TWI651655B - Electrical display card and fabricating method thereof - Google Patents
Electrical display card and fabricating method thereof Download PDFInfo
- Publication number
- TWI651655B TWI651655B TW106144293A TW106144293A TWI651655B TW I651655 B TWI651655 B TW I651655B TW 106144293 A TW106144293 A TW 106144293A TW 106144293 A TW106144293 A TW 106144293A TW I651655 B TWI651655 B TW I651655B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- display
- hole
- substrate
- printed layer
- Prior art date
Links
Abstract
一種電子顯示卡，包括電路板組件、第一板件及第二板件。電路板組件包括電路板及顯示器。電路板具有相對的第一表面與第二表面。顯示器配置於第一表面。第一板件配置於第一表面，第一板件包括依序堆疊的基板、印刷層及透明保護膜，其中基板鄰近第一表面並具有第一貫孔，以露出顯示器。印刷層露出第一貫孔，而透明保護膜覆蓋印刷層及第一貫孔。第一板件更包括第一透明材料，填充於第一貫孔內。第二板件配置於第二表面。本發明另提出一種電子顯示卡的製作方法。An electronic display card includes a circuit board assembly, a first plate member and a second plate member. The circuit board assembly includes a circuit board and a display. The circuit board has opposing first and second surfaces. The display is disposed on the first surface. The first plate is disposed on the first surface, and the first plate comprises a substrate, a printed layer and a transparent protective film which are sequentially stacked, wherein the substrate is adjacent to the first surface and has a first through hole to expose the display. The printed layer exposes the first through hole, and the transparent protective film covers the printed layer and the first through hole. The first plate further includes a first transparent material filled in the first through hole. The second plate is disposed on the second surface. The invention further provides a method for manufacturing an electronic display card.
Description
本發明是有關於一種電子卡，且特別是有關於一種電子顯示卡及其製作方法。The present invention relates to an electronic card, and more particularly to an electronic display card and a method of fabricating the same.
近年來，對於***、金融卡等電子卡的安全性需求愈來愈高，因而發展出一種具有顯示器的電子顯示卡，其可透過按壓電子顯示卡的密碼按鈕產生一組一次性密碼（one time password, OTP）顯示於顯示器上，以供進行安全驗證。In recent years, the security requirements for electronic cards such as credit cards and financial cards have become higher and higher, and thus an electronic display card having a display capable of generating a set of one-time passwords by pressing a password button of an electronic display card (one time) has been developed. Password, OTP) is displayed on the display for security verification.
目前電子顯示卡是由上板、下板及設置於上板與下板之間的電路板組件組成，電路板組件設有顯示器，而上板暴露出顯示器。上板主體通常選用透明基板，並採用印刷方式將油墨刷在透明基板上，以形成印刷層，其中印刷層具有開口以暴露出顯示器。接著，將透明保護膜覆蓋印刷層，並使用熱壓合方式使透明基板與透明保護膜緊密結合。然而，進行壓合後，印刷層的開口處容易產生霧化的情形，進而影響電子顯示卡的顯示品質。At present, an electronic display card is composed of an upper board, a lower board, and a circuit board assembly disposed between the upper board and the lower board. The circuit board assembly is provided with a display, and the upper board exposes the display. The upper plate body is usually selected from a transparent substrate, and the ink is printed on the transparent substrate by printing to form a printed layer, wherein the printed layer has an opening to expose the display. Next, the transparent protective film is covered with the printed layer, and the transparent substrate is tightly bonded to the transparent protective film by thermocompression bonding. However, after the press-fitting, the opening of the printed layer is liable to cause fogging, which in turn affects the display quality of the electronic display card.
本發明提出一種電子顯示卡，以提升顯示品質。The invention provides an electronic display card to improve display quality.
本發明提出一種電子顯示卡的製作方法，以提升電子顯示卡的顯示品質。The invention provides a method for manufacturing an electronic display card to improve the display quality of the electronic display card.
為達上述之一或部分或全部目的或是其他目的，本發明的一實施例提出一種電子顯示卡，包括電路板組件、第一板件及第二板件。電路板組件包括電路板及顯示器。電路板具有相對的第一表面與第二表面。顯示器配置於第一表面。第一板件配置於第一表面，第一板件包括依序堆疊的基板、印刷層及透明保護膜，其中基板鄰近第一表面並具有第一貫孔，以露出顯示器。印刷層露出第一貫孔，而透明保護膜覆蓋印刷層及第一貫孔。第一板件更包括第一透明材料，填充於第一貫孔內。第二板件配置於第二表面。In order to achieve one or a part or all of the above or other purposes, an embodiment of the present invention provides an electronic display card comprising a circuit board assembly, a first plate member and a second plate member. The circuit board assembly includes a circuit board and a display. The circuit board has opposing first and second surfaces. The display is disposed on the first surface. The first plate is disposed on the first surface, and the first plate comprises a substrate, a printed layer and a transparent protective film which are sequentially stacked, wherein the substrate is adjacent to the first surface and has a first through hole to expose the display. The printed layer exposes the first through hole, and the transparent protective film covers the printed layer and the first through hole. The first plate further includes a first transparent material filled in the first through hole. The second plate is disposed on the second surface.
在本發明的一實施例中，上述之電路板組件更包括微處理器，配置於電路板上，並電性連接顯示器。In an embodiment of the invention, the circuit board assembly further includes a microprocessor disposed on the circuit board and electrically connected to the display.
在本發明的一實施例中，上述之基板為白色基板。In an embodiment of the invention, the substrate is a white substrate.
在本發明的一實施例中，上述之電路板組件更包括太陽能電池，配置於第一表面，並電性連接微處理器及顯示器，基板更具有第二貫孔，露出太陽能電池，而印刷層露出第二貫孔，且透明保護膜覆蓋第二貫孔，而第一板件更包括第二透明材料，填充於第二貫孔內。In an embodiment of the invention, the circuit board assembly further includes a solar cell disposed on the first surface and electrically connected to the microprocessor and the display, the substrate further having a second through hole to expose the solar cell, and the printing layer The second through hole is exposed, and the transparent protective film covers the second through hole, and the first plate further includes a second transparent material filled in the second through hole.
在本發明的一實施例中，上述之基板為透明基板。In an embodiment of the invention, the substrate is a transparent substrate.
在本發明的一實施例中，上述之電路板組件更包括太陽能電池，配置於第一表面，並電性連接微處理器及顯示器，且印刷層露出太陽能電池。In an embodiment of the invention, the circuit board assembly further includes a solar cell disposed on the first surface and electrically connected to the microprocessor and the display, and the printed layer exposes the solar cell.
在本發明的一實施例中，上述之電路板組件更包括感應天線，配置於電路板上，並電性連接微處理器及顯示器，感應天線適於產生感應電流，以提供電力至微處理器及顯示器。In an embodiment of the invention, the circuit board assembly further includes an inductive antenna disposed on the circuit board and electrically connected to the microprocessor and the display. The sensing antenna is adapted to generate an induced current to provide power to the microprocessor. And display.
在本發明的一實施例中，上述之電路板組件更包括壓電元件，配置於電路板上，並電性連接微處理器及顯示器，壓電元件適於提供電力至微處理器及顯示器。In an embodiment of the invention, the circuit board assembly further includes a piezoelectric element disposed on the circuit board and electrically connected to the microprocessor and the display, and the piezoelectric element is adapted to provide power to the microprocessor and the display.
在本發明的一實施例中，上述之電路板組件更包括感測開關，配置於電路板上，並電性連接微處理器，微處理器用以根據感測開關所產生的感測訊號驅動顯示器，其中感測開關為電阻式感測元件或慣性感測元件。In an embodiment of the invention, the circuit board assembly further includes a sensing switch disposed on the circuit board and electrically connected to the microprocessor, and the microprocessor is configured to drive the display according to the sensing signal generated by the sensing switch. Wherein the sensing switch is a resistive sensing element or an inertial sensing element.
在本發明的一實施例中，上述之電路板組件更包括溫度感測元件，配置於電路板上，並電性連接微處理器。In an embodiment of the invention, the circuit board assembly further includes a temperature sensing component disposed on the circuit board and electrically connected to the microprocessor.
在本發明的一實施例中，上述之顯示器為電子紙顯示器或發光二極體顯示器。In an embodiment of the invention, the display is an electronic paper display or a light emitting diode display.
在本發明的一實施例中，上述之電路板組件更包括電池，配置於電路板上，並電性連接顯示器。In an embodiment of the invention, the circuit board assembly further includes a battery, is disposed on the circuit board, and is electrically connected to the display.
為達上述之一或部分或全部目的或是其他目的，本發明的一實施例提出一種電子顯示卡的製作方法，包括以下步驟：提供一電路板組件，電路板組件包括電路板及顯示器，電路板具有相對的第一表面及第二表面，且第一表面配置顯示器；將第一板件貼合於第一表面，其中第一板件具有依序堆疊的基板、印刷層、透明保護膜及透明材料，基板鄰近第一表面並具有貫孔，以露出顯示器，印刷層露出貫孔，而透明保護膜覆蓋印刷層及貫孔，且透明材料填充於貫孔內；以及將第二板件貼合於第二表面，其中第一板件的形成方法包括：於基板上形成印刷層；將透明材料填充於貫孔內，並延伸至與印刷層的頂面等高；將透明保護膜覆蓋於印刷層的頂面及透明材料上；以及壓合基板、印刷層及透明保護膜。In order to achieve one or a part or all of the above or other purposes, an embodiment of the present invention provides a method for fabricating an electronic display card, comprising the steps of: providing a circuit board assembly including a circuit board and a display, and a circuit The board has opposite first and second surfaces, and the first surface is provided with a display; the first board is attached to the first surface, wherein the first board has a sequentially stacked substrate, a printed layer, a transparent protective film, and a transparent material, the substrate is adjacent to the first surface and has a through hole to expose the display, the printed layer is exposed to the through hole, and the transparent protective film covers the printed layer and the through hole, and the transparent material is filled in the through hole; and the second plate is pasted And a second surface, wherein the forming method of the first plate comprises: forming a printing layer on the substrate; filling the transparent material in the through hole and extending to the same height as the top surface of the printed layer; covering the transparent protective film The top surface of the printed layer and the transparent material; and the pressed substrate, the printed layer and the transparent protective film.
本發明實施例的電子顯示卡及其製作方法因在暴露出顯示器的貫孔（第一貫孔）內填充有透明材料（第一透明材料），所以在對第一板件進行熱壓合時，貫孔內不會有霧化的情形，而可提升電子顯示卡的顯示品質。The electronic display card and the method for fabricating the same according to the embodiment of the present invention are filled with a transparent material (first transparent material) in a through hole (first through hole) of the display, so that when the first plate is thermally pressed There is no fogging in the through hole, and the display quality of the electronic display card can be improved.
為讓本發明之上述和其他目的、特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式，作詳細說明如下。The above and other objects, features and advantages of the present invention will become more <RTIgt;
圖1是本發明一實施例的電子顯示卡的立體示意圖，圖2是圖1的***示意圖，圖3是圖1之第一板件的剖面示意圖。如圖1及圖2所示，本實施例之電子顯示卡1包括電路板組件10、第一板件20及第二板件30。電路板組件10包括電路板11及顯示器12。電路板11具有相對的第一表面111與第二表面112。顯示器12配置於第一表面111，第一板件20亦配置於第一表面111，以覆蓋第一表面111。第二板件30配置於第二表面112，以覆蓋第二表面112。如圖3所示，第一板件20包括依序堆疊的基板21、印刷層22及透明保護膜23，其中基板21鄰近第一表面111並具有第一貫孔24，以露出顯示器12。印刷層22露出第一貫孔24，而透明保護膜23覆蓋印刷層22及第一貫孔24。第一板件20更包括第一透明材料25，填充於第一貫孔24內。1 is a perspective view of an electronic display card according to an embodiment of the present invention, FIG. 2 is an exploded view of FIG. 1, and FIG. 3 is a cross-sectional view of the first plate of FIG. As shown in FIG. 1 and FIG. 2, the electronic display card 1 of the present embodiment includes a circuit board assembly 10, a first board member 20, and a second board member 30. The circuit board assembly 10 includes a circuit board 11 and a display 12. The circuit board 11 has opposing first and second surfaces 111, 112. The display 12 is disposed on the first surface 111 , and the first plate 20 is also disposed on the first surface 111 to cover the first surface 111 . The second plate 30 is disposed on the second surface 112 to cover the second surface 112. As shown in FIG. 3, the first plate member 20 includes a substrate 21, a printed layer 22, and a transparent protective film 23 which are sequentially stacked, wherein the substrate 21 is adjacent to the first surface 111 and has a first through hole 24 to expose the display 12. The printed layer 22 exposes the first through holes 24, and the transparent protective film 23 covers the printed layer 22 and the first through holes 24. The first plate member 20 further includes a first transparent material 25 filled in the first through hole 24.
上述之電路板組件10可進一步包括電池14，配置於電路板11上，並電性連接顯示器12及其他需要電力的電子元件。上述之顯示器12可用於顯示數字、文字或圖式等訊息。電路板組件10可更包括微處理器13，配置於電路板11上，而顯示器12例如是由微處理器13驅動。此外，顯示器12例如為發光二極體顯示器、電子紙顯示器或低耗電量的其他顯示器。上述電子紙顯示器例如是電濕潤顯示器、電泳顯示器、膽固醇液晶顯示器或其他雙穩態（Bistable）顯示器等。The circuit board assembly 10 described above may further include a battery 14 disposed on the circuit board 11 and electrically connected to the display 12 and other electronic components requiring power. The display 12 described above can be used to display messages such as numbers, words or graphics. The circuit board assembly 10 can further include a microprocessor 13 disposed on the circuit board 11, and the display 12 is driven, for example, by the microprocessor 13. Further, the display 12 is, for example, a light emitting diode display, an electronic paper display, or other display having low power consumption. The above electronic paper display is, for example, an electrowetting display, an electrophoretic display, a cholesteric liquid crystal display or other bistable display or the like.
第一板件20的基板21例如是透明基板，而基板21的底面211例如是透過膠體貼合在第一表面111。印刷層22例如為印刷油墨或熱轉印油墨，用以在基板21上形成花紋或圖案。透明保護膜23覆蓋於印刷層22的頂面221及第一透明材料25。填充於第一貫孔24內的第一透明材料25例如從基板21的底面211延伸至與印刷層22的頂面221等高。The substrate 21 of the first plate member 20 is, for example, a transparent substrate, and the bottom surface 211 of the substrate 21 is bonded to the first surface 111 by, for example, a gel. The printed layer 22 is, for example, a printing ink or a thermal transfer ink for forming a pattern or pattern on the substrate 21. The transparent protective film 23 covers the top surface 221 of the printed layer 22 and the first transparent material 25. The first transparent material 25 filled in the first through holes 24 extends, for example, from the bottom surface 211 of the substrate 21 to the same height as the top surface 221 of the printed layer 22.
第二板件30例如透過膠體貼合在第二表面112。此外，第二板件30的結構例如是類似第一板件20，也包括基板、印刷層與透明保護膜，於此不再重述。The second panel 30 is bonded to the second surface 112, for example, through a gel. In addition, the structure of the second plate member 30 is, for example, similar to the first plate member 20, and also includes a substrate, a printed layer and a transparent protective film, which will not be repeated here.
本實施例之電子顯示卡1因在基板21的第一貫孔24內設有第一透明材料25，所以在製作時能避免第一貫孔24處霧化。以下將詳細說明電子顯示卡1的製作方法。圖4為本發明一實施例之電子顯示卡的製作方法的流程示意圖。請參照圖2及圖4，本實施例之電子顯示卡的製作方法包括以下步驟：如步驟S110所示，提供電路板組件10。電路板組件10包括電路板11及顯示器12，電路板11具有相對的第一表面111及第二表面112，且第一表面111配置顯示器12。Since the electronic display card 1 of the present embodiment is provided with the first transparent material 25 in the first through hole 24 of the substrate 21, atomization at the first through hole 24 can be avoided at the time of fabrication. The method of manufacturing the electronic display card 1 will be described in detail below. FIG. 4 is a schematic flow chart of a method for fabricating an electronic display card according to an embodiment of the present invention. Referring to FIG. 2 and FIG. 4, the manufacturing method of the electronic display card of this embodiment includes the following steps: As shown in step S110, the circuit board assembly 10 is provided. The circuit board assembly 10 includes a circuit board 11 having a first surface 111 and a second surface 112 opposite thereto, and a display 12 having a first surface 111 configured with the display 12.
接著，如步驟S120所示，將第一板件20貼合於第一表面111。如圖3所示，第一板件20具有依序堆疊的基板21、印刷層22、透明保護膜23及透明材料（即第一透明材料25），基板21鄰近第一表面111並具有貫孔（即第一貫孔24），以露出顯示器12，印刷層22露出第一貫孔24，而透明保護膜23覆蓋印刷層22及第一貫孔24，且第一透明材料25填充於第一貫孔24內。具體而言，第一板件20的形成方法包括以下步驟：於基板21上形成印刷層22，其中形成印刷層22的方法可包括進行多次印刷。接著，將第一透明材料25填充於第一貫孔24內，並延伸至與印刷層22的頂面221等高。之後，將透明保護膜23覆蓋於印刷層22的頂面221及第一透明材料25上。然後，壓合基板21、印刷層22及透明保護膜23。此外，上述壓合方式例如是採用熱壓合方式，以將基板21、印刷層22及透明保護膜23緊密貼合形成第一板件20。Next, as shown in step S120, the first plate member 20 is attached to the first surface 111. As shown in FIG. 3, the first plate member 20 has a substrate 21, a printed layer 22, a transparent protective film 23, and a transparent material (ie, a first transparent material 25) stacked in sequence. The substrate 21 is adjacent to the first surface 111 and has a through hole. (ie, the first through hole 24) to expose the display 12, the printed layer 22 exposes the first through hole 24, and the transparent protective film 23 covers the printed layer 22 and the first through hole 24, and the first transparent material 25 is filled in the first Inside the through hole 24. Specifically, the method of forming the first panel 20 includes the steps of forming a printed layer 22 on the substrate 21, wherein the method of forming the printed layer 22 can include performing multiple printings. Next, the first transparent material 25 is filled in the first through hole 24 and extends to the same height as the top surface 221 of the printed layer 22. Thereafter, the transparent protective film 23 is overlaid on the top surface 221 of the printed layer 22 and the first transparent material 25. Then, the substrate 21, the printed layer 22, and the transparent protective film 23 are laminated. Further, the above-described pressing method is, for example, a thermocompression bonding method to closely bond the substrate 21, the printed layer 22, and the transparent protective film 23 to form the first sheet member 20.
之後，如步驟S130所示，將第二板件30貼合於第二表面112。需說明的是，在其他實施例中，也可先貼合第二板件30，再貼合第一板件20，或是同時貼合第一板件20與第二板件30。此外，在將第一板件20及第二板件30分別貼合於電路板11之後，可再對第一板件20、第二板件30及電路板組件10進行冷壓合。Thereafter, as shown in step S130, the second plate member 30 is attached to the second surface 112. It should be noted that in other embodiments, the second plate member 30 may be attached first, and then the first plate member 20 may be attached or the first plate member 20 and the second plate member 30 may be attached at the same time. In addition, after the first plate member 20 and the second plate member 30 are respectively attached to the circuit board 11, the first plate member 20, the second plate member 30, and the circuit board assembly 10 can be cold-pressed.
本實施例的電子顯示卡1及其製作方法因在暴露出顯示器12的第一貫孔24內填充有第一透明材料25，所以在對第一板件20進行熱壓合時，第一貫孔24內不會有霧化的情形，而可提升電子顯示卡1的顯示品質。The electronic display card 1 of the present embodiment and the manufacturing method thereof are filled with the first transparent material 25 in the first through hole 24 exposing the display 12, so when the first plate member 20 is thermocompression-bonded, the first through There is no fogging in the hole 24, and the display quality of the electronic display card 1 can be improved.
請再參照圖1與圖2，電路板組件10也可視設計需求設有其他電子元件，例如感測開關15、溫度感測元件16及感應天線17等。Referring to FIG. 1 and FIG. 2 again, the circuit board assembly 10 is also provided with other electronic components, such as the sensing switch 15, the temperature sensing component 16, and the sensing antenna 17, as needed.
電池14例如配置於電路板11的第一表面111上，並電性連接顯示器12及微處理器13，以提供電力至顯示器12及微處理器13。電池14例如是一次電池、二次電池、化學電池、太陽能電池或紙電池。在一實施例中，電池14例如是太陽能電池，印刷層22可具有透光性，能讓環境光通過印刷層22而照射於電池14，而電池14能將光能轉換成電能以提供電力至顯示器12及微處理器13。在印刷層22不具有透光性的實施例中，可讓印刷層22暴露出電池14（太陽能電池）。此外，電池14亦可視設計需求選用其他種類的電池，於此不限定。The battery 14 is disposed, for example, on the first surface 111 of the circuit board 11 and electrically connected to the display 12 and the microprocessor 13 to provide power to the display 12 and the microprocessor 13. The battery 14 is, for example, a primary battery, a secondary battery, a chemical battery, a solar battery, or a paper battery. In one embodiment, the battery 14 is, for example, a solar cell, and the printed layer 22 can be translucent, allowing ambient light to illuminate the battery 14 through the printed layer 22, and the battery 14 can convert light energy into electrical energy to provide power to Display 12 and microprocessor 13. In embodiments where the printed layer 22 is not transmissive, the printed layer 22 can be exposed to the battery 14 (solar cell). In addition, the battery 14 can also be selected from other types of batteries according to design requirements, and is not limited thereto.
感測開關15例如配置於電路板11上，並電性連接微處理器13。微處理器13用以根據感測開關15所產生的感測訊號驅動顯示器12，以使顯示器12顯示訊息，其中感測開關15可為電阻式感測元件或慣性感測元件。進一步來說，電阻式感測元件可感測使用者的按壓或滑動等操控動作，並產生感測訊號微處理器13接收到感測訊號後，而可適時驅動顯示器12，例如顯示器12可顯示一次性密碼，但不以此為限。另一方面，慣性感測元件可感測使用者震動、晃動或彈卡片等操控方式，進而讓微處理器13驅動顯示器12。The sensing switch 15 is disposed, for example, on the circuit board 11 and electrically connected to the microprocessor 13. The microprocessor 13 is configured to drive the display 12 according to the sensing signal generated by the sensing switch 15 to cause the display 12 to display a message, wherein the sensing switch 15 can be a resistive sensing element or an inertial sensing element. Further, the resistive sensing component can sense a user's pressing or sliding control action, and generate a sensing signal. After receiving the sensing signal, the microprocessor 13 can drive the display 12 in time, for example, the display 12 can display One-time password, but not limited to this. On the other hand, the inertial sensing element can sense the user's vibration, shaking or playing a card, and the microprocessor 13 drives the display 12.
溫度感測元件16例如配置於電路板11上，並電性連接微處理器13。微處理器13可用以驅動顯示器12顯示環境中的溫度訊息。The temperature sensing component 16 is disposed, for example, on the circuit board 11 and electrically connected to the microprocessor 13. Microprocessor 13 can be used to drive display 12 to display temperature information in the environment.
感應天線17例如配置於電路板11上，並電性連接微處理器13。具體而言，感應天線17例如是無線射頻辨識模組，用於與一外部感應裝置交換資料。此外，在一實施例中，感應天線17也可電性連接至微處理器13與顯示器12，藉由與外部感應裝置互感以產生感應電流，進而提供電力至微處理器13及顯示器12，如此上述之電池14可以省略。The sensing antenna 17 is disposed on the circuit board 11 and electrically connected to the microprocessor 13. Specifically, the sensing antenna 17 is, for example, a radio frequency identification module for exchanging data with an external sensing device. In addition, in an embodiment, the sensing antenna 17 can also be electrically connected to the microprocessor 13 and the display 12, and the external sensing device is mutually inductive to generate an induced current, thereby providing power to the microprocessor 13 and the display 12. The battery 14 described above can be omitted.
雖然圖2中這些電子元件（電池14、感測開關15、溫度感測元件16與感應天線17）是以位於電路板11的第一表面111為例，但在其他實施例中，也可以將這些電子元件配置於第二表面112，於此不限定。需說明的是，電池14是太陽能電池並位於第二表面112時，第二板件30需為透明材料或於第二板件30設有對應電池14的開口。在一實施例中，電池14可更換為壓電元件（圖未示）。壓電元件配置於電路板11上，並電性連接微處理器13及顯示器12等需要電力的元件。當使用者按壓壓電元件時，壓電元件能夠產生電力，而適於提供電力至微處理器13及顯示器12等需要電力的元件。Although the electronic components (the battery 14, the sensing switch 15, the temperature sensing component 16, and the sensing antenna 17) in FIG. 2 are exemplified on the first surface 111 of the circuit board 11, in other embodiments, These electronic components are disposed on the second surface 112 and are not limited thereto. It should be noted that when the battery 14 is a solar cell and is located on the second surface 112, the second plate member 30 needs to be a transparent material or the second plate member 30 is provided with an opening corresponding to the battery 14. In an embodiment, the battery 14 can be replaced with a piezoelectric element (not shown). The piezoelectric element is disposed on the circuit board 11 and electrically connected to components such as the microprocessor 13 and the display 12 that require power. When the user presses the piezoelectric element, the piezoelectric element can generate electric power, and is adapted to supply electric power to the element requiring power such as the microprocessor 13 and the display 12.
另一方面，本實施例不限制第一板件20為電子顯示卡1的正面，第二板件30為電子顯示卡的背面，可視第一板件20及第二板件30的印刷層的圖案而定。在一實施例中，顯示器12的數量例如為二個，分別配置在電路板11的第一表面111及第二表面112上，可使第一板件20及第二板件30的基板分別具有貫孔以露出相應的顯示器，而位在各基板上的印刷層露出貫孔，再藉由各透明保護膜覆蓋至各印刷層及各貫孔，所以，此電子顯示卡的正面及反面皆能具有顯示功能。On the other hand, this embodiment does not limit the first board 20 to the front side of the electronic display card 1, and the second board 30 is the back side of the electronic display card, which can be seen as the printed layer of the first board 20 and the second board 30. Depending on the pattern. In one embodiment, the number of the displays 12 is two, for example, disposed on the first surface 111 and the second surface 112 of the circuit board 11, so that the substrates of the first board 20 and the second board 30 respectively have The through hole exposes the corresponding display, and the printed layer on each substrate exposes the through hole, and is covered by each transparent protective film to each printed layer and each through hole, so that the front and back sides of the electronic display card can Has a display function.
此外，在一實施例中，電子顯示卡1也可結合一般資料儲存晶片或磁條等電子元件，並適當配置在第一板件20、電路板組件10或第二板件30，而可適用於一般***、金融卡的交易用途。In addition, in an embodiment, the electronic display card 1 can also be combined with an electronic component such as a general data storage chip or a magnetic strip, and is suitably disposed on the first panel 20, the circuit board assembly 10, or the second panel 30, and is applicable. For general credit card, financial card trading purposes.
圖5是本發明另一實施例之電子顯示卡的立體示意圖，圖6是圖5之第一板件沿A-A線的剖面示意圖。如圖5及圖6所示，本實施例之電子顯示卡1a與圖1的電子顯示卡1類似，主要差異處在於第一板件20a的基板21a例如為白色基板，而基板21a更具有第二貫孔27以露出太陽能電池14a，印刷層22露出第二貫孔27，且透明保護膜23覆蓋第二貫孔27。而第一板件20a更包括第二透明材料28，填充於第二貫孔27內。此外，雖然基板21a是以白色基板為例，但是本發明不以此為限，例如基板21a也可為任意顏色的不透明基板。5 is a perspective view of an electronic display card according to another embodiment of the present invention, and FIG. 6 is a cross-sectional view of the first plate of FIG. 5 taken along line A-A. As shown in FIG. 5 and FIG. 6 , the electronic display card 1 a of the present embodiment is similar to the electronic display card 1 of FIG. 1 . The main difference is that the substrate 21 a of the first plate 20 a is, for example, a white substrate, and the substrate 21 a has a second The through hole 27 exposes the solar cell 14a, the printed layer 22 exposes the second through hole 27, and the transparent protective film 23 covers the second through hole 27. The first plate member 20a further includes a second transparent material 28 filled in the second through hole 27. In addition, although the substrate 21a is exemplified by a white substrate, the present invention is not limited thereto. For example, the substrate 21a may be an opaque substrate of any color.
如此，本實施例的電子顯示卡1a因在暴露出太陽能電池14a的第二貫孔27內填充有第二透明材料28，所以基板21a為不透明基板時，太陽能電池14a仍可接收通過第二貫孔27的環境光，進而供電至顯示器12與微處理器13。Thus, the electronic display card 1a of the present embodiment is filled with the second transparent material 28 in the second through hole 27 exposing the solar cell 14a. Therefore, when the substrate 21a is an opaque substrate, the solar cell 14a can still receive the second through. The ambient light of aperture 27 is in turn supplied to display 12 and microprocessor 13.
綜上所述，本發明的電子顯示卡及其製作方法因在暴露出顯示器的貫孔（第一貫孔）內填充有透明材料（第一透明材料），所以在對第一板件進行熱壓合時，貫孔內不會有霧化的情形，而可提升電子顯示卡的顯示品質。另外，本實施例的電子顯示卡因在暴露出太陽能電池的第二貫孔內填充有第二透明材料，所以基板為不透明基板時，太陽能電池仍可接收通過第二貫孔的環境光，進而供電至顯示器與微處理器。In summary, the electronic display card of the present invention and the manufacturing method thereof are filled with a transparent material (first transparent material) in a through hole (first through hole) exposing the display, so that the first plate member is heated. When pressing, there is no fogging in the through hole, and the display quality of the electronic display card can be improved. In addition, the electronic display card of the embodiment is filled with the second transparent material in the second through hole of the exposed solar cell, so when the substrate is an opaque substrate, the solar cell can still receive the ambient light passing through the second through hole, and further Power is supplied to the display and microprocessor.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
1、1a‧‧‧電子顯示卡1, 1a‧‧‧ electronic display card
10、10a‧‧‧電路板組件 10, 10a‧‧‧ circuit board assembly
11‧‧‧電路板 11‧‧‧ boards
111‧‧‧第一表面 111‧‧‧ first surface
112‧‧‧第二表面 112‧‧‧ second surface
12‧‧‧顯示器 12‧‧‧ display
13‧‧‧微處理器 13‧‧‧Microprocessor
14‧‧‧電池 14‧‧‧Battery
14a‧‧‧太陽能電池 14a‧‧‧Solar battery
15‧‧‧感測開關 15‧‧‧Sensing switch
16‧‧‧溫度感測元件 16‧‧‧Temperature sensing components
17‧‧‧感應天線 17‧‧‧Sensor antenna
20、20a‧‧‧第一板件 20, 20a‧‧‧ first board
21、21a‧‧‧基板 21, 21a‧‧‧ substrate
211‧‧‧底面 211‧‧‧ bottom
22‧‧‧印刷層 22‧‧‧Printing layer
221‧‧‧頂面 221‧‧‧ top surface
23‧‧‧透明保護膜 23‧‧‧Transparent protective film
24‧‧‧第一貫孔 24‧‧‧ first through hole
25‧‧‧第一透明材料 25‧‧‧ First transparent material
27‧‧‧第二貫孔 27‧‧‧second through hole
28‧‧‧第二透明材料 28‧‧‧Second transparent material
30‧‧‧第二板件 30‧‧‧Second board
S110、S120、S130‧‧‧步驟 S110, S120, S130‧‧‧ steps
圖1是本發明之一實施例的電子顯示卡的立體示意圖。 圖2是圖1之***示意圖。 圖3是圖1之第一板件的剖面示意圖。 圖4為本發明一實施例之電子顯示卡的製作方法的流程示意圖。 圖5是本發明之另一實施例的電子顯示卡的立體示意圖。 圖6是圖5之第一板件沿A-A線的剖面示意圖。1 is a perspective view of an electronic display card in accordance with an embodiment of the present invention. Figure 2 is a schematic view of the explosion of Figure 1. Figure 3 is a cross-sectional view of the first plate of Figure 1. FIG. 4 is a schematic flow chart of a method for fabricating an electronic display card according to an embodiment of the present invention. FIG. 5 is a perspective view of an electronic display card according to another embodiment of the present invention. Figure 6 is a cross-sectional view of the first plate of Figure 5 taken along line A-A.
Claims (13)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106144293A TWI651655B (en) | 2017-12-15 | 2017-12-15 | Electrical display card and fabricating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106144293A TWI651655B (en) | 2017-12-15 | 2017-12-15 | Electrical display card and fabricating method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI651655B true TWI651655B (en) | 2019-02-21 |
| TW201928782A TW201928782A (en) | 2019-07-16 |
Family
ID=66213741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106144293A TWI651655B (en) | 2017-12-15 | 2017-12-15 | Electrical display card and fabricating method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI651655B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW559454U (en) * | 2003-02-27 | 2003-10-21 | Hon Hai Prec Ind Co Ltd | Collapse electric housing assembled |
| CN101375647A (en) * | 2005-04-11 | 2009-02-25 | 艾维索股份有限公司 | Layered structure with printed elements |
| US7959082B2 (en) * | 2001-12-17 | 2011-06-14 | Zih Corp. | XML system |
| TW201133354A (en) * | 2010-03-15 | 2011-10-01 | Innovatier Inc | An electronic card containing a display window and method for manufacturing an electronic card containing a display window |
| US9122968B2 (en) * | 2012-04-03 | 2015-09-01 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| CN205680116U (en) * | 2016-05-05 | 2016-11-09 | 魏赛琦 | A kind of one-piece type smart card |
| CN206497482U (en) * | 2015-11-11 | 2017-09-15 | 苏州海博智能***有限公司 | A kind of smart card with temperature measurement function |
| TWM551398U (en) * | 2017-07-25 | 2017-11-01 | 宏通數碼科技股份有限公司 | Electronic card |
-
2017
- 2017-12-15 TW TW106144293A patent/TWI651655B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7959082B2 (en) * | 2001-12-17 | 2011-06-14 | Zih Corp. | XML system |
| TW559454U (en) * | 2003-02-27 | 2003-10-21 | Hon Hai Prec Ind Co Ltd | Collapse electric housing assembled |
| CN101375647A (en) * | 2005-04-11 | 2009-02-25 | 艾维索股份有限公司 | Layered structure with printed elements |
| TW201133354A (en) * | 2010-03-15 | 2011-10-01 | Innovatier Inc | An electronic card containing a display window and method for manufacturing an electronic card containing a display window |
| US9122968B2 (en) * | 2012-04-03 | 2015-09-01 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| CN206497482U (en) * | 2015-11-11 | 2017-09-15 | 苏州海博智能***有限公司 | A kind of smart card with temperature measurement function |
| CN205680116U (en) * | 2016-05-05 | 2016-11-09 | 魏赛琦 | A kind of one-piece type smart card |
| TWM551398U (en) * | 2017-07-25 | 2017-11-01 | 宏通數碼科技股份有限公司 | Electronic card |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201928782A (en) | 2019-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9004365B2 (en) | One-time password card for secure transactions | |
| US20080246748A1 (en) | Laminated and tilled displays and methods of manufacturing the same | |
| JP5418696B2 (en) | Electronic component built-in card | |
| JP5671611B2 (en) | Multifunctional module and method of manufacturing device including the same | |
| JPS6362014B2 (en) | ||
| TWM557862U (en) | Electrical display card | |
| JPH0452575B2 (en) | ||
| TWI651655B (en) | Electrical display card and fabricating method thereof | |
| TWI634532B (en) | Electrical display card and fabricating method thereof | |
| TWM559454U (en) | Electrical display card | |
| JP2005321912A (en) | Ic card with solar panel | |
| JPH1115394A (en) | Electronic part, electronic apparatus, and watch using them | |
| KR101672530B1 (en) | A card having multiple fubctions and the method for fabrication the same | |
| JPH09311922A (en) | Film with liquid crystal display device and ic card using the same | |
| JP5402088B2 (en) | IC media with display function | |
| JPH09311921A (en) | Circuit board and ic card using the same | |
| JP2000331142A (en) | Non-contact ic card provided with design antenna | |
| KR101904257B1 (en) | A method for fabrication of a card having input/output device | |
| JPS6116464A (en) | Small-sized electronic device | |
| JPS60122456A (en) | Small sized sheet form electronic device | |
| JP2521990B2 (en) | Small electronic device and manufacturing method thereof | |
| JPH0731658B2 (en) | Card type electronic device | |
| JPS6259824B2 (en) | ||
| KR910007038B1 (en) | Electronic card | |
| JPH04292997A (en) | Ic card |