TWI606745B - 用於製備透明磷光性陶瓷板的製程 - Google Patents
用於製備透明磷光性陶瓷板的製程 Download PDFInfo
- Publication number
- TWI606745B TWI606745B TW105138216A TW105138216A TWI606745B TW I606745 B TWI606745 B TW I606745B TW 105138216 A TW105138216 A TW 105138216A TW 105138216 A TW105138216 A TW 105138216A TW I606745 B TWI606745 B TW I606745B
- Authority
- TW
- Taiwan
- Prior art keywords
- phosphorescent
- ceramic plate
- yag phosphor
- present disclosure
- transparent ceramic
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims description 24
- 238000004519 manufacturing process Methods 0.000 title description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 12
- 238000000227 grinding Methods 0.000 claims description 9
- 238000005245 sintering Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 4
- 229910052684 Cerium Inorganic materials 0.000 description 3
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000012190 activator Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000010532 solid phase synthesis reaction Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150191757A KR20170081042A (ko) | 2015-12-31 | 2015-12-31 | 형광체 투명 세라믹 플레이트의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201735726A TW201735726A (zh) | 2017-10-01 |
TWI606745B true TWI606745B (zh) | 2017-11-21 |
Family
ID=59224881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105138216A TWI606745B (zh) | 2015-12-31 | 2016-11-22 | 用於製備透明磷光性陶瓷板的製程 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20170081042A (ko) |
TW (1) | TWI606745B (ko) |
WO (1) | WO2017116000A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102121249B1 (ko) * | 2018-07-04 | 2020-06-10 | 한국광기술원 | 형광체 플레이트 및 그의 제조방법 |
KR102278026B1 (ko) * | 2019-11-18 | 2021-07-15 | 주식회사 에프씨씨 | 테이프 형태의 형광체 시트 제조방법 |
CN112661512A (zh) * | 2020-12-23 | 2021-04-16 | 新沂市锡沂高新材料产业技术研究院有限公司 | 一种室温下荧光粉与氧化钇陶瓷致密化的方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4605829B2 (ja) * | 1998-05-25 | 2011-01-05 | 京セラ株式会社 | 高強度、高硬度アルミナセラミックス及びその製造方法 |
JP2006315955A (ja) * | 2000-07-10 | 2006-11-24 | Toshiba Ceramics Co Ltd | セラミックス部材 |
WO2007026739A1 (ja) * | 2005-08-31 | 2007-03-08 | Kyocera Corporation | 耐食性部材、これを用いた処理装置および試料処理方法ならびに耐食性部材の製造方法 |
CN103890138B (zh) * | 2011-08-16 | 2016-06-22 | 日东电工株式会社 | 磷光化合物及其制备方法 |
KR102255213B1 (ko) * | 2013-12-10 | 2021-05-24 | 삼성전자주식회사 | 형광체와 이를 포함하는 발광 소자 |
-
2015
- 2015-12-31 KR KR1020150191757A patent/KR20170081042A/ko active Search and Examination
-
2016
- 2016-11-10 WO PCT/KR2016/012929 patent/WO2017116000A1/ko active Application Filing
- 2016-11-22 TW TW105138216A patent/TWI606745B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201735726A (zh) | 2017-10-01 |
WO2017116000A1 (ko) | 2017-07-06 |
KR20170081042A (ko) | 2017-07-11 |
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