TWI650613B - Light source device and exposure device - Google Patents
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Abstract
目的在於提供一種光源裝置,該光源裝置係使用波長相異之複數種光源,而且不必以既定排列嚴密地配置光源。 It is an object of the invention to provide a light source device that uses a plurality of light sources of different wavelengths and that does not have to be closely arranged in a predetermined arrangement.
複數個LD模組1、2係各個包括一個LD(laser diode)與聚光透鏡,並射出波長相異的雷射光。各LD模組1、2之LD係由控制裝置99所控制,並控制點燈、熄燈以及其輸出(照度)。在第1光纖束部b1,射入該3個LD模組1與一個LD模組2之射出光,經由4條第1光纖5,再經由第1連接器6,聚光於一條第2光纖7。3條第2光纖7係更被引導至第2光纖束部b2,其射出端側以因應於對曝光頭18內的DMD56之光照射區域的形狀之排列導體圖案成束,並與第3光纖9連接,再經由第2連接器10,與入射光學系統40連接,而將雷射光引導至曝光裝置B的曝光頭18。 Each of the plurality of LD modules 1 and 2 includes an LD (laser diode) and a collecting lens, and emits laser light having different wavelengths. The LD of each LD module 1, 2 is controlled by the control device 99, and controls lighting, turning off the light, and its output (illuminance). In the first fiber bundle portion b1, the light emitted from the three LD modules 1 and the one LD module 2 is incident on the first optical fiber 5, and then condensed on the second optical fiber via the first connector 6. 7. The third optical fiber 7 is further guided to the second fiber bundle portion b2, and the emission end side is bundled in accordance with the arrangement of the conductor patterns in the shape of the light irradiation region of the DMD 56 in the exposure head 18, and The optical fiber 9 is connected, and is connected to the incident optical system 40 via the second connector 10 to guide the laser light to the exposure head 18 of the exposure device B.
Description
本發明係有關於適合用於印刷基板、半導體晶圓、液晶顯示器等在根據光微影法之曝光步驟所使用之直接描繪方法的光源裝置及曝光裝置。 The present invention relates to a light source device and an exposure device suitable for use in a direct drawing method used in an exposure step of a photolithography method, such as a printed substrate, a semiconductor wafer, or a liquid crystal display.
以往,在使用光微影法來產生電路圖案之所謂的曝光步驟廣為使用使用光罩之密接式曝光裝置,但是近年來,為了配合高密度化,逐漸使用未使用光罩之DMD(digital micro mirror device,數位微反射鏡組件)等的光調變元件來調變光並進行曝光的直繪式曝光裝置(專利文獻1)。 Conventionally, a so-called exposure step using a photolithography method to generate a circuit pattern has been widely used as a close-contact exposure apparatus using a photomask. However, in recent years, in order to cope with high density, a DMD (digital micro) which does not use a photomask is gradually used. A direct-drawing type exposure apparatus in which a light modulation element such as a mirror device or a digital micromirror device adjusts light and performs exposure (Patent Document 1).
可是,此直繪式曝光裝置所使用之光源係為了作成可產生高精細的圖案,單波長的情況多。另一方面,在被曝光之抗蝕劑有具有寬波長帶之靈敏度者,亦有在單波長未充分地硬化的情況或曝光時間變長的情況。 However, the light source used in the direct-drawing apparatus is often designed to produce a high-definition pattern, and a single wavelength is often used. On the other hand, in the case where the exposed resist has sensitivity to a wide wavelength band, there is a case where the single wavelength is not sufficiently cured or the exposure time becomes long.
因此,如專利文獻2所示,提議一種光源裝置,該光源裝置係使用具有複數種相異之波長特性的光,並藉透鏡聚光的構成。 Therefore, as disclosed in Patent Document 2, a light source device is proposed which uses light having a plurality of different wavelength characteristics and is condensed by a lens.
[專利文獻1]日本特開2006-267719 [Patent Document 1] Japanese Patent Laid-Open No. 2006-267719
[專利文獻2]日本特開2012-063390 [Patent Document 2] Japanese Special Open 2012-063390
可是,在使用波長相異之複數種光源與透鏡之構成的情況,需要以既定排列嚴密地配置光源之光源陣列與透鏡陣列,而具有裝置變得複雜之問題。 However, in the case where a plurality of types of light sources and lenses having different wavelengths are used, it is necessary to closely arrange the light source array and the lens array of the light source in a predetermined arrangement, which has a problem that the apparatus becomes complicated.
本發明之目的在於解決這種習知技術的缺點。 It is an object of the present invention to address the shortcomings of this prior art.
為了達成該目的,本發明之特徵為具有:一個雷射二極體,係射出具有既定波長特性之雷射光;別的雷射二極體,係射出具有與該既定波長特性相異之別的波長特性之雷射光;複數條第1光纖束,係具有:一條第1光纖,係使來自該一個雷射二極體之射出光在入射端射入並在射出端射出;別的第1光纖,係使來自該別的雷射二極體之射出光在入射端射入並在射出端射出;以及第2光纖,係使該一條與別的第1光纖之射出光聚光;並使該一條第1光纖與該別的第1光纖的射出端側以既定排列成束,而使該一條與別的第1光纖之射出光聚光後,射入該第2光纖的入射端;第2光纖束,係具有將該第2光纖之射出光聚光的第3光纖,並使該複數條第1光纖束部的複數條第2光纖的射出端側以既定排列成束,而使各第2光纖之射出光聚光後,射入該第3光纖的入射端;以及輸出部,係與該第3光纖之輸出端連接,並用以輸出至外部。 In order to achieve the object, the present invention is characterized in that: a laser diode emits laser light having a predetermined wavelength characteristic; and another laser diode emits light having a different characteristic from the predetermined wavelength. a laser beam having a wavelength characteristic; the plurality of first fiber bundles having: a first optical fiber that emits light from the one laser diode at an incident end and emits at an emission end; another first optical fiber Emitting the emitted light from the other laser diode at the incident end and emitting it at the emitting end; and the second optical fiber condensing the emitted light from the other first optical fiber; a first optical fiber and an emission end side of the other first optical fiber are bundled in a predetermined arrangement, and the emitted light of the first optical fiber and the other first optical fiber is condensed, and then incident on the incident end of the second optical fiber; The optical fiber bundle has a third optical fiber that condenses the light emitted from the second optical fiber, and the emission end sides of the plurality of second optical fibers of the plurality of first optical fiber bundle portions are bundled in a predetermined arrangement. 2, after the light emitted by the optical fiber is concentrated, the incident end of the third optical fiber is injected; and the output portion And connected to the output end of the third optical fiber and used for output to the outside.
在該雷射二極體,具備個別地進行點燈、熄燈控制與輸出控制之至少一種的控制裝置較佳。又,在該雷射二極體,具備 對各既定組進行點燈、熄燈控制與輸出控制之至少一種的控制裝置較佳。 It is preferable that the laser diode has a control device that performs at least one of lighting, light-off control, and output control individually. Moreover, in the laser diode, A control device that performs at least one of lighting, light-off control, and output control for each predetermined group is preferable.
進而,本發明之曝光裝置係藉排列各個獨立地調變之多個像素部的空間光調變元件調變從光源裝置所發射之光,並藉該調變之光使感光材料進行曝光的曝光裝置,其特徵為使用該光源裝置。 Furthermore, the exposure apparatus of the present invention modulates the light emitted from the light source device by arranging the spatial light modulation elements of the plurality of pixel portions independently modulated, and exposes the photosensitive material by the modulated light. A device characterized by the use of the light source device.
若依據本發明之光源裝置及曝光裝置,因為成為由複數種波長所混合之曝光波長的光源,所以可應付廣範圍之抗蝕劑。又,不必以既定排列嚴密地配置光源,亦不需要透鏡陣列,而可簡化裝置。又,可簡單地增設雷射二極體,而可簡單地進行高照度化。 According to the light source device and the exposure device of the present invention, since it is a light source having an exposure wavelength mixed by a plurality of wavelengths, it is possible to cope with a wide range of resists. Moreover, it is not necessary to arrange the light source strictly in a predetermined arrangement, and a lens array is not required, and the apparatus can be simplified. Further, the laser diode can be simply added, and the high illumination can be easily performed.
若更設置控制裝置,進行雷射二極體之點燈控制或輸出控制,可變更各波長之照度比例,具有可提供最佳之曝光條件等的效果。 If the control device is further provided and the lighting control or output control of the laser diode is performed, the illuminance ratio of each wavelength can be changed, and the effect of providing optimum exposure conditions and the like can be obtained.
1‧‧‧LD模組 1‧‧‧LD module
2‧‧‧LD模組 2‧‧‧LD module
3‧‧‧LD光纖 3‧‧‧LD fiber
4‧‧‧連接器 4‧‧‧Connector
5‧‧‧第1光纖 5‧‧‧1st fiber
6‧‧‧第1連接器 6‧‧‧1st connector
7‧‧‧第2光纖 7‧‧‧2nd fiber
9‧‧‧第3光纖 9‧‧‧3rd fiber
10‧‧‧第2連接器 10‧‧‧2nd connector
12‧‧‧基板(曝光對象) 12‧‧‧Substrate (exposure target)
14‧‧‧曝光部 14‧‧‧Exposure Department
18‧‧‧曝光頭 18‧‧‧Exposure head
19‧‧‧光源單元 19‧‧‧Light source unit
40‧‧‧入射光學系統 40‧‧‧Infrared optical system
41‧‧‧光調變部 41‧‧‧Light Modulation Department
42‧‧‧第1成像光學系統 42‧‧‧1st imaging optical system
43‧‧‧微透鏡陣列 43‧‧‧Microlens array
43a‧‧‧微透鏡 43a‧‧‧microlens
44‧‧‧孔徑陣列 44‧‧‧Aperture Array
44a‧‧‧孔徑 44a‧‧‧Aperture
45‧‧‧第2成像光學系統(投影光學系統) 45‧‧‧2nd imaging optical system (projection optical system)
56‧‧‧DMD(空間光調變元件) 56‧‧‧DMD (Space Light Modulation Element)
99‧‧‧控制裝置 99‧‧‧Control device
b1‧‧‧第1光纖束部 B1‧‧‧1st fiber bundle
b2‧‧‧第2光纖束部 B2‧‧‧2nd fiber bundle
A‧‧‧光源裝置 A‧‧‧Light source device
B‧‧‧曝光裝置 B‧‧‧Exposure device
第1圖係表示本發明之光源裝置之一實施形態的構成圖。 Fig. 1 is a view showing the configuration of an embodiment of a light source device of the present invention.
第2圖係表示本發明之曝光裝置之一實施形態的立體圖。 Fig. 2 is a perspective view showing an embodiment of an exposure apparatus of the present invention.
第3圖係示意地表示在本發明之曝光裝置的一實施形態之曝光頭的構成之說明圖。 Fig. 3 is an explanatory view schematically showing the configuration of an exposure head according to an embodiment of the exposure apparatus of the present invention.
以下,說明本發明之實施形態。 Hereinafter, embodiments of the present invention will be described.
此光源裝置係基本上成為將從複數個波長相異之雷射二 極體所射出的光聚光並引入光纖,在引導至各個後,在其光路中途使數條成束,再以連接器與比其粗之光纖連接而混合的構成。 The light source device is basically a laser that will differ from a plurality of wavelengths. The light emitted from the polar body is condensed and introduced into the optical fiber, and after being guided to each, a plurality of bundles are bundled in the middle of the optical path, and then the connector is connected to the thicker optical fiber to be mixed.
以下,根據第1圖至第3圖,詳細地說明。 Hereinafter, the details will be described based on the first to third figures.
如第1圖所示,光源裝置A包括複數個LD模組1、2。各LD模組1、2包括一個雷射二極體(LD:laser diode)與聚光透鏡。LD模組1與LD模組2係具備射出波長相異(波長A、波長B)之雷射光的LD,在本實施形態,將3個波長A之LD模組1與1個波長B之LD模組2作為一組,並具備12個之共3組的LD模組1、2,並以LD光纖3將各LD模組1、2引導至連接器4。 As shown in FIG. 1, the light source device A includes a plurality of LD modules 1, 2. Each of the LD modules 1 and 2 includes a laser diode (LD) and a collecting lens. The LD module 1 and the LD module 2 are provided with LDs that emit laser light having different wavelengths (wavelength A and wavelength B). In the present embodiment, the LD module 1 of three wavelengths A and the LD of one wavelength B are used. The module 2 is a group and has three groups of LD modules 1 and 2, and the LD modules 1 and 2 are guided to the connector 4 by the LD fiber 3.
又,LD模組1、2之LD的波長採用具有190~530nm之波長特性者較佳。 Further, it is preferable that the wavelengths of the LDs of the LD modules 1 and 2 have a wavelength characteristic of 190 to 530 nm.
在本實施形態,LD模組1之LD的波長A具有在375nm附近具有尖峰值的波長特性,LD模組2之LD的波長B具有在405nm附近具有尖峰值的波長特性。 In the present embodiment, the wavelength A of the LD of the LD module 1 has a wavelength characteristic having a sharp peak near 375 nm, and the wavelength B of the LD of the LD module 2 has a wavelength characteristic having a sharp peak near 405 nm.
各LD模組1、2之LD係藉控制裝置99控制,並構成為控制其點燈、熄燈以及其輸出(照度)。LD模組1、2之各LD係亦可構成為藉控制裝置99個別地控制,亦可構成為藉控制裝置99分組地控制。 The LDs of the LD modules 1 and 2 are controlled by the control device 99, and are configured to control their lighting, turning off the lights, and their outputs (illuminance). The LDs of the LD modules 1 and 2 may be configured to be individually controlled by the control device 99, or may be configured to be controlled in groups by the control device 99.
第1光纖束部b1之第1光纖5與各連接器4連接,並構成為來自LD模組1、2之LD的射出光在第1光纖5的入射端射入,進而,在其射出端射出。第1光纖束部b1包括第1光纖5、第1連接器6以及第2光纖7。 The first optical fiber 5 of the first optical fiber bundle portion b1 is connected to each of the connectors 4, and the light emitted from the LDs of the LD modules 1 and 2 is incident on the incident end of the first optical fiber 5, and further, at the emission end thereof. Shoot out. The first fiber bundle portion b1 includes the first optical fiber 5, the first connector 6, and the second optical fiber 7.
構成為該3個LD模組1與1個LD模組2的射出光射入第1光纖束部b1,經由4條該第1光纖5,再經由第1連接器6,聚光於一條第2光纖7。 The light emitted from the three LD modules 1 and the one LD module 2 is incident on the first fiber bundle portion b1, and is condensed in the first via the first connector 6 through the four first fibers 5 2 fiber 7.
各LD模組1、2之第1光纖5係其射出端側以既定排列成束,再經由第1連接器6與1個第2光纖7連接。 The first optical fibers 5 of the LD modules 1 and 2 are bundled in a predetermined arrangement on the emission end side, and are connected to one second optical fiber 7 via the first connector 6.
第2光纖7係具有與使第1光纖5在4條成束之狀態的光射出區域同等以上之大小的芯,如上述所示,將來自4個LD模組1、2之光聚光於一條第2光纖7。 The second optical fiber 7 has a core having a size equal to or larger than that of the light-emitting region in which the first optical fibers 5 are bundled in four bundles. As described above, the light from the four LD modules 1 and 2 is condensed. A second optical fiber 7.
在本實施形態,具備3個第1光纖束部b1,在3個第1光纖束部b1,將共12個之LD模組1、2聚光於3條第2光纖7。 In the present embodiment, three first fiber bundle portions b1 are provided, and a total of twelve LD modules 1 and 2 are collected by the three first fiber bundles 7 in the three first fiber bundle portions b1.
此第2光纖7係多模態光纖,並構成為藉在光纖內之光的干涉或模式間的相互作用進行均勻化。 The second optical fiber 7 is a multi-mode optical fiber and is configured to be uniformed by interference of light in the optical fiber or interaction between modes.
3條第2光纖7係更被引導至第2光纖束部b2,其射出端側成為以因應於對後述之曝光頭18內的DMD56之光照射區域的形狀之排列導體圖案成束的第3光纖9。 The third optical fiber 7 is guided to the second optical fiber bundle portion b2, and the emission end side is the third bundled with the aligned conductor pattern in the shape of the light irradiation region of the DMD 56 in the exposure head 18 to be described later. Optical fiber 9.
此3條第2光纖7所成束的第3光纖9構成為其射出端側經由第2連接器10與入射光學系統40連接,並將雷射光引導至曝光裝置B之曝光頭18。 The third optical fiber 9 bundled by the three second optical fibers 7 is configured such that the emission end side thereof is connected to the incident optical system 40 via the second connector 10, and the laser beam is guided to the exposure head 18 of the exposure device B.
此外,在該實施形態,表示使用2種波長之雷射光的例子,但是亦可是更多種波長,又,亦可藉由適當地增設LD模組1、2,提高裝置之輸出。 Further, in this embodiment, an example in which laser light of two kinds of wavelengths is used is shown, but a wider variety of wavelengths may be used, and the output of the device may be increased by appropriately adding the LD modules 1 and 2.
以上所說明之光源裝置A係因為使第1光纖5、第2光纖7之射出端側成束,而將來自LD模組1、2之雷射光 合成,所以不必將LD模組1、2排列於既定位置,而各LD模組1、2係可獨立地配置。因此,LD模組1、2之設置的自由度提高。 In the light source device A described above, the laser light from the LD modules 1 and 2 is bundled by forming the emission end sides of the first optical fiber 5 and the second optical fiber 7 Since it is synthesized, it is not necessary to arrange the LD modules 1 and 2 at a predetermined position, and each of the LD modules 1 and 2 can be independently arranged. Therefore, the degree of freedom in setting the LD modules 1 and 2 is improved.
又,藉控制裝置99控制LD模組1、2之LD的點燈個數或輸出,藉此,可變更各波長之照度比例,而可提供所需之最佳的曝光條件。 Further, by controlling the number of lighting or output of the LDs of the LDs of the LD modules 1 and 2 by the control device 99, the illuminance ratio of each wavelength can be changed, and the optimum exposure conditions required can be provided.
根據第2圖,說明使用該光源裝置A之數位曝光裝置(影像曝光裝置)B的構成。 The configuration of the digital exposure device (image exposure device) B using the light source device A will be described based on Fig. 2 .
曝光裝置B包括:底座11,係形成大致長方形的平板,並水平地配置;移動工作台13,係滑動自如地安裝於該底座11,並在表面吸附固持成為曝光對象的基板12;以及曝光部14,係對該移動工作台13所固持之基板12進行曝光。 The exposure apparatus B includes a base 11 which is formed into a substantially rectangular flat plate and is horizontally disposed, and a movable table 13 which is slidably attached to the base 11 and which adsorbs and holds the substrate 12 to be exposed on the surface; and an exposure section 14. Exposing the substrate 12 held by the moving table 13 to the substrate 12.
基板12係例如表面被塗布或黏合感光材料之印刷配線基板或平板顯示器用玻璃基板等。此數位曝光裝置B係藉由對如上述所示之基板12進行曝光,而例如以無遮罩將配線圖案等記錄於基板12的感光材料。此外,在本實施形態,在說明中,將移動工作台13之移動方向設為Y方向、將在水平面上與Y方向正交的方向設為X方向(基板12之寬度方向),並將與水平面正交的鉛垂方向設為Z方向。底座11係以在Y方向長之方式所形成。 The substrate 12 is, for example, a printed wiring board on which a photosensitive material is applied or bonded, or a glass substrate for a flat panel display. The digital exposure device B exposes the substrate 12 as described above, and the photosensitive material is recorded on the substrate 12 by, for example, a wiring pattern or the like without a mask. Further, in the present embodiment, in the description, the moving direction of the moving table 13 is referred to as the Y direction, and the direction orthogonal to the Y direction in the horizontal plane is referred to as the X direction (the width direction of the substrate 12), and The vertical direction orthogonal to the horizontal plane is set to the Z direction. The base 11 is formed to be long in the Y direction.
底座11係藉安裝於四角落之各角落的腳部115所支撐。與Y方向大致平行之2支導軌16設置於底座11的上面11a。移動工作台13係在底座11安裝成經由這些各導軌16在Y方向滑動自如。又,在移動工作台13,連接藉線性馬達等所 構成之驅動機構(省略圖示),並因應於此驅動機構之驅動,在Y方向移動。 The base 11 is supported by the feet 115 mounted at each corner of the four corners. Two guide rails 16 substantially parallel to the Y direction are provided on the upper surface 11a of the base 11. The moving table 13 is attached to the base 11 so as to be slidable in the Y direction via the respective guide rails 16. Moreover, in the mobile workbench 13, a linear motor or the like is connected. The drive mechanism (not shown) is configured to move in the Y direction in response to the drive of the drive mechanism.
曝光部14係經由一對支柱17,安裝於底座11之Y方向中央部。各支柱17被固定於底座11之X方向兩端部。各支柱17係以在移動工作台13在Y方向移動時通過曝光部14之下的方式將曝光部14固持成與底座11之上面11a相距既定距離。曝光部14具有16個曝光頭18。這些各曝光頭18係對通過曝光部14之下的基板12照射光。 The exposure unit 14 is attached to the center portion of the chassis 11 in the Y direction via a pair of pillars 17 . Each of the pillars 17 is fixed to both end portions of the base 11 in the X direction. Each of the pillars 17 holds the exposure portion 14 at a predetermined distance from the upper surface 11a of the base 11 so as to pass under the exposure portion 14 when the moving table 13 moves in the Y direction. The exposure unit 14 has 16 exposure heads 18. Each of the exposure heads 18 irradiates light to the substrate 12 passing under the exposure portion 14.
各曝光頭18係在X方向以2列排列各8個。第2列之各曝光頭18係以各個的中心位於第1列之各曝光頭18的鄰接者之彼此之中央附近的方式配置成對第1列之各曝光頭18在X方向錯開1/2間距。藉由依此方式錯開地配置,藉第2列之各曝光頭18將藉第1列之各曝光頭18無法曝光的部分進行曝光,基板12之X方向無間隙地進行曝光記錄。此外,設置於曝光部14之曝光頭18的個數或排列的方法係可因應於基板12之尺寸等適當地變更。 Each of the exposure heads 18 is arranged in eight rows in the X direction. Each of the exposure heads 18 of the second row is arranged such that the respective exposure heads 18 of the first column are shifted by 1/2 in the X direction so that the respective centers are located near the center of the adjacent ones of the respective exposure heads 18 of the first column. spacing. By disposing in this manner, the exposure heads 18 of the second column expose the portions which are not exposed by the respective exposure heads 18 of the first column, and the substrate 12 is subjected to exposure recording without a gap in the X direction. Further, the number of the exposure heads 18 or the arrangement of the exposure heads 18 provided in the exposure unit 14 can be appropriately changed in accordance with the size of the substrate 12 or the like.
在影像處理單元21,輸入因應於記錄於基板12之導體圖案等的影像資料(影像資訊)。影像處理單元21係根據所輸入之影像資料,製作各曝光頭18的圖框資料。而且,影像處理單元21係經由信號電纜22將圖框資料輸入至各曝光頭18。圖框資料係例如以2值(點之記錄的有無)表示構成影像之各像素之濃度的資料。 The image processing unit 21 inputs image data (image information) in response to a conductor pattern or the like recorded on the substrate 12. The image processing unit 21 creates frame data of each exposure head 18 based on the input image data. Further, the image processing unit 21 inputs the frame material to each of the exposure heads 18 via the signal cable 22. The frame data is, for example, data indicating the density of each pixel constituting the image by a binary value (the presence or absence of the recording of the dot).
各曝光頭18係根據圖框資料,調變從光源裝置A所射入之雷射光後,將已調變之光投影至藉移動工作台13所 搬運之基板12。藉此,將因應於影像處理單元21所輸入之影像資料的影像曝光記錄於基板12。 Each of the exposure heads 18 modulates the laser light incident from the light source device A according to the frame data, and then projects the modulated light to the mobile workbench 13 The substrate 12 is carried. Thereby, the image corresponding to the image data input by the image processing unit 21 is exposed and recorded on the substrate 12.
在底座11,更設置形成大致字形的門23、與安裝於Y方向之一端部的一對測長機24。門23係以跨各導軌16之方式在底座11安裝成與X方向大致平行。3台照相機25被安裝於門23。各照相機25與統籌地控制數位曝光裝置10整體的控制器(省略圖示)連接。 In the base 11, more settings are formed The glyph door 23 and a pair of length measuring machines 24 attached to one end of the Y direction. The door 23 is mounted on the base 11 so as to be substantially parallel to the X direction so as to straddle the guide rails 16. Three cameras 25 are attached to the door 23. Each of the cameras 25 is connected to a controller (not shown) that integrally controls the entire digital exposure device 10.
各照相機25係拍攝通過門23之移動工作台13,並將所取得之影像資料輸出至控制器。控制器係根據各照相機25所取得之影像資料,算出基板12相對移動工作台13上的適當位置之X方向、Y方向以及θ方向(以Z方向為軸之旋轉)的偏差量。所算出之偏差量係被輸入影像處理單元21,並用於修正圖框資料。此外,亦可照相機25之台數或配置間隔等係因應於基板12之尺寸等適當地變更。又,偏差量之算出係可藉周知之影像處理進行。在此時,為了易於算出偏差量,將對準記號等設置於基板12較佳。 Each camera 25 captures the moving table 13 passing through the door 23 and outputs the acquired image data to the controller. The controller calculates the amount of deviation of the substrate 12 from the X position, the Y direction, and the θ direction (rotation in the Z direction) of the appropriate position on the moving table 13 based on the image data acquired by each camera 25. The calculated amount of deviation is input to the image processing unit 21 and used to correct the frame data. In addition, the number of the cameras 25, the arrangement interval, and the like may be appropriately changed depending on the size of the substrate 12 or the like. Moreover, the calculation of the amount of deviation can be performed by well-known image processing. At this time, in order to easily calculate the amount of deviation, it is preferable to provide an alignment mark or the like on the substrate 12.
各測長機24係與各照相機25一樣,與控制器連接。各測長機24係將雷射光照射於移動工作台13的側端面,藉由對其反射光受光,測量移動工作台13的位置。而且,測長機24係將所測量之移動工作台13的位置輸出至控制器。此外,在本實施形態,表示所謂的雷射光干涉式測長機24,但是未限定如此,例如,只要是超音波或立體相機等可測量移動工作台13之位置者,亦可使用其他的任何裝置。 Each of the length measuring machines 24 is connected to the controller like the respective cameras 25. Each of the length measuring machines 24 irradiates the laser beam to the side end surface of the moving table 13, and receives the light by the reflected light to measure the position of the moving table 13. Moreover, the length measuring machine 24 outputs the measured position of the moving table 13 to the controller. Further, in the present embodiment, the so-called laser light interferometric length measuring machine 24 is shown. However, the present invention is not limited thereto. For example, any other position that can measure the moving table 13 such as an ultrasonic wave or a stereo camera may be used. Device.
根據第3圖,說明該構成之曝光裝置B的曝光頭 18與光源裝置A之連接部分的細節。 According to FIG. 3, the exposure head of the exposure apparatus B of this configuration will be described. Details of the portion of the connection with the light source device A.
曝光頭18係由入射光學系統40、光調變部41、第1成像光學系統42、微透鏡陣列(MLA:micro lens array)43、孔徑陣列(APA:aperture array)44以及第2成像光學系統(投影光學系統)45所構成。入射光學系統40係經由第2連接器10配置成與第3光纖9之射出端部相向。此入射光學系統40包括:聚光透鏡50,係將從第3光纖9所射出之雷射光(LB:laser beam)聚光;棒狀之光學式積分器(optical integrator)51,係配置於已通過聚光透鏡50之雷射光LB的光路上;成像透鏡52,係使已通過光學式積分器51之雷射光LB成像;以及反射鏡53,係使藉成像透鏡52所成像之雷射光LB反射並使其射入光調變部41。 The exposure head 18 is composed of an incident optical system 40, a light modulation unit 41, a first imaging optical system 42, a micro lens array (MLA) 43, an aperture array (APA: aperture array) 44, and a second imaging optical system. (Projection optical system) 45 is constructed. The incident optical system 40 is disposed to face the emission end of the third optical fiber 9 via the second connector 10 . The incident optical system 40 includes a condensing lens 50 that condenses laser light (LB: laser beam) emitted from the third optical fiber 9; and a rod-shaped optical integrator 51 is disposed in the optical lens The laser beam LB passes through the optical path of the condensing lens 50; the imaging lens 52 images the laser light LB that has passed through the optical integrator 51; and the mirror 53 reflects the laser light LB imaged by the imaging lens 52. And it is incident on the light modulation portion 41.
光學式積分器51例如是形成四角柱狀之透光性棒。光學式積分器51係使一面進行全反射一面在內部行進之雷射光LB變成接***行光而且光束截面內強度被均勻化的光束。藉此,照明光強度無不均之高精細的影像被曝光於基板12。此外,在光學式積分器51之入射端面及射出端面,為了提高透光率,塗布反射防止膜較佳。 The optical integrator 51 is, for example, a translucent rod formed in a quadrangular prism shape. The optical integrator 51 is a light beam in which the laser beam LB traveling inside while being totally reflected on one side becomes close to parallel light and the intensity in the beam cross section is uniformized. Thereby, a high-definition image in which the intensity of the illumination light is uneven is exposed to the substrate 12. Further, in order to increase the light transmittance, the incident end surface and the output end surface of the optical integrator 51 are preferably coated with an anti-reflection film.
光調變部41包括TIR(全反射:total internal reflection)稜鏡55、是空間光調變元件之DMD(digital micro mirror device,數位微反射鏡組件)56。TIR稜鏡55係使經由反射鏡53所射入之雷射光LB朝向DMD56反射。DMD56係在二維地排列之SRAM(Static Random Access Memory)單元上,將構成像素之微反射鏡以支柱支撐並設置成傾斜自如的反 射鏡裝置。 The optical modulation unit 41 includes a TIR (total internal reflection) 稜鏡 55 and a DMD (digital micro mirror device) 56 that is a spatial light modulation element. The TIR 稜鏡 55 is such that the laser light LB incident through the mirror 53 is reflected toward the DMD 56. The DMD56 is a two-dimensionally arranged SRAM (Static Random Access Memory) unit, and the micromirrors constituting the pixels are supported by the pillars and arranged to be tilted freely. Mirror device.
DMD56係因應於SRAM單元所寫入之數位信號,將微反射鏡之傾斜角度改變成所照射之雷射光LB朝向第1成像光學系統42反射的狀態、與所照射之雷射光LB朝向省略圖示之光吸收體反射的狀態。光調變部41係因應於從影像處理單元21所輸入之圖框資料,控制DMD56之像素之微反射鏡的傾斜,藉此,產生因應於圖框資料之影像光。 The DMD 56 changes the tilt angle of the micromirror to reflect the state in which the irradiated laser light LB is reflected toward the first imaging optical system 42 in accordance with the digital signal written in the SRAM cell, and the direction of the irradiated laser light LB is omitted. The state in which the light absorber is reflected. The light modulation unit 41 controls the tilt of the micromirrors of the pixels of the DMD 56 in response to the frame data input from the image processing unit 21, thereby generating image light corresponding to the frame data.
第1成像光學系統42係由透鏡57、58所構成,將藉光調變部41所產生之影像光放大既定倍率並成像於MLA43上。 The first imaging optical system 42 is composed of lenses 57 and 58, and the image light generated by the light modulation unit 41 is amplified by a predetermined magnification and imaged on the MLA 43.
MLA43係例如藉石英玻璃形成大致長方形的平板。又,在MLA43,形成以對應於DMD56之各像素之方式二維地排列的複數個微透鏡43a。各微透鏡43a係上面為平面、下面為凸面的平凸透鏡。各微透鏡43a係使來自DMD56之各微反射鏡的影像光各個個別地成像,而使以第1成像光學系統42所放大之影像光變得鮮艷。此外,各微透鏡43a的形狀係未限定為平凸透鏡,例如,亦可是雙凸透鏡等。 MLA43 is formed, for example, by quartz glass to form a substantially rectangular flat plate. Further, in the MLA 43, a plurality of microlenses 43a which are two-dimensionally arranged in correspondence with the respective pixels of the DMD 56 are formed. Each of the microlenses 43a is a plano-convex lens having a flat surface on the upper surface and a convex surface on the lower surface. Each of the microlenses 43a individually images the image light from each of the micromirrors of the DMD 56, and brightens the image light amplified by the first imaging optical system 42. Further, the shape of each of the microlenses 43a is not limited to a plano-convex lens, and may be, for example, a lenticular lens or the like.
APA44係具有遮光性,並形成複數個用以使影像光通過的孔徑44a。各孔徑44a係與各微透鏡43a一樣,以對應於DMD56之各像素之方式二維地排列。APA44係配置成使各孔徑44a與各微透鏡43a相向,並使藉各微透鏡43a所成像之影像光通過各個個別地對應之各孔徑44a。APA44係防止因DMD56之各微反射鏡的顫動等所產生之不要光通過,而更提高曝光影像之清晰度。 The APA44 is light-shielding and forms a plurality of apertures 44a for passing image light. Each of the apertures 44a is two-dimensionally arranged in correspondence with each of the pixels of the DMD 56, similarly to the respective microlenses 43a. The APA 44 is disposed such that the respective apertures 44a face the respective microlenses 43a, and the image light imaged by the respective microlenses 43a passes through the respective individually corresponding apertures 44a. The APA44 prevents the light generated by the chattering of the micromirrors of the DMD 56 from passing through, and improves the sharpness of the exposed image.
第2成像光學系統45包括透鏡60、61與稜鏡對62,並將通過APA44之影像光投影至基板12。各透鏡60、61係將通過APA44之影像光放大至既定倍率,或以等倍率使其射入稜鏡對62。稜鏡對62係設置成在上下方向移動自如,藉由上下地移動,調整在基板12上之影像光的焦點。 The second imaging optical system 45 includes lenses 60, 61 and a pair of pupils 62, and projects image light that has passed through the APA 44 onto the substrate 12. Each of the lenses 60, 61 amplifies the image light that has passed through the APA 44 to a predetermined magnification, or injects it into the pair 62 at an equal magnification. The 62-series is provided so as to be movable in the vertical direction, and the focus of the image light on the substrate 12 is adjusted by moving up and down.
又,在該實施形態,作為空間光調變元件,表示DMD56,但是空間光調變元件係未限定如此,例如,亦可是液晶光快門等。進而,在該實施形態,作為曝光對象,表示被塗布或黏合感光材料之基板12,但是曝光對象係未限定如此,例如,亦可是照相底片或相紙等。 Further, in this embodiment, the DMD 56 is shown as the spatial light modulation element. However, the spatial light modulation element is not limited thereto, and may be, for example, a liquid crystal shutter. Further, in this embodiment, the substrate 12 to which the photosensitive material is applied or bonded is shown as an exposure target, but the exposure target is not limited thereto, and may be, for example, a photographic film or a photographic paper.
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