TWI650825B - Wafer processing machine and processing method thereof - Google Patents
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- 238000012545 processing Methods 0.000 title claims abstract description 59
- 238000003672 processing method Methods 0.000 title claims abstract description 29
- 230000002159 abnormal effect Effects 0.000 claims abstract description 86
- 238000004064 recycling Methods 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 29
- 238000011084 recovery Methods 0.000 claims abstract description 25
- 235000012431 wafers Nutrition 0.000 claims description 134
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- 230000005856 abnormality Effects 0.000 description 19
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- 238000003825 pressing Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
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Abstract
一種晶圓加工機及其加工處理方法，係由每一工作站內的感測器偵測工作站的工作狀態產生一正常狀態訊號或一異常狀態訊號，經由一控制裝置接收各工作站的感測器傳出的正常狀態訊號或異常狀態訊號，判斷該控制裝置是否收到至少一個異常狀態訊號，若收到至少一個異常狀態訊號，該控制裝置係產生一回收訊號控制一機械手臂執行一晶圓回收程序，反之該控制裝置係產生一驅動訊號控制一機械手臂執行一正常工作程序，所述晶圓回收程序先回收發出正常狀態訊號的工作站內的一晶圓，再回收發出異常狀態訊號的工作站內的另一晶圓。 A wafer processing machine and a processing method thereof for detecting a working state of a workstation by a sensor in each workstation to generate a normal state signal or an abnormal state signal, and receiving a sensor transmission of each workstation via a control device A normal status signal or an abnormal status signal is sent to determine whether the control device receives at least one abnormal status signal. If at least one abnormal status signal is received, the control device generates a recovery signal to control a robot arm to perform a wafer recycling procedure. Conversely, the control device generates a driving signal to control a robot arm to perform a normal working process, and the wafer recycling program first recovers a wafer in the workstation that sends out the normal state signal, and then recovers the workstation in the workstation that sends the abnormal state signal. Another wafer.
Description
本發明係有關一種晶圓加工機及其加工處理方法，特別是一種發生異常時優先回收正常狀態下工作站內的晶圓，再回收異常狀態下工作站內的晶圓之晶圓加工機及其加工處理方法。 The invention relates to a wafer processing machine and a processing method thereof, in particular to a wafer processing machine for processing a wafer in a workstation under normal conditions when an abnormality is recovered, and recycling a wafer in an abnormal state. Approach.
晶圓透過連續加工將電路製作於表面上，完成各種需求的電子零件，而晶圓的加工過程則視製作需求而定，但大多都會有多個步驟如壓合、冷卻及加熱等等步驟。 The wafer is fabricated on the surface by continuous processing to complete the electronic components of various requirements, and the processing of the wafer depends on the production requirements, but most of them have multiple steps such as pressing, cooling and heating.
當前的晶圓加工機，針對各個工作站的作業類型需求，會設置一些感測器來輔助作業，如壓力感測器以感測壓合的力量是否足夠、真空度感測器以感測工作站腔室是否密閉、溫度感測器以感測工作站腔室內的溫度是否足夠等等。 Current wafer processing machines, for the job type requirements of each workstation, some sensors are provided to assist the operation, such as the pressure sensor to sense whether the force of the pressing is sufficient, and the vacuum sensor to sense the workstation cavity. Whether the chamber is sealed, a temperature sensor to sense whether the temperature in the workstation chamber is sufficient, and the like.
當上述晶圓加工機的任一或多個工作站發生異常時，會使整個工作序列都停下來且晶圓停留在工作站內，並等待相關人員來排除異常，然而晶圓在每一個工作站內所能停留的時間是有一定的極限，當晶圓停留在某一工作站內的時間過長時晶圓損壞的機率就會越高，如停留在烤箱內時間太久導致晶圓過烤而報廢，因晶圓屬於高精密度且高價值的物件，任何的異常狀況都有可能導致晶圓損壞，而任一晶圓的損壞都是重大的損失。 When an abnormality occurs in any one or more of the above-mentioned wafer processing machines, the entire working sequence is stopped and the wafer stays in the workstation, and waiting for the relevant personnel to eliminate the abnormality, but the wafer is in each workstation. There is a certain limit to the time that can be stayed. When the wafer stays in a certain workstation for a long time, the probability of wafer damage will be higher. If it stays in the oven for too long, the wafer will be baked and scrapped. Because wafers are high-precision and high-value objects, any abnormal condition can cause wafer damage, and any wafer damage is a major loss.
是以，要如何解決上述之問題與缺失，即為本案之創作人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above problems and deficiencies, that is, the creators of the case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.
爰此，為有效解決上述之問題，本發明之主要目的在於提供一種具有異常時自動回收晶圓的晶圓加工機及其加工處理方法。 Accordingly, in order to effectively solve the above problems, it is a primary object of the present invention to provide a wafer processing machine that automatically recovers wafers with an abnormality and a processing method therefor.
本發明之另一主要目的在於提供一種依據異常狀況不同而自動調整晶圓回收順序的晶圓加工機及其加工處理方法。 Another main object of the present invention is to provide a wafer processing machine and a processing method thereof for automatically adjusting a wafer recycling sequence depending on an abnormal condition.
本發明之另一主要目的在於提供一種依據各工作站當前狀況不同而自動調整晶圓回收順序的晶圓加工機及其加工處理方法。 Another main object of the present invention is to provide a wafer processing machine and a processing method thereof for automatically adjusting the wafer recycling order according to the current situation of each workstation.
本發明之另一主要目的在於提供一種依據晶圓價值高低而自動調整晶圓回收順序的晶圓加工機及其加工處理方法。 Another main object of the present invention is to provide a wafer processing machine and a processing method thereof for automatically adjusting the wafer recycling order according to the wafer value.
為達上述之目的，本發明提供一種晶圓加工機，包含：一機械手臂；至少一工作站，每一工作站具有至少一感測器偵測該工作站的工作狀況產生一正常狀態訊號或一異常狀態訊號；一控制裝置，係與該機械手臂及該等工作站連接，且接收各工作站的感測器傳出的正常狀態訊號或異常狀態訊號，並根據該異常狀態訊號產生一回收訊號控制該機械手臂先回收發出正常狀態訊號的工作站內的一晶圓，再回收發出異常狀態訊號的工作站內的另一晶圓。 To achieve the above objective, the present invention provides a wafer processing machine comprising: a robot arm; at least one workstation, each workstation having at least one sensor detecting the working condition of the workstation to generate a normal state signal or an abnormal state a control device is connected to the robot arm and the workstations, and receives a normal state signal or an abnormal state signal transmitted from the sensors of each workstation, and generates a recovery signal according to the abnormal state signal to control the robot arm. First, a wafer in the workstation that sends out the normal status signal is recovered, and another wafer in the workstation that sends the abnormal status signal is recovered.
前述感測器係為壓力感測器、溫度感測器或真空度感測器其中任一或組合。 The aforementioned sensor is any one or combination of a pressure sensor, a temperature sensor or a vacuum sensor.
前述控制裝置包括：一輸入單元，用以接收該正常狀態訊號或該異常狀態訊號；一判斷單元，根據該等正常狀態訊號判斷所有處於正常狀態下工作站目前的工作狀態剩餘時間、內部剩餘空間及內部空間溫度產生一判斷結果；一規劃單元，由該判斷結果規劃晶圓回收的優先順序並產生一規劃結果；一驅動單 元，將該規劃結果轉換成該回收訊號；一輸出單元，用以輸出該回收訊號；一儲存單元，用以保存該規劃結果及儲存晶圓的回收記錄。 The control device includes: an input unit configured to receive the normal status signal or the abnormal status signal; a determining unit, determining, according to the normal status signals, all remaining working time, internal remaining space, and The internal space temperature produces a judgment result; a planning unit, the priority of the wafer recycling is planned by the judgment result and a planning result is generated; And converting the planning result into the recovery signal; an output unit for outputting the recovery signal; and a storage unit for storing the planning result and the recovery record of the storage wafer.
前述晶圓加工機更具有一總回收站，所述總回收站具有一容置空間用以容置回收後的所有晶圓。 The aforementioned wafer processing machine further has a total recycling station, and the total recycling station has an accommodating space for accommodating all the recovered wafers.
前述總回收站的容置空間大於或等於所有工作站的作業空間總和。 The storage space of the aforementioned total recycling station is greater than or equal to the sum of the working spaces of all workstations.
前述晶圓加工機更具有一異常警報器與該控制裝置連接且產生一異常警告訊號。 The wafer processor further has an abnormal alarm connected to the control device and generates an abnormal warning signal.
本發明另提供一種晶圓加工處理方法，包含：每一工作站的感測器偵測工作站的工作狀態產生一正常狀態訊號或一異常狀態訊號；經由一控制裝置接收各工作站的感測器傳出的正常狀態訊號或異常狀態訊號；該控制裝置是否收到至少一個異常狀態訊號；若是，該控制裝置係產生一回收訊號控制一機械手臂執行一晶圓回收程序；若否，該控制裝置係產生一驅動訊號控制一機械手臂執行一正常工作程序。 The invention further provides a wafer processing method, comprising: the sensor of each workstation detecting the working state of the workstation generates a normal state signal or an abnormal state signal; receiving the sensor transmitting of each workstation via a control device a normal status signal or an abnormal status signal; whether the control device receives at least one abnormal status signal; if so, the control device generates a recovery signal to control a robot arm to perform a wafer recovery procedure; if not, the control device generates A drive signal controls a robotic arm to perform a normal working procedure.
前述感測器係偵測該等工作站的壓力狀態、溫度狀態或真空度狀態其中任一或多個。 The aforementioned sensors detect any one or more of a pressure state, a temperature state, or a vacuum state of the workstations.
前述晶圓加工處理方法更包含：回收後的晶圓集中至一總回收站內加以保存。 The wafer processing method further includes: collecting the collected wafers into a total recycling station for storage.
前述晶圓回收程序包含：該機械手臂先回收發出正常狀態訊號的工作站內的一晶圓；該機械手臂再回收發出異常狀態訊號的工作站內的另一晶圓。 The wafer recycling process includes: the robot arm first recovers a wafer in a workstation that sends a normal status signal; and the robot arm reclaims another wafer in the workstation that sends an abnormal state signal.
前述晶圓加工處理方法更包含：該控制裝置經由一異常警報器產生一異常警告訊號，且該控制裝置同時進行一計時程序；該控制裝置判斷該計時程序結束前工作站異常狀態是否排除。 The wafer processing method further includes: the control device generates an abnormality warning signal via an abnormality alarm, and the control device simultaneously performs a timing program; the control device determines whether the abnormal state of the workstation is excluded before the timing program ends.
本發明之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。 The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
1‧‧‧工作站 1‧‧‧Workstation
11‧‧‧感測器 11‧‧‧ Sensor
12‧‧‧作業空間 12‧‧‧Workspace
2‧‧‧控制裝置 2‧‧‧Control device
21‧‧‧輸入單元 21‧‧‧ Input unit
22‧‧‧判斷單元 22‧‧‧judging unit
23‧‧‧規劃單元 23‧‧‧ Planning unit
24‧‧‧驅動單元 24‧‧‧Drive unit
25‧‧‧輸出單元 25‧‧‧Output unit
26‧‧‧儲存單元 26‧‧‧ storage unit
3‧‧‧機械手臂 3‧‧‧ Robotic arm
4‧‧‧總回收站 4‧‧‧ total recycling station
41‧‧‧容置空間 41‧‧‧ accommodating space
5‧‧‧異常警報器 5‧‧‧Abident alarm
S1、S2、S3、S31、S32、S4、S5、S6、S7、S8‧‧‧步驟 S1, S2, S3, S31, S32, S4, S5, S6, S7, S8‧‧
第1A圖為本發明晶圓加工機第一實施例之方塊示意圖；第1B圖為本發明控制裝置之方塊示意圖；第2圖為本發明晶圓加工機第二實施例之方塊示意圖；第3圖為本發明晶圓加工機第三實施例之方塊示意圖；第4圖為本發明晶圓加工機第四實施例之方塊示意圖；第5圖為本發明第一實施例之加工異常處理方法流程示意圖；第6圖為本發明第二實施例之加工異常處理方法流程示意圖；第7圖為本發明第三實施例之加工異常處理方法流程示意圖；第8圖為本發明第四實施例之加工異常處理方法流程示意圖； 1A is a block diagram of a first embodiment of a wafer processing machine of the present invention; FIG. 1B is a block diagram of a control device of the present invention; and FIG. 2 is a block diagram of a second embodiment of the wafer processing machine of the present invention; The figure is a block diagram of a third embodiment of the wafer processing machine of the present invention; FIG. 4 is a block diagram of a fourth embodiment of the wafer processing machine of the present invention; and FIG. 5 is a flow chart of the processing abnormal processing method according to the first embodiment of the present invention; FIG. 6 is a schematic flow chart of a processing abnormality processing method according to a second embodiment of the present invention; FIG. 7 is a schematic flow chart of a processing abnormal processing method according to a third embodiment of the present invention; and FIG. 8 is a fourth embodiment of the present invention. Schematic diagram of the exception handling method flow;
本發明之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。 The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
請參考第1A圖及第1B圖係為本發明晶圓加工機第一實施例之方塊示意圖及控制裝置之方塊示意圖，本發明之晶圓加工機包括：複數工作站1、一控制裝置2及一機械手臂3。 1A and 1B are block diagrams showing a block diagram and a control device of a first embodiment of a wafer processing machine according to the present invention. The wafer processing machine of the present invention comprises: a plurality of workstations 1, a control device 2 and a Robot arm 3.
該等工作站1例如但不限制為壓合設備、冷卻設備或加熱設備，每一工作站1皆具有至少一感測器11及一作業空間12，該感測器11依據工作站1所進行的工作選用適當的類型，例如為壓力感測器、溫度感測器或真空度感測器其 中任一或組合，該作業空間12用以容置晶圓，上述之感測器11偵測該工作站的工作狀況來產生一正常狀態訊號或一異常狀態訊號。 The workstations 1 are, for example but not limited to, a pressing device, a cooling device or a heating device. Each workstation 1 has at least one sensor 11 and a working space 12, and the sensor 11 is selected according to the work performed by the workstation 1. Suitable types, such as pressure sensors, temperature sensors or vacuum sensors The working space 12 is used to accommodate the wafer, and the sensor 11 detects the working condition of the workstation to generate a normal status signal or an abnormal status signal.
該控制裝置2例如但不限制為一電腦，該控制裝置2包含一輸入單元21、一判斷單元22、一規劃單元23、一驅動單元24、一輸出單元25及一儲存單元26，該輸入單元21與每一感測器11連接並接收該正常狀態訊號或該異常狀態訊號，該輸入單元21將這些正常或異常的狀態訊號傳給判斷單元22，該判斷單元22依據這些狀態訊號判斷所有處於正常狀態下工作站1目前工作狀態的剩餘時間、內部剩餘空間及內部空間溫度等條件以產生一判斷結果，該規劃單元23接收該判斷結果後並根據工作站內部剩餘的作業空間、晶圓當前溫度或晶圓價值等綜合因素規劃產生一規劃結果並傳給該儲存單元26及該驅動單元24，該驅動單元24將該規劃結果轉換成一回收訊號後傳給該輸出單元25，該輸出單元25將該回收訊號輸出給該機械手臂3，該儲存單元26用以保存該規劃結果及晶圓回收記錄，以便日後復工時各晶圓可接續回收程序前最後一個加工步驟，也便於相關人員處理異常時了解整個晶圓回收過程，上述影響晶圓回收順序的條件之優先程度可事先加以設定，例如根據加工機的規格類型或各晶圓價值等等自行加以設定，或由規劃單元23自行規畫產生最佳化的結果。 The control device 2 includes, for example but not limited to, a computer. The control device 2 includes an input unit 21, a determination unit 22, a planning unit 23, a driving unit 24, an output unit 25, and a storage unit 26. The input unit 21 is connected to each sensor 11 and receives the normal status signal or the abnormal status signal, and the input unit 21 transmits the normal or abnormal status signals to the determining unit 22, and the determining unit 22 determines that all of the status signals are based on the status signals. The condition of the remaining time of the current working state of the workstation 1 in the normal state, the internal remaining space, and the internal space temperature to generate a judgment result, and the planning unit 23 receives the judgment result and according to the remaining working space inside the workstation, the current temperature of the wafer, or The integrated factor planning such as wafer value generates a planning result and transmits the result to the storage unit 26 and the driving unit 24. The driving unit 24 converts the planning result into a recovery signal and transmits the result to the output unit 25, and the output unit 25 The recovery signal is output to the robot arm 3, and the storage unit 26 is configured to save the planning result and the wafer recovery record to In the future, each wafer can be recycled to the last processing step before the recycling process, and it is also convenient for the relevant personnel to understand the entire wafer recycling process when the abnormality is handled. The priority of the conditions affecting the wafer recycling sequence can be set in advance, for example, according to the processing. The specification type of the machine or the value of each wafer or the like is set by itself, or is planned by the planning unit 23 to produce an optimized result.
該機械手臂3與該輸出單元25連接並接收該回收訊號以進行一晶圓回收程序，該機械手臂3將各工作站1內的晶圓加以回收，所述機械手臂3先將發出正常狀態訊號的工作站1的晶圓回收，再回收發出異常狀態訊號的工作站1內的另一晶圓，所述機械手臂3可根據承載晶圓的需求任意替換對應的夾具或支架。 The robot arm 3 is connected to the output unit 25 and receives the recovery signal for performing a wafer recycling process. The robot arm 3 recovers the wafers in each workstation 1 , and the robot arm 3 first sends a normal status signal. The wafer of the workstation 1 is recovered, and another wafer in the workstation 1 that sends out an abnormal state signal is recovered. The robot arm 3 can arbitrarily replace the corresponding fixture or bracket according to the requirements of the carrier wafer.
請參考第2圖係為本發明晶圓加工機第二實施例之方塊示意圖，所述部分結構與前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第一實施 例最主要之差異為更具有一總回收站4，所述總回收站4具有一容置空間41用以容置回收後的所有晶圓，該總回收站4與該控制裝置2連結並回報容置空間41內當前的狀態如剩餘空間及溫度等，所述容置空間41大於或等於所有工作站1的作業空間12總和，以確保所有回收後的晶圓都能收入容置空間41內。 2 is a block diagram of a second embodiment of the wafer processing machine of the present invention. The partial structure is the same as that of the first embodiment, and therefore will not be described herein again. However, the present embodiment and the foregoing first embodiment are omitted. The main difference is that there is a total recycle bin 4 having an accommodating space 41 for accommodating all the recovered wafers. The total recycle bin 4 is connected to the control device 2 and returns The current state in the accommodating space 41, such as the remaining space and the temperature, is greater than or equal to the sum of the working spaces 12 of all the workstations 1 to ensure that all the recovered wafers can be included in the accommodating space 41.
請參考第3圖係為本發明晶圓加工機第三實施例之方塊示意圖，所述部分結構與前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第一實施例最主要之差異為更具有一異常警報器5與該控制裝置2連接且產生一異常警告訊號，該異常警告訊號可為但不限制如警報聲進行公開播送或錯誤訊息傳遞至遠端的另一主機供給相關人員得知，且同一時間內控制裝置2進行一計時程序，所述控制裝置2判斷該計時程序結束前各工作站1的異常狀態是否排除。 Please refer to FIG. 3, which is a block diagram of a third embodiment of the wafer processing machine of the present invention. The partial structure is the same as that of the first embodiment, and therefore will not be described herein again. However, the present embodiment and the foregoing first embodiment are omitted. The most important difference is that there is an abnormal alarm 5 connected to the control device 2 and an abnormal warning signal is generated, which can be, but is not limited to, a public broadcast such as an alarm sound or an error message transmitted to the remote end. A host is provided to the relevant personnel to know, and at the same time, the control device 2 performs a timing program, and the control device 2 determines whether the abnormal state of each workstation 1 before the end of the timing program is excluded.
請參考第4圖係為本發明晶圓加工機第四實施例之方塊示意圖，所述部分結構與前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第一實施例最主要之差異為更具有一總回收站4及一異常警報器5，該總回收站4及該異常警報器5各別與該控制裝置2連結，所述總回收站4具有一容置空間41用以容置回收後的所有晶圓，該容置空間41大於或等於所有工作站1的作業空間12總和，以確保所有回收後的晶圓都能收入容置空間41內，且該總回收站4回報容置空間41內當前的狀態如剩餘空間及溫度等供控制裝置2參考，該異常警報器5產生一異常警告訊號，該異常警告訊號可為但不限制如警報聲進行公開播送或錯誤訊息傳遞至遠端的另一主機供給相關人員得知，在同一時間內控制裝置2進行一計時程序，所述控制裝置2判斷該計時程序結束前各工作站1的異常狀態是否排除，當計時程序結束時且異常狀態尚未排除時，該機械手臂3將依序把晶圓回收到該總回收站4內加以保存。 4 is a block diagram of a fourth embodiment of the wafer processing machine of the present invention. The partial structure is the same as that of the first embodiment, and therefore will not be described herein again. However, the present embodiment and the foregoing first embodiment are omitted. The main difference is that there is a total recycle bin 4 and an abnormal alarm 5, and the total recycle bin 4 and the abnormal alarm 5 are respectively connected to the control device 2, and the total recycle bin 4 has an accommodation. The space 41 is used for accommodating all the recovered wafers, and the accommodating space 41 is greater than or equal to the sum of the working spaces 12 of all the workstations 1 to ensure that all the recovered wafers can be collected into the accommodating space 41, and the total The recycle station 4 returns the current state in the accommodating space 41, such as the remaining space and temperature, for reference by the control device 2, and the abnormal alarm 5 generates an abnormal warning signal, which can be, but is not limited to, publicly broadcasted as an alarm sound. Or the error message is transmitted to another host at the remote end to supply the relevant personnel to know that the control device 2 performs a timing program at the same time, and the control device 2 determines whether the abnormal state of each workstation 1 before the end of the timing program is In addition, when the end of the counting procedures and the abnormal state has not been ruled out, the robotic arm 3 in turn will be saved to the wafer reclaim 4 the total trash.
請參考第5圖係為本發明第一實施例之加工異常處理方法流程示意圖，並輔以參考第1A圖及第1B圖，本發明第一實施例之加工異常處理方法包含： 5 is a schematic flowchart of a processing abnormality processing method according to a first embodiment of the present invention, and with reference to FIG. 1A and FIG. 1B, the processing abnormal processing method according to the first embodiment of the present invention includes:
步驟S1：每一工作站的感測器偵測工作站的工作狀態產生一正常狀態訊號或一異常狀態訊號。如上所述各工作站1的感測器11針對當前的工作狀態產生正常狀態訊號或異常狀態訊號，而根據各工作站1的工作內容不同，該感測器11係偵測該等工作站1的壓力狀態、溫度狀態或真空度狀態其中任一或多個。 Step S1: The sensor of each workstation detects that the working state of the workstation generates a normal status signal or an abnormal status signal. As described above, the sensor 11 of each workstation 1 generates a normal state signal or an abnormal state signal for the current working state, and the sensor 11 detects the pressure state of the workstation 1 according to the work content of each workstation 1. , any one or more of a temperature state or a vacuum state.
步驟S2：經由一控制裝置接收各工作站的感測器傳出的正常狀態訊號或異常狀態訊號。如上所述由控制裝置2接收所有的感測器11傳來的正常狀態訊號或異常狀態訊號。 Step S2: receiving a normal status signal or an abnormal status signal transmitted by the sensors of each workstation via a control device. All of the normal state signals or abnormal state signals transmitted from the sensor 11 are received by the control device 2 as described above.
步驟S3：該控制裝置是否收到至少一個異常狀態訊號。如上所述控制裝置2確認是否有收到一個或以上的異常狀態訊號，進而判斷是否有任一或多個工作站1發生異常。 Step S3: Whether the control device receives at least one abnormal status signal. As described above, the control device 2 confirms whether one or more abnormal state signals have been received, thereby judging whether or not any one or more of the workstations 1 has an abnormality.
步驟S4：該控制裝置係產生一驅動訊號控制一機械手臂執行一正常工作程序。如上所述若控制裝置2沒有收到任何的異常狀態訊號，即代表各個工作站1當前處於無異常的狀態，此時控制裝置2則產生一驅動訊號來控制機械手臂3進行預定的工作行程。 Step S4: The control device generates a driving signal to control a robot arm to perform a normal working procedure. As described above, if the control device 2 does not receive any abnormal status signal, it means that each workstation 1 is currently in an abnormal state. At this time, the control device 2 generates a driving signal to control the robot arm 3 to perform a predetermined working stroke.
步驟S5：該控制裝置係產生一回收訊號控制一機械手臂執行一晶圓回收程序。如上所述若控制裝置2收到任何一個或多個異常狀態訊號，即代表某一工作站1或多個工作站1當前處於異常的狀態，此時控制裝置2將會根據各工作站1內部剩餘的作業空間、晶圓當前溫度或晶圓價值等綜合因素來規劃晶圓回收的順序，並產生回收訊號以控制機械手臂3執行晶圓回收程序。 Step S5: The control device generates a recovery signal to control a robot arm to perform a wafer recycling process. If the control device 2 receives any one or more abnormal status signals as described above, that is, the workstation 1 or the plurality of workstations 1 is currently in an abnormal state, the control device 2 will perform the remaining operations according to the internal workstations 1 . A combination of space, wafer current temperature or wafer value is used to plan the order of wafer recycling and generate recovery signals to control robot 3 to perform wafer recycling procedures.
上述步驟S5控制裝置2會依據一些不同的因素來規劃晶圓回收的順序，大致上可以分為空間因素、溫度因素及價值因素。 In the above step S5, the control device 2 plans the order of wafer recycling according to a number of different factors, which can be roughly divided into a space factor, a temperature factor and a value factor.
在以工作站1內的作業空間12作為限制因素時，當控制裝置2收到正常狀態訊號後由判斷單元22判讀這些正常狀態訊號後，確定各個發出正常狀態訊號工作站1當前工作狀況產生一判斷結果，由規劃單元23加以分析各工作站1當前正在進行的工作剩餘時間產生一規劃結果，由驅動單元24將該規劃結果轉換成對應的回收訊號後使機械手臂3執行晶圓回收程序。 When the working space 12 in the workstation 1 is used as a limiting factor, after the control device 2 receives the normal status signal, the determining unit 22 interprets the normal status signals, and determines that the current working status of each of the normal status signals is generated. The planning unit 23 analyzes the remaining time of the work currently being performed by each workstation 1 to generate a planning result, and the driving unit 24 converts the planning result into a corresponding recovery signal, and then causes the robot arm 3 to perform a wafer recycling process.
在以晶圓溫度作為限制因素時，當控制裝置2收到正常狀態訊號後由判斷單元22判讀這些正常狀態訊號後，確定各個發出正常狀態訊號工作站1當前內部剩餘空間產生一判斷結果，由規劃單元23加以分析判斷結果，並根據各個正常狀態下的工作站1當前的晶圓溫度產生一規劃結果，由驅動單元24將該規劃結果轉換成對應的回收訊號後使機械手臂3執行晶圓回收程序。 When the wafer temperature is used as a limiting factor, after the control device 2 receives the normal status signal, the determining unit 22 interprets the normal status signals, and determines that the current internal remaining space of the normal status signal station 1 generates a determination result. The unit 23 analyzes the judgment result, and generates a planning result according to the current wafer temperature of the workstation 1 in each normal state, and the driving unit 24 converts the planning result into a corresponding recovery signal, and causes the robot arm 3 to perform a wafer recycling procedure. .
在以晶圓價值作為限制因素時，當控制裝置2收到正常狀態訊號後由判斷單元22判讀這些正常狀態訊號後，確定各個發出正常狀態訊號工作站1當前設備是否良好產生一判斷結果，由規劃單元23加以分析判斷結果，並根據各個正常狀態下的工作站1當前的晶圓價值產生一規劃結果，由驅動單元24將該規劃結果轉換成對應的回收訊號後使機械手臂3執行晶圓回收程序。 When the value of the wafer is used as a limiting factor, after the control unit 2 receives the normal status signal, the determining unit 22 interprets the normal status signals, and determines whether the current device that sends the normal status signal station 1 is good to generate a judgment result. The unit 23 analyzes the judgment result, and generates a planning result according to the current wafer value of the workstation 1 in each normal state, and the driving unit 24 converts the planning result into a corresponding recovery signal, and causes the robot arm 3 to perform a wafer recycling procedure. .
控制裝置2根據上述空間因素、溫度因素及價值因素等綜合因素來規劃晶圓回收的順序，可擇一或多個限制條件來設定，例如以溫度因素做為單一限制條件下，晶圓都需先降溫完成後才可以回收；例如以溫度因素及價值因素做為多個限制條件下，價值高的晶圓優先降溫並回收，再降溫並回收其他價值次高 的晶圓；上述的限制條件可根據需求自行加以設定或由規劃單元23自行規畫產生最佳化的結果。 The control device 2 plans the order of wafer recycling according to the above-mentioned spatial factors, temperature factors and value factors, and can be set by one or more limiting conditions, for example, the temperature factor is used as a single limiting condition, and the wafer needs to be It can be recycled only after the temperature is lowered first; for example, under the condition of temperature factor and value factor, the wafer with high value is preferentially cooled and recovered, and then cooled and recovered to the next highest value. Wafers; the above restrictions can be set by themselves according to requirements or by the planning unit 23 to produce optimized results.
步驟S6：該機械手臂先回收發出正常狀態訊號的工作站內的一晶圓。如上所述機械手臂3執行晶圓回收程序，優先將發出正常狀態訊號的工作站內的晶圓優先回收。 Step S6: The robot arm first collects a wafer in the workstation that sends a normal status signal. As described above, the robot arm 3 performs a wafer recycling process to preferentially reclaim the wafers in the workstation that issued the normal status signal.
步驟S7：該機械手臂再回收發出異常狀態訊號的工作站內的另一晶圓。如上所述機械手臂3繼續執行晶圓回收程序，再將發出異常狀態訊號的工作站內的晶圓優先回收。 Step S7: The robot arm re-collects another wafer in the workstation that sends an abnormal state signal. As described above, the robot arm 3 continues to perform the wafer recycling process, and then the wafer in the workstation that issues the abnormal state signal is preferentially recovered.
上述步驟S6、S7優先回收發出正常狀態訊號工作站內的晶圓，再回收發出異常狀態訊號工作站內的晶圓，其目的是確保能回收到最多尚未因異常而做壞的晶圓，藉以降低因單一工作站1異常而導致整批晶圓產品做壞之損失。 The above steps S6 and S7 preferentially recover the wafers in the normal state signal workstation, and then reclaim the wafers in the abnormal state signal workstation, the purpose of which is to ensure that the wafers that have not been damaged by the abnormality can be recovered, thereby reducing the cause. A single workstation 1 is abnormal and causes a loss of the entire batch of wafer products.
請參考第6圖係為本發明第二實施例之加工異常處理方法流程示意圖，並輔以參考第2圖，所述部分方法與前述第一實施例之加工異常處理方法相同，故在此將不再贅述，惟本實施例之加工異常處理與前述第一實施例之加工異常處理最主要之差異為更具有： Please refer to FIG. 6 , which is a schematic flowchart of a processing abnormality processing method according to a second embodiment of the present invention, and supplemented with reference to FIG. 2 , the partial method is the same as the processing abnormal processing method of the first embodiment, and therefore It is not described again, but the main difference between the processing abnormal processing of the present embodiment and the processing abnormal processing of the foregoing first embodiment is:
步驟S8：回收後的晶圓集中至一總回收站內加以保存。如上所述總回收站4與控制裝置2連結並回報容置空間41當前的狀態如剩餘空間及溫度等，將回收後的晶圓全部集中到總回收站4內加以保存。 Step S8: The recovered wafers are concentrated in a total recycling station for storage. As described above, the total collection station 4 is connected to the control device 2 and returns the current state of the accommodation space 41 such as the remaining space and temperature, and the collected wafers are all collected in the total collection station 4 and stored.
請參考第7圖係為本發明第三實施例之加工異常處理方法流程示意圖，並輔以參考第3圖，所述部分方法與前述第一實施例之加工異常處理方法相同，故在此將不再贅述，惟本實施例之加工異常處理與前述第一實施例之加工異常處理最主要之差異為更具有： Please refer to FIG. 7 , which is a schematic flowchart of a processing abnormality processing method according to a third embodiment of the present invention, and supplemented with reference to FIG. 3 , the partial method is the same as the processing abnormal processing method of the first embodiment, and therefore It is not described again, but the main difference between the processing abnormal processing of the present embodiment and the processing abnormal processing of the foregoing first embodiment is:
步驟S31：該控制裝置經由一異常警報器產生一異常警告訊號，且該控制裝置同時進行一計時程序。如上所述控制裝置2連結一異常警報器5，當控制裝置2接收到一個以上的異常狀態訊號時進行一計時程序如倒數計時，其計時時間長短可根據需求自行設定例如十分鐘，同時間異常警報器5會發出一異常警告訊號例如警報聲或傳遞一錯誤訊息給進行遠端監控的另一主機，在這計時程序進行時間內異常警告訊號會持續的產生。 Step S31: The control device generates an abnormal warning signal via an abnormal alarm, and the control device simultaneously performs a timing program. As described above, the control device 2 is coupled to an abnormality alarm 5, and when the control device 2 receives more than one abnormal state signal, a timing program such as a countdown is performed, and the length of the time can be set according to requirements, for example, ten minutes, and the time is abnormal. The alarm 5 will send an abnormal warning signal such as an alarm sound or an error message to another host for remote monitoring, and an abnormal warning signal will continue to be generated during the timing of the timing.
步驟S32：該控制裝置判斷該計時程序結束前工作站異常狀態是否排除。如上所述在計時程序結束前，如有相關人員得知此訊息後來加以排除異常，則進行步驟S4以執行正常工作程序，如沒有計時程序結束時尚無相關人員處理或異常無法排除，則進行步驟S5以執行晶圓回收程序。 Step S32: The control device determines whether the abnormal state of the workstation is excluded before the end of the timing program. Before the end of the timing program as described above, if the relevant personnel knows that the message is subsequently excluded, the process proceeds to step S4 to execute the normal working procedure. If there is no timing program to end the fashion without relevant personnel processing or the abnormality cannot be excluded, the steps are performed. S5 to perform a wafer recycling process.
請參考第8圖係為本發明第四實施例之加工異常處理方法流程示意圖，並輔以參考第4圖，所述部分方法與前述第一實施例之加工異常處理方法相同，故在此將不再贅述，惟本實施例之加工異常處理與前述第一實施例之加工異常處理最主要之差異為更具有： Please refer to FIG. 8 is a schematic flow chart of a processing abnormality processing method according to a fourth embodiment of the present invention, and supplemented with reference to FIG. 4, the partial method is the same as the processing abnormal processing method of the first embodiment, and therefore It is not described again, but the main difference between the processing abnormal processing of the present embodiment and the processing abnormal processing of the foregoing first embodiment is:
步驟S31：該控制裝置經由一異常警報器產生一異常警告訊號，且該控制裝置同時進行一計時程序。如上所述控制裝置2連結一異常警報器5，當控制裝置2接收到一個以上的異常狀態訊號時進行一計時程序如倒數計時，其計時時間長短可根據需求設定自行設定例如十分鐘，同時間異常警報器5會發出一異常警告訊號例如警報聲或傳遞一錯誤訊息給進行遠端監控的另一主機，在這計時程序進行時間內異常警告訊號會持續的產生。 Step S31: The control device generates an abnormal warning signal via an abnormal alarm, and the control device simultaneously performs a timing program. As described above, the control device 2 is coupled to an abnormality alarm device 5. When the control device 2 receives more than one abnormal state signal, a timing program such as a countdown is performed. The length of the time can be set according to the demand setting, for example, ten minutes. The abnormal alarm 5 will send an abnormal warning signal such as an alarm sound or an error message to another host for remote monitoring, and the abnormal warning signal will continue to be generated during the timing of the timing.
步驟S32：該控制裝置判斷該計時程序結束前工作站異常狀態是否排除。如上所述在計時程序結束前，如有相關人員得知此訊息後來加以排除異常，則進 行步驟S4以執行正常工作程序，如沒有計時程序結束時尚無相關人員處理或異常無法排除，則進行步驟S5以執行晶圓回收程序。 Step S32: The control device determines whether the abnormal state of the workstation is excluded before the end of the timing program. As mentioned above, before the end of the timing program, if the relevant personnel knows that the message is subsequently excluded, then Step S4 is performed to execute the normal working procedure. If there is no timing program to end the fashion without relevant personnel processing or the abnormality cannot be eliminated, then step S5 is performed to execute the wafer recycling procedure.
步驟S8：回收後的晶圓集中至一總回收站內加以保存。如上所述總回收站4與控制裝置2連結並回報容置空間41當前的狀態如剩餘空間及溫度等，將回收後的晶圓全部集中到總回收站4內加以保存。 Step S8: The recovered wafers are concentrated in a total recycling station for storage. As described above, the total collection station 4 is connected to the control device 2 and returns the current state of the accommodation space 41 such as the remaining space and temperature, and the collected wafers are all collected in the total collection station 4 and stored.
藉由本發明的技術手段，本發明相較於當前晶圓加工機有下列優點：1、發生異常時自動回收所有晶圓；2、根據不同的異常狀況自動最佳化晶圓回收順序；3、根據各工作站當前狀況不同自動調整晶圓回收順序；4、根據晶圓價值高低而自動調整晶圓回收順序。 By the technical means of the present invention, the present invention has the following advantages compared with the current wafer processing machine: 1. automatically recovering all wafers when an abnormality occurs; 2. automatically optimizing the wafer recycling order according to different abnormal conditions; The wafer recycling sequence is automatically adjusted according to the current status of each workstation; 4. The wafer recycling sequence is automatically adjusted according to the wafer value.
以上已將本發明做一詳細說明，惟以上所述者，僅為本發明之一較佳實施例而已，當不能限定本發明實施之範圍。即凡依本發明申請範圍所作之均等變化與修飾等，皆應仍屬本發明之專利涵蓋範圍。 The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.
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| TW201338084A (en) * | 2012-03-14 | 2013-09-16 | Taiwan Semiconductor Mfg | Systems and methods of controlling semiconductor wafer fabrication processes |
| TW201433533A (en) * | 2012-11-22 | 2014-09-01 | Tokyo Electron Ltd | Substrate processing device, cover opening and closing mechanism, shielding mechanism, and chamber purging method |
| TW201600946A (en) * | 2014-06-27 | 2016-01-01 | 旺矽科技股份有限公司 | Apparatus of fully-auto loader and control method thereof |
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| TW201338084A (en) * | 2012-03-14 | 2013-09-16 | Taiwan Semiconductor Mfg | Systems and methods of controlling semiconductor wafer fabrication processes |
| TW201433533A (en) * | 2012-11-22 | 2014-09-01 | Tokyo Electron Ltd | Substrate processing device, cover opening and closing mechanism, shielding mechanism, and chamber purging method |
| TW201600946A (en) * | 2014-06-27 | 2016-01-01 | 旺矽科技股份有限公司 | Apparatus of fully-auto loader and control method thereof |
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