TWI642930B - Lighting unit, defects inspection device and lighting method - Google Patents

Lighting unit, defects inspection device and lighting method Download PDF

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TWI642930B
TWI642930B TW106121226A TW106121226A TWI642930B TW I642930 B TWI642930 B TW I642930B TW 106121226 A TW106121226 A TW 106121226A TW 106121226 A TW106121226 A TW 106121226A TW I642930 B TWI642930 B TW I642930B
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TW201804151A (en
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松山晃久
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日商歐姆龍股份有限公司
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    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/94Investigating contamination, e.g. dust
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8809Adjustment for highlighting flaws
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    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8812Diffuse illumination, e.g. "sky"
    • G01N2021/8816Diffuse illumination, e.g. "sky" by using multiple sources, e.g. LEDs
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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    • G01N21/88Investigating the presence of flaws or contamination
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    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8845Multiple wavelengths of illumination or detection
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    • G01N21/89Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G01N2021/8924Dents; Relief flaws
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    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/06Illumination; Optics
    • G01N2201/062LED's
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/06Illumination; Optics
    • G01N2201/063Illuminating optical parts

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Abstract

一種照明單元、缺陷檢查裝置及照明方法。照明單元包括第1照明部、第2照明部及第3照明部。第1照明部從第1方向發出照射至安置在檢查位置上的檢查物件物的照明光。第2照明部從第2方向發出照射至安置在檢查位置上的檢查物件物的照明光。第3照明部從第3方向發出照射至安置在檢查位置上的檢查物件物的照明光。第1方向、第2方向及第3方向是各不相同的方向。第2照明部或第3照明部中的一者發出與第1照明部顏色相同的照明光。第1方向是如下的方向,即,使由第1照明部照射,並經檢查物件物反射的正反射光的光軸與相機的光軸相吻合。A lighting unit, a defect inspection device and a lighting method. The lighting unit includes a first lighting section, a second lighting section, and a third lighting section. The first illumination unit emits illumination light from the first direction to the inspection object placed at the inspection position. The second illumination unit emits illumination light from the second direction to the inspection object placed on the inspection position. The third illumination unit emits illumination light from the third direction to the inspection object placed at the inspection position. The first direction, the second direction, and the third direction are different directions. Either the second lighting unit or the third lighting unit emits lighting light having the same color as the first lighting unit. The first direction is a direction in which the optical axis of the specularly reflected light irradiated by the first illumination unit and reflected by the inspection object coincides with the optical axis of the camera.

Description

照明單元、缺陷檢查裝置及照明方法Lighting unit, defect inspection device and lighting method

本發明涉及一種檢查在檢查對象物中是否產生有缺陷的技術。The present invention relates to a technique for inspecting whether a defect is generated in an inspection object.

先前,存在檢查在檢查對象物中是否產生有色彩缺陷或凹凸缺陷(以下,對它們進行總稱時,簡稱為缺陷)的缺陷檢查裝置(參照專利文獻1)。檢查對象物是各種成型體,是電子零件或電子設備等物品。色彩缺陷是在檢查對象物的成型工序時或成型工序後,因異物附著等而產生的缺陷。凹凸缺陷是檢查對象物的成型工序時的成型不良、或成型工序後碰撞到某物等而產生的瑕疵或凹痕。Conventionally, there is a defect inspection device (see Patent Document 1) for inspecting whether color defects or uneven defects (hereinafter, collectively referred to as defects) are generated in an inspection object. The objects to be inspected are various molded bodies, and are items such as electronic parts or electronic equipment. A color defect is a defect caused by the adhesion of a foreign matter during or after the molding process of an inspection target. Concavo-convex defects are defects in molding at the time of the molding process of the inspection object, or flaws or dents caused by collision with a certain object or the like after the molding process.

專利文獻1的缺陷檢查裝置具有如下構成:對拍攝檢查對象物而成的影像進行處理,並檢查在檢查對象物中是否產生有缺陷。具體而言,所述缺陷檢查裝置是在對檢查對象物,從第1方向照射第1照明光,並且從與第1方向不同的第2方向照射第2照明光的狀態下,利用相機對所述檢查對象物的彩色影像進行拍攝。第1照明光與第2照明光是不同顏色的照明光。相機安裝在接收照明光的正反射光的方向上,所述照明光是從第1方向照射至檢查對象物。缺陷檢查裝置針對相機所拍攝的檢查對象物的影像,生成與第1照明光的顏色相對應的第1色彩影像及與第2照明光的顏色相對應的第2色彩影像。而且,缺陷檢查裝置對第1色彩影像進行處理而檢查在檢查對象物中是否產生有凹凸缺陷,並且對第2色彩影像進行處理而檢查在檢查對象物中是否產生有色彩缺陷。The defect inspection device of Patent Document 1 has a configuration in which an image obtained by photographing an inspection target is processed, and whether or not a defect occurs in the inspection target is inspected. Specifically, the defect inspection device irradiates the inspection object with the first illumination light from the first direction and irradiates the second illumination light from the second direction different from the first direction. The color image of the inspection object is captured. The first illumination light and the second illumination light are illumination lights of different colors. The camera is mounted in a direction that receives the specularly reflected light of the illumination light, which is irradiated to the inspection object from the first direction. The defect inspection device generates a first color image corresponding to the color of the first illumination light and a second color image corresponding to the color of the second illumination light with respect to the image of the inspection object captured by the camera. In addition, the defect inspection device processes the first color image to check whether or not a concave-convex defect occurs in the inspection object, and processes the second color image to check whether a color defect occurs in the inspection object.

專利文獻1的缺陷檢查裝置是利用如下原理,來檢查在檢查對象物中是否產生有缺陷,所述原理是在產生有凹凸缺陷的地方,在所對應的像素中接收到的第1照明光的正反射光的光量會減少,以及在產生有色彩缺陷的地方所對應的像素及未產生色彩缺陷的地方所對應的像素中,所接收到的漫反射光(第2照明光的反射光)的光量會產生差異。 [現有技術文獻] [專利文獻]The defect inspection device of Patent Document 1 uses a principle to check whether a defect occurs in an inspection object. The principle is that the first illumination light is received in a corresponding pixel at a place where a bump defect is generated. The amount of regular reflected light is reduced, and the diffused reflected light (the reflected light of the second illumination light) is received in the pixels corresponding to the place where the color defect occurs and the pixels corresponding to the place where the color defect does not occur. The amount of light makes a difference. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利特開2006-313146號公報[Patent Document 1] Japanese Patent Laid-Open No. 2006-313146

[發明所要解決的問題] 但是,專利文獻1的缺陷檢查裝置是將檢查對象物的光澤不均作為缺陷(色彩缺陷)來檢測的裝置。因此,在專利文獻1的缺陷檢查裝置中,如果檢查對象物是存在光澤不均的物品,則無法適當地進行缺陷檢查。[Problems to be Solved by the Invention] However, the defect inspection device of Patent Document 1 is a device that detects unevenness in gloss of an inspection target as a defect (color defect). Therefore, in the defect inspection device of Patent Document 1, if the inspection target is an article having uneven gloss, the defect inspection cannot be performed properly.

所謂存在光澤不均的檢查對象物,是指檢查面的反射率不一樣的物品,例如撓性基板(撓性印刷電路(flexible printed circuit,FPC)基板)、印刷基板、表面上描繪有花紋的物品(包含花紋上形成有塗佈層的物品)。FPC基板或印刷基板形成有電路圖案(導體圖案),通常由金屬薄膜形成。但是,金屬薄膜的表面因為其加工上的問題而會在表面上斑駁地存在反射率高的地方(鏡面)及反射率低的地方(擴散面),從而產生了光澤不均。The inspection object with uneven glossiness refers to articles with different reflectances on the inspection surface, such as flexible substrates (flexible printed circuit (FPC) substrates), printed substrates, and patterns on the surface Articles (including articles with a coating layer formed on the pattern). The FPC board or printed board is formed with a circuit pattern (conductor pattern), and is usually formed of a metal thin film. However, the surface of the metal thin film has mottled areas with high reflectance (mirror surface) and low reflectance (diffusion surface) on the surface due to processing problems, resulting in uneven gloss.

本發明的目的在於提供一種即使檢查對象物是存在光澤不均的物品,也可以適當地進行色彩缺陷或凹凸缺陷的檢查的技術。 [解決問題的手段]An object of the present invention is to provide a technique capable of appropriately performing inspection for color defects or irregularities even if the inspection target is an article having uneven gloss. [Means to solve the problem]

為了達成所述目的,本發明的照明單元構成如下。In order to achieve the object, the lighting unit of the present invention is configured as follows.

所述照明單元在利用相機對安置在檢查位置上的檢查對象物進行拍攝時,對所述檢查對象物照射照明光。照明單元包括第1照明部、第2照明部及第3照明部。The illumination unit irradiates illumination light on the inspection object when shooting the inspection object placed on the inspection position with a camera. The lighting unit includes a first lighting section, a second lighting section, and a third lighting section.

第1照明部從第1方向,發出照射至安置在檢查位置上的檢查對象物的照明光。第2照明部從第2方向,發出照射至安置在檢查位置上的檢查對象物的照明光。第3照明部從第3方向,發出照射至安置在檢查位置上的檢查對象物的照明光。第1方向、第2方向及第3方向是各不相同的方向。The first illumination unit emits illumination light from the first direction to the inspection object placed at the inspection position. The second illumination unit emits illumination light from the second direction to the inspection object placed at the inspection position. The third illumination unit emits illumination light from the third direction to the inspection target placed at the inspection position. The first direction, the second direction, and the third direction are different directions.

並且,第2照明部或第3照明部中的至少一者發出與第1照明部所照射的照明光顏色相同的照明光。此處所謂的顏色相同的照明光,並非解釋為波長完全一致的限定性的涵義,也可以是類似的顏色。而且,第1照明部所照射的照明光的顏色優選的是設為缺陷與背景的差異增大的顏色。此外,第1方向是使由第1照明部照射至檢查對象物的照明光、經檢查對象物反射的正反射光的光軸與相機的光軸相吻合的方向。In addition, at least one of the second lighting unit and the third lighting unit emits lighting light having the same color as the lighting light irradiated by the first lighting unit. The so-called illuminating light with the same color here is not to be interpreted as a limiting meaning with completely identical wavelengths, but may also be similar colors. The color of the illuminating light irradiated by the first illuminating unit is preferably a color in which the difference between the defect and the background increases. The first direction is a direction in which the optical axis of the illuminating light irradiated to the inspection target by the first illumination section and the specular reflection light reflected by the inspection target coincide with the optical axis of the camera.

再者,此處所謂的使經檢查對象物反射的正反射光的光軸與相機的光軸相吻合,並非解釋為使所述正反射光的光軸與相機的光軸相一致的限定性的涵義,而是解釋為這些光軸所成的角度比較小(例如未達10°)的涵義。Furthermore, the so-called optical axis of the specularly reflected light reflected by the inspected object coincides with the optical axis of the camera, which is not to be construed as limiting the optical axis of the specularly reflected light to the optical axis of the camera The meaning of is interpreted as the meaning that the angle formed by these optical axes is relatively small (for example, less than 10 °).

相機利用各像素來接收由第1照明部照射的照明光、經檢查對象物反射的正反射光,以及由第2照明部及第3照明部照射的照明光、經檢查對象物反射的漫反射光。The camera uses each pixel to receive the illumination light irradiated by the first illumination section, the regular reflection light reflected by the inspection object, the illumination light irradiated by the second illumination section and the third illumination section, and the diffuse reflection reflected by the inspection object. Light.

對於由第1照明部照射的照明光、在相機的各像素中接收到的正反射光是在所照射的照明光的顏色的正反射率越高的區域,光量越大。另一方面,對於由第2照明部及第3照明部照射的照明光、在相機的各像素中接收到的漫反射光是在所照射的照明光的顏色的正反射率越高的區域,光量越小。因此,即使檢查對象物是存在光澤不均的物品,通過調整第1照明部所照射的照明光的光量、以及第2照明部或第3照明部所照射的照明光的光量,也可以針對第1照明部所照射的顏色的照明光,使在相機的各像素中接收到的光量大致均勻,所述第2照明部是照射與第1照明部顏色相同的照明光。即,即使檢查對象物是存在光澤不均的物品,也可以利用相機對已消除檢查對象物的光澤不均的影像進行拍攝。並且,即使檢查對象物是不存在光澤不均的物品,也可以利用相機來拍攝與檢查對象物的光澤相對應的影像。Regarding the illuminating light irradiated by the first illuminating section and the regular reflection light received in each pixel of the camera is a region where the regular reflectance of the color of the illuminating light is higher, the light amount is larger. On the other hand, for the illumination light irradiated by the second illumination section and the third illumination section, and the diffuse reflection light received in each pixel of the camera is an area where the regular reflectance of the color of the illumination light is higher, The smaller the amount of light. Therefore, even if the inspection object is an article with uneven glossiness, the light amount of the illumination light irradiated by the first illumination section and the light amount of the illumination light irradiated by the second illumination section or the third illumination section can be adjusted for the first The illuminating light of the color irradiated by the first illuminating portion makes the amount of light received by each pixel of the camera approximately uniform, and the second illuminating portion irradiates the illuminating light of the same color as the first illuminating portion. That is, even if the inspection object is an article with uneven glossiness, an image from which the unevenness of glossiness of the inspection object is removed can be captured by a camera. In addition, even if the inspection object is an article without uneven glossiness, an image corresponding to the glossiness of the inspection object can be captured by a camera.

並且,關於產生有異物附著等色彩缺陷的地方、或產生有存在瑕疵或凹痕的凹凸缺陷的地方,在所對應的像素中接收到的反射光的光量減少。因此,在相機所拍攝的影像中,適當地拍攝了產生有色彩缺陷及凹凸缺陷的地方。In addition, with respect to a place where a color defect such as foreign matter adhesion occurs, or a place where a concavo-convex defect having a flaw or a dent occurs, the amount of reflected light received by the corresponding pixel is reduced. Therefore, in the image captured by the camera, the place where the color defect and the bump defect are generated is appropriately captured.

因此,相機所拍攝的影像成為檢查對象物的光澤不均消失,而拍攝到異物附著的色彩缺陷、或因瑕疵或凹痕引起的凹凸缺陷的影像。因此,不論檢查對象物是存在光澤不均的物品,還是不存在光澤不均的物品,都可以適當地進行色彩缺陷或凹凸缺陷的檢查。Therefore, the image captured by the camera disappears as the gloss unevenness of the inspection object disappears, and an image of a color defect adhering to a foreign object or a bump defect caused by a flaw or a dent is captured. Therefore, regardless of whether the object to be inspected is an article with uneven gloss or an article without uneven gloss, the inspection of color defects or irregularities can be performed appropriately.

並且,也可以使第2照明部發出與第1照明部所照射的照明光顏色相同的照明光,並且使第3照明部發出與第1照明部所照射的照明光顏色不同的照明光。In addition, the second illumination unit may emit illumination light having the same color as the illumination light emitted by the first illumination unit, and the third illumination unit may emit illumination light of a different color from that of the first illumination unit.

對於由第3照明部所照射的照明光、在產生有凹凸缺陷的地方所對應的像素中接收到的反射光的光量,和在未產生凹凸缺陷的地方所對應的像素中接收到的反射光的光量不同。因此,通過對相機所拍攝的影像、即第3照明部所照射的顏色的色彩影像進行處理,可以將檢查對象物的色彩缺陷與凹凸缺陷加以區別地檢測出來。The amount of reflected light received by the illumination light irradiated by the third illuminating unit in the pixel corresponding to the place where the bump defect is generated, and the reflected light received in the pixel corresponding to the place where the bump defect is not generated. The amount of light is different. Therefore, by processing the image captured by the camera, that is, the color image of the color irradiated by the third illumination section, it is possible to detect the color defect and the unevenness defect of the inspection object distinguishably.

並且,第3照明部所照射的照明光因為所產生的凹凸缺陷的傾斜而產生正反射。因此,通過使第1方向與第2方向所成的角度大於第1方向與第3方向所成的角度(換而言之,使第1方向與第3方向所成的角度小於第1方向與第2方向所成的角度),可以使第3照明部所照射的照明光、即在產生有凹凸缺陷的地方所對應的像素中接收到的反射光的光量,大於在產生有色彩缺陷的地方所對應的像素中接收到的反射光的光量。In addition, the illuminating light irradiated by the third illuminating unit is specularly reflected due to the inclination of the generated unevenness defect. Therefore, by making the angle between the first direction and the second direction larger than the angle between the first direction and the third direction (in other words, making the angle between the first direction and the third direction smaller than the angle between the first direction and the third direction) The angle formed by the second direction) can make the amount of illumination light irradiated by the third illuminating part, that is, the amount of reflected light received in the pixel corresponding to the place where the bump defect is generated, greater than the place where the color defect is generated The amount of reflected light received in the corresponding pixel.

此外,第1方向是設為與相機的光軸相吻合的方向,也可以將第1照明部的照明光設為所謂同軸落射照明。The first direction is a direction that coincides with the optical axis of the camera, and the illumination light of the first illuminating unit may be a so-called coaxial epi-illumination.

再者,此處所謂的使第1方向與相機的光軸相吻合,並非解釋為使第1方向與相機的光軸相一致的限定性的涵義,而是解釋為使第1方向與相機的光軸所成的角度比較小(例如未達10°)的涵義。Moreover, the so-called matching of the first direction with the optical axis of the camera is not to be interpreted as a limiting meaning to make the first direction coincide with the optical axis of the camera, but is to be interpreted as making the first direction coincide with the camera's optical axis. The meaning that the angle formed by the optical axis is relatively small (for example, less than 10 °).

並且,本發明的缺陷檢查裝置包括所述照明單元、相機及影像處理單元。影像處理單元對相機所拍攝的影像進行處理,而對檢查對象物中所產生的缺陷進行檢測。The defect inspection device of the present invention includes the illumination unit, a camera, and an image processing unit. The image processing unit processes the image captured by the camera and detects defects generated in the inspection object.

如上所述,如果是所述缺陷檢查裝置,則相機所拍攝到的影像成為檢查對象物的光澤不均消失,而拍攝到異物附著的色彩缺陷、或因瑕疵或凹痕引起的凹凸缺陷的影像。As described above, if it is the defect inspection device, the image captured by the camera disappears as the gloss unevenness of the inspection object disappears, and an image of a color defect adhering to a foreign object or an uneven defect caused by a flaw or a dent is captured. .

並且,本發明的缺陷檢查裝置包括:前述的照明單元,第2照明部及第3照明部所照射的照明光的顏色不同;相機;以及影像處理單元。影像處理單元針對相機所拍攝的影像,生成與第1照明部所照射的照明光的顏色相對應的色彩的第1色彩影像、以及與第3照明部所照射的照明光的顏色相對應的色彩的第2色彩影像,並通過第1色彩影像及第2色彩影像,而檢測出檢查對象物中所產生的缺陷。In addition, the defect inspection device of the present invention includes the aforementioned illumination unit, the colors of the illumination light irradiated by the second illumination unit and the third illumination unit are different, a camera, and an image processing unit. The image processing unit generates a first color image of a color corresponding to the color of the illumination light irradiated by the first illumination unit and a color corresponding to the color of the illumination light irradiated by the third illumination unit with respect to the image captured by the camera. The second color image is detected by the first color image and the second color image.

如上所述,如果是所述缺陷檢查裝置,則檢查對象物的光澤不均會消失,可以利用各不相同的反射光的顏色將異物附著的色彩缺陷與因瑕疵或凹痕引起的凹凸缺陷加以區別地檢測出來。 [發明的效果]As described above, if the defect inspection device is used, the uneven glossiness of the inspection object will disappear, and the color defect of the foreign matter adhesion and the uneven defect caused by the defect or dent can be added by using different colors of reflected light. Differentially detected. [Effect of the invention]

根據本發明,即使檢查對象物是存在光澤不均的物品,也可以適當地進行色彩缺陷或凹凸缺陷的檢查。According to the present invention, even if the object to be inspected is an article having uneven glossiness, inspection of color defects or irregularities can be performed appropriately.

以下,對作為本發明的實施方式的缺陷檢查裝置進行說明。Hereinafter, a defect inspection device as an embodiment of the present invention will be described.

圖1是表示缺陷檢查裝置的主要部分的構成的框圖。圖2(A)是缺陷檢查裝置的俯視概略圖,圖2(B)是缺陷檢查裝置的前視概略圖。缺陷檢查裝置1包括控制單元2、照明單元3、影像處理單元4、檢查對象物搬運單元5、顯示單元6及操作單元7。所述缺陷檢查裝置1所檢查的檢查對象物既可以是存在光澤不均的物品,也可以是不存在光澤不均的物品。FIG. 1 is a block diagram showing a configuration of a main part of a defect inspection device. FIG. 2 (A) is a schematic plan view of the defect inspection device, and FIG. 2 (B) is a schematic front view of the defect inspection device. The defect inspection device 1 includes a control unit 2, an illumination unit 3, an image processing unit 4, an inspection object conveying unit 5, a display unit 6, and an operation unit 7. The inspection object to be inspected by the defect inspection device 1 may be an article with uneven gloss or an article without uneven gloss.

控制單元2對構成缺陷檢查裝置1本體的各單元進行控制。The control unit 2 controls each unit constituting the body of the defect inspection apparatus 1.

照明單元3對安置在檢查位置上的檢查對象物照射照明光。照明單元3按照控制單元2的指示,對照射至檢查對象物的照明光的顏色或光量進行控制。關於所述照明單元3的詳細情況,將在後文描述。The illuminating unit 3 irradiates the inspection object placed at the inspection position with illumination light. The illuminating unit 3 controls the color or light amount of the illuminating light irradiated to the inspection object in accordance with an instruction from the control unit 2. The details of the lighting unit 3 will be described later.

在影像處理單元4上,連接著相機10。相機10包含將n×m個受光元件呈矩陣狀排列的拍攝元件,可以對彩色影像進行拍攝。拍攝元件的各受光元件是像素。相機10是以使安置檢查對象物的檢查位置處於拍攝區內的方式而安裝。影像處理單元4對相機10所拍攝的檢查對象物的影像進行處理,而對所述檢查對象物中所產生的缺陷進行檢測。影像處理單元4所檢測的缺陷是色彩缺陷及凹凸缺陷。色彩缺陷是在檢查對象物的製造工序時或製造工序後,因異物或污垢附著等而產生的缺陷。凹凸缺陷是檢查對象物的製造工序時的成型不良、或製造工序後碰撞至某物等而產生的瑕疵或凹痕。缺陷檢查裝置1將影像處理單元4未檢測出缺陷的檢查對象物作為合格品,將影像處理單元4檢測出缺陷的檢查對象物作為不合格品。A camera 10 is connected to the image processing unit 4. The camera 10 includes imaging elements in which n × m light-receiving elements are arranged in a matrix, and can capture color images. Each light receiving element of the imaging element is a pixel. The camera 10 is mounted so that the inspection position where the inspection object is placed is within the imaging area. The image processing unit 4 processes an image of an inspection object captured by the camera 10 and detects a defect generated in the inspection object. The defects detected by the image processing unit 4 are color defects and uneven defects. A color defect is a defect caused by foreign matter, dirt, or the like during or after the manufacturing process of an inspection target. Concavo-convex defects are defects or dents caused by defective molding during the manufacturing process of an inspection target, or collision with an object after the manufacturing process. The defect inspection device 1 uses an inspection object in which a defect is not detected by the image processing unit 4 as a defective product, and an inspection object in which a defect is detected by the image processing unit 4 is a defective product.

再者,相機10只要具有拍攝物件物的構成及輸出所拍攝的物件物的彩色影像的構成即可。例如,相機10也可以是單色相機(monochrome camera),對針對紅色(red,R)、綠色(green,G)、藍色(blue,B)每種成分而拍攝的影像進行合成,並加以輸出。The camera 10 only needs to have a configuration for capturing an object and a configuration for outputting a color image of the captured object. For example, the camera 10 may be a monochrome camera, which synthesizes and captures images captured for each component of red (R, R), green (G, G), and blue (B). Output.

檢查對象物搬運單元5包括安置檢查對象物的工作臺51。所述工作臺51是在如下兩個位置之間,即,從缺陷檢查裝置1本體的框體突出的位置(圖2(A)及圖2(B)所示的位置)與收納於缺陷檢查裝置1本體的框體內部的位置之間移動自如地安裝。工作臺51具有如下構成:通過未圖示的伺服馬達,而在兩個位置之間移動。檢查對象物搬運單元5按照來自控制單元2的指示,對所述伺服馬達進行控制。並且,工作臺51具備通過真空吸附而保持所載置的檢查對象物的構成(未圖示)。檢查對象物搬運單元5按照來自控制單元2的指示,對載置於工作臺51上的檢查對象物進行真空吸附。當工作臺51處於收納於缺陷檢查裝置1本體的框體內部的位置時,載置於所述工作臺51上的檢查對象物位於檢查位置。The inspection target conveyance unit 5 includes a table 51 on which inspection objects are placed. The table 51 is located between the two positions, that is, the position protruding from the frame of the main body of the defect inspection device 1 (the position shown in FIGS. 2 (A) and 2 (B)) and being accommodated in the defect inspection The positions inside the housing of the apparatus 1 main body are freely mounted. The table 51 has a structure configured to move between two positions by a servo motor (not shown). The inspection object conveying unit 5 controls the servo motor in accordance with an instruction from the control unit 2. In addition, the table 51 has a configuration (not shown) that holds the inspection target placed thereon by vacuum suction. The inspection target conveyance unit 5 vacuum-absorbs the inspection target placed on the table 51 in accordance with an instruction from the control unit 2. When the table 51 is located inside the housing of the main body of the defect inspection apparatus 1, the inspection object placed on the table 51 is located at the inspection position.

顯示單元6對設置於缺陷檢查裝置1本體正面的兩個顯示器61、顯示器62中的畫面顯示進行控制。顯示器61顯示檢查對象物的檢查的操作順序等的引導畫面。顯示器62顯示檢查對象物的檢查結果等的確認畫面。兩個顯示器61、顯示器62也可以由一個顯示器61構成。The display unit 6 controls screen display on the two displays 61 and 62 provided on the front of the main body of the defect inspection apparatus 1. The display 61 displays a guidance screen such as an operation procedure of the inspection of the inspection target. The display 62 displays a confirmation screen such as an inspection result of the inspection object. The two displays 61 and 62 may be constituted by one display 61.

操作單元7接受操作員(operator)對缺陷檢查裝置1本體的操作。操作單元7包含貼附於顯示器61、顯示器62的畫面上的觸控式螢幕71、觸控式螢幕72等輸入器件。The operation unit 7 accepts an operation of the body of the defect inspection apparatus 1 by an operator. The operation unit 7 includes input devices such as a touch screen 71 and a touch screen 72 attached to the screens of the display 61 and the display 62.

其次,對照明單元3進行詳細說明。照明單元3具有覆蓋檢查位置的形狀。圖3是相機的光軸方向上的照明單元的剖面圖。圖4是沿圖3所示的箭頭A方向觀察的照明單元的平面圖。在照明單元3上,安裝有相機10。相機10安裝在對位於檢查位置的檢查對象物從上方進行拍攝的方向上。即,相機10是以拍攝元件與位於檢查位置的檢查對象物的檢查面相對向的方式而安裝。相機10所拍攝的面是檢查對象物的檢查面。照明單元3包含配置在相機10與檢查位置之間的半反射鏡31。相機10穿過半反射鏡31,對位於檢查位置的檢查對象物進行拍攝。Next, the lighting unit 3 will be described in detail. The lighting unit 3 has a shape covering an inspection position. 3 is a cross-sectional view of a lighting unit in a direction of an optical axis of a camera. FIG. 4 is a plan view of the lighting unit viewed in a direction of an arrow A shown in FIG. 3. A camera 10 is mounted on the lighting unit 3. The camera 10 is mounted in a direction in which an inspection object located at an inspection position is photographed from above. That is, the camera 10 is mounted so that the imaging element faces the inspection surface of the inspection target located at the inspection position. The surface captured by the camera 10 is an inspection surface of an inspection target. The lighting unit 3 includes a half mirror 31 disposed between the camera 10 and the inspection position. The camera 10 passes through the half-mirror 31 and captures an inspection object at the inspection position.

並且,照明單元3包括將照明光照射至位於檢查位置的檢查對象物的第1照明部32、第2照明部33、第3照明部34及第4照明部35。In addition, the lighting unit 3 includes a first lighting unit 32, a second lighting unit 33, a third lighting unit 34, and a fourth lighting unit 35 that irradiate the illumination light to the inspection object located at the inspection position.

第1照明部32配置在第1照明室32A內,所述第1照明室32A設置於與半反射鏡31大致相同的高度。此處所謂的高度方向是相機10的光軸方向。第1照明部32將發光顏色為紅色的紅色發光二極體(light-emitting diode,LED)32R、發光顏色為綠色的綠色LED32G及發光顏色為藍色的藍色LED32B作為一組發光元件群,而具有一組以上的前述的發光元件群。紅色LED32R、綠色LED32G、藍色LED32B是使發光面朝向半反射鏡31而安裝。通過使紅色LED32R、綠色LED32G、藍色LED32B中的至少一者發光而照射的光是第1照明部32的照明光。第1照明部32的照明光是通過半反射鏡31,而從與相機10的光軸相吻合的方向(相當於本發明中所謂的第1方向),照射至位於檢查位置的檢查對象物。即,第1照明部32的照明光是同軸落射照明,沿在相機10的各像素中接收經檢查對象物反射的正反射光的方向照射。The first lighting unit 32 is arranged in the first lighting room 32A, and the first lighting room 32A is provided at substantially the same height as the half mirror 31. The height direction referred to here is the optical axis direction of the camera 10. The first lighting unit 32 includes a red light-emitting diode (LED) 32R having a red emission color, a green LED 32G having a green emission color, and a blue LED 32B having a blue emission color as a group of light emitting element groups. It has one or more of the aforementioned light-emitting element groups. The red LED 32R, the green LED 32G, and the blue LED 32B are mounted with the light emitting surface facing the half mirror 31. The light irradiated by causing at least one of the red LED 32R, the green LED 32G, and the blue LED 32B to emit light is the illumination light of the first illumination unit 32. The illuminating light from the first illuminating unit 32 passes through the half mirror 31 and irradiates the inspection object located at the inspection position from a direction (corresponding to the first direction in the present invention) that coincides with the optical axis of the camera 10. That is, the illuminating light of the first illuminating unit 32 is coaxial epi-illumination, and is irradiated in a direction in which each pixel of the camera 10 receives regular reflection light reflected by the inspection object.

再者,本發明中所謂的第1方向是照射至位於檢查位置的檢查對象物的照明光的方向,並非對第1照明部32的紅色LED32R、綠色LED32G、藍色LED32B的發光面的方向進行規定。並且,所謂使由第1照明部32照射至位於檢查位置的檢查對象物的照明光的方向與相機10的光軸相吻合,並非限定性地解釋為所述方向與相機10的光軸相一致,而是解釋為如下涵義:所述方向與相機10的光軸所成的角度除了檢查對象物的面積以外,根據相機10的透鏡特性而為適當的比較小的角度(例如未達10°)。In the present invention, the first direction is a direction of illuminating light that is irradiated to the inspection object located at the inspection position, and is not the direction of the light emitting surfaces of the red LED 32R, green LED 32G, and blue LED 32B of the first illumination section 32. Regulations. In addition, the direction of the illumination light irradiated by the first illumination unit 32 to the inspection object located at the inspection position coincides with the optical axis of the camera 10, and it is not limited to interpret the direction to coincide with the optical axis of the camera 10 Instead, it is interpreted as the meaning that the angle formed by the direction and the optical axis of the camera 10 is an appropriate smaller angle (for example, less than 10 °) according to the lens characteristics of the camera 10 in addition to the area of the inspection object. .

照明單元3按照來自控制單元2的指示,分別針對第1照明部32所含的紅色LED32R、綠色LED32G及藍色LED32B,對發光進行控制,並且對發光光量進行控制。The lighting unit 3 controls the light emission of the red LED 32R, the green LED 32G, and the blue LED 32B included in the first lighting unit 32 according to an instruction from the control unit 2 and controls the amount of light emitted.

並且,第2照明部33配置在第2照明室33A,第3照明部34配置在第3照明室34A,第4照明部35配置在第4照明室35A。第2照明室33A、第3照明室34A及第4照明室35A是從以相機10的光軸為中心的圓的外周側,依此順序設置。如圖3及圖4所示,第2照明室33A、第3照明室34A及第4照明室35A是以相機10的光軸為中心的環形空間。The second lighting unit 33 is arranged in the second lighting room 33A, the third lighting unit 34 is arranged in the third lighting room 34A, and the fourth lighting unit 35 is arranged in the fourth lighting room 35A. The second lighting room 33A, the third lighting room 34A, and the fourth lighting room 35A are provided in this order from the outer peripheral side of a circle centered on the optical axis of the camera 10. As shown in FIGS. 3 and 4, the second lighting room 33A, the third lighting room 34A, and the fourth lighting room 35A are annular spaces centered on the optical axis of the camera 10.

第2照明部33將發光顏色為紅色的紅色LED33R、發光顏色為綠色的綠色LED33G及發光顏色為藍色的藍色LED33B作為一組發光元件群,而具有多組前述的發光元件群。第2照明部33將多組發光元件群呈環狀配置在第2照明室33A內。紅色LED33R、綠色LED33G及藍色LED33B是朝向下側(檢查位置側)安裝發光面。The second lighting unit 33 includes a plurality of groups of the aforementioned light-emitting element groups, including a red LED 33R having a light emission color of red, a green LED 33G having a light emission color of green, and a blue LED 33B having a light emission color of blue as a group of light-emitting element groups. The second lighting unit 33 arranges a plurality of groups of light emitting element groups in a ring shape in the second lighting room 33A. The red LEDs 33R, the green LEDs 33G, and the blue LEDs 33B are mounted with the light emitting surfaces facing downward (inspection position side).

並且,第3照明部34將發光顏色為紅色的紅色LED34R、發光顏色為綠色的綠色LED34G及發光顏色為藍色的藍色LED34B作為一組發光元件群,而具有多組前述的發光元件群。第3照明部34將多組發光元件群呈環狀配置在第3照明室34A內。紅色LED34R、綠色LED34G及藍色LED34B是朝向下側(檢查位置側)安裝發光面。In addition, the third lighting unit 34 includes a plurality of groups of the aforementioned light-emitting element groups, including a red LED 34R having a light emitting color of red, a green LED 34G having a light emitting color of green, and a blue LED 34B having a light emitting color of blue as a group of light emitting element groups. The third lighting unit 34 arranges a plurality of sets of light emitting element groups in a ring shape in the third lighting room 34A. The red LEDs 34R, the green LEDs 34G, and the blue LEDs 34B are mounted with the light emitting surfaces facing downward (inspection position side).

並且,第4照明部35將發光顏色為紅色的紅色LED35R、發光顏色為綠色的綠色LED35G及發光顏色為藍色的藍色LED35B作為一組發光元件群,而具有多組前述的發光元件群。第4照明部35將多組發光元件群呈環狀配置在第4照明室35A內。紅色LED35R、綠色LED35G及藍色LED35B是朝向下側(檢查位置側)安裝發光面。The fourth lighting unit 35 includes a plurality of groups of the aforementioned light-emitting element groups, including a red LED 35R having a light emission color of red, a green LED 35G having a light emission color of green, and a blue LED 35B having a light emission color of blue as a group of light-emitting element groups. The fourth lighting section 35 arranges a plurality of groups of light emitting element groups in a ring shape in the fourth lighting room 35A. The red LED35R, the green LED35G, and the blue LED35B are mounted with the light emitting surfaces facing downward (inspection position side).

並且,在第2照明室33A與第3照明室34A之間,設置有遮光板36,以防止第2照明部33的照明光入射至第3照明室34A,並且防止第3照明部34的照明光入射至第2照明室33A。而且,在第3照明室34A與第4照明室35A之間,設置有遮光板37,以防止第3照明部34的照明光入射至第4照明室35A,並且防止第4照明部35的照明光入射至第3照明室34A。A light shielding plate 36 is provided between the second lighting room 33A and the third lighting room 34A to prevent the illumination light of the second lighting portion 33 from entering the third lighting room 34A and to prevent the lighting of the third lighting portion 34 The light is incident on the second lighting room 33A. A light shielding plate 37 is provided between the third lighting room 34A and the fourth lighting room 35A to prevent the illumination light of the third lighting portion 34 from entering the fourth lighting room 35A and to prevent the lighting of the fourth lighting portion 35 The light is incident on the third lighting room 34A.

通過使紅色LED33R、綠色LED33G、藍色LED33B中的至少一者發光而照射的光是第2照明部33的照明光。照明單元3按照來自控制單元2的指示,分別針對第2照明部33所含的紅色LED33R、綠色LED33G及藍色LED33B,對發光進行控制,並且對發光光量進行控制。The light irradiated by causing at least one of the red LED 33R, the green LED 33G, and the blue LED 33B to emit light is the illumination light of the second illumination unit 33. The lighting unit 3 controls the light emission of the red LED 33R, the green LED 33G, and the blue LED 33B included in the second lighting unit 33 according to an instruction from the control unit 2 and controls the amount of light emitted.

並且,通過使紅色LED34R、綠色LED34G、藍色LED34B中的至少一者發光而照射的光是第3照明部34的照明光。照明單元3按照來自控制單元2的指示,分別針對第3照明部34所含的紅色LED34R、綠色LED34G及藍色LED34B,對發光進行控制,並且對發光光量進行控制。The light irradiated by causing at least one of the red LED 34R, the green LED 34G, and the blue LED 34B to emit light is the illumination light of the third illumination unit 34. The lighting unit 3 controls the light emission of the red LED 34R, the green LED 34G, and the blue LED 34B included in the third lighting unit 34 according to an instruction from the control unit 2 and controls the amount of light emitted.

並且,通過使紅色LED35R、綠色LED35G、藍色LED35B中的至少一者發光而照射的光是第4照明部35的照明光。照明單元3按照來自控制單元2的指示,分別針對第4照明部35所含的紅色LED35R、綠色LED35G及藍色LED35B,對發光進行控制,並且對發光光量進行控制。The light irradiated by emitting at least one of the red LED 35R, the green LED 35G, and the blue LED 35B is the illumination light of the fourth illumination unit 35. The lighting unit 3 controls the light emission of the red LED 35R, the green LED 35G, and the blue LED 35B included in the fourth lighting unit 35 according to an instruction from the control unit 2 and controls the amount of light emitted.

在第2照明室33A內,安裝有與紅色LED33R、綠色LED33G及藍色LED33B的發光面相對向而配置的擴散板38。在第3照明室34A內,安裝有與紅色LED34R、綠色LED34G及藍色LED34B的發光面相對向而配置的擴散板39。在第4照明室35A內,安裝有與紅色LED35R、綠色LED35G及藍色LED35B的發光面相對向而配置的擴散板40。擴散板38是使第2照明部33的照明光朝向照射至檢查位置的方向傾斜而安裝。擴散板39是使第3照明部34的照明光朝向照射至檢查位置的方向傾斜而安裝。擴散板40是使第4照明部35的照明光朝向照射至檢查位置的方向傾斜而安裝。擴散板38、擴散板39、擴散板40的傾斜方向相同,但是擴散板38、擴散板39、擴散板40相對於相機10的光軸的傾斜角各不相同。In the second lighting room 33A, a diffuser plate 38 is mounted so as to face the light emitting surfaces of the red LED 33R, the green LED 33G, and the blue LED 33B. In the third lighting room 34A, a diffuser plate 39 is mounted to face the light emitting surfaces of the red LED 34R, the green LED 34G, and the blue LED 34B. In the fourth lighting room 35A, a diffuser plate 40 is mounted so as to face the light emitting surfaces of the red LED 35R, the green LED 35G, and the blue LED 35B. The diffuser plate 38 is attached by inclining the illuminating light of the second illuminating portion 33 in a direction to be irradiated to the inspection position. The diffuser plate 39 is attached by inclining the illumination light of the third illuminating portion 34 in a direction to be irradiated to the inspection position. The diffuser plate 40 is attached by inclining the illumination light of the fourth illuminating unit 35 in a direction to be irradiated to the inspection position. The inclination directions of the diffusion plate 38, the diffusion plate 39, and the diffusion plate 40 are the same, but the inclination angles of the diffusion plate 38, the diffusion plate 39, and the diffusion plate 40 with respect to the optical axis of the camera 10 are different.

使第2照明部33的紅色LED33R、綠色LED33G及藍色LED33B中的至少一個顏色的LED發光的光穿過擴散板38而照射至檢查位置。當使第2照明部33的紅色LED33R、綠色LED33G及藍色LED33B中的兩個以上的顏色的LED發光時,在第2照明室33A中加以混合,並穿過擴散板38而照射至檢查位置。使第3照明部34的紅色LED34R、綠色LED34G及藍色LED34B中的至少一者發光的光是穿過擴散板39而照射至檢查位置。當使第3照明部34的紅色LED34R、綠色LED34G及藍色LED34B中的兩個以上的顏色的LED發光時,在第3照明室34A中加以混合,並穿過擴散板39而照射至檢查位置。使第4照明部35的紅色LED35R、綠色LED35G及藍色LED35B中的至少一者發光的光是穿過擴散板40而照射至檢查位置。當使第4照明部35的紅色LED35R、綠色LED35G及藍色LED35B中的兩個以上的顏色的LED發光時,在第4照明室35A中加以混合,並穿過擴散板38而照射至檢查位置。如上所述,擴散板38、擴散板39、擴散板40相對於相機10的光軸的傾斜角各不相同,所以第2照明部33、第3照明部34及第4照明部35照射至位於檢查位置的檢查對象物的照明光的照射角度各不相同。The light emitted from at least one color LED of the red LED 33R, the green LED 33G, and the blue LED 33B of the second illumination section 33 passes through the diffuser plate 38 and is irradiated to the inspection position. When two or more color LEDs of the red LED 33R, the green LED 33G, and the blue LED 33B of the second lighting unit 33 are made to emit light, they are mixed in the second lighting room 33A and passed through the diffuser plate 38 to be irradiated to the inspection position. . The light that causes at least one of the red LED 34R, the green LED 34G, and the blue LED 34B of the third illumination section 34 to pass through the diffuser plate 39 is irradiated to the inspection position. When two or more color LEDs of the red LED 34R, the green LED 34G, and the blue LED 34B of the third lighting section 34 are made to emit light, they are mixed in the third lighting room 34A and passed through the diffuser plate 39 to irradiate the inspection position . The light that causes at least one of the red LED 35R, the green LED 35G, and the blue LED 35B of the fourth illumination section 35 to emit light passes through the diffusion plate 40 and is irradiated to the inspection position. When two or more color LEDs of the red LED 35R, the green LED 35G, and the blue LED 35B of the fourth lighting section 35 are made to emit light, they are mixed in the fourth lighting room 35A and passed through the diffuser plate 38 to irradiate the inspection position . As described above, since the inclination angles of the diffuser plate 38, the diffuser plate 39, and the diffuser plate 40 with respect to the optical axis of the camera 10 are different, the second illumination portion 33, the third illumination portion 34, and the fourth illumination portion 35 are radiated to The irradiation angle of the illumination light of the inspection object at the inspection position varies.

例如,將如下的照明光、即通過使第2照明部33的紅色LED33R、綠色LED33G及藍色LED33B中的至少一者發光而產生的照明光,從與相機10的光軸所成的角度為60°左右的方向(相當於本發明中所謂的第2方向)照射至位於檢查位置的檢查對象物。將如下的照明光、即通過使第3照明部34的紅色LED34R、綠色LED34G及藍色LED34B中的至少一者發光而產生的照明光,從與相機10的光軸所成的角度為37°左右的方向(相當於本發明中所謂的第3方向)照射至位於檢查位置的檢查對象物。將如下的照明光、即通過使第4照明部35的紅色LED35R、綠色LED35G及藍色LED35B中的至少一者發光而產生的照明光,從與相機10的光軸所成的角度為20°左右的方向照射至位於檢查位置的檢查對象物。For example, the illumination light generated by emitting at least one of the red LED 33R, the green LED 33G, and the blue LED 33B of the second illumination unit 33 from the angle formed with the optical axis of the camera 10 is A direction of approximately 60 ° (corresponding to the so-called second direction in the present invention) is irradiated to the inspection target located at the inspection position. The illumination light generated by illuminating at least one of the red LED 34R, the green LED 34G, and the blue LED 34B of the third illumination unit 34 from the angle formed with the optical axis of the camera 10 is 37 ° The left-right direction (corresponding to the so-called third direction in the present invention) is irradiated to the inspection target located at the inspection position. The illumination light generated by illuminating at least one of the red LED 35R, the green LED 35G, and the blue LED 35B of the fourth illumination unit 35 from the angle formed by the optical axis of the camera 10 is 20 ° The left and right directions are irradiated onto the inspection object located at the inspection position.

本發明中所謂的第2方向是照射至位於檢查位置的檢查對象物的照明光的方向,並非對第2照明部33的紅色LED33R、綠色LED33G、藍色LED33B的發光面的方向進行規定。並且,本發明中所謂的第3方向是照射至位於檢查位置的檢查對象物的照明光的方向,並非對第3照明部34的紅色LED34R、綠色LED34G、藍色LED34B的發光面的方向進行規定。In the present invention, the second direction is a direction of illuminating light that is irradiated to the inspection object located at the inspection position, and does not define the directions of the light emitting surfaces of the red LEDs 33R, green LEDs 33G, and blue LEDs 33B of the second illumination unit 33. In the present invention, the third direction is the direction of the illumination light which is irradiated to the inspection object located at the inspection position, and does not define the direction of the light emitting surfaces of the red LED 34R, the green LED 34G, and the blue LED 34B of the third illumination unit 34. .

並且,如從所述說明可知,第2照明部33照射照明光的方向與第1照明部32照射照明光的方向(相機10的光軸)所成的角度,大於第3照明部34照射照明光的方向與第1照明部32照射照明光的方向(相機10的光軸)所成的角度。並且,第3照明部34照射照明光的方向與第1照明部32照射照明光的方向(相機10的光軸)所成的角度,大於第4照明部35照射照明光的方向與第1照明部32照射照明光的方向(相機10的光軸)所成的角度。In addition, as can be understood from the above description, the angle formed by the direction in which the second illuminating portion 33 irradiates the illuminating light and the direction in which the first illuminating portion 32 irradiates the illuminating light (the optical axis of the camera 10) is larger than the third illuminating portion 34 illuminates The angle formed by the direction of the light and the direction (the optical axis of the camera 10) of the illumination light irradiated by the first illumination unit 32. In addition, the angle formed by the direction in which the third lighting unit 34 irradiates the illuminating light and the direction in which the first lighting unit 32 irradiates the illuminating light (the optical axis of the camera 10) is larger than the direction in which the fourth illuminating unit 35 irradiates the illuminating light and the first illumination. The angle formed by the direction in which the portion 32 irradiates the illumination light (the optical axis of the camera 10).

並且,在所述示例中,是將對位於檢查位置的檢查對象物從傾斜方向照射照明光的照明部設為第2照明部33、第3照明部34及第4照明部35三個,但是只要對檢查對象物從傾斜方向照射照明光的照明部為兩個以上,則無論幾個均可。Furthermore, in the example described above, the illumination unit that irradiates the illumination light from the oblique direction to the inspection object located at the inspection position is three illumination units 33, third illumination unit 34, and fourth illumination unit 35, but As long as there are two or more illuminating parts which irradiate the inspection object with illumination light from an oblique direction, any number may be used.

其次,對如下檢查對象物進行說明,所述檢查對象物是由所述示例的缺陷檢查裝置1進行是否產生有缺陷這一檢查。圖5是表示所述示例的檢查對象物即FPC原始基板的平面圖。如圖5所示,在FPC原始基板100上,形成有多個(圖5所示的示例中為10個)FPC基板101。從FPC原始基板100切割的FPC基板101是作為電子設備等的零件而使用。FPC原始基板100存在如下情況:形成有電路圖案(圖5中用影線表示的部分)的金屬薄膜的反射率因為製造工序上的原因而局部產生光澤不均。即,FPC原始基板100上的電路圖案表面可能是存在光澤不均的檢查對象物。Next, a description will be given of an inspection object that is inspected by the defect inspection apparatus 1 of the example to determine whether a defect has occurred. FIG. 5 is a plan view showing an FPC original substrate as an inspection object in the example. As shown in FIG. 5, a plurality of (10 in the example shown in FIG. 5) FPC substrates 101 are formed on the FPC original substrate 100. The FPC substrate 101 cut from the FPC original substrate 100 is used as a component of an electronic device or the like. In the FPC original substrate 100, the reflectance of the metal thin film on which a circuit pattern (a portion indicated by hatching in FIG. 5) is formed may cause uneven glossiness due to a manufacturing process. That is, the circuit pattern surface on the FPC original substrate 100 may be an inspection target having uneven gloss.

其次,在缺陷檢查裝置1中,對如下處理進行說明,即,檢查在形成於FPC原始基板100上的各FPC基板101中是否產生有缺陷。圖6是表示缺陷檢查裝置的運行的流程圖。Next, in the defect inspection apparatus 1, a process for inspecting whether or not a defect has occurred in each FPC substrate 101 formed on the FPC original substrate 100 will be described. FIG. 6 is a flowchart showing the operation of the defect inspection device.

操作員按照顯示器61中所顯示的操作引導畫面,將作為檢查對象物的FPC原始基板100載置在位於本體外側的工作臺51上。在工作臺51上,形成有用於使FPC原始基板100的載置位置對準的突起等。缺陷檢查裝置1在操作單元7中,接受到缺陷檢查開始的操作員的操作時,將FPC原始基板100真空吸附於工作臺51上。並且,缺陷檢查裝置1使工作臺51移動至本體內部,將真空吸附著的FPC原始基板100安置在檢查位置上(s1)。The operator mounts the FPC original substrate 100 as an inspection target on the table 51 located outside the main body according to the operation guidance screen displayed on the display 61. The stage 51 is formed with a protrusion or the like for aligning the mounting position of the FPC original substrate 100. The defect inspection apparatus 1 vacuum-absorbs the FPC original substrate 100 on the table 51 when receiving an operation by an operator who starts the defect inspection in the operation unit 7. In addition, the defect inspection apparatus 1 moves the table 51 to the inside of the main body, and sets the FPC original substrate 100 vacuum-adsorbed at the inspection position (s1).

缺陷檢查裝置1利用照明單元3,對安置在檢查位置上的FPC原始基板100進行照明控制(s2)。在s2中,照明單元3針對第1照明部32及第2照明部33,使一個顏色或兩個顏色的LED發光,使剩下的LED不發光。並且,照明單元3針對第3照明部34及第4照明部35,使在第1照明部32及第2照明部33中不發光的一個顏色或兩個顏色的LED發光,使剩下的LED不發光。The defect inspection apparatus 1 uses the illumination unit 3 to perform illumination control on the FPC original substrate 100 placed at the inspection position (s2). In s2, the lighting unit 3 emits one-color or two-color LEDs to the first lighting portion 32 and the second lighting portion 33, and causes the remaining LEDs to not emit light. In addition, the lighting unit 3 emits light of one color or two colors of the LEDs that do not emit light in the first lighting portion 32 and the second lighting portion 33 to the third lighting portion 34 and the fourth lighting portion 35, and causes the remaining LEDs to emit light. Does not glow.

在第1照明部32及第2照明部33中發光的LED的顏色只要根據檢查對象物而確定即可。具體而言,在第1照明部32及第2照明部33中發光的LED只要設為對於檢查對象物(在所述示例中,FPC原始基板100上的電路圖案表面)的顏色,反射特性好的顏色即可。在第3照明部34及第4照明部35中發光的LED只要利用在第1照明部32及第2照明部33中不發光的發光元件、或者難以從檢查對象物產生漫反射的顏色來選擇即可。The colors of the LEDs that emit light in the first lighting section 32 and the second lighting section 33 may be determined based on the inspection target. Specifically, as long as the LEDs that emit light in the first lighting section 32 and the second lighting section 33 are set to the color of the inspection object (in the example, the circuit pattern surface on the FPC original substrate 100), the reflection characteristics are good. Color. The LED that emits light in the third lighting section 34 and the fourth lighting section 35 may be selected by using a light emitting element that does not emit light in the first lighting section 32 and the second lighting section 33 or a color that is difficult to cause diffuse reflection from the inspection object. Just fine.

在所述示例中,照明單元3對於第1照明部32及第2照明部33,使紅色LED32R、紅色LED33R及藍色LED32B、藍色LED33B發光,而使綠色LED32G、綠色LED33G不發光。並且,照明單元3對於第3照明部34及第4照明部35,使紅色LED34R、紅色LED35R及藍色LED34B、藍色LED35B不發光,而使綠色LED34G、綠色LED35G發光。並且,照明單元3在這時,分別針對第1照明部32、第2照明部33、第3照明部34及第4照明部35,控制所發光的LED的發光光量。In the example, the lighting unit 3 emits red LEDs 32R, red LEDs 33R, blue LEDs 32B, and blue LEDs 33B to the first lighting unit 32 and the second lighting unit 33, and does not emit green LED 32G and green LED 33G. Furthermore, the lighting unit 3 does not emit red LED 34R, red LED 35R, blue LED 34B, and blue LED 35B to the third lighting unit 34 and the fourth lighting unit 35, and emits green LED 34G and green LED 35G. In this case, the lighting unit 3 controls the amount of light emitted by the LEDs for the first lighting unit 32, the second lighting unit 33, the third lighting unit 34, and the fourth lighting unit 35, respectively.

並且,對於平緩傾斜的凹凸缺陷,當使用電路圖案的顏色的相反顏色時,可以提高訊號雜訊比(signal-noise ratio,S/N比)。In addition, for the gently inclined concave-convex defect, when the opposite color of the color of the circuit pattern is used, the signal-noise ratio (S / N ratio) can be improved.

再者,照明單元3按照來自控制單元2的指示,進行s2的照明控制。In addition, the lighting unit 3 performs lighting control of s2 in accordance with an instruction from the control unit 2.

缺陷檢查裝置1進行拍攝處理,利用相機10對FPC原始基板100進行拍攝,所述FPC原始基板100安置在檢查位置上,被照明單元3照射有照明光(s3)。The defect inspection device 1 performs a photographing process, and uses a camera 10 to photograph an FPC original substrate 100 which is placed at an inspection position and is illuminated with illumination light by the illumination unit 3 (s3).

缺陷檢查裝置1對相機10所拍攝的拍攝影像進行處理,利用與第1照明部32及第2照明部33所照射的照明光相對應的顏色(在所述示例中為品紅)的色彩影像(相當於本發明中所謂的第1色彩影像)、以及與第3照明部34及第4照明部35所照射的照明光相對應的顏色(在所述示例中為綠色)的色彩影像(相當於本發明中所謂的第2色彩影像)進行影像過濾處理(s4)。The defect inspection device 1 processes a captured image captured by the camera 10 and uses a color image of a color (in this example, magenta) corresponding to the illumination light irradiated by the first illumination section 32 and the second illumination section 33. (Equivalent to the so-called first color image in the present invention), and a color image (corresponding to a color (green in the example) corresponding to the illumination light irradiated by the third illumination portion 34 and the fourth illumination portion 35 (equivalent to the example) The so-called second color image in the present invention) is subjected to an image filtering process (s4).

在s3的拍攝處理中,關於第1照明部32照射至FPC原始基板100的照明光,在相機10的各像素中接收來自FPC原始基板100的正反射光。關於第2照明部33照射至FPC原始基板100的照明光,在相機10的各像素中接收來自FPC原始基板100的漫反射光。在相機10的各像素中接收到的正反射光在所照射的顏色的反射率越高的區域(光澤越高的區域),光量越大。另一方面,在相機10的各像素中接收到的漫反射光在所照射的顏色的反射率越高的區域,光量越小。因此,通過對第1照明部32及第2照明部33照射至檢查對象物的照明光的光量進行控制,可以使在相機10的各像素中接收到的第1照明部32及第2照明部33所照射的顏色的反射光的光量大致均勻,而不會受到檢查對象物的光澤不均的影響。In the imaging process of s3, the illumination light irradiated to the FPC original substrate 100 by the first illumination unit 32 receives the specularly reflected light from the FPC original substrate 100 in each pixel of the camera 10. Regarding the illumination light irradiated to the FPC original substrate 100 by the second illuminating unit 33, diffuse reflection light from the FPC original substrate 100 is received in each pixel of the camera 10. The area of the specularly-reflected light received by each pixel of the camera 10 in the region with the higher reflectance of the irradiated color (the region with higher gloss) has a larger amount of light. On the other hand, the diffused light received in each pixel of the camera 10 has a smaller amount of light in a region where the reflectance of the irradiated color is higher. Therefore, by controlling the light amount of the illumination light irradiated to the inspection object by the first illumination unit 32 and the second illumination unit 33, the first illumination unit 32 and the second illumination unit received at each pixel of the camera 10 can be made The light amount of the reflected light of the irradiated color 33 is substantially uniform without being affected by uneven glossiness of the inspection target.

再者,關於與產生有色彩缺陷或凹凸缺陷的地方相對應的像素,第1照明部32所照射的照明光的正反射光的光接收量會減少。In addition, with respect to pixels corresponding to a place where a color defect or a bump defect is generated, the light reception amount of the specular reflection light of the illumination light irradiated by the first illumination portion 32 is reduced.

並且,在s3的拍攝處理中,關於第3照明部34及第4照明部35照射至FPC原始基板100的照明光,是因為凹凸缺陷的傾斜而反射。因此,關於第3照明部34及第4照明部35照射至FPC原始基板100的顏色的照明光,在產生有凹凸缺陷的地方所對應的像素、與未產生凹凸缺陷的地方所對應的像素之間所接收到的反射光的光量會產生差異。In the imaging process of s3, the illumination light irradiated onto the FPC original substrate 100 by the third illumination unit 34 and the fourth illumination unit 35 is reflected by the inclination of the unevenness defect. Therefore, regarding the illumination light of the color irradiated to the FPC original substrate 100 by the third illumination portion 34 and the fourth illumination portion 35, the pixel corresponding to the place where the bump defect is generated and the pixel corresponding to the place where the bump defect is not generated. There will be a difference in the amount of reflected light received between the two.

因此,通過s4的影像過濾處理而生成的與第1照明部32及第2照明部33所照射的照明光相對應的顏色的色彩影像(品紅的色彩影像)是消除了檢查對象物的光澤不均的影像,並且是產生有缺陷的地方所對應的像素的光接收量小於未產生缺陷的地方所對應的像素的光接收量的影像。而且,通過s4的過濾處理而生成的與第3照明部34及第4照明部35所照射的照明光相對應的顏色的色彩影像(綠色的色彩影像)是產生有凹凸缺陷的地方所對應的像素的光接收量小於未產生凹凸缺陷的地方所對應的像素的光接收量的影像。Therefore, the color image (color image of magenta) of the color corresponding to the illumination light irradiated by the first illumination section 32 and the second illumination section 33 generated by the image filtering process of s4 eliminates the gloss of the inspection object. The uneven image is an image in which the light receiving amount of the pixel corresponding to the place where the defect is generated is smaller than the light receiving amount of the pixel corresponding to the place where the defect is not generated. In addition, the color image (green color image) of a color corresponding to the illumination light irradiated by the third illumination section 34 and the fourth illumination section 35 generated by the filtering process of s4 corresponds to the place where the bump defect is generated. An image in which the amount of light received by a pixel is smaller than the amount of light received by a pixel corresponding to a place where no bump defect is generated.

例如,如圖7(A)所示,當第1照明部32照射至FPC原始基板100上的電路圖案的照明光的顏色、與第2照明部33、第3照明部34及第4照明部35照射至FPC原始基板100上的電路圖案的照明光的顏色不同時,第1照明部32所照射的照明光的顏色的色彩影像如圖7(B)所示,成為被拍攝到光澤不均X、色彩缺陷Y及凹凸缺陷Z的影像。而且,在所述色彩影像中,無法對光澤不均X、色彩缺陷Y及凹凸缺陷Z進行區別。圖7(B)表示從FPC原始基板100的拍攝影像中提取的一個FPC基板101。For example, as shown in FIG. 7 (A), when the first illumination section 32 irradiates the color of the illumination light of the circuit pattern on the FPC original substrate 100, and the second illumination section 33, the third illumination section 34, and the fourth illumination section When the color of the illumination light irradiated to the circuit pattern on the FPC original substrate 100 is different, the color image of the color of the illumination light irradiated by the first illumination section 32 is as shown in FIG. 7 (B), and uneven gloss is captured. Images of X, color defect Y, and bump defect Z. In addition, in the color image, it is impossible to distinguish gloss unevenness X, color defects Y, and unevenness defects Z. FIG. 7 (B) shows one FPC substrate 101 extracted from a captured image of the FPC original substrate 100.

但是,所述示例的缺陷檢查裝置1中,由於第1照明部32及第2照明部33將相同顏色(品紅)的照明光照射至FPC原始基板100,第3照明部34及第4照明部35將與第1照明部32及第2照明部33不同的顏色(綠色)的照明光照射至FPC原始基板100(參照圖8(A)),所以第1照明部32及第2照明部33所照射的照明光的顏色的色彩影像如圖8(B)所示,成為被拍攝到色彩缺陷Y及凹凸缺陷Z的影像。即,所述品紅的色彩影像是未拍攝到光澤不均X的影像(消除了光澤不均的影像)。在圖8(A)中,為了使第1照明部32及第2照明部33所照射的照明光易懂,省略了第3照明部34及第4照明部35所照射的照明光的圖示。圖8(B)表示從FPC原始基板100的拍攝影像中提取的一個FPC基板101。However, in the defect inspection apparatus 1 of the above-mentioned example, since the first illumination section 32 and the second illumination section 33 irradiate the same color (magenta) illumination light to the FPC original substrate 100, the third illumination section 34 and the fourth illumination The unit 35 irradiates the FPC original substrate 100 (see FIG. 8 (A)) with illumination light of a different color (green) from the first illumination unit 32 and the second illumination unit 33. Therefore, the first illumination unit 32 and the second illumination unit As shown in FIG. 8 (B), a color image of the color of the irradiated illumination light is an image in which a color defect Y and a bump defect Z are captured. That is, the color image of the magenta is an image in which gloss unevenness X is not captured (an image in which gloss unevenness is eliminated). In FIG. 8 (A), in order to make the illumination light irradiated by the first illumination unit 32 and the second illumination unit 33 easier to understand, the illustration of the illumination light emitted by the third illumination unit 34 and the fourth illumination unit 35 is omitted. . FIG. 8 (B) shows one FPC substrate 101 extracted from a captured image of the FPC original substrate 100.

再者,在所述品紅的色彩影像中,無法對色彩缺陷Y與凹凸缺陷Z進行區別。Moreover, in the color image of the magenta, it is impossible to distinguish between the color defect Y and the unevenness defect Z.

並且,所述示例的缺陷檢查裝置1如上所述,由於第1照明部32及第2照明部33將相同顏色(品紅)的照明光照射至FPC原始基板100,第3照明部34及第4照明部35將與第1照明部32及第2照明部33不同的顏色(綠色)的照明光照射至FPC原始基板100(參照圖9(A)),所以第3照明部34及第4照明部35所照射的照明光的顏色的色彩影像(綠色的色彩影像)如圖9(B)所示,成為被拍攝到凹凸缺陷Z的影像。即,所述綠色的色彩影像是未拍攝到光澤不均X及色彩缺陷Y的影像。在圖9(A)中,為了使第3照明部34及第4照明部35所照射的照明光易懂,省略了第1照明部32及第2照明部33所照射的照明光的圖示。圖9(B)表示從FPC原始基板100的拍攝影像中提取的一個FPC基板101。In addition, as described above, the defect inspection apparatus 1 of the example described above irradiates the FPC original substrate 100 with the first illumination unit 32 and the second illumination unit 33 with the same color (magenta), and the third illumination unit 34 and the third illumination unit 34 The 4 illumination unit 35 irradiates the FPC original substrate 100 (see FIG. 9 (A)) with illumination light of a different color (green) from the first illumination unit 32 and the second illumination unit 33. Therefore, the third illumination unit 34 and the fourth illumination unit 35 As shown in FIG. 9 (B), a color image (green color image) of the color of the illuminating light irradiated by the illuminating unit 35 is an image where the unevenness defect Z is captured. That is, the green color image is an image in which gloss unevenness X and color defect Y are not captured. In FIG. 9 (A), in order to make the illumination light irradiated by the third illumination portion 34 and the fourth illumination portion 35 easier to understand, the illustration of the illumination light emitted by the first illumination portion 32 and the second illumination portion 33 is omitted. . FIG. 9 (B) shows one FPC substrate 101 extracted from a captured image of the FPC original substrate 100.

缺陷檢查裝置1在影像處理單元4中,對FPC原始基板100進行缺陷檢測處理(s5)。缺陷檢查裝置1在影像處理單元4中,對與第3照明部34及第4照明部35照射至FPC原始基板100的照明光的顏色相對應的綠色的拍攝部位進行影像處理(例如,利用顏色的二進位化),而檢測在FPC原始基板100上的電路圖案中是否產生有凹凸缺陷。並且,缺陷檢查裝置1在影像處理單元4中,對與第1照明部32及第2照明部33照射至FPC原始基板100的照明光的顏色相對應的品紅的色彩影像(圖8(B)所示的色彩影像)進行影像處理(例如,利用濃度的二進位化),而檢測在FPC原始基板100上的電路圖案中是否產生有缺陷。The defect inspection apparatus 1 performs defect detection processing on the FPC original substrate 100 in the image processing unit 4 (s5). In the image processing unit 4, the defect inspection device 1 performs image processing on a green imaging portion corresponding to the color of the illumination light irradiated to the FPC original substrate 100 by the third illumination unit 34 and the fourth illumination unit 35 (for example, using color Binarization), and it is detected whether there are irregularities in the circuit pattern on the FPC original substrate 100. In addition, the defect inspection device 1 in the image processing unit 4 applies a magenta color image corresponding to the color of the illumination light irradiated to the FPC original substrate 100 by the first illumination unit 32 and the second illumination unit 33 (FIG. 8 (B The color image shown in ()) is subjected to image processing (for example, using binary density) to detect whether a defect is generated in the circuit pattern on the FPC original substrate 100.

在第1照明部32及第2照明部33照射至FPC原始基板100的照明光的顏色的色彩影像中,如上所述無法將色彩缺陷與凹凸缺陷加以區別地檢測出來,但是通過第3照明部34及第4照明部35照射至FPC原始基板100的照明光的顏色的色彩影像,可以檢測出凹凸缺陷。因此,缺陷檢查裝置1可以將色彩缺陷與凹凸缺陷加以區別地檢測出來。In the color image of the color of the illumination light irradiated to the FPC original substrate 100 by the first illumination section 32 and the second illumination section 33, color defects and uneven defects cannot be detected as described above, but the third illumination section The color image of the color of the illuminating light irradiated to the FPC original substrate 100 by the 34 and the fourth illuminating unit 35 can detect unevenness defects. Therefore, the defect inspection apparatus 1 can detect a color defect and a bump defect differently.

缺陷檢查裝置1輸出影像處理單元4中的FPC原始基板100的檢查結果(s6),結束本處理。The defect inspection apparatus 1 outputs the inspection result of the FPC original substrate 100 in the image processing unit 4 (s6), and ends the present process.

再者,缺陷檢查裝置1在操作單元7中,接受到操作員的取出檢查對象物的操作時,使工作臺51移動至本體外側,而停止FPC原始基板100的真空吸附。In addition, when the defect inspection device 1 receives an operation for removing the inspection object by the operator in the operation unit 7, the table 51 is moved to the outside of the main body, and the vacuum adsorption of the FPC original substrate 100 is stopped.

並且,在所述示例中,是設為第2照明部33照射與第1照明部32顏色相同的照明光,但是也可以設為如下構成,即,第3照明部34或第4照明部35照射與第1照明部32顏色相同的照明光。In the above example, the second lighting unit 33 is configured to irradiate the same lighting light as the first lighting unit 32. However, the third lighting unit 34 or the fourth lighting unit 35 may be configured as follows. Illumination light having the same color as the first illumination portion 32 is irradiated.

而且,也可以設為如下構成:第1照明部32、第2照明部33、第3照明部34及第4照明部35全部照射相同顏色的照明光。但是,在這種情況下,如上所述,雖然可以拍攝已消除FPC原始基板100的光澤不均的影像,但是無法將凹凸缺陷與色彩缺陷加以區別地檢測出來。Further, the first lighting unit 32, the second lighting unit 33, the third lighting unit 34, and the fourth lighting unit 35 may be configured to irradiate lighting light of the same color. However, in this case, as described above, although an image in which gloss unevenness of the FPC original substrate 100 is eliminated can be captured, it is impossible to detect unevenness and color defects separately.

而且,即使檢查對象物是存在光澤不均的例如印刷基板、表面上描繪有花紋的物品(包含在花紋上形成有塗佈層的物品),所述缺陷檢查裝置1也可以適當地進行缺陷的檢查。並且,即使檢查對象物是不存在光澤不均的物品,缺陷檢查裝置1也可以適當地進行缺陷的檢查。Further, the defect inspection apparatus 1 can properly perform a defect even if the inspection object has uneven gloss such as a printed circuit board, or an article with a pattern drawn on the surface (including an article with a coating layer formed on the pattern). an examination. In addition, even if the inspection target is an article without uneven glossiness, the defect inspection device 1 can appropriately perform an inspection of the defect.

1‧‧‧缺陷檢查裝置1‧‧‧ Defect inspection device

2‧‧‧控制單元2‧‧‧control unit

3‧‧‧照明單元3‧‧‧lighting unit

4‧‧‧影像處理單元4‧‧‧Image processing unit

5‧‧‧檢查對象物搬運單元5‧‧‧ Inspection object handling unit

6‧‧‧顯示單元6‧‧‧display unit

7‧‧‧操作單元7‧‧‧operation unit

10‧‧‧相機10‧‧‧ Camera

31‧‧‧半反射鏡31‧‧‧ half mirror

32‧‧‧第1照明部32‧‧‧The first lighting department

32A‧‧‧第1照明室32A‧‧‧The first lighting room

32R、33R、34R、35R‧‧‧紅色LED32R, 33R, 34R, 35R‧‧‧ red LED

32G、33G、34G、35G‧‧‧綠色LED32G, 33G, 34G, 35G‧‧‧ green LED

32B、33B、34B、35B‧‧‧藍色LED32B, 33B, 34B, 35B‧‧‧ Blue LED

33‧‧‧第2照明部33‧‧‧The second lighting department

33A‧‧‧第2照明室33A‧‧‧The second lighting room

34‧‧‧第3照明部34‧‧‧The third lighting department

34A‧‧‧第3照明室34A‧‧‧The third lighting room

35‧‧‧第4照明部35‧‧‧The fourth lighting department

35A‧‧‧第4照明室35A‧‧‧The fourth lighting room

36、37‧‧‧遮光板36, 37‧‧‧ Shading plate

38、39、40‧‧‧擴散板38, 39, 40‧‧‧ diffuser

51‧‧‧工作臺51‧‧‧Workbench

61、62‧‧‧顯示器61, 62‧‧‧ Display

71、72‧‧‧觸控式螢幕71, 72‧‧‧ touch screen

100‧‧‧FPC原始基板100‧‧‧FPC original substrate

101‧‧‧FPC基板101‧‧‧FPC substrate

s1~s6‧‧‧步驟s1 ~ s6‧‧‧‧steps

X‧‧‧光澤不均X‧‧‧ uneven gloss

Y‧‧‧色彩缺陷Y‧‧‧ color defect

Z‧‧‧凹凸缺陷Z‧‧‧ Bump defect

A‧‧‧方向A‧‧‧ direction

圖1是表示缺陷檢查裝置的主要部分的構成的框圖。 圖2(A)及圖2(B)是表示缺陷檢查裝置的外觀的概略圖。 圖3是相機的光軸方向上的照明單元的剖面圖。 圖4是沿圖3所示的箭頭A方向觀察的照明單元的平面圖。 圖5是表示所述示例的檢查對象物即FPC原始基板的平面圖。 圖6是表示缺陷檢查裝置的運行的流程圖。 圖7(A)及圖7(B)是對通過過濾處理而生成的影像進行說明的圖。 圖8(A)及圖8(B)是對通過過濾處理而生成的影像進行說明的圖。 圖9(A)及圖9(B)是對通過過濾處理而生成的影像進行說明的圖。FIG. 1 is a block diagram showing a configuration of a main part of a defect inspection device. 2 (A) and 2 (B) are schematic diagrams showing the appearance of a defect inspection device. 3 is a cross-sectional view of a lighting unit in a direction of an optical axis of a camera. FIG. 4 is a plan view of the lighting unit viewed in a direction of an arrow A shown in FIG. 3. FIG. 5 is a plan view showing an FPC original substrate as an inspection object in the example. FIG. 6 is a flowchart showing the operation of the defect inspection device. FIG. 7 (A) and FIG. 7 (B) are diagrams explaining an image generated by a filtering process. 8 (A) and 8 (B) are diagrams explaining an image generated by a filtering process. 9 (A) and 9 (B) are diagrams explaining an image generated by the filtering process.

Claims (7)

一種照明單元,在利用相機對安置在檢查位置上的檢查對象物進行拍攝時,對所述檢查對象物照射照明光,所述照明單元包括: 第1照明部,從第1方向,發出照射至安置在所述檢查位置上的所述檢查對象物的照明光; 第2照明部,從與所述第1方向不同的第2方向,發出照射至安置在所述檢查位置上的所述檢查對象物的照明光;以及 第3照明部,從與所述第1方向及所述第2方向不同的第3方向,發出照射至安置在所述檢查位置上的所述檢查對象物的照明光;並且 所述第2照明部或所述第3照明部中的至少一者發出與所述第1照明部所照射的照明光顏色相同的照明光, 所述第1方向是使由所述第1照明部照射至所述檢查對象物的照明光、經所述檢查對象物反射的正反射光的光軸與所述相機的光軸相吻合的方向。An illumination unit irradiates illumination light on an inspection object when an inspection object placed at an inspection position is photographed by a camera, and the illumination unit includes: a first illumination unit that emits illumination from a first direction to Illumination light of the inspection object placed at the inspection position; the second illumination unit emits light from a second direction different from the first direction to the inspection object placed at the inspection position An illumination light from the object; and a third illumination unit emitting illumination light from the third direction different from the first direction and the second direction to the inspection object placed on the inspection position; In addition, at least one of the second lighting unit or the third lighting unit emits lighting light having the same color as the lighting light irradiated by the first lighting unit, and the first direction is such that the first The direction in which the optical axis of the illuminating light irradiated by the illuminating part to the inspection object and the specular reflection light reflected by the inspection object coincide with the optical axis of the camera. 如申請專利範圍第1項所述的照明單元,其中: 所述第2照明部發出與所述第1照明部所照射的照明光顏色相同的照明光, 所述第3照明部發出與所述第1照明部所照射的照明光顏色不同的照明光。The lighting unit according to item 1 of the scope of patent application, wherein: the second lighting unit emits lighting light having the same color as the lighting light irradiated by the first lighting unit, and the third lighting unit emits the light Illumination light having a different color from the first illumination unit. 如申請專利範圍第2項所述的照明單元,其中: 所述第1方向與所述第2方向所成的角度大於所述第1方向與所述第3方向所成的角度。The lighting unit according to item 2 of the scope of patent application, wherein: an angle formed by the first direction and the second direction is greater than an angle formed by the first direction and the third direction. 如申請專利範圍第1至3項中任一項所述的照明單元,其中: 所述第1方向是與所述相機的光軸相吻合的方向。The lighting unit according to any one of claims 1 to 3, wherein: the first direction is a direction that coincides with an optical axis of the camera. 一種缺陷檢查裝置,包括: 相機; 如申請專利範圍第1至4項中任一項所述的照明單元;以及 影像處理單元,對所述相機所拍攝的影像進行處理,而檢測所述檢查對象物中所產生的缺陷。A defect inspection device includes: a camera; the illumination unit according to any one of claims 1 to 4; and an image processing unit that processes an image captured by the camera to detect the inspection object Defects in objects. 一種缺陷檢查裝置,包括: 相機; 如申請專利範圍第2至4項中任一項所述的照明單元;以及 影像處理單元,對所述相機所拍攝的影像進行處理,而檢測所述檢查對象物中所產生的缺陷;並且 所述影像處理單元針對所述相機所拍攝的影像,生成與所述第1照明部所照射的照明光的顏色相對應的色彩的第1色彩影像、及與所述第3照明部所照射的照明光的顏色相對應的色彩的第2色彩影像,並通過所述第1色彩影像及所述第2色彩影像,而檢測所述檢查對象物中所產生的缺陷。A defect inspection device includes: a camera; the illumination unit according to any one of claims 2 to 4; and an image processing unit that processes an image captured by the camera to detect the inspection object The image processing unit generates a first color image of a color corresponding to the color of the illuminating light irradiated by the first lighting unit with respect to an image captured by the camera, and The second color image of the color corresponding to the color of the illuminating light irradiated by the third lighting unit is used to detect a defect generated in the inspection object through the first color image and the second color image. . 一種照明方法,在利用相機對安置在檢查位置上的檢查對象物進行拍攝時,對所述檢查對象物照射照明光,所述照明方法的特徵在於: 使第1照明部發光,從第1方向,對安置在所述檢查位置上的所述檢查對象物照射照明光, 使第2照明部發光,從與所述第1方向不同的第2方向,對安置在所述檢查位置上的所述檢查對象物照射照明光, 使第3照明部發光,從與所述第1方向及所述第2方向不同的第3方向,對安置在所述檢查位置上的所述檢查對象物照射照明光, 並且,所述第2照明部或所述第3照明部中的至少一者是利用與所述第1照明部所照射的照明光顏色相同的照明光來發光, 此外,所述第1方向設為如下的方向,即,使由所述第1照明部照射至所述檢查對象物的照明光、經所述檢查對象物反射的正反射光的光軸與所述相機的光軸相吻合。An illumination method for irradiating the inspection object with illumination light when shooting an inspection object placed at an inspection position with a camera. The illumination method is characterized in that a first illumination section is caused to emit light from a first direction. Irradiating the inspection object placed on the inspection position with illuminating light to make the second illumination part emit light, and from a second direction different from the first direction, the inspection object placed on the inspection position The inspection object irradiates illumination light to cause the third illumination section to emit light, and irradiates the inspection object placed on the inspection position from a third direction different from the first direction and the second direction. In addition, at least one of the second lighting unit or the third lighting unit emits light using illumination light having the same color as the illumination light irradiated by the first illumination unit, and the first direction It is assumed that the optical axis of the illumination light irradiated by the first illumination unit to the inspection object and the specular reflection light reflected by the inspection object coincide with the optical axis of the camera .
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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6969439B2 (en) 2018-02-23 2021-11-24 オムロン株式会社 Visual inspection device and lighting condition setting method for visual inspection device
JP7010057B2 (en) * 2018-02-26 2022-01-26 オムロン株式会社 Image processing system and setting method
JP6958444B2 (en) 2018-03-13 2021-11-02 オムロン株式会社 Controller and image processing system
JP7067148B2 (en) 2018-03-13 2022-05-16 オムロン株式会社 Lighting equipment and image processing system
CN109596625A (en) * 2019-02-01 2019-04-09 东莞中科蓝海智能视觉科技有限公司 Workpiece, defect detection recognition method in charging tray
CN109859192A (en) * 2019-02-01 2019-06-07 东莞中科蓝海智能视觉科技有限公司 The detection recognition method of round high reflective workpiece
CN111044521A (en) * 2019-12-13 2020-04-21 苏州通富超威半导体有限公司 Combined light source device and method for chip detection
CN116819857A (en) * 2023-08-22 2023-09-29 苏州默然光电科技有限公司 Lighting unit, visual detection system and method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005091049A (en) * 2003-09-12 2005-04-07 Ccs Inc Light irradiator for image processing and light irradiation method for image processing
JP2005274558A (en) * 2004-02-27 2005-10-06 Omron Corp Surface condition inspecting method, surface condition inspecting apparatus employing it, and substrate inspecting apparatus
JP2007240431A (en) * 2006-03-10 2007-09-20 Omron Corp Defect inspection device and defect inspection method
JP2009174857A (en) * 2008-01-21 2009-08-06 Omron Corp Illuminating device and defect inspection device using same
TWI491871B (en) * 2013-07-05 2015-07-11 Machvision Inc Illumination system for use in optical inspection, illumination system-based inspection system, and illumination system-based inspection method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11237210A (en) * 1998-02-19 1999-08-31 Komatsu Ltd Inspecting equipment of semiconductor package
CN1844901A (en) * 2005-04-08 2006-10-11 欧姆龙株式会社 Defect inspection method and defect inspection system using the method
JP4826750B2 (en) * 2005-04-08 2011-11-30 オムロン株式会社 Defect inspection method and defect inspection apparatus using the method
JP4809032B2 (en) * 2005-10-04 2011-11-02 ヤマハ発動機株式会社 Mounting board inspection device and printing device
US7567344B2 (en) * 2006-05-12 2009-07-28 Corning Incorporated Apparatus and method for characterizing defects in a transparent substrate
JP4389982B2 (en) * 2007-08-09 2009-12-24 オムロン株式会社 Substrate visual inspection device
KR101175595B1 (en) * 2011-09-26 2012-08-24 주식회사 미르기술 Apparatus and method for noncontact inspection for components
JP5927930B2 (en) * 2012-01-19 2016-06-01 株式会社リコー Information processing apparatus and program
JP5673621B2 (en) * 2012-07-18 2015-02-18 オムロン株式会社 Defect inspection method and defect inspection apparatus
JP2014035307A (en) * 2012-08-10 2014-02-24 Hitachi High-Technologies Corp Defect inspection device and defect inspection method
JP2014038045A (en) * 2012-08-17 2014-02-27 Sony Corp Inspection device, illumination, inspection method, program and substrate producing method
JP2014122863A (en) * 2012-12-21 2014-07-03 Murata Mfg Co Ltd Imaging device and imaging method
JP6220521B2 (en) * 2013-01-18 2017-10-25 株式会社ニューフレアテクノロジー Inspection device
JP5825278B2 (en) * 2013-02-21 2015-12-02 オムロン株式会社 Defect inspection apparatus and defect inspection method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005091049A (en) * 2003-09-12 2005-04-07 Ccs Inc Light irradiator for image processing and light irradiation method for image processing
JP2005274558A (en) * 2004-02-27 2005-10-06 Omron Corp Surface condition inspecting method, surface condition inspecting apparatus employing it, and substrate inspecting apparatus
JP2007240431A (en) * 2006-03-10 2007-09-20 Omron Corp Defect inspection device and defect inspection method
JP2009174857A (en) * 2008-01-21 2009-08-06 Omron Corp Illuminating device and defect inspection device using same
TWI491871B (en) * 2013-07-05 2015-07-11 Machvision Inc Illumination system for use in optical inspection, illumination system-based inspection system, and illumination system-based inspection method

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