper component and the pressing component The abutting frame is linked, and the first abutting component and a second abutting component on the abutting frame form a abutting module and are arranged on a fixed seat, wherein the first abutting component is provided with a heat source, and the The second pressing component has the same structure as the first pressing component but is not provided with a heat source; the first pressing component can be driven to press the wiper head against the swab to clean the surface to be applied.
依據本發明另一目的之晶圓殘膠清潔裝置,使用如所述擦拭機構,其中,包括:以一機台由龍門軌架分隔出一第一工作區以及一第二工作區;一檢測機構,設於朝第一工作區的該龍門軌架一側,對第一工作區中的待施作工件進行檢視;一取放機構,設於機台該第一工作區,包括相隔間距設置的二夾座;一載台,設於機台該第二工作區可受驅動而位移於第一工作區、第二工作區間,並自取放機構承接待施作工件或將待施作工件交付取放機構;該擦拭機構,設於朝第二工作區的該龍門軌架一側,該第一壓抵組件可受驅動壓抵拭材對載台上的待施作工件進行殘膠清潔。 According to another object of the present invention, a wafer residue cleaning device uses the wiping mechanism as described above, which includes: a first working area and a second working area separated by a gantry rail frame by a machine; a detection mechanism , Located on the side of the gantry rail facing the first work area, inspecting the workpieces to be applied in the first work area; a pick-and-place mechanism, located in the first work area of the machine, including spaced-apart Two clamp bases; a carrier set on the machine. The second work area can be driven to move to the first work area and the second work area, and accepts the work piece from the pick-and-place mechanism or delivers the work piece to be used. A picking and placing mechanism; the wiping mechanism is provided on the side of the gantry rail frame facing the second work area, and the first pressing component can be driven to press against the wiping material to clean the residual work on the carrier to be applied.
依據本發明另一目的之另一晶圓殘膠清潔裝置,包括:以一機台由龍門軌架分隔出一第一工作區以及一第二工作區;一檢測機構,設於朝第一工作區的該龍門軌架一側,對第一工作區中的待施作工件進行檢視;一取放機構,設於機台該第一工作區,包括相隔間距設置的二夾座;一載台,設於機台該第二工作區可受驅動而位移於第一工作區、第二工作區間,並自取放機構承接待施作工件或將待施作工件交付取放機構;一擦拭機構,設於朝第二工作區的該龍門軌架一側,包括:一第一壓抵組件,可受驅動作上下位移,該第一壓抵組件設於一壓抵座架上,該壓抵座架上 該第一壓抵組件及一第二壓抵組件形成一壓抵模組;一拭材組件,其上繞設有帶狀拭材;該第一壓抵組件可受驅動以一移擦頭壓抵該拭材抵於載台上待施作工件表面進行清潔。 According to another object of the present invention, another wafer residue cleaning device includes: a first working area and a second working area separated by a gantry rail by a machine; a detection mechanism provided in the first working direction; One side of the gantry rail frame in the area inspects the workpieces to be applied in the first work area; a pick-and-place mechanism is set in the first work area of the machine, and includes two clamp seats spaced apart; a carrier platform The second working area located on the machine can be driven to move to the first working area and the second working area, and accept the application workpiece from the pick-and-place mechanism or deliver it to the pick-and-place mechanism; a wiping mechanism It is located on the side of the gantry rail frame facing the second working area and includes: a first pressing component that can be driven to move up and down. The first pressing component is provided on a pressing seat and the pressing On the seat The first pressing component and a second pressing component form a pressing module; a wiping material component is provided with a band-shaped wiping material wound around it; the first pressing component can be driven to move the pressing head The wiper is cleaned against the surface of the workpiece to be applied on the stage.
本發明實施例之擦拭機構及使用該擦拭機構之晶圓殘膠清潔裝置,由於擦拭機構採晶粒逐一擦膠清潔方式進行,故可針對被檢出有殘膠的晶粒單獨清潔,除可達較佳清潔效果外,對於整片晶圓上殘膠的清潔可以有效率的執行;且在待施作工件已被載台上加熱元件加熱而使殘膠受溫熱執行一由下對整片待施作工件第一次熱解程序的情況下,擦拭機構由具有熱源的第一壓抵組件再執行一由上對下針對單獨晶粒的第二次熱解程序,被進行擦膠的該晶粒上殘膠已融成液態稀釋狀,再經無熱源的第二壓抵組件擦拭下,可以使殘膠清潔更容易進行,且配合線雷射測高器所投射線性雷射光束對擦膠效果進行檢查,可以更無遺漏的完成各晶粒清潔;而擦拭機構的拭材組件藉由釋材區中捲輪釋放拭材到捲收區中空的捲輪捲收拭材,其間使拭材可以無間斷地自清潔液容器上滾輪沾附清潔液,並經配重輪配重輪、調整拭材在整個流路中被拉引的鬆緊適度,使擦膠清潔的作業可以循環不間斷的自動化進行,使清潔效能大幅提高;同時壓抵模組藉第二軌座上、下側的彈性元件在Z軸向上、下位移時具有彈性之緩衝,使壓抵模組上的第一壓抵組件或第二壓抵組件壓抵拭材抵於晶粒表面時,除受載台上荷重量測元件的量測而監控下壓力道外,下壓之壓力本身就具有緩衝,可以降低待施作工件上晶粒受損。 According to the wiping mechanism of the embodiment of the present invention and the wafer residue cleaning device using the wiping mechanism, since the wiping mechanism adopts a one-by-one wiping cleaning method for the grains, it can be cleaned separately for the grains with residual gums detected. In addition to achieving a better cleaning effect, the cleaning of the residual glue on the entire wafer can be efficiently performed; and the workpiece to be applied has been heated by the heating element on the stage, so that the residual glue is heated to perform a bottom-to-side alignment. In the case that the piece is to be subjected to the first pyrolysis procedure of the workpiece, the wiping mechanism is executed by the first pressing component with a heat source and then a second pyrolysis procedure for the individual grains from top to bottom is performed. The residual glue on the crystal grains has been melted into a liquid dilution state, and then wiped by the second pressing component without a heat source, which can make the cleaning of the residual glue easier, and cooperate with the linear laser beam projected by the line laser altimeter. The glue effect is checked to complete the cleaning of each grain without any omissions; while the wiper assembly of the wiper mechanism releases the wiper through the roll in the release area to the hollow roll in the take-up area to rewind the wipe, during which Wipes can be self-cleaning without interruption The upper roller is adhered with cleaning liquid, and the weight of the wiper is adjusted through the weight wheel and the adjustment of the tightness of the material in the entire flow path, so that the cleaning operation of the glue can be performed continuously and automatically, and the cleaning efficiency is greatly improved. ; At the same time, the pressing module uses the elastic elements on the upper and lower sides of the second rail seat to have an elastic buffer when the Z axis is displaced up and down, so that the first pressing component or the second pressing component on the pressing module is pressed. When the rubbing material is pressed against the surface of the crystal grain, in addition to being monitored by the load cell on the stage to monitor the downward pressure channel, the downward pressure itself has a buffer, which can reduce the damage to the crystal grains on the workpiece to be applied.
A‧‧‧機台 A‧‧‧machine
A1‧‧‧機台台面 A1‧‧‧machine table top
A2‧‧‧台座 A2‧‧‧ pedestal
A21‧‧‧上表面 A21‧‧‧upper surface
A3‧‧‧移載區間 A3‧‧‧ transfer interval
A4‧‧‧第一工作區 A4‧‧‧First Work Area
A5‧‧‧第二工作區 A5‧‧‧Second Work Area
B‧‧‧龍門軌架 B‧‧‧ Longmen Rail
B1‧‧‧立柱 B1‧‧‧post
B2‧‧‧橫樑 B2‧‧‧ beam
B3‧‧‧第一驅動件 B3‧‧‧First Drive
B4‧‧‧滑軌 B4‧‧‧Slide
B5‧‧‧滑軌 B5‧‧‧Slide
B6‧‧‧滑座 B6‧‧‧slide
B7‧‧‧第二驅動件 B7‧‧‧Second driver
C‧‧‧檢測機構 C‧‧‧testing agency
D‧‧‧取放機構 D‧‧‧Pick-and-place
D1‧‧‧夾座 D1‧‧‧clip
D2‧‧‧卡掣部 D2‧‧‧Clamp
D3‧‧‧嵌夾件 D3‧‧‧Inlay clip
D4‧‧‧樞軸 D4‧‧‧ Pivot
D5‧‧‧固定座 D5‧‧‧Fixed
D6‧‧‧驅動件 D6‧‧‧Driver
E‧‧‧軌座 E‧‧‧rail mount
E1‧‧‧軌座驅動件 E1‧‧‧rail seat driver
F‧‧‧供液機構 F‧‧‧liquid supply mechanism
G‧‧‧載台 G‧‧‧ carrier
G1‧‧‧固定座 G1‧‧‧Fixed
G2‧‧‧載盤 G2‧‧‧carriage
G21‧‧‧上表面 G21‧‧‧upper surface
G22‧‧‧支撐架 G22‧‧‧Support
G23‧‧‧荷重量測元件 G23‧‧‧Load-weight measuring element
G24‧‧‧定位件 G24‧‧‧ Positioning piece
G3‧‧‧固定架 G3‧‧‧Fixed
G31‧‧‧座面 G31‧‧‧Seat
G311‧‧‧側邊 G311‧‧‧side
G32‧‧‧架腳 G32‧‧‧ frame feet
G33‧‧‧定位區間 G33‧‧‧Positioning interval
G4‧‧‧加熱元件 G4‧‧‧Heating element
G41‧‧‧加熱棒 G41‧‧‧Heating rod
G5‧‧‧定位盤 G5‧‧‧Positioning plate
G51‧‧‧凹溝 G51‧‧‧Ditch
G52‧‧‧凹溝 G52‧‧‧Ditch
G53‧‧‧氣孔 G53‧‧‧Stoma
H‧‧‧擦拭機構 H‧‧‧ Wiping mechanism
H1‧‧‧壓抵座架 H1‧‧‧ pressed against the seat
H11‧‧‧固定座 H11‧‧‧Fixed
H12‧‧‧驅動件 H12‧‧‧Driver
H13‧‧‧第一軌座 H13‧‧‧First rail seat
H131‧‧‧滑座 H131‧‧‧Slide
H14‧‧‧連動座 H14‧‧‧Interlocking seat
H15‧‧‧第二軌座 H15‧‧‧Second rail seat
H151‧‧‧滑軌 H151‧‧‧Slide
H152‧‧‧滑座 H152‧‧‧Slide
H153‧‧‧軌桿 H153‧‧‧rail
H154‧‧‧驅動件 H154‧‧‧Driver
H155‧‧‧彈性元件 H155‧‧‧Elastic element
H2‧‧‧雷射測高器 H2‧‧‧Laser Altimeter
H21‧‧‧線雷射光束 H21‧‧‧line laser beam
H3‧‧‧壓抵模組 H3‧‧‧Pressing module
H31‧‧‧第一壓抵組件 H31‧‧‧The first pressing component
H311‧‧‧驅動件 H311‧‧‧Driver
H3111‧‧‧固定座 H3111‧‧‧Fixed
H3112‧‧‧連結座 H3112‧‧‧Connecting Block
H3113‧‧‧側座 H3113‧‧‧Side Seat
H312‧‧‧調整組件 H312‧‧‧Adjustment kit
H3121‧‧‧第一調整座 H3121‧‧‧The first adjustment seat
H3122‧‧‧第二調整座 H3122‧‧‧Second adjustment seat
H3123‧‧‧第三調整座 H3123‧‧‧The third adjustment seat
H3124‧‧‧固定件 H3124‧‧‧Fixing
H3125‧‧‧固定件 H3125‧‧‧Fixing
H313‧‧‧聯結座 H313‧‧‧Joint Block
H3131‧‧‧加熱孔 H3131‧‧‧Heating hole
H3132‧‧‧測溫孔 H3132‧‧‧Temperature hole
H3133‧‧‧裝卸部 H3133‧‧‧ Loading and unloading department
H3134‧‧‧裝卸孔 H3134‧‧‧Mounting hole
H3135‧‧‧溫度開關 H3135‧‧‧Temperature Switch
H314‧‧‧加熱件 H314‧‧‧Heating element
H315‧‧‧壓抵座 H315‧‧‧Pressed to the seat
H3151‧‧‧裝卸頭 H3151‧‧‧ Loading head
H3152‧‧‧移擦頭 H3152‧‧‧ Mobile wipe head
H3153‧‧‧推把 H3153‧‧‧ Push handle
H3154‧‧‧聯接件 H3154‧‧‧Joint
H3155‧‧‧移擦部 H3155‧‧‧moving and wiping department
H3156‧‧‧磁吸件 H3156‧‧‧Magnetic piece
H316‧‧‧螺接件 H316‧‧‧Screw
H3161‧‧‧微調螺接件 H3161‧‧‧fine adjustment screw
H3162‧‧‧固定螺接件 H3162‧‧‧Fixed screw
H3163‧‧‧可調螺接件 H3163‧‧‧Adjustable screw
H3164‧‧‧穿孔 H3164‧‧‧ perforated
H3171‧‧‧銷件 H3171‧‧‧pin
H3172‧‧‧彈性元件 H3172‧‧‧Elastic element
H32‧‧‧第二壓抵組件 H32‧‧‧Second pressing component
H33‧‧‧座架 H33‧‧‧Seat
H4‧‧‧拭材組件 H4‧‧‧ wipe material assembly
H41‧‧‧固定架 H41‧‧‧Fixed frame
H411‧‧‧第一區間 H411‧‧‧First Interval
H412‧‧‧第二區間 H412‧‧‧Second Section
H413‧‧‧固定部 H413‧‧‧Fixed section
H414‧‧‧釋材區 H414‧‧‧Release area
H4141‧‧‧驅動件 H4141‧‧‧Driver
H4142‧‧‧捲輪 H4142‧‧‧roller
H4143‧‧‧第一轉向輪 H4143‧‧‧First steering wheel
H4144‧‧‧第二轉向輪 H4144‧‧‧Second Steering Wheel
H4145‧‧‧配重輪 H4145‧‧‧weight wheel
H4146‧‧‧長槽孔 H4146‧‧‧long slot
H4147‧‧‧配重 H4147‧‧‧ Counterweight
H4148‧‧‧滑軌 H4148‧‧‧Slide
H4149‧‧‧感測件 H4149‧‧‧Sensor
H415‧‧‧捲收區 H415‧‧‧Rewinding area
H4151‧‧‧驅動件 H4151‧‧‧Driver
H4152‧‧‧捲輪 H4152‧‧‧roller
H4153‧‧‧第一轉向輪 H4153‧‧‧First steering wheel
H4154‧‧‧第二轉向輪 H4154‧‧‧Second Steering Wheel
H4155‧‧‧配重輪 H4155‧‧‧weight wheel
H4156‧‧‧長槽孔 H4156‧‧‧long slot
H4157‧‧‧配重 H4157‧‧‧ Counterweight
H4158‧‧‧滑軌 H4158‧‧‧Slide
H4159‧‧‧感測件 H4159‧‧‧Sensor
H416‧‧‧沾液區 H416‧‧‧Stained liquid area
H4161‧‧‧清潔液容器 H4161‧‧‧Cleaning liquid container
H4162‧‧‧滾輪 H4162‧‧‧roller
H4163‧‧‧近轉輪 H4163‧‧‧Recent runner
H4164‧‧‧擺架 H4164‧‧‧ Display
H4165‧‧‧第一活動輪 H4165‧‧‧The first activity wheel
H4166‧‧‧第二活動輪 H4166‧‧‧Second Activity Wheel
H4167‧‧‧長槽孔 H4167‧‧‧long slot
H4168‧‧‧軸桿 H4168‧‧‧Shaft
H4169‧‧‧旋轉驅動件 H4169‧‧‧Rotary driver
H417‧‧‧拉引區 H417‧‧‧Pull Zone
H4171‧‧‧驅動件 H4171‧‧‧Driver
H4172‧‧‧拉引輪 H4172‧‧‧Drawing Pulley
H4173‧‧‧嵌抵輪 H4173‧‧‧Bucket
H4174‧‧‧樞軸 H4174‧‧‧ Pivot
H4175‧‧‧擺臂 H4175‧‧‧Swing arm
H4176‧‧‧樞銷 H4176‧‧‧ pivot pin
H4177‧‧‧彈性元件 H4177‧‧‧Elastic element
H418‧‧‧擦拭區 H418‧‧‧ wipe area
H4181‧‧‧第一導引臂 H4181‧‧‧First Guide Arm
H4182‧‧‧第二導引臂 H4182‧‧‧Second Guide Arm
H4183‧‧‧操作間距 H4183‧‧‧ Operating distance
H4184‧‧‧第一支撐輪 H4184‧‧‧First support wheel
H4185‧‧‧第二支撐輪 H4185‧‧‧Second support wheel
H4186‧‧‧導引輪 H4186‧‧‧Guide Wheel
H419‧‧‧溫度感測器 H419‧‧‧Temperature Sensor
H4191‧‧‧延伸桿 H4191‧‧‧ extension rod
H4192‧‧‧固定座 H4192‧‧‧Fixed
H4193‧‧‧滑座 H4193‧‧‧slide
H4194‧‧‧滑軌 H4194‧‧‧Slide
W‧‧‧待施作工件 W‧‧‧ to be applied
W1‧‧‧鋼框 W1‧‧‧steel frame
W2‧‧‧膠膜 W2‧‧‧ Adhesive film
W3‧‧‧晶圓 W3‧‧‧ Wafer
W4‧‧‧晶粒 W4‧‧‧ Grain
圖1係本發明實施例中晶圓殘膠清潔裝置機台第一工作區側之機構立體示意圖。 FIG. 1 is a schematic perspective view of a mechanism on the side of a first working area of a wafer residue cleaning device table in an embodiment of the present invention.
圖2係本發明實施例中晶圓殘膠清潔裝置機台第二工作區側之機構立體示意圖。 FIG. 2 is a schematic perspective view of the mechanism of the second work area side of the wafer residue cleaning device table in the embodiment of the present invention.
圖3係本發明實施例中圖1之正面示意圖。 FIG. 3 is a schematic front view of FIG. 1 in the embodiment of the present invention.
圖4係本發明實施例中圖1之左側示意圖。 FIG. 4 is a schematic diagram on the left side of FIG. 1 in the embodiment of the present invention.
圖5係本發明實施例中載台之立體分解示意圖。 FIG. 5 is an exploded perspective view of a carrier in the embodiment of the present invention.
圖6係本發明實施例中載台之定位盤上氣孔之示意圖。 FIG. 6 is a schematic diagram of air holes on a positioning plate of a carrier in the embodiment of the present invention.
圖7係本發明實施例中擦拭機構之立體示意圖。 FIG. 7 is a schematic perspective view of the wiping mechanism in the embodiment of the present invention.
圖8係本發明實施例中擦拭機構之背側立體示意圖。 FIG. 8 is a schematic perspective view of the back side of the wiping mechanism in the embodiment of the present invention.
圖9係本發明實施例中壓抵座架與壓抵模組之立體分解示意圖。 FIG. 9 is an exploded perspective view of the pressing seat and the pressing module in the embodiment of the present invention.
圖10係本發明實施例中壓抵模組及第一壓抵組件之立體分解示意圖。 FIG. 10 is an exploded perspective view of the pressing module and the first pressing module in the embodiment of the present invention.
圖11係本發明實施例中調整組件之立體分解示意圖。 FIG. 11 is a three-dimensional exploded schematic view of an adjustment component in an embodiment of the present invention.
圖12係本發明實施例中拭材組件之立體示意圖。 FIG. 12 is a schematic perspective view of a wipe material assembly in the embodiment of the present invention.
圖13係本發明實施例中拭材組件繞設拭材之正面示意圖。 FIG. 13 is a schematic front view of a wipe material assembly surrounding a wipe material in an embodiment of the present invention.
圖14係本發明實施例中第一壓抵組件之移擦頭在晶圓之晶粒上作移擦之立體示意圖。 FIG. 14 is a three-dimensional schematic diagram of the moving and erasing head of the first pressing component moving on the die of the wafer in the embodiment of the present invention.
圖15係本發明實施例中以雷射測高器的線雷射光束進行殘膠檢測之示意圖。 FIG. 15 is a schematic diagram of detecting residual glue by using a line laser beam of a laser altimeter according to an embodiment of the present invention.
請參閱圖1、2,本發明實施例可以圖中的晶圓殘膠清潔裝置來說明,包括:一機台A,具有一機台台面A1,機台A一端的機台台面A1上兩側各凸設形成高度相對應的台座A2,使二台座A2間形成一凹設狀之移載區間A3, 該二台座A2上表面A21與未設台座A2的機台A另一端機台台面A1形成一高度落差;一龍門軌架B,以二立柱B1橫跨架於該機台A的二台座A2上,一橫樑B2設於二立柱B1間,該龍門軌架B將機台A分隔並規劃出位於未設台座A2的機台A另一端機台台面A1的第一工作區A4,以及位於二台座A2一側的第二工作區A5,其中,該第一工作區A4用以執行取放待施作工件W及對待施作工件W進行檢測;該第二工作區A5用以對待施作工件W進行擦膠作業;該待施作工件W為一黏設於一環狀鋼框W1所貼設之膠膜W2上的晶圓W3,該晶圓W3與環狀鋼框W1保持一環狀間距,晶圓W3並已完成切割出逐粒之晶粒W4,並因相關製程而於晶粒W4上留有殘膠;一檢測機構C,由一CCD鏡頭所構成,設於朝第一工作區A4的該龍門軌架B一側,其受龍門軌架B上一第一驅動件B3所驅動而可在龍門軌架B上橫樑B2的X軸向滑軌B4作X軸向往復位移,該檢測機構C的CCD鏡頭以Z軸向朝下方向對第一工作區A4中的待施作工件W進行檢視;一取放機構D,設於第一工作區A4的機台台面A1上,其包括在X軸向相隔間距設置的二夾座D1,二夾座D1分別各設有相向凹設卡掣部D2之嵌夾件D3,各嵌夾件D3分別各設於位於呈Y軸向間隔列設的複數樞軸D4所支撐的固定座D5上,該二嵌夾件D3分別各受其下方固定座D5上的一驅動件D6所驅動,可作X軸向相向夾扣待施作工件W的環狀鋼框W1,使待施作工件W呈水平狀態跨架於二嵌夾件D3間;該固定座D5並可連動嵌夾件D3隨樞軸D4受驅動昇降,而連動所夾持的待施作工件W作上下昇降;二嵌夾件D3夾持扣待施作工件W時,待施作工件W的高度低於該龍門軌架B上橫樑B2及檢測機構C下端之高度; 一軌座E,設於機台台面A1上,呈Y軸向設置,其一端伸於第一工作區A4中該取放機構D中二夾座D1的待施作工件W下方,另一端穿經龍門軌架B下方而伸置於第二工作區A5的二台座A2間凹設狀之移載區間A3中,其一端並設有軌座驅動件E1;一供液機構F,設於第一工作區A4中的機台台面A1上,內容置有清潔液,可設有管路將清潔液進行輸送;一載台G,設於該第二工作區A5的二台座A2間凹設狀之移載區間A3中軌座E上,並受該軌座E上軌座驅動件E1之驅動可作Y軸向穿經龍門軌架B下方而位移於第一工作區A4、第二工作區A5間;請同時配合參閱圖3、4,載台G可在穿經龍門軌架B位移於第一工作區A4中時,移入取放機構D中二夾座D1的待施作工件W下方,並自取放機構D承接待施作工件W,並於承接待施作工件W後移至檢測機構C下方接受檢測,再承載移待施作工件W移至第二工作區A5中進行擦膠作業,完成擦膠作業後再至回移第一工作區A4中時,將完成擦膠作業的待施作工件W交付取放機構D;一擦拭機構H,設於朝第二工作區A5的該龍門軌架B之橫樑B2一側的X軸向滑軌B5的滑座B6上,其受龍門軌架B上一第二驅動件B7所驅動而可在滑軌B5上作X軸向往復位移,該擦拭機構H以Z軸向朝下方向對移送至第二工作區A5中的待施作工件W進行擦膠作業。 Please refer to FIGS. 1 and 2, an embodiment of the present invention can be described by the wafer residue cleaning device in the figure, including: a machine A, having a machine table A1, and two sides of the machine table A1 at one end of the machine A Each convex setting forms a pedestal A2 corresponding to the height, so that a concave-shaped transfer area A3 is formed between the two pedestals A2, The upper surface A21 of the two pedestals A2 forms a height difference with the table surface A1 of the other end of the machine A without the pedestal A2; a gantry rail frame B is straddled on the two pedestals A2 of the machine A with two pillars B1 A beam B2 is located between the two pillars B1. The gantry rail B separates machine A and plans a first work area A4 located on the other side of machine table A1 without machine table A2, and is located on two machine tables. The second work area A5 on the side of A2, wherein the first work area A4 is used to perform inspection of the workpiece W to be applied and the work W to be applied; the second work area A5 is used to treat the work W Perform the wiping operation; the workpiece W to be applied is a wafer W3 adhered to the adhesive film W2 attached to an annular steel frame W1, and the wafer W3 and the annular steel frame W1 maintain an annular distance The wafer W3 has finished cutting out the individual grains W4, and the residual glue is left on the grains W4 due to the relevant process; a detection mechanism C is composed of a CCD lens and is located in the first working area The side of the gantry rail B of A4 is driven by a first drive member B3 on the gantry rail B and can be used as the X axis on the X-axis slide rail B4 of the beam B2 on the gantry rail B After resetting, the CCD lens of the detection mechanism C inspects the workpiece W to be applied in the first work area A4 in the downward direction of the Z axis; a pick-and-place mechanism D is provided on the table surface of the first work area A4. On A1, it includes two clip holders D1 which are arranged at a distance from each other in the X-axis direction. The two clip holders D1 are respectively provided with recessed clamping members D3 opposite to each other and the latching sections D2 are provided. On the fixed seat D5 supported by a plurality of pivots D4 arranged in the Y-axis space, the two insert clips D3 are each driven by a driving member D6 on the fixed seat D5 below it, which can be used as the X-axis opposing clips. The ring-shaped steel frame W1 of the workpiece W to be applied makes the workpiece W to be horizontally straddled between the two insert clips D3; the fixed seat D5 can be driven to move up and down with the pivot D4 in conjunction with the insert clip D3. When the workpiece W to be applied is moved up and down by two linked clamps; when the workpiece W to be applied is clamped by the two insert clips D3, the height of the workpiece W to be applied is lower than the cross beam B2 of the gantry rail B and the detection mechanism. The height of the lower end of C; A rail seat E is provided on the machine table A1 and is arranged in the Y-axis direction. One end of the rail seat E extends below the workpiece W to be applied in the second clamping seat D1 of the pick-and-place mechanism D in the first work area A4. It is placed under the gantry rail B in the recessed transfer area A3 between the two bases A2 of the second work area A5, and one end is provided with a rail drive E1; a liquid supply mechanism F is provided at the first On the machine table A1 in a work area A4, a cleaning liquid is placed in the content, and a pipeline can be provided to convey the cleaning liquid. A carrier G is recessed between the two bases A2 of the second work area A5. In the transfer area A3, on the rail base E, and driven by the rail base driver E1 on the rail base E, it can be axially penetrated under the gantry rail B and displaced in the first working area A4 and the second working area. Room A5; please refer to Figures 3 and 4 at the same time. When the platform G can move through the gantry rail B in the first working area A4, it can be moved under the workpiece W to be applied to the two clamps D1 in the pick-and-place mechanism D. And pick up and put in place D to receive the applied workpiece W, and after receiving the applied workpiece W, it is moved to the bottom of the detection mechanism C for testing, and then the workpiece W to be applied is moved to the second work area A5 Carry out the rubber-rubbing operation. After the rubber-rubbing operation is completed and then moved back to the first work area A4, the work piece W to be applied which has completed the rubber-rubbing operation is delivered to the pick-and-place mechanism D; a wiping mechanism H is provided in the second work direction. On the slide seat B6 of the X-axis slide rail B5 on the side of the cross beam B2 of the gantry rail frame B in area A5, it can be driven by a second drive member B7 on the gantry rail frame B to act as an X on the slide rail B5. Reciprocating in the axial direction, the wiping mechanism H performs a gumming operation on the workpiece W to be applied to the second work area A5 in a downward direction of the Z axis.
請參閱圖5,該載台G包括:一固定座G1,設於該軌座E上,受該軌座E上軌座驅動件E1之驅動可作Y軸向位移,一載盤G2,設於固定座G1上,可受固定座G1中驅動件(圖中未示)驅動而作旋轉,載盤G2呈一圓盤狀並於周緣等分設有外凸並微上揚高於載盤G2上表面G21的複數個支撐架G22(本實施例中為四個),載盤G2的上表面G21 中央設有一荷重量測元件G23,載盤G2的上表面G21於荷重量測元件G23外周側以呈九十度角方位分別各設有二定位件G24;一固定架G3,設於載盤G2上的荷重量測元件G23上方並受荷重量測元件G23量測,其以一座面G31貼靠設於荷重量測元件G23上,並以四角部向外延伸凸設的架腳G32分別各座設於該載盤G2的支撐架G22上,固定架G3並可受載盤G2連動進行旋轉;固定架G3上四架腳G32互呈九十度分叉設置,並使每二架腳G32間鄰靠的座面G31側邊G311形成直邊狀,二架腳G32與其間鄰靠的座面G31側邊G311間形成凹設的定位區間G33,固定架G3以座面G31貼靠設於荷重量測元件G23時,二相鄰的定位區間G33恰被該荷重量測元件G23外周側呈九十度角方位設置的二定位件G24所嵌靠定位;一加熱元件G4,由複數個加熱棒G41所組成,各加熱棒G41呈相隔間距平行並水平設置於固定架G3上方;一定位盤G5,設於該固定架G3上,其四角落並各由固定架G3的四架腳G32所支撐,該加熱元件G4則位於定位盤G5與固定架G3間,且貼靠於定位盤G5下表面,可對定位盤G5進行加熱;定位盤G5上表面設有環形的複數環相隔間距的同心凹溝G51,以及互呈九十度交叉設置的直線凹溝G52,在凹溝G51與凹溝G52交叉處的凹溝中設有氣孔G53(請配合參閱圖6),該氣孔G53中通有負壓可對定位盤G5上承載物進行吸附。 Please refer to FIG. 5. The carrier G includes a fixed base G1 provided on the rail base E, and can be moved in the Y-axis direction by the drive of the rail base driver E1 on the rail base E. A carrier G2, On the fixed base G1, it can be driven and rotated by a driving member (not shown) in the fixed base G1. The carrier G2 is in the shape of a circular disk and is provided with a convex protrusion on the periphery and is slightly higher than the carrier G2. A plurality of support frames G22 on the upper surface G21 (four in this embodiment), and an upper surface G21 of the carrier G2 There is a load measuring element G23 in the center, and the upper surface G21 of the carrier plate G2 is provided with two positioning members G24 at an angle of ninety degrees on the outer peripheral side of the load measuring element G23. A fixed frame G3 is provided on the carrier plate G2. Above the load measuring element G23 above and measured by the load measuring element G23, it rests on the load measuring element G23 with one surface G31, and each of the frame feet G32 protruding outwardly is extended at four corners. It is set on the support frame G22 of the carrier G2, and the fixed frame G3 can be rotated in conjunction with the carrier G2. The four feet G32 on the fixed frame G3 are arranged at a 90-degree bifurcation with each other, and there is a space between every two feet G32. The adjacent seat surface G31 side G311 forms a straight edge, the two legs G32 and the adjacent seat surface G31 side G311 form a recessed positioning interval G33, and the fixed frame G3 is seated against the load with the seat surface G31. When measuring the element G23, two adjacent positioning sections G33 are just positioned by two positioning members G24 arranged at a 90-degree angle on the outer peripheral side of the load measuring element G23. A heating element G4 is composed of a plurality of heating rods. It is composed of G41. Each heating rod G41 is parallel to each other and is horizontally arranged above the fixed frame G3; a positioning plate G5 The heating element G4 is located on the fixing frame G3, and its four corners are each supported by the four legs G32 of the fixing frame G3. The heating element G4 is located between the positioning plate G5 and the fixing frame G3, and abuts on the lower surface of the positioning plate G5. The positioning disc G5 can be heated; the upper surface of the positioning disc G5 is provided with a plurality of annular concentric grooves G51 spaced apart from each other, and a linear groove G52 arranged at a ninety degree cross with each other, and the groove G51 intersects the groove G52 An air hole G53 (refer to FIG. 6) is provided in the groove at the place, and a negative pressure is passed through the air hole G53 to adsorb the load on the positioning plate G5.
請參閱圖2、7、8,該擦拭機構H設有:一壓抵座架H1,設有長方形之一呈Z軸向立置的固定座H11,其固設於第二工作區A5的該龍門軌架B之橫樑B2一側的X軸向滑軌B5的滑座B6上,並可受第二驅動件B7驅動而在滑軌B5上作X軸向滑移;該固定座H11背側下方固設有一線雷射測高器H2,其與固定座H11連動並可向下投射線性雷射光束H21;該固定座H11前側設有壓抵模組H3,其由一第一壓抵組件H31 及第二壓抵組件H32所構成,其中,該第一壓抵組件H31設有熱源;壓抵模組H3受壓抵座架H1之固定座H11上方一驅動件H12驅動而可作上下位移;一拭材組件H4,設有一略呈ㄇ形的固定架H41,並於固定架H41下方設有一下方開口狀的鏤空第一區間H411,固定架H41上方同時也是鏤空第一區間H411上方設有一中空的鏤空第二區間H412,第一區間H411與第二區間H412間設有一肋狀固定部H413,拭材組件H4以該固定架H41之固定部H413與該壓抵座架H1固設並受其連動。 Please refer to FIGS. 2, 7 and 8. The wiping mechanism H is provided with a pressing seat H1 and a fixing seat H11 which is one of the rectangles and stands in the Z-axis direction. The fixing seat H11 is fixed in the second working area A5. The gantry rail B is on the slide seat B6 of the X-axis slide rail B5 on the side of the beam B2 of the gantry rail B, and can be driven by the second driver B7 to perform X-axis slide on the slide rail B5; the back of the fixed seat H11 A linear laser altimeter H2 is fixed underneath, which is linked with the fixed base H11 and can project a linear laser beam H21 downwards; the fixed base H11 is provided with a pressing module H3 on the front side, and a first pressing module H31 And a second pressing component H32, wherein the first pressing component H31 is provided with a heat source; the pressing module H3 is driven by a driving member H12 above the fixed seat H11 of the seat frame H1 and can move up and down; A wipe material assembly H4 is provided with a slightly ㄇ -shaped fixing frame H41, and below the fixing frame H41 is provided a hollow first section H411 which is open at the bottom. Above the fixing frame H41 is also provided above the hollow first section H411. The hollow hollow second section H412, a rib-shaped fixing portion H413 is provided between the first section H411 and the second section H412, and the wipe material assembly H4 is fixed and received by the fixing portion H413 of the fixing frame H41 and the pressing seat H1. Its linkage.
請參閱圖7、9,該壓抵座架H1於固定座H11前側設有一Z軸向第一軌座H13,該軌座H13上設有Z軸向滑軌(圖中未示),並於滑軌上設有一滑座H131,一連動座H14設於該滑座H131上並受驅動件H12所驅動可作Z軸向滑移,該連動座H14供該拭材組件H4之固定架H41的固定部H413固設其上,使該拭材組件H4被驅動件H12所驅動可作Z軸向滑移及與壓抵座架H1連動;該連動座H14下方的滑座H131上設有一X軸向之第二軌座H15,該第二軌座H15可在第一軌座H13上作Z軸向上下位移,第二軌座H15上設有X軸向的滑軌H151,其上設有可在滑軌H151上作X軸向位移的滑座H152;滑軌H151下方相隔間距平行設有X軸向軌桿H153,軌桿H152上設有可在軌桿H153上作X軸向滑移的驅動件H154,該第二軌座H15上、下側各在X軸向相隔間距設有Z軸向彈性作用力之彈簧構成的彈性元件H155,該彈性元件H155使整個第二軌座H15在Z軸向上、下位移時具有彈性之緩衝;該壓抵模組H3以一座架H33底部座設於該驅動件H154上受其驅動可作X軸向位移,座架H33背側並同時貼靠固設於該滑座H152以獲得被驅動時的穩固滑移,故壓抵模組H3將藉第二軌座H15上、下側的彈性元件H155在Z軸向上、下位移時具有彈性之緩衝。 Please refer to FIGS. 7 and 9. The pressing seat H1 is provided with a first Z-axis first rail seat H13 on the front side of the fixed seat H11, and a Z-axis slide rail (not shown) is provided on the rail seat H13. A slide seat H131 is provided on the slide rail. A linkage seat H14 is provided on the slide seat H131 and driven by a driving member H12 to perform Z-axis sliding. The linkage seat H14 is used for the fixing frame H41 of the wiping material assembly H4. The fixing part H413 is fixed on it, so that the wiping material assembly H4 can be driven by the driving member H12 to perform Z-axis sliding and interlock with the pressing seat H1; the sliding seat H131 under the interlocking seat H14 is provided with an X axis To the second rail seat H15, the second rail seat H15 can be moved up and down in the Z axis on the first rail seat H13, and the second rail seat H15 is provided with an X-axis slide rail H151 on which A sliding seat H152 for X-axis displacement is provided on the sliding rail H151; X-axis rails H153 are arranged parallel to each other at a distance below the sliding rail H151, and rails H152 are provided with X-axis sliding on the rail H153. The driving member H154, the upper and lower sides of the second rail seat H15 are provided with elastic elements H155 composed of springs with Z axial elastic force at intervals in the X axis, and the elastic elements H155 make the entire second rail seat H15 at Z Axially It has elastic buffering during downward displacement; the pressing module H3 is seated on the driving member H154 at the bottom of a frame H33 and can be driven by the X axis for displacement. The back side of the seat frame H33 is fixed against the same. The sliding seat H152 obtains a stable slip when being driven, so the pressing module H3 will use the elastic elements H155 on the upper and lower sides of the second rail seat H15 to elastically cushion the Z axis when it is displaced upward and downward.
請參閱圖10,該壓抵模組H3以座架H33供第一壓抵組件H31及第二壓抵組件H32分別各以Z軸向且平行地相併設置;其中,該第一壓抵組件H31包括:一驅動件H311,以一固定座H3111固設於該座架H33上並受座架H33連動,該驅動件H311驅動其下方一連結座H3112可作Z軸向上、下位移,連結座H3112一側固設一與其連動的側座H3113;一調整組件H312,其上端以一第一調整座H3121上表面與該驅動件H311的連結座H3112底部固設,並以第一調整座H3121的側面與側座H3113下端前側固定;一聯結座H313,其上端與該調整組件H312下端的一第二調整座H3122固設,聯結座H313中設有一加熱孔H3131,聯結座H313一側設有溫度開關H3135,可在偵測溫度高於一預定值時停止加熱;聯結座H313前側兩斜角面處各分別設有與加熱孔H3131相通之測溫孔H3132;聯結座H313下端凸設有一裝卸部H3133,其上設有裝卸孔H3134;一加熱件H314,為一長條棒狀體並穿置於該聯結座H313的加熱孔H3131中,其受溫度開關H3135所監控;一壓抵座H315,設於調整組件H312下方,並受連結座H3112連動可作Z軸向上、下位移,其設有一呈U型的裝卸頭H3151及位於裝卸部H3151下端的移擦頭H3152,該裝卸頭H3151可嵌套定位於該聯結座H313下端的裝卸部H3133,並以一推把H3153所連動的插銷狀聯接件H3154***該裝卸部H3133的裝卸孔H3134而聯結;移擦頭H3152為一方型體狀,其下端具有一方形平面狀的移擦部H3155;加熱件H314底端與該移擦頭H3152接觸並將熱源傳導至移擦頭H3152的移擦部H3155;推把H3153一側設有一磁吸件 H3156,可在聯接件H3154***該裝卸部H3133的裝卸孔H3134時與聯結座H313吸附,使推把H3153不易滑脫;該加熱件H314係加熱該聯結座H313而將熱溫傳導至壓抵座H315的移擦頭H3152之移擦部H3155,該裝卸頭H3151及移擦頭H3152為銅質材料製成;該調整組件H312用以微調及連動壓抵座H315下方移擦頭H3152的移擦部H3155在X軸向、Y軸向的兩側水平高度,以符合並對應下方所擦拭的表面;該第二壓抵組件H32構造與第一壓抵組件H31相同,僅未設加熱件H314及溫度開關H3135,茲不贅述其它構件。 Please refer to FIG. 10, the pressing module H3 is provided with a seat frame H33 for the first pressing module H31 and the second pressing module H32, respectively, to be arranged in parallel with each other in the Z-axis direction. Among them, the first pressing module H31 includes: a driving member H311, which is fixed on the seat frame H33 by a fixed seat H3111 and is linked by the seat frame H33. The driving member H311 drives a coupling seat H3112 below which can move up and down in the Z axis, and connects the seat A side seat H3113 linked to H3112 is fixed on one side; an adjusting assembly H312 is fixed at the upper end with a bottom of the first seat H3112 of the first adjusting seat H3121 and the driving member H311, and the first adjusting seat H3121 The side is fixed to the front side of the lower end of the side seat H3113; a coupling seat H313 is fixed at the upper end to a second adjustment seat H3122 at the lower end of the adjustment assembly H312. A heating hole H3131 is provided in the connection seat H313, and a temperature is provided on one side of the connection seat H313. The switch H3135 can stop heating when the detected temperature is higher than a predetermined value; the two oblique angles on the front side of the coupling base H313 are respectively provided with a temperature measuring hole H3132 communicating with the heating hole H3131; the lower end of the coupling base H313 is provided with a loading and unloading part H3133, with mounting holes H3134; one plus The hot piece H314 is a long rod-shaped body and is inserted into the heating hole H3131 of the coupling seat H313, which is monitored by the temperature switch H3135; a pressing seat H315 is arranged below the adjustment component H312 and is connected by the connecting seat H3112 can be moved up and down in the Z axis through linkage. It has a U-shaped loading and unloading head H3151 and a wiper head H3152 located at the lower end of the loading and unloading part H3151. H3133, and push the pin-shaped coupling H3154 linked to H3153 into the mounting hole H3134 of the loading and unloading unit H3133 by a push; the wiper head H3152 is a square body, and the lower end has a square flat wiper H3155 ; The bottom end of the heating element H314 is in contact with the wiper head H3152 and conducts heat to the wiper portion H3155 of the wiper head H3152; a pusher H3153 is provided with a magnetic member H3156, which can be attracted to the coupling seat H313 when the coupling member H3154 is inserted into the mounting hole H3134 of the loading and unloading section H3133, so that the pusher H3153 is not easy to slip off; the heating member H314 is heating the coupling seat H313 to conduct heat to the pressure seat H315 wiper head H3155 wiper head H3152, the loading and unloading head H3151 and wiper head H3152 are made of copper material; the adjustment component H312 is used to fine-tune and link the wiper head H3152 wiper head under the seat H315 The horizontal height of H3155 on both sides of the X-axis and Y-axis to match and correspond to the surface wiped below; the structure of the second pressing component H32 is the same as the first pressing component H31, except that the heating element H314 and temperature are not provided. Switch H3135 will not repeat the other components.
請參閱圖11,該調整組件H312的第一調整座H3121與第二調整座H3122間設有一第三調整座H3123;其中,該位於上方的第一調整座H3121與位於下方的第三調整座H3123形成一組X軸向水平調整組件,其間的X軸向兩側各以片狀固定件H3124固設;該位於上方的第三調整座H3123與位於下方的第二調整座H3122形成一組Y軸向水平調整組件,其間的Y軸向兩側各以片狀固定件H3125固設;以該位於上方的第一調整座H3121與位於下方的第三調整座H3123形成一組X軸向水平調整組件為例,該位於上方的第一調整座H3121與位於下方的第三調整座H3123間以一組螺接件H316螺設,該組螺接件H316包括:位於上方的第一調整座H3121的X軸向偏設一側用以由上而下螺設位於上方的第一調整座H3121與位於下方的第三調整座H3123間的一微調螺接件H3161、自兩側固定件H3124外用以分別各將二側固定件H3124上端與位於上方的第一調整座H3121固定的四固定螺接件H3182、自一側固定件H3124 外用以將固定件H3124下端與位於下方的第三調整座H3123固定的四可調螺接件H3163;其中,該可調螺接件H3163螺經的固定件H3124下端穿孔H3164孔徑較可調螺接件H3163的螺紋部外徑略大,使其間留有可移位之餘裕,但該位於一側的該組二可調螺接件H3163採與位於下方的第三調整座H3123常態性螺固,另一組與微調螺接件H3161同側的二可調螺接件H3163採與位於下方的第三調整座H3123可依須要隨機作鬆放或螺固;在與微調螺接件H3161同側的固定件H3124外,設有插經固定件H3124下端與位於下方的第三調整座H3123的二銷件H3171;在與微調螺接件H3161同側的位於上方的第一調整座H3121與位於下方的第三調整座H3123間,設有在Y軸向相隔間距的彈簧構成的二彈性元件H3172;該二銷件H3171插設狀態為一常態下的標準定位,一旦出現須調整傾斜狀態時,由於二固定件H3124在X軸向兩側相隔設置,因此可先拔出該二銷件H3171,並鬆放與微調螺接件H3161同側該二可調螺接件H3163,由於穿孔H3164孔徑與可調螺接件H3163的螺紋部外徑間留有可移位之餘裕,故與微調螺接件H3161同側的二彈性元件H3172將在位於上方的第一調整座H3121固定下,遂行一撐張推抵位於下方的第三調整座H3123該與微調螺接件H3161同側下移的驅力,經由微調該微調螺接件H3161,使該彈性元件H3172撐張推抵的驅力將位於下方的第三調整座H3123與微調螺接件H3161同側的該側向下推抵,以獲得位於下方的第三調整座H3123X軸向兩側水平高度的調整,調整定位後再將與微調螺接件H3161同側的該二可調螺接件H3163螺緊鎖固;該位於上方的第三調整座H3123與位於下方的第二調整座H3122所組成的該組Y軸向水平調整組件其間的Y軸向兩側水平高度的調整與前述X軸 向兩側水平高度的調整方法同理,其構件亦相同,惟設置方位以Y軸向對稱設置,此由圖11中可以理解,茲不贅述。 Please refer to FIG. 11, a third adjustment base H3123 is provided between the first adjustment base H3121 and the second adjustment base H3122 of the adjustment assembly H312; wherein, the first adjustment base H3121 located above and the third adjustment base H3123 located below A set of X-axis horizontal adjustment components is formed, and both sides of the X-axis are fixed with sheet-shaped fixing members H3124; the third adjustment seat H3123 located above and the second adjustment seat H3122 located below form a group of Y-axis The horizontal adjustment assembly is fixed with sheet-shaped fixing members H3125 on both sides in the Y-axis direction; the first adjustment seat H3121 located above and the third adjustment seat H3123 located below form a set of X-axis horizontal adjustment assemblies As an example, a set of screw connections H316 are screwed between the first adjustment base H3121 located above and the third adjustment base H3123 located below. The set of screw connections H316 includes: X of the first adjustment base H3121 located above One side of the axial offset is used to set a fine adjustment screw H3161 between the first adjusting seat H3121 located above and the third adjusting seat H3123 located below from the top, and the fixing parts H3124 from the two sides are used for each. Connect the upper end of the two side fixings H3124 with The four fixing screws H3182 fixed by the first adjusting seat H3121 above are fixed from one side H3124 Four adjustable screw joints H3163 for fixing the lower end of the fixing member H3124 to the third adjusting seat H3123 located below; the lower end of the fixing member H3124 through which the adjustable screw joint H3163 is screwed has a hole diameter H3164 that is more adjustable than the adjustable screw joint The outer diameter of the threaded part of H3163 is slightly larger, so that there is room for displacement. However, the set of two adjustable screw joints H3163 located on one side is normally screwed with the third adjustment seat H3123 located below. Another group of two adjustable screw joints H3163 on the same side as the fine adjustment screw H3161 is adopted with the third adjustment seat H3123 located below, which can be loosened or screwed randomly according to the need; on the same side as the fine adjustment screw H3161 Outside the fixing piece H3124, there are two pin pieces H3171 inserted through the lower end of the fixing piece H3124 and the third adjustment seat H3123 located below; on the same side as the fine adjustment screw H3161, the first adjustment seat H3121 located above and the lower adjustment seat Between the third adjusting seat H3123, two elastic elements H3172 composed of springs spaced apart from each other in the Y-axis direction are provided; the two-pin H3171 is inserted in a standard positioning state in a normal state. The fixing parts H3124 are spaced apart on both sides of the X axis. Therefore, you can first pull out the two pin H3171, and loosen the two adjustable screw H3163 on the same side as the fine adjustment screw H3161. Due to the hole H3164 and the outer diameter of the threaded part of the adjustable screw H3163, There is room for displacement, so the two elastic elements H3172 on the same side as the fine adjustment screw H3161 will be fixed on the first adjustment seat H3121 located above, and then a stretch will be pushed against the third adjustment seat H3123 located below. The driving force for moving the same side of the fine-adjusting screw H3161 downwards. By fine-tuning the fine-adjusting screw H3161, the driving force for the elastic element H3172 to stretch and push will push the third adjusting seat H3123 located below the same as the fine-adjusting screw H3161. This side of the side is pushed down to obtain the adjustment of the horizontal height of the third adjustment seat H3123X on both sides of the axis. After adjusting the positioning, the two adjustable screws H3163 on the same side as the fine adjustment screw H3161 are adjusted. Tighten and lock; the set of Y-axis horizontal adjustment components consisting of the third adjustment seat H3123 located above and the second adjustment seat H3122 located below the adjustment of the horizontal height on both sides of the Y-axis and the aforementioned X-axis The method of adjusting the horizontal height to both sides is the same, and the components are the same, but the setting orientation is set symmetrically in the Y axis, which can be understood from FIG. 11 and will not be described in detail.
請參閱圖8、12,該拭材組件H4的ㄇ形固定架H41下方開口狀的凹設鏤空之第一區間H411一側設有一釋材區H414,鏤空之第一區間H411另一側設有一捲收區H415,該與釋材區H414同側的下方設有一沾液區H416,與捲收區H412同側的下方設有一拉引區H417,在沾液區H416與拉引區H417間形成一擦拭區H418;一溫度感測器H419以一延伸桿H4191上端之一固定座H4192固設於一滑座H4193上,該滑座H4193設於固定架H41上方中空的鏤空第二區間H412底緣的X軸向滑軌H4194上,該溫度感測器H419可嵌設於聯結座H313(請配合參閱圖7、10)前側兩斜角面處與加熱孔H3131相通之測溫孔H3132中偵測加熱件H314溫度並隨第一壓抵組件H31同步作X軸向位移;其中,該釋材區H414設有輪軸呈Y軸向設置並受固定架H41背側一驅動件H4141驅動之捲繞拭材的捲輪H4142,捲輪H4142下方設有X軸向相隔間距輪軸呈Y軸向設置之第一轉向輪H4143、第二轉向輪H4144,第一轉向輪H4143、第二轉向輪H4144間的下方設有一輪軸呈Y軸向設置之配重輪H4145,配重輪H4145位於釋材區H414中固定架H41上的一Z軸向長槽孔H4146處,該配重輪H4145之輪軸伸經該長槽孔H4146而於固定架H41背側與一配重H4147連動,該配重H4147設於一長槽孔H4146側並與長槽孔H4146平行之Z軸向滑軌H4148上,而可連動該配重輪H4145作Z軸向上下位移,其上下位移之行程間距受一組分置上、下位置之感測件H4149所監測及控制;該捲收區H415設有輪軸呈Y軸向設置並受固定架H41背側一驅動件H4151驅動之捲繞拭材的空捲輪H4152,捲輪H4152下方設有X軸向相隔間 距輪軸呈Y軸向設置之第三轉向輪H4153、第四轉向輪H4154,第三轉向輪H4153、第四轉向輪H4154間的下方設有一輪軸呈Y軸向設置之配重輪H4155,配重輪H4155位於捲收區H415中固定架H41上的一Z軸向長槽孔H4156處,該配重輪H4155之輪軸伸經該長槽孔H4156而於固定架H41背側與一配重H4157連動,該配重H4157設於一長槽孔H4156側並與長槽孔H4156平行之Z軸向滑軌H4158上,而可連動該配重輪H4155作Z軸向上下位移,其上下位移之行程間距受一組分置上、下位置之感測件H4159所監測及控制;該沾液區H416設有一清潔液容器H4161,其置設於固定架H41下端固設的置架H42上,並與圖1中供液機構F間設有管路(圖中未示)聯結,可自該供液機構F獲得清潔液的供給;清潔液容器H4161中設有一滾輪H4162,該滾輪H4162的輪軸呈Y軸向設於清潔液容器H4161,滾輪H4162的圓周一部份沾浸於清潔液容器H4161中,一部份顯露於清潔液容器H4161外,其圓周表面並呈等間距環列佈設成Y軸向嵌溝狀;沾液區H416中設有一輪軸呈Y軸向設置之近轉輪H4163,其近靠該清潔液容器H4161,並於近轉輪H4163與清潔液容器H4161的滾輪H4162間上方,設有一由二個為一組並相隔間距設於一擺架H4164的第一活動輪H4165、第二活動輪H4166,該第一活動輪H4165、第二活動輪H4166位於沾液區H416中固定架H41上的一Z軸向長槽孔H4167處,設於擺架H4164後側之軸桿H4168伸經該長槽孔H4167而於固定架H41背側受一旋轉驅動件H4169驅動,使擺架H4164可作旋擺而令第一活動輪H4165可下移抵靠該清潔液容器H4161上滾輪H4162上周緣;該拉引區H417設有一受固定架H41背側一驅動件H4171驅動,且其輪軸呈Y軸向設置之可旋轉拉引輪H4172,該拉引輪H4172之圓周表面呈等間距環列佈設成Y軸向嵌溝狀;拉引輪H4172鄰側設有一輪軸呈Y軸向設置之 嵌抵輪H4173,其圓周表面同樣呈等間距環列佈設成Y軸向嵌溝狀,嵌抵輪H4173設於一以樞軸H4174為支點樞設於固定架H41的擺臂H4175上,擺臂H4174上的嵌抵輪H4173鄰側另設有插樞於固定架H41的樞銷H4176,相對樞銷H4176的嵌抵輪H4173另一側擺臂H4174受固定架H41上一彈簧構成的彈性元件H4177(圖13)所拉引,在拔起插樞於固定架H41的樞銷H4176後,擺臂H4175將受彈性元件H4177拉引而嵌抵該拉引輪H4172圓周;該擦拭區H418設有由沾液區H416之固定架H41固設並斜向朝下延伸的第一導引臂H4181,以及由拉引區H417之固定架H41固設並斜向朝下延伸的第二導引臂H4182,第一導引臂H4181、第二導引臂H4182下端相靠近而保持一操作間距H4183,並各於末端設有輪軸呈Y軸向設置之第一支撐輪H4184、第二支撐輪H4185;第一支撐輪H4184、第二支撐輪H4185底緣共同維持一相同的X軸向水平高度;其中,第二導引臂H4182的上方鄰靠該拉引區H417之拉引輪H4172處設有一輪軸呈Y軸向設置之導引輪H4186。 Please refer to FIG. 8 and FIG. 12. A material releasing area H414 is provided on one side of the hollow recessed first section H411 under the H-shaped fixing frame H41 of the wiper assembly H4, and the other side of the hollow first section H411 is provided with a The winding area H415 is provided with a liquid-staining area H416 below the same side as the release area H414, and a pull-out area H417 is provided below the same side as the rolling-out area H412, formed between the liquid-sucking area H416 and the pull-out area H417 A wiping area H418; a temperature sensor H419 is fixed on a sliding seat H4193 by a fixing seat H4192 on the upper end of an extension rod H4191, which is arranged on the bottom edge of the hollow hollow second section H412 above the fixing frame H41 On the X-axis slide rail H4194, the temperature sensor H419 can be embedded in the coupling hole H313 (please refer to Figures 7 and 10) and detected in the temperature measuring hole H3132 communicating with the heating hole H3131 at the two oblique angles on the front side. The temperature of the heating element H314 is synchronized with the X-axis displacement with the first pressing component H31. Among them, the material release area H414 is provided with a winding shaft arranged in the Y-axis direction and driven by a driving member H4141 on the back side of the fixing frame H41. Material reel H4142, under the reel H4142, there is a first steering wheel with an X-axis spaced apart wheel axis arranged in the Y-axis direction H4143, the second steering wheel H4144, between the first steering wheel H4143, the second steering wheel H4144, a counterweight wheel H4145 with the axle axially arranged in the Y axis is located on the fixed frame H41 in the release area H414 A Z-axis long slot hole H4146, the axle of the counterweight wheel H4145 extends through the long slot hole H4146 and is linked to a counterweight H4147 on the back of the fixed frame H41. The counterweight H4147 is provided in a long slot hole H4146. On the Z-axis slide rail H4148 that is parallel to the long slot H4146 on the side, the weight wheel H4145 can be linked to move up and down in the Z axis. The travel distance of the up and down displacement is sensed by the upper and lower positions of a group. It is monitored and controlled by H4149; the winding area H415 is provided with an empty reel H4152 with a wheel shaft arranged in the Y-axis direction and driven by a drive member H4151 on the back side of the fixed frame H41. An X is provided below the reel H4152. Axial compartment The third steering wheel H4153 and the fourth steering wheel H4154 are arranged in the Y-axis direction from the axle. A counterweight wheel H4155 is arranged below the third steering wheel H4153 and the fourth steering wheel H4154 in the Y-axis direction. The wheel H4155 is located at a Z-axis long slot H4156 on the fixed frame H41 in the winding area H415. The wheel shaft of the weight wheel H4155 extends through the long slot H4156 and is linked with a counterweight H4157 on the back side of the fixed frame H41. The counterweight H4157 is located on a Z-axis slide rail H4158 on the side of a long slot H4156 and parallel to the long slot H4156, and the weight wheel H4155 can be linked up and down to move in the Z-axis direction. It is monitored and controlled by a component H4159 placed on the upper and lower positions of the component; a cleaning liquid container H4161 is set in the liquid-soaking zone H416, and it is placed on a holder H42 fixed at the lower end of the holder H41. A pipe (not shown) is connected between the liquid supply mechanisms F in 1 to obtain a supply of cleaning liquid from the liquid supply mechanism F. A roller H4162 is provided in the cleaning liquid container H4161, and the axis of the roller H4162 is the Y axis. Immerse the cleaning liquid container H4161 in the cleaning liquid container H4161 and a part of the circumference of the roller H4162. Is exposed outside the cleaning liquid container H4161, and the circumferential surface of the cleaning liquid container H4161 is arranged in a Y-axis embedded groove at an equal interval; a liquid-receiving area H416 is provided with a near-rotor H4163 in which the axle is arranged in the Y-axis direction, which is close to the The cleaning liquid container H4161 is located between the near runner H4163 and the roller H4162 of the cleaning liquid container H4161. There are a first movable wheel H4165 and a second movable wheel which are arranged in a group and spaced on a swing frame H4164. H4166, the first movable wheel H4165 and the second movable wheel H4166 are located in a Z-axis long slot H4167 on the fixed frame H41 in the liquid-soaking zone H416, and a shaft H4168 provided on the rear side of the swing frame H4164 extends through the length The slot H4167 is driven by a rotary drive member H4169 on the back side of the fixed frame H41, so that the swing frame H4164 can be swiveled and the first movable wheel H4165 can be moved down against the upper periphery of the upper roller H4162 of the cleaning liquid container H4161; The pull-out zone H417 is provided with a rotatable pull-out pulley H4172 driven by a drive member H4171 on the back side of the fixed frame H41, and its axis is arranged in the Y-axis direction. The circumferential surface of the pull-out pulley H4172 is arranged in the Y-axis at an equal interval. It is shaped like a groove; there is a wheel axle on the side of the pull pulley H4172, which is arranged in the Y-axis direction. The indentation wheel H4173 is also arranged on the circumferential surface in an equally spaced ring array in the shape of a Y-axis inset groove. The indentation wheel H4173 is provided on a swing arm H4175 pivoted on a fixed frame H41 with a pivot axis H4174 as a fulcrum. On the adjacent side of the indentation wheel H4173 on H4174, there is a pivot pin H4176 that is inserted in the fixing frame H41. The opposite side of the inset wheel H4173 of the pivot pin H4176 is an elastic element H4177 formed by a spring on the fixed frame H41. (Fig. 13) After pulling out the pivot pin H4176 which is inserted into the fixing frame H41, the swing arm H4175 will be pulled by the elastic element H4177 and engage the circumference of the pull wheel H4172; the wiping area H418 is provided with The first guide arm H4181 fixed by the fixing frame H41 of the liquid area H416 and extending obliquely downward, and the second guide arm H4182 fixed by the fixing frame H41 of the drawing area H417 and extending obliquely downward. A guide arm H4181 and a lower end of the second guide arm H4182 are close to each other to maintain an operating distance H4183. Each end is provided with a first support wheel H4184 and a second support wheel H4185 which are arranged in the Y axis direction at the end; the first support The bottom edge of the wheel H4184 and the second support wheel H4185 maintain the same X-axis horizontal height together; of which, the second guide A guide wheel H4186 is provided at the upper side of the arm H4182 adjacent to the pull pulley H4172 of the pull zone H417 in a Y-axis direction.
請參閱圖12、13,在進行殘膠的擦拭清潔上,使成捲的帶狀拭材L自該釋材區H414的捲輪H4142依序繞經第一轉向輪H4143、配重輪H4145、第二轉向輪H4144後;進入該沾液區H416並繞經近轉輪H4163、第一活動輪H4165、第二活動輪H4166、滾輪H4162後,再繞經該擦拭區H418之第一支撐輪H4184、第二支撐輪H4185、導引輪H4186,而進入該拉引區H417繞經拉引輪H4172後,進入該捲收區H415而繞經第三轉向輪H4153、配重輪H4155、第四轉向輪H4154,而被空的捲輪H4152所捲收;其中,拭材L在繞經第二活動輪H4166時,第二活動輪H4166可被驅動壓抵繞經該第二活動輪H4166處拭材L抵及清潔液容器H4161上已沾附清潔液的滾輪H4162以沾附清潔液;拭材L在繞經拉引輪H4172時受嵌抵輪H4173夾抵,使拉引輪H4172受驅動件H4171驅動時可以拉動繞經擦拭區H418中的拭材 L進行位移,當擦拭區H418中的拭材L被拉引至該釋材區H414中的配重輪H4145被迫上移至配重H4147觸及上方位置之感測件H4149後,將促使該驅動件H4141驅動捲輪H4142釋放拭材L,直到配重H4147觸及下方位置之感測件H4149為止;而在捲收區H415處一樣,當拭材L被拉引輪H4172拉引至使捲收區H415中拭材L鬆弛至該配重輪H4155連動之配重H4157觸及下方位置之感測件H4159時,驅動件H4151將驅動該空的捲輪H4152捲收拭材L直到配重H4157觸及上方位置之感測件H4159為止,藉此以調整拭材L在整個流路中被拉引的鬆緊適度;該壓抵模組H3可選擇性地以第一壓抵組件H31或第二壓抵組件H32進行操作,並分別各以壓抵座H315下端移擦頭H3152的移擦部H3155壓貼該繞跨於該擦拭區H418中第一支撐輪H4184、第二支撐輪H4185間的拭材L上方。 Please refer to FIGS. 12 and 13. In the wiping and cleaning of the residual glue, the rolled strip-shaped wipe material L is passed from the reel H4142 of the material release area H414 in sequence through the first steering wheel H4143, the counterweight wheel H4145, After the second steering wheel H4144, enter the wetted area H416 and pass by the near-wheel H4163, the first movable wheel H4165, the second movable wheel H4166, and the roller H4162, and then pass the first support wheel H4184 of the wiping zone H418. , The second support wheel H4185, the guide wheel H4186, and after entering the pull-in area H417 and passing the draw-in wheel H4172, enter the rewinding area H415 and pass the third steering wheel H4153, the counterweight wheel H4155, and the fourth steering wheel H4154, while being wound up by the empty reel H4152; wherein, when the swab L passes around the second movable wheel H4166, the second movable wheel H4166 can be driven to press against the swab L passing through the second movable wheel H4166 The cleaning liquid container H4161 has been wiped with the cleaning liquid roller H4162 to adhere to the cleaning liquid; the wipe material L is sandwiched by the embedded resistance wheel H4173 when passing around the pull pulley H4172, so that the pull pulley H4172 can be driven by the driving member H4171 Pull the swab around the wipe area H418 L is displaced. When the wiper L in the wiping area H418 is pulled to the counterweight wheel H4145 in the release area H414, it is forced to move up to the counterweight H4147 touching the upper sensing element H4149, which will cause the drive. H4141 drives the reel H4142 to release the swab L until the counterweight H4147 touches the sensor H4149 at the lower position. As in the rewinding area H415, when the swab L is pulled by the puller wheel H4172 to the rewinding area H415 The middle wiper L is relaxed until the counterweight H4157 linked to the counterweight wheel H4155 touches the sensor H4159 in the lower position, and the driver H4151 will drive the empty reel H4152 to wind up the wiper L until the counterweight H4157 touches the upper position. Up to the sensor H4159 to adjust the tightness of the swab L being drawn in the entire flow path; the pressing module H3 can be selectively performed by the first pressing module H31 or the second pressing module H32. Operate and press the wiper portions H3155 of the wiper head H3152 at the lower end of the seat H315 against the wiper material L between the first support wheel H4184 and the second support wheel H4185 in the wiping area H418.
本發明實施例進行晶圓殘膠清潔方法係執行以下步驟:一供料步驟,將待施作工件W載入該取放機構D中受二夾座D1上二嵌夾件D3以呈水平狀態夾持;該載入作業可由一機器人(圖中未示)自一供收料裝置(Load/Unload)(圖中未示)取出及執行;一取料步驟,使載台G由第二工作區A5以Y軸向直線位移流路穿經龍門軌架B位移於第一工作區A4中,並移入取放機構D中二夾座D1間的待施作工件W下方,並自取放機構D上的二嵌夾件D3承接待施作工件W;待施作工件W被載台G承接時,將於載盤G2上受到氣孔G53中所通負壓吸附而定位於載盤G2上,且受到加熱元件G4的加熱;一殘膠檢查步驟,使載台G沿Y軸向直線位移流路回移,並於第一工作區A4中於移出取放機構D時,使待施作工件W受龍門軌架B上檢測機構C逐一對其上各晶粒W4檢視其殘膠狀況; 一換區步驟,使完成殘膠狀況的待施作工件W被載台G沿原Y軸向直線位移流路穿經龍門軌架B位移回第二工作區A5;一晶粒擦拭步驟,使該擦拭機構H的壓抵座架H1連動拭材組件H4,以設有熱源的第一壓抵組件H31的移擦頭H3152之移擦部H3155壓貼該拭材L(請參閱圖14),並使拭材L受拉引輪H4172拉引輪H4172,而在移擦頭H3152之移擦部H3155底面與晶粒W4上表面間移擦,對被檢出有殘膠的個別晶粒W4進行擦拭,;由於該移擦頭H3152方型體狀下端方形平面狀的移擦部H3155面積與晶粒W4的表面積約略相當,故擦拭範圍可涵蓋整個晶粒;待施作工件W上各被檢出有殘膠的晶粒W4完成擦拭後,再以無熱源的第二壓抵組件H32的移擦頭H3152之移擦部H3155壓貼該拭材L對被檢出有殘膠的晶粒W4進行擦拭;在移擦頭H3152之移擦部H3155壓貼拭材L抵於施作工件W上晶粒W4時,移擦頭H3152下壓的施力受到載台G中荷重量測元件G23的量測,一旦達到設定的荷重值時,移擦頭H3152將停止下壓以避免損及晶粒W4;一清潔檢查步驟,使待施作工件W被載台G沿Y軸向直線位移流路往取放機構D方向位移,並於龍門軌架B下方的第二工作區A5受壓抵座架H1固定座H11背側下方的線雷射測高器H2所投射線性雷射光束H21對原被檢出有殘膠的晶粒W4進行檢查(請參閱圖15);當檢出尚有清潔未達預期程度的晶粒時,待施作工件W被載台G沿Y軸向直線位移流路重新執行前述晶粒W4擦拭步驟;當所有原被檢出有殘膠的晶粒W4被檢查已達合於預期程度時,被認定已清潔完成;一換件步驟,已清潔完成待施作工件W被載台G沿Y軸向直線位移流路經過龍門軌架B下方往第一工作區A4中取放機構D方向位移,並移入取放機構D中二夾座D1間,使取放機構D上的二嵌夾件D3承接待施作工件W以供 機器人取走卸離並轉存放入該供收料裝置,並執行下一循環之載入待施作工件W。 The method for cleaning wafer residues according to the embodiment of the present invention is to perform the following steps: a feeding step, loading a workpiece W to be applied into the pick-and-place mechanism D, and receiving two clamping pieces D3 on two clamping seats D1 in a horizontal state. Clamping; the loading operation can be taken out and executed by a robot (not shown) from a load / unload (not shown); a loading step makes the stage G work by the second The area A5 passes through the gantry rail B through the gantry rail B and is displaced in the first working area A4 by the Y-axis linear displacement flow path, and is moved under the workpiece W to be applied between the two clamping seats D1 in the pick-and-place mechanism D, and the pick-and-place mechanism The two insert clips D3 on D receive the application workpiece W; when the application workpiece W is received by the carrier G, it will be adsorbed on the carrier G2 by the negative pressure in the air hole G53 and positioned on the carrier G2. And is heated by the heating element G4; a residual glue inspection step causes the stage G to be linearly displaced along the Y axis, and the flow path is moved back, and when the pick-up mechanism D is removed in the first work area A4, the workpiece to be applied is W receives the inspection mechanism C on the gantry rail B to check the residual glue status of each die W4 one by one; A step of changing the area, so that the workpiece W to be applied, which has completed the state of residual glue, is linearly displaced along the original Y axis by the stage G, and the flow path passes through the gantry rail B to move back to the second working area A5; The pressing mechanism H1 of the wiping mechanism H interlocks the wiping material assembly H4, and the wiping material L (see FIG. 14) is pressed against the wiping material H3155 of the wiping head H3152 of the first pressing unit H31 provided with a heat source. The wiper material L is pulled by the puller wheel H4172 and the puller wheel H4172 is moved between the bottom surface of the wiper portion H3155 of the wiper head H3152 and the upper surface of the crystal grain W4 to wipe the individual crystal grains W4 with residual glue detected. ; Since the area of the wiper head H3152 with a square-shaped lower flat square-shaped wiper portion H3155 is approximately the same as the surface area of the crystal grain W4, the wiping range can cover the entire crystal grain; After the wiping of the residual resin grains W4 is completed, the second wiping head H3152 of the wiping head H3152 of the component H32 is pressed against the wiping material L to wipe the grain W4 with residual gums detected. ; When the wiper part H3155 of the wiper head H3152 presses the wiper material L against the grain W4 on the workpiece W, the pressing force of the wiper head H3152 is loaded. For the measurement of the G23 load measuring element G23, once the set load value is reached, the moving head H3152 will stop pressing to avoid damaging the crystal grain W4. A cleaning inspection step will make the workpiece to be applied W the stage G Displace along the Y-axis linear flow path toward the pick-and-place mechanism D, and press the second working area A5 below the gantry rail B against the line H1 of the line laser altimeter H2 below the back of the mount H1 holder H11. The linear laser beam H21 is projected to inspect the grains W4 originally detected with residual glue (see Figure 15); when the grains that have not been cleaned as expected are detected, the workpiece W is to be placed on the stage G re-execute the aforementioned grain W4 wiping step along the Y-axis linear displacement flow path; when all the grains W4 originally detected with residual glue have been inspected to meet the expected level, they are deemed to have been cleaned; a replacement Steps, the workpiece to be applied W has been cleaned, and the stage G is linearly displaced along the Y axis in the Y-axis. The flow path passes under the gantry rail B and is displaced in the direction of the pick-and-place mechanism D in the first work area A4, and moved into the pick-and-place mechanism D. Between the clamp bases D1, the two insert clamps D3 on the pick-and-place mechanism D receive the work pieces W for supply. The robot removes it, transfers it to the feeding and receiving device, and executes loading of the workpiece W to be processed in the next cycle.
本發明實施例擦拭機構及使用該擦拭機構之晶圓殘膠清潔裝置,由於擦拭機構H採晶粒W4逐一擦膠清潔方式進行,故可針對被檢出有殘膠的晶粒W4單獨清潔,除可達較佳清潔效果外,對於整片晶圓上殘膠的清潔可以有效率的執行;且在待施作工件W已被載台G上加熱元件G4加熱而使殘膠受溫熱執行一由下對整片待施作工件W第一次熱解程序的情況下,擦拭機構H由具有熱源的第一壓抵組件H31再執行一由上對下針對單獨晶粒W4的第二次熱解程序,被進行擦膠的該晶粒W4上殘膠已融成液態稀釋狀,再經無熱源的第二壓抵組件H32擦拭下,可以使殘膠清潔更容易進行,且配合線雷射測高器H2所投射線性雷射光束H21對擦膠效果進行檢查,可以更無遺漏的完成各晶粒清潔;而擦拭機構H的拭材組件H4藉由釋材區H414中捲輪H4142釋放拭材L到捲收區H415中空的捲輪H4152捲收拭材,其間使拭材L可以無間斷地自清潔液容器H4161上滾輪H4162沾附清潔液,並經配重輪配重輪H4145、H4155調整拭材L在整個流路中被拉引的鬆緊適度,使擦膠清潔的作業可以循環不間斷的自動化進行,使清潔效能大幅提高;同時壓抵模組H3藉第二軌座H15上、下側的彈性元件H155在Z軸向上、下位移時具有彈性之緩衝,使壓抵模組H3上的第一壓抵組件H31或第二壓抵組件H32壓抵拭材抵於晶粒表面時,除受載台G上荷重量測元件G23的量測而監控下壓力道外,下壓之壓力本身就具有緩衝,可以降低待施作工件W上晶粒W4受損。 The wiping mechanism and the wafer residue cleaning device using the wiping mechanism in the embodiment of the present invention, since the wiping mechanism H uses the crystal grains W4 to clean the wafers one by one, so the wafers W4 with residual gums can be cleaned separately. In addition to achieving a better cleaning effect, the cleaning of the residual glue on the entire wafer can be efficiently performed; and the workpiece W to be applied has been heated by the heating element G4 on the stage G, so that the residual glue is warmly performed In the case of the first pyrolysis process of the entire piece of workpiece W to be applied from the bottom, the wiping mechanism H is executed by the first pressing component H31 with a heat source, and the second is performed from the top to the bottom for the individual die W4. Pyrolysis process, the residual glue on the grain W4 that has been rubbed has been melted into a liquid dilution state, and then wiped by a second heat-resistant second pressing component H32, which can make the cleaning of the residual glue easier, and cooperate with the line mine The linear laser beam H21 projected by the altimeter H2 checks the effect of the eraser, which can complete the cleaning of each crystal without any omission; and the wiper assembly H4 of the wiping mechanism H is released by the reel H4142 in the release area H414. The wipe material L to the winding area H415, the hollow reel H4152, takes up the wipe material. Make the wipe material L be able to adhere to the cleaning liquid container H4161 with the cleaning liquid on the roller H4162 without interruption, and adjust the weight of the wipe material L in the entire flow path through the weight wheels H4145 and H4155. The cleaning operation of the glue can be carried out continuously and automatically, so that the cleaning efficiency is greatly improved; at the same time, the module H3 has an elastic buffer when the upper and lower elastic elements H155 of the second rail seat H15 are displaced in the Z axis. When the first pressing component H31 or the second pressing component H32 on the pressing module H3 is pressed against the surface of the die, it is monitored under the measurement of the load measuring element G23 on the stage G. Outside the pressure channel, the pressing force of the downward pressure itself has a buffer, which can reduce the damage of the crystal grains W4 on the workpiece W to be applied.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 However, the above are only the preferred embodiments of the present invention. When the scope of implementation of the present invention cannot be limited by this, that is, the simple equivalent changes and modifications made according to the scope of the patent application and the description of the invention, All are still within the scope of the invention patent.
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