TWI602260B - Chip positioning device - Google Patents
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- TWI602260B TWI602260B TW105143492A TW105143492A TWI602260B TW I602260 B TWI602260 B TW I602260B TW 105143492 A TW105143492 A TW 105143492A TW 105143492 A TW105143492 A TW 105143492A TW I602260 B TWI602260 B TW I602260B
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Description
本發明相關於一種晶粒定位裝置，特別是相關於一種具有絕對精度記號的晶粒定位裝置。 The present invention relates to a grain positioning device, and more particularly to a grain positioning device having an absolute precision mark.
在半導體晶圓級封裝的製程中，必須將晶圓切割成複數晶粒，再從中挑出良品，重新貼附到膠膜或基板上以進行後續的加工。貼附的過程係利用機械手臂及可移動的載台等精密設備以準確地控制晶粒的貼附位置。 In the process of semiconductor wafer level packaging, the wafer must be cut into a plurality of crystal grains, and then the good products are picked out and reattached to the film or substrate for subsequent processing. The attached process utilizes precision equipment such as a robotic arm and a movable stage to accurately control the attachment position of the die.
然而，傳統的晶粒定位方式係以已貼附的晶粒作為參考點，因此相鄰兩顆晶粒之間具有相對精度，但整體的晶粒貼附位置可能沒有絕對精度。若初期晶粒的貼附位置有些微誤差(例如偏離X軸、偏離Y軸或角度不正)，這些誤差可能在貼附完若干晶粒後累積到可觀的程度，嚴重影響後續加工製程，並導致成本上升及良率低落。 However, the conventional grain positioning method uses the attached die as a reference point, so the relative accuracy between adjacent two crystal grains, but the overall die attaching position may not have absolute precision. If there are some slight errors in the attachment position of the initial grain (for example, deviation from the X axis, deviation from the Y axis or angular misalignment), these errors may accumulate to a considerable extent after attaching a number of grains, seriously affecting the subsequent processing and causing Cost increases and yields are low.
因此，為解決上述問題，本發明的目的即在提供一種具有絕對精度記號的晶粒定位裝置。 Accordingly, in order to solve the above problems, it is an object of the present invention to provide a die positioning apparatus having an absolute precision mark.
本發明為解決習知技術之問題所採用之技術手段係提供一種晶粒定位裝置，包含：一絕對精度記號構件，該絕對精度記號構件的表面具有一預定圖形輪廓的一絕對精度記號；一晶粒貼附體，設置於該絕對精度記號構件 的表面，該晶粒貼附體具有一晶粒貼附面及一相反於該晶粒貼附面的一背面，其中該背面朝向該絕對精度記號構件，且該晶粒貼附體係為可被電磁波穿透；一影像擷取構件，於該晶粒貼附面擷取包含有該絕對精度記號的一晶粒定位用影像；一貼附構件；以及一定位調整構件，訊號連接該貼附構件及該影像擷取構件，該定位調整構件依據該晶粒定位用影像精密調整以使該貼附構件對應匹配該晶粒貼附面的一晶粒貼附位置。 The technical means adopted by the present invention to solve the problems of the prior art provides a die positioning device comprising: an absolute precision mark member having a surface having an absolute precision mark of a predetermined pattern profile; a particle attached body disposed on the absolute precision mark member The surface of the die attaching body has a die attaching surface and a back surface opposite to the die attaching surface, wherein the back surface faces the absolute precision marking member, and the die attaching system is Electromagnetic wave penetration; an image capturing member picking up a die positioning image including the absolute precision mark on the die attaching surface; an attaching member; and a positioning adjusting member, the signal connecting the attaching member And the image capturing member, the positioning adjusting member is precisely adjusted according to the image for positioning the die so that the attaching member corresponds to a die attaching position of the die attaching surface.
在本發明的一實施例中係提供一種晶粒定位裝置，該絕對精度記號係排列為直角座標系的複數個座標點。 In an embodiment of the invention, a die positioning device is provided, the absolute precision marks being arranged as a plurality of coordinate points of a rectangular coordinate system.
在本發明的一實施例中係提供一種晶粒定位裝置，該絕對精度記號係呈垂直網狀。 In an embodiment of the invention, a die positioning device is provided, the absolute precision mark being in the form of a vertical mesh.
在本發明的一實施例中係提供一種晶粒定位裝置，該定位調整構件包括一控制構件及一晶粒承載調整構件，該控制構件訊號連接該晶粒承載調整構件及該貼附構件，該晶粒承載調整構件設置於該絕對精度記號構件的一相反於該表面的背面且經設置而帶動該晶粒貼附體及該絕對精度記號構件移動，該控制構件控制該貼附構件自一晶粒供應區揀取一晶粒並依據該預設晶粒貼附位置而貼附該晶粒於該晶粒貼附面。 In an embodiment of the invention, a die positioning device is provided, the positioning adjustment member includes a control member and a die load adjustment member, and the control member signals the die load adjustment member and the attachment member. The die load adjusting member is disposed on a back surface of the absolute precision mark member opposite to the surface and configured to drive the die attaching body and the absolute precision mark member to move, the control member controlling the attaching member from a crystal The grain supply area picks up a die and attaches the die to the die attaching surface according to the preset die attaching position.
在本發明的一實施例中係提供一種晶粒定位裝置，該控制構件控制該貼附構件移動到一預備置晶位置，該控制構件依據該晶粒定位用影像中的至少一個絕對精度記號的位置，透過精密調整該晶粒承載調整構件與該貼附構件的相對關係而使該貼附構件對應匹配該晶粒貼附面的該晶預設粒貼附位置。 In an embodiment of the invention, there is provided a die positioning device, wherein the control member controls the attachment member to move to a preliminary crystallizing position, the control member being in accordance with at least one absolute precision mark in the image for positioning the die Positioning, by precisely adjusting the relative relationship between the die load regulating member and the attaching member, the attaching member correspondingly matches the crystal preset grain attaching position of the die attaching surface.
在本發明的一實施例中係提供一種晶粒定位裝置，該控制構件經設置而透過一第二影像擷取構件擷取該貼附構件揀取該晶粒的影像以分析一位 置誤差值，並依據該位置誤差值及該晶粒定位用影像精密調整以使該貼附構件對應匹配該晶粒貼附面的該預設晶粒貼附位置。 In an embodiment of the invention, a die positioning device is provided. The control member is configured to pick up an image of the die by a second image capturing member to pick up an image of the die to analyze a bit. And setting the error value according to the position error value and the image for positioning the crystal grain so that the attaching member corresponds to the preset die attaching position of the die attaching surface.
在本發明的一實施例中係提供一種晶粒定位裝置，該控制構件控制該貼附構件移動到一預備置晶位置，該控制構件依據該晶粒定位用影像中的至少一個絕對精度記號及該晶粒位置誤差值，透過精密調整該晶粒承載調整構件與該貼附構件的相對關係而使該貼附構件對應匹配該晶粒貼附面的該預設晶粒貼附位置。 In an embodiment of the invention, there is provided a die positioning device, wherein the control member controls the attachment member to move to a preliminary crystallizing position, the control member according to at least one absolute precision mark in the image for positioning the die and The die position error value is such that the attaching member corresponds to the predetermined die attaching position of the die attaching surface by precisely adjusting the relative relationship between the die load adjusting member and the attaching member.
在本發明的一實施例中係提供一種晶粒定位裝置，更包括一發光構件，經設置而朝向該晶粒貼附面發射一輔助定位光線。 In an embodiment of the invention, a die positioning device is provided, further comprising a light emitting member configured to emit an auxiliary positioning light toward the die attaching surface.
在本發明的一實施例中係提供一種晶粒定位裝置，該發光構件係為可見光發光構件、紅外光發光構件、紫外光發光構件或X光發光構件。 In an embodiment of the invention, a die positioning device is provided, the light emitting member being a visible light emitting member, an infrared light emitting member, an ultraviolet light emitting member or an X-ray emitting member.
經由本發明所採用之技術手段，可依據晶粒定位用影像中的絕對精度記號的位置，使各個晶粒的實際擺放位置匹配預設的晶粒貼附位置而具有絕對精度，並使各個晶粒之間也有相對精度，因而提升晶粒貼附的精確度。 According to the technical means adopted by the present invention, the actual placement position of each die can be matched to the preset die attach position according to the position of the absolute precision mark in the image for image positioning, and the absolute precision is obtained. There is also relative precision between the grains, which improves the accuracy of the die attach.
本發明所採用的具體實施例，將藉由以下之實施例及附呈圖式作進一步之說明。 The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings.
100‧‧‧晶粒定位裝置 100‧‧‧die positioning device
1‧‧‧晶粒貼附體 1‧‧‧ die attach
11‧‧‧晶粒貼附面 11‧‧‧ die attaching surface
12‧‧‧背面 12‧‧‧ Back
2‧‧‧絕對精度記號構件 2‧‧‧Absolute precision mark member
21‧‧‧表面 21‧‧‧ surface
22‧‧‧背面 22‧‧‧ Back
23‧‧‧絕對精度記號 23‧‧‧Absolute precision mark
23a‧‧‧絕對精度記號 23a‧‧‧Absolute precision mark
23b‧‧‧絕對精度記號 23b‧‧‧Absolute precision mark
3‧‧‧定位調整構件 3‧‧‧ Positioning adjustment components
31‧‧‧控制構件 31‧‧‧Control components
32‧‧‧晶粒承載調整構件 32‧‧‧Grade carrying adjustment member
4‧‧‧發光構件 4‧‧‧Lighting components
6‧‧‧貼附構件 6‧‧‧ Attached components
C1‧‧‧第一影像擷取構件 C1‧‧‧First image capture component
C2‧‧‧第二影像擷取構件 C2‧‧‧Second image capture component
D‧‧‧晶粒 D‧‧‧ grain
L‧‧‧輔助定位光線 L‧‧‧Assisted positioning of light
第1圖為顯示根據本發明一實施例的晶粒定位裝置之示意圖。 FIG. 1 is a schematic view showing a die positioning device according to an embodiment of the present invention.
第2圖為顯示根據本發明的實施例的絕對精度記號構件之示意圖。 Fig. 2 is a schematic view showing an absolute precision mark member according to an embodiment of the present invention.
第3圖為顯示根據本發明另一實施例的絕對精度記號構件之示意圖。 Fig. 3 is a schematic view showing an absolute precision mark member according to another embodiment of the present invention.
第4圖為顯示根據本發明另一實施例的絕對精度記號構件之示意圖。 Fig. 4 is a schematic view showing an absolute precision mark member according to another embodiment of the present invention.
以下根據第1圖至第4圖，而說明本發明的實施方式。該說明並非為限制本發明的實施方式，而為本發明之實施例的一種。 Hereinafter, embodiments of the present invention will be described based on Figs. 1 to 4 . This description is not intended to limit the embodiments of the invention, but is an embodiment of the invention.
如第1圖及第2圖所示，本發明一實施例的一晶粒定位裝置100包含一晶粒貼附體1、一絕對精度記號構件2、一第一影像擷取構件C1、一貼附構件6及一包括一控制構件31及一晶粒承載調整構件32的一定位調整構件3。 As shown in FIG. 1 and FIG. 2, a die positioning device 100 according to an embodiment of the present invention includes a die attaching body 1, an absolute precision mark member 2, a first image capturing member C1, and a sticker. The attachment member 6 and a positioning adjustment member 3 including a control member 31 and a die load adjustment member 32.
絕對精度記號構件2的表面21具有一預定圖形輪廓的一絕對精度記號23。如第2圖所示，絕對精度記號23為排列成直角座標系的複數個十字形座標點。然而本發明不限於此，在其他實施例中，例如如第3圖所示，絕對精度記號23a為排列成直角座標系的複數個圓點座標點。如第4圖所示，絕對精度記號23b係呈垂直網狀。 The surface 21 of the absolute precision mark member 2 has an absolute precision mark 23 of a predetermined pattern outline. As shown in Fig. 2, the absolute precision mark 23 is a plurality of cross-shaped coordinate points arranged in a rectangular coordinate system. However, the present invention is not limited thereto, and in other embodiments, for example, as shown in Fig. 3, the absolute precision symbol 23a is a plurality of dot coordinate points arranged in a rectangular coordinate system. As shown in Fig. 4, the absolute precision mark 23b is a vertical mesh.
晶粒貼附體1設置於絕對精度記號構件2的表面21。晶粒貼附體1具有一晶粒貼附面11及一相反於晶粒貼附面11的一背面12，其中背面12朝向絕對精度記號構件2，且晶粒貼附體1係為可被電磁波穿透。舉例來說，晶粒貼附體1例如是透明或半透明的藍膜、UV膜或硬質的透光板，也可以是能被紅外光、紫外光或X光穿透的載體(例如塑膠)，且本發明不限於此。 The die attach 1 is provided on the surface 21 of the absolute precision mark member 2. The die attaching body 1 has a die attaching surface 11 and a back surface 12 opposite to the die attaching surface 11, wherein the back surface 12 faces the absolute precision marking member 2, and the die attaching body 1 is capable of being Electromagnetic waves penetrate. For example, the die attach body 1 is, for example, a transparent or translucent blue film, a UV film or a hard light-transmitting plate, and may also be a carrier (for example, plastic) that can be penetrated by infrared light, ultraviolet light or X-ray light. And the invention is not limited thereto.
第一影像擷取構件C1於晶粒貼附面11擷取包含有絕對精度記號23的一晶粒定位用影像。 The first image capturing member C1 captures a die positioning image including the absolute precision mark 23 on the die attaching surface 11.
定位調整構件3訊號連接貼附構件6及第一影像擷取構件C1。定位調整構件3依據該晶粒定位用影像精密調整以使該貼附構件對應匹配晶粒貼附面11的一預設晶粒貼附位置。 The positioning adjustment member 3 signals the attachment member 6 and the first image capturing member C1. The positioning adjustment member 3 is precisely adjusted according to the image for positioning the die so that the attachment member corresponds to a predetermined die attaching position of the die attaching surface 11.
詳細來說，在本實施例中，定位調整構件3包括一控制構件31及一晶粒承載調整構件32，控制構件31訊號連接晶粒承載調整構件32及貼附構件6。晶粒承載調整構件32設置於絕對精度記號構件2的一相反於表面21的背面22，經設置而一起帶動晶粒貼附體1及絕對精度記號構件2移動(例如在第1圖中平行圖面地上下移動，或垂直圖面地前後移動)，也可以旋轉移動以調整角度。控制構件31控制貼附構件6自一晶粒供應區揀取一晶粒D，並控制貼附構件6及/或晶粒承載調整構件32相對移動到一預備置晶位置。由於機械震動、溫度變化、或其他產生誤差的因素等的影響，導致該預備置晶位置往往與理想的預設晶粒貼附位置有落差，因此控制構件31依據該晶粒定位用影像中的至少一個絕對精度記號23的位置，透過精密調整晶粒承載調整構件32與貼附構件6的相對關係而使貼附構件6對應匹配晶粒貼附面11的該預設晶粒貼附位置。如此，可使各個晶粒D的實際擺放位置匹配該預設晶粒貼附位置而具有絕對精度，各個晶粒D之間也有相對精度，因而可使複數個晶粒D在晶粒貼附面11上排列整齊。 In detail, in the present embodiment, the positioning adjustment member 3 includes a control member 31 and a die load adjustment member 32, and the control member 31 signals the die load adjustment member 32 and the attachment member 6. The die load adjusting member 32 is disposed on a back surface 22 of the absolute precision mark member 2 opposite to the surface 21, and is provided to drive the die attaching body 1 and the absolute precision mark member 2 to move together (for example, in FIG. 1 in parallel form) Move up and down, or move back and forth in the vertical plane. You can also rotate to adjust the angle. The control member 31 controls the attaching member 6 to pick up a die D from a die supply area and control the relative movement of the attaching member 6 and/or the die load adjusting member 32 to a preliminary crystallizing position. Due to the influence of mechanical vibration, temperature change, or other factors causing errors, the preliminary crystallizing position tends to fall from the ideal preset die attaching position, and thus the control member 31 is in accordance with the image in the die positioning image. The position of the at least one absolute precision mark 23 is such that the attaching member 6 corresponds to the predetermined die attaching position of the die attaching surface 11 by precisely adjusting the relative relationship between the die load adjusting member 32 and the attaching member 6. In this way, the actual placement position of each of the crystal grains D can be matched to the preset die attaching position to have absolute precision, and the relative precision of each of the crystal grains D is also obtained, so that a plurality of crystal grains D can be attached to the crystal grains. The faces 11 are arranged neatly.
進一步地，在本實施例中，貼附構件6可包括一吸取式的機械手臂。在另一個實施例中，控制構件31可依據該晶粒定位用影像中的至少一個絕對精度記號23的位置，透過精密調整貼附構件6以使貼附構件6對應匹配該預設晶粒貼附位置。 Further, in the present embodiment, the attachment member 6 may include a suction type mechanical arm. In another embodiment, the control member 31 can precisely adjust the attaching member 6 according to the position of the at least one absolute precision mark 23 in the image for image positioning, so that the attaching member 6 correspondingly matches the preset die. Attached to the location.
進一步地，由於機械震動、溫度變化、或其他產生誤差的因素等的影響，導致該預備置晶位置往往與理想的預設晶粒貼附位置有落差。控制構件31經設置而透過一第二影像擷取構件C2擷取貼附構件6揀取該晶粒D的影像以分析一位置誤差值，控制構件31控制貼附構件6移動到一預備置晶位置，控制構件31依據該位置誤差值及該晶粒定位用影像中的至少一個絕對精度記號23，透過精密調整晶粒承載調整構件32與貼附構件6的相對關係而使貼附構件6對應匹配晶粒貼附面11的該預設晶粒貼附位置。 Further, due to mechanical vibration, temperature changes, or other factors that cause errors, the preliminary crystallographic position tends to fall from the ideal preset die attach position. The control member 31 is configured to pick up the image of the die D through a second image capturing member C2 to pick up the image of the die D to analyze a position error value, and the control member 31 controls the attaching member 6 to move to a preliminary crystal. The position control member 31 transmits the relative relationship between the die load regulating member 32 and the attaching member 6 in accordance with the position error value and at least one absolute precision mark 23 in the die positioning image, so that the attaching member 6 corresponds to The predetermined die attaching position of the die attaching surface 11 is matched.
進一步地，晶粒定位裝置100更包括一發光構件4，經設置而朝向晶粒貼附面11發射一輔助定位光線L，以供C1擷取影像，輔助控制構件31控制定位調整構件3調整該預設晶粒貼附位置。發光構件4係為可見光發光構件、紅外光發光構件、紫外光發光構件或X光發光構件。 Further, the die positioning device 100 further includes a light-emitting member 4 configured to emit an auxiliary positioning light L toward the die attaching surface 11 for capturing images by C1, and the auxiliary control member 31 controls the positioning adjusting member 3 to adjust the Preset the die attach position. The light-emitting member 4 is a visible light-emitting member, an infrared light-emitting member, an ultraviolet light-emitting member, or an X-ray light-emitting member.
綜上所述，本發明的晶粒定位裝置相對於先前技術，可使晶粒與晶粒之間、晶粒與晶粒貼附體整體具有絕對精度，因而提升晶粒貼附的精確度。 In summary, the die positioning device of the present invention can provide absolute precision between the die and the die, and between the die and the die attaching body, thereby improving the accuracy of die attaching.
以上之敘述以及說明僅為本發明之較佳實施例之說明，對於此項技術具有通常知識者當可依據以下所界定申請專利範圍以及上述之說明而作其他之修改，惟此些修改仍屬於本發明之發明精神而在本發明之權利範圍中。 The above description and description are only illustrative of the preferred embodiments of the present invention, and those of ordinary skill in the art can make other modifications in accordance with the scope of the invention as defined below and the description above, but such modifications still belong to The inventive spirit of the invention is within the scope of the invention.
100‧‧‧晶粒定位裝置 100‧‧‧die positioning device
1‧‧‧晶粒貼附體 1‧‧‧ die attach
11‧‧‧晶粒貼附面 11‧‧‧ die attaching surface
12‧‧‧背面 12‧‧‧ Back
2‧‧‧絕對精度記號構件 2‧‧‧Absolute precision mark member
21‧‧‧表面 21‧‧‧ surface
22‧‧‧背面 22‧‧‧ Back
3‧‧‧定位調整構件 3‧‧‧ Positioning adjustment components
31‧‧‧控制構件 31‧‧‧Control components
32‧‧‧晶粒承載調整構件 32‧‧‧Grade carrying adjustment member
4‧‧‧發光構件 4‧‧‧Lighting components
6‧‧‧貼附構件 6‧‧‧ Attached components
C1‧‧‧第一影像擷取構件 C1‧‧‧First image capture component
C2‧‧‧第二影像擷取構件 C2‧‧‧Second image capture component
D‧‧‧晶粒 D‧‧‧ grain
L‧‧‧輔助定位光線 L‧‧‧Assisted positioning of light
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105143492A TWI602260B (en) | 2016-12-28 | 2016-12-28 | Chip positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105143492A TWI602260B (en) | 2016-12-28 | 2016-12-28 | Chip positioning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI602260B true TWI602260B (en) | 2017-10-11 |
| TW201824443A TW201824443A (en) | 2018-07-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105143492A TWI602260B (en) | 2016-12-28 | 2016-12-28 | Chip positioning device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI602260B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110880468A (en) * | 2019-11-26 | 2020-03-13 | 深圳市矽电半导体设备有限公司 | Method for aligning core particles to sorting membrane and core particle sorting method |
| CN110933927A (en) * | 2018-09-20 | 2020-03-27 | 梭特科技股份有限公司 | Die attaching position positioning device capable of improving mask contrast |
| CN111446151A (en) * | 2020-03-27 | 2020-07-24 | 绍兴同芯成集成电路有限公司 | Method for transferring crystal grains to blue film in batches after crystal grains are cut |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111086906A (en) * | 2019-11-26 | 2020-05-01 | 矽电半导体设备(深圳)股份有限公司 | Position correction method for placing core particles on sorting film and core particle sorting method |
| TWI755129B (en) * | 2020-10-30 | 2022-02-11 | 梭特科技股份有限公司 | A chip pick-and-place transfer device and method for chip positioning thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201246416A (en) * | 2011-02-18 | 2012-11-16 | Hitachi High Tech Instr Co Ltd | Die Bonder and Semiconductor Manufacturing Method |
| TW201320232A (en) * | 2011-11-09 | 2013-05-16 | I-Hsing Tsai | Method for automatically positioning first die on wafer |
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- 2016-12-28 TW TW105143492A patent/TWI602260B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201246416A (en) * | 2011-02-18 | 2012-11-16 | Hitachi High Tech Instr Co Ltd | Die Bonder and Semiconductor Manufacturing Method |
| TW201320232A (en) * | 2011-11-09 | 2013-05-16 | I-Hsing Tsai | Method for automatically positioning first die on wafer |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110933927A (en) * | 2018-09-20 | 2020-03-27 | 梭特科技股份有限公司 | Die attaching position positioning device capable of improving mask contrast |
| CN110880468A (en) * | 2019-11-26 | 2020-03-13 | 深圳市矽电半导体设备有限公司 | Method for aligning core particles to sorting membrane and core particle sorting method |
| CN111446151A (en) * | 2020-03-27 | 2020-07-24 | 绍兴同芯成集成电路有限公司 | Method for transferring crystal grains to blue film in batches after crystal grains are cut |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201824443A (en) | 2018-07-01 |
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