TWI643931B - Tape for electronic device packaging - Google Patents
Tape for electronic device packaging Download PDFInfo
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- TWI643931B TWI643931B TW106109582A TW106109582A TWI643931B TW I643931 B TWI643931 B TW I643931B TW 106109582 A TW106109582 A TW 106109582A TW 106109582 A TW106109582 A TW 106109582A TW I643931 B TWI643931 B TW I643931B
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- adhesive layer
- metal layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Wire Bonding (AREA)
- Packages (AREA)
Abstract
本發明之課題為提供將附接著劑層之金屬層由黏著膠帶拾取時,可藉由拾取裝置,良好地辨識所欲拾取的附接著劑層之金屬層的單片之電子裝置封裝用膠帶。 An object of the present invention is to provide a single-piece electronic device packaging tape which can be used to recognize a metal layer of an adhesive layer to be picked up by a pick-up device when the metal layer of the adhesive layer is picked up by an adhesive tape.
其解決手段為,本發明之電子裝置封裝用膠帶(1),其特徵為具有:具有基材薄膜(51)與黏著劑層(52)之黏著膠帶(5)、層合於黏著劑層(52)之與基材薄膜(51)相反側而設置的接著劑層(4);與層合於與接著劑層(4)之與黏著劑層(52)相反側而設置的金屬層(3),且金屬層(3)係由十點平均粗度所得之表面粗度RzJIS為未達5.0μm。 The solution is the tape (1) for electronic device packaging of the present invention, which is characterized in that it has an adhesive tape (5) having a base film (51) and an adhesive layer (52), and is laminated on the adhesive layer ( 52) an adhesive layer (4) provided on the opposite side of the substrate film (51); and a metal layer (3) laminated on the opposite side of the adhesive layer (52) from the adhesive layer (4) And the metal layer (3) has a surface roughness RzJIS of less than 5.0 μm obtained from a ten-point average roughness.
Description
本發明係關於電子裝置封裝用膠帶,特別是關於具有金屬層之電子裝置封裝用膠帶。 The present invention relates to an adhesive tape for electronic device packaging, and more particularly to an electronic device packaging tape having a metal layer.
近年來,行動電話或筆記型PC等之電子機器,要求更加薄型化/小型化。因而,為了將搭載於電子機器之半導體封裝等之電子裝置封裝薄型化/小型化,係使電子裝置或電路基板之電極數增加,進而亦使節距變窄。如此之電子裝置封裝中,例如係有覆晶(FC;Flip Chip)構裝封裝。 In recent years, electronic devices such as mobile phones and notebook PCs have been required to be thinner and smaller. Therefore, in order to reduce the thickness and size of an electronic device package such as a semiconductor package mounted on an electronic device, the number of electrodes of the electronic device or the circuit board is increased, and the pitch is further narrowed. In such an electronic device package, for example, a flip chip (FC) package is provided.
於覆晶構裝封裝中,如上所述,電極數目增加或者窄節距化,因此發熱量增加係成為問題。因而,作為覆晶構裝封裝之散熱構造,提出有於電子裝置背面隔著接著劑層而設置金屬層(例如參照專利文獻1)。 In the flip chip package, as described above, the number of electrodes is increased or the pitch is narrowed, so that an increase in heat generation is a problem. Therefore, as a heat dissipation structure of the flip chip package, it is proposed to provide a metal layer on the back surface of the electronic device via the adhesive layer (see, for example, Patent Document 1).
又,於覆晶構裝封裝中,可能有電子裝置之線膨脹率與電路基板之線膨脹率大幅相異的情況。此時,於電子裝置封裝之製造過程中,中間製品被加熱及冷卻時,電子裝置與電路基板之間會產生膨脹量及收縮量的差 異。因為該差異,電子裝置封裝中會產生翹曲。作為抑制如此之翹曲的構造,亦提出於電子裝置之背面隔著接著劑層而設置金屬層(例如參照專利文獻2)。 Further, in the flip chip package, there is a possibility that the linear expansion ratio of the electronic device greatly differs from the linear expansion ratio of the circuit board. At this time, in the manufacturing process of the electronic device package, when the intermediate product is heated and cooled, the difference between the expansion amount and the shrinkage amount between the electronic device and the circuit substrate occurs. different. Because of this difference, warpage occurs in the electronic device package. As a structure for suppressing such warpage, it is also proposed to provide a metal layer on the back surface of the electronic device via the adhesive layer (see, for example, Patent Document 2).
進一步地,於覆晶構裝封裝中,亦提出於電子裝置之背面隔著接著劑層而設置金屬層,且使用該金屬層作為雷射標記用之保護層(例如參照專利文獻3)。 Further, in the flip chip package, it is also proposed to provide a metal layer on the back surface of the electronic device via the adhesive layer, and use the metal layer as a protective layer for laser marking (see, for example, Patent Document 3).
又,近年來,有於半導體晶片上進一步層合相同尺寸之其他半導體晶片,進行三次元構裝的情況。此處,為了可於半導體晶片上層合相同尺寸之其他半導體晶片,於兩者之間必須預先層合間隔件。其係因於半導體晶片中之電極墊部分上亦會層合其他半導體晶片之故。作為前述間隔件,提出了使用附接著劑層之金屬層(例如參照專利文獻4)。專利文獻4中記載,間隔件係藉由如下步驟而設置:將具有至少一面具備接著劑層之金屬層的間隔件用接著薄片,以接著劑層為貼合面貼合於切割薄片之步驟;切割間隔件用接著薄片,形成具備接著劑層之晶片狀的間隔件之步驟;將間隔件以插梢頂起,且將頂起的間隔件,藉由連同接著劑層自切割薄片剝離半導體晶片時所使用之拾取裝置,連同接著劑層一起自切割薄片剝離之步驟;與隔著接著劑層將間隔件固定於被黏著體之步驟。 Further, in recent years, other semiconductor wafers of the same size are further laminated on a semiconductor wafer, and a three-dimensional assembly is performed. Here, in order to laminate other semiconductor wafers of the same size on the semiconductor wafer, the spacers must be laminated in advance between the two. This is due to the fact that other semiconductor wafers are also laminated on the electrode pad portion of the semiconductor wafer. As the spacer, a metal layer using an adhesive layer has been proposed (for example, see Patent Document 4). Patent Document 4 discloses that the spacer is provided by the step of bonding a spacer having a metal layer having at least one surface of the adhesive layer to the dicing sheet with the adhesive layer as a bonding surface; Cutting the spacer with a sheet to form a wafer-like spacer having an adhesive layer; lifting the spacer with the spigot, and staking the spacer, and peeling the semiconductor wafer from the dicing sheet together with the adhesive layer The pick-up device used at the time, the step of peeling off the cut sheet together with the adhesive layer; and the step of fixing the spacer to the adherend via the adhesive layer.
[專利文獻1]日本特開2007-235022號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-235022
[專利文獻2]日本專利第5487847號公報 [Patent Document 2] Japanese Patent No. 5487847
[專利文獻3]日本專利第5419226號公報 [Patent Document 3] Japanese Patent No. 5419226
[專利文獻4]日本專利第4954569號公報 [Patent Document 4] Japanese Patent No. 4954569
如上所述,附接著劑層之金屬層,有用於各種電子裝置封裝,由生產性之觀點,如專利文獻4所揭示,要求使用既有的裝置進行拾取或對被黏著體之固定。 As described above, the metal layer of the adhesive layer is used for various electronic device packages, and from the viewpoint of productivity, as disclosed in Patent Document 4, it is required to use an existing device for picking up or fixing the adherend.
既有之拾取裝置中,係將半導體晶片以吸附器(colette)真空吸附來進行拾取。此時,有必要將半導體晶片確實地進行拾取,因此係進行辨識半導體晶片之位置,檢測半導體晶片之偏移,修正吸附器之位置,而拾取半導體晶片。 In the conventional pick-up device, the semiconductor wafer is vacuum-adsorbed by a colette for pick-up. At this time, it is necessary to surely pick up the semiconductor wafer. Therefore, the position of the semiconductor wafer is recognized, the offset of the semiconductor wafer is detected, the position of the adsorber is corrected, and the semiconductor wafer is picked up.
半導體晶片之辨識方法,主要使用圖型辨識。使用圖型辨識之方法,係預先登錄半導體晶片之電路、校準標記或晶片外形等作為樣板,並比對該樣板與由攝影裝置所攝影之半導體晶片的影像,來辨識半導體晶片之位置。如裸晶片般,未形成有電路或校準標記時,係登錄以晶片外形與均勻的晶片面所構成的樣板。 The identification method of the semiconductor wafer mainly uses pattern recognition. Using the pattern recognition method, a circuit of a semiconductor wafer, a calibration mark, or a wafer shape is preliminarily registered as a template, and the position of the semiconductor wafer is identified by an image of the template and the semiconductor wafer imaged by the photographing device. As with a bare wafer, when no circuit or calibration mark is formed, a pattern consisting of the wafer shape and a uniform wafer surface is registered.
欲使用如此之既有的拾取裝置,由黏著膠帶拾取附接著劑層之金屬層時,因為於金屬層上不存在電路,因此與裸晶片同樣地,係使用以金屬層外形與均勻的 金屬層面所構成的樣板。但是,金屬層之表面粗度大時,攝影裝置會檢測出表面的凹凸,判斷所攝影之金屬層表面與樣板不同,結果有無法辨識金屬層單片的問題。 In order to use such a conventional pick-up device, when the metal layer of the adhesive layer is picked up by the adhesive tape, since the circuit does not exist on the metal layer, the appearance and uniformity of the metal layer are used similarly to the bare wafer. A model of a metal layer. However, when the surface roughness of the metal layer is large, the photographing device detects the unevenness of the surface, and judges that the surface of the photographed metal layer is different from the template, and as a result, there is a problem that the metal layer is not recognized.
因而,本案發明之目的為提供將附接著劑層之金屬層由黏著膠帶拾取時,可藉由拾取裝置,良好地辨識欲拾取的附接著劑層之金屬層的單片之電子裝置封裝用膠帶。 Accordingly, it is an object of the present invention to provide a single-piece electronic device packaging tape which can be used to pick up a metal layer of an adhesive layer to be picked up by a pick-up device when the metal layer of the adhesive layer is picked up by an adhesive tape. .
為了解決以上課題,本發明之電子裝置封裝用膠帶,其特徵為具有:具有基材薄膜與黏著劑層之黏著膠帶、層合於前述黏著劑層之與前述基材薄膜相反側而設置之接著劑層、與層合於前述接著劑層之與前述黏著劑層相反側而設置之金屬層,且前述金屬層,與接著劑層相反側之面的由十點平均粗度所得之表面粗度RzJIS為未達5.0μm。 In order to solve the above problems, an adhesive tape for an electronic device according to the present invention has an adhesive tape having a base film and an adhesive layer, and is laminated on the opposite side of the adhesive film from the base film. a layer of a metal layer disposed on a side opposite to the adhesive layer of the adhesive layer, and a surface roughness obtained by a ten-point average roughness of the surface of the metal layer opposite to the adhesive layer RzJIS is less than 5.0 μm .
上述電子裝置封裝用膠帶,前述金屬層之於入射角60度的鏡面光澤度較佳為未達100%。 In the above-mentioned tape for electronic device packaging, the specular gloss of the metal layer at an incident angle of 60 degrees is preferably less than 100%.
上述電子裝置封裝用膠帶,金屬層之厚度較佳為5μm以上且未達200μm。 In the above-mentioned tape for electronic device packaging, the thickness of the metal layer is preferably 5 μm or more and less than 200 μm.
上述電子裝置封裝用膠帶,於自前述黏著膠帶拾取前述接著劑層及前述金屬層的狀態下,前述黏著膠帶與前述接著劑層之黏著力較佳為0.03~0.5N/25mm。 In the above-described adhesive tape for electronic device packaging, in the state in which the adhesive layer and the metal layer are picked up from the adhesive tape, the adhesive force between the adhesive tape and the adhesive layer is preferably 0.03 to 0.5 N/25 mm.
上述電子裝置封裝用膠帶,前述金屬層較佳 為含有銅或鋁。 The above-mentioned electronic device packaging tape, the metal layer is preferably It contains copper or aluminum.
又,上述電子裝置封裝用膠帶,前述接著劑層較佳含有(A)環氧樹脂、(B)硬化劑、(C)丙烯酸樹脂或苯氧樹脂、及(D)經表面處理之無機填充材。 Further, in the above-described tape for electronic device packaging, the adhesive layer preferably contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. .
又,電子裝置封裝用膠帶,前述黏著劑層較佳含有包含CH2=CHCOOR(式中,R為碳數4~18之烷基)表示之丙烯酸酯、含羥基之單體、與分子內具有自由基反應性碳-碳雙鍵之異氰酸酯化合物所構成的丙烯酸系聚合物。 Further, in the tape for electronic device packaging, the adhesive layer preferably contains an acrylate represented by CH 2 =CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and an intramolecular component. An acrylic polymer composed of an isocyanate compound having a radical-reactive carbon-carbon double bond.
依照本發明,將附接著劑層之金屬層由黏著膠帶拾取時,可藉由拾取裝置,良好地辨識欲拾取的附接著劑層之金屬層的單片。 According to the present invention, when the metal layer of the adhesive layer is picked up by the adhesive tape, a single piece of the metal layer of the adhesive layer to be picked up can be well recognized by the pick-up device.
1‧‧‧電子裝置封裝用膠帶 1‧‧‧Electronic device packaging tape
2‧‧‧基材膠帶 2‧‧‧Substrate tape
3‧‧‧金屬層 3‧‧‧metal layer
4‧‧‧接著劑層 4‧‧‧ adhesive layer
5‧‧‧黏著膠帶 5‧‧‧Adhesive tape
5a‧‧‧標籤部 5a‧‧‧Label
5b‧‧‧周邊部 5b‧‧‧ peripherals
[圖1]示意顯示本發明之實施形態的電子裝置封裝用膠帶之構造的截面圖。 Fig. 1 is a cross-sectional view schematically showing the structure of an adhesive tape for electronic device according to an embodiment of the present invention.
[圖2](a)為示意顯示本發明之實施形態的電子裝置封裝用膠帶之構造的平面圖、(b)為該截面圖。 Fig. 2 (a) is a plan view schematically showing a structure of an adhesive tape for electronic device packaging according to an embodiment of the present invention, and (b) is a cross-sectional view.
[圖3]示意顯示本發明之實施形態的電子裝置封裝用膠帶之構造的透視圖。 Fig. 3 is a perspective view schematically showing the structure of an adhesive tape for electronic device according to an embodiment of the present invention.
[圖4]示意顯示本發明之實施形態的電子裝置封裝用 膠帶之製造方法的說明圖,(A)為顯示金屬層之貼合步驟的長邊方向截面圖、(B)為顯示接著劑層之貼合步驟的長邊方向截面圖、(C)為顯示預切(precut)步驟之短邊方向截面圖、(D)為顯示不要部分之去除步驟的透視圖。 FIG. 4 is a view schematically showing an electronic device package according to an embodiment of the present invention; (A) is a longitudinal cross-sectional view showing a bonding step of a metal layer, (B) is a longitudinal cross-sectional view showing a bonding step of an adhesive layer, and (C) is a display. A short-side cross-sectional view of the precut step, and (D) is a perspective view showing a removal step of the unnecessary portion.
[圖5]示意顯示本發明之實施形態的電子裝置封裝用膠帶之製造方法的說明圖,(A)為顯示黏著膠帶之貼合步驟的短邊方向截面圖、(B)為顯示預切步驟之短邊方向截面圖、(C)為顯示不要部分之去除步驟的短邊方向截面圖。 FIG. 5 is an explanatory view showing a method of manufacturing an adhesive tape for electronic device according to an embodiment of the present invention, wherein (A) is a cross-sectional view showing a step of bonding the adhesive tape, and (B) is a step of displaying a pre-cut. The cross-sectional view in the short side direction and (C) are cross-sectional views in the short side direction showing the removal step of the unnecessary portion.
[圖6]示意說明本發明之實施形態的電子裝置封裝用膠帶之使用方法的截面圖。 Fig. 6 is a cross-sectional view schematically showing a method of using an adhesive tape for electronic device according to an embodiment of the present invention.
[圖7]示意說明本發明之實施形態的電子裝置封裝用膠帶之使用方法的截面圖。 Fig. 7 is a cross-sectional view schematically showing a method of using an adhesive tape for electronic device according to an embodiment of the present invention.
[圖8]示意顯示使用本發明之實施形態的電子裝置封裝用膠帶之電子裝置封裝的構造之截面圖。 Fig. 8 is a cross-sectional view schematically showing a structure of an electronic device package using a tape for electronic device packaging according to an embodiment of the present invention.
以下詳細說明本發明之實施形態。 Hereinafter, embodiments of the present invention will be described in detail.
圖1為顯示本發明之實施形態的電子裝置封裝用膠帶1之截面圖。該電子裝置封裝用膠帶1,具有由基材薄膜51與設置於基材薄膜51上之黏著劑層52所成的黏著膠帶5,於黏著劑層52上,設置有接著劑層4、與層合於接著劑層4而設置的金屬層3。金屬層3,亦可隔 著用以使與接著劑層4之密著性成為良好的底塗層等,而間接地設置於接著劑層4上。 Fig. 1 is a cross-sectional view showing an adhesive tape 1 for an electronic device according to an embodiment of the present invention. The electronic device encapsulating tape 1 has an adhesive tape 5 formed of a base film 51 and an adhesive layer 52 provided on the base film 51, and an adhesive layer 4 and a layer are provided on the adhesive layer 52. The metal layer 3 is provided in combination with the adhesive layer 4. Metal layer 3, can also be separated The undercoat layer or the like for making the adhesion to the adhesive layer 4 excellent is provided indirectly on the adhesive layer 4.
本發明之電子裝置封裝用膠帶1,如圖2及圖3所示,較佳為黏著膠帶5被切斷為對應於環狀框架R(參照圖7)之形狀,且金屬層3及接著劑層4亦對應於此而被切斷(預切加工)為特定形狀,本實施形態中係經預切加工。 As shown in FIGS. 2 and 3, the adhesive tape 1 for electronic device packaging of the present invention preferably has the adhesive tape 5 cut into a shape corresponding to the annular frame R (refer to FIG. 7), and the metal layer 3 and the adhesive The layer 4 is also cut (precut) into a specific shape in accordance with this, and in the present embodiment, it is pre-cut.
本發明之電子裝置封裝用膠帶1,如圖2及圖3所示,較佳為將形成有複數個層合體之長形之基材膠帶2捲繞為輥狀之形態,該層合體係層合有金屬層3、接著劑層4、切斷為對應於環狀框架R之形狀的黏著膠帶5(標籤部5a);本實施形態中,雖捲繞為輥狀,但亦可為設置於基材膠帶2之層合體逐個被切斷的形態。 As shown in FIG. 2 and FIG. 3, the tape 1 for electronic device packaging of the present invention preferably has a shape in which a long substrate tape 2 in which a plurality of laminates are formed is wound into a roll shape, and the laminated system layer is formed. The metal layer 3 and the adhesive layer 4 are bonded to the adhesive tape 5 (label portion 5a) which is cut into a shape corresponding to the annular frame R. In the present embodiment, the film is wound into a roll shape, but may be provided in a roll shape. The laminate of the base tape 2 is cut one by one.
被預切加工而捲繞為輥狀時,如圖2及圖3所示,電子裝置封裝用膠帶1,具有基材膠帶2,於基材膠帶2上,設置有具有特定平面形狀之金屬層3;於金屬層3之與基材膠帶2側相反側與金屬層3層合而設置,且具有特定平面形狀之接著劑層4;與具有被覆接著劑層4且設置為於接著劑層4周圍與基材膠帶2接觸的特定平面形狀之標籤部5a及包圍該標籤部5a之外側的周邊部5b之黏著膠帶5。 When it is pre-cut and wound into a roll shape, as shown in FIGS. 2 and 3, the electronic device packaging tape 1 has a base tape 2, and a metal layer having a specific planar shape is provided on the base tape 2. 3; an adhesive layer 4 provided on the opposite side of the metal layer 3 from the side of the substrate tape 2 and laminated with the metal layer 3, and having a specific planar shape; and having the adhesive layer 4 and disposed on the adhesive layer 4 A label portion 5a having a specific planar shape in contact with the substrate tape 2 and an adhesive tape 5 surrounding the peripheral portion 5b on the outer side of the label portion 5a.
標籤部5a,具有對應於切割用之環狀框架R的形狀。對應於切割用之環狀框架R的形狀之形狀,較佳為與環狀框架R之內側大致相同形狀且係大於環狀框架R 內側之大小的相似形。又,並不一定必須為圓形,但較佳為接近圓形之形狀、更佳為圓形。周邊部5b,包含完全包圍標籤部5a之外側的形態、與如圖示之未完全包圍之形態。再者,亦可不設置周邊部5b,但若設置時,於捲繞為輥狀的形態時,可分散標籤部5a之捲曲的張力。 The label portion 5a has a shape corresponding to the annular frame R for dicing. The shape corresponding to the shape of the annular frame R for cutting is preferably substantially the same shape as the inner side of the annular frame R and larger than the annular frame R. Similar shape of the size of the inside. Further, it is not necessarily required to be circular, but it is preferably a shape close to a circle, and more preferably a circle. The peripheral portion 5b includes a form that completely surrounds the outer side of the label portion 5a and a form that is not completely surrounded as shown. Further, the peripheral portion 5b may not be provided. However, when it is installed, when it is wound into a roll shape, the tension of the curl of the label portion 5a can be dispersed.
接著劑層4具有特定之平面形狀,該平面形狀,以將環狀框架R貼合於黏著膠帶5之標籤部5a的周緣部,而能夠以拾取裝置之頂起構件頂起的方式(參照圖7(C)),而成為小於標籤部5a之形狀。接著劑層4,較佳為與標籤部5a大致相同形狀且係小於標籤部5a之大小的相似形。接著劑層4,並不一定必須為圓形,但較佳為接近圓形之形狀、更佳為圓形。 The adhesive layer 4 has a specific planar shape in which the annular frame R is bonded to the peripheral edge portion of the label portion 5a of the adhesive tape 5, and can be lifted up by the lifting member of the pickup device (refer to the drawing). 7(C)), which is smaller than the shape of the label portion 5a. The subsequent layer 4 is preferably substantially the same shape as the label portion 5a and is similar to the size of the label portion 5a. The subsequent agent layer 4 does not necessarily have to be circular, but is preferably close to a circular shape, more preferably circular.
金屬層3係為與接著劑層4相同之形狀,接著劑層4層合於金屬層3。此處所稱之層合,只要主要部分有層合即可,金屬層3與接著劑層4並不一定必須為相同大小,但由製造之便利性而言,較佳為大致相同形狀。以下說明各構成要素。 The metal layer 3 has the same shape as the adhesive layer 4, and the adhesive layer 4 is laminated on the metal layer 3. The lamination referred to herein is not necessarily required to be the same size as long as the main portion is laminated, but it is preferably substantially the same shape in terms of convenience in production. Each component will be described below.
基材膠帶2可由公知之分隔件構成,但亦可直接使用電子裝置封裝用膠帶之預切加工所使用之基材膠帶。直接使用電子裝置封裝用膠帶之預切加工所使用之基材膠帶時,基材膠帶2於預切加工時必須黏著保持金屬層3,因此可適合地使用例如具有樹脂薄膜與設置於樹脂薄膜之單 面的基材膠帶用黏著劑層之膠帶。 The base tape 2 may be composed of a known separator, but the base tape used for pre-cutting of the tape for electronic device packaging may be directly used. When the base tape used for the pre-cut processing of the tape for electronic device packaging is used as it is, the base tape 2 must adhere to the metal layer 3 during the pre-cut processing, and therefore, for example, a resin film and a resin film can be suitably used. single The adhesive tape of the adhesive tape layer on the surface of the substrate.
構成基材膠帶2之樹脂薄膜的素材,可使用公知材料,若為例示者,則可列舉聚酯(PET、PBT、PEN、PBN、PTT)系、聚烯烴(PP、PE)系、共聚物(EVA、EEA、EBA)系、及將此等材料一部分取代,進一步提高接著性或機械強度之薄膜。又,亦可為此等薄膜之層合體。由耐熱性、平滑性、及獲得容易性的觀點,較佳為由聚對苯二甲酸乙二酯、聚丙烯、及聚乙烯中選擇。 A known material can be used as the material of the resin film constituting the base tape 2, and examples thereof include polyester (PET, PBT, PEN, PBN, PTT), polyolefin (PP, PE), and copolymer. (EVA, EEA, EBA), and a film in which some of these materials are substituted to further improve adhesion or mechanical strength. Further, a laminate of the film may be used for this purpose. From the viewpoints of heat resistance, smoothness, and ease of availability, it is preferably selected from polyethylene terephthalate, polypropylene, and polyethylene.
構成基材膠帶2之樹脂薄膜的厚度,並無特殊限定,可適當設定,較佳為10~150μm。 The thickness of the resin film constituting the base tape 2 is not particularly limited and may be appropriately set, and is preferably 10 to 150 μm.
使用於基材膠帶用黏著劑層之樹脂,可使用黏著劑所使用之公知氯化聚丙烯樹脂、丙烯酸樹脂、聚酯樹脂、聚胺基甲酸酯樹脂、環氧樹脂等,較佳為以丙烯酸系聚合物為基底聚合物之丙烯酸系黏著劑。 As the resin used for the adhesive layer for a base tape, a known chlorinated polypropylene resin, an acrylic resin, a polyester resin, a polyurethane resin, an epoxy resin or the like which is used for the adhesive can be used, and preferably The acrylic polymer is an acrylic adhesive of a base polymer.
丙烯酸系聚合物,可列舉例如使用(甲基)丙烯酸烷基酯(例如甲基酯、乙基酯、丙基酯、異丙基酯、丁基酯、異丁基酯、s-丁基酯、t-丁基酯、戊基酯、異戊基酯、己基酯、庚基酯、辛基酯、2-乙基己基酯、異辛基酯、壬基酯、癸基酯、異癸基酯、十一烷基酯、十二烷基酯、十三烷基酯、十四烷基酯、十六烷基酯、十八烷基酯、二十烷基酯等之烷基的碳數1~30、特別是碳數4~18之直鏈狀或分支鏈狀的烷基酯等)及(甲基)丙烯酸環烷基酯(例如環戊基酯、環己基酯等)之1種或2種以上作為單體成分的丙烯酸系聚合物等。再者,(甲基) 丙烯酸酯係指丙烯酸酯及/或甲基丙烯酸酯,本發明之(甲基)均為相同之意義。 Examples of the acrylic polymer include alkyl (meth)acrylate (for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester). , t-butyl ester, amyl ester, isoamyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, decyl ester, decyl ester, isodecyl Carbon number of alkyl groups such as ester, undecyl ester, dodecyl ester, tridecyl ester, myristyl ester, cetyl ester, octadecyl ester, eicosyl ester, etc. 1 to 30, particularly a linear or branched alkyl ester having 4 to 18 carbon atoms, and a cycloalkyl (meth)acrylate (for example, cyclopentyl ester or cyclohexyl ester) Or two or more types of acrylic polymers and the like as a monomer component. Furthermore, (methyl) Acrylate means acrylate and/or methacrylate, and the (meth) of the present invention has the same meaning.
丙烯酸系聚合物,亦能夠以凝集力、耐熱性等之改質為目的,依需要含有可與前述(甲基)丙烯酸烷基酯或環烷基酯共聚合之其他單體成分所對應的單位。如此之單體成分可列舉例如丙烯酸、甲基丙烯酸、(甲基)丙烯酸羧基乙酯、(甲基)丙烯酸羧基戊酯、依康酸、馬來酸、富馬酸、巴豆酸等之含羧基之單體;馬來酸酐、依康酸酐等之酸酐單體;(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(甲基)丙烯酸(4-羥基甲基環己基)甲酯等之含羥基之單體;苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺-2-甲基丙烷磺酸、(甲基)丙烯醯胺丙烷磺酸、(甲基)丙烯酸磺丙酯、(甲基)丙烯醯氧基萘磺酸等之含磺酸基之單體;2-羥基乙基丙烯醯基磷酸酯等之含磷酸基之單體;丙烯醯胺、丙烯腈等。此等可共聚合之單體成分,可使用1種或2種以上。此等可共聚合之單體的使用量,較佳為全部單體成分之40重量%以下。 The acrylic polymer may also have a unit corresponding to other monomer components copolymerizable with the alkyl (meth)acrylate or the cycloalkyl ester as needed for the purpose of reforming such as cohesive force and heat resistance. . Examples of such a monomer component include carboxyl groups such as acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, isaconic acid, maleic acid, fumaric acid, and crotonic acid. Monomer; anhydride monomer such as maleic anhydride or isaconic anhydride; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (meth)acrylic acid ( a hydroxyl group-containing monomer such as 4-hydroxymethylcyclohexyl)methyl ester; styrenesulfonic acid, allylsulfonic acid, 2-(methyl)propenylamine-2-methylpropanesulfonic acid, (methyl a sulfonic acid group-containing monomer such as acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate or (meth) propylene phthaloxy naphthalene sulfonic acid; 2-hydroxyethyl acrylonitrile phosphate; a monomer containing a phosphate group; acrylamide, acrylonitrile, or the like. These monomer components which can be copolymerized may be used alone or in combination of two or more. The amount of these copolymerizable monomers to be used is preferably 40% by weight or less based on the entire monomer components.
進一步地,丙烯酸系聚合物因為會被交聯,因此亦可依需要含有多官能性單體等作為共聚合用單體成分。如此之多官能性單體,可列舉例如己二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙 二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、(甲基)丙烯酸環氧酯、聚酯(甲基)丙烯酸酯、胺基甲酸酯(甲基)丙烯酸酯等。此等多官能性單體亦可使用1種或2種以上。多官能性單體之使用量,由黏著特性等之觀點,較佳為全部單體成分之30重量%以下。 Further, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like may be contained as a monomer component for copolymerization as needed. Examples of such a polyfunctional monomer include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, and (poly)propyl. Diol (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (methyl) Acrylate, dipentaerythritol hexa(meth) acrylate, (meth) acrylate epoxy ester, polyester (meth) acrylate, urethane (meth) acrylate, and the like. These polyfunctional monomers may be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less based on the total of the monomer components from the viewpoint of adhesion characteristics and the like.
丙烯酸系聚合物之配製,例如可對1種或2種以上之成分單體的混合物應用溶液聚合方式或乳化聚合方式、塊狀聚合方式或懸浮聚合方式等之適當方式來進行。基材膠帶用黏著劑層,由防止晶圓污染等之觀點,較佳為抑制低分子量物質之含有的組成,由該觀點,係以重量平均分子量30萬以上、特別是40萬~300萬之丙烯酸系聚合物為主成分者較佳,由此,黏著劑亦能夠以內部交聯方式或外部交聯方式等而成為適當的交聯形態。 The preparation of the acrylic polymer can be carried out, for example, by a suitable method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method or a suspension polymerization method, for a mixture of one or two or more kinds of component monomers. The adhesive layer for a base tape is preferably a composition for suppressing the inclusion of a low molecular weight substance from the viewpoint of preventing contamination of the wafer. From this viewpoint, the weight average molecular weight is 300,000 or more, particularly 400,000 to 3,000,000. The acrylic polymer is preferred as a main component, and thus the adhesive can be appropriately crosslinked by an internal crosslinking method or an external crosslinking method.
又,為了控制基材膠帶用黏著劑層之交聯密度而提高與黏著膠帶5之剝離性,例如可採用使用多官能異氰酸酯系化合物、多官能環氧系化合物、三聚氰胺系化合物、金屬鹽系化合物、金屬鉗合系化合物、胺基樹脂系化合物、或過氧化物等之適當的外部交聯劑來進行交聯處理之方式;或混合具有2個以上碳-碳雙鍵之低分子化合物並藉由能量線照射等來進行交聯處理之方式等之適當方式。使用外部交聯劑時,其使用量係依與欲交聯之基底聚 合物的平衡、進而依作為黏著劑之使用用途來適當決定。一般而言,相對於前述基底聚合物100重量份而言,較佳摻合20重量份左右以下、更佳摻合0.1重量份~20重量份。 Further, in order to control the crosslink density of the adhesive layer for a base tape, the peeling property with the adhesive tape 5 is improved, and for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, or a metal salt compound can be used. a method of crosslinking treatment by a suitable external crosslinking agent such as a metal nip compound, an amine resin compound, or a peroxide; or mixing a low molecular compound having two or more carbon-carbon double bonds and borrowing An appropriate method such as a method of performing crosslinking treatment by irradiation with an energy ray or the like. When an external crosslinking agent is used, the amount of the crosslinking agent is based on the matrix to be crosslinked. The balance of the compound and the use of the adhesive are appropriately determined depending on the use of the adhesive. In general, it is preferably blended in an amount of about 20 parts by weight or less, more preferably from 0.1 part by weight to 20 parts by weight, based on 100 parts by weight of the base polymer.
基材膠帶用黏著劑層之厚度,無特殊限制,可適當決定,一般而言為3~200μm左右。又,基材膠帶用黏著劑層可由單層構成亦可由複數層構成。 The thickness of the adhesive layer for the base tape is not particularly limited and can be appropriately determined, and is generally about 3 to 200 μm. Further, the adhesive layer for the base tape may be composed of a single layer or a plurality of layers.
黏著膠帶5,並無特殊限制,可使用習知之切割膠帶。作為黏著膠帶5,例如可適合使用於基材薄膜51上設置有黏著劑層52者。 The adhesive tape 5 is not particularly limited, and a conventional cutting tape can be used. As the adhesive tape 5, for example, an adhesive layer 52 may be suitably used for the base film 51.
基材薄膜51,只要係以往公知者則可無特別限制地使用,但使用放射線硬化性之材料作為後述黏著劑層52時,較佳為使用具有放射線透過性者。 The base film 51 is not particularly limited as long as it is conventionally known. However, when a radiation curable material is used as the adhesive layer 52 to be described later, it is preferable to use a radiation-transmitting property.
例如,作為其材料,可列舉聚乙烯、聚丙烯、乙烯-丙烯共聚物、聚丁烯-1、聚-4-甲基戊烯-1、乙烯-乙酸乙烯酯共聚物、乙烯-丙烯酸乙酯共聚物、乙烯-丙烯酸甲酯共聚物、乙烯-丙烯酸共聚物、離子聚合物等之α-烯烴之均聚物或共聚物或此等之混合物、聚胺基甲酸酯、苯乙烯-乙烯-丁烯或戊烯系共聚物、聚醯胺-多元醇共聚物等之熱可塑性彈性體、及此等之混合物。又,基材薄膜亦可為混合由此等之群中選出的2種以上之材料者,此等亦可為單層或經複層化者。 For example, examples of the material thereof include polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, and ethylene-ethyl acrylate. a homopolymer or copolymer of an α-olefin of a copolymer, an ethylene-methyl acrylate copolymer, an ethylene-acrylic acid copolymer, an ionic polymer, or the like, a mixture thereof, a polyurethane, a styrene-ethylene- A thermoplastic elastomer such as a butene or pentene copolymer, a polyamine-polyol copolymer, or the like, and a mixture thereof. Further, the base film may be a mixture of two or more selected from the group, and the like may be a single layer or a stratified layer.
基材薄膜51之厚度並無特殊限定,可適當設定,但考慮到拾取時之擴展步驟時,較佳為50~200μm。 The thickness of the base film 51 is not particularly limited and may be appropriately set. However, in consideration of the expansion step at the time of picking up, it is preferably 50 to 200 μm.
為了提高基材薄膜51與黏著劑層52之密著性,亦可對基材薄膜51之表面施以鉻酸處理、臭氧暴露、火焰暴露、高壓電撃暴露、離子化放射線處理等之化學或物理性表面處理。 In order to improve the adhesion between the base film 51 and the adhesive layer 52, the surface of the base film 51 may be subjected to chemistry such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric discharge, ionizing radiation treatment, or the like. Sexual surface treatment.
又,本實施形態中,雖於基材薄膜51上直接設置黏著劑層52,但亦可隔著用以提高密著性之底塗層、或用以提高切割時之切削性的錨定層、應力緩和層、抗靜電層等而間接地設置。 Further, in the present embodiment, the adhesive layer 52 is directly provided on the base film 51, but an undercoat layer for improving adhesion or an anchor layer for improving machinability at the time of cutting may be interposed therebetween. Indirectly provided by a stress relaxation layer, an antistatic layer, or the like.
黏著膠帶5之黏著劑層52所使用的樹脂,並無特殊限定,可使用黏著劑所使用之公知的氯化聚丙烯樹脂、丙烯酸樹脂、聚酯樹脂、聚胺基甲酸酯樹脂、環氧樹脂等,較佳為以丙烯酸系聚合物為基底聚合物之丙烯酸系黏著劑。 The resin used for the adhesive layer 52 of the adhesive tape 5 is not particularly limited, and a known chlorinated polypropylene resin, an acrylic resin, a polyester resin, a polyurethane resin, or an epoxy used in the adhesive can be used. The resin or the like is preferably an acrylic adhesive having an acrylic polymer as a base polymer.
丙烯酸系聚合物,可列舉例如使用(甲基)丙烯酸烷基酯(例如甲基酯、乙基酯、丙基酯、異丙基酯、丁基酯、異丁基酯、s-丁基酯、t-丁基酯、戊基酯、異戊基酯、己基酯、庚基酯、辛基酯、2-乙基己基酯、異辛基酯、壬基酯、癸基酯、異癸基酯、十一烷基酯、十二烷基酯、十三烷基酯、十四烷基酯、十六烷基酯、十八烷基酯、二十烷基酯等之烷基的碳數1~30、特別是碳數4~18之直鏈狀或分支鏈狀的烷基酯等)及(甲基)丙烯酸環烷基酯(例如環戊基酯、環己基酯等)之1種或2種 以上作為單體成分的丙烯酸系聚合物等。再者,(甲基)丙烯酸酯係指丙烯酸酯及/或甲基丙烯酸酯,本發明之(甲基)均為相同之意義。 Examples of the acrylic polymer include alkyl (meth)acrylate (for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester). , t-butyl ester, amyl ester, isoamyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, decyl ester, decyl ester, isodecyl Carbon number of alkyl groups such as ester, undecyl ester, dodecyl ester, tridecyl ester, myristyl ester, cetyl ester, octadecyl ester, eicosyl ester, etc. 1 to 30, particularly a linear or branched alkyl ester having 4 to 18 carbon atoms, and a cycloalkyl (meth)acrylate (for example, cyclopentyl ester or cyclohexyl ester) Or 2 The acrylic polymer or the like as a monomer component. Further, (meth) acrylate means acrylate and/or methacrylate, and (meth) of the present invention has the same meaning.
丙烯酸系聚合物,能夠以凝集力、耐熱性、交聯性等之改質為目的,依需要含有可與前述(甲基)丙烯酸烷基酯或環烷基酯共聚合之其他單體成分所對應的單位。如此之單體成分可列舉例如丙烯酸、甲基丙烯酸、(甲基)丙烯酸羧基乙酯、(甲基)丙烯酸羧基戊酯、依康酸、馬來酸、富馬酸、巴豆酸等之含羧基之單體;馬來酸酐、依康酸酐等之酸酐單體;(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(甲基)丙烯酸(4-羥基甲基環己基)甲酯等之含羥基之單體;苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺-2-甲基丙烷磺酸、(甲基)丙烯醯胺丙烷磺酸、(甲基)丙烯酸磺丙酯、(甲基)丙烯醯氧基萘磺酸等之含磺酸基之單體;2-羥基乙基丙烯醯基磷酸酯等之含磷酸基之單體;丙烯醯胺、丙烯腈等。此等可共聚合之單體成分,可使用1種或2種以上。此等可共聚合之單體的使用量,較佳為全部單體成分之40重量%以下。 The acrylic polymer can be modified by agglomeration, heat resistance, crosslinkability, etc., and optionally contains other monomer components copolymerizable with the alkyl (meth)acrylate or cycloalkyl ester. Corresponding unit. Examples of such a monomer component include carboxyl groups such as acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, isaconic acid, maleic acid, fumaric acid, and crotonic acid. Monomer; anhydride monomer such as maleic anhydride or isaconic anhydride; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (meth)acrylic acid ( a hydroxyl group-containing monomer such as 4-hydroxymethylcyclohexyl)methyl ester; styrenesulfonic acid, allylsulfonic acid, 2-(methyl)propenylamine-2-methylpropanesulfonic acid, (methyl a sulfonic acid group-containing monomer such as acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate or (meth) propylene phthaloxy naphthalene sulfonic acid; 2-hydroxyethyl acrylonitrile phosphate; a monomer containing a phosphate group; acrylamide, acrylonitrile, or the like. These monomer components which can be copolymerized may be used alone or in combination of two or more. The amount of these copolymerizable monomers to be used is preferably 40% by weight or less based on the entire monomer components.
進一步地,丙烯酸系聚合物因為會被交聯,因此亦可依需要含有多官能性單體等作為共聚合用單體成分。如此之多官能性單體,可列舉例如己二醇二(甲基) 丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、(甲基)丙烯酸環氧酯、聚酯(甲基)丙烯酸酯、胺基甲酸酯(甲基)丙烯酸酯等。此等多官能性單體亦可使用1種或2種以上。多官能性單體之使用量,由黏著特性等之觀點,較佳為全部單體成分之30重量%以下。 Further, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like may be contained as a monomer component for copolymerization as needed. Such a polyfunctional monomer may, for example, be hexanediol di(methyl) Acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, Trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, (meth)acrylic acid epoxy ester, polyester (meth) acrylate, A urethane (meth) acrylate or the like. These polyfunctional monomers may be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less based on the total of the monomer components from the viewpoint of adhesion characteristics and the like.
丙烯酸系聚合物之配製,例如可對1種或2種以上之成分單體的混合物應用溶液聚合方式或乳化聚合方式、塊狀聚合方式或懸浮聚合方式等之適當方式來進行。黏著劑層52,較佳為抑制低分子量物質之含有的組成,由該觀點,係以重量平均分子量30萬以上、特別是40萬~300萬之丙烯酸系聚合物為主成分者較佳,由此,黏著劑亦能夠以內部交聯方式或外部交聯方式等而成為適當的交聯形態。 The preparation of the acrylic polymer can be carried out, for example, by a suitable method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method or a suspension polymerization method, for a mixture of one or two or more kinds of component monomers. The adhesive layer 52 preferably has a composition for suppressing the content of the low molecular weight substance. From this viewpoint, it is preferable that the acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3,000,000, is mainly composed of Therefore, the adhesive can also be in an appropriate crosslinked form by internal crosslinking or external crosslinking.
又,為了控制黏著劑層52之交聯密度而提高拾取性,可採用例如使用多官能異氰酸酯系化合物、多官能環氧系化合物、三聚氰胺系化合物、金屬鹽系化合物、金屬鉗合系化合物、胺基樹脂系化合物、或過氧化物等之適當的外部交聯劑進行交聯處理之方式;或混合具有2個以上碳-碳雙鍵之低分子化合物,藉由能量線的照射等而進行交聯處理之方式等之適當的方式。使用外部交聯劑 時,其使用量係依與欲交聯之基底聚合物的平衡、進而依作為黏著劑之使用用途來適當決定。一般而言,相對於前述基底聚合物100重量份而言,較佳摻合20重量份左右以下、更佳摻合0.1重量份~20重量份。再者,由防止劣化等之觀點而言,於黏著劑中,亦可依需要,於前述成分以外,使用各種增黏劑、老化防止劑等之添加劑。 Further, in order to control the crosslinking density of the adhesive layer 52 and improve the pick-up property, for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, a metal chelating compound, or an amine can be used. A method of crosslinking treatment by a suitable external crosslinking agent such as a base resin compound or a peroxide; or mixing a low molecular compound having two or more carbon-carbon double bonds, and performing the irradiation by energy rays or the like The appropriate way of coordinating the way. Use external crosslinker In the case of the use of the base polymer to be crosslinked, it is appropriately determined depending on the use as the adhesive. In general, it is preferably blended in an amount of about 20 parts by weight or less, more preferably from 0.1 part by weight to 20 parts by weight, based on 100 parts by weight of the base polymer. Further, from the viewpoint of preventing deterioration or the like, an additive such as various tackifiers or aging inhibitors may be used in the adhesive other than the above-mentioned components.
構成黏著劑層52之黏著劑,放射線硬化型黏著劑為適宜。放射線硬化型黏著劑,可例示於前述黏著劑中,摻合了放射線硬化性之單體成分或放射線硬化性之寡聚物成分的添加型之放射線硬化型黏著劑。 As the adhesive constituting the adhesive layer 52, a radiation hardening type adhesive is suitable. In the above-mentioned adhesive, the radiation-curable adhesive may be an additive type radiation-curable adhesive in which a radiation curable monomer component or a radiation curable oligomer component is blended.
所摻合之放射線硬化性的單體成分,可列舉例如胺基甲酸酯(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷四(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇單羥基五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯等。此等單體成分可使用1種或合併使用2種以上。 Examples of the radiation curable monomer component to be blended include, for example, urethane (meth) acrylate, trimethylolpropane tri(meth) acrylate, and tetramethylol methane tetra(methyl). Acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol Di(meth)acrylate and the like. These monomer components can be used alone or in combination of two or more.
又,放射線硬化性之寡聚物成分可列舉胺基甲酸酯系、聚醚系、聚酯系、聚碳酸酯系、聚丁二烯系等各種寡聚物,其分子量以100~30000左右之範圍者為適當。放射線硬化性之單體成分或寡聚物成分的摻合量,可依前述黏著劑層52之種類,適當決定可使黏著劑層52之黏著力降低的量。一般而言,相對於構成黏著劑之丙烯酸系聚合物等之基底聚合物100重量份而言,例如為5重量 份~500重量份、較佳為70重量份~150重量份左右。 Further, examples of the radiation curable oligomer component include various oligomers such as a urethane type, a polyether type, a polyester type, a polycarbonate type, and a polybutadiene type, and the molecular weight thereof is about 100 to 30,000. The scope is appropriate. The blending amount of the radiation hardening monomer component or the oligomer component can appropriately determine the amount by which the adhesive force of the adhesive layer 52 can be lowered depending on the type of the adhesive layer 52. In general, for example, 5 parts by weight based on 100 parts by weight of the base polymer of the acrylic polymer or the like constituting the adhesive. It is about 500 parts by weight, preferably about 70 parts by weight to 150 parts by weight.
又,放射線硬化型黏著劑,除了前述添加型之放射線硬化型黏著劑以外,亦可列舉使用於聚合物側鏈或主鏈中或主鏈末端具有具有碳-碳雙鍵者作為基底聚合物的內在型之放射線硬化型黏著劑。內在型之放射線硬化型黏著劑,不需含有低分子成分的寡聚物成分等,或者含量不多,因此寡聚物成分等不會隨著時間經過而於黏著劑中移動,可形成安定之層構造的黏著劑層52,故較佳。 Further, the radiation-curable pressure-sensitive adhesive may be used as a base polymer in a side chain or a main chain of a polymer or a carbon-carbon double bond at a terminal end of the main chain, in addition to the radiation-type adhesive of the above-mentioned addition type. An intrinsic type of radiation-curing adhesive. The intrinsic type radiation curable adhesive does not need to contain a low molecular component oligomer component or the like, or has a small content. Therefore, the oligomer component does not move in the adhesive over time, and can form a stable phase. The adhesive layer 52 of the layer structure is preferred.
具有碳-碳雙鍵之基底聚合物,可無特別限制地使用具有碳-碳雙鍵、且具有黏著性者。如此之基底聚合物,較佳為以丙烯酸系聚合物為基本骨架者。丙烯酸系聚合物之基本骨架,可列舉前述例示之丙烯酸系聚合物。 The base polymer having a carbon-carbon double bond can be used without any particular limitation, and has a carbon-carbon double bond and has adhesiveness. Such a base polymer is preferably an acrylic polymer as a basic skeleton. The basic skeleton of the acrylic polymer may, for example, be an acrylic polymer exemplified above.
碳-碳雙鍵對丙烯酸系聚合物之導入法並無特殊限制,可採用各種方法,但於分子設計上將碳-碳雙鍵導入聚合物側鏈較為容易。例如,可列舉預先使具有官能基的單體與丙烯酸系聚合物共聚合後,使具有可與該官能基反應之官能基及碳-碳雙鍵的化合物,在維持碳-碳雙鍵之放射線硬化性之下進行縮合或加成反應之方法。 The introduction method of the carbon-carbon double bond to the acrylic polymer is not particularly limited, and various methods can be employed. However, it is easy to introduce a carbon-carbon double bond into the polymer side chain in molecular design. For example, a compound having a functional group and an acrylic polymer are copolymerized in advance, and a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is maintained, and radiation of a carbon-carbon double bond is maintained. A method of performing a condensation or addition reaction under hardening.
此等官能基之組合的例子,可列舉羧酸基與環氧基、羧酸基與氮丙啶基、羥基與異氰酸酯基等。就反應追蹤的容易性而言,此等官能基之組合當中尤以羥基與異氰酸酯基之組合為適宜。又,藉由此等官能基之組合,只要是會生成前述具有碳-碳雙鍵之丙烯酸系聚合物的組合,則官能基不管位於丙烯酸系聚合物與前述化合物之何 側均可,於前述較佳之組合中,以丙烯酸系聚合物具有羥基、前述化合物具有異氰酸酯基的情況為適宜。此時,具有碳-碳雙鍵之異氰酸酯化合物,可列舉例如甲基丙烯醯基異氰酸酯、2-甲基丙烯醯氧基乙基異氰酸酯、m-異丙烯基-α,α-二甲基苄基異氰酸酯等。又,丙烯酸系聚合物,可使用使前述例示的含羥基之單體或2-羥基乙基乙烯基醚、4-羥基丁基乙烯基醚、二乙二醇單乙烯基醚等之醚系化合物等共聚合者。 Examples of combinations of such functional groups include a carboxylic acid group and an epoxy group, a carboxylic acid group and an aziridine group, a hydroxyl group and an isocyanate group. In view of the ease of reaction tracking, a combination of a hydroxyl group and an isocyanate group is particularly preferable among the combinations of such functional groups. Further, by the combination of such functional groups, as long as the combination of the acrylic polymer having the carbon-carbon double bond is formed, the functional group is located regardless of the acrylic polymer and the aforementioned compound. In the above preferred combination, it is preferable that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryl oxime isocyanate, 2-methacryloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl. Isocyanate, etc. Further, as the acrylic polymer, an ether compound such as the above-exemplified hydroxyl group-containing monomer or 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether or diethylene glycol monovinyl ether can be used. Co-aggregators.
內在型之放射線硬化型黏著劑,可單獨使用前述具有碳-碳雙鍵之基底聚合物(特別是丙烯酸系聚合物),然亦可摻合前述放射線硬化性之單體成分或寡聚物成分等之光聚合性化合物至不使特性惡化之程度。該光聚合性化合物之摻合量,通常相對於基底聚合物100重量份而言係30重量份以下之範圍內、較佳為0~10重量份之範圍內。 The intrinsic type radiation-curable adhesive may be a base polymer (especially an acrylic polymer) having a carbon-carbon double bond, or may be blended with the radiation curable monomer component or oligomer component. The photopolymerizable compound is such that it does not deteriorate the properties. The blending amount of the photopolymerizable compound is usually in the range of 30 parts by weight or less, preferably 0 to 10 parts by weight based on 100 parts by weight of the base polymer.
藉由紫外線等來硬化時,放射線硬化型黏著劑中較佳為含有光聚合起始劑。 When hardened by ultraviolet rays or the like, it is preferred that the radiation-curable adhesive contains a photopolymerization initiator.
上述之丙烯酸系聚合物中,尤特別以含有以CH2=CHCOOR(式中,R為碳數4~18之烷基)表示之丙烯酸酯、含羥基之單體、與分子內具有自由基反應性碳-碳雙鍵之異氰酸酯化合物而構成之丙烯酸系聚合物A為佳。 In the above acrylic polymer, particularly, an acrylate having a CH 2 =CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and a radical reaction in the molecule are contained. The acrylic polymer A composed of an isocyanate compound of a carbon-carbon double bond is preferred.
丙烯酸烷基酯之烷基的碳數未達4時,可能有極性高,剝離力變得過大,使拾取性降低的情況。另一 方面,丙烯酸烷基酯之烷基碳數超過18時,黏著劑層52之玻璃轉移溫度變得過高,於常溫之接著特性降低,其結果,切割時可能有產生接著劑層4及金屬層3之剝離的情況。 When the carbon number of the alkyl group of the alkyl acrylate is less than 4, the polarity may be high, the peeling force may become too large, and the pick-up property may fall. another On the other hand, when the alkyl carbon number of the alkyl acrylate exceeds 18, the glass transition temperature of the adhesive layer 52 becomes too high, and the subsequent characteristics at normal temperature are lowered, and as a result, the adhesive layer 4 and the metal layer may be formed during dicing. 3 stripping situation.
上述丙烯酸系聚合物A,亦可依需要含有其他單體成分所對應之單位。 The acrylic polymer A may contain units corresponding to other monomer components as needed.
丙烯酸系聚合物A中,可使用具有自由基反應性碳-碳雙鍵之異氰酸酯化合物。亦即,丙烯酸聚合物,較佳為具有對於前述丙烯酸酯或含羥基之單體等之單體組成物所成的聚合物,使含有雙鍵之異氰酸酯化合物進行加成反應而得的構成。因此,丙烯酸系聚合物,較佳為於其分子構造內,具有自由基反應性碳-碳雙鍵。藉此,可成為藉由活性能量線(紫外線等)之照射而硬化的活性能量線硬化型黏著劑層(紫外線硬化型黏著劑層等),且可降低金屬層3與黏著劑層52之剝離力。 In the acrylic polymer A, an isocyanate compound having a radically reactive carbon-carbon double bond can be used. In other words, the acrylic polymer preferably has a structure in which an isocyanate compound containing a double bond is subjected to an addition reaction with a polymer composed of a monomer composition such as the above acrylate or a hydroxyl group-containing monomer. Therefore, the acrylic polymer preferably has a radical-reactive carbon-carbon double bond in its molecular structure. Thereby, the active energy ray-curable adhesive layer (such as an ultraviolet curable adhesive layer) which is cured by irradiation with an active energy ray (such as ultraviolet rays) can be used, and the peeling of the metal layer 3 and the adhesive layer 52 can be reduced. force.
含有雙鍵之異氰酸酯化合物,可列舉例如甲基丙烯醯基異氰酸酯、丙烯醯基異氰酸酯、2-甲基丙烯醯氧基乙基異氰酸酯、2-丙烯醯氧基乙基異氰酸酯、m-異丙烯基-α,α-二甲基苄基異氰酸酯等。含有雙鍵之異氰酸酯化合物可單獨或組合2種以上使用。 Examples of the isocyanate compound containing a double bond include methacryl oxime isocyanate, propylene decyl isocyanate, 2-methacryloxyethyl isocyanate, 2-propenyl methoxyethyl isocyanate, and m-isopropenyl group. α,α-dimethylbenzyl isocyanate or the like. The isocyanate compound containing a double bond can be used individually or in combination of 2 or more types.
又,於活性能量線硬化型黏著劑,為了調整活性能量線照射前之黏著力、或活性能量線照射後之黏著力,亦可適當使用外部交聯劑。作為外部交聯方法之具體的手段,可列舉添加聚異氰酸酯化合物、環氧化合物、氮 丙啶化合物、三聚氰胺系交聯劑等之所謂的交聯劑來進行反應的方法。 Further, in the active energy ray-curable adhesive, an external crosslinking agent may be appropriately used in order to adjust the adhesion before the active energy ray irradiation or the adhesion after the active energy ray irradiation. Specific examples of the external crosslinking method include addition of a polyisocyanate compound, an epoxy compound, and nitrogen. A method of reacting a so-called cross-linking agent such as a propidium compound or a melamine-based crosslinking agent.
前述聚異氰酸酯化合物,可列舉例如1,2-伸乙二異氰酸酯、1,4-伸丁二異氰酸酯、1,6-六亞甲二異氰酸酯等之低級脂肪族聚異氰酸酯類;伸環戊二異氰酸酯、伸環己二異氰酸酯、異佛酮二異氰酸酯、氫化甲苯二異氰酸酯、氫化二甲苯二異氰酸酯等之脂環族聚異氰酸酯類;2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、4,4’-二苯基甲烷二異氰酸酯、伸二甲苯二異氰酸酯等之芳香族聚異氰酸酯類等,其他,亦可使用三羥甲基丙烷/甲苯二異氰酸酯3聚體加成物[東曹股份有限公司製、商品名「CORONATE L」]、三羥甲基丙烷/六亞甲二異氰酸酯3聚體加成物[東曹股份有限公司製、商品名「CORONATE HL」]等。又,前述環氧化合物,可列舉例如N,N,N’,N’-四縮水甘油基-m-二甲苯二胺、二縮水甘油基苯胺、1,3-雙(N,N-縮水甘油胺基甲基)環己烷、1,6-己二醇二縮水甘油醚、新戊二醇二縮水甘油醚、乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、聚丙二醇二縮水甘油醚、山梨醇聚縮水甘油醚、甘油聚縮水甘油醚、季戊四醇聚縮水甘油醚、聚甘油聚縮水甘油醚、山梨醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、三縮水甘油基-參(2-羥基乙基)三聚異氰酸酯、間苯二酚二縮水甘油醚、雙酚-S-二縮水甘油醚,此外可列舉分子內具有2個以上 環氧基之環氧系樹脂等。 Examples of the polyisocyanate compound include lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; and cyclopentaisoisocyanate; An alicyclic polyisocyanate such as cyclohexyl diisocyanate, isophorone diisocyanate, hydrogenated toluene diisocyanate, hydrogenated xylene diisocyanate; 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4 An aromatic polyisocyanate such as -diphenylmethane diisocyanate or xylene diisocyanate, or a trimethylolpropane/toluene diisocyanate trimer adduct (also manufactured by Tosoh Corporation) The product name "CORONATE L"], a trimethylolpropane/hexamethylene diisocyanate trimer [manufactured by Tosoh Corporation, trade name "CORONATE HL"], and the like. Further, examples of the epoxy compound include N,N,N',N'-tetraglycidyl-m-xylylenediamine, diglycidylaniline, and 1,3-bis(N,N-glycidol). Aminomethyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diminish Glycerol ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane poly Glycidyl ether, diglycidyl adipate, diglycidyl phthalate, triglycidyl- cis (2-hydroxyethyl) trimeric isocyanate, resorcinol diglycidyl ether, bisphenol- S-diglycidyl ether, in addition, there are two or more molecules in the molecule An epoxy resin such as an epoxy group.
使用外部交聯劑時,其使用量,係依與欲交聯之基底聚合物的平衡、進而依作為黏著劑之使用用途而適當決定。外部交聯劑之使用量,一般而言,相對於前述基底聚合物100重量份而言,係20重量份以下(較佳為0.1重量份~10重量份)。進一步地,亦可依需要,於前述成分以外,對活性能量線硬化型黏著劑摻合以往公知之各種增黏劑、老化防止劑、發泡劑等之添加劑。 When an external crosslinking agent is used, the amount of the crosslinking agent is appropriately determined depending on the balance of the base polymer to be crosslinked and the use of the adhesive. The amount of the external crosslinking agent used is generally 20 parts by weight or less (preferably 0.1 parts by weight to 10 parts by weight) based on 100 parts by weight of the base polymer. Further, an active energy ray-curable adhesive may be blended with an additive such as various conventionally known tackifiers, aging inhibitors, and foaming agents, in addition to the above-mentioned components, as needed.
再者,本發明中,亦可藉由電子束或紫外線等之照射,來取代使用交聯劑或與交聯劑同時使用,以實施交聯處理。 Further, in the present invention, the crosslinking treatment may be carried out by using an electron beam or an ultraviolet ray instead of using a crosslinking agent or a crosslinking agent.
黏著劑層52之厚度並無特殊限制,可適當決定,一般而言為5~200μm左右。又,黏著劑層52可由單層構成亦可由複數層構成。 The thickness of the adhesive layer 52 is not particularly limited and can be appropriately determined, and is generally about 5 to 200 μm. Further, the adhesive layer 52 may be composed of a single layer or a plurality of layers.
構成金屬層3之金屬並無特殊限定,例如,含有選自由不鏽鋼、鋁、鐵、鈦、錫、鎳及銅所成之群的至少1種,就散熱性、電子裝置封裝8之翹曲防止的觀點而言較佳。此等之中,就熱傳導性高,可得到散熱效果的觀點而言,特佳為含有銅。又,就電子裝置封裝8之翹曲防止的觀點而言,特佳為含有鋁。 The metal constituting the metal layer 3 is not particularly limited. For example, it contains at least one selected from the group consisting of stainless steel, aluminum, iron, titanium, tin, nickel, and copper, and heat dissipation and warpage prevention of the electronic device package 8 are prevented. The point of view is preferred. Among these, in terms of heat conductivity and heat dissipation, it is particularly preferable to contain copper. Further, from the viewpoint of preventing warpage of the electronic device package 8, it is particularly preferable to contain aluminum.
金屬層3之厚度,較佳為5μm以上且未達200μm。藉由成為5μm以上,即使擴展量增大,亦可抑制 金屬層翹曲或由黏著膠帶剝離,因此可使鄰接之金屬層彼此的間隔為大,界線之識別變得容易。又,若未達200μm,則加工容易,且於捲繞或貼合中有必要沿著核心或貼合輥彎曲時,可抑制金屬層過度強韌而產生折痕,於拾取裝置成為辨識錯誤的現象。 The thickness of the metal layer 3 is preferably 5 μm or more and less than 200 μm. By becoming 5 μm or more, even if the amount of expansion is increased, it can be suppressed. Since the metal layer is warped or peeled off by the adhesive tape, the interval between the adjacent metal layers can be made large, and the boundary can be easily recognized. Moreover, if it is less than 200 μm, processing is easy, and when it is necessary to bend along the core or the bonding roll during winding or bonding, it is possible to suppress the metal layer from being excessively strong and crease, and the pickup device becomes misidentified. phenomenon.
金屬層3之與接著劑層4相反側之面的由十點平均粗度所得之表面粗度RzJIS為未達5.0μm。藉由使金屬層3之由十點平均粗度所得之表面粗度RzJIS未達5.0μm,可抑制因檢測出表面之凹凸,而使所攝影之金屬層3被判斷為與樣板不同的問題。因此,可取得所登錄之樣板與為了拾取所攝影之金屬層3的單片影像之間的比對,該單片係作為拾取對象而被辨識。再者,本說明書中之表面粗度RzJIS,為JIS B 0601:2013之附屬書JA中所規定的十點平均粗度。 The surface roughness RzJIS obtained by the ten-point average roughness of the surface of the metal layer 3 on the opposite side to the adhesive layer 4 was less than 5.0 μm. By making the surface roughness RzJIS of the metal layer 3 from the ten-point average roughness less than 5.0 μm, it is possible to suppress the problem that the photographed metal layer 3 is determined to be different from the template by detecting the unevenness of the surface. Therefore, an alignment between the registered template and a single image for picking up the photographed metal layer 3 can be obtained, and the single sheet is recognized as a pickup target. In addition, the surface roughness RzJIS in this specification is the ten-point average roughness prescribed by the JA of JIS B 0601:2013.
如此之金屬層3,可使用金屬箔,金屬箔之作為與接著劑層4相反側之面的面之表面粗度RzJIS只要未達5.0μm,則可為電解箔亦可為壓延箔。為電解箔的情況時,表面粗度RzJIS可藉由電解條件(液組成/液溫/電流/添加劑等)來調節。 As the metal layer 3, a metal foil can be used. The surface roughness RzJIS of the surface of the metal foil which is the surface opposite to the adhesive layer 4 may be an electrolytic foil or a rolled foil as long as it is less than 5.0 μm. In the case of an electrolytic foil, the surface roughness RzJIS can be adjusted by electrolysis conditions (liquid composition/liquid temperature/current/additive, etc.).
金屬層3之於入射角60度的鏡面光澤度較佳為未達100%。鏡面光澤度太高時,依拾取裝置之照明角度或量不同,來自所欲拾取之金屬層3的單片或附近的單片之反射光會成為眩光,變得不易辨識所欲拾取之金屬層3的單片之外形。金屬層3之光澤度若未達100%,則會 抑制眩光,良好地辨識金屬層3之單片的外形。光澤度為根據JIS Z 8741所測定之值。光澤度之測定可藉由市售之光澤度計來測定,例如可使用日本電色股份有限公司製光澤度計Handy glossmeter PG-1等。 The specular gloss of the metal layer 3 at an incident angle of 60 degrees is preferably less than 100%. When the specular gloss is too high, depending on the illumination angle or amount of the pickup device, the reflected light from a single piece or a nearby single piece of the metal layer 3 to be picked up may become glare, and it becomes difficult to recognize the metal layer to be picked up. 3's monolithic shape. If the gloss of the metal layer 3 is less than 100%, then The glare is suppressed, and the shape of the single piece of the metal layer 3 is well recognized. The gloss is a value measured in accordance with JIS Z 8741. The measurement of the gloss can be measured by a commercially available gloss meter, and for example, a gloss meter Handy glossmeter PG-1 manufactured by Nippon Denshoku Co., Ltd., or the like can be used.
調節鏡面光澤度的情況時,可單獨或組合進行公知之表面處理。例如可於進行鍍Cu等之粗化處理後,藉由PR脈衝電解等,來進行粗化粒子之小型化、粗化粒子數之增大、粗化粒子表面之平滑化。進一步地亦可依需要,以製箔用添加劑等之表面污染物的殘渣之去除或粗化粒子表面之平滑化為目的,而進行鹼浸漬處理。 When the specular gloss is adjusted, a known surface treatment can be carried out singly or in combination. For example, after roughening treatment such as Cu plating, the roughening particles are miniaturized, the number of roughened particles is increased, and the surface of the roughened particles is smoothed by PR pulse electrolysis or the like. Further, if necessary, alkali immersion treatment may be performed for the purpose of removing the residue of surface contaminants such as a foil-forming additive or smoothing the surface of the roughened particles.
接著劑層4,為將接著劑預先薄膜化者。 Next, the agent layer 4 is a film which is previously thinned by an adhesive.
接著劑層4,至少係由熱硬化性樹脂形成,較佳為至少由熱硬化性樹脂與熱可塑性樹脂形成。 The subsequent agent layer 4 is formed of at least a thermosetting resin, and is preferably formed of at least a thermosetting resin and a thermoplastic resin.
熱可塑性樹脂,可列舉例如天然橡膠、丁基橡膠、異戊二烯橡膠、氯丁二烯橡膠、乙烯-乙酸乙烯酯共聚物、乙烯-丙烯酸共聚物、乙烯-丙烯酸酯共聚物、聚丁二烯樹脂、聚碳酸酯樹脂、熱可塑性聚醯亞胺樹脂、6-耐綸或6,6-耐綸等之聚醯胺樹脂、苯氧樹脂、丙烯酸樹脂、PET(聚對苯二甲酸乙二酯)或PBT(聚對苯二甲酸丁二酯)等之飽和聚酯樹脂、聚醯胺醯亞胺樹脂、或氟樹脂等。熱可塑性樹脂可單獨或合併使用2種以上。此等熱可塑性樹脂當中,就離子性雜質少,應力緩和性優良的觀 點,且就丙烯酸樹脂兼具可撓性與強度而為高韌性的觀點而言,苯氧樹脂由於在各個觀點可容易確保半導體元件之信賴性,故為特佳。 Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, and polybutylene. Polyene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resin such as 6-nene or 6,6-nylon, phenoxy resin, acrylic resin, PET (polyethylene terephthalate) A saturated polyester resin such as ester) or PBT (polybutylene terephthalate), a polyamidoximine resin, or a fluororesin. The thermoplastic resin may be used alone or in combination of two or more. Among these thermoplastic resins, there are few ionic impurities and excellent stress relaxation properties. In view of the fact that the acrylic resin has both flexibility and strength and high toughness, the phenoxy resin is particularly preferable because it can easily ensure the reliability of the semiconductor element from various viewpoints.
丙烯酸樹脂,並無特殊限定,可列舉以具有碳數30以下(較佳為碳數1~18)之直鏈或分支之烷基的丙烯酸或甲基丙烯酸之酯的1種或2種以上作為成分之聚合物等。亦即,本發明中,丙烯酸樹脂係為亦包含甲基丙烯酸樹脂之廣義的意義。前述烷基可列舉例如甲基、乙基、丙基、異丙基、n-丁基、t-丁基、異丁基、戊基、異戊基、己基、庚基、2-乙基己基、辛基、異辛基、壬基、異壬基、癸基、異癸基、十一烷基、十二烷基(月桂基)、十三烷基、十四烷基、硬脂基、十八烷基等。 The acrylic resin is not particularly limited, and one or two or more kinds of esters of acrylic acid or methacrylic acid having a linear or branched alkyl group having a carbon number of 30 or less (preferably having 1 to 18 carbon atoms) may be mentioned. a polymer such as a component. That is, in the present invention, the acrylic resin has a broad meaning including methacrylic resin. The aforementioned alkyl group may, for example, be methyl, ethyl, propyl, isopropyl, n-butyl, t-butyl, isobutyl, pentyl, isopentyl, hexyl, heptyl or 2-ethylhexyl. , octyl, isooctyl, decyl, isodecyl, decyl, isodecyl, undecyl, dodecyl (lauryl), tridecyl, tetradecyl, stearyl, Octadecyl and the like.
又,用以形成丙烯酸樹脂之其他單體(烷基之碳數為30以下之丙烯酸或甲基丙烯酸的烷基酯以外之單體),並無特殊限定,可列舉例如丙烯酸、甲基丙烯酸、丙烯酸羧基乙酯、丙烯酸羧基戊酯、依康酸、馬來酸、富馬酸或巴豆酸等之含羧基之單體;馬來酸酐或依康酸酐等之酸酐單體;(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯或丙烯酸(4-羥基甲基環己基)-甲酯等之含羥基之單體;苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺-2-甲基丙烷磺酸、(甲基)丙烯醯胺丙烷磺酸、 (甲基)丙烯酸磺丙酯或(甲基)丙烯醯氧基萘磺酸等之含磺酸基之單體;2-羥基乙基丙烯醯基磷酸酯等之含磷酸基之單體或丙烯腈等。再者,(甲基)丙烯酸係指丙烯酸及/或甲基丙烯酸,本發明之(甲基)均為相同之意義。 Further, the other monomer for forming the acrylic resin (a monomer other than the alkyl ester of acrylic acid or methacrylic acid having an alkyl group having 30 or less carbon atoms) is not particularly limited, and examples thereof include acrylic acid and methacrylic acid. a carboxyl group-containing monomer such as carboxyethyl acrylate, carboxy amyl acrylate, isaconic acid, maleic acid, fumaric acid or crotonic acid; an anhydride monomer such as maleic anhydride or isocanic anhydride; (meth)acrylic acid 2-hydroxyethyl ester, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, a hydroxyl group-containing monomer such as 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate or (4-hydroxymethylcyclohexyl)-methyl acrylate; styrenesulfonic acid, allylic Sulfonic acid, 2-(methyl) propylene decylamine-2-methylpropane sulfonic acid, (meth) acrylamide propylene sulfonic acid, a sulfonic acid group-containing monomer such as sulfopropyl (meth)acrylate or (meth)acryloxynaphthalenesulfonic acid; a phosphate group-containing monomer such as 2-hydroxyethyl acryloylphosphoryl phosphate or propylene Nitrile and the like. Further, (meth)acrylic means acrylic acid and/or methacrylic acid, and (meth) of the present invention has the same meaning.
又,熱硬化性樹脂除了可列舉環氧樹脂、酚樹脂以外,可列舉胺基樹脂、不飽和聚酯樹脂、聚胺基甲酸酯樹脂、聚矽氧樹脂、熱硬化性聚醯亞胺樹脂等。熱硬化性樹脂可單獨或合併使用2種以上。作為熱硬化性樹脂,特別以會腐蝕半導體元件之離子性雜質等含量少的環氧樹脂為適宜。又,作為環氧樹脂之硬化劑,可適合使用酚樹脂。 Further, examples of the thermosetting resin include an epoxy resin and a phenol resin, and examples thereof include an amine resin, an unsaturated polyester resin, a polyurethane resin, a polyoxyl resin, and a thermosetting polyimide resin. Wait. The thermosetting resin may be used alone or in combination of two or more. As the thermosetting resin, an epoxy resin having a small content such as ionic impurities which corrode the semiconductor element is particularly preferable. Further, as the curing agent for the epoxy resin, a phenol resin can be suitably used.
環氧樹脂並無特殊限定,例如可使用雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、溴化雙酚A型環氧樹脂、氫化雙酚A型環氧樹脂、雙酚AF型環氧樹脂、聯苯型環氧樹脂、萘型環氧樹脂、茀型環氧樹脂、酚酚醛清漆型環氧樹脂、鄰甲酚酚醛清漆型環氧樹脂、參羥基苯基甲烷型環氧樹脂、四苯酚基乙烷型環氧樹脂等之二官能環氧樹脂或多官能環氧樹脂;或乙內醯脲型環氧樹脂、參縮水甘油基三聚異氰酸酯型環氧樹脂或縮水甘油胺型環氧樹脂等之環氧樹脂。 The epoxy resin is not particularly limited, and for example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, a brominated bisphenol A type epoxy resin, or a hydrogenated bisphenol A type can be used. Epoxy resin, bisphenol AF type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, bismuth type epoxy resin, phenol novolak type epoxy resin, o-cresol novolac type epoxy resin, ginseng a difunctional epoxy resin or a polyfunctional epoxy resin such as a hydroxyphenylmethane type epoxy resin or a tetraphenol ethane type epoxy resin; or an intramethylene urea type epoxy resin or a diglycidyl isocyanurate type Epoxy resin such as epoxy resin or glycidylamine epoxy resin.
作為環氧樹脂,於例示當中,特佳為酚醛清漆型環氧樹脂、聯苯型環氧樹脂、參羥基苯基甲烷型環氧樹脂、四苯酚基乙烷型環氧樹脂。其係因此等環氧樹脂富有與作為硬化劑之酚樹脂的反應性,耐熱性等優良之故。 As the epoxy resin, in particular, a novolac type epoxy resin, a biphenyl type epoxy resin, a parahydroxyphenylmethane type epoxy resin, or a tetraphenol ethane type epoxy resin is preferable. Therefore, the epoxy resin is rich in reactivity with a phenol resin as a curing agent, and is excellent in heat resistance and the like.
進一步地,酚樹脂為作為環氧樹脂之硬化劑而作用者,可列舉例如酚酚醛清漆樹脂、酚芳烷基樹脂、甲酚酚醛清漆樹脂、tert-丁基酚酚醛清漆樹脂、壬基酚酚醛清漆樹脂等之酚醛清漆型酚樹脂;可溶酚醛型酚樹脂、聚對氧苯乙烯等之聚氧苯乙烯等。酚樹脂可單獨或合併使用2種以上。此等酚樹脂當中,特佳為酚酚醛清漆樹脂、酚芳烷基樹脂。其係因可提高半導體裝置之連接信賴性之故。 Further, the phenol resin acts as a curing agent for the epoxy resin, and examples thereof include a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, a tert-butyl phenol novolak resin, and a nonylphenol phenol aldehyde. A novolac type phenol resin such as a varnish resin; a polyoxystyrene such as a novolac type phenol resin or a polyoxypoxy styrene. The phenol resin may be used alone or in combination of two or more. Among these phenol resins, a phenol novolak resin and a phenol aralkyl resin are particularly preferred. This is because the connection reliability of the semiconductor device can be improved.
環氧樹脂與酚樹脂之摻合比例,例如,以環氧樹脂成分中之環氧基每1當量而言,酚樹脂中之羥基成為0.5當量~2.0當量的方式摻合為適宜。更適宜者為0.8當量~1.2當量。亦即,係因為兩者之摻合比例在前述範圍之外時,未進行充分的硬化反應,環氧樹脂硬化物之特性容易劣化之故。 The blending ratio of the epoxy resin and the phenol resin is, for example, suitably blended in such a manner that the hydroxyl group in the phenol resin is from 0.5 equivalent to 2.0 equivalents per equivalent of the epoxy group in the epoxy resin component. More preferably, it is 0.8 equivalents to 1.2 equivalents. In other words, when the blending ratio of the two is outside the above range, a sufficient hardening reaction is not performed, and the properties of the cured epoxy resin are likely to deteriorate.
又,亦可使用環氧樹脂與酚樹脂之熱硬化促進觸媒。熱硬化促進觸媒並無特殊限制,可由公知之熱硬化促進觸媒當中適當選擇來使用。熱硬化促進觸媒可單獨或組合2種以上來使用。作為熱硬化促進觸媒,例如可使用胺系硬化促進劑、磷系硬化促進劑、咪唑系硬化促進劑、硼系硬化促進劑、磷-硼系硬化促進劑等。 Further, it is also possible to use a thermosetting epoxy resin and a phenol resin to promote the catalyst. The thermosetting-promoting catalyst is not particularly limited and can be used by appropriately selecting a known thermal hardening-promoting catalyst. The thermosetting-suppressing catalyst can be used singly or in combination of two or more. As the thermosetting-promoting catalyst, for example, an amine-based curing accelerator, a phosphorus-based curing accelerator, an imidazole-based curing accelerator, a boron-based curing accelerator, a phosphorus-boron-based curing accelerator, or the like can be used.
作為環氧樹脂之硬化劑,如上所述,較佳為使用酚樹脂,但亦可使用咪唑類、胺類、酸酐類等之公知之硬化劑。 As the curing agent for the epoxy resin, as described above, a phenol resin is preferably used, but a known curing agent such as an imidazole, an amine or an acid anhydride may be used.
接著劑層4,對電子裝置等之被黏著體9具有 接著性(密著性)是重要的。因而,為了將接著劑層4預先交聯至某種程度,亦可預先添加會與聚合物之分子鏈末端之官能基等反應的多官能性化合物作為交聯劑。藉此,可提昇於高溫下之接著特性,實現耐熱性的改善。 The agent layer 4 has an adherend 9 for an electronic device or the like. Subsequent (adhesion) is important. Therefore, in order to crosslink the adhesive layer 4 to some extent in advance, a polyfunctional compound that reacts with a functional group at the end of the molecular chain of the polymer or the like may be added in advance as a crosslinking agent. Thereby, the subsequent characteristics at a high temperature can be improved, and the heat resistance can be improved.
交聯劑並無特殊限制,可使用公知之交聯劑。具體而言,除了可列舉例如異氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑以外,尚可列舉尿素系交聯劑、金屬烷氧化物系交聯劑、金屬鉗合系交聯劑、金屬鹽系交聯劑、碳二醯亞胺系交聯劑、噁唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑等。作為交聯劑,異氰酸酯系交聯劑或環氧系交聯劑較適宜。又,前述交聯劑可單獨或組合2種以上使用。 The crosslinking agent is not particularly limited, and a known crosslinking agent can be used. Specifically, examples thereof include an isocyanate crosslinking agent, an epoxy crosslinking agent, a melamine crosslinking agent, and a peroxide crosslinking agent, and a urea crosslinking agent and a metal alkoxide system are also mentioned. Cross-linking agent, metal-clamping crosslinking agent, metal salt-based crosslinking agent, carbodiimide crosslinking agent, oxazoline crosslinking agent, aziridine crosslinking agent, amine crosslinking agent Wait. As the crosslinking agent, an isocyanate crosslinking agent or an epoxy crosslinking agent is suitable. Further, the above-mentioned crosslinking agents may be used alone or in combination of two or more.
再者,本發明中,亦可藉由電子束或紫外線等之照射,來取代使用交聯劑或與交聯劑同時使用,以實施交聯處理。 Further, in the present invention, the crosslinking treatment may be carried out by using an electron beam or an ultraviolet ray instead of using a crosslinking agent or a crosslinking agent.
接著劑層4中,可依需要適當摻合其他添加劑。其他添加劑可列舉例如填充劑(填料)、難燃劑、矽烷偶合劑、離子捕捉劑,此外可列舉增量劑、老化防止劑、抗氧化劑、界面活性劑等。 In the subsequent agent layer 4, other additives may be appropriately blended as needed. Examples of the other additives include a filler (filler), a flame retardant, a decane coupling agent, and an ion scavenger, and examples thereof include an extender, an aging preventive, an antioxidant, and a surfactant.
作為填充劑,係無機填充劑、有機填充劑均可,無機填充劑較適宜。藉由無機填充劑等之填充劑的摻合,可於接著劑層4實現熱傳導性之提高、彈性率之調節等。無機填充劑可列舉例如二氧化矽、黏土、石膏、碳酸鈣、硫酸鋇、氧化鋁、氧化鈹、碳化矽、氮化鋁、氮化矽 等之陶瓷類;鋁、銅、銀、金、鎳、鉻、鉛、錫、鋅、鈀、銲錫等之金屬、或合金類、其他碳等所成之各種無機粉末等。填充劑可單獨或合併使用2種以上。作為填充劑,其中尤以二氧化矽或氧化鋁為適宜;作為二氧化矽特別以熔融二氧化矽為適宜。再者,無機填充劑之平均粒徑較佳為0.001μm~80μm之範圍內。無機填充劑之平均粒徑,例如可藉由雷射繞射型粒度分布測定裝置測定,本案中平均粒徑係指粒度分布中累積體積為50%時的粒子徑。 As the filler, an inorganic filler or an organic filler may be used, and an inorganic filler is preferred. The adhesion of the filler such as an inorganic filler can improve the thermal conductivity, adjust the elastic modulus, and the like in the adhesive layer 4. Examples of the inorganic filler include ceramics such as cerium oxide, clay, gypsum, calcium carbonate, barium sulfate, aluminum oxide, cerium oxide, cerium carbide, aluminum nitride, and cerium nitride; aluminum, copper, silver, gold, and nickel. Various kinds of inorganic powders such as metals such as chromium, lead, tin, zinc, palladium, and solder, or alloys and other carbons. The filler may be used alone or in combination of two or more. As the filler, cerium oxide or aluminum oxide is particularly preferable, and cerium oxide is particularly preferred as molten cerium oxide. Further, the average particle diameter of the inorganic filler is preferably in the range of 0.001 μm to 80 μm . The average particle diameter of the inorganic filler can be measured, for example, by a laser diffraction type particle size distribution measuring apparatus. In the present invention, the average particle diameter means a particle diameter when the cumulative volume in the particle size distribution is 50%.
填充劑(特別是無機填充劑)之摻合量,相對於有機樹脂成分而言,較佳為98重量%以下(0重量%~98重量%),特別是二氧化矽的情況時適宜為0重量%~70重量%、熱傳導或導電等之功能性無機填充劑的情況時適宜為10重量%~98重量%。 The blending amount of the filler (especially the inorganic filler) is preferably 98% by weight or less (0% by weight to 98% by weight) based on the organic resin component, and particularly preferably 0 in the case of cerium oxide. The functional inorganic filler such as weight% to 70% by weight, heat conduction or electric conductivity is preferably 10% by weight to 98% by weight.
又,難燃劑可列舉例如三氧化銻、五氧化銻、溴化環氧樹脂等。難燃劑可單獨或合併使用2種以上。矽烷偶合劑可列舉例如β-(3、4-環氧基環己基)乙基三甲氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基甲基二乙氧基矽烷等。矽烷偶合劑可單獨或合併使用2種以上。離子捕捉劑可列舉例如水滑石類、氫氧化鉍等。離子捕捉劑可單獨或合併使用2種以上。 Further, examples of the flame retardant include antimony trioxide, antimony pentoxide, and brominated epoxy resin. The flame retardant may be used alone or in combination of two or more. The decane coupling agent may, for example, be β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, γ-glycidoxypropyltrimethoxydecane, γ-glycidoxypropylmethyldi Ethoxy decane and the like. The decane coupling agent may be used alone or in combination of two or more. Examples of the ion scavenger include hydrotalcites, barium hydroxide, and the like. The ion scavenger may be used alone or in combination of two or more.
接著劑層4,由接著性與信賴性之觀點而言,特佳為含有(A)環氧樹脂、(B)硬化劑、(C)丙烯酸樹脂或苯氧樹脂、及(D)經表面處理之無機填充材。 The adhesive layer 4 is particularly preferably composed of (A) epoxy resin, (B) hardener, (C) acrylic resin or phenoxy resin, and (D) surface-treated from the viewpoint of adhesion and reliability. Inorganic filler.
藉由使用(A)環氧樹脂,可得到高的接著性、耐水性、耐熱性。環氧樹脂可使用上述公知之環氧樹脂。(B)硬化劑可使用上述公知之硬化劑。 By using (A) an epoxy resin, high adhesiveness, water resistance, and heat resistance can be obtained. As the epoxy resin, the above-mentioned known epoxy resin can be used. (B) A hardener can be used as the above-mentioned known hardener.
(C)丙烯酸樹脂係兼具可撓性與強度而為高韌性。較佳之丙烯酸樹脂,為Tg(玻璃轉移溫度)為-50℃~50℃,且使具有環氧基、縮水甘油基、醇性羥基、酚性羥基或羧基作為交聯性官能基之單體聚合而得的含有交聯性官能基之(甲基)丙烯酸共聚物。進一步地,若含有丙烯腈等而顯示橡膠特性時,可得更高韌性。 (C) The acrylic resin has high flexibility as well as flexibility and strength. A preferred acrylic resin is a Tg (glass transition temperature) of -50 ° C to 50 ° C, and a monomer having an epoxy group, a glycidyl group, an alcoholic hydroxyl group, a phenolic hydroxyl group or a carboxyl group as a crosslinkable functional group. The resulting (meth)acrylic copolymer containing a crosslinkable functional group. Further, when acrylonitrile or the like is contained to exhibit rubber properties, higher toughness can be obtained.
又,關於(C)苯氧樹脂,苯氧樹脂係分子鏈長,與環氧樹脂構造類似,於高交聯密度之組成物中作為可撓性材料而作用,會賦予高韌性,因此雖為高強度但可得到強韌的組成物。較佳之苯氧樹脂,為主骨架為雙酚A型者,其他可列舉雙酚F型苯氧樹脂、雙酚A/F混合型苯氧樹脂或溴化苯氧樹脂等市售之苯氧樹脂作為較佳者。 Further, the (C) phenoxy resin has a molecular chain length similar to that of an epoxy resin, and acts as a flexible material in a composition having a high crosslinking density, thereby imparting high toughness. High strength but strong composition. A preferred phenoxy resin is a bisphenol A type as a main skeleton, and other commercially available phenoxy resins such as bisphenol F type phenoxy resin, bisphenol A/F mixed phenoxy resin or brominated phenoxy resin may be mentioned. As a better.
(D)經表面處理之無機填充材,可列舉經偶合劑表面處理之無機填充劑。無機填充材,可使用上述公知之無機填充劑,例如二氧化矽、氧化鋁。藉由經偶合劑表面處理,無機填充劑之分散性成為良好。因此,可得到流動性優良的接著劑層,故可提高與金屬層3之接著力。又,可使無機填充劑成為高填充,因此可降低吸水率,提高耐濕性。 (D) The surface-treated inorganic filler may, for example, be an inorganic filler surface-treated with a coupling agent. As the inorganic filler, the above-mentioned known inorganic fillers such as cerium oxide or aluminum oxide can be used. The dispersibility of the inorganic filler is good by surface treatment with a coupling agent. Therefore, an adhesive layer having excellent fluidity can be obtained, so that the adhesion to the metal layer 3 can be improved. Further, since the inorganic filler can be made highly filled, the water absorption rate can be lowered and the moisture resistance can be improved.
例如以矽烷偶合劑所進行之無機填充材之表面處理,係藉由公知方法,使無機填充材分散於矽烷偶合 劑溶液中,藉以使無機填充劑之表面所存在的羥基與矽烷偶合劑之烷氧基等之水解基被水解而得的矽醇基反應,於無機填充劑之表面生成Si-O-Si鍵結來進行。 For example, the surface treatment of the inorganic filler by the decane coupling agent is carried out by dispersing the inorganic filler in the decane coupling by a known method. In the solution, a sterol group obtained by hydrolyzing a hydroxyl group present on the surface of the inorganic filler with an alkoxy group such as a decane coupling agent is reacted to form a Si-O-Si bond on the surface of the inorganic filler. Come on.
接著劑層4之厚度並無特殊限制,但由充分進行金屬層與被黏著體之接著的觀點而言,較佳為3μm以上、更佳為5μm以上,為了有助於半導體封裝之薄型化,較佳為150μm以下、更佳為100μm以下。接著劑層4可由單層構成亦可由複數層構成。 The thickness of the adhesive layer 4 is not particularly limited, but is preferably 3 μm or more, and more preferably 5 μm or more from the viewpoint of sufficiently adhering the metal layer to the adherend, and in order to contribute to thinning of the semiconductor package, It is preferably 150 μm or less, more preferably 100 μm or less. The subsequent agent layer 4 may be composed of a single layer or a plurality of layers.
又,接著劑層4,較佳為於25℃、50% RH之損失正切tanδ為0.4以上。又,於25℃、50% RH之接著劑層4的損失正切tanδ,較佳為3以下。 Further, the adhesive layer 4 preferably has a loss tangent tan δ of 0.4 or more at 25 ° C and 50% RH. Further, the loss tangent tan δ of the adhesive layer 4 at 25 ° C and 50% RH is preferably 3 or less.
損失正切tanδ,係使用動態黏彈性測定裝置,由0℃以昇溫速度5℃/min昇溫,以測定頻率1Hz測定,到達25℃時之值。 The loss tangent tan δ was measured by a dynamic viscoelasticity measuring device, which was heated at a temperature rising rate of 5 ° C/min at 0 ° C, and measured at a measurement frequency of 1 Hz, and reached a value at 25 ° C.
於25℃、50% RH之接著劑層4的損失正切tanδ若為0.4以上,則接著劑層4可緩和因拾取裝置之插梢頂起所致的應力。因此,即使插梢之頂起量變大,亦可抑制於金屬層3產生插梢痕跡。損失正切tanδ若為3以下,則亦不會損及插梢頂起之應答性,可良好地拾取。 When the loss tangent tan δ of the adhesive layer 4 at 25 ° C and 50% RH is 0.4 or more, the adhesive layer 4 can alleviate the stress caused by the tipping of the pick-up device. Therefore, even if the amount of jacking of the plug is increased, it is possible to suppress the occurrence of the tip of the metal layer 3. When the loss tangent tan δ is 3 or less, the responsiveness of the insertion tip is not impaired, and it can be picked up satisfactorily.
欲使損失正切tanδ高,可使環氧樹脂或酚樹脂等之低分子量成分多、且使丙烯酸樹脂等之高分子量成分少。又,摻合填料時,亦可使填料摻合量少。 When the loss tangent tan δ is high, a low molecular weight component such as an epoxy resin or a phenol resin can be obtained, and a high molecular weight component such as an acrylic resin can be made small. Further, when the filler is blended, the filler blending amount may be small.
又,接著劑層4,於B階(未硬化狀態或半硬化狀態)下,與金屬層3之黏著力(23℃、剝離角度 180度、線速300mm/分)較佳為0.3N/25mm以上、更佳為0.5N/25mm以上、又更佳為1.0N/25mm以上。黏著力未達0.3N/25mm時,將經單片化之樣品擴展時,有於接著劑層4與金屬層3之間產生剝離之虞。 Further, the adhesion layer 4 adheres to the metal layer 3 in the B-stage (unhardened state or semi-hardened state) (23 ° C, peeling angle) 180 degrees, line speed 300 mm/min) is preferably 0.3 N/25 mm or more, more preferably 0.5 N/25 mm or more, and still more preferably 1.0 N/25 mm or more. When the adhesion is less than 0.3 N/25 mm, when the singulated sample is expanded, peeling occurs between the adhesive layer 4 and the metal layer 3.
接著劑層4之吸水率,較佳為1.5vol%以下。吸水率之測定方法如下所述。亦即,以50×50mm大小之接著劑層4(薄膜狀接著劑)為樣品,將樣品於真空乾燥機中,120℃、3小時乾燥,於乾燥器中放冷後,測定乾燥質量,作為M1。將樣品於室溫下浸漬於蒸餾水24小時後取出,將樣品表面以濾紙擦拭,迅速秤量,作為M2。吸水率係由下式(1)算出。 The water absorption rate of the layer 4 is preferably 1.5 vol% or less. The method of measuring the water absorption rate is as follows. That is, a 50×50 mm adhesive layer 4 (film-like adhesive) was used as a sample, and the sample was dried in a vacuum dryer at 120° C. for 3 hours, and then allowed to cool in a desiccator, and the dry mass was measured as M1. The sample was immersed in distilled water at room temperature for 24 hours, and then taken out, and the surface of the sample was wiped with a filter paper and quickly weighed to obtain M2. The water absorption rate is calculated by the following formula (1).
吸水率(vol%)=[(M2-M1)/(M1/d)]×100 (1)此處,d為薄膜之密度。 Water absorption rate (vol%) = [(M2-M1) / (M1/d)] × 100 (1) Here, d is the density of the film.
吸水率超過1.5vol%時,係有因吸水之水分而於焊接回焊時產生封裝龜裂之虞。 When the water absorption rate exceeds 1.5 vol%, there is a problem that a package crack occurs during solder reflow due to moisture absorption.
接著劑層4之飽和吸濕率,較佳為1.0vol%以下。飽和吸濕率之測定方法如下所述。亦即,以直徑100mm之圓形的接著劑層4(薄膜狀接著劑)為樣品,將樣品於真空乾燥機中,120℃、3小時乾燥,於乾燥器中放冷後,測定乾燥質量,作為M1。將樣品於85℃、85% RH之恆溫恆濕槽中吸濕168小時後取出,迅速秤量,作為M2。飽和吸濕率係由下式(2)算出。 The saturated moisture absorption rate of the layer 4 is preferably 1.0 vol% or less. The method for measuring the saturated moisture absorption rate is as follows. That is, a circular adhesive layer 4 (film-like adhesive) having a diameter of 100 mm was used as a sample, and the sample was dried in a vacuum dryer at 120 ° C for 3 hours, and after cooling in a desiccator, the dry mass was measured. As M1. The sample was absorbed for 168 hours in a constant temperature and humidity chamber at 85 ° C and 85% RH, and then taken out and quickly weighed as M2. The saturated moisture absorption rate is calculated by the following formula (2).
飽和吸濕率(vol%)=[(M2-M1)/(M1/d)]×100 (2)此處,d為薄膜之密度。 Saturated moisture absorption rate (vol%) = [(M2-M1) / (M1/d)] × 100 (2) Here, d is the density of the film.
飽和吸濕率超過1.0vol%時,係有因回焊時之吸濕而使蒸氣壓之值變高,無法得到良好的回焊特性之虞。 When the saturated moisture absorption rate exceeds 1.0 vol%, the value of the vapor pressure is increased due to moisture absorption during reflow, and good reflow characteristics cannot be obtained.
接著劑層4之殘存揮發成分,較佳為3.0wt%以下。殘存揮發成分之測定方法係如下所述。亦即,係以50×50mm大小之接著劑層4(薄膜接著劑)為樣品,測定樣品之初期質量,作為M1,將樣品於熱風循環恆溫槽中,200℃、2小時加熱後,秤量並作為M2。殘存揮發成分係由下式(3)算出。 The residual volatile component of the layer 4 is preferably 3.0% by weight or less. The method for measuring the residual volatile component is as follows. That is, a 50×50 mm adhesive layer 4 (film adhesive) is used as a sample, and the initial mass of the sample is measured. As M1, the sample is heated in a hot air circulation thermostat at 200° C. for 2 hours, and then weighed and As M2. The residual volatile component is calculated by the following formula (3).
殘存揮發成分(wt%)=[(M2-M1)/M1]×100 (3) Residual volatile components (wt%) = [(M2-M1)/M1] × 100 (3)
殘存揮發成分超過3.0wt%時,係有因封裝時之加熱而使溶劑揮發,於接著劑層4之內部產生孔隙,產生封裝龜裂之虞。 When the residual volatile component exceeds 3.0% by weight, the solvent is volatilized by heating during the encapsulation, and pores are formed inside the adhesive layer 4 to cause cracking of the package.
又,由黏著膠帶5拾取接著劑層4及金屬層3之狀態時,黏著膠帶5與接著劑層4之黏著力為0.03~0.5N/25mm。因為係由黏著膠帶5拾取接著劑層4及金屬層3之狀態時的黏著膠帶5與接著劑層4之黏著力,故黏著膠帶5之黏著劑層52係以放射線硬化型之黏著劑構成,且對黏著膠帶5照射放射線使黏著力降低後拾取接著劑層4及金屬層3時,會成為放射線照射後之黏著力。 Further, when the adhesive layer 5 and the metal layer 3 are picked up by the adhesive tape 5, the adhesive force between the adhesive tape 5 and the adhesive layer 4 is 0.03 to 0.5 N/25 mm. Since the adhesion between the adhesive tape 5 and the adhesive layer 4 in the state in which the adhesive layer 4 and the metal layer 3 are picked up by the adhesive tape 5, the adhesive layer 52 of the adhesive tape 5 is formed of a radiation-curable adhesive. When the adhesive tape 5 is irradiated with radiation to lower the adhesive force, and the adhesive layer 4 and the metal layer 3 are picked up, the adhesive force after radiation irradiation is obtained.
黏著力係根據JIS Z0237,於23℃、50% RH之環境下,將切割為寬25mm尺寸之黏著膠帶5與接著劑層4貼合,使用萬能型拉伸試驗機以剝離角度180°、剝離速度300mm/min測定。 Adhesive force is adhered to the adhesive tape 5 cut into a width of 25 mm in an environment of 23 ° C and 50% RH according to JIS Z0237, and the peeling angle is 180° and peeled off using a universal tensile tester. The speed was measured at 300 mm/min.
欲使黏著力成為上述範圍,可調整黏著膠帶5 之黏著劑層52或接著劑層4各自的黏彈性或表面能量、或調整其組合。 To make the adhesion force into the above range, the adhesive tape can be adjusted 5 The adhesive or surface energy of each of the adhesive layer 52 or the adhesive layer 4, or a combination thereof.
黏著膠帶5與接著劑層4之黏著力若為0.5N/25mm以下,由黏著膠帶5拾取接著劑層及金屬層3時,即使插梢之頂起速度或頂起量降低,對金屬層所賦予的力小,亦可拾取,因此可抑制於金屬層3產生插梢痕跡。黏著膠帶5與接著劑層4之黏著力若為0.03N/25mm以上,則擴展金屬層3及接著劑層4時,金屬層3及接著劑層4不會由黏著膠帶5剝離,其係良好地被保持。 When the adhesive force of the adhesive tape 5 and the adhesive layer 4 is 0.5 N/25 mm or less, when the adhesive layer 5 and the metal layer 3 are picked up by the adhesive tape 5, even if the jacking speed or the jacking amount of the plug is lowered, the metal layer is The force imparted is small and can be picked up, so that it is possible to suppress the occurrence of the tip of the metal layer 3. When the adhesive force between the adhesive tape 5 and the adhesive layer 4 is 0.03 N/25 mm or more, when the metal layer 3 and the adhesive layer 4 are expanded, the metal layer 3 and the adhesive layer 4 are not peeled off by the adhesive tape 5, and the system is good. The ground is kept.
接著,說明本實施形態之電子裝置封裝用膠帶1之製造方法的一例。首先,準備長形之金屬層3。金屬層3只要使用市售之金屬箔即可。接著,如圖4(A)所示,使用貼合輥r等,將金屬層3貼合於長形之基材膠帶2之黏著面。 Next, an example of a method of manufacturing the tape 1 for electronic device packaging of the present embodiment will be described. First, an elongated metal layer 3 is prepared. As long as the metal layer 3 is a commercially available metal foil. Next, as shown in FIG. 4(A), the metal layer 3 is bonded to the adhesive surface of the elongated base tape 2 by using a bonding roll r or the like.
另外形成長形薄膜狀之接著劑層4。接著劑層4可利用配製樹脂組成物而形成為薄膜狀之層的慣用方法來形成。具體而言,可列舉例如於適當之分隔件(剝離紙等)上塗佈前述樹脂組成物並乾燥(熱硬化為必要時的情況等,係依需要實施加熱處理而乾燥),來形成接著劑層4之方法等。前述樹脂組成物可為溶液亦可為分散液。 Further, an adhesive film layer 4 having an elongated film shape is formed. The subsequent agent layer 4 can be formed by a conventional method of forming a film-like layer by formulating a resin composition. Specifically, for example, the resin composition is applied to a suitable separator (release paper or the like) and dried (heat curing is necessary, and the like, if necessary, dried by heat treatment) to form an adhesive. The method of layer 4 and the like. The resin composition may be a solution or a dispersion.
接著如圖4(B)所示,於貼合於基材膠帶2之金屬層3上,使用貼合輥r等貼合由分隔件剝離之接著劑層4。 Next, as shown in FIG. 4(B), the adhesive layer 4 peeled off by the separator is bonded to the metal layer 3 bonded to the base tape 2 by using a bonding roll r or the like.
再者,上述係於基材膠帶2貼合金屬層3 後,於金屬層3上貼合接著劑層4,但亦可於貼合金屬層3與接著劑層4後,將金屬層3側之面貼合於基材膠帶2。 Furthermore, the above-mentioned substrate tape 2 is attached to the metal layer 3 Thereafter, the adhesive layer 4 is bonded to the metal layer 3, but the metal layer 3 and the adhesive layer 4 may be bonded to each other, and then the surface of the metal layer 3 may be bonded to the base tape 2.
接著,如圖4(C)所示,將接著劑層4及金屬層3使用壓切刀等預切為特定形狀(此處為圓形形狀),如圖4(D)所示,係將周邊之不要部分6由基材膠帶2剝離而去除。再者,預切不限於上述,亦可使用外緣為圓形形狀之格子狀的壓切齒,將接著劑層4及金屬層3預先單片化為對應於半導體晶片C之大小等之特定大小。 Next, as shown in FIG. 4(C), the adhesive layer 4 and the metal layer 3 are pre-cut into a specific shape (here, a circular shape) using a press cutter or the like, as shown in FIG. 4(D), The peripheral portion 6 is removed by peeling off the substrate tape 2. Further, the pre-cutting is not limited to the above, and the bonding layer 4 and the metal layer 3 may be preliminarily formed into a specific size corresponding to the size of the semiconductor wafer C or the like using a lattice-shaped cutting tooth having a circular outer shape. .
再者,於基材膠帶2上形成特定形狀之金屬層3及接著劑層4的方法,不限定於上述者,可將長形之金屬層3貼合於長形之基材膠帶2,衝壓為特定形狀,將不要部分6去除後,將形成為特定形狀之接著劑層4貼合於特定形狀之金屬層3上,亦可將預先各自形成為特定形狀之金屬層3與接著劑層4貼合於基材膠帶2,但由製造步驟之簡便性而言,較佳為藉由上述圖4(A)~(D)所示之步驟製造。 Further, the method of forming the metal layer 3 and the adhesive layer 4 having a specific shape on the base tape 2 is not limited to the above, and the elongated metal layer 3 can be bonded to the elongated base tape 2 and punched. After the unnecessary portion 6 is removed for a specific shape, the adhesive layer 4 formed into a specific shape is attached to the metal layer 3 of a specific shape, and the metal layer 3 and the adhesive layer 4 which are each formed into a specific shape in advance may be used. It is bonded to the base tape 2, but it is preferable to manufacture by the procedure shown in the above-mentioned FIG. 4 (A) - (D) from the simplicity of a manufacturing process.
又,另外製作黏著膠帶5。基材薄膜可藉由以往公知之製膜方法製膜。該製膜方法可例示例如壓延製膜法、於有機溶劑中之澆鑄法、於密閉系統之吹脹擠出法、T模擠出法、共擠出法、乾疊合法等。接著,於基材薄膜51上塗佈黏著劑層組成物並乾燥(依需要加熱交聯)而形成黏著劑層52。塗佈方式可列舉輥塗覆、網版塗覆、 凹版塗覆等。再者,可將黏著劑層組成物直接塗佈於基材薄膜,於基材薄膜51上形成黏著劑層52,又,亦可將黏著劑層組成物塗佈於表面進行過剝離處理之剝離紙等而形成黏著劑層52後,將該黏著劑層轉印於基材薄膜51。藉此,製作於基材薄膜51上形成有黏著劑層52之黏著膠帶5。 Further, an adhesive tape 5 was separately prepared. The base film can be formed by a conventionally known film forming method. The film forming method may, for example, be a calendering film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, a dry lamination method, or the like. Next, an adhesive layer composition is applied onto the base film 51 and dried (heat-crosslinking as needed) to form an adhesive layer 52. Coating methods include roll coating, screen coating, Gravure coating, etc. Further, the adhesive layer composition may be directly applied to the base film, the adhesive layer 52 may be formed on the base film 51, or the adhesive layer composition may be applied to the surface and peeled off. After the adhesive layer 52 is formed by paper or the like, the adhesive layer is transferred to the base film 51. Thereby, the adhesive tape 5 in which the adhesive layer 52 was formed on the base film 51 was produced.
之後,如圖5(A)所示,於基材膠帶2上所設置之特定形狀的金屬層3及接著劑層4之接著劑層4側的面上,以黏著膠帶5之黏著劑層側52的面接觸的方式疊合黏著膠帶5。 Thereafter, as shown in FIG. 5(A), the adhesive layer layer side of the adhesive tape 5 is applied to the surface of the metal layer 3 of the specific shape provided on the base tape 2 and the adhesive layer 4 side of the adhesive layer 4. The adhesive tape 5 is laminated in a manner of face contact of 52.
接著,如圖5(B)所示,將黏著膠帶5使用壓切刀等預切為特定形狀,如圖5(C)所示,藉由將周邊之不要部分7由基材膠帶2剝離而去除,製作電子裝置封裝用膠帶1。再者,之後,亦可將使用於預切加工之基材膠帶2剝離,將公知之分隔件與黏著膠帶5之黏著劑層52貼合。 Next, as shown in FIG. 5(B), the adhesive tape 5 is pre-cut into a specific shape using a press cutter or the like, and as shown in FIG. 5(C), the peripheral unnecessary portion 7 is peeled off from the base tape 2 The tape 1 for electronic device packaging is removed. Further, after that, the base tape 2 used for the pre-cut processing may be peeled off, and the known separator may be bonded to the adhesive layer 52 of the adhesive tape 5.
接著,一邊參照圖6~圖8一邊說明使用本實施形態之電子裝置封裝用膠帶1來製造電子裝置封裝8之方法。再者,本實施形態中,作為電子裝置封裝8,係以覆晶連接於被黏著體9上之半導體晶片C為例來說明。 Next, a method of manufacturing the electronic device package 8 using the tape 1 for electronic device packaging of the present embodiment will be described with reference to FIGS. 6 to 8. Further, in the present embodiment, the electronic device package 8 will be described by taking a semiconductor wafer C which is flip-chip bonded to the adherend 9 as an example.
首先,準備與本發明之電子裝置封裝用膠帶1之黏著膠帶5同樣的另外之切割膠帶D,於該切割膠帶D上之中央部,如圖6(A)表示,貼附半導體晶圓W,將其黏著保持並固定(半導體晶圓W之裝配步驟),而且於切割膠帶D之周緣部貼合環狀框架R。此時,切割膠帶D係貼附於半導體晶圓W之背面。半導體晶圓W之背面,意指與電路面相反側之面(亦稱為非電路面、非電極形成面等)。貼附方法並無特殊限定,較佳為加熱壓接之方法。壓接通常係藉由壓接輥等之按壓手段一邊按壓來進行。 First, a separate dicing tape D similar to the adhesive tape 5 of the tape 1 for electronic device packaging of the present invention is prepared, and a semiconductor wafer W is attached to the central portion of the dicing tape D as shown in FIG. 6(A). The adhesive tape is held and fixed (the assembly step of the semiconductor wafer W), and the annular frame R is bonded to the peripheral edge portion of the dicing tape D. At this time, the dicing tape D is attached to the back surface of the semiconductor wafer W. The back surface of the semiconductor wafer W means a surface opposite to the circuit surface (also referred to as a non-circuit surface, a non-electrode forming surface, etc.). The attachment method is not particularly limited, and is preferably a method of heating and crimping. The pressure bonding is usually performed by pressing by a pressing means such as a pressure roller.
接著,如圖6(B)表示,進行半導體晶圓W之切割。藉此,將半導體晶圓W切斷為特定尺寸進行單片化(小片化),以製造半導體晶片C。切割例如係由半導體晶圓W之電路面側起遵照一般方法進行。又,本步驟中,例如可採用進行切入至切割膠帶D為止之稱為全切(fullcut)的切斷方式等。本步驟所用之切割裝置並無特殊限定,可使用以往公知者。再者,進行切割膠帶D之擴展時,該擴展可使用以往公知之擴展裝置進行。 Next, as shown in FIG. 6(B), the semiconductor wafer W is cut. Thereby, the semiconductor wafer W is cut into a specific size and diced (small-sized) to manufacture the semiconductor wafer C. The dicing is performed, for example, from the circuit surface side of the semiconductor wafer W in accordance with a general method. Moreover, in this step, for example, a cutting method called full cut that cuts into the dicing tape D can be used. The cutting device used in this step is not particularly limited, and a conventionally known one can be used. Further, when the expansion of the dicing tape D is performed, the expansion can be performed using a conventionally known expansion device.
如圖6(C)表示,進行半導體晶片C之拾取,將半導體晶片C由切割膠帶D剝離。拾取之方法並無特殊限定,可採用以往公知之各種方法。例如,將貼合有半導體 晶片C及環狀框架R之切割膠帶D,以基材薄膜側朝下,載置於拾取裝置之載台S上,於經固定環狀框架R之狀態下,使中空圓柱形狀之頂起構件T上昇,擴張切割膠帶D。可列舉於此狀態下,將個別的半導體晶片C藉由插梢N由切割膠帶D之基材薄膜側頂起,且將頂起之半導體晶片C以拾取裝置拾取之方法等。 As shown in FIG. 6(C), the semiconductor wafer C is picked up, and the semiconductor wafer C is peeled off from the dicing tape D. The method of picking up is not particularly limited, and various methods known in the art can be employed. For example, a semiconductor will be bonded The dicing tape D of the wafer C and the annular frame R is placed on the stage S of the pick-up device with the substrate film side facing downward, and the hollow cylindrical shape ejector member is fixed in the state of fixing the annular frame R. T rises and expands the cutting tape D. In this state, a method in which the individual semiconductor wafers C are lifted up from the base film side of the dicing tape D by the nip N, and the semiconductor wafer C that is lifted up is picked up by the pickup device can be cited.
經拾取之半導體晶片C,係如圖6(D)表示,以覆晶接合方式(覆晶構裝方式)固定於基板等之被黏著體9。具體而言,將半導體晶片C,以半導體晶片C之電路面(亦稱為表面、電路圖型形成面、電極形成面等)與被黏著體9對向之形態下,遵照一般方法固定於被黏著體9。例如,首先使助焊劑附著於形成於半導體晶片C之電路面側之作為連接部的凸塊10。接著,使半導體晶片C之凸塊10接觸於被黏合於被黏著體9之連接墊的接合用之導電材11(銲錫等),一邊按壓一邊使凸塊10及導電材11熔融,藉此可確保半導體晶片C與被黏著體9之電性導通,使半導體晶片C固定於被黏著體9(覆晶接合步驟)。此時,半導體晶片C與被黏著體9之間係形成有空隙,其空隙間距離,一般而言為30μm~300μm左右。殘存於半導體晶片C與被黏著體9之對向面或間隙中的助焊劑係被洗淨去除。 As shown in FIG. 6(D), the semiconductor wafer C that has been picked up is fixed to the adherend 9 such as a substrate by a flip chip bonding method (flip-chip bonding method). Specifically, the semiconductor wafer C is fixed to the adhered film in accordance with a general method in a form in which the circuit surface (also referred to as a surface, a circuit pattern forming surface, an electrode forming surface, and the like) of the semiconductor wafer C is opposed to the adherend 9 . Body 9. For example, first, the flux is attached to the bump 10 as a connection portion formed on the circuit surface side of the semiconductor wafer C. Then, the bumps 10 of the semiconductor wafer C are brought into contact with the bonding conductive material 11 (such as solder) bonded to the connection pads of the adherend 9, and the bumps 10 and the conductive material 11 are melted while being pressed. The semiconductor wafer C is electrically connected to the adherend 9 to fix the semiconductor wafer C to the adherend 9 (the flip chip bonding step). At this time, a gap is formed between the semiconductor wafer C and the adherend 9, and the distance between the gaps is generally about 30 μm to 300 μm . The flux remaining in the opposite surface or gap of the semiconductor wafer C and the adherend 9 is washed and removed.
作為被黏著體9,可使用引線框架或電路基板 (配線電路基板等)等之各種基板。如此之基板的材質並無特殊限定,可列舉陶瓷基板、或塑膠基板。塑膠基板可列舉例如環氧樹脂基板、雙馬來醯亞胺三嗪基板、聚醯亞胺基板等。又,藉由以其他半導體晶片為被黏著體9,且將上述半導體晶片C予以覆晶連接,亦可成為晶片堆疊構造(chip on chip)。 As the adherend 9, a lead frame or a circuit substrate can be used Various substrates such as (wiring circuit board, etc.). The material of such a substrate is not particularly limited, and examples thereof include a ceramic substrate or a plastic substrate. Examples of the plastic substrate include an epoxy resin substrate, a bismaleimide triazine substrate, and a polyimide substrate. Further, by using another semiconductor wafer as the adherend 9 and flip-chip bonding the semiconductor wafer C, it is possible to form a chip on chip.
接著,如圖7(A)所示,將本實施形態之電子裝置封裝用膠帶1之基材膠帶2剝離,使金屬層3及黏著膠帶5之黏著劑層52露出,將黏著劑層52之周緣部固定於環狀框架R。 Next, as shown in FIG. 7(A), the base tape 2 of the tape 1 for electronic device packaging of the present embodiment is peeled off, and the adhesive layer 52 of the metal layer 3 and the adhesive tape 5 is exposed, and the adhesive layer 52 is exposed. The peripheral portion is fixed to the annular frame R.
接著,如圖7(B)所示,將金屬層3及接著劑層4切斷為對應於半導體晶片C之大小而單片化。切斷可藉由與上述半導體晶圓W之切割步驟相同之步驟進行。再者,有進行將金屬層3及接著劑層4預先單片化之預切加工的情況時,不進行本步驟。 Next, as shown in FIG. 7(B), the metal layer 3 and the adhesive layer 4 are cut into pieces corresponding to the size of the semiconductor wafer C. The cutting can be performed by the same steps as the cutting step of the semiconductor wafer W described above. In the case where the pre-cut processing for pre-single the metal layer 3 and the adhesive layer 4 is performed, this step is not performed.
接著,如圖7(C)所示,將經單片化之金屬層3及接著劑層4進行拾取,由黏著膠帶5剝離。拾取可藉由與上述半導體晶片C之拾取步驟相同之步驟進行。 Next, as shown in FIG. 7(C), the singulated metal layer 3 and the adhesive layer 4 are picked up and peeled off by the adhesive tape 5. The pickup can be performed by the same steps as the pickup step of the above-described semiconductor wafer C.
接著,將經拾取之金屬層3及接著劑層4之接著劑層4側,如圖8所示,貼合於經覆晶連接之半導體晶片C的背面。之後,於附有金屬層3之半導體晶片C的周邊及半導體晶片C與被黏著體9之間隙中填充密封材(密封樹脂等)進行密封。密封係遵照一般方法進行。此時,因為於半導體晶片C之背面設置有金屬層3,故於覆 晶接合步驟中因半導體晶片C與被黏著體9之熱膨脹率差所產生的翹曲,會被半導體晶片C與金屬層3之熱膨脹率差所抵消。又,因為於半導體晶片C之背面設置有金屬層3,故作為電子裝置使用時之發熱係藉由金屬層3散熱。 Next, the side of the adhesive layer 4 of the picked-up metal layer 3 and the adhesive layer 4 is bonded to the back surface of the flip-chip bonded semiconductor wafer C as shown in FIG. Thereafter, a sealing material (a sealing resin or the like) is filled in the periphery of the semiconductor wafer C with the metal layer 3 and the gap between the semiconductor wafer C and the adherend 9 to be sealed. The sealing system is carried out in accordance with a general method. At this time, since the metal layer 3 is provided on the back surface of the semiconductor wafer C, it is overcoated. The warpage caused by the difference in thermal expansion coefficient between the semiconductor wafer C and the adherend 9 in the crystal bonding step is offset by the difference in thermal expansion coefficient between the semiconductor wafer C and the metal layer 3. Further, since the metal layer 3 is provided on the back surface of the semiconductor wafer C, heat generated during use as an electronic device is radiated by the metal layer 3.
再者,上述係說明了將金屬層3隔著接著劑層4直接設置於半導體晶片C之背面,金屬層3亦與半導體晶片C一起密封之封裝構造,但亦可於密封半導體晶片C後,將金屬層3隔著接著劑層4設置於於密封體之上側面。電子裝置封裝8,由於在密封時亦會產生翹曲,故藉由於密封體之上側面設置金屬層3,可抵消密封時之翹曲。 In the above description, the metal layer 3 is directly provided on the back surface of the semiconductor wafer C via the adhesive layer 4, and the metal layer 3 is also sealed together with the semiconductor wafer C. However, after the semiconductor wafer C is sealed, The metal layer 3 is provided on the upper surface of the sealing body via the adhesive layer 4. Since the electronic device package 8 is warped even when it is sealed, the warpage at the time of sealing can be offset by providing the metal layer 3 on the upper side surface of the sealing body.
再者,上述係以於被黏著體9上覆晶連接之半導體晶片C,作為電子裝置封裝8為例來說明,但不限定於此,例如,於半導體晶片上層合有相同尺寸之其他半導體晶片的電子裝置封裝構造中,為了使用本發明之電子裝置封裝用膠帶1之金屬層3作為兩晶片間之間隔件,亦可隔著接著劑層4於下側之半導體晶片上設置金屬層3。 In addition, the semiconductor wafer C which is flip-chip bonded to the adherend 9 is described as an example of the electronic device package 8. However, the present invention is not limited thereto. For example, other semiconductor wafers of the same size are laminated on the semiconductor wafer. In the electronic device package structure, in order to use the metal layer 3 of the tape 1 for electronic device packaging of the present invention as a spacer between the two wafers, the metal layer 3 may be provided on the semiconductor wafer on the lower side via the adhesive layer 4.
接著,為了使本發明之效果更加明確,係詳細地說明實施例及比較例,但本發明不限定於此等實施例。 Next, in order to clarify the effects of the present invention, the examples and comparative examples will be described in detail, but the present invention is not limited to the examples.
作為具有官能基之丙烯酸系共聚物(A1),係配製由丙烯酸2-乙基己酯、丙烯酸2-羥基乙酯及丙烯酸所成,且丙烯酸2-乙基己酯之比率為80莫耳%、質量平均分子量70萬之共聚物。接著,以碘價成為15的方式,添加甲基丙烯酸2-異氰酸基乙酯,配製玻璃轉移溫度-70℃、羥基價20mgKOH/g、酸價5mgKOH/g之丙烯酸系共聚物(a-1)。 The acrylic copolymer (A1) having a functional group is prepared by 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and acrylic acid, and the ratio of 2-ethylhexyl acrylate is 80 mol%. A copolymer having a mass average molecular weight of 700,000. Next, 2-isocyanatoethyl methacrylate was added so that the iodine value became 15 to prepare an acrylic copolymer having a glass transition temperature of -70 ° C, a hydroxyl group of 20 mgKOH/g, and an acid value of 5 mgKOH/g (a- 1).
將相對於丙烯酸系共聚物(a-1)100質量份而言,添加作為聚異氰酸酯之CORONATE L(東曹股份有限公司製)10質量份,且添加作為光聚合起始劑之Irgacure 184(BASF公司製)3質量份之混合物,溶解於乙酸乙酯,攪拌而得到黏著劑層組成物(1)。 To 100 parts by mass of the acrylic copolymer (a-1), 10 parts by mass of CORONATE L (manufactured by Tosoh Corporation) as a polyisocyanate was added, and Irgacure 184 (BASF) as a photopolymerization initiator was added. A mixture of 3 parts by mass of the company was dissolved in ethyl acetate and stirred to obtain an adhesive layer composition (1).
作為具有官能基之丙烯酸系共聚物(A1),係配製由丙烯酸丁酯、丙烯酸2-乙基己酯、丙烯酸2-羥基乙酯及丙烯酸所成,且丙烯酸2-乙基己酯之比率為50莫耳%,質量平均分子量65萬、玻璃轉移溫度-60℃、羥基價25mgKOH/g、酸價6mgKOH/g之丙烯酸系共聚物(a-2)。 The acrylic copolymer (A1) having a functional group is prepared from butyl acrylate, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and acrylic acid, and the ratio of 2-ethylhexyl acrylate is 50 mol%, an acrylic copolymer (a-2) having a mass average molecular weight of 650,000, a glass transition temperature of -60 ° C, a hydroxyl value of 25 mgKOH/g, and an acid value of 6 mgKOH/g.
將相對於丙烯酸系共聚物(a-2)100質量份而言,添加作為聚異氰酸酯之CORONATE L(東曹股份有限公司製)10質量份之混合物,溶解於乙酸乙酯,攪拌而得到黏著劑層組成物(2)。 To 100 parts by mass of the acrylic copolymer (a-2), a mixture of 10 parts by mass of CORONATE L (manufactured by Tosoh Corp.) as a polyisocyanate was added, dissolved in ethyl acetate, and stirred to obtain an adhesive. Layer composition (2).
將相對於丙烯酸系共聚物(a-2)100質量份而言,添加作為聚異氰酸酯之CORONATE L(東曹股份有限公司製)8質量份之混合物,溶解於乙酸乙酯,攪拌而得到黏著劑層組成物(3)。 To 100 parts by mass of the acrylic copolymer (a-2), a mixture of 8 parts by mass of CORONATE L (manufactured by Tosoh Corp.) as a polyisocyanate was added, dissolved in ethyl acetate, and stirred to obtain an adhesive. Layer composition (3).
作為基材薄膜,係製作以下者。 As the base film, the following were produced.
將聚丙烯PP及熱可塑性彈性體HSBR之混合物(PP:HSBR=80:20)的樹脂珠於200℃熔融,使用擠出機成形為厚度80μm之長形薄膜狀,製作基材薄膜(1)。聚丙烯PP係使用出光石油化學股份有限公司製之F-300SP(商品名)、熱可塑性彈性體HSBR係使用JSR股份有限公司製之DYNARON 1320P(商品名)。 A resin bead of a mixture of polypropylene PP and thermoplastic elastomer HSBR (PP: HSBR = 80: 20) was melted at 200 ° C, and formed into an elongated film having a thickness of 80 μm using an extruder to prepare a base film ( 1). For the polypropylene PP, F-300SP (trade name) manufactured by Idemitsu Petrochemical Co., Ltd. and thermoplastic elastomer HSBR manufactured by JSR Co., Ltd. were used as DYNARON 1320P (trade name) manufactured by JSR Co., Ltd.
於經脫模處理之聚對苯二甲酸乙二酯薄膜所成的剝離襯墊上,將上述黏著劑層組成物(1),以乾燥後之厚度成為10μm的方式進行塗覆,於110℃乾燥3分鐘而成為黏著劑層後,與上述基材薄膜(1)貼合,製作黏著膠帶(1)。 The adhesive layer composition (1) was applied to a release liner formed of a release-treated polyethylene terephthalate film so as to have a thickness of 10 μm after drying. After drying at 110 ° C for 3 minutes to form an adhesive layer, it was bonded to the base film (1) to prepare an adhesive tape (1).
除了使用黏著劑層組成物(2)以外,係與黏著膠帶 (1)相同地製作黏著膠帶(2)。 In addition to the use of the adhesive layer composition (2), the adhesive tape (1) Adhesive tape (2) was produced in the same manner.
除了使用黏著劑層組成物(3)以外,係與黏著膠帶(1)相同地製作黏著膠帶(3)。 An adhesive tape (3) was produced in the same manner as the adhesive tape (1) except that the adhesive layer composition (3) was used.
將丙烯酸樹脂(Nagase ChemteX股份有限公司製、商品名「Teisanresin SG-P3」、Mw85萬、Tg12℃)80質量份、與萘型環氧樹脂(DIC股份有限公司製、商品名「HP-4700」)10質量份、作為硬化劑之酚樹脂(明和化成股份有限公司製、商品名「MEH7851」)10質量份,溶解於甲基乙基酮,配製接著劑層組成物溶液。將該接著劑層組成物溶液,塗佈於經聚矽氧脫模處理之厚度50μm的聚對苯二甲酸乙二酯薄膜所成之脫模處理薄膜(剝離襯墊)上後,於130℃乾燥5分鐘。藉此,製作厚度20μm之接著劑層(1)。 80 parts by mass of an acrylic resin (manufactured by Nagase ChemteX Co., Ltd., trade name "Teisanresin SG-P3", Mw 850,000, Tg 12 ° C), and a naphthalene type epoxy resin (manufactured by DIC Corporation, trade name "HP-4700") 10 parts by mass of 10 parts by mass of a phenol resin (manufactured by Megumi Kasei Co., Ltd., trade name "MEH7851") as a curing agent, dissolved in methyl ethyl ketone, and a solution of an adhesive layer composition was prepared. The adhesive layer composition solution was applied onto a release-treated film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm which was subjected to polyfluorene oxygen stripping treatment, and then dried at 130 ° C. Dry for 5 minutes. Thereby, an adhesive layer (1) having a thickness of 20 μm was produced.
將雙酚A型苯氧樹脂(新日鐵住金化學股份有限公司製、商品名「YP-50S」、Mw6萬、Tg84℃)100質量份、與甲酚酚醛清漆型環氧樹脂(日本化藥股份有限公司製、 商品名「EOCN-1020」、環氧當量198、軟化點64℃)40質量份、液體雙酚A型環氧樹脂(新日鐵住金化學股份有限公司、商品名「YD-128」、Mw400、環氧當量190)100質量份、作為硬化劑之咪唑(四國化成工業股份有限公司製、商品名「2PHZ-PW」)1.5質量份、二氧化矽填料(Admatechs股份有限公司製、商品名「SO-C2」、平均粒徑0.5μm)20質量份,溶解或分散於甲基乙基酮,配製接著劑層組成物溶液。使用該接著劑層組成物溶液,以與接著劑層(1)相同之方法製作厚度20μm之接著劑層(2)。 100 parts by mass of bisphenol A type phenoxy resin (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., trade name "YP-50S", Mw 60,000, Tg84 ° C), and cresol novolak type epoxy resin (Japanese chemical) Co., Ltd., product name "EOCN-1020", epoxy equivalent 198, softening point 64 °C) 40 parts by mass, liquid bisphenol A type epoxy resin (Nippon Steel & Sumitomo Chemical Co., Ltd., trade name "YD- 128", Mw400, epoxy equivalent 190) 100 parts by mass, imidazole as a curing agent (manufactured by Shikoku Chemicals Co., Ltd., trade name "2PHZ-PW") 1.5 parts by mass, ruthenium dioxide filler (Admatechs Co., Ltd.) 20 parts by mass of a product name "SO-C2" and an average particle diameter of 0.5 μm) was dissolved or dispersed in methyl ethyl ketone to prepare a solution of a binder layer composition. Using the adhesive layer composition solution, an adhesive layer (2) having a thickness of 20 μm was produced in the same manner as the adhesive layer (1).
作為金屬層,係準備以下者。 As the metal layer, the following are prepared.
F3-WS(古河電氣工業、銅箔、厚度12μm、表面粗度RzJIS2.8μm) F3-WS (Furukawa Electric Industry, copper foil, thickness 12μm, surface roughness RzJIS2.8μm)
GTS(古河電氣工業、銅箔、厚度9μm、表面粗度RzJIS6.0μm) GTS (Furukawa Electric Industry, copper foil, thickness 9μm, surface roughness RzJIS6.0μm)
1085(UACJ、鋁箔、厚度20μm、表面粗度RzJIS1.9μm) 1085 (UACJ, aluminum foil, thickness 20μm, surface roughness RzJIS1.9μm)
1085(UACJ、鋁箔、厚度20μm、表面粗度RzJIS4.9μm) 1085 (UACJ, aluminum foil, thickness 20μm, surface roughness RzJIS4.9μm)
SUS304(新日鐵住金Materials、不鏽鋼箔、厚度20μm、表面粗度RzJIS2.1um) SUS304 (Nippon Steel Living Materials, stainless steel foil, thickness 20μm, surface roughness RzJIS2.1um)
將厚度35μm、M面之光澤度230%、S面之光澤度100%的電解銅箔予以脫脂/酸洗後,以下述表1及2所示之條件進行粗化處理、PR脈衝電解、鹼浸漬處理,準備金屬層(6)~(11)。 The electrolytic copper foil having a thickness of 35 μm, a gloss of 230% on the M surface, and a gloss of 100% on the S surface was degreased/acid washed, and then subjected to roughening treatment, PR pulse electrolysis, and alkali under the conditions shown in Tables 1 and 2 below. The metal layer (6) to (11) are prepared by immersion treatment.
再者,於金屬層(1)~(11),表面粗度RzJIS為金屬層之未貼合於接著劑層的面之由十點平均粗度所得之表面粗度RzJIS。又,金屬層(6)~(11)中,光澤度為根據JIS Z 8741,使用日本電色股份有限公司製光澤度計Handy glossmeter PG-1所測定之金屬層的未貼合於接著劑層之面於入射角60度的鏡面光澤度。 Further, in the metal layers (1) to (11), the surface roughness RzJIS is the surface roughness RzJIS obtained from the ten-point average roughness of the surface of the metal layer which is not bonded to the adhesive layer. Further, in the metal layers (6) to (11), the glossiness is not adhered to the adhesive layer in accordance with JIS Z 8741, and the metal layer measured by the gloss meter Handy glossmeter PG-1 manufactured by Nippon Denshoku Co., Ltd. is used. The specular gloss at 60 degrees of incidence.
將形成於上述剝離襯墊上之接著劑層(1)與金屬層(1),以貼合角度120°、壓力0.2MPa、速度10mm/s之條件貼合,製作單面接著薄膜。將黏著膠帶(1)以可貼合於環狀框架的方式預切為圓形形狀、將單面接著薄膜預切為小於黏著膠帶(1)之圓形形狀。將剝離前述單面接著薄膜之脫模處理薄膜所露出的接著劑層(1)側與前述黏著膠帶(1)之黏著劑層,以於單面接著薄膜之周圍露出黏著劑層的方式貼合,製作如圖1所示之實施例1之電子裝置封裝用膠帶。 The adhesive layer (1) formed on the release liner and the metal layer (1) were bonded together under the conditions of a bonding angle of 120°, a pressure of 0.2 MPa, and a speed of 10 mm/s to prepare a single-sided film. The adhesive tape (1) is pre-cut into a circular shape so as to be conformable to the annular frame, and the single-sided adhesive film is pre-cut into a circular shape smaller than the adhesive tape (1). Adhesive layer (1) exposed on the release-treated film of the single-sided adhesive film and the adhesive layer of the adhesive tape (1) are adhered to each other so as to expose the adhesive layer around the single-sided film. A tape for packaging an electronic device of Example 1 as shown in FIG. 1 was produced.
除了使黏著膠帶、接著劑層組成物、金屬層之組合成為表3、4記載之組合以外,係藉由與實施例1相同之手法,製作實施例2~12、比較例1之電子裝置封裝用膠 帶。 The electronic device packages of Examples 2 to 12 and Comparative Example 1 were produced by the same method as in Example 1 except that the combination of the adhesive tape, the adhesive layer composition, and the metal layer was the combination described in Tables 3 and 4. Glue band.
對於實施例1~12及比較例1之電子裝置封裝用膠帶進行以下之測定及評估。其結果示於表3、4。 The following measurement and evaluation were performed on the tapes for electronic device packaging of Examples 1 to 12 and Comparative Example 1. The results are shown in Tables 3 and 4.
將各實施例及比較例之接著劑層由剝離襯墊剝離,藉由2kg之輥,於接著劑層之表面貼合形狀保持膠帶(積水化學工業股份有限公司製、商品名「Forte」),切取為25mm寬之條狀,製作依序層合有基材薄膜、黏著劑層、接著劑層與形狀保持膠帶之試驗片。所製作之試驗片當中,將實施例1、3、4及7~12藉由空冷式高壓水銀燈(80W/cm、照射距離100mm)照射紫外線200mJ/cm2。之後,藉由東洋精機製作所股份有限公司製之Strograph(商品名「VE10」)分為「基材薄膜及黏著劑層」之層合體、與「接著劑層及形狀保持膠帶」之層合體而抓取,以線速300mm/min測定黏著劑層與接著劑層之間的黏著力。再者,黏著力之單位為[N/25mm]。測定係以180°剝離法進行,測定溫度為23℃、測定濕度為50%。又,分為「基材薄膜及黏著劑層」之層合體、與「接著劑層及形狀保持膠帶」之層合體,由「基材薄膜及黏著劑層」剝離「接著劑層及形狀保持膠帶」,係因為若僅抓取接著劑層進行剝離時,會有接著劑層延伸之虞之故。 The adhesive layer of each of the examples and the comparative examples was peeled off from the release liner, and a shape-retaining tape (manufactured by Sekisui Chemical Co., Ltd., trade name "Forte") was attached to the surface of the adhesive layer by a roll of 2 kg. A strip having a width of 25 mm was cut out, and a test piece in which a base film, an adhesive layer, an adhesive layer, and a shape-retaining tape were laminated in this order was prepared. Among the test pieces produced, Examples 1, 3, 4, and 7 to 12 were irradiated with ultraviolet rays of 200 mJ/cm 2 by an air-cooled high-pressure mercury lamp (80 W/cm, irradiation distance of 100 mm). After that, Strograph (trade name "VE10" manufactured by Toyo Seiki Co., Ltd.) is divided into a laminate of "base film and adhesive layer" and a laminate of "adhesive layer and shape-retaining tape". The adhesion between the adhesive layer and the adhesive layer was measured at a line speed of 300 mm/min. Furthermore, the unit of adhesion is [N/25mm]. The measurement was carried out by a 180° peeling method, and the measurement temperature was 23° C., and the measurement humidity was 50%. Further, the laminate of the "base film and the adhesive layer" and the laminate of the "adhesive layer and the shape-retaining tape" are peeled off from the "base film and the adhesive layer". "Adhesive layer and shape-retaining tape" Therefore, if the adhesive layer is only peeled off, the adhesive layer may be stretched.
將各實施例及比較例之接著劑層切取為5.0cm×5.0cm之尺寸進行層合,於載台70℃之熱板上,以手墨輥貼合,得到厚度約1.0mm之試驗片。對於該試驗片,使用Haake公司製之Leometer(商品名「RS6000」),於溫度範圍10~150℃、昇溫速度5℃/min昇溫,求得於25℃之損失正切tanδ。測定係以50% RH、測定頻率1Hz進行。 The adhesive layers of the respective examples and comparative examples were cut into a size of 5.0 cm × 5.0 cm, laminated, and bonded on a hot plate at 70 ° C on a loading table with a hand roller to obtain a test piece having a thickness of about 1.0 mm. The test piece was subjected to a temperature range of 10 to 150 ° C and a temperature increase rate of 5 ° C / min using a Leometer (trade name "RS6000" manufactured by Haake Co., Ltd., and the loss tangent tan δ at 25 ° C was obtained. The measurement was carried out at 50% RH and a measurement frequency of 1 Hz.
將上述實施例及比較例之各樣品的電子裝置封裝用膠帶之金屬層及接著劑層,單片化為5mm×5mm大小之樣品。之後,藉由空冷式高壓水銀燈(80W/cm、照射距離10cm),由基材薄膜側對黏著劑層照射紫外線200mJ/cm2。對於電子裝置封裝用膠帶中央部之單片樣品100個,使用Canon Machinery股份有限公司製之Dice Picker裝置(商品名「CAP-300II」),確認是否可與矽晶圓晶片同樣地辨識單片化樣品。將可與晶片同樣辨識者作為良品,評估為○;將藉由變更光之照射角度或照射量而可與晶片同樣辨識者作為容許品,評估為△;將無法辨識者作為不良品,評估為×。其結果示於表3、4。 The metal layer and the adhesive layer of the tape for electronic device packaging of each of the samples of the above examples and comparative examples were singulated into a sample having a size of 5 mm × 5 mm. Thereafter, the adhesive layer was irradiated with ultraviolet rays of 200 mJ/cm 2 from the base film side by means of an air-cooled high-pressure mercury lamp (80 W/cm, irradiation distance: 10 cm). For 100 pieces of a single sample in the center of the tape for electronic device packaging, a Dice Picker device (trade name "CAP-300II") manufactured by Canon Machinery Co., Ltd. was used to confirm whether the singulation can be recognized in the same manner as the wafer wafer. sample. The same identifiable as the wafer is evaluated as ○; the illuminating angle or the amount of irradiation can be changed to the same as the wafer, and the identifiable product is evaluated as Δ; ×. The results are shown in Tables 3 and 4.
於上述辨識性試驗之後,對於上述單片樣品250個,以下述拾取條件進行拾取試驗,算出可拾取200個以上之樣品的插梢高度(插梢高)。再者,插梢高之上限設為 400μm。其結果示於表3、4。實施例6之電子裝置封裝用膠帶,黏著膠帶與接著劑層之黏著力過高,於本試驗條件下無法拾取單片樣品,因此無法算出插梢高。惟,可辨識單片化樣品,若將插梢高設定為高於400μm則可拾取,故無問題。再者,插梢高過高時,有於金屬層產生插梢痕之虞,但產生插梢痕時,可於將金屬層及接著劑層貼合於半導體晶片之背面時按壓金屬層,撫平插梢痕。又,比較例1之電子裝置封裝用膠帶,無法辨識單片樣品,無法進行拾取,因此無法算出插梢高。 After the above-described identification test, 250 pieces of the above-mentioned single-piece samples were subjected to a pick-up test under the following pick-up conditions, and the height of the plug which can pick up 200 or more samples was calculated. Furthermore, the upper limit of the insertion height is set to 400 μm. The results are shown in Tables 3 and 4. In the tape for electronic device packaging of Example 6, the adhesion between the adhesive tape and the adhesive layer was too high, and the single-piece sample could not be picked up under the test conditions, so that the insertion height could not be calculated. However, the singulated sample can be identified, and if the insertion height is set to be higher than 400 μm, it can be picked up, so that there is no problem. Moreover, when the insertion height is too high, there is a flaw in the metal layer, but when the tip is formed, the metal layer and the adhesive layer can be pressed against the back surface of the semiconductor wafer, and the metal layer is pressed. Flat stitch marks. Further, in the tape for electronic device packaging of Comparative Example 1, the single-piece sample could not be recognized, and the pickup could not be performed, so that the insertion height could not be calculated.
拾取裝置:Canon Machinery公司製CAP-300II Pickup device: CAP-300II manufactured by Canon Machinery Co., Ltd.
頂起插梢形狀:半徑0.7mm、前端曲率半徑R=0.25mm、前端θ=15 Jacking tip shape: radius 0.7mm, front end radius of curvature R=0.25mm, front end θ=15
插梢頂起速度:50mm/sec Inserting jacking speed: 50mm/sec
如表3、4所示,實施例1~12之電子裝置封裝用膠帶,金屬層之與接著劑層相反側之面的由十點平均粗度所得之表面粗度RzJIS為未達5.0μm,因此於辨識性評估中成為良好的結果。再者,如表4所示,實施例8之電子裝置封裝用膠帶,金屬層之於入射角60度的鏡面光澤度為117%,因此有必要變更光之照射角度與照射量,但照射角度與量之調節後可辨識單片化樣品,因此為容許範圍。 As shown in Tables 3 and 4, the tape for electronic device packaging of Examples 1 to 12, the surface roughness RzJIS obtained by the ten-point average roughness of the surface of the metal layer opposite to the adhesive layer was less than 5.0 μm. Therefore, it becomes a good result in the identification evaluation. Further, as shown in Table 4, in the tape for electronic device packaging of the eighth embodiment, the specular gloss of the metal layer at an incident angle of 60 degrees is 117%, so it is necessary to change the irradiation angle and the irradiation amount of the light, but the irradiation angle. The uniform sample can be identified after adjustment with the amount, and is therefore an allowable range.
相對於此,比較例1之電子裝置封裝用膠帶,金屬層之與接著劑層相反側的面之由十點平均粗度所得之表面粗度RzJIS為6.0μm,因此於辨識性評估中為不良的結果。 On the other hand, in the tape for electronic device packaging of Comparative Example 1, the surface roughness RzJIS obtained by the ten-point average roughness of the surface of the metal layer opposite to the adhesive layer was 6.0 μm, which was bad in the visibility evaluation. the result of.
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