TWI613947B

TWI613947B - Pre-drilling wet plating metal clad laminate amd method for manufacturing the same

Info

Publication number: TWI613947B
Application number: TW104111388A
Authority: TW
Inventors: 陳宗儀; 濱澤晃久; 陳文欽; 邱建峰; 范士誠
Original assignee: 柏彌蘭金屬化研究股份有限公司; 達邁科技股份有限公司; 荒川化學工業股份有限公司
Priority date: 2015-04-09
Filing date: 2015-04-09
Publication date: 2018-02-01
Also published as: TW201637539A

Abstract

A pre-drilled wet-plated metal substrate and a method of manufacturing the same, comprising: providing a polyimide film; performing a plurality of pre-drilling operations on the polyimide film to form the polyimide film a plurality of through holes; the polyimine film is subjected to surface cleaning treatment; the polyimine film is chemically deposited to form a first metal layer on the surface and the plurality of through holes; and the poly The ruthenium imide film is deposited by electroplating to form a second metal layer over the first metal layer.

Description

預鑽孔之濕式電鍍金屬基板及其製造方法 Pre-drilled wet-plated metal substrate and method of manufacturing same

本發明係有關於一種預鑽孔之濕式電鍍金屬基板及其製造方法，特別係指一種FCCL在金屬化作業前先在預定位置鑽孔，再進行金屬化作業，可有效達到降低生產成本及達到細線、微孔及高密度的需求。 The invention relates to a pre-drilled wet-plated metal substrate and a manufacturing method thereof, in particular to a FCCL which is drilled at a predetermined position before metallization work, and then metallized, which can effectively reduce production cost and Achieve the need for fine lines, micropores and high density.

可撓性銅箔積層板(Flexible copper clad laminate,FCCL)係廣泛應用於電子產業中作為電路基板(PCB)，FCCL除了具有輕、薄及可撓的優點外，用聚醯亞胺膜還具有電性能、熱性能及耐熱性優良的特點外，其較低的介電常數(Dk)性，使得電信號得到快速的傳遞，良好的熱性能，可使組件易於降溫，較高的玻璃化溫度(Tg)，可使組件在較高的溫度下良好運行。 Flexible copper clad laminate (FCCL) is widely used in the electronics industry as a circuit board (PCB). In addition to its advantages of lightness, thinness and flexibility, FCCL also has a polyimide film. In addition to the excellent electrical properties, thermal properties and heat resistance, its low dielectric constant (Dk) makes the electrical signal transfer quickly, good thermal performance, easy to cool components, high glass transition temperature (Tg) allows the assembly to operate well at higher temperatures.

撓性銅箔基材要分為二大類，一為傳統接著劑型三層軟板基材(3FCCL)，另一種為新型無接著劑二層軟板基材(2FCCL)兩大類，此兩類基材材料，其製造方法不同，其應用產品項目也不同，三層軟板基材一般應用於大宗軟板產品上，二層軟板基材具有輕薄短小之優勢，可應用於較高階軟板製造上。就現有二層軟板基材的製造方法而言，可分為塗佈型(Casting Type)、壓合型(Lamination)、濺鍍型及溼式鍍法型四種，其係皆在一介電材料上形成金屬層，以完成可撓性金屬基板的製作，該等製造方法皆為習知技術，於此不加贅述。 Flexible copper foil substrates are divided into two categories, one is the traditional adhesive type three-layer soft board substrate (3FCCL), and the other is the new type of non-adhesive two-layer soft board substrate (2FCCL). Material materials, their manufacturing methods are different, their application products are also different, three-layer soft board substrate is generally applied to bulk soft board products, and the second-layer soft board substrate has the advantages of lightness, thinness and shortness, and can be applied to higher-order soft board manufacturing. on. As for the manufacturing method of the existing two-layer soft board substrate, it can be classified into four types: a coating type (Casting Type), a press type (Lamination), a sputtering type, and a wet plating type. A metal layer is formed on a dielectric material to complete the fabrication of the flexible metal substrate, and the manufacturing methods are all conventional techniques, and are not described herein.

而現有可撓性電路板的製造方式，係先將前述撓性銅箔基板進行鑽孔，如第一圖及第二圖所示，係在一具有銅層10的基板12上先進行鑽孔作業，使基板12上形成複數個貫孔14，再於貫孔14內形成導電介質16(如傳統化銅、電鍍銅及傳統導電石墨等金屬化微孔，以形成導電介質16)，最後再將撓性金屬基板12上進行電鍍二次銅18，使銅層10上方及貫孔14內形成二次銅18，而得以使基板12上、下電路導通，此種習知可撓性電路板之製造上較為繁瑣，且成本較高，且於基板12之銅10上再形成二次銅18，將造成電路板的厚度增加，不利於細線及高密度之需求，而貫孔14內之傳統導電介層16製作方式(如傳統化銅、電鍍銅及傳統導電石墨等金屬化微孔)，其厚度較大，亦不利於微孔化之需求。 In the conventional flexible circuit board, the flexible copper foil substrate is drilled first, and as shown in the first and second figures, the substrate 12 having the copper layer 10 is first drilled. The operation is such that a plurality of through holes 14 are formed on the substrate 12, and a conductive medium 16 (such as a metallized micro hole such as a conventional copper, an electroplated copper or a conventional conductive graphite to form a conductive medium 16) is formed in the through hole 14, and finally, The secondary copper 18 is plated on the flexible metal substrate 12 to form a secondary copper 18 above the copper layer 10 and in the through hole 14, so that the upper and lower circuits of the substrate 12 are turned on. Such a conventional flexible circuit board The manufacturing is cumbersome and costly, and the secondary copper 18 is formed on the copper 10 of the substrate 12, which will increase the thickness of the circuit board, which is not conducive to the demand for thin wires and high density, and the tradition in the through hole 14 The way in which the conductive via 16 is fabricated (such as conventionalized copper, electroplated copper, and metallized micropores such as conventional conductive graphite) has a large thickness and is also disadvantageous for microporation.

為解決上述習知可撓性電路板及製作之缺點，發明人遂發明出本發明。 The inventors have invented the present invention in order to solve the above disadvantages of the conventional flexible circuit board and its fabrication.

本發明為一種預鑽孔之濕式電鍍金屬基板之製造方法，其包括有提供一聚醯亞胺膜；於該聚醯亞胺膜上進行鑽孔作業，使其形成複數個貫孔；將該聚醯亞胺膜表面清潔處理，該表面清潔處理包括有乾式處理及濕式處理；將清潔後之聚醯亞胺膜進行化學沉積，使其表面及貫孔壁上形成有一第一金屬層；及將該聚醯亞胺膜進行電鍍沉積，使該第一金屬層上形成一第二金屬層。 The invention relates to a method for manufacturing a pre-drilled wet-plated metal substrate, which comprises providing a polyimide film; performing a drilling operation on the polyimide film to form a plurality of through holes; The surface of the polyimide film is cleaned by a dry treatment and a wet treatment; the cleaned polyimide film is chemically deposited to form a first metal layer on the surface and the through-hole wall. And depositing the polyimide film to form a second metal layer on the first metal layer.

本發明為一種預鑽孔之濕式電鍍金屬積基板，其包括有一聚醯亞胺膜；該聚醯亞胺膜上形成複數個貫孔；一第一金屬層形成於聚醯亞胺膜表面及貫孔壁上，一第二金屬層形成於該第一金屬層上。 The present invention is a pre-drilled wet-plated metallized substrate comprising a poly a bismuth imine film; forming a plurality of through holes on the polyimide film; a first metal layer is formed on the surface of the polyimide film and the wall of the through hole, and a second metal layer is formed on the first metal layer .

10‧‧‧銅層 10‧‧‧ copper layer

12‧‧‧基板 12‧‧‧Substrate

14‧‧‧貫孔 14‧‧‧through holes

16‧‧‧導電介質 16‧‧‧Electrical medium

18‧‧‧二次銅 18‧‧‧Second copper

20‧‧‧聚醯亞胺膜 20‧‧‧ Polyimine film

22‧‧‧貫孔 22‧‧‧through holes

24‧‧‧第一金屬層 24‧‧‧First metal layer

26‧‧‧第二金屬層 26‧‧‧Second metal layer

第1圖為習知撓性電路基板之剖視圖。 Fig. 1 is a cross-sectional view showing a conventional flexible circuit board.

第2圖為第一圖鑽孔之剖視圖。 Figure 2 is a cross-sectional view of the first figure drilled.

第3圖本發明之製造流程圖。 Figure 3 is a manufacturing flow diagram of the present invention.

第4圖為本發明聚醯亞胺膜之剖視圖。 Figure 4 is a cross-sectional view of the polyimide film of the present invention.

第5圖為本發明聚醯亞胺膜預鑽孔之剖視圖。 Figure 5 is a cross-sectional view showing the pre-drilled film of the polyimide film of the present invention.

第6圖為第5圖形成第一金屬層之剖視圖。 Fig. 6 is a cross-sectional view showing the first metal layer in Fig. 5.

第7圖為第6圖形成第二金屬層之剖視圖。 Fig. 7 is a cross-sectional view showing the second metal layer in Fig. 6.

第8圖為本發明預鑽孔後未清洗而直鍍化之示意圖。 Figure 8 is a schematic view showing the direct plating of the invention after pre-drilling without cleaning.

第9圖為本發明預鑽孔後經清洗而鍍化之示意圖。 Figure 9 is a schematic view showing the plating of the present invention after cleaning and pre-drilling.

本發明預鑽孔之濕式電鍍金屬基板之製造方法，請參閱第3圖及第4圖所示，其包括有提供一聚醯亞胺膜20(Polyimide film)(S1)，本實施例中其單體成份及備製方法並未特別限制，可藉由本技術領域之通常技術進行，其厚度可為7-50微米(μm)。 The method for manufacturing the pre-drilled wet-plated metal substrate of the present invention, as shown in FIG. 3 and FIG. 4, includes providing a polyimide film 20 (S1), in this embodiment. The monomer composition and preparation method thereof are not particularly limited, and may be carried out by a usual technique in the art, and may have a thickness of 7 to 50 μm.

請配合參閱第3圖示，提供一聚醯亞胺膜10(S1)，在聚醯亞胺膜(Polyimide film)10上先行預鑽孔作業(S2)，使聚醯亞胺膜20表面形成複數個貫孔22。 Referring to FIG. 3, a polyimine film 10 (S1) is provided, and a pre-drilling operation (S2) is performed on a Polyimide film 10 to form a surface of the polyimide film 20. A plurality of through holes 22.

將完成預鑽孔的聚醯亞胺膜20進行一黏層作業(S3)，再進行一表面清潔處理，以去除聚醯亞胺膜20上之雜質/污垢，其中，該表面清潔處理包括先進行一乾式處理(S4)，再進行一濕式處理(S5)，該乾式處理可為電暈(corona)、或電漿(plasma)或紫外光照射(UV irradiation)等物理性高能量處理方式，此不但可清潔膜面，亦可具有不同程度表改質，以增加膜面之附著力，而電暈方式更可活化膜面之親水性，有利於後續濕式處理。該濕式處理為化學藥液清洗，其更包括有一超因波震盪，可促進化學藥液對膜面污垢的處理效率。 The pre-drilled polyimide film 20 is subjected to a bonding operation (S3), and a surface cleaning treatment is performed to remove impurities/dirt on the polyimide film 20, wherein the surface is cleaned. The treatment includes performing a dry treatment (S4) and then performing a wet treatment (S5), which may be a physical high such as corona, plasma or ultraviolet irradiation. The energy treatment method not only can clean the membrane surface, but also has different degrees of table modification to increase the adhesion of the membrane surface, and the corona method can activate the hydrophilicity of the membrane surface, which is beneficial to the subsequent wet treatment. The wet treatment is a chemical liquid cleaning, which further includes a super-wave shock, which can promote the treatment efficiency of the chemical liquid on the membrane surface.

將完成清潔處理的聚醯亞胺膜20以化學電鍍法製程，使其表面及貫孔22壁面形成一第一金屬層24(S6)，本實施例中第一金屬層24為鎳金屬，其厚度可為0.05-0.2微米。 The polyimine film 20 which has been subjected to the cleaning treatment is subjected to an electroless plating process to form a first metal layer 24 (S6) on the surface and the wall surface of the through hole 22. In this embodiment, the first metal layer 24 is made of nickel metal. The thickness can be from 0.05 to 0.2 microns.

將完成第一金屬層24之聚醯亞胺膜20進行一熱處理(S7)，藉由該熱處理，可改善習知金屬層與聚醯亞胺膜間的接著力問題(即兩者間的剝離強度之高溫信賴性不足)。經由該熱處理，可於維持金屬層與聚醯亞胺膜之剝離強度的同時，提高銅層電鍍之良率，並改善銅層電鍍之操作性。 The polyimine film 20 of the first metal layer 24 is subjected to a heat treatment (S7), and the heat treatment can improve the adhesion force between the conventional metal layer and the polyimide film (ie, peeling between the two) The high temperature reliability of the strength is insufficient). Through the heat treatment, the peeling strength of the metal layer and the polyimide film can be maintained, the yield of the copper layer plating can be improved, and the handleability of the copper layer plating can be improved.

請參閱第6圖所示，將完成熱處理後之聚醯亞胺膜20進行電鍍第二金屬層26製程，使第一金屬層24上方形成一第二金屬層26(S8)。 Referring to FIG. 6, the polyimide film 20 after the heat treatment is subjected to a process of plating the second metal layer 26 to form a second metal layer 26 over the first metal layer 24 (S8).

再者，本發明將聚醯亞胺膜20在金屬化前先行預鑽孔，再於清潔處理後，以濕式電鍍形成金屬層，可改善第一圖所示習知撓性電路板之製程複雜度，且可達到細線、微孔及高密度之產品需求。 Furthermore, in the present invention, the polyimine film 20 is pre-drilled prior to metallization, and after the cleaning process, the metal layer is formed by wet plating, which can improve the process of the conventional flexible circuit board shown in the first figure. Complexity, and can meet the needs of fine lines, micropores and high density products.

本發明預鑽孔之濕式電鍍金屬基板，請參閱第7圖所示，其包括有一聚醯亞胺膜20，其上形成有複數個貫孔22；於聚醯亞胺膜20上設有一第一金屬層24位於其表面及貫孔22壁面上，其可為鎳金屬，厚度可為0.05-0.2微米及一第二金屬層26設於第一金屬層24上，第二金屬層26為銅，其厚度為0.2-12微米。 The pre-drilled wet-plated metal substrate of the present invention, as shown in FIG. 7, includes a polyimide film 20 having a plurality of through holes 22 formed therein; and a polyimine film 20 is provided thereon. The first metal layer 24 is located on the surface thereof and the wall surface of the through hole 22, which may be nickel metal and has a thickness A second metal layer 26 is provided on the first metal layer 24, and the second metal layer 26 is copper having a thickness of 0.2 to 12 μm.

請參閱第8圖，本發明預鑽孔後未清洗而直接鍍化而有漏度之情形，請參閱第9圖，本發明預鑽孔後經清洗而直接鍍化無漏鍍之情形。 Please refer to FIG. 8 , the present invention is not directly cleaned after pre-drilling and is directly plated with leakage. Referring to FIG. 9 , the present invention is pre-drilled and then directly plated without leakage plating after cleaning.

如下表格顯示，經電暈處理可提昇化鎳作業之品質。 The table below shows that corona treatment improves the quality of nickel work.

20‧‧‧聚醯亞胺膜 20‧‧‧ Polyimine film

22‧‧‧貫孔 22‧‧‧through holes

24‧‧‧第一金屬層 24‧‧‧First metal layer

26‧‧‧第二金屬層 26‧‧‧Second metal layer

Claims

一種預鑽孔之濕式電鍍金屬基板製造方法，其包括下列步驟：提供一聚醯亞胺膜；於該聚醯亞胺膜上進行複數個預鑽孔作業，使該聚醯亞安膜形成複數個貫孔；將該聚醯亞胺膜進行表面清潔處理，該表面清潔處理包括乾式處理及濕式處理；將該聚醯亞胺膜進行化學法沉積，使其表面及複數個貫孔壁上形成一第一金屬層，該第一金屬層為一厚度為0.05-0.2微米之鎳金屬；及將該聚醯亞胺膜進行電鍍法沉積，使該第一金屬層上方形成一第二金屬層，該第二金屬層為一厚度為0.2-12微米之銅金屬。 A pre-drilled wet-plated metal substrate manufacturing method, comprising the steps of: providing a polyimide film; performing a plurality of pre-drilling operations on the polyimide film to form the polyimide film a plurality of through holes; the polyimine film is subjected to surface cleaning treatment, the surface cleaning treatment comprises dry treatment and wet treatment; and the polyimide film is chemically deposited to have a surface and a plurality of through-hole walls Forming a first metal layer, the first metal layer is a nickel metal having a thickness of 0.05-0.2 micrometer; and depositing the polyimine film by electroplating to form a second metal over the first metal layer The second metal layer is a copper metal having a thickness of 0.2 to 12 microns.

如申請專利範圍第1項所述之方法，其中，該表面清潔處理包括先進行乾式處理後再進行濕式處理。 The method of claim 1, wherein the surface cleaning treatment comprises performing a dry treatment followed by a wet treatment.

如申請專利範圍第1所述之方法，其中，該乾式處理可為電暈(corona)、或電漿(plasma)或紫外光照射(UV irradiation)等物理性高能量處理方式。 The method of claim 1, wherein the dry treatment is a physical high energy treatment such as corona, or plasma or UV irradiation.

如申請專利範圍第1項所述之方法，其中，該表面清潔處理前可進行一黏層作業。 The method of claim 1, wherein the surface cleaning process can perform a bonding operation.

如申請專利範圍第1述之方法，其中，該濕式處理為化學藥液清洗，其更包括有一超音波震盪處理。 The method of claim 1, wherein the wet treatment is a chemical liquid cleaning, and further comprises an ultrasonic vibration treatment.

一種預鑽孔之濕式電鍍金屬基板，其包括有：一聚醯亞胺膜；該聚醯亞胺膜上形成複數個貫孔；以化學鍍鎳沉積一鎳金屬層於該聚醯亞胺膜表面及貫孔壁上；及以電鍍銅法沉積一銅金屬層於該鎳金屬層上，使該聚醯亞胺膜之表面及貫孔壁形成一鎳金屬層及一銅金屬層。 A pre-drilled wet-plated metal substrate comprising: a polyimine film; forming a plurality of through holes on the polyimide film; Depositing a nickel metal layer on the surface of the polyimide film and the pore wall by electroless nickel plating; and depositing a copper metal layer on the nickel metal layer by electroplating copper to make the surface of the polyimide film The through hole wall forms a nickel metal layer and a copper metal layer.

如申請專利範圍第6項所述之濕式電鍍金屬基板，其中該鎳金屬層厚度為0.05-0.2微米，該銅金屬層厚度為0.2-12微米。 The wet-plated metal substrate according to claim 6, wherein the nickel metal layer has a thickness of 0.05 to 0.2 μm and the copper metal layer has a thickness of 0.2 to 12 μm.