TWI650913B - Receptacle connector including the improved contact array structure - Google Patents
Receptacle connector including the improved contact array structure Download PDFInfo
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Abstract
所揭示者係一插座連接器，其具有一改善的接點陣列結構。該插座連接器包括一絕緣體；一第一接點陣列，其具有在該絕緣體處裝配為一列之複數個接點銷；一第二接點陣列，其具有在該絕緣體處裝配為一列之複數個接點銷，並與該第一接點陣列隔開；及一殼體，其經組態以環繞該絕緣體、該第一接點陣列、及該第二接點陣列之一組合件。此處，該第二接點陣列中所包括之一部分接點銷的安裝部分係位於與該第一接點陣列中所包括之該等接點銷之安裝部分相同的列。The disclosed person is a socket connector having an improved contact array structure. The socket connector includes an insulator; a first array of contacts having a plurality of contact pins assembled at the insulator; and a second array of contacts having a plurality of columns assembled at the insulator a contact pin spaced apart from the first contact array; and a housing configured to surround the insulator, the first contact array, and one of the second contact array assemblies. Here, the mounting portion of one of the partial contact pins included in the second contact array is located in the same column as the mounting portion of the contact pins included in the first contact array.
Description
本揭露係關於一插座連接器，且更特別地，係關於一具有一改善的接點陣列安排之插座連接器。 The present disclosure relates to a receptacle connector and, more particularly, to a receptacle connector having an improved contact array arrangement.
一般而言，一插座連接器係安裝至各種可攜式電子裝置之一印刷電路板(PCB)，並連接至一與之對應的插頭連接器，且通常經組態以符合USB(微通用串列匯流排)標準。 In general, a socket connector is mounted to a printed circuit board (PCB) of one of various portable electronic devices and is connected to a corresponding plug connector and is typically configured to conform to USB (micro universal string) Column bus) standard.
近來，在英特爾開發者論壇(Intel Developer Forum,IDF)中已公開為新式USB標準之一C型連接器(type-C connector)的詳細資訊。USB C型連接器所具有的尺寸類似於USB 2.0 Micro-B，且不受插頭連接器之連接方向的影響，其允許插頭連接器的各附接或分離。此外，USB C型連接器具有高達10Gbps的傳輸率，其較現存的USB 3.0快上約兩倍，且亦允許高達100W的功率供應，且因此預期將USB C型用於各種領域。 Recently, detailed information on one of the new USB standards, the type-C connector, has been published in the Intel Developer Forum (IDF). The USB Type-C connector has a size similar to that of the USB 2.0 Micro-B and is not affected by the connection direction of the plug connector, which allows for the attachment or detachment of the plug connector. In addition, the USB Type-C connector has a transfer rate of up to 10 Gbps, which is about twice as fast as the existing USB 3.0, and also allows a power supply of up to 100 W, and thus the USB C type is expected to be used in various fields.
USB C型連接器依據印刷電路板的安裝方式被分類為雙SMT(表面黏著技術)型及混成(SMT+DIP)型。在SMT型中，USB C型連接器之接點銷係安裝為與印刷電路板的表面接觸，且在SMT型中，兩列接點銷係表面安裝至印刷電路板。在混成型中，於兩列接點銷之中，一列接點銷係安裝在SMT型中，且剩餘的一列接點銷係安裝在DIP(雙列直插式封裝)型中。此時，在DIP型中，一連接器之一接點銷係形成為垂直印刷電路板並***形 成在印刷電路板中用於安裝之一貫通孔。在上述之中，於雙SMT型連接器中，不容易檢查兩列接點銷的其中一者是否正確地安裝於印刷電路板頂部。因此，允許檢查所有接點銷是否正確安裝之一混成型連接器為優選。 The USB Type-C connectors are classified into a dual SMT (Surface Adhesion Technology) type and a hybrid (SMT+DIP) type depending on the mounting method of the printed circuit board. In the SMT type, the contact pins of the USB C-type connector are mounted in contact with the surface of the printed circuit board, and in the SMT type, the two rows of contact pins are surface mounted to the printed circuit board. In the hybrid molding, among the two rows of contact pins, one row of the pin pins is mounted in the SMT type, and the remaining one of the row of pin pins is mounted in the DIP (Dual In-Line Package) type. At this time, in the DIP type, one of the contacts of the connector is formed as a vertical printed circuit board and inserted into the shape It is used to mount one through hole in a printed circuit board. Among the above, in the dual SMT type connector, it is not easy to check whether one of the two rows of contact pins is correctly mounted on the top of the printed circuit board. Therefore, it is preferred to allow inspection of whether all of the contact pins are properly installed with one of the hybrid molded connectors.
圖1為顯示一現存混成型插座連接器之一底部表面的一部分的圖。如圖1所示，混成型插座連接器包括一絕緣體11，其具有一預定形狀；一第一接點陣列12與一第二接點陣列13，該等係裝配至絕緣體11；以及一殼體10，其環繞整個產品的外部。第一接點陣列12係由一列SMT型接點銷構成，且第二接點陣列13係由兩列DIP型接點銷構成。DIP型接點銷可以一列來組態，但在此例子中，不可能在一列中配置許多DIP型接點銷，且因此通常以兩列來安排DIP型接點銷，如圖1所示。 Figure 1 is a diagram showing a portion of the bottom surface of one of the existing hybrid molded receptacle connectors. As shown in FIG. 1, the hybrid socket connector includes an insulator 11 having a predetermined shape; a first contact array 12 and a second contact array 13, which are assembled to the insulator 11; and a housing 10, which surrounds the outside of the entire product. The first contact array 12 is composed of a row of SMT type contact pins, and the second contact array 13 is composed of two columns of DIP type contact pins. DIP type contact pins can be configured in one column, but in this example, it is not possible to configure many DIP type contact pins in one column, and therefore DIP type contact pins are usually arranged in two columns, as shown in FIG.
然而，在如上述般經組態之現存的混成型插座連接器中，由兩列DIP型接點銷構成之第二接點陣列13在印刷電路板上佔據一大面積。此外，由於第二接點陣列13係由兩列接點銷構成，且第一接點陣列12係由一列接點銷構成，插座連接器總共具有三列接點銷，其導致整個產品的長度長。因此，具有三列接點銷之現存的插座連接器不符合具有較大螢幕及較薄設計之可攜式電子裝置的新近趨勢。特別地，接點陣列之一現存安排成為縮減邊框部分的尺寸以放大可攜式電子裝置螢幕或者增加電池容量的阻礙。 However, in the existing hybrid molded receptacle connector configured as described above, the second contact array 13 composed of two columns of DIP type contact pins occupies a large area on the printed circuit board. In addition, since the second contact array 13 is composed of two rows of contact pins, and the first contact array 12 is composed of a row of contact pins, the socket connector has a total of three rows of contact pins, which results in the length of the entire product. long. Therefore, existing socket connectors with three rows of contact pins do not meet the recent trend of portable electronic devices with larger screens and thinner designs. In particular, one of the arrays of contacts is arranged to reduce the size of the frame portion to amplify the portable electronic device screen or increase the battery capacity.
本揭露經設計以解決相關技術的問題，且因此本揭露係關於提供一混成插座連接器，其具有一改善的接點銷安排，以便該等接點陣列在一印刷電路板上可佔據一縮減的安裝面積，且該插座連接器具有一較短型設計。 The present disclosure is designed to solve the problems of the related art, and thus the present disclosure is directed to providing a hybrid receptacle connector having an improved contact pin arrangement such that the array of contacts can occupy a reduction on a printed circuit board The mounting area and the socket connector have a shorter design.
在本揭露之一態樣中，茲提供一插座連接器，其包含：一絕緣體；一第一接點陣列，其具有在該絕緣體處裝配為一列之複數個接點銷；一第二接點陣列，其具有在該絕緣體處裝配為一列之複數個接點銷，並與該第一接點陣列隔開；以及一殼體，其經組態以環繞該絕緣體、該第一接點陣列、及該第二接點陣列之一組合件，其中該第二接點陣列中所包括之一部分接點銷的安裝部分係位於與該第一接點陣列中所包括之該等接點銷之安裝部分相同的列。 In one aspect of the disclosure, a socket connector is provided, comprising: an insulator; a first array of contacts having a plurality of contact pins assembled in a row at the insulator; a second contact An array having a plurality of contact pins assembled in a row at the insulator and spaced apart from the first contact array; and a housing configured to surround the insulator, the first contact array, And an assembly of the second contact array, wherein a mounting portion of the partial contact pin included in the second contact array is located in the mounting of the contact pins included in the first contact array Partially identical columns.
該第一接點陣列中所包括之複數個接點銷分別可包括：一接點部分，其經組態以提供與一插頭連接器之一電接點；一安裝部分，其係表面安裝至一印刷電路板；以及一連接部分，其經組態以連接該接點部分至該安裝部分。 The plurality of contact pins included in the first contact array may respectively include: a contact portion configured to provide an electrical contact with one of the plug connectors; and a mounting portion that is surface mounted to a printed circuit board; and a connection portion configured to connect the contact portion to the mounting portion.
在該第一接點陣列中所包括之複數個接點銷之中，一部分接點銷的接點部分可具有一向外傾斜的彎曲，且剩餘接點銷的接點部分可具有一線形。 Among the plurality of contact pins included in the first contact array, the contact portions of a part of the contact pins may have an outwardly inclined curvature, and the contact portions of the remaining contact pins may have a linear shape.
彎曲可為一向外傾斜的斜面。 The bend can be an outwardly inclined bevel.
該第二接點陣列中所包括之該部分接點銷的安裝部分可位於具有彎曲之該等接點銷的安裝部分與具有線形接點部分之該等接點銷的安裝部分之間。 The mounting portion of the portion of the contact pins included in the second array of contacts may be located between the mounting portion having the bent contact pins and the mounting portion of the contact pins having the linear contact portions.
接點部分可平行安裝部分，且連接部分可垂直接點部分及安裝部分。 The contact portion may be parallel to the mounting portion, and the connecting portion may be a vertical contact portion and a mounting portion.
以插座連接器的底部表面為基礎，該第一接點陣列中所包括之複數個接點銷的安裝部分的位置可高於接點部分。 Based on the bottom surface of the receptacle connector, the mounting portion of the plurality of contact pins included in the first contact array may be positioned higher than the contact portion.
接點部分可平行安裝部分，且連接部分可具有「」形。 The contact portion can be installed in parallel, and the connecting portion can have " "shape.
該第二接點陣列中所包括之複數個接點銷分別可包括：一接點部分，其經組態以提供與一插頭連接器之一電接點；一安裝部分，其係安裝置一印刷電路板；以及一連接部分，其經組態以連接該接點部分至該安裝部分，其中在該第二接點陣列中所包括之複數個接點銷之中，該部分接點銷的安裝部分係表面安裝至該印刷電路板，且剩餘的接點銷的安裝部分係***安裝至該印刷電路板。 The plurality of contact pins included in the second contact array may respectively include: a contact portion configured to provide an electrical contact with one of the plug connectors; and a mounting portion of the mounting device a printed circuit board; and a connection portion configured to connect the contact portion to the mounting portion, wherein among the plurality of contact pins included in the second contact array, the portion of the contact pin The mounting portion is surface mounted to the printed circuit board, and the mounting portion of the remaining contact pins is inserted into the printed circuit board.
該第二接點陣列中所包括之該部分接點銷的接點部分可具有一向外傾斜的彎曲，且剩餘接點銷的接點部分可具有一線形。 The contact portion of the partial contact pin included in the second contact array may have an outwardly inclined bend, and the contact portion of the remaining contact pins may have a linear shape.
在該第二接點陣列中所包括之該部分接點銷之中，一部分接點銷的接點部分可具有一向外傾斜的彎曲，且在該第二接點陣列中所包括之該部分接點銷之中，剩餘接點銷的接點部分可具有一線形。 Among the partial contact pins included in the second contact array, a contact portion of a part of the contact pins may have an outwardly inclined bend, and the partial portion included in the second contact array Among the click pins, the contact portion of the remaining contact pins may have a linear shape.
彎曲可具有一直角或為一向外傾斜的斜面。 The bend may have a right angle or be an outwardly inclined bevel.
該第二接點陣列中所包括之該部分接點銷的接點部分可具有一線形。 The contact portion of the partial contact pin included in the second contact array may have a linear shape.
該第二接點陣列中所包括之剩餘接點銷的連接部分可垂直地連接至該接點部分及水平連接至該安裝部分，並具有一彎曲。 A connecting portion of the remaining contact pins included in the second contact array may be vertically connected to the contact portion and horizontally connected to the mounting portion and have a bend.
該第二接點陣列中所包括之剩餘接點銷的連接部分可垂直地連接至該接點部分及該安裝部分，並具有一彎曲。 The connecting portion of the remaining contact pins included in the second contact array may be vertically connected to the contact portion and the mounting portion and have a bend.
以插座連接器的底部表面為基礎，連接至該第二接點陣列中所包括之剩餘接點銷的連接部分之接點部分的一端的位置可低於連接至剩餘接點銷之連接部分之安裝部分的一端。 Based on the bottom surface of the receptacle connector, the end of the contact portion of the connection portion connected to the remaining contact pins included in the second contact array may be located lower than the connection portion connected to the remaining contact pins. One end of the mounting section.
該第二接點陣列中所包括之剩餘接點銷的連接部分可具有一「」形。 The connecting portion of the remaining contact pins included in the second contact array may have a " "shape.
以插座連接器的底部表面為基礎，該第二接點陣列中所包括之該部分接點銷的安裝部分的位置可高於接點部分。 The mounting portion of the portion of the contact pins included in the second contact array may be positioned higher than the contact portion based on the bottom surface of the receptacle connector.
該第二接點陣列中所包括之該部分接點銷的連接部分可具有一「」形。 The connecting portion of the partial contact pin included in the second contact array may have a " "shape.
該第一接點陣列中所包括之複數個接點銷的安裝部分與該第二接點陣列中所包括之該部分接點銷的安裝部分可表面安裝至一印刷電路板，且該第二接點陣列中所包括之剩餘接點銷的安裝部分可***安裝至該印刷電路板。 The mounting portion of the plurality of contact pins included in the first contact array and the mounting portion of the portion of the contact pins included in the second contact array are surface mountable to a printed circuit board, and the second A mounting portion of the remaining contact pins included in the contact array can be inserted into the printed circuit board.
該第一接點陣列中所包括之複數個接點銷之一介面安排可與該第二接點陣列之複數個接點銷之一介面安排相反。 One interface arrangement of the plurality of contact pins included in the first contact array may be opposite to one of the plurality of contact pins of the second contact array.
在本揭露中，一混成型插座連接器中之接點陣列的安排係從三列減為兩列，從而縮減印刷電路板上的安裝面積，且亦縮減插座連接器的長度。 In the present disclosure, the arrangement of the array of contacts in a hybrid socket connector is reduced from three columns to two columns, thereby reducing the mounting area on the printed circuit board and also reducing the length of the socket connector.
特別地，由於增加印刷電路板上的安裝面積之DIP型接點銷的安排從兩列減為一列，可進一步縮減印刷電路板上的安裝面積，且亦進一步縮減插座連接器的長度。 In particular, since the arrangement of DIP type contact pins for increasing the mounting area on the printed circuit board is reduced from two columns to one column, the mounting area on the printed circuit board can be further reduced, and the length of the socket connector can be further reduced.
因此，若本揭露被應用至例如智慧型手機之可攜式電子裝置，則可縮減安置插座連接器之邊框部分的尺寸，且因此可輕易地增加螢幕面積並增強電池容量。 Therefore, if the present disclosure is applied to a portable electronic device such as a smart phone, the size of the frame portion of the socket connector can be reduced, and thus the screen area can be easily increased and the battery capacity can be enhanced.
10‧‧‧殼體 10‧‧‧shell
11‧‧‧絕緣體 11‧‧‧Insulator
12‧‧‧第一接點陣列 12‧‧‧First contact array
13‧‧‧第二接點陣列 13‧‧‧Second contact array
100、101‧‧‧絕緣體 100, 101‧‧‧ insulator
102‧‧‧第一接點陣列 102‧‧‧First contact array
102a‧‧‧安裝部分 102a‧‧‧Installation section
102b‧‧‧接點部分 102b‧‧‧Contact section
102c‧‧‧連接部分 102c‧‧‧Connected section
103‧‧‧第二接點陣列 103‧‧‧Second contact array
103a-1、103a-2‧‧‧安裝部分 103a-1, 103a-2‧‧‧Installation section
103b‧‧‧接點部分 103b‧‧‧Contact section
103c‧‧‧連接部分 103c‧‧‧Connected section
104‧‧‧中板 104‧‧‧ Medium board
104a‧‧‧耦合突出 104a‧‧‧coupled
105‧‧‧RFI墊 105‧‧‧RFI pad
106‧‧‧殼體 106‧‧‧Shell
106a‧‧‧焊接部分 106a‧‧‧welding part
402a‧‧‧安裝部分 402a‧‧‧Installation section
402b‧‧‧接點部分 402b‧‧‧Contact section
402c‧‧‧連接部分 402c‧‧‧Connected section
403a-1、403a-2‧‧‧安裝部分 403a-1, 403a-2‧‧‧Installation section
403b‧‧‧接點部分 403b‧‧‧Contact section
403c‧‧‧連接部分 403c‧‧‧Connected section
1702a‧‧‧安裝部分 1702a‧‧‧Installation section
1702b‧‧‧接點部分 1702b‧‧‧Contact section
1702c‧‧‧連接部分 1702c‧‧‧Connected section
1703a-1‧‧‧安裝部分 1703a-1‧‧‧Installation section
1703a-2‧‧‧安裝部分 1703a-2‧‧‧Installation section
1703b‧‧‧接點部分 1703b‧‧‧Contact section
1703c‧‧‧連接部分 1703c‧‧‧Connected section
2010‧‧‧印刷電路板 2010‧‧‧Printed circuit board
伴隨圖式說明本揭露的較佳實施例，且與前文揭露一起作用於提供對本揭露之技術特徵的進一步了解。不過，本揭露不欲理解為受限於圖式。 The preferred embodiment of the present disclosure is described in conjunction with the drawings, and together with the foregoing disclosure, provides a further understanding of the technical features of the disclosure. However, this disclosure is not intended to be construed as being limited by the drawings.
圖1為顯示一現存混成型插座連接器之一底部表面的一部分的圖。 Figure 1 is a diagram showing a portion of the bottom surface of one of the existing hybrid molded receptacle connectors.
圖2為顯示根據本揭露之一實施例之一插座連接器的分解透視圖。 2 is an exploded perspective view showing a receptacle connector in accordance with an embodiment of the present disclosure.
圖3為顯示根據本揭露之一實施例之一接點陣列的圖。 3 is a diagram showing a contact array in accordance with an embodiment of the present disclosure.
圖4為顯示包括圖3所繪示之接點陣列之一插座連接器的裝配透視圖。 4 is an assembled perspective view showing one of the socket connectors including the contact array illustrated in FIG.
圖5為圖4之底視圖。 Figure 5 is a bottom view of Figure 4.
圖6為顯示根據本揭露之另一實施例之一接點陣列的圖。 6 is a diagram showing a contact array in accordance with another embodiment of the present disclosure.
圖7為顯示包括圖6所繪示之接點陣列之一插座連接器的底視圖。 Figure 7 is a bottom plan view showing one of the socket connectors including the contact array illustrated in Figure 6.
圖8為顯示根據本揭露之另一實施例之一接點陣列的圖。 FIG. 8 is a diagram showing a contact array in accordance with another embodiment of the present disclosure.
圖9為顯示包括圖8所繪示之接點陣列之一插座連接器的底視圖。 Figure 9 is a bottom plan view showing one of the socket connectors including the contact array illustrated in Figure 8.
圖10為顯示根據本揭露之另一實施例之一接點陣列的圖。 FIG. 10 is a diagram showing a contact array in accordance with another embodiment of the present disclosure.
圖11為顯示包括圖10所繪示之接點陣列之一插座連接器的底視圖。 Figure 11 is a bottom plan view showing one of the socket connectors including the contact array illustrated in Figure 10.
圖12為顯示根據本揭露之另一實施例之一接點陣列的圖。 12 is a diagram showing a contact array in accordance with another embodiment of the present disclosure.
圖13為顯示包括圖12所繪示之接點陣列之一插座連接器的底視圖。 Figure 13 is a bottom plan view showing one of the socket connectors including the contact array illustrated in Figure 12.
圖14為顯示根據本揭露之另一實施例之一接點陣列的圖。 14 is a diagram showing a contact array in accordance with another embodiment of the present disclosure.
圖15為顯示包括圖14所繪示之接點陣列之一插座連接器的底視圖。 Figure 15 is a bottom plan view showing one of the socket connectors including the contact array illustrated in Figure 14.
圖16為顯示根據本揭露之另一實施例之一插座連接器的分解透視圖。 Figure 16 is an exploded perspective view showing a receptacle connector in accordance with another embodiment of the present disclosure.
圖17為詳細顯示圖16之插座連接器之一接點陣列的圖。 Figure 17 is a diagram showing in detail one of the contact arrays of the receptacle connector of Figure 16.
圖18為顯示包括圖17所繪示之接點陣列之一插座連接器的裝配透視圖。 Figure 18 is an assembled perspective view showing one of the socket connectors including the contact array illustrated in Figure 17.
圖19為圖18之底視圖。 Figure 19 is a bottom view of Figure 18.
圖20為用於比較根據本發明之一實施例之一接點陣列與一現存的接點陣列在一印刷電路板上之安裝圖案的圖。 20 is a diagram for comparing mounting patterns of a contact array and an existing contact array on a printed circuit board in accordance with an embodiment of the present invention.
在下文中，本揭露的較佳實施例將參照伴隨圖式詳細地敘述。在敘述之前，須了解本說明書與附加的申請專利範圍中所使用的措辭不應理 解為受限於通用的及字典中的含意，而是基於允許本發明人針對最佳解釋適當地定義措辭的原則以對應本揭露之技術態樣的含意及概念為基礎加以解釋。因此，本文所提出的敘述只是僅用於說明目的之一較佳範例，而非意欲限制本揭露的範圍，因此須了解可在不偏離本揭露之範圍的情況下作出其他的等同物及修改物。 Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Before the narrative, it should be understood that the wording used in this specification and the scope of the attached patent application should not be understood. The explanation is limited to the meanings of the general and the dictionary, but is based on the meaning of allowing the inventors to appropriately define the wording for the best explanation, based on the meaning and concept of the technical aspect of the disclosure. Therefore, the descriptions of the present invention are intended to be illustrative only, and are not intended to limit the scope of the disclosure, and it is understood that other equivalents and modifications may be made without departing from the scope of the disclosure. .
在下列揭露中，「前部」一詞意指欲耦合至一插座連接器之一插頭連接器所處之一方向，且「後部」一詞意指一與其相反的方向。 In the following disclosure, the term "front" means the direction in which one of the plug connectors of a socket connector is to be coupled, and the term "rear" means a direction opposite thereto.
1.板上型插座連接器 1. On-board socket connector
圖2為顯示根據本揭露之一實施例之一插座連接器的分解透視圖。圖2所繪示之插座連接器的組件僅為一範例，在所屬技術領域中具有通常知識者顯而易見的範圍內，圖2所繪示的組件可部分被排除或與其他組件交換，或可分開地增添任何進一步的組件。此實施例的插座連接器為一板上型插座連接器，其係放置於一印刷電路板上並直接安裝至該處。 2 is an exploded perspective view showing a receptacle connector in accordance with an embodiment of the present disclosure. The components of the receptacle connector illustrated in FIG. 2 are merely examples, and the components illustrated in FIG. 2 may be partially excluded or exchanged with other components, or may be separated, within the scope apparent to those of ordinary skill in the art. Add any further components. The receptacle connector of this embodiment is an on-board receptacle connector that is placed on a printed circuit board and mounted directly thereto.
參照圖2，根據本揭露之一實施例之插座連接器包括絕緣體100、101，該等係由具有一預定形狀之一絕緣體塊材構成；一第一接點陣列102與一第二接點陣列103，該等係裝配至絕緣體100、101；以及一殼體106，其經組態以環繞產品外部。 Referring to FIG. 2, a socket connector according to an embodiment of the present disclosure includes insulators 100, 101, which are composed of an insulator block having a predetermined shape; a first contact array 102 and a second contact array 103, the systems are assembled to the insulators 100, 101; and a housing 106 is configured to surround the exterior of the product.
絕緣體100、101包括一第一絕緣體100，其係容納於殼體106中；及一第二絕緣體101，其具有一主體，該主體與一部分的第一絕緣體100整合，並完成殼體106的後側。第一絕緣體100及第二絕緣體101分別具有複數個用於裝配接點銷的狹槽(未圖示)。絕緣體100、101可以例如塑膠樹脂製成。 The insulators 100, 101 include a first insulator 100 that is received in the housing 106, and a second insulator 101 that has a body that is integrated with a portion of the first insulator 100 and that completes the housing 106. side. The first insulator 100 and the second insulator 101 each have a plurality of slots (not shown) for mounting the contact pins. The insulators 100, 101 may be made of, for example, a plastic resin.
此外，為了防止射頻干擾(RFI)，在第二絕緣體101的一側安裝一預定的RFI墊105。RFI墊105阻隔訊號干擾，訊號干擾可在透過第一接點陣 列102及第二接點陣列103傳輸或接收訊號時發生於接點陣列102、103之間。詳細地，若一高速訊號流過第一接點陣列102及第二接點陣列103，則一流過任何一個接點銷的訊號可對一流過另一個接點銷的訊號造成影響。當一流過任何一個接點銷的訊號被發射時，接地的RFI墊105允許發射訊號流至RFI墊105而非另一接點銷，從而防止接點銷之間的干擾。 Further, in order to prevent radio frequency interference (RFI), a predetermined RFI pad 105 is mounted on one side of the second insulator 101. RFI pad 105 blocks signal interference, signal interference can pass through the first contact array The column 102 and the second contact array 103 occur between the contact arrays 102, 103 when transmitting or receiving signals. In detail, if a high speed signal flows through the first contact array 102 and the second contact array 103, the signal of any one of the contact pins can affect the signal of the first contact pin. The grounded RFI pad 105 allows the transmitted signal to flow to the RFI pad 105 instead of the other contact pin when the signal of any of the contact pins is transmitted, thereby preventing interference between the contact pins.
一用於加固接點銷組合件之強度的中板104係配置在第一絕緣體100中。中板104係位於第一接點陣列102及第二接點陣列103之間。中板104係用於阻隔一流過第一接點陣列102的訊號與一流過第二接點陣列103的訊號之間的干擾。例如，當一流過第二接點陣列103的訊號被發射時，中板104允許發射訊號流至接地端而非第一接點陣列102。 An intermediate plate 104 for reinforcing the strength of the contact pin assembly is disposed in the first insulator 100. The middle plate 104 is located between the first contact array 102 and the second contact array 103. The midplane 104 is used to block interference between signals that have passed through the first contact array 102 and signals that are better than the second contact array 103. For example, when a signal that is first passed through the second contact array 103 is transmitted, the midplane 104 allows the transmit signal to flow to the ground instead of the first contact array 102.
此外，中板104可具有一耦合突出104a。耦合突出104a與一插頭連接器之一對應的突出嚙合，以便插座連接器及插頭連接器彼此耦合。詳細地，當插頭連接器被耦合至插座連接器或與插座連接器分開時，耦合突出104a可與插頭連接器之對應的突出嚙合，以達成用於防止插座連接器被耦合或分開達某一程度的鉤接功能(hooking function)。因此，使用者可準確地識別插頭連接器是否確切地耦合至插座連接器或確切地從插座連接器分開。 Additionally, the midplane 104 can have a coupling protrusion 104a. The coupling projection 104a is in protruding engagement with one of the plug connectors such that the receptacle connector and the plug connector are coupled to each other. In detail, when the plug connector is coupled to or disconnected from the receptacle connector, the coupling protrusion 104a can engage with a corresponding protrusion of the plug connector to achieve a function for preventing the receptacle connector from being coupled or separated to a certain The degree of hooking function. Therefore, the user can accurately identify whether the plug connector is exactly coupled to the socket connector or is exactly separated from the socket connector.
殼體106係以金屬材料製成，並在其後側將第二絕緣體101容納於其中。此外，殼體106將第一絕緣體100容納於其中，且殼體106的後側係藉由第二絕緣體101來完成。殼體106可經由一焊接部分106a安裝至一印刷電路板。 The housing 106 is made of a metal material and accommodates the second insulator 101 therein at its rear side. Further, the housing 106 houses the first insulator 100 therein, and the rear side of the housing 106 is completed by the second insulator 101. The housing 106 can be mounted to a printed circuit board via a solder portion 106a.
第一接點陣列102位於放置在第一絕緣體100之上部表面上的第二絕緣體101。第二接點陣列103位於第一絕緣體100的下部表面。因此，第一接點陣列102及第二接點陣列103係彼此分開。從第二接點陣列103觀看堆疊 順序，組件係以第二接點陣列103、第一絕緣體100之下部表面、中板104、第一絕緣體100之上部表面、一部分的第二絕緣體101、及第一接點陣列102的順序堆疊。 The first contact array 102 is located on the second insulator 101 placed on the upper surface of the first insulator 100. The second contact array 103 is located on a lower surface of the first insulator 100. Therefore, the first contact array 102 and the second contact array 103 are separated from each other. Viewing the stack from the second contact array 103 In order, the components are stacked in the order of the second contact array 103, the lower surface of the first insulator 100, the middle plate 104, the upper surface of the first insulator 100, a portion of the second insulator 101, and the first contact array 102.
觀看製造程序，第一絕緣體100係經由與第二接點陣列103及中板104一起之第一插物模製而形成。在形成第一絕緣體100之後，第一接點陣列102係放置為與第一絕緣體100隔開一預定距離，之後經由第二插物模製最終形成第二絕緣體101。 Looking at the manufacturing process, the first insulator 100 is formed by molding the first insert together with the second contact array 103 and the intermediate plate 104. After forming the first insulator 100, the first contact array 102 is placed at a predetermined distance from the first insulator 100, and then the second insulator 101 is finally formed via the second insert molding.
在圖2所繪示之第一接點陣列102及第二接點陣列103中，十二個接點銷分別以規則節距安排，且各銷具有沿著圖中「A」方向之一介面，如下文表1所示。下文表1顯示USB C型連接器的介面標準。如下文表1所示，第一接點陣列102之接點銷的介面安排順序與第二接點陣列103之接點銷的介面安排順序相反。不過，兩端的介面相同地為接地端。因此，在本說明書中，介面安排的相反順序意指除了兩端的接地銷之外，相反地安排剩餘的接點銷。由於第一及第二接點陣列102、103之接點銷的介面安排如上述般地彼此相反，一插頭連接器不管其連接方向為何均可附接或分離。 In the first contact array 102 and the second contact array 103 illustrated in FIG. 2, twelve contact pins are respectively arranged at regular pitches, and each pin has an interface along the "A" direction in the figure. , as shown in Table 1 below. Table 1 below shows the interface standard for USB Type-C connectors. As shown in Table 1 below, the interface arrangement order of the contact pins of the first contact array 102 is opposite to the interface arrangement order of the contact pins of the second contact array 103. However, the interfaces at both ends are identically grounded. Therefore, in the present specification, the reverse order of the interface arrangement means that the remaining contact pins are arranged oppositely except for the ground pins at both ends. Since the interface arrangement of the contact pins of the first and second contact arrays 102, 103 is opposite to each other as described above, a plug connector can be attached or detached regardless of its connection direction.
一GND銷為一接地銷。一TX銷及一RX銷為資料匯流排銷，且一(+)銷及一(-)銷係彼此相鄰同時成對。一VBUS銷為一用於供應功率的銷。一SBU銷(SBU1、SBU2)為一用於旁帶的銷。一CC銷(CC1、CC2)為一用於組態通道的銷。一D銷(D1、D2)為一用於差動資料訊號的銷，且一(+)銷及一(-)銷係彼此相鄰同時成對。如稍後所述者，當第二接點陣列103的接點銷中有一部分接點銷的安裝部分103a-1與第一接點陣列102之接點銷的安裝部分102a位於相同的列時，成對之接點銷的安裝部分102a、103a-1、103a-2的位置必須沿著節距方向彼此相鄰。此處，成對的接點銷可為TX銷、RX銷、或D銷。上述接點陣列102、103將參照圖式在下文詳細地敘述。 A GND pin is a ground pin. A TX pin and an RX pin are data bus pins, and one (+) pin and one (-) pin are adjacent to each other at the same time. A VBUS pin is a pin for supplying power. An SBU pin (SBU1, SBU2) is a pin for the side band. A CC pin (CC1, CC2) is a pin for configuring the channel. A D pin (D1, D2) is a pin for a differential data signal, and one (+) pin and one (-) pin are adjacent to each other and paired at the same time. As will be described later, when the mounting portion 103a-1 of a portion of the contact pins of the second contact array 103 and the mounting portion 102a of the contact pins of the first contact array 102 are located in the same column The positions of the mounting portions 102a, 103a-1, 103a-2 of the pair of contact pins must be adjacent to each other along the pitch direction. Here, the pair of contact pins may be a TX pin, an RX pin, or a D pin. The contact arrays 102, 103 described above will be described in detail below with reference to the drawings.
(1.1)接點陣列的第一範例 (1.1) The first example of a contact array
圖3為顯示根據本揭露之一實施例之一接點陣列的圖，其中圖3(a)顯示一第一接點陣列102，圖3(b)顯示一第二接點陣列103，且圖3(c)為平面圖，其由上方顯示第一接點陣列102及第二接點陣列103。 3 is a diagram showing a contact array according to an embodiment of the present disclosure, wherein FIG. 3(a) shows a first contact array 102, and FIG. 3(b) shows a second contact array 103, and FIG. 3(c) is a plan view showing the first contact array 102 and the second contact array 103 from above.
如圖3(a)所示，第一接點陣列102之接點銷分別包括一安裝部分102a、一接點部分102b、及一連接部分102c。安裝部分102a係表面安裝至一印刷電路板，平行該印刷電路板，並透過第二絕緣體101被抽出。接點部分102b與一對應的插頭連接器之一接點陣列形成一電接點。接點部分102b係耦合至第一絕緣體100之一狹槽。連接部分102c連接安裝部分102a至接點部分102b。如圖3(a)所示，安裝部分102a及接點部分102b係接近彼此平行，且連接部分102c係接近垂直地連接至安裝部分102a及接點部分102b。此外，如圖3(a)所示，第一接點陣列102之複數個接點銷相同地具有一線形。 As shown in FIG. 3(a), the contact pins of the first contact array 102 respectively include a mounting portion 102a, a contact portion 102b, and a connecting portion 102c. The mounting portion 102a is surface mounted to a printed circuit board, parallel to the printed circuit board, and drawn through the second insulator 101. The contact portion 102b forms an electrical contact with a contact array of a corresponding plug connector. The contact portion 102b is coupled to one of the slots of the first insulator 100. The connecting portion 102c connects the mounting portion 102a to the contact portion 102b. As shown in FIG. 3(a), the mounting portion 102a and the contact portion 102b are nearly parallel to each other, and the connecting portion 102c is connected to the mounting portion 102a and the contact portion 102b in a nearly vertical manner. Further, as shown in FIG. 3(a), the plurality of contact pins of the first contact array 102 have the same linear shape.
如圖3(b)所示，第二接點陣列103包括兩種接點銷。 As shown in FIG. 3(b), the second contact array 103 includes two kinds of contact pins.
第一種接點銷分別包括一安裝部分103a-1、一接點部分103b、及一連接部分103c。在第一種接點銷中，接點部分103b係經成形以具有一彎曲而非一線形。當從上方觀察時，彎曲的形成致使安裝部分103a-1及接點部分103b並非位於相同直線上，但安裝部分103a-1平行接點部分103b但位於外側。在此實施例中，彎曲可具有一直角或一斜面形狀，但不受限於此。接點部分103b具有一彎曲，因為第一種接點銷的安裝部分103a-1係位於第一接點陣列102的最外側，同時沿著節距方向形成與第一接點陣列102之安裝部分102a相同的列，如稍後所述者。 The first type of contact pins respectively include a mounting portion 103a-1, a contact portion 103b, and a connecting portion 103c. In the first type of contact pin, the contact portion 103b is shaped to have a curvature rather than a line. When viewed from above, the formation of the bending causes the mounting portion 103a-1 and the contact portion 103b not to lie on the same straight line, but the mounting portion 103a-1 is parallel to the contact portion 103b but is located outside. In this embodiment, the curvature may have a right angle or a bevel shape, but is not limited thereto. The contact portion 103b has a bend because the mounting portion 103a-1 of the first type of contact pin is located at the outermost side of the first contact array 102 while forming the mounting portion with the first contact array 102 along the pitch direction. 102a is the same column as described later.
第二種接點銷分別包括一安裝部分103a-2、一接點部分103b、及一連接部分103c。第二種接點銷之接點部分103b與一對應的插頭連接器之一接點陣列形成一電接點。接點部分103b係耦合至第一絕緣體100之一狹槽。第二種接點銷之接點部分103b具有一線形，且安裝部分103a-2係接近垂直接點部分103b。連接部分103c係接近垂直地連接至接點部分103b，並水平地連接至安裝部分103a-2。第二種接點銷之連接部分103c具有一向外傾斜的彎曲，如圖3(b)所示。設置彎曲以拉長安裝部分103a-2之間的節距間隔。若不需要拉長節距間隔則可不形成彎曲。第一種接點銷之安裝部分103a-1係表面安裝至一印刷電路板並平行該印刷電路板。同時，第二種接點銷之安裝部分103a-2係***印刷電路板中並焊接至該處。 The second contact pins respectively include a mounting portion 103a-2, a contact portion 103b, and a connecting portion 103c. The contact portion 103b of the second contact pin forms an electrical contact with a contact array of a corresponding plug connector. The contact portion 103b is coupled to one of the slots of the first insulator 100. The contact portion 103b of the second contact pin has a linear shape, and the mounting portion 103a-2 is close to the vertical contact portion 103b. The connecting portion 103c is connected to the contact portion 103b nearly vertically, and is horizontally connected to the mounting portion 103a-2. The connecting portion 103c of the second contact pin has an outwardly inclined curve as shown in Fig. 3(b). A bend is provided to elongate the pitch interval between the mounting portions 103a-2. If the pitch interval is not required to be elongated, no bending may be formed. The mounting portion 103a-1 of the first type of contact pin is surface mounted to a printed circuit board and parallel to the printed circuit board. At the same time, the mounting portion 103a-2 of the second contact pin is inserted into the printed circuit board and soldered thereto.
如圖3(c)所示，若第一及第二接點陣列102、103均耦合至第一絕緣體100，則第二接點陣列103之第一種接點銷的安裝部分103a-1係沿著節距方向位於與第一接點陣列102之接點銷的安裝部分102a相同的列。 As shown in FIG. 3(c), if the first and second contact arrays 102, 103 are both coupled to the first insulator 100, the mounting portion 103a-1 of the first contact pin of the second contact array 103 is The columns are located in the same direction as the mounting portion 102a of the contact pins of the first contact array 102 along the pitch direction.
圖4為顯示包括圖3所繪示之接點陣列之一插座連接器的裝配透視圖，且圖5為圖4之底視圖。 4 is an assembled perspective view showing one of the socket connectors including the contact array illustrated in FIG. 3, and FIG. 5 is a bottom view of FIG.
參照圖4及5，第一接點陣列102的安裝部分102a及第二接點陣列103之第一種接點銷的安裝部分103a-1係透過插座連接器之第二絕緣體101的底部表面被抽出。此時，透過第二絕緣體101之底部表面抽出之第二接點陣列103之第一種接點銷的安裝部分103a-1係沿著節距方向位於與第一接點陣列102之接點銷的安裝部分102a相同的列。如圖5所示，第二接點陣列103之第二種接點銷的安裝部分103a-2係以DIP焊接型繪製，且第二接點陣列103之第一種接點銷的安裝部分103a-1及第一接點陣列102之接點銷的安裝部分102a係以SMT型繪製。若第二接點陣列103之一部分接點銷的安裝部分103a-1如上述般地位於第一接點陣列102之安裝部分102a的列，則第二接點陣列103之剩餘接點銷的安裝部分103a-2可以一列設置。此接點銷安排可實現一在其中結合一列DIP焊接型接點銷及一列SMT型接點銷的安裝結構，其與在其中結合兩列DIP焊接型接點銷及一列SMT型接點銷之現存的安裝結構不同。因此，可有效地縮減印刷電路板上之接點銷的安裝面積，且亦縮短連接器的長度。 Referring to FIGS. 4 and 5, the mounting portion 102a of the first contact array 102 and the mounting portion 103a-1 of the first contact pin of the second contact array 103 are through the bottom surface of the second insulator 101 of the receptacle connector. Take out. At this time, the mounting portion 103a-1 of the first type of contact pin of the second contact array 103 drawn through the bottom surface of the second insulator 101 is located at the contact pin with the first contact array 102 along the pitch direction. The mounting portion 102a has the same column. As shown in FIG. 5, the mounting portion 103a-2 of the second contact pin of the second contact array 103 is drawn in the DIP soldering type, and the mounting portion 103a of the first contact pin of the second contact array 103 is shown. The mounting portion 102a of the contact pin of -1 and the first contact array 102 is drawn in the SMT type. If the mounting portion 103a-1 of one of the contact pins of the second contact array 103 is located in the column of the mounting portion 102a of the first contact array 102 as described above, the mounting of the remaining contact pins of the second contact array 103 The sections 103a-2 can be arranged in a column. The contact pin arrangement can realize a mounting structure in which a row of DIP welded type contact pins and a row of SMT type contact pins are combined, and the two columns of DIP welded type contact pins and one column of SMT type contact pins are combined therein. The existing installation structure is different. Therefore, the mounting area of the contact pins on the printed circuit board can be effectively reduced, and the length of the connector is also shortened.
如上述，在安排接點銷時，須注意用於差動對訊號之接點銷(例如，TX2+、TX2-、D2+、D2-、RX1+、RX1-)的安裝部分須配置為彼此相鄰。用於差動對訊號的接點銷抵消由沿著相反方向施加之電場所導致的雜訊，且因此防止雜訊被轉移至另一接點銷。詳細地，參照圖3，在第二接點陣列103中所包括之第一種接點銷的安裝部分103a-1的安排中，左側的三個安裝部分103a-1從左開始分別為GND、TX2+、TX2-介面，且TX2+及TX2-介面的位置係彼此相鄰。此外，右側的三個安裝部分103a-1從左開始分別為RX1-、RX1+、GND介面，且RX1-及RX1+介面的位置係彼此相鄰。此外，第二接點陣列103中所包括之第二種接點銷的安裝部分103a-2係以從左開 始為VBUS、CC2、D2+、D2-、SBU2、VBUS介面的順序設置，且D2+及D2-的位置亦彼此相鄰。 As described above, when arranging the contact pins, it should be noted that the mounting portions for the contact pins of the differential pair signal (for example, TX2+, TX2-, D2+, D2-, RX1+, RX1-) must be disposed adjacent to each other. The contact pin for the differential pair signal cancels the noise caused by the electrical field applied in the opposite direction, and thus prevents the noise from being transferred to the other contact pin. In detail, referring to FIG. 3, in the arrangement of the mounting portion 103a-1 of the first type of contact pin included in the second contact array 103, the three mounting portions 103a-1 on the left side are respectively GND from the left, The TX2+, TX2-interface, and the locations of the TX2+ and TX2-interfaces are adjacent to each other. Further, the three mounting portions 103a-1 on the right side are RX1-, RX1+, and GND interfaces from the left, and the positions of the RX1- and RX1+ interfaces are adjacent to each other. In addition, the mounting portion 103a-2 of the second contact pin included in the second contact array 103 is opened from the left The order is initially set for the VBUS, CC2, D2+, D2-, SBU2, and VBUS interfaces, and the positions of D2+ and D2- are also adjacent to each other.
(1.2)接點陣列的第二範例 (1.2) Second example of a contact array
圖6為顯示根據本揭露之另一實施例之一接點陣列的圖，其中圖6(a)顯示一第一接點陣列102，圖6(b)顯示一第二接點陣列103，且圖6(c)為平面圖，其由上方觀察顯示第一接點陣列102及第二接點陣列103。 6 is a diagram showing a contact array according to another embodiment of the present disclosure, wherein FIG. 6(a) shows a first contact array 102, and FIG. 6(b) shows a second contact array 103, and Fig. 6(c) is a plan view showing the first contact array 102 and the second contact array 103 as viewed from above.
如圖6(a)所示，第一接點陣列102之接點銷包括一安裝部分402a、一接點部分402b、及一連接部分402c。安裝部分402a係表面安裝至一印刷電路板，並平行該印刷電路板，且安裝部分402a係透過第二絕緣體101被抽出。接點部分402b與一對應的插頭連接器之一接點陣列形成一電接點。接點部分402b係耦合至第一絕緣體100之狹槽。連接部分402c連接安裝部分402a至接點部分402b。如圖6(a)所示，安裝部分402a及接點部分402b係接近彼此平行，且連接部分402c係接近垂直地連接至安裝部分402a及接點部分402b。圖6之第一接點陣列102係經組態，以便以中心處的兩個接點銷為基礎，位於兩側之外部接點銷的接點部分402b具有一彎曲。在此實施例中，彎曲可具有一直角或一斜面形狀，但不受限於此。接點部分402b具有一彎曲，以形成一空間，其中第二接點陣列103之一部分接點銷的安裝部分403a-1係位於與第一接點陣列102之接點銷的安裝部分402a相同的列。 As shown in FIG. 6(a), the contact pins of the first contact array 102 include a mounting portion 402a, a contact portion 402b, and a connecting portion 402c. The mounting portion 402a is surface-mounted to a printed circuit board and parallel to the printed circuit board, and the mounting portion 402a is drawn through the second insulator 101. Contact portion 402b forms an electrical contact with a contact array of a corresponding plug connector. Contact portion 402b is coupled to the slot of first insulator 100. The connecting portion 402c connects the mounting portion 402a to the contact portion 402b. As shown in Fig. 6(a), the mounting portion 402a and the contact portion 402b are nearly parallel to each other, and the connecting portion 402c is nearly vertically connected to the mounting portion 402a and the contact portion 402b. The first contact array 102 of Figure 6 is configured such that the contact portions 402b of the external contact pins on both sides have a bend based on the two contact pins at the center. In this embodiment, the curvature may have a right angle or a bevel shape, but is not limited thereto. The contact portion 402b has a bend to form a space in which the mounting portion 403a-1 of one of the contact pins of the second contact array 103 is located in the same manner as the mounting portion 402a of the contact pin of the first contact array 102. Column.
如圖6(b)所示，第二接點陣列103包括兩種接點銷。 As shown in FIG. 6(b), the second contact array 103 includes two kinds of contact pins.
第一種接點銷分別包括一安裝部分403a-1、一接點部分403b、及一連接部分403c。一部分的第一種接點銷包括一線形接點部分403b，且其一部分具有一彎曲。當從上方觀察時，彎曲的形成致使安裝部分403a-1及接點部分403b並非位於相同直線上，但安裝部分403a-1平行接點部分403b但位於外側。在此實施例中，具有一彎曲的接點部分403b係垂直地彎曲兩 次。彎曲的數量及角度可依據實施例改變，或者彎曲可為一傾斜的斜面，但不受限於此。接點部分403b具有一如上述之彎曲，因為第一種接點銷的安裝部分403a-1係位於第一接點陣列102的最外側，同時形成與第一接點陣列102之安裝部分402a相同的列。 The first type of contact pins respectively include a mounting portion 403a-1, a contact portion 403b, and a connecting portion 403c. A portion of the first type of contact pin includes a linear contact portion 403b and a portion thereof has a bend. When viewed from above, the formation of the bending causes the mounting portion 403a-1 and the contact portion 403b not to lie on the same straight line, but the mounting portion 403a-1 is parallel to the contact portion 403b but is located outside. In this embodiment, the contact portion 403b having a bend is bent perpendicularly. Times. The number and angle of the bends may vary depending on the embodiment, or the bend may be a sloped slope, but is not limited thereto. The contact portion 403b has a bend as described above because the mounting portion 403a-1 of the first contact pin is located at the outermost side of the first contact array 102 while being formed the same as the mounting portion 402a of the first contact array 102. Column.
第二種接點銷分別包括一安裝部分403a-2、一接點部分403b、及一連接部分403c。第二種接點銷之接點部分403b與一對應的插頭連接器之一接點陣列形成一電接點。接點部分403b係耦合至第一絕緣體100之狹槽。第二種接點銷之接點部分403b具有一線形，且安裝部分403a-2係接近垂直接點部分403b。連接部分403c係接近垂直地連接至接點部分403b，並接近水平地連接至安裝部分403a-2。第二種接點銷之連接部分403c具有一向外或向內傾斜的彎曲，如圖6(b)所示。形成彎曲以便安裝部分403a-2可具有規則且長的節距。若不需要拉長節距間隔則可不形成彎曲。第一種接點銷之安裝部分403a-1係表面安裝至一印刷電路板並平行該印刷電路板。同時，第二種接點銷之安裝部分403a-2係***印刷電路板中並焊接至該處。 The second contact pins respectively include a mounting portion 403a-2, a contact portion 403b, and a connecting portion 403c. The contact portion 403b of the second contact pin forms an electrical contact with a contact array of a corresponding plug connector. The contact portion 403b is coupled to the slot of the first insulator 100. The contact portion 403b of the second contact pin has a linear shape, and the mounting portion 403a-2 is adjacent to the vertical contact portion 403b. The connecting portion 403c is connected to the contact portion 403b nearly vertically, and is connected to the mounting portion 403a-2 close to horizontal. The connecting portion 403c of the second contact pin has an outwardly or inwardly inclined curve as shown in Fig. 6(b). The bending is formed so that the mounting portion 403a-2 can have a regular and long pitch. If the pitch interval is not required to be elongated, no bending may be formed. The mounting portion 403a-1 of the first type of contact pin is surface mounted to a printed circuit board and parallel to the printed circuit board. At the same time, the mounting portion 403a-2 of the second contact pin is inserted into the printed circuit board and soldered thereto.
如圖6(c)所示，若第一及第二接點陣列102、103均耦合至第一絕緣體100，則第二接點陣列103之第一種接點銷的安裝部分403a-1係沿著節距方向位於與第一接點陣列102之接點銷的安裝部分402a相同的列。 As shown in FIG. 6(c), if the first and second contact arrays 102, 103 are both coupled to the first insulator 100, the mounting portion 403a-1 of the first contact pin of the second contact array 103 is The columns are located in the same direction as the mounting portion 402a of the contact pins of the first contact array 102 along the pitch direction.
圖7為顯示包括圖6所繪示之接點陣列之一插座連接器的底視圖。參照圖7，第二接點陣列103中所包括之第一種接點銷的安裝部分403a-1間歇地位於第一接點陣列102的安裝部分402a之中，並形成與第一接點陣列102之安裝部分402a相同的列。如圖7所示，可實施一在其中結合一列DIP焊接型接點銷及一列SMT型接點銷的安裝結構，且因此可有效率地縮減接點銷在印刷電路板上的安裝面積。 Figure 7 is a bottom plan view showing one of the socket connectors including the contact array illustrated in Figure 6. Referring to FIG. 7, the mounting portion 403a-1 of the first type of contact pins included in the second contact array 103 is intermittently located in the mounting portion 402a of the first contact array 102, and is formed with the first contact array. The mounting portion 402 of 102 has the same column. As shown in FIG. 7, a mounting structure in which a row of DIP soldering type contact pins and a column of SMT type contact pins are combined can be implemented, and thus the mounting area of the contact pins on the printed circuit board can be effectively reduced.
如上述，在安排接點銷時，須注意用於差動對訊號之接點銷(例如，TX2+、TX2-、D2+、D2-、RX1+、RX1-)的安裝部分須配置為彼此相鄰。用於差動對訊號的接點銷抵消由沿著相反方向施加之電場所導致的雜訊，且因此防止雜訊被轉移至另一接點銷。詳細地，參照圖6，第二接點陣列103中所包括之第一種接點銷的安裝部分403a-1的安排從左開始係由GND、VBUS、CC2、SBU2、VBUS、GND所構成。此外，第二接點陣列103中所包括之第二種接點銷的安裝部分403a-2從左開始係由TX2+、TX2-、D2+、D2-、RX1-、RX1+所構成。如上述，用於差動對訊號的接點銷的位置係彼此相鄰。 As described above, when arranging the contact pins, it should be noted that the mounting portions for the contact pins of the differential pair signal (for example, TX2+, TX2-, D2+, D2-, RX1+, RX1-) must be disposed adjacent to each other. The contact pin for the differential pair signal cancels the noise caused by the electrical field applied in the opposite direction, and thus prevents the noise from being transferred to the other contact pin. In detail, referring to FIG. 6, the arrangement of the mounting portion 403a-1 of the first type of contact pin included in the second contact array 103 is constituted by GND, VBUS, CC2, SBU2, VBUS, and GND from the left. Further, the mounting portion 403a-2 of the second contact pin included in the second contact array 103 is composed of TX2+, TX2-, D2+, D2-, RX1-, RX1+ from the left. As described above, the positions of the contact pins for the differential pair signals are adjacent to each other.
(1.3)接點陣列的第三範例 (1.3) Third example of a contact array
圖8為顯示根據本揭露之另一實施例之一接點陣列的圖。參照圖8，第一接點陣列102具有與圖6所繪示之第一接點陣列102相同的組態。同時，圖8所繪示之第二接點陣列103則不同於圖6的第二接點陣列103。詳細地，圖6之第二接點陣列103之位於兩外側的接點銷所具有的接點部分403b具有一彎曲，且安裝部分403a-1係位於與第一接點陣列102之安裝部分402a相同的列。然而，圖8之第二接點陣列103之位於兩外側的接點銷所具有的接點部分403b具有一線形而非一彎曲，且安裝部分403a-2並非位於與第一接點陣列102之安裝部分402a相同的列。換言之，圖8之第二接點陣列103之位於兩外側的接點銷為第二種接點銷。 FIG. 8 is a diagram showing a contact array in accordance with another embodiment of the present disclosure. Referring to FIG. 8, the first contact array 102 has the same configuration as the first contact array 102 illustrated in FIG. Meanwhile, the second contact array 103 illustrated in FIG. 8 is different from the second contact array 103 of FIG. In detail, the contact pins 403b of the contact pins on the outer sides of the second contact array 103 of FIG. 6 have a curvature, and the mounting portion 403a-1 is located at the mounting portion 402a of the first contact array 102. The same column. However, the contact pins 403b of the contact pins located at the outer sides of the second contact array 103 of FIG. 8 have a line shape instead of a bend, and the mounting portion 403a-2 is not located with the first contact array 102. The mounting portion 402a has the same column. In other words, the contact pins on the outer sides of the second contact array 103 of FIG. 8 are the second contact pins.
圖9為顯示包括圖8所繪示之接點陣列之一插座連接器的底視圖。參照圖9，第二接點陣列103中所包括之第一種接點銷的安裝部分403a-1間歇地位於第一接點陣列102的安裝部分402a之中，並位於與第一接點陣列102之安裝部分402a相同的列。如圖9所示，可實施一在其中結合一列DIP 焊接型接點銷及一列SMT型接點銷的安裝結構，且因此可有效率地縮減接點銷在印刷電路板上的安裝面積。 Figure 9 is a bottom plan view showing one of the socket connectors including the contact array illustrated in Figure 8. Referring to FIG. 9, the mounting portion 403a-1 of the first type of contact pins included in the second contact array 103 is intermittently located in the mounting portion 402a of the first contact array 102 and located in the first contact array. The mounting portion 402 of 102 has the same column. As shown in Figure 9, a DIP can be implemented in which a column is combined The mounting structure of the solder type contact pin and the column of the SMT type contact pin, and thus the mounting area of the contact pin on the printed circuit board can be effectively reduced.
如上述，在安排接點銷時，須注意用於差動對訊號之接點銷(例如，TX2+、TX2-、D2+、D2-、RX1+、RX1-)的安裝部分須配置為彼此相鄰。用於差動對訊號的接點銷抵消由沿著相反方向施加之電場所導致的雜訊，且因此防止雜訊被轉移至另一接點銷。詳細地，參照圖8，第二接點陣列103中所包括之第一種接點銷的安裝部分403a-1的安排從左開始係由VBUS、CC2、SBU2、VBUS所構成。此外，第二接點陣列103中所包括之第二種接點銷的安裝部分403a-2從左開始係由GND、TX2+、TX2-、D2+、D2-、RX1-、RX1+、GND所構成。如上述，用於差動對訊號的接點銷(TX2+、TX2-、D2+、D2-、RX1-、RX1+)的位置係彼此相鄰。 As described above, when arranging the contact pins, it should be noted that the mounting portions for the contact pins of the differential pair signal (for example, TX2+, TX2-, D2+, D2-, RX1+, RX1-) must be disposed adjacent to each other. The contact pin for the differential pair signal cancels the noise caused by the electrical field applied in the opposite direction, and thus prevents the noise from being transferred to the other contact pin. In detail, referring to Fig. 8, the arrangement of the mounting portion 403a-1 of the first type of contact pin included in the second contact array 103 is constituted by VBUS, CC2, SBU2, and VBUS from the left. Further, the mounting portion 403a-2 of the second contact pin included in the second contact array 103 is composed of GND, TX2+, TX2-, D2+, D2-, RX1-, RX1+, and GND from the left. As described above, the positions of the contact pins (TX2+, TX2-, D2+, D2-, RX1-, RX1+) for the differential pair signals are adjacent to each other.
(1.4)接點陣列的第四範例 (1.4) Fourth example of a contact array
圖10為顯示根據本揭露之另一實施例之一接點陣列的圖。參照圖10，第一接點陣列102具有與圖3所繪示之第一接點陣列102相同的組態。同時，圖10所繪示之第二接點陣列103則不同於圖3的第二接點陣列103。詳細地，圖3之第二接點陣列103之位於兩外側的接點銷所具有的接點部分103b具有一彎曲，且安裝部分103a-1係位於與第一接點陣列102之安裝部分102a相同的列。然而，圖10之第二接點陣列103之位於兩外側的接點銷所具有的接點部分103b具有一線形而非一彎曲，且安裝部分103a-2並非位於與第一接點陣列102之安裝部分102a相同的列。換言之，圖10之第二接點陣列103之位於兩外側的接點銷為第二種接點銷。 FIG. 10 is a diagram showing a contact array in accordance with another embodiment of the present disclosure. Referring to FIG. 10, the first contact array 102 has the same configuration as the first contact array 102 illustrated in FIG. Meanwhile, the second contact array 103 illustrated in FIG. 10 is different from the second contact array 103 of FIG. In detail, the contact pins 103b of the second contact array 103 of the second contact array 103 of FIG. 3 have a curved portion, and the mounting portion 103a-1 is located at the mounting portion 102a of the first contact array 102. The same column. However, the contact pins 103b of the second contact array 103 of the second contact array 103 of FIG. 10 have a linear shape instead of a bend, and the mounting portion 103a-2 is not located with the first contact array 102. The mounting portion 102a has the same column. In other words, the contact pins on the outer sides of the second contact array 103 of FIG. 10 are the second contact pins.
圖11為顯示包括圖10所繪示之接點陣列之一插座連接器的底視圖。參照圖11，第二接點陣列103中所包括之第一種接點銷的安裝部分103a-1間歇地位於第一接點陣列102的安裝部分102a之中，並位於與第一接 點陣列102之安裝部分102a相同的列。如圖11所示，可實施一在其中結合一列DIP焊接型接點銷及一列SMT型接點銷的安裝結構，且因此可有效率地縮減接點銷在印刷電路板上的安裝面積。 Figure 11 is a bottom plan view showing one of the socket connectors including the contact array illustrated in Figure 10. Referring to FIG. 11, the mounting portion 103a-1 of the first type of contact pin included in the second contact array 103 is intermittently located in the mounting portion 102a of the first contact array 102, and is located at the first connection The mounting portion 102a of the dot array 102 has the same column. As shown in FIG. 11, a mounting structure in which a row of DIP soldering type contact pins and a column of SMT type contact pins are combined can be implemented, and thus the mounting area of the contact pins on the printed circuit board can be effectively reduced.
如上述，在安排接點銷時，須注意用於差動對訊號之接點銷(例如，TX2+、TX2-、D2+、D2-、RX1+、RX1-)的安裝部分須配置為彼此相鄰。用於差動對訊號的接點銷抵消由沿著相反方向施加之電場所導致的雜訊，且因此防止雜訊被轉移至另一接點銷。詳細地，參照圖10，第二接點陣列103中所包括之第一種接點銷的安裝部分103a-1的安排係由位於左側的TX2+、TX2-及位於右側的RX1-及RX1+所構成，以便用於差動對訊號的接點銷的位置彼此相鄰。此外，第二接點陣列103中所包括之第二種接點銷的安裝部分103a-2從左開始係由GND、VBUS、CC2、D2+、D2-、SBU2、VBUS、GND所構成。此處，D2+及D2-的位置亦彼此相鄰。 As described above, when arranging the contact pins, it should be noted that the mounting portions for the contact pins of the differential pair signal (for example, TX2+, TX2-, D2+, D2-, RX1+, RX1-) must be disposed adjacent to each other. The contact pin for the differential pair signal cancels the noise caused by the electrical field applied in the opposite direction, and thus prevents the noise from being transferred to the other contact pin. In detail, referring to FIG. 10, the arrangement of the mounting portion 103a-1 of the first type of contact pin included in the second contact array 103 is composed of TX2+, TX2- on the left side and RX1- and RX1+ on the right side. So that the positions of the contact pins for the differential pair signal are adjacent to each other. Further, the mounting portion 103a-2 of the second contact pin included in the second contact array 103 is composed of GND, VBUS, CC2, D2+, D2-, SBU2, VBUS, and GND from the left. Here, the positions of D2+ and D2- are also adjacent to each other.
(1.5)接點陣列的第五範例 (1.5) Fifth example of a contact array
圖12為顯示根據本揭露之另一實施例之一接點陣列的圖。圖12之第一接點陣列102稍微不同於圖6的第一接點陣列102。在圖6的第一接點陣列102中，在具有線形接點部分402b之一接點銷及與其相鄰之具有彎曲接點部分402b之一接點銷的安裝部分402a之間形成一間隔，以在其中包括屬於第二接點陣列103之兩個接點銷的兩個安裝部分403a-1。然而，在圖12中，間隔係形成為包括僅單一個安裝部分403a-1。同時，圖12所繪示之第二接點陣列103稍微不同於圖6的第二接點陣列103。詳細地，圖6之第二接點陣列103中所包括之第一種接點銷的數量為六，但圖12之第二接點陣列103中所包括之第一種接點銷的數量為四。換言之，圖12之第二接點陣列103與一例子等效，其中在圖6之第二接點陣列103之第一種接點銷之中，從兩外部端數來的第二個接點銷被第二種接點銷，即DIP焊接型接點銷，所取代。 12 is a diagram showing a contact array in accordance with another embodiment of the present disclosure. The first contact array 102 of FIG. 12 is slightly different from the first contact array 102 of FIG. In the first contact array 102 of FIG. 6, a space is formed between a contact pin having one of the linear contact portions 402b and a mounting portion 402a having a contact pin of one of the curved contact portions 402b adjacent thereto. The two mounting portions 403a-1 including the two contact pins belonging to the second contact array 103 are included therein. However, in Fig. 12, the spacer is formed to include only a single mounting portion 403a-1. Meanwhile, the second contact array 103 illustrated in FIG. 12 is slightly different from the second contact array 103 of FIG. In detail, the number of the first type of contact pins included in the second contact array 103 of FIG. 6 is six, but the number of the first type of contact pins included in the second contact array 103 of FIG. 12 is four. In other words, the second contact array 103 of FIG. 12 is equivalent to an example in which the second contact from the two external ends among the first type of contact pins of the second contact array 103 of FIG. The pin is replaced by a second contact pin, a DIP welded contact pin.
圖13為顯示包括圖12所繪示之接點陣列之一插座連接器的底視圖。參照圖13，第二接點陣列103中所包括之第一種接點銷的安裝部分403a-1間歇地位於第一接點陣列102之中，並位於與第一接點陣列102之安裝部分402a相同的列。如圖13所示，可實施一在其中結合一列DIP焊接型接點銷及一列SMT型接點銷的安裝結構，且因此可有效率地縮減接點銷在印刷電路板上的安裝面積。 Figure 13 is a bottom plan view showing one of the socket connectors including the contact array illustrated in Figure 12. Referring to FIG. 13, the mounting portion 403a-1 of the first type of contact pins included in the second contact array 103 is intermittently located in the first contact array 102 and located in the mounting portion with the first contact array 102. 402a the same column. As shown in FIG. 13, a mounting structure in which a row of DIP soldering type contact pins and a column of SMT type contact pins are combined can be implemented, and thus the mounting area of the contact pins on the printed circuit board can be effectively reduced.
如上述，在安排接點銷時，須注意用於差動對訊號之接點銷(例如，TX2+、TX2-、D2+、D2-、RX1+、RX1-)的安裝部分須配置為彼此相鄰。用於差動對訊號的接點銷抵消由沿著相反方向施加之電場所導致的雜訊，且因此防止雜訊被轉移至另一接點銷。詳細地，參照圖12，第二接點陣列103中所包括之第一種接點銷的安裝部分403a-1的安排從左開始係由GND、CC2、SBU2、GND所構成。此外，第二接點陣列103中所包括之第二種接點銷的安裝部分403a-2從左開始係由TX2+、TX2-、VBUS、D2+、D2-、VBUS、RX1-、RX1+所構成。如上述，用於差動對訊號的接點銷(TX2+、TX2-、D2+、D2-、RX1-、RX1+)的位置係彼此相鄰。 As described above, when arranging the contact pins, it should be noted that the mounting portions for the contact pins of the differential pair signal (for example, TX2+, TX2-, D2+, D2-, RX1+, RX1-) must be disposed adjacent to each other. The contact pin for the differential pair signal cancels the noise caused by the electrical field applied in the opposite direction, and thus prevents the noise from being transferred to the other contact pin. In detail, referring to FIG. 12, the arrangement of the mounting portion 403a-1 of the first type of contact pin included in the second contact array 103 is constituted by GND, CC2, SBU2, and GND from the left. Further, the mounting portion 403a-2 of the second contact pin included in the second contact array 103 is composed of TX2+, TX2-, VBUS, D2+, D2-, VBUS, RX1-, RX1+ from the left. As described above, the positions of the contact pins (TX2+, TX2-, D2+, D2-, RX1-, RX1+) for the differential pair signals are adjacent to each other.
(1.6)接點陣列的第六範例 (1.6) Sixth example of a contact array
圖14為顯示根據本揭露之另一實施例之一接點陣列的圖。圖14之第一接點陣列102稍微不同於圖6的第一接點陣列102。在圖6的第一接點陣列102中，位於中心處並具有線形接點部分402b之接點銷的數量為二，但在圖14的第一接點陣列102中，此類接點銷的數量為四。此外，在圖6的第一接點陣列102中，在具有線形接點部分402b之一接點銷及與其相鄰之具有彎曲接點部分402b之一接點銷的安裝部分402a之間形成一間隔，以在其中包括屬於第二接點陣列103之接點銷的兩個安裝部分403a-1。同時，圖14之第一接點陣列102具有一在其中僅可包括單一個安裝部分403a-1的間隔。 14 is a diagram showing a contact array in accordance with another embodiment of the present disclosure. The first contact array 102 of FIG. 14 is slightly different from the first contact array 102 of FIG. In the first contact array 102 of FIG. 6, the number of contact pins located at the center and having the linear contact portions 402b is two, but in the first contact array 102 of FIG. 14, such contact pins are The number is four. Further, in the first contact array 102 of FIG. 6, a contact pin 402a having one of the linear contact portions 402b and a mounting portion 402a having a contact pin of one of the curved contact portions 402b adjacent thereto is formed. The spacing is to include therein two mounting portions 403a-1 belonging to the contact pins of the second contact array 103. Meanwhile, the first contact array 102 of FIG. 14 has an interval in which only a single mounting portion 403a-1 can be included.
圖14所繪示之第二接點陣列103稍微不同於圖6的第二接點陣列103。詳細地，圖6之第二接點陣列103中所包括之第一種接點銷的數量為六，但圖14之第二接點陣列103中所包括之第一種接點銷的數量為四。換言之，圖14之第二接點陣列103與一例子等效，其中在圖6之第二接點陣列103之第一種接點銷之中，從兩外部端數來的第三個接點銷被第二種接點銷，即DIP焊接型接點銷，所取代。 The second contact array 103 illustrated in FIG. 14 is slightly different from the second contact array 103 of FIG. In detail, the number of the first type of contact pins included in the second contact array 103 of FIG. 6 is six, but the number of the first type of contact pins included in the second contact array 103 of FIG. 14 is four. In other words, the second contact array 103 of FIG. 14 is equivalent to an example in which the third contact from the two external terminals is among the first type of contact pins of the second contact array 103 of FIG. The pin is replaced by a second contact pin, a DIP welded contact pin.
圖15為顯示包括圖14所繪示之接點陣列之一插座連接器的底視圖。參照圖15，第二接點陣列103中所包括之第一種接點銷的安裝部分403a-1間歇地位於第一接點陣列102的安裝部分402a之中，並位於與第一接點陣列102之安裝部分402a相同的列。如圖15所示，可實施一在其中結合一列DIP焊接型接點銷及一列SMT型接點銷的安裝結構，且因此可有效率地縮減接點銷在印刷電路板上的安裝面積。 Figure 15 is a bottom plan view showing one of the socket connectors including the contact array illustrated in Figure 14. Referring to FIG. 15, the mounting portion 403a-1 of the first type of contact pins included in the second contact array 103 is intermittently located in the mounting portion 402a of the first contact array 102 and located in the first contact array. The mounting portion 402 of 102 has the same column. As shown in FIG. 15, a mounting structure in which a row of DIP soldering type contact pins and a column of SMT type contact pins are combined can be implemented, and thus the mounting area of the contact pins on the printed circuit board can be effectively reduced.
如上述，在安排接點銷時，須注意用於差動對訊號之接點銷(例如，TX2+、TX2-、D2+、D2-、RX1+、RX1-)的安裝部分須配置為彼此相鄰。用於差動對訊號的接點銷抵消由沿著相反方向施加之電場所導致的雜訊，且因此防止雜訊被轉移至另一接點銷。詳細地，參照圖14，第二接點陣列103中所包括之第一種接點銷的安裝部分403a-1的安排從左開始係由GND、VBUS、VBUS、GND所構成。此外，第二接點陣列103中所包括之第二種接點銷的安裝部分403a-2從左開始係由TX2+、TX2-、CC2、D2+、D2-、SBU2、RX1-、RX1+所構成。如上述，用於差動對訊號的接點銷(TX2+、TX2-、D2+、D2-、RX1-、RX1+)的位置係彼此相鄰。 As described above, when arranging the contact pins, it should be noted that the mounting portions for the contact pins of the differential pair signal (for example, TX2+, TX2-, D2+, D2-, RX1+, RX1-) must be disposed adjacent to each other. The contact pin for the differential pair signal cancels the noise caused by the electrical field applied in the opposite direction, and thus prevents the noise from being transferred to the other contact pin. In detail, referring to FIG. 14, the arrangement of the mounting portion 403a-1 of the first type of contact pin included in the second contact array 103 is constituted by GND, VBUS, VBUS, and GND from the left. Further, the mounting portion 403a-2 of the second contact pin included in the second contact array 103 is composed of TX2+, TX2-, CC2, D2+, D2-, SBU2, RX1-, RX1+ from the left. As described above, the positions of the contact pins (TX2+, TX2-, D2+, D2-, RX1-, RX1+) for the differential pair signals are adjacent to each other.
2.板切斷型插座連接器 2. Board cut type socket connector
圖16為顯示根據本揭露之另一實施例之一插座連接器的分解透視圖。圖16所繪示之插座連接器的組件僅為一範例，在所屬技術領域中具有 通常知識者顯而易見的範圍內，圖16所繪示的組件可部分被排除或與其他組件交換，或可分開地增添任何進一步的組件。由與圖2相同之參考符號所指示之圖16的任一組件執行與圖2所繪示者相同的功能及操作。然而，圖16所繪示之插座連接器為一板切斷型插座連接器，且圖16所繪示之一些組件的形狀及結構與圖2的那些不同。印刷電路板對應圖16之插座連接器的形狀經部分地切割，且圖16的插座連接器係***印刷電路板的切割部分中。同時，圖2所繪示之插座連接器係放置在印刷電路板的表面上。因此，即使圖2所繪示之插座連接器的焊接部分106a位於殼體106的低端，圖16之插座連接器的焊接部分106a係位於殼體106的上端。此外，即使圖2的中板104具有一平面形狀，圖16之中板104具有一階梯形狀。此外，即使圖2之第二絕緣體101經組態以便接點陣列102、103係從其低端抽出，但圖16之第二絕緣體101經組態以便接點陣列102、103係從其上端抽出。第一接點陣列102經裝配以在第一絕緣體100的上部表面上形成一列，且第二接點陣列103經裝配為與第一接點陣列102隔開，以在第一絕緣體100的下部表面上形成一列。接點陣列102、103稍後將參照圖式詳細地敘述。 Figure 16 is an exploded perspective view showing a receptacle connector in accordance with another embodiment of the present disclosure. The components of the socket connector illustrated in FIG. 16 are merely examples, and have Within the obvious scope of the knowledge, the components illustrated in Figure 16 may be partially excluded or exchanged with other components, or any further components may be added separately. Any of the components of FIG. 16 indicated by the same reference numerals as in FIG. 2 perform the same functions and operations as those illustrated in FIG. 2. However, the socket connector illustrated in FIG. 16 is a board-cut socket connector, and the components and structures of the components illustrated in FIG. 16 are different from those of FIG. The shape of the printed circuit board corresponding to the socket connector of Fig. 16 is partially cut, and the socket connector of Fig. 16 is inserted into the cut portion of the printed circuit board. At the same time, the socket connector illustrated in Figure 2 is placed on the surface of the printed circuit board. Therefore, even if the welded portion 106a of the receptacle connector illustrated in FIG. 2 is located at the lower end of the housing 106, the welded portion 106a of the receptacle connector of FIG. 16 is located at the upper end of the housing 106. Further, even if the intermediate plate 104 of Fig. 2 has a planar shape, the plate 104 of Fig. 16 has a stepped shape. Moreover, even though the second insulator 101 of FIG. 2 is configured such that the contact arrays 102, 103 are withdrawn from their lower ends, the second insulator 101 of FIG. 16 is configured such that the contact arrays 102, 103 are extracted from their upper ends. . The first contact array 102 is assembled to form a column on the upper surface of the first insulator 100, and the second contact array 103 is assembled to be spaced apart from the first contact array 102 to be on the lower surface of the first insulator 100 Form a column on it. The contact arrays 102, 103 will be described in detail later with reference to the drawings.
圖17為詳細顯示圖16之插座連接器之一接點陣列的圖，其中圖17(a)顯示一第一接點陣列102，圖17(b)顯示一第二接點陣列103，且圖17(c)為平面圖，其由上方顯示第一接點陣列102及第二接點陣列103。 17 is a diagram showing in detail a contact array of the socket connector of FIG. 16, wherein FIG. 17(a) shows a first contact array 102, and FIG. 17(b) shows a second contact array 103, and FIG. 17(c) is a plan view showing the first contact array 102 and the second contact array 103 from above.
如圖17(a)所示，第一接點陣列102之接點銷分別包括一安裝部分1702a、一接點部分1702b、及一連接部分1702c。安裝部分1702a係表面安裝至一印刷電路板，平行該印刷電路板，並透過第二絕緣體101被抽出。接點部分1702b與一對應的插頭連接器之一接點陣列形成一電接點。接點部分1702b係耦合至第一絕緣體100之一狹槽。所有的接點部分1702b具有一線形。連接部分1702c連接安裝部分1702a至接點部分1702b。如圖17(a)所示， 安裝部分1702a及接點部分1702b係接近彼此平行，且連接部分1702c具有一「」形，其在上部及下部側具有彎曲，以提升安裝部分1702a與接點部分1702b相比的高度。此外，連接部分1702c接近垂直地連接至安裝部分1702a及接點部分1702b。此外，連接部分1702c係形成為具有一從接點部分1702b朝安裝部分1702a逐漸減少的寬度。當第一接點陣列102之安裝部分1702a及第二接點陣列103之部分安裝部分1703a-1沿著節距方向位於相同列時，逐漸減少的寬度縮減節距，以防止插座連接器的寬度增加。然而，若插座連接器的寬度無關緊要，則可不減少連接部分1702c的寬度。 As shown in FIG. 17(a), the contact pins of the first contact array 102 respectively include a mounting portion 1702a, a contact portion 1702b, and a connecting portion 1702c. The mounting portion 1702a is surface mounted to a printed circuit board, parallel to the printed circuit board, and drawn through the second insulator 101. The contact portion 1702b forms an electrical contact with a contact array of a corresponding plug connector. The contact portion 1702b is coupled to one of the slots of the first insulator 100. All of the contact portions 1702b have a linear shape. The connecting portion 1702c connects the mounting portion 1702a to the contact portion 1702b. As shown in Fig. 17 (a), the mounting portion 1702a and the contact portion 1702b are nearly parallel to each other, and the connecting portion 1702c has a "" The shape has a curvature on the upper and lower sides to increase the height of the mounting portion 1702a compared to the contact portion 1702b. Further, the connecting portion 1702c is nearly vertically connected to the mounting portion 1702a and the contact portion 1702b. Further, the connecting portion 1702c is formed to have a width gradually decreasing from the contact portion 1702b toward the mounting portion 1702a. When the mounting portion 1702a of the first contact array 102 and the partial mounting portion 1703a-1 of the second contact array 103 are located in the same column along the pitch direction, the decreasing width reduces the pitch to prevent the width of the socket connector. increase. However, if the width of the socket connector does not matter, the width of the connecting portion 1702c may not be reduced.
如圖17(b)所示，第二接點陣列103包括兩種接點銷。 As shown in FIG. 17(b), the second contact array 103 includes two kinds of contact pins.
第一種接點銷分別包括一安裝部分1703a-1、一接點部分1703b、及一連接部分1703c。第一種接點銷包括一接點部分1703b，其具有一彎曲形狀而非一線形。若從上方觀察到彎曲，則安裝部分1703a-1及接點部分1703b並非位於相同直線上，但安裝部分1703a-1係平行接點部分1703b處於比接點部分1703b更外部的位置。在此實施例中，彎曲具有一朝外傾斜的斜面形狀，但亦可實施為一直角形狀或其類似物。接點部分1703b具有彎曲，因為第一種接點銷的安裝部分1703a-1係位於第一接點陣列102的最外側，同時形成與第一接點陣列102之安裝部分1702a相同的列。第一種接點銷之連接部分1703c具有一具有上部及下部彎曲的「」，以提升安裝部分1703a-1與接點部分1703b相比的高度。 The first type of contact pins respectively include a mounting portion 1703a-1, a contact portion 1703b, and a connecting portion 1703c. The first type of contact pin includes a contact portion 1703b having a curved shape rather than a linear shape. If the bending is observed from above, the mounting portion 1703a-1 and the contact portion 1703b are not located on the same straight line, but the mounting portion 1703a-1 is a parallel contact portion 1703b at a position outside the contact portion 1703b. In this embodiment, the bend has an inclined shape that is inclined outward, but can also be implemented as a right-angle shape or the like. The contact portion 1703b has a bend because the mounting portion 1703a-1 of the first type of contact pin is located at the outermost side of the first contact array 102 while forming the same column as the mounting portion 1702a of the first contact array 102. The connecting portion 1703c of the first type of contact pin has a curved portion having an upper portion and a lower portion. To increase the height of the mounting portion 1703a-1 compared to the contact portion 1703b.
此外，第二接點陣列103之第二種接點銷分別包括一安裝部分1703a-2、一接點部分1703b、及一連接部分1703c。第二種接點銷之接點部分1703b與一對應的插頭連接器之一接點陣列形成一電接點。對應的接點部分1703b係耦合至第一絕緣體100之狹槽。第二種接點銷之接點部分1703b具有一線形，且安裝部分1703a-2係接近垂直接點部分1703b。第二種接點 銷之連接部分1702c具有一「」，以提升安裝部分1703a-2與接點部分1703b相比的高度。在此實施例中，第二種接點銷的連接部分1702c具有一朝外傾斜的斜面形狀，以增加安裝部分1703a-2之一間隔。第一種接點銷之安裝部分1703a-1係表面安裝至一印刷電路板並平行該印刷電路板。同時，第二種接點銷之安裝部分1703a-2係***印刷電路板中並焊接至該處。 In addition, the second contact pins of the second contact array 103 respectively include a mounting portion 1703a-2, a contact portion 1703b, and a connecting portion 1703c. The contact portion 1703b of the second contact pin forms an electrical contact with a contact array of a corresponding plug connector. The corresponding contact portion 1703b is coupled to the slot of the first insulator 100. The contact portion 1703b of the second contact pin has a linear shape, and the mounting portion 1703a-2 is adjacent to the vertical contact portion 1703b. The connecting portion 1702c of the second contact pin has a " To increase the height of the mounting portion 1703a-2 compared to the contact portion 1703b. In this embodiment, the connecting portion 1702c of the second contact pin has an inclined shape that is inclined outward to increase the interval of one of the mounting portions 1703a-2. The mounting portion 1703a-1 of the first type of contact pin is surface mounted to a printed circuit board and parallel to the printed circuit board. At the same time, the mounting portion 1703a-2 of the second contact pin is inserted into the printed circuit board and soldered thereto.
如圖17(c)所示，若第一及第二接點陣列102、103均耦合至第一絕緣體100，則第二接點陣列103之第一種接點銷的安裝部分1703a-1係沿著節距方向位於與第一接點陣列102之接點銷的安裝部分1702a相同的列。 As shown in FIG. 17(c), if the first and second contact arrays 102, 103 are both coupled to the first insulator 100, the mounting portion 1703a-1 of the first contact pin of the second contact array 103 is The columns are located in the same direction as the mounting portion 1702a of the contact pins of the first contact array 102 along the pitch direction.
圖18為顯示包括圖17所繪示之接點陣列之一插座連接器的裝配透視圖，且圖19為圖18之底視圖。 Figure 18 is an assembled perspective view showing one of the socket connectors including the contact array shown in Figure 17, and Figure 19 is a bottom view of Figure 18.
參照圖18及19，第一接點陣列102的安裝部分1702a及第二接點陣列103之第一種接點銷的安裝部分1703a-1係透過插座連接器之第二絕緣體101被抽出。此時，透過第二絕緣體101抽出之第二接點陣列103之第一種接點銷的安裝部分1703a-1係沿著節距方向位於與第一接點陣列102中所包括之接點銷的安裝部分1702a相同的列。如圖19所示，第二接點陣列103中所包括之第二種接點銷的安裝部分1703a-2係以DIP焊接型繪製，且第二接點陣列103之第一種接點銷的安裝部分1703a-1及第一接點陣列102之接點銷的安裝部分1702a係以SMT型繪製。若第二接點陣列103中所包括之一部分接點銷的安裝部分1703a-1如上述般地位於第一接點陣列102之安裝部分1702a的列，則第二接點陣列103之剩餘接點銷的安裝部分1703a-2可以一列設置。此接點銷安排可實現一在其中結合一列DIP焊接型接點銷及一列SMT型接點銷的安裝結構，其與在其中結合兩列DIP焊接型接點銷及一列SMT型接點銷之現存的安裝結構不同。因此，可有效地縮減印刷電路板上之接點銷的安裝面積。 Referring to Figures 18 and 19, the mounting portion 1702a of the first contact array 102 and the mounting portion 1703a-1 of the first contact pin of the second contact array 103 are withdrawn through the second insulator 101 of the receptacle connector. At this time, the mounting portion 1703a-1 of the first type of contact pins of the second contact array 103 drawn through the second insulator 101 is located along the pitch direction and the contact pin included in the first contact array 102. The mounting portion 1702a has the same column. As shown in FIG. 19, the mounting portion 1703a-2 of the second contact pin included in the second contact array 103 is drawn in a DIP solder type, and the first contact pin of the second contact array 103 is The mounting portion 1702a-1 and the mounting portion 1702a of the contact pin of the first contact array 102 are drawn in an SMT type. If the mounting portion 1703a-1 of one of the partial contact pins included in the second contact array 103 is located in the column of the mounting portion 1702a of the first contact array 102 as described above, the remaining contacts of the second contact array 103 The pin mounting portions 1703a-2 can be arranged in a row. The contact pin arrangement can realize a mounting structure in which a row of DIP welded type contact pins and a row of SMT type contact pins are combined, and the two columns of DIP welded type contact pins and one column of SMT type contact pins are combined therein. The existing installation structure is different. Therefore, the mounting area of the contact pins on the printed circuit board can be effectively reduced.
除了圖17所繪示之接點陣列102、103的接點安排之外，板切斷型插座連接器亦可具有如圖6至15所繪示之板上型插座連接器的接點銷安排。由於接點銷的安排已完全參照圖6至15予以敘述，此處便不再詳細敘述。 In addition to the contact arrangement of the contact arrays 102, 103 illustrated in FIG. 17, the board-cut receptacle connector may also have a contact pin arrangement of the on-board receptacle connector as illustrated in FIGS. 6-15. . Since the arrangement of the contact pins has been fully described with reference to Figs. 6 to 15, it will not be described in detail herein.
圖20為用於比較根據本發明之一實施例之一接點陣列與一現存的接點陣列在一印刷電路板上之安裝圖案的圖。圖20(a)為側視圖，顯示一現存的板上型插座連接器之接點陣列12、13被安裝至一印刷電路板2010。圖20(b)為側視圖，顯示根據本揭露之一實施例的板上型插座連接器之接點陣列102、103被安裝至印刷電路板2010。圖20(c)為側視圖，顯示根據本揭露之一實施例的板切斷型插座連接器之接點陣列102、103被安裝至印刷電路板2010。 20 is a diagram for comparing mounting patterns of a contact array and an existing contact array on a printed circuit board in accordance with an embodiment of the present invention. Figure 20 (a) is a side view showing the contact arrays 12, 13 of an existing on-board receptacle connector mounted to a printed circuit board 2010. Figure 20 (b) is a side view showing the contact arrays 102, 103 of the on-board receptacle connectors mounted to the printed circuit board 2010 in accordance with an embodiment of the present disclosure. Figure 20 (c) is a side view showing the contact arrays 102, 103 of the board-cut receptacle connector in accordance with an embodiment of the present disclosure mounted to the printed circuit board 2010.
參照圖20，現存的插座連接器係由一列SMT型接點銷及兩列DIP型接點銷所構成。然而，根據本揭露之一實施例之插座連接器係由一列SMT型接點銷及一列DIP型接點銷所構成。特別地，在根據本揭露之一實施例之插座連接器中，一部分的DIP型接點銷可變成SMT型並與SMT型接點銷安裝在相同的列，以減少佔據大安裝面積之DIP型接點銷的數量。因此，可縮減插座連接器的整個安裝面積。此外，由於接點銷的結構從三列縮減為兩列，可大為縮減整個插座連接器的長度。 Referring to Fig. 20, the existing socket connector is composed of a row of SMT type contact pins and two rows of DIP type contact pins. However, the socket connector according to an embodiment of the present disclosure is composed of a row of SMT type contact pins and a row of DIP type contact pins. In particular, in the socket connector according to an embodiment of the present disclosure, a part of the DIP type contact pin can be changed to the SMT type and installed in the same column as the SMT type contact pin to reduce the DIP type occupying a large mounting area. The number of contact pins. Therefore, the entire mounting area of the socket connector can be reduced. In addition, since the structure of the contact pins is reduced from three columns to two columns, the length of the entire receptacle connector can be greatly reduced.
本揭露已詳細敘述。不過，在指出本揭露之較佳實施例的同時，須了解詳細敘述與特定範例係僅經由說明方式給定，因為那些熟悉此項技術者當由此詳細敘述明白屬於本揭露之範圍內的各種變化及修改。 This disclosure has been described in detail. However, while the invention has been described with respect to the preferred embodiments of the present invention, it is to be understood that Changes and modifications.
Claims (14)
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| TW105101032A TWI650913B (en) | 2016-01-14 | 2016-01-14 | Receptacle connector including the improved contact array structure |
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| TW105101032A TWI650913B (en) | 2016-01-14 | 2016-01-14 | Receptacle connector including the improved contact array structure |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM476384U (en) * | 2013-10-18 | 2014-04-11 | Advanced Connectek Inc | Receptacle of electrical connector |
| US20140113481A1 (en) * | 2012-10-19 | 2014-04-24 | Hon Hai Precision Industry Co., Ltd. | Electrical connector with improved mating member having anti-mismating portion for preventing incorrect insertion |
| CN105140687A (en) * | 2015-09-17 | 2015-12-09 | 连展科技（深圳）有限公司 | Socket electric connector |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140113481A1 (en) * | 2012-10-19 | 2014-04-24 | Hon Hai Precision Industry Co., Ltd. | Electrical connector with improved mating member having anti-mismating portion for preventing incorrect insertion |
| TWM476384U (en) * | 2013-10-18 | 2014-04-11 | Advanced Connectek Inc | Receptacle of electrical connector |
| CN105140687A (en) * | 2015-09-17 | 2015-12-09 | 连展科技（深圳）有限公司 | Socket electric connector |
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