TWI598202B - Debris removal device for scribing of brittle material substrates - Google Patents

Debris removal device for scribing of brittle material substrates Download PDF

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Publication number
TWI598202B
TWI598202B TW102134056A TW102134056A TWI598202B TW I598202 B TWI598202 B TW I598202B TW 102134056 A TW102134056 A TW 102134056A TW 102134056 A TW102134056 A TW 102134056A TW I598202 B TWI598202 B TW I598202B
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Taiwan
Prior art keywords
brittle material
material substrate
adhesive tape
wheel
scribing
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TW102134056A
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Chinese (zh)
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TW201424969A (en
Inventor
Yoshitaka Nishio
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Mitsuboshi Diamond Ind Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Cleaning In General (AREA)

Description

脆性材料基板之刻劃用碎屑去除裝置 Fragment removal device for scribing material substrate

本發明係關於一種脆性材料基板之刻劃用碎屑去除裝置，更詳細而言，係關於一種可有效率地去除在脆性材料基板形成刻劃線時所產生之碎屑(cullet)(切粉)的脆性材料基板之刻劃用碎屑去除裝置。 BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a chip removing device for scribing a brittle material substrate, and more particularly to a method for efficiently removing cullets generated when a scribe line is formed on a brittle material substrate (cutting powder) The chip of the brittle material substrate is marked with a debris removal device.

習知，已知有如圖1所示，為了將玻璃、矽、陶瓷、半導體等之脆性材料基板分斷成所希望之大小，藉由刻劃輪2、2a於脆性材料基板1形成刻劃線之方法。在圖1中，雖揭示有於脆性材料基板1之上側與下側配置刻劃輪2、2a之構成，但由於上側之刻劃輪2與下側之刻劃輪2a實質上同樣地進行動作，因此於以下以上側之刻劃輪2為中心，針對形成刻劃線之過程進行說明。 It is known that, as shown in FIG. 1, in order to divide a brittle material substrate such as glass, tantalum, ceramics, or semiconductor into a desired size, a scribe line is formed on the brittle material substrate 1 by the scribing wheels 2, 2a. The method. In FIG. 1, the scribing wheels 2 and 2a are disposed on the upper side and the lower side of the brittle material substrate 1. However, the upper scribing wheel 2 and the lower scribing wheel 2a operate substantially in the same manner. Therefore, the process of forming the score line will be described centering on the scribing wheel 2 on the following side.

首先，使刻劃輪2從圖1(a)之位置往圖1(b)之位置、亦即往脆性材料基板1上下降。接著，使刻劃輪2往既定之方向按壓移動而形成刻劃線。一旦刻劃輪2移動至圖1(c)之位置，則如圖1(d)所示般使刻劃輪2從脆性材料基板1脫離而完成刻劃作業。 First, the scribing wheel 2 is lowered from the position of FIG. 1(a) to the position of FIG. 1(b), that is, to the brittle material substrate 1. Next, the scribing wheel 2 is pressed and moved in a predetermined direction to form a score line. Once the scribing wheel 2 has moved to the position of FIG. 1(c), the scribing wheel 2 is detached from the brittle material substrate 1 as shown in FIG. 1(d) to complete the scribing operation.

此外，在進行如此般之刻劃作業時，存在有因刻劃輪2之負載或移動速度等而導致於脆性材料基板1上產生大量之碎屑的情形。由於該碎屑飛散至非常遠，因此即使使用吸引裝置，亦僅能吸引於刻劃輪2之周邊產生之一部分之碎屑。未被吸引之碎屑，不僅污染作業空間之周邊， 亦侵入至作業者之呼吸器官而對其健康產生有害之影響。 Further, when such a scribe operation is performed, there is a case where a large amount of debris is generated on the brittle material substrate 1 due to the load or moving speed of the scribe wheel 2. Since the debris is scattered so far, even if the suction device is used, only a part of the debris generated at the periphery of the scoring wheel 2 can be attracted. Unattractive debris, not only contaminating the perimeter of the work space, It also invades the operator's respiratory organs and has a detrimental effect on their health.

作為對此之對策，於最近取得有藉由來自噴嘴之空氣噴射而 將所產生之碎屑吹飛、藉由利用刷子之清掃而去除碎屑等之方法。然而，由於碎屑係非常小之微粒子，且因加工法而大量產生，因此要完全地去除係有其困難。此外，作為其他之方法，雖亦考慮到使其真空吸附而進行去除之方法，但藉由如此之方法亦難以完全地去除不規則且遙遠地飛散之碎屑。 As a countermeasure against this, it has recently been obtained by air injection from a nozzle. A method of blowing off generated debris and removing debris by cleaning with a brush. However, since the chips are very small particles and are produced in large quantities by the processing method, it is difficult to completely remove them. Further, as another method, a method of removing it by vacuum adsorption is also considered, but it is also difficult to completely remove irregular and distantly scattered debris by such a method.

本發明，係有鑑於如上述般之問題點而完成者，其目的在於 提供一種可於脆性材料基板之刻劃線形成時，不使所產生之碎屑飛散，而容易地進行去除碎屑之裝置。 The present invention has been made in view of the above problems, and its object is to Provided is a device which can easily remove debris when the scribe line of the brittle material substrate is formed without scattering the generated debris.

為了達成該目的，本發明之刻劃用碎屑去除裝置，具備：刻 劃輪，係對脆性材料基板之任一面或兩面形成刻劃線；黏貼裝置，係沿該刻劃線一邊貼附黏著帶材一邊進行移動；以及剝離裝置，係將已貼附之該黏著帶材從該脆性材料基板剝取並進行回收。 In order to achieve the object, the scribing device for scribing of the present invention has: The scribing wheel is formed by scribing one or both sides of the brittle material substrate; the sticking device moves while attaching the adhesive tape along the scribing line; and the peeling device is the attached adhesive tape The material is stripped from the brittle material substrate and recovered.

該黏貼裝置，可構成為具備：供給該黏著帶材之帶材供給輪 (pulley)、以及使從該帶材供給輪供給之該黏著帶材密接於該脆性材料基板並貼附之黏貼輥子(roller)。 The adhesive device may be configured to include a tape supply wheel for supplying the adhesive tape (pulley), and an adhesive roller that adheres the adhesive tape supplied from the tape supply wheel to the brittle material substrate and attaches the adhesive tape.

該剝離裝置，可構成為具備：將已貼附於該脆性材料基板之 該黏著帶材一邊從該脆性材料基板之表面反轉一邊剝取之剝離輥子部、以及對由該剝離輥子部剝起之該黏著帶材進行回收之黏著帶材回收輪。 The peeling device may be configured to: be attached to the substrate of the brittle material The peeling roller portion which is peeled off from the surface of the brittle material substrate while being peeled off, and the adhesive tape collecting wheel for recovering the adhesive tape stripped by the peeling roller portion.

根據本發明之一實施形態之構成，藉由將於脆性材料基板之 刻劃線形成時產生之碎屑立刻以帶材貼附，可有效率地防止碎屑之飛散。根據本發明之另一實施形態之構成，本發明之黏貼裝置，不僅可使黏著帶材以黏貼輥子一邊密接於脆性材料基板上一邊容易地貼附，亦由於黏著帶材不浮起而可防止碎屑漏出。根據本發明之再另一實施形態之構成，本發明之剝離裝置，於將已附著於脆性材料基板上之黏著帶材剝取後，將附著有碎屑之黏著帶材以黏著帶材回收輪捲取並進行回收，因此可防止碎屑二度飛散。 According to an embodiment of the present invention, by using a substrate for a brittle material The debris generated when the score line is formed is immediately attached to the tape, and the scattering of the debris can be effectively prevented. According to another embodiment of the present invention, the adhesive device of the present invention can prevent the adhesive tape from being easily attached while being adhered to the brittle material substrate by the adhesive roller, and can also be prevented because the adhesive tape does not float. The debris leaked out. According to still another embodiment of the present invention, in the peeling device of the present invention, after the adhesive tape attached to the substrate of the brittle material is peeled off, the adhesive tape to which the debris adheres is adhered to the adhesive tape collecting wheel. Coiled and recycled, thus preventing the debris from scattering twice.

1‧‧‧脆性材料基板 1‧‧‧Battery material substrate

2、2a‧‧‧刻劃輪 2, 2a‧‧‧ marking wheel

11‧‧‧黏著帶材 11‧‧‧Adhesive strip

22、22a‧‧‧黏貼輥子 22, 22a‧‧‧Adhesive rollers

28、28a‧‧‧帶材供給輪 28, 28a‧‧‧Feed supply wheel

29、29a‧‧‧黏貼裝置 29, 29a‧‧‧Adhesive device

30、30a‧‧‧黏著帶材回收輪 30, 30a‧‧‧Adhesive strip recycling wheel

32、32a‧‧‧剝離裝置 32, 32a‧‧‧ peeling device

圖1，係表示習知的脆性材料基板之刻劃作業流程的圖式。 Fig. 1 is a view showing a flow of a scribing operation of a conventional brittle material substrate.

圖2，係表示本發明的一實施形態之脆性材料基板之刻劃用碎屑去除裝置之刻劃開始前之狀態的圖式。 FIG. 2 is a view showing a state before the start of scoring of the chip removing device for scribing of the brittle material substrate according to the embodiment of the present invention.

圖3，係表示本發明的一實施形態之脆性材料基板之刻劃用碎屑去除裝置已開始進行刻劃之狀態的圖式。 FIG. 3 is a view showing a state in which the chip removing device for scoring a brittle material substrate according to an embodiment of the present invention has started scribing.

圖4，係表示本發明的一實施形態之脆性材料基板之刻劃用碎屑去除裝置完成了黏著帶材之貼附之狀態的圖式。 Fig. 4 is a view showing a state in which the crumb removing device for scribing the brittle material substrate according to the embodiment of the present invention completes the attachment of the adhesive tape.

圖5，係表示本發明的一實施形態之脆性材料基板之刻劃用碎屑去除裝置剝取黏著帶材之狀態的圖式。 Fig. 5 is a view showing a state in which the adhesive strip is removed by the chip removing device for scribing the brittle material substrate according to the embodiment of the present invention.

針對本發明之一實施形態的脆性材料基板之刻劃用碎屑去除裝置，參照圖2至圖5具體地進行說明。另外，於圖2至圖5中，雖圖示有在脆性材料基板1之上側及下側同時地進行刻劃作業之過程，但該等之 過程，係僅脆性材料基板之上下位置關係有所不同而相互地對應之構成，因此在以下，以於脆性材料基板之上側所配置之構成為中心進行說明。 A chip removing device for scoring a brittle material substrate according to an embodiment of the present invention will be specifically described with reference to Figs. 2 to 5 . In addition, in FIGS. 2 to 5, although the process of performing the scribing operation on the upper side and the lower side of the brittle material substrate 1 is shown, these are shown. In the process, the positional relationship between the upper and lower sides of the brittle material substrate is different from each other. Therefore, the configuration in which the upper side of the brittle material substrate is disposed will be mainly described below.

首先，為了於脆性材料基板1之表面形成刻劃線(未圖示)， 如圖2之以箭頭所示般，將刻劃輪2往脆性材料基板1之表面下降。之後，如圖3所示般，將刻劃輪2一邊對脆性材料基板1之表面按壓一邊往既定之方向移動。此時，於刻劃輪2之行進方向後側產生碎屑。 First, in order to form a score line (not shown) on the surface of the brittle material substrate 1, As shown by the arrow in Fig. 2, the scoring wheel 2 is lowered toward the surface of the brittle material substrate 1. Thereafter, as shown in FIG. 3, the scribing wheel 2 is moved in a predetermined direction while pressing the surface of the brittle material substrate 1. At this time, debris is generated on the rear side in the traveling direction of the scribing wheel 2.

於刻劃輪2之後尾側位置，設置有黏貼裝置29；一旦刻劃 輪2開始進行用以形成刻劃線之移動，則該黏貼裝置29一邊追隨刻劃輪2一邊開始移動，而於形成刻劃線2後一刻，於刻劃線2上貼附黏著帶材。 After the trailing wheel 2 is positioned at the rear side, an adhesive device 29 is provided; once scribed When the wheel 2 starts moving to form the score line, the sticking device 29 starts moving while following the score wheel 2, and the adhesive tape is attached to the score line 2 immediately after the score line 2 is formed.

黏貼裝置29，具備：供給黏著帶材11之帶材供給輪28、以 及使從該帶材供給輪28供給之黏著帶材11密接於脆性材料基板1之表面並進行加壓之黏貼輥子22。亦即，黏貼裝置29，藉由黏貼輥子22一邊於脆性材料基板1之表面貼附黏著帶材11一邊進行移動。 The pasting device 29 includes a tape supply wheel 28 that supplies the adhesive tape 11, and The adhesive tape 11 supplied from the tape supply wheel 28 is adhered to the surface of the brittle material substrate 1 and pressed to adhere the roller 22. In other words, the bonding device 29 moves while adhering the adhesive tape 11 to the surface of the brittle material substrate 1 by the bonding roller 22.

一旦黏貼輥子22以在脆性材料基板1之表面押附有黏著帶 材11之狀態下往右方向進行移動，則容易將捲繞於帶材供給輪28之黏著帶材11引出並供給。 Once the roller 22 is adhered to adhere the adhesive tape on the surface of the brittle material substrate 1 When the material 11 is moved in the right direction, the adhesive tape 11 wound around the tape supply wheel 28 is easily taken out and supplied.

如此，黏貼裝置29一邊追隨於刻劃輪2之緊鄰後方、一邊 對刻劃線2貼附黏著帶材11，因此碎屑接觸黏著帶材11之黏著面並黏著固定，防止其往周圍之飛散。 Thus, the pasting device 29 follows the rear side and the side of the scoring wheel 2 The adhesive tape 11 is attached to the score line 2, so that the debris contacts the adhesive surface of the adhesive tape 11 and is adhered to prevent it from scattering to the surroundings.

一旦利用刻劃輪2之刻劃作業完成，接著利用黏貼裝置29 之黏著帶材11之貼附亦完成，則刻劃輪2及黏貼裝置29，如圖4所示般於脆性材料基板1之端部待機。 Once the scribe operation using the scoring wheel 2 is completed, the adhesive device 29 is used. The attachment of the adhesive tape 11 is also completed, and the scoring wheel 2 and the attaching device 29 stand by at the end of the brittle material substrate 1 as shown in FIG.

接著，為了去除黏著帶材11，使剝離裝置32往與黏貼裝置 29之移動方向為同一方向移動，而從脆性材料基板1之表面剝取黏著帶材11。剝離裝置32，如圖5所示般從脆性材料基板1之一端部側開始剝取黏著帶材11，沿著與黏貼裝置29相同軌跡移動。 Next, in order to remove the adhesive tape 11, the peeling device 32 is brought to the adhesive device The moving direction of 29 is moved in the same direction, and the adhesive tape 11 is peeled off from the surface of the brittle material substrate 1. As shown in FIG. 5, the peeling device 32 peels the adhesive tape 11 from one end side of the brittle material substrate 1, and moves along the same trajectory as the pasting device 29.

剝離裝置32，具有由多個輥子35、36、37構成之剝離輥子 部(參照圖2)。多個輥子之中，輥子35，具有在將黏著帶材11貼附於脆性材料基板1上時，以不形成皺紋之方式賦予張力之功能。此外，輥子36，在剝取黏著帶材11時，以往與貼附面相反側反轉之方式，而容易地進行從脆性材料基板1之表面之去除。進一步地，輥子37，具有防止黏著帶材11鬆弛而下垂之功能。 The peeling device 32 has a peeling roller composed of a plurality of rollers 35, 36, 37 Department (see Figure 2). Among the plurality of rollers, the roller 35 has a function of imparting tension so as not to form wrinkles when the adhesive tape 11 is attached to the brittle material substrate 1. Further, when the adhesive tape 11 is peeled off, the roller 36 is easily removed from the surface of the brittle material substrate 1 so as to be reversed from the side opposite to the attachment surface. Further, the roller 37 has a function of preventing the adhesive tape 11 from sagging and sagging.

在本實施形態中，雖以將輥子限定為3個而進行說明，但並 不限制輥子之個數，亦可根據狀況而除去一部分輥子、或追加輥子而構成為具有穩定性。 In the present embodiment, the description will be made by limiting the number of rollers to three. The number of the rolls is not limited, and a part of the rolls or an additional roll may be removed depending on the situation to have stability.

一旦藉由剝離裝置32完成黏著帶材11之剝除作業，則刻劃 輪2、黏貼裝置29、及剝離裝置32開始進行往原本位置之返回。一旦刻劃輪2、黏貼裝置29及剝離裝置32開始進行往原本位置之返回動作，則黏著帶材回收輪30進行旋轉而捲繞黏著帶材11並進行回收。將由脆性材料基板1所產生之碎屑，以附著於黏著帶材11之黏著面之狀態，捲繞於黏著帶材回收輪30而回收保管。藉此，可防止碎屑之往外部飛散。 Once the stripping operation of the adhesive strip 11 is completed by the stripping device 32, the scribing is performed The wheel 2, the pasting device 29, and the stripping device 32 begin the return to the original position. When the scoring wheel 2, the attaching device 29, and the peeling device 32 start the returning operation to the original position, the adhesive tape collecting wheel 30 rotates to wind the adhesive tape 11 and collect it. The crumbs generated by the brittle material substrate 1 are wound around the adhesive tape of the adhesive tape 11 and are wound around the adhesive tape collecting wheel 30 to be stored and stored. Thereby, the debris can be prevented from scattering to the outside.

如此，根據本實施形態之刻劃用碎屑去除裝置，藉由利用黏著帶材11覆蓋刻劃線上之方式，可防止碎屑往作業場所內之周邊空間飛散。 As described above, according to the swarf removing device of the present embodiment, by covering the scribe line with the adhesive tape 11, it is possible to prevent the debris from scattering to the surrounding space in the work place.

以上，雖已參照所附之圖式，對本發明之實施形態之一例進 行了說明，但本發明並不限定於上述之實施形態，在不脫離申請專利範圍之技術性思想之範圍內，當然可進行各種之變更與變形。 Hereinabove, with reference to the attached drawings, an example of an embodiment of the present invention is The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention.

1‧‧‧脆性材料基板 1‧‧‧Battery material substrate

2、2a‧‧‧刻劃輪 2, 2a‧‧‧ marking wheel

11‧‧‧黏著帶材 11‧‧‧Adhesive strip

22、22a‧‧‧黏貼輥子 22, 22a‧‧‧Adhesive rollers

28、28a‧‧‧帶材供給輪 28, 28a‧‧‧Feed supply wheel

29、29a‧‧‧黏貼裝置 29, 29a‧‧‧Adhesive device

30、30a‧‧‧黏著帶材回收輪 30, 30a‧‧‧Adhesive strip recycling wheel

32、32a‧‧‧剝離裝置 32, 32a‧‧‧ peeling device

35、36、37‧‧‧輥子 35, 36, 37‧‧‧ Rolls

Claims (3)

一種脆性材料基板之刻劃用碎屑去除裝置，其特徵在於，具備：刻劃輪，係對脆性材料基板之任一面或兩面形成刻劃線；黏貼裝置，係沿該刻劃線一邊貼附黏著帶材一邊進行移動；以及剝離裝置，係將已貼附之該黏著帶材從該脆性材料基板剝取並進行回收。 A chip removing device for scribing a brittle material substrate, comprising: a scoring wheel for forming a scribe line on either or both sides of a brittle material substrate; and an adhesive device attached along the scribe line The adhesive tape is moved while moving; and the peeling device removes the adhered tape from the brittle material substrate and recovers it. 如申請專利範圍第1項之脆性材料基板之刻劃用碎屑去除裝置，其中，該黏貼裝置，具備：供給該黏著帶材之帶材供給輪、以及使從該帶材供給輪供給之該黏著帶材密接於該脆性材料基板並貼附之黏貼輥子。 A chip removing device for marking a brittle material substrate according to the first aspect of the invention, wherein the bonding device comprises: a tape supply wheel for supplying the adhesive tape; and the supply of the tape supply wheel The adhesive tape is adhered to the brittle material substrate and attached to the adhesive roller. 如申請專利範圍第1項之脆性材料基板之刻劃用碎屑去除裝置，其中，該剝離裝置，具備：將已貼附於該脆性材料基板之該黏著帶材一邊從該脆性材料基板之表面反轉一邊剝取之剝離輥子部、以及對由該剝離輥子部剝起之該黏著帶材進行回收之黏著帶材回收輪。 The chip removing device for marking a brittle material substrate according to claim 1, wherein the peeling device comprises: attaching the adhesive tape attached to the brittle material substrate from a surface of the brittle material substrate The peeling roller portion that is peeled off and the adhesive tape collecting wheel that collects the adhesive tape stripped by the peeling roller portion are reversed.
TW102134056A 2012-12-27 2013-09-23 Debris removal device for scribing of brittle material substrates TWI598202B (en)

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TWI598202B true TWI598202B (en) 2017-09-11

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JPS5028750A (en) * 1973-07-13 1975-03-24
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JP4198601B2 (en) * 2002-04-01 2008-12-17 三星ダイヤモンド工業株式会社 Method of dividing brittle material substrate and cutting apparatus using the method
JP2005219951A (en) * 2004-02-04 2005-08-18 Mitsuboshi Diamond Industrial Co Ltd Scribing unit for brittle substrate and scribing method using the same
JP2006075940A (en) * 2004-09-09 2006-03-23 Nitto Denko Corp Method and device for cutting protective tape for semiconductor wafer
JP2008094692A (en) * 2006-10-16 2008-04-24 Seiko Epson Corp Apparatus and method for removing glass cullet, and breaking apparatus
JP2009204647A (en) * 2008-02-26 2009-09-10 Seiko Epson Corp Method of manufacturing electrooptic device
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TW201424969A (en) 2014-07-01
CN103895115B (en) 2017-04-12

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