TWI613188B - Water-soluble cutting fluid for fixed honing granule saw, cutting method using the same, and substrate for electronic material obtained therefrom - Google Patents
Water-soluble cutting fluid for fixed honing granule saw, cutting method using the same, and substrate for electronic material obtained therefrom Download PDFInfo
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- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
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- B28—WORKING CEMENT, CLAY, OR STONE
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- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
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- C10M2207/10—Carboxylix acids; Neutral salts thereof
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- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
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- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
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- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/06—Oiliness; Film-strength; Anti-wear; Resistance to extreme pressure
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- C10N2040/32—Wires, ropes or cables lubricants
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Abstract
本發明提供一種起泡少、切削性能高之固定研磨粒線鋸用水溶性切削液、使用其之鑄錠的切削方法及由其所得之電子材料用基板。 The invention provides a water-soluble cutting fluid for a fixed abrasive grain wire saw with less foaming and high cutting performance, a cutting method for an ingot using the same, and an electronic material substrate obtained therefrom.
一種固定研磨粒線鋸用水溶性切削液,其含有化學式(1)表示之(a)2,4,7,9-四甲基-5-癸炔-4,7-二醇(2,4,7,9-tetramethyl-5-decyne-4,7-diol)之伸烷基(alkylene)加成物。又,一種鑄錠之切削方法及由該切削方法所得之電子材料用基板,該鑄錠之切削方法,係使用上述固定研磨粒線鋸用水溶性切削液,藉由固定研磨粒線鋸切削鑄錠而獲得作為電子材料基板之晶圓。 A water-soluble cutting fluid for a fixed abrasive grain wire saw, which contains (a) 2,4,7,9-tetramethyl-5-decyne-4,7-diol (2,4, 7,9-tetramethyl-5-decyne-4,7-diol) alkylene adduct. A cutting method of an ingot and a substrate for an electronic material obtained by the cutting method. The ingot cutting method uses the above-mentioned water-soluble cutting fluid for a fixed abrasive wire saw, and the ingot is cut by the fixed abrasive wire saw. A wafer as an electronic material substrate is obtained.
Description
本發明係關於一種用以切削矽鑄錠之固定研磨粒線鋸用水溶性切削液、使用其之鑄錠的切削方法及由其所得之電子材料用基板。 The present invention relates to a water-soluble cutting fluid for a fixed abrasive grain wire saw for cutting a silicon ingot, a cutting method for the ingot using the same, and an electronic material substrate obtained therefrom.
先前以來,電子材料用基板之晶圓係藉由使用有游離研磨粒之利用帶鋸(band saw)或線鋸之切削而獲得。然而,使用有游離研磨粒之切削存在如下問題:漿料附著於經切削之晶圓,後續步驟中之洗淨負荷高,又,不易自使用液將游離研磨粒、沈澱物(sludge)、切削液分離,再利用性差。 Previously, wafers of substrates for electronic materials were obtained by cutting with a band saw or a wire saw using free abrasive particles. However, cutting with free abrasive particles has the following problems: the slurry adheres to the cut wafer, the cleaning load in the subsequent steps is high, and it is not easy to use the liquid to free abrasive particles, sludge, and cutting Liquid separation and poor reusability.
針對該等問題,開發出利用電鍍或樹脂黏合劑將研磨粒固定於線上之固定研磨粒線鋸,具有簡化洗淨步驟、或藉由將切削液與沈澱物分離而提高再利用性之優點。作為使用該固定研磨粒線鋸切削為電子材料用基板之晶圓時所使用之切削液,提出了水或例如專利文獻1及2中之水溶性切削液。 In response to these problems, the development of fixed abrasive wire saws that use electroplating or resin adhesives to fix abrasive particles on the wire has the advantages of simplifying the cleaning step or improving the recyclability by separating the cutting fluid from the sediment. As a cutting fluid used when cutting a wafer that is a substrate for an electronic material using the fixed abrasive wire saw, water or a water-soluble cutting fluid such as those described in Patent Documents 1 and 2 has been proposed.
專利文獻1:日本特開2003-82334號公報 Patent Document 1: Japanese Patent Application Laid-Open No. 2003-82334
專利文獻2:日本特開2009-57423號公報 Patent Document 2: Japanese Patent Application Laid-Open No. 2009-57423
然而,近年來,為了提高品質方面及切削速度,而使線速度逐步加快,存在如下問題:若使用如專利文獻1及2所揭示之水溶性切削液切削成為電子材料用基板之鑄錠,則所使用之水溶性切削液會起泡,而無法獲得品質良好之晶圓。 However, in recent years, in order to improve the quality and cutting speed, the linear speed has been gradually increased, and there is a problem that if a water-soluble cutting fluid as disclosed in Patent Documents 1 and 2 is used to cut an ingot that is a substrate for electronic materials, The water-soluble cutting fluid used will foam, and a good quality wafer cannot be obtained.
因此,本發明提供一種起泡少、切削性能高之固定研磨粒線鋸用水溶性切削液、使用其之鑄錠的切削方法及由其所得之電子材料用基板。 Therefore, the present invention provides a water-soluble cutting fluid for a fixed abrasive grain wire saw with low foaming and high cutting performance, a cutting method using the ingot, and a substrate for an electronic material obtained therefrom.
為了達成以上目的,本發明人等努力進行反覆研究,結果發現藉由使用含有(a)2,4,7,9-四甲基-5-癸炔-4,7-二醇(2,4,7,9-tetramethyl-5-decyne-4,7-diol)之伸烷基(alkylene)加成物之水溶性切削液,即便在用於固定研磨粒線鋸時,亦可進行起泡少、切削性能高之切削,從而完成本發明。即,本發明係關於一種固定研磨粒線鋸用水溶性切削液,其特徵在於:含有下述化學式(1)表示之(a)2,4,7,9-四甲基-5-癸炔-4,7-二醇之伸烷基加成物。 In order to achieve the above object, the present inventors have made repeated efforts, and as a result, found that by using (a) 2,4,7,9-tetramethyl-5-decyne-4,7-diol (2,4 , 7,9-tetramethyl-5-decyne-4,7-diol), a water-soluble cutting fluid of alkylene adducts, can be used to reduce foaming even when used to fix abrasive wire saws And cutting with high cutting performance, thereby completing the present invention. That is, the present invention relates to a water-soluble cutting fluid for a fixed abrasive wire saw, which is characterized by containing (a) 2,4,7,9-tetramethyl-5-decyne- Alkyl adduct of 4,7-diol.
(其中,R表示分別相同或不同之碳數1~4之伸烷基,m1+m2+n1+n2表示伸烷基加成物之總加成莫耳數,為1以上之整數) (Where R represents the same or different carbon number of 1 to 4 alkylene groups, and m1 + m2 + n1 + n2 represents the total number of moles of alkylene adducts, which is an integer of 1 or more)
又,本發明係關於一種鑄錠之切削方法、及由該切削方法所得之電子材料用基板,該鑄錠之切削方法之特徵在於:使用上述固定研磨粒線鋸用水溶性切削液,藉由固定研磨粒線鋸切削鑄錠而獲得作為電子材料用基板之晶圓。 The present invention relates to a method for cutting an ingot and a substrate for an electronic material obtained by the method. The method for cutting an ingot is characterized in that the above-mentioned water-soluble cutting fluid for a fixed abrasive grain wire saw is used and fixed by The abrasive grain saw cuts the ingot to obtain a wafer as a substrate for electronic materials.
如上所述,根據本發明,可提供一種起泡少、切削性能高之固定研磨粒線鋸用水溶性切削液、使用其之鑄錠的切削方法及由其所得之電子材料用基板。 As described above, according to the present invention, it is possible to provide a water-soluble cutting fluid for a fixed abrasive grain wire saw with low foaming and high cutting performance, a cutting method using the ingot, and a substrate for an electronic material obtained therefrom.
本發明之固定研磨粒線鋸用水溶性切削液中使用之(a)成 分即2,4,7,9-四甲基-5-癸炔-4,7-二醇之伸烷基加成物具有下述化學式(1)表示之結構。 The component (a) used in the water-soluble cutting fluid for a fixed abrasive grain wire saw of the present invention The fraction is an alkylene adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol having a structure represented by the following chemical formula (1).
(其中,R表示分別相同或不同之碳數1~4之伸烷基,m1+m2+n1+n2表示伸烷基加成物之總加成莫耳數,為1以上之整數) (Where R represents the same or different carbon number of 1 to 4 alkylene groups, and m1 + m2 + n1 + n2 represents the total number of moles of alkylene adducts, which is an integer of 1 or more)
於上述化學式(1)中,作為加成於2,4,7,9-四甲基-5-癸炔-4,7-二醇上之環氧烷,只要為碳數1~4之環氧烷即可,具體而言,尤佳為環氧乙烷單體、或環氧乙烷及環氧丙烷兩者。 In the above chemical formula (1), as the alkylene oxide added to 2,4,7,9-tetramethyl-5-decyne-4,7-diol, as long as it is a ring having 1 to 4 carbon atoms The oxyalkylene is sufficient, and specifically, an ethylene oxide monomer, or both ethylene oxide and propylene oxide are particularly preferable.
又,所加成之環氧烷係以無規聚合加成,因此若上述化學式(1)之4個伸烷基(-OR-)均為碳數1~4之伸烷基,則可相同或不同,較佳為4個伸烷基為乙烯單體、或乙烯及丙烯兩者中任一者,尤佳為4個伸烷基均為乙烯。 In addition, the added alkylene oxide is added by random polymerization. Therefore, if the 4 alkylene groups (-OR-) in the above chemical formula (1) are all alkylene groups having 1 to 4 carbon atoms, they may be the same. Or differently, it is preferred that the 4 alkylene groups are either ethylene monomers or both ethylene and propylene, and it is particularly preferred that the 4 alkylene groups are all ethylene.
於上述化學式(1)中,伸烷基加成物之加成莫耳數以總量計為1莫耳以上,較佳為1~20莫耳,更佳為4~12莫耳。尤其是,於所加成之伸烷基加成物為環氧乙烷單體時,較佳為環氧乙烷4~12莫耳,更佳為4~8莫耳, 尤佳為4~6莫耳。又,於所加成之伸烷基加成物為環氧乙烷及環氧丙烷時,較佳為環氧乙烷4~8莫耳及環氧丙烷2~4莫耳。 In the above-mentioned chemical formula (1), the addition mole number of the alkylene adduct is 1 mole or more in total, preferably 1 to 20 moles, and more preferably 4 to 12 moles. In particular, when the added alkylene adduct is an ethylene oxide monomer, the ethylene oxide is preferably 4 to 12 moles, and more preferably 4 to 8 moles. Especially preferred is 4 to 6 moles. When the added alkylene adducts are ethylene oxide and propylene oxide, 4 to 8 moles of ethylene oxide and 2 to 4 moles of propylene oxide are preferred.
(a)成分可單獨使用1種,亦可併用2種以上,作為(a)成分之添加量,相對於水溶性切削液,較佳為0.01~5.0重量%,更佳為0.05~2.0重量%。若(a)之添加量未達0.01重量%,則消泡效果小、水溶性切削液之動態表面張力較高,因此存在水溶性切削液難以進入加工部位而使切削品質惡化之傾向,若超過5.0重量%,則存在水溶性切削液難以獲得如顯示消泡效果之調配平衡之情況。 (a) The component may be used singly or in combination of two or more. The amount of the component (a) is preferably 0.01 to 5.0% by weight, and more preferably 0.05 to 2.0% by weight relative to the water-soluble cutting fluid. . If the amount of (a) is less than 0.01% by weight, the defoaming effect is small and the dynamic surface tension of the water-soluble cutting fluid is high. Therefore, it is difficult for the water-soluble cutting fluid to enter the processing site and deteriorate the cutting quality. 5.0% by weight, there is a case where it is difficult to obtain a formulation balance such as a defoaming effect with a water-soluble cutting fluid.
本發明之固定研磨粒線鋸用水溶性切削液,較佳為除了上述(a)成分,亦含有下述所示之(b)、(c)及(d)成分。藉由含有(b)、(c)及(d)成分,可控制固定研磨粒線與加工物之間之潤滑性,提高固定研磨粒線之工具壽命。 It is preferred that the water-soluble cutting fluid for a fixed abrasive grain wire saw of the present invention contains the components (b), (c), and (d) shown below in addition to the component (a). By containing the components (b), (c), and (d), the lubricity between the fixed abrasive grain line and the workpiece can be controlled, and the tool life of the fixed abrasive grain line can be improved.
於本發明中,(b)成分較佳為羧酸、巰基苯并噻唑、苯并噻唑基硫代乙酸(benzothiazolylthio acetic acid)及苯并噻唑基硫代丙酸(benzothiazolylthio propionic acid)中之至少1種以上。作為羧酸,只要具有1個以上之COOH基即可,例如可列舉:辛酸、己酸、月桂酸、油酸、檸檬酸、順丁烯二酸、反丁烯二酸、己二酸、間苯二甲酸、蘋果酸、酒石酸、十二烷二酸及癸二酸等。(b)成分可單獨使用1種,亦可併用2種以上。 In the present invention, the component (b) is preferably at least one of carboxylic acid, mercaptobenzothiazole, benzothiazolylthio acetic acid, and benzothiazolylthio propionic acid. More than that. The carboxylic acid may have one or more COOH groups, and examples thereof include caprylic acid, caproic acid, lauric acid, oleic acid, citric acid, maleic acid, fumaric acid, adipic acid, and Phthalic acid, malic acid, tartaric acid, dodecanedioic acid and sebacic acid. (b) A component may be used individually by 1 type, and may use 2 or more types together.
又,(c)成分較佳為胺、氫氧化鈉及氫氧化鉀中之至少1種以上,更佳為胺。作為胺,可列舉:單乙醇胺、二乙醇胺、三乙醇胺、單異丙醇胺、二異丙醇胺、三異丙醇胺、二環己基胺、三羥甲基丙烷聚(氧化丙烯)三胺、N,N-雙(2羥基乙基)-N-環己基胺及間二甲苯二胺 (metaxylenediamine)之伸烷基加成物等。(c)成分可單獨使用1種,亦可併用2種以上。 The component (c) is preferably at least one kind of amine, sodium hydroxide, and potassium hydroxide, and more preferably an amine. Examples of the amine include monoethanolamine, diethanolamine, triethanolamine, monoisopropanolamine, diisopropanolamine, triisopropanolamine, dicyclohexylamine, and trimethylolpropane poly (propylene oxide) triamine. , N, N-bis (2hydroxyethyl) -N-cyclohexylamine and m-xylylenediamine (metaxylenediamine) alkylene adducts, etc. (c) A component may be used individually by 1 type, and may use 2 or more types together.
關於(b)成分與(c)成分,若均可溶於水,則可以任意比例含有,較佳為(c)成分為將(b)成分中和之量或為該量以上,較理想的是(b)成分與(c)成分之總和為5重量%以下。 The component (b) and the component (c) may be contained in any ratio as long as they are both soluble in water. It is preferable that the component (c) is an amount that neutralizes the component (b) or more. The total of the component (b) and the component (c) is 5% by weight or less.
又,(d)成分較佳為二醇、聚伸烷基二醇(polyalkylene glycol)、二醇醚、聚伸烷基二醇醚、甘油及甘油之伸烷基加成物中之至少1種以上。二醇只要具有2個OH基即可,例如可列舉:單乙二醇、二乙二醇、三乙二醇、單丙二醇、二丙二醇、三丙二醇及己二醇等,作為聚伸烷基二醇,例如可列舉:聚乙二醇、聚丙二醇、聚氧乙烯聚氧丙烯之共聚物及聚氧乙烯聚氧丁烯之共聚物。作為二醇醚,例如可列舉:二乙二醇單甲醚、二乙二醇單丁醚及二乙二醇單己醚等。作為聚氧伸烷基二醇醚,例如可列舉:聚氧乙烯單甲醚、聚氧丙烯單甲醚及聚氧乙烯聚氧丙烯共聚物之單丁醚。作為甘油之伸烷基加成物,例如可列舉:甘油之乙烯加成物、丙烯加成物及乙烯丙烯共聚合加成物。(d)成分可單獨使用1種,亦可併用2種以上。(d)成分之含量只要可溶於水即可,較佳為70重量%以下。 In addition, the component (d) is preferably at least one of a diol, a polyalkylene glycol, a glycol ether, a polyalkylene glycol ether, glycerol, and an alkylene adduct of glycerol. the above. The diol only needs to have two OH groups, and examples thereof include monoethylene glycol, diethylene glycol, triethylene glycol, monopropylene glycol, dipropylene glycol, tripropylene glycol, and hexanediol. As the polyalkylene dialkylene, Examples of the alcohol include polyethylene glycol, polypropylene glycol, a copolymer of polyoxyethylene polyoxypropylene, and a copolymer of polyoxyethylene polyoxybutylene. Examples of glycol ethers include diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, and diethylene glycol monohexyl ether. Examples of the polyoxyalkylene glycol ether include polyoxyethylene monomethyl ether, polyoxypropylene monomethyl ether, and monobutyl ether of a polyoxyethylene polyoxypropylene copolymer. Examples of the alkylene adducts of glycerol include ethylene adducts of glycerol, propylene adducts, and ethylene propylene copolymerization adducts. (d) A component may be used individually by 1 type, and may use 2 or more types together. The content of the component (d) is only required to be soluble in water, and is preferably 70% by weight or less.
又,本發明之固定研磨粒線鋸用水溶性切削液,亦可視需要添加防銹劑、防腐劑、香料、染料等。 In addition, the water-soluble cutting fluid for the fixed abrasive grain wire saw of the present invention may be added with a rust inhibitor, a preservative, a fragrance, a dye, or the like, as necessary.
使用本發明之固定研磨粒線鋸用水溶性切削液,藉由固定研磨粒線鋸切削鑄錠,藉此可獲得品質良好之電子材料用基板。 By using the water-soluble cutting fluid for a fixed abrasive grain wire saw of the present invention and cutting an ingot by the fixed abrasive grain wire saw, a substrate for electronic materials with good quality can be obtained.
於用於本發明之固定研磨粒線鋸中,成為母線之線可為鐵製或不鏽鋼製,亦可為經鍍銅者、經鍍鉑者。作為固著於線上之研磨粒,可 使用市售之研磨粒,較佳為金剛石、氮化硼。為了將研磨粒固著於線上,較佳為利用鎳等金屬之電鍍或使用樹脂之樹脂接著。 In the fixed abrasive wire saw used in the present invention, the wire used as the bus bar may be made of iron or stainless steel, and may also be copper-plated or platinum-plated. As abrasive particles fixed on the wire, Commercially available abrasive particles are used, preferably diamond and boron nitride. In order to fix the abrasive grains on a wire, it is preferable to use electroplating of a metal such as nickel or resin bonding using a resin.
又,作為用於本發明之切削機,只要為市場上販售之多線鋸加工機,則並無特別限定,較佳為固定研磨粒線鋸專用多線鋸加工機。 The cutting machine used in the present invention is not particularly limited as long as it is a commercially available multi-wire saw processing machine, and it is preferably a multi-wire saw processing machine for fixed abrasive grain wire saws.
又,作為用於本發明之鑄錠,只要為用以製造電子材料用基板之鑄錠,則並無特別限定,例如較佳為使用使矽、藍寶石、水晶、石英、碳化矽、鉭酸鋰、氮化鎵及砷化鎵等結晶成長並高純度化而成之鑄錠。 The ingot used in the present invention is not particularly limited as long as it is an ingot for manufacturing a substrate for electronic materials. For example, silicon, sapphire, crystal, quartz, silicon carbide, and lithium tantalate are preferably used. Ingots made of crystals such as gallium nitride, gallium arsenide, and gallium.
如上所述,於藉由固定研磨粒線鋸自鑄錠切削作為電子材料銅基板之晶圓時,藉由使用本發明之固定研磨粒線鋸用水溶性切削液,可使起泡少,又,可提高切削性能。 As described above, when a wafer as an electronic material copper substrate is cut from an ingot by a fixed abrasive wire saw, by using the water-soluble cutting fluid for a fixed abrasive wire saw of the present invention, foaming can be reduced, and Improves cutting performance.
實施例 Examples
繼而,對本發明之固定研磨粒線鋸用水溶性切削液之實施例進行說明,但本發明並不限定於此。首先,依據表1及表2表示之各成分之調配量,藉由常法將該等混合,藉此獲得實施例1至實施例9之固定研磨粒線鋸用水溶性切削液、以及比較例1至比較例4之固定研磨粒線鋸用水溶性切削液。 Next, an example of the water-soluble cutting fluid for a fixed abrasive grain wire saw of the present invention will be described, but the present invention is not limited to this. First, according to the blending amounts of the components shown in Tables 1 and 2, these are mixed by a conventional method to obtain the water-soluble cutting fluid for fixed abrasive grain wire saws of Examples 1 to 9 and Comparative Example 1 The water-soluble cutting fluid for the fixed abrasive wire saw to Comparative Example 4.
(起泡試驗) (Foaming test)
其次,假定切削中之起泡,將50ml之實施例1至實施例9之固定研磨粒線鋸用水溶性切削液、及比較例1至比較例4之固定研磨粒線鋸用水溶性切削液添加至有栓式100ml量筒中,塞住栓後,劇烈搖晃,確認剛搖晃後之初期起泡量及起泡消失為止之消泡時間。將其結果示於表3。再者,穩定性係於25℃靜置1週而判定,○:於1週無分離、沈澱,△:於4日以 上且未達1週發生分離、沈澱,×:於未達4日發生分離、沈澱。 Next, assuming foaming during cutting, 50 ml of the water-soluble cutting fluid for fixed abrasive wire saws of Examples 1 to 9 and the water-soluble cutting fluid for fixed abrasive wire saws of Comparative Examples 1 to 4 were added to In the 100ml graduated cylinder with a plug, shake it vigorously after plugging the plug, and check the initial foaming amount immediately after shaking and the defoaming time until foaming disappears. The results are shown in Table 3. In addition, the stability was determined by standing at 25 ° C for one week. ○: No separation or precipitation in 1 week, △: In 4 days Separation and precipitation occurred within 1 week, and ×: Separation and precipitation occurred within 4 days.
根據表3可知,比較例2之切削液之穩定性較差,比較例3 及4之切削液之起泡較多,消泡時間亦超過60秒。相對於此,可知本發明之固定研磨粒線鋸用水溶性切削液之起泡較少,較良好。再者,穩定性較差之比較例2中,已分離之(a)成分會附著於裝置、配管內而引起污染,或者因自切削液去除(a)成分而使切削品質惡化,從而難以用作切削液。 According to Table 3, the stability of the cutting fluid of Comparative Example 2 is poor. Comparative Example 3 And 4 of the cutting fluid foamed more, the defoaming time also exceeded 60 seconds. On the other hand, it can be seen that the water-soluble cutting fluid for the fixed abrasive grain wire saw of the present invention has less foaming and is relatively good. Furthermore, in Comparative Example 2 with poor stability, the separated (a) component adheres to the device and piping and causes contamination, or the cutting quality is deteriorated by removing the (a) component from the cutting fluid, making it difficult to use. Cutting fluid.
(切削試驗) (Cutting test)
其次,使用實施例1至實施例9之固定研磨粒線鋸用水溶性切削液、以及比較例1至比較例4之固定研磨粒線鋸用水溶性切削液,於表4之條件進行切削試驗,測定經切削之晶圓之剖面曲線的最底部高度(PV)。將結果示於表5。 Next, using the water-soluble cutting fluid for fixed abrasive wire saws of Examples 1 to 9 and the water-soluble cutting fluid for fixed abrasive wire saws of Comparative Examples 1 to 4, the cutting tests were performed under the conditions shown in Table 4 to determine The bottom-most height (PV) of the profile of the sliced wafer. The results are shown in Table 5.
根據表5可知,比較例1及2之切削液無法切削鑄錠,比較例3及4之切削液的PV值較大,無法形成良好剖面。相對於此,可知本實施例之固定研磨粒線鋸用水溶性切削液之PV值較小,切削性能良好。 It can be seen from Table 5 that the cutting fluids of Comparative Examples 1 and 2 cannot cut ingots, and the cutting fluids of Comparative Examples 3 and 4 have large PV values and cannot form good cross sections. In contrast, it can be seen that the PV value of the water-soluble cutting fluid for the fixed abrasive grain wire saw in this embodiment is small, and the cutting performance is good.
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