TWI606529B - Lens housing assembly for wafer inspection equipment - Google Patents

Lens housing assembly for wafer inspection equipment Download PDF

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Publication number
TWI606529B
TWI606529B TW105135480A TW105135480A TWI606529B TW I606529 B TWI606529 B TW I606529B TW 105135480 A TW105135480 A TW 105135480A TW 105135480 A TW105135480 A TW 105135480A TW I606529 B TWI606529 B TW I606529B
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hole
outer casing
frame
wall portion
housing assembly
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TW105135480A
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TW201818486A (zh
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Jian-Cheng Chen
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Priority to TW105135480A priority Critical patent/TWI606529B/zh
Priority to CN201710821287.8A priority patent/CN108010858A/zh
Priority to CN201721169345.5U priority patent/CN207303044U/zh
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Publication of TW201818486A publication Critical patent/TW201818486A/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043Making grooves, e.g. cutting

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

晶圓檢查設備之鏡頭殼體組合
本發明與晶圓檢查設備有關,特別是指一種晶圓檢查設備之鏡頭殼體組合。
對於晶圓背面切割道檢查而言,多數的檢測機台從晶圓背面檢測切割道時,會因為被晶圓背面的藍膜(dicing tape)阻隔而無法獲得清晰的影像進而無法精確地檢測晶圓背面的切割道缺陷。對此,已有中華民國申請101147513專利之技術克服影像不清晰的問題,其係運用浸潤液體的折射率和藍膜的折射率匹配達成獲得清晰影像的功效。此外,另有中華民國申請號102119748專利之技術,讓檢測機台在檢測時具有足夠的浸潤液體,並且排放多餘的浸潤液體。
然而,運用上述技術的檢測機台從晶圓背面檢測晶圓時,仍有需要改善的地方,說明如下:
1、待檢測的晶圓為已經被切割的晶圓,切割道所在之處僅有藍膜本身而無晶片貼覆。如申請號102119748專利第1-3圖顯示,浸潤液體由第一間隙21流至第二間隙31覆蓋透明片30的同時也接觸藍膜80,實際上,因為浸潤液體係受加壓的液體,所以浸潤液體流出第二間隙31後會施加壓力在藍膜80上,使得受浸潤液體壓力的局部區域位置(約透明片30大小)被浸潤液體撐高,造成晶片因為局部位置突起而脫離藍膜,或是相鄰晶片因為周圍局部位置突起彼此靠近而碰撞。
2、由於浸潤液體接觸藍膜後會在藍膜上殘留,需要進一步處置殘留在藍膜上的浸潤液體,避免殘留的浸潤液體滴落在檢測機台內產生檢測機台故障或鏽蝕的風險。
針對前述問題,本發明之目的在於提供一種晶圓檢查設備之鏡頭殼體組合,減少受測晶圓上的晶片脫離藍膜或互相碰撞的情況。
此外,本發明之另一目的在於提供一種晶圓檢查設備之鏡頭殼體組合,能夠減少檢測晶圓後藍膜上的餘液。
為了達成上述目的,本發明提供一種晶圓檢查設備之鏡頭殼體組合,包含一外殼體,具有一頂部,該外殼體於該頂部具有一第一孔,該外殼體於外圍具有一槽體;一透明片,設置在該外殼體,並且蓋住該第一孔;一外蓋,係設置在該外殼體,該外蓋具有一第二孔和一第三孔,且該外蓋與該外殼體之間形成一第一間隙,該第一間隙連通該第二孔和該第三孔:以及一框體,係套設在該外殼體或該外蓋,該框體位在該槽體上方,該框體具有一頂緣,該頂緣位置同高或高出該外蓋。
使用配有本發明所提供之鏡頭殼體組合的晶圓檢測機台時,浸潤液體分佈範圍將會是該框體所圍繞的範圍,將大於於先前技術約透明片大小的範圍,因而減少局部區域位置被撐高的程度,減少受測晶圓上的晶片脫離藍膜或互相碰撞的情況。此外,檢測機台執行檢測作業時,該框體與受測晶圓背面的藍膜接觸,並竊讓浸潤液體係在該框體內分佈,隨著鏡頭移動,該框體將會刮除藍膜上的餘液,故能夠減少檢測晶圓後藍膜上的餘液。
此外,還可以讓該框體與該外蓋之間形成一第二間隙,供液體從該第二間隙流入該槽體。
更佳地,該框體具有一刮壁部,該頂緣位於該刮壁部頂端,該刮壁部具有彈性,用以讓該刮壁部保持接觸藍膜。
還有,該框體具有一刮壁部,該頂緣位於該刮壁部頂端,該刮壁部於該頂緣之外圍形成一斜面,以減少鏡頭移動時因刮壁部接觸藍膜所造成的摩擦阻力。
請參閱第1-4圖,本發明實施例所提供一種晶圓檢查設備之鏡頭殼體組合,包含一外殼體11、一透明片12、一外蓋13和一框體14。
該外殼體11,具有一頂部111,該頂部111係錐形突起,該外殼體11於該頂部111具有一第一孔112,當檢測機台所使用的鏡頭設置在該外殼體11內部時,係透過該第一孔112擷取孔外的影像。該外殼體11於外圍具有一槽體113,該槽體113朝上開設,用來收集浸潤液體。
該透明片12,設置在該外殼體11,並且蓋住該第一孔112,讓裝設在該外殼體11內的鏡頭透過該透明片12而擷取到該第一孔孔112外的影像,並且防止外物,如浸潤液體,經過該第一孔112進入到該外殼體11內。
該外蓋13,係設置在該外殼體11,該外蓋13具有一第二孔131和一第三孔132,且該外蓋13與該外殼體11之間形成一第一間隙133,該第一間隙133連通該第二孔131和該第三孔132。須說明的是,在本實施例中,該第二孔131係供管線輸入浸潤液體,浸潤液體流經該第一間隙133後會由該第三孔132溢流出該外蓋13,並且讓浸潤液體覆蓋該透明片12。該第三孔132,係讓該第三孔132孔外的影像能夠從該透明片12穿透進入該外殼體11內。
該框體14,係套設在該外殼體11或該外蓋13,在本實施例中係以套設在該外蓋13為例,但是不以此為限,也可以套設在該外殼體11。該框體14位在該槽體113上方,如此一來,浸潤液體能夠從該框體14順利地流入該槽體113。另外,該框體14具有一頂緣141,該頂緣141位置同高或高出該外蓋13,藉以確保檢測機台運作時,該框體14因為該頂緣141相對於該外蓋13的位置關係,能夠持續地接觸藍膜。
值得一提的是,本實施例中,該框體14與該外蓋13之間形成一第二間隙142,供浸潤液體從該第二間隙142流入該槽體113。若不設該第二間隙142,則浸潤液體將從該框體14溢流而出,會產生該框體14沒有持續接觸藍膜的情況,減低該框體14刮除藍膜上餘液的效果。
此外,在本實施例中,該框體14具有一刮壁部143,該頂緣141位於該刮壁部143頂端,該刮壁部143具有彈性,藉此減少該框體14沒有持續接觸藍膜的情況。而且,該刮壁部143於該頂緣141之外圍形成一斜面144,用以減少鏡頭移動時因該刮壁部143接觸藍膜所造成的摩擦阻力。
11‧‧‧外殼體
111‧‧‧頂部
112‧‧‧第一孔
113‧‧‧槽體
12‧‧‧透明片
13‧‧‧外蓋
131‧‧‧第二孔
132‧‧‧第三孔
133‧‧‧第一間隙
14‧‧‧框體
141‧‧‧頂緣
142‧‧‧第二間隙
143‧‧‧刮壁部
144‧‧‧斜面
第1圖為本發明實施例之立體圖。 第2圖為本發明實施例之側視圖。 第3圖為本發明實施例之剖視圖。 第4圖為本發明實施例之剖面示意圖。
11‧‧‧外殼體
113‧‧‧槽體
12‧‧‧透明片
13‧‧‧外蓋
14‧‧‧框體

Claims (4)

  1. 一種晶圓檢查設備之鏡頭殼體組合,包含: 一外殼體,具有一頂部,該外殼體於該頂部具有一第一孔,該外殼體於外圍具有一槽體; 一透明片,設置在該外殼體,並且蓋住該第一孔; 一外蓋,係設置在該外殼體,該外蓋具有一第二孔和一第三孔,且該外蓋與該外殼體之間形成一第一間隙,該第一間隙連通該第二孔和該第三孔:以及 一框體,係套設在該外殼體或該外蓋,該框體位在該槽體上方,該框體具有一頂緣,該頂緣位置同高或高出該外蓋。
  2. 如請求項1所述之晶圓檢查設備之鏡頭殼體組合中,其中,該框體與該外蓋之間形成一第二間隙,供液體從該第二間隙流入該槽體。
  3. 如請求項1所述之晶圓檢查設備之鏡頭殼體組合中,其中,該框體具有一刮壁部,該頂緣位於該刮壁部頂端,該刮壁部具有彈性。
  4. 如請求項1或3所述之晶圓檢查設備之鏡頭殼體組合中,其中,該框體具有一刮壁部,該頂緣位於該刮壁部頂端,該刮壁部於該頂緣之外圍形成一斜面。
TW105135480A 2016-11-02 2016-11-02 Lens housing assembly for wafer inspection equipment TWI606529B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW105135480A TWI606529B (zh) 2016-11-02 2016-11-02 Lens housing assembly for wafer inspection equipment
CN201710821287.8A CN108010858A (zh) 2016-11-02 2017-09-13 晶圆检查设备的镜头壳体组合
CN201721169345.5U CN207303044U (zh) 2016-11-02 2017-09-13 晶圆检查设备的镜头壳体组合

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Application Number Priority Date Filing Date Title
TW105135480A TWI606529B (zh) 2016-11-02 2016-11-02 Lens housing assembly for wafer inspection equipment

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TWI606529B true TWI606529B (zh) 2017-11-21
TW201818486A TW201818486A (zh) 2018-05-16

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* Cited by examiner, † Cited by third party
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TWI606529B (zh) * 2016-11-02 2017-11-21 Lens housing assembly for wafer inspection equipment

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US20060275918A1 (en) * 2004-02-16 2006-12-07 Olympus Corporation Immersion objective lens, retention mechanism for immersion medium, and manufacturing method
US20100027109A1 (en) * 2006-09-07 2010-02-04 Leica Microsystems Cms Gmbh Immersion objective, apparatus for forming an immersion film and method
TW201109850A (en) * 2009-05-04 2011-03-16 Zeiss Carl Smt Ag Optical imaging with reduced immersion liquid evaporation effects
TW201448076A (zh) * 2013-06-04 2014-12-16 Yayatech Co Ltd 浸潤液體補充裝置及補充方法與具有浸潤液體補充裝置之晶圓切割道檢測機
TWM539148U (zh) * 2016-11-02 2017-04-01 Yayatech Co Ltd 晶圓檢查設備之鏡頭殼體組合

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US8237911B2 (en) * 2007-03-15 2012-08-07 Nikon Corporation Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine
US8235505B2 (en) * 2009-06-30 2012-08-07 Eastman Kodak Company Flow through drop dispenser including porous member
TWI606529B (zh) * 2016-11-02 2017-11-21 Lens housing assembly for wafer inspection equipment

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060275918A1 (en) * 2004-02-16 2006-12-07 Olympus Corporation Immersion objective lens, retention mechanism for immersion medium, and manufacturing method
US20100027109A1 (en) * 2006-09-07 2010-02-04 Leica Microsystems Cms Gmbh Immersion objective, apparatus for forming an immersion film and method
TW201109850A (en) * 2009-05-04 2011-03-16 Zeiss Carl Smt Ag Optical imaging with reduced immersion liquid evaporation effects
TW201448076A (zh) * 2013-06-04 2014-12-16 Yayatech Co Ltd 浸潤液體補充裝置及補充方法與具有浸潤液體補充裝置之晶圓切割道檢測機
TWM539148U (zh) * 2016-11-02 2017-04-01 Yayatech Co Ltd 晶圓檢查設備之鏡頭殼體組合

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CN207303044U (zh) 2018-05-01
CN108010858A (zh) 2018-05-08
TW201818486A (zh) 2018-05-16

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