TWI618615B - Method for forming thermosetting resin package sheet - Google Patents
Method for forming thermosetting resin package sheet Download PDFInfo
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- TWI618615B TWI618615B TW104126299A TW104126299A TWI618615B TW I618615 B TWI618615 B TW I618615B TW 104126299 A TW104126299 A TW 104126299A TW 104126299 A TW104126299 A TW 104126299A TW I618615 B TWI618615 B TW I618615B
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Abstract
本發明提出一種用於熱固性樹脂封裝料片之成型方法，包括機座、第一模具、第二模具、填料腔以及壓力閥。當第一模具移動第一加壓方向且與第二模具之間形成第一合模腔室，壓力閥加壓熱固性樹脂至第一合模腔室，包覆料片，當第二模具之活動模具移動第二加壓方向且方向相反第一加壓方向時，活動模具下壓至第一合模腔室而改變形成第二合模腔室，能夠穩定熱固性樹脂封裝料片的製程，且凝固之熱固性樹脂之成型高度可降低以及變薄，能更貼近於被包覆的料片的高度，符合生產者需求。 The invention provides a molding method for a thermosetting resin package tablet, which comprises a base, a first mold, a second mold, a filling chamber and a pressure valve. When the first mold moves the first pressing direction and forms a first clamping chamber with the second mold, the pressure valve pressurizes the thermosetting resin to the first clamping chamber, and covers the web, when the second mold is active When the mold moves the second pressing direction and the direction is opposite to the first pressing direction, the movable mold is pressed down to the first mold clamping chamber to change to form the second mold clamping chamber, which can stabilize the process of the thermosetting resin package sheet and solidify The thermosetting resin can be reduced in height and thinned, and can be closer to the height of the coated material to meet the needs of the manufacturer.
Description
本發明係關於一種成型方法，尤指一種用於熱固性樹脂封裝料片之成型方法。 The present invention relates to a molding method, and more particularly to a molding method for a thermosetting resin package sheet.
隨著科技的進步、生活的發展，電子科技產品所扮演的角色越來越重要，逐漸成為人們生活中不可或缺的產品。在電子科技產品中包含許多電子元件，為了保護電子元件不受損害，就必須將電子元件封裝成型，因此如何從料片上封裝電子元件就更顯重要。 With the advancement of technology and the development of life, the role played by electronic technology products has become more and more important, and has gradually become an indispensable product in people's lives. In electronic technology products, many electronic components are included. In order to protect electronic components from damage, electronic components must be packaged, so how to package electronic components from the chip is even more important.
傳統料片封裝成型的方式，係將料片置入模具內，再利用高分子原料(例如熱固性樹脂)，進行加熱後，以加壓或射出成型的方式，使其包覆料片並凝固成型，後續再進行其他製程。無論是將高分子原料射出成型或加壓成型，由於製程上的限制，料片承載於腔室內的基座上，當高分子原料輸入模具裡的腔室時，塑液無法越過料片的高度進而無法完成覆蓋料片的動作，同時輸入的高分子原料因壓力較大，也會對位於基座的料片造成衝撞、沖刷的效果，以致料片移位，更無法達到封裝成型的目的，因此目前都必須注入高過料片數倍的塑液，使料片上的晶片完全包覆後再進行研磨，以達所需要的高度。 In the conventional material package molding method, the material is placed in a mold, and then a polymer raw material (for example, a thermosetting resin) is used for heating, and then the material is coated and solidified by press or injection molding. Follow-up and other processes. Whether the injection or molding of the polymer material is carried out, the material is carried on the susceptor in the chamber due to the limitation of the process. When the polymer material is input into the chamber in the mold, the plastic liquid cannot exceed the height of the material. In addition, the operation of covering the material piece cannot be completed, and at the same time, the input polymer material causes a collision and scouring effect on the material piece located on the pedestal due to the large pressure, so that the material piece is displaced, and the purpose of the package molding cannot be achieved. Therefore, it is necessary to inject a plastic liquid several times higher than the material to completely cover the wafer on the web and then grind it to reach the required height.
因此，以多量的高分子原料加壓輸入腔室，雖然能完成封裝成型，然而過多已凝固的成型之高分子原料覆蓋於料片上，不符合實際輕薄的需求。因此，製造者往往需要付出更多的製程成本來彌補上述的問題。 Therefore, a large amount of polymer raw material is pressed into the input chamber, and although the package molding can be completed, the excessively solidified molded polymer material covers the material, which does not meet the actual thin and light requirements. Therefore, manufacturers often need to pay more process costs to make up for the above problems.
有鑑於此，如何提供一種封裝成型方法，在封裝成型過程中，能夠穩定控制高分子原料包覆料片，且凝固之高分子原料之高度能貼近於料片的高度，符合客戶需求，解決上述問題，本發明提出一種用於熱固性樹脂封裝料片之成型方法，其包括步驟：提供一第一模具，以一成型區承載該料片；提供一第二模具，與該第一模具位於一合模位置，該第二模具之一模腔覆蓋該成型區而形成一第一合模腔室，該第二模具以一活動模具下壓至該第一合模腔室而改變該第一合模腔室形成一第二合模腔室；提供一填料腔，容納該熱固性樹脂；提供一壓力閥，加壓該熱固性樹脂至該第一合模腔室，包覆該料片；將該第一合模腔室之該熱固性樹脂高度改變為該第二合模腔室之該熱固性樹脂高度；及該壓力閥洩壓時，部份該熱固性樹脂退料至該填料腔。 In view of this, how to provide a package molding method, in the process of packaging molding, can stably control the polymer material coating material, and the height of the solidified polymer material can be close to the height of the material, and meet the customer's needs, and solve the above The present invention provides a method for forming a thermosetting resin package sheet, comprising the steps of: providing a first mold to carry the web in a forming zone; and providing a second mold to be placed in the first mold a mold position, a cavity of the second mold covers the molding area to form a first mold clamping chamber, and the second mold is pressed into the first mold clamping chamber by a movable mold to change the first mold clamping Forming a second clamping chamber; providing a filling chamber for accommodating the thermosetting resin; providing a pressure valve, pressing the thermosetting resin to the first clamping chamber to cover the web; The thermosetting resin height of the mold clamping chamber is changed to the height of the thermosetting resin of the second mold clamping chamber; and when the pressure valve is released, part of the thermosetting resin is returned to the filler chamber.
於一實施例中，以該成型區承載該料片之步驟前，更包括以一承載座置放該料片 In an embodiment, before the step of carrying the web by the forming zone, the method further comprises placing the web with a carrier.
於一實施例中，以該成型區承載該料片之步驟時，更包括以至少一定位柱固定該料片。 In one embodiment, the step of carrying the web in the forming zone further comprises fixing the web with at least one positioning post.
於一實施例中，以該活動模具下壓至該第一合模腔室而改變該第一合模腔室形成一第二合模腔室之步驟時，更包括以至少一第三移動 機構驅動該活動模具。 In an embodiment, when the movable mold is pressed down to the first mold clamping chamber to change the first mold clamping chamber to form a second mold clamping chamber, the method further comprises at least one third movement. The mechanism drives the active mold.
於一實施例中，以該第一模具與該第二模具位於一合模位置之步驟時，更包括以至少一第一移動機構驅動該第一模具移動。 In an embodiment, the step of positioning the first mold and the second mold in a clamping position further comprises driving the first mold movement by at least one first moving mechanism.
於一實施例中，以該第一模具與該第二模具位於一合模位置之步驟時，更包括以至少一第二移動機構驅動該第二模具移動。 In an embodiment, the step of positioning the first mold and the second mold in a clamping position further comprises driving the second mold movement by using at least one second moving mechanism.
於一實施例中，以將該第一合模腔室之該熱固性樹脂高度改變為該第二合模腔室之該熱固性樹脂高度之步驟後，更包括以該第一模具之至少一第一頂出機構頂出該熱固性樹脂進行退料。 In an embodiment, after the step of changing the height of the thermosetting resin of the first mold clamping chamber to the height of the thermosetting resin of the second mold clamping chamber, further comprising at least one of the first molds The ejector mechanism ejects the thermosetting resin for returning.
於一實施例中，以將該第一合模腔室之該熱固性樹脂高度改變為該第二合模腔室之該熱固性樹脂高度之步驟後，更包括以該第二模具之至少一第二頂出機構頂出該熱固性樹脂進行退料。 In an embodiment, after the step of changing the height of the thermosetting resin of the first mold clamping chamber to the height of the thermosetting resin of the second mold clamping chamber, further comprising at least one second of the second mold The ejector mechanism ejects the thermosetting resin for returning.
於一實施例中，以該壓力閥加壓該熱固性樹脂至該第一合模腔室之步驟中，更包括將該熱固性樹脂經由一進出料流道進料至該第一合模腔室。 In one embodiment, the step of pressurizing the thermosetting resin to the first mold clamping chamber by the pressure valve further comprises feeding the thermosetting resin to the first mold clamping chamber via an inlet and outlet flow passage.
於一實施例中，以該壓力閥洩壓時，部份該熱固性樹脂退料至該填料腔之步驟中，更包括將該熱固性樹脂經由該進出料流道退料至該填料腔。 In an embodiment, when the pressure valve is released from pressure, part of the thermosetting resin is returned to the filling chamber, and the thermosetting resin is further discharged to the filling chamber through the inlet and outlet channels.
本發明之熱固性樹脂封裝料片之成型方法，在熱固性樹脂經加熱後，以壓力閥加壓熱固性樹脂至第一合模腔室以完成包覆的步驟中，活動模具下壓至第一合模腔室而改變第一合模腔室形成第二合模腔室，改變熱固性樹脂成型的高度，部份的熱固性樹脂由進出料流道退料至壓力閥。透過上述之運作，能夠穩定熱固性樹脂封裝料片的製程，且凝固之熱 固性樹脂之成型高度可降低以及變薄，能更貼近於被包覆的料片的高度，符合實際需求，徹底解決上述先前技術所遭遇的問題。 In the method for molding a thermosetting resin package tablet according to the present invention, after the thermosetting resin is heated, the thermosetting resin is pressed by a pressure valve to the first mold clamping chamber to complete the coating step, and the movable mold is pressed down to the first mold clamping step. The chamber changes the first mold clamping chamber to form a second mold clamping chamber, and the height of the thermosetting resin is changed. Part of the thermosetting resin is discharged from the inlet and outlet channels to the pressure valve. Through the above operation, the process of the thermosetting resin package sheet can be stabilized, and the heat of solidification can be achieved. The molding height of the curable resin can be reduced and thinned, and can be closer to the height of the coated material, which meets the actual needs and completely solves the problems encountered in the prior art mentioned above.
以下在實施方式中詳細敘述本發明之詳細特徵以及優點，其內容足以使任何熟習相關技藝者瞭解本發明之技術內容並以據以實施，且根據本說明書所揭露之內容、申請專利範圍及圖式，任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。 The detailed features and advantages of the present invention are described in detail in the embodiments of the present invention, which are to be understood by those skilled in the art and The related objects and advantages of the present invention will be readily understood by those skilled in the art.
1‧‧‧成型機台 1‧‧‧Molding machine
10‧‧‧機座 10‧‧‧ machine base
10a‧‧‧底座 10a‧‧‧Base
10b‧‧‧支撐桿 10b‧‧‧Support rod
10c‧‧‧頂板 10c‧‧‧ top board
101‧‧‧工作平台 101‧‧‧Working platform
102‧‧‧加工區域 102‧‧‧Processing area
103‧‧‧操控按鈕 103‧‧‧Control button
104‧‧‧操控面板 104‧‧‧Control panel
11‧‧‧第一模具 11‧‧‧First mould
111‧‧‧成型區 111‧‧‧Forming area
112‧‧‧承載座 112‧‧‧ bearing seat
113‧‧‧定位柱 113‧‧‧Positioning column
114‧‧‧定位桿 114‧‧‧ Positioning rod
115‧‧‧第一頂出機構 115‧‧‧First launching agency
116‧‧‧第一移動機構 116‧‧‧First mobile agency
12‧‧‧第二模具 12‧‧‧Second mold
121‧‧‧模腔 121‧‧‧ cavity
122‧‧‧活動模具 122‧‧‧ activity mould
123‧‧‧進出料流道 123‧‧‧In and out flow channels
124‧‧‧套合桿 124‧‧‧Set of rods
125‧‧‧第二頂出機構 125‧‧‧Second ejection agency
126‧‧‧第二移動機構 126‧‧‧Second mobile agency
126a‧‧‧鎖接元件 126a‧‧‧Locking components
127‧‧‧第三移動機構 127‧‧‧ Third mobile agency
127a‧‧‧鎖接元件 127a‧‧‧Locking components
127b‧‧‧油管 127b‧‧‧Tube
13‧‧‧填料腔 13‧‧‧Packing chamber
14‧‧‧壓力閥 14‧‧‧pressure valve
141‧‧‧連桿 141‧‧‧ Connecting rod
142‧‧‧活塞 142‧‧‧Piston
16‧‧‧第一合模腔室 16‧‧‧First Clamping Chamber
17‧‧‧第二合模腔室 17‧‧‧Second clamping chamber
2‧‧‧料片 2‧‧‧materials
21‧‧‧晶片 21‧‧‧ wafer
22‧‧‧電路板 22‧‧‧ Circuit board
3‧‧‧熱固性樹脂 3‧‧‧ thermosetting resin
D1‧‧‧高度 D1‧‧‧ Height
D2‧‧‧高度 D2‧‧‧ height
P1‧‧‧第一加壓方向 P1‧‧‧First pressurization direction
P2‧‧‧第二加壓方向 P2‧‧‧Second pressure direction
Step501‧‧‧提供一第一模具，以一成型區承載該料片 置，該第二模具之一模腔覆蓋該成型區而形成一第一合模腔室，該第二模具以一活動模具下壓至該第一合模腔室而改變該第一合模腔室形成一第二合模腔室 Step 501‧‧‧ provides a first mold to carry the web in a forming zone a cavity of the second mold covers the molding area to form a first mold clamping chamber, and the second mold is pressed into the first mold clamping chamber by a movable mold to change the first mold cavity Forming a second clamping chamber
Step503‧‧‧提供一填料腔，容納該熱固性樹脂 Step 503‧‧‧ Provide a packing chamber to accommodate the thermosetting resin
Step504‧‧‧提供一壓力閥，加壓該熱固性樹脂至該第一合模腔室，包覆該料片 Step 504 ‧ ‧ provides a pressure valve, pressurizing the thermosetting resin to the first clamping cavity, covering the material
Step505‧‧‧將該第一合模腔室之該熱固性樹脂高度改變為該第二合模腔室之該熱固性樹脂高度 Step 505. The height of the thermosetting resin of the first mold clamping chamber is changed to the height of the thermosetting resin of the second mold clamping chamber
Step506‧‧‧該壓力閥洩壓時，部份該熱固性樹脂退料至該填料腔 Step506‧‧‧ When the pressure valve is released, part of the thermosetting resin is returned to the filling chamber
第1圖：為本發明之一實施例成型過程之步驟流程圖。 Figure 1 is a flow chart showing the steps of a molding process in accordance with one embodiment of the present invention.
第2圖：為本發明之一實施例組裝於機台之立體示意圖。 Figure 2 is a perspective view of an embodiment of the present invention assembled on a machine table.
第3圖：為本發明之一實施例使用時之側視示意圖。 Figure 3 is a side elevational view showing the use of an embodiment of the present invention.
第4圖：為本發明之另一實施例使用時之側視示意圖(一)。 Figure 4 is a side elevational view (I) of another embodiment of the present invention when used.
第5圖：為本發明之另一實施例運用成型機台之立體示意圖。 Fig. 5 is a perspective view showing the use of a molding machine in accordance with another embodiment of the present invention.
第6圖：為本發明之另一實施例使用時之側視示意圖(二)。 Figure 6 is a side elevational view (ii) of another embodiment of the present invention when used.
第7圖：為本發明之另一實施例使用時之側視示意圖(三)。 Figure 7 is a side elevational view (3) of another embodiment of the present invention when used.
第8圖：為本發明之另一實施例使用時之側視示意圖(四)。 Figure 8 is a side elevational view (4) of another embodiment of the present invention when used.
第9圖：為本發明之另一實施例使用時之側視示意圖(五)。 Figure 9 is a side elevational view (5) of another embodiment of the present invention when used.
第10圖：為本發明之熱固性樹脂進料路徑之側視示意圖。 Figure 10 is a side elevational view of the feed path of the thermosetting resin of the present invention.
第11圖：為本發明之熱固性樹脂卸料路徑之側視示意圖。 Figure 11 is a side elevational view of the unsealing path of the thermoset resin of the present invention.
第12圖：為本發明之成型機台中模具之分解示意圖。 Fig. 12 is a schematic exploded view of the mold in the molding machine of the present invention.
第13圖：為本發明之置放料片前之外觀示意圖。 Figure 13 is a schematic view showing the appearance of the material before the placement of the sheet of the present invention.
第14圖：為本發明之置放料片後之外觀示意圖。 Figure 14 is a schematic view showing the appearance of the tablet after the present invention.
第15圖：為本發明之複數成品示意圖。 Figure 15 is a schematic view of a plurality of finished products of the present invention.
以下藉由具體實施例說明本發明之實施方式，熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。 The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.
本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本發明可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本發明所能產生之功效及所能達成之目的下，均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時，本說明書中所引用之如“一”、“兩”、“上”等之用語，亦僅為便於敘述之明瞭，而非用以限定本發明可實施之範圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本發明可實施之範疇。 The structure, the proportions, the sizes, and the like of the present invention are only used to clarify the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The conditions are not technically meaningful, and any modification of the structure, change of the proportional relationship or adjustment of the size should remain in the present invention without affecting the effects and the achievable objectives of the present invention. The technical content revealed can be covered. In the meantime, the terms "a", "an", "the" and "the" are used in the description, and are not intended to limit the scope of the invention. Adjustments, where there is no material change, are considered to be within the scope of the invention.
請參閱第1圖，為成型過程之步驟流程圖，並請同時參閱第6圖至第9圖。熱固性樹脂封裝料片之成型方法的步驟包括： Please refer to Figure 1 for the flow chart of the molding process, and please refer to Figure 6 to Figure 9. The steps of the method for molding the thermosetting resin package tablet include:
Step501：提供一第一模具11，以一成型區111承載該料片2。 Step 501: A first mold 11 is provided to carry the web 2 in a molding zone 111.
Step502：提供一第二模具12，與該第一模具11位於一合模位置，該第二模具12之一模腔121覆蓋該成型區111而形成一第一合模腔室16，該第二模具12以一活動模具122下壓至該第一合模腔室16而改變該第一合模腔室16形成一第二合模腔室17。 Step 502: providing a second mold 12, and the first mold 11 is located at a clamping position, and a cavity 121 of the second mold 12 covers the molding area 111 to form a first mold clamping chamber 16, the second The mold 12 is pressed down to the first mold clamping chamber 16 by a movable mold 122 to change the first mold clamping chamber 16 to form a second mold clamping chamber 17.
Step503：提供一填料腔13，容納該熱固性樹脂3。 Step 503: A filling chamber 13 is provided to accommodate the thermosetting resin 3.
Step504：提供一壓力閥14，加壓該熱固性樹脂3至該第一合模腔室16，包覆該料片2。 Step 504: A pressure valve 14 is provided to pressurize the thermosetting resin 3 to the first mold clamping chamber 16 to coat the web 2.
Step505：將該第一合模腔室16之該熱固性樹脂3高度D1改變為該第二合模腔室17之該熱固性樹脂3高度D2。 Step 505: changing the height D1 of the thermosetting resin 3 of the first mold clamping chamber 16 to the height D2 of the thermosetting resin 3 of the second mold clamping chamber 17.
Step506：該壓力閥14洩壓時，部份該熱固性樹脂3退料至該填料腔13。 Step 506: When the pressure valve 14 is released from pressure, part of the thermosetting resin 3 is returned to the filling chamber 13 .
請參閱第2圖及第3圖，為成型方法使用之成型機台1，成型機台1包括機座10、第一模具11、第二模具12、填料腔13以及壓力閥14。機座10為一操作加工機具，機座10由一底座10a及底座10a上方支撐桿10b及頂板10c所組成，此外，機座10包括一工作平台101及加工區域102，工作平台101位於底座10a表面，加工區域102位於工作平台101一側，特別是，加工區域102位於底座10a與頂板10c之間。此外，機座10更包括操控按鈕103及操控面板104，操控按鈕103及操控面板104設置於底座10a前側而位置工作平台101的外部，以操控按鈕103或操控面板104控制加工作業的啟動、關閉或停止等動作，並可藉由操控面板104顯示成型機台1各項運行作業的數值，以便於查看運作資訊並可得知相關故障位置訊息而有效排除的作用。 Referring to FIGS. 2 and 3, a molding machine 1 for use in a molding method includes a base 10, a first die 11, a second die 12, a packing chamber 13, and a pressure valve 14. The base 10 is a working machine. The base 10 is composed of a base 10a and a support rod 10b and a top plate 10c. The base 10 includes a working platform 101 and a processing area 102. The working platform 101 is located at the base 10a. The surface, the processing area 102 is located on the side of the work platform 101, and in particular, the processing area 102 is located between the base 10a and the top plate 10c. In addition, the base 10 further includes a control button 103 and a control panel 104. The control button 103 and the control panel 104 are disposed on the front side of the base 10a and outside the position work platform 101, and the control button 103 or the control panel 104 controls the start and close of the machining operation. Or stop the action, and the value of each running operation of the molding machine 1 can be displayed by the control panel 104, so as to view the operation information and know the relevant fault location information and effectively eliminate the effect.
請參閱第1圖、第6圖至第11圖，第一模具11設置於加工區域102，第一模具11包括成型區111，第二模具12設置於加工區域102而位於第一模具11的一側。成型方法中，以壓力閥14加壓該熱固性樹脂3至第一合模腔室16之步驟中，更包括將熱固性樹脂3經由一進出料流道123進料至第一合模腔室16。並且，以壓力閥14洩壓時，部份熱固性樹脂3退料至填料腔13之步驟中，更包括將熱固性樹脂3經由進出料流道123退料至填料腔13。也 就是，第二模具12包括模腔121、活動模具122及進出料流道123，模腔121對應上述成型區111，活動模具122的一面位於模腔121內側壁面，進出料流道123一端連通於模腔121。填料腔13位於第一模具11而連通於進出料流道123之另一端，填料腔13可容納熱固性樹脂3。壓力閥14則相鄰於填料腔13一側。 Referring to FIG. 1 and FIG. 6 to FIG. 11 , the first mold 11 is disposed in the processing region 102 , the first mold 11 includes a molding region 111 , and the second mold 12 is disposed in the processing region 102 and is located in the first mold 11 . side. In the molding method, the step of pressurizing the thermosetting resin 3 to the first mold clamping chamber 16 with the pressure valve 14 further includes feeding the thermosetting resin 3 to the first mold clamping chamber 16 via an inlet and outlet flow passage 123. Moreover, when the pressure valve 14 is released from pressure, a part of the thermosetting resin 3 is returned to the filling chamber 13 , and the thermosetting resin 3 is further discharged to the filling chamber 13 via the inlet and outlet flow passages 123 . and also That is, the second mold 12 includes a cavity 121, a movable mold 122, and an inlet and outlet flow passage 123. The cavity 121 corresponds to the molding zone 111. One side of the movable mold 122 is located on the inner wall surface of the cavity 121, and one end of the inlet and outlet flow passage 123 communicates with Cavity 121. The packing chamber 13 is located at the other end of the first mold 11 and communicates with the inlet and outlet flow passage 123, and the filling chamber 13 can accommodate the thermosetting resin 3. The pressure valve 14 is adjacent to the side of the packing chamber 13.
接著請參閱第1圖、第12至14圖，成型方法中，以成型區111承載料片2之步驟前，更包括以承載座112置放料片2。特別是，第一模具11包括可進一步包括有承載座112，承載座112用以置放料片2，本實施例中，將料片2亦可直接置放於第一模具11表面，可省略承載座112的設置成本。在成型方法中，以成型區111承載該料片2之步驟時，更包括以至少一定位柱113固定該料片2。也就是，第一模具11包括至少一定位柱113，而定位柱113則是當放料片2時，用以固定料片2。除此之外，第一模具11包含定位桿114，第二模具12相對於第一模具11，則有套合桿124，在第一模具11與第二模具12相互接近、壓縮時，定位桿114與套合桿124則可相互密合，具有定位的作用。 Next, referring to FIG. 1 and FIGS. 12 to 14, in the molding method, before the step of carrying the web 2 in the molding zone 111, the material 2 is placed on the carrier 112. In particular, the first mold 11 may further include a carrier 112 for placing the web 2. In this embodiment, the web 2 may be directly placed on the surface of the first mold 11 and may be omitted. The installation cost of the carrier 112. In the molding method, the step of carrying the web 2 in the forming zone 111 further comprises fixing the web 2 with at least one positioning post 113. That is, the first mold 11 includes at least one positioning post 113, and the positioning post 113 is used to fix the web 2 when the sheet 2 is discharged. In addition, the first mold 11 includes a positioning rod 114, and the second mold 12 has a sleeve rod 124 with respect to the first mold 11, and when the first mold 11 and the second mold 12 are close to each other and compressed, the positioning rod The 114 and the sleeve rods 124 are in close contact with each other and have a positioning function.
接著請參閱第3圖、第6圖至第9圖、第13圖，第一模具11中的承載座112具有一料片2，熱固性樹脂3材料置放於填料腔13。第6圖顯示第一模具11向上移動至合模位置，當第一模具11移動第一加壓方向P1時，承載座112進入第二模具12的膜腔中，模腔121覆蓋成型區111而形成第一合模腔室16，接著在加熱熱固性樹脂3後，其形成塑液狀態，請參閱第7圖，此時將壓力閥14加壓，致熱固性樹脂3(塑液狀態)流入至第一合模腔室16而包覆料片2，其流動方向以及狀態請參閱第10圖。接著請參閱第8圖，此 時將壓力閥14洩壓，並且活動模具122向下至擠壓位置，第二模具12之活動模具122移動第二加壓方向P2，第二加壓方向P2相反第一加壓方向P1，使得第一合模腔室16形成第二合模腔室17，由於熱固性樹脂3為塑液狀態，部份的熱固性樹脂3由進出料流道123退料至壓力閥14，藉由將第一合模腔室16之熱固性樹脂3高度D1改變為第二合模腔室17之熱固性樹脂3高度D2方式，將多餘的熱固性樹脂3退料至壓力閥14，而使得凝固成型後的熱固性樹脂3，其封裝在料片2外的熱固性樹脂3高度可降低以及變薄，能更貼近於被包覆的料片2的高度，並且，部分的熱固性樹脂3退料至壓力閥14的流動方向與狀態，如第11圖所示。 Next, referring to FIG. 3, FIG. 6 to FIG. 9 and FIG. 13, the carrier 112 in the first mold 11 has a web 2 on which the thermosetting resin 3 material is placed. 6 shows that the first mold 11 is moved upward to the clamping position, and when the first mold 11 moves in the first pressing direction P1, the carrier 112 enters the film cavity of the second mold 12, and the cavity 121 covers the molding area 111. The first mold clamping chamber 16 is formed, and after the thermosetting resin 3 is heated, it is in a molten metal state. Referring to FIG. 7, the pressure valve 14 is pressurized, and the thermosetting resin 3 (plastic state) flows into the first stage. The film 2 is covered by a mold clamping chamber 16, and the flow direction and state thereof are shown in Fig. 10. Then see Figure 8, this When the pressure valve 14 is released, and the movable mold 122 is pressed down to the pressing position, the movable mold 122 of the second mold 12 is moved to the second pressing direction P2, and the second pressing direction P2 is opposite to the first pressing direction P1, so that The first mold clamping chamber 16 forms a second mold clamping chamber 17. Since the thermosetting resin 3 is in a plastic state, a part of the thermosetting resin 3 is discharged from the inlet and outlet flow passages 123 to the pressure valve 14 by the first combination. The height D1 of the thermosetting resin 3 of the mold chamber 16 is changed to the height D2 of the thermosetting resin 3 of the second mold clamping chamber 17, and the excess thermosetting resin 3 is returned to the pressure valve 14, so that the thermosetting resin 3 after solidification molding, The height of the thermosetting resin 3 encapsulated outside the web 2 can be lowered and thinned, can be closer to the height of the coated web 2, and part of the thermosetting resin 3 is returned to the flow direction and state of the pressure valve 14. As shown in Figure 11.
請再參閱第1圖、第10圖及第11圖，成型方法中，以將第一合模腔室16之該熱固性樹脂3高度D1改變為第二合模腔室17之該熱固性樹脂3高度D2之步驟後，更包括以第一模具11之至少一第一頂出機構115頂出熱固性樹脂3進行退料(如第9圖所示)。也就是，於此實施例中，第一模具11包括至少一第一頂出機構115，其一端延伸至成型區111而接觸熱固性樹脂3，第一頂出機構115的設置在於幫助經熱固性樹脂3封裝成型後的成品脫離第一模具11。相對地，進一步於其他實施例中，可以第二模具12之至少一第二頂出機構125頂出熱固性樹脂3進行退料，也就是，經熱固性樹脂3封裝成型後的成品是成型於第二模具12內，則第二模具12中包括至少一第二頂出機構125，其一端延伸至模腔121而接觸熱固性樹脂3(如第6圖、第7圖所示)。第二頂出機構125的設置在於幫助經熱固性樹脂3封裝成型後的成品脫離第二模具12，本發明並不以此為限制。 Referring to FIG. 1 , FIG. 10 and FIG. 11 again, in the molding method, the height D1 of the thermosetting resin 3 of the first mold clamping chamber 16 is changed to the height of the thermosetting resin 3 of the second mold clamping chamber 17. After the step of D2, the method further comprises: discharging the thermosetting resin 3 by at least one first ejecting mechanism 115 of the first mold 11 to perform the returning (as shown in FIG. 9). That is, in this embodiment, the first mold 11 includes at least one first ejecting mechanism 115, one end of which extends to the molding zone 111 to contact the thermosetting resin 3, and the first ejecting mechanism 115 is disposed to assist the thermosetting resin 3 The finished product after the package molding is separated from the first mold 11. In contrast, in other embodiments, at least one second ejecting mechanism 125 of the second mold 12 can eject the thermosetting resin 3 to perform the returning, that is, the finished product after being molded by the thermosetting resin 3 is molded into the second. In the mold 12, the second mold 12 includes at least one second ejecting mechanism 125, one end of which extends to the cavity 121 to contact the thermosetting resin 3 (as shown in FIGS. 6 and 7). The second ejecting mechanism 125 is disposed to help the finished product packaged by the thermosetting resin 3 to be detached from the second mold 12, and the present invention is not limited thereto.
請再參閱第6圖至第9圖，成型方法中，以第一模具11與第二 模具12位於一合模位置之步驟時，更包括以至少一第一移動機構116驅動該第一模具11移動。也就是，第一模具11包括至少一第一移動機構116，至少一第一移動機構116一側連接第一模具11一側，至少一第一移動機構116另一側連接工作平台101一側。第一移動機構116提供動力，協助第一模具11向第二模具12移動。而在其他的實施例中，可以至少一第二移動機構126驅動該第二模具12移動。也就是，第二模具12中包括至少一第二移動機構126，至少一第二移動機構126一側連接第二模具12一側，此時則是第二移動機構126提供動力，幫助第二模具12向第一模具11移動。再者，亦有第一模具11與第二模具12相對壓縮移動，本發明之熱固性樹脂3封裝料片2之成型方法並不限定上述任一第一模具11與第二模具12相互壓縮的方式。第一移動機構116與第二移動機構126可以由油壓缸驅動，或經由螺桿機構傳動，第二移動機構126以油壓缸結構時，則以鎖接元件126a鎖固在第二模具12頂板(如第4圖及第5圖所示)，亦可以視需要改換為馬達驅動，其中馬達可以是感應馬達、步進馬達或精度更高的伺服馬達等。 Please refer to FIG. 6 to FIG. 9 again, in the molding method, with the first mold 11 and the second When the mold 12 is located at a clamping position, the method further includes driving the first mold 11 to move by the at least one first moving mechanism 116. That is, the first mold 11 includes at least one first moving mechanism 116, at least one side of the first moving mechanism 116 is connected to the side of the first mold 11, and the other side of the at least one first moving mechanism 116 is connected to the side of the working platform 101. The first moving mechanism 116 provides power to assist the first mold 11 to move toward the second mold 12. In other embodiments, at least one second moving mechanism 126 can drive the second mold 12 to move. That is, the second mold 12 includes at least one second moving mechanism 126, and at least one second moving mechanism 126 is connected to one side of the second mold 12, and at this time, the second moving mechanism 126 provides power to assist the second mold. 12 moves to the first mold 11. Furthermore, the first mold 11 and the second mold 12 are relatively compressed and moved, and the molding method of the thermosetting resin 3 package sheet 2 of the present invention does not limit the manner in which any of the first mold 11 and the second mold 12 are compressed with each other. . The first moving mechanism 116 and the second moving mechanism 126 can be driven by the hydraulic cylinder or by the screw mechanism. When the second moving mechanism 126 is in the hydraulic cylinder structure, the second mold 12 is locked by the locking component 126a. (As shown in Figures 4 and 5), it can also be changed to motor drive as needed. The motor can be an induction motor, a stepper motor or a servo motor with higher precision.
另外，成型方法中，以活動模具122下壓至第一合模腔室16而改變該第一合模腔室16形成一第二合模腔室17之步驟時，更包括以至少一第三移動機構127驅動活動模具122。也就是，第二模具12包括至少一第三移動機構127，至少一第三移動機構127連接活動模具122，在此，至少一第三移動機構127可以是油壓缸(如第4圖所示)或是馬達(如第3圖)等元件，至少一第三移動機構127以油壓缸結構時，則以鎖接元件127a鎖固在第二模具12頂板(如第4圖及第5圖所示)。至少一第三移動機構127為馬達驅動結構時(如第3圖所示)，可將馬達埋設於第二模具12所形成的凹槽中， 並以油管127b連接並傳輸動力來源，至少一第三移動機構127用於推動活動模具122下壓使得第一合模腔室16形成第二合模腔室17。而在壓力閥14中，包括連桿141及活塞142，活塞142位於填料腔13，連桿141一端連接活塞142，連桿141另一端延伸至填料腔13外部，連桿141與活塞142則是幫助壓力閥14加壓，促使液態的熱固性樹脂3流入第一合模腔室16。 In addition, in the molding method, when the movable mold 122 is pressed down to the first mold clamping chamber 16 and the first mold clamping chamber 16 is changed to form a second mold clamping chamber 17, the method further includes at least one third. The moving mechanism 127 drives the movable mold 122. That is, the second mold 12 includes at least one third moving mechanism 127, and at least one third moving mechanism 127 is connected to the movable mold 122. Here, the at least one third moving mechanism 127 may be a hydraulic cylinder (as shown in FIG. 4). Or a motor (such as Figure 3), etc., when at least one of the third moving mechanisms 127 is in the hydraulic cylinder structure, the locking member 127a is locked on the top plate of the second mold 12 (as shown in Figures 4 and 5). Shown). When at least one of the third moving mechanisms 127 is a motor driving structure (as shown in FIG. 3), the motor can be embedded in the recess formed by the second mold 12, The power source is connected and transmitted by the oil pipe 127b, and at least one third moving mechanism 127 is used to push the movable mold 122 down so that the first mold clamping chamber 16 forms the second mold clamping chamber 17. In the pressure valve 14, including the connecting rod 141 and the piston 142, the piston 142 is located in the filling chamber 13, one end of the connecting rod 141 is connected to the piston 142, the other end of the connecting rod 141 extends to the outside of the filling chamber 13, and the connecting rod 141 and the piston 142 are The pressure valve 14 is pressurized to cause the liquid thermosetting resin 3 to flow into the first mold clamping chamber 16.
接著請參閱第15圖，複數料片2經本發明之熱固性樹脂3封裝料片2之成型方法加工後之複數成品。上述之實施例(第6圖至第11圖)是以單一料片2封裝成型說明，然而，本發明之熱固性樹脂3封裝料片2之成型方法，是可應用於封裝複數料片2，在複數料片2經熱固性樹脂3封裝料片2之成型包裝覆後，經刀工將封裝完成的料片2一一切割成獨立成品，後續再進行其他加工製程。 Next, referring to Fig. 15, the plurality of blanks 2 are processed by the molding method of the thermosetting resin 3 package sheet 2 of the present invention. The above embodiments (Fig. 6 to Fig. 11) are packaged in a single sheet 2, however, the molding method of the thermosetting resin 3 package sheet 2 of the present invention can be applied to package a plurality of sheets 2, After the plurality of webs 2 are covered by the molding package of the thermosetting resin 3 encapsulating web 2, the packaged web 2 is cut into individual products one by one by a knife, and then other processing processes are performed.
在上述的實施例中，本發明所指的料片2，可以包括晶片21及電路板22，且晶片21連接電路板22上。除此之外，於一些實施例中，可應用於表面貼焊元件(Surface Mount Device，SMD)或者是雙列直插封裝元件(Dual In-Line Package，DIP)的封裝成型，本發明並不以此為限。 In the above embodiment, the web 2 referred to in the present invention may include a wafer 21 and a circuit board 22, and the wafer 21 is connected to the circuit board 22. In addition, in some embodiments, it can be applied to a surface mount device (SMD) or a package package of a dual in-line package (DIP). This is limited to this.
綜合上述，可以得知本發明之熱固性樹脂3封裝料片2之成型方法，在料片2進行封裝包覆的過程中，活動模具122下壓至第一合模腔室16而改變第一合模腔室16形成第二合模腔室17，可改變熱固性樹脂3成型的高度，將部份的熱固性樹脂3由進出料流道123退料至壓力閥14。使凝固之熱固性樹脂3之成型高度可降低以及變薄，能更貼近於被包覆的料片2的高度，也就是說，成品可以更符合實際需求，穩定熱固性樹脂3封裝料片2的製程。 In summary, the molding method of the thermosetting resin 3 package material sheet 2 of the present invention can be known. During the package coating process of the material sheet 2, the movable mold 122 is pressed down to the first mold clamping chamber 16 to change the first combination. The cavity chamber 16 forms a second mold clamping chamber 17 which changes the height of the thermosetting resin 3 to be formed, and a part of the thermosetting resin 3 is discharged from the inlet and outlet flow passages 123 to the pressure valve 14. The molding height of the solidified thermosetting resin 3 can be reduced and thinned, and can be closer to the height of the coated web 2, that is, the finished product can be more in line with actual needs, and the process of stabilizing the thermosetting resin 3 package sheet 2 can be stabilized. .
上述實施例僅為例示性說明本發明的原理及其功效，而非用於限制本發明。任何熟悉此項技藝的人士均可在不違背本發明的精神及範疇下，對上述實施例進行修改。因此本發明的權利保護範圍，應如後述申請專利範圍所列。 The above embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as listed in the scope of the patent application described later.
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| TW201511355A (en) * | 2006-06-02 | 2015-03-16 | Hitachi Chemical Co Ltd | Thermosetting resin composition, molding material, package for carrying optical semiconductor element and production method thereof and optical semiconductor device |
| TW201516122A (en) * | 2013-09-24 | 2015-05-01 | Nitto Denko Corp | Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package |
-
2015
- 2015-08-12 TW TW104126299A patent/TWI618615B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006103962A1 (en) * | 2005-03-25 | 2006-10-05 | Sumitomo Bakelite Co., Ltd. | Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulation |
| TW201511355A (en) * | 2006-06-02 | 2015-03-16 | Hitachi Chemical Co Ltd | Thermosetting resin composition, molding material, package for carrying optical semiconductor element and production method thereof and optical semiconductor device |
| JP2012227441A (en) * | 2011-04-21 | 2012-11-15 | Sumitomo Bakelite Co Ltd | Semiconductor device manufacturing method and semiconductor device |
| TW201340412A (en) * | 2012-02-28 | 2013-10-01 | Towa Corp | Resin sealing device and manufacturing method for resin sealing body |
| TW201516122A (en) * | 2013-09-24 | 2015-05-01 | Nitto Denko Corp | Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package |
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| TW201706105A (en) | 2017-02-16 |
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