TWI639005B - Testing system for semiconductor package component and its thermal barrier layer element - Google Patents
Testing system for semiconductor package component and its thermal barrier layer element Download PDFInfo
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Abstract
一種半導體封裝元件之檢測系統包含一測試電路板、一測試基座、至少一探針銷及一熱阻障層元件。測試電路板具有至少一電性接點。測試基座用以容納一受驗元件。探針銷位於測試基座上，用以接觸受驗元件。熱阻障層元件位於測試電路板與測試基座之間，電性連接且熱隔絕探針銷與電性接點。 A detection system for a semiconductor package component includes a test circuit board, a test pedestal, at least one probe pin, and a thermal barrier layer component. The test board has at least one electrical contact. The test base is adapted to receive an assay component. The probe pin is located on the test base to contact the component under test. The thermal barrier layer component is located between the test circuit board and the test pedestal, electrically connected and thermally insulated from the probe pin and the electrical contact.
Description
本發明有關於一種檢測系統，尤指一種半導體封裝元件之檢測系統。 The invention relates to a detection system, in particular to a detection system for a semiconductor package component.
一般而言，半導體封裝元件(例如半導體封裝晶片)在製作完成後會進行電性檢測，以確保半導體封裝元件在出貨時的品質。在進行電性檢測時，受驗元件(DUT)會被放置於一檢測裝置之測試基座(socket)上，以便受驗元件的端點(如銲球solder ball)電性連接測試電路板(load board)，藉此對受驗元件進行電性測試。 In general, semiconductor package components (eg, semiconductor package wafers) are electrically tested after fabrication to ensure the quality of the semiconductor package components at the time of shipment. When performing electrical detection, the component (DUT) is placed on the test socket of a detecting device, so that the end of the component (such as the solder ball) is electrically connected to the test circuit board ( Load board), thereby electrically testing the component under test.
然而，在對受驗元件進行高溫檢測時，測試人員常常發現受驗元件在測試基座上的實際溫度明顯低於檢測裝置之設定溫度，導致高溫檢測之試驗數據不夠精準，故受驗元件無法在預定溫度之環境中進行檢測。 However, when performing high-temperature detection on the component under test, the tester often finds that the actual temperature of the component under test on the test pedestal is significantly lower than the set temperature of the test device, resulting in insufficient accuracy of the test data for the high-temperature test, so the component under test cannot The detection is performed in an environment of a predetermined temperature.
故，如何研發出一種解決方案以改善上述所帶來 的缺失及不便，實乃相關業者目前刻不容緩之一重要課題。 Therefore, how to develop a solution to improve the above The lack of inconvenience and inconvenience is an important issue that the relevant industry is currently unable to delay.
本發明之一實施例提供了一種檢測系統之熱阻障層元件。熱阻障層元件包含一絕緣墊及至少一導電隔熱部。導電隔熱部形成於絕緣墊上，且導電隔熱部具有包含奈米碳管之氣凝膠，或者，具有包含奈米碳管之矽膠。 One embodiment of the present invention provides a thermal barrier layer component of a detection system. The thermal barrier layer component includes an insulating pad and at least one electrically conductive insulating portion. The conductive heat insulating portion is formed on the insulating mat, and the conductive heat insulating portion has an aerogel containing a carbon nanotube or has a silicone containing a carbon nanotube.
在本發明一或複數個實施例中，絕緣墊包含一墊體與至少一容納區，容納區形成於墊體內，且連接墊體之二相對表面，且導電隔熱部一體成形地位於容納區內。 In one or more embodiments of the present invention, the insulating mat includes a pad body and at least one receiving area formed in the pad body and connected to the opposite surfaces of the pad body, and the conductive heat insulating portion is integrally formed in the receiving area. Inside.
在本發明一或複數個實施例中，絕緣墊包含一墊體與至少一貫孔。貫孔貫穿墊體，且連接墊體之二相對表面，且導電隔熱部覆蓋其中一表面及貫孔。 In one or more embodiments of the invention, the insulating mat includes a pad body and at least a consistent aperture. The through hole penetrates the pad body and connects the opposite surfaces of the pad body, and the conductive heat insulating portion covers one surface and the through hole.
在本發明一或複數個實施例中，至少一導電隔熱部為多個時，這些導電隔熱部間隔地位於絕緣墊上。 In one or more embodiments of the present invention, when there are at least one conductive heat insulating portion, the conductive heat insulating portions are spaced apart on the insulating mat.
在本發明一或複數個實施例中，導電隔熱部以一矩陣方式排列。 In one or more embodiments of the invention, the electrically conductive thermally insulating portions are arranged in a matrix.
在本發明一或複數個實施例中，導電隔熱部之表面具有一凹陷槽。 In one or more embodiments of the invention, the surface of the electrically conductive insulating portion has a recessed groove.
本發明之另一實施例提供了一種半導體封裝元件之檢測系統。檢測系統包含一測試電路板、一測試基座、至少一探針銷及一熱阻障層元件。測試電路板具有至少一電性接點。測試基座用以容納一受驗元件。探針銷位於測試基座上，用以電性連接受驗元件與電性接點。熱阻障層元件位於探針銷 與電性接點之間，電性導接探針銷與電性接點，至少減緩探針銷與電性接點之間的熱傳遞。 Another embodiment of the present invention provides a detection system for a semiconductor package component. The detection system includes a test circuit board, a test base, at least one probe pin, and a thermal barrier layer component. The test board has at least one electrical contact. The test base is adapted to receive an assay component. The probe pin is located on the test base for electrically connecting the component to be tested and the electrical contact. Thermal barrier element is located on the probe pin Between the electrical contact and the electrical contact, the probe pin and the electrical contact electrically reduce the heat transfer between the probe pin and the electrical contact.
在本發明一或複數個實施例中，熱阻障層元件包含一絕緣墊與至少一導電隔熱部。絕緣墊受夾合於測試電路板與測試基座之間。導電隔熱部形成於絕緣墊上，直接夾合於電性接點及探針銷之間，用以熱阻隔探針銷與電性接點。 In one or more embodiments of the invention, the thermal barrier layer component includes an insulating pad and at least one electrically conductive insulating portion. The insulating mat is sandwiched between the test board and the test pedestal. The conductive heat insulating portion is formed on the insulating pad and directly sandwiched between the electrical contact and the probe pin for thermally blocking the probe pin and the electrical contact.
在本發明一或複數個實施例中，絕緣墊包含一墊體與至少一容納區，容納區形成於墊體內，且連接墊體之二相對表面，且導電隔熱部一體成形地位於容納區內。 In one or more embodiments of the present invention, the insulating mat includes a pad body and at least one receiving area formed in the pad body and connected to the opposite surfaces of the pad body, and the conductive heat insulating portion is integrally formed in the receiving area. Inside.
在本發明一或複數個實施例中，絕緣墊包含一墊體與至少一貫孔。貫孔貫穿墊體，且連接墊體之二相對表面，且導電隔熱部覆蓋其中一表面及貫孔，且探針銷伸入貫孔內並接觸導電隔熱部。 In one or more embodiments of the invention, the insulating mat includes a pad body and at least a consistent aperture. The through hole penetrates the pad body and connects the opposite surfaces of the pad body, and the conductive heat insulating portion covers one surface and the through hole, and the probe pin protrudes into the through hole and contacts the conductive heat insulating portion.
在本發明一或複數個實施例中，導電隔熱部、至少一電性接點與探針銷分別為多個時，這些導電隔熱部間隔地位於絕緣墊上，且每個導電隔熱部分別被夾合於其中一電性接點以及其中一探針銷之間。 In one or more embodiments of the present invention, when the conductive heat insulating portion, the at least one electrical contact and the probe pin are respectively plural, the conductive heat insulating portions are spaced apart on the insulating mat, and each conductive heat insulating portion Do not be clamped between one of the electrical contacts and one of the probe pins.
在本發明一或複數個實施例中，這些導電隔熱部依據一矩陣方式排列。 In one or more embodiments of the invention, the electrically conductive thermally insulating portions are arranged in a matrix.
在本發明一或複數個實施例中，導電隔熱部之表面具有一凹陷槽，且探針銷伸入凹陷槽內。 In one or more embodiments of the present invention, the surface of the conductive heat insulating portion has a recessed groove, and the probe pin protrudes into the recessed groove.
在本發明一或複數個實施例中，導電隔熱部具有包含奈米碳管之氣凝膠，或者，具有包含奈米碳管之矽膠。 In one or more embodiments of the invention, the electrically conductive insulating portion has an aerogel comprising a carbon nanotube or a silicone comprising a carbon nanotube.
本發明之另一實施例提供了一種半導體封裝元件 之檢測系統。檢測系統包含一測試電路板、一測試基座、至少一探針銷及一熱阻障層元件。測試電路板具有至少一電性接點。測試基座具有一凹槽。凹槽用以容納一受驗元件。探針銷位於測試基座上，用以電性連接受驗元件與電性接點。熱阻障層元件位於凹槽內，覆蓋探針銷，用以電性導接探針銷與受驗元件，且至少減緩探針銷與受驗元件之間的熱傳遞。 Another embodiment of the present invention provides a semiconductor package component Detection system. The detection system includes a test circuit board, a test base, at least one probe pin, and a thermal barrier layer component. The test board has at least one electrical contact. The test base has a recess. The recess is for receiving a component to be tested. The probe pin is located on the test base for electrically connecting the component to be tested and the electrical contact. The thermal barrier layer element is located within the recess and covers the probe pin for electrically guiding the probe pin and the test component and at least slowing heat transfer between the probe pin and the test component.
如此，藉由以上實施例所述之檢測系統，由於熱阻障層元件介於探針銷與電性接點之間，或者探針銷與受驗元件之間，測試基座以及受驗元件所受到之熱能不致迅速朝測試電路板之方向散去，不僅降低受驗元件的試驗數據不夠精準的機會，也確保熱能不致傷害測試電路板。 Thus, with the detection system described in the above embodiments, since the thermal barrier layer component is interposed between the probe pin and the electrical contact, or between the probe pin and the test component, the test base and the test component The heat received does not quickly dissipate in the direction of the test board, which not only reduces the chance of the test data of the component being tested, but also ensures that the heat does not harm the test board.
以上所述僅係用以闡述本發明所欲解決的問題、解決問題的技術手段、及其產生的功效等等，本發明之具體細節將在下文的實施例及相關圖式中詳細介紹。 The above description is only for explaining the problems to be solved by the present invention, the technical means for solving the problems, the effects thereof, and the like, and the specific details of the present invention will be described in detail in the following embodiments and related drawings.
10、11、12、13‧‧‧檢測系統 10, 11, 12, 13‧‧‧ Inspection system
100‧‧‧測試電路板 100‧‧‧Test circuit board
101‧‧‧測試電路板之一面 101‧‧‧One side of the test circuit board
110‧‧‧電性接點 110‧‧‧Electrical contacts
200‧‧‧測試基座 200‧‧‧Test base
210‧‧‧凹槽 210‧‧‧ Groove
211‧‧‧凹槽之底面 211‧‧‧ underside of the groove
220‧‧‧管道 220‧‧‧ pipeline
300、301、302、303‧‧‧熱阻障層元件 300, 301, 302, 303‧ ‧ thermal barrier elements
310‧‧‧絕緣墊 310‧‧‧Insulation mat
311‧‧‧墊體 311‧‧‧The body
311A‧‧‧第一表面 311A‧‧‧ first surface
311B‧‧‧第二表面 311B‧‧‧ second surface
312‧‧‧容納區 312‧‧‧ accommodating area
313‧‧‧貫孔 313‧‧‧through holes
320‧‧‧導電隔熱部 320‧‧‧Electrical insulation
321‧‧‧凹陷槽 321‧‧‧recessed trough
322‧‧‧弧形底面 322‧‧‧ curved bottom surface
400‧‧‧探針銷 400‧‧‧Probe pin
410‧‧‧上端部 410‧‧‧Upper end
420‧‧‧下端部 420‧‧‧ lower end
500‧‧‧分配手臂 500‧‧‧Distributed arm
600‧‧‧加熱器 600‧‧‧heater
700‧‧‧溫度感測器 700‧‧‧temperature sensor
800‧‧‧受驗元件 800‧‧‧Inspected components
810‧‧‧端點 810‧‧‧Endpoint
A1、A2、M‧‧‧區域 A1, A2, M‧‧‧ areas
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之說明如下：第1圖繪示本發明一實施例之檢測系統的側視示意圖；第2圖繪示第1圖之區域M之局部放大圖；第3圖繪示第2圖之局部分解圖；第4圖繪示第1圖之熱阻障層元件之上視圖；第5圖繪示本發明一實施例之檢測系統的局部放大圖；第6圖繪示本發明一實施例之檢測系統的局部放大圖；以及 第7圖繪示本發明一實施例之檢測系統的側視示意圖。 The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; 1 is a partial enlarged view of a region M of FIG. 1; FIG. 3 is a partial exploded view of FIG. 2; FIG. 4 is a top view of the thermal barrier layer of FIG. 1; A partially enlarged view of a detection system according to an embodiment of the present invention; and a sixth enlarged view of the detection system according to an embodiment of the present invention; Figure 7 is a side elevational view of a detection system in accordance with an embodiment of the present invention.
以下將以圖式揭露本發明之複數個實施例，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本發明。也就是說，在本發明中空體實施例中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 The embodiments of the present invention are disclosed in the following drawings, and for the purpose of illustration However, it should be understood that these practical details are not intended to limit the invention. That is to say, in the hollow body embodiment of the present invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
有鑑於上述半導體封裝元件(後稱受驗元件)在測試基座上的實際溫度明顯低於檢測系統之設定溫度，導致受驗元件之試驗數據不夠精準，對此發明人經實驗後證明測試基座及受驗元件之熱能有一部分是透過連接於測試基座與測試電路板之間的探針銷之引導而朝測試電路板之方向散去，導致受驗元件與測試基座之處的實際溫度無法接近或等同檢測裝置之設定溫度。針對上述，本發明提出一具有熱阻障設計之檢測系統，可以至少減緩受驗元件與測試電路板之間的熱傳遞，進而讓受驗元件可以在預定溫度之環境中進行檢測，進而提高受驗元件於高溫檢測之試驗數據的精準度。 In view of the fact that the actual temperature of the above semiconductor package component (hereinafter referred to as the test component) on the test pedestal is significantly lower than the set temperature of the detection system, the test data of the test component is not accurate enough, and the inventor proves the test base after the experiment. The thermal energy of the seat and the tested component is partially dissipated toward the test circuit board by the guidance of the probe pin connected between the test base and the test circuit board, resulting in the actual location of the test component and the test pedestal. The temperature cannot be approximated or equivalent to the set temperature of the detection device. In view of the above, the present invention provides a detection system with a thermal barrier design that can at least slow down the heat transfer between the component under test and the test circuit board, thereby allowing the component to be inspected in a predetermined temperature environment, thereby improving the Verify the accuracy of the test data of the component at high temperature.
第1圖繪示本發明一實施例之檢測系統10的側視示意圖。第2圖繪示第1圖之區域M之局部放大圖。第3圖繪示第2圖之局部分解圖。如第1圖至第3圖所示，在本實施例中，半導體封裝元件之檢測系統10包含一測試電路板100、一測試基座200、一熱阻障層元件300及多個探針銷400。測試電路板 100具有多個電性接點110。這些電性接點110間隔地排列於測試電路板100之一面101。測試基座200具有一凹槽210。凹槽210用以容納一半導體封裝元件(例如半導體封裝晶片，後稱受驗元件800)。這些探針銷400位於測試基座200上，且間隔地排列於測試基座200之內。每個探針銷400穿過測試基座200之管道220，使得每個探針銷400之一端(即探針銷400之上端部410)伸入凹槽210或至少自凹槽210之底面211暴露出來，其另端(即探針銷400之下端部420)抵接熱阻障層元件300。探針銷400包括彈簧探針(pogo pin)，但不以此為限。熱阻障層元件300位於測試電路板100與測試基座200之間，不僅能夠電性導接探針銷400與電性接點110，還能夠至少減緩探針銷400與電性接點110之間的熱傳遞。 1 is a side elevational view of a detection system 10 in accordance with an embodiment of the present invention. Fig. 2 is a partial enlarged view of a region M of Fig. 1. Fig. 3 is a partial exploded view of Fig. 2. As shown in FIG. 1 to FIG. 3 , in the present embodiment, the semiconductor package component detection system 10 includes a test circuit board 100 , a test pedestal 200 , a thermal barrier layer component 300 , and a plurality of probe pins . 400. Test board 100 has a plurality of electrical contacts 110. The electrical contacts 110 are spaced apart from one side 101 of the test circuit board 100. Test base 200 has a recess 210. The recess 210 is for receiving a semiconductor package component (for example, a semiconductor package wafer, hereinafter referred to as the test component 800). These probe pins 400 are located on the test pedestal 200 and are spaced apart within the test pedestal 200. Each probe pin 400 passes through the conduit 220 of the test base 200 such that one end of each probe pin 400 (i.e., the upper end 410 of the probe pin 400) extends into the recess 210 or at least from the bottom surface 211 of the recess 210. Upon exposure, the other end (i.e., the lower end 420 of the probe pin 400) abuts the thermal barrier element 300. The probe pin 400 includes a pogo pin, but is not limited thereto. The thermal barrier layer component 300 is located between the test circuit board 100 and the test pedestal 200, and can not only electrically connect the probe pin 400 and the electrical contact 110, but also can at least slow down the probe pin 400 and the electrical contact 110. The heat transfer between.
在本實施例中，詳細來說，熱阻障層元件300包含一絕緣墊310與多個導電隔熱部320。每個絕緣墊310位於測試電路板100與測試基座200之間。導電隔熱部320形成於絕緣墊310上，直接夾合於其中一電性接點110及其中一探針銷400之間，用以熱阻隔探針銷400與電性接點110。更具體地，絕緣墊310包含一墊體311與多個容納區312。墊體311具有相對配置之第一表面311A與第二表面311B，且第一表面311A面向測試電路板100。這些容納區312間隔地形成於墊體311內，且每個容納區312連接墊體311之第一表面311A與第二表面311B。每個導電隔熱部320一體成形地位於容納區312內。墊體311介於任二容納區312之間的區域A1分別對齊任二電性接點110之間的區域A2。 In this embodiment, in detail, the thermal barrier layer component 300 includes an insulating pad 310 and a plurality of conductive heat insulating portions 320. Each insulating pad 310 is located between the test circuit board 100 and the test pedestal 200. The conductive heat insulating portion 320 is formed on the insulating pad 310 and directly sandwiched between one of the electrical contacts 110 and one of the probe pins 400 for thermally blocking the probe pin 400 and the electrical contact 110. More specifically, the insulating mat 310 includes a pad body 311 and a plurality of receiving areas 312. The pad body 311 has a first surface 311A and a second surface 311B opposite to each other, and the first surface 311A faces the test circuit board 100. The receiving areas 312 are formed in the pad body 311 at intervals, and each of the receiving areas 312 connects the first surface 311A and the second surface 311B of the pad body 311. Each of the electrically conductive insulating portions 320 is integrally formed within the receiving area 312. The area A1 of the pad body 311 between any two receiving areas 312 is respectively aligned with the area A2 between any two electrical contacts 110.
在本實施例中，在製成熱阻障層元件300時，首先將這些已成形之導電隔熱部320分別排列於一模具內，接著，於模具內填滿絕緣墊310之液態原料，待絕緣墊310固化成型後，開模後即可得到厚度相同或不同厚度的熱阻障層元件300，其中每個導電隔熱部320填滿於容納區312內，分別與墊體311之第一表面311A與第二表面311B齊平。 In the present embodiment, when the thermal barrier layer component 300 is formed, the formed conductive thermal insulation portions 320 are first arranged in a mold, and then the liquid material of the insulating mat 310 is filled in the mold. After the insulating mat 310 is solidified and formed, the thermal barrier layer elements 300 having the same thickness or different thicknesses can be obtained after the mold is opened, wherein each of the conductive heat insulating portions 320 is filled in the receiving area 312, and is respectively first with the mat body 311. The surface 311A is flush with the second surface 311B.
如第1圖與第2圖，檢測系統10更包含一分配手臂500(handler test arm)。分配手臂500用以移動不同之受驗元件800至測試基座200，並於測試完成後移除測試基座200上之受驗元件800。如此，當分配手臂500(handler test arm)將一受驗元件800放入凹槽210內，使得受驗元件800之多個端點810(如銲球solder ball)分別一一接觸這些探針銷400之上端部410，此時，受驗元件800之每個端點810便能夠透過對應位置之探針銷400與導電隔熱部320電性連接測試電路板100之其中一電性接點110。 As in Figures 1 and 2, the detection system 10 further includes a handler test arm 500. The dispensing arm 500 is configured to move a different test component 800 to the test pedestal 200 and remove the tested component 800 on the test pedestal 200 after testing is complete. Thus, when the hand test arm 800 places an expedited component 800 into the recess 210, the plurality of end points 810 of the component 800 (such as solder ball) are contacted one by one. The upper end portion 410 of the test device 800 is electrically connected to one of the electrical contacts 110 of the test circuit board 100 through the probe pin 400 and the conductive heat insulating portion 320 of the corresponding position. .
在測試期間，由於熱阻障層元件300受夾合於測試電路板100與測試基座200之間，熱阻障層元件300能夠熱阻隔這些探針銷400與測試電路板100，或者，至少能夠減緩探針銷400與電性接點110之間的熱傳遞，故，測試基座200(包含受驗元件800)之位置所受到之熱能不致迅速透過探針銷400散去。如此，不僅降低受驗元件800的試驗數據不夠精準的機會，也確保熱能不致傷害測試電路板100。 During the test, since the thermal barrier layer component 300 is sandwiched between the test circuit board 100 and the test pedestal 200, the thermal barrier layer component 300 can thermally block the probe pins 400 from the test circuit board 100, or at least The heat transfer between the probe pin 400 and the electrical contact 110 can be slowed down, so that the thermal energy received by the test susceptor 200 (including the component 800) is not quickly dissipated through the probe pin 400. In this way, not only is the opportunity for the test data of the component 800 to be less accurate, but also the thermal energy is not damaged to the test circuit board 100.
此外，檢測系統10更包含一加熱器600與一溫度感測器700。加熱器600位於分配手臂500上，用以對測試基座 200(包含受驗元件800)加熱至預設溫度，以控制測試基座200(包含受驗元件800)之位置之環境溫度。溫度感測器700位於分配手臂500或測試基座200(圖中未示)，用以感測受驗元件800的溫度。然而，若僅考慮測試電路板不致受到熱能傷害之目的，本發明不限必須具有加熱器與溫度感測器。 In addition, the detection system 10 further includes a heater 600 and a temperature sensor 700. The heater 600 is located on the dispensing arm 500 for the test base 200 (including the component 800 in question) is heated to a preset temperature to control the ambient temperature at the location of the test pedestal 200 (including the component 800 in question). Temperature sensor 700 is located in dispensing arm 500 or test pedestal 200 (not shown) for sensing the temperature of subject 800. However, the present invention is not necessarily limited to having a heater and a temperature sensor if only the test circuit board is not subjected to thermal energy damage.
第4圖繪示第1圖之熱阻障層元件300之上視圖。如第4圖所示，這些導電隔熱部320間隔地排列於絕緣墊310上，舉例來說，但不以此為限，這些導電隔熱部320以一矩陣方式排列於絕緣墊310上。然而，只要配合受驗元件800之端點810、探針銷400以及測試電路板100之電性接點110之排列方式，本發明不限於這些導電隔熱部320之排列方式。此外，絕緣墊310呈矩形，且這些導電隔熱部320呈圓形，且絕緣墊310之面積不大於測試基座200底面之面積，然而，本發明不限於絕緣墊310、導電隔熱部320之形狀以及絕緣墊310之面積。 4 is a top view of the thermal barrier layer element 300 of FIG. 1. As shown in FIG. 4, the conductive heat insulating portions 320 are spaced apart from each other on the insulating pad 310. For example, but not limited to, the conductive heat insulating portions 320 are arranged in a matrix on the insulating pad 310. However, the present invention is not limited to the arrangement of the conductive heat insulating portions 320 as long as the arrangement of the end points 810 of the test element 800, the probe pins 400, and the electrical contacts 110 of the test circuit board 100 is matched. In addition, the insulating pads 310 are rectangular, and the conductive heat insulating portions 320 are circular, and the area of the insulating pads 310 is not larger than the area of the bottom surface of the test pedestal 200. However, the present invention is not limited to the insulating pads 310 and the conductive heat insulating portion 320. The shape and the area of the insulating mat 310.
在本實施例中，導電隔熱部320之材料為奈米碳管氣凝膠，是為一種包含奈米碳管(carbon nano tube)之氣凝膠(Aerogel)。碳管氣凝膠是極輕又具有彈性的固體物質。因為其堅固的結構，使碳管氣凝膠可以支撐比其重量100倍以上的重量。碳管氣凝膠具有大量的孔洞(不大於100奈米)，其孔洞分布廣，具有良好的透氣性。此外，與其他氣凝膠不同的是，由於碳管氣凝膠之奈米碳管具有鏈結性，可電連接上述任一導電隔熱部兩側之導體，故，碳管氣凝膠可同時導電，也可以能阻絕熱量轉移，以提供良好的熱阻隔能力。 In the present embodiment, the material of the conductive heat insulating portion 320 is a carbon nanotube aerogel, which is an aerogel containing a carbon nano tube. Carbon tube aerogels are extremely light and elastic solid materials. Because of its strong structure, the carbon tube aerogel can support more than 100 times its weight. Carbon tube aerogel has a large number of holes (not more than 100 nm), and its pores are widely distributed and have good gas permeability. In addition, unlike other aerogels, carbon nanotube aerogels can be electrically connected to the conductors on either side of any of the above-mentioned conductive heat insulating portions because of the chain nature of the carbon nanotube aerogel. Conductive at the same time can also block heat transfer to provide good thermal barrier.
然而，本發明不限於此，只要能同時符合導電及 隔熱(或低導熱)特性，導電隔熱部之材料亦可以為奈米碳管矽膠，亦即一種具有包含奈米碳管之矽膠。 However, the present invention is not limited thereto as long as it can simultaneously conform to conduction and Insulation (or low thermal conductivity), the material of the conductive insulation can also be a carbon nanotube rubber, that is, a silicone having a carbon nanotube.
第5圖繪示本發明一實施例之檢測系統11的局部放大圖。如第5圖所示，第5圖之熱阻障層元件301大致相同第2圖之熱阻障層元件300，相同的部件沿用相同的符號。然而，第5圖之熱阻障層元件301與第2圖之熱阻障層元件300差別在於：至少一個或每個導電隔熱部320面向探針銷400之表面具有一凹陷槽321。凹陷槽321具有一弧形底面322，弧形底面322連接墊體311之第二表面311B。探針銷400伸入凹陷槽321內，且抵靠凹陷槽321之弧形底面322。由於弧形底面322具有一特定弧度，使得伸入之探針銷400不致輕易脫離導電隔熱部320之位置，以致定位於對應導電隔熱部320，進而維持電氣傳導之性能。 FIG. 5 is a partial enlarged view of the detecting system 11 according to an embodiment of the present invention. As shown in Fig. 5, the thermal barrier layer element 301 of Fig. 5 is substantially the same as the thermal barrier layer element 300 of Fig. 2, and the same components are denoted by the same reference numerals. However, the thermal barrier layer element 301 of FIG. 5 differs from the thermal barrier layer element 300 of FIG. 2 in that at least one or each of the electrically conductive thermally insulating portions 320 has a recessed groove 321 facing the surface of the probe pin 400. The recessed groove 321 has a curved bottom surface 322, and the curved bottom surface 322 is connected to the second surface 311B of the pad body 311. The probe pin 400 extends into the recessed groove 321 and abuts against the curved bottom surface 322 of the recessed groove 321 . Since the curved bottom surface 322 has a certain curvature, the protruding probe pin 400 is not easily separated from the position of the conductive heat insulating portion 320 so as to be positioned at the corresponding conductive heat insulating portion 320, thereby maintaining the electrical conduction performance.
第6圖繪示本發明一實施例之檢測系統12的局部放大圖。如第6圖所示，第6圖之熱阻障層元件302大致相同第2圖之熱阻障層元件300，相同的部件沿用相同的符號。然而，第6圖之熱阻障層元件302與第2圖之熱阻障層元件300差別在於：絕緣墊310包含一墊體311與多個貫孔313。墊體311具有相對配置之第一表面311A與第二表面311B，第一表面311A面向測試電路板100。這些貫孔313間隔地排列於墊體311上，且每個貫孔313連接墊體311之第一表面311A與第二表面311B。每個導電隔熱部320覆蓋第一表面311A及貫孔313，使得每個探針銷400伸入對應之貫孔313內並接觸對應之導電隔熱部320。由於探針銷400可有效地被限位於貫孔313內，使得 對應之探針銷400得以接觸對應導電隔熱部320，不致輕易脫離導電隔熱部320，進而維持電氣傳導之性能。 Figure 6 is a partial enlarged view of the detection system 12 in accordance with an embodiment of the present invention. As shown in Fig. 6, the thermal barrier layer element 302 of Fig. 6 is substantially the same as the thermal barrier layer element 300 of Fig. 2, and the same components are denoted by the same reference numerals. However, the thermal barrier layer element 302 of FIG. 6 differs from the thermal barrier layer element 300 of FIG. 2 in that the insulating pad 310 includes a pad body 311 and a plurality of through holes 313. The pad body 311 has a first surface 311A and a second surface 311B opposite to each other, and the first surface 311A faces the test circuit board 100. The through holes 313 are spaced apart from each other on the pad body 311, and each of the through holes 313 is connected to the first surface 311A and the second surface 311B of the pad body 311. Each of the conductive heat insulating portions 320 covers the first surface 311A and the through holes 313 such that each of the probe pins 400 protrudes into the corresponding through hole 313 and contacts the corresponding conductive heat insulating portion 320. Since the probe pin 400 can be effectively confined within the through hole 313, The corresponding probe pin 400 is brought into contact with the corresponding conductive heat insulating portion 320 so as not to be easily separated from the conductive heat insulating portion 320, thereby maintaining electrical conduction performance.
此外，本實施例中之至少一個或每個導電隔熱部320面向貫孔313之表面也可以具有第5圖所示之凹陷槽321，以降低探針銷400於對應之導電隔熱部320上滑動的機會。 In addition, at least one or each of the conductive heat insulating portions 320 in the embodiment may have a recessed groove 321 as shown in FIG. 5 to reduce the probe pin 400 to the corresponding conductive heat insulating portion 320. The chance to slide on.
第7圖繪示本發明一實施例之檢測系統13的側視示意圖。如第7圖所示，第7圖之檢測系統13大致相同第1圖之檢測系統10，相同的部件沿用相同的符號，其差別在於：第7圖之熱阻障層元件303並非如第1圖之熱阻障層元件300位於測試電路板100與測試基座200之間，而是熱阻障層元件303位於凹槽210之底面211，且覆蓋這些探針銷400，用以電性導接探針銷400與受驗元件800，且至少減緩探針銷400與受驗元件800之間的熱傳遞。 FIG. 7 is a side elevational view of the detection system 13 in accordance with an embodiment of the present invention. As shown in Fig. 7, the detecting system 13 of Fig. 7 is substantially the same as the detecting system 10 of Fig. 1, and the same components are denoted by the same reference numerals, and the difference is that the thermal barrier layer element 303 of Fig. 7 is not the first one. The thermal barrier layer component 300 is located between the test circuit board 100 and the test pedestal 200, but the thermal barrier layer component 303 is located on the bottom surface 211 of the recess 210 and covers the probe pins 400 for electrical conduction. The probe pin 400 is coupled to the subject element 800 and at least slows heat transfer between the probe pin 400 and the subject element 800.
如此，當一受驗元件800被放入凹槽210內時，熱阻障層元件303直接位於受驗元件800與這些探針銷400之間，使得每個導電隔熱部320直接位於受驗元件800之其中一端點810以及其中一探針銷400之間，亦即，每個導電隔熱部320接觸其中一探針銷400之上端部410以及受驗元件800之其中一端點810(如銲球solder ball)。此時，由於每個探針銷400之下端部420直接接觸測試電路板100之其中一電性接點110，受驗元件800之每個端點810便能夠透過對應位置之導電隔熱部320與探針銷400電性連接測試電路板100之電性接點110。 Thus, when a component 800 is placed in the recess 210, the thermal barrier layer 303 is directly between the component 800 and the probe pins 400 such that each conductive insulator 320 is directly positioned Between one of the end points 810 of the component 800 and one of the probe pins 400, that is, each of the conductive insulating portions 320 contacts one of the upper end portions 410 of the probe pin 400 and one of the end points 810 of the tested component 800 (eg, Solder ball). At this time, since the lower end portion 420 of each probe pin 400 directly contacts one of the electrical contacts 110 of the test circuit board 100, each end point 810 of the test component 800 can pass through the conductive heat insulating portion 320 of the corresponding position. The electrical contact 110 of the test circuit board 100 is electrically connected to the probe pin 400.
在測試期間，由於熱阻障層元件303受夾合於受驗 元件800與探針銷400之間，可有效地避免測試基座200(包含受驗元件800)所受到之熱能透過這些探針銷400迅速散去，不僅降低受驗元件800的試驗數據不夠精準的機會，也確保熱能不致傷害測試電路板100。 During the test, since the thermal barrier layer element 303 is clamped to the test Between the component 800 and the probe pin 400, the thermal energy received by the test pedestal 200 (including the component to be tested 800) can be effectively prevented from being quickly dissipated through the probe pins 400, and the test data of the component 800 is not reduced accurately. The opportunity also ensures that thermal energy does not harm the test board 100.
此外，在此實施方式中，檢測系統13也配置有合適的定位機制，使得熱阻障層元件303得以固定於凹槽210內，不致隨著檢測過程而被帶起或產生位移。所述定位機制例如透過夾合或黏合方式，將熱阻障層元件303得以固定於凹槽210之底面211。然而，本發明不限於此。 Moreover, in this embodiment, the detection system 13 is also configured with a suitable positioning mechanism such that the thermal barrier layer element 303 is secured within the recess 210 so as not to be brought up or displaced as the detection process. The positioning mechanism fixes the thermal barrier layer element 303 to the bottom surface 211 of the recess 210, for example, by means of clamping or bonding. However, the invention is not limited thereto.
須了解到，本發明具有通常知識者因應任何需求與限制也可以將第7圖之熱阻障層元件303改為第2圖、第5圖與第6圖之熱阻障層元件300~302。 It should be understood that the present invention has the general knowledge that the thermal barrier layer element 303 of FIG. 7 can be changed to the thermal barrier layer elements 300-302 of FIG. 2, FIG. 5 and FIG. 6 in response to any need and limitation. .
如此，藉由以上實施例所述之檢測系統，無論熱阻障層元件介於探針銷與電性接點之間，或者介於探針銷與受驗元件之間，測試基座以及受驗元件所受到之熱能都能被確保不致迅速朝測試電路板之方向散去，不僅降低受驗元件的高溫檢測之試驗數據受到影響的機會，也確保熱能不致傷害測試電路板。 Thus, with the detection system described in the above embodiments, whether the thermal barrier layer component is interposed between the probe pin and the electrical contact, or between the probe pin and the test component, the test pedestal and the The thermal energy received by the component can be ensured that it does not quickly dissipate in the direction of the test board, which not only reduces the chance of the test data of the high temperature detection of the component being affected, but also ensures that the thermal energy does not harm the test board.
最後，上述所揭露之各實施例中，並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，皆可被保護於本發明中。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Finally, the various embodiments disclosed above are not intended to limit the invention, and those skilled in the art can be protected in various modifications and refinements without departing from the spirit and scope of the invention. In the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
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| TWI639005B true TWI639005B (en) | 2018-10-21 |
| TW201913099A TW201913099A (en) | 2019-04-01 |
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| TW106129207A TWI639005B (en) | 2017-08-28 | 2017-08-28 | Testing system for semiconductor package component and its thermal barrier layer element |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110911300A (en) * | 2019-12-05 | 2020-03-24 | 白辉 | Semiconductor packaging structure detection system based on Internet of things |
| CN112845158A (en) * | 2019-11-27 | 2021-05-28 | 鸿劲精密股份有限公司 | Substrate temperature control unit of testing device and testing classification equipment applied by same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI738193B (en) * | 2020-01-22 | 2021-09-01 | 復格企業股份有限公司 | Inner testing method and apparatus of ic packages |
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| US6081110A (en) | 1998-09-30 | 2000-06-27 | Credence Systems Corporation | Thermal isolation plate for probe card |
| TW200844443A (en) | 2006-12-29 | 2008-11-16 | Formfactor Inc | Stiffener assembly for use with testing devices |
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| TW201428302A (en) | 2012-11-20 | 2014-07-16 | Formfactor Inc | Contactor devices with carbon nanotube probes embedded in a flexible film and processes of making such |
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| US6081110A (en) | 1998-09-30 | 2000-06-27 | Credence Systems Corporation | Thermal isolation plate for probe card |
| TW200844443A (en) | 2006-12-29 | 2008-11-16 | Formfactor Inc | Stiffener assembly for use with testing devices |
| TW200925612A (en) | 2007-09-28 | 2009-06-16 | Formfactor Inc | Apparatus for testing devices |
| TW201428302A (en) | 2012-11-20 | 2014-07-16 | Formfactor Inc | Contactor devices with carbon nanotube probes embedded in a flexible film and processes of making such |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112845158A (en) * | 2019-11-27 | 2021-05-28 | 鸿劲精密股份有限公司 | Substrate temperature control unit of testing device and testing classification equipment applied by same |
| CN112845158B (en) * | 2019-11-27 | 2023-11-17 | 鸿劲精密股份有限公司 | Substrate temperature control unit of testing device and testing classification equipment applied by same |
| CN110911300A (en) * | 2019-12-05 | 2020-03-24 | 白辉 | Semiconductor packaging structure detection system based on Internet of things |
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| Publication number | Publication date |
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| TW201913099A (en) | 2019-04-01 |
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