TWI630372B - Laser detection device - Google Patents
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Abstract
一種雷射探測裝置，包含一個雷射發射單元、一個影像擷取單元，及一個處理單元。該雷射發射單元可投射出一束扇形的雷射光，而於障礙物表面投射形成一個投射標記。該影像擷取單元拍攝擷取該投射標記於障礙物表面所構成的投射影像。該處理單元自該投射影像中辨識出該投射標記，並於該投射影像中測量該投射標記與一個參考標記之間的影像偏距，並根據該影像偏距分析計算出該雷射探測裝置與該障礙物間的距離。本發明透過發射出扇形的雷射光，能大範圍地探測障礙物，以提高行車安全性。A laser detecting device comprises a laser emitting unit, an image capturing unit, and a processing unit. The laser emitting unit can project a fan-shaped laser light and project a projection mark on the surface of the obstacle. The image capturing unit captures a projected image formed by capturing the projection mark on the surface of the obstacle. The processing unit recognizes the projection mark from the projected image, and measures an image offset between the projection mark and a reference mark in the projected image, and calculates the laser detecting device according to the image offset analysis The distance between the obstacles. The invention can detect obstacles in a wide range by emitting fan-shaped laser light to improve driving safety.
Description
本發明是有關於一種探測裝置，特別是指一種雷射探測裝置。The present invention relates to a detecting device, and more particularly to a laser detecting device.
現有的車載用雷達可用來探測車輛前方後方是否有障礙物，而依照發射介質的不同可分成微波、超聲波、紅外線等雷達，而本發明的目的在於提供一種結構新穎並透過雷射光來進行探測的雷射探測裝置，以供使用者選擇使用或購買。另外，現有雷達的探測範圍相當狹小，若障礙物為細長柱狀，例如電線桿，現有雷達往往無法準確偵測到所述障礙物，而造成碰撞意外，進而降低駕駛安全性。The existing vehicle-mounted radar can be used to detect whether there is an obstacle in front of the vehicle, and can be divided into microwave, ultrasonic, infrared, etc. according to the different medium, and the object of the present invention is to provide a novel structure and to detect by laser light. Laser detection device for users to choose to use or purchase. In addition, the detection range of the existing radar is rather narrow. If the obstacle is an elongated column, such as a utility pole, the existing radar often cannot accurately detect the obstacle, thereby causing a collision accident, thereby reducing driving safety.
因此，本發明之目的，即在提供一種能量測物距的雷射探測裝置。Accordingly, it is an object of the present invention to provide a laser detecting device for measuring the object distance.
於是，本發明雷射探測裝置，適用於探測一個障礙物，並包含一個雷射發射單元、一個影像擷取單元，及一個處理單元。該雷射發射單元可投射出一束雷射光，而於該障礙物表面投射形成一個投射標記。該影像擷取單元可拍攝擷取該投射標記於該障礙物表面所構成的影像，而輸出一個投射影像。該處理單元會自該投射影像中辨識出該投射標記，並於該投射影像中測量該投射標記與一個參考標記之間的影像距離，而輸出一個影像偏距，且根據該影像偏距分析出該雷射探測裝置與該障礙物間的距離，而輸出一個實際物距。Thus, the laser detecting apparatus of the present invention is suitable for detecting an obstacle and includes a laser emitting unit, an image capturing unit, and a processing unit. The laser emitting unit can project a beam of laser light and project a surface on the obstacle to form a projection mark. The image capturing unit can capture an image formed by capturing the projection mark on the surface of the obstacle, and output a projected image. The processing unit recognizes the projection mark from the projected image, and measures an image distance between the projection mark and a reference mark in the projected image, and outputs an image offset, and analyzes according to the image offset The distance between the laser detecting device and the obstacle, and outputting a real object distance.
因此，本發明之另一目的，即在提供一種能提高探測範圍的雷射探測裝置。Accordingly, it is another object of the present invention to provide a laser detecting apparatus capable of improving the detection range.
本發明所述雷射探測裝置，該雷射發射單元投射出之雷射光的行進軌跡呈扇形，該投射標記呈水平直線。In the laser detecting device of the present invention, the traveling trajectory of the laser light projected by the laser emitting unit is in a fan shape, and the projection mark is in a horizontal straight line.
本發明之功效在於：透過該雷射發射單元、該影像擷取單元與該處理單元的設計，能發射出扇形軌跡的雷射光來沿水平方向大範圍地探測該障礙物，並透過該雷射光投射於該障礙物所形成的投射標記來分析計算出該雷射探測裝置與該障礙物之間的距離。The effect of the invention is that, through the design of the laser emitting unit, the image capturing unit and the processing unit, the laser light of the fan-shaped trajectory can be emitted to detect the obstacle in a wide range in the horizontal direction, and the laser light is transmitted through the laser beam. Projection marks formed by the obstacle are analyzed to calculate the distance between the laser detecting device and the obstacle.
在本發明被詳細描述之前，應當注意在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.
參閱圖1、圖2與圖3，本發明雷射探測裝置之第一實施例，適用於探測一個障礙物900，在本實施例中，該障礙物900以細長的電線桿為例，該雷射探測裝置包含一個雷射發射單元1、一個影像擷取單元2，及一個處理單元3。Referring to Figures 1, 2 and 3, a first embodiment of the laser detecting apparatus of the present invention is adapted to detect an obstacle 900. In the present embodiment, the obstacle 900 is exemplified by an elongated utility pole. The radiation detecting device comprises a laser emitting unit 1, an image capturing unit 2, and a processing unit 3.
該雷射發射單元1包括一個雷射發射模組11。該雷射發射模組11位於一個發射高度K1，並可向一個與一平面相夾一個投射角度δ的投射方向傾斜投射出一束雷射光。該雷射光沿一個扇形的行進軌跡投射（圖1的角度觀看為扇形），並於該障礙物900表面投射形成一條呈水平直線的投射標記P。實施上，可利用雷射光源投射至一個圓柱形的透鏡，來折射出沿該扇形軌跡行進的雷射光，但不以上述方式為限。The laser emitting unit 1 includes a laser emitting module 11. The laser emitting module 11 is located at an emission height K1 and can obliquely project a laser beam to a projection direction of a projection angle δ with a plane. The laser light is projected along a trajectory of a sector (the angle of FIG. 1 is a fan shape), and is projected on the surface of the obstacle 900 to form a horizontally-lined projection mark P. In practice, a laser source can be used to project a cylindrical lens to refract laser light traveling along the sector track, but not limited to the above.
該影像擷取單元2位於一個拍攝高度K2，並可拍攝擷取該等投射標記P於該障礙物900表面所構成的影像，而輸出一個投射影像，定義一個該影像擷取單元2之可視範圍與地面之交界處為一個基準位置E，也就是說，該基準位置E是位於該投射影像的底邊，假設該障礙物900會於基準位置E形成一個虛擬物。實施上，也可定義一個該影像擷取單元2之可視範圍與任一平面之交界處為該基準位置E，使得該基準位置E為該投射影像中的一條水平線，不以本實施例為限。實施上，該影像擷取單元2可為感光耦合元件（Charge-coupled Device，CCD），或為互補式金氧半導體（Complementary Metal-Oxide-Semiconductor，CMOS）類型的影像感測器，由於CCD與CMOS已為習知技術，故在此不再詳述。The image capturing unit 2 is located at a shooting height K2, and can capture an image formed by capturing the projection marks P on the surface of the obstacle 900, and output a projection image to define a visible range of the image capturing unit 2. The boundary with the ground is a reference position E, that is, the reference position E is located at the bottom edge of the projected image, assuming that the obstacle 900 will form a virtual object at the reference position E. In practice, it is also possible to define a boundary between the visible range of the image capturing unit 2 and any plane as the reference position E, such that the reference position E is a horizontal line in the projected image, not limited to this embodiment. . In practice, the image capturing unit 2 can be a Charge-coupled Device (CCD) or a Complementary Metal-Oxide-Semiconductor (CMOS) type image sensor, due to the CCD and CMOS is a well-known technique and will not be described in detail herein.
該處理單元3訊號連接該影像擷取單元2與該雷射發射單元1，並包括一個影像分析模組31、一個基距量測模組32、一個像物比分析模組33、一個偏距量測模組34、一個距離分析模組35、一個影像寬度量測模組36，及一個寬度分析模組37。The processing unit 3 is connected to the image capturing unit 2 and the laser emitting unit 1 and includes an image analyzing module 31, a base distance measuring module 32, an image ratio analyzing module 33, and an offset The measurement module 34, a distance analysis module 35, an image width measurement module 36, and a width analysis module 37.
該影像分析模組31可透過影像分析技術自該投射影像中辨識出該投射標記P，例如透過影像二值化來進行邊緣偵測，以截取出該投射影像中的該投射標記P，但實施上亦可使用其他影像辨識技術，由於類型眾多，故在此不再詳述。The image analysis module 31 can recognize the projection mark P from the projected image through image analysis technology, for example, performing edge detection through image binarization to intercept the projection mark P in the projected image, but implementing Other image recognition techniques can also be used, and since there are many types, they will not be described in detail here.
該基距量測模組32可從該影像擷取單元2拍攝該雷射發射單元1於地面的一個參考位置R投射出一個參考標記R’所構成的一個參考投射影像中，量測該參考標記R’與該參考投射影像之側邊間的影像距離，而輸出一個參考基距（見圖6）。該基距量測模組32會以像素作為影像距離的單位，因此該參考基距L0（見圖6）代表該參考投射影像之側邊間之垂直方向的像素數量。The base distance measurement module 32 can capture the reference projection image formed by the laser light extraction unit 1 and project a reference mark R′ from a reference position R on the ground, and measure the reference. The image distance between the mark R' and the side of the reference projected image is output, and a reference base distance is output (see Fig. 6). The base distance measurement module 32 uses the pixel as the unit of the image distance, so the reference base distance L0 (see FIG. 6) represents the number of pixels in the vertical direction between the sides of the reference projected image.
該像物比分析模組33可根據該參考基距L0（見圖6）分析出一個單位像物比。由於該參考位置R與該雷射探測裝置之間的距離、該參考位置R與該基準位置E之間的距離、該拍攝高度K2，以及該參考基距L0（見圖6）皆為已知，故可透過三角函數計算出該單位像物比。The image ratio analysis module 33 can analyze a unit image ratio according to the reference base distance L0 (see FIG. 6). Due to the distance between the reference position R and the laser detecting device, the distance between the reference position R and the reference position E, the shooting height K2, and the reference base distance L0 (see FIG. 6) are known Therefore, the unit image ratio can be calculated by a trigonometric function.
該偏距量測模組34會於該投射影像中測量該投射標記P與該參考標記R’之間的影像距離，而輸出一個影像偏距L1（見圖4）。在本實施例中，該投射影像中的該投射標記P與該參考標記R’皆為水平直線，該偏距量測模組34會以像素作為影像距離的單位，因此該影像偏距L1（見圖4）代表該投射標記P與該參考標記R’彼此之間垂直間隔的像素數量。The offset measurement module 34 measures the image distance between the projection mark P and the reference mark R' in the projected image, and outputs an image offset L1 (see FIG. 4). In this embodiment, the projection mark P and the reference mark R′ in the projected image are both horizontal lines, and the offset measurement module 34 uses the pixel as the unit of the image distance, so the image offset L1 ( See Fig. 4) to represent the number of pixels in which the projection mark P and the reference mark R' are vertically spaced from each other.
該距離分析模組35內建有一個物距轉換函數，在本實施例中，該物距轉換函數可透過該發射高度K1、該拍攝高度K2、該投射角度δ等已知參數經過三角函數分析計算所得到，當然實施上亦可透過統計分析數據的方式建立數學模型來得到，不以本實施例為限。該距離分析模組35會將該偏距量測模組34所量測之影像偏距L1（見圖4）作為變數帶入該物距轉換函數，而計算得到一個實際物距D。本實施例在分析計算時，是透過自動光學檢查（Automated OAtical InsAection， AOI）技術來進行分析。The distance analysis module 35 has an object distance conversion function. In the embodiment, the object distance conversion function can analyze the known parameters such as the emission height K1, the shooting height K2, and the projection angle δ through a trigonometric function. The calculation can be obtained, of course, the mathematical model can also be obtained by statistically analyzing the data, which is not limited to the embodiment. The distance analysis module 35 takes the image offset L1 (see FIG. 4) measured by the offset measurement module 34 as a variable into the object distance conversion function, and calculates a physical object distance D. In the embodiment, the analysis is performed by an Automated OAtical Insection (AOI) technique.
該影像寬度量測模組36會於該投射影像中測量該投射標記P的水平寬度，而輸出一個影像寬度。該影像寬度量測模組36會以像素作為影像距離的單位，因此該影像寬度代表該投射標記P之水平方向的像素數量。The image width measuring module 36 measures the horizontal width of the projection mark P in the projected image, and outputs an image width. The image width measurement module 36 uses pixels as a unit of image distance, and thus the image width represents the number of pixels in the horizontal direction of the projection mark P.
該寬度分析模組37內建有該單位像物比，該單位像物比為該投射影像中每一個像素代表之位於該基準位置E之物體的實際長度，該寬度分析模組37會根據該影像寬度與該單位像物比分析計算出位於該基準位置E之該虛擬物的一個虛擬寬度，再根據該距離分析模組35所分析出之實際物距D，透過三角函數來計算得到一個該障礙物900的實際寬度。The width analysis module 37 has the unit image ratio built in, the unit image ratio is the actual length of the object represented by each pixel in the projected image at the reference position E, and the width analysis module 37 according to the The image width and the unit image ratio analysis calculate a virtual width of the virtual object located at the reference position E, and then calculate a physical object distance D according to the distance analysis module 35, and calculate a The actual width of the obstacle 900.
參閱圖3、圖5與圖6，本發明雷射探測裝置實施時可設置於一個無人載具上，並在使用前進行初始設定。啟動該雷射發射單元1，而使該雷射發射單元1如圖5所示地以投射角度δ向地面投射出該雷射光，而於該平地的參考位置R投射形成該參考標記R’。接著，使該影像擷取單元2拍攝擷取該參考標記R’於該地面所構成的影像，而輸出一個如圖6所示的參考投射影像。然後，該基距量測模組32於該參考投射影像中的該參考標記R’量測出該參考基距L0（見圖6）。而該像物比分析模組33則根據該參考基距L0（見圖6）計算出該單位像物比。Referring to Figures 3, 5 and 6, the laser detecting device of the present invention can be implemented on an unmanned vehicle and initially set before use. The laser emitting unit 1 is activated, and the laser emitting unit 1 projects the laser light toward the ground at a projection angle δ as shown in Fig. 5, and the reference mark R' is projected at the reference position R of the flat ground. Then, the image capturing unit 2 captures an image formed by capturing the reference mark R' on the ground, and outputs a reference projected image as shown in FIG. 6. Then, the reference distance measurement module 32 measures the reference base distance L0 (see FIG. 6) of the reference mark R' in the reference projected image. The image ratio analysis module 33 calculates the unit image ratio based on the reference base distance L0 (see FIG. 6).
參閱圖2、圖3與圖7，設定後，當無人載具行移動並位於位置A時，會驅使該雷射探測裝置開始進行探測，此時，該雷射發射單元1以投射角度δ向障礙物900發射雷射光。具體來說，而透過扇形軌跡的設計，能使雷射光完整地照射到該無人載具後方的整個水平範圍，就能避免出現探測盲區。當該雷射光投射於該障礙物900表面時，會於該障礙物900形成水平直線狀的投射標記P。該影像擷取單元2會拍攝擷取該投射標記P於該等障礙物900表面所構成的影像並輸出該投射影像。接著，該處理單元3會自該投射影像辨識出該投射標記P，並測量出該影像偏距L1（見圖4），再根據該影像偏距L1（見圖4）分析計算出該實際物距D，從圖7中可知該無人載具未靠近該障礙物900，因此該無人載具會繼續移動，到達位置B時該雷射探測裝置可探測該無人載具仍未靠近該障礙物900，直到位置C時，該雷射探測裝置可探測該無人載具已靠近該障礙物900，則可驅使該無人載具停止或進行其他動作。Referring to FIG. 2, FIG. 3 and FIG. 7, after setting, when the unmanned vehicle line moves and is located at position A, the laser detecting device is driven to start detecting. At this time, the laser emitting unit 1 is projected at a projection angle δ. The obstacle 900 emits laser light. Specifically, through the design of the sector track, the laser light can be completely irradiated to the entire horizontal range behind the unmanned vehicle, and the detection dead zone can be avoided. When the laser light is projected on the surface of the obstacle 900, a horizontally linear projection mark P is formed on the obstacle 900. The image capturing unit 2 captures an image formed by capturing the projection mark P on the surface of the obstacles 900 and outputs the projected image. Then, the processing unit 3 recognizes the projection mark P from the projected image, and measures the image offset L1 (see FIG. 4), and then calculates and calculates the actual object according to the image offset L1 (see FIG. 4). From the distance D, it can be seen from FIG. 7 that the unmanned vehicle is not close to the obstacle 900, so the unmanned vehicle will continue to move. When the position B is reached, the laser detecting device can detect that the unmanned vehicle is still not near the obstacle 900. Until position C, the laser detecting device can detect that the unmanned vehicle has approached the obstacle 900, thereby driving the unmanned vehicle to stop or perform other actions.
另外，該處理單元3還可根據該投射影像的該投射標記P計算得到該障礙物900的實際寬度，而操控該無人載具以適當的角度轉向以避開該障礙物900，而達到全自動駕駛的功能，當然實施上，該處理單元3亦可省略該影像寬度量測模組36與該寬度分析模組37，不以本實施例為限。需要說明的是，該雷射探測裝置除了應用於無人載具，也能應用於自走式清掃機等需要探測障礙物的裝置，不以本實施例的應用為限。In addition, the processing unit 3 can also calculate the actual width of the obstacle 900 according to the projection mark P of the projected image, and control the unmanned vehicle to turn at an appropriate angle to avoid the obstacle 900, thereby achieving full automatic operation. The function of the driving, of course, the processing unit 3 can also omit the image width measuring module 36 and the width analyzing module 37, which is not limited to the embodiment. It should be noted that the laser detecting device can be applied to a device such as a self-propelled sweeping machine that needs to detect an obstacle, and is not limited to the application of the embodiment.
本發明雷射探測裝置，透過該雷射發射單元1、該影像擷取單元2與該處理單元3的設計，能發射出扇形軌跡的雷射光來沿水平方向大範圍地探測該障礙物900，並透過該雷射光投射於該等障礙物900所形成的投射標記P，能分析計算出該雷射探測裝置與障礙物900之間的實際物距D，藉此能提高行車安全性，故確實能達成本發明之目的。The laser detecting device of the present invention, through the design of the laser emitting unit 1, the image capturing unit 2 and the processing unit 3, can emit a laser beam of a fan-shaped trajectory to detect the obstacle 900 in a wide range in a horizontal direction. And by projecting the projection mark P formed by the laser light on the obstacles 900, the actual object distance D between the laser detecting device and the obstacle 900 can be analyzed and calculated, thereby improving driving safety, so The object of the invention can be achieved.
參閱圖8與圖9，本發明雷射探測裝置的一個第二實施例，本實施例與該第二實施例大致相同，不同之處在於：該雷射探測裝置適用於偵測數個障礙物900，該等障礙物900表面分別投射形成有呈水平直線的投射標記，該處理單元3還包括一個影像間距量測模組38，及一個間距分析模組39。Referring to FIG. 8 and FIG. 9, a second embodiment of the laser detecting device of the present invention is substantially the same as the second embodiment, except that the laser detecting device is suitable for detecting several obstacles. 900. The surface of the obstacles 900 is respectively projected with a horizontally-lined projection mark. The processing unit 3 further includes an image spacing measurement module 38 and a spacing analysis module 39.
該影像間距量測模組38會於該投射影像中測量該等投射標記之間的水平間距，而分別輸出數個影像間距，該影像間距量測模組38會以像素作為影像距離的單位，因此該影像間距代表該等投射標記之間的像素數量。The image spacing measurement module 38 measures the horizontal spacing between the projection markers in the projection image, and outputs a plurality of image spacings respectively. The image spacing measurement module 38 uses the pixels as the unit of the image distance. Thus the image spacing represents the number of pixels between the projected markers.
該間距分析模組39內建有該單位像物比，該單位像物比為該投射影像中每一個像素代表之位於該基準位置之物體的實際長度，該間距分析模組39會根據該等影像間距與該單位像物比分析計算出位於該基準位置之該等虛擬物之間的一個虛擬間距，再根據該距離分析模組35所分析出之實際物距D，透過三角函數計算得到該等障礙物900之間的數個實際間距。The ratio analysis module 39 has a unit image ratio built in, and the unit image ratio is an actual length of an object represented by each pixel in the projected image at the reference position, and the interval analysis module 39 according to the The image spacing and the unit image ratio analysis calculate a virtual distance between the virtual objects located at the reference position, and then calculate the actual object distance D analyzed by the distance analysis module 35, and calculate the result by a trigonometric function. Several actual spacings between obstacles 900.
如此一來，透過該影像間距量測模組38與該間距分析模組39的設計，還可從該等投射標記分析出該等障礙物900間的距離，以便於控制該無人載具。In this way, through the design of the image spacing measurement module 38 and the spacing analysis module 39, the distance between the obstacles 900 can be analyzed from the projection marks to facilitate control of the unmanned vehicle.
參閱圖10與圖11，本發明雷射探測裝置的一個第三實施例，本實施例與該第二實施例大致相同，不同之處在於：該雷射發射單元1還包括一個角度調整模組12。該角度調整模組12可帶動該雷射發射模組11俯仰偏擺，以調整該投射角度δ，在本實施例中，該角度調整模組12包括一個馬達，及一個連接於該雷射發射單元1與該馬達之間的減速機構，該馬達可被驅動而透動該減速機構帶動該雷射發射單元1偏轉，進而使該雷射發射單元1俯仰偏擺，但實施上，該角度調整模組12還可透過反射鏡或稜鏡來調整該投射角度，不以本實施例為限。Referring to FIG. 10 and FIG. 11, a third embodiment of the laser detecting device of the present invention is substantially the same as the second embodiment, except that the laser emitting unit 1 further includes an angle adjusting module. 12. The angle adjustment module 12 can drive the laser illuminating module 11 to tilt the yaw to adjust the projection angle δ. In the embodiment, the angle adjustment module 12 includes a motor, and one is connected to the laser emission. a speed reduction mechanism between the unit 1 and the motor, the motor being driven to transmit the speed reduction mechanism to deflect the laser emitting unit 1, thereby causing the laser emitting unit 1 to pitch and yaw, but in practice, the angle adjustment The module 12 can also adjust the projection angle through a mirror or a cymbal, which is not limited to this embodiment.
該偏距量測模組34內建有數個於該投射影像中且分別對應於不同投射角度δ的參考標記R’，並根據該雷射發射單元1所投射的投射角度δ選用相對應的參考標記R’來進行量測。該距離分析模組35內建有數個分別對應於不同投射角度δ的物距轉換函數，並會根據該雷射發射單元1所投射的投射角度δ選用相對應的物距轉換函數。當然實施上，該距離分析模組35亦可內建有數個分別對應於不同投射角度δ的物距轉換表，並會根據該雷射發射單元1所投射的投射角度δ選用相對應的物距轉換表，以比對出對應的實際物距D。The offset measuring module 34 has a plurality of reference marks R′ in the projected image and corresponding to different projection angles δ, and selects a corresponding reference according to the projection angle δ projected by the laser emitting unit 1 . Mark R' for measurement. The distance analysis module 35 has a plurality of object distance conversion functions respectively corresponding to different projection angles δ, and selects a corresponding object distance conversion function according to the projection angle δ projected by the laser emission unit 1. Of course, the distance analysis module 35 can also have a plurality of object distance conversion tables respectively corresponding to different projection angles δ, and select the corresponding object distance according to the projection angle δ projected by the laser emission unit 1. Convert the table to compare the corresponding actual object distance D.
該寬度分析模組37內建有數個分別對應於不同投射角度δ的單位像物比，並會根據該雷射發射單元1所投射的投射角度δ選用相對應的單位像物比。該間距分析模組39內建有數個分別對應於不同投射角度δ的單位像物比，並會根據該雷射發射單元1所投射的投射角度δ選用相對應的單位像物比。The width analysis module 37 has a plurality of unit image ratios respectively corresponding to different projection angles δ, and selects a corresponding unit image ratio according to the projection angle δ projected by the laser emission unit 1. The spacing analysis module 39 has a plurality of unit image ratios respectively corresponding to different projection angles δ, and selects a corresponding unit image ratio according to the projection angle δ projected by the laser emitting unit 1.
本實施例在進行初始設定時，該處理單元3會於不同的投射角度δ下分別進行初始設定，而使該基距量測模組32與該像物比分析模組33分析建立出數個分別對應不同投射角度δ的參考基距L0（見圖6）與單位像物比。同時，進行初始設定時，該偏距量測模組34會建立分別對應於不同投射角度δ的參考標記，該距離分析模組35會建立分別對應於不同投射角度δ的物距轉換函數。In the embodiment, when the initial setting is performed, the processing unit 3 performs initial setting at different projection angles δ, and the base distance measurement module 32 and the image ratio analysis module 33 analyze and establish several The reference base distance L0 (see FIG. 6) corresponding to different projection angles δ is respectively compared with the unit image ratio. At the same time, when the initial setting is performed, the offset measurement module 34 establishes reference marks respectively corresponding to different projection angles δ, and the distance analysis module 35 establishes object distance conversion functions respectively corresponding to different projection angles δ.
日後，當無人載具行移動而驅使該雷射探測裝置會開始進行探測時，可根據所需調整該投射角度δ，該偏距量測模組34會選用相對應的參考標記，而該距離分析模組35會選用相對應的物距轉換函數。該寬度分析模組37與該間距分析模組39會選用相對應的單位像物比。藉此，能便於該無人載具偵測更大範圍的障礙物900，而能更加提高安全性。In the future, when the unmanned vehicle line moves to drive the laser detecting device to start detecting, the projection angle δ can be adjusted according to the need, and the offset measuring module 34 selects the corresponding reference mark, and the distance is selected. The analysis module 35 will select the corresponding object distance conversion function. The width analysis module 37 and the spacing analysis module 39 select a corresponding unit image ratio. Thereby, the unmanned vehicle can be easily detected to detect a wider range of obstacles 900, and the safety can be further improved.
惟以上所述者，僅為本發明之實施例而已，當不能以此限定本發明實施之範圍，凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, and all the equivalent equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still The scope of the invention is covered.
<TABLE border="1" borderColor="#000000" width="85%"><TBODY><tr><td> 1·········· 雷射發射單元 11········· 雷射發射模組 12········ 角度調整模組 2·········· 影像擷取單元 3·········· 處理單元 31········ 影像分析模組 32········ 基距量測模組 33········ 像物比分析模組 34········ 偏距量測模組 35········ 距離分析模組 36········ 影像寬度量測模組 37········ 寬度分析模組 38········ 影像間距量測模組 39········ 間距分析模組 </td><td> 900······ 障礙物 A·········· 位置 B ········· 位置 C·········· 位置 E·········· 基準位置 P·········· 投射標記 R·········· 參考位置 R’ ········ 參考標記 D·········· 實際物距 K1······ 發射高度 K2······ 拍攝高度 δ········· 投射角度 L0········ 參考基距 L1········ 影像偏距 </td></tr></TBODY></TABLE><TABLE border="1" borderColor="#000000" width="85%"><TBODY><tr><td> 1·········· Laser emission unit 11····· ···· Laser emission module 12········ Angle adjustment module 2·········· Image capture unit 3·········· Processing unit 31········ Image Analysis Module 32········ Base Distance Measurement Module 33········ Image Ratio Analysis Module 34······ ··Offset measurement module 35········ Distance analysis module 36········ Image width measurement module 37········ Width analysis module 38 ········ Image Spacing Measurement Module 39········ Pitch Analysis Module</td><td> 900······ Obstacle A······ ···· Location B ········· Location C·········· Location E······························ ·· Projection mark R·········· Reference position R' ········ Reference mark D·········· The actual object distance K1······ Emission height K2······ Shooting height δ········· Projection Angle L0········ Reference base distance L1········ Image offset </td></tr></TBODY></TABLE>
本發明之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中： 圖1是一個俯視示意圖，說明本發明雷射探測裝置的第一實施例的一個雷射發射單元投射出一束扇形雷射光於一個障礙物； 圖2是一個側視示意圖，說明該第一實施例的該雷射發射單元投射出該雷射光於該障礙物； 圖3是一個功能方塊圖，說明該第一實施例的系統架構； 圖4是一個影像示意圖，說明該第一實施例的一個影像擷取單元所拍攝的一個投射影像； 圖5是一個側視示意圖，說明該第一實施例的該雷射發射單元投射出該雷射光於地面； 圖6是一個影像示意圖，說明該第一實施例的該影像擷取單元於初始設定所拍攝的一個參考投射影像； 圖7是一個示意圖，說明該第一實施例移動靠近該障礙物； 圖8是一個功能方塊圖，說明本發明雷射探測裝置的第二實施例的系統架構； 圖9是一個俯視示意圖，說明該第二實施例的一個雷射發射單元投射出一束扇形雷射光於兩個障礙物； 圖10是一個功能方塊圖，說明本發明雷射探測裝置的第三實施例的系統架構；及 圖11是一個側視示意圖，說明該第三實施例的該雷射發射單元可俯仰偏擺。Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: Figure 1 is a top plan view showing a laser emitting unit projection of a first embodiment of the laser detecting apparatus of the present invention. A fan-shaped laser beam is emitted from an obstacle; FIG. 2 is a side elevational view showing the laser emitting unit of the first embodiment projecting the laser light to the obstacle; FIG. 3 is a functional block diagram illustrating The system architecture of the first embodiment; FIG. 4 is a schematic diagram showing a projected image captured by an image capturing unit of the first embodiment; FIG. 5 is a side elevational view showing the first embodiment. The laser emitting unit projects the laser light on the ground; FIG. 6 is a schematic diagram showing a reference projection image taken by the image capturing unit of the first embodiment at the initial setting; FIG. 7 is a schematic diagram illustrating The first embodiment moves closer to the obstacle; FIG. 8 is a functional block diagram illustrating the system architecture of the second embodiment of the laser detecting apparatus of the present invention; 9 is a top plan view showing a laser emitting unit of the second embodiment projecting a bundle of fan-shaped laser light to two obstacles; FIG. 10 is a functional block diagram showing the third embodiment of the laser detecting device of the present invention The system architecture of the example; and FIG. 11 is a side elevational view showing the laser emitting unit of the third embodiment being tiltable.
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