TWI617812B - Test socket for fine pitch package testing - Google Patents
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Abstract
本發明提供一種用於細間距封裝測試之測試座，包含：測試針套件，包括測試針上部套件、測試針中間套件以及測試針底部套件，其中試針上部套件具有第一穿孔，測試針中間套件具有第二穿孔，而測試針底部套件具有第三穿孔；以及測試針，包含前端部分、彎曲部分與後端部分，該彎曲部分連接前端部分與後端部分；其中該前端部分穿過第一穿孔以利於電性耦合影像感測晶片，而該後端部分穿過第二穿孔與第三穿孔。 The invention provides a test stand for a fine pitch package test, comprising: a test pin set comprising a test pin upper set, a test pin intermediate set and a test pin bottom set, wherein the test pin upper set has a first perforation, a test pin intermediate set Having a second perforation, and the test pin bottom set has a third perforation; and a test pin including a front end portion, a curved portion and a rear end portion, the curved portion connecting the front end portion and the rear end portion; wherein the front end portion passes through the first perforation In order to facilitate the electrically coupled image sensing wafer, the rear end portion passes through the second through hole and the third through hole.
Description
本發明有關於一種半導體元件之測試座，更詳而言之，其為一種用於細間距封裝測試之測試座。 The present invention relates to a test stand for a semiconductor component, and more particularly to a test stand for fine pitch package testing.
隨著時代的進步，人類對科技產品的需求已越來越高，在產品保持輕薄短小的原則下，功能需求卻只增不減。在對於功能增強但體積縮小的情形下，電子電路已逐漸走向積體化。在製作有著強大功能的晶片時，所需的製作成本也隨之提高。對於這些昂貴的晶片而言，品質管制的要求也必須越來越高。 With the advancement of the times, human demand for technology products has become higher and higher. Under the principle of keeping products thin and short, the functional requirements have only increased. In the case of functional enhancement but volume reduction, electronic circuits have gradually become integrated. When you make a powerful chip, the cost of production is increased. For these expensive wafers, the quality control requirements must also be higher and higher.
影像感測晶片，例如互補式金屬氧化層半導體影像感測晶片(CMOS image sensor)或電荷耦合元件(CCD)等，在經過封裝之後，仍須進行最終測試。 The image sensing wafer, such as a complementary metal oxide semiconductor CMOS image sensor or a charge coupled device (CCD), is still subjected to final testing after being packaged.
隨著數位相機、行動電話、平板電腦、筆記型電腦、車用攝像頭以及各式監視器等大量普及，造就了攝像裝置龐大的需求規模，也逐步地提升影像感測器測試領域的蓬勃發展。 With the proliferation of digital cameras, mobile phones, tablets, notebook computers, car cameras, and various types of monitors, the huge demand for camera devices has increased, and the field of image sensor testing has been gradually developed.
在準備出廠的影像感測晶片中，都一定要經過產品的檢測。傳統方法上，為了測試這些精密的影像感測晶片元件，待測晶片將焊接於測試電路板之上。然而，待測晶片焊接於測試電路板之上，測試完成之後難以取下，易使該待測晶片變成耗材，產生多餘的成本。此外，待測晶片於焊接時，常造成接腳折損，亦造成不必要的浪費。 In the image sensing chip that is ready to be shipped from the factory, it must be tested by the product. Traditionally, in order to test these precision image sensing wafer components, the wafer to be tested will be soldered over the test board. However, the wafer to be tested is soldered on the test circuit board, and it is difficult to remove after the test is completed, which tends to make the wafer to be tested into consumables, resulting in unnecessary cost. In addition, when the wafer to be tested is soldered, the pin is often broken and unnecessary waste is caused.
另一方面，封裝完成的積體電路必須作電性測試，方可確保晶片的品質。以半導體封裝廠來說，由於其生產量大，必須使用能快速測試之晶片測試系統。對於後續下游的電器製造商來說，由於晶片的使用數量相對來說明顯較少，在組裝前仍然必須先作測試以將可能的不良品篩選出來，藉以降低成品或製程中的半成品之不良率，而可降低整體的製造成本。 On the other hand, the packaged integrated circuit must be electrically tested to ensure the quality of the wafer. In the case of semiconductor packaging plants, due to their high throughput, wafer test systems that can be quickly tested must be used. For subsequent downstream electrical appliance manufacturers, since the number of wafers used is relatively small, it is still necessary to test before the assembly to screen out possible defective products, thereby reducing the defective rate of semi-finished products in the finished product or process. , which can reduce the overall manufacturing cost.
一般傳統的半導體元件測試座配備有測試針以電性連接封裝元件以及測試電路板，使得待測晶片可以進行測試。目前半導體元件的測試針大部分都採用所謂的彈簧探針(pogo pin測試針)，其又稱為彈簧連接器(spring-loaded connector)。意即，一般的測試座結構之設計係適用於彈簧探針的測試結構，並且彈簧探針係用以訊號連接封裝元件以及測試電路板。彈簧探針是一種由針軸(plunger)、彈簧(spring)、針管(tube)三個基本部件通過精密儀器鉚壓之後所形成的彈簧式探針，其內部有一個精密的彈簧結構。由於彈簧探針是一個很精細的探針，所以應用在精密連接器中可以降低連接器的重量以及外觀的體積。對於細間距封裝結構的測試，測試的彈簧探針結構大小取決於封裝的錫球(solder ball)或測試墊間距(test pad pitch)的大小而定。對於醫學用的晶片而言，晶片封裝結構之焊接球間距大約為205微米，則需要使用微間距的彈簧探針以用於測試座。根據焊接球間距與測試座機械空間，適當的彈簧探針之桶直徑(barrel diameter)僅約為150微米，而針軸直徑(plunger diameter)僅約為80微米。因此，微間距彈簧探針具有成本高、使用期短的缺點。所以於封裝測試之中採用微間距彈簧探針會使整體的測試成本提高。並且，相對的測試板也要隨著封裝結構的間距而調整其測試墊佈局。由於較低的製造良率，測試板的成本將變得更高。 Generally, a conventional semiconductor component test socket is equipped with a test pin to electrically connect the package component and the test circuit board, so that the wafer to be tested can be tested. At present, most of the test pins of semiconductor components use a so-called spring probe (pogo pin test pin), which is also called a spring-loaded connector. That is, the design of the general test stand structure is suitable for the test structure of the spring probe, and the spring probe is used for signal connection of the package component and the test circuit board. The spring probe is a spring-type probe formed by three basic components of a plunger, a spring, and a tube, which are riveted by a precision instrument, and has a precise spring structure inside. Since the spring probe is a very fine probe, it can be used in precision connectors to reduce the weight of the connector and the volume of the appearance. For the testing of fine pitch package structures, the size of the spring probe structure tested depends on the size of the packaged solder ball or test pad pitch. For medical wafers, the solder ball pitch of the chip package structure is approximately 205 microns, requiring the use of a fine pitch spring probe for the test pad. Depending on the pitch of the solder balls and the mechanical space of the test stand, a suitable spring probe has a barrel diameter of only about 150 microns and a plunger diameter of only about 80 microns. Therefore, the micro-pitch spring probe has the disadvantages of high cost and short service life. Therefore, the use of micro-pitch spring probes in package testing will increase the overall test cost. Moreover, the opposite test board also adjusts its test pad layout with the spacing of the package structure. The cost of the test board will become higher due to lower manufacturing yield.
上述傳統的多晶片測試座結構具有諸多缺點與問題。因此，為了改善上述缺點，本發明改進現有的測試座結構，進一步提出一具有產業利用之發明；其將詳述於後。 The above conventional multi-wafer test stand structure has many disadvantages and problems. Therefore, in order to improve the above disadvantages, the present invention improves the existing test stand structure, and further proposes an invention having industrial use; it will be described in detail later.
本發明之目的在於提供一種用於細間距封裝測試之測試座。 It is an object of the present invention to provide a test stand for fine pitch package testing.
為達上揭以及其他目的，本發明提供一種用於細間距封裝測試之測試座，包含：測試針套件，包括測試針上部套件、測試針中間套件以及測試針底部套件，其中試針上部套件具有第一穿孔，測試針中間套件具有第二穿孔，而測試針底部套件具有第三穿孔；以及測試針，包含前端部分、彎曲部分與後端部分，該彎曲部分連接前端部分與後端部分；其中該前端部分穿過第一穿孔以利於電性耦合影像感測晶片，而該後端部分穿過第二穿孔與第三穿孔。 To achieve the above and other objects, the present invention provides a test stand for fine pitch package testing, comprising: a test pin kit comprising a test pin upper set, a test pin intermediate set, and a test pin bottom set, wherein the test pin upper set has a first perforation, the test pin intermediate set has a second perforation, and the test pin bottom set has a third perforation; and a test pin including a front end portion, a curved portion and a rear end portion, the curved portion connecting the front end portion and the rear end portion; The front end portion passes through the first perforation to facilitate electrically coupling the image sensing wafer, and the rear end portion passes through the second perforation and the third perforation.
上述測試座更包括一浮置板，以利於晶片封裝結構位於其中。 The test stand further includes a floating plate to facilitate the wafer package structure being located therein.
上述測試座更包括一彈性件，其中該彈性件配置於浮置板之下凹 槽與測試針上部套件之上凹槽之間。 The test seat further includes an elastic member, wherein the elastic member is disposed under the floating plate Between the groove and the groove above the upper part of the test pin.
上述測試座更包括一測試板，其中該測試針之後端部分穿過第二穿孔與第三穿孔以電性連接該測試板之焊接墊。 The test stand further includes a test board, wherein the rear end portion of the test pin passes through the second through hole and the third through hole to electrically connect the solder pad of the test board.
其中該測試針底部套件配置於測試板之上。 The test pin bottom kit is disposed on the test board.
上述測試座更包括一測試座基座框架配置於該測試板之上。 The test stand further includes a test stand base frame disposed on the test board.
上述測試座更包括一測試座基座上蓋配置於該測試座基座框架之上。 The test stand further includes a test stand base cover disposed on the test stand base frame.
其中相鄰的測試針之該前端部分具有第一間距，而相鄰的該測試針之後端部分具有第二間距。其中第二間距大於第一間距。 The front end portion of the adjacent test pin has a first pitch, and the adjacent end portion of the test pin has a second pitch. Wherein the second pitch is greater than the first pitch.
其中第二穿孔係對準第三穿孔。 Wherein the second perforation is aligned with the third perforation.
此些優點及其他優點從以下較佳實施例之敘述及申請專利範圍將使讀者得以清楚了解本發明。 These and other advantages are apparent from the following description of the preferred embodiments and claims.
10‧‧‧測試座基座構件 10‧‧‧Test base member
20‧‧‧測試座蓋件 20‧‧‧Test cover
22‧‧‧透鏡架 22‧‧‧ lens holder
24‧‧‧透鏡 24‧‧‧ lens
26‧‧‧工作壓件 26‧‧‧Working parts
30‧‧‧晶片封裝結構 30‧‧‧ Chip package structure
32‧‧‧影像感測晶片 32‧‧‧Image sensing wafer
34‧‧‧焊接球 34‧‧‧ solder balls
100‧‧‧彈性體探針 100‧‧‧ Elastomer probe
101‧‧‧彈性體探針之垂直長度 101‧‧‧Vertical length of elastomer probe
110‧‧‧彈性件 110‧‧‧Flexible parts
120‧‧‧測試板 120‧‧‧ test board
122‧‧‧焊接墊 122‧‧‧ solder pad
130‧‧‧測試針上部套件 130‧‧‧Test pin upper kit
130a、132a、134a‧‧‧穿孔 130a, 132a, 134a‧‧‧ perforation
130b、134b‧‧‧上凹槽 130b, 134b‧‧‧ upper groove
130c‧‧‧下凹槽 130c‧‧‧lower groove
132‧‧‧測試針中間套件 132‧‧‧Test pin intermediate kit
134‧‧‧測試針底部套件 134‧‧‧Test pin bottom kit
140‧‧‧測試座基座框架 140‧‧‧Test base frame
150‧‧‧浮置板 150‧‧‧Floating board
152‧‧‧上凹槽 152‧‧‧Upper groove
154‧‧‧下凹槽 154‧‧‧ Lower groove
160‧‧‧測試座基座上蓋 160‧‧‧Test base base cover
180‧‧‧圓虛線 180‧‧‧Dash line
182‧‧‧圓虛線 182‧‧‧Dash line
如下所述之對本發明的詳細描述與實施例之示意圖，應使本發明更被充分地理解；然而，應可理解此僅限於作為理解本發明應用之參考，而非限制本發明於一特定實施例之中。 The present invention will be more fully understood from the following detailed description of the embodiments of the invention, and In the example.
第一圖係顯示本發明之用於測試影像感測晶片之測試機構之示意圖。 The first figure shows a schematic diagram of a test mechanism for testing an image sensing wafer of the present invention.
第二圖係顯示本發明之用於測試影像感測晶片之測試機構之示意圖。 The second figure shows a schematic diagram of a test mechanism for testing an image sensing wafer of the present invention.
第三圖A係顯示本發明之用於測試影像感測晶片之初始狀態之測試座之截面示意圖。 FIG. 3A is a schematic cross-sectional view showing a test stand of the present invention for testing an initial state of an image sensing wafer.
第三圖B係顯示本發明之用於測試影像感測晶片之測試(接觸)狀態之測試座之截面示意圖。 Figure 3B is a schematic cross-sectional view showing the test stand of the present invention for testing the test (contact) state of the image sensing wafer.
此處本發明將針對發明具體實施例及其觀點加以詳細描述，此類描述為解釋本發明之結構或步驟流程，其係供以說明之用而非用以限制本發明之申請專利範圍。因此，除說明書中之具體實施例與較佳實施例外，本發明亦可廣泛施行於其他不同的實施例中。以下藉由特定的具體實施例說明本發明之實施方式，熟悉此技術之人士可藉由本說明書所揭示之內容輕易地瞭解本發明 之功效性與其優點。且本發明亦可藉由其他具體實施例加以運用及實施，本說明書所闡述之各項細節亦可基於不同需求而應用，且在不悖離本發明之精神下進行各種不同的修飾或變更。 The invention is described in detail herein with reference to the particular embodiments of the invention, and the description of the invention. Therefore, the present invention may be widely practiced in other different embodiments in addition to the specific embodiments and preferred embodiments of the specification. The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can easily understand the present invention by the contents disclosed in the present specification. Its efficacy and its advantages. The present invention may be applied and implemented by other specific embodiments. The details of the present invention may be applied to various needs, and various modifications or changes may be made without departing from the spirit and scope of the invention.
說明書中所述一實施例指的是一特定被敘述與此實施例有關之特徵、方法或者特性被包含在至少一些實施例中。因此，一實施例或多個實施例之各態樣之實施不一定為相同實施例。此外，本發明有關之特徵、方法或者特性可以適當地結合於一或多個實施例之中。 An embodiment described in the specification refers to a particular feature, method or characteristic described in connection with this embodiment, which is included in at least some embodiments. Therefore, the implementation of the various embodiments or aspects of the various embodiments is not necessarily the same embodiment. Furthermore, the features, methods, or characteristics of the invention may be combined as appropriate in one or more embodiments.
為了提供超影像感測晶片測試，本發明之多晶片測試座包括測試座蓋件(socket lid)與測試座基座構件(socket base assembly)，其二個構件互相結合以利於晶片之測試。在本發明之中，當晶片封裝結構(device package)配置於測試座蓋件之上時，會使用工作壓件(work press)來固定晶片封裝結構。透鏡架(lens holder)配置於工作壓件之中。工作壓件可以置於測試座蓋件之中。測試座蓋件結合測試座基座之後，晶片封裝結構之中的影像感測晶片可以接觸測試針以進行晶片之測試。 In order to provide a super image sensing wafer test, the multi wafer test socket of the present invention includes a socket lid and a socket base assembly, the two members of which are combined to facilitate wafer testing. In the present invention, when a device package is disposed over the test cover member, a work press is used to secure the chip package structure. A lens holder is disposed in the working press. The working press can be placed in the test cover. After the test cover member is coupled to the test socket base, the image sensing wafer in the wafer package structure can contact the test pin for wafer testing.
如第一圖所示，其顯示本發明之用於測試影像感測晶片之測試機構之示意圖。在本實施例之中，測試機構包括測試座基座構件10與測試座蓋件20。測試座蓋件20之上具有透鏡架22、透鏡24、工作壓件26，其他部分元件未顯示於圖中。透鏡架22配置於工作壓件26之中或之上。在一實施例之中，當測試座蓋件結合測試座基座之後，透鏡架22與工作壓件26即位於測試座基座構件10之開口之中。晶片封裝結構30置放於測試座蓋件20之上時，工作壓件26即用以固定晶片封裝結構30。而晶片封裝結構30上之影像感測晶片32即延伸至測試座基座構件10之浮置板(floating plate)150之上凹槽152之中，如第二圖所示。 As shown in the first figure, it shows a schematic diagram of a test mechanism for testing an image sensing wafer of the present invention. In the present embodiment, the test mechanism includes a test seat base member 10 and a test seat cover member 20. Above the test cover member 20, there are a lens holder 22, a lens 24, and a working press member 26. Other parts are not shown in the drawings. The lens holder 22 is disposed in or on the working press member 26. In one embodiment, after the test cover member is coupled to the test seat base, the lens holder 22 and the work press member 26 are located in the opening of the test seat base member 10. When the chip package structure 30 is placed over the test cover member 20, the work press member 26 is used to fix the chip package structure 30. The image sensing wafer 32 on the chip package structure 30 extends into the recess 152 above the floating plate 150 of the test socket base member 10, as shown in the second figure.
本發明提供浮置板150，可以配置於測試座基座構件10或測試座蓋件20之中。在一實施例中，浮置板150係配置於測試座蓋件20之上，以提供一空間使得晶片封裝結構30可以延伸於其中的上凹槽152。換言之，浮置板150之上凹槽152的尺寸約略大於晶片封裝結構30的尺寸，使晶片封裝結構30得以容納於其上凹槽152之中。上凹槽152的形狀可以為矩形或其他形狀。在本實施例之中，浮置板150之形狀為矩形，而浮置板150之上凹槽152的形狀亦為矩形。換言之，本發明之浮置板150之上下兩側各設有凹槽，即上凹槽 152與下凹槽154，上凹槽152之開口向上，而下凹槽154之開口向下；其中上凹槽152提供一空間使得晶片封裝結構30配置於浮置板150之上凹槽152之中，而下凹槽154則提供一空間使得彈性件110之前端部分接觸至浮置板150之下凹槽154。彈性件110例如為彈簧(spring)。上凹槽152之中設置有數個穿孔(via hole)156，使得晶片封裝結構30之焊接球(solder ball)34穿過該穿孔156以裸露出來。下凹槽154的尺寸約略大於彈性件110的尺寸，使彈性件110得以接觸下凹槽154。下凹槽154的形狀可以為圓形或其他形狀。浮置板150之上凹槽152與下凹槽154之形狀與大小可以分別依照晶片封裝結構30與彈性件110之形狀與大小來設計。 The present invention provides a floating plate 150 that can be disposed in the test stand base member 10 or the test seat cover member 20. In one embodiment, the floating plate 150 is disposed over the test cover member 20 to provide a space such that the wafer package structure 30 can extend into the upper recess 152 therein. In other words, the size of the recess 152 above the floating panel 150 is approximately larger than the size of the wafer package structure 30, allowing the wafer package structure 30 to be received in the upper recess 152. The shape of the upper groove 152 may be rectangular or other shape. In the present embodiment, the shape of the floating plate 150 is rectangular, and the shape of the groove 152 above the floating plate 150 is also rectangular. In other words, the floating plate 150 of the present invention is provided with grooves on the upper and lower sides, that is, the upper groove 152 and the lower groove 154, the opening of the upper groove 152 is upward, and the opening of the lower groove 154 is downward; wherein the upper groove 152 provides a space for the chip package structure 30 to be disposed on the groove 152 above the floating plate 150. The lower recess 154 provides a space for the front end portion of the elastic member 110 to contact the recess 154 below the floating plate 150. The elastic member 110 is, for example, a spring. A plurality of via holes 156 are disposed in the upper recess 152 such that a solder ball 34 of the wafer package structure 30 passes through the through holes 156 to be exposed. The size of the lower recess 154 is approximately larger than the size of the elastic member 110, so that the elastic member 110 can contact the lower recess 154. The shape of the lower groove 154 may be circular or other shape. The shape and size of the recess 152 and the lower recess 154 above the floating plate 150 can be designed according to the shape and size of the chip package structure 30 and the elastic member 110, respectively.
浮置板150之材料可以為一塑膠材料。在塑膠材料之中，聚醚醯亞胺(Polyetherimide,PEI)材料之熱傳導率約為0.3Wm-1K-1，且具有優異的機械强度、剛性、電器性能及卓越的耐熱性(可達温度170℃)，其為一種熱可塑性非結晶型塑膠材料。長時間的耐潛變(creep)性使得PEI材料在很多結構強度之應用能取代金屬及其他材料，並且其在經常變化的溫度、濕度和頻率條件之下，還可維持優異穩定的電氣特性。因此，本發明可以選用PEI作為浮置板150之材料。 The material of the floating plate 150 can be a plastic material. Among the plastic materials, polyetherimide (PEI) materials have a thermal conductivity of about 0.3 Wm -1 K -1 and have excellent mechanical strength, rigidity, electrical properties and excellent heat resistance (up to temperature). 170 ° C), which is a thermoplastic plastic material. The long-term creep resistance allows PEI materials to replace metals and other materials in many structural strength applications, and maintains excellent electrical characteristics under constantly changing temperature, humidity and frequency conditions. Therefore, the present invention can select PEI as the material of the floating plate 150.
如第二圖所示，其顯示本發明之用於測試影像感測晶片之測試座基座示意圖。測試座基座構件(socket base assembly)10包括測試座基座框架(socket base frame)140、浮置板150、測試座基座上蓋(socket base cover)160與測試針套件(pin housing)。其中測試針套件可以使得本發明之測試針固定或配置於其中。在一實施例之中，測試針套件包括測試針上部套件(pin housing-top)130、測試針中間套件(pin housing-middle)132以及測試針底部套件(pin housing-bottom)134。 As shown in the second figure, it shows a schematic diagram of a test stand base for testing an image sensing wafer of the present invention. The socket base assembly 10 includes a test socket base frame 140, a floating plate 150, a test socket base cover 160, and a pin housing. Wherein the test needle kit can be used to secure or dispose the test needle of the present invention therein. In one embodiment, the test needle kit includes a pin housing-top 130, a pin housing-middle 132, and a pin housing-bottom 134.
為了改善傳統的細間距彈簧探針的缺點，本發明採用一種具有彎曲結構之彈性體探針(cobra pin測試針)100以取代傳統的彈簧探針。因此，測試座基座構件10之結構也隨著彈性體探針100之結構而有不同的設計。彈性體探針100之結構包含三部分：第一部分為前端部分，第二部分為彎曲部分，而第三部分為後端部分，彎曲部分為中間段並連接前端部分與後端部分。彎曲部分的曲率與長度可以依照實際需求而設定。前端部分與後端部分均為直條狀，前端部分之長度小於後端部分之長度。舉例而言，後端部分之長度大於或等於前 端部分之長度的3倍。舉一實施例而言，彈性體探針之垂直長度101約為5~6毫米(millimeter：mm)，如第三圖A所示。測試針100之前端部分係用於測試時接觸(電性連接)晶片封裝結構30之焊接球34。因此，相鄰的測試針100之前端部分的間距約略等於焊接球34的間距。測試針100之後端部分係用於測試時接觸(電性連接)測試板120之焊接墊122。相鄰的測試針100之後端部分的間距可以依照設計而調整。在本實施例之中，由於相鄰的測試針100係以鏡像的方式平行地配置，所以相鄰的測試針100之後端部分的間距大於相鄰的測試針100之前端部分的間距(或焊接球34的間距)。在一例子中，相鄰的測試針100亦可以鏡像的方式以一個夾角相對配置。 In order to improve the disadvantages of the conventional fine pitch spring probe, the present invention employs a flexible probe (cobra pin test pin) 100 having a curved structure instead of the conventional spring probe. Therefore, the structure of the test stand base member 10 also has a different design depending on the structure of the elastomer probe 100. The structure of the elastomer probe 100 comprises three parts: a first part is a front end part, a second part is a curved part, and a third part is a rear end part, and the curved part is an intermediate section and connects the front end part and the rear end part. The curvature and length of the curved portion can be set according to actual needs. The front end portion and the rear end portion are both straight strips, and the length of the front end portion is smaller than the length of the rear end portion. For example, the length of the back end portion is greater than or equal to the front 3 times the length of the end portion. For one embodiment, the elastomeric probe has a vertical length 101 of about 5-6 mm (millimeter: mm), as shown in Figure 3A. The front end portion of the test pin 100 is used to contact (electrically connect) the solder balls 34 of the chip package structure 30 during testing. Therefore, the pitch of the front end portions of the adjacent test pins 100 is approximately equal to the pitch of the solder balls 34. The rear end portion of the test pin 100 is used to contact (electrically connect) the solder pads 122 of the test board 120 during testing. The spacing of the end portions of adjacent test pins 100 can be adjusted as designed. In the present embodiment, since the adjacent test pins 100 are arranged in parallel in a mirror image manner, the pitch of the rear end portions of the adjacent test pins 100 is larger than the pitch of the front end portions of the adjacent test pins 100 (or soldering). The spacing of the balls 34). In an example, adjacent test pins 100 can also be mirrored at an angle.
在本實施例之中，測試座基座構件10之測試針套件設計為包括測試針上部套件130、測試針中間套件132以及測試針底部套件134之三件式測試針套件。測試針上部套件130與測試針底部套件134可以利用黏著材料或緊固件(螺絲)以分別固定於測試針中間套件132之上下兩側。在一實施例之中，測試針上部套件130之上側設有數個穿孔(via hole)130a與上凹槽130b，而其下側則有下凹槽130c。其中穿孔130a可以讓測試針100之前端部分穿過，以利於測試時測試針100之前端部分可以電性連接晶片封裝結構30之焊接球34。測試針100的數目對應晶片封裝結構30之焊接球34的數目。其中上凹槽130b則提供一空間使得彈性件110之後端部分接觸至測試針上部套件130之上凹槽130b。因此，在浮置板150與測試針上部套件130組裝之後，彈性件110即配置於浮置板150之下凹槽154與測試針上部套件130之上凹槽130b之間。測試針上部套件130之下凹槽130c提供一空間以容納測試針100。 In the present embodiment, the test pin kit of the test stand base member 10 is designed to include a test pin upper set 130, a test pin intermediate set 132, and a three-piece test pin set of the test pin bottom set 134. The test needle upper set 130 and the test pin bottom set 134 may be secured to the upper and lower sides of the test pin intermediate set 132, respectively, using adhesive materials or fasteners (screws). In one embodiment, the test needle upper set 130 has a plurality of via holes 130a and upper grooves 130b on the upper side and a lower groove 130c on the lower side. The through hole 130a can pass the front end portion of the test pin 100 to facilitate the electrical connection between the solder ball 34 of the chip package structure 30 at the front end portion of the test pin 100 during the test. The number of test pins 100 corresponds to the number of solder balls 34 of the chip package structure 30. The upper groove 130b provides a space such that the rear end portion of the elastic member 110 contacts the groove 130b above the test needle upper set 130. Therefore, after the floating plate 150 is assembled with the test needle upper set 130, the elastic member 110 is disposed between the groove 154 below the floating plate 150 and the groove 130b above the test pin upper set 130. The recess 130c below the test needle upper set 130 provides a space to accommodate the test needle 100.
在一實施例之中，測試針中間套件132之上設有數個穿孔132a，以利於讓測試針100之後端部分穿過。測試針中間套件132係用於測試針100之後端部分穿過該穿孔132a之後固定、不旋轉。測試針底部套件134之上亦設有數個穿孔134a，以利於讓測試針100之後端部分穿過。換言之，測試針100之後端部分可以穿過測試針中間套件132之穿孔132a以及測試針底部套件134之穿孔134a。因此，在測試針底部套件134與測試板120組裝之後，測試針100之後端部分即配置於測試板120之上，以電性連接測試板120上之焊接墊122。由於測試針100之後端部分為直條狀，測試針中間套件132之穿孔132a的位置需對齊測試針底部套件134之穿孔134a的位置。測試針底部套件134之上凹槽 134b提供一空間以容納測試針100。 In one embodiment, a plurality of perforations 132a are provided over the test pin intermediate set 132 to facilitate passage of the rear end portion of the test pin 100. The test needle intermediate set 132 is used to fix and not rotate the rear end portion of the test pin 100 after passing through the perforation 132a. A plurality of perforations 134a are also provided over the test pin bottom kit 134 to facilitate passage of the rear end portion of the test pin 100. In other words, the rear end portion of the test pin 100 can pass through the perforation 132a of the test pin intermediate set 132 and the perforation 134a of the test pin bottom set 134. Therefore, after the test pin bottom kit 134 is assembled with the test board 120, the rear end portion of the test pin 100 is disposed on the test board 120 to electrically connect the solder pads 122 on the test board 120. Since the rear end portion of the test pin 100 is straight, the position of the through hole 132a of the test pin intermediate set 132 needs to be aligned with the position of the through hole 134a of the test pin bottom set 134. Test the needle groove 134 above the groove The 134b provides a space to accommodate the test pin 100.
在一實施例之中，測試針底部套件134係固定於測試板120之上，例如利用一緊固件(螺絲)而固定之。在一實施例之中，測試座基座框架140係固定於測試板120之上，例如利用一緊固件(螺絲)而固定之。測試座基座上蓋160係設置於測試座基座框架140之上。 In one embodiment, the test pin bottom kit 134 is secured to the test panel 120, such as by a fastener (screw). In one embodiment, the test stand base frame 140 is secured to the test board 120, such as by a fastener (screw). The test stand base cover 160 is disposed above the test stand base frame 140.
在一實施例之中，本發明之測試座可用於測試一影像感測晶片，例如互補式金屬氧化層半導體(CMOS)影像感測晶片或電荷耦合元件(CCD)。影像感測晶片具有一感光區域，感光區域面向一光源所發出的光線。感光區域主要由畫素陣列構成，畫素陣列面向光源處可覆蓋一微透鏡(micro lens)使得光線可以照射到畫素陣列之每一畫素。微透鏡具有一定的透光度，其材質可為矽、石英、玻璃、高分子透光材料及其他光學材料等其中之一或其組合。 In one embodiment, the test socket of the present invention can be used to test an image sensing wafer, such as a complementary metal oxide semiconductor (CMOS) image sensing wafer or a charge coupled device (CCD). The image sensing wafer has a photosensitive area that faces the light emitted by a light source. The photosensitive area is mainly composed of a pixel array, and the pixel array faces the light source to cover a micro lens so that the light can illuminate every pixel of the pixel array. The microlens has a certain transmittance, and the material thereof may be one or a combination of bismuth, quartz, glass, polymer light-transmitting material and other optical materials.
舉例而言，彈性體探針100之材質可以為鈹銅合金或不銹鋼。在測試針100表面可以鍍一層金或鎳。其作動原理為：當測試座蓋件20之工作壓件26往下壓，而其中的浮置板150以及晶片封裝結構30均隨之往下移動，浮置板150之下凹槽154內的彈簧110即壓縮，而測試針100之兩端即分別與晶片封裝結構30之焊接球(錫球)34及測試板(test board)120之焊接墊122接觸而電性連接，如第三圖B之圓虛線182所示，探測針100之前端部分接觸焊接球(錫球)34。如第三圖A之圓虛線180所示，此為測試座的初始狀態，探測針100之前端部分與焊接球(錫球)34有一段距離，亦即二者尚未接觸。當測試針100用於測試時，測試針上部套件130、測試針中間套件132以及測試針底部套件134即用以限制測試針100的位置，並使測試針100於測試期間僅能於垂直方向(z-direction)移動。從上述可知，當晶片封裝結構30置於浮置板150之上凹槽152之中並且藉由工作壓件26而接觸時，晶片封裝結構30與浮置板150可以往下移動，然後晶片封裝結構30與測試針100接觸，使得測試針100電性連接測試板120與晶片封裝結構30，以利於晶片的測試。 For example, the material of the elastomer probe 100 may be beryllium copper alloy or stainless steel. A layer of gold or nickel may be plated on the surface of the test pin 100. The operation principle is as follows: when the working pressing member 26 of the test cover member 20 is pressed downward, and the floating plate 150 and the chip package structure 30 are moved downwards together, the groove 154 in the lower surface of the floating plate 150 The spring 110 is compressed, and the two ends of the test pin 100 are respectively electrically connected to the solder balls (solder balls) 34 of the chip package structure 30 and the solder pads 122 of the test board 120, as shown in the third figure B. As indicated by the dotted line 182, the front end portion of the probe pin 100 contacts the solder ball (tin ball) 34. As indicated by the dotted line 180 of the third figure A, this is the initial state of the test socket, and the front end portion of the probe pin 100 is at a distance from the solder ball (tin ball) 34, that is, the two are not yet in contact. When the test pin 100 is used for testing, the test pin upper set 130, the test pin intermediate set 132, and the test pin bottom set 134 are used to limit the position of the test pin 100, and the test pin 100 can only be in the vertical direction during the test ( Z-direction) moves. As can be seen from the above, when the chip package structure 30 is placed in the recess 152 above the floating board 150 and contacted by the working press 26, the chip package structure 30 and the floating board 150 can be moved downward, and then the chip package The structure 30 is in contact with the test pin 100 such that the test pin 100 is electrically connected to the test board 120 and the chip package structure 30 to facilitate testing of the wafer.
在一實施例之中，浮置板150之材料為金屬，例如鋁。在一實施例之中，測試針上部套件130、測試針中間套件132、測試針底部套件之材料為塑膠材料，例如PEI材料。在一實施例之中，試座基座框架140之材料為塑膠材料，例如PEI材料。在一實施例之中，上蓋測試座基座構件10可以包含防漏光、防光折射或散射、防導電之結構設計或材料(例如測試座基座上蓋160)，例 如為經由一陽極處理之鋁金屬板，或者為耐高溫的塑膠件。 In one embodiment, the material of the floating plate 150 is a metal such as aluminum. In one embodiment, the test needle upper set 130, the test pin intermediate set 132, and the test pin bottom set are made of a plastic material, such as a PEI material. In one embodiment, the material of the test stand base frame 140 is a plastic material, such as a PEI material. In an embodiment, the upper cover test base member 10 may include a structure design or material that prevents light leakage, light refraction or scattering, and conductance (for example, the test cover base cover 160). For example, it is an aluminum metal plate treated by an anode, or a plastic piece resistant to high temperature.
在一實施例之中，透鏡架22配置有透鏡，其可視張角可以達到130度。 In one embodiment, the lens holder 22 is configured with a lens that has a visible opening angle of up to 130 degrees.
此外，測試座亦可以設置一擴散片(diffuser)，配置於透鏡之上。光藉由擴散片可以擴散及散射光。擴散片可以讓通過的光線降低亮度。舉例而言，擴散片可以藉由擠壓聚苯乙烯(polystyrene,PS)或聚碳酸酯(polycarbonate,PC)所製成。擴散片之材料包括工程塑膠。另外，具有與擴散片材質不同折射率的空隙或擴散劑分布於光擴散片內。擴散片內部之空隙或擴散劑折射或反射進入擴散片的光。特別是，當足夠數量之空隙或擴散劑呈現於擴散片內時，進入擴散片的光在其內部折射或反射足夠次數後散射。所以，當進入擴散片的光離開擴散片時，光的強度是一致且其發散角度增加。然而，部分進入擴散片的光在藉由擴散片內部的空隙或擴散劑折射或反射後被吸收。所以，當光通過擴散片時會發生光損耗，亦即會產生光衰減。 In addition, the test socket can also be provided with a diffuser disposed on the lens. Light can diffuse and scatter light by means of a diffuser. The diffuser allows the passing light to reduce brightness. For example, the diffusion sheet can be made of polystyrene (PS) or polycarbonate (PC). The material of the diffusion sheet includes engineering plastics. Further, a void or a diffusing agent having a refractive index different from that of the diffusion sheet material is distributed in the light diffusion sheet. A void or diffusing agent inside the diffuser refracts or reflects light entering the diffuser. In particular, when a sufficient amount of voids or diffusing agent is present in the diffuser, the light entering the diffuser is scattered after being internally refracted or reflected for a sufficient number of times. Therefore, when the light entering the diffusion sheet leaves the diffusion sheet, the intensity of the light is uniform and the divergence angle thereof increases. However, part of the light entering the diffusion sheet is absorbed after being refracted or reflected by a void or a diffusing agent inside the diffusion sheet. Therefore, light loss occurs when light passes through the diffusion sheet, that is, light attenuation occurs.
在一實施例之中，測試座亦設有一固定環(ring)，用以固定擴散片。舉例而言，固定環設有一開口得以容納擴散片，並且壓住、固定該擴散片，以避免擴散片上下移動。 In one embodiment, the test socket is also provided with a retaining ring for securing the diffuser. For example, the fixing ring is provided with an opening to accommodate the diffusion sheet, and the diffusion sheet is pressed and fixed to prevent the diffusion sheet from moving up and down.
如上所述，在本發明之中，提出三件式測試針套件結構(包括測試針上部套件130、測試針中間套件132以及測試針底部套件134)，另外利用彈性體探針取代傳統的彈簧探針，彈性體探針無論在外觀、結構與垂直長度方面均不同於傳統的彈簧探針(太長，阻抗大影響測試)；其中彈簧110為獨立構件而配置於浮置板150與測試針上部套件130之間。其中主要的彈性體探針之結構可以使得相鄰的測試針之兩端具有不同的間距，其中第一端的間距約略等於晶片封裝結構30之焊接球34的間距，而第二端的間距則大於第一端的間距、也大於焊接球34的間距。因此，本發明可以克服習知技術之測試座結構，彈簧探針對位不正時所產生針體歪掉、或進一步壞掉，以及卡針而壓不下去、取不出來的問題。換言之，本發明之測試座、彈性體探針結構與三件式測試針套件結構的設計，非常有利於細間距封裝測試。 As described above, in the present invention, a three-piece test pin kit structure (including a test pin upper set 130, a test pin intermediate set 132, and a test pin bottom set 134) is proposed, and an elastomer probe is used in place of the conventional spring probe. Needle, elastomer probe is different from traditional spring probe in terms of appearance, structure and vertical length (too long, high impedance impact test); wherein spring 110 is a separate component and is disposed on floating plate 150 and upper test pin Between kits 130. The structure of the main elastomer probes may be such that the two ends of the adjacent test pins have different pitches, wherein the pitch of the first end is approximately equal to the pitch of the solder balls 34 of the chip package structure 30, and the pitch of the second end is greater than The pitch of the first end is also greater than the pitch of the solder balls 34. Therefore, the present invention can overcome the problem of the test stand structure of the prior art, the needle body which is generated when the spring probe is misaligned, or which is further broken, and the card pin cannot be pressed and cannot be taken out. In other words, the design of the test seat, elastomer probe structure and three-piece test pin kit structure of the present invention is very advantageous for fine pitch package testing.
從上述可知，本發明具有習知技術所無法預期之功效。 As apparent from the above, the present invention has an effect unpredictable by the prior art.
根據上述，本發明具有底下之優點：一、新的測試座設計概念提供了一個彈性體探針，其長度約為傳 統的彈簧探針的一半；二、彈性體探針之長度縮短，阻抗變小而使得晶片之測試效果得到提升；三、彈性體探針具有較長的使用期限(life time)，並且對於測試硬體的維護較為簡易；四、本發明具有彈性體探針之測試座比傳統的具有彈簧探針之測試座於整體成本上較低；五、本發明之相鄰的彈性體探針之第二端的間距較大，因此，。測試板上焊接墊的間距也加大了，所以測試板的佈局與製造也更為容易了；六、本發明之彈性體探針之探針標記(probe mark)比具有皇冠型針軸之彈簧探針來得更佳。 According to the above, the present invention has the following advantages: 1. The new test stand design concept provides an elastomer probe with a length of about Half of the spring probe; Second, the length of the elastomer probe is shortened, the impedance is reduced, and the test effect of the wafer is improved; Third, the elastomer probe has a long life time, and for testing The maintenance of the hardware is relatively simple; Fourth, the test socket with the elastomer probe of the present invention is lower in overall cost than the conventional test socket with the spring probe; 5. The adjacent elastomer probe of the present invention The spacing between the two ends is larger, so. The spacing of the solder pads on the test board is also increased, so the layout and manufacture of the test board is also easier. 6. The probe mark of the elastomer probe of the present invention is more than the spring with the crown type needle shaft. The probe is better.
上述敘述係為本發明之較佳實施例。此領域之技藝者應得以領會其係用以說明本發明而非用以限定本發明所主張之專利權利範圍。其專利保護範圍當視後附之申請專利範圍及其等同領域而定。凡熟悉此領域之技藝者，在不脫離本專利精神或範圍內，所作之更動或潤飾，均屬於本發明所揭示精神下所完成之等效改變或設計，且應包含在下述之申請專利範圍內。 The above description is a preferred embodiment of the invention. Those skilled in the art should be able to understand the invention and not to limit the scope of the patent claims claimed herein. The scope of patent protection is subject to the scope of the patent application and its equivalent fields. Any modification or refinement made by those skilled in the art without departing from the spirit or scope of the present invention is equivalent to the equivalent change or design made in the spirit of the present disclosure, and should be included in the following patent application scope. Inside.
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| TW106105092A TWI617812B (en) | 2017-02-16 | 2017-02-16 | Test socket for fine pitch package testing |
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| TW106105092A TWI617812B (en) | 2017-02-16 | 2017-02-16 | Test socket for fine pitch package testing |
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| TWI617812B true TWI617812B (en) | 2018-03-11 |
| TW201831911A TW201831911A (en) | 2018-09-01 |
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|---|---|---|---|---|
| TWI348028B (en) * | 2007-10-03 | 2011-09-01 | Advanced Semiconductor Eng | Ic socket and test interface thereof |
| TW201132999A (en) * | 2010-03-19 | 2011-10-01 | Global Master Tech Co Ltd | Chip test device |
| US20130342233A1 (en) * | 2009-04-21 | 2013-12-26 | Johnstech International Corporation | Wafer Level Integrated Circuit Contactor and Method of Construction |
| CN104049116A (en) * | 2013-03-15 | 2014-09-17 | 稳懋半导体股份有限公司 | Probe card, probe structure and manufacturing method thereof |
| CN204514967U (en) * | 2015-04-07 | 2015-07-29 | 梅县梅雁旋窑水泥有限公司 | A kind of PCB test connector |
| WO2015138388A2 (en) * | 2014-03-10 | 2015-09-17 | Johnstech International Corporation | Wafer level integrated circuit probe array and method of construction |
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|---|---|---|---|---|
| TWI348028B (en) * | 2007-10-03 | 2011-09-01 | Advanced Semiconductor Eng | Ic socket and test interface thereof |
| US20130342233A1 (en) * | 2009-04-21 | 2013-12-26 | Johnstech International Corporation | Wafer Level Integrated Circuit Contactor and Method of Construction |
| TW201132999A (en) * | 2010-03-19 | 2011-10-01 | Global Master Tech Co Ltd | Chip test device |
| CN104049116A (en) * | 2013-03-15 | 2014-09-17 | 稳懋半导体股份有限公司 | Probe card, probe structure and manufacturing method thereof |
| WO2015138388A2 (en) * | 2014-03-10 | 2015-09-17 | Johnstech International Corporation | Wafer level integrated circuit probe array and method of construction |
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