TWI606984B - Method for cutting glass workpiece - Google Patents
Method for cutting glass workpiece Download PDFInfo
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- TWI606984B TWI606984B TW105121653A TW105121653A TWI606984B TW I606984 B TWI606984 B TW I606984B TW 105121653 A TW105121653 A TW 105121653A TW 105121653 A TW105121653 A TW 105121653A TW I606984 B TWI606984 B TW I606984B
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- glass workpiece
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- cut surface
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- cutting
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
Description
本發明揭示一種玻璃加工物切割方法，且揭示一種利用雷射束切割玻璃加工物，強化玻璃加工物的切割面的技術。The invention discloses a method for cutting a glass workpiece, and discloses a technique for cutting a glass workpiece by using a laser beam to strengthen a cut surface of the glass workpiece.
薄板玻璃的加工及成形自普通製品至保護作為尖端精密製品的顯示裝置的畫面的面板等在整個產業內較為廣泛。可於智慧型手機或與其相似的便攜設備的罩蓋玻璃中常用上述薄板玻璃，需根據應用的製品切割薄板玻璃。The processing and molding of thin-plate glass is widely used in the entire industry from ordinary products to panels for protecting the screen of a display device as a sophisticated product. The above-mentioned thin plate glass can be commonly used in a cover glass of a smart phone or a portable device similar thereto, and the thin plate glass is cut according to the applied product.
薄板玻璃的切割大致可應用機械方式及雷射加工方式。機械方式是利用切割輪切割薄板玻璃，於該情形時，具有難以將玻璃的切割面形狀製成曲面的缺點。並且，若利用雷射切割薄板玻璃，則具有切割面的表面粗糙度值較高，切割面易於破損的缺點。The cutting of thin glass can be roughly applied by mechanical means and laser processing. The mechanical method is to cut the thin plate glass by the cutting wheel, and in this case, it has a drawback that it is difficult to make the shape of the cut surface of the glass into a curved surface. Further, when the thin plate glass is cut by laser, the surface roughness value of the cut surface is high, and the cut surface is easily broken.
[發明欲解決的課題][Question to be solved by the invention]
本發明提供一種用以解決上述問題的玻璃加工物切割方法。 [解決課題的手段]The present invention provides a glass workpiece cutting method for solving the above problems. [Means for solving the problem]
於一觀點中， 提供一種玻璃加工物切割方法，其是利用雷射束者，上述玻璃加工物切割方法包括如下步驟： 藉由向上述玻璃加工物照射第一雷射束而切割玻璃加工物的步驟；及 藉由向上述玻璃加工物的切割面照射第二雷射束而對上述玻璃加工物的切割面進行加工的步驟；且 上述第一雷射束與第二雷射束的波長不同。In one aspect, a glass workpiece cutting method is provided, which utilizes a laser beam, the glass workpiece cutting method comprising the steps of: cutting a glass workpiece by irradiating the glass workpiece with a first laser beam; And a step of processing the cut surface of the glass workpiece by irradiating the cut surface of the glass workpiece with a second laser beam; and the wavelengths of the first laser beam and the second laser beam are different.
上述第一雷射束的波長可為1030 nm至1080 nm。The first laser beam may have a wavelength of 1030 nm to 1080 nm.
上述第二雷射束的波長可為9.4 μm至10.6 μm。The second laser beam may have a wavelength of 9.4 μm to 10.6 μm.
於對上述玻璃加工物的切割面進行加工的步驟中，可向上述玻璃加工物的切割面照射上述第二雷射束2秒至3秒。In the step of processing the cut surface of the glass workpiece, the second laser beam may be irradiated onto the cut surface of the glass workpiece for 2 seconds to 3 seconds.
於切割上述玻璃加工物的步驟中，可沿曲線照射上述第一雷射束，以便上述玻璃加工物的切割面成為曲面。In the step of cutting the glass workpiece, the first laser beam may be irradiated along a curved line so that the cut surface of the glass workpiece becomes a curved surface.
上述第一雷射束可為具有100 ps至1 fs的脈寬的脈衝雷射束。The first laser beam described above may be a pulsed laser beam having a pulse width of 100 ps to 1 fs.
於另一觀點中， 提供一種玻璃加工物切割裝置，其是利用雷射束者，上述玻璃加工物切割裝置包括： 第一光源，其藉由向上述玻璃加工物照射第一雷射束而切割玻璃加工物；及 第二光源，其藉由向上述玻璃加工物的切割面照射第二雷射束而對上述玻璃加工物的切割面進行加工。In another aspect, a glass workpiece cutting apparatus is provided that utilizes a laser beam cutting apparatus, the glass workpiece cutting apparatus comprising: a first light source that is cut by irradiating the glass workpiece with a first laser beam a glass processed product; and a second light source that processes the cut surface of the glass processed product by irradiating a second laser beam to the cut surface of the glass processed product.
上述第一雷射束的波長可為1030 nm至1080 nm。The first laser beam may have a wavelength of 1030 nm to 1080 nm.
上述第二雷射束的波長可為9.4 μm至10.6 μm。The second laser beam may have a wavelength of 9.4 μm to 10.6 μm.
上述第二光源可為CO2 雷射光源。The second light source may be a CO 2 laser light source.
上述第一雷射束可為具有100 ps至1 fs的脈寬的脈衝雷射束。 [發明效果]The first laser beam described above may be a pulsed laser beam having a pulse width of 100 ps to 1 fs. [Effect of the invention]
根據例示性的實施例，自光源照射的雷射束可變為強度分佈幾乎均勻的線光束而提高雷射加工的品質。According to an exemplary embodiment, the laser beam irradiated from the light source can be changed to a line beam having an almost uniform intensity distribution to improve the quality of the laser processing.
於以下圖式中，相同的參照符號代表相同的構成要素，於圖式中，為了說明的明確性及便利性，可誇張表示各構成要素的尺寸。另一方面，以下所說明的實施例僅為示例，可根據這些實施例實現各種變形。In the following drawings, the same reference numerals denote the same constituent elements, and in the drawings, the dimensions of the respective constituent elements may be exaggerated for clarity and convenience of explanation. On the other hand, the embodiments described below are merely examples, and various modifications can be made according to the embodiments.
第1、第2等用語可用於說明各種構成要素，但構成要素不應受用語的限定。用語僅以自其他構成要素區分一個構成要素為目的而使用。Terms such as the first and second terms can be used to describe various constituent elements, but the constituent elements should not be limited by the terms. The term is used only for the purpose of distinguishing one component from other components.
只要未於文中明確地表示其他含義，則單數的表達包括複數的表達。並且，於記載為某個部分“包括”某個構成要素時，只要無特別相反的記載，則意味著可更包括其他構成要素，而並非是指排除其他構成要素。As long as the other meanings are not explicitly indicated in the text, the singular expression includes the plural expression. In addition, when a part is "included" as a certain component, unless otherwise indicated, it means that it may include other components, and does not mean that other components are excluded.
並且，說明書中所記載的“…部”、“模組”等用語是指對至少一個功能或動作進行處理的單位。Further, terms such as "parts" and "modules" described in the specification refer to units that process at least one function or operation.
圖1是例示性的實施例的玻璃加工物切割方法的流程圖。並且，圖2是概略性地表示用以實施圖1所示的玻璃加工物切割方法的玻璃加工物切割裝置的情況的圖。1 is a flow chart of a glass workpiece cutting method of an exemplary embodiment. 2 is a view schematically showing a state of a glass workpiece cutting device for carrying out the glass workpiece cutting method shown in FIG. 1.
參照圖1及圖2，例示性的實施例的玻璃加工物切割方法可包括藉由向玻璃加工物10照射第一雷射束而切割玻璃加工物10的步驟S110。玻璃加工物10可包括薄板玻璃、玻璃板等。玻璃加工物10的切割形狀及尺寸可根據使用玻璃加工物10的製品的種類而不同。切割及加工而成的玻璃加工物10可使用於行動電話的罩蓋玻璃或顯示裝置的面板等。Referring to FIGS. 1 and 2, the glass workpiece cutting method of the exemplary embodiment may include a step S110 of cutting the glass workpiece 10 by irradiating the glass workpiece 10 with the first laser beam. The glass workpiece 10 may include a thin plate glass, a glass plate, or the like. The cutting shape and size of the glass workpiece 10 may vary depending on the type of the product using the glass workpiece 10. The cut and processed glass workpiece 10 can be used for a cover glass for a mobile phone, a panel of a display device, or the like.
於切割玻璃加工物10的步驟S110中，可利用玻璃加工物切割裝置的第一光源110a。第一光源110a可射出具有1030 nm至1080 nm的波長的第一雷射束。此種第一光源110a可例示性地由摻釹釔鋁石榴石（neodymium-doped yttrium aluminium garnet，Nd:YAG；Nd:Y3 Al5 O12 ）雷射實現，但實施例並不限制於此。第一光源110a可藉由向玻璃加工物10照射第一雷射束而切割玻璃加工物10。如圖2所示，可於第一光源110a與玻璃加工物10之間設置第1光束傳輸光學系統。第1光束傳輸光學系統可調節自第一光源110a出射的第一雷射束的光束尺寸、及第一雷射束照射至玻璃加工物10的位置。並且，第1光束傳輸光學系統可包括將第一雷射束聚焦至玻璃加工物10上的第1聚光單元120a。圖2所示的第1光束傳輸光學系統的構成僅為示例，可包括於第1光束傳輸光學系統的光學裝置的構成及個數可不同。In step S110 of cutting the glass workpiece 10, the first light source 110a of the glass workpiece cutting device can be utilized. The first light source 110a may emit a first laser beam having a wavelength of 1030 nm to 1080 nm. Such a first light source 110a can be exemplarily implemented by a neodymium-doped yttrium aluminium garnet (Nd:YAG; Nd:Y 3 Al 5 O 12 ) laser, but the embodiment is not limited thereto. . The first light source 110a can cut the glass workpiece 10 by irradiating the glass workpiece 10 with a first laser beam. As shown in FIG. 2, a first light beam transmission optical system can be disposed between the first light source 110a and the glass workpiece 10. The first beam transmitting optical system can adjust the beam size of the first laser beam emitted from the first light source 110a and the position at which the first laser beam is irradiated to the glass workpiece 10. Also, the first beam transmitting optical system may include a first light collecting unit 120a that focuses the first laser beam onto the glass workpiece 10. The configuration of the first light beam transmission optical system shown in FIG. 2 is merely an example, and the configuration and the number of optical devices that can be included in the first light beam transmission optical system may be different.
並且，自第一光源射出的第一雷射束可為超短脈衝雷射或極超短脈衝雷射。即，脈衝雷射的脈寬可為皮秒（ps，pico second，10-12 second，超短）至飛秒（femto second，10-15 second，極超短）。並且，可根據作為加工對象的玻璃加工物的厚度及特性，以具有數百皮秒至飛秒的範圍的方式選擇第一雷射束的脈寬。更佳為，亦能夠以成為1 ps至1 fs的方式進行選擇。於具有超短脈寬或極超短脈寬的脈衝雷射的情形時，可傳輸高效率的能量而光滑地加工切割面。並且，於利用具有超短脈寬或極超短脈寬的雷射束對玻璃加工物進行加工的情形時，僅對加工區域及鄰接於加工區域的部分產生影響，從而亦可對之後可能進行的追加加工提供耐久性。於切割玻璃加工物的步驟S110中，可將玻璃加工物切割成各種形狀。於切割玻璃加工物的步驟S110中，利用第一雷射束切割玻璃加工物10，因此玻璃加工物10的切割形狀可不受限。Moreover, the first laser beam emitted from the first light source may be an ultrashort pulse laser or a very ultrashort pulse laser. That is, the pulse width of the pulsed laser can be picosecond (ps, pico second, 10 -12 second, ultra short) to femto second (10 -15 second, very short). Further, the pulse width of the first laser beam can be selected in a range of several hundred picoseconds to femtoseconds depending on the thickness and characteristics of the glass workpiece to be processed. More preferably, it can be selected in a manner of from 1 ps to 1 fs. In the case of a pulsed laser having an ultra-short pulse width or an extremely short pulse width, high-efficiency energy can be transmitted to smoothly process the cut surface. Moreover, in the case of processing a glass workpiece by using a laser beam having an ultra-short pulse width or an ultra-short pulse width, it only affects the processing region and the portion adjacent to the processing region, and may also be possible later. Additional processing provides durability. In step S110 of cutting the glass workpiece, the glass workpiece can be cut into various shapes. In the step S110 of cutting the glass workpiece, the glass workpiece 10 is cut by the first laser beam, and thus the cutting shape of the glass workpiece 10 is not limited.
圖3是例示性地表示於切割玻璃加工物的步驟S110中切割出的玻璃加工物10的切割面S1的圖。FIG. 3 is a view exemplarily showing the cut surface S1 of the glass workpiece 10 cut in the step S110 of cutting the glass workpiece.
參照圖3，於切割玻璃加工物的步驟S110中，可使玻璃加工物10的切割面S2成為曲面。為此，第一光源110a可於玻璃加工物10上沿曲線將第一雷射束照射至玻璃加工物10。Referring to Fig. 3, in step S110 of cutting the glass workpiece, the cut surface S2 of the glass workpiece 10 can be made into a curved surface. To this end, the first light source 110a can illuminate the first laser beam onto the glass workpiece 10 along the curve to the glass workpiece 10.
圖4是表示於切割玻璃加工物的步驟S110中切割出的玻璃加工物10的切割面S1的另一例的圖。FIG. 4 is a view showing another example of the cut surface S1 of the glass workpiece 10 cut in the step S110 of cutting the glass workpiece.
參照圖4，於切割玻璃加工物的步驟S110中，可使玻璃加工物10的切割面S1成為平面。為此，第一光源110a可於玻璃加工物10上沿直線將第一雷射束照射至玻璃加工物10。Referring to Fig. 4, in step S110 of cutting the glass workpiece, the cut surface S1 of the glass workpiece 10 can be made flat. To this end, the first light source 110a can illuminate the first laser beam onto the glass workpiece 10 in a straight line to the glass workpiece 10.
如圖3及圖4所示，若利用第一光源110a的第一雷射束切割玻璃加工物10，則可使玻璃加工物10的切割面形狀實現各種變形。即，與利用切割輪的機械切割方式不同，玻璃加工物10的切割形狀的變形可不受限。藉此，可容易地根據應用玻璃加工物10的製品而改變玻璃加工物10的加工形狀。As shown in FIGS. 3 and 4, when the glass workpiece 10 is cut by the first laser beam of the first light source 110a, the shape of the cut surface of the glass workpiece 10 can be variously deformed. That is, unlike the mechanical cutting method using the cutting wheel, the deformation of the cutting shape of the glass workpiece 10 is not limited. Thereby, the processed shape of the glass workpiece 10 can be easily changed depending on the product to which the glass workpiece 10 is applied.
於利用第一光源110a切割玻璃加工物10時，玻璃加工物的切割面S1、S2的表面粗糙度值（Roughness Average：Ra）會較高。圖5是表示圖4所示的玻璃加工物10的切割面S1的表面粗糙度的圖。When the glass workpiece 10 is cut by the first light source 110a, the surface roughness values (Roughness Average: Ra) of the cut surfaces S1 and S2 of the glass workpiece are high. FIG. 5 is a view showing the surface roughness of the cut surface S1 of the glass workpiece 10 shown in FIG. 4 .
參照圖5，可知於利用第一雷射束切割玻璃加工物10時，玻璃加工物10的切割面並不光滑。若玻璃加工物10的切割面的表面粗糙度值較高，則有於其他加工製程中破損之虞，且會不易與其他零件結合。為此，需對利用第一雷射束切割出的玻璃加工物10的切割面S1、S2進行加工。Referring to Fig. 5, it is understood that when the glass workpiece 10 is cut by the first laser beam, the cut surface of the glass workpiece 10 is not smooth. If the surface roughness value of the cut surface of the glass workpiece 10 is high, it may be damaged in other processing processes, and it may be difficult to bond with other parts. To this end, the cut faces S1, S2 of the glass workpiece 10 cut by the first laser beam are processed.
作為對玻璃加工物10的切割面S1、S2進行加工的例，有利用倒角設備對玻璃加工物10的切割面實施倒角製程的方法。然而，於實施倒角製程的情形時，會為了設置倒角設備而需要更多的費用、時間及倒角設備的設置空間。並且，有因倒角製程中產生的粉塵等而污染作業環境之虞，且具有如下缺點：為了去除欲進行倒角製程而塗佈至玻璃加工物10的切削油，需要另外的清洗製程。另外，於倒角製程中，玻璃加工物10會破損，從而亦會使產率下降。As an example of processing the cut surfaces S1 and S2 of the glass workpiece 10, there is a method of chamfering the cut surface of the glass workpiece 10 by a chamfering apparatus. However, in the case of implementing a chamfering process, more cost, time, and installation space of the chamfering device are required for setting the chamfering device. Further, there is a problem that the working environment is contaminated by dust or the like generated in the chamfering process, and there is a disadvantage that an additional cleaning process is required in order to remove the cutting oil applied to the glass workpiece 10 to be subjected to the chamfering process. In addition, in the chamfering process, the glass workpiece 10 is broken, which also causes a decrease in the yield.
為了不經由上述倒角製程而對玻璃加工物10的切割面進行加工，例示性的實施例的玻璃加工物切割方法可利用第二雷射束對玻璃加工物10的切割面進行加工。In order to process the cut surface of the glass workpiece 10 without the chamfering process described above, the glass workpiece cutting method of the exemplary embodiment can process the cut surface of the glass workpiece 10 using the second laser beam.
再次參照圖1及圖2，例示性的實施例的玻璃加工物切割方法可包括藉由向玻璃加工物10的切割面照射第二雷射束而對玻璃加工物10的切割面進行加工的步驟S120。於對玻璃加工物10的切割面進行加工的步驟S120中，因第二雷射束而於玻璃加工物10發生熱反應，藉此玻璃加工物10的切割面的表面會變光滑。並且，可強化玻璃加工物10的切割面的拉伸強度。Referring again to FIGS. 1 and 2, the glass workpiece cutting method of the exemplary embodiment may include the step of processing the cut surface of the glass workpiece 10 by irradiating the cut surface of the glass workpiece 10 with the second laser beam. S120. In the step S120 of processing the cut surface of the glass workpiece 10, the glass workpiece 10 is thermally reacted by the second laser beam, whereby the surface of the cut surface of the glass workpiece 10 is smoothed. Further, the tensile strength of the cut surface of the glass workpiece 10 can be strengthened.
於對玻璃加工物10的切割面進行加工的步驟S120中，可利用玻璃加工物切割裝置的第二光源110b。自第二光源110b出射的第二雷射束可具有與自第一光源110a出射的第一雷射束不同的波長。第一雷射束可具有適於切斷玻璃加工物10所包括的化合物的結合關係而切割玻璃加工物10的波長。相反地，第二雷射束可具有可於玻璃加工物10的切割面引起熱反應的波長。因此，第二雷射束可具有與第一雷射束不同的波長。In step S120 of processing the cut surface of the glass workpiece 10, the second light source 110b of the glass workpiece cutting device can be utilized. The second laser beam emerging from the second light source 110b may have a different wavelength than the first laser beam emitted from the first light source 110a. The first laser beam may have a wavelength suitable for cutting the bonding relationship of the compounds included in the glass workpiece 10 to cut the glass workpiece 10. Conversely, the second laser beam can have a wavelength that can cause a thermal reaction at the cut surface of the glass workpiece 10. Thus, the second laser beam can have a different wavelength than the first laser beam.
自第二光源110b出射的第二雷射束的波長例示性地大致可為9.4 μm至10.6 μm。若第二雷射束的波長具有上述波長範圍內的值，則可藉由第二雷射束而於玻璃加工物10的切割面的表面引起熱反應。另外，會因上述熱反應而玻璃加工物的切割面變光滑，切割面的拉伸強度變強。The wavelength of the second laser beam emitted from the second light source 110b is illustratively approximately 9.4 μm to 10.6 μm. If the wavelength of the second laser beam has a value within the above wavelength range, a thermal reaction can be induced on the surface of the cut surface of the glass workpiece 10 by the second laser beam. Further, the cut surface of the glass processed product becomes smooth due to the above thermal reaction, and the tensile strength of the cut surface becomes strong.
為了滿足上述第二雷射束的波長範圍，第二光源110b例示性地可為CO2 雷射光源。使第二光源110b與第一光源110a藉由不同的介質出射雷射束，藉此第一雷射束與第二雷射束的波長會不同。In order to satisfy the wavelength range of the second laser beam described above, the second light source 110b is illustratively a CO 2 laser light source. The second light source 110b and the first light source 110a are caused to emit a laser beam by a different medium, whereby the wavelengths of the first laser beam and the second laser beam are different.
如圖2所示，可於第二光源110b與玻璃加工物10之間設置第2光束傳輸光學系統。第2光束傳輸光學系統可調節自第二光源110b出射的第二雷射束的光束尺寸、及第二雷射束照射至玻璃加工物10的位置。並且，第2光束傳輸光學系統可包括將第二雷射束聚焦至玻璃加工物10上的第2聚光單元120b。圖2所示的第2光束傳輸光學系統的構成僅為示例，可包括於第2光束傳輸光學系統的光學裝置的構成及個數可不同。As shown in FIG. 2, a second light beam transmission optical system can be disposed between the second light source 110b and the glass workpiece 10. The second beam transmitting optical system can adjust the beam size of the second laser beam emitted from the second light source 110b and the position at which the second laser beam is irradiated to the glass workpiece 10. Also, the second beam transmitting optical system may include a second concentrating unit 120b that focuses the second laser beam onto the glass workpiece 10. The configuration of the second light beam transmission optical system shown in FIG. 2 is merely an example, and the configuration and the number of optical devices that can be included in the second light beam transmission optical system may be different.
圖6是表示向圖5所示的玻璃加工物10的切割面照射第二雷射束的情形時的切割面形狀的變化的圖。FIG. 6 is a view showing a change in the shape of the cut surface when the second laser beam is irradiated onto the cut surface of the glass workpiece 10 shown in FIG. 5.
參照圖6，自第二光源110b向玻璃加工物10的切割面S1照射第二雷射束，藉此玻璃加工物10的切割面S1的表面會發生變化。玻璃加工物10的切割面S1的表面會根據照射第二雷射束的方向及照射時間而發生變化。然而，若過長時間地向玻璃加工物10照射第二雷射束，則會使玻璃加工物的物性發生變化或玻璃加工物10的切割面形狀變得不可控制。因此，向玻璃加工物10的切割面照射第二雷射束的時間可調節為大致2秒至3秒左右。並且，第二雷射束的輸出功率可保持為大致500 W以上。Referring to Fig. 6, the second laser beam is irradiated from the second light source 110b to the cut surface S1 of the glass workpiece 10, whereby the surface of the cut surface S1 of the glass workpiece 10 changes. The surface of the cut surface S1 of the glass workpiece 10 changes depending on the direction in which the second laser beam is irradiated and the irradiation time. However, if the second laser beam is irradiated to the glass workpiece 10 for a long period of time, the physical properties of the glass workpiece are changed or the shape of the cut surface of the glass workpiece 10 is uncontrollable. Therefore, the time for irradiating the cut surface of the glass workpiece 10 with the second laser beam can be adjusted to be approximately 2 seconds to 3 seconds. Also, the output power of the second laser beam can be maintained at approximately 500 W or more.
如圖6所示，根據第二雷射束的照射量及照射方向，玻璃加工物10的切割面S1可如第1切割面S3般變成曲面，亦可如第2切割面S4般變成平面。圖6所示的切割面形狀的變化例僅為示例，實施例並不限制於此。As shown in FIG. 6, the cut surface S1 of the glass workpiece 10 can be curved like the first cut surface S3 according to the irradiation amount and the irradiation direction of the second laser beam, and can be flat as the second cut surface S4. The variation of the shape of the cut surface shown in Fig. 6 is merely an example, and the embodiment is not limited thereto.
圖7及圖8是表示圖6所示的玻璃加工物10的切割面因第二雷射束而發生變化的例的圖。FIG. 7 and FIG. 8 are views showing an example in which the cut surface of the glass workpiece 10 shown in FIG. 6 is changed by the second laser beam.
參照圖7，玻璃加工物10的切割面S3可成為曲面。並且，玻璃加工物10的切割面S3的表面粗糙度值會變小。另外，參照圖8，玻璃加工物10的切割面S4可成為平面。並且，玻璃加工物10的切割面S4的表面粗糙度值會變小。如圖7及圖8所示，若自包括CO2 雷射的第二光源110b向玻璃加工物10的切割面照射第二雷射束，則玻璃加工物10的切割面S3、S4的表面粗糙度值會變小。不僅如此，玻璃加工物10的切割面S3、S4的拉伸強度會變強。Referring to Fig. 7, the cut surface S3 of the glass workpiece 10 may be a curved surface. Further, the surface roughness value of the cut surface S3 of the glass workpiece 10 becomes small. Further, referring to Fig. 8, the cut surface S4 of the glass workpiece 10 may be a flat surface. Further, the surface roughness value of the cut surface S4 of the glass workpiece 10 becomes small. As shown in FIGS. 7 and 8, when the second laser beam 110b including the CO 2 laser is irradiated to the cut surface of the glass workpiece 10, the surface of the cut surface S3, S4 of the glass workpiece 10 is rough. The degree will become smaller. Moreover, the tensile strength of the cut surfaces S3 and S4 of the glass workpiece 10 becomes strong.
以上，參照圖1至圖8，對例示性的實施例的玻璃加工物切割方法及裝置進行了說明。根據實施例，於利用第一雷射束切割玻璃加工物10後，可利用波長不同於第一雷射束的第二雷射束對玻璃加工物10的切割面進行加工。藉此，可改善玻璃加工物10的切割面的表面粗糙度值及拉伸強度。Hereinabove, the glass workpiece cutting method and apparatus of the exemplary embodiment have been described with reference to Figs. 1 to 8 . According to an embodiment, after the glass workpiece 10 is cut with the first laser beam, the cut surface of the glass workpiece 10 can be processed using a second laser beam having a different wavelength than the first laser beam. Thereby, the surface roughness value and the tensile strength of the cut surface of the glass workpiece 10 can be improved.
於以上說明中，具體地記載有多個事項，但這些事項並不限定發明的範圍，而應解釋為較佳的實施例的示例。因此，本發明的範圍不應由所說明的實施例界定，而應由申請專利範圍中所記載的技術思想界定。In the above description, a plurality of items are specifically described, but these matters are not intended to limit the scope of the invention, but should be construed as an example of a preferred embodiment. Therefore, the scope of the invention should not be limited by the illustrated embodiments, but should be defined by the technical idea recited in the claims.
10‧‧‧玻璃加工物
110a‧‧‧第一光源
110b‧‧‧第二光源
120a‧‧‧第1聚光單元
120b‧‧‧第2聚光單元
S1、S2、S3、S4‧‧‧切割面
S110、S120‧‧‧步驟10‧‧‧Glass processing
110a‧‧‧first light source
110b‧‧‧second light source
120a‧‧‧1st concentrating unit
120b‧‧‧2nd concentrating unit
S1, S2, S3, S4‧‧‧ cutting surface
S110, S120‧‧‧ steps
圖1是例示性的實施例的玻璃加工物切割方法的流程圖。 圖2是概略性地表示用以實施圖1所示的玻璃加工物切割方法的玻璃加工物切割裝置的情況的圖。 圖3是例示性地表示於切割玻璃加工物的步驟中切割出的玻璃加工物的切割面的圖。 圖4是表示於切割玻璃加工物的步驟中切割出的玻璃加工物的切割面的另一例的圖。 圖5是表示圖4所示的玻璃加工物的切割面的表面粗糙度的圖。 圖6是表示第二雷射束照射至圖5所示的玻璃加工物的切割面的情形時的切割面形狀的變化的圖。 圖7及圖8是表示圖6所示的玻璃加工物的切割面因第二雷射束而發生變化的例的圖。1 is a flow chart of a glass workpiece cutting method of an exemplary embodiment. Fig. 2 is a view schematically showing a state of a glass workpiece cutting device for carrying out the glass workpiece cutting method shown in Fig. 1; Fig. 3 is a view exemplarily showing a cut surface of a glass workpiece cut in a step of cutting a glass workpiece. 4 is a view showing another example of a cut surface of a glass workpiece cut in the step of cutting a glass processed product. Fig. 5 is a view showing a surface roughness of a cut surface of the glass workpiece shown in Fig. 4; FIG. 6 is a view showing a change in the shape of the cut surface when the second laser beam is irradiated onto the cut surface of the glass workpiece shown in FIG. 5. 7 and 8 are views showing an example in which the cut surface of the glass workpiece shown in Fig. 6 is changed by the second laser beam.
S110、S120‧‧‧步驟 S110, S120‧‧‧ steps
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH091368A (en) * | 1995-06-20 | 1997-01-07 | Hitachi Cable Ltd | Cutting method for nonmetallic material substrate and its device |
| TW496807B (en) * | 2001-05-21 | 2002-08-01 | Samsung Electronics Co Ltd | Method and apparatus for cutting a non-metal substrate using a laser beam |
| TW201321321A (en) * | 2011-10-07 | 2013-06-01 | Schott Ag | Method for cutting thin glass with special edge formation |
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| KR20000040563A (en) * | 1998-12-18 | 2000-07-05 | 구자홍 | Apparatus for cutting processed glass formed with a pattern |
| JP2002012436A (en) * | 2000-06-23 | 2002-01-15 | Nippon Sheet Glass Co Ltd | Method of treating glass plate end and plate glass treated thereby |
| JP5884691B2 (en) * | 2011-09-15 | 2016-03-15 | 日本電気硝子株式会社 | Glass plate cutting method |
| KR101505470B1 (en) * | 2013-05-03 | 2015-03-24 | 주식회사 엘티에스 | Method for manufacturing tempered glass cell |
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| JPH091368A (en) * | 1995-06-20 | 1997-01-07 | Hitachi Cable Ltd | Cutting method for nonmetallic material substrate and its device |
| TW496807B (en) * | 2001-05-21 | 2002-08-01 | Samsung Electronics Co Ltd | Method and apparatus for cutting a non-metal substrate using a laser beam |
| TW201321321A (en) * | 2011-10-07 | 2013-06-01 | Schott Ag | Method for cutting thin glass with special edge formation |
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| WO2017007255A1 (en) | 2017-01-12 |
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| CN208166851U (en) | 2018-11-30 |
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