TWI608566B - Optical sensor assembly for inspecting knife and apparatus for cutting substrate including the same - Google Patents
Optical sensor assembly for inspecting knife and apparatus for cutting substrate including the same Download PDFInfo
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- TWI608566B TWI608566B TW102130166A TW102130166A TWI608566B TW I608566 B TWI608566 B TW I608566B TW 102130166 A TW102130166 A TW 102130166A TW 102130166 A TW102130166 A TW 102130166A TW I608566 B TWI608566 B TW I608566B
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- 238000005520 cutting process Methods 0.000 title claims description 131
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
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- Engineering & Computer Science (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
本發明關於一種用於檢查刀片的光學感測器組件及包含其之用於切割基板的設備。 The present invention relates to an optical sensor assembly for inspecting a blade and an apparatus therefor for cutting a substrate.
大部分製造顯示裝置、半導體、太陽能電池及類似物的過程都包含切割過程。舉例來說，形成液晶顯示器、場發射顯示器、電漿顯示器、電致發光顯示器及類似物的基底的基板可透過切割母基板以取得。 Most processes for manufacturing display devices, semiconductors, solar cells, and the like include a cutting process. For example, a substrate forming a substrate of a liquid crystal display, a field emission display, a plasma display, an electroluminescence display, and the like can be obtained by cutting a mother substrate.
通常，切割過程以基板放置且固定到切割台上的方式來執行，且使用刀片切割基板。特別是，刀片從基板的上方部分朝著基板下降以分割基板。在此，隨著大量基板的切割被執行，刀片的缺陷，例如刀片的刀鋒斷裂、刀片的磨損及類似情況，可由於基板及刀片或基板上的外來物質之間的硬度差異而發生。 Typically, the cutting process is performed in such a manner that the substrate is placed and fixed to the cutting table, and the substrate is cut using a blade. In particular, the blade descends from the upper portion of the substrate toward the substrate to divide the substrate. Here, as the cutting of a large number of substrates is performed, defects of the blade, such as blade breakage of the blade, abrasion of the blade, and the like, may occur due to a difference in hardness between the substrate and the foreign matter on the blade or the substrate.
若切割過程以具有此類缺陷的刀片持續地執行，基板的劣質，例如裂痕可能發生，而這可導致最終產品品質的嚴重劣化。 If the cutting process is continuously performed with a blade having such defects, inferior quality of the substrate, such as cracks, may occur, which may result in severe deterioration of the quality of the final product.
因此，本發明欲解決的一個標的為提出一種用於切割基板的設備，其可自動地檢查刀片是否具有任何缺陷，且若刀片具有缺陷時發出警告給工作人員或使工作人員修補或移除刀片。 Accordingly, an object of the present invention is to provide an apparatus for cutting a substrate that automatically checks whether the blade has any defects and issues a warning to the worker or causes the worker to repair or remove the blade if the blade has a defect. .
本發明欲解決的另一個標的為提出一種用於檢查刀片的光學感測器組件，其可自動地檢查刀片是否具有任何缺陷，且若刀片具有缺陷時發出警告給工作人員或使工作人員修補或移除刀片。 Another object to be solved by the present invention is to propose an optical sensor assembly for inspecting a blade that automatically checks whether the blade has any defects and issues a warning to the worker or repairs the worker if the blade has a defect or Remove the blade.
本發明之另外的優點、標的及特徵對於技術領域中具有通常知識者來說一部分將在下文描述中記載而一部分將在研究下文或可從本發明的實作中習得而變得顯而易見。 Additional advantages, aspects, and features of the invention will become apparent to those skilled in the art in the <RTIgt;
在本發明的一個態樣中，其提出一種用於切割基板的設備，其包含切割基板之至少一刀片、以及透過照射光線在刀片的刀鋒上檢查刀片是否具有缺陷之至少一光學感測器。 In one aspect of the invention, an apparatus for cutting a substrate is provided that includes at least one blade that cuts the substrate, and at least one optical sensor that inspects the blade for flaws on the blade edge of the blade by the illumination.
在本發明的另一態樣中提出一種用於切割基板的設備，其包含在沿垂直於基板的表面的方向移動時切割基板的至少一刀片、以及設置於刀片之移動路徑的兩側部分以檢查刀片是否具有缺陷之至少一光學感測器。 In another aspect of the present invention, an apparatus for cutting a substrate including at least one blade that cuts a substrate while moving in a direction perpendicular to a surface of the substrate, and both side portions of the moving path of the blade are proposed At least one optical sensor that checks if the blade has a defect.
在本發明的又一實施例中，其提出一種用於檢查刀片的光學感測器組件，其包含以光線照射刀片的刀鋒的光學感測器、以及支撐光學感測器的光學感測器支架。 In yet another embodiment of the present invention, an optical sensor assembly for inspecting a blade is provided that includes an optical sensor that illuminates the blade of the blade with light, and an optical sensor bracket that supports the optical sensor .
根據本發明的實施例，至少下述的效果可被達到。 According to an embodiment of the invention, at least the effects described below can be achieved.
亦即，不論用於切割基板的設備的刀片是否具有任何缺陷都會被自動地檢查，而若刀片具有此類缺陷，則工作人員被警告有缺陷或被引導以修補或移除刀片。 That is, whether or not the blade of the apparatus for cutting the substrate has any defects is automatically checked, and if the blade has such a defect, the worker is warned to be defective or guided to repair or remove the blade.
再者，以刀片切割而形成的基板的切割表面變得一致，且因此產品可以高品質製造。 Furthermore, the cut surface of the substrate formed by cutting the blade becomes uniform, and thus the product can be manufactured with high quality.
根據本發明的效果不限制於上述例示的內容，而更多各種效果將在本發明的說明書中被描述。 The effects according to the present invention are not limited to the above-exemplified contents, and more various effects will be described in the specification of the present invention.
100‧‧‧切割台 100‧‧‧ cutting table
200‧‧‧母基板 200‧‧‧ mother substrate
210‧‧‧基底基板 210‧‧‧Base substrate
230‧‧‧功能層 230‧‧‧ functional layer
250‧‧‧切割線 250‧‧‧ cutting line
300、301、302‧‧‧刀片組件 300, 301, 302‧‧‧ blade components
310、311、312‧‧‧刀片 310, 311, 312‧‧‧ blades
330、331、332‧‧‧刀片支架 330, 331, 332‧‧‧ blade bracket
400、401、402‧‧‧光學感測器組件 400, 401, 402‧‧‧ Optical Sensor Components
410、411、412‧‧‧光學感測器 410, 411, 412‧‧‧ optical sensors
410a、411a、412a‧‧‧光線發射部分 410a, 411a, 412a‧‧‧Light emission section
410b、411b、412b‧‧‧光線接收部分 410b, 411b, 412b‧‧‧ light receiving part
410b-1、411b-1‧‧‧第一光線接收部分 410b-1, 411b-1‧‧‧ first light receiving part
410b-2、411b-2‧‧‧第二光線接收部分 410b-2, 411b-2‧‧‧second light receiving part
430、431、432‧‧‧光學感測器支架 430, 431, 432‧‧‧ optical sensor bracket
430a、431a‧‧‧支架基底 430a, 431a‧‧‧ bracket base
430b、431b‧‧‧凸部 430b, 431b‧‧‧ convex
500、501‧‧‧雷射 500, 501‧ ‧ laser
510、511‧‧‧發射光 510, 511‧‧‧ emitted light
530、531‧‧‧反射光 530, 531‧‧ ‧ reflected light
550、551‧‧‧入射光 550, 551‧‧‧ incident light
d‧‧‧缺陷 D‧‧‧ Defects
p‧‧‧微粒 p‧‧‧Particles
本發明的上述及其他標的、特徵及優點將經由搭配附圖之下述詳細描述而變得顯而易見，其中：第1圖為根據本發明實施例之用於切割基板的設備的透視圖；第2圖為說明其中光學感測器組件掃描刀片之第1圖中用於切割基板的設備的透視圖；第3圖為第1圖用於切割基板的設備中刀片組件及光學感測器組件的前視圖；第4圖為第1圖用於切割基板的設備中刀片組件及光學感測器組件的側視圖；第5圖為說明第4圖的「V」部分的放大圖；第6圖為說明第1圖用於切割基板的設備中包含具損壞的刀鋒的刀片的刀片組件及光學感測器組件的前視圖； 第7圖為說明第1圖用於切割基板的設備中包含具損壞的刀鋒的刀片的刀片組件及光學感測器組件的側視圖；第8圖為說明第1圖用於切割基板的設備中包含磨損的刀片的刀片組件及光學感測器組件的前視圖；第9圖為說明第1圖用於切割基板的設備中包含微粒吸附於其上的刀片的刀片組件及光學感測器組件的前視圖；第10圖為根據本發明另一實施例之用於切割基板的設備的透視圖；第11圖為說明其中光學感測器組件掃描複數個刀片之第1圖用於切割基板的設備的透視圖；第12圖為根據本發明又一實施例之用於切割基板的設備的透視圖；第13圖為第12圖用於切割基板的設備中的刀片組件及光學感測器組件的前視圖；第14圖為第12圖用於切割基板的設備中的刀片組件、光學感測器組件、以及切割台的側面圖；第15圖為說明第14圖的「XV」部分的放大圖；第16圖為根據本發明又一實施例之用於切割基板的設備的透視圖；以及第17圖為第16圖用於切割基板的設備中的刀片組件及光學感測器組件的前視圖。 The above and other objects, features, and advantages of the invention will be apparent from the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a perspective view showing an apparatus for cutting a substrate in FIG. 1 of an optical sensor assembly scanning blade; FIG. 3 is a front view of the blade assembly and the optical sensor assembly in the apparatus for cutting a substrate in FIG. Figure 4 is a side view of the blade assembly and the optical sensor assembly in the apparatus for cutting a substrate in Fig. 1; Fig. 5 is an enlarged view showing a portion "V" of Fig. 4; 1 is a front view of a blade assembly and an optical sensor assembly including a blade having a damaged blade in an apparatus for cutting a substrate; 7 is a side view illustrating a blade assembly and an optical sensor assembly including a blade having a damaged blade in the apparatus for cutting a substrate in FIG. 1; and FIG. 8 is a view illustrating the apparatus for cutting a substrate in FIG. A front view of a blade assembly and an optical sensor assembly including a worn blade; and FIG. 9 is a view showing a blade assembly and an optical sensor assembly including a blade on which a particle is adsorbed in an apparatus for cutting a substrate in FIG. 10 is a perspective view of an apparatus for cutting a substrate according to another embodiment of the present invention; and FIG. 11 is a view for explaining an apparatus for cutting a substrate in which the optical sensor assembly scans a plurality of blades 12 is a perspective view of an apparatus for cutting a substrate according to still another embodiment of the present invention; and FIG. 13 is a blade assembly and an optical sensor assembly of the apparatus for cutting a substrate according to FIG. 14 is a side view of the blade assembly, the optical sensor assembly, and the cutting table in the apparatus for cutting a substrate, and FIG. 15 is an enlarged view showing a portion of the "XV" portion of FIG. ; Figure 16 is based on A further embodiment of the invention is a perspective view of an apparatus for cutting a substrate of the embodiment; and FIG. 17, graph 16, front view of the apparatus for cutting a substrate of the blade assembly and the optical sensor assembly.
本發明的態樣及特徵及達到這些態樣及特徵的方法將藉由參考附圖參照詳細描述的實施例而變得顯而易見。然而，本發明並不限於下文中揭露的實施例，而是可以各種形式實施。於描述中定義的內容，例如詳細架構及元件，僅為特定細節提供以協助技術領域中具有通常知識者對本發明有完整地理解，而本發明僅定義於附加的申請專利範圍的範疇內。 The aspects and features of the present invention, as well as the methods of the present invention, will be apparent by reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed hereinafter, but can be implemented in various forms. The matters defined in the description, such as the detailed description of the embodiments of the invention,
用於表明一元件位於另一元件上或位於不同層上的詞彙「上」包含一元件直接位於其他元件或層上的情況及一元件透過其他層或又另一元件而位於其他元件上的情況。在本發明的全部描述中，相同的圖式參考符號在各種圖式中用於相同的元件。 The word "upper" used to indicate that one element is on the other element or on a different layer includes the case where one element is directly on the other element or layer and the element is placed on the other element through another layer or another element. . Throughout the description of the invention, the same drawing reference numerals are used for the same elements in the various drawings.
雖然「第一」、「第二」等詞彙用於描述不同的組成元件，此類組成元件並不受這些詞彙所限制。這些詞彙僅用於分辨一組成元件與其他組成元件。因此，在下述描述中，第一組成元件可為第二組成元件。 Although the terms "first" and "second" are used to describe different constituent elements, such constituent elements are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, in the following description, the first constituent element may be the second constituent element.
本發明之說明中描述的詞彙「基板」可為半導體基板、顯示基板、薄膜電晶體(TFT,Thin Film Transistor)基板、印刷電路板(PCB,Printed Circuit Board)、或可撓式基板，但並不以此為限。再者，詞彙「基板(substrate)」可不僅為所表示之「基板(substrate)」而是可為「膜(film)」或「薄膜(thin film)」。 The term "substrate" as described in the description of the present invention may be a semiconductor substrate, a display substrate, a thin film transistor (TFT) substrate, a printed circuit board (PCB), or a flexible substrate, but Not limited to this. Furthermore, the term "substrate" may be not only a "substrate" but also a "film" or a "thin film".
再者，在本發明說明中描述的詞彙「用於切割基板的設備」可不僅為單純用於切割基板的設備，而是可為用於使用刀片310處理基板的設備。舉例來說，「用於切割基板的設備」可不僅為用於將母基板200切割成單位基板的設備，而是可為用於暴露單位基板上的墊部分(pad portion)的半切割設備(half-cutting apparatus)，但並不以此為限。 Furthermore, the term "device for cutting a substrate" described in the description of the present invention may be not only a device for cutting a substrate but a device for processing a substrate using the blade 310. For example, the "device for cutting a substrate" may be not only a device for cutting the mother substrate 200 into a unit substrate, but may be a half-cut device for exposing a pad portion on a unit substrate ( Half-cutting apparatus), but not limited to this.
下文中，本發明之較佳實施例將參考附圖而描述。 Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
第1圖為根據本發明實施例之用於切割基板的設備的透視圖。第2圖為說明其中光學感測器組件400掃描刀片310之第1圖用於切割基板的設備的透視圖。第3圖為第1圖用於切割基板的設備中刀片組件300及光學感測器組件400的前視圖，且第4圖為第1圖用於切割基板的設備中刀片組件300及光學感測器組件400的側視圖。第5圖為說明第4圖的「V」部分的放大圖。第6圖為說明第1圖用於切割基板的設備中包含具損壞刀鋒的刀片310的刀片組件300及光學感測器組件400的前視圖。第7圖為說明第1圖用於切割基板的設備中包含具損壞刀鋒的刀片310的刀片組件300及光學感測器組件400的側視圖。第8圖為說明第1圖用於切割基板的設備中包含磨損刀片310的刀片組件300及光學感測器組件400的前視圖。第9圖為說明第1圖用於切割基板的設備中包含微粒p吸附於其上的刀片310的刀片組件300及光學感測器組件400的前視圖。參閱第1圖到第9圖，用於切割基板的設備可包含切割台100、刀片組件300、以及光學感測器組件400。 Fig. 1 is a perspective view of an apparatus for cutting a substrate according to an embodiment of the present invention. 2 is a perspective view illustrating an apparatus in which the optical sensor assembly 400 scans the blade 310 for cutting a substrate. 3 is a front view of the blade assembly 300 and the optical sensor assembly 400 in the apparatus for cutting a substrate in FIG. 1, and FIG. 4 is a blade assembly 300 and optical sensing in the apparatus for cutting a substrate in FIG. Side view of the assembly 400. Fig. 5 is an enlarged view showing a portion "V" of Fig. 4. Fig. 6 is a front elevational view showing the blade assembly 300 and the optical sensor assembly 400 including the blade 310 having a damaged blade in the apparatus for cutting a substrate of Fig. 1. Figure 7 is a side elevational view of the blade assembly 300 and optical sensor assembly 400 including the blade 310 with a damaged blade in the apparatus for cutting a substrate of Figure 1. Figure 8 is a front elevational view of the blade assembly 300 and optical sensor assembly 400 including the wear blade 310 in the apparatus for cutting a substrate of Figure 1. Fig. 9 is a front elevational view showing the blade assembly 300 and the optical sensor assembly 400 including the blade 310 to which the particles p are adsorbed in the apparatus for cutting a substrate in Fig. 1. Referring to FIGS. 1 through 9, the apparatus for cutting a substrate may include a cutting table 100, a blade assembly 300, and an optical sensor assembly 400.
切割台100可支撐基板。在一例示性實施例中，切割台100可包含至少一平坦表面，並可使基板安置於平坦表面上。在第1圖說明的例示性實施例中，切割台100可為立方形板狀形狀，但並不以此為限。切割台100可依據基板的形狀而具有各種形狀。再者，切割台100可以可承受由切割工具施加的外部力量的材質所製造，舉例來說，可以不鏽鋼(SUS,Steel Use Stainless)製造。 The cutting table 100 can support a substrate. In an exemplary embodiment, the cutting table 100 can include at least one flat surface and can position the substrate on a flat surface. In the exemplary embodiment illustrated in FIG. 1, the cutting table 100 may have a cuboid plate shape, but is not limited thereto. The cutting table 100 can have various shapes depending on the shape of the substrate. Further, the cutting table 100 may be made of a material that can withstand the external force applied by the cutting tool, and may be, for example, made of stainless steel (SUS, Steel Use Stainless).
基板可安置於切割台100上。在第1圖說明的例示性實施例中，母基板200安置於切割台100上，但本發明並不以此為限。在此，母基板200可為包含複數個單位基板的基板。在一例示性實施例中，母基板200可為可撓式基板，但並不以此為限。母基板200可為剛性基板(rigid substrate)。 The substrate can be placed on the cutting table 100. In the exemplary embodiment illustrated in FIG. 1, the mother substrate 200 is disposed on the cutting table 100, but the invention is not limited thereto. Here, the mother substrate 200 may be a substrate including a plurality of unit substrates. In an exemplary embodiment, the mother substrate 200 can be a flexible substrate, but is not limited thereto. The mother substrate 200 may be a rigid substrate.
母基板200可包含基底基板210、功能層230、以及切割線250。 The mother substrate 200 may include a base substrate 210, a functional layer 230, and a cutting line 250.
基底基板210可放置在切割台100上以與切割台100接觸。基底基板210可為立方形板狀形狀，但並不以此為限。基底基板210可依據各種應用例子而具有各種形狀。再者，基底基板210可包含絕緣材料如氧化矽(SiOx)、薄膜玻璃、金屬箔、塑膠、或其組合。在此，塑膠可為聚亞醯氨(PI,polyimide)或玻璃纖維強化塑膠。 The base substrate 210 may be placed on the cutting table 100 to be in contact with the cutting table 100. The base substrate 210 may have a cuboid plate shape, but is not limited thereto. The base substrate 210 can have various shapes depending on various application examples. Furthermore, the base substrate 210 may comprise an insulating material such as yttrium oxide (SiOx), thin film glass, metal foil, plastic, or a combination thereof. Here, the plastic may be a polyacrylamide (PI) or a glass fiber reinforced plastic.
複數個功能層230可形成以放置在基底基板210上。在一例示性實施例中，一功能層230可具有多層結構使組成有機發光裝置的組成元件堆疊於其中，並可為薄膜電晶體(TFT)、電極、及有機材料有機地(organically)設置於其中的結構。複數個功能層230可以矩陣形式設置。在第1圖及第2圖中說明的例示性實施例中，複數個功能層230形成3×3的矩陣。然而這僅為例示性，且複數個功能層230可形成n×m的矩陣(其中n與m為大於1的整數)。 A plurality of functional layers 230 may be formed to be placed on the base substrate 210. In an exemplary embodiment, a functional layer 230 may have a multi-layer structure in which constituent elements constituting the organic light-emitting device are stacked, and may be organically disposed on a thin film transistor (TFT), an electrode, and an organic material. The structure of it. A plurality of functional layers 230 may be arranged in a matrix form. In the exemplary embodiment illustrated in Figures 1 and 2, the plurality of functional layers 230 form a 3 x 3 matrix. However, this is merely exemplary, and a plurality of functional layers 230 may form a matrix of n x m (where n and m are integers greater than one).
切割線250可形成於複數個功能層230之間。切割線250可為連接鄰近功能層230的中點的線。切割線250可為虛擬線，但並不以此為限。切割線250可為藉由刻劃所形成的線。 A cutting line 250 can be formed between the plurality of functional layers 230. The cutting line 250 can be a line connecting the midpoint of the adjacent functional layer 230. The cutting line 250 can be a virtual line, but is not limited thereto. The cutting line 250 can be a line formed by scoring.
一個母基板200可在沿著切割線250切割時被分割為複數個單位基板。在第1圖及第2圖中說明的例示性實施例中，若母基板200沿著切割線250被切割，則可被分割成9個單位基板。 A mother substrate 200 can be divided into a plurality of unit substrates as it is cut along the cutting line 250. In the exemplary embodiment described in FIGS. 1 and 2, if the mother substrate 200 is cut along the dicing line 250, it can be divided into nine unit substrates.
刀片組件300可放置在母基板200上。刀片組件300可包含刀片310及刀片支架330。 The blade assembly 300 can be placed on the mother substrate 200. Blade assembly 300 can include blade 310 and blade holder 330.
刀片310可放置於切割台100上以切割設置於刀片310及切割台100之間的母基板200。具體來說，刀片310沿著垂直於母基板200的一個表面的 方向下降以沿著切割線250切割母基板200。刀片310可由具有足夠硬度切割母基板200的材料製造。在一例示性實施例中，刀片310可以鉻、鎳、鐵、或其組合製造。在一較佳實施例中，硬度強度可為母基板200、刀片310、以及切割台100的次序。 The blade 310 can be placed on the cutting table 100 to cut the mother substrate 200 disposed between the blade 310 and the cutting table 100. Specifically, the blade 310 is along a surface perpendicular to one surface of the mother substrate 200. The direction is lowered to cut the mother substrate 200 along the cutting line 250. The blade 310 may be fabricated from a material having sufficient hardness to cut the mother substrate 200. In an exemplary embodiment, the blade 310 can be fabricated from chromium, nickel, iron, or a combination thereof. In a preferred embodiment, the hardness strength can be the order of the mother substrate 200, the blade 310, and the cutting table 100.
刀片可包含刀鋒。刀片310的刀鋒可設置於面對切割台100及母基板200的刀片310的末端部分。刀片310的刀鋒可為刀片310最薄且最銳利的部分。如圖所示，刀片310的刀鋒的剖面可為三角形形狀，但並不以此為限。當刀片310的刀鋒接觸母基板200的切割線250時，母基板200的切割可開始。 The blade can contain a blade. The blade of the blade 310 may be disposed at an end portion of the blade 310 facing the cutting table 100 and the mother substrate 200. The blade 310 can have the blade that is the thinnest and sharpest portion of the blade 310. As shown, the blade edge of the blade 310 may have a triangular shape, but is not limited thereto. When the blade of the blade 310 contacts the cutting line 250 of the mother substrate 200, the cutting of the mother substrate 200 can be started.
刀片310的刀鋒可形成以沿著平行切割台100及/或母基板200之一表面的方向延伸。在第1圖及第2圖說明的例示性實施例中，刀片310的刀鋒係形成以沿著y方向延伸，但並不以此為限。刀片310的刀鋒也可形成以沿著x方向延伸。 The blade edge of the blade 310 may be formed to extend in a direction parallel to one of the surfaces of the cutting table 100 and/or the mother substrate 200. In the exemplary embodiment illustrated in FIGS. 1 and 2, the blade edge of the blade 310 is formed to extend in the y direction, but is not limited thereto. The blade edge of the blade 310 can also be formed to extend in the x direction.
刀片支架330可連接到刀片310面向刀片310的刀鋒的另一末端部分以支撐刀片310。雖然未繪示於圖中，刀片支架330可連接到機器手臂以移動刀片310。在此，刀片支架330可使刀片310向上/向下移動以使刀片310切割母基板200，並可旋轉刀片310以改變母基板200的切割方向。 The blade holder 330 can be coupled to the other end portion of the blade 310 facing the blade 310 to support the blade 310. Although not shown in the figures, the blade holder 330 can be coupled to a robotic arm to move the blade 310. Here, the blade holder 330 may move the blade 310 up/down to cause the blade 310 to cut the mother substrate 200, and may rotate the blade 310 to change the cutting direction of the mother substrate 200.
光學感測器組件400可設置於切割台100及刀片組件300的一側。在一例示性實施例中，光學感測器組件400可在切割過程期間固定地放置在與切割台100及刀片組件300間隔的位置(見第1圖)，且接著在預定數量的切割過程執行之後可移動以鄰近刀片組件300以檢查刀片是否具有缺陷d(見第2圖)。在此，刀片310是否具有缺陷d可由光學感測器組件400沿著刀片310的刀鋒移動時掃描刀片310來檢查。在另一例示性實施例中，光學感測器組件400可固定在與切割 台100及刀片組件300間隔的位置，而在預定數量的切割過程執行之後，刀片組件300可移動以鄰近光學感測器組件400以檢查刀片310是否具有缺陷d。在此，刀片310是否具有缺陷d可在刀片組件300移動使得刀片310的刀鋒通過光學感測器組件400上時來檢查。下文中，要於下文中說明之光學感測器組件400及刀片組件300之間的位置關係變成當光學感測器組件400及刀片組件300彼此鄰近以檢查刀片是否具有缺陷d的位置關係。 The optical sensor assembly 400 can be disposed on one side of the cutting table 100 and the blade assembly 300. In an exemplary embodiment, optical sensor assembly 400 can be fixedly placed at a location spaced from cutting table 100 and blade assembly 300 during the cutting process (see FIG. 1), and then executed during a predetermined number of cutting processes It can then be moved adjacent to the blade assembly 300 to check if the blade has a defect d (see Figure 2). Here, whether the blade 310 has a defect d can be inspected by the scanning blade 310 as the optical sensor assembly 400 moves along the blade edge of the blade 310. In another exemplary embodiment, optical sensor assembly 400 can be fixed and cut The station 100 and the blade assembly 300 are spaced apart, and after a predetermined number of cutting processes are performed, the blade assembly 300 can be moved adjacent to the optical sensor assembly 400 to check whether the blade 310 has a defect d. Here, whether the blade 310 has a defect d can be checked when the blade assembly 300 is moved such that the blade edge of the blade 310 passes over the optical sensor assembly 400. Hereinafter, the positional relationship between the optical sensor assembly 400 and the blade assembly 300 to be described hereinafter becomes a positional relationship when the optical sensor assembly 400 and the blade assembly 300 are adjacent to each other to check whether the blade has the defect d.
光學感測器組件400可包含光學感測器410及光學感測器支架430。 The optical sensor assembly 400 can include an optical sensor 410 and an optical sensor bracket 430.
光學感測器410可為偵測光線本身或透過光線轉換在光線中所包含的資訊或轉成電子訊號在光線中所包含的資訊的裝置。光學感測器410可藉由用光線照射刀片310的刀鋒來檢查刀片是否具有缺陷d。光線感測器410可由光學纖維形成，並可包含光線發射部分410a及光線接收部分410b。光線接收部分410b可包含第一光線接收部分410b-1及第二光線接收部分410b-2。在此，光線發射部分410a可為發射光線的部分，而光線接收部分410b可為光線入射的部分。從光線發射部分410a發射的光線可為雷射500，如紅外線雷射、鎵-砷半導體雷射(gallium-arsenide semiconductor laser)、釔-鋁石榴石(YAG，Yttrium Aluminum Garnet)雷射、氦-氖雷射，或二氧化碳雷射，但並不以此為限。 The optical sensor 410 can be used to detect the light itself or to convert the information contained in the light or the information contained in the light into the light. The optical sensor 410 can check whether the blade has a defect d by illuminating the blade of the blade 310 with light. The light sensor 410 may be formed of optical fibers and may include a light emitting portion 410a and a light receiving portion 410b. The light receiving portion 410b may include a first light receiving portion 410b-1 and a second light receiving portion 410b-2. Here, the light emitting portion 410a may be a portion that emits light, and the light receiving portion 410b may be a portion where light is incident. The light emitted from the light emitting portion 410a may be a laser 500 such as an infrared laser, a gallium-arsenide semiconductor laser, a YAG (Yttrium Aluminum Garnet) laser, or a germanium-氖 Laser, or carbon dioxide laser, but not limited to this.
光線發射部分410a可設置於刀片310的一側部分，而第一光線接收部分410b-1可設置於刀片面向刀片310的一側部分的另一側部分。在例示性實施例中，光線發射部分410a及第一光線接收部分410b-1可對稱於刀片310。在另一例示性實施例中，虛擬線可連接光線發射部分410a及第一光線接收部分410b-1平行於切割台100的一表面。在又一例示性實施例中，光線發射部分410a及第一 光線接收部分410b-1可形成以延伸為長達刀片310的刀鋒的長度，並可平行刀片310的刀鋒而配置。 The light emitting portion 410a may be disposed at one side portion of the blade 310, and the first light receiving portion 410b-1 may be disposed at the other side portion of the blade facing one side portion of the blade 310. In an exemplary embodiment, the light emitting portion 410a and the first light receiving portion 410b-1 may be symmetric with respect to the blade 310. In another exemplary embodiment, the imaginary line may connect the light emitting portion 410a and the first light receiving portion 410b-1 parallel to a surface of the cutting table 100. In still another exemplary embodiment, the light emitting portion 410a and the first The light receiving portion 410b-1 may be formed to extend the length of the blade leading up to the blade 310 and may be configured to be parallel to the blade edge of the blade 310.
第二光線接收部分410b-2可設置於刀片310的下方部分。將於稍後描述的第二光線接收部分410b-2可接收由刀片310的刀鋒反射且以預定方向傳遞的光線。在一例示性實施例中，第二光線接收部分410b-2可設置以在刀片310的刀鋒指著的方向與刀片310以預定距離間隔。在另一例示性實施例中，第二光線接收部分410b-2可形成以鄰近光線發射部分410a及/或第一光線接收部分410b-1。在又另一實施例中，第二光線接收部分410b-2可被省略，並可以光線吸收構件取代。 The second light receiving portion 410b-2 may be disposed at a lower portion of the blade 310. The second light receiving portion 410b-2, which will be described later, can receive the light reflected by the blade of the blade 310 and transmitted in a predetermined direction. In an exemplary embodiment, the second light receiving portion 410b-2 may be disposed to be spaced apart from the blade 310 by a predetermined distance in a direction pointed by the blade 310. In another exemplary embodiment, the second light receiving portion 410b-2 may be formed to be adjacent to the light emitting portion 410a and/or the first light receiving portion 410b-1. In still another embodiment, the second light receiving portion 410b-2 may be omitted and replaced with a light absorbing member.
光線發射部分410a可朝第一光線接收部分410b-1的方向發射光線，而刀片310的刀鋒可設置在光線的傳遞路徑。在此，光線的傳遞路徑可為直線形狀。 The light emitting portion 410a can emit light in the direction of the first light receiving portion 410b-1, and the blade edge of the blade 310 can be disposed in the light transmission path. Here, the light transmission path may be a straight shape.
光學感測器支架430可支撐光學感測器410。光學感測器支架430可沿著刀片310的刀鋒移動光學感測器410。光學感測器支架430可包含支架基底430a及凸部430b。 The optical sensor bracket 430 can support the optical sensor 410. The optical sensor bracket 430 can move the optical sensor 410 along the blade edge of the blade 310. The optical sensor bracket 430 can include a bracket base 430a and a protrusion 430b.
支架基底430a可設置在刀片310的下方部分上。支架基底430a可包含第二光線接收部分410b-2，並可沿刀片310的方向暴露第二光線接收部分410b-2的一部分。如圖所示，支架基底430a可為立方形板狀形狀，但並不以此為限。支架基底430a可根據刀片310的形狀及第二光線接收部分410b-2的尺寸而具有各種形狀。支架基底430的一表面可平行於切割台100的一表面，或可垂直於刀片組件300的移動方向。雖然未繪示於圖中，支架基底430a可包含如線性比例 尺(linear scale)、滾珠螺桿(ball screw)及線性運動(LM,Linear Motion)導件的元件，並可設計以具有較佳的導向性及水平度。 The holder base 430a may be disposed on a lower portion of the blade 310. The holder base 430a may include the second light receiving portion 410b-2 and may expose a portion of the second light receiving portion 410b-2 in the direction of the blade 310. As shown, the bracket base 430a may have a cuboid plate shape, but is not limited thereto. The holder base 430a may have various shapes depending on the shape of the blade 310 and the size of the second light receiving portion 410b-2. A surface of the bracket base 430 may be parallel to a surface of the cutting table 100 or may be perpendicular to the direction of movement of the blade assembly 300. Although not shown in the drawings, the stent substrate 430a may comprise, for example, a linear scale The components of the linear scale, ball screw and linear motion guides can be designed for better guiding and leveling.
凸部430b可形成以從支架基底430a的一表面朝著刀片310的方向凸出。二凸部430b可以其中一凸部430b設置在刀片310的一側部分且另一凸部430b設置在刀片310的另一側部分的方式提供。設置在刀片310一側部分的凸部430b可包含光線發射部分410a，並可在朝著刀片310的刀鋒的方向暴露光線發射部分410a的一部分。設置在刀片310另一側部分的凸部430b可包含第一光線接收部分410b-1，並可在朝著刀片310的刀鋒的方向暴露第一光線接收部分410b-1的一部分。承上所述，藉由從兩側凸出的凸部430b，光學感測器支架430可整體為鉗子形狀。 The convex portion 430b may be formed to protrude from a surface of the holder base 430a toward the blade 310. The two convex portions 430b may be provided in such a manner that one convex portion 430b is provided at one side portion of the blade 310 and the other convex portion 430b is provided at the other side portion of the blade 310. The convex portion 430b provided at a side portion of the blade 310 may include the light emitting portion 410a, and may expose a portion of the light emitting portion 410a in a direction toward the blade edge of the blade 310. The convex portion 430b disposed at the other side portion of the blade 310 may include the first light receiving portion 410b-1, and may expose a portion of the first light receiving portion 410b-1 in a direction toward the blade edge of the blade 310. As described above, the optical sensor holder 430 can be entirely in the shape of a pliers by the convex portions 430b protruding from both sides.
參閱第3圖至第5圖，若刀片310為正常的，亦即，刀片310不具有缺陷d，則從光線發射部分410a朝著第一光線接收部分410b-1的方向所發射之發射光510並不入射到第一光線接收部分410b-1，而完全地被刀片310的刀鋒反射而入射到第二光線接收部分410b-2。在此，若假設從刀片310的刀鋒所反射的光線為反射光530，只有發射光510及反射光530可存在於正常的刀片310上。 Referring to FIGS. 3 to 5, if the blade 310 is normal, that is, the blade 310 does not have the defect d, the emitted light 510 emitted from the light emitting portion 410a toward the first light receiving portion 410b-1. It is not incident on the first light receiving portion 410b-1, but is completely reflected by the blade edge of the blade 310 and is incident on the second light receiving portion 410b-2. Here, if it is assumed that the light reflected from the blade edge of the blade 310 is the reflected light 530, only the emitted light 510 and the reflected light 530 may exist on the normal blade 310.
參閱第6圖及第7圖，若刀片310不正常，亦即，若刀片310的刀鋒有損壞，則從光線發射部分410a朝著第一光線接收部分410b-1的方向所發射之發射光510可穿過刀片310的刀鋒的損壞部分(破洞形成於其上的部分)，而接著可完全地入射到第一光線接收部分410b-1。在此，若假設入射到第一光線接收部分410b-1的光線為入射光550，只有發射光510及入射光550可存在於具損壞刀鋒的刀片310。 Referring to FIGS. 6 and 7, if the blade 310 is abnormal, that is, if the blade edge of the blade 310 is damaged, the emitted light 510 emitted from the light emitting portion 410a toward the first light receiving portion 410b-1. The damaged portion of the blade (the portion on which the hole is formed) may pass through the blade 310, and then may be completely incident on the first light receiving portion 410b-1. Here, if it is assumed that the light incident to the first light receiving portion 410b-1 is the incident light 550, only the emitted light 510 and the incident light 550 may exist in the blade 310 having the damaged blade edge.
參閱第8圖，若刀片310不正常，亦即，若刀片310的刀鋒有磨損，則從光線發射部分410a發射到第一光線接收部分410b-1的發射光510可被刀片310的刀鋒完全地反射。被刀片310的刀鋒反射的反射光可不入射到第一光線接收部分410b-1及第二光線接收部分410b-2。亦即，從刀片310的刀鋒所反射之反射光530可朝著不同於第一光線接收部分410b-1的方向及第二光線接收部分410b-2的方向之方向傳遞。在此，只有發射光510及反射光530可存在於具磨損刀鋒的刀片310。 Referring to Fig. 8, if the blade 310 is abnormal, that is, if the blade edge of the blade 310 is worn, the emitted light 510 emitted from the light emitting portion 410a to the first light receiving portion 410b-1 can be completely cut by the blade of the blade 310. reflection. The reflected light reflected by the blade edge of the blade 310 may not be incident on the first light receiving portion 410b-1 and the second light receiving portion 410b-2. That is, the reflected light 530 reflected from the blade edge of the blade 310 can be transmitted in a direction different from the direction of the first light receiving portion 410b-1 and the direction of the second light receiving portion 410b-2. Here, only the emitted light 510 and the reflected light 530 may be present in the blade 310 with the worn blade.
參閱第9圖，若微粒p被吸附到刀片310的刀鋒上，從光線發射部分410a發射到第一光線接收部分410b-1的發射光510可被吸附在刀片310的刀鋒上的微粒p完全地反射。吸附在刀片310的刀鋒上的微粒p所反射的反射光可不入射到第一光線接收部分410b-1及第二光線接收部分410b-2。亦即，被吸附在刀片310的刀鋒上的微粒p所反射的反射光530可朝著不同於第一光線接收部分410b-1的方向及第二光線接收部分410b-2的方向之方向傳遞。在此，只有發射光510及反射光530可存在於具有微粒p吸附於其上之刀鋒的刀片310。 Referring to Fig. 9, if the particles p are adsorbed onto the blade edge of the blade 310, the emitted light 510 emitted from the light emitting portion 410a to the first light receiving portion 410b-1 can be adsorbed on the blade edge of the blade 310 completely. reflection. The reflected light reflected by the particles p adsorbed on the blade edge of the blade 310 may not be incident on the first light receiving portion 410b-1 and the second light receiving portion 410b-2. That is, the reflected light 530 reflected by the particles p adsorbed on the blade edge of the blade 310 can be transmitted in a direction different from the direction of the first light receiving portion 410b-1 and the direction of the second light receiving portion 410b-2. Here, only the emitted light 510 and the reflected light 530 may exist in the blade 310 having the blade to which the particles p are adsorbed.
承上所述，光學感測器組件400可透過照射光線到刀片310的刀鋒上以檢查刀片310是否具有缺陷。若刀片不具有缺陷d，光線不會於第一光線接收部分410b-1接收，而是於第二光線接收部分410b-2接收。若刀片310具有缺陷d，亦即，若如刀片的斷裂、刀片的磨損或微粒p吸附到刀片上之刀片310的缺陷d存在，則光線可被第一光線接收部分410b-1接收，而可不被第二光線接收部分410b-2接收。 As described above, the optical sensor assembly 400 can illuminate the blade of the blade 310 to inspect the blade 310 for defects. If the blade does not have the defect d, the light is not received by the first light receiving portion 410b-1, but is received by the second light receiving portion 410b-2. If the blade 310 has the defect d, that is, if the blade is broken, the blade is worn, or the defect d of the blade 310 adsorbed to the blade by the particle p exists, the light can be received by the first light receiving portion 410b-1, or not It is received by the second light receiving portion 410b-2.
根據本發明實施例之用於切割基板的設備可更包含若光線被第一光線接收部分410b-1接收及/或若光線並未被第二光線接收部分410b-2接收 時，修補或移除刀片310的控制部分。在此，刀片310的修補可指刀片310的刀鋒的削尖(sharpening)以移除斷裂的刀鋒或磨損的刀鋒，或經由刀片310的清理而移除吸附的微粒p。若刀片310的缺陷d相當嚴重而不可能透過修補刀片310而重複使用刀片310時，刀片310可被移除。在控制部分的此類操作中，雖然未繪示於圖中，光線發射部分410a、第一光線接收部分410b-1及第二光線接收部分410b-2可藉由有線或無線方式連接到控制部分。 The apparatus for cutting a substrate according to an embodiment of the present invention may further include if the light is received by the first light receiving portion 410b-1 and/or if the light is not received by the second light receiving portion 410b-2 At this time, the control portion of the blade 310 is repaired or removed. Here, the repair of the blade 310 may refer to the sharpening of the blade edge of the blade 310 to remove the broken blade edge or the worn blade edge, or the removal of the adsorbed particles p via the cleaning of the blade 310. If the defect d of the blade 310 is quite severe and it is not possible to reuse the blade 310 through the repair blade 310, the blade 310 can be removed. In such an operation of the control portion, although not shown in the drawing, the light emitting portion 410a, the first light receiving portion 410b-1, and the second light receiving portion 410b-2 may be connected to the control portion by wire or wirelessly. .
進一步地，控制部分可透過調整刀片310的刀鋒之光線照射於其上的點與刀片310的刀鋒的末端之間的距離而調整刀片的缺陷d的偵測靈敏度。在例示性實施例中，若刀片310的刀鋒之光線照射於其上的點與刀片310的刀鋒的末端之間的距離縮減，則即使如刀鋒的微小斷裂或微小磨損的微小缺陷的發生，都會造成光線傳遞路徑的改變，且因此刀片之缺陷d的偵測靈敏度可增加。在另一例示性實施例中，若刀片310的刀鋒之光線照射於其上的點與刀片310的刀鋒的末端之間的距離加寬，則光線傳遞路徑即使發生微小缺陷也不會改變，且因此刀片的缺陷d的偵測靈敏度可降低。 Further, the control portion can adjust the detection sensitivity of the defect d of the blade by adjusting the distance between the point on which the blade of the blade 310 is irradiated and the tip end of the blade 310. In the exemplary embodiment, if the distance between the point on which the blade of the blade 310 is irradiated and the end of the blade edge of the blade 310 is reduced, even a minute defect such as a slight break of the blade or a slight wear of the blade may occur. This causes a change in the light transmission path, and thus the detection sensitivity of the defect d of the blade can be increased. In another exemplary embodiment, if the distance between the point on which the blade of the blade 310 is irradiated and the end of the blade edge of the blade 310 is widened, the light transmission path does not change even if a minute defect occurs, and Therefore, the detection sensitivity of the defect d of the blade can be lowered.
承上所述，根據本發明實施例之用於切割基板的設備包含用於檢查刀片310，且自動地檢查用於切割基板的設備的刀片是否具有缺陷d的光學感測器組件400。若刀片具有缺陷d，工作人員被警告有缺陷d或被引導以修補或移除刀片310。進一步地，以刀片310切割而形成的基板的切割表面變得一致，因此產品可以高品質製造。 As described above, the apparatus for cutting a substrate according to an embodiment of the present invention includes an optical sensor assembly 400 for inspecting the blade 310 and automatically checking whether the blade of the apparatus for cutting the substrate has the defect d. If the blade has a defect d, the worker is warned of being defective d or being directed to repair or remove the blade 310. Further, the cut surface of the substrate formed by cutting with the blade 310 becomes uniform, and thus the product can be manufactured with high quality.
第10圖為根據本發明另一實施例之用於切割基板的設備的透視圖，而第11圖為說明其中光學感測器組件401掃描複數個刀片311之第1圖用於切 割基板的設備的透視圖。為了方便解釋，相同的參考符號用於與第1圖到第9圖中描述的元件實質上相同的元件，且其重複解釋將被省略。 10 is a perspective view of an apparatus for cutting a substrate according to another embodiment of the present invention, and FIG. 11 is a view showing a first diagram in which the optical sensor unit 401 scans a plurality of blades 311 for cutting. A perspective view of the device that cuts the substrate. For convenience of explanation, the same reference numerals are used for elements substantially the same as those described in FIGS. 1 to 9, and repeated explanation thereof will be omitted.
參閱第10圖及第11圖，根據本發明另一實施例，複數個刀片組件301可提供於用於切割基板的設備。在例示性實施例中，複數個刀片組件301的複數個刀片311可設置為彼此平行且彼此間隔預定距離，而在母基板200上沿相同方向形成的複數個切割線250可同步地切割。第10圖及第11圖繪示複數個刀片311同步地切割沿y方向形成的複數個切割線250。然而，本發明並不以此為限，而刀片311可同步地切割沿x方向形成的複數個切割線250。在另一例示性實施例中，複數個刀片311可以格子狀設置，以便同步地切割所有切割線250。 Referring to Figures 10 and 11, in accordance with another embodiment of the present invention, a plurality of blade assemblies 301 can be provided for use in a device for cutting a substrate. In an exemplary embodiment, the plurality of blades 311 of the plurality of blade assemblies 301 may be disposed parallel to each other and spaced apart from each other by a predetermined distance, and the plurality of cutting lines 250 formed in the same direction on the mother substrate 200 may be synchronously cut. FIGS. 10 and 11 illustrate that a plurality of blades 311 synchronously cut a plurality of cutting lines 250 formed in the y direction. However, the present invention is not limited thereto, and the blade 311 can synchronously cut a plurality of cutting lines 250 formed in the x direction. In another exemplary embodiment, a plurality of blades 311 may be arranged in a lattice to sequentially cut all of the cutting lines 250.
複數個刀片組件301可形成為一體。在例示性實施例中，一個刀片支架331連接到複數個刀片311以移動複數個刀片311，但並不以此為限。 A plurality of blade assemblies 301 can be formed in one piece. In the exemplary embodiment, one blade holder 331 is coupled to a plurality of blades 311 to move a plurality of blades 311, but is not limited thereto.
光學感測器組件401的光學感測器411可包含光線發射部分411a及光線接收部分411b，如同根據本發明實施例之光學感測器410一樣的方式，光線接收部分411b可包含第一光線接收部分411b-1及第二光線接收部分411b-2。在此，光線發射部分411a及第一光線接收部分411b-1可設置在兩個相鄰的刀片組件301之間，而第二光線接收部分411b-2可設置在刀片311的下方部分。第10圖及第11圖繪示第一光線接收部分411b-1位於兩個刀片組件301之間，但並不以此為限。光線發射部分411a可設置在兩個刀片組件301之間，而光線發射部分411a及第一光線接收部分411b-1可設置在一起。 The optical sensor 411 of the optical sensor assembly 401 may include a light emitting portion 411a and a light receiving portion 411b, and the light receiving portion 411b may include the first light receiving manner in the same manner as the optical sensor 410 according to an embodiment of the present invention. The portion 411b-1 and the second light receiving portion 411b-2. Here, the light emitting portion 411a and the first light receiving portion 411b-1 may be disposed between two adjacent blade assemblies 301, and the second light receiving portion 411b-2 may be disposed at a lower portion of the blade 311. 10 and 11 illustrate that the first light receiving portion 411b-1 is located between the two blade assemblies 301, but is not limited thereto. The light emitting portion 411a may be disposed between the two blade assemblies 301, and the light emitting portion 411a and the first light receiving portion 411b-1 may be disposed together.
光學感測器組件401的光學感測器支架431可包含支架基底431a及凸部431b，如同根據本發明實施例之光學感測器支架430一樣的方式。在此， 根據本發明實施例之支架基底431a可形成以延伸長於支架基底430a，而根據本發明實施例之凸部431b的數量可多於凸部430b之數量。 The optical sensor holder 431 of the optical sensor assembly 401 can include a holder base 431a and a protrusion 431b in the same manner as the optical sensor holder 430 in accordance with an embodiment of the present invention. here, The holder base 431a according to an embodiment of the present invention may be formed to extend longer than the holder base 430a, and the number of the convex portions 431b according to the embodiment of the present invention may be larger than the number of the convex portions 430b.
承上所述，根據本發明另一實施例之用於切割基板的設備可用複數個刀片311同步地切割基板的數個部位，並可透過使用光學感測器組件401的一次掃描而偵測複數個刀片的缺陷d。 As described above, the apparatus for cutting a substrate according to another embodiment of the present invention can simultaneously cut a plurality of portions of the substrate by a plurality of blades 311, and can detect the plural by using one scan of the optical sensor assembly 401. The defect d of the blade.
第12圖為根據本發明再一實施例之用於切割基板的設備的透視圖。第13圖為第12圖用於切割基板的設備中的刀片組件300及光學感測器組件402的前視圖。第14圖為第12圖用於切割基板的設備中的刀片組件300、光學感測器組件402、以及切割台100的側面圖，而第15圖為說明第14圖的「XV」部分的放大圖。為了方便解釋，相同的參考符號用於與第1圖到第9圖中描述的元件實質上相同的元件，而其重複解釋將被省略。 Figure 12 is a perspective view of an apparatus for cutting a substrate according to still another embodiment of the present invention. Figure 13 is a front elevational view of the blade assembly 300 and optical sensor assembly 402 in the apparatus for cutting a substrate in Figure 12. Figure 14 is a side view of the blade assembly 300, the optical sensor assembly 402, and the cutting table 100 in the apparatus for cutting a substrate in Fig. 12, and Fig. 15 is an enlarged view showing the "XV" portion of Fig. 14. Figure. For convenience of explanation, the same reference numerals are used for elements substantially the same as those described in FIGS. 1 to 9, and repeated explanation thereof will be omitted.
參閱第12圖，在根據本發明又一實施例之用於切割基板的設備中，光學感測器組件402可固定地安裝在切割台100上。特別是，光學感測器組件402可設置在刀片310的移動路徑的兩邊部分以檢查刀片是否具有缺陷d。亦即，光學感測器組件402可設置在連接刀片310的刀鋒末端及切割線250的虛擬平面的兩邊。 Referring to Fig. 12, in an apparatus for cutting a substrate according to still another embodiment of the present invention, the optical sensor assembly 402 can be fixedly mounted on the cutting table 100. In particular, the optical sensor assembly 402 can be disposed on both sides of the path of movement of the blade 310 to check if the blade has a defect d. That is, the optical sensor assembly 402 can be disposed on both sides of the blade end of the attachment blade 310 and the virtual plane of the cutting line 250.
與根據本發明實施例之光學感測器410相同的方式，光學感測器組件402的光學感測器412可包含光線發射部分412a及光線接收部分412b。在此，光線發射部分412a可設置在刀片310之移動路徑的一側部分，而光線接收部分412b可設置在刀片310之移動路徑的另一側部分。進一步地，光線發射部分412a及光線接收部分412b可形成以延伸為長達對應刀片310的刀鋒的長度之長度，且因此支撐光線發射部分412a及光線接收部分412b的光學感測器支架432也 可形成以延伸為長達對應刀片310的刀鋒的長度之長度。在此，光線發射部分412a及光線接收部分412b的長度可相同於或長於刀片310的刀鋒的長度。 In the same manner as the optical sensor 410 according to an embodiment of the present invention, the optical sensor 412 of the optical sensor assembly 402 can include a light emitting portion 412a and a light receiving portion 412b. Here, the light emitting portion 412a may be disposed at one side portion of the moving path of the blade 310, and the light receiving portion 412b may be disposed at the other side portion of the moving path of the blade 310. Further, the light emitting portion 412a and the light receiving portion 412b may be formed to extend the length of the blade length of the corresponding blade 310, and thus the optical sensor bracket 432 supporting the light emitting portion 412a and the light receiving portion 412b is also A length that extends to a length that extends up to the blade of the corresponding blade 310 can be formed. Here, the length of the light emitting portion 412a and the light receiving portion 412b may be the same as or longer than the length of the blade edge of the blade 310.
第13圖到第15圖為說明光線照射在刀片310的缺陷d中刀片310的破損刀鋒上情況的示意圖。請參閱第13圖到第15圖，從光線發射部分412a發射的光線的傳遞路徑可為表面形狀。在此，發射光511的光通量可相同於反射光531的光通量及入射光551的光通量的總和。這在第13圖中被表示為雷射501的厚度。從光線發射部分412a朝著光線接收部分412b之方向發射的光線可完全地往下反射，除了破損刀鋒存在的部分。在此，反射光531可照射到母基板200及/或切割台100上。在另一例示性實施例中，為了將施加於母基板200及/或切割台100的雷射501的影響最小化，反射板可另外安裝在反射光531的傳遞路徑上。 Figs. 13 to 15 are diagrams for explaining the case where light is irradiated on the broken blade of the blade 310 in the defect d of the blade 310. Referring to Figures 13 to 15, the transmission path of the light emitted from the light emitting portion 412a may be a surface shape. Here, the luminous flux of the emitted light 511 may be the same as the sum of the luminous flux of the reflected light 531 and the luminous flux of the incident light 551. This is indicated in Figure 13 as the thickness of the laser 501. The light emitted from the light emitting portion 412a toward the light receiving portion 412b can be totally reflected downward except for the portion where the broken blade is present. Here, the reflected light 531 may be irradiated onto the mother substrate 200 and/or the cutting table 100. In another exemplary embodiment, in order to minimize the influence of the laser 501 applied to the mother substrate 200 and/or the cutting table 100, the reflecting plate may be additionally mounted on the transmission path of the reflected light 531.
雖然未繪示於圖中，根據本發明又一實施例之用於切割基板的設備可更包含控制部分，而此控制部分可在光線被光線接收部分412b接收時修補或移除刀片310。 Although not shown in the drawings, an apparatus for cutting a substrate according to still another embodiment of the present invention may further include a control portion that can repair or remove the blade 310 when light is received by the light receiving portion 412b.
承上所述，依據根據本發明又一實施例之用於切割基板的設備，當刀片組件300的刀片310通過光學感測器組件402之間，光學感測器組件402運作以檢查刀片是否具有缺陷d。由於光學感測器組件402的光學感測器412發射表面形狀的光線，故有可能一次性檢查刀片是否具有缺陷d。進一步地，由於執行切割過程中隨時檢查刀片是否具有缺陷d，基板之劣質切割表面的形成可根本地避免。 As described above, according to another apparatus for cutting a substrate according to still another embodiment of the present invention, when the blade 310 of the blade assembly 300 passes between the optical sensor assemblies 402, the optical sensor assembly 402 operates to check whether the blade has Defect d. Since the optical sensor 412 of the optical sensor assembly 402 emits light of a surface shape, it is possible to check whether the blade has a defect d at one time. Further, since the inspection of the blade at any time during the cutting process has the defect d, the formation of the inferior cutting surface of the substrate can be fundamentally avoided.
第16圖為根據本發明又一實施例之用於切割基板的設備的透視圖，而第17圖為第16圖用於切割基板的設備中的刀片組件302及光學感測器組件 400的前視圖。為了方便解釋，相同的參考符號用於與第1圖到第9圖中描述的元件實質上相同的元件，而其重複解釋將被省略。 Figure 16 is a perspective view of an apparatus for cutting a substrate according to still another embodiment of the present invention, and Figure 17 is a blade assembly 302 and an optical sensor assembly in the apparatus for cutting a substrate according to Figure 16 Front view of the 400. For convenience of explanation, the same reference numerals are used for elements substantially the same as those described in FIGS. 1 to 9, and repeated explanation thereof will be omitted.
參閱第16圖及第17圖，刀片312可為圓板狀，而刀片312的刀鋒可沿著刀片312的圓周形成。亦即，具有圓板狀的刀片312可以軸心旋轉而切割母基板200。在此，刀片312的軸心可連接到刀片支架332。刀片支架332可以平行切割台100的方向移動刀片312。 Referring to Figures 16 and 17, the blade 312 can be disc shaped and the blade 312 can be formed along the circumference of the blade 312. That is, the blade 312 having a disk shape can be axially rotated to cut the mother substrate 200. Here, the axis of the blade 312 can be coupled to the blade holder 332. The blade holder 332 can move the blade 312 in a direction parallel to the cutting table 100.
雖然未直接繪示於第16圖及第17圖中，光學感測器組件400可固定地安裝在刀片支架332上。 Although not directly illustrated in FIGS. 16 and 17, the optical sensor assembly 400 can be fixedly mounted on the blade holder 332.
承上所述，若根據本發明又一實施例之用於切割基板的設備的光學感測器410的光線發射部分410a以光線照射一特定點，刀片312的刀鋒在旋轉時通過特定部分，且因此可能在切割母基板200時同步地檢查刀片是否具有缺陷d。 As described above, if the light emitting portion 410a of the optical sensor 410 of the apparatus for cutting a substrate according to still another embodiment of the present invention illuminates a specific point with light, the blade edge of the blade 312 passes through a specific portion while rotating, and It is therefore possible to synchronously check whether the blade has the defect d while cutting the mother substrate 200.
雖然本發明的較佳實施例係為了說明目的而被描述，技術領域中具有通常知識者將理解的是，在不偏離本發明由附加申請專利範圍所揭露的範疇及精神下，各種修改、增加及替換為可能的。 While the preferred embodiment of the present invention has been described for the purpose of illustration, it will be understood by those of ordinary skill in the art And replace with possible.
100‧‧‧切割台 100‧‧‧ cutting table
200‧‧‧母基板 200‧‧‧ mother substrate
210‧‧‧基底基板 210‧‧‧Base substrate
230‧‧‧功能層 230‧‧‧ functional layer
250‧‧‧切割線 250‧‧‧ cutting line
300‧‧‧刀片組件 300‧‧‧ blade components
310‧‧‧刀片 310‧‧‧blade
330‧‧‧刀片支架 330‧‧‧blade bracket
400‧‧‧光學感測器組件 400‧‧‧Optical sensor assembly
410‧‧‧光學感測器 410‧‧‧ Optical Sensor
410a‧‧‧光線發射部分 410a‧‧‧Light emitting part
410b‧‧‧光線接收部分 410b‧‧‧Light receiving part
410b-1‧‧‧第一光線接收部分 410b-1‧‧‧First light receiving part
410b-2‧‧‧第二光線接收部分 410b-2‧‧‧second light receiving part
430‧‧‧光學感測器支架 430‧‧‧Optical sensor bracket
430a‧‧‧支架基底 430a‧‧‧ bracket base
430b‧‧‧凸部 430b‧‧‧ convex
Claims (28)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130025731A KR20140112607A (en) | 2013-03-11 | 2013-03-11 | Optical sensor assembly for inspecting knife and Apparatus for cutting substrate including the same |
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| Publication Number | Publication Date |
|---|---|
| TW201436106A TW201436106A (en) | 2014-09-16 |
| TWI608566B true TWI608566B (en) | 2017-12-11 |
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| TW102130166A TWI608566B (en) | 2013-03-11 | 2013-08-23 | Optical sensor assembly for inspecting knife and apparatus for cutting substrate including the same |
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| KR (1) | KR20140112607A (en) |
| CN (1) | CN104044176A (en) |
| TW (1) | TWI608566B (en) |
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| US10206675B2 (en) * | 2016-07-13 | 2019-02-19 | Ethicon Llc | Method and apparatus for fabricating self-retaining sutures with calibration |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200303296A (en) * | 2001-11-08 | 2003-09-01 | Sharp Kk | Method and apparatus for cutting apart a glass substrate, liquid crystal panel, and apparatus for fabricating a liquid crystal panel |
| TW200529973A (en) * | 2003-11-13 | 2005-09-16 | Applied Materials Inc | Real time process control for a polishing process |
| TW200532850A (en) * | 2004-03-17 | 2005-10-01 | Nitto Denko Corp | Dicing die-bonding film |
| TW201104902A (en) * | 2009-04-14 | 2011-02-01 | Intersil Inc | Optical sensors and methods for providing optical sensors |
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|---|---|---|---|---|
| US5031360A (en) * | 1989-08-29 | 1991-07-16 | Micron Technology, Inc. | Broken blade detector for semiconductor die saws |
| EP0532933B1 (en) * | 1991-08-21 | 1995-11-02 | Tokyo Seimitsu Co.,Ltd. | Blade position detection apparatus |
| US5718615A (en) * | 1995-10-20 | 1998-02-17 | Boucher; John N. | Semiconductor wafer dicing method |
| JP3746422B2 (en) * | 2000-12-05 | 2006-02-15 | シャープ株式会社 | Dicing apparatus and dicing method |
| US6761615B2 (en) * | 2001-11-01 | 2004-07-13 | Advanced Dicing Technologies, Ltd. | In-situ wear measurement apparatus for dicing saw blades |
| JP4105905B2 (en) * | 2002-07-01 | 2008-06-25 | 株式会社ディスコ | Cutting blade monitoring device for cutting equipment |
| JP4481667B2 (en) * | 2004-02-02 | 2010-06-16 | 株式会社ディスコ | Cutting method |
| JP2007042855A (en) * | 2005-08-03 | 2007-02-15 | Disco Abrasive Syst Ltd | Cutter with blade detection means |
-
2013
- 2013-03-11 KR KR1020130025731A patent/KR20140112607A/en not_active Application Discontinuation
- 2013-06-20 CN CN201310246947.6A patent/CN104044176A/en active Pending
- 2013-08-23 TW TW102130166A patent/TWI608566B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200303296A (en) * | 2001-11-08 | 2003-09-01 | Sharp Kk | Method and apparatus for cutting apart a glass substrate, liquid crystal panel, and apparatus for fabricating a liquid crystal panel |
| TW200529973A (en) * | 2003-11-13 | 2005-09-16 | Applied Materials Inc | Real time process control for a polishing process |
| TW200532850A (en) * | 2004-03-17 | 2005-10-01 | Nitto Denko Corp | Dicing die-bonding film |
| TW201104902A (en) * | 2009-04-14 | 2011-02-01 | Intersil Inc | Optical sensors and methods for providing optical sensors |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201436106A (en) | 2014-09-16 |
| KR20140112607A (en) | 2014-09-24 |
| CN104044176A (en) | 2014-09-17 |
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