TWI604199B - Multi-turret handler - Google Patents
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- TWI604199B TWI604199B TW106103211A TW106103211A TWI604199B TW I604199 B TWI604199 B TW I604199B TW 106103211 A TW106103211 A TW 106103211A TW 106103211 A TW106103211 A TW 106103211A TW I604199 B TWI604199 B TW I604199B
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Description
本發明係有關於一種多轉塔式測試設備，特別係有關於一種可提高測試效率之多轉塔式測試設備。 The present invention relates to a multi-turret type test apparatus, and more particularly to a multi-turret type test apparatus capable of improving test efficiency.
習知之轉塔機台基於空間限制，無法有效增加電子元件測試數量。在習知概念中，若轉塔直徑加大以容納更多吸嘴，便可增加電子元件測試數量。然而，更多吸嘴亦代表重量增加，慣性太大不利高速旋轉。若因為吸嘴數量增加而降低轉速，則增加索引時間(Index Time)，非但增加了測試過程所需要的時間，也使得測試成本增加。 The conventional turret machine is unable to effectively increase the number of electronic component tests based on space constraints. In the conventional concept, if the diameter of the turret is increased to accommodate more nozzles, the number of electronic component tests can be increased. However, more nozzles also represent an increase in weight, and inertia is too large to facilitate high-speed rotation. If the rotation speed is lowered because the number of nozzles is increased, the index time is increased, which not only increases the time required for the test process, but also increases the test cost.
本發明係為了欲解決習知技術之問題而提供之一種多轉塔式測試設備，適於對複數個電子元件進行測試，包括一主轉塔以及一測試轉塔。主轉塔包括複數個吸嘴。測試轉塔包括複數個傳送架以及一測試單元。測試單元包括複數個測試頭以及複數個測試座，其中，該等傳送架於一第一位置以及一第二位置之間移動，當該等傳送架位於該第一位置時，該等吸嘴各自對該等傳送架取放該等電子元件，當該等傳送架位於該第二位置時，該等傳送架各自對應該等測試座，該等測試頭各自***該等傳送架以及該等測試座之中以對該等電子元件進行測試。 The present invention is a multi-turret test apparatus for solving the problems of the prior art, and is suitable for testing a plurality of electronic components, including a main turret and a test turret. The main turret includes a plurality of nozzles. The test turret includes a plurality of transfer racks and a test unit. The test unit includes a plurality of test heads and a plurality of test sockets, wherein the transport racks are moved between a first position and a second position, and when the transport racks are located at the first position, the nozzles are respectively Receiving the electronic components for the transport racks, and when the transport racks are in the second position, the transport racks respectively correspond to the test sockets, and the test heads are respectively inserted into the transport racks and the test sockets Among them, the electronic components were tested.
在一實施例中，該測試轉塔更包括一主控單元，其中，該等測試座耦接該主控單元，該主控單元透過該等測試座對該等電子元件進行測試。 In one embodiment, the test turret further includes a main control unit, wherein the test sockets are coupled to the main control unit, and the main control unit tests the electronic components through the test sockets.
在一實施例中，該測試轉塔更包括一傳送轉盤，其中，該等傳送架設於該傳送轉盤之上，並隨該傳送轉盤轉動。 In one embodiment, the test turret further includes a transfer carousel, wherein the transfer racks are disposed above the transfer carousel and rotate with the transfer carousel.
在一實施例中，該主轉塔更包括主轉盤，該等吸嘴設於該主轉盤之上，並隨該主轉盤轉動。 In an embodiment, the main turret further includes a main turntable, and the suction nozzles are disposed on the main turntable and rotate with the main turntable.
在一實施例中，該主轉盤以及該傳送轉盤在一投影平面上形成一交集區域，當該等傳送架位於該第一位置時，其中之一該傳送架位於該交集區域之中，並對應其中之一該吸嘴，該吸嘴於該交集區域中對該傳送架取放該電子元件。 In an embodiment, the main turntable and the transfer turntable form an intersection area on a projection plane. When the transport rack is located at the first position, one of the transport racks is located in the intersection area, and corresponds to One of the nozzles, the nozzle picking up and placing the electronic component on the transport rack in the intersection area.
在一實施例中，該傳送轉盤包括複數個輸送皮帶，該等輸送皮帶帶動該等傳送架於該第一位置以及該第二位置之間移動。 In one embodiment, the transfer carousel includes a plurality of conveyor belts that move the conveyors between the first position and the second position.
在一實施例中，該傳送轉盤更包括複數個第一傳送輪以及複數個第二傳送輪，該輸送皮帶由該第一傳送輪以及該第二傳送輪所帶動，該第一傳送輪被轉動以帶動該輸送皮帶，該傳送架被夾設於相鄰且平行設置之該等輸送皮帶之間。 In an embodiment, the transfer carousel further includes a plurality of first transfer wheels and a plurality of second transfer wheels, the transport belt being driven by the first transfer wheel and the second transfer wheel, the first transfer wheel being rotated To drive the conveyor belt, the conveyor is sandwiched between adjacent conveyor belts disposed in parallel.
在一實施例中，該測試轉塔更包括一旋轉軸，該旋轉軸之一端連接該傳送轉盤，該傳送轉盤適於相對該旋轉軸在一第一高度以及一第二高度之間移動，該旋轉軸包括複數個齒條，該齒條嚙合該第一傳送輪，以帶動該第一傳送輪轉動。 In one embodiment, the test turret further includes a rotating shaft, one end of the rotating shaft is coupled to the transfer carousel, and the transfer carousel is adapted to move between a first height and a second height relative to the rotating shaft, The rotating shaft includes a plurality of racks that engage the first transfer wheel to drive the first transfer wheel to rotate.
在一實施例中，該傳送轉盤包括複數個齒軌以及複數個致動器，該致動器連接該傳送架，該致動器嚙合該齒 軌，該致動器沿該齒軌移動，以將該等傳送架於該第一位置以及該第二位置之間移動。 In one embodiment, the transfer carousel includes a plurality of racks and a plurality of actuators coupled to the carriage, the actuators engaging the teeth A rail that moves along the rack to move the rack between the first position and the second position.
在一實施例中，該多轉塔式測試設備更包括一正印檢查轉盤，該正印檢查轉盤位於該主轉塔以及該測試轉塔之間，該正印檢查轉盤包括複數個置放部，該等吸嘴將該等電子元件置於該等置放部以進行檢查，再從該等置放部取起該等電子元件以移送至該等傳送架。 In one embodiment, the multi-turret test apparatus further includes a positive inspection check dial located between the main turret and the test turret, the positive check dial including a plurality of placement portions, and the like The nozzles place the electronic components in the placement sections for inspection, and the electronic components are removed from the placement sections for transport to the transport racks.
應用本發明實施例之多轉塔式測試設備，由於測試的工作由測試轉塔負責，因此電子元件測試數量與吸嘴數量無關，不會有因為吸嘴數量造成重量增加，不利高速旋轉的問題。測試單元的測試頭以及測試座是不會轉動的，其數量可視需要增加，不會有慣性的問題。而傳送架的重量輕，因此傳送架的數量增加不會發生不利高速旋轉的問題。本發明實施例之多轉塔式測試設備，可大幅增加電子元件測試數量，提高測試效率，降低測試成本。此外，在不同的實施例中，單一個主轉塔可搭配多個測試轉塔運作，藉此可更進一步提升測試效率。 When the multi-turret type test equipment of the embodiment of the present invention is applied, since the test work is performed by the test turret, the number of electronic component tests is independent of the number of nozzles, and there is no problem that the weight is increased due to the number of nozzles, and the problem of high-speed rotation is unfavorable. . The test head and the test socket of the test unit are not rotated, and the number thereof can be increased as needed, and there is no problem of inertia. The weight of the transport rack is light, so that the increase in the number of transport racks does not cause the problem of unfavorable high-speed rotation. The multi-turret type test equipment of the embodiment of the invention can greatly increase the number of electronic component tests, improve test efficiency, and reduce test cost. In addition, in different embodiments, a single main turret can be operated with multiple test turrets, thereby further improving test efficiency.
T‧‧‧多轉塔式測試設備 T‧‧‧Multi-turret test equipment
C‧‧‧電子元件 C‧‧‧Electronic components
P1‧‧‧第一位置 P1‧‧‧ first position
P2‧‧‧第二位置 P2‧‧‧ second position
IA‧‧‧交集區域 IA‧‧‧ intersection area
1‧‧‧主轉塔 1‧‧‧Main turret
11‧‧‧吸嘴 11‧‧‧ nozzle
12‧‧‧主轉盤 12‧‧‧Main turntable
2‧‧‧測試轉塔 2‧‧‧Test turret
21‧‧‧傳送架 21‧‧‧Transport
22‧‧‧傳送轉盤 22‧‧‧Transfer carousel
23‧‧‧輸送皮帶 23‧‧‧Conveyor belt
241‧‧‧第一傳送輪 241‧‧‧First transfer wheel
242‧‧‧第二傳送輪 242‧‧‧Second transfer wheel
25‧‧‧旋轉軸 25‧‧‧Rotary axis
251‧‧‧齒條 251‧‧‧Rack
26‧‧‧齒軌 26‧‧‧ rack
27‧‧‧致動器 27‧‧‧Actuator
3‧‧‧測試單元 3‧‧‧Test unit
31‧‧‧測試頭 31‧‧‧Test head
32‧‧‧測試座 32‧‧‧ test seat
4‧‧‧正印檢查轉盤 4‧‧‧Printing inspection turntable
41‧‧‧置放部 41‧‧‧Placement Department
第1A圖係顯示本發明實施例之多轉塔式測試設備的截面示意圖，其中，電子元件欲被置入傳送架。 Fig. 1A is a schematic cross-sectional view showing a multi-turret type test apparatus according to an embodiment of the present invention, in which an electronic component is to be placed in a transport rack.
第1B圖係顯示本發明實施例之多轉塔式測試設備的截面示意圖，其中，電子元件被測試單元測試。 Fig. 1B is a schematic cross-sectional view showing a multi-turret type test apparatus according to an embodiment of the present invention, in which electronic components are tested by a test unit.
第1C圖係顯示本發明實施例之多轉塔式測試設備的截面示意圖，其中，電子元件被吸嘴取出。 Fig. 1C is a schematic cross-sectional view showing a multi-turret type test apparatus according to an embodiment of the present invention, in which an electronic component is taken out by a suction nozzle.
第2圖係顯示本發明實施例之測試單元的系統方塊圖。 Figure 2 is a block diagram showing the system of the test unit of the embodiment of the present invention.
第3圖係顯示本發明實施例之多轉塔式測試設備的俯視示意圖。 Fig. 3 is a top plan view showing a multi-turret type test apparatus according to an embodiment of the present invention.
第4A圖係顯示本發明一實施例之傳送轉盤的俯視示意圖，其中，傳送架位於第一位置。 Figure 4A is a top plan view showing a transfer carousel according to an embodiment of the present invention, wherein the transfer frame is in the first position.
第4B圖係顯示本發明一實施例之傳送轉盤的俯視示意圖，其中，傳送架位於第二位置。 Figure 4B is a top plan view showing a transfer carousel according to an embodiment of the present invention, wherein the transfer frame is in the second position.
第4C圖係顯示本發明一實施例之傳送轉盤的側視示意圖，其中，傳送架位於第一位置。 Figure 4C is a side elevational view showing a transfer carousel in accordance with an embodiment of the present invention, wherein the transfer carriage is in the first position.
第4D圖係顯示本發明一實施例之傳送轉盤的側視示意圖，其中，傳送架位於第二位置。 4D is a side elevational view showing a transfer carousel according to an embodiment of the present invention, wherein the transfer carriage is in the second position.
第5圖係顯示本發明另一實施例之傳送轉盤的俯視示意圖。 Fig. 5 is a schematic plan view showing a transfer carousel according to another embodiment of the present invention.
第1A~1C圖係顯示本發明實施例之多轉塔式測試設備T的截面示意圖。參照第1A~1C圖，本發明實施例之多轉塔式測試設備T，適於對複數個電子元件C進行測試，包括一主轉塔1以及一測試轉塔2。主轉塔1包括複數個吸嘴11。測試轉塔2包括複數個傳送架21以及一測試單元3。測試單元3包括複數個測試頭31以及複數個測試座32，其中，該等傳送架21於一第一位置P1(第1A、1C圖)以及一第二位置P2(第1B圖)之間移動，當該等傳送架21位於該第一位置P1時，該等吸嘴11各自對該等傳送架21取放該等電子元件C，當該等傳送架21位於該第二位置P2時，該等傳送架21各自對應該等測試座32，該等測試 頭31各自***該等傳送架21以及該等測試座32之中以對該等電子元件C進行測試。 1A to 1C are schematic cross-sectional views showing a multi-turret type test apparatus T according to an embodiment of the present invention. Referring to FIGS. 1A-1C, the multi-turret test equipment T of the embodiment of the present invention is suitable for testing a plurality of electronic components C, including a main turret 1 and a test turret 2. The main turret 1 includes a plurality of suction nozzles 11. The test turret 2 includes a plurality of transfer racks 21 and a test unit 3. The test unit 3 includes a plurality of test heads 31 and a plurality of test sockets 32, wherein the transport racks 21 move between a first position P1 (1A, 1C) and a second position P2 (1B). When the transport racks 21 are located at the first position P1, the nozzles 11 each pick up and place the electronic components C to the transport racks 21, when the transport racks 21 are located at the second position P2, Waiting for the transfer rack 21 to correspond to the test socket 32, the test The heads 31 are each inserted into the transport rack 21 and the test sockets 32 to test the electronic components C.
就細部步驟而言，參照第1A圖，首先該等傳送架21位於該第一位置P1，該等吸嘴11依序將該等電子元件C置於該等傳送架21。接著，參照第1B圖，該等傳送架21被移至該第二位置P2以供該測試單元3進行檢測。檢測完畢後，參照第1C圖，該等傳送架21移至該第一位置P1，該等吸嘴11依序將該等電子元件C從該等傳送架21取出。 For the detailed steps, referring to FIG. 1A, first, the transport frames 21 are located at the first position P1, and the nozzles 11 sequentially place the electronic components C on the transport frames 21. Next, referring to FIG. 1B, the transport racks 21 are moved to the second position P2 for the test unit 3 to detect. After the detection, referring to FIG. 1C, the transport frames 21 are moved to the first position P1, and the nozzles 11 sequentially take the electronic components C out of the transport frames 21.
參照第2圖，在一實施例中，該測試轉塔更包括一主控單元33，其中，該等測試座32耦接該主控單元33，該主控單元33透過該等測試座32對該等電子元件C進行測試。一般而言，該等測試座32由於耦接主控單元33，因此其位置不會相對主控單元33而移動。然，上述揭露並未限制本發明。在一實施例中，該等測試座32與該主控單元33之間透過電纜線連接，相較於習知技術，電纜的長度可縮短。 Referring to FIG. 2, in an embodiment, the test turret further includes a main control unit 33, wherein the test sockets 32 are coupled to the main control unit 33, and the main control unit 33 passes through the test sockets 32. These electronic components C are tested. In general, the test sockets 32 are not moved relative to the main control unit 33 because they are coupled to the main control unit 33. However, the above disclosure does not limit the invention. In an embodiment, the test sockets 32 and the main control unit 33 are connected by a cable, and the length of the cable can be shortened compared with the prior art.
再參照第1A~1C圖，在一實施例中，該測試轉塔2更包括一傳送轉盤22，其中，該等傳送架21設於該傳送轉盤22之上，並隨該傳送轉盤22轉動。該主轉塔1更包括主轉盤12，該等吸嘴11設於該主轉盤12之上，並隨該主轉盤12轉動。 Referring again to FIGS. 1A-1C, in an embodiment, the test turret 2 further includes a transfer carousel 22, wherein the transfer frames 21 are disposed above the transfer carousel 22 and rotate with the transfer carousel 22. The main turret 1 further includes a main turntable 12, which is disposed above the main turntable 12 and rotates with the main turntable 12.
參照第1A~1C、3圖、在一實施例中，該主轉盤12以及該傳送轉盤22在一投影平面上形成一交集區域IA，當該等傳送架21位於該第一位置P1時，其中之一該傳送架21位於該交集區域IA之中，並對應其中之一該吸嘴11，該吸嘴11於該交集區域IA中對該傳送架21取放該電子元件C。 Referring to FIGS. 1A-1C and 3, in an embodiment, the main turntable 12 and the transfer turntable 22 form an intersection area IA on a projection plane, and when the transport frames 21 are located at the first position P1, One of the transport racks 21 is located in the intersection area IA and corresponds to one of the nozzles 11, and the nozzle 11 picks up the electronic component C in the transporting area 21 in the intersection area IA.
參照第4A~4D圖，在一實施例中，該傳送轉盤22包括複數個輸送皮帶23，該等輸送皮帶23帶動該等傳送架21於該第一位置P1以及該第二位置P2之間移動。在一實施例中，該傳送轉盤22更包括複數個第一傳送輪241以及複數個第二傳送輪242，該輸送皮帶23由該第一傳送輪241以及該第二傳送輪242所帶動，該第一傳送輪241被轉動以帶動該輸送皮帶23，該傳送架21被夾設於相鄰且平行設置之該等輸送皮帶23之間。 Referring to Figures 4A-4D, in one embodiment, the transfer carousel 22 includes a plurality of conveyor belts 23 that move the conveyor frames 21 between the first position P1 and the second position P2. . In an embodiment, the transfer carousel 22 further includes a plurality of first transfer wheels 241 and a plurality of second transfer wheels 242. The conveyor belt 23 is driven by the first transfer wheel 241 and the second transfer wheel 242. The first transfer wheel 241 is rotated to drive the transport belt 23, which is sandwiched between adjacent and parallel transport belts 23.
在一實施例中，該等輸送皮帶23可以為齒形皮帶，該等輸送皮帶23嚙合該第一傳送輪241以及該第二傳送輪242，藉此可為傳送架21提供更準確的定位效果。然，上述揭露並未限制本創作，例如，該等傳送架21的定位亦可以由止擋結構所提供。 In an embodiment, the conveyor belts 23 may be toothed belts that engage the first conveyor wheel 241 and the second conveyor wheel 242, thereby providing a more accurate positioning effect for the conveyor frame 21. . However, the above disclosure does not limit the creation. For example, the positioning of the transport racks 21 can also be provided by the stop structure.
參照第4A~4D圖，在一實施例中，該測試轉塔2更包括一旋轉軸25，該旋轉軸25之一端連接該傳送轉盤22，該傳送轉盤22適於相對該旋轉軸25在一第一高度(第4C圖)以及一第二高度(第4D圖)之間移動，該旋轉軸25包括複數個齒條251，該齒條251嚙合該第一傳送輪241，以帶動該第一傳送輪241。 Referring to Figures 4A-4D, in an embodiment, the test turret 2 further includes a rotating shaft 25, one end of which is coupled to the transfer carousel 22, the transfer carousel 22 being adapted to be opposite the rotating shaft 25 Moving between a first height (Fig. 4C) and a second height (Fig. 4D), the rotating shaft 25 includes a plurality of racks 251 that engage the first transfer wheel 241 to drive the first Transfer wheel 241.
參照第5圖，在另一實施例中，該傳送轉盤22包括複數個齒軌26以及複數個致動器27，該致動器27連接該傳送架21，該致動器27透過齒輪嚙合該齒軌26，該致動器27沿該齒軌26移動，以將該等傳送架21於該第一位置P1以及該第二位置P2之間移動。該致動器27可以為電動馬達。 Referring to Figure 5, in another embodiment, the transfer carousel 22 includes a plurality of racks 26 and a plurality of actuators 27 coupled to the carriage 21, the actuators 27 engaging the gears The rack 26 moves along the rack 26 to move the transport rack 21 between the first position P1 and the second position P2. The actuator 27 can be an electric motor.
在本發明之實施例中，雖已揭露兩種不同之傳送 架的移動手段，然而，上述揭露並未限制本發明，傳送架亦可能以其他手段進行移動。 In the embodiment of the invention, two different transmissions have been disclosed The means of movement of the rack, however, the above disclosure does not limit the invention, and the transport rack may be moved by other means.
再參照第3圖，在一實施例中，該多轉塔式測試設備T更包括一正印檢查轉盤4，該正印檢查轉盤4位於該主轉塔1以及該測試轉塔2之間，該正印檢查轉盤4包括複數個置放部41，該等吸嘴11將該等電子元件C置於該等置放部41以進行檢查，再從該等置放部41取起該等電子元件C以移送至該等傳送架21。 Referring again to FIG. 3, in an embodiment, the multi-turret test apparatus T further includes a positive inspection turntable 4 located between the main turret 1 and the test turret 2, the print The inspection turntable 4 includes a plurality of placement portions 41. The suction nozzles 11 place the electronic components C on the placement portions 41 for inspection, and then pick up the electronic components C from the placement portions 41. Transfer to the transport racks 21.
應用本發明實施例之多轉塔式測試設備，由於測試的工作由測試轉塔負責，因此電子元件測試數量與吸嘴數量無關，不會有因為吸嘴數量造成重量增加，不利高速旋轉的問題。測試單元的測試頭以及測試座是不會轉動的，其數量可視需要增加，不會有慣性的問題。而傳送架的重量輕，因此傳送架的數量增加不會發生不利高速旋轉的問題。本發明實施例之多轉塔式測試設備，可大幅增加電子元件測試數量，提高測試效率，降低測試成本。此外，在不同的實施例中，單一個主轉塔可搭配多個測試轉塔運作，藉此可更進一步提升測試效率。 When the multi-turret type test equipment of the embodiment of the present invention is applied, since the test work is performed by the test turret, the number of electronic component tests is independent of the number of nozzles, and there is no problem that the weight is increased due to the number of nozzles, and the problem of high-speed rotation is unfavorable. . The test head and the test socket of the test unit are not rotated, and the number thereof can be increased as needed, and there is no problem of inertia. The weight of the transport rack is light, so that the increase in the number of transport racks does not cause the problem of unfavorable high-speed rotation. The multi-turret type test equipment of the embodiment of the invention can greatly increase the number of electronic component tests, improve test efficiency, and reduce test cost. In addition, in different embodiments, a single main turret can be operated with multiple test turrets, thereby further improving test efficiency.
在一實施例中，電子元件包括複數個接腳，在測試時，該測試頭壓在接腳的上表面，接腳穿過傳送架底部開孔而接觸測試座的接點。由於作用於接腳的力量上下抵銷，因此接腳形狀不會被改變。 In one embodiment, the electronic component includes a plurality of pins that, when tested, press against the upper surface of the pin, the pin passing through the bottom opening of the carrier to contact the contact of the test pad. Since the force acting on the pins is offset up and down, the shape of the pins is not changed.
在一實施例中，該測試轉塔可設置於一腔體之中，該腔體內的溫度可以被控制，藉此可滿足於不同環境條件進行測試的需求。 In one embodiment, the test turret can be disposed in a cavity, and the temperature within the cavity can be controlled, thereby satisfying the need for testing under different environmental conditions.
雖然本發明已以具體之較佳實施例揭露如上，然其並非用以限定本發明，任何熟習此項技術者，在不脫離本發明之精神和範圍內，仍可作些許的更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and may be modified and modified without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
T‧‧‧多轉塔式測試設備 T‧‧‧Multi-turret test equipment
C‧‧‧電子元件 C‧‧‧Electronic components
P1‧‧‧第一位置 P1‧‧‧ first position
1‧‧‧主轉塔 1‧‧‧Main turret
11‧‧‧吸嘴 11‧‧‧ nozzle
12‧‧‧主轉盤 12‧‧‧Main turntable
2‧‧‧測試轉塔 2‧‧‧Test turret
21‧‧‧傳送架 21‧‧‧Transport
22‧‧‧傳送轉盤 22‧‧‧Transfer carousel
3‧‧‧測試單元 3‧‧‧Test unit
31‧‧‧測試頭 31‧‧‧Test head
32‧‧‧測試座 32‧‧‧ test seat
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106103211A TWI604199B (en) | 2017-01-26 | 2017-01-26 | Multi-turret handler |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106103211A TWI604199B (en) | 2017-01-26 | 2017-01-26 | Multi-turret handler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI604199B true TWI604199B (en) | 2017-11-01 |
| TW201827832A TW201827832A (en) | 2018-08-01 |
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| TW106103211A TWI604199B (en) | 2017-01-26 | 2017-01-26 | Multi-turret handler |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI649571B (en) * | 2018-06-05 | 2019-02-01 | 華邦電子股份有限公司 | Electronic element inspection equipment |
| CN111936401A (en) * | 2018-10-16 | 2020-11-13 | 上野精机株式会社 | Turnover unit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080290004A1 (en) * | 2007-05-25 | 2008-11-27 | Pei Wei Tsai | System for testing and sorting electronic components |
| CN205246703U (en) * | 2015-11-19 | 2016-05-18 | 日月光半导体（昆山）有限公司 | Capstan head test board and mount pad thereof |
| CN103809097B (en) * | 2012-11-13 | 2016-08-17 | 京元电子股份有限公司 | There is test bench and the test system thereof of Improvement type compression leg |
| TWI567394B (en) * | 2014-07-07 | 2017-01-21 | 京元電子股份有限公司 | Magnetic coil test machine and test equipment using the same |
-
2017
- 2017-01-26 TW TW106103211A patent/TWI604199B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080290004A1 (en) * | 2007-05-25 | 2008-11-27 | Pei Wei Tsai | System for testing and sorting electronic components |
| JP2008292450A (en) * | 2007-05-25 | 2008-12-04 | Asm Assembly Automation Ltd | System for inspecting and sorting electronic component |
| CN103809097B (en) * | 2012-11-13 | 2016-08-17 | 京元电子股份有限公司 | There is test bench and the test system thereof of Improvement type compression leg |
| TWI567394B (en) * | 2014-07-07 | 2017-01-21 | 京元電子股份有限公司 | Magnetic coil test machine and test equipment using the same |
| CN205246703U (en) * | 2015-11-19 | 2016-05-18 | 日月光半导体（昆山）有限公司 | Capstan head test board and mount pad thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI649571B (en) * | 2018-06-05 | 2019-02-01 | 華邦電子股份有限公司 | Electronic element inspection equipment |
| CN111936401A (en) * | 2018-10-16 | 2020-11-13 | 上野精机株式会社 | Turnover unit |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201827832A (en) | 2018-08-01 |
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