TWI617223B - Flexible substrate embedded with wires and method for fabricating the same - Google Patents
Flexible substrate embedded with wires and method for fabricating the same Download PDFInfo
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Abstract
本揭露提供一種嵌有導線之軟性基板，包括：一軟性基板，由一高分子材料所構成；以及一連續導線圖案，包含複數個孔洞，嵌於該軟性基板中，其中該高分子材料填入該等孔洞。本揭露另提供一種嵌有導線之軟性基板之製造方法。 The present invention provides a flexible substrate embedded with a wire, comprising: a flexible substrate composed of a polymer material; and a continuous wire pattern comprising a plurality of holes embedded in the flexible substrate, wherein the polymer material is filled These holes. The present disclosure further provides a method of manufacturing a flexible substrate embedded with a wire.
Description
本揭露係有關於一種軟性基板，特別是有關於一種嵌有導線之軟性基板及其製造方法。 The present disclosure relates to a flexible substrate, and more particularly to a flexible substrate embedded with a wire and a method of manufacturing the same.
現行軟性印刷電路板主要以軟性銅箔基板(FCCL)為主。依層數可區分為無膠系軟性銅箔基板(2-layer FCCL)和有膠系軟性銅箔基板(3-layer FCCL)，兩者最大差異在於銅箔和聚醯亞胺薄膜之間有無接著劑。2L FCCL具有耐熱性高、撓折性佳、尺寸安定性良好等優點，但成本相對較高，因此，大部份軟板主要使用3L FCCL，只有較高階軟板才會用到2L FCCL。 Current flexible printed circuit boards are mainly based on flexible copper foil substrates (FCCL). According to the number of layers, it can be divided into a non-adhesive soft copper foil substrate (2-layer FCCL) and a rubber-based soft copper foil substrate (3-layer FCCL). The biggest difference between the two is whether there is a copper foil and a polyimide film. Follow-up agent. 2L FCCL has the advantages of high heat resistance, good flexibility, and good dimensional stability, but the cost is relatively high. Therefore, most of the soft boards mainly use 3L FCCL, and only the higher order soft boards use 2L FCCL.
3L FCCL需有環氧樹脂接著劑當作軟板與導線接著，但一般環氧樹脂接著劑的耐溫性較聚醯亞胺(polyimide)差，因此，使用上會有溫度的限制。此外，在可靠度上也不甚理想。2L FCCL需藉由表面處理、鍍膜、蝕刻方式才能達到線路圖案化之需求，其製程複雜、耗時長。 3L FCCL requires an epoxy resin adhesive as a soft board and a wire. However, the epoxy resin is generally inferior in temperature resistance to polyimide. Therefore, there is a temperature limit in use. In addition, it is not ideal in terms of reliability. 2L FCCL needs to be surface-treated, coated, and etched to meet the needs of circuit patterning. The process is complicated and time-consuming.
本揭露之一實施例，提供一種嵌有導線之軟性基板，包括：一軟性基板，由一高分子材料所構成；以及一連續導線圖案，包含複數個孔洞，嵌於該軟性基板中，其中該高分 子材料填入該等孔洞。 An embodiment of the present disclosure provides a flexible substrate embedded with a wire, comprising: a flexible substrate composed of a polymer material; and a continuous wire pattern including a plurality of holes embedded in the flexible substrate, wherein the flexible substrate High score Sub-materials are filled into the holes.
本揭露之另一實施例，提供一種嵌有導線之軟性基板之製造方法，包括：提供一載板；形成一連續導線圖案於該載板上，其中該連續導線圖案包含複數個孔洞；覆蓋一高分子材料於該連續導線圖案與該載板上，並填入該等孔洞；以及分離該高分子材料與該載板，以形成嵌有該連續導線圖案之一軟性基板。 Another embodiment of the present disclosure provides a method for manufacturing a flexible substrate embedded with a wire, comprising: providing a carrier; forming a continuous wire pattern on the carrier, wherein the continuous wire pattern includes a plurality of holes; And forming a polymer material on the continuous wire pattern and the carrier plate, and filling the holes; and separating the polymer material from the carrier plate to form a flexible substrate embedded with the continuous wire pattern.
本揭露開發一種全印刷式結構設計，可將金屬導線嵌於軟性基板中，解決了現行基板與導線密著度、可靠度不佳的問題，其製程簡單化亦可達到更佳效益，可廣泛應用於軟性電子、軟性印刷電路、LED等相關產業。本揭露嵌有金屬導線之軟性基板結構主要是利用金屬導線與載板密著度不佳之特點，而其所搭配之高分子材料於塗佈成形後，可自載板輕易取下，並將金屬導線嵌於高分子材料中，其基板與導線密著度良好不易剝落且結構耐撓曲度佳。 The disclosure discloses a full-printing structure design, which can embed a metal wire in a flexible substrate, solves the problem of poor adhesion and reliability of the current substrate and the wire, and the process can be simplified to achieve better benefits, and can be widely used. Used in soft electronics, flexible printed circuits, LED and other related industries. The soft substrate structure embedded with the metal wire is mainly characterized by the poor adhesion of the metal wire and the carrier plate, and the polymer material matched with the metal material can be easily removed from the carrier plate after the coating and forming, and the metal is removed. The wire is embedded in the polymer material, and the substrate and the wire have good adhesion and are not easily peeled off, and the structure has good flex resistance.
本揭露軟性基板結構藉由高分子材料對導線孔洞的充填與滲透，使得高分子材料有效地包覆金屬導線，致使最終結構之金屬導線內埋或嵌於高分子基板表面，可使金屬導線同時達到耐熱、耐焊、抗撓曲、薄化與高電子傳導等特性。此外，本揭露所開發一種新型軟性基板導體電路結構可應用於超薄高分子基板與電路的形成，達到整體積體的薄化，亦可有效應用於軟性LED封裝基板、觸控面板、顯示器等軟性顯示器，另可作為高功率電子晶片接著、薄化封裝及電子電路相關應用。 The soft substrate structure fills and penetrates the hole of the wire by the polymer material, so that the polymer material effectively coats the metal wire, so that the metal wire of the final structure is buried or embedded on the surface of the polymer substrate, so that the metal wire can be simultaneously It achieves heat resistance, solder resistance, flexing resistance, thinning and high electron conduction. In addition, a novel flexible substrate conductor circuit structure developed by the present disclosure can be applied to the formation of an ultra-thin polymer substrate and a circuit to achieve thinning of a whole body, and can also be effectively applied to a flexible LED package substrate, a touch panel, a display, etc. Flexible displays can also be used as high power electronic wafers, thin package and electronic circuit related applications.
為讓本揭露之上述目的、特徵及優點能更明顯易懂，下文特舉一較佳實施例，並配合所附的圖式，作詳細說明如下。 The above described objects, features and advantages of the present invention will become more apparent from the following description.
10、100‧‧‧嵌有導線之軟性基板 10, 100‧‧‧Soft substrates embedded with wires
12、120‧‧‧軟性基板 12, 120‧‧‧Soft substrate
12’、120’‧‧‧高分子材料 12', 120'‧‧‧ Polymer materials
14、140‧‧‧連續導線圖案 14, 140‧‧‧Continuous wire pattern
16、160‧‧‧孔洞 16, 160‧‧‧ holes
18、180‧‧‧載板 18, 180‧‧‧ carrier board
200‧‧‧表面處理製程 200‧‧‧ surface treatment process
第1圖係根據本揭露之一實施例，一種嵌有導線之軟性基板之剖面示意圖；第2圖係根據本揭露之一實施例，一種嵌有導線之軟性基板之剖面示意圖；第3A~3C圖係根據本揭露之一實施例，一種嵌有導線之軟性基板之製造方法之剖面示意圖；以及第4A~4D圖係根據本揭露之一實施例，一種嵌有導線之軟性基板之製造方法之剖面示意圖。 1 is a schematic cross-sectional view of a flexible substrate embedded with a wire according to an embodiment of the present disclosure; and FIG. 2 is a schematic cross-sectional view of a flexible substrate embedded with a wire according to an embodiment of the present disclosure; 3A-3C BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4 is a cross-sectional view showing a method of fabricating a flexible substrate embedded with a wire; and FIGS. 4A to 4D are diagrams showing a method of manufacturing a flexible substrate embedded with a wire according to an embodiment of the present disclosure. Schematic diagram of the section.
請參閱第1圖，根據本揭露之一實施例，提供一種嵌有導線之軟性基板。嵌有導線之軟性基板10包括一軟性基板12以及一連續導線圖案14。軟性基板12由一高分子材料12’所構成。連續導線圖案14包含複數個孔洞16，嵌於軟性基板12中，且高分子材料12’填入孔洞16。 Referring to FIG. 1, according to an embodiment of the present disclosure, a flexible substrate embedded with a wire is provided. The flexible substrate 10 embedded with wires includes a flexible substrate 12 and a continuous wire pattern 14. The flexible substrate 12 is composed of a polymer material 12'. The continuous wire pattern 14 includes a plurality of holes 16 embedded in the flexible substrate 12, and the polymer material 12' is filled into the holes 16.
上述高分子材料12’可包括聚亞醯胺(polyimide,PI)或聚氟化二乙烯(polyvinylidene fluoride,PVDF)。 The above polymer material 12' may include polyimide (PI) or polyvinylidene fluoride (PVDF).
上述導線圖案14可由例如銀、銅、鎳或其合金所構成。上述導線圖案14之電阻率大體介於1.6x10-6~10x10-6Ω．cm。 The above-described wire pattern 14 may be composed of, for example, silver, copper, nickel or an alloy thereof. The resistivity of the above-mentioned wire pattern 14 is generally between 1.6x10 -6 and 10x10 -6 Ω. Cm.
上述連續導線圖案14所包含孔洞16之尺寸大體介於10nm~100μm。 The size of the hole 16 included in the continuous wire pattern 14 is generally between 10 nm and 100 μm.
在此實施例中，上述連續導線圖案14嵌於軟性基板12之內部，如第1圖所示。 In this embodiment, the continuous wire pattern 14 is embedded inside the flexible substrate 12 as shown in FIG.
請參閱第2圖，根據本揭露之另一實施例，提供一種嵌有導線之軟性基板。嵌有導線之軟性基板100包括一軟性基板120以及一連續導線圖案140。軟性基板120由一高分子材料120’所構成。連續導線圖案140包含複數個孔洞160，嵌於軟性基板120中，且高分子材料120’填入孔洞160。 Referring to FIG. 2, according to another embodiment of the present disclosure, a flexible substrate embedded with a wire is provided. The flexible substrate 100 embedded with a wire includes a flexible substrate 120 and a continuous wire pattern 140. The flexible substrate 120 is composed of a polymer material 120'. The continuous wire pattern 140 includes a plurality of holes 160 embedded in the flexible substrate 120, and the polymer material 120' is filled into the holes 160.
上述高分子材料120’可包括聚亞醯胺(polyimide,PI)或聚氟化二乙烯(polyvinylidene fluoride,PVDF)。 The above polymer material 120' may include polyimide (PI) or polyvinylidene fluoride (PVDF).
上述導線圖案140可由例如銀、銅、鎳或其合金所構成。上述導線圖案140之電阻率大體介於1.6x10-6~10x10-6Ω．cm。 The above-described wire pattern 140 may be composed of, for example, silver, copper, nickel, or an alloy thereof. The resistivity of the above conductor pattern 140 is generally between 1.6x10 -6 and 10x10 -6 Ω. Cm.
上述連續導線圖案140所包含孔洞160之尺寸大體介於10nm~100μm。 The size of the hole 160 included in the continuous wire pattern 140 is generally between 10 nm and 100 μm.
在此實施例中，上述連續導線圖案140嵌於軟性基板120之表面，如第2圖所示。 In this embodiment, the continuous wire pattern 140 is embedded on the surface of the flexible substrate 120, as shown in FIG.
請參閱第3A~3C圖，根據本揭露之一實施例，提供一種嵌有導線之軟性基板(flexible substrate)之製造方法。首先，如第3A圖所示，提供一載板18。上述載板18可由玻璃或金屬所構成。 Referring to FIGS. 3A-3C, according to an embodiment of the present disclosure, a method of manufacturing a flexible substrate embedded with a wire is provided. First, as shown in Fig. 3A, a carrier 18 is provided. The carrier plate 18 may be made of glass or metal.
接著，形成一連續導線圖案14於載板18上。上述連續導線圖案14包含複數個孔洞(未圖示)。本實施例形成包含 複數個孔洞的連續導線圖案14於載板18上的步驟可包括以例如網印製程形成連續導線圖案14於載板18上，接著，以例如250~300℃之溫度對連續導線圖案14進行燒結，以形成包含複數個孔洞的連續導線圖案14。上述導線圖案14可由例如銀、銅、鎳或其合金所構成。上述導線圖案14之電阻率大體介於1.6x10-6~10x10-6Ω．cm。上述連續導線圖案14所包含孔洞之尺寸大體介於10nm~100μm。 Next, a continuous wire pattern 14 is formed on the carrier 18. The continuous wire pattern 14 includes a plurality of holes (not shown). The step of forming a continuous wire pattern 14 comprising a plurality of holes on the carrier plate 18 in the present embodiment may include forming a continuous wire pattern 14 on the carrier plate 18 by, for example, a screen printing process, and then continuing to a temperature of, for example, 250 to 300 ° C. The wire pattern 14 is sintered to form a continuous wire pattern 14 comprising a plurality of holes. The above-described wire pattern 14 may be composed of, for example, silver, copper, nickel or an alloy thereof. The resistivity of the above-mentioned wire pattern 14 is generally between 1.6x10 -6 and 10x10 -6 Ω. Cm. The size of the holes included in the continuous wire pattern 14 is generally between 10 nm and 100 μm.
在一實施例中，上述形成一連續導線圖案14於載板18上之步驟包括：提供一金屬膠(未圖示)，其固含量介於80~85%，形成金屬膠之一連續圖案14於載板18上，以及對載板18進行一燒結製程。上述燒結製程之溫度介於300~350℃，時間介於30~40分鐘。 In one embodiment, the step of forming a continuous conductor pattern 14 on the carrier board 18 includes: providing a metal paste (not shown) having a solid content of 80-85% to form a continuous pattern of one of the metal pastes. A sintering process is performed on the carrier 18 and on the carrier 18. The temperature of the above sintering process is between 300 and 350 ° C and the time is between 30 and 40 minutes.
接著，以例如塗佈製程覆蓋一高分子材料12’於連續導線圖案14與載板18上，並填入孔洞(未圖示)。上述高分子材料12’可包括聚亞醯胺(polyimide,PI)或聚氟化二乙烯(polyvinylidene fluoride,PVDF)。 Next, a polymer material 12' is coated on the continuous wiring pattern 14 and the carrier 18 by, for example, a coating process, and a hole (not shown) is filled. The above polymer material 12' may include polyimide (PI) or polyvinylidene fluoride (PVDF).
在一實施例中，上述覆蓋一高分子材料12’於連續導線圖案14與載板18上之步驟包括：提供一聚氟化二乙烯(PVDF)(未圖示)，其固含量介於5~30%，形成一聚氟化二乙烯(PVDF)層12’於連續導線圖案14與載板18上，以及對載板18進行一烘烤製程。上述烘烤製程之溫度介於50~180℃，時間介於10~30分鐘。 In one embodiment, the step of covering a polymer material 12' on the continuous wire pattern 14 and the carrier 18 comprises: providing a polyfluorinated diethylene (PVDF) (not shown) having a solid content of 5 ~30%, a polyfluorinated diethylene (PVDF) layer 12' is formed on the continuous conductor pattern 14 and the carrier 18, and a carrier 18 is subjected to a baking process. The temperature of the above baking process is between 50 and 180 ° C, and the time is between 10 and 30 minutes.
在另一實施例中，上述覆蓋一高分子材料12’於連續導線圖案14與載板18上之步驟包括：提供一聚亞醯胺(PI)(未 圖示)，其固含量介於5~40%，形成一聚亞醯胺(PI)層12’於連續導線圖案14與載板18上，以及對載板18進行一烘烤製程。上述烘烤製程之溫度介於50~210℃，時間介於30~60分鐘。 In another embodiment, the step of covering a polymeric material 12' on the continuous wire pattern 14 and the carrier 18 comprises: providing a poly-liminamide (PI) (not As shown in the figure, the solid content is between 5 and 40%, forming a polybenzamine (PI) layer 12' on the continuous wire pattern 14 and the carrier 18, and performing a baking process on the carrier 18. The temperature of the above baking process is between 50 and 210 ° C, and the time is between 30 and 60 minutes.
接著，以例如切割製程分離高分子材料12’與載板18，以形成嵌有連續導線圖案14之一軟性基板12。 Next, the polymer material 12' and the carrier 18 are separated by, for example, a dicing process to form a flexible substrate 12 in which the continuous wiring pattern 14 is embedded.
在此實施例中，上述連續導線圖案14嵌於軟性基板12之內部，如第3C圖所示。 In this embodiment, the continuous wire pattern 14 is embedded inside the flexible substrate 12 as shown in FIG. 3C.
請參閱第4A~4D圖，根據本揭露之一實施例，提供一種嵌有導線之軟性基板(flexible substrate)之製造方法。首先，如第4A圖所示，提供一載板180。上述載板180可由玻璃或金屬所構成。 Referring to FIGS. 4A-4D, according to an embodiment of the present disclosure, a method of manufacturing a flexible substrate embedded with a wire is provided. First, as shown in Fig. 4A, a carrier 180 is provided. The carrier plate 180 may be made of glass or metal.
接著，形成一連續導線圖案140於載板180上。上述連續導線圖案140包含複數個孔洞(未圖示)。本實施例形成包含複數個孔洞的連續導線圖案140於載板180上的步驟可包括以例如網印製程形成連續導線圖案140於載板180上，接著，以例如250~300℃之溫度對連續導線圖案140進行燒結，以形成包含複數個孔洞的連續導線圖案140。上述導線圖案140可由例如銀、銅、鎳或其合金所構成。上述導線圖案140之電阻率大體介於1.6x10-6~10x10-6Ω．cm。上述連續導線圖案140所包含孔洞之尺寸大體介於10nm~100μm。 Next, a continuous wire pattern 140 is formed on the carrier 180. The continuous wire pattern 140 includes a plurality of holes (not shown). The step of forming a continuous wire pattern 140 comprising a plurality of holes on the carrier plate 180 in this embodiment may include forming a continuous wire pattern 140 on the carrier plate 180 by, for example, a screen printing process, and then continuing to a temperature of, for example, 250 to 300 ° C. The wire pattern 140 is sintered to form a continuous wire pattern 140 comprising a plurality of holes. The above-described wire pattern 140 may be composed of, for example, silver, copper, nickel, or an alloy thereof. The resistivity of the above conductor pattern 140 is generally between 1.6x10 -6 and 10x10 -6 Ω. Cm. The size of the holes included in the continuous wire pattern 140 is generally between 10 nm and 100 μm.
接著，以例如塗佈製程覆蓋一高分子材料120’於連續導線圖案140與載板180上，並填入孔洞(未圖示)。上述高分子材料120’可包括聚亞醯胺(polyimide,PI)或聚氟化二乙烯(polyvinylidene fluoride,PVDF)。 Next, a polymer material 120' is coated on the continuous wiring pattern 140 and the carrier 180 by, for example, a coating process, and a hole (not shown) is filled. The above polymer material 120' may include polyimide (PI) or polyvinylidene fluoride (PVDF).
接著，以例如切割製程分離高分子材料120’與載板180，以形成嵌有連續導線圖案140之一軟性基板120。 Next, the polymer material 120' and the carrier plate 180 are separated by, for example, a dicing process to form a flexible substrate 120 in which the continuous wire pattern 140 is embedded.
接著，對嵌有連續導線圖案140之軟性基板120進行一表面處理製程200，例如一電漿製程，以露出連續導線圖案140。 Next, a surface treatment process 200, such as a plasma process, is performed on the flexible substrate 120 in which the continuous wire pattern 140 is embedded to expose the continuous wire pattern 140.
在此實施例中，上述連續導線圖案140嵌於軟性基板120之表面，如第4D圖所示。 In this embodiment, the continuous wire pattern 140 is embedded on the surface of the flexible substrate 120 as shown in FIG. 4D.
本揭露開發一種全印刷式結構設計，可將金屬導線嵌於軟性基板中，解決了現行基板與導線密著度、可靠度不佳的問題，其製程簡單化亦可達到更佳效益，可廣泛應用於軟性電子、軟性印刷電路、LED等相關產業。本揭露嵌有金屬導線之軟性基板結構主要是利用金屬導線與載板密著度不佳之特點，而其所搭配之高分子材料於塗佈成形後，可自載板輕易取下，並將金屬導線嵌於高分子材料中，其基板與導線密著度良好不易剝落且結構耐撓曲度佳。 The disclosure discloses a full-printing structure design, which can embed a metal wire in a flexible substrate, solves the problem of poor adhesion and reliability of the current substrate and the wire, and the process can be simplified to achieve better benefits, and can be widely used. Used in soft electronics, flexible printed circuits, LED and other related industries. The soft substrate structure embedded with the metal wire is mainly characterized by the poor adhesion of the metal wire and the carrier plate, and the polymer material matched with the metal material can be easily removed from the carrier plate after the coating and forming, and the metal is removed. The wire is embedded in the polymer material, and the substrate and the wire have good adhesion and are not easily peeled off, and the structure has good flex resistance.
本揭露軟性基板結構藉由高分子材料對導線孔洞的充填與滲透，使得高分子材料有效地包覆金屬導線，致使最終結構之金屬導線內埋或嵌於高分子基板表面，可使金屬導線同時達到耐熱、耐焊、抗撓曲、薄化與高電子傳導等特性。此外，本揭露所開發一種新型軟性基板導體電路結構可應用於超薄高分子基板與電路的形成，達到整體積體的薄化，亦可有效應用於軟性LED封裝基板、觸控面板、顯示器等軟性顯示器，另可作為高功率電子晶片接著、薄化封裝及電子電路相關應用。 The soft substrate structure fills and penetrates the hole of the wire by the polymer material, so that the polymer material effectively coats the metal wire, so that the metal wire of the final structure is buried or embedded on the surface of the polymer substrate, so that the metal wire can be simultaneously It achieves heat resistance, solder resistance, flexing resistance, thinning and high electron conduction. In addition, a novel flexible substrate conductor circuit structure developed by the present disclosure can be applied to the formation of an ultra-thin polymer substrate and a circuit to achieve thinning of a whole body, and can also be effectively applied to a flexible LED package substrate, a touch panel, a display, etc. Flexible displays can also be used as high power electronic wafers, thin package and electronic circuit related applications.
實施例1 Example 1
本揭露嵌有導線之軟性基板之製備(1)及其特性分析The invention discloses the preparation of flexible substrate embedded with wires (1) and its characteristic analysis
請參閱第3A~3C圖，首先，如第3A圖所示，提供一載板18。上述載板18由玻璃所構成。 Referring to Figures 3A-3C, first, as shown in Figure 3A, a carrier 18 is provided. The carrier plate 18 is made of glass.
接著，形成一連續導線圖案14於載板18上。上述連續導線圖案14包含複數個孔洞(未圖示)。本實施例形成包含複數個孔洞的連續導線圖案14於載板18上的步驟包括將有機酸銀(C11H21OOAg)溶解於二甲苯(xylene)中，接著，取100nm~300nm球狀金屬銀粉體與上述溶液混練，製備固含量85%之導電銀膠(黏度100,000cp.)，之後，以mesh數為325之網板印刷形成連續導線圖案14於載板18上，接著，以300℃之溫度對連續導線圖案14進行燒結約30分鐘，以形成包含複數個孔洞的連續導線圖案14。上述連續導線圖案14所包含孔洞之尺寸介於10nm~100μm。 Next, a continuous wire pattern 14 is formed on the carrier 18. The continuous wire pattern 14 includes a plurality of holes (not shown). The step of forming a continuous wire pattern 14 comprising a plurality of holes on the carrier plate 18 in the embodiment comprises dissolving organic acid silver (C 11 H 21 OOAg) in xylene, and then taking a spherical metal of 100 nm to 300 nm. The silver powder is kneaded with the above solution to prepare a conductive silver paste (viscosity 100,000 cp.) having a solid content of 85%, and then a continuous wire pattern 14 is formed on the carrier plate 18 by screen printing having a mesh number of 325, and then, 300 The continuous wire pattern 14 is sintered for about 30 minutes at a temperature of °C to form a continuous wire pattern 14 comprising a plurality of holes. The continuous conductor pattern 14 has a hole having a size of 10 nm to 100 μm.
接著，以塗佈製程覆蓋一高分子材料12’於連續導線圖案14與載板18上，並填入孔洞(未圖示)。本實施例覆蓋高分子材料12’於連續導線圖案14與載板18上的步驟包括將固含量約20%的聚亞醯胺(PI)溶液利用300μm刮刀塗佈成膜，接著，分別以50℃、30分鐘，140℃、30分鐘以及210℃、60分鐘的烘烤條件對聚亞醯胺(PI)膜進行烘烤，以獲得透明聚亞醯胺(PI)薄膜。 Next, a polymer material 12' is coated on the continuous conductor pattern 14 and the carrier 18 by a coating process, and a hole (not shown) is filled. The step of covering the polymer material 12' on the continuous wire pattern 14 and the carrier 18 in this embodiment comprises coating a polyimidamine (PI) solution having a solid content of about 20% into a film by using a 300 μm doctor blade, and then respectively, 50. The polybenzamine (PI) film was baked at ° C, 30 minutes, 140 ° C, 30 minutes, and 210 ° C, 60 minutes of baking conditions to obtain a transparent polyimine (PI) film.
接著，以切割製程分離高分子材料12’與載板18，以形成嵌有連續導線圖案14之一軟性基板12。上述切割製程為 一簡單機械切割製程。 Next, the polymer material 12' and the carrier 18 are separated by a dicing process to form a flexible substrate 12 in which the continuous wiring pattern 14 is embedded. The above cutting process is A simple mechanical cutting process.
在此實施例中，上述連續導線圖案14嵌於軟性基板12之內部，如第3C圖所示。 In this embodiment, the continuous wire pattern 14 is embedded inside the flexible substrate 12 as shown in FIG. 3C.
接著，對本實施例嵌有導線之軟性基板進行包括基板與導線密著度、電阻率的特性分析及相關撓曲及銲錫測試，結果載於下表1。 Next, the flexible substrate in which the wires are embedded in the present embodiment is subjected to characteristic analysis including substrate adhesion and wire adhesion, and resistivity and related flexural and soldering tests. The results are shown in Table 1 below.
實施例2 Example 2
本揭露嵌有導線之軟性基板之製備(2)及其特性分析The invention discloses the preparation of flexible substrate embedded with wires (2) and its characteristic analysis
仍請參閱第3A~3C圖，首先，如第3A圖所示，提供一載板18。上述載板18由不銹鋼所構成。 Still referring to Figures 3A-3C, first, as shown in Figure 3A, a carrier 18 is provided. The carrier plate 18 is made of stainless steel.
接著，形成一連續導線圖案14於載板18上。上述連續導線圖案14包含複數個孔洞(未圖示)。本實施例形成包含複數個孔洞的連續導線圖案14於載板18上的步驟包括將有機酸銀(C11H21OOAg)溶解於二甲苯(xylene)中，接著，取100nm~300nm球狀金屬銀粉體與上述溶液混練，製備固含量85%之導電銀膠(黏度100,000cp.)，之後，以mesh數為325之網板印刷形成連續導線圖案14於載板18上，接著，以300℃之溫度對連續導線圖案14進行燒結約30分鐘，以形成包含複數個孔洞的連續導線圖案14。上述連續導線圖案14所包含孔洞之尺寸介於10nm~100μm。 Next, a continuous wire pattern 14 is formed on the carrier 18. The continuous wire pattern 14 includes a plurality of holes (not shown). The step of forming a continuous wire pattern 14 comprising a plurality of holes on the carrier plate 18 in the embodiment comprises dissolving organic acid silver (C 11 H 21 OOAg) in xylene, and then taking a spherical metal of 100 nm to 300 nm. The silver powder is kneaded with the above solution to prepare a conductive silver paste (viscosity 100,000 cp.) having a solid content of 85%, and then a continuous wire pattern 14 is formed on the carrier plate 18 by screen printing having a mesh number of 325, and then, 300 The continuous wire pattern 14 is sintered for about 30 minutes at a temperature of °C to form a continuous wire pattern 14 comprising a plurality of holes. The continuous conductor pattern 14 has a hole having a size of 10 nm to 100 μm.
接著，以塗佈製程覆蓋一高分子材料12’於連續導線圖案14與載板18上，並填入孔洞(未圖示)。本實施例覆蓋高分子材料12’於連續導線圖案14與載板18上的步驟包括將固含 量約15%的聚氟化二乙烯(PVDF)溶液利用500μm刮刀塗佈成膜，接著，分別以80℃、10分鐘以及180℃、30分鐘的烘烤條件對聚氟化二乙烯(PVDF)膜進行烘烤，以獲得透明聚氟化二乙烯(PVDF)薄膜。 Next, a polymer material 12' is coated on the continuous conductor pattern 14 and the carrier 18 by a coating process, and a hole (not shown) is filled. The step of covering the polymer material 12' on the continuous wire pattern 14 and the carrier 18 in this embodiment includes solid-containing Approximately 15% of a polyfluorinated diethylene oxide (PVDF) solution was coated with a 500 μm doctor blade, followed by a baking condition of 80 ° C, 10 minutes, and 180 ° C for 30 minutes, respectively. The film was baked to obtain a transparent polyfluorinated diethylene (PVDF) film.
接著，以切割製程分離高分子材料12’與載板18，以形成嵌有連續導線圖案14之一軟性基板12。上述切割製程為一簡單機械切割製程。 Next, the polymer material 12' and the carrier 18 are separated by a dicing process to form a flexible substrate 12 in which the continuous wiring pattern 14 is embedded. The above cutting process is a simple mechanical cutting process.
在此實施例中，上述連續導線圖案14嵌於軟性基板12之內部，如第3C圖所示。 In this embodiment, the continuous wire pattern 14 is embedded inside the flexible substrate 12 as shown in FIG. 3C.
接著，對本實施例嵌有導線之軟性基板進行包括基板與導線密著度、電阻率的特性分析及相關撓曲及銲錫測試，結果載於下表1。 Next, the flexible substrate in which the wires are embedded in the present embodiment is subjected to characteristic analysis including substrate adhesion and wire adhesion, and resistivity and related flexural and soldering tests. The results are shown in Table 1 below.
實施例3 Example 3
本揭露嵌有導線之軟性基板之製備(3)及其特性分析The invention discloses the preparation of flexible substrate embedded with wires (3) and its characteristic analysis
請參閱第4A~4D圖，首先，如第4A圖所示，提供一載板180。上述載板180由玻璃所構成。 Referring to Figures 4A-4D, first, as shown in Figure 4A, a carrier plate 180 is provided. The carrier plate 180 is made of glass.
接著，形成一連續導線圖案140於載板180上。上述連續導線圖案140包含複數個孔洞(未圖示)。本實施例形成包含複數個孔洞的連續導線圖案140於載板180上的步驟包括將有機酸銀(C11H21OOAg)溶解於二甲苯(xylene)中，接著，取100nm~300nm球狀金屬銀粉體與上述溶液混練，製備固含量85%之導電銀膠(黏度100,000cp.)，之後，以mesh數為325之網板印刷形成連續導線圖案140於載板180上，接著，以300℃之 溫度對連續導線圖案140進行燒結約30分鐘，以形成包含複數個孔洞的連續導線圖案140。上述連續導線圖案140所包含孔洞之尺寸介於10nm~100μm。 Next, a continuous wire pattern 140 is formed on the carrier 180. The continuous wire pattern 140 includes a plurality of holes (not shown). The step of forming a continuous wire pattern 140 comprising a plurality of holes on the carrier plate 180 in the embodiment comprises dissolving organic acid silver (C 11 H 21 OOAg) in xylene, and then taking a spherical metal of 100 nm to 300 nm. The silver powder is kneaded with the above solution to prepare a conductive silver paste (viscosity 100,000 cp.) having a solid content of 85%. Thereafter, the continuous wire pattern 140 is formed on the carrier plate 180 by screen printing having a mesh number of 325, and then, 300. The continuous wire pattern 140 is sintered for about 30 minutes at a temperature of °C to form a continuous wire pattern 140 comprising a plurality of holes. The continuous conductor pattern 140 includes holes having a size ranging from 10 nm to 100 μm.
接著，以塗佈製程覆蓋一高分子材料120’於連續導線圖案140與載板180上，並填入孔洞(未圖示)。本實施例覆蓋高分子材料120’於連續導線圖案140與載板180上的步驟包括將固含量約20%的聚亞醯胺(PI)溶液利用300μm刮刀塗佈成膜，接著，分別以50℃、30分鐘，140℃、30分鐘以及210℃、60分鐘的烘烤條件對聚亞醯胺(PI)膜進行烘烤，以獲得透明聚亞醯胺(PI)薄膜。 Next, a polymer material 120' is coated on the continuous wire pattern 140 and the carrier 180 by a coating process, and holes (not shown) are filled. The step of covering the polymer material 120' on the continuous wire pattern 140 and the carrier plate 180 in this embodiment includes coating a polyimide (PI) solution having a solid content of about 20% into a film by using a 300 μm doctor blade, and then respectively, 50 The polybenzamine (PI) film was baked at ° C, 30 minutes, 140 ° C, 30 minutes, and 210 ° C, 60 minutes of baking conditions to obtain a transparent polyimine (PI) film.
接著，以切割製程分離高分子材料120’與載板180，以形成嵌有連續導線圖案140之一軟性基板120。上述切割製程為一簡單機械切割製程。 Next, the polymer material 120' and the carrier 180 are separated by a dicing process to form a flexible substrate 120 in which the continuous wiring pattern 140 is embedded. The above cutting process is a simple mechanical cutting process.
接著，對嵌有連續導線圖案140之軟性基板120進行一表面處理製程200，以露出連續導線圖案140。上述表面處理製程200為一電漿製程。 Next, a surface treatment process 200 is performed on the flexible substrate 120 in which the continuous wire pattern 140 is embedded to expose the continuous wire pattern 140. The surface treatment process 200 described above is a plasma process.
在此實施例中，上述連續導線圖案140嵌於軟性基板120之表面，如第4D圖所示。 In this embodiment, the continuous wire pattern 140 is embedded on the surface of the flexible substrate 120 as shown in FIG. 4D.
接著，對本實施例嵌有導線之軟性基板進行包括基板與導線密著度、電阻率的特性分析及相關撓曲及銲錫測試，結果載於下表1。 Next, the flexible substrate in which the wires are embedded in the present embodiment is subjected to characteristic analysis including substrate adhesion and wire adhesion, and resistivity and related flexural and soldering tests. The results are shown in Table 1 below.
比較實施例1 Comparative Example 1
傳統其上形成導線之軟性基板之製備及其特性分析Preparation and Characterization of a Flexible Substrate Forming a Wire on It
首先，提供一基板。上述基板由聚亞醯胺(PI)所構成。 First, a substrate is provided. The above substrate is composed of polyamidamine (PI).
接著，形成一導線圖案於基板上。本實施例形成導線圖案於基板上的步驟包括將有機酸銀(C11H21OOAg)溶解於二甲苯(xylene)中，接著，取100nm~300nm球狀金屬銀粉體與上述溶液混練，製備固含量85%之導電銀膠，之後，以mesh數為325之網板印刷形成上述導線圖案於基板上。 Next, a wire pattern is formed on the substrate. The step of forming the wire pattern on the substrate in this embodiment comprises dissolving organic acid silver (C 11 H 21 OOAg) in xylene, and then mixing 100 nm to 300 nm spherical metal silver powder with the above solution to prepare Conductive silver paste having a solid content of 85%, and then the above-mentioned wire pattern was formed on the substrate by screen printing having a mesh number of 325.
接著，對本實施例其上形成導線之軟性基板進行包括基板與導線密著度、電阻率的特性分析及相關撓曲及銲錫測試，結果載於下表1。 Next, the soft substrate on which the wires were formed in the present embodiment was subjected to characteristic analysis including substrate and wire adhesion and electrical resistivity, and related flexural and soldering tests. The results are shown in Table 1 below.
雖然本發明已以數個較佳實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作任意之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the scope of the present invention, and any one of ordinary skill in the art can make any changes without departing from the spirit and scope of the invention. And the scope of the present invention is defined by the scope of the appended claims.
Claims (11)
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| CN201510085481.5A CN104869754B (en) | 2014-02-25 | 2015-02-17 | Flexible substrate embedded with conducting wire and manufacturing method thereof |
| US14/627,913 US9707706B2 (en) | 2014-02-25 | 2015-02-20 | Flexible substrate embedded with wires and method for fabricating the same |
| JP2015033458A JP2015162678A (en) | 2014-02-25 | 2015-02-24 | Flexible substrate embedded with wiring and manufacturing method of the same |
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| TWI608639B (en) | 2016-12-06 | 2017-12-11 | 財團法人工業技術研究院 | Flexible thermoelectric structure and method for manufacturing the same |
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| JP3102046B2 (en) * | 1991-03-20 | 2000-10-23 | 日産自動車株式会社 | Planetary gear train of automatic transmission |
| CN1391430A (en) * | 2001-06-07 | 2003-01-15 | 明碁电通股份有限公司 | Flexible circuit board and its preparing process |
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