TWI631307B - Flat heat pipe circuit - Google Patents
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- TWI631307B TWI631307B TW105130731A TW105130731A TWI631307B TW I631307 B TWI631307 B TW I631307B TW 105130731 A TW105130731 A TW 105130731A TW 105130731 A TW105130731 A TW 105130731A TW I631307 B TWI631307 B TW I631307B
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Abstract
本發明為一種平板式熱管迴路，包含上下蓋中間部位挖空的兩環狀板體及成形於該兩板體之間的環槽，環槽內設有至少一支撐柱，用於支撐板體避免凹陷，上蓋板除了支撐柱外呈現空的槽道，而下蓋板體的空的槽道則具有金屬粉末燒結層與金屬網布置在上面，環槽內設有工作流體；使用時，熱源置於近板體處，而使該處的工作流體遇熱蒸發成氣體，而位於熱管迴路其他處的工作流體仍為液體，因此使得此熱管迴路裝置的內部具有溫度差及壓力差，並進而使氣體沿著環槽環繞移動迴路，氣體環繞移動的同時將熱量散發至板體各處，並冷卻成液體而回流到近熱源的蒸發處，最後通過毛細結構通道而回到蒸發處；由於工作流體移動熱量的速度遠較材料自身導熱來的快，因此可有效提升導熱速度。 The invention relates to a flat heat pipe circuit, comprising two annular plates which are hollowed out in the middle part of the upper and lower covers and a ring groove formed between the two plates, wherein at least one support column is arranged in the ring groove for supporting the plate body To avoid dents, the upper cover plate has an empty channel in addition to the support column, and the empty channel of the lower cover body has a metal powder sintered layer and a metal mesh disposed thereon, and a working fluid is arranged in the ring groove; when used, the heat source Being placed near the plate body, so that the working fluid at that place is evaporated into gas by heat, and the working fluid located elsewhere in the heat pipe circuit is still liquid, thus causing temperature difference and pressure difference inside the heat pipe circuit device, and further The gas is moved around the ring groove to move the circuit, and the gas is distributed around the body while dissipating heat, and is cooled to a liquid and returned to the evaporation point of the near heat source, and finally returns to the evaporation portion through the capillary structure passage; The fluid moves heat much faster than the material itself, so it can effectively increase the heat transfer rate.
Description
本發明涉及一種電子產品的熱傳導裝置，特別是一種用於電腦、通信等電子產品的平板式熱管迴路。 The invention relates to a heat conduction device for an electronic product, in particular to a flat heat pipe circuit for electronic products such as computers and communications.
現有技術的電子產品中，為了避免處理器或其各種他高功率電子元件散發出來的熱點集中在某一處而產生過熱現象，這會讓使用者觸碰時感到不舒服，因此往往會設置一熱管或者均溫板將熱均勻地傳遞開來；現有的熱傳導技術是以使用均溫板為比較好的設計方式，均溫板為一金屬薄片，其中接近一側處接觸熱源，並通過均溫板自身的導熱特性來將熱源的熱傳遞到整個均溫板上，以達到將熱源的熱均勻傳遞的目的。 In the prior art electronic products, in order to prevent the hotspots emitted by the processor or various high-power electronic components from being concentrated in one place and generating overheating, which may cause the user to feel uncomfortable when touching, a heat pipe is often disposed. Or the temperature equalizing plate transmits the heat evenly; the existing heat conduction technology is a relatively good design method using the temperature equalizing plate, and the temperature equalizing plate is a metal foil, wherein the heat source is contacted near one side, and the temperature equalizing plate is passed through Its own thermal conductivity to transfer heat from the heat source to the entire temperature equalization plate for the purpose of evenly transferring heat from the heat source.
然而隨著科技的日新月異，電子產品中的處理器等元件所散發的熱越來越多，而現有技術的均溫板僅通過自身材料導熱的方式，其導熱的速度已不足以應付新型的高功率處理器等元件，因此有待進一步加以改良。 However, with the rapid development of technology, more and more heat is emitted from components such as processors in electronic products, and the prior art uniform temperature plate only has a heat conduction rate of its own material, and its heat conduction speed is insufficient to cope with the new high. Components such as power processors are therefore subject to further improvements.
有鑒於前述現有技術的缺點及不足，本發明提供一種平板式熱管迴路，其可有效提升導熱的速度。 In view of the above disadvantages and deficiencies of the prior art, the present invention provides a flat type heat pipe loop which can effectively increase the speed of heat conduction.
為達到上述的發明目的，本發明所採用的技術手段為提供一種平板式熱管迴路，包含：兩中間部位挖空的環狀板體，包含一上蓋金屬板及一下蓋金屬板，呈現相對應環狀凹槽，各板體包含有一凹槽內側面及一外側面，上下蓋板體內部凹槽係面對面貼合固定，兩板體的內側面相貼合並且包覆凹槽；其中之一板體(下蓋板)具有毛細結構；至少一環槽，其成形於兩板體之間的腔體，各自設有至少一相對應的支撐柱，上、下蓋板體的支撐柱是連接的，用以支撐板體不致凹陷；環槽腔體內設有工作流體。 In order to achieve the above object, the technical means adopted by the present invention is to provide a flat heat pipe circuit comprising: an annular plate body hollowed out at two intermediate portions, comprising an upper cover metal plate and a lower cover metal plate, presenting a corresponding ring a groove, each plate body comprises a groove inner side surface and an outer side surface, and the inner groove of the upper and lower cover body body is surface-fitted and fixed, the inner side surfaces of the two plate bodies are fitted together and cover the groove; one of the plates The (lower cover) has a capillary structure; at least one annular groove formed in the cavity between the two plates, each of which is provided with at least one corresponding supporting column, and the supporting columns of the upper and lower cover bodies are connected, The support plate body is not recessed; the working fluid is provided in the annular groove cavity.
上述其中之一板體具有的毛細結構為金屬粉末燒結、吸液芯、泡沫金屬(metal foam)、金屬網、編織網或者金屬纖維團等，其中以金屬粉末燒結較佳；其中該下蓋板體的金屬粉末燒結層更含有一金屬網層覆蓋在該金屬粉末燒結層的上面為最佳。 One of the above-mentioned plates has a capillary structure of metal powder sintering, a wick, a metal foam, a metal mesh, a woven mesh or a metal fiber mass, wherein the metal powder is preferably sintered; wherein the lower cover It is preferred that the sintered metal powder layer further comprises a metal mesh layer overlying the sintered metal powder layer.
本發明的平板式熱管迴路，具有中間部位挖空的環狀板體並且為多邊形狀，可以是三邊形、四邊形、五邊形…等等，必須是依據設計所需目的而使得多邊數大於或等於三；更有使得所述的多邊形板體為等邊長及等邊寬的結構。 The flat heat pipe circuit of the present invention has an annular plate body hollowed out in the middle portion and is polygonal, and may be a trigonal shape, a quadrangular shape, a pentagon shape, etc., and the polygonal number must be larger than the purpose required for the design. Or equal to three; more so that the polygonal plate body is equilaterally long and equilaterally wide.
本發明所述的工作流體為水、酒精、乙醇等，而工作流體的體積約占所述環槽內部容積的1/100至1/10之間，而最佳值是控制在1/70至1/50之間。本發明的平板式熱管迴路，其上下蓋兩板體的壁厚介於0.25mm至0.60mm之間，而最常使用的壁厚為0.3mm至0.35mm之間。 The working fluid of the present invention is water, alcohol, ethanol, etc., and the working fluid has a volume of about 1/100 to 1/10 of the internal volume of the ring groove, and the optimum value is controlled at 1/70 to Between 1/50. In the flat heat pipe circuit of the present invention, the wall thickness of the upper and lower cover plates is between 0.25 mm and 0.60 mm, and the most commonly used wall thickness is between 0.3 mm and 0.35 mm.
本發明的平板式熱管迴路，其中上、下蓋板貼合固定方式是以高溫高壓鍵合(bonding)方式接合邊緣凸壁。 In the flat heat pipe circuit of the present invention, the upper and lower cover plates are fixedly joined by a high temperature and high pressure bonding method to join the edge convex walls.
本發明的平板式熱管迴路，為了增加平板式熱管迴路的可靠度，於製造成成品之後再在板體表面電鍍一層與平板熱管迴路板體相容的奈米金屬材料(約為200奈米左右)，可避免因為高溫燒結時所產生的金屬表面結晶化而導致工作液體洩漏而影響到可靠度。 In order to increase the reliability of the flat heat pipe circuit, the flat heat pipe circuit of the present invention is plated with a nano metal material compatible with the flat heat pipe circuit board after being manufactured into a finished product (about 200 nm or so). ), it is possible to avoid leakage of the working liquid due to crystallization of the metal surface generated at the time of high-temperature sintering, which affects reliability.
與現有技術的比較，本發明的優勢在於：1、一般平板型熱管的散熱能力大約只有4-50瓦，本發明平板式熱管迴路依照形狀大小搭配散熱鰭片及風扇可承載散熱能力範圍約為100-500瓦；2、一般迴路式熱管雖可以承載散熱能力約100-200瓦，但是由於會受到重力的影響，導致放置的方式一改變就影響到散熱能力，另一個迴路式熱管的重大缺點就是低功率無法啟動散熱效能。本發明平板式熱管迴路基本上不受重力或者低功率無法啟動的影響；3、本發明平板式熱管迴路及其散熱模組，可根據複數個晶片的位置、大小及形狀等要求，利用並調整平板式熱管迴路的邊寬度來佈局設計解決散熱需求；4、本發明平板式熱管迴路，由於迴路通道皆為導通狀態，具備自我調節的功能，可達到整體溫度差很小的散熱效果，而依此種平板式熱管迴路設計之散熱模組更可以很快速達成平板式熱管迴路的整體溫度均勻分布的效果；5、本發明平板式熱管迴路可比照均熱板來使用，由於具有多邊形封閉迴路結構，可引導剩餘熱源以自我調節方式輸送至其它邊的位置幫助均衡散熱，其效果優於均熱板。 Compared with the prior art, the advantages of the present invention are as follows: 1. The heat dissipation capability of a general flat type heat pipe is only about 4-50 watts. The flat heat pipe of the present invention can be equipped with heat dissipation fins and a fan capable of carrying heat dissipation capacity according to the shape and size. 100-500 watts; 2, the general loop heat pipe can carry the heat dissipation capacity of about 100-200 watts, but due to the influence of gravity, the way of placing changes will affect the heat dissipation capacity, another major disadvantage of the loop heat pipe That is, low power cannot start the cooling performance. The flat heat pipe circuit of the invention is basically not affected by gravity or low power failure to start; 3. The flat heat pipe circuit and the heat dissipation module of the invention can be utilized and adjusted according to the requirements of the position, size and shape of the plurality of wafers. The width of the flat heat pipe loop is designed to solve the heat dissipation requirement. 4. The flat heat pipe circuit of the present invention has a self-regulating function because the circuit channels are all in a conducting state, and the heat dissipation effect with a small overall temperature difference can be achieved. The heat dissipation module designed by the flat heat pipe circuit can quickly achieve the uniform temperature distribution effect of the flat heat pipe circuit. 5. The flat heat pipe circuit of the present invention can be used as compared with the uniform heat plate, because of the polygonal closed loop structure. It can guide the remaining heat source to be self-adjusting to the other side to help balance heat dissipation, which is better than the heat equalizing plate.
本發明所屬技術領域中具有通常知識者，在閱讀此說明書之後，將可理解本發明其它目的及優點。 Other objects and advantages of the present invention will be understood from the description of the appended claims.
10‧‧‧散熱模組 10‧‧‧ Thermal Module
20‧‧‧平板式熱管迴路 20‧‧‧Plate heat pipe circuit
21‧‧‧上蓋 21‧‧‧Upper cover
22‧‧‧下蓋 22‧‧‧Under the cover
23‧‧‧上蓋邊緣凸壁 23‧‧‧Upper edge of the cover
24‧‧‧下蓋邊緣凸壁 24‧‧‧Under the edge of the cover
25‧‧‧金屬網 25‧‧‧Metal net
26‧‧‧粉末燒結層 26‧‧‧Stained powder layer
27‧‧‧支撐柱 27‧‧‧Support column
20’‧‧‧三邊平板式熱管迴路 20'‧‧‧Three-sided flat heat pipe circuit
20”‧‧‧五邊平板式熱管迴路 20”‧‧‧Five-sided flat heat pipe circuit
30‧‧‧散熱鰭片組 30‧‧‧Fixing fin set
40‧‧‧風扇 40‧‧‧Fan
圖1 為本發明的外觀示意圖；圖2 為本發明的在無支撐柱部位的剖面示意圖；圖3 為本發明的在有支撐柱部位的剖面示意圖；圖4 為其他各種不同形狀設計的外觀示意圖；圖5 為使用本發明於散熱模組的應用範例示意圖； 1 is a schematic view of the appearance of the present invention; FIG. 2 is a schematic cross-sectional view of the unsupported column portion of the present invention; FIG. 3 is a schematic cross-sectional view of a portion of the support column of the present invention; FIG. 5 is a schematic diagram of an application example of using the present invention in a heat dissipation module;
以下配合圖式及本發明的較佳實施例，進一步闡述本發明為達成預定發明目的所採取的技術手段。 The technical means adopted by the present invention for achieving the intended purpose of the invention are further described below in conjunction with the drawings and preferred embodiments of the invention.
請參閱圖1-圖3所示，為本發明的平板式熱管迴路的實施例，其包含有中間部位挖空的上蓋板21及下蓋板22，兩板體結合成為本發明的平板式熱管迴路20，及其所形成的環槽外觀結構，其中長度為30cm，而寬度為25cm。 Referring to FIG. 1 to FIG. 3, an embodiment of the flat heat pipe circuit of the present invention includes an upper cover 21 and a lower cover 22 which are hollowed out at an intermediate portion, and the two plates are combined to form a flat plate of the present invention. The heat pipe loop 20, and the annular groove appearance structure formed therein, has a length of 30 cm and a width of 25 cm.
如圖2及圖3所示為圖1的凹槽剖面圖，上、下蓋板通常是使用金屬銅板塊切割成的，中間部位挖空成為對應的環體，環體狀的每一邊的邊寬度可以為20mm至40mm，金屬銅板塊未加工前的厚度約為0.6mm至1.2mm，本發明使用的每一邊寬度為25mm，而環槽則是使用蝕刻或者CNC機械加工成形為凹槽狀，其中凹槽成形後的厚度約為0.25mm至0.5mm，而在本發明使用的案例厚度為0.3-0.35mm。而上、下板體皆保留有互相對應的複數個支撐柱27沒有被挖掉或蝕刻掉，而周邊的邊緣凸壁也予以保留。圖3則為具有支撐柱27部位AA’的剖面圖，圖2則是其他沒有支撐柱27部位的剖面圖。 2 and FIG. 3 are cross-sectional views of the groove of FIG. 1. The upper and lower covers are usually cut by using a metal copper plate, and the middle portion is hollowed out to be a corresponding ring body, and the sides of each side of the ring body are formed. The width may be 20mm to 40mm, the thickness of the metal copper plate before processing is about 0.6mm to 1.2mm, the width of each side used in the present invention is 25mm, and the ring groove is formed into a groove shape by etching or CNC machining. The thickness of the groove after forming is about 0.25 mm to 0.5 mm, and the thickness of the case used in the present invention is 0.3-0.35 mm. The upper and lower plates retain a plurality of support columns 27 which are corresponding to each other and are not dug or etched away, and the peripheral edge convex walls are also retained. 3 is a cross-sectional view having a portion AA' of the support post 27, and FIG. 2 is a cross-sectional view showing the other portion without the support post 27.
如圖2及圖3所示的上蓋板21板體，於被挖掉或蝕刻掉之後並未予以處理，但是對於下蓋板則是先舖上一層薄薄的金屬粉末，放進燒結爐溫度約在980度至1150度之間讓金屬粉末與下蓋板的內凹金屬面鍵結在一起，即可以形成一層粉末燒結層25，於高溫爐維持一段時間後即進行退火降溫，之後再鋪上一層薄薄的金屬網26，其中金屬網的網目介於100-500目之間。網目的數字意義是參考金屬網供應商提供的商品資訊。 The plate of the upper cover 21 shown in FIG. 2 and FIG. 3 is not treated after being excavated or etched, but for the lower cover, a thin layer of metal powder is first placed and placed in the sintering furnace. The metal powder is bonded to the concave metal surface of the lower cover plate at a temperature of about 980 to 1150 degrees, that is, a powder sintered layer 25 can be formed, and after annealing for a while in the high temperature furnace, annealing and cooling are performed, and then A thin metal mesh 26 is laid, wherein the mesh of the metal mesh is between 100 and 500 mesh. The digital meaning of the network is based on the information provided by the metal network supplier.
金屬網必須適當的剪裁與內凹的溝槽尺寸相似，並且挖空與支撐柱27相對應的部位使金屬網26能夠與粉末燒結層25貼近，形成複合毛細結構，這樣的複合毛細結構是目前應用於高導熱效率的最佳組合，如圖3所示。 The metal mesh must be appropriately cut to be similar in size to the concave groove, and the portion corresponding to the support column 27 can be hollowed out so that the metal mesh 26 can be in close contact with the powder sintered layer 25 to form a composite capillary structure. Such a composite capillary structure is currently The best combination for high thermal conductivity, as shown in Figure 3.
當這些前置作業都已經處理妥當之後，將上蓋板21與下蓋板22的凹槽面以面對面的方式貼合，而這種貼合方式可以使用AB膠或者錫膏使上蓋板21的邊緣凸壁23與下蓋板22的邊緣凸壁24先暫時黏合，再以高溫高壓的方式讓上下蓋板的邊緣凸壁23、24鍵合在一起。而原先保留的支撐柱也因高溫高壓之下鍵合的製程而接合在一起。 After the pre-operations have been handled properly, the upper cover 21 and the groove surface of the lower cover 22 are attached in a face-to-face manner, and the bonding method can use the AB glue or the solder paste to make the upper cover 21 The edge convex wall 23 is temporarily bonded to the edge convex wall 24 of the lower cover 22, and the edge convex walls 23, 24 of the upper and lower cover plates are bonded together in a high temperature and high pressure manner. The previously retained support columns are also joined together by a high temperature and high pressure bonding process.
在上蓋板21與下蓋板22鍵合的製程還需要保留與外界一個小小的通口，這是要***並且焊接注液針口(並未顯示於示 意圖中)，而這個注液針口的主要用途就是要除氣真空並且注入些許的工作流體約佔整個中空腔體體積的1/100至1/10之間，而最佳狀況則大約為1/70至1/50之間。注液之後迅速將針口點焊封死以避免外界空氣再進入腔體內。 The process of bonding the upper cover 21 and the lower cover 22 also needs to keep a small opening with the outside, which is to insert and weld the injection needle (not shown in the schematic), and this injection needle The main purpose of the mouth is to degas the vacuum and inject a small amount of working fluid between about 1/100 and 1/10 of the volume of the entire hollow body, and the best condition is between 1/70 and 1/50. Immediately after the injection, the needle spot welding is sealed to prevent the outside air from entering the cavity.
在完成上述製造過程後，必須進行下一步驟的各種檢測項目，包括測漏、成品的功率、以及老化、可靠度等各種規格測試通過之後的產品才算能包裝出貨。而為了避免平板式熱管迴路20於燒結過程產生金屬結晶化及提升產品的可靠度，通常會進一步於產品表面電鍍一層薄薄的奈米金屬層(未顯示)，厚度大約200奈米。 After completing the above manufacturing process, it is necessary to carry out the various testing items of the next step, including the leakage test, the power of the finished product, and the aging, reliability and other various specifications. In order to avoid the metal crystallization of the flat heat pipe loop 20 during the sintering process and improve the reliability of the product, a thin layer of nano metal (not shown) is usually further plated on the surface of the product, and the thickness is about 200 nm.
本發明平板式熱管迴路的外觀形狀當不只於上面所述的四邊形，也可以如圖4(b)、4(c)或者其他的多邊形狀均可，但是必須是依照所需的設計規格而定。由於本發明的平板式熱管迴路20具有自我調節迴路功能，散熱途徑不再如熱管單一方向而是兩個方向並且能自我迴路調節熱蒸氣的流向。冷凝的工作液體經由複合毛細結構迴流也不再是單一走向，再加上能自我迴路調節熱蒸氣的流向，並且不會像迴路式熱管容易受到重力的影響而產生重大變化，因此在熱傳導的性能上具有優勢地位。再者由於把平板式熱管迴路20多邊形的邊寬加大也是另一種形式的均熱板，而本發明讓熱蒸氣的走向多了自我迴路的調節功能，更具有絕對的優勢。又本發明在工作液體的嚴密控制，比較不容易發生平板式熱管迴路20腔體內部因為熱蒸氣飽和而導致導熱性能降低現 象，也因此優於其他的設計。 The appearance shape of the flat heat pipe circuit of the present invention may be not limited to the above-mentioned quadrilateral shape, and may be as shown in FIG. 4(b), 4(c) or other polygonal shapes, but it must be determined according to required design specifications. . Since the flat-plate heat pipe loop 20 of the present invention has a self-regulating circuit function, the heat dissipation path is no longer in the single direction of the heat pipe but in both directions and can self-loop regulate the flow of the hot vapor. The condensed working fluid is no longer a single direction through the composite capillary structure, and the self-loop can regulate the flow of the hot vapor, and does not cause significant changes like the loop heat pipe is easily affected by gravity, so the performance in heat conduction Has an advantageous position. Furthermore, since the polygonal side width of the flat heat pipe loop 20 is increased, it is another form of soaking plate, and the present invention has an absolute advantage in that the direction of the hot steam is increased by the self-loop regulation function. Further, in the strict control of the working liquid of the present invention, it is less prone to the occurrence of a decrease in thermal conductivity due to thermal vapor saturation in the cavity of the flat heat pipe loop 20, and thus is superior to other designs.
圖5是本發明的使用於散熱模組10的範例示意圖，當平板式熱管迴路20貼放在電路板上的CPU、GPU或其他容易產生高熱的晶片，以吸收傳導大量的熱能，並且在平板式熱管迴路20設置散熱鰭片30靠著自然對流散掉大量的熱能，若是再加上一個風扇40又可以增加高達30%的散熱量。在本發明的實施例根據本發明平板式熱管迴路20的設計規格及實驗數據，圖5的散熱模組可以散熱大約250-300瓦左右，這足以證明本發明優於目前市面上的散熱產品。 FIG. 5 is a schematic diagram showing an example of the heat dissipation module 10 used in the present invention. When the flat heat pipe circuit 20 is placed on a circuit board, a CPU, a GPU, or other wafers that are prone to generate high heat to absorb a large amount of heat energy, and in the flat plate. The heat pipe loop 20 is provided with heat dissipation fins 30 to dissipate a large amount of heat energy by natural convection. If a fan 40 is added, the heat dissipation amount can be increased by up to 30%. In the embodiment of the present invention, according to the design specifications and experimental data of the flat heat pipe loop 20 of the present invention, the heat dissipation module of FIG. 5 can dissipate about 250-300 watts, which is sufficient to prove that the present invention is superior to the current heat dissipation products on the market.
以上所述僅是本發明的較佳實施例而已，並非對本發明做任何形式上的限制，雖然本發明已以較佳實施例揭露如上，然而並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明技術方案的範圍內，當可利用上述揭示的技術內容作出些許更動或修飾為等同變化的等效實施例，但凡是未脫離本發明技術方案的內容，依據本發明的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾，均仍屬於本發明技術方案的範圍內。 The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and A person skilled in the art can make some modifications or modifications to equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. The present invention is not limited to any simple modifications, equivalent changes and modifications of the above embodiments.
Claims (10)
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| TW105130731A TWI631307B (en) | 2016-09-23 | 2016-09-23 | Flat heat pipe circuit |
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| TW105130731A TWI631307B (en) | 2016-09-23 | 2016-09-23 | Flat heat pipe circuit |
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| CN2791882Y (en) * | 2004-10-19 | 2006-06-28 | 李宗举 | Interface layer-structure of reducing jointing inter face thermoresistance |
| CN103256846A (en) * | 2012-02-17 | 2013-08-21 | 白豪 | Capillary structure forming method and finished product of plate-shaped heat pipe |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2791882Y (en) * | 2004-10-19 | 2006-06-28 | 李宗举 | Interface layer-structure of reducing jointing inter face thermoresistance |
| CN103256846A (en) * | 2012-02-17 | 2013-08-21 | 白豪 | Capillary structure forming method and finished product of plate-shaped heat pipe |
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