TWI631587B - Backlight module adapted for a keyboard and keyboard therewith - Google Patents
Backlight module adapted for a keyboard and keyboard therewith Download PDFInfo
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Abstract
一鍵盤之背光模組，包含一遮光板、一導光板、一發光單元、一反射板以及一黏貼層。該遮光板形成有複數個上穿孔，各上穿孔周圍定義一上貼合區。該導光板設置於該遮光板下，該導光板形成有複數個貫孔，該發光單元位於該導光板的一側。該反射板設置於該導光板下且對應該複數個貫孔處形成有複數個下穿孔，各下穿孔周圍定義一下貼合區，該下貼合區經由該貫孔貼合於該上貼合區。該黏貼層設置於該下貼合區與該上貼合區之間，用以黏貼該下貼合區與該上貼合區。A backlight module of a keyboard comprises a light shielding plate, a light guiding plate, a light emitting unit, a reflecting plate and an adhesive layer. The visor is formed with a plurality of upper perforations, and an upper affixing zone is defined around each of the upper perforations. The light guide plate is disposed under the light shielding plate, and the light guide plate is formed with a plurality of through holes, and the light emitting unit is located at one side of the light guide plate. The reflector is disposed under the light guide plate and a plurality of lower perforations are formed corresponding to the plurality of through holes, and a bonding area is defined around each of the lower perforations, and the lower bonding area is attached to the upper bonding layer via the through hole Area. The adhesive layer is disposed between the lower bonding area and the upper bonding area for adhering the lower bonding area and the upper bonding area.
Description
本發明關於一種背光模組及鍵盤，尤指一種可防止於底板之開孔處漏光之背光模組及鍵盤。 The invention relates to a backlight module and a keyboard, in particular to a backlight module and a keyboard which can prevent light leakage at the opening of the bottom plate.
近來，鍵盤已成為人們常見的輸入工具，用以輸入文字、數字、符號等。為使鍵盤具有視覺化效果及提升於黑暗場所的辨識度，常於鍵盤的底板下設置一背光模組，以使按鍵能透出光線而產生發光效果。於實務上，背光模組的導光板上常需開設貫孔，以供底板之柱體(例如螺絲柱或熱熔柱等)通過，或供氣流通過，以協助背光模組或鍵盤下方的CPU晶片散熱。然而，背光模組所發出的光線常會經由導光板的貫孔處透出，致使鍵盤於導光板的貫孔處產生漏光的現象，影響產品外觀。 Recently, keyboards have become a common input tool for people to input text, numbers, symbols, and the like. In order to make the keyboard visual and enhance the recognition in the dark place, a backlight module is often arranged under the bottom plate of the keyboard, so that the button can emit light and generate a luminous effect. In practice, the light guide plate of the backlight module often needs to be provided with a through hole for the column of the bottom plate (such as a screw column or a hot-melt column) to pass through, or for airflow to assist the backlight module or the CPU under the keyboard. The chip is cooled. However, the light emitted by the backlight module often passes through the through hole of the light guide plate, causing the keyboard to leak light at the through hole of the light guide plate, which affects the appearance of the product.
本發明提供一種可防止於底板之開孔處漏光之背光模組及鍵盤，以解決上述問題。 The invention provides a backlight module and a keyboard which can prevent light leakage at the opening of the bottom plate to solve the above problems.
為了達成上述目的，本發明揭露一種適用於一鍵盤之背光模組，該鍵盤包含一底板及複數個按鍵，該底板具有一上表面及一下表面，該複數個按鍵佈置於該上表面上，該背光模組包含一遮光板、一導光板、一發光單元、一反射板以及一黏貼層。該遮光板設置於該下表面，該遮光板形成有複數個上穿孔，各上穿孔周圍定義一上貼合區。該導光板設置於該遮光板下，該導光板對應該複數個上穿孔處形成有複數個貫孔，該發光單元位於該導光板的一側，用 以發射一光線進入該導光板。該反射板設置於該導光板下，用以反射被該導光板導引射向該反射板的光線，該反射板對應該複數個貫孔處形成有複數個下穿孔，各下穿孔周圍定義一下貼合區，該下貼合區經由該貫孔貼合於該上貼合區，以封閉該貫孔的孔壁。該黏貼層設置於該下貼合區與該上貼合區之間，用以黏貼該下貼合區與該上貼合區，其中該上貼合區的厚度、該下貼合區的厚度與該黏貼層的厚度的和小於該導光板的厚度。 In order to achieve the above object, the present invention discloses a backlight module suitable for a keyboard, the keyboard includes a bottom plate and a plurality of buttons, the bottom plate has an upper surface and a lower surface, and the plurality of buttons are disposed on the upper surface, The backlight module comprises a light shielding plate, a light guiding plate, a light emitting unit, a reflecting plate and an adhesive layer. The visor is disposed on the lower surface, and the visor is formed with a plurality of upper perforations, and an upper affixing area is defined around each of the upper perforations. The light guide plate is disposed under the light shielding plate, and the light guide plate is formed with a plurality of through holes corresponding to the plurality of upper perforations, and the light emitting unit is located at one side of the light guide plate, A light is emitted to enter the light guide plate. The reflector is disposed under the light guide plate for reflecting light guided by the light guide plate to the reflector plate. The reflector plate is formed with a plurality of lower perforations corresponding to the plurality of through holes, and each of the lower perforations is defined. In the bonding area, the lower bonding area is adhered to the upper bonding area via the through hole to close the hole wall of the through hole. The adhesive layer is disposed between the lower bonding area and the upper bonding area for adhering the lower bonding area and the upper bonding area, wherein the thickness of the upper bonding area and the thickness of the lower bonding area The sum of the thicknesses of the adhesive layer is smaller than the thickness of the light guide plate.
根據本發明之其中之一實施方式，本發明另揭露一種鍵盤，包含一底板、複數個按鍵以及一背光模組，該底板具有一上表面及一下表面，該複數個按鍵佈置於該上表面上，該背光模組包含一遮光板、一導光板、一發光單元、一反射板以及一黏貼層。該遮光板設置於該下表面，該遮光板形成有複數個上穿孔，各上穿孔周圍定義一上貼合區。該導光板設置於該遮光板下，該導光板對應該複數個上穿孔處形成有複數個貫孔，該發光單元位於該導光板的一側，用以發射一光線進入該導光板。該反射板設置於該導光板下，用以反射被該導光板導引射向該反射板的光線，該反射板對應該複數個貫孔處形成有複數個下穿孔，各下穿孔周圍定義一下貼合區，該下貼合區經由該貫孔貼合於該上貼合區，以封閉該貫孔的孔壁。該黏貼層設置於該下貼合區與該上貼合區之間，用以黏貼該下貼合區與該上貼合區，其中該上貼合區的厚度、該下貼合區的厚度與該黏貼層的厚度的和小於該導光板的厚度。 According to another embodiment of the present invention, a keyboard includes a bottom plate, a plurality of buttons, and a backlight module. The bottom plate has an upper surface and a lower surface. The plurality of buttons are disposed on the upper surface. The backlight module comprises a light shielding plate, a light guiding plate, a light emitting unit, a reflecting plate and an adhesive layer. The visor is disposed on the lower surface, and the visor is formed with a plurality of upper perforations, and an upper affixing area is defined around each of the upper perforations. The light guide plate is disposed under the light shielding plate. The light guide plate is formed with a plurality of through holes corresponding to the plurality of upper perforations. The light emitting unit is located at one side of the light guide plate for emitting a light into the light guide plate. The reflector is disposed under the light guide plate for reflecting light guided by the light guide plate to the reflector plate. The reflector plate is formed with a plurality of lower perforations corresponding to the plurality of through holes, and each of the lower perforations is defined. In the bonding area, the lower bonding area is adhered to the upper bonding area via the through hole to close the hole wall of the through hole. The adhesive layer is disposed between the lower bonding area and the upper bonding area for adhering the lower bonding area and the upper bonding area, wherein the thickness of the upper bonding area and the thickness of the lower bonding area The sum of the thicknesses of the adhesive layer is smaller than the thickness of the light guide plate.
根據本發明之其中之一實施方式，本發明另揭露一種鍵盤，包含一底板、複數個按鍵以及一背光模組，該底板具有一上表面及一下表面，該複數個按鍵佈置於該上表面上，該背光模組包含一遮光板、一導光板、一發光單元、一反射板以及一黏貼層。該遮光板設置於該下表面，該遮光板形成有複數個上穿孔，各上穿孔周圍定義一上貼合區。該導光板設置於該遮光板下，該導光板對應該複數個上穿孔處形成有複數個貫孔，該發光單元位於該導光板的一側， 用以發射一光線進入該導光板。該反射板設置於該導光板下，用以反射被該導光板導引射向該反射板的光線，該反射板對應該複數個貫孔處形成有複數個下穿孔，各下穿孔周圍定義一下貼合區，該下貼合區經由該貫孔貼合於該上貼合區，以封閉該貫孔的孔壁。該黏貼層設置於該下貼合區與該上貼合區之間，用以黏貼該下貼合區與該上貼合區，其中該上貼合區的尺寸實質上等於該下貼合區的尺寸，使該上貼合區與該下貼合區黏貼後，該黏貼層高度實質位於該導光板一半厚度處，該上貼合區與該鍵盤底板分離。 According to another embodiment of the present invention, a keyboard includes a bottom plate, a plurality of buttons, and a backlight module. The bottom plate has an upper surface and a lower surface. The plurality of buttons are disposed on the upper surface. The backlight module comprises a light shielding plate, a light guiding plate, a light emitting unit, a reflecting plate and an adhesive layer. The visor is disposed on the lower surface, and the visor is formed with a plurality of upper perforations, and an upper affixing area is defined around each of the upper perforations. The light guide plate is disposed under the light shielding plate, and the light guide plate is formed with a plurality of through holes corresponding to the plurality of upper perforations, and the light emitting unit is located at one side of the light guide plate. It is used to emit a light into the light guide plate. The reflector is disposed under the light guide plate for reflecting light guided by the light guide plate to the reflector plate. The reflector plate is formed with a plurality of lower perforations corresponding to the plurality of through holes, and each of the lower perforations is defined. In the bonding area, the lower bonding area is adhered to the upper bonding area via the through hole to close the hole wall of the through hole. The adhesive layer is disposed between the lower bonding area and the upper bonding area for adhering the lower bonding area and the upper bonding area, wherein the upper bonding area has a size substantially equal to the lower bonding area The adhesive layer has a height substantially at a half thickness of the light guide plate, and the upper bonding region is separated from the keyboard bottom plate.
根據本發明之其中之一實施方式，本發明另揭露一種鍵盤，包含一底板、複數個按鍵以及一背光模組，該底板具有一上表面及一下表面，該複數個按鍵佈置於該上表面上，該背光模組包含一遮光板、一導光板、一發光單元、一反射板以及一黏貼層。該遮光板設置於該下表面，該遮光板形成有複數個上穿孔，各上穿孔周圍定義一上貼合區。該導光板設置於該遮光板下，該導光板對應該複數個上穿孔處形成有複數個貫孔，該發光單元位於該導光板的一側，用以發射一光線進入該導光板。該反射板設置於該導光板下，用以反射被該導光板導引射向該反射板的光線，該反射板對應該複數個貫孔處形成有複數個下穿孔，各下穿孔周圍定義一下貼合區，該下貼合區經由該貫孔貼合於該上貼合區，以封閉該貫孔的孔壁。該黏貼層設置於該下貼合區與該上貼合區之間，用以黏貼該下貼合區與該上貼合區，其中該上貼合區的尺寸大於該下貼合區的尺寸，使該上貼合區與該下貼合區黏貼後，該黏貼層與該導光板下緣處實質相同高度，該上貼合區與該鍵盤底板分離。 According to another embodiment of the present invention, a keyboard includes a bottom plate, a plurality of buttons, and a backlight module. The bottom plate has an upper surface and a lower surface. The plurality of buttons are disposed on the upper surface. The backlight module comprises a light shielding plate, a light guiding plate, a light emitting unit, a reflecting plate and an adhesive layer. The visor is disposed on the lower surface, and the visor is formed with a plurality of upper perforations, and an upper affixing area is defined around each of the upper perforations. The light guide plate is disposed under the light shielding plate. The light guide plate is formed with a plurality of through holes corresponding to the plurality of upper perforations. The light emitting unit is located at one side of the light guide plate for emitting a light into the light guide plate. The reflector is disposed under the light guide plate for reflecting light guided by the light guide plate to the reflector plate. The reflector plate is formed with a plurality of lower perforations corresponding to the plurality of through holes, and each of the lower perforations is defined. In the bonding area, the lower bonding area is adhered to the upper bonding area via the through hole to close the hole wall of the through hole. The adhesive layer is disposed between the lower bonding area and the upper bonding area for bonding the lower bonding area and the upper bonding area, wherein the size of the upper bonding area is larger than the size of the lower bonding area After the upper bonding area and the lower bonding area are pasted, the adhesive layer is substantially the same height as the lower edge of the light guide plate, and the upper bonding area is separated from the keyboard bottom plate.
綜上所述，本發明的遮光板的上貼合區與反射板的下貼合區利用黏貼層於導光板的貫孔內彼此貼合，以封閉導光板的貫孔的孔壁，進而遮擋進入導光板的光線經由導光板的貫孔射出導光板外，以防止背光模組於導光板的貫孔處產生漏光的現象。此外，本發明上貼合區的厚度、下貼合區的厚度及黏貼 層的厚度的和小於導光板的厚度。如此一來，當下貼合區於貫孔內藉由黏貼層貼緊於上貼合區時，上貼合區與黏貼層均可完全落入貫孔內，即上貼合區與黏貼層均不會突出於導光板，進而影響背光模組的整體厚度。有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之實施例的詳細說明中，將可清楚的呈現。 In summary, the upper bonding area of the visor of the present invention and the lower bonding area of the reflecting plate are adhered to each other by the adhesive layer in the through hole of the light guiding plate to close the hole wall of the through hole of the light guiding plate, thereby blocking The light entering the light guide plate is emitted outside the light guide plate through the through hole of the light guide plate to prevent the backlight module from leaking light at the through hole of the light guide plate. In addition, the thickness of the bonding area of the present invention, the thickness of the lower bonding area, and the adhesion The sum of the thicknesses of the layers is smaller than the thickness of the light guide plate. In this way, when the bonding area is adhered to the upper bonding area by the adhesive layer in the through hole, the upper bonding area and the adhesive layer can completely fall into the through hole, that is, the upper bonding area and the adhesive layer are both It does not protrude from the light guide plate, which affects the overall thickness of the backlight module. The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the invention.
1000、1000'、1000"‧‧‧鍵盤 1000, 1000', 1000" ‧ ‧ keyboard
1‧‧‧底板 1‧‧‧floor
10‧‧‧上表面 10‧‧‧ upper surface
103‧‧‧底板破孔 103‧‧‧Bottom hole
11‧‧‧下表面 11‧‧‧ Lower surface
12‧‧‧柱體 12‧‧‧Cylinder
2‧‧‧按鍵 2‧‧‧ buttons
3、3'、3"‧‧‧背光模組 3, 3', 3" ‧ ‧ backlight module
30、30'、30"‧‧‧遮光板 30, 30', 30" ‧ ‧ visors
301‧‧‧上穿孔 301‧‧‧perforation
302、302'、302"‧‧‧上貼合區 302, 302', 302" ‧‧‧ affixed area
3020‧‧‧厚度 3020‧‧‧ thickness
3021、3021'‧‧‧上貼合部 3021, 3021'‧‧‧上上部
3022、3022'‧‧‧上貼合連接部 3022, 3022'‧‧‧ affixed joints
303‧‧‧透光區域 303‧‧‧Lighting area
31‧‧‧導光板 31‧‧‧Light guide plate
310‧‧‧貫孔 310‧‧‧through holes
311‧‧‧側 311‧‧‧ side
312‧‧‧厚度 312‧‧‧ thickness
32‧‧‧發光單元 32‧‧‧Lighting unit
320‧‧‧光線 320‧‧‧Light
33、33'、33"‧‧‧反射板 33, 33', 33" ‧ ‧ reflector
330‧‧‧下穿孔 330‧‧‧ underperture
331、331'、331"‧‧‧下貼合區 331, 331 ', 331" ‧ ‧ under the fit area
3310‧‧‧厚度 3310‧‧‧ thickness
3311、3311'‧‧‧下貼合部 3311, 3311'‧‧‧ under the fitting department
3312、3312'‧‧‧下貼合連接部 3312, 3312'‧‧‧ lower fitting joint
34‧‧‧黏貼層 34‧‧‧Adhesive layer
340‧‧‧厚度 340‧‧‧ thickness
X-X‧‧‧剖面線 X-X‧‧‧ hatching
第1圖為本發明第一實施例鍵盤的局部剖面示意圖。 1 is a partial cross-sectional view showing a keyboard of a first embodiment of the present invention.
第2圖為本發明第一實施例背光模組的***示意圖。 FIG. 2 is a schematic exploded view of a backlight module according to a first embodiment of the present invention.
第3圖為本發明第二實施例鍵盤的局部剖面示意圖。 Figure 3 is a partial cross-sectional view showing the keyboard of the second embodiment of the present invention.
第4圖為本發明第三實施例鍵盤的局部剖面示意圖。 Figure 4 is a partial cross-sectional view showing the keyboard of the third embodiment of the present invention.
以下實施例中所提到的方向用語，例如：上、下、左、右、前或後等，僅是參考附加圖式的方向。因此，使用的方向用語是用來說明並非用來限制本發明。請參閱第1圖，第1圖為本發明第一實施例一鍵盤1000的局部剖面示意圖。如第1圖所示，鍵盤1000包含一底板1、複數個按鍵2以及一背光模組3，底板1具有一上表面10及一下表面11，複數個按鍵2佈置於底板1的上表面10上，以供使用者按壓，進而輸入文字、數字、符號等。 The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation. Please refer to FIG. 1. FIG. 1 is a partial cross-sectional view of a keyboard 1000 according to a first embodiment of the present invention. As shown in FIG. 1 , the keyboard 1000 includes a bottom plate 1 , a plurality of buttons 2 , and a backlight module 3 . The bottom plate 1 has an upper surface 10 and a lower surface 11 . The plurality of buttons 2 are disposed on the upper surface 10 of the bottom plate 1 . For the user to press, and then enter text, numbers, symbols, and the like.
請參閱第1圖以及第2圖，第2圖為本發明第一實施例背光模組3的***示意圖，值得一提的是，第1圖所示的鍵盤1000係沿第2圖所示剖面線X-X所繪示。如第1圖以及第2圖所示，背光模組3包含一遮光板30、一導光板31、一發光單元32、一反射板33以及一黏貼層34，遮光板30設置於底板1的下表面11且未緊 貼在底板1的下表面11，即遮光板30與底板1的下表面11間具有間隙，遮光板30形成有複數個上穿孔301及複數個透光區域303，複數個透光區域303係分別對應設置於各個鍵帽下方，透光區域303可以是窗孔或是未塗佈深色油墨的透明塑膠膜層；各上穿孔301周圍定義一上貼合區302，導光板31設置於遮光板30下，導光板31對應複數個上穿孔301形成有複數個貫孔310，發光單元32設置於反射板33上且位於導光板31之一側311，發光單元32用以發射一光線320進入導光板31，使導光板31能導引光線320射向遮光板30，如此射向遮光板30的光線320便可經由透光區域303射出遮光板30外而分別照亮各個鍵帽。換言之，導光板31可導引部分光線320經由複數個透光區域303透出，使鍵盤1000各個鍵帽透光字符產生發光的效果，值得一提的是，底板1上對應靠近透光區域303處也有破孔，以使光線通過而照射鍵帽。此外，反射板33設置於導光板31下，用以反射被導光板31導引射向反射板33的光線320，使發光單元32所發出的光線320能更集中地朝遮光板30投射，增進鍵盤1000的發光效果。反射板33對應複數個貫孔310處形成有複數個下穿孔330，即反射板33的下穿孔330、導光板31的貫孔310及遮光板30的上穿孔301係彼此對應。另外於對應筆記型電腦CPU設置處上方，底板1亦設置複數個底板破孔103，且這些底板破孔103下方也有對應的反射板33下穿孔330、導光板31貫孔310及遮光板30上穿孔301，如此形成一個垂直貫穿鍵盤模組上下表面的氣流通道，有助於CPU附近的熱空氣向上方流動而脫離筆記型電腦殼體內部，能有效降低CPU溫度。 Please refer to FIG. 1 and FIG. 2 . FIG. 2 is a schematic exploded view of the backlight module 3 according to the first embodiment of the present invention. It is worth mentioning that the keyboard 1000 shown in FIG. 1 is along the section shown in FIG. 2 . Line XX is shown. As shown in FIG. 1 and FIG. 2 , the backlight module 3 includes a light shielding plate 30 , a light guide plate 31 , a light emitting unit 32 , a reflective plate 33 , and an adhesive layer 34 . The light shielding plate 30 is disposed under the bottom plate 1 . Surface 11 is not tight The light is affixed to the lower surface 11 of the bottom plate 1, that is, the light shielding plate 30 has a gap between the lower surface 11 of the bottom plate 1, and the light shielding plate 30 is formed with a plurality of upper perforations 301 and a plurality of transparent regions 303, and the plurality of transparent regions 303 are respectively Correspondingly disposed under each of the keycaps, the light-transmitting area 303 may be a window or a transparent plastic film layer not coated with dark ink; an upper bonding area 302 is defined around each of the upper through holes 301, and the light guiding plate 31 is disposed on the light shielding plate. 30, the light guide plate 31 is formed with a plurality of through holes 310 corresponding to the plurality of upper through holes 301. The light emitting unit 32 is disposed on the reflective plate 33 and located on one side 311 of the light guide plate 31. The light emitting unit 32 is configured to emit a light 320 into the guide. The light guide plate 31 allows the light guide plate 31 to guide the light 320 to the light shielding plate 30, so that the light 320 that is incident on the light shielding plate 30 can be emitted outside the light shielding plate 30 via the light transmitting region 303 to respectively illuminate the respective keycaps. In other words, the light guide plate 31 can guide a portion of the light ray 320 to pass through the plurality of light-transmitting regions 303, so that the light-transmitting characters of the key caps of the keyboard 1000 produce a light-emitting effect. It is worth mentioning that the bottom plate 1 is corresponding to the light-transmitting region 303. There are also holes in the hole to allow light to pass through and illuminate the keycap. In addition, the reflector 33 is disposed under the light guide plate 31 for reflecting the light 320 that is guided by the light guide plate 31 to the reflector 33, so that the light 320 emitted by the light-emitting unit 32 can be more concentratedly projected toward the shutter 30. The lighting effect of the keyboard 1000. The reflection plate 33 is formed with a plurality of lower perforations 330 corresponding to the plurality of through holes 310, that is, the lower perforations 330 of the reflection plate 33, the through holes 310 of the light guide plate 31, and the upper perforations 301 of the shading plate 30 correspond to each other. In addition, above the corresponding notebook computer CPU setting, the bottom plate 1 is also provided with a plurality of bottom plate holes 103, and the bottom plate holes 103 also have corresponding reflecting plates 33 under the through holes 330, the light guide plate 31 through holes 310 and the light shielding plate 30. The perforation 301 forms an air flow passage vertically penetrating the upper and lower surfaces of the keyboard module, which helps the hot air near the CPU to flow upward and out of the interior of the notebook casing, thereby effectively reducing the CPU temperature.
各下穿孔330周圍定義一下貼合區331，其中貫孔310的孔徑大於上穿孔301的孔徑與下穿孔330的孔徑，即貫孔310的尺寸大於上穿孔301的尺寸與下穿孔330的尺寸，藉此反射板33的下穿孔330周圍的下貼合區331便可經由導光板31的貫孔310貼合於遮光板30的上穿孔301周圍的上貼合區302，以封閉導光板31 的貫孔310的孔壁。而黏貼層34設置於下貼合區331與上貼合區302之間，用以黏貼下貼合區331與上貼合區302，使下貼合區331於貫孔310內貼緊於上貼合區302。承上所述，反射板33的下穿孔330周圍的下貼合區331貼合於遮光板30的上穿孔301周圍的上貼合區302的結構設計，便可使遮光板30的上穿孔301周圍的上貼合區302遮擋進入導光板31的光線320經由導光板31的貫孔310射出導光板31外，以防止背光模組3於導光板31的貫孔310處產生漏光的現象。 A fitting area 331 is defined around each of the lower perforations 330. The aperture of the through hole 310 is larger than the aperture of the upper perforation 301 and the aperture of the lower perforation 330. That is, the size of the through hole 310 is larger than the size of the upper perforation 301 and the size of the lower perforation 330. The lower bonding area 331 around the lower perforation 330 of the reflector 33 can be adhered to the upper bonding area 302 around the upper perforation 301 of the visor 30 via the through hole 310 of the light guide plate 31 to close the light guide plate 31. The wall of the hole of the through hole 310. The adhesive layer 34 is disposed between the lower bonding area 331 and the upper bonding area 302 for adhering the lower bonding area 331 and the upper bonding area 302, so that the lower bonding area 331 is adhered to the upper hole 310. Fit area 302. As described above, the lower abutment region 331 around the lower perforation 330 of the reflector 33 is attached to the upper abutment region 302 around the upper perforation 301 of the visor 30, so that the upper perforation 301 of the visor 30 can be made. The light passing through the upper bonding area 302 and the light entering the light guide plate 31 is emitted from the light guide plate 31 through the through hole 310 of the light guide plate 31 to prevent the backlight module 3 from leaking light at the through hole 310 of the light guide plate 31.
值得一提的是，底板1可包含有突出於下表面11的複數個柱體12，而該些柱體12可分別對應至少一部分上穿孔301、貫孔310與下穿孔330。如第2圖所示，當下貼合區331於貫孔310內藉由黏貼層34貼緊於上貼合區302時，上貼合區302所定義的上穿孔301對齊於下貼合區331所定義的下穿孔330而形成一通道，藉此各柱體12便可穿過該通道(即上穿孔301與下穿孔330)，以組裝於背光模組3下方的機台殼體(未繪示於圖中)上，再者如第3圖所示，各柱體12於位於對應的通道內時抵接對應的下貼合區331。於實務上，柱體12可為一螺絲柱、一熱熔柱等，但本發明不受此限。另一方面，另一部分之上穿孔301、貫孔310與下穿孔330可不穿設有柱體12，以提供氣流通過，進而協助背光模組散熱，端視實際需求而定。 It is worth mentioning that the bottom plate 1 can include a plurality of cylinders 12 protruding from the lower surface 11 , and the pillars 12 can respectively correspond to at least a portion of the upper perforations 301 , the through holes 310 and the lower perforations 330 . As shown in FIG. 2, when the lower bonding area 331 is adhered to the upper bonding area 302 by the adhesive layer 34 in the through hole 310, the upper perforation 301 defined by the upper bonding area 302 is aligned with the lower bonding area 331. The lower perforation 330 is defined to form a channel, so that the columns 12 can pass through the channel (ie, the upper perforation 301 and the lower perforation 330) to be assembled in the machine housing below the backlight module 3 (not drawn As shown in FIG. 3, as shown in FIG. 3, each of the cylinders 12 abuts the corresponding lower bonding area 331 when it is located in the corresponding channel. In practice, the column 12 can be a screw column, a hot-melt column, etc., but the invention is not limited thereto. On the other hand, the other part of the through hole 301, the through hole 310 and the lower through hole 330 may not be provided with the column 12 to provide airflow, thereby assisting the backlight module to dissipate heat, depending on actual needs.
於此實施例中，下貼合區331可為一平面結構，上貼合區302包含有一上貼合部3021以及一上貼合連接部3022，上貼合部3021設置於導光板31的貫孔310內，其中黏貼層34是黏貼於該平面結構(即下貼合區331)與上貼合部3021，上貼合連接部3022連接上貼合部3021與遮光板30且位於導光板31的貫孔310內。值得一提的是，本發明上貼合區302的厚度3020、下貼合區331的厚度3310及黏貼層34的厚度340的和小於導光板31的厚度312。如此一來，當下貼合區331 於貫孔310內藉由黏貼層34貼緊於上貼合區302時，上貼合區302與黏貼層34均可完全落入貫孔310內，即上貼合區302與黏貼層34均不會突出於導光板31，進而影響背光模組3的整體厚度。如第1圖所示，上貼合區302的尺寸(即上貼合部3021與上貼合連接部3022的尺寸和)係大於下貼合區331的尺寸(即該平面結構的尺寸)，因此當上貼合區302與下貼合區331黏貼後，即當上貼合區302的上貼合部3021利用黏貼層34黏貼於下貼合區331後，黏貼層34可與導光板31下緣處實質相同高度。另外，於此實施例中，上貼合區302與底板1分離，以便於底板1與背光模組3的組裝。 In this embodiment, the lower bonding area 331 can be a planar structure, and the upper bonding area 302 includes an upper bonding portion 3021 and an upper bonding portion 3022. The upper bonding portion 3021 is disposed on the light guide plate 31. In the hole 310, the adhesive layer 34 is adhered to the planar structure (ie, the lower bonding area 331) and the upper bonding part 3021, and the upper bonding connection part 3022 is connected to the bonding part 3021 and the light shielding plate 30 and is located on the light guide plate 31. Inside the through hole 310. It is worth mentioning that the sum of the thickness 3020 of the bonding area 302, the thickness 3310 of the lower bonding area 331 and the thickness 340 of the adhesive layer 34 of the present invention is smaller than the thickness 312 of the light guide plate 31. As a result, the current fitting area 331 When the adhesive layer 34 is adhered to the upper bonding area 302 in the through hole 310, the upper bonding area 302 and the adhesive layer 34 can completely fall into the through hole 310, that is, the upper bonding area 302 and the adhesive layer 34 are both It does not protrude from the light guide plate 31, thereby affecting the overall thickness of the backlight module 3. As shown in FIG. 1 , the size of the upper bonding portion 302 (ie, the size of the upper bonding portion 3021 and the upper bonding portion 3022 ) is greater than the size of the lower bonding region 331 (ie, the size of the planar structure). Therefore, after the upper bonding area 302 and the lower bonding area 331 are adhered, that is, when the upper bonding part 3021 of the upper bonding area 302 is adhered to the lower bonding area 331 by the adhesive layer 34, the adhesive layer 34 and the light guide plate 31 can be used. The lower edge is substantially the same height. In addition, in this embodiment, the upper bonding area 302 is separated from the bottom plate 1 to facilitate assembly of the bottom plate 1 and the backlight module 3.
值得一提的是，本發明遮光板的上貼合區與反射板的下貼合區的結構設計可不侷限於此實施例圖式所繪示。舉例來說，請參閱第3圖，第3圖為本發明第二實施例一鍵盤1000'的局部剖面示意圖。如第3圖所示，鍵盤1000'與上述鍵盤1000的主要不同處在於：鍵盤1000'的一背光模組3'的一遮光板30'的一上貼合區302'為一平面結構，且背光模組3'的一反射板33'的一下貼合區331'包含有一下貼合部3311以及一下貼合連接部3312，下貼合區331'的下貼合部3311設置於導光板31的貫孔310內，其中黏貼層34是黏貼於該平面結構(即上貼合區302')與下貼合部3311，下貼合連接部3312連接下貼合部3311與反射板33'且位於導光板31的貫孔310內。而此實施例與上述實施例中具有相同標號之元件，其具有相同之結構設計與作用原理，為求簡潔，於此不再贅述。 It is to be noted that the structural design of the upper bonding area of the visor of the present invention and the lower bonding area of the reflecting plate is not limited to the embodiment of the embodiment. For example, please refer to FIG. 3, which is a partial cross-sectional view of a keyboard 1000' according to a second embodiment of the present invention. As shown in FIG. 3, the main difference between the keyboard 1000' and the keyboard 1000 is that an upper bonding area 302' of a light shielding plate 30' of a backlight module 3' of the keyboard 1000' is a planar structure, and The lower bonding area 331 ′ of the reflective plate 33 ′ of the backlight module 3 ′ includes a lower bonding portion 3311 and a lower bonding connecting portion 3312 , and the lower bonding portion 3311 of the lower bonding region 331 ′ is disposed on the light guiding plate 31 . In the through hole 310, the adhesive layer 34 is adhered to the planar structure (ie, the upper bonding area 302') and the lower bonding portion 3311, and the lower bonding connection portion 3312 is connected to the lower bonding portion 3311 and the reflection plate 33'. It is located in the through hole 310 of the light guide plate 31. The components of the embodiment having the same reference numerals as in the above embodiments have the same structural design and function principle, and are not described herein for brevity.
請參閱第4圖，第4圖為本發明第三實施例一鍵盤1000"的局部剖面示意圖。如第4圖所示，鍵盤1000"與上述鍵盤1000的主要不同處在於：鍵盤1000"的一背光模組3"的一遮光板30"的一上貼合區302"包含有一上貼合部3021'以及一上貼合連接部3022'，上貼合部3021'設置於導光板31的貫孔310內，上貼合連接部 3022'連接上貼合部3021'與遮光板30"且位於導光板31的貫孔310內。另外，背光模組3"的一反射板33"的一下貼合區331"包含有一下貼合部3311'以及一下貼合連接部3312'，下貼合部3311'亦設置於導光板31的貫孔310內，且下貼合連接部3312'連接下貼合部3311'且位於導光板31的貫孔310內。於此實施例中，黏貼層34是黏貼於上貼合部3021'以及下貼合部3311'。如第4圖所示，遮光板30"的上貼合區302"的尺寸(即上貼合部3021'與上貼合連接部3022'的尺寸和)實質上等於反射板33"的下貼合區331"的尺寸(即下貼合部3311'與下貼合連接部3312'的尺寸和)。因此，當上貼合區302"與下貼合區331"黏貼後，即當上貼合區302"的上貼合部3021'利用黏貼層34黏貼於下貼合區331"的下貼合部3311'後，黏貼層34高度可實質位於導光板31一半厚度處。而此實施例與上述實施例中具有相同標號之元件，其具有相同之結構設計與作用原理，為求簡潔，於此不再贅述。相較於先前技術，本發明的遮光板的上貼合區與反射板的下貼合區利用黏貼層於導光板的貫孔內彼此貼合，以封閉導光板的貫孔的孔壁，進而遮擋進入導光板的光線經由導光板的貫孔射出導光板外，以防止背光模組於導光板的貫孔處產生漏光的現象。此外，本發明上貼合區的厚度、下貼合區的厚度及黏貼層的厚度的和小於導光板的厚度。如此一來，當下貼合區於貫孔內藉由黏貼層貼緊於上貼合區時，上貼合區與黏貼層均可完全落入貫孔內，即上貼合區與黏貼層均不會突出於導光板，進而影響背光模組的整體厚度。以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 Please refer to FIG. 4, which is a partial cross-sectional view of a keyboard 1000" according to a third embodiment of the present invention. As shown in FIG. 4, the main difference between the keyboard 1000" and the keyboard 1000 is: a keyboard 1000" An upper bonding area 302" of a light shielding plate 30" of the backlight module 3" includes an upper bonding portion 3021' and an upper bonding portion 3022'. The upper bonding portion 3021' is disposed on the light guiding plate 31. Inside the hole 310, the upper joint portion 3022' is connected to the bonding portion 3021' and the light shielding plate 30" and is located in the through hole 310 of the light guide plate 31. In addition, the lower bonding area 331" of a reflecting plate 33" of the backlight module 3" includes a lower fitting The portion 3311 ′ and the lower bonding portion 3312 ′, the lower bonding portion 3311 ′ is also disposed in the through hole 310 of the light guide plate 31 , and the lower bonding connecting portion 3312 ′ is connected to the lower bonding portion 3311 ′ and located on the light guide plate 31 . Inside the through hole 310. In this embodiment, the adhesive layer 34 is adhered to the upper bonding portion 3021' and the lower bonding portion 3311'. As shown in Fig. 4, the size of the upper bonding area 302" of the visor 30" (i.e., the size of the upper bonding portion 3021' and the upper bonding portion 3022') is substantially equal to the lower surface of the reflecting plate 33". The size of the joint area 331" (i.e., the size of the lower fitting portion 3311' and the lower fitting portion 3312'). Therefore, when the upper bonding area 302" is adhered to the lower bonding area 331", that is, the upper bonding portion 3021' of the upper bonding area 302" is adhered to the lower bonding area 331" by the adhesive layer 34. After the portion 3311', the height of the adhesive layer 34 can be substantially at half the thickness of the light guide plate 31. The components of the embodiment having the same reference numerals as in the above embodiments have the same structural design and function principle, and are not described herein for brevity. Compared with the prior art, the upper bonding area of the visor of the present invention and the lower bonding area of the reflecting plate are adhered to each other by the adhesive layer in the through hole of the light guiding plate to close the hole wall of the through hole of the light guiding plate, thereby further The light that blocks the light entering the light guide plate is emitted outside the light guide plate through the through hole of the light guide plate to prevent the backlight module from leaking light at the through hole of the light guide plate. Further, the sum of the thickness of the bonding region, the thickness of the lower bonding region, and the thickness of the adhesive layer of the present invention is smaller than the thickness of the light guide plate. In this way, when the bonding area is adhered to the upper bonding area by the adhesive layer in the through hole, the upper bonding area and the adhesive layer can completely fall into the through hole, that is, the upper bonding area and the adhesive layer are both It does not protrude from the light guide plate, which affects the overall thickness of the backlight module. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
Claims (13)
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| US15/190,171 US9875864B2 (en) | 2015-08-21 | 2016-06-22 | Keyboard and backlight module |
| US15/839,821 US10014133B2 (en) | 2015-08-21 | 2017-12-12 | Keyboard and backlight module |
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| TW105200593U TWM523184U (en) | 2015-08-21 | 2016-01-15 | Backlight module adapted for a keyboard and keyboard therewith |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9875864B2 (en) | 2015-08-21 | 2018-01-23 | Darfon Electronics Corp. | Keyboard and backlight module |
| CN108735541A (en) * | 2017-04-14 | 2018-11-02 | 致伸科技股份有限公司 | Illuminated keyboard |
| TWI635526B (en) * | 2017-06-19 | 2018-09-11 | 達方電子股份有限公司 | Illuminated keyboard |
| CN117854970A (en) * | 2022-09-30 | 2024-04-09 | 致伸科技股份有限公司 | Backlight module suitable for keyboard and keyboard |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202307643U (en) * | 2011-10-19 | 2012-07-04 | 苏州达方电子有限公司 | Light-emitting keyboard |
| TWM465611U (en) * | 2013-07-12 | 2013-11-11 | Darfon Electronics Corp | Pointing stick cursor key and illuminating keyboard therewith |
| CN204204709U (en) * | 2014-10-09 | 2015-03-11 | 群光电子(苏州)有限公司 | The backlight module of light leakage |
-
2016
- 2016-01-15 TW TW105101189A patent/TWI631587B/en active
- 2016-01-15 TW TW105200593U patent/TWM523184U/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202307643U (en) * | 2011-10-19 | 2012-07-04 | 苏州达方电子有限公司 | Light-emitting keyboard |
| TWM465611U (en) * | 2013-07-12 | 2013-11-11 | Darfon Electronics Corp | Pointing stick cursor key and illuminating keyboard therewith |
| CN204204709U (en) * | 2014-10-09 | 2015-03-11 | 群光电子(苏州)有限公司 | The backlight module of light leakage |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM523184U (en) | 2016-06-01 |
| TW201709248A (en) | 2017-03-01 |
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