TWI652234B - Substrate processing device - Google Patents
Substrate processing device Download PDFInfo
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- TWI652234B TWI652234B TW104122807A TW104122807A TWI652234B TW I652234 B TWI652234 B TW I652234B TW 104122807 A TW104122807 A TW 104122807A TW 104122807 A TW104122807 A TW 104122807A TW I652234 B TWI652234 B TW I652234B
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Abstract
本發明提供一種不易損傷脆性材料基板之基板加工裝置。 The present invention provides a substrate processing apparatus that does not easily damage a substrate of a brittle material.
本發明之基板加工裝置具備：搬送帶11，其搬送脆性材料基板300；及夾緊裝置40，其將載置於搬送帶11上之脆性材料基板300夾緊；且搬送帶11與夾緊裝置40連結。 The substrate processing apparatus of the present invention includes: a conveyance belt 11 that conveys the brittle material substrate 300; and a clamp device 40 that clamps the brittle material substrate 300 placed on the conveyance belt 11; and the conveyance belt 11 and the clamp device 40 links.
Description
本發明係關於一種加工脆性材料基板之基板加工裝置。 The present invention relates to a substrate processing apparatus for processing a substrate of a brittle material.
基板加工裝置係用於例如分斷由玻璃等形成之脆性材料基板。專利文獻1揭示有先前基板加工裝置之一例。該基板加工裝置具備：搬送帶，其搬送脆性材料基板；定位裝置及夾緊裝置，其等於脆性材料基板之搬送方向上配置於搬送帶之上游側；及刻劃裝置，其於脆性材料基板之搬送方向上配置於搬送帶之下游側。基板加工裝置進而具備：第1驅動裝置，其於脆性材料基板之搬送方向上移動搬送帶；及第2驅動裝置，其於脆性材料基板之搬送方向上移動夾緊裝置。 The substrate processing apparatus is used to, for example, break a brittle material substrate formed of glass or the like. Patent Document 1 discloses an example of a prior substrate processing apparatus. The substrate processing apparatus includes: a conveyance belt that conveys a brittle material substrate; a positioning device and a clamping device that is disposed on an upstream side of the conveyance belt in a conveyance direction of the brittle material substrate; and a scribing device that is on the brittle material substrate It is disposed on the downstream side of the conveyor belt in the transport direction. Further, the substrate processing apparatus further includes a first driving device that moves the conveying belt in a conveying direction of the brittle material substrate, and a second driving device that moves the clamping device in a conveying direction of the brittle material substrate.
根據上述基板加工裝置，首先利用定位裝置決定脆性材料基板之位置。接著，利用定位裝置將脆性材料基板搬送至搬送帶上。然後，利用夾緊裝置夾緊載置於搬送帶上之脆性材料基板。之後，利用第1驅動裝置驅動搬送帶，同時利用第2驅動裝置驅動夾緊裝置，藉此將脆性材料基板搬送至刻劃裝置。接著，利用刻劃裝置於脆性材料基板上形成劃線。然後，沿著劃線將該脆性材料基板分斷，藉此形成特定大小之面板。 According to the above substrate processing apparatus, first, the position of the brittle material substrate is determined by the positioning device. Next, the brittle material substrate is transferred to the conveyor belt by the positioning device. Then, the brittle material substrate placed on the conveyor belt is clamped by the clamp device. Thereafter, the conveyor belt is driven by the first drive device, and the clamp device is driven by the second drive device to transport the brittle material substrate to the scribing device. Next, a scribe line is formed on the brittle material substrate by the scribing device. The brittle material substrate is then separated along the scribe lines, thereby forming a panel of a particular size.
[專利文獻1]再公表專利WO2005/087458號公報 [Patent Document 1] Re-publication Patent WO2005/087458
根據上述基板加工裝置，當搬送脆性材料基板時，第1驅動裝置及第2驅動裝置係以搬送帶及夾緊裝置同步移動之方式進行動作。然而，搬送帶之移動速度與夾緊裝置之移動速度有可能並不一致。於此情形時，被夾緊裝置夾緊之脆性材料基板相對於搬送帶而移動，於脆性材料基板與搬送帶之間產生摩擦，有可能會損傷脆性材料基板。 According to the substrate processing apparatus described above, when the brittle material substrate is transferred, the first driving device and the second driving device operate in such a manner that the conveying belt and the clamping device move in synchronization. However, the moving speed of the conveyor belt may not coincide with the moving speed of the clamping device. In this case, the brittle material substrate clamped by the clamp device moves relative to the conveyor belt, and friction occurs between the brittle material substrate and the conveyor belt, which may damage the brittle material substrate.
本發明之目的在於提供一種不易損傷脆性材料基板之基板加工裝置。 It is an object of the present invention to provide a substrate processing apparatus that does not easily damage a brittle material substrate.
(1)本發明之一實施形態之基板加工裝置具備：搬送帶，其搬送脆性材料基板；及夾緊裝置，其將載置於上述搬送帶上之上述脆性材料基板夾緊；且上述搬送帶與上述夾緊裝置連結。 (1) A substrate processing apparatus according to an embodiment of the present invention includes: a conveyance belt that conveys a brittle material substrate; and a clamping device that clamps the brittle material substrate placed on the conveyance belt; and the conveyance belt Connected to the above clamping device.
根據本基板加工裝置，由於搬送帶與夾緊裝置連結，因此搬送帶之移動速度與夾緊裝置之移動速度實質上一致。因此，減小脆性材料基板與搬送帶之間產生摩擦之可能性，從而不易損傷脆性材料基板。 According to the substrate processing apparatus, since the conveyor belt is coupled to the clamp device, the moving speed of the conveyor belt substantially coincides with the moving speed of the clamp device. Therefore, the possibility of friction between the brittle material substrate and the conveyor belt is reduced, and the brittle material substrate is less likely to be damaged.
(2)根據上述基板加工裝置之一實施形態，其進而具備驅動裝置，上述驅動裝置藉由對上述搬送帶及上述夾緊裝置兩者傳達驅動力，使上述搬送帶及上述夾緊裝置於上述脆性材料基板之搬送方向上移動。 (2) The embodiment of the substrate processing apparatus according to the aspect of the invention, further comprising: a driving device, wherein the driving device transmits the driving force to both the conveying belt and the clamping device, and the conveying belt and the clamping device are The brittle material substrate moves in the transport direction.
根據本基板加工裝置，搬送帶及夾緊裝置藉由共通之驅動裝置而於搬送方向移動，因此搬送帶之移動速度與夾緊裝置之移動速度實質上一致。因此，抑制脆性材料基板與搬送帶之間產生摩擦之情形，不易損傷脆性材料基板。 According to the substrate processing apparatus, since the conveyance belt and the clamp are moved in the conveyance direction by the common drive means, the moving speed of the conveyance belt substantially coincides with the moving speed of the clamp. Therefore, it is suppressed that friction occurs between the brittle material substrate and the conveyor belt, and the brittle material substrate is not easily damaged.
(3)根據上述基板加工裝置之一實施形態，其進而具備前步驟裝置，上述前步驟裝置自上述搬送帶之上方向上述搬送帶上載置上述脆性材料基板，上述夾緊裝置具備：基板支持部，其相對於上述搬送帶之位置固定，自下方支持上述脆性材料基板；及機械臂，其相對於上 述基板支持部旋轉或移動，將上述脆性材料基板夾入機械臂與上述基板支持部之間。 (3) The apparatus according to any one of the above-mentioned substrate processing apparatuses, further comprising: a pre-step apparatus, wherein the brittle material substrate is placed on the transport belt from above the transport belt, and the clamp apparatus includes a substrate support unit And fixed to the position of the conveyor belt, supporting the brittle material substrate from below; and the mechanical arm, which is opposite to the upper The substrate supporting portion is rotated or moved to sandwich the brittle material substrate between the robot arm and the substrate supporting portion.
根據本基板加工裝置，利用前步驟裝置，將脆性材料基板自搬送帶之上方載置於搬送帶上。因此，構成夾緊裝置之基板支持部即便相對於搬送帶之位置預先被固定，於脆性材料基板在搬送帶上移動之過程中亦不會妨礙脆性材料基板之移動。進而，藉由採用基板支持部之位置被固定之構造，能夠省去先前基板加工裝置包含之夾緊裝置之升降機構。因此，夾緊裝置之構成被簡化。 According to the substrate processing apparatus, the brittle material substrate is placed on the conveyor belt from above the conveyor belt by the pre-step apparatus. Therefore, even if the substrate supporting portion constituting the clamp device is fixed in advance with respect to the position of the transport belt, the movement of the brittle material substrate is not hindered during the movement of the brittle material substrate on the transport belt. Further, by adopting a structure in which the position of the substrate supporting portion is fixed, the lifting mechanism of the clamping device included in the previous substrate processing apparatus can be omitted. Therefore, the constitution of the clamping device is simplified.
(4)根據上述基板加工裝置之一實施形態，於上述搬送帶上形成有孔或凹部，上述基板支持部配置於上述孔或上述凹部。 (4) According to an embodiment of the substrate processing apparatus, a hole or a recess is formed in the transfer belt, and the substrate support portion is disposed in the hole or the recess.
根據本基板加工裝置，與將基板支持部配置於搬送帶周圍之情形相比，基板加工裝置中基板支持部及搬送帶所佔據之區域變小。因此，基板加工裝置容易小型化。 According to the substrate processing apparatus, the area occupied by the substrate supporting portion and the conveying belt in the substrate processing apparatus is smaller than when the substrate supporting portion is disposed around the conveying belt. Therefore, the substrate processing apparatus is easily miniaturized.
(5)根據上述基板加工裝置之一實施形態，上述前步驟裝置決定上述脆性材料基板於上述搬送帶之寬度方向上之相對於上述搬送帶之位置。 (5) According to an embodiment of the substrate processing apparatus, the pre-step apparatus determines a position of the brittle material substrate relative to the conveyance belt in a width direction of the conveyance belt.
根據本基板加工裝置，將經過前步驟裝置定位後之脆性材料基板載置於搬送帶及基板支持部上。接著，藉由夾緊裝置之機械臂旋轉或移動，脆性材料基板被夾緊裝置夾緊。因此，夾緊裝置夾緊脆性材料基板時決定之脆性材料基板之位置不易偏移。 According to the substrate processing apparatus, the brittle material substrate positioned by the pre-step apparatus is placed on the conveyor belt and the substrate support portion. The brittle material substrate is then clamped by the clamping device by rotation or movement of the arm of the clamping device. Therefore, the position of the brittle material substrate determined when the clamping device clamps the brittle material substrate is not easily offset.
根據上述基板加工裝置之一實施形態，不易損傷脆性材料基板。 According to an embodiment of the substrate processing apparatus described above, the brittle material substrate is less likely to be damaged.
1‧‧‧基板加工裝置 1‧‧‧Substrate processing device
2‧‧‧框架 2‧‧‧Frame
10‧‧‧搬送裝置 10‧‧‧Transporting device
11‧‧‧搬送帶 11‧‧‧Transport belt
11A‧‧‧孔 11A‧‧‧ hole
12‧‧‧支持板 12‧‧‧Support board
13A‧‧‧滾筒 13A‧‧‧Roller
13B‧‧‧滾筒 13B‧‧‧Roller
20‧‧‧驅動裝置 20‧‧‧ drive
21‧‧‧一對軌道 21‧‧‧A pair of tracks
22‧‧‧一對導件 22‧‧‧A pair of guides
23‧‧‧2塊導件連結板 23‧‧‧2 guide link plates
24‧‧‧搬送帶連結部 24‧‧‧Transport belt connection
24A‧‧‧支柱 24A‧‧‧ pillar
24B‧‧‧支柱連結構件 24B‧‧‧Pole joint members
25‧‧‧馬達 25‧‧‧Motor
30‧‧‧纜線引導裝置 30‧‧‧ Cable guiding device
31‧‧‧搬送帶 31‧‧‧Transport belt
31A‧‧‧固定端 31A‧‧‧Fixed end
31B‧‧‧移動端 31B‧‧‧Mobile
40‧‧‧夾緊裝置 40‧‧‧Clamping device
50‧‧‧夾緊部 50‧‧‧Clamping Department
51‧‧‧基板支持部 51‧‧‧Substrate Support Department
51A‧‧‧支持面 51A‧‧‧Support surface
52‧‧‧機械臂安裝台 52‧‧‧Manipulator mounting table
53‧‧‧壁部 53‧‧‧ wall
53A‧‧‧孔 53A‧‧ hole
54‧‧‧機械臂配置部 54‧‧‧ Robot Arm Configuration Department
54A‧‧‧槽 54A‧‧‧ slot
55‧‧‧旋轉軸 55‧‧‧Rotary axis
56‧‧‧螺釘 56‧‧‧ screws
57‧‧‧機械臂 57‧‧‧ Robotic arm
58‧‧‧桿連結部 58‧‧‧ rod joint
58A‧‧‧連結軸 58A‧‧‧Connected shaft
60‧‧‧夾緊驅動裝置 60‧‧‧Clamping drive
61‧‧‧動力傳達構件 61‧‧‧Power transmission components
62‧‧‧規制構件 62‧‧‧Regular components
62A‧‧‧凹部 62A‧‧‧ recess
70‧‧‧往復移動式氣缸 70‧‧‧Reciprocating mobile cylinder
71‧‧‧管體 71‧‧‧ tube body
71A‧‧‧管 71A‧‧‧ tube
71B‧‧‧管 71B‧‧‧ tube
72‧‧‧活塞 72‧‧‧Piston
73‧‧‧活塞桿 73‧‧‧ piston rod
80‧‧‧機械臂連結桿 80‧‧‧Robot link rod
90‧‧‧刻劃裝置 90‧‧‧ scribing device
100‧‧‧前步驟裝置 100‧‧‧Pre-step device
200‧‧‧斷開裝置 200‧‧‧Disconnect device
300‧‧‧脆性材料基板 300‧‧‧Battery material substrate
圖1係實施形態之基板加工裝置之正面側之立體圖。 Fig. 1 is a perspective view showing a front side of a substrate processing apparatus according to an embodiment.
圖2係圖1之基板加工裝置之俯視圖。 2 is a plan view of the substrate processing apparatus of FIG. 1.
圖3係圖1之基板加工裝置之背面側之立體圖。 3 is a perspective view of the back side of the substrate processing apparatus of FIG. 1.
圖4係圖1之基板加工裝置之夾緊部之放大圖。 4 is an enlarged view of a clamping portion of the substrate processing apparatus of FIG. 1.
圖5係圖1之夾緊裝置之俯視圖。 Figure 5 is a plan view of the clamping device of Figure 1.
圖6係圖5之夾緊裝置之側視圖。 Figure 6 is a side elevational view of the clamping device of Figure 5.
圖7係圖6之夾緊裝置之機械臂打開之狀態之側視圖。 Figure 7 is a side elevational view showing the state in which the arm of the clamping device of Figure 6 is opened.
圖8係圖7之夾緊裝置之機械臂閉合之狀態之側視圖。 Figure 8 is a side elevational view showing the state in which the arm of the clamping device of Figure 7 is closed.
圖9係圖3之基板加工裝置正在搬送脆性材料基板之背面側之立體圖。 Fig. 9 is a perspective view showing the back surface side of the substrate for processing the brittle material in the substrate processing apparatus of Fig. 3;
參照圖1，對基板加工裝置1之構成進行說明。 The configuration of the substrate processing apparatus 1 will be described with reference to Fig. 1 .
基板加工裝置1具備：搬送裝置10，其搬送由玻璃等形成之脆性材料基板300；複數個夾緊裝置40，其等夾緊脆性材料基板300；及刻劃裝置90，其於由搬送裝置10搬送之脆性材料基板300上形成劃線。又，於較刻劃裝置90更靠脆性材料基板300之搬送方向下游側，配置有斷開裝置200，上述斷開裝置200沿著劃線將脆性材料基板300分割。進而，於基板加工裝置1之框架2之側方配置有前步驟裝置100，上述前步驟裝置100決定脆性材料基板300於搬送裝置10之搬送帶11之寬度方向上相對於搬送帶11之位置，並將脆性材料基板300自搬送帶11之上方載置於搬送帶11上。 The substrate processing apparatus 1 includes a transfer device 10 that transports a brittle material substrate 300 formed of glass or the like, a plurality of clamp devices 40 that clamp the brittle material substrate 300, and a scribing device 90 that is used by the transfer device 10 A scribe line is formed on the transported brittle material substrate 300. Further, the disconnecting device 200 is disposed on the downstream side of the sculpt device 90 in the transport direction of the brittle material substrate 300, and the disconnecting device 200 divides the brittle material substrate 300 along the scribe line. Further, a pre-step apparatus 100 is disposed on the side of the frame 2 of the substrate processing apparatus 1, and the pre-step apparatus 100 determines the position of the brittle material substrate 300 in the width direction of the conveyance belt 11 of the conveyance apparatus 10 with respect to the conveyance belt 11. The brittle material substrate 300 is placed on the conveyor belt 11 from above the conveyor belt 11.
參照圖2，對搬送裝置10之構成進行說明。 The configuration of the transport device 10 will be described with reference to Fig. 2 .
搬送裝置10具備：搬送帶11(參照圖1)，其供載置脆性材料基板300；複數個支持板12，其等安裝於基板加工裝置1之框架2上；及滾筒13A、13B，其等供捲繞搬送帶11。 The transport device 10 includes a transport belt 11 (see FIG. 1) on which a brittle material substrate 300 is placed, a plurality of support plates 12 attached to the frame 2 of the substrate processing apparatus 1, and rollers 13A and 13B. The winding conveyor belt 11 is provided.
搬送帶11形成有複數個孔11A(參照圖4)。複數個支持板12於搬送帶11(參照圖1)之寬度方向空開間隔而排列，且前端安裝有複數個滾筒13A。又，於框架2中較支持板12更靠脆性材料基板300之搬送方向之上游側，安裝有一個滾筒13B。 The conveyor belt 11 is formed with a plurality of holes 11A (see FIG. 4). A plurality of support plates 12 are arranged at intervals in the width direction of the conveyor belt 11 (see FIG. 1), and a plurality of rollers 13A are attached to the front end. Further, in the frame 2, one roller 13B is attached to the upstream side of the support plate 12 in the conveying direction of the brittle material substrate 300.
參照圖3及圖4，對驅動裝置20之構成進行說明。 The configuration of the drive unit 20 will be described with reference to Figs. 3 and 4 .
如圖3所示，驅動裝置20具備：一對軌道21，其等形成於框架2之側方；一對導件22，其等沿著軌道21移動；2塊導件連結板23，其等連結一對導件22；搬送帶連結部24，其連結導件連結板23與搬送帶11；及馬達25，其使一對導件22移動。 As shown in FIG. 3, the driving device 20 includes a pair of rails 21 which are formed on the side of the frame 2, a pair of guides 22 which are moved along the rail 21, two guide connecting plates 23, and the like. A pair of guides 22 are connected; a conveyor belt connecting portion 24 that connects the guide coupling plate 23 and the conveyor belt 11; and a motor 25 that moves the pair of guides 22.
一對軌道21為沿著脆性材料基板300之搬送方向延伸之形狀。一對導件22經由例如進給螺桿機構(省略圖示)而與馬達25之輸出軸連結。 The pair of rails 21 have a shape that extends in the conveying direction of the brittle material substrate 300. The pair of guides 22 are coupled to the output shaft of the motor 25 via, for example, a feed screw mechanism (not shown).
2塊導件連結板23配置成自一對導件22中之一導件22跨及另一導件22。 The two guide link plates 23 are configured to span from one of the pair of guides 22 and the other guide 22.
如圖3及圖4所示，搬送帶連結部24具備自導件連結板23之下表面朝下方延伸之支柱24A、及安裝於搬送帶11上表面之支柱連結構件24B。 As shown in FIGS. 3 and 4, the conveyor belt connecting portion 24 includes a pillar 24A extending downward from the lower surface of the conductor connecting plate 23, and a pillar connecting member 24B attached to the upper surface of the conveyor belt 11.
支柱連結構件24B係沿著脆性材料基板300之搬送方向延伸之長方體，相對於1個夾緊裝置40而於支持板12之短邊方向空開間隔地配置2個，且於上表面安裝有支柱24A。 The pillar connecting member 24B is a rectangular parallelepiped extending in the conveying direction of the brittle material substrate 300, and two of the clamp devices 40 are disposed at intervals in the short-side direction of the support plate 12, and the pillars are attached to the upper surface. 24A.
又，於一對軌道21之下方配置有纜線引導裝置30。纜線引導裝置30具備搬送帶31，上述搬送帶31收容有向馬達25之控制裝置(省略圖示)供給電力之纜線(省略圖示)。搬送帶31之一端部即固定端31A與電源(省略圖示)連接，另一端部即移動端31B經由導件連結板32而與軌道21連結。 Further, a cable guiding device 30 is disposed below the pair of rails 21. The cable guiding device 30 includes a conveying belt 31 that accommodates a cable (not shown) that supplies electric power to a control device (not shown) of the motor 25. The fixed end 31A, which is one end of the conveyor belt 31, is connected to a power source (not shown), and the other end, that is, the moving end 31B, is coupled to the rail 21 via the guide connecting plate 32.
參照圖3，對夾緊裝置40之構成進行說明。 The configuration of the clamp device 40 will be described with reference to Fig. 3 .
複數個夾緊裝置40在支持板12之短邊方向空開間隔而配置，具備夾緊脆性材料基板300(參照圖1)之端部之夾緊部50、及驅動夾緊部50之夾緊驅動裝置60。 A plurality of clamp devices 40 are disposed at intervals in the short-side direction of the support plate 12, and include a clamp portion 50 that clamps an end portion of the brittle material substrate 300 (see FIG. 1), and a clamping portion of the drive clamp portion 50. Drive unit 60.
夾緊部50配置於相鄰之支持板12之間。夾緊驅動裝置60配置於較 夾緊部50更靠脆性材料基板300(參照圖1)之搬送方向之上游側。 The clamping portion 50 is disposed between adjacent support plates 12. The clamping drive device 60 is configured in the comparison The clamp portion 50 is further on the upstream side in the conveyance direction of the brittle material substrate 300 (see FIG. 1).
參照圖4，對夾緊部50之構成進行說明。 The configuration of the clamp portion 50 will be described with reference to Fig. 4 .
夾緊部50具備：基板支持部51，其安裝於搬送帶11之下表面；機械臂安裝台52，其安裝於搬送帶11之上表面；機械臂57，其將脆性材料基板300(參照圖1)夾入該機械臂57與基板支持部51之間；及桿連結部58，其與夾緊驅動裝置60之機械臂連結桿80連結。 The clamp portion 50 includes a substrate support portion 51 attached to the lower surface of the conveyor belt 11, a robot arm mounting base 52 attached to the upper surface of the conveyor belt 11, and a robot arm 57 for the brittle material substrate 300 (refer to the figure). 1) sandwiching between the robot arm 57 and the substrate supporting portion 51; and a lever connecting portion 58 coupled to the arm connecting rod 80 of the clamp driving device 60.
基板支持部51之前端之支持面51A與搬送帶11之上表面之關係為同一平面。 The relationship between the support surface 51A at the front end of the substrate support portion 51 and the upper surface of the conveyance belt 11 is the same plane.
機械臂安裝台52具備：壁部53，其藉由複數個螺釘56而被固定於2個支柱連結構件24B之端部；及機械臂配置部54，其自壁部53向脆性材料基板300(參照圖1)之搬送方向之下游側突出，且安裝於搬送帶11之上表面。 The arm mounting base 52 includes a wall portion 53 that is fixed to an end portion of the two pillar connecting members 24B by a plurality of screws 56, and a robot arm arranging portion 54 that extends from the wall portion 53 toward the brittle material substrate 300 ( Referring to the downstream side of the conveyance direction of FIG. 1), it is attached to the upper surface of the conveyance belt 11.
壁部53係與機械臂配置部54一體地成形，形成有供機械臂連結桿80***之孔53A。 The wall portion 53 is integrally formed with the arm arrangement portion 54, and a hole 53A into which the arm connecting rod 80 is inserted is formed.
機械臂57係配置於機械臂配置部54之槽54A內。機械臂57安裝成能夠繞安裝於機械臂配置部54之旋轉軸55旋轉。又，機械臂57安裝成能夠繞安裝於桿連結部58之連結軸58A旋轉。 The robot arm 57 is disposed in the groove 54A of the arm arrangement portion 54. The robot arm 57 is mounted to be rotatable about a rotation shaft 55 attached to the arm arrangement portion 54. Further, the mechanical arm 57 is attached to be rotatable about a connecting shaft 58A attached to the rod connecting portion 58.
參照圖5及圖6，對夾緊驅動裝置60之構成進行說明。 The configuration of the clamp driving device 60 will be described with reference to Figs. 5 and 6 .
夾緊驅動裝置60具備：往復移動式氣缸70；機械臂連結桿80，其連結氣缸70與桿連結部58；動力傳達構件61，其將氣缸70之動力傳達至機械臂連結桿80；及規制構件62，其安裝於支柱連結構件24B。 The clamp driving device 60 includes a reciprocating cylinder 70, a robot arm connecting rod 80 that couples the cylinder 70 and the rod connecting portion 58, and a power transmitting member 61 that transmits the power of the cylinder 70 to the arm connecting rod 80; The member 62 is attached to the pillar connecting member 24B.
氣缸70具備管體71、配置於管體71內部之活塞72、及與活塞72連結之活塞桿73。 The cylinder 70 includes a pipe body 71, a piston 72 disposed inside the pipe body 71, and a piston rod 73 coupled to the piston 72.
於管體71中安裝有送入壓縮空氣之管71A及71B。活塞72經由管71A將壓縮空氣送入管體71之內部，另外自管71B排出空氣，藉此向前方移動。另一方面，活塞72經由管71B將壓縮空氣送入管體71內部， 另外經由管71A排出空氣，藉此向後方移動。 Tubes 71A and 71B for supplying compressed air are attached to the pipe body 71. The piston 72 sends compressed air into the inside of the pipe body 71 via the pipe 71A, and also discharges air from the pipe 71B, thereby moving forward. On the other hand, the piston 72 sends compressed air into the inside of the pipe body 71 via the pipe 71B. Further, air is discharged through the tube 71A, thereby moving rearward.
動力傳達構件61之上端可旋轉地連結於活塞桿73之端部，下端可旋轉地連結於機械臂連結桿80。又，動力傳達構件61中與機械臂連結桿80連結之部分藉由彈性構件(省略圖示)而朝前方被賦能。 The upper end of the power transmission member 61 is rotatably coupled to the end of the piston rod 73, and the lower end is rotatably coupled to the arm coupling rod 80. Further, a portion of the power transmission member 61 that is coupled to the arm connecting rod 80 is energized toward the front by an elastic member (not shown).
規制構件62決定動力傳達構件61向前方移動之極限位置。規制構件62被固定於支柱連結構件24B之上表面，且形成因活塞桿73自管體71突出而供動力傳達構件61接觸之凹部62A。 The regulation member 62 determines the extreme position at which the power transmission member 61 moves forward. The regulation member 62 is fixed to the upper surface of the pillar coupling member 24B, and a concave portion 62A that protrudes from the tubular body 71 by the piston rod 73 and contacts the power transmission member 61 is formed.
機械臂連結桿80配置於相鄰之支柱連結構件24B之間，一端部與動力傳達構件61連結，另一端部與桿連結部58連結。 The arm connecting rod 80 is disposed between the adjacent pillar connecting members 24B, and one end portion is coupled to the power transmitting member 61, and the other end portion is coupled to the rod connecting portion 58.
參照圖7~圖9，對基板加工裝置1之作用進行說明。 The operation of the substrate processing apparatus 1 will be described with reference to Figs. 7 to 9 .
如圖7所示，自管71A向管體71內部之空間送入壓縮空氣，另一方面，自管71B排出空氣，藉此活塞72向前方移動，活塞桿73自管體71突出。因此，與活塞桿73連結之動力傳達構件61向前方移動而與規制構件62之凹部62A接觸，動力傳達構件61中與活塞桿73連結之部分旋轉。然後，動力傳達構件61中與機械臂連結桿80連結之部分朝後方移動，藉此機械臂連結桿80及桿連結部58向後方移動。藉由機械臂連結桿80朝後方移動，機械臂57繞旋轉軸55旋轉，支持面51A之上方開放。然後，將已藉由前步驟裝置100(參照圖1)進行搬送帶11之寬度方向定位之脆性材料基板300自支持面51A之上方降下而載置於支持面51A。 As shown in Fig. 7, compressed air is supplied from the tube 71A to the space inside the tube 71, while air is discharged from the tube 71B, whereby the piston 72 moves forward, and the piston rod 73 protrudes from the tube 71. Therefore, the power transmission member 61 coupled to the piston rod 73 moves forward and comes into contact with the concave portion 62A of the regulation member 62, and the portion of the power transmission member 61 that is coupled to the piston rod 73 rotates. Then, the portion of the power transmission member 61 that is coupled to the arm connecting rod 80 moves rearward, whereby the arm connecting rod 80 and the rod connecting portion 58 move rearward. The robot arm 57 is moved rearward by the mechanical arm coupling rod 80, and the robot arm 57 is rotated about the rotation shaft 55, and the upper side of the support surface 51A is opened. Then, the brittle material substrate 300 positioned in the width direction of the conveyor belt 11 by the pre-step apparatus 100 (see FIG. 1) is lowered from above the support surface 51A and placed on the support surface 51A.
如圖8所示，自管71A排出空氣，另一方面自管71B向管體71之內部空間送入壓縮空氣，藉此活塞72朝後方移動。 As shown in Fig. 8, the air is discharged from the tube 71A, and on the other hand, compressed air is supplied from the tube 71B to the internal space of the tube 71, whereby the piston 72 moves rearward.
因此，活塞桿73進入管體71之內部，與活塞桿73連結之動力傳達構件61朝後方移動。因此，動力傳達構件61離開規制構件62之凹部62A。而藉由彈性構件(省略圖示)之賦能力，動力傳達構件61中與機械臂連結桿80連結之部分朝前方移動，機械臂連結桿80及桿連結部58朝前方移動。因此，機械臂57繞旋轉軸55旋轉，在機械臂57與基板支持 部51之支持面51A之間將脆性材料基板300夾入並夾緊。 Therefore, the piston rod 73 enters the inside of the pipe body 71, and the power transmission member 61 coupled to the piston rod 73 moves rearward. Therefore, the power transmission member 61 is separated from the recess 62A of the regulation member 62. By the ability of the elastic member (not shown), the portion of the power transmission member 61 that is coupled to the arm connecting rod 80 moves forward, and the arm connecting rod 80 and the rod connecting portion 58 move forward. Therefore, the robot arm 57 rotates about the rotation axis 55, and supports the robot arm 57 and the substrate. The brittle material substrate 300 is sandwiched and clamped between the support faces 51A of the portion 51.
如圖9所示，於夾緊裝置40夾緊脆性材料基板300之狀態下向馬達25供給電力，導件22利用進給螺桿機構(省略圖示)而沿著軌道21移動。 As shown in FIG. 9, electric power is supplied to the motor 25 in a state in which the clamp device 40 clamps the brittle material substrate 300, and the guide 22 moves along the rail 21 by a feed screw mechanism (not shown).
連結一對導件22之導件連結板23係經由搬送帶連結部24而與搬送帶11連結，從而將搬送帶11與夾緊裝置40連結。因此，隨著導件22沿著軌道21移動，搬送帶11及夾緊裝置40亦沿著脆性材料基板300之搬送方向移動，將脆性材料基板300搬送至刻劃裝置90。 The guide connecting plate 23 that connects the pair of guides 22 is coupled to the conveyor belt 11 via the conveyor belt connecting portion 24 to connect the conveyor belt 11 to the clamp device 40. Therefore, as the guide 22 moves along the rail 21, the conveyance belt 11 and the clamp device 40 also move in the conveyance direction of the brittle material substrate 300, and the brittle material substrate 300 is conveyed to the scribing device 90.
根據基板加工裝置1，獲得以下之效果。 According to the substrate processing apparatus 1, the following effects are obtained.
(1)由於搬送帶11與夾緊裝置40連結，因此搬送帶11之移動速度與夾緊裝置40之移動速度實質上一致。因此，減小脆性材料基板300與搬送帶11之間產生摩擦之可能性，不易損傷脆性材料基板300。 (1) Since the conveyor belt 11 is coupled to the clamp device 40, the moving speed of the conveyor belt 11 substantially coincides with the moving speed of the clamp device 40. Therefore, the possibility of friction between the brittle material substrate 300 and the conveyor belt 11 is reduced, and the brittle material substrate 300 is less likely to be damaged.
(2)由於搬送帶11及夾緊裝置40利用共通之驅動裝置20而沿著搬送方向移動，因此搬送帶11之移動速度與夾緊裝置40之移動速度實質上一致。因此，抑制脆性材料基板300與搬送帶11之間產生摩擦之情形，不易損傷脆性材料基板300。 (2) Since the conveyor belt 11 and the clamp device 40 are moved in the conveyance direction by the common drive device 20, the moving speed of the conveyor belt 11 substantially coincides with the moving speed of the clamp device 40. Therefore, the friction between the brittle material substrate 300 and the conveyor belt 11 is suppressed, and the brittle material substrate 300 is less likely to be damaged.
(3)利用前步驟裝置100將脆性材料基板300自搬送帶11上方載置於搬送帶11上。因此，構成夾緊裝置40之基板支持部51即便相對於搬送帶11之位置被預先固定，於脆性材料基板300在搬送帶11上移動之過程中亦不會妨礙脆性材料基板300之移動。進而，藉由採用基板支持部51之位置被固定之構造，能夠省略先前基板加工裝置包含之夾緊裝置之升降機構。因此，夾緊裝置40之構成被簡化。 (3) The brittle material substrate 300 is placed on the conveyor belt 11 from above the conveyor belt 11 by the pre-step apparatus 100. Therefore, even if the substrate support portion 51 constituting the clamp device 40 is fixed in advance with respect to the position of the conveyance belt 11, the movement of the brittle material substrate 300 is not hindered during the movement of the brittle material substrate 300 on the conveyance belt 11. Further, by adopting a structure in which the position of the substrate supporting portion 51 is fixed, the elevating mechanism of the clamping device included in the previous substrate processing apparatus can be omitted. Therefore, the constitution of the clamping device 40 is simplified.
(4)由於基板支持部51配置於搬送帶11之孔11A內，因此與基板支持部51配置於搬送帶11周圍之情形相比，基板加工裝置1中基板支持部51及搬送帶11所佔據之區域變小。因此，容易將基板加工裝置1小型化。 (4) Since the substrate supporting portion 51 is disposed in the hole 11A of the conveying belt 11, the substrate supporting portion 51 and the conveying belt 11 are occupied by the substrate processing apparatus 1 as compared with the case where the substrate supporting portion 51 is disposed around the conveying belt 11. The area is getting smaller. Therefore, it is easy to downsize the substrate processing apparatus 1.
(5)將利用前步驟裝置100定位後之脆性材料基板300載置於搬送帶11及基板支持部51上。接著，夾緊裝置40之機械臂57旋轉，藉此脆 性材料基板300被夾緊裝置40夾緊。因此，當夾緊裝置40夾緊脆性材料基板300時決定之脆性材料基板300之位置不易偏移。 (5) The brittle material substrate 300 positioned by the pre-step device 100 is placed on the conveyor belt 11 and the substrate supporting portion 51. Then, the mechanical arm 57 of the clamping device 40 rotates, thereby brittle The material substrate 300 is clamped by the clamping device 40. Therefore, the position of the brittle material substrate 300 determined when the clamping device 40 clamps the brittle material substrate 300 is not easily offset.
(6)由於基板支持部51配置於搬送帶11之孔11A內，因此機械臂57與支持面51A之間未介置搬送帶11。藉此，機械臂57與支持面51A能夠直接夾入脆性材料基板300，相較於機械臂57與支持面51A之間介置搬送帶11之情形，能夠更牢固地夾緊脆性材料基板300。 (6) Since the substrate supporting portion 51 is disposed in the hole 11A of the conveying belt 11, the conveying belt 11 is not interposed between the robot arm 57 and the support surface 51A. Thereby, the robot arm 57 and the support surface 51A can be directly inserted into the brittle material substrate 300, and the brittle material substrate 300 can be more firmly clamped than when the conveyor belt 11 is interposed between the robot arm 57 and the support surface 51A.
(7)由於基板支持部51配置於搬送帶11之孔11A內，因此相較於基板支持部51與搬送帶11之下表面空開間隔而配置之情形，抑制基板支持部51支持脆性材料基板300時，搬送帶11彎曲而脆性材料基板300之位置偏移之情形。 (7) Since the substrate supporting portion 51 is disposed in the hole 11A of the conveying belt 11, the substrate supporting portion 51 is prevented from supporting the brittle material substrate as compared with the case where the substrate supporting portion 51 and the lower surface of the conveying belt 11 are spaced apart from each other. At 300 o'clock, the conveyance belt 11 is bent and the position of the brittle material substrate 300 is shifted.
(8)由於夾緊部50配置於相鄰之支持板12之間，因此沿著脆性材料基板300之搬送方向移動時，不會與安裝於支持板12前端之複數個滾筒13A干涉。因此，搬送脆性材料基板300之過程中，夾緊部50夾緊之脆性材料基板300之位置不易偏移。 (8) Since the clamp portion 50 is disposed between the adjacent support plates 12, it does not interfere with the plurality of rollers 13A attached to the front end of the support plate 12 when moving in the transport direction of the brittle material substrate 300. Therefore, in the process of transporting the brittle material substrate 300, the position of the brittle material substrate 300 clamped by the clamp portion 50 is not easily displaced.
基板加工裝置能夠採用之具體形態並不限定於上述實施形態中例示之形態。基板加工裝置能夠採用與上述實施形態不同之各種形態。以下所示之上述實施形態之變化例係基板加工裝置能夠採用之各種形態之一例。 The specific form in which the substrate processing apparatus can be employed is not limited to the form exemplified in the above embodiment. The substrate processing apparatus can adopt various forms different from the above embodiment. The variation of the above embodiment shown below is an example of various forms that can be employed in the substrate processing apparatus.
‧根據上述實施形態之變化例，搬送帶11與夾緊裝置40並不直接連結。 According to a variation of the above embodiment, the conveyor belt 11 and the clamp device 40 are not directly coupled.
‧根據上述實施形態之變化例，夾緊裝置40之夾緊部50與搬送帶11經由中間構件而間接連結。 According to a variation of the above embodiment, the clamp portion 50 of the clamp device 40 and the conveyor belt 11 are indirectly connected via the intermediate member.
‧根據上述實施形態之變化例，夾緊裝置40之夾緊部50配置於較搬送帶11更靠脆性材料基板300之搬送方向之上游側。 According to the modification of the above embodiment, the clamp portion 50 of the clamp device 40 is disposed on the upstream side of the transport belt 11 in the transport direction of the brittle material substrate 300.
‧根據上述實施形態之變化例，搬送帶11上並不形成孔11A，且基板支持部51安裝於搬送帶11之下表面。 According to a variation of the above embodiment, the hole 11A is not formed in the conveyor belt 11, and the substrate support portion 51 is attached to the lower surface of the conveyor belt 11.
‧根據上述實施形態之變化例，搬送帶11上形成有凹部，於此凹部內配置基板支持部51。 According to a variation of the above embodiment, the conveyor belt 11 is formed with a recess, and the board support portion 51 is disposed in the recess.
‧根據上述實施形態之變化例，具備驅動機械臂57之開閉動作之馬達。 According to a variation of the above embodiment, a motor that drives the opening and closing operation of the arm 57 is provided.
‧根據上述實施形態之變化例，具備機械臂57，該機械臂57不與基板支持部51連結，而是相對於基板支持部51移動，藉此夾緊載置於基板支持部51之支持面51A上之脆性材料基板300。該變化例之機械臂57直接或間接連結搬送帶11。 According to a variation of the above embodiment, the robot arm 57 is provided, and the robot arm 57 is not coupled to the substrate supporting portion 51, but is moved relative to the substrate supporting portion 51, thereby clamping the supporting surface placed on the substrate supporting portion 51. The brittle material substrate 300 on 51A. The robot arm 57 of this modification directly or indirectly connects the conveyor belt 11.
‧根據上述實施形態之變化例，馬達25之輸出軸與滾筒13A及13B之至少一者之旋轉軸連結，馬達25使滾筒13A及13B旋轉，藉此使搬送帶11及夾緊裝置40沿著脆性材料基板300之搬送方向移動。 According to a variation of the above embodiment, the output shaft of the motor 25 is coupled to the rotation shaft of at least one of the rollers 13A and 13B, and the motor 25 rotates the rollers 13A and 13B, whereby the conveyor belt 11 and the clamp device 40 are moved along The conveyance direction of the brittle material substrate 300 moves.
Claims (7)
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| JP2014217602A JP6439378B2 (en) | 2014-10-24 | 2014-10-24 | Substrate processing equipment |
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| TWI652234B true TWI652234B (en) | 2019-03-01 |
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| JP (1) | JP6439378B2 (en) |
| KR (1) | KR102365097B1 (en) |
| CN (1) | CN105541093B (en) |
| TW (1) | TWI652234B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102304576B1 (en) * | 2019-08-27 | 2021-09-24 | 주식회사 탑 엔지니어링 | Dummy removing unit and scribe apparatus including the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858948A (en) * | 1981-09-30 | 1983-04-07 | Matsushita Electric Works Ltd | Carrying device for work |
| JPH0133222Y2 (en) * | 1984-11-14 | 1989-10-09 | ||
| JPS63185597A (en) * | 1987-01-23 | 1988-08-01 | 株式会社 タムラ製作所 | Water jet cutting device |
| JP2002510432A (en) * | 1997-03-05 | 2002-04-02 | バンティコ アクチエンゲゼルシャフト | Transfer equipment for thin substrates |
| JP4402883B2 (en) * | 2001-01-17 | 2010-01-20 | 三星ダイヤモンド工業株式会社 | Dividing device, dividing system and dividing method |
| JP3794555B2 (en) * | 2001-10-05 | 2006-07-05 | 北辰工業株式会社 | Feeding mechanism for sheet-like long objects in a cutting apparatus for elastic sheet-like long objects |
| KR100752551B1 (en) * | 2002-11-22 | 2007-08-29 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method |
| US7770500B2 (en) | 2004-03-15 | 2010-08-10 | Mitsuboshi Diamond Industrial Co., Ltd. | Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method |
| JP4904036B2 (en) * | 2005-09-15 | 2012-03-28 | 三星ダイヤモンド工業株式会社 | Substrate cutting system |
| KR100913581B1 (en) * | 2007-11-29 | 2009-08-26 | 주식회사 에스에프에이 | Glass cutting system |
| JP5167160B2 (en) * | 2009-01-30 | 2013-03-21 | 三星ダイヤモンド工業株式会社 | Brittle material substrate transfer and cutting equipment |
| KR101449487B1 (en) * | 2012-06-01 | 2014-10-14 | 한국미쯔보시다이아몬드공업(주) | Panel cutting device and method of transferring panel in the same |
| JP5702765B2 (en) * | 2012-12-06 | 2015-04-15 | 三星ダイヤモンド工業株式会社 | Scribing apparatus and scribing method |
| CN203292158U (en) | 2013-05-31 | 2013-11-20 | 京东方科技集团股份有限公司 | Substrate cleaning system |
-
2014
- 2014-10-24 JP JP2014217602A patent/JP6439378B2/en active Active
-
2015
- 2015-06-12 KR KR1020150083706A patent/KR102365097B1/en active IP Right Grant
- 2015-07-14 TW TW104122807A patent/TWI652234B/en active
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2016083821A (en) | 2016-05-19 |
| JP6439378B2 (en) | 2018-12-19 |
| KR20160048631A (en) | 2016-05-04 |
| TW201615573A (en) | 2016-05-01 |
| KR102365097B1 (en) | 2022-02-18 |
| CN105541093A (en) | 2016-05-04 |
| CN105541093B (en) | 2021-06-04 |
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