TWI644456B - Remote sensor packaging method - Google Patents
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Abstract
一種遠距離感測器的封裝方法，包含下列步驟：提供一基板，並將一發光晶片以及一感測晶片相互分離地設置於該基板之承載面；將二封裝膠體分別包覆該發光晶片以及該感測晶片，並同時將各該封裝膠體相互分離；以及將一預先成型之封蓋設置於該基板之承載面以及各該封裝膠體上方，並藉由黏性膠體將該封蓋固接於該基板之承載面以及各該封裝膠體。A method for packaging a remote sensor includes the steps of: providing a substrate, and disposing an illuminating chip and a sensing wafer separately from each other on a bearing surface of the substrate; and coating the luminescent wafer with the two encapsulants respectively The sensing wafer is separated from each other at the same time; and a pre-formed cover is disposed on the bearing surface of the substrate and each of the encapsulants, and the cover is fixed by the adhesive colloid The bearing surface of the substrate and each of the encapsulants.
Description
本發明係與封裝方法有關，特別是指一種遠距離感測器的封裝方法。The invention relates to a packaging method, in particular to a packaging method of a remote sensor.
習知的遠距離感測器封裝結構係在一基板上設置一發光晶片及一感測晶片，接著經由模壓製程(Molding)將二封裝膠體分別包覆該發光晶片及該感測晶片，同時在各該封裝膠體頂面形成一半球狀透鏡部以對應該發光晶片及該感測晶片，最後同樣經由模壓製程將一封蓋設置於該基板及各該封裝膠體上方以完成整個封裝流程，值得一提的是，該封蓋通常會開設一光發射孔以及一光接收孔分別用以容納各該透鏡部。The conventional remote sensor package structure is provided with a light-emitting chip and a sensing wafer on a substrate, and then the two packaged gels are respectively coated on the light-emitting chip and the sensing wafer via Molding, and Each of the encapsulants forms a semi-spherical lens portion to correspond to the light-emitting chip and the sensing wafer, and finally a cover is disposed on the substrate and each of the encapsulants through a molding process to complete the entire packaging process, which is worth one. It is noted that the cover usually has a light emitting aperture and a light receiving aperture for receiving each of the lens portions.
惟，此種經由二次模壓製程形成各該封裝膠體以及該封蓋之方式，該封蓋與各該封裝膠體及該基板之間的結合性較差，並且，此種利用模壓製程形成該封蓋的方式，因為模壓模具無法接近各該透鏡部，因此該封蓋較無法貼近各該透鏡部，使得遠距離感測器的感測距離較短，因此，習用的遠距離感測器封裝結構以及其封裝方法仍有其缺點，而有待改進。However, in such a manner that the encapsulant and the cover are formed by the second molding process, the bonding between the cover and each of the encapsulant and the substrate is poor, and the cover is formed by a molding process. In a manner, since the molding die cannot access each of the lens portions, the cover is less likely to be close to each of the lens portions, so that the sensing distance of the remote sensor is shorter, and therefore, the conventional remote sensor package structure and The packaging method still has its shortcomings and needs to be improved.
綜合上述說明，本發明之主要目的係在於提供一種遠距離感測器的封裝結構，其具有封裝材料結合性較佳並且感測的距離較遠之優點。In view of the above description, the main object of the present invention is to provide a package structure of a remote sensor, which has the advantages of better combination of packaging materials and long distance of sensing.
該遠距離感測器的封裝結構包含一基板、一發光晶片、一感測晶片、二封裝膠體以及一封蓋，該基板具有一承載面，該發光晶片與該感測晶片係相互分離地設置於該承載面，該二封裝膠體係分別包覆該發光晶片以及該感測晶片並且彼此分離，該封蓋設置於該承載面以及各該封裝膠體之上，並且藉由黏性膠體固接於該承載面以及各該封裝膠體，該封蓋設有一光發射孔以及一光接收孔，該光發射孔以及該光接收孔分別位於該發光晶片以及該感測晶片上方。The package structure of the remote sensor includes a substrate, a light emitting chip, a sensing chip, two encapsulants, and a cover. The substrate has a bearing surface, and the light emitting chip and the sensing chip are disposed separately from each other. On the carrying surface, the two encapsulant systems respectively cover the illuminating wafer and the sensing wafer and are separated from each other. The cover is disposed on the bearing surface and each of the encapsulants, and is fixed by a viscous gel. The cover surface and each of the encapsulants are provided with a light emitting hole and a light receiving hole, and the light emitting hole and the light receiving hole are respectively located above the light emitting chip and the sensing wafer.
藉此，該封蓋可藉由黏性膠體固接於該承載面以及各該封裝膠體，提升了封裝結構的材料結合度。Thereby, the cover can be fixed to the bearing surface and each of the encapsulant by the adhesive colloid, thereby improving the material bonding degree of the package structure.
本發明之次要目的係在於提供一種遠距離感測器的封裝方法，包含下列步驟： (a)提供一基板，並將一發光晶片以及一感測晶片相互分離地設置於該基板之承載面； (b)將二封裝膠體分別包覆該發光晶片以及該感測晶片，並同時將各該封裝膠體相互分離；以及 (c)將一預先成型之封蓋設置於該基板之承載面以及各該封裝膠體上方，並藉由黏性膠體將該封蓋固接於該基板之承載面以及各該封裝膠體。A secondary object of the present invention is to provide a method for packaging a remote sensor, comprising the steps of: (a) providing a substrate, and disposing an illuminating wafer and a sensing wafer on the bearing surface of the substrate separately from each other; (b) separately coating the light-emitting wafer and the sensing wafer with the two packaged pastes, and simultaneously separating the respective encapsulants from each other; and (c) disposing a pre-formed cover on the bearing surface of the substrate and each Above the encapsulant, the cover is fixed to the bearing surface of the substrate and each of the encapsulants by an adhesive colloid.
較佳地，於步驟(b)中，係利用模壓(Molding)的方式將二封裝膠體分別包覆該發光晶片以及該感測晶片。Preferably, in the step (b), the two encapsulants are respectively coated on the illuminating wafer and the sensing wafer by means of molding.
藉此，由於該封蓋係為預先成型，可直接藉由黏性膠體黏貼並固接於各該封裝膠體以及該承載面，並且可克服習知技術係利用兩次模壓分別形成封裝膠體以及封蓋，導致封蓋無法接近封裝膠體進而降低感測距離之缺點。Therefore, since the cover is pre-formed, it can be directly adhered to and adhered to each of the encapsulant and the bearing surface by the adhesive colloid, and the conventional technique can be used to form the encapsulant and seal by using two moldings respectively. The cover causes the cover to be inaccessible to the encapsulant and thereby reduce the sensing distance.
有關本發明所提供之詳細構造、特點，將於後續的實施方式詳細說明中予以描述。然而，在本領域中具有通常知識者應能瞭解，該等詳細說明以及實施本發明所列舉的特定實施例，僅係用於說明本發明，並非用以限制本發明之專利申請範圍。The detailed construction and features of the present invention will be described in the following detailed description of the embodiments. However, it should be understood by those of ordinary skill in the art that the present invention is not limited to the scope of the invention.
請參考第1~2圖，係顯示本發明第一較佳實施例所提供之遠距離感測器的封裝結構10，係包含一基板20、一發光晶片30、一感測晶片40、二封裝膠體50以及一封蓋60。Referring to FIG. 1 to FIG. 2, a package structure 10 for a remote sensor according to a first preferred embodiment of the present invention includes a substrate 20, a light emitting chip 30, a sensing wafer 40, and a second package. The colloid 50 and a cover 60.
基板20於本較佳實施例中係可為印刷電路板(通稱PCB)、雙馬來醯亞胺三嗪基板(通稱BT)、玻璃纖維基板(通稱FR4)或是直接覆銅基板(通稱DBC)但並不以此為限，藉此，基板20之生產成本較低，基板20具有一承載面22。In the preferred embodiment, the substrate 20 can be a printed circuit board (commonly known as PCB), a bismaleimide triazine substrate (commonly known as BT), a fiberglass substrate (commonly known as FR4), or a direct copper-clad substrate (commonly known as DBC). However, it is not limited thereto, whereby the production cost of the substrate 20 is low, and the substrate 20 has a bearing surface 22.
發光晶片30係設置於承載面22，並可藉由打線製程(Wire Bonding)電性連接於基板20，於本較佳實施例中發光晶片30係為LED晶片並可用以發射光源。The light-emitting chip 30 is disposed on the carrying surface 22 and can be electrically connected to the substrate 20 by wire bonding. In the preferred embodiment, the light-emitting chip 30 is an LED chip and can be used to emit a light source.
感測晶片40係設置於承載面22並與發光晶片30相互分離，其中，感測晶片40亦可藉由打線製程電性連接於基板20，感測晶片40可用以感測發光晶片30所發出的光源。The sensing wafer 40 is disposed on the carrying surface 22 and separated from the light emitting chip 30. The sensing wafer 40 can also be electrically connected to the substrate 20 by a wire bonding process. The sensing wafer 40 can be used to sense the emitted light emitting chip 30. Light source.
二封裝膠體50係利用模壓(Molding)的方式形成並分別包覆發光晶片30以及感測晶片40，二封裝膠體50係相互分離並於彼此之間形成一凹溝51，各封裝膠體50頂面具有一透鏡部52以及一肩部54，於本較佳實施例中，各封裝膠體50頂面之肩部54係圍繞透鏡部52，各封裝膠體50頂面之透鏡部52係呈半球狀，並且各封裝膠體50頂面之透鏡部52曲率可視需求於製造時進行調整，各封裝膠體50係為透光材質製成，如透明的環氧樹脂(Epoxy Resin)。The two encapsulants 50 are formed by molding and respectively coated with the illuminating wafer 30 and the sensing wafer 40. The two encapsulants 50 are separated from each other and form a groove 51 between each other, and the top surface of each encapsulant 50 is formed. There is a lens portion 52 and a shoulder portion 54. In the preferred embodiment, the shoulder portion 54 of the top surface of each encapsulant 50 surrounds the lens portion 52, and the lens portion 52 of the top surface of each encapsulant 50 is hemispherical. Moreover, the curvature of the lens portion 52 on the top surface of each of the encapsulants 50 can be adjusted at the time of manufacture, and each encapsulant 50 is made of a light transmissive material, such as a transparent epoxy resin (Epoxy Resin).
封蓋60係設置於承載面22以及各封裝膠體50之上，並藉由黏性膠體70固設於承載面22以及各封裝膠體50，封蓋60設有一光發射孔72以及一光接收孔74，光發射孔72以及光接收孔74分別位於發光晶片30以及感測晶片40上方，更進一步來說，封蓋60係包含一橫向段76以及複數由橫向段76向下延伸之延伸段78，橫向段76係設有光發射孔72以及光接收孔74，橫向段76係藉由黏性膠體70固設於各封裝膠體50頂面之肩部54，並且光發射孔72以及光接收孔74分別位於各封裝膠體50頂面之透鏡部52上方，各封裝膠體50頂面之透鏡部52係分別容納於光發射孔72及光接收孔74中，各延伸段78係分別位於凹溝51以及各封裝膠體50外周並且藉由黏性膠體70固接於承載面22。The cover 60 is disposed on the bearing surface 22 and the encapsulant 50, and is fixed on the bearing surface 22 and the encapsulant 50 by the adhesive colloid 70. The cover 60 is provided with a light emitting hole 72 and a light receiving hole. 74, the light emitting aperture 72 and the light receiving aperture 74 are respectively located above the light emitting chip 30 and the sensing wafer 40. Further, the cover 60 comprises a transverse section 76 and a plurality of extensions 78 extending downwardly from the transverse section 76. The horizontal section 76 is provided with a light emitting hole 72 and a light receiving hole 74. The horizontal section 76 is fixed to the shoulder portion 54 of the top surface of each of the encapsulants 50 by the adhesive colloid 70, and the light emitting hole 72 and the light receiving hole are provided. The lens portions 52 of the top surface of each of the encapsulants 50 are respectively received in the light emitting holes 72 and the light receiving holes 74, and the extending portions 78 are respectively located in the grooves 51. And the outer periphery of each encapsulant 50 is fixed to the bearing surface 22 by the adhesive colloid 70.
封蓋60係由不透光材質所製成，如不透光的環氧樹脂(Epoxy Resin)。The cover 60 is made of an opaque material such as Epoxy Resin.
請接著參考第4A~4D圖，係為本發明第一較佳實施例遠距離感測器的封裝結構10的封裝方法，係包含下列步驟：Please refer to FIG. 4A to FIG. 4D, which are packaging methods of the package structure 10 of the remote sensor according to the first preferred embodiment of the present invention, which includes the following steps:
步驟(a)：提供基板20，並將發光晶片30以及感測晶片40相互分離地設置於基板20之承載面22。Step (a): Providing the substrate 20 and disposing the luminescent wafer 30 and the sensing wafer 40 on the bearing surface 22 of the substrate 20 separately from each other.
步驟(b)：將二封裝膠體50分別包覆發光晶片30及感測晶片40，同時將各封裝膠體50彼此分離，值得一提的是，於本較佳實施例中係使用模壓(Molding)的方式將二封裝膠體50分別包覆發光晶片30及感測晶片40，並且係使用直接模壓成型的方式使各封裝膠體50彼此分離，另外，於本步驟中，於形成各封裝膠體50時，可同時於各封裝膠體50頂面形成一透鏡部52以及一肩部54。Step (b): The two encapsulants 50 are respectively coated on the light-emitting chip 30 and the sensing wafer 40, and the encapsulants 50 are separated from each other. It is worth mentioning that in the preferred embodiment, molding is used. The two encapsulants 50 respectively cover the illuminating wafer 30 and the sensing wafer 40, and the encapsulants 50 are separated from each other by direct compression molding. In addition, in this step, when each encapsulant 50 is formed, A lens portion 52 and a shoulder portion 54 may be formed on the top surface of each of the encapsulants 50 at the same time.
步驟(c)：將一預先成型之封蓋60設置於基板20之承載面22以及各封裝膠體50之上，並藉由黏性膠體70將封蓋60固接於基板20之承載面22以及各封裝膠體50，更進一步來說，於本步驟中，可將黏性膠體70(如不透光之環氧樹脂)經由點膠製程(Dispensing)塗佈於基板20之承載面22以及各封裝膠體50頂面之肩部54，再將封蓋60設置於基板20之承載面22以及各封裝膠體50之上，經由烘烤製程(Baking)使封蓋60固接於基板20之承載面22以及各封裝膠體50頂面之肩部54。Step (c): a pre-formed cover 60 is disposed on the bearing surface 22 of the substrate 20 and each of the encapsulants 50, and the cover 60 is fixed to the bearing surface 22 of the substrate 20 by the adhesive colloid 70 and Each of the encapsulants 50, and further, in this step, the adhesive colloid 70 (such as an opaque epoxy resin) can be applied to the carrying surface 22 of the substrate 20 via a dispensing process and each package. The top surface 54 of the colloid 50 is disposed on the bearing surface 22 of the substrate 20 and the encapsulant 50 of the substrate 50, and the cover 60 is fixed to the bearing surface 22 of the substrate 20 via a baking process. And a shoulder 54 on the top surface of each encapsulant 50.
請接著參考第5A~5E圖，係為本發明第二較佳實施例遠距離感測器的封裝結構10’的封裝方法，值得一提的是，第二較佳實施例之步驟(a)與第一較佳實施例之步驟(a)相同，其差異在於，第二較佳實施例之步驟(b)中，係使用模壓(Molding)的方式將單一封裝膠體55包覆發光晶片30及感測晶片40，並同時在上述單一封裝膠體55頂面形成二透鏡部52，各透鏡部52係分別位於發光晶片30及感測晶片40上方，之後再使用切割的方式將上述單一封裝膠體55切割成二彼此分離之封裝膠體50’，其中，各封裝膠體50’分別包覆發光晶片30及感測晶片40。Please refer to FIG. 5A to FIG. 5E , which are packaging methods of the package structure 10 ′ of the remote sensor according to the second preferred embodiment of the present invention. It is worth mentioning that the step (a) of the second preferred embodiment is The same as step (a) of the first preferred embodiment, the difference is that in the step (b) of the second preferred embodiment, the single encapsulant 55 is coated with the luminescent wafer 30 by using a molding method. The wafer 40 is sensed, and at the same time, the two lens portions 52 are formed on the top surface of the single encapsulant 55, and the lens portions 52 are respectively located on the light-emitting chip 30 and the sensing wafer 40, and then the single encapsulant 55 is cut by cutting. The encapsulant 50' is separated into two separate packages, wherein each encapsulant 50' covers the luminescent wafer 30 and the sensing wafer 40, respectively.
接著於第二較佳實施例之步驟(c)中，先將黏性膠體70(如錫膏)以網版印刷(Screen Printing)的方式塗佈於封蓋60底部，同時在各封裝膠體50’頂面之肩部54以及各封裝膠體50’之間以點膠製程塗佈黏性膠體70(如不透光之環氧樹脂)，在將封蓋60設置於基板20之承載面22以及各封裝膠體50’之上，經由烘烤製程(Baking)使封蓋60固接於基板20之承載面22以及各封裝膠體50’頂面之肩部54。Then in the step (c) of the second preferred embodiment, the adhesive colloid 70 (such as solder paste) is first applied to the bottom of the cover 60 by screen printing, and at the same time, each of the encapsulants 50 Applying a viscous colloid 70 (such as an opaque epoxy resin) between the top shoulder portion 54 and each of the encapsulants 50' in a dispensing process, the cover 60 is disposed on the carrier surface 22 of the substrate 20 and Above each of the encapsulants 50', the cover 60 is fixed to the bearing surface 22 of the substrate 20 and the shoulder portion 54 of the top surface of each encapsulant 50' via a baking process.
經由上述步驟，請參考第3圖，係為第二較佳實施例之封裝方法所製成之遠距離感測器之封裝結構10’。Through the above steps, please refer to FIG. 3, which is a package structure 10' of a remote sensor manufactured by the packaging method of the second preferred embodiment.
綜合上述說明，封蓋60可藉由黏性膠體70固接於承載面22以及各封裝膠體(50、50’)，提升了封裝結構(10、10’)的材料結合度，並且，由於封蓋60係為預先成型，於製造封蓋60時即可將光發射孔72及光接收孔74製成貼近各透鏡部52之尺寸，再直接藉由黏性膠體70將封蓋60固接於承載面22以及各封裝膠體(50、50’)之上，由於光發射孔72及光接收孔74可貼近各透鏡部52，因此可提高遠距離感測器之感測距離。In combination with the above description, the cover 60 can be fixed to the bearing surface 22 and the respective encapsulants (50, 50') by the adhesive colloid 70, thereby improving the material bonding degree of the package structure (10, 10'), and The cover 60 is pre-formed. When the cover 60 is manufactured, the light-emitting hole 72 and the light-receiving hole 74 can be made close to the size of each lens portion 52, and the cover 60 can be directly fixed by the adhesive colloid 70. Above the bearing surface 22 and each of the encapsulants (50, 50'), since the light emitting holes 72 and the light receiving holes 74 can be close to the respective lens portions 52, the sensing distance of the remote sensor can be improved.
最後必須再次說明，本發明於前揭實施例中所揭露的構成元件，僅為舉例說明，並非用來限制本案之範圍，其他等效元件的替代或變化，亦應為本案之申請專利範圍所涵蓋。Finally, it should be noted that the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention. The alternatives or variations of other equivalent elements should also be the scope of the patent application of the present application. Covered.
10、10’‧‧‧封裝結構 10, 10'‧‧‧ package structure
20‧‧‧基板 20‧‧‧Substrate
30‧‧‧發光晶片 30‧‧‧Lighting chip
40‧‧‧感測晶片 40‧‧‧Sensor wafer
50、50’‧‧‧封裝膠體 50, 50'‧‧‧Package colloid
55‧‧‧封裝膠體 55‧‧‧Package colloid
60‧‧‧封蓋 60‧‧‧ Cover
22‧‧‧承載面 22‧‧‧ bearing surface
51‧‧‧凹溝 51‧‧‧ Groove
52‧‧‧透鏡部 52‧‧‧ lens department
54‧‧‧肩部 54‧‧‧ shoulder
70‧‧‧黏性膠體 70‧‧‧ Viscous colloid
72‧‧‧光發射孔 72‧‧‧Light emitting aperture
74‧‧‧光接收孔 74‧‧‧Light receiving hole
76‧‧‧橫向段 76‧‧ ‧ horizontal section
78‧‧‧延伸段 78‧‧‧Extension
第1圖為本發明第一較佳實施例之俯視圖。 第2圖為第1圖之2-2剖線剖視圖。 第3圖為本發明第二較佳實施例之剖視圖。 第4A~4D圖為本發明第一較佳實施例之製造流程圖。 第5A~5E圖為本發明第二較佳實施例之製造流程圖。Figure 1 is a plan view of a first preferred embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line 2-2 of Fig. 1. Figure 3 is a cross-sectional view showing a second preferred embodiment of the present invention. 4A to 4D are manufacturing flow charts of the first preferred embodiment of the present invention. 5A-5E are manufacturing flow charts of a second preferred embodiment of the present invention.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106126580A TWI644456B (en) | 2016-12-30 | 2016-12-30 | Remote sensor packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106126580A TWI644456B (en) | 2016-12-30 | 2016-12-30 | Remote sensor packaging method |
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| Publication Number | Publication Date |
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| TW201824590A TW201824590A (en) | 2018-07-01 |
| TWI644456B true TWI644456B (en) | 2018-12-11 |
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| TW106126580A TWI644456B (en) | 2016-12-30 | 2016-12-30 | Remote sensor packaging method |
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| TW (1) | TWI644456B (en) |
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| CN111613692A (en) * | 2020-04-22 | 2020-09-01 | 福建天电光电有限公司 | Photoelectric switch packaging structure and packaging method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201619576A (en) * | 2014-11-20 | 2016-06-01 | 日月光半導體製造股份有限公司 | Optical module, method of manufacturing the same and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201619576A (en) * | 2014-11-20 | 2016-06-01 | 日月光半導體製造股份有限公司 | Optical module, method of manufacturing the same and electronic device |
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| TW201824590A (en) | 2018-07-01 |
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