TWI603810B - A polishing apparatus and a polishing method of polishing the peripheral edge of a workpiece such as a plate glass with a - Google Patents

A polishing apparatus and a polishing method of polishing the peripheral edge of a workpiece such as a plate glass with a Download PDF

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TWI603810B
TWI603810B TW102118246A TW102118246A TWI603810B TW I603810 B TWI603810 B TW I603810B TW 102118246 A TW102118246 A TW 102118246A TW 102118246 A TW102118246 A TW 102118246A TW I603810 B TWI603810 B TW I603810B
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polishing
workpiece
axis
polished
grinding
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TW102118246A
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Chinese (zh)
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TW201420267A (en
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Mitsunobu Shishido
Naohiro Yamaguchi
Satoru Sato
Toru Yamazaki
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Nihon Micro Coating Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/16—Machines or devices using grinding or polishing belts; Accessories therefor for grinding other surfaces of particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B24B21/22—Accessories for producing a reciprocation of the grinding belt normal to its direction of movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Surface Treatment Of Glass (AREA)

Description

利用研磨帶研磨板狀玻璃等工件之周緣部的研磨裝置及研磨方法 Polishing device and polishing method for polishing a peripheral portion of a workpiece such as a plate glass by a polishing tape

本發明係關於一種行動電話機顯示窗、液晶面板、有機EL面板、電漿面板、太陽能電池面板等之平面顯示器或電子零件用之覆蓋玻璃(cover glass)、光學濾光片等所使用之板狀玻璃等工件的裝置及研磨方法。尤其是關於一種使用研磨帶高精度地研磨板狀玻璃等工件之周緣部的研磨裝置及研磨方法。 The present invention relates to a flat display for a mobile phone display window, a liquid crystal panel, an organic EL panel, a plasma panel, a solar cell panel, or a cover glass for an electronic component, an optical filter, or the like. A device such as glass and a polishing method. In particular, a polishing apparatus and a polishing method for polishing a peripheral portion of a workpiece such as a sheet glass using a polishing tape with high precision.

近年來，智慧型手機(smart phone)、平板型終端(tablet type terminal)等的市場正擴大中。此等的電子機器，其顯示器多露出，且在掉落或撞擊時容易受傷。顯示器之尺寸，例如，智慧型手機為5吋前後，平板型終端為6吋至10吋前後，功能型手機(feature phone)為3吋前後(高寬比(aspect ratio)通常為4：3之橫：縱比率，寬的情況為16：9)。用以保護如此電子機器用之顯示器的覆蓋構件之需要正增大中。 In recent years, markets such as smart phones and tablet type terminals are expanding. In such electronic machines, the display is exposed and is easily injured when dropped or hit. The size of the display, for example, is 5 inches before and after the smart phone, 6 inches to 10 inches before and after the tablet terminal, and the front and rear of the feature phone is 3 inches (the aspect ratio is usually 4:3). Horizontal: vertical ratio, width is 16:9). The need to cover the cover members of displays for such electronic devices is increasing.

作為顯示器(主要顯示器、輔助顯示器、照 相機之顯示器等)之覆蓋構件的材料，近年來已增大採用覆蓋玻璃，取代在先前之單面(或雙面)施予硬塗敷的耐傷性之丙烯酸或聚碳酸酯，其課題在於提高該覆蓋玻璃之強度。 As a display (main display, auxiliary display, photo The material of the covering member of a camera display or the like has been increased in recent years by using a cover glass instead of the acrylic or polycarbonate which is hard-coated on the previous single side (or both sides), and the problem is to improve The strength of the cover glass.

玻璃，雖然在理論上是強度高的材料(1000 kg/mm2至2000 kg/mm2)，但是實際的強度很低(3 kg/mm2至20 kg/mm2)。此是因在玻璃之表面等有存在眼睛看不到的細微之傷痕、裂痕(crack)、崩裂(chipping)等(潛在傷痕)，且在拉伸應力作用於玻璃時會發生應力集中，而多造成破損原因之故。 Glass, although theoretically a high strength material (1000 kg/mm 2 to 2000 kg/mm 2 ), has a very low actual strength (3 kg/mm 2 to 20 kg/mm 2 ). This is because there are fine scratches, cracks, chipping, etc. (potential scratches) that are invisible to the eyes on the surface of the glass, and stress concentration occurs when tensile stress acts on the glass. Cause the damage.

為了提高玻璃之強度，雖然思考了各式各樣的物理方法(表面急冷法等)、化學方法(化學蝕刻處理、離子交換法等)，但是在採用此等的強化方法的情況，重要的也是在於除掉造成破損原因的玻璃之細微傷痕。 In order to increase the strength of the glass, various physical methods (surface quenching method, etc.) and chemical methods (chemical etching treatment, ion exchange method, etc.) have been considered. However, in the case of using such a strengthening method, it is also important. It is to remove the slight flaws of the glass that caused the damage.

覆蓋玻璃，大致上是將作為材料的玻璃素板切斷成預定的尺寸，且藉由對此施予各式各樣的加工所製造。玻璃素板之作為切斷面的端面，係形成有細微的傷痕或裂痕等。為了要除掉形成於如此端面之細微的傷痕，而進行除掉稜部或角部之倒角(淺倒角)。 The cover glass is roughly cut into a predetermined size by cutting a glass plate as a material, and is manufactured by subjecting various processes to this. The end surface of the glass plate as the cut surface is formed with fine scratches or cracks. In order to remove the minute flaws formed on such end faces, chamfering (shallow chamfering) of the ridges or corners is removed.

在倒角中，係可進行研磨預定形狀(矩形等)之板狀玻璃的邊部(端面與上面或下面之境界部)之所謂的C倒角、或是研磨角部(一個端面與相鄰的端面之境界部)之所謂的R倒角等。 In the chamfering, it is possible to perform so-called C-chamfering or grinding of the edge portion (end surface and the upper or lower boundary portion) of the plate-shaped glass of a predetermined shape (rectangular or the like) (one end face and adjacent side) The so-called R chamfer of the end face of the end face.

先前，在C倒角或R倒角係使用磨石等的研磨材料，尤其是在R倒角中因R形狀(例如，R1、R10等)，而需要對應的形狀之研磨材料，且難以高精度地形成研磨材料之形狀。又，難以維持、提高研磨程式之製作或藉由研磨所形成的被研磨面之品質。 Conventionally, in C chamfering or R chamfering, an abrasive material such as a grindstone is used, and in particular, an R-shaped shape (for example, R1, R10, etc.) in the R chamfering is required, and an abrasive material of a corresponding shape is required, and it is difficult to be high. The shape of the abrasive material is formed with precision. Moreover, it is difficult to maintain and improve the quality of the surface to be polished or the surface to be polished formed by polishing.

先前，進行一種C倒角加工，其將大致圓盤狀的研削磨石之圓盤面傾斜而壓抵於板狀玻璃之稜部藉此僅去除稜部(日本特開2000-233351公報：專利文獻1)。又，進行一種C倒角加工，其在研削磨石之端面設置傾斜面，將該傾斜面壓抵於板狀玻璃之稜部僅去除稜部(日本特開2003-231046公報：專利文獻2，日本特開2011-51068公報：專利文獻3)。 In the past, a C-chamfering process was performed in which the disk surface of the substantially disk-shaped grinding stone was inclined and pressed against the edge of the plate glass to thereby remove only the rib (Japanese Patent Laid-Open Publication No. 2000-233351: Patent Document 1). Further, a C-chamfering process is provided in which an inclined surface is provided on the end surface of the grinding stone, and the inclined surface is pressed against the edge portion of the sheet glass to remove only the rib portion (Japanese Patent Laid-Open Publication No. 2003-231046: Patent Document 2, Japanese Laid-Open Patent Publication No. 2011-51068: Patent Document 3).

再者，進行R倒角加工或造型加工，其在研削磨石之端面形成圓弧狀之凹部或所期望的形狀之凹部，並仿照研削磨石之端面形狀而去除板狀玻璃之端面(日本特開2002-59346公報：專利文獻4，日本特開2001-85710公報：專利文獻5)。 Further, R chamfering or molding is performed, and an arc-shaped concave portion or a concave portion of a desired shape is formed on the end surface of the grinding stone, and the end surface of the plate glass is removed in accordance with the shape of the end surface of the grinding stone (Japan JP-A-2002-59346: Patent Document 4, Japanese Laid-Open Patent Publication No. 2001-85710: Patent Document 5).

在如上述之先前的倒角加工中，作為研削磨石，可使用將金屬粉末凝固並燒結且將鑽石研磨粒固定所成的金屬黏結(metal bond)之鑽石輪等，且使用研磨粒之尺寸不同的輪(磨石)，進行一次加工與二次加工。在一次加工中，係可使用採用網格大小(mesh size)為#325至#600之鑽石粒子的輪，而加工後的板狀玻璃端緣部之平均表面粗糙度Ra，大致是在0.5μm至1.0μm之範 圍。為了縮小該表面粗糙度，在二次加工中，係使用成形為與一次加工用之輪相同的剖面形狀之採用網格大小為#1000至#2000之鑽石粒子的精加工用輪。 In the above-described chamfering process as described above, as the grinding stone, a metal wheel which is formed by solidifying and sintering a metal powder and fixing the diamond abrasive grains may be used, and the size of the abrasive grain is used. Different rounds (grinding stones), one processing and two processing. In one processing, a wheel having a mesh size of #325 to #600 diamond particles can be used, and the average surface roughness Ra of the edge portion of the processed sheet glass is approximately 0.5 μm. To 1.0μm Wai. In order to reduce the surface roughness, in the secondary processing, a finishing wheel using diamond particles having a mesh size of #1000 to #2000 is formed using the same cross-sectional shape as that of the primary processing wheel.

又，有提案一種纖維間由樹脂所填充的纖維構成體之倒角輪、或配設有網格大小為#500至#2000之碳化矽、氧化鋁等研磨粒所成的樹脂構成體之倒角輪，取代如上述之金屬黏結的鑽石輪(日本特開2002-160147公報：專利文獻6)。一邊使該倒角輪(磨石)旋轉，一邊將形成剖面凹狀的輪之周緣部壓抵於液晶顯示器用板狀玻璃等之端面，藉此進行加工。為了消除加工不均且進行均等的研磨，倒角輪，係將旋轉軸相對於豎立在板狀玻璃之表面的垂線傾斜預定之角度來使用。 Further, there is proposed a chamfering wheel of a fiber structure in which a fiber is filled with a resin, or a resin structure in which abrasive grains such as tantalum carbide or alumina having a mesh size of #500 to #2000 are disposed. The angle wheel replaces the metal-bonded diamond wheel as described above (JP-A-2002-160147: Patent Document 6). When the chamfering wheel (grinding stone) is rotated, the peripheral edge portion of the wheel having a concave cross section is pressed against the end surface of the sheet glass for liquid crystal display or the like to perform processing. In order to eliminate uneven machining and perform uniform grinding, the chamfering wheel is used by inclining the rotating shaft at a predetermined angle with respect to a perpendicular line standing on the surface of the sheet glass.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

(專利文獻1)日本特開2000-233351公報 (Patent Document 1) Japanese Patent Laid-Open Publication No. 2000-233351

(專利文獻2)日本特開2003-231046公報 (Patent Document 2) Japanese Patent Laid-Open Publication No. 2003-231046

(專利文獻3)日本特開2011-51068公報 (Patent Document 3) Japanese Patent Laid-Open Publication No. 2011-51068

(專利文獻4)日本特開2002-59346公報 (Patent Document 4) Japanese Patent Laid-Open Publication No. 2002-59346

(專利文獻5)日本特開2001-85710公報 (Patent Document 5) Japanese Patent Laid-Open Publication No. 2001-85710

(專利文獻6)日本特開2002-160147公報 (Patent Document 6) Japanese Patent Laid-Open Publication No. 2002-160147

當將如上述之磨石(輪)壓抵於板狀玻璃之端緣部並一邊使其旋轉一邊進行倒角時，就有磨石之堵塞或磨石之磨損會慢慢地進行的問題。當磨石之加工部的形狀等因堵塞或磨損而變差時，就會在板狀玻璃之周緣部發生研削傷痕，且因磨石未接觸到板狀玻璃之周緣部的局部而會產生未加工部(加工不均)，又，有時會因加工壓力之不均等而產生燒傷等。 When the grindstone (wheel) as described above is pressed against the edge portion of the sheet glass and is chamfered while being rotated, there is a problem that the blockage of the grindstone or the abrasion of the grindstone proceeds slowly. When the shape or the like of the processed portion of the grindstone is deteriorated due to clogging or abrasion, scratches are formed on the peripheral edge portion of the sheet glass, and the grindstone does not contact a portion of the peripheral portion of the sheet glass. In the processing unit (uneven processing), burns may occur due to uneven processing pressure.

在磨石之加工部的形狀等變差的情況，雖然可進行修整(dressing)或整形(truing)，但是在鑽石輪中，因不可缺少高度的成形精度，且在修整等或磨石之位置調整需要費時，故而作業效率降低。又，因有必要在多有殘留磨石之未使用區域的狀態下進行加工部之修整等，或進行磨石之交換以延長壽命，故而有增大成本的問題。 In the case where the shape of the processed portion of the grindstone is deteriorated, although dressing or truing can be performed, in the diamond wheel, the molding precision is indispensable, and the position of the dressing or the grindstone is indispensable. Adjustments take time, so work efficiency is reduced. Further, there is a problem in that it is necessary to carry out trimming of the processed portion or the like in the state where the unused portion of the grindstone is often used, or to exchange the grindstone to prolong the life.

又，當使用磨石進行板狀玻璃之周緣部的倒角時，在將磨石抵接於加工物時就會施加機械衝擊，會有玻璃因該衝擊而破損，且加工良率變差的問題。 Further, when the chamfering of the peripheral portion of the sheet glass is performed using the grindstone, a mechanical impact is applied when the grindstone is in contact with the workpiece, and the glass is broken by the impact, and the processing yield is deteriorated. problem.

與金屬黏結的鑽石輪相比在剛性較低之樹脂構成體等的倒角輪(專利文獻6)中，可減少朝向板狀玻璃之端緣部的衝擊，且減少缺陷或傷痕的發生。但是，因磨石的損耗變得急劇使得加工部之形狀變化加速，亦會發生堵塞，故而有磨石的修整(或整形)之頻度高的問題。又，因磨石之磨損渣滓附著於板狀玻璃等工件，需要洗淨裝置或洗淨工序，或是會弄髒裝置本身，故而有裝置保養 費時的問題。 Compared with a metal-bonded diamond wheel, a chamfering wheel such as a resin structure having a low rigidity (Patent Document 6) can reduce the impact toward the edge portion of the sheet glass and reduce the occurrence of defects or scratches. However, since the loss of the grindstone is sharp, the shape change of the processed portion is accelerated, and clogging also occurs, so that the frequency of dressing (or shaping) of the grindstone is high. In addition, since the wear debris of the grindstone adheres to a workpiece such as a sheet glass, a cleaning device or a washing process is required, or the device itself is soiled, so that the device is maintained. Time-consuming problem.

再者，近年來需要正擴大中的顯示器用之覆蓋玻璃(板狀玻璃)有被要求厚度要薄(例如，1mm以下)，且能更高精度地倒角加工周緣部(稜部或角部)。在使用先前的研削磨石來倒角板狀玻璃之周緣部的情況，所得的加工面之精度不夠充分，在周緣部會殘留細微的傷痕或崩裂，無法藉由研磨提高板狀玻璃之強度。 In addition, in recent years, it is required that the cover glass (sheet glass) for display that is being enlarged is required to be thin (for example, 1 mm or less), and the peripheral portion (edge or corner portion) can be chamfered with higher precision. ). When the peripheral grinding portion of the chamfered plate glass is used using the conventional grinding stone, the precision of the obtained machined surface is insufficient, and fine scratches or cracks remain in the peripheral portion, and the strength of the plate glass cannot be improved by polishing.

有鑑於上述問題，本發明之目的係在於提供一種可以使用研磨帶來研磨板狀玻璃等工件之周緣部(邊部、角部等)，且高精度地加工的研磨裝置。又，提供一種可以使用研磨裝置與研磨帶，來研磨具有各式各樣之形狀的工件之周緣部的研磨裝置。 In view of the above problems, an object of the present invention is to provide a polishing apparatus which can polish a peripheral portion (a side portion, a corner portion, and the like) of a workpiece such as a sheet glass by using a polishing belt and process it with high precision. Further, there is provided a polishing apparatus which can polish a peripheral portion of a workpiece having various shapes using a polishing apparatus and a polishing tape.

又，為了提高板狀玻璃之強度，其目的在於提供一種高精度地研磨板狀玻璃之周緣部的研磨方法。其目的在於提供一種藉由該方法而研磨，且提高強度的板狀玻璃。 Further, in order to increase the strength of the sheet glass, it is an object of the invention to provide a polishing method for polishing the peripheral edge portion of the sheet glass with high precision. It is an object of the invention to provide a sheet glass which is ground by the method and which has improved strength.

解決上述課題的本發明之一態樣之用以使用研磨帶來研磨工件之周緣部的研磨裝置，其特徵為，包含：第1研磨部，其係具有水平的第1研磨軸線，用以研磨工件之周緣部之直線的被研磨部分；以及第2研磨部，其係具有水平的第2研磨軸線，用以研磨工件之周緣部之非直線的被研磨部分，第1研磨部，係包含：第1工件單 元，其係用以保持工件；以及第1研磨帶單元，其係用以夾隔著第1研磨軸線而與第1工件單元相對向地配置第1研磨帶之至少一部分的表面，第2研磨部，係包含：第2工件單元，其係用以保持工件；以及第2研磨帶單元，其係用以夾隔著第2研磨軸線而與第2工件單元相對向地配置第2研磨帶之至少一部分的表面，在第1研磨部中，所配置的第1研磨帶之表面係劃分為第1研磨面，可藉由直線的被研磨部分與第1研磨面相接觸並在第1研磨軸線相對移動進行研磨，在第2研磨部中，所配置的第2研磨帶之表面係劃分為第2研磨面，可藉由非直線的被研磨部分與第2研磨面相接觸並在第2研磨軸線相對移動進行研磨。 A polishing apparatus for polishing a peripheral portion of a workpiece using a polishing belt according to the aspect of the invention, characterized in that the first polishing portion includes a horizontal first polishing axis for polishing a polished portion of a straight line at a peripheral portion of the workpiece; and a second polishing portion having a horizontal second polishing axis for polishing a non-linear polished portion of the peripheral portion of the workpiece, wherein the first polishing portion includes: 1st work order And a first polishing tape unit for arranging at least a part of the surface of the first polishing tape facing the first workpiece unit with the first polishing axis interposed therebetween, and the second polishing The second workpiece unit is configured to hold the workpiece, and the second polishing belt unit is configured to arrange the second polishing belt opposite to the second workpiece unit with the second polishing axis interposed therebetween In at least a part of the surface, the surface of the first polishing tape disposed in the first polishing portion is divided into a first polishing surface, and the linearly polished portion is in contact with the first polishing surface and is opposed to the first polishing axis. Moving and polishing, in the second polishing portion, the surface of the second polishing tape disposed is divided into a second polishing surface, and the non-linear polished portion is in contact with the second polishing surface and is opposed to the second polishing axis. Move to grind.

藉由如此地構成，可以使用研磨帶，以研磨裝置來研磨工件之周緣部之直線的被研磨部分、例如矩形的板狀玻璃之邊部(稜部)、與工件之周緣部之非直線的被研磨部、例如矩形的板狀玻璃之角部。又，藉由如上述地構成，例如將第1研磨帶與第2研磨帶(亦可為相同物)配置於研磨裝置，藉此可以研磨各式各樣的形狀(例如，直線的形狀或具有預定曲率的形狀)之被研磨部分。本發明之研磨裝置，係可以高精度地研磨厚度為1mm以下的薄板工件之周緣部。工件可為板狀玻璃，亦可為由矽等之結晶材料所構成的板。本發明係特別為了提高由具有劈開性之結晶材料所構成的板之強度，而有效地研磨周緣部。工件，可為由不具有劈開性之結晶材料所構成的板， 又可為由不銹鋼或鋁等之金屬材料所構成的板。 According to this configuration, the polishing belt can be used to polish the polished portion of the straight portion of the peripheral portion of the workpiece, for example, the side portion (edge portion) of the rectangular sheet glass and the non-linear portion of the peripheral portion of the workpiece. The corner of the portion to be polished, for example, a rectangular plate glass. Further, by configuring as described above, for example, the first polishing tape and the second polishing tape (which may be the same) are disposed in the polishing device, whereby various shapes (for example, a straight shape or have a shape) can be polished. The portion of the curvature that is predetermined to be ground. In the polishing apparatus of the present invention, the peripheral portion of the thin plate workpiece having a thickness of 1 mm or less can be polished with high precision. The workpiece may be a plate glass or a plate made of a crystalline material such as tantalum. In the present invention, in particular, in order to increase the strength of a plate composed of a crystal material having a cleavage property, the peripheral portion is efficiently polished. The workpiece may be a plate composed of a crystalline material having no cleavage property. Further, it may be a plate made of a metal material such as stainless steel or aluminum.

本發明之研磨裝置，較佳是為了從第1研磨部至第2研磨部進行自動的連續研磨，而亦可包含工件搬運單元。工件搬運單元，較佳是具有用以吸附搬運工件之上面的機械臂手段。工件搬運單元之機械臂手段，又是在工件單元上旋轉配置工件。例如，如第15圖所示，有關矩形的工件W，係以作為工件之對角線之交叉點的中心C1、或是包含工件之短邊的正方形之對角線之交叉點的中心C2為中心，來旋轉工件(每一90度、或每一180度)。藉由具有工件搬運單元，可以連續且自動地研磨例如包含矩形的工件之四個端面(或是，上面、下面的八邊)或四個腳部的工件之周緣部全體。 The polishing apparatus of the present invention preferably includes a workpiece transfer unit for automatic continuous polishing from the first polishing portion to the second polishing portion. The workpiece handling unit preferably has a mechanical arm means for adsorbing the upper surface of the workpiece. The robot arm means of the workpiece handling unit rotates the workpiece on the workpiece unit. For example, as shown in Fig. 15, the workpiece W relating to the rectangle is center C1 which is the intersection of the diagonal of the workpiece, or the center C2 of the intersection of the diagonals of the square including the short side of the workpiece. Center to rotate the workpiece (every 90 degrees, or 180 degrees each). By having the workpiece transfer unit, it is possible to continuously and automatically polish, for example, the entire peripheral portion of the workpiece including the four end faces of the rectangular workpiece (or the upper and lower sides) or the four leg portions.

本發明之研磨裝置，較佳是研磨由板狀玻璃所構成的工件之周緣部。當研磨由板狀玻璃所構成的工件之周緣部時，在研磨裝置之第1研磨部中，直線的被研磨部分與第1研磨面，係以將板狀玻璃之周緣部之直線的被研磨部分，形成平均表面粗糙度Ra為20nm以下、且最大谷深Rv為200nm以下的方式相對移動，在第2研磨部中，非直線的被研磨部分與第2研磨面，係以將板狀玻璃之周緣部之非直線的被研磨部分，形成平均表面粗糙度Ra為20nm以下、且最大谷深Rv為200nm以下的方式相對移動。 In the polishing apparatus of the present invention, it is preferable to polish the peripheral portion of the workpiece formed of the sheet glass. When the peripheral portion of the workpiece made of the sheet glass is polished, in the first polishing portion of the polishing apparatus, the straight polished portion and the first polishing surface are polished by a straight line connecting the peripheral portions of the sheet glass. In some cases, the average surface roughness Ra is 20 nm or less, and the maximum valley depth Rv is 200 nm or less. In the second polishing portion, the non-linear polished portion and the second polished surface are plate-shaped glass. The non-linear polished portion of the peripheral portion is relatively moved so that the average surface roughness Ra is 20 nm or less and the maximum valley depth Rv is 200 nm or less.

本發明之研磨裝置，係研磨板狀玻璃之周緣部，並以提高板狀玻璃之機械強度的方式所構成。如第 16圖所示，作為被研磨部的板狀玻璃W，係在主表面(上面、下面)或端面之周緣部(稜部、角部)，具有當割斷素板時所形成的(A)凹部或凸部、及(B)裂痕等。形成於稜部的尖銳之凸部係成為崩裂之起點，而裂痕係成為板狀玻璃之破壞的起點。本發明之研磨裝置，係以製造板狀玻璃時產生之裂痕等不傳遞就會消滅的方式高精度地研磨周緣部，以提高板狀玻璃之強度。為了形成可以提高板狀玻璃之強度的高精度之表面性狀，研磨面可藉由研磨帶所構成，且研磨面與被研磨部分以不會在被研磨部分形成傷痕或崩裂的方式相對移動。 In the polishing apparatus of the present invention, the peripheral portion of the sheet glass is polished and the mechanical strength of the sheet glass is increased. Such as the first As shown in Fig. 16, the plate-shaped glass W as the to-be-polished portion is formed on the main surface (upper surface, lower surface) or the peripheral edge portion (edge portion, corner portion) of the end surface, and has a recess (A) formed when the plain plate is cut. Or convex parts, and (B) cracks, and the like. The sharp convex portion formed on the ridge portion serves as a starting point for the cracking, and the crack is the starting point of the destruction of the sheet glass. In the polishing apparatus of the present invention, the peripheral portion is polished with high precision so that the crack generated when the sheet glass is produced is not transmitted, and the strength of the sheet glass is increased. In order to form a highly precise surface property which can increase the strength of the sheet glass, the polishing surface can be constituted by a polishing tape, and the polishing surface and the portion to be polished can relatively move without causing scratches or cracks in the portion to be polished.

具體而言，第1工件單元，係包含：第1工件保持台，其係用以保持工件；以及擺動手段，其係用以使第1工件保持台沿著第1研磨軸線擺動。 Specifically, the first workpiece unit includes a first workpiece holding table for holding the workpiece, and a swinging means for swinging the first workpiece holding table along the first polishing axis.

在本發明之研磨裝置中，係對靜止的研磨面，藉由直線的被研磨部分呈水平地以預定之行程(stroke)往復移動(擺動)來進行研磨。工件單元係藉由小型化、輕量化，又配置平衡器(balancer)等，可以減低擺動時的震動。藉此，可以減低因震動所引起的被研磨面之傷痕發生，且可以高精度地精加工成平滑的被研磨面。研磨面之位置亦可靜止，形成研磨面的研磨帶亦可行走。 In the polishing apparatus of the present invention, the stationary abrasive surface is ground by a reciprocating movement (oscillation) of the linearly polished portion horizontally by a predetermined stroke. The workpiece unit is reduced in size and weight, and a balancer is provided to reduce the vibration during the swing. Thereby, it is possible to reduce the occurrence of scratches on the surface to be polished due to vibration, and it is possible to finish the smooth surface to be polished with high precision. The position of the polished surface can also be static, and the abrasive belt forming the polished surface can also travel.

在本發明之研磨裝置中，藉由工件保持單元所保持的板狀玻璃、與研磨帶單元之研磨面(相對地)擺動的範圍(行程)，較佳是在正負1mm至200mm之範 圍。藉由如此，就不易發生研磨量之不均等(塌邊)。 In the polishing apparatus of the present invention, the range (stroke) of the plate-shaped glass held by the workpiece holding unit and the polishing surface of the polishing belt unit (relatively) is preferably between plus and minus 1 mm to 200 mm. Wai. In this way, unevenness in the amount of polishing (collapse) is less likely to occur.

又，第2工件單元，其特徵是在水平的基座上，包含：X方向可動載置台，其係設置成能夠移動於水平方向且與第2研磨軸線呈垂直之方向(X方向)；及Y方向可動載置台，其係設置成能夠移動於與第2研磨軸線呈平行之方向(Y方向)，且一體地具有朝向X方向伸長的溝槽部；以及第2工件保持台，其係藉由一體地設置於X方向可動載置台之第1鉛垂軸而能夠旋轉地被水平支撐，第2工件保持台，係具有：第2鉛垂軸，其係從該第2工件保持台之表面垂直地伸長，且能夠滑動地位於前述Y方向可動載置台之前述溝槽部內，工件係由前述第2工件保持台所保持，非直線的被研磨部，係藉由第1鉛垂軸及前述第2鉛垂軸之移動，一邊進行迴旋擺頭運動一邊沿著前述第2研磨軸線擺動。 Further, the second workpiece unit is characterized in that the horizontal base includes an X-direction movable mounting table that is movable in a horizontal direction and perpendicular to the second polishing axis (X direction); a movable mounting stage in the Y direction, which is provided to be movable in a direction parallel to the second polishing axis (Y direction), and integrally has a groove portion elongated in the X direction; and a second workpiece holding table The second workpiece holding stage is rotatably supported by a first vertical axis that is integrally provided in the X-direction movable mounting table, and has a second vertical axis that is from the surface of the second workpiece holding table. Longitudinally extending and slidably positioned in the groove portion of the Y-direction movable mounting table, the workpiece is held by the second workpiece holding table, and the non-linear polished portion is formed by the first vertical axis and the first 2 The movement of the vertical axis oscillates along the second polishing axis while performing the swinging oscillating motion.

即便是在第2研磨部中，對靜止的研磨面，為非直線的被研磨部分，亦藉由在水平面內一邊進行迴旋擺頭運動一邊以預定之行程往復移動來進行研磨。此時，迴旋擺頭運動，係可以按照被研磨部分之曲率等(或是，按照欲形成之曲率)決定，由於水平的往復移動之軌跡，係一致於研磨軸線，所以能使非直線的被研磨部分一邊依次地抵接於平坦的研磨面一邊進行研磨。 Even in the second polishing portion, the stationary polishing surface is a non-linear polished portion, and is polished by reciprocating movement in a predetermined stroke while performing a swinging oscillating motion in a horizontal plane. At this time, the swinging head movement can be determined according to the curvature of the portion to be polished (or according to the curvature to be formed). Since the horizontal reciprocating movement trajectory is consistent with the grinding axis, the non-linear line can be The polishing portion is ground while sequentially abutting against a flat polishing surface.

二個鉛垂軸之位置，較佳是藉由伺服馬達等來同步控制。藉由同步地控制第1鉛垂軸之X方向的位置x、及第2鉛垂軸之X方向的位置x’、Y方向的位置y， 就可以將板狀玻璃之角部等非直線的被研磨部分，形成為所期望之R形狀(例如，R1、R10等)。 The position of the two vertical axes is preferably controlled synchronously by a servo motor or the like. By synchronously controlling the position x in the X direction of the first vertical axis, the position x' in the X direction of the second vertical axis, and the position y in the Y direction, It is possible to form a non-linear polished portion such as a corner portion of the sheet glass into a desired R shape (for example, R1, R10, or the like).

較佳為：即便是一種類的研磨帶，亦可以研磨具有各式各樣之曲率的被研磨部分。沒有必要配合R形狀製作研磨材料(磨石等)，就可以一邊削減成本一邊在工件之角部形成高精度的精加工面。 Preferably, even a type of abrasive belt can be used to grind the portion to be polished having a wide variety of curvatures. It is not necessary to produce an abrasive (such as a grindstone) in accordance with the R shape, and it is possible to form a highly precise finished surface at the corner portion of the workpiece while reducing the cost.

又，其特徵為：第1研磨帶單元，係具有用以使第1研磨面朝向水平方向且與第1研磨軸線呈垂直之方向移動的第1研磨帶移動手段，藉此，直線的被研磨部分與第1研磨面可以在前述第1研磨軸線抵接，第2研磨帶單元，係具有用以使第2研磨面朝向水平方向且與第2研磨軸線呈垂直之方向移動的第2研磨帶移動手段，藉此，非直線的被研磨部分之至少一部分與第2研磨面可以在第2研磨軸線抵接。 Further, the first polishing tape unit has a first polishing tape moving means for moving the first polishing surface in the horizontal direction and perpendicular to the first polishing axis, whereby the linear polishing is performed. The second polishing tape unit may be in contact with the first polishing axis, and the second polishing tape unit may have a second polishing tape for moving the second polishing surface in a horizontal direction and perpendicular to the second polishing axis. By the moving means, at least a part of the non-linear polished portion and the second polishing surface can abut on the second polishing axis.

藉由具有如上述之定位機構，例如，矩形的工件之邊部全體就可以抵接在研磨軸線於平坦的研磨面，且可以進行沒有局部接觸之均等的研磨。又，因能抑制對工件之一點的機械衝擊，故而亦能抑制崩裂之發生與已存在於工件的裂痕之傳遞，且可以進行提高工件之破壞強度的高精度之研磨。又，沒有每一工件之強度的不均等，可以穩定品質。 By having the positioning mechanism as described above, for example, the entire side portion of the rectangular workpiece can be abutted against the polishing axis on the flat polishing surface, and uniform polishing without local contact can be performed. Further, since the mechanical impact on one point of the workpiece can be suppressed, it is possible to suppress the occurrence of cracking and the transmission of the crack existing in the workpiece, and it is possible to perform high-precision polishing which improves the breaking strength of the workpiece. Moreover, the quality of each workpiece can be stabilized without the unevenness of the strength of each workpiece.

再者，其特徵為：第1研磨帶單元，係包含：用以使第1研磨面之長邊軸線，傾斜於第1研磨軸線的第1傾斜手段，第2研磨帶單元，係包含：用以使第2 研磨面之長邊軸線，傾斜於第2研磨軸線的第2傾斜手段。 Further, the first polishing tape unit includes: a first tilting means for tilting a longitudinal axis of the first polishing surface to the first polishing axis; and the second polishing tape unit includes: To make the 2nd The long axis of the polishing surface is a second inclination means inclined to the second polishing axis.

本發明之研磨帶單元，較佳是具有對向地位在工件單元之與研磨軸線呈平行的研磨墊，而(能夠形走地)配置於該研磨墊的研磨帶之表面，係劃分為用以研磨工件之被研磨部分的研磨面。配置於研磨墊的研磨帶係具有預定之寬度與長度，且具有長邊方向之軸線(長邊軸線)。該長邊軸線，係在研磨帶行走時，等於行走方向。該長邊軸線亦可與研磨軸線一致，又可傾斜於研磨軸線。 The polishing belt unit of the present invention preferably has a polishing pad which is opposite to the grinding axis in the workpiece unit, and is disposed on the surface of the polishing belt of the polishing pad, and is divided into Grinding the polished surface of the ground portion of the workpiece. The polishing tape disposed on the polishing pad has a predetermined width and length and has an axis of the long side direction (long axis). The long axis is equal to the direction of travel when the abrasive belt is walking. The long axis can also be aligned with the grinding axis and can be inclined to the grinding axis.

可以將研磨面之長邊軸線，例如僅傾斜θ度。在研磨面為鉛垂的面時，θ度係成為對水平面的傾斜角度。 The long side axis of the abrasive surface can be, for example, only tilted by θ. When the polished surface is a vertical surface, the θ degree is an inclination angle to the horizontal plane.

劃分為研磨面的研磨帶，係具有預定之寬度。又，有時能以預定之速度連續行走。當研磨帶之長邊軸線形成水平時，例如，抵接於水平的工件之直線狀的邊部之研磨面(研磨帶)僅有些微量，而不進行研磨就使用完並被捲繞的研磨帶之量則會變多。本發明之研磨裝置，由於具有使研磨面之長邊軸線傾斜的手段，所以在成本方面有較大的優勢。亦即，藉由將研磨面之長邊軸線(行走的情況，為行走方向)傾斜於研磨軸線，就可以有效地使用研磨帶較寬的範圍(較佳為全面)，且可以減低運轉成本(running cost)(研磨帶之成本)。可以按照板狀玻璃等工件之邊部的長度，將傾斜的角度θ，決定在例如0度<θ≦90度之範圍。可以用固定寬度的研磨帶來對應 尺寸不同的板狀玻璃等工件，且可以簡化研磨帶單元之構造。在使用複數個研磨帶單元時，規格亦成為均一，且可以減低研磨帶單元之製造成本。又，由於可以用一種類之研磨帶來對應多種的工件(板狀玻璃等)，所以沒有必要就每一工件交換研磨帶，可以減低週期時間(cycle time)。由於研磨帶之種類很少就足夠，所以庫存管理亦變得容易(不良庫存之減低、因統一購入同種類之研磨帶所帶來的總額折扣(volume discount))。可以使用窄幅的研磨帶，將研磨帶輕量化，且研磨帶之交換作業變得簡便。又，可以使用固定寬度之研磨帶，同時地研磨複數個板狀玻璃，且可以謀求週期時間之更進一步的減低。 The polishing tape divided into the abrasive faces has a predetermined width. Also, it is possible to continuously walk at a predetermined speed. When the long side axis of the polishing tape is horizontal, for example, the polishing surface (grinding tape) abutting on the linear side of the horizontal workpiece is only slightly traced, and the polishing tape is used and wound without being ground. The amount will increase. Since the polishing apparatus of the present invention has a means for inclining the long side axis of the polishing surface, it has a large advantage in terms of cost. That is, by tilting the long side axis of the polished surface (the traveling direction, the running direction) to the grinding axis, it is possible to effectively use a wide range (preferably comprehensive) of the polishing belt, and it is possible to reduce the running cost ( Running cost) (cost of the grinding belt). The inclination angle θ can be determined in the range of, for example, 0 degrees < θ ≦ 90 degrees in accordance with the length of the side portion of the workpiece such as the plate glass. Can be fixed with a fixed width of abrasive A workpiece such as a plate glass having a different size, and the structure of the polishing tape unit can be simplified. When a plurality of polishing belt units are used, the specifications are also uniform, and the manufacturing cost of the polishing belt unit can be reduced. Further, since a plurality of types of workpieces (sheet glass or the like) can be used with one type of polishing, it is not necessary to exchange the polishing tape for each workpiece, and the cycle time can be reduced. Since the type of the abrasive tape is small enough, the inventory management is also easy (the reduction of the defective stock, the total volume discount due to the uniform purchase of the same type of abrasive belt). A narrow belt can be used to lighten the belt and the exchange of the belt is easy. Further, a plurality of plate-shaped glasses can be simultaneously polished using a polishing tape having a fixed width, and further reduction in cycle time can be achieved.

再者，其特徵為：第1研磨帶單元，係包含：用以使第1研磨面，以第1研磨軸線為中心旋動的第1旋動手段，第2研磨帶單元，係包含：用以使第2研磨面，以第2研磨軸線為中心旋動的第2旋動手段。 Further, the first polishing tape unit includes: a first rotation means for rotating the first polishing surface around the first polishing axis; and the second polishing tape unit includes: The second polishing means is a second rotation means that is rotated about the second polishing axis.

本發明之研磨裝置，係可以鉛垂地配置研磨面，又可以使研磨面以研磨軸線(或是，平行於研磨軸線之旋動軸線)為中心而旋動，且傾斜於鉛垂面。藉由如此，可以將工件之直線的邊部進行C面研磨。由於研磨帶單元旋動，所以可以對水平固定於工件單元的工件之上面及下面的邊部，進行所期望的C面研磨。工件單元，沒有必要將工件傾斜等，且可以簡化構成。研磨帶單元之研磨面，以研磨軸線為中心而旋動的角度α之範圍，較佳是將平行於鉛垂面的研磨面設為0度並在上下方向最大為90 度(此時，研磨面為水平)。 In the polishing apparatus of the present invention, the polishing surface may be vertically disposed, and the polishing surface may be rotated about the polishing axis (or a rotation axis parallel to the polishing axis) and inclined to the vertical surface. By doing so, the side of the straight line of the workpiece can be C-face polished. Since the polishing tape unit is rotated, it is possible to perform desired C-surface polishing on the side portions of the upper and lower surfaces of the workpiece horizontally fixed to the workpiece unit. The workpiece unit does not have to tilt the workpiece, etc., and the configuration can be simplified. The polishing surface of the polishing belt unit has a range of an angle α which is rotated about the polishing axis, and preferably has a grinding surface parallel to the vertical surface of 0 degrees and a maximum of 90 degrees in the up and down direction. Degree (at this time, the polished surface is horizontal).

或是，研磨帶單元亦可不具有旋動機構。在此情況下，為了要將有關水平置放的板狀玻璃等工件之上面(或下面)的一個邊部(稜部)進行C面研磨，亦可將研磨帶單元之研磨面，相對於鉛垂面(或水平面)，以傾斜例如45度之狀態固定，而構成研磨帶單元。 Alternatively, the belt unit may not have a turning mechanism. In this case, in order to perform C-side polishing of one side (edge) of the upper surface (or lower surface) of the workpiece such as the sheet glass placed horizontally, the polishing surface of the polishing belt unit may be relative to the lead. The vertical surface (or the horizontal surface) is fixed at an inclination of, for example, 45 degrees to constitute a polishing belt unit.

再者，其特徵為：第1工件單元，係包含用以使工件朝向水平方向且與第1研磨軸線呈垂直之方向移動的工件移動手段。藉由如此，直線的被研磨部分與研磨面，就可以在研磨軸線確實地抵接。 Further, the first workpiece unit includes a workpiece moving means for moving the workpiece in a horizontal direction and perpendicular to the first polishing axis. By doing so, the straight polished portion and the polished surface can reliably abut on the polishing axis.

再者，本發明之研磨裝置，其特徵為：第1工件單元，係包含：用以將工件，按壓並予以固定、及/或吸附並予以固定的第1工件固定手段，第2工件單元，係包含：用以將工件，按壓並予以固定、及/或吸附並予以固定的第2工件固定手段。 Furthermore, the polishing apparatus according to the present invention is characterized in that the first workpiece unit includes a first workpiece fixing means for pressing and fixing the workpiece, and/or adsorbing and fixing the second workpiece unit, and the second workpiece unit. The second workpiece fixing means for pressing and fixing the workpiece, and/or adsorbing and fixing the workpiece.

置放於工件單元(第1、第2)的板狀玻璃等之工件，係在實際研磨處理之前固定於工件單元的工件保持台。作為固定手段，較佳是可使用吸引力與緊壓力。板狀玻璃等的工件，可藉由固定板等從上方按壓而固定，又可藉由真空吸附法等固定於保持台。在保持台之表面及固定板之背面，可貼附有布類或橡膠等之彈性薄片，以免在板狀玻璃等工件之上面及下面發生傷痕。 The workpiece such as the sheet glass placed on the workpiece unit (first and second) is fixed to the workpiece holding stage of the workpiece unit before the actual polishing process. As a fixing means, it is preferable to use an attractive force and a tight pressure. The workpiece such as a plate glass can be fixed by pressing from a top by a fixing plate or the like, and can be fixed to the holding table by a vacuum suction method or the like. On the surface of the holding table and the back surface of the fixing plate, an elastic sheet such as cloth or rubber can be attached to prevent scratches on the upper surface and the lower surface of the workpiece such as the sheet glass.

藉由按壓上面，且一併吸附下面，就能以較高之保持力將工件保持於工件保持台。在研磨處理中，即 使在藉由研磨帶單元之研磨面按壓時板狀玻璃亦不會移動，可以效率佳地進行研磨。 By pressing the upper surface and adsorbing the lower side together, the workpiece can be held at the workpiece holding table with a high holding force. In the grinding process, ie When the plate glass is not pressed by the polishing surface of the polishing tape unit, the polishing can be performed efficiently.

又，其特徵為：第1研磨帶單元，係包含用以使第1研磨帶行走的第1研磨帶行走手段，第2研磨帶單元，係包含用以使第2研磨帶行走的第2研磨帶行走手段。 Further, the first polishing tape unit includes a first polishing tape running means for moving the first polishing tape, and the second polishing tape unit includes a second polishing tape for moving the second polishing tape. With walking means.

本發明之另一態樣的研磨裝置，係用以使用研磨帶來研磨工件之周緣部之直線的被研磨部分，且具有水平之研磨軸線的研磨裝置，其特徵為，包含：工件單元，其係用以保持工件；以及研磨帶單元，其係用以夾隔著研磨軸線而與工件單元相對向地配置研磨帶之至少一部分的表面，所配置的研磨帶之表面係劃分為研磨面，可藉由直線的被研磨部分與研磨面相接觸並在研磨軸線相對移動進行研磨。 A polishing apparatus according to another aspect of the present invention is a polishing apparatus for polishing a straight-lined polished portion of a peripheral portion of a workpiece using a polishing belt, and having a horizontal grinding axis, characterized by comprising: a workpiece unit; And a polishing belt unit configured to dispose at least a portion of the polishing belt opposite to the workpiece unit with the grinding axis interposed therebetween, and the surface of the disposed polishing belt is divided into a grinding surface. Grinding is performed by the linearly polished portion being in contact with the abrasive surface and moving relative to the grinding axis.

又，其特徵為：工件係由板狀玻璃所構成，工件單元，係包含：工件保持台，其係用以保持工件；以及擺動手段，其係用以使工件保持台沿著研磨軸線擺動，直線的被研磨部分與研磨面，係以將板狀玻璃之周緣部之直線的被研磨部分，形成平均表面粗糙度Ra為20nm以下、且最大谷深Rv為200nm以下的方式相對移動。 Moreover, the workpiece is composed of a sheet glass, and the workpiece unit includes: a workpiece holding table for holding the workpiece; and a swinging means for swinging the workpiece holding table along the grinding axis, The polished portion and the polished surface of the straight line are relatively moved so that the polished portion having a straight line at the peripheral edge portion of the sheet glass has an average surface roughness Ra of 20 nm or less and a maximum valley depth Rv of 200 nm or less.

再者，其特徵為：研磨帶單元，係包含：研磨帶移動手段，其係用以使研磨面朝向水平方向且與研磨軸線呈垂直之方向移動，藉此，直線的被研磨部分與研磨面可以抵接在研磨軸線；及傾斜手段，其係用以使研磨面 之長邊軸線，傾斜於研磨軸線；以及旋動手段，其係用以使研磨面，以研磨軸線為中心旋動。 Furthermore, the polishing tape unit includes: a polishing tape moving means for moving the polishing surface in a horizontal direction and perpendicular to the polishing axis, whereby the linearly polished portion and the polished surface Can abut against the grinding axis; and tilting means for making the grinding surface The long side axis is inclined to the grinding axis; and the rotating means is configured to rotate the grinding surface centering on the grinding axis.

再者，工件單元，係包含用以使工件朝向水平方向且與研磨軸線呈垂直之方向移動的工件移動手段。 Further, the workpiece unit includes a workpiece moving means for moving the workpiece in a horizontal direction and perpendicular to the polishing axis.

藉由如此構成，本發明之研磨裝置，係可以使用研磨帶，將矩形的板狀玻璃之邊部等工件之直線的被研磨部分，使用研磨帶，進行所期望之C面研磨。又，本發明之研磨裝置，係可以高精度地研磨板狀玻璃之邊部或端部，以提高板狀玻璃之強度。 According to this configuration, in the polishing apparatus of the present invention, it is possible to perform a desired C-side polishing using a polishing tape using a polishing tape to straighten a polished portion of a workpiece such as a side portion of a rectangular plate-shaped glass. Further, in the polishing apparatus of the present invention, the side portion or the end portion of the sheet glass can be polished with high precision to increase the strength of the sheet glass.

本發明之更另一態樣的研磨裝置，係用以使用研磨帶來研磨工件之周緣部之非直線的被研磨部分，且具有水平之研磨軸線的研磨裝置，其特徵為，包含：工件單元，其係用以保持工件；以及研磨帶單元，其係用以夾隔著研磨軸線而與工件單元相對向地配置研磨帶之至少一部分的表面，所配置的研磨帶之表面係劃分為研磨面，可藉由非直線的被研磨部分與研磨面相接觸並在研磨軸線相對移動進行研磨。 A polishing apparatus according to still another aspect of the present invention is a grinding apparatus for grinding a non-linear polished portion of a peripheral portion of a workpiece using a grinding belt, and having a horizontal grinding axis, characterized by comprising: a workpiece unit And the polishing belt unit is configured to dispose at least a portion of the surface of the polishing belt opposite to the workpiece unit with the grinding axis interposed therebetween, and the surface of the disposed polishing belt is divided into a grinding surface. The grinding may be performed by contacting the non-linear polished portion with the abrasive surface and moving relative to the grinding axis.

又，其特徵為：工件係由板狀玻璃所構成，工件單元，係在水平的基座上，包含：X方向可動載置台，其係設置成能夠移動於水平方向且與研磨軸線呈垂直之方向(X方向)；及Y方向可動載置台，其係設置成能夠移動於與研磨軸線呈平行之方向(Y方向)，且一體地具有朝向X方向伸長的溝槽部；以及工件保持台，其係藉由一體地設置於X方向可動載置台之第1鉛垂軸而能夠旋 轉地被水平支撐，工件保持台，係具有：第2鉛垂軸，其係從該工件保持台之表面垂直地伸長，且能夠滑動地位於Y方向可動載置台之溝槽部內，工件係由工件保持台所保持，非直線的被研磨部，係藉由第1鉛垂軸及第2鉛垂軸之移動，一邊進行迴旋擺頭運動一邊沿著前述研磨軸線擺動，非直線的被研磨部分與研磨面，係以將板狀玻璃之周緣部之非直線的被研磨部分，形成平均表面粗糙度Ra為20nm以下、且最大谷深Rv為200nm以下的方式相對移動。 Further, the workpiece is composed of a sheet glass, and the workpiece unit is mounted on a horizontal base, and includes an X-direction movable mounting table that is configured to be movable in a horizontal direction and perpendicular to the grinding axis. a direction (X direction); and a movable mounting stage in the Y direction, which is provided to be movable in a direction parallel to the polishing axis (Y direction), and integrally has a groove portion elongated in the X direction; and a workpiece holding table, It can be rotated by being integrally provided on the first vertical axis of the movable mounting table in the X direction. The workpiece is held horizontally, and the workpiece holding table has a second vertical axis which is vertically elongated from the surface of the workpiece holding table and slidably located in the groove portion of the Y-direction movable mounting table, and the workpiece is The non-linear polished portion is held by the workpiece holding table, and the non-linear polished portion is oscillated along the polishing axis while the turret is moved by the movement of the first vertical axis and the second vertical axis. In the polished surface, the non-linear polished portion of the peripheral portion of the sheet glass is relatively moved so that the average surface roughness Ra is 20 nm or less and the maximum valley depth Rv is 200 nm or less.

藉由如此構成，本發明之研磨裝置，係可以使用研磨帶，進行板狀玻璃等工件之非直線的被研磨部分之研磨(例如，角部之R面研磨)。當研磨具有曲率不同之R形狀的被研磨部分時(例如，R1、R10等)，由於工件單元會按照該形狀而一邊進行迴旋擺頭運動一邊擺動於研磨軸線上，所以不需要對應R形狀來變更研磨材料(磨石等)，可以進行高精度的研磨。 According to this configuration, in the polishing apparatus of the present invention, the polishing belt can be used to polish the non-linear polished portion of the workpiece such as the sheet glass (for example, the R-side polishing of the corner portion). When the ground portion having the R shape having different curvatures is polished (for example, R1, R10, etc.), since the workpiece unit swings on the grinding axis while performing the swinging head motion according to the shape, the corresponding R shape is not required. By changing the abrasive material (grinding stone, etc.), it is possible to perform high-precision polishing.

上述本發明之研磨裝置所使用的研磨帶，係在塑膠製的基材薄膜之表面塗敷使研磨粒分散於樹脂黏結劑的溶液，且將乾燥、硬化後的薄片開縫(slit)成必要寬度，並捲繞於捲軸(reel)所成。 In the polishing tape used in the polishing apparatus of the present invention, a solution in which abrasive grains are dispersed in a resin binder is applied to the surface of a base film made of plastic, and the dried and hardened sheets are slit. Width, and wound on a reel.

作為基材薄膜，係可使用具有柔軟性的合成樹脂製之塑膠薄膜。具體而言，由聚對苯二甲酸乙烯酯(PET)、聚對苯二甲酸丁二醇酯(PBT)、聚對萘二甲酸乙二酯(PEN)、聚對萘二甲酸丁二醇酯(PBN)等的 聚酯系樹脂、聚乙烯、聚丙烯等的聚烯烴系樹脂、以聚乙烯醇(PVA)或甲基丙烯酸醇為主成分之丙烯酸系樹脂等所構成的薄膜作為基材薄膜來使用。 As the base film, a plastic film made of a synthetic resin having flexibility can be used. Specifically, it consists of polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), and polybutylene naphthalate. (PBN), etc. A polyolefin resin, a polyolefin resin such as polyethylene or polypropylene, or a film composed of an acrylic resin containing polyvinyl alcohol (PVA) or methacrylic alcohol as a main component is used as a base film.

作為研磨粒(研磨粒子)，係可以使用氧化鋁(Al2O3)、氧化鈰(CeO2)、氧化矽(SiO2)、鑽石、碳化矽(SiC)、氧化鉻(Cr2O3)、氧化鋯(ZrO2)、立方晶氮化硼(cBN)等及其混合物。 As the abrasive grains (abrasive particles), alumina (Al 2 O 3 ), cerium oxide (CeO 2 ), cerium oxide (SiO 2 ), diamond, lanthanum carbide (SiC), chromium oxide (Cr 2 O 3 ) can be used. Zirconium oxide (ZrO 2 ), cubic boron nitride (cBN), and the like, and mixtures thereof.

研磨粒之平均粒徑，較佳是在0.2μm以上(#20000)、3μm以下(#4000)之範圍。當平均粒徑超過3μm時，雖然可以去除研磨前之端面之比較大的傷痕或缺陷，但是會在精加工面新發生細微的傷痕或缺陷，而無法對板狀玻璃提供充分的強度故而不佳。當平均粒徑未滿0.2μm時，因研磨效率極端下降且生產性差，故而在工業上不實用。 The average particle diameter of the abrasive grains is preferably in the range of 0.2 μm or more (#20000) and 3 μm or less (#4000). When the average particle diameter exceeds 3 μm, although relatively large flaws or defects of the end face before polishing can be removed, fine flaws or defects are newly formed on the finished surface, and it is not preferable to provide sufficient strength to the plate glass. . When the average particle diameter is less than 0.2 μm, the polishing efficiency is extremely lowered and the productivity is poor, so that it is not practical in the industry.

再者，本發明，係提供一種使用上面所述的裝置，以提高由板狀玻璃所構成的工件之強度之方式來研磨該工件之周緣部的方法。該方法係由研磨步驟所構成，該研磨步驟，係使用研磨帶來研磨工件之周緣部之直線的被研磨部分、或非直線的被研磨部分，且將被研磨部分，形成平均表面粗糙度Ra為20nm以下、且最大谷深Rv為200nm以下，研磨帶，係藉由樹脂黏結劑將具有預定粒徑之研磨粒黏著固定於基材薄膜所成。 Furthermore, the present invention provides a method of polishing the peripheral portion of the workpiece by using the apparatus described above to increase the strength of the workpiece formed by the sheet glass. The method is constituted by a polishing step of polishing a straight portion of a polished portion or a non-linear polished portion of a peripheral portion of the workpiece using a polishing belt, and forming a polished portion to form an average surface roughness Ra The film is 20 nm or less and the maximum valley depth Rv is 200 nm or less. The polishing tape is formed by adhering and fixing the abrasive grains having a predetermined particle diameter to the base film by a resin binder.

為了對板狀玻璃賦予充分的機械強度，有效的是在板狀玻璃之周緣部，形成上述之表面粗糙度Ra及 最大谷深Rv的精加工面。以周緣部具有上述之表面性狀的方式，被研磨的板狀玻璃，係可以預防以周緣部之細微的傷痕或缺陷為起點的破裂之發生，且可以防止因機械應力或熱衝擊(heat shock)所引起的破損。又，可以改善後段工序之加工良率，且可以提高組入有板狀玻璃的製品之可靠度。 In order to impart sufficient mechanical strength to the sheet glass, it is effective to form the above-described surface roughness Ra at the peripheral portion of the sheet glass. The finishing surface of the largest valley depth Rv. The plate-shaped glass to be polished so that the peripheral portion has the surface properties described above can prevent the occurrence of cracks starting from minute flaws or defects of the peripheral portion, and can prevent mechanical stress or heat shock. The damage caused. Moreover, the processing yield of the subsequent step can be improved, and the reliability of the product incorporating the sheet glass can be improved.

藉由實施本發明之研磨裝置或研磨方法，可以除掉智慧型手機或平板型終端之面板、液晶面板、有機EL面板、電漿面板、太陽能電池面板等平面顯示用的覆蓋玻璃、其他的電子零件用之覆蓋玻璃等製造中所用的板狀玻璃之邊部及/或角部的潛在傷痕，可以形成高精度之表面性狀，且對板狀玻璃賦予較高之機械強度。可以藉由使用本發明之板狀玻璃以製造覆蓋玻璃，且採用於可攜式終端等，來改善各種製品之製程的製造良率，且可以提高組入有該板狀玻璃的製品之品質。 By implementing the polishing apparatus or the polishing method of the present invention, it is possible to remove the cover glass for the flat display, the liquid crystal panel, the organic EL panel, the plasma panel, the solar cell panel, and the like, and other electronic components. The surface of the sheet glass used in the manufacture of the cover glass and/or the potential damage of the corner portion can be formed with high precision and impart high mechanical strength to the sheet glass. The cover glass can be manufactured by using the plate glass of the present invention, and can be used in a portable terminal or the like to improve the manufacturing yield of the process of various products, and can improve the quality of the product in which the plate glass is incorporated.

又，依據本發明之研磨裝置、研磨方法，可以研磨板狀玻璃等工件之邊部、端面、角部、角部之稜部等，且沒有必要配合被研磨物之形狀來製作研磨材料。又，由於可以有效率地使用研磨帶，所以可以一邊減低成本一邊提高品質。 Further, according to the polishing apparatus and the polishing method of the present invention, it is possible to polish the side portion, the end surface, the corner portion, the ridge portion of the corner portion, and the like of the workpiece such as the plate glass, and it is not necessary to form the abrasive material in accordance with the shape of the workpiece. Moreover, since the polishing tape can be used efficiently, it is possible to improve the quality while reducing the cost.

W、W12‧‧‧工件 W, W12‧‧‧ workpiece

T‧‧‧研磨帶 T‧‧‧grinding tape

A、A’‧‧‧研磨軸線 A, A’‧‧‧ grinding axis

A1‧‧‧垂直於研磨軸線A之方向 A1‧‧‧ perpendicular to the direction of the grinding axis A

A2‧‧‧旋動軸線 A2‧‧‧Rotary axis

A3‧‧‧長邊軸線 A3‧‧‧ long axis

A4、A5‧‧‧鉛垂軸 A4, A5‧‧‧ vertical axis

1‧‧‧研磨裝置 1‧‧‧ grinding device

2‧‧‧基座 2‧‧‧Base

10‧‧‧第1工件置放台 10‧‧‧1st workpiece placement table

20‧‧‧工件搬運單元 20‧‧‧Workpiece handling unit

30‧‧‧第1研磨部 30‧‧‧1st grinding department

40‧‧‧第2研磨部 40‧‧‧2nd grinding department

50‧‧‧第2工件置放台 50‧‧‧2nd workpiece placement table

300‧‧‧第1研磨帶單元 300‧‧‧1st abrasive belt unit

300’‧‧‧第2研磨帶單元 300’‧‧‧2nd grinding belt unit

301‧‧‧研磨帶單元載置台 301‧‧‧grinding belt unit mounting table

302、332、352、402‧‧‧馬達 302, 332, 352, 402‧‧ ‧ motors

303、304、309‧‧‧LM導件 303, 304, 309‧‧‧LM Guide

305、306、307、404‧‧‧支柱 305, 306, 307, 404‧‧ ‧ pillars

310‧‧‧單軸機器人 310‧‧‧ Single-axis robot

311‧‧‧連結塊 311‧‧‧Link block

312、312’‧‧‧軸 312, 312'‧‧ Axis

313‧‧‧連結構件 313‧‧‧Linking components

314、315‧‧‧旋動臂 314, 315‧‧‧ rotating arm

314’‧‧‧延長臂 314’‧‧‧Extension arm

316、325‧‧‧軸支銷 316, 325‧‧ ‧ shaft support

317‧‧‧板 317‧‧‧ board

318‧‧‧傾斜板 318‧‧‧ sloping plate

319‧‧‧研磨頭 319‧‧‧ polishing head

320‧‧‧研磨面 320‧‧‧Grinding surface

321‧‧‧供應輥 321‧‧‧Supply roller

322‧‧‧捲繞輥 322‧‧‧ winding roller

324‧‧‧墊構件(研磨墊) 324‧‧‧Mat member (polishing pad)

326a、326b、326c、326d、412‧‧‧導槽 326a, 326b, 326c, 326d, 412‧‧

327a、327b、327c、327d‧‧‧固定夾具 327a, 327b, 327c, 327d‧‧‧fixed fixture

330、331‧‧‧連接夾具 330, 331‧‧‧ Connection fixture

333、356a、356b、356c、427‧‧‧桿 333, 356a, 356b, 356c, 427‧‧ ‧

334、357a、357b、357c‧‧‧溝槽 334, 357a, 357b, 357c‧‧‧ trench

350‧‧‧第1工件單元 350‧‧‧1st workpiece unit

351、351’‧‧‧第1工件保持台 351, 351'‧‧‧1st workpiece holding table

353a、353b、353c、353d、354a、354b、354c、422‧‧‧確動滑輪 353a, 353b, 353c, 353d, 354a, 354b, 354c, 422‧‧‧

355、423‧‧‧確動皮帶 355, 423‧‧‧Activity belt

358b、358c‧‧‧平衡器 358b, 358c‧‧‧ balancer

359、403、405‧‧‧固定板 359, 403, 405‧‧‧ fixed plates

360a、360b‧‧‧LM軌條 360a, 360b‧‧‧LM rail

361a、361b、361c、361d、362a、362b、363a、363b‧‧‧LM塊體 361a, 361b, 361c, 361d, 362a, 362b, 363a, 363b‧‧‧LM block

400‧‧‧第2工件單元 400‧‧‧2nd workpiece unit

401‧‧‧第2工件保持台 401‧‧‧2nd workpiece holding table

406‧‧‧X方向可動板 406‧‧‧X direction movable plate

407‧‧‧Y方向可動載置台 407‧‧‧Y-direction movable table

408‧‧‧單軸可動單元 408‧‧‧Single-axis movable unit

409‧‧‧線性導件 409‧‧‧Linear Guides

410‧‧‧Y方向可動板 410‧‧‧Y direction movable plate

411‧‧‧導引構件 411‧‧‧Guide members

413‧‧‧X方向可動載置台 413‧‧‧X-direction movable mounting table

414‧‧‧伺服馬達 414‧‧‧Servo motor

425‧‧‧旋轉構件 425‧‧‧Rotating components

429‧‧‧孔 429‧‧‧ holes

Ra‧‧‧平均表面粗糙度 Ra‧‧‧average surface roughness

Rv‧‧‧最大谷深 Rv‧‧‧Max Valley Deep

Wf‧‧‧流動方向 Wf‧‧‧flow direction

第1圖係顯示一態樣之工件的示意圖。 Figure 1 is a schematic diagram showing a workpiece of an aspect.

第2圖(A)係工件之部分剖視圖；第2圖(B)係工件之俯視圖。 Fig. 2(A) is a partial cross-sectional view of the workpiece; Fig. 2(B) is a plan view of the workpiece.

第3圖係示意性顯示本發明之一樣態的研磨裝置1之省略後的前視圖。 Fig. 3 is a front view schematically showing the omitted polishing apparatus 1 of the same state of the present invention.

第4A圖係示意性顯示本發明之一態樣的研磨部之俯視圖。 Fig. 4A is a plan view schematically showing a polishing portion of an aspect of the present invention.

第4B圖係示意性顯示本發明之一態樣的研磨帶單元之定位機構的俯視圖。 Fig. 4B is a plan view schematically showing a positioning mechanism of the polishing belt unit of one aspect of the present invention.

第5圖係示意性顯示本發明之一態樣的研磨帶單元之旋動機構之沿著第4A圖之X-X’線的局部省略側視圖。 Fig. 5 is a partially omitted side view schematically showing the slewing mechanism of the polishing belt unit of the aspect of the invention taken along the line X-X' of Fig. 4A.

第6圖係示意性顯示本發明之一態樣的研磨帶單元之傾斜機構的局部省略前視圖。 Fig. 6 is a partially omitted front view schematically showing a tilting mechanism of a polishing belt unit in an aspect of the present invention.

第7圖係示意性顯示本發明之一態樣的工件單元之擺動機構的俯視圖。 Fig. 7 is a plan view schematically showing a swing mechanism of a workpiece unit in an aspect of the present invention.

第8圖係示意性顯示本發明之一態樣的工件單元之工件移動機構的俯視圖。 Fig. 8 is a plan view schematically showing a workpiece moving mechanism of a workpiece unit in an aspect of the present invention.

第9圖係示意性顯示本發明之另一態樣的研磨部之俯視圖。 Fig. 9 is a plan view schematically showing a polishing portion of another aspect of the present invention.

第10A圖係示意性顯示本發明之另一態樣的工件單元之俯視圖。 Fig. 10A is a plan view schematically showing a workpiece unit of another aspect of the present invention.

第10B圖係示意性顯示本發明之另一態樣的工件單元之側視圖。 Fig. 10B is a side view schematically showing a workpiece unit of another aspect of the present invention.

第11圖係顯示使用磨石的工件邊部(稜部)之研磨方法的示意圖。 Fig. 11 is a schematic view showing a grinding method of a workpiece edge portion (edge portion) using a grindstone.

第12圖係實施例及比較例之被研磨面的放大照片。 Fig. 12 is an enlarged photograph of the surface to be polished of the examples and the comparative examples.

第13圖係其他的比較例之被研磨面的放大照片。 Fig. 13 is an enlarged photograph of the surface to be polished of the other comparative examples.

第14圖係顯示邊緣強度試驗之方法的示意圖。 Figure 14 is a schematic diagram showing the method of the edge strength test.

第15圖係顯示長方形之板狀玻璃等工件的中心C1、C2的示意圖。 Fig. 15 is a schematic view showing the centers C1 and C2 of a workpiece such as a rectangular plate glass.

第16圖係作為工件的板狀玻璃之(A)側面觀察像、及(B)上面觀察像。 Fig. 16 is a (A) side observation image and (B) an upper observation image of a sheet glass as a workpiece.

以下，一邊參照圖式，一邊同時說明本發明之各式各樣的特徵，以及非意圖限定本發明的較佳實施例。圖式係以說明為單純目的，尺度亦不一定一致。 Hereinafter, various features of the present invention will be described with reference to the drawings, and the preferred embodiments of the present invention are not intended to be limited. The schema is for illustrative purposes and the scales are not necessarily consistent.

第1圖係示意性顯示作為被研磨物的工件W。工件W亦可為玻璃板、不銹鋼板、鋁板、作為太陽能電池基板來使用的矽板等。工件可為矩形，又可為其他的形狀。工件W，係在上面或下面(主表面)與端面之境界部具有邊部(稜部)，又在一個端面與相鄰的端面之境界部具有角部(角隅(corner)部)。端面或角部，可保持為從素板切出的狀態(as slice：***)，亦可施加粗研磨。 Fig. 1 is a view schematically showing a workpiece W as an object to be polished. The workpiece W may be a glass plate, a stainless steel plate, an aluminum plate, a slab used as a solar cell substrate, or the like. The workpiece can be rectangular or other shapes. The workpiece W has a side portion (edge portion) at the boundary portion between the upper surface or the lower surface (main surface) and the end surface, and has a corner portion (corner portion) at the boundary portion between the one end surface and the adjacent end surface. The end face or the corner portion can be kept in a state of being cut out from the plain plate (as slice: a piece), and a rough grinding can also be applied.

第2圖(A)係顯示至少二個邊部進行所謂C面倒角後的工件W1之部分剖面。第2圖係顯示四個角部 進行所謂R面倒角後的工件W2。藉由研磨邊部或角部，可獲得具有精加工面S1、S1’、或S2、S2’、S2”、S2’’’的工件W1、W2。 Fig. 2(A) shows a partial cross section of the workpiece W1 after the so-called C-face chamfering is performed on at least two side portions. Figure 2 shows the four corners The workpiece W2 after the R-face chamfering is performed. By grinding the side portions or the corner portions, the workpieces W1, W2 having the finished surfaces S1, S1', or S2, S2', S2", S2''' can be obtained.

工件W，可由板狀玻璃所構成。為了提高板狀玻璃之強度，重要的是研磨周緣部以除掉傷痕或崩裂，且縮小精加工面S1等或S2等之表面粗糙度或最大谷深。為了對板狀玻璃W賦予較高的機械強度，精加工面S1等或S2等，較佳是將其平均表面粗糙度Ra形成為20nm以下，將粗糙度曲線之最大谷深Rv形成為200nm以下。 The workpiece W may be composed of sheet glass. In order to increase the strength of the sheet glass, it is important to polish the peripheral portion to remove the flaw or crack, and to reduce the surface roughness or the maximum valley depth of the finished surface S1 or the like or S2 or the like. In order to impart high mechanical strength to the sheet glass W, the finished surface S1 or the like, or S2, etc., it is preferable to form the average surface roughness Ra to 20 nm or less and the maximum valley depth Rv of the roughness curve to 200 nm or less. .

第3圖係示意性顯示本發明之一態樣的研磨裝置1。研磨裝置1，係由配置於基座2上的工件W之第1工件置放台10、按照工件W之流動方向Wf而搬運工件W的工件搬運單元20、第1研磨部30、第2研磨部40、以及置放有研磨處理結束後之工件W12的第2工件置放台50所構成。第1研磨部30，係以研磨直線的被研磨部分之方式所構成。第2研磨部40，係以研磨非直線的被研磨部分之方式所構成。此等研磨部之數量或組合亦可不受限於此。 Fig. 3 is a view schematically showing a polishing apparatus 1 according to an aspect of the present invention. The polishing apparatus 1 is a first workpiece placement table 10 of a workpiece W placed on a susceptor 2, a workpiece conveyance unit 20 that conveys a workpiece W in accordance with a flow direction Wf of the workpiece W, a first polishing unit 30, and a second polishing unit. The portion 40 and the second workpiece placing table 50 on which the workpiece W12 after the polishing process is completed are placed. The first polishing unit 30 is configured to polish a polished portion of a straight line. The second polishing unit 40 is configured to polish a non-linear polished portion. The number or combination of the polishing portions may not be limited thereto.

第4A圖係示意性顯示第1研磨部30。第1研磨部30，係由夾隔著水平之研磨軸線A而對向配置於水平之基座2上的第1研磨帶單元300及第1工件單元350所構成。 Fig. 4A schematically shows the first polishing unit 30. The first polishing unit 30 is composed of a first polishing tape unit 300 and a first workpiece unit 350 that are opposed to each other on the horizontal base 2 with the horizontal polishing axis A interposed therebetween.

第1研磨帶單元300，係包含能夠朝向水平方向且作為垂直於研磨軸線A之方向的A1方向移動地設置於 基座2上的研磨帶單元載置台301。研磨帶單元載置台301，係藉由設置於研磨帶單元載置台301與基座2之間之供推出控制用的馬達302、LM導件303、304，而可以朝向A1方向往復移動。在研磨帶單元載置台301上，設置有朝向鉛垂方向伸長的支柱305、306、307。連結塊311，係能夠藉由平行設置於支柱305的LM導件309及單軸機器人310沿著支柱305朝向鉛垂方向移動。較佳是二根軸312、312’(第5圖)能夠朝向水平方向滑動地貫通連結塊311。在軸312、312’之前端安裝有連結構件313。連結構件313，係藉由軸支銷316而能夠旋轉地連結於與旋動臂314一體的延長臂314’。旋動臂314(及延長臂314’)與旋動臂315，係具有大致左右對稱的形狀，且中介連接夾具330、331、板317及傾斜板318，從左右保持收容及配置研磨帶T之作為箱體的研磨頭319。旋動臂314、315，係以旋動軸線A2為中心而能夠旋動地安裝於支柱306、307。旋動軸線A2係與研磨軸線A平行。 The first polishing tape unit 300 is provided to be movable in the A1 direction which is horizontal to the direction perpendicular to the polishing axis A. The polishing tape unit mounting table 301 on the susceptor 2. The polishing tape unit mounting table 301 is reciprocable in the A1 direction by the motor 302 for the push-out control and the LM guides 303 and 304 provided between the polishing tape unit mounting table 301 and the susceptor 2. On the polishing tape unit mounting table 301, pillars 305, 306, and 307 that are elongated in the vertical direction are provided. The connecting block 311 is movable in the vertical direction along the stay 305 by the LM guide 309 and the single-axis robot 310 which are disposed in parallel to the stay 305. Preferably, the two shafts 312 and 312' (Fig. 5) are slidably penetrated through the coupling block 311 in the horizontal direction. A coupling member 313 is attached to the front end of the shafts 312, 312'. The coupling member 313 is rotatably coupled to the extension arm 314' integral with the swing arm 314 by the shaft pin 316. The swing arm 314 (and the extension arm 314') and the swing arm 315 have a substantially bilaterally symmetrical shape, and the intermediate connecting jigs 330, 331, the plate 317, and the inclined plate 318 are connected to receive and dispose the polishing tape T from the left and right. A polishing head 319 as a case. The swing arms 314 and 315 are rotatably attached to the stays 306 and 307 around the rotation axis A2. The rotation axis A2 is parallel to the grinding axis A.

研磨頭319，係能夠旋轉地配置有用以在具有底面與側面的箱體之中配置研磨帶T的輥子所成。研磨頭319之頂面較佳是由能夠開閉的蓋所構成。研磨頭319係具備墊(pad)構件(研磨墊)324，藉由輥子所供應的研磨帶則配置於墊構件324。研磨帶T，係從供應輥321所供應，且藉由捲繞輥322而捲繞。供應輥321，係為了對研磨帶T提供適度的張力，而連接於轉矩馬達(torque motor)(未圖示)。捲繞輥322係連接於步進馬達 (stepping motor)(未圖示)，且捲繞從供應輥321供應的研磨帶T。可復配置有：用以對研磨帶T提供適度之張力的止動輥(stopper roller)、以及用以將研磨帶T適切地配置於墊構件324的輔助輥等。配置於研磨墊324的研磨帶T，係按照研磨墊324之表面的形狀(例如，平坦的長方形)，劃分具有預定之長度與寬度的研磨面320。 The polishing head 319 is rotatably provided with a roller for arranging the polishing tape T in a case having a bottom surface and a side surface. The top surface of the polishing head 319 is preferably made of a cover that can be opened and closed. The polishing head 319 is provided with a pad member (polishing pad) 324, and the polishing tape supplied by the roller is disposed on the pad member 324. The polishing tape T is supplied from the supply roller 321 and wound by the winding roller 322. The supply roller 321 is connected to a torque motor (not shown) in order to provide a moderate tension to the polishing tape T. Winding roller 322 is connected to stepper motor (stepping motor) (not shown), and the polishing tape T supplied from the supply roller 321 is wound. A stopper roller for providing a moderate tension to the polishing tape T, and an auxiliary roller for appropriately arranging the polishing tape T to the pad member 324 may be disposed. The polishing tape T disposed on the polishing pad 324 divides the polishing surface 320 having a predetermined length and width in accordance with the shape of the surface of the polishing pad 324 (for example, a flat rectangular shape).

墊構件324，較佳是為了在工件W之被研磨部分形成高精度的表面性狀，可適切地選擇。當墊構件324之彈性過大時(例如，蕭氏(Shore)A硬度未滿20)，工件W之被研磨部分(例如，邊部)的精加工面會塌邊，且邊緣部之直線性容易消失。又，當研磨帶T之表面所含的研磨粒之平均粒徑為1μm以下(#8000)的情況，在彈性大的發泡樹脂板等之墊構件方面，研磨速度會急劇地變慢而非實用。當彈性小的情況(例如，蕭氏A硬度超過90)，精加工面之邊緣部的直線性雖然充分，但是因機械衝擊而發生在工件的傷痕或缺陷之去除則容易變得不充分。 The pad member 324 is preferably selected in order to form a highly precise surface property on the portion to be polished of the workpiece W. When the elasticity of the pad member 324 is excessively large (for example, the Shore A hardness is less than 20), the finished surface of the ground portion (for example, the side portion) of the workpiece W may collapse, and the linearity of the edge portion is easy. disappear. In addition, when the average particle diameter of the abrasive grains contained in the surface of the polishing tape T is 1 μm or less (#8000), the polishing speed is drastically slowed off in the case of a cushion member such as a foamed resin sheet having a large elasticity. practical. When the elasticity is small (for example, the Shore A hardness exceeds 90), the linearity of the edge portion of the finished surface is sufficient, but the occurrence of scratches or defects occurring in the workpiece due to mechanical impact is likely to be insufficient.

例如，作為墊構件324，為了要緩和機械衝擊，而可以使用蕭氏A硬度為20至50之範圍的發泡樹脂板。中介具有彈性的墊構件324，將藉由研磨帶T所形成的研磨面320抵接於工件，藉此可以緩和機械衝擊，且即便被研磨部之形狀與研磨一同變化亦可容易追蹤。 For example, as the pad member 324, a foamed resin sheet having a Shore A hardness of 20 to 50 may be used in order to alleviate the mechanical impact. The pad member 324 having an elastic property abuts the workpiece by the polishing surface 320 formed by the polishing tape T, whereby the mechanical impact can be alleviated, and the shape of the portion to be polished can be easily tracked even if it changes together with the polishing.

或是，作為墊構件324，亦可使用將如上述之發泡樹脂板、與蕭氏A硬度在80至90之範圍的橡膠板組 合在一起者。藉由如此，即便是使用平均粒徑極細微的(例如，1μm以下)研磨粒之研磨帶，亦不會使研磨速度過慢，而可以形成具有高精度之表面性狀(Ra、Rv)之邊緣部的直線性優異之精加工面。 Alternatively, as the pad member 324, a rubber sheet group having a foamed resin sheet as described above and having a Shore A hardness of 80 to 90 may be used. Together. In this way, even if a polishing tape having an extremely fine average particle diameter (for example, 1 μm or less) is used, the polishing rate is not too slow, and an edge having a highly precise surface property (Ra, Rv) can be formed. The finishing surface of the department with excellent linearity.

墊構件324，亦可為不具有MC尼龍等之彈性者。當墊構件324不具有彈性的情況，較佳是進行按壓控制，以免發生機械衝擊。 The pad member 324 may also be elastic without MC nylon or the like. When the pad member 324 does not have elasticity, it is preferable to perform press control to prevent mechanical shock.

墊構件324之表面，亦可為非平坦的凸狀之曲面。此是因可以限制被研磨部分之端部(例如，邊部之兩端等)對研磨帶T(研磨面)之接觸，且可以一邊保護研磨帶T一邊進行研磨之故。 The surface of the pad member 324 may also be a non-flat convex curved surface. This is because the end portion of the portion to be polished (for example, the both ends of the side portion) can be restricted from contacting the polishing tape T (polishing surface), and the polishing tape T can be polished while being polished.

使用具有柔軟性的研磨帶與具有彈性的墊構件進行工件W之周緣部的C面研磨，藉此在精加工面(S1，第2圖)中，邊緣部(上面或下面與精加工面S1之境界部)大致能形成為剖面R形狀的曲面，且不會在新的邊緣部形成新的傷痕或缺陷。 The C-side polishing of the peripheral portion of the workpiece W is performed using a flexible polishing tape and an elastic spacer member, whereby in the finished surface (S1, FIG. 2), the edge portion (the upper or lower surface and the finished surface S1) The boundary portion can be formed into a curved surface having a cross-sectional shape R, and no new flaws or defects are formed in the new edge portion.

研磨處理中，研磨帶T可為靜止的狀態，亦可連續性或斷續性地行走。在短時間結束研磨的情況，亦可不使研磨帶T行走而在靜止的狀態下使用，且為了在研磨後進行下次的研磨而將新的研磨帶T之表面作為研磨面供應至墊構件。若如此，則可以減低成本。在研磨及於長時間的情況，為了供應繼續穩定的研磨面、即包含研磨粒的研磨帶之表面，較佳是連續性或繼續地使研磨帶行走。若如此，則可以提高研磨效率。 In the polishing process, the polishing tape T may be in a stationary state, and may be continuously or intermittently traveled. When the polishing is completed in a short time, the polishing tape T may be used in a stationary state without being moved, and the surface of the new polishing tape T may be supplied as a polishing surface to the pad member in order to perform the next polishing after polishing. If so, you can reduce costs. In the case of grinding and for a long period of time, in order to supply the surface of the polishing belt which continues to be stable, that is, the surface of the polishing belt containing the abrasive grains, it is preferred to continuously or continuously move the polishing belt. If so, the polishing efficiency can be improved.

用以將藉由配置於墊構件324之研磨帶T而劃分的研磨面320按壓於板狀玻璃等工件W之邊部或端面的按壓力，係可依工件W之狀態，在研磨初期較小，而隨著研磨之行進逐漸地變大。例如，在板狀玻璃的情況，當在***之角部或端面有銳角的部分，且從研磨初期施加較強的按壓力時，就有因銳角的部分而在研磨面320之研磨帶T留下傷痕，或使研磨帶T破損的情況。可以藉由調節按壓力，一邊保護研磨帶表面一邊進行研磨。 The pressing surface 320 for dividing the polishing surface 320 defined by the polishing tape T disposed on the pad member 324 against the side or end surface of the workpiece W such as the sheet glass may be smaller in the initial stage of the grinding according to the state of the workpiece W. And gradually becomes larger as the grinding progresses. For example, in the case of a sheet glass, when a portion having an acute angle at a corner portion or an end surface of the sheet and a strong pressing force is applied from the initial stage of the grinding, there is a portion of the sharp angle which is left in the polishing belt T of the polishing surface 320. Lower scratches or damage to the polishing tape T. Grinding can be performed while protecting the surface of the polishing tape by adjusting the pressing force.

第1工件單元350，係具有用以將工件W保持於水平的呈水平之第1工件保持台351。在研磨處理之前，工件W較佳是(藉由工件搬運單元20)橫跨研磨軸線A而配置於第1工件保持台351。 The first workpiece unit 350 has a first workpiece holding stage 351 which is horizontal to hold the workpiece W horizontal. Before the polishing process, the workpiece W is preferably disposed on the first workpiece holding table 351 across the polishing axis A (by the workpiece conveying unit 20).

第4B圖係圖示本發明的研磨裝置之第1研磨部中的定位機構。研磨帶單元載置台301，係藉由馬達302(第4A圖)與LM導件303、304(第4A圖)而朝向A1方向移動，使置放於第1工件保持台351的工件W之一個端面(或邊部)的至少一部分抵接於研磨面320。進而藉由被推向研磨面320，一個端面(邊部)整體，就會在研磨軸線A抵接於研磨面320。此時研磨軸線A，係可與旋動軸線A2一致。 Fig. 4B is a view showing a positioning mechanism in the first polishing portion of the polishing apparatus of the present invention. The polishing tape unit mounting table 301 is moved in the A1 direction by the motor 302 (Fig. 4A) and the LM guides 303 and 304 (Fig. 4A), and one of the workpieces W placed on the first workpiece holding table 351 is placed. At least a portion of the end surface (or the side portion) abuts against the polishing surface 320. Further, by being pushed toward the polishing surface 320, the entire end surface (side portion) abuts on the polishing surface 320 at the polishing axis A. At this time, the grinding axis A can be aligned with the rotation axis A2.

如此定位的工件W，由於能固定於第1工件保持台351，並進行研磨處理，所以可以對矩形的工件之一個端面(邊部)，進行沒有局部接觸之均一的研磨。 Since the workpiece W thus positioned can be fixed to the first workpiece holding table 351 and polished, it is possible to perform uniform polishing on one end surface (side portion) of the rectangular workpiece without local contact.

第5圖係顯示第4A圖之一部分省略後的X- X’線側視圖。旋動臂314與延長臂314’係為了簡化而圖示為一體，研磨頭319係以虛線圖示。中介連接夾具330、板317、傾斜板318而保持的旋動臂314，能夠以旋動軸線A2(較佳是位在研磨面320上)為中心而旋動地，將研磨頭319安裝於支柱306。夾隔著研磨頭319而在相反側，將旋動臂315安裝於支柱307(第4A圖)。旋動臂或連接夾具之形狀並非被特別限定，可以適當選擇來保持研磨頭319及與研磨頭319一體的構件(板、馬達等)。 Figure 5 shows the X- omitted part of Figure 4A. Side view of the X' line. The swivel arm 314 and the elongate arm 314' are shown as being integrated for simplicity, and the lapping head 319 is illustrated by dashed lines. The rotary arm 314 held by the intermediate connection jig 330, the plate 317, and the inclined plate 318 can be rotated about the rotation axis A2 (preferably on the polishing surface 320), and the polishing head 319 is attached to the support. 306. The rotating arm 315 is attached to the stay 307 (Fig. 4A) on the opposite side with the polishing head 319 interposed therebetween. The shape of the swing arm or the connection jig is not particularly limited, and the polishing head 319 and the member (plate, motor, etc.) integrated with the polishing head 319 can be appropriately selected.

如上述，旋動臂314，係藉由軸支銷316樞接於連結構件313，在連結構件313之後端，固定安裝有貫通連結塊311的軸312、312’，連結塊311，係能夠藉由LM導件309及單軸機械人310，沿著支柱305朝向鉛垂方向移動。 As described above, the swing arm 314 is pivotally connected to the connecting member 313 by the pivot pin 316, and the shaft 312, 312' that penetrates the connecting block 311 is fixedly attached to the rear end of the connecting member 313, and the connecting block 311 can be borrowed. The LM guide 309 and the single-axis robot 310 move in the vertical direction along the support 305.

隨著連結塊311沿著支柱305朝向上方移動，與連結構件313一體的軸312、312’可朝向圖式之右方向引出，旋動臂314旋動於旋動軸線A2之周圍，由旋動臂保持的研磨頭319旋動於旋動軸線A2之周圍，而研磨面320，可以對鉛垂面，傾斜α度。角度α之範圍，並未被限定於圖示之例，可以藉由連結塊311之鉛垂方向的移動距離或軸312、312’之長度等而任意決定。角度α之範圍，相對於包含旋動軸線A2的鉛垂面，較佳是-90度≦α≦90度。 As the connecting block 311 moves upward along the strut 305, the shafts 312, 312' integral with the connecting member 313 can be drawn toward the right direction of the drawing, and the swing arm 314 is swung around the rotation axis A2, and is rotated. The arm holding head 319 is rotated around the rotation axis A2, and the grinding surface 320 can be inclined by a degree to the vertical plane. The range of the angle α is not limited to the illustrated example, and can be arbitrarily determined by the moving distance of the connecting block 311 in the vertical direction or the length of the shafts 312 and 312'. The range of the angle α is preferably -90 degrees ≦α ≦ 90 degrees with respect to the vertical plane including the rotation axis A2.

如此，藉由研磨頭319之研磨面320僅對鉛垂面傾斜角度α，就可以對水平保持於工件單元的工件W (未圖示)之上面的一個邊部(稜部)進行所期望的C面研磨。 Thus, by the polishing surface 320 of the polishing head 319 tilting the angle α only to the vertical plane, the workpiece W held horizontally to the workpiece unit can be held. One of the upper side portions (edge portions) (not shown) performs desired C-side polishing.

同樣地，藉由連結塊311沿著支柱305朝向下方移動，研磨面320，係可以抵接於水平保持於工件單元的工件W(未圖示)之下面的邊部(稜部)且進行所期望的C面研磨。 Similarly, the connecting block 311 is moved downward along the support post 305, and the polishing surface 320 can be brought into contact with the side portion (edge portion) of the workpiece W (not shown) horizontally held by the workpiece unit. The desired C-face grinding.

第6圖係圖示本發明的第1研磨帶單元300之傾斜機構。如上述，與旋動臂314(第4A圖、第5圖)一體的連接夾具330、331係一體地保持板317。傾斜板318，係藉由軸支銷325，能夠旋動於貫通軸支銷325的軸線A7(第5圖)之周圍地安裝於板317。研磨頭319之下面，係一體地連結於傾斜板318之平坦的上端(第4A圖)。在板317，係設置有以軸支銷325(軸線A7)為中心之形成圓之圓弧的導槽326a、326b、326c、326d。一體地設置於傾斜板318的固定夾具327a、327b、327c、327d，係隨著傾斜板318之旋動，而各個滑動於導槽326a、326b、326c、326d內，且在任意的位置將傾斜板318固定於板317。 Fig. 6 is a view showing the tilt mechanism of the first polishing tape unit 300 of the present invention. As described above, the connection jigs 330 and 331 which are integral with the swing arm 314 (Fig. 4A and Fig. 5) integrally hold the plate 317. The inclined plate 318 is attached to the plate 317 by the pivot pin 325 so as to be rotatable around the axis A7 (Fig. 5) of the through-shaft pin 325. The lower surface of the polishing head 319 is integrally coupled to the flat upper end of the inclined plate 318 (Fig. 4A). In the plate 317, guide grooves 326a, 326b, 326c, and 326d which form a circular arc around the shaft pin 325 (axis A7) are provided. The fixing jigs 327a, 327b, 327c, and 327d integrally provided on the inclined plate 318 are slid in the guide grooves 326a, 326b, 326c, and 326d as the inclined plates 318 are rotated, and are inclined at an arbitrary position. Plate 318 is secured to plate 317.

當傾斜板不旋動時，藉由研磨帶T之表面而形成的研磨面320之長邊軸線A3，係與研磨軸線A(工件之被研磨部分與研磨面接觸並為了研磨而相對移動的軌跡)一致。當傾斜板318旋動時，研磨面320之長邊軸線A3，例如就僅對長邊軸線A3’傾斜θ。角度θ之範圍，較佳是0度<θ≦90度。 When the inclined plate is not rotated, the long side axis A3 of the polishing surface 320 formed by polishing the surface of the belt T is a trajectory with the grinding axis A (the workpiece is polished by the ground portion and moved relative to the grinding surface for grinding) ) Consistent. When the inclined plate 318 is rotated, the long side axis A3 of the grinding surface 320 is inclined, for example, only to the long side axis A3'. The range of the angle θ is preferably 0 degrees < θ ≦ 90 degrees.

第7圖係圖示本發明的第1工件單元350中之保持工件W的第1工件保持台351之擺動機構。 Fig. 7 is a view showing a swing mechanism of the first workpiece holding stage 351 holding the workpiece W in the first workpiece unit 350 of the present invention.

第1工件單元350，係具有：固定板359，其係水平載置於在基座2之上朝向鉛垂方向伸長的支柱(未圖示)之頂部，且於上面具有平行於研磨軸線A的LM軌條360a、360b。在固定板359之下方，係設置有藉由馬達352與確動皮帶(timing belt)355而連動並驅動的確動滑輪(timing pulley)354a、354b、354c、及353a、353b、353c、353d。在固定板359之上方，係與能夠擺動於LM軌條360a、360b上的LM塊體361a、361b、361c、361d一體地水平載置有第1工件保持台351。同樣地，在固定板359之上方，係與能夠擺動於LM軌條360a、360b上的LM塊體362a、362b一體地載置有平衡器(配重)358b，且與LM塊體363a、363b一體地載置有平衡器(配重)358c。 The first workpiece unit 350 has a fixing plate 359 that is horizontally placed on top of a post (not shown) that is elongated in the vertical direction on the susceptor 2, and has a parallel to the grinding axis A on the upper surface. LM rails 360a, 360b. Below the fixed plate 359, timing pulleys 354a, 354b, 354c, and 353a, 353b, 353c, and 353d that are interlocked and driven by a motor 352 and a timing belt 355 are provided. Above the fixing plate 359, the first workpiece holding table 351 is horizontally placed integrally with the LM blocks 361a, 361b, 361c, and 361d that can swing on the LM rails 360a and 360b. Similarly, above the fixing plate 359, a balancer (weight) 358b is placed integrally with the LM blocks 362a and 362b swingable on the LM rails 360a and 360b, and the LM blocks 363a and 363b are placed. A balancer (weight) 358c is placed integrally.

在設置於第1工件保持台351之下面的溝槽357a，係***有從確動滑輪354a之上面鉛垂地伸長的桿(rod)356a。又，在設置於平衡器358b之下面的溝槽357b，係***有從確動滑輪354b之上面鉛垂地伸長的桿356b，在設置於平衡器358c之下面的溝槽357c，係***有從確動滑輪354c之上面鉛垂地伸長的桿356c。 A rod 356a that is vertically extended from the upper surface of the fixed pulley 354a is inserted into the groove 357a provided on the lower surface of the first workpiece holding table 351. Further, a groove 356b that is vertically extended from the upper surface of the fixed pulley 354b is inserted into the groove 357b provided under the balancer 358b, and the groove 357c provided under the balancer 358c is inserted into the groove 357c. A rod 356c that is vertically elongated on the upper side of the movable pulley 354c.

藉由馬達352之驅動，確動滑輪354a、354b、354c會旋轉，且桿356a、356b、356c會同步地旋轉，藉此第1工件保持台351、平衡器358b、358c各個 沿著研磨軸線A擺動。 The driving pulleys 354a, 354b, and 354c are rotated by the driving of the motor 352, and the rods 356a, 356b, and 356c are synchronously rotated, whereby the first workpiece holding table 351, the balancers 358b, and 358c are each rotated. Swing along the grinding axis A.

在此，第1工件保持台351，係構成為能充分地抑制藉由固定手段(未圖示)而保持於水平的工件W之震動。當第1工件保持台351朝向圖式之左方向移動時，平衡器358b、358c就各個朝向右方向移動。當第1工件保持台351朝向圖式之右方向移動時，平衡器358b、358c就各個朝向左方向移動。藉由如此，能抵消第1工件保持台351擺動時的震動，且可以進行高精度的研磨。 Here, the first workpiece holding stage 351 is configured to sufficiently suppress the vibration of the workpiece W held horizontally by the fixing means (not shown). When the first workpiece holding stage 351 moves in the left direction of the drawing, the balancers 358b and 358c move in the right direction. When the first workpiece holding stage 351 moves in the right direction of the drawing, the balancers 358b and 358c move in the left direction. As a result, it is possible to cancel the vibration when the first workpiece holding table 351 is swung, and it is possible to perform high-precision polishing.

擺動機構，亦可構成為：為了抑制震動，而相鄰設置複數台(例如，二台)第1工件保持台351，且沿著研磨軸線A，同步地朝向相反方向擺動。在此情況下，由於能藉由複數台工件保持台來抵消震動，所以不需要平衡器。 The swing mechanism may be configured such that a plurality of (for example, two) first workpiece holding stages 351 are disposed adjacent to each other in order to suppress vibration, and are swung in opposite directions along the grinding axis A. In this case, since the vibration can be counteracted by the plurality of workpiece holding stages, the balancer is not required.

即便藉由按壓研磨面(研磨帶T)之力、墊構件之柔軟性、彈性、及板狀玻璃之強度，使被研磨體(板狀玻璃)相對於研磨體(研磨面)移動並進行研磨處理，在研磨中亦不會使被研磨體破損。由於研磨時的被研磨部分與研磨面(研磨帶之表面)之相對移動，會抑制震動並沿著研磨軸線進行，所以可以將高精度之表面性狀提供給被研磨面(精加工面S1等，第2圖)，以便提高板狀玻璃之強度。 Even if the strength of the polishing surface (the polishing tape T), the flexibility of the pad member, the elasticity, and the strength of the plate glass are pressed, the object to be polished (plate glass) is moved and polished with respect to the polishing body (polishing surface). The treatment does not damage the object to be polished during polishing. Since the relative movement of the polished portion and the polishing surface (the surface of the polishing tape) during polishing suppresses the vibration and proceeds along the polishing axis, it is possible to provide a highly precise surface property to the surface to be polished (finished surface S1, etc. Figure 2) in order to increase the strength of the sheet glass.

第8圖係圖示本發明的研磨裝置之其他態樣的定位機構。第1工件單元350之第1工件保持台351’，係在上面具有溝槽334。能夠朝向馬達332之驅動軸A1’ 方向移動的桿333係位於該溝槽內。 Fig. 8 is a view showing a positioning mechanism of another aspect of the polishing apparatus of the present invention. The first workpiece holding stage 351' of the first workpiece unit 350 has a groove 334 on its upper surface. A drive shaft A1' capable of facing the motor 332 A directionally moving rod 333 is located within the groove.

如第8圖(A)，在工件W未跨越研磨軸線A來置放的情況，藉由馬達332所驅動的桿333係將工件W在A1方向，朝向研磨軸線A推出。藉由如此，研磨帶單元之研磨面與工件W之被研磨部分，可以在研磨軸線A確實地抵接。 As shown in Fig. 8(A), when the workpiece W is not placed across the grinding axis A, the rod 333 driven by the motor 332 pushes the workpiece W toward the grinding axis A in the A1 direction. As a result, the polishing surface of the polishing tape unit and the polished portion of the workpiece W can reliably abut on the polishing axis A.

第9圖係圖示本發明的研磨裝置1(第3圖)之第2研磨部40。第2研磨部40，係包含：第2研磨帶單元300’；以及第2工件單元400，其係夾隔著研磨軸線A對向配置於該第2研磨帶單元300’，且具有可供工件W配置的第2工件保持台401。第2研磨帶單元300’，較佳是具有與第1研磨帶單元300同樣的構成。研磨軸線A係可與第1研磨部一致。又，亦可具有不與第1研磨軸線A一致之水平的研磨軸線A’。 Fig. 9 is a view showing the second polishing unit 40 of the polishing apparatus 1 (Fig. 3) of the present invention. The second polishing unit 40 includes a second polishing tape unit 300 ′ and a second workpiece unit 400 that is disposed opposite to the second polishing tape unit 300 ′ via the polishing axis A and has a workpiece available The second workpiece holding stage 401 disposed in the W. The second polishing tape unit 300' preferably has the same configuration as that of the first polishing tape unit 300. The polishing axis A can match the first polishing portion. Further, it is also possible to have a polishing axis A' which is not horizontal to the first polishing axis A.

第10A圖及第10B圖係圖示第2工件單元400。在第10A圖中，工件W及第2工件保持台401係以虛線顯示。 FIGS. 10A and 10B are diagrams showing the second workpiece unit 400. In Fig. 10A, the workpiece W and the second workpiece holding table 401 are shown by broken lines.

第2工件單元400，係具有：固定板403，其係水平載置於從水平之基座2上朝向鉛垂上方伸長的支柱402、402’之上；以及固定板405，其係水平載置於從固定板403之上面朝向鉛垂上方伸長的支柱404之上。 The second workpiece unit 400 has a fixing plate 403 which is horizontally placed on the pillars 402, 402' which are elongated from the horizontal base 2 toward the vertically upward direction, and a fixing plate 405 which is horizontally placed. Above the support 404 which is elongated from the upper surface of the fixed plate 403 toward the vertical direction.

在固定板405之上，係藉由伺服馬達414及單軸可動單元408而能夠朝向X方向往復移動地安裝有X方向可動載置台413。在X方向可動載置台413之上係一 體地安裝有X方向可動板406。由軸構件所構成的鉛垂軸A4係從X方向可動板406之上面鉛垂地伸長，且能夠旋轉地水平支撐第2工件保持台401。 On the fixed plate 405, the X-direction movable mounting table 413 is attached to the X-direction reciprocating movement by the servo motor 414 and the single-axis movable unit 408. Attached to the movable mounting table 413 in the X direction The X-direction movable plate 406 is integrally mounted. The vertical axis A4 formed of the shaft member is vertically extended from the upper surface of the X-direction movable plate 406, and the second workpiece holding table 401 is rotatably supported horizontally.

又，在固定板405之上，係藉由線性導件409而能夠朝向Y方向往復移動地安裝有具有孔429的Y方向可動載置台407。在Y方向可動載置台407之上，係一體地設置有Y方向可動板410，且在該Y方向可動板410之上一體地安裝有具有導槽412的導引構件411。由從第2工件保持台401之下面鉛垂地伸長的桿(或銷)所構成的軸A5，係能夠滑動地位在X方向上所形成的導槽412內。 Further, on the fixed plate 405, a Y-direction movable mounting table 407 having a hole 429 is reciprocally movable in the Y direction by the linear guide 409. A Y-direction movable plate 410 is integrally provided on the Y-direction movable stage 407, and a guide member 411 having a guide groove 412 is integrally attached to the Y-direction movable plate 410. The shaft A5 composed of a rod (or a pin) that is vertically extended from the lower surface of the second workpiece holding stage 401 is slidably positioned in the guide groove 412 formed in the X direction.

在板403與板405之間，係設置有藉由馬達420及確動皮帶423而連動並驅動的確動滑輪422、424，且在確動滑輪422與Y方向可動載置台407之間，設置有能夠與確動滑輪422同步地旋轉的旋轉構件425。從旋轉構件425之上面朝向鉛垂上方伸長的桿427係***於Y方向可動載置台407之孔429內。 Between the plate 403 and the plate 405, the actuating pulleys 422 and 424 that are interlocked and driven by the motor 420 and the actuating belt 423 are provided, and between the securing pulley 422 and the Y-direction movable mounting table 407, The rotating member 425 that rotates the pulley 422 synchronously. A rod 427 that is elongated from the upper surface of the rotating member 425 toward the vertical direction is inserted into the hole 429 of the Y-direction movable mounting table 407.

當藉由馬達420之驅動，使確動滑輪422中介確動皮帶423而旋轉時，旋轉構件425就會與滑輪422同步地旋轉。當旋轉構件425旋轉時，一體的桿427就會旋轉且一邊移動於設置在Y方向可動載置台407的孔429內，一邊使可動載置台407以固定的行程朝向Y方向往復移動。按照Y方向可動載置台407之往復移動，一體的板410及導引構件411會朝向Y方向往復移動，且導槽412內的鉛垂軸A5會朝向Y方向移動。對應鉛垂軸A5朝向 Y方向之移動，鉛垂軸A5之Y方向的位置y，會通過定序器(sequencer)而傳遞至伺服馬達414，且藉由伺服馬達414，使得鉛垂軸A4同步，並朝向工件W之非直線的被研磨部分(具有預定之曲率的角部)位在研磨軸線A上之鉛垂軸A4的X方向之位置x移動。藉由鉛垂軸A4朝向X方向之移動，能夠旋轉地水平保持於該鉛垂軸A4的第2工件保持台401就會朝向X方向移動，而與第2工件保持台401一體的鉛垂軸A5，則滑動於溝槽412內並朝向X方向移動。鉛垂軸A5之動作，係將Y方向與X方向之移動組合在一起者，且成為旋動於鉛垂軸A4之周圍的動作。例如鉛垂軸A5，係以擺動的行程之中心C為中心，而可移動於將長徑設為2d的橢圓之圓周上。 When the driving pulley 422 is rotated by the driving of the motor 420 to actuate the belt 423, the rotating member 425 rotates in synchronization with the pulley 422. When the rotating member 425 rotates, the integral rod 427 rotates and moves in the hole 429 provided in the Y-direction movable mounting table 407, and the movable mounting table 407 reciprocates in the Y direction with a fixed stroke. According to the reciprocating movement of the movable stage 407 in the Y direction, the integrated plate 410 and the guide member 411 reciprocate in the Y direction, and the vertical axis A5 in the guide groove 412 moves in the Y direction. Corresponding to the vertical axis A5 orientation In the Y direction, the position y of the vertical axis A5 in the Y direction is transmitted to the servo motor 414 through the sequencer, and the servo motor 414 synchronizes the vertical axis A4 toward the workpiece W. The non-linear polished portion (the corner having the predetermined curvature) is moved at the position x in the X direction of the vertical axis A4 on the grinding axis A. By the movement of the vertical axis A4 in the X direction, the second workpiece holding stage 401 that is rotatably held horizontally on the vertical axis A4 moves in the X direction, and the vertical axis integrated with the second workpiece holding table 401 A5 slides in the groove 412 and moves in the X direction. The operation of the vertical axis A5 is a combination of the movement of the Y direction and the X direction, and the operation of the rotation around the vertical axis A4. For example, the vertical axis A5 is centered on the center C of the stroke of the swing, and is movable on the circumference of the ellipse having the long diameter of 2d.

如此，鉛垂軸A4朝向X方向移動，鉛垂軸A5朝向X方向及Y方向移動，藉此第2工件保持台401可以一邊進行迴旋擺頭運動一邊沿著研磨軸線A擺動，且使矩形的工件之角部等之非直線的被研磨部分一邊依次地抵接於研磨面一邊進行研磨。 In this manner, the vertical axis A4 moves in the X direction, and the vertical axis A5 moves in the X direction and the Y direction, whereby the second workpiece holding stage 401 can swing along the polishing axis A while performing the swinging oscillating motion, and is rectangular. The non-linear polished portion of the corner portion of the workpiece is sequentially abutted against the polishing surface and polished.

使用伺服馬達進行位置控制，藉此可以輕易地控制研磨軸線A上之非直線的被研磨部分之迴旋擺頭、擺動的行程，且可以進行所期望之曲率的R面研磨。由於工件可以沿著工件之被研磨部分的形狀擺動且進行研磨，所以沒必要按照工件之被研磨部分的形狀來製作研磨物(磨石等)。 Position control is performed using a servo motor, whereby the gyroscopic swing head of the non-linear polished portion on the grinding axis A, the stroke of the swing, and the R-face grinding of the desired curvature can be easily controlled. Since the workpiece can be swung and polished along the shape of the portion to be polished of the workpiece, it is not necessary to produce an abrasive (grinding stone or the like) in accordance with the shape of the portion to be polished of the workpiece.

亦可藉由伺服馬達進行X軸與Y軸的雙軸控 制，以取代上述的構成。或是，亦可藉由凸輪控制來控制上述的二個鉛垂軸之位置，以取代伺服馬達之控制。在該情況下，可以使用用以使鉛垂軸A4朝向X方向移動的確動滑輪、及與鉛垂軸A5之Y方向之移動同步的凸輪，取代伺服馬達，而構成裝置。 Dual-axis control of X-axis and Y-axis by servo motor In order to replace the above composition. Alternatively, the position of the two vertical axes described above may be controlled by cam control instead of the control of the servo motor. In this case, a servo pulley for moving the vertical axis A4 in the X direction and a cam synchronized with the movement of the vertical axis A5 in the Y direction can be used instead of the servo motor.

第2研磨帶單元300’之研磨面320’，亦可藉由對鉛垂面傾斜α度，來進行工件W之角部之上面(或下面)的稜部之研磨。 The polishing surface 320' of the second polishing tape unit 300' may be polished by slanting the vertical surface by a degree to the upper surface (or lower surface) of the corner portion of the workpiece W.

本發明之研磨裝置，較佳是包含用以控制各單元的控制裝置(未圖示)。 The polishing apparatus of the present invention preferably includes a control device (not shown) for controlling each unit.

本發明之研磨裝置，係可以進行乾式或濕式之任一種研磨。為了進行濕式研磨，較佳是具有用以供應施加有水或界面活性劑之水溶液的供水機或水管(未圖示)。藉由對研磨面或工件供應水等，就可以提高研磨效率，或是可以沖洗研磨屑。研磨裝置，亦可具備用以噴射空氣的空氣噴嘴。因可以預防水或研磨屑附著於工件單元等之故。又，為了防止由金屬材料所構成的工件之燒傷，較佳是具有供應加工油的供應機或管(未圖示)。 The polishing apparatus of the present invention can perform either one of dry or wet type grinding. For wet grinding, it is preferred to have a water supply or water pipe (not shown) for supplying an aqueous solution to which water or a surfactant is applied. By supplying water or the like to the polishing surface or the workpiece, the polishing efficiency can be improved, or the polishing debris can be washed. The polishing apparatus may also be provided with an air nozzle for injecting air. This prevents water or abrasive debris from adhering to the workpiece unit. Further, in order to prevent burns of the workpiece made of a metal material, it is preferable to have a supply machine or a tube (not shown) for supplying the processing oil.

本發明之研磨裝置，係可包含研磨上述的工件之直線的被研磨部分之第1研磨部以及研磨工件之非直線的被研磨部分之第2研磨部所構成。藉由如此，可以用一台研磨裝置來研磨板狀玻璃之周緣部的全體。又，由於使用研磨帶進行研磨，所以可以在精加工面形成高精度之表面性狀，且可以提高被研磨物之品質。由於可以使用研 磨帶來研磨各式各樣的形狀之工件，所以可以減低成本，亦少發生研磨時的研磨屑，且亦容易進行裝置之保養。 The polishing apparatus of the present invention may comprise a first polishing portion that polishes the polished portion of the straight line of the workpiece, and a second polishing portion that polishes the non-linear polished portion of the workpiece. Thus, the entire periphery of the sheet glass can be polished by one polishing apparatus. Moreover, since polishing is performed using a polishing tape, it is possible to form a highly precise surface property on the finished surface, and it is possible to improve the quality of the object to be polished. Because you can use research Grinding brings about the grinding of various shapes of the workpiece, so that the cost can be reduced, the grinding debris during grinding is less likely to occur, and the maintenance of the device is easy.

又，本發明之研磨裝置，亦可由上述的第1研磨部及第2研磨部之任一方所構成。 Further, the polishing apparatus of the present invention may be constituted by any one of the first polishing unit and the second polishing unit described above.

實施例1 Example 1

使用本發明之研磨裝置，可研磨工件之邊部(稜部)。作為工件，可使用長度70mm、寬度40mm、厚度0.8mm之長方形的鹼石灰玻璃(soda lime glass)。可藉由研磨該板狀玻璃之上面及下面的八邊而形成精加工面(S1等，第2圖)。在研磨中，研磨帶單元之研磨面的長邊軸線，係可對研磨軸線傾斜10度(θ=10°)。又，研磨面，係對鉛垂面傾斜45度(α=45°)。如此可藉由板狀玻璃之一個邊部與研磨面抵接，工件單元沿著研磨軸線擺動並使板狀玻璃與研磨面相對移動來進行研磨。C面研磨之研磨量係設為50μm，且為了設為固定的研磨量，可藉由研磨帶之表面所含的研磨粒徑，來調節板狀玻璃之往復次數(1次往復=1次通過)。研磨面係平行於研磨軸線，而研磨帶並未行走。又，一邊對研磨面供應小量的水一邊進行研磨。 The edge portion (edge portion) of the workpiece can be polished using the polishing apparatus of the present invention. As the workpiece, a rectangular soda lime glass having a length of 70 mm, a width of 40 mm, and a thickness of 0.8 mm can be used. The finished surface can be formed by grinding the upper and lower sides of the plate glass (S1, etc., Fig. 2). In the grinding, the long side axis of the polishing surface of the polishing belt unit can be inclined by 10 degrees (θ = 10°) to the grinding axis. Further, the polished surface was inclined by 45 degrees (α = 45°) with respect to the vertical plane. Thus, one side of the sheet glass is brought into contact with the polishing surface, and the workpiece unit is swung along the polishing axis and the sheet glass is moved relative to the polishing surface to be polished. The grinding amount of the C-side grinding is set to 50 μm, and the number of reciprocating times of the sheet glass can be adjusted by the grinding particle diameter contained on the surface of the polishing belt in order to set the amount of polishing to be fixed (1 passback = 1 pass) ). The abrasive surface is parallel to the axis of the grinding and the abrasive belt is not running. Further, the polishing is performed while supplying a small amount of water to the polishing surface.

其他的實施例1之研磨條件，係如以下所述。 The polishing conditions of the other Example 1 are as follows.

研磨條件(1邊) Grinding conditions (1 side)

玻璃之往復運動的行程長度(L)：150mm Stroke length of glass reciprocating motion (L): 150mm

研磨帶之寬度：30mm Grinding belt width: 30mm

研磨帶之按壓力(推力)：15N Pressing belt pressure (thrust): 15N

作為研磨帶，係可使用GC(綠色金剛砂(green carborundum))#4000(SiC：平均研磨粒徑3μm)，而作為墊構件，係使用蕭氏A硬度30的發泡樹脂墊。板狀玻璃之往復次數為21次通過。 As the polishing tape, GC (green carborundum) #4000 (SiC: average polishing particle diameter: 3 μm) can be used, and as the pad member, a foamed resin pad having a Shore A hardness of 30 is used. The number of reciprocations of the sheet glass was 21 passes.

實施例2 Example 2

在實施例2之製造方法中，作為研磨帶，係使用GC#6000(平均研磨粒徑2μm)。板狀玻璃之往復次數為24次通過。其他的條件係與實施例1同樣。 In the production method of Example 2, GC#6000 (average polishing particle diameter: 2 μm) was used as the polishing tape. The number of reciprocations of the plate glass was 24 passes. Other conditions are the same as in the first embodiment.

實施例3 Example 3

在實施例3之製造方法中，作為研磨帶，係使用GC#10000(平均研磨粒徑0.5μm)。作為墊構件，係可使用蕭氏A硬度80的橡膠板及蕭氏A硬度30的發泡樹脂板。板狀玻璃之往復次數為31次通過。其他的條件係與實施例1同樣。 In the production method of Example 3, GC#10000 (average polishing particle diameter: 0.5 μm) was used as the polishing tape. As the mat member, a rubber sheet having a Shore A hardness of 80 and a foamed resin sheet having a Shore A hardness of 30 can be used. The number of reciprocations of the sheet glass was 31 passes. Other conditions are the same as in the first embodiment.

比較例1 Comparative example 1

在比較例1之製造方法中，作為研磨帶，係使用GC#1000(平均研磨粒徑16μm)。板狀玻璃之往復次數為7次通過。其他的條件係與實施例1同樣。 In the production method of Comparative Example 1, GC#1000 (average polishing particle diameter: 16 μm) was used as the polishing tape. The number of reciprocations of the sheet glass was 7 passes. Other conditions are the same as in the first embodiment.

比較例2 Comparative example 2

在比較例2之製造方法中，作為研磨帶，係使用GC#2000(平均研磨粒徑9μm)。板狀玻璃之往復次數為11次通過。其他的條件係與實施例1同樣。 In the production method of Comparative Example 2, GC#2000 (average polishing particle diameter: 9 μm) was used as the polishing tape. The number of reciprocations of the plate glass was 11 passes. Other conditions are the same as in the first embodiment.

比較例3 Comparative example 3

在比較例3之製造方法中，作為研磨帶，係使用GC#3000(平均研磨粒徑5μm)。板狀玻璃之往復次數為17次通過。其他的條件係與實施例1同樣。 In the production method of Comparative Example 3, GC#3000 (average polishing particle diameter: 5 μm) was used as the polishing tape. The number of reciprocations of the plate glass was 17 passes. Other conditions are the same as in the first embodiment.

比較例4 Comparative example 4

在比較例4之製造方法中，使用將網格大小#1000之鑽石研磨粒(平均粒徑14μm至22μm)進行金屬黏結的磨石500。如第11圖所示，可藉由配置磨石與板狀玻璃之主表面(上面及下面)的稜部，且使磨石旋轉，來進行稜部之倒角研磨。 In the manufacturing method of Comparative Example 4, a grindstone 500 in which a diamond abrasive grain of a mesh size of #1000 (average particle diameter of 14 μm to 22 μm) was metal-bonded was used. As shown in Fig. 11, chamfering of the ribs can be performed by arranging the ridges of the main surfaces (upper and lower surfaces) of the grindstone and the plate glass and rotating the grindstone.

如上述精加工研磨後的實施例、比較例之平均表面粗糙度Ra及粗糙度曲線的最大谷深Rv，係顯示於以下之表1。平均表面粗糙度Ra及最大谷深Rv係藉由表面粗糙計(製品名New View5000：Zygo公司製)所測定。 The average surface roughness Ra of the examples and comparative examples after the above-mentioned finishing polishing and the maximum valley depth Rv of the roughness curve are shown in Table 1 below. The average surface roughness Ra and the maximum valley depth Rv were measured by a surface roughness meter (product name New View 5000: manufactured by Zygo Co., Ltd.).

藉由實施例1至3之製造方法，可獲得被研磨部分形成高精度之精加工面(平均表面粗糙度Ra：1.7nm至11.5nm、最大谷深Rv：32nm至162nm)的板狀玻璃。往復通過次數為20次至30次左右，且研磨速度也充分。取決於比較例之製造方法的板狀玻璃之精加工面，多為最大谷深超過1000nm者。 By the production methods of Examples 1 to 3, it is possible to obtain a plate-shaped glass in which a highly polished surface (average surface roughness Ra: 1.7 nm to 11.5 nm, maximum valley depth Rv: 32 nm to 162 nm) is formed in the polished portion. The number of reciprocating passes is about 20 to 30 times, and the polishing speed is also sufficient. The finishing surface of the sheet glass depending on the manufacturing method of the comparative example is mostly those having a maximum valley depth of more than 1000 nm.

實施例、比較例之精加工面的放大照片係顯示於第12圖。左側為數位顯微鏡(digital microscope)(製品名VHX500：KEYENCE公司製)之光學照片，右側為表面粗糙度計(製品名New View5000：Zygo公司製)之光學照片。其中(A)為比較例1之精加工面，(B)為比較例2之精加工面，(C)為實施例1之精加工面，(D)為實施例3之精加工面。 The enlarged photographs of the finished surfaces of the examples and comparative examples are shown in Fig. 12. The left side is an optical photograph of a digital microscope (product name: VHX500: manufactured by Keyence), and the right side is an optical photograph of a surface roughness meter (product name: New View 5000: manufactured by Zygo Co., Ltd.). (A) is the finishing surface of Comparative Example 1, (B) is the finishing surface of Comparative Example 2, (C) is the finishing surface of Example 1, and (D) is the finishing surface of Example 3.

比較例之(A)、(B)，係表面之凹凸多且不足作為精加工面之表面性狀。實施例(C)、(D)，係成為沒有凹凸或傷痕的高精度之精加工面，且邊緣部之 直線性亦為優異。藉由使用研磨帶，精加工面係具有曲面。 In the comparative examples (A) and (B), the surface has many irregularities and is insufficient as a surface property of the finished surface. Examples (C) and (D) are high-precision finishing surfaces without irregularities or scratches, and the edges are Linearity is also excellent. The finished surface has a curved surface by using a grinding tape.

第13圖係以比較例4之製造方法所得的板狀玻璃之精加工面的放大照片。在表面有研磨痕(輪痕(wheel mark))，可看到很多的傷痕。藉由以磨石進行研磨，精加工面係未被形成曲面。 Fig. 13 is an enlarged photograph of the finished surface of the plate glass obtained by the production method of Comparative Example 4. There are scratch marks (wheel marks) on the surface, and many scars can be seen. The finished surface is not formed into a curved surface by grinding with a grindstone.

測定實施例、比較例之各板狀玻璃的邊緣強度(MPa)。所謂邊緣強度，係指玻璃之端緣部的強度。邊緣強度，係基於室溫彎曲強度試驗方法(JIS R1601)，使用市售的四點彎曲試驗機來測定。邊緣強度試驗(四點彎曲)之方法係示意性顯示於第14圖。以負荷夾具間隔為10mm、支撐夾具間隔為30mm、負荷速度為5mm/min之條件進行試驗。 The edge strength (MPa) of each of the plate glasses of the examples and the comparative examples was measured. The edge strength refers to the strength of the edge portion of the glass. The edge strength was measured based on the room temperature bending strength test method (JIS R1601) using a commercially available four-point bending tester. The method of the edge strength test (four-point bending) is schematically shown in Fig. 14. The test was carried out under the conditions of a load jig interval of 10 mm, a support jig interval of 30 mm, and a load speed of 5 mm/min.

表1係記載著試驗各10片的實施例、比較例之板狀玻璃，且將所得的邊緣強度予以平均所得的值。藉由本發明之研磨裝置，使用表面包含細微之研磨粒的研磨帶來研磨端緣部且形成精加工面的板狀玻璃，係可以大幅地減低精加工面之平均表面粗糙度Ra及最大谷深Rv值，結果與先前的磨石之加工相較，邊緣強度可以提高三倍以上。如此，本發明之板狀玻璃，因邊緣強度顯著提高，故而在使用該板狀玻璃之製品的製程中，可以預防板狀玻璃因機械應力或熱衝擊而破損。又，在板狀玻璃組入於製品之後亦不容易破損，且可以提高製品的可靠度。 Table 1 shows the values obtained by averaging the edge strengths of the examples of the ten sheets and the comparative examples of the sheet glass. According to the polishing apparatus of the present invention, the plate-like glass which is polished by the polishing tape having fine abrasive grains on the surface and which forms the finished surface can greatly reduce the average surface roughness Ra and the maximum valley depth of the finished surface. The Rv value results in an edge strength that is more than three times higher than that of the previous grindstone. As described above, since the edge glass strength of the sheet glass of the present invention is remarkably improved, it is possible to prevent the sheet glass from being damaged by mechanical stress or thermal shock in the process of using the sheet glass product. Moreover, the sheet glass is not easily broken after being placed in the product, and the reliability of the product can be improved.

實施例4 Example 4

使用本發明之研磨裝置，研磨板狀玻璃之角部。該板狀玻璃，係使用事先藉由磨石施予預定之R形狀加工(粗研磨)者。可使用與實施例1相同的研磨帶。壓力為1N，往復次數為5次通過。 The corners of the sheet glass are ground using the polishing apparatus of the present invention. The plate glass is subjected to a predetermined R shape processing (rough grinding) by a grindstone in advance. The same abrasive tape as in Example 1 can be used. The pressure was 1 N and the number of reciprocations was 5 passes.

實施例5 Example 5

研磨並未施予粗研磨的(***)板狀玻璃之角部。研磨帶，係在以D#600(30μm)施予R形狀加工(粗研磨)之後，使用與實施例1相同的研磨帶。 The corners of the coarsely ground (flare) sheet glass were not applied by grinding. The polishing tape was subjected to R-shape processing (rough grinding) at D #600 (30 μm), and the same polishing belt as in Example 1 was used.

即便是在實施例4、5中，亦可獲得高精度之精加工面(平均表面粗糙度Ra：約1.5nm至12nm、最大谷深Rv：約30nm至165nm)。 Even in Examples 4 and 5, a highly precise finished surface (average surface roughness Ra: about 1.5 nm to 12 nm, maximum valley depth Rv: about 30 nm to 165 nm) can be obtained.

只要未脫離本發明之思想及態樣仍能夠進行各式各樣的修正，此為該發明所屬技術領域中具有通常知識者所知。因而，當然本發明之態樣只不過是例示，而非限定本發明之範圍。 A wide variety of modifications can be made without departing from the spirit and scope of the invention, which is known to those of ordinary skill in the art. Accordingly, it is a matter of course that the invention is not to be construed as limiting the scope of the invention.

1‧‧‧研磨裝置 1‧‧‧ grinding device

2‧‧‧基座 2‧‧‧Base

10‧‧‧第1工件置放台 10‧‧‧1st workpiece placement table

20‧‧‧工件搬運單元 20‧‧‧Workpiece handling unit

30‧‧‧第1研磨部 30‧‧‧1st grinding department

40‧‧‧第2研磨部 40‧‧‧2nd grinding department

50‧‧‧第2工件置放台 50‧‧‧2nd workpiece placement table

W、W12‧‧‧工件 W, W12‧‧‧ workpiece

Wf‧‧‧流動方向 Wf‧‧‧flow direction

Claims (21)

一種研磨裝置，係用以使用研磨帶來研磨工件之周緣部的研磨裝置，其特徵為，包含：第1研磨部，其係具有水平的第1研磨軸線，用以研磨前述工件之周緣部之直線的被研磨部分；以及第2研磨部，其係具有水平的第2研磨軸線，用以研磨前述工件之周緣部之非直線的被研磨部分，前述第1研磨部，係包含：第1工件單元，其係用以保持前述工件；以及第1研磨帶單元，其係用以夾隔著前述第1研磨軸線而與前述第1工件單元相對向地配置第1研磨帶之至少一部分的表面，前述第2研磨部，係包含：第2工件單元，其係用以保持前述工件；以及第2研磨帶單元，其係用以夾隔著前述第2研磨軸線而與前述第2工件單元相對向地配置第2研磨帶之至少一部分的表面，在前述第1研磨部中，前述所配置的第1研磨帶之表面係劃分為第1研磨面，可藉由前述直線的被研磨部分與前述第1研磨面相接觸並在前述第1研磨軸線相對移動進行研磨，在前述第2研磨部中，前述所配置的第2研磨帶之表面係劃分為第2研磨面，可藉由前述非直線的被研磨部分與前述第2研磨面相接觸並在前述第2研磨軸線相對移動進行研磨。 A polishing apparatus for polishing a peripheral portion of a workpiece by using a polishing belt, comprising: a first polishing portion having a horizontal first polishing axis for polishing a peripheral portion of the workpiece a second polished portion, wherein the second polishing portion has a horizontal second polishing axis for polishing a non-linear polished portion of the peripheral portion of the workpiece, and the first polishing portion includes a first workpiece a unit for holding the workpiece; and a first polishing tape unit for arranging at least a portion of the surface of the first polishing tape facing the first workpiece unit with the first polishing axis interposed therebetween The second polishing unit includes a second workpiece unit for holding the workpiece, and a second polishing belt unit that faces the second workpiece unit with the second polishing axis interposed therebetween The surface of at least a part of the second polishing tape is disposed, and in the first polishing portion, the surface of the first polishing tape disposed is divided into a first polishing surface, and the polished portion and the front portion of the straight line are The first polishing surface is in contact with each other and is polished by the relative movement of the first polishing axis. In the second polishing portion, the surface of the second polishing tape disposed is divided into a second polishing surface, and the non-linear The polished portion is in contact with the second polishing surface and is polished by the relative movement of the second polishing axis. 如申請專利範圍第1項所述的研磨裝置，其中，前 述工件係由板狀玻璃所構成，在前述第1研磨部中，前述直線的被研磨部分與前述第1研磨面，係以將前述板狀玻璃之周緣部之直線的被研磨部分，形成平均表面粗糙度Ra為200nm以下、且最大谷深Rv為20nm以下的方式相對移動，在前述第2研磨部中，前述非直線的被研磨部分與前述第2研磨面，係以將前述板狀玻璃之周緣部之非直線的被研磨部分，形成平均表面粗糙度Ra為20nm以下、且最大谷深Rv為200nm以下的方式相對移動。 A grinding apparatus according to claim 1, wherein the front The workpiece is formed of a sheet glass, and in the first polishing unit, the polished portion of the straight line and the first polishing surface are formed by averaging the polished portion of the straight portion of the peripheral portion of the sheet glass. The surface roughness Ra is 200 nm or less and the maximum valley depth Rv is 20 nm or less. In the second polishing unit, the non-linear polished portion and the second polishing surface are formed by the plate glass. The non-linear polished portion of the peripheral portion is relatively moved so that the average surface roughness Ra is 20 nm or less and the maximum valley depth Rv is 200 nm or less. 如申請專利範圍第1或2項所述的研磨裝置，其中，前述第1工件單元，係包含：第1工件保持台，其係用以保持前述工件；以及擺動手段，其係用以使前述第1工件保持台沿著前述第1研磨軸線擺動。 The polishing apparatus according to claim 1 or 2, wherein the first workpiece unit includes: a first workpiece holding stage for holding the workpiece; and a swinging means for causing the aforementioned The first workpiece holding table is swung along the first polishing axis. 如申請專利範圍第1或2項所述的研磨裝置，其中，前述第2工件單元，係在水平的基座上，包含：X方向可動載置台，其係設置成能夠移動於水平方向且與前述第2研磨軸線呈垂直之方向(X方向)；及Y方向可動載置台，其係設置成能夠移動於與前述第2研磨軸線呈平行之方向(Y方向)，且一體地具有朝向X方向伸長的溝槽部；以及第2工件保持台，其係藉由一體地設置於前述X方向可動載置台之第1鉛垂軸而能夠旋轉地被水平支撐，前述第2工件保持台，係具有：第2鉛垂軸，其係從 該第2工件保持台之表面垂直地伸長，且能夠滑動地位於前述Y方向可動載置台之前述溝槽部內，前述工件係由前述第2工件保持台所保持，前述非直線的被研磨部，係藉由前述第1鉛垂軸及前述第2鉛垂軸之移動，一邊進行迴旋擺頭運動一邊沿著前述第2研磨軸線擺動。 The polishing apparatus according to claim 1 or 2, wherein the second workpiece unit is a horizontal susceptor, and includes an X-direction movable mounting table that is movable in a horizontal direction and is The second polishing axis is in a vertical direction (X direction); and a Y-direction movable mounting table is provided to be movable in a direction (Y direction) parallel to the second polishing axis, and integrally has a direction toward the X direction And a second workpiece holding stage that is rotatably supported horizontally by a first vertical axis that is integrally provided on the X-direction movable mounting table, and the second workpiece holding stage has : the second vertical axis, which is from The surface of the second workpiece holding table is vertically extended and slidably positioned in the groove portion of the Y-direction movable mounting table, and the workpiece is held by the second workpiece holding table, and the non-linear polished portion is By the movement of the first vertical axis and the second vertical axis, the turbulent oscillating motion is swung along the second polishing axis. 如申請專利範圍第1或2項所述的研磨裝置，其中，前述第1研磨帶單元，係具有用以使前述第1研磨面朝向水平方向且與前述第1研磨軸線呈垂直之方向移動的第1研磨帶移動手段，藉此，前述直線的被研磨部分與前述第1研磨面可以在前述第1研磨軸線抵接，前述第2研磨帶單元，係具有用以使前述第2研磨面朝向水平方向且與前述第2研磨軸線呈垂直之方向移動的第2研磨帶移動手段，藉此，前述非直線的被研磨部分之至少一部分與前述第2研磨面可以在前述第2研磨軸線抵接。 The polishing apparatus according to claim 1 or 2, wherein the first polishing tape unit has a first polishing surface that moves in a direction perpendicular to the first polishing axis in a horizontal direction. In the first polishing tape moving means, the polished portion of the straight line and the first polishing surface may be in contact with the first polishing axis, and the second polishing tape unit may have the second polishing surface facing a second polishing belt moving means that moves in a direction perpendicular to the second polishing axis in a horizontal direction, whereby at least a part of the non-linear polished portion and the second polishing surface are abuttable on the second polishing axis . 如申請專利範圍第1或2項所述的研磨裝置，其中，前述第1研磨帶單元，係包含：用以使前述第1研磨面之長邊軸線，傾斜於前述第1研磨軸線的第1傾斜手段，前述第2研磨帶單元，係包含：用以使前述第2研磨面之長邊軸線，傾斜於前述第2研磨軸線的第2傾斜手段。 The polishing apparatus according to the first or second aspect of the invention, wherein the first polishing tape unit includes: a first axis that inclines the long axis of the first polishing surface and is inclined to the first polishing axis In the tilting means, the second polishing tape unit includes a second tilting means for inclining the long axis of the second polishing surface to the second polishing axis. 如申請專利範圍第1或2項所述的研磨裝置，其 中，前述第1研磨帶單元，係包含：用以使前述第1研磨面，以前述第1研磨軸線為中心旋動的第1旋動手段，前述第2研磨帶單元，係包含：用以使前述第2研磨面，以前述第2研磨軸線為中心旋動的第2旋動手段。 A polishing apparatus according to claim 1 or 2, wherein The first polishing tape unit includes: a first rotation means for rotating the first polishing surface around the first polishing axis; and the second polishing tape unit includes: The second polishing surface is a second rotation means that is rotated about the second polishing axis. 如申請專利範圍第1或2項所述的研磨裝置，其中，前述第1工件單元，係包含用以使前述工件朝向水平方向且與前述第1研磨軸線呈垂直之方向移動的工件移動手段。 The polishing apparatus according to claim 1 or 2, wherein the first workpiece unit includes a workpiece moving means for moving the workpiece in a horizontal direction and perpendicular to the first polishing axis. 如申請專利範圍第1或2項所述的研磨裝置，其中，前述第1工件單元，係包含：用以將前述工件，按壓並予以固定、及/或吸附並予以固定的第1工件固定手段，前述第2工件單元，係包含：用以將前述工件，按壓並予以固定、及/或吸附並予以固定的第2工件固定手段。 The polishing apparatus according to claim 1 or 2, wherein the first workpiece unit includes: a first workpiece fixing means for pressing and fixing the workpiece, and/or adsorbing and fixing the workpiece The second workpiece unit includes a second workpiece fixing means for pressing and fixing the workpiece, and/or adsorbing and fixing the workpiece. 如申請專利範圍第1或2項所述的研磨裝置，其中，前述第1研磨帶單元，係包含用以使前述第1研磨帶行走的第1研磨帶行走手段，前述第2研磨帶單元，係包含用以使前述第2研磨帶行走的第2研磨帶行走手段。 The polishing apparatus according to the first or second aspect of the invention, wherein the first polishing tape unit includes a first polishing tape running means for moving the first polishing tape, and the second polishing tape unit The second polishing tape running means for moving the second polishing tape is included. 一種研磨裝置，係用以使用研磨帶來研磨工件之周緣部之直線的被研磨部分，且具有水平之研磨軸線的研磨裝置，其特徵為，包含：工件單元，其係用以保持前述工件；以及 研磨帶單元，其係用以夾隔著前述研磨軸線而與前述工件單元相對向地配置研磨帶之至少一部分的表面，前述所配置的研磨帶之表面係劃分為研磨面，可藉由前述直線的被研磨部分與前述研磨面相接觸並在前述研磨軸線相對移動進行研磨。 A grinding device for grinding a straight portion of a polished portion of a peripheral portion of a workpiece using a grinding belt, and having a horizontal grinding axis, characterized by comprising: a workpiece unit for holding the workpiece; as well as The polishing tape unit is configured to arrange a surface of at least a portion of the polishing tape facing the workpiece unit with the polishing axis interposed therebetween, and the surface of the polishing tape disposed is divided into a polishing surface by the straight line The ground portion is brought into contact with the aforementioned abrasive surface and is ground by relative movement of the aforementioned grinding axis. 如申請專利範圍第11項所述的研磨裝置，其中，前述工件係由板狀玻璃所構成，前述工件單元，係包含：工件保持台，其係用以保持前述工件；以及擺動手段，其係用以使前述工件保持台沿著前述研磨軸線擺動，前述直線的被研磨部分與前述研磨面，係以將前述板狀玻璃之周緣部之直線的被研磨部分，形成平均表面粗糙度Ra為20nm以下、且最大谷深Rv為200nm以下的方式相對移動。 The polishing apparatus according to claim 11, wherein the workpiece is made of sheet glass, and the workpiece unit includes: a workpiece holding table for holding the workpiece; and a swinging means The workpiece holding stage is oscillated along the polishing axis, and the polished portion of the straight line and the polished surface are formed by straightening the polished portion of the peripheral portion of the sheet glass to have an average surface roughness Ra of 20 nm. In the following, the maximum valley depth Rv is relatively 200 nm or less. 如申請專利範圍第11或12項所述的研磨裝置，其中，前述研磨帶單元，係包含：研磨帶移動手段，其係用以使前述研磨面朝向水平方向且與前述研磨軸線呈垂直之方向移動，藉此，前述直線的被研磨部分與前述研磨面可以抵接在前述研磨軸線；及傾斜手段，其係用以使前述研磨面之長邊軸線，傾斜於前述研磨軸線；以及旋動手段，其係用以使前述研磨面，以前述研磨軸線為中心旋動。 The polishing apparatus according to claim 11 or 12, wherein the polishing tape unit comprises: a polishing tape moving means for causing the polishing surface to face in a horizontal direction and perpendicular to the polishing axis Moving, whereby the polished portion of the straight line and the polishing surface can abut against the polishing axis; and the tilting means for tilting the long axis of the polishing surface to the polishing axis; and the means for rotating It is used to rotate the aforementioned polishing surface centering on the grinding axis. 如申請專利範圍第11或12項所述的研磨裝置，其中，前述工件單元，係包含用以使前述工件朝向水平方向且與前述研磨軸線呈垂直之方向移動的工件移動手段。 The polishing apparatus according to claim 11 or 12, wherein the workpiece unit includes a workpiece moving means for moving the workpiece in a horizontal direction and perpendicular to the polishing axis. 一種研磨帶，其特徵為：使用於申請專利範圍第11至14項中任一項所述的研磨裝置。 A polishing belt characterized by being used in the polishing apparatus according to any one of claims 11 to 14. 一種研磨裝置，係用以使用研磨帶來研磨工件之周緣部之非直線的被研磨部分，且具有水平之研磨軸線的研磨裝置，其特徵為，包含：工件單元，其係用以保持前述工件；以及研磨帶單元，其係用以夾隔著前述研磨軸線而與前述工件單元相對向地配置研磨帶之至少一部分的表面，前述所配置的研磨帶之表面係劃分為研磨面，可藉由前述非直線的被研磨部分與前述研磨面相接觸並在前述研磨軸線相對移動進行研磨。 A polishing apparatus for grinding a non-linear polished portion of a peripheral portion of a workpiece using an abrasive belt, and having a horizontal grinding axis, characterized by comprising: a workpiece unit for holding the workpiece And a polishing tape unit for arranging at least a portion of the polishing tape opposite to the workpiece unit with the polishing axis interposed therebetween, wherein the surface of the polishing tape disposed is divided into a polishing surface by The non-linear polished portion is in contact with the polishing surface and is relatively moved by the grinding axis to be polished. 如申請專利範圍第16項所述的研磨裝置，其中，前述工件係由板狀玻璃所構成，前述工件單元，係在水平的基座上，包含：X方向可動載置台，其係設置成能夠移動於水平方向且與前述研磨軸線呈垂直之方向(X方向)；及Y方向可動載置台，其係設置成能夠移動於與前述研磨軸線呈平行之方向(Y方向)，且一體地具有朝向X方向伸長的溝槽部；以及工件保持台，其係藉由一體地設置於前述X方向可動 載置台之第1鉛垂軸而能夠旋轉地被水平支撐，前述工件保持台，係具有：第2鉛垂軸，其係從該工件保持台之表面垂直地伸長，且能夠滑動地位於前述Y方向可動載置台之前述溝槽部內，前述工件係由前述工件保持台所保持，前述非直線的被研磨部，係藉由前述第1鉛垂軸及前述第2鉛垂軸之移動，一邊進行迴旋擺頭運動一邊沿著前述研磨軸線擺動，前述非直線的被研磨部分與前述研磨面，係以將前述板狀玻璃之周緣部之非直線的被研磨部分，形成平均表面粗糙度Ra為20nm以下、且最大谷深Rv為200nm以下的方式相對移動。 The polishing apparatus according to claim 16, wherein the workpiece is made of sheet glass, and the workpiece unit is on a horizontal base, and includes an X-direction movable mounting table, which is provided to be capable of Moving in a horizontal direction and perpendicular to the grinding axis (X direction); and a Y-direction movable mounting table that is configured to be movable in a direction parallel to the grinding axis (Y direction) and integrally oriented a groove portion elongated in the X direction; and a workpiece holding table that is movable by being integrally disposed in the X direction The first vertical axis of the mounting table is rotatably supported horizontally, and the workpiece holding table has a second vertical axis that is vertically extended from the surface of the workpiece holding table and slidably located at the Y In the groove portion of the movable mounting stage, the workpiece is held by the workpiece holding stage, and the non-linear polished portion is swirled by the movement of the first vertical axis and the second vertical axis The oscillating motion is oscillated along the polishing axis, and the non-linear polished portion and the polished surface are formed such that the peripheral portion of the peripheral portion of the sheet glass is not linear, and the average surface roughness Ra is 20 nm or less. And the relative depth of the maximum valley depth Rv is 200 nm or less. 一種研磨帶，係使用於申請專利範圍第16或17項所述的研磨裝置，且藉由樹脂黏結劑將研磨粒黏著固定於基材薄膜所成的研磨帶，其特徵為：前述研磨粒之粒徑，係在0.2μm以上、3μm以下之範圍。 An abrasive belt used in the polishing apparatus according to claim 16 or 17, wherein the abrasive grain is adhered to the base film by a resin binder, and the abrasive grain is The particle diameter is in the range of 0.2 μm or more and 3 μm or less. 一種研磨方法，係使用申請專利範圍第11項所述的裝置，以提高由板狀玻璃所構成的工件之強度之方式來研磨該工件之周緣部的方法，其特徵為，是由研磨步驟所構成，該研磨步驟，係使用研磨帶來研磨前述工件之周緣部之直線的被研磨部分，且將前述被研磨部分，形成平均表面粗糙度Ra為20nm以下、且最大谷深Rv為200nm以 下，前述研磨帶，係藉由樹脂黏結劑將研磨粒黏著固定於基材薄膜所成，前述研磨粒之粒徑，係在0.2μm以上、3μm以下之範圍。 A polishing method for polishing a peripheral portion of a workpiece by using a device according to claim 11 to increase the strength of a workpiece composed of a sheet glass, which is characterized by a grinding step In the polishing step, the polished portion of the straight line of the peripheral portion of the workpiece is polished by using a polishing belt, and the polished portion is formed to have an average surface roughness Ra of 20 nm or less and a maximum valley depth Rv of 200 nm. Next, the polishing tape is formed by adhering and fixing the abrasive grains to a base film by a resin binder, and the particle diameter of the abrasive grains is in a range of 0.2 μm or more and 3 μm or less. 一種研磨方法，係使用申請專利範圍第16項所述的裝置，以提高由板狀玻璃所構成的工件之強度之方式來研磨該工件之周緣部的方法，其特徵為，是由研磨步驟所構成，該研磨步驟，係使用研磨帶來研磨前述工件之周緣部之非直線的被研磨部分，且將前述被研磨部分，形成平均表面粗糙度Ra為20nm以下、且最大谷深Rv為200nm以下，前述研磨帶，係由基材及藉由黏結劑樹脂黏著固定於該基材的研磨粒所構成，前述研磨粒之粒徑，係在0.2μm以上、3μm以下之範圍。 A polishing method for polishing a peripheral portion of a workpiece by using a device according to claim 16 to improve the strength of a workpiece composed of a sheet glass, which is characterized by a grinding step In the polishing step, the non-linear polished portion of the peripheral portion of the workpiece is polished by using a polishing belt, and the polished portion is formed to have an average surface roughness Ra of 20 nm or less and a maximum valley depth Rv of 200 nm or less. The polishing tape is composed of a base material and abrasive grains fixed to the base material by a binder resin, and the particle diameter of the abrasive grains is in a range of 0.2 μm or more and 3 μm or less. 一種板狀玻璃，其特徵為：藉由申請專利範圍第19或20項之研磨方法來研磨周緣部之至少一部分。 A sheet glass characterized in that at least a part of the peripheral portion is ground by the grinding method of claim 19 or 20.
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