TWI624040B - 光學晶圓之製造 - Google Patents
光學晶圓之製造 Download PDFInfo
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Abstract
本發明係關於製造一光學晶圓,其包含提供一晶圓,該晶圓包括由一玻璃強化環氧樹脂組成之一核心區域,該晶圓進一步包括位於該核心區域之一頂部表面上之一第一樹脂層及位於該核心區域之一底部表面上之一第二樹脂層。該核心區域及該等第一及第二樹脂層對於電磁光譜之一特定範圍係實質上不可穿透的。該晶圓進一步包含垂直透明區域,該等垂直透明區域延伸穿過該核心區域及該等第一及第二樹脂層且由對於該電磁光譜之該特定範圍係實質上可穿透之一材料組成。舉例而言藉由拋光將該晶圓自其頂部表面及其底部表面薄化使得一所得厚度在一預定範圍內而不致使該核心區域之玻璃纖維被曝露。在該等透明區域之至少一些之一或多個經曝露表面上提供各別光學結構。
Description
本發明係關於光學晶圓之製造。
各種裝置併入光學模組或光電模組。此等模組有時以晶圓級製造以促進同時製造多個模組。模組之製造有時包含依次往上堆疊多個晶圓,其中各晶圓為所得模組提供某種特定功能性。該等晶圓之一或多者(其可被稱為一光學晶圓)可併入各種光學元件。儘管以晶圓級製造模組可促進總體製程,然跨晶圓之變動可在此等製造程序中提出挑戰。
在一些實施方案中,本發明可有助於減少在一光學晶圓中發生之一些變動且因此可有助於改良用於自光學晶圓製成光學構件之總體晶圓級製造程序以及改良用於製成各種光學模組或光電模組之總體晶圓級製造程序。
舉例而言,在一個態樣中,製造一光學晶圓包含提供一晶圓,該晶圓包括由一玻璃強化環氧樹脂組成之一核心區域,該晶圓進一步包括位於核心區域之一頂部表面上之一第一樹脂層及位於核心區域之一底部表面上之一第二樹脂層。核心區域及該等第一及第二樹脂層對於電磁光譜之一特定範圍係實質上不可穿透的。該晶圓進一步包含垂直透明區域,該等垂直
透明區域延伸穿過核心區域及該等第一及第二樹脂層且由對於電磁光譜之該特定範圍係實質上可穿透之一材料組成。舉例而言藉由拋光將該晶圓自其頂部表面及其底部表面薄化使得一所得厚度在一預定範圍內而不致使核心區域之玻璃纖維被曝露。在該等透明區域之至少一些之一或多個經曝露表面上提供各別光學結構。
一些實施方案包含以下特徵之一或多者。舉例而言,核心區域可由一複合材料組成,該複合材料由具有一環氧樹脂黏結劑之編織玻璃纖維布組成。舉例而言,該等第一及第二樹脂層可由一無玻璃黑色環氧樹脂組成。
在一些實施方案中,在拋光之後,該等第一及第二樹脂層之各者之剩餘厚度係在該等第一及第二樹脂層之各別初始厚度之10%至50%之範圍內。類似地,在一些實施方案中,在拋光之後,晶圓之總體厚度在跨晶圓之一預定厚度之±5μm至±50μm內。在一些情況下,在拋光之後,光學晶圓OW之總體厚度之變動相對於絕對厚度以及相對於跨晶圓之變動不超過5%。
舉例而言,核心區域及該等第一及第二樹脂層對於電磁光譜之紅外線或近紅外線部分可為實質上不可穿透的。在一些實施方案中,透明元件上之光學結構包含透鏡。方法可包含使用一複製程序以提供光學結構。方法亦可包含將光學晶圓分成個別光學構件及/或將光學晶圓併入至一晶圓堆疊中以形成光電模組。
根據一第二態樣,製造一光學晶圓之一方法包含提供一前驅體晶圓,該前驅體晶圓包括一核心區域,該核心區域由對於一特定光譜範圍之光係實質上不可穿透之一玻璃強化環氧樹脂組成,該前驅體晶圓進一步包
括位於核心區域之一頂部表面上之一第一樹脂層及位於核心區域之一底部表面上之一第二樹脂層。在前驅體晶圓內形成開口,使得該等開口自前驅體晶圓之一頂部延伸至前驅體晶圓之一底部。使用一材料實質上填充該等開口,該材料在硬化時對於該特定光譜範圍之光係實質上可穿透的,且硬化開口中之材料以形成對於該特定光譜範圍之光係實質上可穿透之透明元件。拋光前驅體晶圓之一頂部表面及前驅體晶圓之一底部表面以獲得具有在一預定範圍內之一厚度之一晶圓而不致使核心區域之玻璃纖維被曝露。在該等透明元件之至少一些之一或多個經曝露表面上提供各別光學結構。
在一些實施方案中,核心區域係由一複合材料組成,該複合材料由具有環氧樹脂黏結劑之耐燃編織玻璃纖維布組成。因此,核心區域可由(舉例而言)藉由***以環氧樹脂黏結劑浸漬之連續玻璃編織織物所產製之一材料組成,而該等第一及第二樹脂層可由(舉例而言)一無玻璃黑色環氧樹脂組成。
根據又一態樣,一晶圓堆疊包含依次往上堆疊之複數個晶圓(包含一光學晶圓)。該光學晶圓包含一核心區域,該核心區域由一玻璃強化環氧樹脂組成。該光學晶圓進一步包含位於核心區域之一頂部表面上之一第一樹脂層及位於核心區域之一底部表面上之一第二樹脂層。核心區域及該等第一及第二樹脂層對於電磁光譜之一特定範圍係實質上不可穿透的,且該等第一及第二樹脂層之各者之一厚度小於10μm。核心區域及該等第一及第二樹脂層之跨光學晶圓之一總體組合厚度變動不超過5%。該光學晶圓進一步包含透明區域,該等透明區域之各者延伸穿過核心區域及該等第一及第二樹脂層且由對於電磁光譜之該特定範圍係實質上可穿透之一材料組成。該光學晶圓亦包含位於該等透明區域之至少一些之一或多個表面上之
光學結構。
在附圖及以下描述中闡明一或多個實施方案之細節。其他態樣、特徵及優點將根據描述及圖式及根據申請專利範圍而顯而易見。
1‧‧‧光電模組/模組
2‧‧‧晶圓堆疊
3‧‧‧透明區域
4‧‧‧開口
5‧‧‧光學結構
6‧‧‧透明元件/透明區域
7‧‧‧焊料球
8‧‧‧前驅體晶圓/複合晶圓
9‧‧‧印刷電路板(PCB)/核心材料/核心
10‧‧‧電子裝置
10A‧‧‧頂部樹脂層
10B‧‧‧底部樹脂層
11‧‧‧開口
12‧‧‧支撐層
13‧‧‧支撐基板
b‧‧‧阻擋部分
t‧‧‧透明部分
B‧‧‧擋板構件
BW‧‧‧擋板晶圓/晶圓
D‧‧‧主動光學組件/光偵測器/偵測器/偵測構件
E‧‧‧主動光學組件/光發射器
L‧‧‧被動光學組件/透鏡構件
O‧‧‧光學構件
OW‧‧‧光學晶圓/晶圓
P‧‧‧基板
PW‧‧‧基板晶圓/晶圓
S‧‧‧分離構件/間隔物構件
SW‧‧‧間隔物晶圓/晶圓
T‧‧‧透明材料/材料
圖1係一光電模組之一實例之一橫截面圖。
圖2係一光學構件之一實例之一橫截面圖。
圖3係圖2之光學構件之一俯視圖。
圖4係用於形成包含一光學晶圓之一晶圓堆疊之晶圓之一橫截面圖。
圖5係包含一光學晶圓之一晶圓堆疊之一橫截面圖。
圖6係繪示用以獲得光學晶圓之一前驅體晶圓之一實例之一橫截面圖。
圖7至圖11繪示根據一些實施方案之形成光學晶圓之各種處理步驟。
圖12繪示將一光學晶圓分成多個光學構件。
圖13係形成一光學晶圓之一方法之一流程圖。
圖1繪示安裝在一電子裝置10之一印刷電路板9上之一光電模組1之一實例。舉例而言,該電子裝置10可係一手持電子通訊裝置(諸如一智慧電話)或一攝影裝置(諸如一照相機或一視訊攝影機)。
光電模組1包含一光學構件O且亦包含諸如一偵測器D(例如一光二極體)及一光發射器E(例如一發光二極體)之至少一主動光學組件。該等主動光學組件D、E安裝在具有焊料球7之一基板P上。在基板P與光學構件O之間,配置具有開口4之一分離構件S(或間隔物構件S)以確保主動光學組件D、E與被動光學組件L之間具有一合適距離。在頂部上,配置具有透明區
域3之一擋板構件B而起一擋板之作用。
基板P、光學構件O、擋板構件B及分離構件S可具有大致上塊狀或板狀之形狀,其中分離構件S及擋板構件B之各者具有一或多個孔。
如圖2及圖3中所繪示,光學構件O包含一阻擋部分b及兩個透明部分t。阻擋部分b係由對於一特定光譜範圍(波長或波長範圍)之光係實質上不可穿透之一材料(例如一聚合物材料(諸如一玻璃強化環氧樹脂))製成,而透明部分t係由對於至少該特定光譜範圍之光係實質上可穿透之一材料製成。以此方式,阻擋部分b對於透明部分t之各者起一孔口之作用且亦固定(或固持)透明部分t。阻擋部分b藉由實質上衰減或阻擋該特定光譜範圍之光亦可起一遮蔽物之作用以防止非所要光。
在所繪示之實例中,透明部分t之各者具有多個部件:兩個光學結構5(例如凹透鏡元件或凸透鏡元件)及一透明元件6。此等部件共同形成一透鏡構件L,其係一被動光學組件。阻擋部分b與透明元件6一起形成一實質上實心板狀形狀,其中光學結構5自表面突出。透明元件6之各者具有實質上平坦之兩個相對側向表面。
存在對其而言被動光學組件L(及因此透明材料T及用於光學結構5之材料(其可與材料T相同或不同))係可穿透但用於阻擋部分b之材料係不可穿透之一或多個特定波長範圍。
在一些實施方案中,光發射器E可發射之光之波長範圍與光偵測器D可偵測之光之波長範圍之間存在一重疊波長範圍。至少在該重疊波長範圍中,阻擋部分b將係不可穿透的,且至少在該重疊波長範圍之一部分中,透明部分t將係可穿透的。在一些實施方案中,該重疊波長範圍係在電磁光譜之紅外線部分中,且可在電磁光譜之近紅外線部分中。此對於模組1
充當一近接感測器之情形可為特別有用的。
光電模組1可以晶圓級製造。舉例而言,圖4繪示用於形成用於製造多個模組1之一晶圓堆疊2(請參閱圖5)之晶圓之一示意性橫截面圖。
如圖4及圖5中所展示,在一些實施方案中,使用四個晶圓製造多個模組1:一基板晶圓PW、一間隔物晶圓SW、一光學晶圓OW及一擋板晶圓BW。各晶圓包含多個對應構件,舉例而言,該多個對應構件(例如)以彼此之間之一小段距離配置在一矩形晶格上以用於一晶圓分離步驟。
舉例而言,基板晶圓PW可為由標準印刷電路板(PCB)材料組成之一印刷電路板,其一側上具有焊料球7而另一側焊接有主動光學組件(E及D)。可使用標準取放機藉由取放將該等主動光學組件放置於基板晶圓PW上。
為形成晶圓堆疊2,(例如)使用一熱可固化環氧樹脂將該等晶圓BW、OW、SW、PW對準且膠合在一起。該對準包括對準基板晶圓PW與光學晶圓OW使得偵測構件D之各者相對於透明部分t之至少一者而對準,特定言之,其中偵測構件D之各者以相同方式各自與透明部分t之一者對準,且此同樣適用於光發射器E。圖5中之細虛線矩形指示(例如)藉由一切割鋸而發生分離之位置。
儘管前述圖式展示僅三個模組1之佈建,然在一晶圓堆疊中,在各側向方向可佈建多達十個或更多個模組1。
為提供最大保護以防止偵測到非所要光,該等晶圓PW、SW、OW、BW之各者可實質上由對於偵測構件D可偵測之光實質上不可穿透之一材料製成(透明部分t及透明區域3除外)。在一些實施方案中,該等晶圓PW、SW、OW、BW之各者係由一印刷電路板(PCB)材料形成,在一些情
況下,該印刷電路板(PCB)材料可為經纖維強化的。因此,舉例而言,光學晶圓OW之非透明部分可由諸如FR4(亦稱作Garolite)或G10(亦稱作Micarta)之一PCB材料製成。FR4係指派給玻璃強化環氧樹脂印刷電路板之一等級指定。其係由具有環氧樹脂黏結劑之耐燃編織玻璃纖維布組成之一複合材料。G10與FR4類似,但缺少自熄可燃性特性。光學晶圓OW之非透明部分可由其他類似PCB材料製成,包含藉由***以環氧樹脂黏結劑浸漬之連續玻璃編織織物同時在高壓下形成片狀物所產製之材料。
併入一光學晶圓OW之一些應用需要對光學晶圓進行嚴格厚度控制。作為一實例,一些應用之光學晶圓OW之標稱厚度可為大約395微米(μm),其中一容限為±5μm。其他應用亦可需要嚴格厚度控制,然而具有不同厚度及/或容限。
遺憾的是,簡單地拋光一標準PCB晶圓以達成所要厚度控制可能導致編織玻璃PCB材料之纖維被曝露在晶圓之表面處。為克服此問題,可將一額外樹脂層(諸如一黑色環氧樹脂材料)添加至一標準PCB晶圓之頂部表面及底部表面。頂部樹脂層及底部樹脂層應實質上由純樹脂材料(即其等不應經玻璃強化)組成。另外,該等頂部及底部樹脂層應足夠厚,使得隨後該等表面可經拋光以達成所要之厚度控制而不在複合樹脂/玻璃晶圓之頂部表面及底部表面處曝露纖維。
舉例而言,在一些應用中,期望開始於一樹脂/玻璃複合前驅體晶圓8,該樹脂/玻璃複合前驅體晶圓8在頂部表面及底部表面之各者上具有至少20μm之無玻璃黑色環氧樹脂材料(見圖13,區塊100)。將一黑色環氧樹脂用於該等頂部及底部樹脂層容許此等層對於電磁光譜之特定部分(例如對於光譜之紅外線或近紅外線部分中之輻射)亦係實質上不可穿透的。
亦可使用其他非透明樹脂材料。在圖6中所繪示之一特定實例中,一複合前驅體晶圓8具有由玻璃強化環氧樹脂組成之一核心9(其具有約380μm之一厚度)及頂部樹脂層10A及底部樹脂層10B(其各自具有約20μm之一厚度)。在其他實施方案中,該等厚度可變化。
圖7示意性地繪示一前驅體晶圓8,該前驅體晶圓8由如上文所描述之非透明材料製成且具有自該晶圓之頂部表面延伸至其之底部表面之多個開口(例如,通孔)11。舉例而言,開口11之一或多者可配置在一矩形晶格上。因為待製造之光學構件O(圖1及圖2)包括兩個透明部分t,所以開口11配置在一矩形晶格上。舉例而言,可藉由鑽孔或蝕刻來形成開口11(區塊102,圖13)。開口11之形狀可不同於所繪示之圓柱形。
接著,如圖8中所展示,以用於透明元件6之一透明材料T填充開口11(區塊104,圖13)。在填充期間,透明材料T(舉例而言,聚合物)係液體的或具黏性。可使用類似於自網版印刷所熟知之程序之一塗刷程序,或可使用例如(諸如)自半導體工業熟知且用於底填充之一施配器。可逐個實施施配,或例如可藉由使用輸出透明材料T之若干中空針同時填充若干開口。在填充期間,前驅體晶圓8可位於(例如)由聚矽氧(諸如聚二甲基矽氧烷)製成之一支撐層12上。支撐層12由一剛性支撐基板13(例如一玻璃板)支撐以實現機械穩定性。
在填充透明材料T期間,應注意防止在材料T中形成氣泡或腔,因為此可使待產製之被動光學組件L之光學性質降級。舉例而言,該施配可以一方式實施,此方式使得晶圓材料之濕潤在由前驅體晶圓8及下伏支撐層12形成之一邊緣處開始或在接近此一邊緣之一位置中開始((例如)藉由將輸出材料T之一中空針適當地引導靠近此一邊緣)。當開口11實質上充滿材
料T時,停止填充。接著,舉例而言,藉由(例如)使用熱或UV輻射進行固化而使所填充之透明材料T硬化,此促成透明區域6(區塊106,圖13)。在一些實施方案中,如此獲得之透明區域6具有兩個幾乎完全平坦之側向表面,該等側向表面與前驅體晶圓8之周圍非透明阻擋部分b形成一共用平坦表面。然而,在其他實施方案中,填充可較不平坦(例如,可形成一輕微凹面或凸面)。
接著,拋光複合晶圓8之頂部表面及底部表面以自各表面移除材料,以獲得晶圓之所要總體厚度(見圖9及圖13,區塊108)。因此,使用以上實例(其中複合前驅體晶圓8具有厚度約380μm之由玻璃強化環氧樹脂組成之一核心9且頂部樹脂層10A及底部樹脂層10B之各者具有約20μm之一厚度),執行拋光以自該等頂部表面及底部表面之各者移除大約10μm至15μm之材料以獲得約395μm±5μm之所得晶圓之一總體厚度。儘管拋光可導致該等頂部樹脂層10A及底部樹脂層10B之一大量移除,但應在移除整個頂部樹脂層10A及底部樹脂層10B之前停止拋光。如圖9所示,該頂部樹脂層10A的一部分101A及該底部樹脂層10B之一部分101B係藉由拋光而被移除。因此,儘管在前述實例中藉由拋光移除頂部樹脂層10A及底部樹脂層10B之約50%至75%,但即使在拋光完成之後該等頂部樹脂層及底部樹脂層之各者亦應留下若干微米(例如,2μm至5μm)。在一些應用中,在拋光之後留下初始樹脂層厚度之約10%至50%。
拋光可導致具有嚴格厚度控制(例如相對於絕對厚度以及相對於跨晶圓之變動)之一晶圓。舉例而言,取決於應用,光學晶圓OW之總體厚度(舉例而言)可自100μm至1000μm變化,其中一容限為±5μm至±50μm。一些應用可實現相對於絕對厚度以及相對於跨晶圓之變動之0.5%至5%(不超過5%)之光學晶圓OW之總體厚度之一變動。此外,因為薄樹脂層保留
在核心材料9之頂部表面及底部表面上,所以可在不曝露核心材料9中之玻璃纖維之情況下達成所要厚度控制。另外,拋光可導致透明元件6之更完全平坦的側向表面。
在執行拋光之後,將光學結構(例如透鏡)5施覆於透明元件6之經曝露表面(請參閱圖10、圖11及圖13,區塊110)。此可(例如)藉由複製完成,其中將一結構化表面壓印至一液體、黏性或可塑變形材料中。接著,(例如)藉由使用紫外線輻射或加熱進行固化而使該材料硬化且移除該結構化表面。因此,獲得該結構化表面之一複製品(其在此情況中係一複製陰模)。用於複製之合適材料包含(例如)可硬化或可固化聚合物材料或其他複製材料,即可藉由硬化或固化而自一液體、黏性或可塑變形狀態變形至一固體狀態之材料。
在一些實施方案中,使用具有形成待產製之光學結構5之一陰模之一結構化表面之一模子(form)而進行複製程序。在該模子中提供一合適量之複製材料,接著使具有結構化表面之模子朝向晶圓移動以使得複製材料與一透明元件6接觸。隨後,舉例而言,藉由加熱或使用光(諸如紫外線光)照射而使該複製材料硬化(例如固化)且移除模子。可逐個或一次若干個地(但僅為晶圓之一側上之所有光學結構之一小部分)完成光學結構5之形成(藉由複製或另一程序),或可針對晶圓之一側上之所有光學結構同時完成光學結構5之形成。
光學結構5可在晶圓之一側或兩側上形成(請參閱圖10及圖11)。如圖10及圖11中所展示,光學結構5之側向延伸可比透明元件6之側向延伸更大或更小或實質上相同。光學結構5可為具有幾乎任何形狀之透鏡元件,不管是折射透鏡元件及/或繞射透鏡元件或是稜鏡元件或其他元件。對一
些應用而言,透鏡元件係一合適選擇。如上文所解釋,製造程序可導致具有相對於絕對厚度以及相對於跨晶圓之變動之嚴格厚度控制之一光學晶圓OW(圖11)。
所得光學晶圓OW(圖11)可用於產製進一步產品。舉例而言,可將光學晶圓OW併入一晶圓堆疊2中(圖13,區塊112),接著將該晶圓堆疊2分成(例如藉由切割)多個個別光電模組1(見圖4、圖5及圖13,區塊114),光電模組1之各者包含一光學構件O(見圖1至圖3)。可將光學晶圓OW併入至其他類型之晶圓堆疊中,該等晶圓堆疊可包含不同類型或不同數目之晶圓。
另外,在一些應用中,即使光學晶圓OW未併入至一晶圓堆疊中,該光學晶圓本身亦可分成(例如藉由切割;見圖12)如圖2及圖3中所展示之多個光學構件O。在圖12中,細虛線矩形指示可發生分離之位置。
前述製造技術可係一自動化製程之部分。
其他實施方案係在申請專利範圍之範疇內。
Claims (15)
- 一種製造一光學晶圓之方法,該方法包括:提供一前驅體晶圓,該前驅體晶圓包括一核心區域,該核心區域由對於一特定光譜範圍之光係實質上不可穿透之一玻璃強化環氧樹脂組成,該前驅體晶圓進一步包括位於該核心區域之一頂部表面上之一第一樹脂層及位於該核心區域之一底部表面上之一第二樹脂層;在該前驅體晶圓中形成開口,該等開口自該前驅體晶圓之一頂部延伸至該前驅體晶圓之一底部;以一材料實質上填充該等開口,該材料在硬化時對於該特定光譜範圍之光係實質上可穿透的;使該等開口中之該材料硬化以形成對於該特定光譜範圍之光係實質上可穿透之透明元件;接著在不致使該核心區域之玻璃纖維被曝露之情況下,拋光該前驅體晶圓之一頂部表面及該前驅體晶圓之一底部表面以獲得具有在一預定範圍內之一厚度之一晶圓;及接著在該等透明元件之至少一些之一或多個經曝露表面上提供各別光學結構。
- 如請求項1之方法,其中該核心區域係由一複合材料組成,該複合材料由具有一環氧樹脂黏結劑之耐燃編織玻璃纖維布組成。
- 如請求項1或2之方法,其中該核心區域係由一複合材料組成,該複合材料由具有一環氧樹脂黏結劑之編織玻璃纖維布組成。
- 如請求項1或2之方法,其中該核心區域係由藉由***以一環氧樹脂黏結劑浸漬之連續玻璃編織織物所產製之一材料組成。
- 如請求項1或2之方法,其中該等第一及第二樹脂層未經玻璃強化。
- 如請求項1或2之方法,其中該等第一及第二樹脂層係由一無玻璃黑色環氧樹脂組成。
- 如請求項1或2之方法,其中,在該拋光之後,該晶圓之一總體厚度係在跨該晶圓之一預定厚度之±5μm至±50μm內。
- 如請求項1或2之方法,其中,在該拋光之後,該晶圓之總體厚度之變動跨該晶圓不超過5%。
- 如請求項1或2之方法,其中該等第一及第二樹脂層對於該特定光譜範圍之光係實質上不可穿透的。
- 如請求項9之方法,其中該特定光譜範圍包含電磁光譜之紅外線部分。
- 如請求項9之方法,其中該特定光譜範圍包含該電磁光譜之近紅外線部分。
- 如請求項1或2之方法,其中,在該拋光之後,該等第一及第二樹脂層之各者之一剩餘厚度係在該等第一及第二樹脂層之各別初始厚度之10%至50%之範圍內。
- 如請求項1或2之方法,其中位於該等透明元件上之該等光學結構包含透鏡。
- 如請求項1或2之方法,其包含使用一複製程序以提供該等光學結構。
- 如請求項1或2之方法,其中在該晶圓之相對側處之該等透明元件之經曝露表面上形成該等光學結構。
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SG11201500902SA (en) | 2015-03-30 |
CN107425030A (zh) | 2017-12-01 |
TW201413923A (zh) | 2014-04-01 |
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EP2885817B1 (en) | 2018-04-18 |
EP2885817A1 (en) | 2015-06-24 |
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EP3396716B1 (en) | 2020-10-14 |
EP2885817A4 (en) | 2016-05-04 |
US20170194303A1 (en) | 2017-07-06 |
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EP3396716A1 (en) | 2018-10-31 |
CN104781933A (zh) | 2015-07-15 |
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TWI593091B (zh) | 2017-07-21 |
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