TWI615227B - 超音波振動接合裝置 - Google Patents
超音波振動接合裝置 Download PDFInfo
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- TWI615227B TWI615227B TW105103750A TW105103750A TWI615227B TW I615227 B TWI615227 B TW I615227B TW 105103750 A TW105103750 A TW 105103750A TW 105103750 A TW105103750 A TW 105103750A TW I615227 B TWI615227 B TW I615227B
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- 238000003825 pressing Methods 0.000 claims abstract description 168
- 239000000758 substrate Substances 0.000 claims abstract description 76
- 230000007246 mechanism Effects 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims abstract description 40
- 230000008569 process Effects 0.000 claims abstract description 37
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000007667 floating Methods 0.000 abstract description 4
- 239000011521 glass Substances 0.000 description 38
- 238000003466 welding Methods 0.000 description 12
- 239000010408 film Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 239000010409 thin film Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
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- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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Abstract
本發明的目的在提供可確實消除引線浮起而精度良好地將引線接合到基板上之超音波振動接合裝置。並且,本發明係具備有:接合工具(4),係執行從抵接前端部(4t)施加超音波振動至引線(12)上的施加部(12p)之超音波振動處理;以及一對按壓機構(20,30),係具有可做旋轉動作的一對按壓滾輪(23,33)。一對按壓機構(20,30)係組構成:在接合工具(4)執行超音波振動處理時,執行利用一對按壓滾輪(23,33)按壓引線(12)上的施加部的兩側之按壓處理,而在上述超音波振動處理未執行時,執行使一對按壓滾輪(23,33)之旋轉動作執行而一邊按壓引線(12)一邊在引線(12)上移動之移動處理。
Description
本發明係關於加壓式的超音波振動接合裝置,且係關於例如適用於以超音波振動將具有導電性的引線(lead wire)接合到薄厚度的基板上的情況之超音波振動接合裝置。
過去,在例如配線(wire harness)的中間接點(joint)接合的方法方面,係採用加壓式的超音波振動接合技術。該超音波振動接合技術,係將工件配置到預定的構件,且在按壓著該工件的狀態下對該工件施加超音波振動。藉由該按壓及超音波振動的能量,使工件與預定的構件強力接合。
另外,在半導體領域,在安裝電子部件之際也採用加壓式的超音波振動接合技術,這樣的技術的例子,可舉出的有例如專利文獻1中揭示之加壓式超音波振動接合裝置。
專利文獻1:日本特開2011-9262號公報
第6及7圖係用來說明專利文獻1中揭示之以往的加壓式的超音波振動接合裝置200的問題點之說明圖。第6圖係顯示從第1圖的X軸方向觀看超音波振動處理時之按壓構件29及39按壓著引線12的狀態所見之放大圖,第7圖係顯示從第1圖的X軸方向觀看超音波振動處理後的狀態所見之放大圖。第6及7圖中都顯示有XYZ正交座標系。
如第6圖所示,在利用接合工具(bonding tool)4的抵接前端部4t以按壓力P4按壓之狀態,從抵接前端部4t施加超音波振動(沿著X軸方向之振動)至引線12的超音波接合點12p,藉此執行超音波振動接合處理。
另一方面,按壓構件29及39係連結至未圖示的致動缸(cylinder)。按壓構件29及39利用來自致動缸的按壓力F29及F39,在第6圖的Z軸方向(-Z方向)移動,向基板台(table)10側施加壓力。亦即,按壓構件29及39係在超音波振動處理執行時,進行以按壓力F29及F39按壓存在於超音波接合點12p(施加部)的兩側之引線12的按壓部W29及W39之按壓處理。利用此按壓處理,抑制引線12產生引線浮起(撓曲)之現象。
在上述的超音波振動接合處理時從俯視觀看線狀的引線12(從上方(+Z側)觀看時),在該引線12的延
伸方向會存在有:受到按壓構件29按壓之按壓部W29(Y方向的寬度為10mm左右)、間隙△29(1mm左右)、超音波接合點12p(抵接前端部4t的Y方向的寬度)、間隙△39(1mm左右)、受到按壓構件39按壓之按壓部W39(Y方向的寬度為10mm)。亦即,在引線12上,從抵接前端部4t的兩側的端部分別到按壓構件29及按壓構件39的端部,必定會有產生各具有1mm左右的距離之間隙△29及△39。而且,在將超音波接合點12p的間隔設定得比較寬之情況,在相鄰的一方與另一方的超音波接合點12p之間在一方的按壓部W29(W39)與另一方的按壓部W39(W29)之間也會有產生間隙(以下簡稱為「接合點間間隙」)。
在引線12上,會形成上述的間隙△29及△39之區域(引線間隙形成區域)及會形成接合點間間隙之區域(接合點間形成區域),既未執行由按壓構件29及39所進行的按壓處理也未執行由接合工具4所進行的接合處理,所以會如第7圖所示,不僅在引線12的引線間隙形成區域(△29及△39)有產生引線浮起12u(撓曲)之可能性,在上述接合點間形成區域也會有產生撓曲之可能性。
如上所述,在超音波振動處理進行時,即使在利用按壓構件29及39按壓引線12的超音波接合點12p的兩側邊這種態樣的以往的超音波振動接合裝置200中,在按壓構件29及39與接合工具4的抵接前端部4t之間的引線12上必定會存在有上述引線間隙形成區域,所以有無法確實消除引線浮起12u之問題點。
本發明的目的在解決如上述的問題點,提供可確實消除引線浮起而精度良好地將引線接合到基板上之超音波振動接合裝置。
本發明之超音波振動接合裝置係具備有:基板台(table),係用來載置基板;接合工具(bonding tool),係在將具有導電性的引線(lead wire)配置在前述基板上之狀態下,執行一邊向前述基板台側施加預定的壓力,一邊從抵接前端部施加超音波振動至前述引線上的施加部之超音波振動處理;以及第一及第二按壓機構,係具有可做旋轉動作的第一及第二按壓滾輪(roller);其中,前述第一及第二按壓機構係組構成:在前述接合工具執行前述超音波振動處理時,執行利用前述第一及第二按壓滾輪按壓前述引線上的前述施加部的兩側之按壓處理,而在前述接合工具未執行前述超音波振動處理時,執行使前述第一及第二按壓滾輪之旋轉動作執行而一邊按壓前述引線一邊在前述引線上移動之移動處理。
本發明之超音波振動接合裝置,其第一及第二按壓機構係在接合工具執行超音波振動處理時執行按壓處理,因此可抑制超音波振動處理時之引線撓曲這樣的引線浮起。然而,在超音波振動處理時,接合工具與第一及第二按壓滾輪之間會有間隙,所以有會在引線的該間隙下的引線間隙形成區域產生撓曲而發生上述引線浮起的可
能性。
因此,本發明之超音波振動接合裝置,其第一及第二按壓機構在接合工具未執行超音波振動處理時,進行一邊按壓引線一邊在引線上移動之移動處理,因而可利用第一及第二按壓滾輪之中的至少一個按壓滾輪按壓在上述引線間隙部分上,可確實消除上述引線浮起而精度良好地將引線接合到基板上。
從以下的詳細說明及隨附的圖式,將更清楚了解本發明之目的、特徵、態樣、及優點。
1、21、31‧‧‧致動缸
4‧‧‧接合工具
4t‧‧‧抵接前端部
6‧‧‧振動焊頭部
10‧‧‧基板台
11‧‧‧玻璃基板
11g‧‧‧太陽電池薄膜
12‧‧‧引線
12p‧‧‧超音波接合點
15‧‧‧控制部
16‧‧‧驅動部
17‧‧‧超音波振動子
20、30‧‧‧按壓機構
22、32‧‧‧按壓構件
23、33‧‧‧按壓滾輪
22j、32j‧‧‧旋轉軸
25、35‧‧‧接合板
F22、F32‧‧‧按壓力
UV‧‧‧超音波振動
100‧‧‧超音波振動接合裝置
DR100‧‧‧操作方向
第1圖係顯示作為本發明的實施形態之加壓式的超音波振動接合裝置的構成之說明圖。
第2圖係顯示在基板台上配置玻璃基板,並將引線接合到玻璃基板上後的狀態之立體圖。
第3圖係示意性顯示本實施形態之超音波振動接合裝置在執行超音波振動處理時的狀態之剖面圖。
第4圖係示意性顯示本實施形態之超音波振動接合裝置在未執行超音波振動處理時的狀態之剖面圖。
第5圖係示意性顯示本實施形態之超音波振動接合裝置的控制系統之方塊圖。
第6圖係用來說明以往的超音波振動接合裝置的問題點之說明圖。
第7圖係用來說明以往的超音波振動接合裝置的問題
點之說明圖。
本發明係為與用來將具有導電性之引線以超音波振動接合的方式接合到薄厚度的基板上之加壓式的超音波振動接合裝置有關之發明。其中,基板的厚度係在例如2mm以下左右。以下,根據顯示本發明的實施形態之圖式來具體說明本發明。
第1圖係顯示作為本發明的實施形態之加壓式的超音波振動接合裝置100的全體構成之說明圖。第1圖係從斜上方觀看超音波振動接合裝置100所見之立體圖。第1圖及以後第2至4圖中都有顯示XYZ正交座標系。
如第1圖所示,超音波振動接合裝置100具備有:(電動)致動缸1、具有抵接前端部4t之接合工具4、振動焊頭(horn)部6、按壓機構20,30及後述之基板台10(第1圖中未顯示)。
致動缸1係連結至接合工具4,致動缸1的驅動力(按壓力)F1傳遞至接合工具4,可控制接合工具4的驅動。具體而言,致動缸1可使接合工具4沿著Z軸方向移動。而且,致動缸1可透過接合工具4的抵接前端部4t對於引線12施加預定的壓力。引線12的構成材料可考慮採用例如鋁。
接合工具4係由未圖示的支架(holder)加以支持,且在該支架內部接受導引而可上下運動。接合工具4之基板台10側的前端部配設有抵接前端部4t。振動焊頭部6係連接至接合工具4,未圖示的超音波振動子所產生的超音波振動UV透過振動焊頭部6而傳遞至接合工具4。
抵接前端部4t形成於接合工具4的前端,係在超音波振動接合處理之際與工件(引線12)抵接的部分。抵接前端部4t之與引線12的抵接面,係形成有例如預定圖案的第一凹凸形狀,該第一凹凸形狀的面還形成有比第一凹凸形狀小的複數個第二凹凸形狀。
本實施形態之超音波振動接合裝置100中,連結至接合工具4之致動缸1的兩側面(Y方向側的面)係透過接合板25及35而與按壓機構20及30(的致動缸21及31)連結,接合工具4與按壓機構20及30藉此而構成為一體。
按壓機構20(第一按壓機構)係由(電動)致動缸21、按壓構件22及按壓滾輪23所構成,按壓滾輪23(第一按壓滾輪)可做以按壓構件22的旋轉軸22j為中心之旋轉動作。同樣的,按壓機構30(第二按壓機構)係由(電動)致動缸31、按壓構件32及按壓滾輪33所構成,按壓滾輪33(第二按壓滾輪)可做以按壓構件32的旋轉軸32j為中心之旋轉動作。
按壓構件22及32係連結至致動缸21及31。因此,來自致動缸21之驅動力(按壓力)F22會透過按壓構
件22而傳遞至按壓滾輪23,使按壓滾輪23在Z軸方向(-Z方向)移動。另外,致動缸21可透過按壓滾輪23而對引線12施加預定的壓力。同樣的,來自致動缸31之驅動力(按壓力)F32會透過按壓構件32而傳遞至按壓滾輪33,使按壓滾輪33在Z軸方向(-Z方向)移動,另外,致動缸31可透過按壓滾輪33而對引線12施加預定的壓力。
按壓滾輪23及33係由例如橡膠等之彈性體所構成,以如此的按壓滾輪23及33按壓引線12,避免對引線12造成損傷。
另外,有未圖示的驅動部連結至上述之由接合工具4及按壓機構20及30等所一體化構成之超音波振動接合裝置100,而可執行使超音波振動接合裝置100沿著裝置操作方向DR100移動之移動處理。
第2圖係顯示在基板台10上配置玻璃基板11,並將引線12接合到玻璃基板11上後的狀態之立體圖。
如第2圖所示,在基板台10上設置表面形成有太陽電池薄膜11g之玻璃基板11,且在玻璃基板11的太陽電池薄膜11g上設置引線12。另外,雖然圖中省略了,但在基板台10的上表面穿設有至少一個以上的孔,通過該孔進行真空吸引,將玻璃基板11固定在基板台10上。
在超音波震動處理執行時,係為在玻璃基板11(的太陽電池薄膜11g上)配置有具有導電性的引線12
之狀態。在此狀態下,利用來自致動缸1之驅動力F1,接合工具4在往基板台10側對引線12施加預定的壓力之狀態,使經由振動焊頭部6而傳遞過來之超音波振動子所產生的超音波振動UV從接合工具4的抵接前端部4t施加在引線12的超音波接合點12p上,以此方式執行將引線12接合到玻璃基板11之超音波振動處理。
第3及4圖係示意性顯示本實施形態之超音波振動接合裝置在超音波振動處理執行及未執行時的狀態之剖面圖。具體而言,第3圖係顯示利用該按壓機構20及30按壓引線12之按壓處理,第4圖係顯示利用按壓機構20及30的按壓滾輪23及33的旋轉動作而進行之移動處理。第3及4圖都是從橫方向(X方向側)觀看超音波振動接合裝置100所見之放大圖。第3及4圖中省略了太陽電池薄膜11g之圖示。
以下參照第1至4圖來說明使用本實施形態之超音波振動接合裝置100所做之加壓式的超音波振動接合動作。
首先,在基板台10上設置表面形成有太陽電池薄膜11g之薄厚度的玻璃基板11。並且,透過設於基板台10之孔(未圖示)進行真空吸引,將玻璃基板11固定在基板台10上。
接著,從未圖示之捲繞有具有導電性的薄
膜的引線12之捲筒(reel)將引線12拉出,並將該拉出的引線12配置在玻璃基板11(的太陽電池薄膜11g)上的預定的位置。
接著,利用致動缸21及31的按壓力F22及F32,按壓機構20及30的按壓滾輪23及33執行按壓(向基板台10側按壓)引線12之按壓處理。此處,如第3圖所示,按壓滾輪23及33分別位於要實施加壓式的超音波振動接合之超音波接合點12p的兩側而按壓引線12。換言之,按壓滾輪23及33係向基板台10側按壓引線12的超音波振動UV的施加部(超音波接合點12p)的兩側邊。
並且,在以按壓滾輪23及33按壓著引線12的狀態下,利用致動缸1的驅動力F1使接合工具4朝向引線12而下降。然後,當接合工具4的抵接前端部4t抵接到引線12時,就利用致動缸1的驅動力F1向基板台10側對於引線12施加預定的壓力。
如上述,利用按壓機構20及30的按壓處理以按壓滾輪23及33按壓引線12,並在形成為接合工具4對引線12施加預定的壓力之狀態後,使超音波振動子產生超音波振動UV。產生的超音波振動UV經由振動焊頭部6傳遞至接合工具4。於是,接合工具4的抵接前端部4t進行預定的振動數(例如20至40kHz)、振幅10μm以下(例如基於防止對於玻璃基板11造成損傷之觀點而定之4、5μm左右)之超音波振動UV。
此處,超音波振動UV的振動方向可為例如
與Y軸方向平行之方向(亦即引線12的延設方向),亦可為與X軸平行之方向(亦即引線12的寬度方向)。如此,進行使用接合工具4之超音波振動處理,超音波振動UV就透過抵接前端部4t而施加到引線12的超音波接合點12p。
如上述在利用按壓滾輪23及33按壓引線12之狀態,對於引線12執行使用接合工具4(抵接前端部4t)之加壓式的超音波振動處理,使引線12接合到玻璃基板11。
從俯視觀看超音波振動接合之際的線狀的引線12之情況(從上方觀看之情況),如第3圖所示,在引線12的延設方向(Y方向)會存在有:按壓機構20的按壓滾輪23、按壓滾輪23與抵接前端部4t間之間隙△S2(1mm左右)、超音波振動接合施工部(抵接前端部4t的Y方向寬度)、抵接前端部4t與按壓滾輪33間之間隙△S3(1mm左右)、按壓機構30的按壓滾輪33。
該按壓機構20及30之按壓處理,係以按壓滾輪23及33施加於引線12之壓力不會對於玻璃基板11造成損傷之程度的大小所執行,雖然也會依玻璃基板11的材質及厚度而有不同,但大約設定在例如10kg左右之壓力。另外,按壓機構20及30的按壓滾輪23及33係只抵接於引線12,按壓之際並不與玻璃基板11(太陽電池薄膜11g)接觸。
如上述,在利用按壓機構20及30的按壓滾輪23及33之按壓處理按壓引線12的超音波接合點12p的兩側邊之狀態,進行利用接合工具4使引線12的超音波接
合點12p接合至到玻璃基板11之處理。
而且,利用按壓滾輪23及33按壓引線12,也會使玻璃基板11按壓基板台10。因此,玻璃基板11相對於基板台10之固定會更穩,在對於引線12實施加壓式的超音波振動接合之際,可防止玻璃基板11相對於基板台10而移動。如此,使玻璃基板11之固定更穩,就可只使引線12做超音波振動。換言之,可使接合工具4所發出的超音波振動能量有效率地轉換為在玻璃基板11與引線12的接觸部之摩擦能量。因而,可更短時間且更有效率地進行利用超音波振動之引線12與玻璃基板11之接合。
不過,因為按壓滾輪23及33與超音波接合點12p之間存在有間隙△S2及△S3,所以在引線12之該間隙△S2及△S3的形成區域(以下稱為「引線間隙形成區域」)內,因為與第7圖所示的間隙△S29及△S39一樣的原因,會有在引線12產生引線浮起(撓曲)之可能性。另外,在將超音波接合點12p的間隔設定得比較寬之情況,還有在上述超音波接合點間形成區域內的引線12產生引線浮起之可能性。
接著,超音波振動接合裝置100執行在超音波振動處理未執行時進行之按壓機構20及30之移動處理。
如第4圖所示,利用來自致動缸1之按壓力F1,使接合工具4在Z軸方向(+Z方向)移動,成為從基板台10浮起之狀態。亦即,超音波振動接合裝置100在執行使引線12接合至玻璃基板11之超音波振動處理後,利用
致動缸1之按壓力F1使接合工具4向上移動,解除與引線12接觸之狀態。
另一方面,按壓機構20及30的按壓滾輪23及33所施加於引線12之壓力,係設定為:不會對於薄厚度的玻璃基板11造成損傷之大小,且使在引線12上之以旋轉軸22j及32j為中心之按壓滾輪23及33的旋轉動作(旋轉方向R23及R33)執行,使按壓機構20及30可一邊按壓引線12一邊與接合工具4一起在引線12上移動之狀態。
在上述狀態下,利用連結至超音波振動接合裝置100之未圖示的驅動部,執行使超音波振動接合裝置100沿著裝置操作方向DR100移動之移動處理。此外,亦可不設置驅動部,而是使藉真空吸引而有玻璃基板11固定於其上之基板台10沿著裝置操作方向DR100移動,藉此而執行超音波振動接合裝置100之相對於基板台10而言沿著裝置操作方向DR100移動之移動處理。
亦即,執行按壓滾輪23及33藉由本身的旋轉動作而沿著裝置操作方向DR100在引線12上移動這樣的形式之超音波振動接合裝置100之移動處理。並且,在接合工具4的抵接前端部4t位於要施加超音波振動之下一個超音波接合點12p的上方停止移動處理。
結果,在移動處理中,因為按壓滾輪23及33之中的一個按壓滾輪必定在按壓在上述引線12的上述引線間隙形成區域(與間隙△S2及△S3對應之區域)上的狀態移動,所以就算在上述超音波振動處理執行時在引線
12的上述引線間隙形成區域產生了引線浮起之情況,也可藉由上述一個按壓滾輪之按壓而確實消除上述引線浮起。同樣的,就算在接合點間形成區域產生了引線浮起之情況,也可確實消除該引線浮起。
如上所述,本實施形態之超音波振動接合裝置100的按壓機構20及30(第一及第二按壓機構),係在利用接合工具4執行超音波振動處理之後,執行由按壓滾輪23及33一邊按壓引線12一邊在引線12(包含剛剛執行超音波振動處理時之引線間隙形成區域)上移動之移動處理。
因此,在超音波振動接合裝置100之移動處理時,按壓滾輪23及33(第一及第二按壓滾輪)之中的至少一個按壓滾輪可按壓在上述引線間隙形成區域及上述接合點間區域上。結果,就會達成:在超音波振動接合裝置100之移動處理時,可確實消除在引線12產生引線浮起之情形,可精度良好地將引線12接合到玻璃基板11上之效果。
第5圖係示意性顯示超音波振動接合裝置100的控制系統之方塊圖。如第5圖所示,超音波振動接合裝置100還具有控制部15,控制部15係控制致動缸1,21及31、驅動部16及超音波振動子17之驅動。驅動部16係執行使超音波振動接合裝置100全體在裝置操作方向DR100移動之移動處理,超音波振動子17執行透過振動焊頭部6而將超音波振動UV傳遞給接合工具4之超音波振動處理。
控制部15藉由控制致動缸21及31之驅動,而可將按壓滾輪23及33的按壓力F22及F32控制成可變化,並且藉由控制驅動部16而可控制超音波振動接合裝置100之沿著裝置操作方向DR100的移動處理。
再者,控制部15控制對於致動缸1之驅動而可控制施加於接合工具4之沿Z軸方向的驅動力F1,以及控制超音波振動子17而可控制接合工具4之超音波振動處理。因此,控制部15可依照來自例如使用者之指示,而變化控制接合工具4所進行之超音波振動接合處理的條件(振動數、振幅、加壓力)。
另一方面,有必要依照玻璃基板11的材質及厚度、太陽電池薄膜11g的材質及厚度、以及超音波振動接合處理的條件,來使按壓機構20及30之對於玻璃基板11的按壓力變化。因此,控制部15係依照來自使用者之指示,而變化控制透過致動缸21及31之按壓機構20及30所施加的按壓力F22及F32。具體而言,可在各資訊(玻璃基板11本身及構成太陽電池薄膜11g之各膜的材質及厚度、以及超音波振動接合處理的條件等)輸入至控制部15之情況,根據從預先設定的資訊表(table)及上述各資訊決定出的按壓力,來控制按壓機構20及30的按壓力F22及F32。其中,該資訊表中定義有與上述各資訊一對一對應之按壓力。
如上述,透過控制部15之控制來驅動按壓機構20及30的致動缸21及31,可在超音波振動處理執
行時及執行後,分別依照超音波振動接合處理的條件而適當地控制按壓滾輪23及33的按壓力F22及F32。
如此,透過控制部15之控制,將按壓機構20及30的按壓力F22及F32及接合工具4所做的超音波振動接合處理的條件等控制成可變化。因此,可依照玻璃基板11及太陽電池薄膜11g的厚度及材質等,來適當地變更按壓機構20及30的按壓力F22及F32、驅動部16的驅動內容、以及接合工具4(致動缸1、超音波振動子17)所做的超音波振動接合處理的條件。
結果,本實施形態之超音波振動接合裝置100就可將按壓力F22及F32、驅動部16的驅動內容及超音波振動接合處理的條件適切地變更,俾以在不對玻璃基板11(包含太陽電池薄膜11g)造成影響,且確實消除引線12發生上述的引線浮起之可能性的情況下將引線12接合到玻璃基板11上。
而且,上述效果可藉由以控制部15控制至少按壓機構20及30的按壓力F22及F32而得到。
上述的實施形態雖然揭示的是以玻璃基板11來作為要形成引線12之基板,但亦可利用陶瓷(ceramic)、聚矽氧(silicon)、環氧樹脂(epoxy)等之薄厚度的構件來構成基板,以取代玻璃基板11。以及,雖然揭示的是以鋁來作為具有導電性之引線12的構成材料,但亦可採用其他的具有導電
性的材料來作為構成材料。
又,所揭示的超音波振動接合裝置100雖然是將接合工具4及按壓機構20及30構成為一體之構成,但亦可使接合工具4與按壓機構20及30相分離而構成超音波振動接合裝置。在此情況,接合工具4與按壓機構20及30可相互獨立而進行移動處理。另外,雖然揭示的是以電動致動缸來作為致動缸1,21及31,但不限於此。
本發明已詳細說明如上,但上述的說明在各個態樣都只是例示,本發明並不限定於此。未例示的無數的變形例都可在未脫離本發明主旨的範圍內輕易思及。
1、21、31‧‧‧致動缸
4‧‧‧接合工具
6‧‧‧振動焊頭部
12‧‧‧引線
20、30‧‧‧按壓機構
22、32‧‧‧按壓構件
23、33‧‧‧按壓滾輪
25、35‧‧‧接合板
100‧‧‧超音波振動接合裝置
12p‧‧‧超音波接合點
22j、32j‧‧‧旋轉軸
DR100‧‧‧操作方向
F1‧‧‧驅動力(按壓力)
F22、F32‧‧‧按壓力
UV‧‧‧超音波振動
Claims (1)
- 一種超音波振動接合裝置,具備有:基板台(10),係用來載置基板(11);接合工具(4),係在將具有導電性的引線(12)配置在前述基板上之狀態下,執行一邊向前述基板台側施加預定的壓力,一邊從抵接前端部(4t)施加超音波振動至前述引線上的施加部(12p)之超音波振動處理;第一及第二按壓機構(20,30),係具有可做旋轉動作的第一及第二按壓滾輪(23,33);以及控制部(15),係控制前述第一及第二按壓機構;其中,前述第一及第二按壓機構係組構成:在前述接合工具執行前述超音波振動處理時,執行利用前述第一及第二按壓滾輪按壓前述引線上的前述施加部的兩側之按壓處理,在前述接合工具未執行前述超音波振動處理時,執行使前述第一及第二按壓滾輪之旋轉動作執行而一邊按壓前述引線一邊在前述引線上移動之移動處理,前述控制部係將前述第一及第二按壓滾輪的按壓力控制成可變化。
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WO2017056175A1 (ja) | 2017-04-06 |
CN108140584B (zh) | 2021-06-01 |
KR102100067B1 (ko) | 2020-04-10 |
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CN108140584A (zh) | 2018-06-08 |
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