TWI648543B - Rated current testing device - Google Patents
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Abstract
一種額定電流測試裝置，係設置有主機以及待測物溫度偵測器，主機具有微處理器以及微處理器所連接之電流輸出器，且微處理器具有電流控制程式、目標溫差值、環境溫度值、電流增幅值以及溫度平衡時間值；待測物溫度偵測器連接於前述主機之微處理器，用以偵測待測物之溫度，並將此待測物溫度傳送至微處理器，即可自動的對待測物進行額定電流測試，將測試流程自動化，且不會使待測物損壞。A rated current test device is provided with a host and a temperature detector for a test object, the host has a microprocessor and a current output device connected to the microprocessor, and the microprocessor has a current control program, a target temperature difference, and an ambient temperature. a value, a current increase value, and a temperature balance time value; the object temperature detector is connected to the microprocessor of the host to detect the temperature of the object to be tested, and the temperature of the object to be tested is transmitted to the microprocessor. The rated current test of the object to be tested can be automatically performed, and the test process is automated without damage to the object to be tested.
Description
一種額定電流測試裝置，尤指自動進行額定電流測試之裝置。 A rated current test device, especially a device that automatically performs a rated current test.
當電子零件通過電流時，會因為本身電阻的因素而發熱致使零件的溫度上升，電子零件溫度上升超過一個程度時，會導致零件的性能失效，失去該零件在線路裡應該具備的功能，因此，導致零件失效的電流參數是一個很重要的規格，一般來說，會定義使零件溫度從室溫上升某個溫度的電流為額定電流(rated current)。 When an electronic component passes current, it will heat up due to its own resistance, causing the temperature of the component to rise. When the temperature of the electronic component rises more than one degree, the performance of the component will be invalid, and the function that the component should have in the circuit will be lost. Therefore, The current parameter that causes the part to fail is an important specification. In general, the current that causes the part temperature to rise from room temperature to a certain temperature is defined as the rated current.
一般測試額定電流系統架構為電流輸出源、溫度計(熱電偶)以及待測物(電子零件)，進行測試時，將電流輸出源連接待測物，溫度計則以絕熱膠帶纏覆於待測物的表面，續以人工方式調整輸出電源的大小，然後觀察溫度計一段時間，其溫度是否上升到預定的溫度，若低於預定溫度則增加輸出電流；若高於預定溫度則降低輸出電流，此種量測方式的缺點是，測試者必須固定觀察量測的進行，以及測試者可能會因為調整電流的幅度過大而導致待測物毀損；另外，由於待測物被絕熱膠帶纏覆，表面散熱必定會受到影響，進而影響量測的數據。 Generally, the rated current system architecture is a current output source, a thermometer (thermocouple), and a test object (electronic component). When testing, the current output source is connected to the object to be tested, and the thermometer is wrapped with the insulating tape on the object to be tested. Surface, continue to manually adjust the size of the output power, and then observe the thermometer for a period of time, whether its temperature rises to a predetermined temperature, if it is lower than the predetermined temperature, increase the output current; if it is higher than the predetermined temperature, reduce the output current, such amount The disadvantage of the measurement method is that the tester must fix the observation measurement, and the tester may damage the object to be tested because the magnitude of the adjustment current is too large; in addition, since the object to be tested is wrapped by the heat insulation tape, the surface heat dissipation will definitely Affected, which in turn affects the measured data.
本發明之主要目的乃在於，利用額定電流測試裝置自動的對待測物進行額定電流測試，將測試流程自動化，不會使待測物損壞，再者，待測 物的目標溫度與待測物的實際溫度差值越大，電流輸出的越高，差值越低電流增幅越低，可有效的避免損壞待測物。 The main purpose of the invention is to use the rated current test device to automatically perform the rated current test on the object to be tested, to automate the test process, and not to damage the object to be tested, and further, to be tested The greater the difference between the target temperature of the object and the actual temperature of the object to be tested, the higher the current output, and the lower the difference, the lower the current increase, which can effectively avoid damage to the object to be tested.
為達上述目的，本發明之額定電流測試裝置係設置有主機以及待測物溫度偵測器，主機具有微處理器以及微處理器所連接之電流輸出器，且微處理器具有電流控制程式、目標溫差值、環境溫度值、電流增幅值以及溫度平衡時間值；待測物溫度偵測器連接於前述主機之微處理器，用以偵測待測物之溫度，並將此待測物溫度傳送至微處理器。 In order to achieve the above object, the rated current testing device of the present invention is provided with a host and a temperature detector for the object to be tested, the host has a microprocessor and a current output device connected to the microprocessor, and the microprocessor has a current control program. a target temperature difference value, an ambient temperature value, a current increase value, and a temperature balance time value; the object temperature detector is connected to the microprocessor of the host to detect the temperature of the object to be tested, and the temperature of the object to be tested Transfer to the microprocessor.
前述之額定電流測試裝置對待測物進行額定電流測試時，係將待測物連接於電流輸出器，並控制電流輸出器對待測物輸出電流，而電流控制程式會依照目標溫差值與環境溫度值計算出目標溫度，當目標溫度與微處理器所接收到的待測物溫度產生差值時，電流控制程式會以此差值與目標溫差值的比值乘上電流增幅值，調整電流輸出器所輸出之電流，當目標溫度與微處理器所接收到的待測物溫度相同，且持續時間達到溫度平衡時間值時，當前電流即為額定電流。 When the rated current test device performs the rated current test on the object to be tested, the object to be tested is connected to the current output device, and the current output device is controlled to output current, and the current control program according to the target temperature difference and the ambient temperature value. Calculate the target temperature. When the target temperature and the temperature of the object to be tested received by the microprocessor are different, the current control program multiplies the ratio of the difference to the target temperature difference by the current increase value to adjust the current output device. The current output is the rated current when the target temperature is the same as the temperature of the object to be tested received by the microprocessor and the duration reaches the temperature balance time value.
前述之額定電流測試裝置，其中該主機之微處理器進一步連接有輸入器，提供使用者設定目標溫差值、環境溫度值、電流增幅值以及溫度平衡時間值。 In the foregoing rated current testing device, the microprocessor of the host is further connected with an input device, and provides a user to set a target temperature difference value, an ambient temperature value, a current increase value, and a temperature balance time value.
前述之額定電流測試裝置，其中該主機之微處理器進一步連接有環境溫度偵測器，環境溫度偵測器所偵測之環境溫度會傳送至微處理器作為環境溫度值。 In the foregoing rated current testing device, the microprocessor of the host is further connected with an ambient temperature detector, and the ambient temperature detected by the ambient temperature detector is transmitted to the microprocessor as an ambient temperature value.
1‧‧‧主機 1‧‧‧Host
11‧‧‧微處理器 11‧‧‧Microprocessor
111‧‧‧電流控制程式 111‧‧‧ Current Control Program
112‧‧‧目標溫差值 112‧‧‧ target temperature difference
113‧‧‧環境溫度值 113‧‧‧Environmental temperature values
114‧‧‧電流增幅值 114‧‧‧ Current increase
115‧‧‧溫度平衡時間值 115‧‧‧temperature balance time value
12‧‧‧輸入器 12‧‧‧ Inputs
13‧‧‧電流輸出器 13‧‧‧current output
2‧‧‧待測物溫度偵測器 2‧‧‧DST temperature detector
3‧‧‧待測物 3‧‧‧Test object
4‧‧‧環境溫度偵測器 4‧‧‧Environmental Temperature Detector
第一圖係為本發明之方塊圖。 The first figure is a block diagram of the present invention.
請參閱第一圖所示，由圖中可清楚看出，本發明係設置有主機1、待測物溫度偵測器2以及環境溫度偵測器4，其中：該主機1具有微處理器11以及微處理器11所連接之輸入器12以及電流輸出器13，且微處理器11具有電流控制程式111、目標溫差值112、環境溫度值113、電流增幅值114以及溫度平衡時間值115。 Referring to the first figure, it can be clearly seen from the figure that the present invention is provided with a host 1, a temperature detector 2 to be tested, and an ambient temperature detector 4, wherein the host 1 has a microprocessor 11 The input device 12 and the current output device 13 to which the microprocessor 11 is connected, and the microprocessor 11 have a current control program 111, a target temperature difference value 112, an ambient temperature value 113, a current increase value 114, and a temperature balance time value 115.
該待測物溫度偵測器2連接於前述主機1之微處理器11，用以偵測待測物3之溫度，並將此待測物溫度傳送至微處理器11。 The object temperature detector 2 is connected to the microprocessor 11 of the host 1 for detecting the temperature of the object to be tested 3 and transmitting the temperature of the object to be tested to the microprocessor 11.
該環境溫度偵測器4連接於前述主機1之微處理器11，用以偵測待測物3周圍之環境溫度，並將此環境溫度傳送至微處理器11作為環境溫度值113。 The ambient temperature detector 4 is connected to the microprocessor 11 of the host 1 for detecting the ambient temperature around the object 3 and transmitting the ambient temperature to the microprocessor 11 as the ambient temperature value 113.
當待測物3進行額定電流測試時，係將待測物3連接於電流輸出器13，並利用輸入器12設定目標溫差值112、環境溫度值113、電流增幅值114以及溫度平衡時間值115，環境溫度值113亦可直接使用由環境溫度偵測器4所偵測之環境溫度，使電流控制程式111依照目標溫差值112與環境溫度值113計算出目標溫度，而於測試開始時，係先將控制電流輸出器13對待測物3輸出電流，並持續的接收由待測物溫度偵測器2所傳送的待測物溫度，電流控制程式111會先判斷目標溫度與待測物溫度是否產生差值，當目標溫度與待測物溫度具有差值時，電流控制程式111即會運算出電流輸出器13需增加或降低之電流量，該運算式為：輸出電流=當前電流+(((目標溫度-待測物溫度)/目標溫差值)X電流增幅值)，如此，即可計算出電流所需之增幅，再以此增幅調整電流輸出器13之電流輸出。藉由上述可發現，當目標溫度與待測物溫度之差值為正數時，電流輸出器13之電流輸出即會增高，當目標溫度與待測物溫度之差值為負數時，電流輸 出器13之電流輸出即會降低，且目標溫度與待測物溫度之差值越小，電流增幅即會越小，直到目標溫度與微處理器11所接收到的待測物溫度相同，且持續時間達到溫度平衡時間值115時，當前電流即為額定電流。 When the object to be tested 3 performs the rated current test, the object to be tested 3 is connected to the current output device 13, and the target temperature difference 112, the ambient temperature value 113, the current increase value 114, and the temperature balance time value 115 are set by the input device 12. The ambient temperature value 113 can also directly use the ambient temperature detected by the ambient temperature detector 4, so that the current control program 111 calculates the target temperature according to the target temperature difference 112 and the ambient temperature value 113, and at the beginning of the test, First, the control current output device 13 outputs a current to the object 3, and continuously receives the temperature of the object to be tested transmitted by the object temperature detector 2, and the current control program 111 first determines whether the target temperature and the temperature of the object to be tested are A difference is generated. When the target temperature has a difference from the temperature of the object to be tested, the current control program 111 calculates the amount of current that the current output device 13 needs to increase or decrease. The expression is: output current = current current + (( (target temperature - temperature of the object to be tested) / target temperature difference value) X current increase value), in this way, the required increase in current can be calculated, and then the current output of the current output device 13 can be adjusted in this manner. It can be found from the above that when the difference between the target temperature and the temperature of the object to be tested is a positive number, the current output of the current output device 13 is increased, and when the difference between the target temperature and the temperature of the object to be tested is negative, the current is lost. The current output of the output 13 is lowered, and the smaller the difference between the target temperature and the temperature of the object to be tested, the smaller the current increase will be until the target temperature is the same as the temperature of the object to be tested received by the microprocessor 11, and When the duration reaches the temperature balance time value of 115, the current current is the rated current.
是以，本發明為可解決習知技術之不足與缺失，並可增進功效，其關鍵技術在於： Therefore, the present invention can solve the deficiencies and shortcomings of the prior art, and can improve the efficiency. The key technologies are:
一、自動的增加或降低電流輸出器13對待測物3所輸出的電流，直到目標溫度與待測物溫度相同，且持續時間達到溫度平衡時間值115，讓測試過程自動化，不需過多耗費人力。 1. Automatically increase or decrease the current output by the current output device 13 to the object 3 until the target temperature is the same as the temperature of the object to be tested, and the duration reaches the temperature balance time value of 115, so that the test process is automated without excessive labor. .
二、目標溫度與待測物溫度的差值越大，電流輸出器13輸出的電流增幅越高，目標溫度與待測物溫度的差值越低，電流輸出器13輸出的電流增幅越低，可有效的避免損壞待測物3。 2. The greater the difference between the target temperature and the temperature of the object to be tested, the higher the current output of the current output device 13 is, and the lower the difference between the target temperature and the temperature of the object to be tested is, the lower the current output of the current output device 13 is. It can effectively avoid damage to the object to be tested 3.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030233173A1 (en) * | 1999-03-16 | 2003-12-18 | Stewart Robert T. | Method and apparatus for latent temperature control for a device under test |
| US20080024089A1 (en) * | 2006-07-27 | 2008-01-31 | Changhong Meng | Systems and methods for temperature-dependent battery charging |
| CN102590594A (en) * | 2012-03-07 | 2012-07-18 | 广东电网公司佛山供电局 | Transient state thermal circuit model-based method and device for determining permissible current of overhead conductor |
| CN102620846A (en) * | 2011-12-28 | 2012-08-01 | 上海申瑞电力科技股份有限公司 | Method of calculating steady-state heat capacity of power circuit |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030233173A1 (en) * | 1999-03-16 | 2003-12-18 | Stewart Robert T. | Method and apparatus for latent temperature control for a device under test |
| US20080024089A1 (en) * | 2006-07-27 | 2008-01-31 | Changhong Meng | Systems and methods for temperature-dependent battery charging |
| CN102620846A (en) * | 2011-12-28 | 2012-08-01 | 上海申瑞电力科技股份有限公司 | Method of calculating steady-state heat capacity of power circuit |
| CN102590594A (en) * | 2012-03-07 | 2012-07-18 | 广东电网公司佛山供电局 | Transient state thermal circuit model-based method and device for determining permissible current of overhead conductor |
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