TWI632389B - Precise positioning method, positioning system and manipulator device - Google Patents
Precise positioning method, positioning system and manipulator device Download PDFInfo
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- TWI632389B TWI632389B TW106132798A TW106132798A TWI632389B TW I632389 B TWI632389 B TW I632389B TW 106132798 A TW106132798 A TW 106132798A TW 106132798 A TW106132798 A TW 106132798A TW I632389 B TWI632389 B TW I632389B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/02—Sensing devices
- B25J19/021—Optical sensing devices
- B25J19/022—Optical sensing devices using lasers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
- B25J9/1692—Calibration of manipulator
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Abstract
本發明係揭露一種精確定位方法、定位系統以及機械手裝置。精確定位方法包含如下步驟：將設置於操控對象上的雷射接收元件移動至一預設基準點位，預設基準點位位於第一平面內；由至少一固定設置的雷射發射元件向第一平面發出雷射；控制雷射接收元件在第一平面內接收雷射發射元件發出的雷射，並根據雷射接收元件接收到的雷射的位置確定雷射接收元件的平面坐標；根據雷射接收元件接收到的雷射發射元件發出的雷射光斑尺寸，計算雷射發射元件至第一平面的距離，確定雷射接收元件的空間坐標；根據空間坐標與雷射接收元件的預設坐標的差值，對操控對象進行校準定位。The invention discloses a precise positioning method, a positioning system and a robot device. The precise positioning method comprises the steps of: moving the laser receiving component disposed on the control object to a preset reference point, the preset reference point being located in the first plane; and at least one fixedly disposed laser emitting component to the first a plane emits a laser; the laser receiving element receives the laser emitted by the laser emitting element in a first plane, and determines a plane coordinate of the laser receiving element according to a position of the laser received by the laser receiving element; The size of the laser spot emitted by the laser emitting element received by the receiving component, calculating the distance of the laser emitting element to the first plane, determining the spatial coordinate of the laser receiving element; and the preset coordinates of the laser receiving element according to the spatial coordinate The difference is the calibration position of the manipulated object.
Description
本發明關於自動化控制技術領域，特別是關於一種精確定位的方法、實現該精確定位方法的定位系統以及具有該定位系統的機械手裝置。The invention relates to the technical field of automation control, in particular to a precise positioning method, a positioning system for realizing the precise positioning method, and a manipulator device having the positioning system.
在製造加工期間，機械臂與作業面會在實際使用過程中由於人為搬動或震動等原因而使其位置產生偏移。位置偏移對於機械臂的後續操作是非常不利的，例如引起製造加工中的缺陷或進而更糟地損壞產品或其他機械組件。During the manufacturing process, the position of the robot arm and the working surface may be shifted due to human movement or vibration during actual use. Positional deviations are very detrimental to the subsequent operation of the robotic arm, such as causing defects in the manufacturing process or further worsening the product or other mechanical components.
在已知的很多用於在製造加工期間對目標物體進行位置監控以及定位的技術目的是一般均為檢測機械組件中的位置偏移並進行位置的調整。然而，習知的這類技術往往需要的設備較多，計算較為繁瑣，因此，使其使用的效果不佳。Many of the known technical purposes for position monitoring and positioning of target objects during manufacturing processes are generally to detect positional offsets in mechanical components and perform position adjustments. However, the known technologies often require more equipment and more complicated calculations, so their use is not effective.
針對習知技術中的缺陷，本發明的目的是提供一種精確定位的方法、實現該精確定位方法的定位系統以及具有該定位系統的機械手裝置。該精確定位的方法可以對操控對象進行精準度的定位並且所需使用的設備較少、成本低廉、算法簡單明確、任意方向都可以定位、通用性強。Aiming at the defects in the conventional technology, the object of the present invention is to provide a precise positioning method, a positioning system implementing the precise positioning method, and a robot device having the positioning system. The precise positioning method can accurately locate the manipulation object, and requires less equipment, low cost, simple and clear algorithm, positioning in any direction, and strong versatility.
根據本發明的一個方面提供一種精確定位方法，精確定位方法包含下列步驟：將設置於操控對象上的雷射接收元件移動至一預設基準點位，預設基準點位位於第一平面內；由至少一固定設置的雷射發射元件向第一平面發出雷射；控制雷射接收元件在第一平面內接收雷射發射元件發出的雷射，並根據雷射接收元件接收到的雷射的位置確定雷射接收元件的平面坐標；根據雷射接收元件接收到的雷射發射元件發出的雷射光斑尺寸，計算雷射發射元件至第一平面的距離，確定雷射接收元件的空間坐標；根據空間坐標與雷射接收元件的預設坐標的差值，對操控對象進行校準定位。According to an aspect of the present invention, a precise positioning method is provided. The precise positioning method includes the following steps: moving a laser receiving element disposed on a control object to a preset reference point, and the preset reference point is located in a first plane; The at least one fixed laser emitting element emits a laser to the first plane; the laser receiving element is controlled to receive the laser emitted by the laser emitting element in the first plane, and according to the laser receiving element received by the laser receiving element The position determines the plane coordinates of the laser receiving element; calculates the distance from the laser emitting element to the first plane according to the laser spot size emitted by the laser emitting element received by the laser receiving element, and determines the space coordinates of the laser receiving element; According to the difference between the space coordinates and the preset coordinates of the laser receiving element, the control object is calibrated and positioned.
較佳地，在控制雷射接收元件接收雷射發射元件的雷射的步驟中更包含下列步驟：檢測雷射接收元件在預設基準點位是否接收到雷射發射元件發出的雷射；若檢測到雷射發射元件發出的雷射，則以預設基準點位確定雷射接收元件的平面坐標；若未檢測到雷射發射元件發出的雷射，則控制雷射接收元件以及控制對象在第一平面內移動，直至檢測到雷射發射元件發出的雷射，並確定雷射接收元件的平面坐標。Preferably, the step of controlling the laser receiving element to receive the laser of the laser emitting element further includes the following steps: detecting whether the laser receiving element receives the laser emitted by the laser emitting element at a preset reference point; if When the laser emitted by the laser emitting element is detected, the plane coordinates of the laser receiving element are determined by using a preset reference point; if the laser emitted by the laser emitting element is not detected, the laser receiving element and the control object are controlled at Move in the first plane until the laser emitted by the laser emitting element is detected, and determine the plane coordinates of the laser receiving element.
較佳地，雷射接收元件在第一平面內的移動路徑呈方波狀，在控制雷射接收元件在第一平面內移動的步驟中更包含下列步驟：由預設基準點位沿第一方向移動第一距離；若未檢測到雷射發射元件發出的雷射，則沿第二方向移動第二距離，其中，第二方向垂直第一方向；若未檢測到雷射發射元件發出的雷射，則沿與第一方向相反的方向移動第一距離；若未檢測到雷射發射元件發出的雷射，則沿第二方向移動第二距離；重複上述步驟直至檢測到雷射發射元件發出的雷射。Preferably, the movement path of the laser receiving element in the first plane is a square wave, and the step of controlling the movement of the laser receiving element in the first plane further includes the following steps: Move the first distance in the direction; if the laser emitted by the laser emitting element is not detected, move the second distance in the second direction, wherein the second direction is perpendicular to the first direction; if the laser emitted by the laser emitting element is not detected If the laser is not detected, then move the second distance in the second direction; repeat the above steps until the laser emitting element is detected. Laser.
較佳地，第二距離小於等於雷射發射元件的直徑。Preferably, the second distance is less than or equal to the diameter of the laser emitting element.
較佳地，雷射接收元件在第一平面內的移動路徑呈鋸齒狀或正弦波狀。Preferably, the movement path of the laser receiving element in the first plane is sawtooth-shaped or sine-wave-shaped.
較佳地，對操控對象進行校準定位的步驟包含下列步驟：根據空間坐標與雷射發射元件的預設坐標的差值，計算並替換預設基準點位以及雷射發射元件的坐標。Preferably, the step of calibrating and positioning the controlled object includes the following steps: calculating and replacing the preset reference point position and the coordinates of the laser emitting element according to the difference between the space coordinates and the preset coordinates of the laser emitting element.
較佳地，對操控對象進行校準定位的步驟包含下列步驟：根據空間坐標與雷射發射元件的預設坐標的差值，將雷射接收元件移動至其預設坐標。Preferably, the step of calibrating and positioning the manipulation object includes the following steps: moving the laser receiving element to its preset coordinate according to the difference between the space coordinate and the preset coordinate of the laser emitting element.
較佳地，由複數個固定設置的雷射發射元件向第一平面發出雷射，其中，在確定雷射接收元件的平面坐標的步驟中，依次控制雷射接收元件在第一平面內接收所有雷射發射元件發出的雷射，確定接收到各個雷射發射元件發出雷射的位置所對應的雷射接收元件的平面坐標。Preferably, the laser is emitted to the first plane by a plurality of laser emitting elements fixedly arranged, wherein in the step of determining the plane coordinates of the laser receiving element, the laser receiving element is controlled to sequentially receive all of the laser receiving elements in the first plane. The laser emitted by the laser emitting element determines the plane coordinates of the laser receiving element corresponding to the position where the laser emitting element of each laser emitting element was received.
較佳地，精確定位方法用於機械手裝置工作前的定位校準，其中，機械手裝置包含機械手以及第一平台，操控對象為機械手裝置的機械手，雷射接收元件設置於機械手上，雷射發射元件設置於第一平台上。Preferably, the precise positioning method is used for positioning and calibration of the manipulator device before working, wherein the manipulator device includes a manipulator and a first platform, the manipulating object is the manipulator of the manipulator device, and the laser receiving element is arranged on the manipulator. The laser emitting element is arranged on the first platform.
較佳地，雷射接收元件的預設基準點位所對應的機械手所在位置為機械手的工作初始位置。Preferably, the position of the manipulator corresponding to the preset reference point of the laser receiving element is an initial working position of the manipulator.
較佳地，由複數個固定設置的雷射發射元件向第一平面發出雷射，其中，複數個雷射發射元件設置於第一平台的同一側。Preferably, the laser is emitted to the first plane by a plurality of laser emitting elements fixedly arranged, wherein the plurality of laser emitting elements are disposed on the same side of the first platform.
根據本發明的另一個方面，還提供一種定位系統，定位裝置包含：至少一固定設置的雷射發射元件；一雷射接收元件，雷射接收元件設置於操控對象上，且雷射接收元件至少可相對雷射發射元件在第一平面內移動；以及控制檢測單元，控制雷射接收元件在第一平面內移動並計算雷射接收元件接收到雷射發射元件發出雷射時的空間坐標。According to another aspect of the present invention, a positioning system is further provided. The positioning device includes: at least one laser emitting element fixedly disposed; a laser receiving element, the laser receiving element is disposed on the control object, and the laser receiving element is at least It can move relative to the laser emitting element in the first plane; and control the detecting unit to control the laser receiving element to move in the first plane and calculate the space coordinates when the laser receiving element receives the laser emitted by the laser emitting element.
根據本發明的又一個方面，還提供一種機械手裝置，機械手裝置包含：機械手和第一平台，機械手在第一平台上進行工作；以及上述的定位系統，其中，雷射接收元件設置於機械手上，雷射發射元件設置於第一平台上。According to yet another aspect of the present invention, a manipulator device is also provided. The manipulator device includes: a manipulator and a first platform, the manipulator works on the first platform; and the above-mentioned positioning system, wherein the laser receiving element is provided On the manipulator, the laser emitting element is disposed on the first platform.
較佳地，機械手裝置還包含第二平台，機械手設置於第二平台上。Preferably, the manipulator device further includes a second platform, and the manipulator is disposed on the second platform.
相比於習知技術，本發明實施例提供的精確定位方法和定位系統藉由控制設置於操控對象上的雷射接收元件在第一平面內接收雷射發射元件發出的雷射，確定雷射接收元件的平面坐標以及空間坐標，並且根據該空間坐標與雷射接收元件的預設坐標的差值，對操控對象進行校準定位的方式來對操控對象進行精準度的定位，當本發明的機械手裝置應用該定位系統時可以避免機械手因人為搬動，震動產生偏移而引起的操作錯誤等問題。並且該精確定位方法還具有所需使用的設備較少、成本低廉、算法簡單明確、任意方向都可以定位、通用性強等優點。Compared with the conventional technology, the precise positioning method and positioning system provided by the embodiments of the present invention determine the laser by controlling the laser receiving element disposed on the control object to receive the laser emitted by the laser emitting element in the first plane. The plane coordinates and space coordinates of the receiving element, and according to the difference between the space coordinates and the preset coordinates of the laser receiving element, the controlled object is calibrated and positioned to accurately position the controlled object. When the machine of the present invention When the positioning system is applied to a hand device, problems such as operation errors caused by manual movement of the manipulator and displacement due to vibration can be avoided. In addition, the precise positioning method has the advantages of less equipment required, low cost, simple and clear algorithm, positioning in any direction, and strong versatility.
現在將參考圖式更全面地描述示例實施方式。然而，示例實施方式能夠以多種形式實施，且不應被理解為限於在此闡述的實施方式；相反，提供這些實施方式使得本發明將全面和完整，並將示例實施方式的構思全面地傳達給本發明所屬領域的技術人員。在圖中相同的元件標號表示相同或類似的結構，因而將省略對它們的重複描述。Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be comprehensive and complete, and the concept of the example embodiments will be fully conveyed to Those skilled in the art to which this invention belongs. The same reference numerals in the drawings denote the same or similar structures, and their repeated description will be omitted.
所描述的特徵、結構或特性可以以任何合適的方式結合在一個或更多實施方式中。在下面的描述中，提供許多具體細節從而給出對本發明的實施方式的充分理解。然而，本發明所屬領域的技術人員應意識到，沒有特定細節中的一個或更多，或者採用其它的方法、組元、材料等，也可以實踐本發明的技術方案。在某些情況下，不詳細表示或描述習知結構、材料或者操作以避免模糊本發明。The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of the embodiments of the present invention. However, those skilled in the art to which the present invention pertains should realize that the technical solution of the present invention can also be practiced without one or more of the specific details, or by using other methods, components, materials, and the like. In some cases, well-known structures, materials, or operations have not been shown or described in detail to avoid obscuring the invention.
下面結合圖式和實施例對本發明的技術內容進行進一步地說明。The technical content of the present invention is further described below with reference to the drawings and embodiments.
請參見圖1，其表示了本發明的一種精確定位方法的流程圖。需要說明的是，本發明的精確定位方法可以應用於機械手裝置工作前的定位校準中。因此，本發明的實施例中以機械手裝置的定位校準為例進行說明，但並不以此為限，該控制方法同樣可以應用於其他自動化設備的定位技術中。如圖1所示，在本發明的實施例中，該精確定位方法包含下列步驟：Please refer to FIG. 1, which shows a flowchart of a precise positioning method according to the present invention. It should be noted that the precise positioning method of the present invention can be applied to positioning and calibration before the manipulator device works. Therefore, in the embodiment of the present invention, the positioning and calibration of the manipulator device is taken as an example for description, but it is not limited thereto, and the control method can also be applied to the positioning technology of other automated equipment. As shown in FIG. 1, in the embodiment of the present invention, the precise positioning method includes the following steps:
步驟S10：將設置於操控對象上的雷射接收元件移動至一預設基準點位，預設基準點位位於第一平面內。由至少一固定設置的雷射發射元件向第一平面發出雷射。Step S10: Move the laser receiving element set on the control object to a preset reference point, and the preset reference point is located in the first plane. A laser is emitted to the first plane by at least one laser emitting element fixedly arranged.
具體來說，請一併參見圖2至圖4，其分別表示了本發明的一種機械手裝置的結構示意圖、仰視圖以及該機械手裝置的機械手的結構示意圖。如圖2所示，該機械手裝置包含機械手3和第一平台1。其中，機械手3在第一平台1上進行工作。該機械手裝置還包含定位系統，該定位系統包含至少一固定設置的雷射發射元件51以及一雷射接收元件52。雷射接收元件52設置於操控對象上，且至少可相對雷射發射元件51在第一平面內移動。為了增加定位的精確度，在本發明的可選實施例中，定位系統包含複數個雷射發射元件，藉由雷射接收元件52接收複數個雷射發射元件51發出的雷射來加強定位的精確度。在圖2所示的實施例中，該定位系統包含兩個雷射發射元件51。兩個雷射發射元件51設置於第一平台1上，且兩個雷射發射均沿豎直方向（圖2中Z軸所示方向）發射雷射。雷射接收元件52設置於機械手3上，用於接收來自雷射發射元件51發出的雷射。由於機械手3在工作的過程中可進行移動，因此，設置於機械手3上的雷射接收元件52可隨機械手3同步進行移動。進一步地，結合上述圖2、圖3以及步驟S10，即為將設置於機械手3上的雷射接收元件52隨同機械手3移動至一預設基準點位。其中，該雷射接收元件的預設基準點位所對應的機械手3所在位置為可以是機械手3的工作初始位置。該預設基準點位位於第一平面內，在本發明的可選實施例中，第一平面為水平面，即圖2中X軸和Y軸為限定的平面。固定設置於第一平台1上的雷射發射元件51沿豎直方向（即Z軸所示方向）向第一平面發出雷射。Specifically, please refer to FIG. 2 to FIG. 4 together, which respectively show a schematic structural diagram, a bottom view, and a schematic structural diagram of a manipulator of the manipulator device of the present invention. As shown in FIG. 2, the robot device includes a robot 3 and a first platform 1. Among them, the robot arm 3 works on the first platform 1. The robotic device further includes a positioning system. The positioning system includes at least one laser emitting element 51 and a laser receiving element 52 that are fixedly disposed. The laser receiving element 52 is disposed on the control object, and is at least movable relative to the laser emitting element 51 in a first plane. In order to increase the positioning accuracy, in an alternative embodiment of the present invention, the positioning system includes a plurality of laser emitting elements, and the laser receiving element 52 receives the lasers emitted by the plurality of laser emitting elements 51 to enhance the positioning. Accuracy. In the embodiment shown in FIG. 2, the positioning system includes two laser emitting elements 51. Two laser emitting elements 51 are disposed on the first platform 1, and both laser emittings emit lasers in a vertical direction (the direction shown by the Z axis in FIG. 2). The laser receiving element 52 is provided on the robot arm 3 for receiving a laser emitted from the laser emitting element 51. Since the robot hand 3 can move during the work, the laser receiving element 52 provided on the robot hand 3 can move synchronously with the robot hand 3. Further, in combination with the above-mentioned FIG. 2, FIG. 3, and step S10, the laser receiving element 52 provided on the robot arm 3 is moved to a preset reference point position along with the robot arm 3. Wherein, the position of the robot 3 corresponding to the preset reference point of the laser receiving element may be the initial working position of the robot 3. The preset reference point is located in a first plane. In an optional embodiment of the present invention, the first plane is a horizontal plane, that is, the X-axis and the Y-axis in FIG. 2 are defined planes. The laser emitting element 51 fixedly disposed on the first platform 1 emits a laser in a vertical direction (that is, a direction indicated by the Z axis) toward the first plane.
步驟S20：控制所述雷射接收元件在第一平面內接收雷射發射元件發出的雷射，並根據雷射接收元件接收到的雷射的位置確定雷射接收元件的平面坐標。結合上述圖2和圖3，具體來說，控制雷射接收元件52在第一平面（水平面）內接收雷射發射元件51向第一平面發出的雷射。根據雷射接收元件52接收到的雷射的位置確定雷射接收元件52在第一平面內的平面坐標。需要說明的是，在本發明中，根據雷射發射元件與雷射接收元件之間的位置關係，該定位系統具有一套定義雷射發射元件與雷射接收元件之間的位置的坐標系。例如在圖2和圖3所示的實施例中所示的X軸、Y軸和Z軸定義的空間坐標系，該坐標系中的單位可以根據實際的需要進行調整，雷射接收元件在第一平面內的平面坐標即為X軸和Y軸的坐標。Step S20: controlling the laser receiving element to receive the laser emitted by the laser transmitting element in the first plane, and determining the plane coordinates of the laser receiving element according to the position of the laser received by the laser receiving element. With reference to FIG. 2 and FIG. 3 described above, specifically, the laser receiving element 52 is controlled to receive the laser emitted by the laser emitting element 51 toward the first plane in the first plane (horizontal plane). The plane coordinates of the laser receiving element 52 in the first plane are determined according to the position of the laser received by the laser receiving element 52. It should be noted that, in the present invention, according to the positional relationship between the laser emitting element and the laser receiving element, the positioning system has a coordinate system that defines the position between the laser emitting element and the laser receiving element. For example, the spatial coordinate system defined by the X-axis, Y-axis, and Z-axis shown in the embodiments shown in FIG. 2 and FIG. 3, and the units in the coordinate system can be adjusted according to actual needs. The plane coordinates in a plane are the coordinates of the X axis and the Y axis.
進一步地，請參見圖5，其表示了在控制雷射接收元件接收雷射發射元件的雷射的各個步驟的流程圖。如圖5所示，在控制雷射接收元件接收雷射發射元件發出的雷射的步驟中還包含如下步驟：Further, please refer to FIG. 5, which shows a flowchart of each step of controlling the laser receiving element to receive the laser of the laser transmitting element. As shown in FIG. 5, the step of controlling the laser receiving element to receive the laser emitted by the laser transmitting element further includes the following steps:
步驟S201：檢測雷射接收元件在預設基準點位是否接收到雷射發射元件發出的雷射。具體來說，由於在上述步驟S10中，雷射接收元件被移動至預設基準點位，因此，首先檢測在該位置下，雷射接收元件52是否接收到雷射發射元件發出的雷射。若在此步驟中，檢測到雷射發射元件發出的雷射，執行步驟S203：以當前位置（在此情況下即為該預設基準點位）確定雷射接收元件在第一平面（水平面）內的平面坐標。若步驟S201中若未檢測到雷射發射元件發出的雷射，則執行步驟S202：控制雷射接收元件以及控制對象（圖2和圖3的機械手）在第一平面（水平面）內移動，直至檢測到雷射發射元件發出的雷射，並繼續執行步驟S203，即以當前位置（在此情況下即為雷射發射元件接收到雷射發射元件的位置）確定雷射接收元件在第一平面內的平面坐標。Step S201: It is detected whether the laser receiving element receives a laser emitted by the laser transmitting element at a preset reference point. Specifically, since the laser receiving element is moved to a preset reference point in the above step S10, it is first detected whether the laser receiving element 52 receives the laser emitted by the laser transmitting element at this position. If the laser emitted by the laser emitting element is detected in this step, step S203 is performed: the current position (in this case, the preset reference point) is used to determine that the laser receiving element is on the first plane (horizontal plane) In-plane coordinates. If the laser emitted by the laser emitting element is not detected in step S201, then step S202 is performed: controlling the laser receiving element and the control object (the manipulator of Figs. 2 and 3) to move in the first plane (horizontal plane), Until the laser emitted by the laser transmitting element is detected, and step S203 is continued, that is, the current position (in this case, the position where the laser transmitting element receives the laser transmitting element) is determined to determine whether the laser receiving element is at the first position. Plane coordinates in the plane.
進一步地，請一併參見圖6和圖7，其分別表示了本發明的一種精確定位方法在控制雷射接收元件在第一平面內移動的各個步驟的流程圖以及移動過程中的雷射接收元件的移動軌跡圖。在圖6所示的實施例中，雷射接收元件的移動軌跡呈方波狀，在控制雷射接收元件在第一平面內移動的步驟（即上述圖5所示的步驟S202）中還包含如下步驟；Further, please refer to FIG. 6 and FIG. 7 together, which respectively show a flowchart of each step of controlling the movement of the laser receiving element in the first plane by a precise positioning method of the present invention, and the laser receiving during the movement process. Diagram of the movement of the component. In the embodiment shown in FIG. 6, the movement trajectory of the laser receiving element is in a square wave shape. The step of controlling the movement of the laser receiving element in the first plane (that is, step S202 shown in FIG. 5 above) further includes The following steps;
步驟S2021：由預設基準點位沿第一方向移動第一距離。如圖7所示，附圖標記A所在位置為雷射接收元件52的預設基準點。第一方向為與圖7中X軸所示方向相反的方向，雷射接收元件移動的第一距離為D1。若在上述移動的過程中檢測到雷射接收元件發出的雷射，則以執行上述圖5中的步驟S203，即以當前位置確定雷射接收元件在第一平面內的平面坐標。Step S2021: Move the first reference point along the first direction for a first distance. As shown in FIG. 7, the position of reference numeral A is a preset reference point of the laser receiving element 52. The first direction is a direction opposite to the direction shown by the X axis in FIG. 7, and the first distance the laser receiving element moves is D1. If the laser emitted by the laser receiving element is detected during the above movement, step S203 in FIG. 5 described above is performed, that is, the plane coordinates of the laser receiving element in the first plane are determined by the current position.
步驟S2022：若在上述步驟S2021中未檢測到雷射發射元件發出的雷射，則沿第二方向移動第二距離。如圖7所示，第二方向為與圖7中Y軸所示方向，第二方向（Y軸方向）垂直與第一方向（X軸方向）雷射接收元件移動的第二距離為D2。其中，為了加強檢測的精確度、避免在沿第二方向移動的過程中移動的距離太大而越過雷射，因此，較佳地，第二距離D2小於等於雷射發射元件51的直徑。進一步類似地，若在上述移動的過程中檢測到雷射接收元件發出的雷射，則以執行上述圖5中的步驟S203，即以當前位置確定雷射接收元件在第一平面內的平面坐標。Step S2022: if the laser emitted by the laser emitting element is not detected in the above step S2021, the second distance is moved in the second direction. As shown in FIG. 7, the second direction is the direction shown by the Y-axis in FIG. 7, and the second distance perpendicular to the second direction (Y-axis direction) and the first direction (X-axis direction) by which the laser receiving element moves is D2. Among them, in order to enhance the accuracy of the detection and avoid the distance moved during the movement in the second direction is too large to cross the laser, it is preferable that the second distance D2 is less than or equal to the diameter of the laser emitting element 51. Further similarly, if the laser emitted by the laser receiving element is detected during the above-mentioned movement, step S203 in FIG. 5 described above is performed, that is, the plane coordinates of the laser receiving element in the first plane are determined by the current position. .
步驟S2023：若在上述步驟S2022中未檢測到雷射發射元件發出的雷射，則沿與第一方向相反的方向移動第一距離。如圖7所示，與第一方向相反的方向即為圖7中X軸所示的方向，在此步驟中即為沿著與步驟S2021中相反的方向移動相同的距離。類似地，若在上述移動的過程中檢測到雷射接收元件發出的雷射，則以執行上述圖5中的步驟S203，即以當前位置確定雷射接收元件在第一平面內的平面坐標。Step S2023: if the laser emitted by the laser emitting element is not detected in the above step S2022, the first distance is moved in a direction opposite to the first direction. As shown in FIG. 7, the direction opposite to the first direction is the direction shown by the X axis in FIG. 7, and in this step, it is moved by the same distance in the opposite direction from step S2021. Similarly, if the laser emitted by the laser receiving element is detected during the above-mentioned movement, step S203 in FIG. 5 described above is performed, that is, the plane coordinates of the laser receiving element in the first plane are determined by the current position.
步驟S2024：若在上述步驟S2023中未檢測到雷射發射元件發出的雷射，則沿第二方向移動第二距離。該步驟可理解為重複上述步驟S2022，在此不予贅述。Step S2024: if the laser emitted by the laser emitting element is not detected in the above step S2023, the second distance is moved in the second direction. This step can be understood as repeating the above step S2022, which is not repeated here.
步驟S2025：若在上述步驟S2024中仍未檢測到雷射發射元件發出的雷射，則重複上述步驟S2021至步驟S2024，直至檢測到所雷射發射元件發出的雷射。Step S2025: If the laser emitted by the laser emitting element has not been detected in the above step S2024, the above steps S2021 to S2024 are repeated until the laser emitted by the laser emitting element is detected.
由圖7所示，雷射接收元件52的整個移動的軌跡呈一方波圖形，該檢測的方法可即為便捷且精確的檢測到雷射發射元件發出的雷射。需要說明的是，雖然上述實施例中僅以雷射接收元件的移動軌跡呈方波狀的實現方式為例，但並不限於此，在本發明的其他實施例中，雷射接收元件的移動軌跡也可以根據實際的需要進行變化，例如，雷射接收元件在第一平面內的移動路徑可以呈鋸齒狀或正弦波狀，這些實施例同樣可以實現類似的效果，在此不予贅述。As shown in FIG. 7, the entire movement trajectory of the laser receiving element 52 is a square wave pattern, and the detection method can be convenient and accurate detection of the laser emitted by the laser emitting element. It should be noted that, although the above embodiment only takes the implementation manner in which the movement track of the laser receiving element is in a square wave shape as an example, it is not limited to this. In other embodiments of the present invention, the movement of the laser receiving element The trajectory may also be changed according to actual needs. For example, the movement path of the laser receiving element in the first plane may be sawtooth-like or sine-wave-like. These embodiments can also achieve similar effects, and will not be repeated here.
步驟S30：根據所述雷射接收元件接收到的所述雷射發射元件發出的雷射光斑尺寸，計算所述雷射發射元件至所述第一平面的距離，確定所述雷射接收元件的空間坐標。請參見圖8，其示出了本發明的一種精確定位方法計算雷射發射元件至所述第一平面的距離的原理圖。具體來說，由於雷射發射元件51沿豎直方向發出的雷射會根據其距離在不同的平面上形成不同大小的光斑，如圖8所示，雷射發射元件51在距離較近的平面P2上形成的光斑的面積S2小於其在距離較遠的平面P1上形成的光斑的光斑的面積S1，因此，可以根據雷射接收元件接收到的雷射的光斑尺寸，計算雷射發射元件至雷射接收元件所在的第一平面的距離。進而，根據步驟S20中獲取的平面坐標以及該距離確定雷射接收元件的空間坐標。Step S30: Calculate the distance from the laser emitting element to the first plane according to the laser spot size emitted by the laser emitting element received by the laser receiving element, and determine the distance of the laser receiving element. Space coordinates. Please refer to FIG. 8, which illustrates a principle diagram of calculating a distance from a laser emitting element to the first plane by an accurate positioning method according to the present invention. Specifically, since the laser emitted by the laser emitting element 51 in the vertical direction will form different sizes of light spots on different planes according to its distance, as shown in FIG. 8, the laser emitting element 51 is on a plane with a short distance. The area S2 of the light spot formed on P2 is smaller than the area S1 of the light spot formed on the far plane P1. Therefore, the laser emitting element can be calculated based on the spot size of the laser received by the laser receiving element. The distance of the first plane on which the laser receiving element is located. Furthermore, the spatial coordinates of the laser receiving element are determined based on the plane coordinates obtained in step S20 and the distance.
步驟S40：根據所述空間坐標與所述雷射接收元件的預設坐標的差值，對所述操控對象進行校準定位。在本發明的一個實施例中，對操控對象進行校準定位的步驟包含如下步驟：根據步驟S30中獲取的空間坐標與雷射發射元件的預設坐標的差值，計算並替換預設基準點位以及雷射發射元件的坐標。Step S40: Calibrate and position the manipulation object according to a difference between the spatial coordinate and a preset coordinate of the laser receiving element. In an embodiment of the present invention, the step of calibrating and positioning the controlled object includes the following steps: Calculating and replacing the preset reference point according to the difference between the spatial coordinates obtained in step S30 and the preset coordinates of the laser emitting element. And the coordinates of the laser emitting element.
具體來說，在本發明中，根據實際的需求，雷射接收元件可以具有預設坐標，例如，雷射接收元件接收到雷射發射元件時的空間坐標或者雷射接收元件位於預設基準點位時的空間坐標等。在此步驟中，將上述步驟S30中獲取的雷射接收元件實際接收到雷射發射元件發出的雷射的空間坐標與預設的雷射接收元件接收到雷射發射元件時的空間坐標進行比較，並且計算比較後的差值，將預設的所有坐標根據差值均進行替換，例如預設基準點位的坐標、或者機械手工作過程中的各個坐標等，以此實現機械手的精確定位。Specifically, in the present invention, according to actual needs, the laser receiving element may have preset coordinates, for example, the spatial coordinates when the laser receiving element receives the laser transmitting element or the laser receiving element is located at a preset reference point. The spatial coordinates of the time. In this step, the spatial coordinates of the laser actually received by the laser receiving element obtained in step S30 from the laser transmitting element are compared with the preset spatial coordinates when the laser receiving element receives the laser transmitting element. , And calculate the difference after comparison, and replace all preset coordinates according to the difference, such as the coordinates of the preset reference point or the coordinates of the manipulator during the work, so as to achieve the precise positioning of the manipulator .
進一步地，在本發明的另一些實施例中，根據上述步驟S30中獲取的雷射接收元件實際接收到雷射發射元件發出的雷射的空間坐標與預設的雷射接收元件接收到雷射發射元件時的空間坐標比較後的差值，也可以將雷射接收元件移動至其預設坐標，即將機械手復位，進而實現機械手的精確定位。Further, in other embodiments of the present invention, according to the laser receiving element obtained in step S30, the spatial coordinates of the laser actually emitted by the laser emitting element and the preset laser receiving element receiving the laser are received. The difference between the spatial coordinates of the transmitting element and the laser receiving element can also be moved to its preset coordinates, that is, the manipulator will be reset, thereby realizing the precise positioning of the manipulator.
進一步地，本發明的可選實施例中，定位系統包含複數個雷射發射元件，藉由雷射接收元件接收複數個雷射發射元件發出的雷射來加強定位的精確度（圖2和圖3中為兩個雷射發射元件），在圖2和圖3所示的可選實施例中，複數個雷射發射元件設置於第一平台的同一側。進而，在上述接收上述雷射的過程中，是依次控制雷射接收元件在第一平面內接收所有雷射發射元件發出的雷射，確定接收到各個雷射發射元件發出雷射的所述雷射接收元件的平面坐標以及空間坐標，在此不予贅述。Further, in an alternative embodiment of the present invention, the positioning system includes a plurality of laser emitting elements, and the positioning accuracy is enhanced by the laser receiving element receiving lasers emitted by the plurality of laser emitting elements (Fig. 2 and Fig. 2). 3 are two laser emitting elements), in the alternative embodiments shown in FIG. 2 and FIG. 3, a plurality of laser emitting elements are disposed on the same side of the first platform. Further, in the process of receiving the laser, the laser receiving element is sequentially controlled to receive the lasers emitted by all the laser transmitting elements in the first plane, and it is determined that the lasers receiving the lasers emitted by the respective laser transmitting elements are received. The plane coordinates and space coordinates of the transmitting and receiving elements will not be repeated here.
結合上述圖1至圖8所示實施例，本發明的精確定位方法藉由控制設置於操控對象上的雷射接收元件在第一平面內接收雷射發射元件發出的雷射，確定雷射接收元件的平面坐標以及空間坐標，並且根據該空間坐標與雷射接收元件的預設坐標的差值，對操控對象進行校準定位的方式來對操控對象進行精準度的定位，當應用於機械手裝置中時可以避免機械手因人為搬動，震動產生偏移而引起的操作錯誤等問題。並且該精確定位方法還具有所需使用的設備較少、成本低廉、算法簡單明確、任意方向都可以定位、通用性強等優點。With reference to the embodiments shown in FIG. 1 to FIG. 8 described above, the precise positioning method of the present invention determines the laser receiving by controlling the laser receiving element disposed on the control object to receive the laser emitted by the laser transmitting element in the first plane. The plane coordinates and space coordinates of the component, and the positioning of the manipulation object based on the difference between the space coordinate and the preset coordinates of the laser receiving element, to accurately locate the manipulation object. When applied to a robot device In the middle time, it can avoid the manipulator's operation error caused by manual movement and vibration. In addition, the precise positioning method has the advantages of less equipment required, low cost, simple and clear algorithm, positioning in any direction, and strong versatility.
進一步地，本發明還提供一種定位系統。結合上述圖2和圖3所示，所述定位裝置包含至少一固定設置的雷射發射元件51（圖2和圖3中為兩個雷射發射元件）以及一雷射接收元件52。其中，雷射接收元件設置於操控對象（例如機械手3）上，且雷射接收元件52至少可相對雷射發射元件51在第一平面內移動。該定位系統還包含控制檢測單元（圖中未繪示）。控制檢測單元控制雷射接收元件在第一平面內移動並計算雷射接收元件接收到雷射發射元件發出雷射時的空間坐標。該定位系統結合上述的精確定位方法可以有效地對操控對象進行精確定位，並且該定位系統具有設備較少、成本低廉、算法簡單明確、任意方向都可以定位、通用性強等優點。Further, the present invention also provides a positioning system. With reference to FIG. 2 and FIG. 3 described above, the positioning device includes at least one laser emitting element 51 (two laser emitting elements in FIG. 2 and FIG. 3) and a laser receiving element 52. The laser receiving element is disposed on a control object (such as the robot arm 3), and the laser receiving element 52 is at least movable relative to the laser emitting element 51 in a first plane. The positioning system also includes a control and detection unit (not shown in the figure). The control and detection unit controls the laser receiving element to move in the first plane and calculates the space coordinates when the laser receiving element receives the laser emitted by the laser emitting element. The positioning system combined with the above-mentioned precise positioning method can effectively perform precise positioning on a controlled object, and the positioning system has the advantages of less equipment, low cost, simple and clear algorithm, positioning in any direction, and strong versatility.
進一步地，本發明還提供一種機械手裝置。結合上述圖2和圖3所示，所述機械手裝置包含機械手3和第一平台1。機械手3在第一平台上進行工作。並且，該機械手裝置還包含上述的定位系統。其中，定位系統的雷射接收元件52設置於機械手3上。雷射發射元件51設置於第一平台1上。進一步地，在圖2和圖3所示的較佳實施例中，所述機械手裝置還包含第二平台2。機械手3設置於第二平台2上。由於該機械手裝置使用上述的定位系統以及精確定位方法後，可以避免機械手因人為搬動，震動產生偏移而引起的操作錯誤等問題。並且由於所需使用的設備較少，因此實現精確定位的成本也較為低廉。Further, the present invention also provides a manipulator device. With reference to FIG. 2 and FIG. 3 described above, the manipulator device includes a manipulator 3 and a first platform 1. The robot arm 3 works on the first platform. In addition, the robot device further includes the above-mentioned positioning system. The laser receiving element 52 of the positioning system is disposed on the robot arm 3. The laser emitting element 51 is disposed on the first platform 1. Further, in the preferred embodiments shown in FIG. 2 and FIG. 3, the robot device further includes a second platform 2. The robot arm 3 is disposed on the second platform 2. Because the manipulator device uses the above-mentioned positioning system and precise positioning method, problems such as operation errors caused by the manipulator's manual movement and displacement due to vibration can be avoided. And because less equipment is needed, the cost of accurate positioning is also relatively low.
綜上所述，本發明實施例提供的精確定位方法和定位系統藉由控制設置於操控對象上的雷射接收元件在第一平面內接收雷射發射元件發出的雷射，確定雷射接收元件的平面坐標以及空間坐標，並且根據該空間坐標與雷射接收元件的預設坐標的差值，對操控對象進行校準定位的方式來對操控對象進行精準度的定位，當本發明的機械手裝置應用該定位系統時可以避免機械手因人為搬動，震動產生偏移而引起的操作錯誤等問題。並且該精確定位方法還具有所需使用的設備較少、成本低廉、算法簡單明確、任意方向都可以定位、通用性強等優點。In summary, the precise positioning method and positioning system provided by the embodiments of the present invention determine the laser receiving element by controlling the laser receiving element disposed on the control object to receive the laser emitted by the laser transmitting element in the first plane. Plane coordinate and space coordinate, and according to the difference between the space coordinate and the preset coordinates of the laser receiving element, the control object is calibrated and positioned to accurately position the control object. When the manipulator device of the present invention When the positioning system is applied, problems such as operation errors caused by manual movement of the manipulator and displacement due to vibration can be avoided. In addition, the precise positioning method has the advantages of less equipment required, low cost, simple and clear algorithm, positioning in any direction, and strong versatility.
雖然本發明已以可選實施例揭示如上，然而其並非用以限定本發明。本發明所屬技術領域具有通常知識者，在不脫離本發明的精神和範圍內，當可作各種的更動與修改。因此，本發明的保護範圍當視申請專利範圍所界定的範圍為準。Although the invention has been disclosed as above with alternative embodiments, it is not intended to limit the invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the scope of patent application.
1‧‧‧第一平台
2‧‧‧第二平台
3‧‧‧機械手
51‧‧‧雷射發射元件
52‧‧‧雷射接收元件
D1‧‧‧第一距離
D2‧‧‧第二距離
P1、P2‧‧‧平面
S1、S2‧‧‧面積
S10~S40、S201~S203、S2021~S2025‧‧‧步驟1‧‧‧First Platform
2‧‧‧Second Platform
3‧‧‧ manipulator
51‧‧‧laser emitting element
52‧‧‧Laser receiving element
D1‧‧‧First distance
D2‧‧‧Second Distance
P1, P2‧‧‧ plane
S1, S2‧‧‧ Area
S10 ~ S40, S201 ~ S203, S2021 ~ S2025‧‧‧ steps
藉由閱讀參照以下圖式對非限制性實施例所作的詳細描述，本發明的其它特徵、目的和優點將會變得更明顯： 圖1為本發明的一種精確定位方法的流程圖； 圖2為本發明的一種機械手裝置的結構示意圖； 圖3為本發明的一種機械手裝置的仰視圖； 圖4為本發明一種機械手裝置的機械手的結構示意圖； 圖5為本發明一種精確定位方法在控制雷射接收元件接收雷射發射元件的雷射的各個步驟的流程圖； 圖6為本發明的一種精確定位方法在控制雷射接收元件在第一平面內移動的各個步驟的流程圖； 圖7為本發明一種精確定位方法中雷射接收元件的移動軌跡圖；以及 圖8為本發明的一種精確定位方法計算雷射發射元件至第一平面的距離的原理圖。Other features, objects, and advantages of the present invention will become more apparent by reading the detailed description of the non-limiting embodiments with reference to the following drawings: FIG. 1 is a flowchart of an accurate positioning method of the present invention; FIG. 2 FIG. 3 is a bottom view of a manipulator device according to the invention; FIG. 4 is a schematic view of a manipulator device of a manipulator device according to the invention; FIG. 5 is a precise positioning method according to the invention; The flowchart of the steps of the method in controlling the laser receiving element to receive the laser of the laser emitting element; FIG. 6 is the flowchart of the steps of controlling the movement of the laser receiving element in the first plane by an accurate positioning method of the present invention FIG. 7 is a diagram of the movement trajectory of the laser receiving element in an accurate positioning method of the present invention; and FIG. 8 is a principle diagram of calculating the distance between the laser emitting element and the first plane by an accurate positioning method of the present invention.
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| CN112256007A (en) * | 2019-07-03 | 2021-01-22 | 东元电机股份有限公司 | Auxiliary positioning system for reflective sticker |
| CN110802608A (en) * | 2019-10-29 | 2020-02-18 | 许昌许继软件技术有限公司 | Live working robot and positioning method of high-voltage cable |
| CN111498495B (en) * | 2020-05-06 | 2021-09-24 | 珠海格力智能装备有限公司 | Object placing method and device, storage medium and processor |
| CN112757261B (en) * | 2021-01-11 | 2022-05-10 | 珠海格力电器股份有限公司 | Robot dragging teaching device, robot and robot dragging teaching method |
| CN113977558B (en) * | 2021-11-29 | 2023-01-31 | 湖南交通职业技术学院 | Device and method for visually and dynamically displaying tail end track of parallel robot |
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