TWI640238B - Electronic device package - Google Patents
Electronic device package Download PDFInfo
- Publication number
- TWI640238B TWI640238B TW103144482A TW103144482A TWI640238B TW I640238 B TWI640238 B TW I640238B TW 103144482 A TW103144482 A TW 103144482A TW 103144482 A TW103144482 A TW 103144482A TW I640238 B TWI640238 B TW I640238B
- Authority
- TW
- Taiwan
- Prior art keywords
- base
- wiring
- pins
- mounting
- wall
- Prior art date
Links
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
一種電子裝置之封裝盒,包含一個第一基座單元,及一個第二基座單元。該第一基座單元包括一個第一基座,及數支分別插接於該第一基座的第一接腳。該第一基座具有一個第一接線面。每一支第一接腳具有一個突出該第一接線面的第一接線段。該第二基座單元包括一個第二基座,及數支分別貫穿插設於彼此相背靠置之該第二基座及該第一基座的第二接腳。該第二基座具有一個遠離該第一接線面的第二接線面。每一支第二接腳具有一個突出該第二接線面的第二接線段,及一個突出該第一接線面的突腳段。該封裝盒藉由上述設計,可在組裝上更為便捷容易。 A package for an electronic device, comprising a first base unit and a second base unit. The first base unit includes a first base and a plurality of first pins respectively inserted into the first base. The first base has a first wiring face. Each of the first pins has a first wiring segment that protrudes from the first wiring surface. The second base unit includes a second base, and a plurality of second pins respectively inserted through the second base and the first base that are opposite to each other. The second base has a second wiring surface remote from the first wiring surface. Each of the second pins has a second wiring segment projecting the second wiring surface, and a protruding leg portion projecting the first wiring surface. The package is more convenient and easy to assemble by the above design.
Description
本發明是有關於一種封裝盒,特別是指一種專門用來封裝電子元件的電子裝置之封裝盒。 The present invention relates to a package, and more particularly to a package for an electronic device specifically for packaging electronic components.
參閱圖1及圖2,一種現有電子裝置之封裝盒1,可供數個第一電子元件10及數個第二電子元件11安裝。每一個第一電子元件10具有一個中空的第一磁環101,及兩條分別圈繞於該第一磁環101的第一導線102。每一個第二電子元件11具有一個中空的第二磁環111,及兩條分別圈繞於該第二磁環111的第二導線112。該封裝盒1包含一個供該等第一電子元件10安裝的基座單元12,及一個供該等第二電子元件11安裝的封蓋單元13。 Referring to FIG. 1 and FIG. 2, a package 1 of a conventional electronic device is mounted for a plurality of first electronic components 10 and a plurality of second electronic components 11. Each of the first electronic components 10 has a hollow first magnetic ring 101 and two first wires 102 wound around the first magnetic ring 101, respectively. Each of the second electronic components 11 has a hollow second magnetic ring 111 and two second wires 112 respectively wound around the second magnetic ring 111. The package 1 includes a base unit 12 for mounting the first electronic components 10, and a cover unit 13 for mounting the second electronic components 11.
該基座單元12包括一個基座121,及數支彼此間隔地插接於該基座121的第一接腳122。該基座121具有一個供該等第一電子元件10之該等第一磁環101安裝的底壁123、一個由該底壁123之周緣向上突伸的內圍繞壁124,及一個由該內圍繞壁124之周緣底部往外水平突伸的側突壁125。該側突壁125具有數個彼此間隔且分別排列於左右兩側的插孔126。每一支第一接腳122具有一個嵌埋於該 內圍繞壁124內的第一嵌埋段127、一個由該第一嵌埋段127向上突伸出該內圍繞壁124之頂面的第一接線段128,及一個由該第一嵌埋段127向下突伸出該內圍繞壁124之底面的第一突腳段129。每一個第一接線段128供該等第一電子元件10之該等第一導線102之其中之一纏繞連接。 The base unit 12 includes a base 121 and a plurality of first pins 122 that are inserted into the base 121 at intervals. The base 121 has a bottom wall 123 for mounting the first magnetic rings 101 of the first electronic components 10, an inner surrounding wall 124 projecting upward from a periphery of the bottom wall 123, and one inner A side projecting wall 125 projecting horizontally around the bottom of the periphery of the wall 124. The side protruding wall 125 has a plurality of insertion holes 126 spaced apart from each other and arranged on the left and right sides. Each of the first pins 122 has an embedded in the a first embedded section 127 in the inner surrounding wall 124, a first connecting section 128 protruding upward from the first embedded section 127, and a top surface of the inner surrounding wall 124, and a first embedded section 127 projects downwardly from the first leg section 129 of the bottom surface of the inner surrounding wall 124. Each of the first wiring segments 128 is entangled with one of the first wires 102 of the first electronic components 10.
該封蓋單元13包括一個對應蓋設於該基座121上方的封蓋131,及數支彼此間隔地插接於該封蓋131的第二接腳132。該封蓋131具有一個平行地位於該底壁123上方且供該等第二電子元件11之該等第二磁環111安裝的頂壁133,及一個由該頂壁133之周緣向下突伸且結合於該側突壁125的外圍繞壁134。每一支第二接腳132具有一個嵌埋於該外圍繞壁134內的第二嵌埋段135、一個由該第二嵌埋段135向下突伸出該外圍繞壁134之底面的第二接線段136、一個由該第二接線段136往下突伸且***該側突壁125之各別之插孔126的***段137,及一個由該***段137向下突伸出該側突壁125之底面的第二突腳段138。每一個第二接線段136供該等第二電子元件11之該等第二導線112之其中之一纏繞連接。 The cover unit 13 includes a cover 131 correspondingly disposed above the base 121, and a plurality of second pins 132 that are inserted into the cover 131 at intervals. The cover 131 has a top wall 133 which is disposed above the bottom wall 123 and is mounted by the second magnetic rings 111 of the second electronic components 11 and a downward projection from the periphery of the top wall 133. And is coupled to the outer surrounding wall 134 of the side protruding wall 125. Each of the second pins 132 has a second embedded portion 135 embedded in the outer surrounding wall 134, and a second portion of the outer surrounding wall 134 protruding downwardly from the second embedded portion 135. a second wiring section 136, an insertion section 137 extending downwardly from the second wiring section 136 and inserted into each of the insertion holes 126 of the side protruding wall 125, and a projection portion 137 projecting downwardly from the insertion section 137 A second leg section 138 of the bottom surface of the protruding wall 125. Each of the second wiring segments 136 is entangled with one of the second wires 112 of the second electronic components 11.
雖然,該封裝盒1之每一支第一接腳122皆與該等第一電子元件10之其中之一電連接,每一支第二接腳132皆與該等第二電子元件11之其中之一電連接,使用時還能將突伸出該基座121底部之該等第一突腳段129及該等第二突腳段138設置在一片電路板(圖未示)上。然而,由於該封蓋單元13及該基座單元12是採用上下相對蓋合的 設計,所以該封蓋單元13之每一支第二接腳132,突伸出該外圍繞壁134底面的部位,除了供各別之第二導線112纏繞的該第二接線段136以外,還繼續向下延伸有該***段137及該第二突腳段138,導致每一支第二接腳132向下突出的長度較長,故當裝配人員欲將該第二導線112纏繞於該第二接線段136上時,每繞一圈都必需費事地繞過該***段137及該第二突腳段138,才能推移並繫結在接近該外圍繞壁134底面之該第二接線段136上,往往造成組裝上的麻煩不便。 Each of the first pins 122 of the package 1 is electrically connected to one of the first electronic components 10, and each of the second pins 132 is associated with the second electronic component 11 One of the electrical connections can also be used to position the first leg segments 129 and the second leg segments 138 protruding from the bottom of the base 121 on a circuit board (not shown). However, since the capping unit 13 and the base unit 12 are vertically opposed to each other The second pin 132 of the cover unit 13 protrudes from the bottom surface of the outer surrounding wall 134 except for the second wire segment 136 for the second wire 112 to be wound. The insertion section 137 and the second protrusion section 138 continue to extend downward, resulting in a longer length of each of the second pins 132 protruding downward, so that the assembler wants to wrap the second wire 112 around the first When the two wiring sections 136 are wound, it is necessary to circumvent the insertion section 137 and the second protrusion section 138 every time, in order to be pushed and tied to the second wiring section near the bottom surface of the outer surrounding wall 134. On 136, it often causes inconvenience in assembly.
因此,本發明之目的,即在提供一種便於組裝的電子裝置之封裝盒。 Accordingly, it is an object of the present invention to provide a package for an electronic device that is easy to assemble.
於是,本發明電子裝置之封裝盒,可供數個第一電子元件及數個第二電子元件安裝,並包含:一個第一基座單元,及一個第二基座單元。該第一基座單元包括一個第一基座,及數支彼此間隔地插接於該第一基座的第一接腳,該第一基座具有一個第一結合面、一個與該第一結合面相間隔且供該等第一電子元件安裝的第一安裝面,及一個位於該第一安裝面周圍的第一接線面,每一支第一接腳具有一個突伸出該第一基座之該第一接線面且與該等第一電子元件之其中之一電連接的第一接線段。該第二基座單元連接於該第一基座單元,並包括一個第二基座,及數支彼此間隔地插接於該第二基座與該第一基座的第二接腳,該第二基座具有一個對應靠置於該第一結合面的第二結 合面、一個與該第二結合面相間隔且供該等第二電子元件安裝的第二安裝面,及一個位於該第二安裝面周圍的第二接線面,每一支第二接腳具有一個突伸出該第二基座之該第二接線面且與該等第二電子元件之其中之一電連接的第二接線段,及一個突伸出該第一基座之該第一接線面的突腳段。 Therefore, the package of the electronic device of the present invention can be mounted by a plurality of first electronic components and a plurality of second electronic components, and includes: a first base unit and a second base unit. The first base unit includes a first base, and a plurality of first pins that are spaced apart from each other and coupled to the first base, the first base has a first joint surface, and the first base a first mounting surface spaced apart from each other for mounting the first electronic component, and a first wiring surface located around the first mounting surface, each of the first pins having a protruding protrusion from the first pedestal The first wiring face and the first wiring segment electrically connected to one of the first electronic components. The second base unit is coupled to the first base unit and includes a second base, and a plurality of second pins that are spaced apart from each other and are coupled to the second base and the first base. The second base has a second knot corresponding to the first joint surface a mating surface, a second mounting surface spaced apart from the second bonding surface for mounting the second electronic components, and a second wiring surface located around the second mounting surface, each of the second pins having a a second wiring segment protruding from the second wiring surface of the second base and electrically connected to one of the second electronic components, and a first wiring surface protruding from the first base The leg of the leg.
2‧‧‧第一電子元件 2‧‧‧First electronic components
21‧‧‧第一磁環 21‧‧‧First magnetic ring
22‧‧‧第一導線 22‧‧‧First wire
3‧‧‧第二電子元件 3‧‧‧Second electronic components
31‧‧‧第二磁環 31‧‧‧Second magnetic ring
32‧‧‧第二導線 32‧‧‧second wire
4‧‧‧第一基座單元 4‧‧‧First base unit
41‧‧‧第一基座 41‧‧‧First base
411‧‧‧第一安裝壁 411‧‧‧First installation wall
412‧‧‧第一圍繞壁 412‧‧‧ first surrounding wall
413‧‧‧第一結合面 413‧‧‧ first joint
414‧‧‧第一安裝面 414‧‧‧First mounting surface
415‧‧‧第一接線面 415‧‧‧First wiring surface
416‧‧‧第一面部 416‧‧‧ first face
417‧‧‧插孔 417‧‧‧ jack
42‧‧‧第一接腳 42‧‧‧First pin
421‧‧‧第一接線段 421‧‧‧First wiring section
422‧‧‧第一嵌埋段 422‧‧‧First embedded section
5‧‧‧第二基座單元 5‧‧‧Second base unit
51‧‧‧第二基座 51‧‧‧Second base
511‧‧‧第二安裝壁 511‧‧‧Second installation wall
512‧‧‧第二圍繞壁 512‧‧‧Second surrounding wall
513‧‧‧第二結合面 513‧‧‧Second junction
514‧‧‧第二安裝面 514‧‧‧Second mounting surface
515‧‧‧第二接線面 515‧‧‧second wiring surface
516‧‧‧第二面部 516‧‧‧ second face
52‧‧‧第二接腳 52‧‧‧second pin
521‧‧‧第二接線段 521‧‧‧second wiring section
522‧‧‧第二嵌埋段 522‧‧‧Second embedded section
523‧‧‧***段 523‧‧‧Insert paragraph
524‧‧‧突腳段 524‧‧‧Foot section
6‧‧‧封蓋單元 6‧‧‧Cover unit
61‧‧‧蓋壁 61‧‧‧ 盖
62‧‧‧周壁 62‧‧‧Walls
本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是一種現有電子裝置之封裝盒的一局部立體分解圖;圖2是圖1封裝盒的一剖視示意圖;圖3是本發明封裝盒的一實施例的一局部立體分解圖;圖4是該實施例之一剖視組裝示意圖;及圖5是該實施例之一剖視分解示意圖。 Other features and effects of the present invention will be apparent from the following description of the drawings. FIG. 1 is a partially exploded perspective view of a package of the prior art electronic device; FIG. 3 is a partially exploded perspective view of an embodiment of the package of the present invention; FIG. 4 is a cross-sectional assembly view of the embodiment; and FIG. 5 is a cross-sectional exploded view of the embodiment.
參閱圖3、圖4與圖5,本發明封裝盒之一實施例,可供數個第一電子元件2及數個第二電子元件3安裝,在本實施例中,該等第一電子元件2及該等第二電子元件3都是以線圈為例來做說明。每一個第一電子元件2具有一個中空的第一磁環21,及兩條分別圈繞在該第一磁環21的兩側再往外延伸的第一導線22。每一個第二電子元件3具有一個中空的第二磁環31,及兩條分別圈繞在該第二 磁環31的兩側再往外延伸的第二導線32。惟該等第一電子元件2及該等第二電子元件3的構造、型態、數量、排列及安裝位置並非本發明的重點,實施時也可以改變,所以在此不再詳細說明。 Referring to FIG. 3, FIG. 4 and FIG. 5, an embodiment of the package of the present invention is provided for mounting a plurality of first electronic components 2 and a plurality of second electronic components 3. In the embodiment, the first electronic components 2 and the second electronic components 3 are all described by taking a coil as an example. Each of the first electronic components 2 has a hollow first magnetic ring 21, and two first wires 22 respectively wound around the two sides of the first magnetic ring 21 and extending outward. Each of the second electronic components 3 has a hollow second magnetic ring 31, and two coils are respectively wound around the second A second wire 32 extending further outward on both sides of the magnetic ring 31. However, the configurations, types, numbers, arrangements, and mounting positions of the first electronic components 2 and the second electronic components 3 are not the focus of the present invention, and may be changed during implementation, and thus will not be described in detail herein.
該封裝盒包含一個第一基座單元4、一個第二基座單元5,及一個封蓋單元6。在以下說明中皆以圖中所示方向來說明,當然在實施上,該封裝盒的設置方向不受限於本實施例,例如也可以上下翻轉或左右側立。 The package includes a first base unit 4, a second base unit 5, and a cover unit 6. In the following description, the directions are shown in the drawings. Of course, the installation direction of the package is not limited to the embodiment, and for example, it may be turned upside down or left and right.
該第一基座單元4包括一個由絕緣塑膠材料製成的第一基座41,及數支分別由導電金屬材料製成且彼此間隔地插接於該第一基座41的第一接腳42。該第一基座41為一個中空且朝下開口而使剖面呈倒U形的中空座體,並具有一個水平的第一安裝壁411,及一個由該第一安裝壁411之周緣向下突伸的第一圍繞壁412。該第一安裝壁411具有一個形成於頂側的第一結合面413,及一個間隔位於該第一結合面413下方且供該等第一電子元件2安裝的第一安裝面414。該第一圍繞壁412具有一個形成於底側且位於該第一安裝面414之周圍下方的第一接線面415。該第一接線面415具有兩個左右間隔的第一面部416。該第一基座41還具有數個彼此間隔地直向連通該第一結合面413與該第一接線面415的插孔417。 The first base unit 4 includes a first base 41 made of an insulating plastic material, and a plurality of first pins respectively made of a conductive metal material and spaced apart from each other at the first base 41 42. The first base 41 is a hollow seat body which is hollow and faces downward to make an inverted U-shaped cross section, and has a horizontal first mounting wall 411, and a lower side of the periphery of the first mounting wall 411 The first stretched wall 412. The first mounting wall 411 has a first bonding surface 413 formed on the top side, and a first mounting surface 414 spaced below the first bonding surface 413 for mounting the first electronic components 2. The first surrounding wall 412 has a first wiring surface 415 formed on the bottom side and below the first mounting surface 414. The first wiring face 415 has two first and right spaced apart first faces 416. The first base 41 further has a plurality of insertion holes 417 that are directly connected to the first joint surface 413 and the first connection surface 415 at a distance from each other.
每一支第一接腳42具有一個向下突伸出該第一基座41之該第一接線面415且與該等第一電子元件2之其中之一電連接的第一接線段421,及一個伸入該第一基座 41內且同體連接該第一接線段421的第一嵌埋段422。該等第一接腳42之該等第一接線段421分別突伸出該第一基座41之該等第一面部416,並於每一個第一面部416上排成前後錯開且左右間隔的兩列。而該等第一嵌埋段422是在該第一基座41成型時一併結合於該第一基座41。 Each of the first pins 42 has a first connecting portion 421 protruding downwardly from the first connecting surface 415 of the first base 41 and electrically connected to one of the first electronic components 2, And one extending into the first base The first embedded section 422 of the first wiring section 421 is connected to the same body 41. The first connecting segments 421 of the first pins 42 respectively protrude from the first surface portions 416 of the first base 41, and are arranged on the first surface portion 416 to be staggered back and forth. Two columns of spacing. The first embedded segments 422 are bonded to the first base 41 when the first base 41 is molded.
該第二基座單元5連接於該第一基座單元4,並包括一個由絕緣塑膠材料製成且與該第一基座41背對靠置的第二基座51,及數支分別由導電金屬材料製成且彼此間隔地插接於該第二基座51與該第一基座41的第二接腳52。該第二基座51為一個中空且朝上開口而使剖面呈U形的中空座體,並具有一個平行於該第一安裝壁411的第二安裝壁511,及一個由該第二安裝壁511之周緣往上突伸的第二圍繞壁512。該第二安裝壁511具有一個形成於底側且對應靠置於該第一基座41之該第一結合面413的第二結合面513,及一個間隔位於該第二結合面513上方且供該等第二電子元件3安裝的第二安裝面514。該第二圍繞壁512具有一個形成於頂側且位於該第二安裝面514之周圍上方的第二接線面515。該第二接線面515具有兩個左右間隔且分別平行於該等第一面部416的第二面部516。 The second base unit 5 is connected to the first base unit 4 and includes a second base 51 made of an insulating plastic material and facing away from the first base 41, and a plurality of The conductive metal material is made to be inserted into the second base 51 and the second pin 52 of the first base 41 at a distance from each other. The second base 51 is a hollow hollow body that is open in the upward direction and has a U-shaped cross section, and has a second mounting wall 511 parallel to the first mounting wall 411, and a second mounting wall A second surrounding wall 512 projecting upward from the periphery of 511. The second mounting wall 511 has a second joint surface 513 formed on the bottom side and corresponding to the first joint surface 413 of the first base 41, and a spacing is located above the second joint surface 513 for The second mounting surface 514 of the second electronic component 3 is mounted. The second surrounding wall 512 has a second wiring surface 515 formed on the top side and above the circumference of the second mounting surface 514. The second wiring face 515 has two second face portions 516 spaced apart from each other and spaced parallel to the first face portions 416, respectively.
每一支第二接腳52具有一個向上突伸出該第二基座51之該第二接線面515且與該等第二電子元件3之其中之一電連接的第二接線段521、一個由該第二接線段521向下伸入該第二基座51的第二嵌埋段522、一個由該第二嵌埋段522向下***該第一基座41之各別的插孔417的插 入段523,及一個由該***段523向下突伸出該第一基座41之該第一接線面415的突腳段524。該等第二接腳52之該等第二接線段521分別突伸出該第二基座51之該等第二面部516,並於每一個第二面部516上排成前後錯開且左右間隔的兩列。該等第二嵌埋段522是在該第二基座51成型時一併結合於該第二基座51。 Each of the second pins 52 has a second connecting portion 521 protruding upwardly from the second connecting surface 515 of the second base 51 and electrically connected to one of the second electronic components 3, The second embedded section 521 extends downwardly from the second embedded section 522 of the second base 51, and a respective insertion hole 417 of the first base 41 is inserted downwardly from the second embedded section 522. Insert The entry section 523 and a protruding section 524 of the first wiring surface 415 of the first base 41 protrude downward from the insertion section 523. The second connecting segments 521 of the second pins 52 respectively protrude from the second surface portions 516 of the second base 51, and are arranged on the second surface 516 to be staggered in the front and rear and spaced apart from each other. Two columns. The second embedded segments 522 are coupled to the second base 51 when the second base 51 is molded.
該封蓋單元6由絕緣塑膠材料製成,是罩蓋在該第一基座41與該第二基座51外圍,該封蓋單元6包括一個與該第二安裝面514與該第二接線面515間隔相對且覆蓋該等第二接腳52之該等第二接線段521的蓋壁61,及一個由該蓋壁61周緣向下延伸且圍繞於該第二基座51與該第一基座41外圍的周壁62。須說明的是,該封蓋單元6還包括有至少一個設置於該周壁62且可拆離地結合於該第一基座41的卡掣部(圖未示),由於該封蓋單元6與該第一基座41間的結合構造並非本發明重點,所以在此不再說明。 The cover unit 6 is made of an insulating plastic material and is covered on the periphery of the first base 41 and the second base 51. The cover unit 6 includes a second mounting surface 514 and the second wiring. The cover 515 is spaced apart from and covers the cover wall 61 of the second connecting segments 521 of the second pins 52, and a cover wall extending downwardly from the periphery of the cover wall 61 and surrounding the second base 51 and the first A peripheral wall 62 on the periphery of the base 41. It should be noted that the capping unit 6 further includes at least one latching portion (not shown) disposed on the peripheral wall 62 and detachably coupled to the first base 41, since the capping unit 6 is The joint structure between the first pedestals 41 is not the focus of the present invention, and therefore will not be described here.
組裝時,將該等第一電子元件2之該等第一磁環21分別安裝在該第一基座41之該第一安裝面414上,並將該等第一導線22分別拉出至對應該等第一接腳42的該等第一接線段421,且分別纏繞於該等第一接線段421。再將該等第二電子元件3之該等第二磁環31分別安裝在該第二基座51之該第二安裝面514上,並將該等第二導線32分別拉出至對應該等第二接腳52的該等第二接線段521,且分別纏繞於該等第二接線段521。於纏繞後,將該等第一 導線22及該等第二導線32的多餘線段分別截斷,接著進行鍍錫作業,藉以電連接該等第一電子元件2與該等第一接腳42,並電連接該等第二電子元件3與該等第二接腳52。當然,還可以在該第一基座41及該第二基座51內分別填充一絕緣材料(圖未示),用於固定及保護該等第一電子元件2及該等第二電子元件3,在此不再說明。 When assembled, the first magnetic rings 21 of the first electronic components 2 are respectively mounted on the first mounting surface 414 of the first base 41, and the first wires 22 are respectively pulled out to the pair. The first wiring segments 421 of the first pin 42 should be waited for and wound around the first wiring segments 421, respectively. The second magnetic rings 31 of the second electronic components 3 are respectively mounted on the second mounting surface 514 of the second base 51, and the second wires 32 are respectively pulled out to correspond to each other. The second segments 521 of the second pins 52 are wound around the second segments 521, respectively. After winding, the first one The excess line segments of the wires 22 and the second wires 32 are respectively cut off, and then a tin plating operation is performed to electrically connect the first electronic components 2 and the first pins 42 and electrically connect the second electronic components 3 And the second pins 52. Of course, an insulating material (not shown) may be respectively filled in the first pedestal 41 and the second pedestal 51 for fixing and protecting the first electronic component 2 and the second electronic components 3 . , no longer here.
之後再將該第二基座單元5組裝在該第一基座單元4上,組裝時將該第二基座單元5之該等第二接腳52的該等***段523,一起向下***該第一基座單元4之該第一基座41之該等插孔417中,直到該等第二接腳52的該等突腳段524向下突伸出該第一基座41之該第一接線面415,且該第二基座51之該第二結合面513對應靠置於該第一基座41之該第一結合面413為止。最後將該封蓋單元6向下蓋設在該第一基座41與該第二基座51外圍,並結合於該第一基座41,以完成該封裝盒的組裝。 Then, the second base unit 5 is assembled on the first base unit 4, and the insertion sections 523 of the second pins 52 of the second base unit 5 are inserted downward together during assembly. In the sockets 417 of the first base 41 of the first base unit 4, until the protrusions 524 of the second pins 52 protrude downwardly from the first base 41 The first bonding surface 415 of the second pedestal 51 corresponds to the first bonding surface 413 of the first pedestal 41 . Finally, the capping unit 6 is disposed on the outer periphery of the first base 41 and the second base 51, and is coupled to the first base 41 to complete assembly of the package.
組裝完成後,還能將該封裝盒向下突出該第一接線面415之該等第一接線段421及該等突腳段524,插接在一片電路板(圖未示)上,並進行鍍錫作業,藉以電連接並固定於該電路板上。當然,在組裝上亦可以省略上述在該等第一導線22與該等第一接腳42之該等第一接線段421間的鍍錫作業,而能在插設於該電路板後再一併進行鍍錫作業,故可進一步簡化製程。 After the assembly is completed, the first connecting portion 421 and the protruding portion 524 of the first wiring surface 415 are protruded downwardly, and are inserted on a circuit board (not shown). The tin plating operation is electrically connected and fixed to the circuit board. Of course, the tin plating operation between the first wires 22 and the first wiring segments 421 of the first pins 42 can be omitted in the assembly, and can be inserted in the circuit board again. The tin plating operation is carried out, so that the process can be further simplified.
綜上所述,本發明電子裝置之封裝盒,設置該第一基座單元4及該第二基座單元5,以分別供該等第一電 子元件2及該等第二電子元件3安裝,而且該第二基座51與該第一基座41為彼此背對靠置設計,使得該第二接線面515與該第一接線面415上下反向間隔,並讓該等第二接腳52向上突伸出該第二接線面515的部位僅為該等第二接線段521,該等第一接腳42向下突伸出該第一接線面415的部位僅為該等第一接線段421,突伸長度恰可供該等第二導線32與該等第一導線22纏繞連接而不致過長,所以在組裝上較為便捷容易,可節省人力工時,確能有效降低成本,因此本發明不僅是前所未有的創新,更可供產業上利用,故確實能達成本發明之目的。 In summary, the package box of the electronic device of the present invention is provided with the first base unit 4 and the second base unit 5 for respectively supplying the first electric The sub-element 2 and the second electronic component 3 are mounted, and the second pedestal 51 and the first pedestal 41 are disposed opposite each other such that the second wiring surface 515 and the first wiring surface 415 are up and down. The first spacers 521 are oppositely spaced apart, and the second pins 52 are protruded upwardly from the second wiring surface 515. The first pins 42 protrude downwardly from the first portion. The portion of the wiring surface 415 is only the first wiring segments 421, and the protrusion length is just enough for the second wires 32 to be wound and connected with the first wires 22 without being too long, so that the assembly is relatively convenient and easy. The labor saving time can effectively reduce the cost. Therefore, the present invention is not only an unprecedented innovation, but also can be utilized by the industry, so that the object of the present invention can be achieved.
惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103144482A TWI640238B (en) | 2014-12-19 | 2014-12-19 | Electronic device package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103144482A TWI640238B (en) | 2014-12-19 | 2014-12-19 | Electronic device package |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201625104A TW201625104A (en) | 2016-07-01 |
TWI640238B true TWI640238B (en) | 2018-11-01 |
Family
ID=56984928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103144482A TWI640238B (en) | 2014-12-19 | 2014-12-19 | Electronic device package |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI640238B (en) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5274346A (en) * | 1991-08-22 | 1993-12-28 | Tdk Corporation | Integrated LC filter |
TWM368241U (en) * | 2009-06-05 | 2009-11-01 | shao-bai Chen | Structural improvement of filter |
US20100142173A1 (en) * | 2008-12-08 | 2010-06-10 | U.D.Electronic Corp. | Signal filter module |
TW201312605A (en) * | 2011-09-09 | 2013-03-16 | Shao-Pai Chen | Embedded type filter |
US8496499B2 (en) * | 2006-04-05 | 2013-07-30 | Pulse Electronics, Inc. | Modular electronic header assembly and methods of manufacture |
TWM459567U (en) * | 2013-03-06 | 2013-08-11 | Bothhand Entpr Inc | Electric component assembly box |
TWM484862U (en) * | 2014-03-03 | 2014-08-21 | Feei Cherng Entpr Co Ltd | Housing of electrical component and transformer including the housing |
TWM499394U (en) * | 2014-12-19 | 2015-04-21 | Bothhand Entpr Inc | Packaging case of electronic device |
-
2014
- 2014-12-19 TW TW103144482A patent/TWI640238B/en active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5274346A (en) * | 1991-08-22 | 1993-12-28 | Tdk Corporation | Integrated LC filter |
US8496499B2 (en) * | 2006-04-05 | 2013-07-30 | Pulse Electronics, Inc. | Modular electronic header assembly and methods of manufacture |
US20100142173A1 (en) * | 2008-12-08 | 2010-06-10 | U.D.Electronic Corp. | Signal filter module |
TWM368241U (en) * | 2009-06-05 | 2009-11-01 | shao-bai Chen | Structural improvement of filter |
TW201312605A (en) * | 2011-09-09 | 2013-03-16 | Shao-Pai Chen | Embedded type filter |
TWM459567U (en) * | 2013-03-06 | 2013-08-11 | Bothhand Entpr Inc | Electric component assembly box |
TWM484862U (en) * | 2014-03-03 | 2014-08-21 | Feei Cherng Entpr Co Ltd | Housing of electrical component and transformer including the housing |
TWM499394U (en) * | 2014-12-19 | 2015-04-21 | Bothhand Entpr Inc | Packaging case of electronic device |
Also Published As
Publication number | Publication date |
---|---|
TW201625104A (en) | 2016-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWM499394U (en) | Packaging case of electronic device | |
JP2009159650A5 (en) | ||
KR20150127550A (en) | Electronic device mounting apparatus | |
US8905789B2 (en) | Electronic device package box having a base unit and a cover unit with electronic components | |
JP2014236654A (en) | Electric connection box | |
TWI640238B (en) | Electronic device package | |
TWM497651U (en) | Packaging case of electronic device | |
US20150288080A1 (en) | Harness assembly | |
KR200483817Y1 (en) | Electronic device package box | |
US20150236489A1 (en) | Electrical junction box | |
TWM526170U (en) | Electronic device capable of generating filtering function | |
TWI674719B (en) | Package box for loading electronic parts | |
KR20150045880A (en) | Electric-element mount seat | |
KR102644965B1 (en) | Pcb connector and method for manufacturing thereof | |
TWM559506U (en) | Packaging box for carrying electronic components | |
TWI573151B (en) | An electronic device that produces a filtering function | |
TWM535450U (en) | Packaging case of electronic device | |
TWI587325B (en) | Electronic device package box | |
JP5104798B2 (en) | Induction heating cooker | |
TWM459567U (en) | Electric component assembly box | |
TWM513493U (en) | Ring-like structure of electronic component base | |
JP2013065581A (en) | Electric connector and method for manufacturing the same | |
TWI629697B (en) | Electronic device capable of generating filtering function | |
TW201810848A (en) | Coil device and package box thereof capable of improving the processing speed and the soldering accuracy | |
TWM530464U (en) | Electronic device capable of generating filtering function |