TWI604954B - Composite substrate - Google Patents
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- TWI604954B TWI604954B TW104120014A TW104120014A TWI604954B TW I604954 B TWI604954 B TW I604954B TW 104120014 A TW104120014 A TW 104120014A TW 104120014 A TW104120014 A TW 104120014A TW I604954 B TWI604954 B TW I604954B
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本發明是有關一種複合基板，特別是有關一種以氟系聚合物作為介電層之複合基板。 The present invention relates to a composite substrate, and more particularly to a composite substrate using a fluorine-based polymer as a dielectric layer.
近年來，電子產品在輕薄短小及行動化的潮流趨勢下，薄型化、構裝密集化、高速化、高導熱、觸控及節能均是行動電子產品的需求。隨著智慧型手機、平板電腦以及筆電的普及化，印刷電路板之配線必須朝高密度化發展。其中，更需降低印刷電路板中介電層之介電常數與介電損失，以提升電子訊號的傳輸速率，並同時保持訊號的完整度。 In recent years, under the trend of thin, light and mobile, thin products, dense packaging, high speed, high thermal conductivity, touch and energy saving are all demand for mobile electronic products. With the popularization of smart phones, tablets, and notebooks, the wiring of printed circuit boards must be developed toward higher density. Among them, it is more necessary to reduce the dielectric constant and dielectric loss of the dielectric layer of the printed circuit board to increase the transmission rate of the electronic signal while maintaining the integrity of the signal.
其中，氟系聚合物因具有較低的介電常數、較少的介質耗損、並適用於頻率高於10GHz的產品，而廣泛應用於印刷電路板中的介電層。然而，氟系聚合物本身的分子惰性使其親和性差，難以與金屬材料達到穩定結合，進而降低印刷電路板之良率與效率。因此，業界急需開發一種以氟系聚合物作為介電層之複合基板，以解決上述之問題。 Among them, fluorine-based polymers are widely used in dielectric layers in printed circuit boards because of their low dielectric constant, low dielectric loss, and suitable for products with frequencies higher than 10 GHz. However, the molecular inertness of the fluorine-based polymer itself makes it poor in affinity, and it is difficult to achieve stable bonding with the metal material, thereby reducing the yield and efficiency of the printed circuit board. Therefore, there is an urgent need in the industry to develop a composite substrate using a fluorine-based polymer as a dielectric layer to solve the above problems.
本發明之一態樣係提供一種複合基板，包含一金 屬層、一接著膠層以及一氟系聚合物層。氟系聚合物層藉由接著膠層黏合至金屬層，並包含一表面孔洞區，其包含複數個孔洞，此些孔洞至少部分填滿一接著膠並接觸接著膠層。 One aspect of the present invention provides a composite substrate comprising a gold A genus layer, a glue layer and a fluorine-based polymer layer. The fluoropolymer layer is bonded to the metal layer by a bonding layer, and comprises a surface void region comprising a plurality of holes which at least partially fill a bonding adhesive and contact the adhesive layer.
根據本發明一或多個實施方式，金屬層之材質包含銅、鋁、鐵、銀、鈀、鎳、鉻、鉬、鎢、鋅、鉻、錳、鈷、金、錫、鉛不鏽鋼、或其組合。 According to one or more embodiments of the present invention, the material of the metal layer comprises copper, aluminum, iron, silver, palladium, nickel, chromium, molybdenum, tungsten, zinc, chromium, manganese, cobalt, gold, tin, lead stainless steel, or combination.
根據本發明一或多個實施方式，金屬層之厚度為5微米至70微米。 According to one or more embodiments of the invention, the metal layer has a thickness of from 5 micrometers to 70 micrometers.
根據本發明一或多個實施方式，接著膠層之材質包含環氧樹脂、苯氧基樹脂、丙烯酸樹脂、胺基甲酸乙酯樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂、聚醯亞胺樹脂，或其組合。 According to one or more embodiments of the present invention, the material of the adhesive layer comprises an epoxy resin, a phenoxy resin, an acrylic resin, a urethane resin, a ruthenium rubber resin, a polyparaxylene resin, and a double horse. An imine resin, a polyimide resin, or a combination thereof.
根據本發明一或多個實施方式，接著層之厚度為5微米至50微米。 According to one or more embodiments of the invention, the thickness of the adhesive layer is from 5 microns to 50 microns.
根據本發明一或多個實施方式，氟系聚合物層之材質包含聚四氟乙烯、四氟乙烯與乙烯之共聚物、四氟乙烯與六氟丙烯之共聚物、或其組合。 According to one or more embodiments of the present invention, the material of the fluorine-based polymer layer comprises polytetrafluoroethylene, a copolymer of tetrafluoroethylene and ethylene, a copolymer of tetrafluoroethylene and hexafluoropropylene, or a combination thereof.
根據本發明一或多個實施方式，氟系聚合物層之厚度為5微米至200微米。 According to one or more embodiments of the present invention, the fluorine-based polymer layer has a thickness of from 5 micrometers to 200 micrometers.
根據本發明一或多個實施方式，表面孔洞區之厚度與氟系聚合物層之厚度之間的比值大於0.05。 According to one or more embodiments of the present invention, the ratio between the thickness of the surface void region and the thickness of the fluorine-based polymer layer is greater than 0.05.
根據本發明一或多個實施方式，表面孔洞區之厚度與氟系聚合物層之厚度之間的比值介於0.05至0.8之間。 According to one or more embodiments of the present invention, the ratio between the thickness of the surface void region and the thickness of the fluorine-based polymer layer is between 0.05 and 0.8.
根據本發明一或多個實施方式，氟系聚合物層更包含一內部孔洞區，而表面孔洞區位於內部孔洞區與接著膠層之間。 According to one or more embodiments of the present invention, the fluorine-based polymer layer further includes an inner void region, and the surface void region is located between the inner void region and the adhesive layer.
100‧‧‧複合基板 100‧‧‧Composite substrate
110‧‧‧氟系聚合物層 110‧‧‧Fluorine polymer layer
112‧‧‧表面孔洞區 112‧‧‧Surface hole area
114‧‧‧內部孔洞區 114‧‧‧Internal hole area
120‧‧‧接著膠層 120‧‧‧Next glue layer
130‧‧‧金屬層 130‧‧‧metal layer
200‧‧‧複合基板 200‧‧‧Composite substrate
201‧‧‧第一表面 201‧‧‧ first surface
202‧‧‧第二表面 202‧‧‧ second surface
210‧‧‧氟系聚合物層 210‧‧‧Fluorine polymer layer
212‧‧‧第一表面孔洞區 212‧‧‧First surface hole area
214‧‧‧第二表面孔洞區 214‧‧‧Second surface hole area
216‧‧‧內部孔洞區 216‧‧‧Internal hole area
220‧‧‧第一接著層 220‧‧‧ first layer
230‧‧‧第一金屬層 230‧‧‧First metal layer
240‧‧‧第二接著層 240‧‧‧Secondary layer
250‧‧‧第二金屬層 250‧‧‧Second metal layer
300‧‧‧複合基板 300‧‧‧Composite substrate
301‧‧‧接觸面 301‧‧‧Contact surface
310‧‧‧氟系聚合物層 310‧‧‧Fluorine polymer layer
312‧‧‧表面孔洞區 312‧‧‧Surface hole area
314‧‧‧內部孔洞區 314‧‧‧Internal hole area
320‧‧‧接著膠層 320‧‧‧Next glue layer
330‧‧‧金屬層 330‧‧‧metal layer
T1‧‧‧厚度 T1‧‧‧ thickness
T2‧‧‧厚度 T2‧‧‧ thickness
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之詳細說明如下：第1圖繪示本發明之部分實施方式中一種複合基板的示意圖；第2圖繪示本發明之其他部分實施方式中一種複合基板的示意圖；第3圖繪示本發明之其他部分實施方式中一種複合基板的示意圖；第4A-4C圖繪示第1圖之複合基板，在製程各個階段的剖面圖；以及第5A-5B圖繪示第1圖之複合基板，在製程各個階段的剖面圖。 The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; 2 is a schematic view showing a composite substrate according to another embodiment of the present invention; FIG. 3 is a schematic view showing a composite substrate according to another embodiment of the present invention; and FIG. 4A-4C is a composite substrate of FIG. A cross-sectional view at various stages of the process; and a cross-sectional view of the composite substrate of Fig. 1 at various stages of the process, as shown in Figs. 5A-5B.
以下將以圖式揭露本發明之複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本發明。也就是說，在本發明部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在 圖式中將以簡單示意的方式繪示之。 The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some conventional structures and components are used to simplify the drawing. The drawings will be illustrated in a simple schematic manner.
當一個元件被稱為『在…上』時，它可泛指該元件直接在其他元件上，也可以是有其他元件存在於兩者之中。相反地，當一個元件被稱為『直接在』另一元件，它是不能有其他元件存在於兩者之中間。如本文所用，詞彙『與/或』包含了列出的關聯項目中的一個或多個的任何組合。 When an element is referred to as "on", it can generally mean that the element is directly on the other element, or that other element is present in the two. Conversely, when an element is referred to as being "directly on" another element, it cannot be. As used herein, the term "and/or" encompasses any combination of one or more of the listed associated items.
在本文中，使用第一、第二與第三等等之詞彙，是用於描述各種元件、組件、區域、層與/或區塊是可以被理解的。但是這些元件、組件、區域、層與/或區塊不應該被這些術語所限制。這些詞彙只限於用來辨別單一元件、組件、區域、層與/或區塊。因此，在下文中的一第一元件、組件、區域、層與/或區塊也可被稱為第二元件、組件、區域、層與/或區塊，而不脫離本發明的本意。 The use of the terms first, second, and third, etc., is used to describe various elements, components, regions, layers and/or blocks. However, these elements, components, regions, layers and/or blocks should not be limited by these terms. These terms are only used to identify a single element, component, region, layer, and/or block. Thus, a singular element, component, region, layer and/or block may be referred to as a second element, component, region, layer and/or block, without departing from the spirit of the invention.
請先參閱第1圖，第1圖繪示本發明之部分實施方式中一種複合基板的示意圖。一複合基板100包含一氟系聚合物層110、一接著膠層120以及一金屬層130。接著膠層120位於氟系聚合物層110與金屬層130之間，使氟系聚合物層110藉由接著膠層120黏合至金屬層130。 Please refer to FIG. 1 first. FIG. 1 is a schematic view showing a composite substrate in a part of embodiments of the present invention. A composite substrate 100 includes a fluorine-based polymer layer 110, a backing layer 120, and a metal layer 130. Then, the adhesive layer 120 is located between the fluorine-based polymer layer 110 and the metal layer 130, and the fluorine-based polymer layer 110 is adhered to the metal layer 130 by the adhesive layer 120.
在本發明之部分實施例中，金屬層130之厚度為5微米至70微米，且其材質包含銅、鋁、鐵、銀、鈀、鎳、鉻、鉬、鎢、鋅、鉻、錳、鈷、金、錫、鉛不鏽鋼、或其組合。在本發明之其他部分實施例中，氟系聚合物層110之厚度T1為5微米至200微米，且其材質包含包含聚四氟乙烯、四氟乙烯與乙烯之共聚物、四氟乙烯與六氟丙烯之共聚物、 或其組合。 In some embodiments of the present invention, the metal layer 130 has a thickness of 5 micrometers to 70 micrometers, and the material thereof comprises copper, aluminum, iron, silver, palladium, nickel, chromium, molybdenum, tungsten, zinc, chromium, manganese, cobalt. , gold, tin, lead stainless steel, or a combination thereof. In other embodiments of the present invention, the fluorine-based polymer layer 110 has a thickness T1 of 5 micrometers to 200 micrometers, and the material thereof comprises polytetrafluoroethylene, a copolymer of tetrafluoroethylene and ethylene, tetrafluoroethylene and six. a copolymer of fluoropropene, Or a combination thereof.
氟系聚合物層110具有一表面孔洞區112以及一內部孔洞區114，其中表面孔洞區112位於內部孔洞區114與接著膠層120之間。如第1圖的局部放大圖所示，氟系聚合物層110內部具有複數個的孔洞，而接著膠會滲透入此些孔洞中，以形成接觸接著膠層120的表面孔洞區112。更清楚的說，在固化接著膠層120前，部分的接著膠將會流入與此接著膠層120接觸的氟系聚合物層110之表面孔洞區112中，並至少部分填滿此表面孔洞區112中的孔洞。藉此，可提升氟系聚合物層110與接著膠層120之間的接著強度，使兩者之間達成緊密結合，也更進一步提升金屬層130與氟系聚合物層110之接著強度。另一方面，氟系聚合物層110中未被接著膠填滿處則形成內部孔洞區114。 The fluoropolymer layer 110 has a surface void region 112 and an inner void region 114, wherein the surface void region 112 is located between the inner void region 114 and the adhesive layer 120. As shown in a partially enlarged view of FIG. 1, the fluorine-based polymer layer 110 has a plurality of holes therein, and then the glue penetrates into the holes to form a surface hole region 112 contacting the adhesive layer 120. More specifically, before curing the adhesive layer 120, a portion of the adhesive will flow into the surface void region 112 of the fluorine-based polymer layer 110 in contact with the adhesive layer 120, and at least partially fill the surface void region. The hole in 112. Thereby, the bonding strength between the fluorine-based polymer layer 110 and the adhesive layer 120 can be improved, and a close bond between the two can be achieved, and the bonding strength between the metal layer 130 and the fluorine-based polymer layer 110 can be further improved. On the other hand, the internal void region 114 is formed in the fluorine-based polymer layer 110 without being filled with a paste.
在本發明之部分實施例中，表面孔洞區之厚度T2與氟系聚合物層110之厚度T1之間的比值大於0.05。值得注意的是，選用的接著膠之介電常數約略大於氟系聚合物層110之介電常數，但不以此為限。亦可選用任何合適的接著膠以接著氟系聚合物層110與金屬層130。在本發明之其他部分實施例中，表面孔洞區112之厚度T2與氟系聚合物層110之厚度T1之間的比值介於0.05至0.8之間，以提升氟系聚合物層110與接著膠層120之間的接著強度，並使氟系聚合物層110維持於較低的介電常數，而不影響複合基板100之運作。 In some embodiments of the invention, the ratio between the thickness T2 of the surface void region and the thickness T1 of the fluorine-based polymer layer 110 is greater than 0.05. It should be noted that the dielectric constant of the selected adhesive is slightly larger than the dielectric constant of the fluorine-based polymer layer 110, but is not limited thereto. Any suitable adhesive can also be used to follow the fluorine-based polymer layer 110 and the metal layer 130. In other embodiments of the present invention, the ratio between the thickness T2 of the surface hole region 112 and the thickness T1 of the fluorine-based polymer layer 110 is between 0.05 and 0.8 to enhance the fluorine-based polymer layer 110 and the adhesive. The bonding strength between the layers 120 maintains the fluorine-based polymer layer 110 at a lower dielectric constant without affecting the operation of the composite substrate 100.
在本發明之部分實施例中，接著膠層120之厚 度為5微米至50微米，且其材質包含環氧樹脂、苯氧基樹脂、丙烯酸樹脂、胺基甲酸乙酯樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂、聚醯亞胺樹脂，或其組合。 In some embodiments of the present invention, the thickness of the adhesive layer 120 is followed. The degree is from 5 micrometers to 50 micrometers, and the material thereof comprises an epoxy resin, a phenoxy resin, an acrylic resin, a urethane resin, a ruthenium rubber resin, a poly-p-xylene resin, and a bismaleimide. A resin, a polyimide resin, or a combination thereof.
請接著參閱第2圖，第2圖繪示本發明之其他部分實施方式中一種複合基板的示意圖。一複合基板200包含一氟系聚合物層210、一第一接著膠層220、一第一金屬層230、一第二接著膠層240以及一第二金屬層250。氟系聚合物層210具有相對的第一表面201與第二表面202，第一接著膠層220與第一金屬層230位於第一表面201上，且第一接著膠層220位於氟系聚合物層210與第一金屬層230之間，使氟系聚合物層210藉由第一接著膠層220黏合至第一金屬層230。另一方面，第二接著膠層240與第二金屬層250位於第二表面202下，且第二接著膠層240位於氟系聚合物層210與第二金屬層250之間，使氟系聚合物層210藉由第二接著膠層240黏合至第二金屬層250。 Please refer to FIG. 2, which is a schematic diagram of a composite substrate according to another embodiment of the present invention. A composite substrate 200 includes a fluorine-based polymer layer 210, a first adhesive layer 220, a first metal layer 230, a second adhesive layer 240, and a second metal layer 250. The fluorine-based polymer layer 210 has opposite first and second surfaces 201 and 202. The first adhesive layer 220 and the first metal layer 230 are located on the first surface 201, and the first adhesive layer 220 is located on the fluorine-based polymer. Between the layer 210 and the first metal layer 230, the fluorine-based polymer layer 210 is bonded to the first metal layer 230 by the first adhesive layer 220. On the other hand, the second adhesive layer 240 and the second metal layer 250 are located under the second surface 202, and the second adhesive layer 240 is located between the fluorine-based polymer layer 210 and the second metal layer 250 to cause fluorine polymerization. The object layer 210 is bonded to the second metal layer 250 by the second adhesive layer 240.
氟系聚合物層210具有第一表面孔洞區212、第二表面孔洞區214以及一內部孔洞區216，其中第一表面孔洞區212位於內部孔洞區216與第一接著膠層220之間，而第二表面孔洞區214位於內部孔洞區216與第二接著膠層240之間。第一表面孔洞區212與第二表面孔洞區214包含複數個孔洞，且此些孔洞至少部分填滿接著膠，並分別接觸第一接著膠層220與第二接著膠層240。在固化第一接著膠層220與第二接著膠層240前，部分的接著膠將會流入與第 一接著膠層220與第二接著膠層240接觸之第一表面孔洞區212與第二表面孔洞區214中，並填滿此些孔洞。藉此，能提升氟系聚合物層210跟第一金屬層230與第二金屬層250之間的接著強度，以達成緊密結合，進而增加複合基板200的穩定度。另一方面，氟系聚合物層210中未被接著膠填滿處則形成內部孔洞區216。 The fluorine-based polymer layer 210 has a first surface hole region 212, a second surface hole region 214, and an inner hole region 216, wherein the first surface hole region 212 is located between the inner hole region 216 and the first adhesive layer 220, and The second surface void region 214 is between the inner void region 216 and the second adhesive layer 240. The first surface hole region 212 and the second surface hole region 214 include a plurality of holes, and the holes are at least partially filled with the adhesive and contact the first adhesive layer 220 and the second adhesive layer 240, respectively. Before curing the first adhesive layer 220 and the second adhesive layer 240, part of the adhesive will flow into the first Then, the glue layer 220 is in contact with the first surface hole region 212 and the second surface hole region 214 of the second adhesive layer 240, and fills the holes. Thereby, the bonding strength between the fluorine-based polymer layer 210 and the first metal layer 230 and the second metal layer 250 can be improved to achieve close bonding, thereby increasing the stability of the composite substrate 200. On the other hand, the inner void region 216 is formed in the fluorine-based polymer layer 210 without being filled with a paste.
請繼續參閱第3圖，第3圖繪示本發明之其他部分實施方式中一種複合基板的示意圖。一複合基板300包含一氟系聚合物層310、一接著膠層320以及一金屬層330。接著膠層320位於氟系聚合物層310與金屬層330之間，使氟系聚合物層310藉由接著膠層320黏合至金屬層330。第3圖之複合基板300與第1圖之複合基板100之間的差別在於，接著膠層320與氟系聚合物層310之間的接觸面301為一粗糙化表面。此粗糙化表面增加了接著膠層320與氟系聚合物層310之間的接觸面積，並提升兩者間的接著強度。 Please refer to FIG. 3, which is a schematic diagram of a composite substrate in other embodiments of the present invention. A composite substrate 300 includes a fluorine-based polymer layer 310, a backing layer 320, and a metal layer 330. Then, the adhesive layer 320 is located between the fluorine-based polymer layer 310 and the metal layer 330, and the fluorine-based polymer layer 310 is adhered to the metal layer 330 by the adhesive layer 320. The difference between the composite substrate 300 of FIG. 3 and the composite substrate 100 of FIG. 1 is that the contact surface 301 between the adhesive layer 320 and the fluorine-based polymer layer 310 is a roughened surface. This roughened surface increases the contact area between the adhesive layer 320 and the fluorine-based polymer layer 310, and increases the bonding strength between the two.
此外，氟系聚合物層310同樣具有一表面孔洞區312以及一內部孔洞區314，其中表面孔洞區312位於內部孔洞區314與接著膠層320之間。且表面孔洞區312包含複數個孔洞，其中至少部分填滿接著膠，並接觸接著膠層320。在固化接著膠層320前，部分的接著膠將會流入與此接著膠層320接觸的氟系聚合物層310之表面孔洞區312中，並填滿此表面孔洞區312的空隙。藉由粗糙化表面以及氟系聚合物層310中的接著膠，氟系聚合物層310與金屬層330之間接著強度能大幅提升，更增加複合基板300的穩定 度。另一方面，氟系聚合物層310中未被接著膠填滿處則形成內部孔洞區314。 In addition, the fluoropolymer layer 310 also has a surface void region 312 and an inner void region 314, wherein the surface void region 312 is located between the inner void region 314 and the adhesive layer 320. The surface void region 312 includes a plurality of holes, at least partially filled with the adhesive, and contacts the adhesive layer 320. Before curing the adhesive layer 320, a portion of the adhesive will flow into the surface void region 312 of the fluorine-based polymer layer 310 in contact with the adhesive layer 320, and fill the voids of the surface void region 312. By roughening the surface and the adhesive in the fluorine-based polymer layer 310, the strength between the fluorine-based polymer layer 310 and the metal layer 330 can be greatly improved, and the stability of the composite substrate 300 is further increased. degree. On the other hand, the inner void region 314 is formed in the fluorine-based polymer layer 310 without being filled with a paste.
請繼續參閱第4A-4C圖以進一步理解本發明之精神。第4A-4C圖繪示第1圖之複合基板，在製程各個階段的剖面圖。請先參閱第4A圖，提供氟系聚合物層110。接著進行第4B圖之步驟，塗佈接著膠層120至氟系聚合物層110上，可使用任何合適的塗佈方式，而不影響本發明之精神。 Please continue to refer to Figures 4A-4C for a further understanding of the spirit of the present invention. 4A-4C are cross-sectional views showing the composite substrate of Fig. 1 at various stages of the process. Please refer to FIG. 4A first to provide a fluorine-based polymer layer 110. Next, the step of FIG. 4B is performed, and the adhesive layer 120 is applied to the fluorine-based polymer layer 110, and any suitable coating method can be used without affecting the spirit of the present invention.
最後進行第4C圖之步驟，接合金屬層130與氟系聚合物層110。在此步驟中，先將金屬層130置放於接著膠層120上，並進行壓合製程以使接著膠層120中未固化的接著膠滲透入氟系聚合物層110的表面孔洞區112中，而氟系聚合物層110中未被接著膠填滿處則形成內部孔洞區114。最後，再置入烘箱中烘烤以以固化接著膠層120，以完成複合基板100的製備。但本發明不以此為限，依據接著膠材質的不同，亦可先固化接著膠層120，再進行壓合製程使部分的接著膠滲透入氟系聚合物層110的表面孔洞區112中。 Finally, the step of FIG. 4C is performed to bond the metal layer 130 and the fluorine-based polymer layer 110. In this step, the metal layer 130 is first placed on the adhesive layer 120, and a pressing process is performed to infiltrate the uncured adhesive in the adhesive layer 120 into the surface hole region 112 of the fluorine-based polymer layer 110. The inner void region 114 is formed without the adhesive filling in the fluorine-based polymer layer 110. Finally, it is placed in an oven to be baked to cure the adhesive layer 120 to complete the preparation of the composite substrate 100. However, the present invention is not limited thereto. Depending on the material of the adhesive, the adhesive layer 120 may be first cured, and then a press-bonding process may be performed to allow a portion of the adhesive to penetrate into the surface void region 112 of the fluorine-based polymer layer 110.
在本發明之部分實施例中，係以捲撓式製程(roll-to-roll process)進行壓合，其中壓合的壓力值大於3KN/cm，較佳為8至20KN/cm。在本發明之其他部分實施例中，係以片狀製程進行壓合，其中壓合的壓力值大於3Kg/cm2，較佳為80至200Kg/cm2。在本發明之其他部分實施例中，烘烤的溫度大於50℃，較佳為200至380℃。 In some embodiments of the invention, the pressing is performed in a roll-to-roll process wherein the pressure of the press is greater than 3 KN/cm, preferably 8 to 20 KN/cm. In other parts of the invention, the lamination is carried out in a sheet-like process wherein the pressure value of the press is greater than 3 kg/cm 2 , preferably from 80 to 200 kg/cm 2 . In other portions of the invention, the baking temperature is greater than 50 ° C, preferably from 200 to 380 ° C.
接著請參閱第5A-5B圖以進一步理解本發明之精 神。第5A-5B圖繪示第1圖之複合基板，在製程各個階段的剖面圖。請先參閱第5A圖，提供金屬層130，並塗佈接著膠層120至金屬層130下，可使用任何合適的塗佈方式，而不影響本發明之精神。 Next, please refer to Figures 5A-5B to further understand the essence of the present invention. God. 5A-5B are cross-sectional views showing the composite substrate of Fig. 1 at various stages of the process. Please refer to FIG. 5A to provide a metal layer 130 and apply the adhesive layer 120 to the metal layer 130. Any suitable coating method can be used without affecting the spirit of the present invention.
最後進行第5B圖之步驟，接合金屬層130與氟系聚合物層110。在此步驟中，先將氟系聚合物層110置放於接著膠層120下，並進行壓合製程以使接著膠層120中未固化的接著膠滲透入氟系聚合物層110的表面孔洞區112中，而氟系聚合物層110中未被接著膠填滿處則形成內部孔洞區114。最後，再置入烘箱中烘烤以以固化接著膠層120，而完成複合基板100的製備。但本發明不以此為限，依據接著膠材質的不同，亦可先固化接著膠層120，再進行壓合製程使部分的接著膠滲透入氟系聚合物層110的表面孔洞區112中。 Finally, the step of FIG. 5B is performed to bond the metal layer 130 and the fluorine-based polymer layer 110. In this step, the fluorine-based polymer layer 110 is placed under the adhesive layer 120, and a pressing process is performed to infiltrate the surface of the fluorine-based polymer layer 110 into the surface of the fluorine-based polymer layer 110. In the region 112, the inner void region 114 is formed without the adhesive filling in the fluorine-based polymer layer 110. Finally, it is placed in an oven to be baked to cure the adhesive layer 120, and the preparation of the composite substrate 100 is completed. However, the present invention is not limited thereto. Depending on the material of the adhesive, the adhesive layer 120 may be first cured, and then a press-bonding process may be performed to allow a portion of the adhesive to penetrate into the surface void region 112 of the fluorine-based polymer layer 110.
在本發明之部分實施例中，係以捲撓式製程(roll-to-roll process)進行壓合，其中壓合的壓力值大於3KN/cm，較佳為8至20KN/cm。在本發明之其他部分實施例中，係以片狀製程進行壓合，其中壓合的壓力值大於3Kg/cm2，較佳為80至200Kg/cm2。在本發明之其他部分實施例中，烘烤的溫度大於50℃，較佳為200至380℃。 In some embodiments of the invention, the pressing is performed in a roll-to-roll process wherein the pressure of the press is greater than 3 KN/cm, preferably 8 to 20 KN/cm. In other parts of the invention, the lamination is carried out in a sheet-like process wherein the pressure value of the press is greater than 3 kg/cm 2 , preferably from 80 to 200 kg/cm 2 . In other portions of the invention, the baking temperature is greater than 50 ° C, preferably from 200 to 380 ° C.
由上述本發明實施例可知，本發明具有下列優點。本發明藉由氟系聚合物層的多孔洞性質，讓接著膠層中未固化的接著膠滲透入此些孔洞中，而提升氟系聚合物層與接著膠層之間的接著強度。此外，金屬層更能藉由此接著膠 層與氟系聚合物層接合，以形成穩定的複合基板。再者，更可對氟系聚合物層與接著膠層之間的接觸面進行粗糙化處理，以增加兩者間的接觸面積。藉此，可更進一步提升氟系聚合物層與金屬層之間的接著強度，而形成更穩定的複合基板。總結上述數點，本發明提供一種以氟系聚合物作為介電層之複合基板，以解決氟系聚合物層難以與金屬材料達到穩定結合之問題。 It will be apparent from the above-described embodiments of the present invention that the present invention has the following advantages. The present invention enhances the adhesion strength between the fluorine-based polymer layer and the adhesive layer by the porous nature of the fluorine-based polymer layer, allowing the uncured adhesive in the adhesive layer to penetrate into the pores. In addition, the metal layer can be further glued The layer is bonded to the fluorine-based polymer layer to form a stable composite substrate. Furthermore, the contact surface between the fluorine-based polymer layer and the adhesive layer may be roughened to increase the contact area between the two. Thereby, the adhesion strength between the fluorine-based polymer layer and the metal layer can be further improved to form a more stable composite substrate. To summarize the above, the present invention provides a composite substrate using a fluorine-based polymer as a dielectric layer to solve the problem that the fluorine-based polymer layer is difficult to stably bond with the metal material.
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
100‧‧‧複合基板 100‧‧‧Composite substrate
110‧‧‧氟系聚合物層 110‧‧‧Fluorine polymer layer
112‧‧‧表面孔洞區 112‧‧‧Surface hole area
114‧‧‧內部孔洞區 114‧‧‧Internal hole area
120‧‧‧接著膠層 120‧‧‧Next glue layer
130‧‧‧金屬層 130‧‧‧metal layer
T1‧‧‧厚度 T1‧‧‧ thickness
T2‧‧‧厚度 T2‧‧‧ thickness
Claims (9)
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| TW104120014A TWI604954B (en) | 2015-06-22 | 2015-06-22 | Composite substrate |
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| TW201700277A TW201700277A (en) | 2017-01-01 |
| TWI604954B true TWI604954B (en) | 2017-11-11 |
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