TWI608555B - Method and system for high speed height control of a substrate surface within a wafer inspection system - Google Patents
Method and system for high speed height control of a substrate surface within a wafer inspection system Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N21/13—Moving of cuvettes or solid samples to or from the investigating station
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N21/13—Moving of cuvettes or solid samples to or from the investigating station
- G01N2021/135—Sample holder displaceable
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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Description
本發明係關於且自以下所列之(若干)申請案(「相關申請案」)主張最早可用有效申請(若干)日期之權利(例如，主張除了臨時專利申請案外之最早可用優先權日期或根據35 USC§119(e)規定主張臨時專利申請案及(若干)相關申請案之任何及所有前案、前前案、前前前案等申請案之權利)。 The present invention relates to and claims from the (several) application ("Related Application") listed below for the date of the earliest available valid application (several) (for example, claiming the earliest available priority date or basis other than the provisional patent application) 35 USC § 119(e) stipulates the right to claim any provision of the provisional patent application and (in some cases) the relevant application for any and all of the preceding, prior, and prior applications.
為了USPTO額外法定要求之目的，本申請案構成2013年8月23日申請之名為METHOD AND SYSTEM FOR HIGH SPEED HEIGHT CONTROL OF A SUBSTRATE SURFACE WITHIN A WAFER INSPECTION SYSTEM(Zhongping Cai及Jingyi Xiong為發明人)之申請案第61/869,379號之美國臨時專利申請案之一正規(非臨時)專利申請案。 For the purposes of the additional statutory requirements of the USPTO, this application constitutes the name of the application of the METHOD of the United States on August 23, 2013, namely the METHOD AND SYSTEM FOR HIGH SPEED HEIGHT CONTROL OF A SUBSTRATE SURFACE WITHIN A WAFER INSPECTION SYSTEM (Zhongping Cai and Jingyi Xiong are inventors). A formal (non-provisional) patent application in US Provisional Patent Application No. 61/869,379 .
本發明大體上係關於一種用於一基板表面之高度控制之系統及方法，且特定言之係關於一種用於在一晶圓檢測系統內之一基板表面之高速高度控制之系統及方法。 SUMMARY OF THE INVENTION The present invention generally relates to a system and method for height control of a substrate surface, and more particularly to a system and method for high speed height control of a substrate surface within a wafer inspection system.
隨著對於更小半導體裝置之需求持續增加，對於經改良半導體晶圓檢測程序之需求持續增長。檢測工具操作之一態樣包含增加用於晶圓掃描之晶圓高度控制速度以在高掃描速度下減小高度誤差。舉例而言，高度誤差可用於一回饋控制系統中使得晶圓高度跟隨一選定高度目標。回饋控制速度之一基本限制係回饋控制系統之開迴路共振。因此，期望提供用於增加控制速度之一系統及方法。因此，本發明尋求解決先前技術之缺陷。 As the demand for smaller semiconductor devices continues to increase, the demand for improved semiconductor wafer inspection procedures continues to grow. One aspect of inspection tool operation involves increasing the wafer height control speed for wafer scanning to reduce height errors at high scan speeds. For example, height error can be used in a feedback control system such that the wafer height follows a selected height target. One of the feedback control speeds is basically the open loop resonance of the feedback control system. Accordingly, it is desirable to provide a system and method for increasing control speed. Accordingly, the present invention seeks to address the deficiencies of the prior art.
本發明揭示一種在一晶圓檢測系統內之基板之一表面之高速高度控制之系統。在一態樣中，該系統包含(但不限於)：一可動態致動基板平台總成，其包含用於固定一基板之一基板平台；一致動器，其經組態以沿著實質上垂直於該基板之該表面之一方向致動該基板；一高度誤差偵測系統，其經組態以在該表面之一檢測位置處量測該基板之一表面之高度誤差；及一位移感測器，其可操作地耦合至該基板平台總成且經組態以在該基板平台總成之位置處量測實質上垂直於該基板之該表面之一位移。此外，該系統包含通信耦合至該高度誤差偵測系統及該致動器之一回饋控制系統，其中該回饋控制系統經組態以：自該高度誤差偵測系統接收一或多個高度誤差量測；且回應於該經量測之一或多個高度誤差量測，調整該致動器之一致動狀態以維持該基板表面實質上處於該檢測系統之一偵測器之一成像平面或該檢測系統之照明之一焦點處。另外，一前饋控制系統通信耦合至該高度誤差偵測系統及該致動器，其中該前饋控制系統經組態以：自該位移感測器接收一或多個位移量測；回應於來自該一或多個位移量測之一或多個位移值及來自該一或多個高度誤差量測之該一或多個高度誤差值，產生一或多個位移目標；且使用該一或多個位移目標之至少一者致動該致動器以維持該基板表面實質上處於該檢測系統之一偵測器之一成像 平面或該檢測系統之照明之一焦點處。 A system for high speed height control of a surface of a substrate within a wafer inspection system is disclosed. In one aspect, the system includes, but is not limited to: a dynamically actuable substrate platform assembly including a substrate platform for securing a substrate; an actuator configured to substantially follow Actuating the substrate perpendicular to one of the surfaces of the substrate; a height error detection system configured to measure a height error of a surface of the substrate at a detection location of the surface; and a sense of displacement A detector operatively coupled to the substrate platform assembly and configured to measure a displacement of one of the surfaces substantially perpendicular to the substrate at a location of the substrate platform assembly. Additionally, the system includes a feedback control system communicatively coupled to the height error detection system and the actuator, wherein the feedback control system is configured to: receive one or more height error quantities from the height error detection system And adjusting an actuating state of the actuator to maintain the substrate surface substantially at an imaging plane of one of the detectors of the detection system or in response to the measured one or more height error measurements One of the focus of the illumination of the inspection system. Additionally, a feedforward control system is communicatively coupled to the height error detection system and the actuator, wherein the feedforward control system is configured to: receive one or more displacement measurements from the displacement sensor; Deriving one or more displacement values from the one or more displacement measurements and the one or more height error values from the one or more height error measurements to generate one or more displacement targets; and using the one or At least one of the plurality of displacement targets actuates the actuator to maintain the substrate surface substantially imaged by one of the detectors of the detection system The plane or the focus of the illumination of the detection system.
本發明揭示一種用於在一晶圓檢測系統內之基板之一表面之高速高度控制之方法。在一態樣中，該方法包含(但不限於)：將一基板定位於一可動態調整基板平台總成之一基板平台上；沿著實質上垂直於該基板之該表面之一方向致動該基板；使用一高度誤差偵測系統在該表面之一檢測位置處量測該基板之該表面之一或多個高度誤差值；使用一位移感測器在該基板平台總成之位置處量測實質上垂直於該基板之該表面之一或多個位移值；自該一或多個高度誤差值及該一或多個位移值產生一或多個位移目標；使用該經量測之一或多個高度誤差值調整該致動器之一致動狀態以維持該基板表面實質上處於該檢測系統之一偵測器之一成像平面或該檢測系統之照明之一焦點處；及使用該經產生之一或多個位移目標調整該致動器之一致動狀態以維持該基板表面實質上處於該檢測系統之一偵測器之一成像平面或該檢測系統之照明之一焦點處。 A method for high speed height control of a surface of a substrate within a wafer inspection system is disclosed. In one aspect, the method includes, but is not limited to: positioning a substrate on a substrate platform of a dynamically adjustable substrate platform assembly; actuating in a direction substantially perpendicular to one of the surfaces of the substrate The substrate; measuring a height error value of the surface of the substrate at a detection position of the surface using a height error detection system; using a displacement sensor at the position of the substrate platform assembly Measuring one or more displacement values substantially perpendicular to the surface of the substrate; generating one or more displacement targets from the one or more height error values and the one or more displacement values; using one of the measured Or a plurality of height error values adjusting an actuating state of the actuator to maintain the substrate surface substantially at an imaging plane of one of the detectors of the detection system or a focus of illumination of the detection system; and using the Generating one or more displacement targets adjusts the consistent state of the actuator to maintain the substrate surface substantially at an imaging plane of one of the detectors of the detection system or at a focus of illumination of the detection system.
本發明揭示一種用於在一晶圓檢測系統內之基板之一表面之高速高度控制之系統。在一態樣中，該系統包含(但不限於)：一可動態致動基板平台總成，其包含用於固定一基板之一基板平台；一致動器，其經組態以沿著實質上垂直於該基板之該表面之一方向致動該基板；一高度誤差偵測系統，其經組態以在該表面之一檢測位置處量測該基板之一表面之高度誤差；及一位移感測器，其可操作地耦合至該基板平台總成且經組態以在該基板平台總成之位置處量測實質上垂直於該基板之該表面之一位移。此外，該系統包含通信耦合至該高度誤差偵測系統及該致動器之一回饋控制系統，其中該回饋控制系統經組態以：自該高度誤差偵測系統接收一或多個高度誤差量測；且回應於該經量測之一或多個高度誤差量測，調整該致動器之一致動狀態以維持該基板表面實質上處於該檢測系統之一偵測器之一成像平面或該檢 測系統之照明之一焦點處。另外，一前饋控制系統通信耦合至該高度誤差偵測系統及該致動器，其中該前饋控制系統經組態以：自該位移感測器接收一或多個位移量測；回應於來自該一或多個位移量測之一或多個位移值及來自該一或多個高度誤差量測之該一或多個高度誤差值，產生一或多個位移目標；且使用該一或多個位移目標之至少一者致動該致動器以維持該基板表面實質上處於該檢測系統之一偵測器之一成像平面或該檢測系統之照明之一焦點處。該系統進一步包括一軌道單元，其經通信耦合至該前饋系統且經組態以自一或多個先前位移目標量測獲取一位移目標，其中該經獲取之位移目標係用作該前饋目標以減小該前饋控制系統之有效相位延遲。 A system for high speed height control of a surface of a substrate within a wafer inspection system is disclosed. In one aspect, the system includes, but is not limited to: a dynamically actuable substrate platform assembly including a substrate platform for securing a substrate; an actuator configured to substantially follow Actuating the substrate perpendicular to one of the surfaces of the substrate; a height error detection system configured to measure a height error of a surface of the substrate at a detection location of the surface; and a sense of displacement A detector operatively coupled to the substrate platform assembly and configured to measure a displacement of one of the surfaces substantially perpendicular to the substrate at a location of the substrate platform assembly. Additionally, the system includes a feedback control system communicatively coupled to the height error detection system and the actuator, wherein the feedback control system is configured to: receive one or more height error quantities from the height error detection system And adjusting an actuating state of the actuator to maintain the substrate surface substantially at an imaging plane of one of the detectors of the detection system or in response to the measured one or more height error measurements Check One of the focus of the illumination of the measurement system. Additionally, a feedforward control system is communicatively coupled to the height error detection system and the actuator, wherein the feedforward control system is configured to: receive one or more displacement measurements from the displacement sensor; Deriving one or more displacement values from the one or more displacement measurements and the one or more height error values from the one or more height error measurements to generate one or more displacement targets; and using the one or At least one of the plurality of displacement targets actuates the actuator to maintain the substrate surface substantially at an imaging plane of one of the detectors of the detection system or at a focus of illumination of the detection system. The system further includes a track unit communicatively coupled to the feedforward system and configured to acquire a displacement target from one or more previous displacement target measurements, wherein the acquired displacement target is used as the feed forward The goal is to reduce the effective phase delay of the feedforward control system.
本發明揭示一種用於在一晶圓檢測系統內之基板之一表面之高速高度控制之方法。在一態樣中，該方法包含(但不限於)：將一基板定位於一可動態調整基板平台總成之一基板平台上；沿著實質上垂直於該基板之該表面之一方向致動該基板；使用一高度誤差偵測系統在該表面之一檢測位置處量測該基板之該表面之一或多個高度誤差值；使用一位移感測器在該基板平台總成之位置處量測實質上垂直於該基板之該表面之一或多個位移值；自該一或多個先前軌道之該一或多個位移目標產生一或多個位移目標；使用該經量測之一或多個高度誤差值調整該致動器之一致動狀態以維持該基板表面實質上處於該檢測系統之一偵測器之一成像平面或該檢測系統之照明之一焦點處；及使用該經產生之一或多個位移目標調整該致動器之一致動狀態以維持該基板表面實質上處於該檢測系統之一偵測器之一成像平面或該檢測系統之照明之一焦點處。 A method for high speed height control of a surface of a substrate within a wafer inspection system is disclosed. In one aspect, the method includes, but is not limited to: positioning a substrate on a substrate platform of a dynamically adjustable substrate platform assembly; actuating in a direction substantially perpendicular to one of the surfaces of the substrate The substrate; measuring a height error value of the surface of the substrate at a detection position of the surface using a height error detection system; using a displacement sensor at the position of the substrate platform assembly Measuring one or more displacement values substantially perpendicular to the surface of the substrate; generating one or more displacement targets from the one or more displacement targets of the one or more previous tracks; using the measured one or Adjusting an actuating state of the actuator to maintain the substrate surface substantially at an imaging plane of one of the detectors of the detection system or a focus of illumination of the detection system; and using the generated The one or more displacement targets adjust an actuator state of the actuator to maintain the substrate surface substantially at an imaging plane of one of the detectors of the detection system or a focus of illumination of the detection system.
應瞭解，前述一般描述及以下詳細描述僅係例示性及闡釋性的且未必如所主張般限制本發明。併入至本說明書中且構成本說明書之一部分之隨附圖式繪示本發明之實施例且與一般描述一起用於解釋本 發明之原理。 It is to be understood that the foregoing general descriptions Embodiments of the present invention are incorporated in the specification and constitute a part of the specification, and are used together with the general description to explain the present invention. The principle of the invention.
100‧‧‧檢測系統/系統 100‧‧‧Detection system/system
101‧‧‧基板 101‧‧‧Substrate
102‧‧‧基板平台總成/基板總成 102‧‧‧Substrate platform assembly/substrate assembly
103‧‧‧基板平台 103‧‧‧Base platform
104‧‧‧高度誤差偵測系統 104‧‧‧High Error Detection System
105‧‧‧底盤 105‧‧‧Chassis
106‧‧‧位移感測器 106‧‧‧ Displacement Sensor
108‧‧‧致動器 108‧‧‧Actuator
110‧‧‧回饋控制系統/回饋系統 110‧‧‧Feedback Control System/Feedback System
112‧‧‧前饋控制系統 112‧‧‧Feed-for-feed control system
114‧‧‧光學感測器 114‧‧‧ Optical Sensor
116‧‧‧高度目標 116‧‧‧High target
118‧‧‧高度誤差值/高度誤差信號 118‧‧‧ Height error value/height error signal
120‧‧‧位移值/位移量測值 120‧‧‧ Displacement/displacement measurement
122‧‧‧位移目標 122‧‧‧ Displacement target
124‧‧‧位移目標 124‧‧‧ Displacement target
126‧‧‧軌道單元 126‧‧‧ Track unit
128‧‧‧資料切換器/切換器 128‧‧‧Data switcher/switcher
302‧‧‧光源 302‧‧‧Light source
304‧‧‧聚焦透鏡 304‧‧‧focus lens
306‧‧‧基板 306‧‧‧Substrate
308‧‧‧基板平台 308‧‧‧Base platform
310‧‧‧透鏡收集器 310‧‧‧Lens collector
312‧‧‧感測器 312‧‧‧ sensor
314‧‧‧控制器 314‧‧‧ Controller
316‧‧‧處理器 316‧‧‧ processor
318‧‧‧記憶體 318‧‧‧ memory
400‧‧‧方法 400‧‧‧ method
402‧‧‧步驟 402‧‧‧Steps
404‧‧‧步驟 404‧‧‧Steps
406‧‧‧步驟 406‧‧‧Steps
408‧‧‧步驟 408‧‧‧Steps
410‧‧‧步驟 410‧‧‧Steps
412‧‧‧步驟 412‧‧‧Steps
414‧‧‧步驟 414‧‧‧Steps
500‧‧‧系統 500‧‧‧ system
600‧‧‧方法 600‧‧‧ method
602‧‧‧步驟 602‧‧ steps
604‧‧‧步驟 604‧‧‧Steps
606‧‧‧步驟 606‧‧‧Steps
608‧‧‧步驟 608‧‧‧Steps
610‧‧‧步驟 610‧‧‧Steps
612‧‧‧步驟 612‧‧ steps
614‧‧‧步驟 614‧‧‧Steps
700‧‧‧二維掃描圖案 700‧‧‧Two-dimensional scanning pattern
702‧‧‧軌道 702‧‧‧ Track
704‧‧‧軌道 704‧‧‧ Track
706‧‧‧軌道 706‧‧‧ Track
熟習此項技術者可藉由參考隨附圖式而更好瞭解本發明之許多優勢，其中： Those skilled in the art can better understand the many advantages of the present invention by referring to the accompanying drawings, in which:
圖1繪示根據本發明之具有在一晶圓檢測系統內之基板之一表面之高速高度控制迴路之一高度控制系統。 1 illustrates a height control system for a high speed height control loop having a surface of a substrate within a wafer inspection system in accordance with the present invention.
圖2A至圖2C繪示根據本發明之藉由具有在一晶圓檢測系統內之該基板之一表面之高速高度控制迴路之該高度控制系統實施之高速高度控制之一例示性操作。 2A-2C illustrate one exemplary operation of high speed height control implemented by the height control system having a high speed height control loop on one of the surfaces of the substrate within a wafer inspection system in accordance with the present invention.
圖3繪示根據本發明之一高度誤差偵測系統。 3 illustrates a height error detection system in accordance with the present invention.
圖4繪示根據本發明之用於在一晶圓檢測系統內之基板之一表面之高速高度控制之一方法。 4 illustrates one method of high speed height control of a surface of a substrate in a wafer inspection system in accordance with the present invention.
圖5繪示根據本發明之在一晶圓偵測系統內之基板之一表面之一高速高度控制系統。 FIG. 5 illustrates a high speed height control system on a surface of a substrate in a wafer inspection system in accordance with the present invention.
圖6繪示根據本發明之用於在一晶圓偵測系統內之基板之一表面之高速高度控制之一方法。 6 illustrates one method of high speed height control of a surface of a substrate in a wafer inspection system in accordance with the present invention.
圖7繪示根據本發明之系統之一實施例之二維基板循序掃描圖案之一俯視圖。 7 is a top plan view of a two-dimensional substrate sequential scan pattern in accordance with an embodiment of the system of the present invention.
將詳細參考在隨附圖示中繪示之所揭示之標的。 Reference will be made in detail to the subject matter disclosed in the drawings.
大體上參考圖1至圖7，描述根據本發明之在一晶圓檢測系統內之基板之一表面之高速高度控制之一系統及方法。本發明之實施例針對適合於透過一經檢測基板表面之高度之動態調整在一基板檢測系統中進行自動聚焦之一系統及方法。在一實施例中，基板高度之該動態調整包含該基板之選定區域(例如，基板檢測之區域)處之基板高度誤差之量測外加一基板平台致動裝置之回饋控制。在另一實施例中，基 板高度之動態調整包含基板之選定區域處之一或多個基板平台位移目標之量測外加基板平台致動裝置之前饋控制。在此方面，透過來自一位移感測器及高度誤差感測器之輸出之組合來實現一或多個位移目標之量測。應注意，用於一前饋控制系統中之位移感測器及高度誤差感測器輸出之組合容許增加用於基板檢測掃描之高度控制速度之一系統。 Referring generally to Figures 1 through 7, a system and method for high speed height control of a surface of a substrate within a wafer inspection system in accordance with the present invention is described. Embodiments of the present invention are directed to a system and method suitable for autofocusing in a substrate inspection system through dynamic adjustment of the height of the surface of the substrate. In one embodiment, the dynamic adjustment of the substrate height includes a measurement of substrate height error at a selected region of the substrate (eg, a region detected by the substrate) plus feedback control of a substrate platform actuator. In another embodiment, the base Dynamic adjustment of the plate height includes measurement of one or more substrate platform displacement targets at selected regions of the substrate. Additional substrate platform actuation device feed forward control. In this aspect, the measurement of one or more displacement targets is achieved by a combination of outputs from a displacement sensor and a height error sensor. It should be noted that the combination of the displacement sensor and the height error sensor output for use in a feedforward control system allows for the addition of one of the height control speeds for substrate inspection scanning.
圖1繪示根據本發明之用於在一晶圓檢測系統內之基板之一表面之高度高度控制之一系統100。在一實施例中，用於高度控制之該系統100包含一可致動基板總成102。在另一實施例中，基板總成102包含用於固定一基板101之一基板平台103。基板平台103可包含適合於沿著通常垂直基板101之表面之一方向進行致動之此項技術中已知之任何基板平台架構。舉例而言，基板平台103可包含一基板卡盤。在另一實施例中，一底盤105經組態而作為用於基板平台總成102之一基座框架。 1 illustrates a system 100 for height height control of a surface of a substrate within a wafer inspection system in accordance with the present invention. In one embodiment, the system 100 for height control includes an actuatable substrate assembly 102. In another embodiment, the substrate assembly 102 includes a substrate platform 103 for securing a substrate 101. Substrate platform 103 can comprise any substrate platform architecture known in the art suitable for actuation along one of the surfaces of generally vertical substrate 101. For example, the substrate platform 103 can include a substrate chuck. In another embodiment, a chassis 105 is configured as a base frame for the substrate platform assembly 102.
在一實施例中，基板包含(但不限於)一半導體晶圓。為了本發明之目的，可互換地利用術語「基板」及「晶圓」。如貫穿本發明而使用，術語「基板」通常係指由諸如(但不限於)單晶矽、砷化鎵及磷化銦之一半導體材料形成之一晶圓。一晶圓可包含一或多個層。舉例而言，此等層可包含(但不限於)一光阻、一介電材料、一導電材料或一半導電材料。在此項技術中已知此等層之許多不同類型，且如本文中使用之術語「晶圓」意欲涵蓋可由其形成全部類型之此等層之一晶圓。雖然本揭示內容重點討論本發明在半導體晶圓檢測及高度控制之背景下之使用，但在本文中應注意，本發明可擴展至此項技術中已知之任何基板類型。 In an embodiment, the substrate includes, but is not limited to, a semiconductor wafer. For the purposes of the present invention, the terms "substrate" and "wafer" are used interchangeably. As used throughout the present invention, the term "substrate" generally refers to a wafer formed from a semiconductor material such as, but not limited to, single crystal germanium, gallium arsenide, and indium phosphide. A wafer can include one or more layers. For example, such layers can include, but are not limited to, a photoresist, a dielectric material, a conductive material, or a half conductive material. Many different types of such layers are known in the art, and the term "wafer" as used herein is intended to encompass a wafer from which all of these layers can be formed. While the present disclosure focuses on the use of the present invention in the context of semiconductor wafer inspection and height control, it should be noted herein that the present invention extends to any substrate type known in the art.
在一實施例中，系統100包含一致動器108。在另一實施例中，致動器108可操作地耦合至基板平台總成102。在另一實施例中，致動 器108經組態以在基板平台總成102之位置處沿著實質上垂直於基板101之表面之一方向致動基板101。舉例而言，致動器108可經機械耦合至基板平台總成102。在此方面，致動器108可藉由致動基板平台103而調整基板101。致動器108可包含已知適合於沿著一選定方向(例如，垂直方向)致動一基板之任何致動器。舉例而言，致動器108可包含(但不限於)一音圈致動器。 In an embodiment, system 100 includes an actuator 108. In another embodiment, the actuator 108 is operatively coupled to the substrate platform assembly 102. In another embodiment, actuation The device 108 is configured to actuate the substrate 101 at a location substantially perpendicular to the surface of the substrate 101 at a location of the substrate platform assembly 102. For example, the actuator 108 can be mechanically coupled to the substrate platform assembly 102. In this regard, the actuator 108 can adjust the substrate 101 by actuating the substrate platform 103. Actuator 108 can include any actuator known to be suitable for actuating a substrate in a selected direction (e.g., vertical). For example, actuator 108 can include, but is not limited to, a voice coil actuator.
在一實施例中，系統100包含一高度誤差偵測系統104，其經組態以在表面上之一檢測位置處量測基板101之一表面之高度誤差。在另一實施例中，高度誤差偵測系統104包含一或多個光學感測器114，其或其等經組態以在基板101之表面上之一偵測位置處偵測基板101之表面上之高度誤差值118。用於高度誤差偵測系統104中之一或多個光學感測器114可包含此項技術中已知之適合於高度誤差偵測之任何光學感測器。舉例而言，一或多個高度誤差偵測光學感測器114可包含(但不限於)一或多個二元偵測器(bi-cell detector)、一或多個四元偵測器、一或多個線性CCD偵測器、一或多個線性CMOS偵測器或類似者。在本文中進一步更詳細描述適合於實施於高度誤差偵測系統104中之光學組態。 In one embodiment, system 100 includes a height error detection system 104 configured to measure a height error of a surface of one of the substrates 101 at a detection location on the surface. In another embodiment, the height error detection system 104 includes one or more optical sensors 114 or the like configured to detect the surface of the substrate 101 at a detection location on the surface of the substrate 101. The height error value above is 118. One or more of the optical sensors 114 used in the height error detection system 104 can include any optical sensor known in the art to be suitable for height error detection. For example, one or more height error detection optical sensors 114 may include, but are not limited to, one or more bi-cell detectors, one or more quad detectors, One or more linear CCD detectors, one or more linear CMOS detectors or the like. The optical configuration suitable for implementation in the height error detection system 104 is described in further detail herein.
在一實施例中，高度誤差偵測系統104接收基板101之表面之一高度目標116。在另一實施例中，高度目標源(控制器)與高度誤差感測器114通信耦合以產生高度誤差信號118。舉例而言，可藉由自預設高度目標116減去基板101之表面之經量測高度而產生高度誤差信號118。 In one embodiment, the height error detection system 104 receives a height target 116 of one of the surfaces of the substrate 101. In another embodiment, a high target source (controller) is communicatively coupled to the height error sensor 114 to generate a height error signal 118. For example, the height error signal 118 can be generated by subtracting the measured height of the surface of the substrate 101 from the preset height target 116.
在一實施例中，系統100包含一位移感測器106。在另一實施例中，位移感測器106可操作地耦合至基板平台總成102。舉例而言，位移感測器106可與基板平台總成102機械耦合。在另一實施例中，位移感測器106量測來自一或多個位移量測之一或多個位移值120。在本文 中應注意，經量測之一或多個位移值120在基板總成102之位置處實質上垂直於基板101之表面。在另一實施例中，位移感測器106係一Z平台位移感測器。位移感測器106可包含適合於量測平台總成102之位移之任何感測器。舉例而言，位移感測器可包含(但不限於)一渦電流感測器。藉由另一實例，位移感測器106可包含(但不限於)一光學感測器。 In an embodiment, system 100 includes a displacement sensor 106. In another embodiment, the displacement sensor 106 is operatively coupled to the substrate platform assembly 102. For example, the displacement sensor 106 can be mechanically coupled to the substrate platform assembly 102. In another embodiment, the displacement sensor 106 measures one or more displacement values 120 from one or more displacement measurements. In this article It should be noted that one or more of the displacement values 120 are measured substantially perpendicular to the surface of the substrate 101 at the location of the substrate assembly 102. In another embodiment, the displacement sensor 106 is a Z-platform displacement sensor. Displacement sensor 106 can include any sensor suitable for measuring the displacement of platform assembly 102. For example, the displacement sensor can include, but is not limited to, an eddy current sensor. By way of another example, the displacement sensor 106 can include, but is not limited to, an optical sensor.
在一實施例中，系統100包含一回饋控制系統110。在另一實施例中，回饋控制系統110通信耦合至高度誤差偵測系統104。在另一實施例中，回饋控制系統110通信耦合至致動器108。在另一實施例中，回饋控制系統110使用高度誤差偵測系統104接收來自一或多個高度誤差量測之一或多個高度誤差值118。 In an embodiment, system 100 includes a feedback control system 110. In another embodiment, the feedback control system 110 is communicatively coupled to the altitude error detection system 104. In another embodiment, the feedback control system 110 is communicatively coupled to the actuator 108. In another embodiment, the feedback control system 110 receives one or more height error values 118 from one or more height error measurements using the height error detection system 104.
在一實施例中，回饋控制系統110回應於經量測之一或多個高度誤差值118。在另一實施例中，回饋系統110調整致動器108之一致動狀態以維持基板101之表面實質上處於檢測系統100之一偵測器之一成像平面處。在另一實施例中，回饋系統110調整致動器108之一致動狀態以維持檢測系統100之照明之一焦點。 In an embodiment, the feedback control system 110 responds to measuring one or more height error values 118. In another embodiment, the feedback system 110 adjusts the consistent state of the actuator 108 to maintain the surface of the substrate 101 substantially at one of the imaging planes of one of the detectors 100 of the detection system 100. In another embodiment, the feedback system 110 adjusts the consistent state of the actuator 108 to maintain a focus of illumination of the detection system 100.
在一實施例中，系統100包含一前饋控制系統112。在另一實施例中，前饋控制系統112通信耦合至高度誤差偵測系統104。在另一實施例中，前饋控制系統112通信耦合至致動器108。在另一實施例中，前饋控制系統112使用位移感測器106接收來自一或多個位移量測之一或多個位移量測值120。 In an embodiment, system 100 includes a feedforward control system 112. In another embodiment, feedforward control system 112 is communicatively coupled to height error detection system 104. In another embodiment, feedforward control system 112 is communicatively coupled to actuator 108. In another embodiment, the feedforward control system 112 receives one or more displacement measurements 120 from one or more displacement measurements using the displacement sensor 106.
在另一實施例中，前饋控制系統112回應於來自一或多個位移量測之經量測之一或多個位移量測值120及來自一或多個高度誤差量測之一或多個高度誤差值118以產生一或多個位移目標122。舉例而言，可藉由將一或多個高度誤差值118增加至一或多個位移值120而產生一或多個位移目標122。 In another embodiment, the feedforward control system 112 responds to one or more displacement measurements 120 from one or more displacement measurements and one or more from one or more height error measurements. Height error values 118 are generated to generate one or more displacement targets 122. For example, one or more displacement targets 122 may be generated by increasing one or more height error values 118 to one or more displacement values 120.
在另一實施例中，前饋控制系統112使用一或多個位移目標122之至少一者致動致動器108以維持基板101之表面實質上處於檢測系統100之一偵測器之一成像平面處。在另一實施例中，前饋控制系統112使用一或多個位移目標122之至少一者致動致動器108以維持檢測系統之照明之一焦點。 In another embodiment, the feedforward control system 112 actuates the actuator 108 using at least one of the one or more displacement targets 122 to maintain the surface of the substrate 101 substantially imaged by one of the detectors of the detection system 100. At the plane. In another embodiment, the feedforward control system 112 actuates the actuator 108 using at least one of the one or more displacement targets 122 to maintain a focus of illumination of the detection system.
圖2繪示根據本發明之藉由與系統100一致之一系統實施之高速高度控制之一例示性操作。針對圖2之資料，用於高度控制迴路之回饋高度控制頻寬係200Hz。 2 illustrates an exemplary operation of high speed altitude control implemented by one of the systems in accordance with the present invention. For the data of Figure 2, the feedback height control bandwidth for the height control loop is 200 Hz.
圖2A描繪基板101之一高度跳動。在所示基板運動速度下之高度跳動係約8,000nm峰間。在藉由回饋控制系統110之200Hz頻寬高度控制之後，殘餘高度誤差118係約175nm峰間，如圖2B中所示。圖2C描繪藉由添加一前饋控制系統112以控制致動器108來跳動之基板101之一進一步經減小殘餘高度誤差118。在此態樣中，前饋控制系統112增加控制速度。圖2C中之殘餘高度誤差118在此實例中係約45nm峰間。 FIG. 2A depicts a high jitter of one of the substrates 101. The height jump at the substrate motion speed is about 8,000 nm peak. After the 200 Hz bandwidth height control by the feedback control system 110, the residual height error 118 is between about 175 nm peaks, as shown in Figure 2B. 2C depicts further reducing the residual height error 118 by adding one of the feedforward control systems 112 to control the actuator 108 to bounce. In this aspect, the feedforward control system 112 increases the control speed. The residual height error 118 in Figure 2C is between about 45 nm peak in this example.
圖3繪示根據本發明之系統100之一高度誤差偵測系統104。在一實施例中，高度誤差偵測系統104包含一基板平台308。在另一實施例中，基板平台308經組態以安置基板306。基板平台308包含此項技術中已知之任何適當機械總成。舉例而言，基板平台103可包含(但不限於)一基板卡盤。 3 illustrates a height error detection system 104 of a system 100 in accordance with the present invention. In one embodiment, the height error detection system 104 includes a substrate platform 308. In another embodiment, the substrate platform 308 is configured to position the substrate 306. Substrate platform 308 includes any suitable mechanical assembly known in the art. For example, the substrate platform 103 can include, but is not limited to, a substrate chuck.
在另一實施例中，高度誤差偵測系統104包含一或多個光源302，其等經組態以產生一選定波長或波長範圍之一光束。在另一實施例中，一或多個光源302包含此項技術中已知之任何窄頻光源。舉例而言，一或多個光源302可包含(但不限於)一或多個雷射(例如，一或多個紅外雷射)或一或多個窄頻LED。藉由另一實例，一或多個光源可包含(但不限於)任何寬頻光源。舉例而言，一或多個光源302可 包含一準直及/或過濾寬頻源。藉由另一實例，一或多個光源302可包含(但不限於)一寬頻譜LED(例如，具有磷光體層之WLED)。藉由另一實例，一或多個光源302可包含(但不限於)一超輻射LED(SLED)。在另一實例中，一或多個光源302經組態以透過一或多個聚焦透鏡304將一光束引導至基板306之表面之一部分。繼而，一或多個聚焦透鏡304經組態以將光自一或多個光源302引導至基板306之表面之至少一部分。 In another embodiment, height error detection system 104 includes one or more light sources 302 that are configured to produce a beam of a selected wavelength or range of wavelengths. In another embodiment, one or more of the light sources 302 comprise any narrow frequency source known in the art. For example, one or more light sources 302 can include, but are not limited to, one or more lasers (eg, one or more infrared lasers) or one or more narrowband LEDs. By way of another example, one or more light sources can include, but are not limited to, any broadband source. For example, one or more light sources 302 can Includes a collimated and/or filtered broadband source. By way of another example, one or more of the light sources 302 can include, but is not limited to, a wide spectrum LED (eg, a WLED with a phosphor layer). By way of another example, one or more of the light sources 302 can include, but is not limited to, a super-radiation LED (SLED). In another example, one or more light sources 302 are configured to direct a beam of light through one or more focusing lenses 304 to a portion of the surface of the substrate 306. In turn, one or more focusing lenses 304 are configured to direct light from one or more light sources 302 to at least a portion of the surface of the substrate 306.
在另一實施例中，高度誤差偵測系統104包含一或多個感測器312。在另一實施例中，一或多個感測器312經組態以監測自基板306之表面反射之光之一或多個特性。舉例而言，一或多個感測器312可量測(但不限於)基板306之表面之一或多個高度誤差值118。在另一實施例中，藉由基板306之一部分反射之光束由一透鏡收集器310收集，被聚焦且引導至感測器312。高度誤差偵測系統104之一或多個感測器312可包含此項技術中已知之能夠偵測由一或多個光源302產生之一光束之任何適當感測器。舉例而言，一或多個感測器312可包含(但不限於)一或多個二元偵測器、一或多個四元偵測器、一或多個線性CCD偵測器、一或多個線性CMOS偵測器或類似者。一旦自基板306之表面接收一反射束，一或多個感測器312便將經接收光轉換為一或多個高度誤差值118。 In another embodiment, the height error detection system 104 includes one or more sensors 312. In another embodiment, one or more sensors 312 are configured to monitor one or more characteristics of light reflected from the surface of substrate 306. For example, one or more of the sensors 312 can measure, but is not limited to, one or more height error values 118 of the surface of the substrate 306. In another embodiment, the light beam partially reflected by one of the substrates 306 is collected by a lens collector 310, focused and directed to the sensor 312. One or more of the sensors 312 of the height error detection system 104 can include any suitable sensor known in the art that is capable of detecting a beam produced by one or more of the light sources 302. For example, one or more sensors 312 can include, but is not limited to, one or more binary detectors, one or more quad detectors, one or more linear CCD detectors, and one Or multiple linear CMOS detectors or the like. Once a reflected beam is received from the surface of the substrate 306, the one or more sensors 312 convert the received light into one or more height error values 118.
在本文中進一步認知，高度誤差偵測系統104可包含任何數目個額外光學元件以實施所述實施例。舉例而言，高度誤差偵測系統104可進一步包含(但不限於)適合於將光束自一或多個光源302引導及/或聚焦至基板306之表面上之一組光學組件。藉由另一實例，高度誤差偵測系統104可包含(但不限於)用於將一光束自基板306之表面收集及/或反射至一或多個感測器312之一部分上之一組光學組件。 It is further appreciated herein that the height error detection system 104 can include any number of additional optical elements to implement the described embodiments. For example, height error detection system 104 can further include, but is not limited to, a set of optical components suitable for directing and/or focusing a light beam from one or more light sources 302 to a surface of substrate 306. By way of another example, height error detection system 104 can include, but is not limited to, a set of optics for collecting and/or reflecting a beam from a surface of substrate 306 to a portion of one or more sensors 312 Component.
在一實施例中，高度誤差偵測系統104包含經組態以量測基板 306之高度誤差值之一控制器314。在另一實施例中，控制器314通信耦合至高度誤差偵測系統104之一或多個感測器312。舉例而言，控制器314可通信耦合至高度誤差偵測系統104之一或多個感測器312之輸出。此外，控制器314可以任何適合方式耦合至一或多個感測器312使得控制器314可接收由高度誤差偵測系統104獲取之輸出。舉例而言，控制器314可經由一有線或無線連接而耦合。 In an embodiment, the height error detection system 104 includes a configuration to measure the substrate One of the height error values of 306 is controller 314. In another embodiment, controller 314 is communicatively coupled to one or more sensors 312 of height error detection system 104. For example, controller 314 can be communicatively coupled to the output of one or more of sensor 312 of height error detection system 104. Moreover, controller 314 can be coupled to one or more sensors 312 in any suitable manner such that controller 314 can receive the output obtained by height error detection system 104. For example, controller 314 can be coupled via a wired or wireless connection.
在一實施例中，控制器314經組態以自一或多個感測器312接收一或多個經監測光特性。舉例而言，控制器314可接收指示基板306之表面之經量測一或多個高度誤差值118之一或多個信號。在此方面，一或多個感測器312可傳輸作為時間之一函數之經量測高度誤差值。 In an embodiment, controller 314 is configured to receive one or more monitored light characteristics from one or more sensors 312. For example, controller 314 can receive one or more signals indicative of one or more height error values 118 indicative of the surface of substrate 306. In this regard, one or more of the sensors 312 can transmit a measured height error value as a function of time.
在一實施例中，控制器314包含一或多個處理器316及一或多個記憶體318。在另一實施例中，控制器314之一或多個記憶體318含有經組態以致使控制器314之一或多個處理器316實施貫穿本方描述之高度誤差量測之一組程式指令。 In one embodiment, controller 314 includes one or more processors 316 and one or more memories 318. In another embodiment, one or more of the memory 318 of the controller 314 includes a set of program instructions configured to cause one or more of the controllers 314 to implement the height error measurement throughout the description. .
在另一實施例中，一或多個記憶體318含有經組態以產生一或多個高度誤差值118之一高度目標116。舉例而言，控制器314可量測基板306之表面之一或多個高度值。在此方面，經量測之一或多個高度值可自經儲存之高度目標116減去以產生一或多個高度誤差值118。在另一實施例中，經產生之一或多個高度誤差值亦儲存於一或多個記憶體318中。 In another embodiment, one or more of the memory 318 includes a height target 116 configured to generate one or more height error values 118. For example, controller 314 can measure one or more height values of the surface of substrate 306. In this aspect, one or more height values may be measured from the stored height target 116 to produce one or more height error values 118. In another embodiment, one or more height error values are also generated in one or more memories 318.
圖4繪示根據本發明之用於在一晶圓檢測系統100內之基板之一表面之高速高度控制之一方法400。應注意，可利用在本文中先前所述之一或多個系統或子系統來實施本發明之方法400，然而，不應將本文中先前所述之多種結構元件及組態解釋為對方法400之限制，此係因為預期可使用其他結構及組態來實施方法400。 4 illustrates a method 400 for high speed height control of a surface of a substrate within a wafer inspection system 100 in accordance with the present invention. It should be noted that the method 400 of the present invention may be implemented using one or more of the systems or subsystems previously described herein, however, the various structural elements and configurations previously described herein should not be construed as a method 400. This limitation is due to the fact that it is contemplated that the method 400 can be implemented using other structures and configurations.
在步驟402中，將一基板101定位於一可動態調整基板平台總成 102之一基板平台103上。在步驟404中，沿著實質上垂直於該基板101之表面之一方向致動該基板101。在步驟406中，使用一高度誤差偵測系統104在該表面之一檢測位置處量測該基板之該表面之一或多個高度誤差值118。在步驟408中，使用一位移感測器106在該基板平台總成102之位置處量測實質上垂直於該基板101之該表面之一或多個位移值120。在步驟410中，自該經量測之一或多個高度誤差值118及該一或多個位移值120產生一或多個位移目標122。在步驟412中，使用該經量測之一或多個高度誤差值118調整該致動器108之一致動狀態以維持該基板表面實質上處於該檢測系統100之一偵測器之一成像平面或該檢測系統之照明之一焦點處。在步驟414中，使用該經產生之一或多個位移目標122調整該致動器108之一致動狀態以維持該基板表面實質上處於該檢測系統100之一偵測器之一成像平面或該檢測系統之照明之一焦點處。在本文中應進一步注意，方法400之步驟之順序不具有限制性，此係因為認知可以任何順序或同時實施檢測及高度調整程序。 In step 402, a substrate 101 is positioned on a dynamically adjustable substrate platform assembly. 102 is on one of the substrate platforms 103. In step 404, the substrate 101 is actuated in a direction substantially perpendicular to one of the surfaces of the substrate 101. In step 406, a height error detection system 104 is used to measure one or more height error values 118 for the surface of the substrate at a detection location of the surface. In step 408, one or more displacement values 120 that are substantially perpendicular to the surface of the substrate 101 are measured at a location of the substrate platform assembly 102 using a displacement sensor 106. In step 410, one or more displacement targets 122 are generated from the measured one or more height error values 118 and the one or more displacement values 120. In step 412, the measured one or more height error values 118 are used to adjust the consistent state of the actuator 108 to maintain the substrate surface substantially at an imaging plane of one of the detectors of the detection system 100. Or one of the focus of the illumination of the detection system. In step 414, the one or more displacement targets 122 are used to adjust the consistent state of the actuator 108 to maintain the substrate surface substantially at an imaging plane of one of the detectors of the detection system 100 or One of the focus of the illumination of the inspection system. It should be further noted herein that the order of the steps of method 400 is not limiting, as the detection can be performed in any order or simultaneously with detection and height adjustment procedures.
圖5繪示根據本發明之在一晶圓檢測系統內之基板一之表面之高速高度控制之系統之另一實施例。在本文中應注意，圖1中描述之組件及實施例可擴展至系統500，除非另有指明。 5 illustrates another embodiment of a system for high speed height control of the surface of a substrate in a wafer inspection system in accordance with the present invention. It should be noted herein that the components and embodiments described in FIG. 1 can be extended to system 500 unless otherwise indicated.
在一實施例中，系統500包含一資料切換器128。在另一實施例中，資料切換器128含有兩個或更多個埠。在另一實施例中，資料切換器128之至少一個埠通信耦合至前饋控制系統112。舉例而言，如圖5中所示，資料切換器128可通過路徑1而通信耦合至前饋控制系統112。藉由另一實例，資料切換器128可通過路徑2而通信耦合至前饋控制系統112。 In an embodiment, system 500 includes a data switcher 128. In another embodiment, the data switcher 128 contains two or more ports. In another embodiment, at least one of the data switchers 128 is communicatively coupled to the feedforward control system 112. For example, as shown in FIG. 5, data switcher 128 can be communicatively coupled to feedforward control system 112 via path 1. By way of another example, data switcher 128 can be communicatively coupled to feedforward control system 112 via path 2.
在一實施例中，系統500包含一軌道單元126。在另一實施例中，軌道單元126經組態以獲取且維持自一或多個高度誤差值118及一 或多個位移值120產生之一或多個位移目標124。在另一實施例中，軌道單元126通過資料切換器128之一或多個埠而通信耦合至前饋控制系統112。舉例而言，軌道單元126可通過資料切換器128之路徑2而通信耦合至前饋控制系統112。在另一實施例中，軌道單元126使用來自一或多個先前軌道之經獲取之一或多個位移目標124作為用於一當前軌道之一或多個位移目標122。此外，當前軌道之一或多個位移目標122可發送至前饋控制系統112。舉例而言，當在一或多個第一掃描常式之後獲取一或多個位移目標124時，切換器128可自路徑1移位至路徑2以利用一或多個先前軌道之一或多個位移目標124作為用於當前軌道之一或多個位移目標122。應注意，沿著一給定基板檢測路徑之當前軌道之一或多個位移目標122與貫穿本發明提及之一或多個先前軌道之一或多個位移目標124幾乎相同。在此方面，一或多個先前軌道之一或多個位移目標124可精確預測當前軌道之一或多個位移目標122，且減小前饋控制系統112之有效相位延遲。 In an embodiment, system 500 includes a track unit 126. In another embodiment, the track unit 126 is configured to acquire and maintain one or more height error values 118 and one Or a plurality of displacement values 120 produce one or more displacement targets 124. In another embodiment, the track unit 126 is communicatively coupled to the feedforward control system 112 via one or more ports of the data switch 128. For example, track unit 126 can be communicatively coupled to feed forward control system 112 via path 2 of data switch 128. In another embodiment, track unit 126 uses one or more displacement targets 124 from one or more previous tracks as one or more displacement targets 122 for a current track. Additionally, one or more displacement targets 122 of the current track may be sent to feed forward control system 112. For example, when one or more displacement targets 124 are acquired after one or more first scanning routines, the switch 128 can be shifted from path 1 to path 2 to utilize one or more of the one or more previous tracks. The displacement targets 124 serve as one or more displacement targets 122 for the current track. It should be noted that one or more of the displacement targets 122 along the current track of a given substrate detection path are nearly identical to one or more of the displacement targets 124 of one or more of the previous tracks referred to herein. In this regard, one or more of the one or more previous tracks may accurately predict one or more of the current targets 122 and reduce the effective phase delay of the feedforward control system 112.
在一實施例中，軌道單元126使用先前軌道之一單一經獲取位移目標124以預測當前軌道之位移目標122。在另一實施例中，軌道單元126獲取兩個或更多個先前軌道之兩個或更多個位移目標124以預測用於前饋控制112之當前軌道之位移目標122。舉例而言，可平均化兩個或更多個先前軌道之經獲取之兩個或更多個位移目標124以預測用於前饋控制系統112之當前軌道之位移目標122。 In an embodiment, the track unit 126 uses a single one of the previous tracks to acquire the displacement target 124 to predict the displacement target 122 of the current track. In another embodiment, the track unit 126 acquires two or more displacement targets 124 of two or more previous tracks to predict the displacement target 122 for the current track of the feedforward control 112. For example, the acquired two or more displacement targets 124 of two or more previous tracks may be averaged to predict the displacement target 122 for the current orbit of the feedforward control system 112.
在一實施例中，系統500之軌道單元126包含經組態以獲取一或多個位移目標之一或多個處理器。在另一實施例中，系統500之軌道單元126包含經組態以維持一或多個位移目標之一或多個記憶體。在另一實施例中，一或多個記憶體經組態以維持一組程式指令以致使一或多個處理器獲取一或多個先前軌道之一或多個位移目標。在另一實施例中，一組程式指令經組態以發送經獲取之一或多個位移目標至前 饋控制系統112以控制致動器。 In an embodiment, track unit 126 of system 500 includes one or more processors configured to acquire one or more displacement targets. In another embodiment, track unit 126 of system 500 includes one or more memories configured to maintain one or more displacement targets. In another embodiment, one or more memories are configured to maintain a set of program instructions to cause one or more processors to acquire one or more displacement targets of one or more previous tracks. In another embodiment, a set of program instructions are configured to transmit one or more displacement targets prior to acquisition The control system 112 is fed to control the actuator.
圖6繪示根據本發明之在一晶圓檢測系統500內之基板之一表面之高速高度控制之一方法600。在本文中應注意，可利用在本文中先前所述之一或多個系統或子系統而實施本發明之方法600，然而，不應將本文中先前所述之多種結構元件及組態解釋為對方法600之限制，此係因為預期可使用其他結構及組態以實施方法600。 6 illustrates one method 600 of high speed height control of a surface of a substrate within a wafer inspection system 500 in accordance with the present invention. It should be noted herein that the method 600 of the present invention can be implemented using one or more of the systems or subsystems previously described herein, however, the various structural elements and configurations previously described herein should not be construed as The limitations of method 600 are due to the fact that other structures and configurations are contemplated to implement method 600.
在步驟602中，將一基板101定位於一可動態調整基板平台總成102之基板平台103上。在步驟604中，沿著實質上垂直於該基板101之該表面之一方向致動該基板101。在步驟606中，使用一高度誤差偵測系統104在該表面之一檢測位置處量測該基板101之該表面之一或多個高度誤差值118。在步驟608中，使用一位移感測器106在該基板平台總成102之位置處量測實質上垂直於該基板101之該表面之一或多個位移值120。在步驟610中，自一或多個先前軌道之一或多個位移目標124產生一或多個位移目標122。在步驟612中，使用該經量測之一或多個高度誤差值118調整致動器108之一致動狀態以維持該基板表面實質上處於該檢測系統100之一偵測器之一成像平面或該檢測系統之照明之一焦點處。在步驟614中，使用該經產生之一或多個位移目標122調整該致動器108之一致動狀態以維持該基板表面實質上處於該檢測系統100之一偵測器之一成像平面或該檢測系統之照明之一焦點處。在本文中應進一步注意，方法600之步驟之順序不具限制性，此係因為認知可以任何順序或同時實施檢測及高度調整程序。 In step 602, a substrate 101 is positioned on a substrate platform 103 that can dynamically adjust the substrate platform assembly 102. In step 604, the substrate 101 is actuated in a direction substantially perpendicular to one of the surfaces of the substrate 101. In step 606, a height error detection system 104 is used to measure one or more height error values 118 for the surface of the substrate 101 at a detection location of the surface. In step 608, one or more displacement values 120 that are substantially perpendicular to the surface of the substrate 101 are measured at a location of the substrate platform assembly 102 using a displacement sensor 106. In step 610, one or more displacement targets 122 are generated from one or more displacement targets 124 of one or more previous tracks. In step 612, the measured one or more height error values 118 are used to adjust the consistent state of the actuator 108 to maintain the substrate surface substantially at one of the imaging planes of one of the detectors of the detection system 100 or One of the illumination points of the illumination of the detection system. In step 614, the one or more displacement targets 122 are used to adjust the consistent state of the actuator 108 to maintain the substrate surface substantially at an imaging plane of one of the detectors of the detection system 100 or One of the focus of the illumination of the inspection system. It should be further noted herein that the order of the steps of method 600 is not limiting, as the detection can be performed in any order or simultaneously with detection and height adjustment procedures.
圖7繪示根據本發明之系統500之一實施例之二維基板循序掃描圖案之一俯視圖。在一實施例中，基板101之掃描包含二維可變半徑/可變角度掃描。舉例而言，基板101之掃描可包含形成此項技術中已知之任何掃描圖案之二維掃描圖案700。 7 is a top plan view of a two-dimensional substrate sequential scan pattern in accordance with an embodiment of the system 500 of the present invention. In an embodiment, the scanning of substrate 101 comprises a two-dimensional variable radius/variable angle scan. For example, scanning of substrate 101 can include a two-dimensional scan pattern 700 that forms any of the scan patterns known in the art.
舉例而言，如圖7中所示，二維掃描圖案700可包含一螺旋圖 案。在一實施例中，自一晶圓之中心至該晶圓之邊緣或替代地，自該晶圓之邊緣至該晶圓之中心掃描螺旋圖案700。在另一實施例中，沿著一當前軌道702之位移目標非常接近沿著先前軌道704之位移目標。在另一實施例中，先前軌道704之位移目標用於預測當前軌道706。在另一實施例中，獲取且使用沿著先前軌道704及706之兩個或更多個位移目標以產生當前軌道702之位移目標。舉例而言，獲取且平均化沿著先前軌道704及706之兩個或更多個位移目標以用作當前軌道702之位移目標。 For example, as shown in FIG. 7, the two-dimensional scanning pattern 700 may include a spiral pattern. case. In one embodiment, the spiral pattern 700 is scanned from the edge of the wafer to the edge of the wafer or alternatively from the edge of the wafer to the center of the wafer. In another embodiment, the displacement target along a current track 702 is very close to the displacement target along the previous track 704. In another embodiment, the displacement target of the previous track 704 is used to predict the current track 706. In another embodiment, two or more displacement targets along the previous tracks 704 and 706 are acquired and used to generate a displacement target for the current track 702. For example, two or more displacement targets along the previous tracks 704 and 706 are acquired and averaged to serve as the displacement target for the current track 702.
熟習此項技術者將認知此項技術之狀態至以本文中提到之方式描述之系統及方法，且其後使用工程實踐以將此等所描述之系統及方法整合為高速晶圓檢測系統。即，可經由一合理數量之試驗將本文中描述之系統及方法之至少一部分整合為一高速晶圓檢測系統。可利用任何適合可市售組件(諸如在晶圓檢測及/或自動聚焦系統中通常找到之組件)實施一典型高速晶圓檢測系統。 Those skilled in the art will recognize the state of the art to systems and methods described in the manner described herein, and thereafter use engineering practice to integrate such systems and methods as a high speed wafer inspection system. That is, at least a portion of the systems and methods described herein can be integrated into a high speed wafer inspection system via a reasonable number of tests. A typical high speed wafer inspection system can be implemented using any suitable component that is commercially available, such as those typically found in wafer inspection and/or autofocus systems.
在一些實施例中，本文中所述之系統(及以下方法)之多種步驟、功能及/或操作可藉由以下之一或多者實施：電子電路、邏輯閘、多工器、可程式化邏輯裝置、ASIC、類比或數位控制件/切換器、微控制器或計算系統。控制器可包含(但不限於)一個人計算系統、大型機計算系統、工作站、影像電腦、並行處理器或此項技術中已知之任何其他裝置。一般而言，術語「計算系統」經寬泛定義以涵蓋具有執行來自一載體媒體或記憶體之指令之一或多個處理器之任何裝置。實施方法(諸如本文中所述之彼等方法)之程式指令可經由載體媒體傳輸或儲存於載體媒體上。載體媒體可包含一儲存媒體，諸如一唯讀記憶體、一隨機存取記憶體、一磁碟或光碟、一非揮發性記憶體、一固態記憶體、一磁帶及類似者。一載體媒體可包含一傳輸媒體，諸如一導線、電纜或無線傳輸鏈路。 In some embodiments, various steps, functions, and/or operations of the systems (and methods described herein) may be implemented by one or more of the following: electronic circuits, logic gates, multiplexers, and stylized Logic device, ASIC, analog or digital control/switcher, microcontroller or computing system. The controller can include, but is not limited to, a personal computing system, a mainframe computing system, a workstation, an imaging computer, a parallel processor, or any other device known in the art. In general, the term "computing system" is broadly defined to encompass any device having one or more processors that execute instructions from a carrier medium or memory. Program instructions for implementing methods, such as those described herein, may be transmitted or stored on a carrier medium via a carrier medium. The carrier medium can include a storage medium such as a read only memory, a random access memory, a magnetic or optical disk, a non-volatile memory, a solid state memory, a magnetic tape, and the like. A carrier medium can include a transmission medium such as a wire, cable or wireless transmission link.
應認知，可藉由一單一控制器(或電腦系統)或替代地多個控制器(或多個電腦系統)實施貫穿本發明描述之多種步驟。此外，系統之不同子系統可包含適合於實施上文所述之步驟之至少一部分之一或多個計算或邏輯系統。因此，不應將上述描述解釋為對本發明之一限制而僅作為闡釋。此外，控制器可經組態以執行本文中描述之任何方法實施例之任何其他(若干)步驟。 It will be appreciated that the various steps described throughout this disclosure may be implemented by a single controller (or computer system) or alternatively multiple controllers (or multiple computer systems). Moreover, different subsystems of the system can include one or more computing or logic systems suitable for implementing at least a portion of the steps described above. Therefore, the above description should not be taken as limiting of the invention. Moreover, the controller can be configured to perform any other (several) steps of any of the method embodiments described herein.
熟習此項技術者將瞭解，存在多種載具，可藉由此等載具實施本文中所述之程序及/或系統及/或其他技術(例如，硬體、軟體及/或韌體)，且較佳載具將隨其中部署程序及/或系統及/或其他技術之背景而變動。 Those skilled in the art will appreciate that there are a variety of vehicles by which the programs and/or systems and/or other techniques (e.g., hardware, software, and/or firmware) described herein can be implemented. The preferred carrier will vary depending on the context in which the program and/or system and/or other technology is deployed.
本文中所述之全部方法可包含將方法實施例之一或多個步驟之結果儲存於一儲存媒體中。該等結果可包含本文中所述之結果之任何者且可以此項技術中已知之任何方式儲存。儲存媒體可包含本文中所述之任何儲存媒體或此項技術中已知之任何其他適合儲存媒體。在儲存結果之後，結果可在儲存媒體中存取且可由本文中所述之任何方法或系統實施例使用，經格式化以向一使用者顯示，由另一軟體模組、方法或系統等使用。此外，該等結果可「永久」、「半永久」、暫時儲存或儲存某一時間段。舉例而言，儲存媒體可係隨機存取記憶體(RAM)，且該等結果不必須無限期留存於儲存媒體中。 All of the methods described herein can include storing the results of one or more of the method embodiments in a storage medium. These results can include any of the results described herein and can be stored in any manner known in the art. The storage medium may include any of the storage media described herein or any other suitable storage medium known in the art. After storing the results, the results can be accessed in a storage medium and can be used by any of the methods or system embodiments described herein, formatted for display to a user, used by another software module, method or system, etc. . In addition, such results may be "permanently", "semi-permanent", temporarily stored or stored for a certain period of time. For example, the storage medium may be a random access memory (RAM) and the results do not have to remain in the storage medium indefinitely.
熟習此項技術者將認知，以本文中提到之方式描述裝置及/或程序且其後使用工程實踐以將此等描述之裝置及/或程序整合為資料處理系統在此項技術內係常見的。即，可經由一合理數量之試驗將本文中描述之裝置及/或程序之至少一部分整合為一資料處理系統。熟習此項技術者將認知，一典型資料處理系統通常包含一系統單元外殼、一顯示裝置、諸如揮發性或非揮發性記憶體之一記憶體、諸如微處理器及數位信號處理器之處理器、諸如操作系統、驅動器、圖形使用者 介面及應用程式之計算實體、諸如一觸控墊或觸控螢幕之一或多個互動裝置及/或包含回饋迴路及控制馬達(例如，用於感測位置及/或速度之回饋；用於移動及/或調整組件及/或數量之控制馬達)之控制系統。可利用任何適合可市售組件(諸如在資料計算/通信及/或網路計算/通通信系統中通常找到之組件)實施一典型資料處理系統。 Those skilled in the art will recognize that the devices and/or procedures are described in the manner described herein and thereafter the use of engineering practice to integrate such described devices and/or procedures into a data processing system is common within the art. of. That is, at least a portion of the devices and/or procedures described herein can be integrated into a data processing system via a reasonable number of tests. Those skilled in the art will recognize that a typical data processing system typically includes a system unit housing, a display device, a memory such as a volatile or non-volatile memory, a processor such as a microprocessor and a digital signal processor. , such as operating systems, drives, graphical users a computing entity of the interface and application, such as one or more interactive devices of a touch pad or touch screen and/or a feedback loop and a control motor (eg, for sensing position and/or speed feedback; A control system that moves and/or adjusts components and/or quantities of control motors. A typical data processing system can be implemented using any suitable component that is commercially available, such as those typically found in data computing/communication and/or network computing/communication systems.
雖然已繪示本發明之特定實施例，但應瞭解，熟習此項技術者可作出本發明之多種修改及實施例而不脫離前述揭示內容之範疇及精神。因此，本發明之範疇僅由隨附申請專利範圍限制。 While the invention has been described with respect to the specific embodiments of the present invention, it will be understood that Accordingly, the scope of the invention is limited only by the scope of the accompanying claims.
100‧‧‧檢測系統/系統 100‧‧‧Detection system/system
101‧‧‧基板平台總成/基板 101‧‧‧Substrate platform assembly/substrate
102‧‧‧基板平台總成/基板總成 102‧‧‧Substrate platform assembly/substrate assembly
103‧‧‧基板平台 103‧‧‧Base platform
104‧‧‧高度誤差偵測系統 104‧‧‧High Error Detection System
105‧‧‧底盤 105‧‧‧Chassis
106‧‧‧位移感測器 106‧‧‧ Displacement Sensor
108‧‧‧致動器 108‧‧‧Actuator
110‧‧‧回饋控制系統/回饋系統 110‧‧‧Feedback Control System/Feedback System
112‧‧‧前饋控制系統 112‧‧‧Feed-for-feed control system
114‧‧‧光學感測器 114‧‧‧ Optical Sensor
116‧‧‧高度目標 116‧‧‧High target
118‧‧‧高度誤差值/高度誤差信號 118‧‧‧ Height error value/height error signal
120‧‧‧位移值/位移量測值 120‧‧‧ Displacement/displacement measurement
122‧‧‧位移目標 122‧‧‧ Displacement target
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