TWI593918B - Light emitting module - Google Patents
Light emitting module Download PDFInfo
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- TWI593918B TWI593918B TW104122012A TW104122012A TWI593918B TW I593918 B TWI593918 B TW I593918B TW 104122012 A TW104122012 A TW 104122012A TW 104122012 A TW104122012 A TW 104122012A TW I593918 B TWI593918 B TW I593918B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
- Electroluminescent Light Sources (AREA)
Description
本發明是有關於一種發光模組，且特別是有關於一種具有光調整層之發光模組。 The invention relates to a lighting module, and in particular to a lighting module with a light adjusting layer.
發光二極體(Light-Emitting Diode,LED)為常見之點光源，其具有高亮度、壽命長及省電等優點。然而，當LED應用在大面積之平面照明裝置或直下式LED電視時，常需設置大量的LED，以滿足照明之需求。此外，LED的發光波長與發光強度容易受LED之封裝體影響，導致LED之間因發光波長或發光強度之差異造成發光模組之光色或出光量不均勻。 Light-Emitting Diode (LED) is a common point source, which has the advantages of high brightness, long life and power saving. However, when LEDs are used in large-area planar lighting devices or direct-lit LED televisions, it is often necessary to provide a large number of LEDs to meet the needs of lighting. In addition, the light-emitting wavelength and the light-emitting intensity of the LED are easily affected by the package of the LED, resulting in uneven light color or light output of the light-emitting module due to the difference in light-emitting wavelength or light-emitting intensity between the LEDs.
為了調整發光模組之光學效果，習知作法係在電路板上以雙面膠貼附一反射片，以增加光反射的效果。反射片設置於透鏡的下方，其大小與各透鏡面積大致上相同，用以調整由發光元件出光之光線路徑及光量。然而，反射片的耐熱性較差，在高溫環境下使用容易剝離或造成雙面膠的黏性變差，且太靠近LED而受熱，容易產生變形或變質，影響其可靠度。 In order to adjust the optical effect of the light-emitting module, a conventional method is to attach a reflective sheet on the circuit board with double-sided tape to increase the effect of light reflection. The reflection sheet is disposed under the lens and has a size substantially the same as the lens area for adjusting the light path and the amount of light emitted by the light-emitting element. However, the heat resistance of the reflective sheet is poor, and it is easy to peel off in a high-temperature environment or cause the adhesiveness of the double-sided adhesive to be deteriorated, and is too close to the LED to be heated, which is liable to be deformed or deteriorated, thereby affecting the reliability.
本發明係有關於一種發光模組，具有穩定性佳且可 靠度高的光調整層，藉以調整發光元件之光線路徑、光量及/或光色。 The invention relates to a lighting module, which has good stability and can be A light-adjusting layer with a high degree of dependence is used to adjust the light path, amount of light, and/or color of the light-emitting element.
根據本發明之一方面，提出一種發光模組，包括一電路板、一光調整層、一發光元件以及一光學透鏡。光調整層鋪設於電路板表面，光調整層可具有調整光線路徑、光量或光色之功能，光調整層於電路板之一光學調整區內具有一第一厚度，且光調整層於光學調整區外具有一第二厚度，其中第一厚度大於第二厚度。發光元件配置於電路板上。光學透鏡位於電路板上並覆蓋發光元件，且光學透鏡位置對應於光學調整區。 According to an aspect of the invention, a light emitting module includes a circuit board, a light adjusting layer, a light emitting element, and an optical lens. The light adjustment layer is disposed on the surface of the circuit board, and the light adjustment layer has a function of adjusting a light path, a light quantity or a light color. The light adjustment layer has a first thickness in an optical adjustment area of the circuit board, and the light adjustment layer is optically adjusted. The outer portion has a second thickness, wherein the first thickness is greater than the second thickness. The light emitting element is disposed on the circuit board. The optical lens is located on the circuit board and covers the light emitting element, and the optical lens position corresponds to the optical adjustment area.
為了對本發明之上述及其他方面有更佳的瞭解，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下： In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:
100‧‧‧燈源 100‧‧‧Light source
102‧‧‧燈殼 102‧‧‧Light shell
104‧‧‧燈條 104‧‧‧Light strips
106‧‧‧發光單元 106‧‧‧Lighting unit
110、111‧‧‧發光模組 110, 111‧‧‧Lighting Module
112‧‧‧電路板 112‧‧‧Circuit board
113‧‧‧電極 113‧‧‧Electrode
114、124‧‧‧光調整層 114, 124‧‧‧Light adjustment layer
114a、124a‧‧‧第一調整層 114a, 124a‧‧‧ first adjustment layer
114b、124b‧‧‧第二調整層 114b, 124b‧‧‧ second adjustment layer
115‧‧‧固定接點 115‧‧‧Fixed joints
116‧‧‧發光元件 116‧‧‧Lighting elements
117‧‧‧電極 117‧‧‧electrode
118‧‧‧光學透鏡 118‧‧‧ optical lens
119‧‧‧固定件 119‧‧‧Fixed parts
D1、D2‧‧‧厚度 D1, D2‧‧‧ thickness
E1、E2‧‧‧厚度 E1, E2‧‧‧ thickness
LA‧‧‧光學調整區 LA‧‧‧Optical adjustment area
第1圖繪示一種燈源的示意圖。 Figure 1 is a schematic view of a light source.
第2圖繪示依照本發明一實施例之發光模組的示意圖。 FIG. 2 is a schematic diagram of a light emitting module according to an embodiment of the invention.
第3圖繪示依照本發明一實施例之發光模組的立體分解圖。 FIG. 3 is an exploded perspective view of a light emitting module according to an embodiment of the invention.
第4圖繪示依照本發明一實施例之發光模組的示意圖。 FIG. 4 is a schematic diagram of a light emitting module according to an embodiment of the invention.
以下係提出實施例進行詳細說明，實施例僅用以作為範例說明，並非用以限縮本發明欲保護之範圍。 The embodiments are described in detail below, and the embodiments are only intended to be illustrative and not intended to limit the scope of the invention.
請參照第1、2及3圖，其中第1圖繪示一種燈源100的示意圖，第2圖繪示依照本發明一實施例之發光模組110 的示意圖，第3圖繪示依照本發明一實施例之發光模組110的立體分解圖。其中，第2圖為第1圖之單一發光單元106沿著I-I線的剖面圖。此外，為了方便說明，第3圖之光學透鏡118僅有一部分以半圓剖面表示，以了解其內部結構。 Please refer to the figures 1 , 2 and 3 , wherein FIG. 1 is a schematic diagram of a light source 100, and FIG. 2 is a light emitting module 110 according to an embodiment of the invention. 3 is a perspective exploded view of a light emitting module 110 according to an embodiment of the invention. 2 is a cross-sectional view of the single light-emitting unit 106 of FIG. 1 taken along line I-I. Further, for convenience of explanation, only a part of the optical lens 118 of Fig. 3 is shown in a semicircular cross section to understand the internal structure thereof.
請參照第1圖，燈源100包括一燈殼102以及複數個燈條104。燈條104平行排列於燈殼102上，且每一燈條104上具有多個發光單元106，用以產生多個點光源。在一實施例中，此些發光單元106組成一預定面積的發光二極體陣列，以做為一背光模組或一平面照明裝置之面光源。在第1圖中雖未繪示光擴散板或其他光學膜片，但可想而知，此些發光單元106出射之光線可經由光學膜片均勻擴散，以得到均勻的面光源。以下針對單一發光單元106所構成的發光模組110進行說明。 Referring to FIG. 1 , the light source 100 includes a lamp housing 102 and a plurality of light bars 104 . The light strips 104 are arranged in parallel on the lamp housing 102, and each of the light strips 104 has a plurality of light emitting units 106 for generating a plurality of point light sources. In one embodiment, the light-emitting units 106 form a predetermined area of the LED array as a surface light source of a backlight module or a planar illumination device. Although the light diffusing plate or other optical film is not shown in Fig. 1, it is conceivable that the light emitted from the light emitting units 106 can be uniformly diffused through the optical film to obtain a uniform surface light source. Hereinafter, the light-emitting module 110 constituted by the single light-emitting unit 106 will be described.
請參照第2圖，發光模組110包括一電路板112、一光調整層114、一發光元件116以及一光學透鏡118。發光元件116配置於電路板112上，且發光元件116具有二電極117，用以電性連接電路板112。發光元件116為半導體發光元件，例如是由n型氮化物半導體層、多重量子井發光層以及p型氮化物半導體層堆疊而成，其在電壓驅動下，使流經n型氮化物半導體層之電子與流經p型氮化物半導體層之電洞於多重量子井發光層中結合而發光。在一實施例中，發光元件116可為一發光二極體(LED)之封裝體，其使用發光二極體之色光激發螢光粉，例如以藍光LED激發黃色螢光粉，或者是利用藍光LED激發紅、綠色螢光 粉，又或是利用紫外光LED激發紅、綠、藍三色螢光粉來產生白光。 Referring to FIG. 2 , the light emitting module 110 includes a circuit board 112 , a light adjusting layer 114 , a light emitting component 116 , and an optical lens 118 . The light emitting element 116 is disposed on the circuit board 112, and the light emitting element 116 has two electrodes 117 for electrically connecting the circuit board 112. The light-emitting element 116 is a semiconductor light-emitting element, for example, which is formed by stacking an n-type nitride semiconductor layer, a multiple quantum well light-emitting layer, and a p-type nitride semiconductor layer, and is driven by a voltage to drive through the n-type nitride semiconductor layer. The electrons are combined with the holes flowing through the p-type nitride semiconductor layer to emit light in the multiple quantum well light-emitting layers. In one embodiment, the light-emitting element 116 can be a light-emitting diode (LED) package that uses the color light of the light-emitting diode to excite the phosphor powder, for example, to excite the yellow phosphor powder with a blue LED, or to utilize blue light. LED stimulates red and green fluorescence Powder, or use ultraviolet light LED to stimulate red, green and blue fluorescent powder to produce white light.
光學透鏡118為一中空的透明腔體，其位於電路板112之表面上並覆蓋發光元件116，可使發光元件116射出的光線經由光學透鏡118之內外表面折射而改變光路，以產生二次光學效果。在本實施例中，為了得到較佳的二次光學效果，發光元件116與光學透鏡118之間的高度差維持不變，例如維持在0.05~0.1mm左右。例如，發光元件116的高度為0.8mm時，光學透鏡118的高度約為0.85~0.9mm之間，而發光元件116的高度為0.6時，光學透鏡118的高度約為0.65~0.7之間。 The optical lens 118 is a hollow transparent cavity which is located on the surface of the circuit board 112 and covers the light-emitting element 116. The light emitted from the light-emitting element 116 can be refracted through the inner and outer surfaces of the optical lens 118 to change the optical path to generate secondary optics. effect. In the present embodiment, in order to obtain a preferable secondary optical effect, the difference in height between the light-emitting element 116 and the optical lens 118 is maintained, for example, at about 0.05 to 0.1 mm. For example, when the height of the light-emitting element 116 is 0.8 mm, the height of the optical lens 118 is between 0.85 and 0.9 mm, and when the height of the light-emitting element 116 is 0.6, the height of the optical lens 118 is between 0.65 and 0.7.
此外，為了調整光線路徑、光量及/或光色，本實施例之光調整層114鋪設於電路板112的表面。光調整層114例如以反射油墨塗佈於電路板112上，用以反射可見光範圍380nm~700nm內的色光，以使發光模組110之反射光頻譜呈現均勻的色度，進而減少色偏情形發生。再者，光調整層114可為高反射率之白色油墨或其他顏色的油墨，例如反射率大於90%的白色油墨，以增加反射光量。 In addition, in order to adjust the light path, the amount of light, and/or the color of light, the light adjustment layer 114 of the present embodiment is laid on the surface of the circuit board 112. The light adjustment layer 114 is coated on the circuit board 112 by using a reflective ink, for example, to reflect the color light in the visible light range of 380 nm to 700 nm, so that the reflected light spectrum of the light emitting module 110 exhibits uniform chromaticity, thereby reducing the occurrence of color shift. . Furthermore, the light adjustment layer 114 can be a high reflectivity white ink or other color ink, such as a white ink having a reflectance greater than 90%, to increase the amount of reflected light.
請參照第2圖，光調整層114為雙層結構，其包括一第一調整層114a以及一第二調整層114b。第二調整層114b與部分第一調整層114a相疊，以使光調整層114於電路板112之一光學調整區LA內具有一第一厚度，即D1+D2，且光調整層114於光學調整區LA外具有一第二厚度，即D1。其中D1為第一調 整層114a的厚度，D2為第二調整層114b的厚度。 Referring to FIG. 2, the light adjustment layer 114 has a two-layer structure including a first adjustment layer 114a and a second adjustment layer 114b. The second adjustment layer 114b is overlapped with the portion of the first adjustment layer 114a such that the light adjustment layer 114 has a first thickness in the optical adjustment area LA of the circuit board 112, that is, D1+D2, and the light adjustment layer 114 is optical. The adjustment area LA has a second thickness outside the area LA, that is, D1. Where D1 is the first tune The thickness of the entire layer 114a, D2 is the thickness of the second adjustment layer 114b.
也就是說，本實施例利用二次油墨塗佈的方式於光學調整區LA內外形成有高度差的光調整層114，以取代習知在電路板112上貼附反射片的做法。二次油墨塗佈的方式包括下列步驟。首先，以網版印刷厚度D1之第一層油墨，以形成第一調整層114a於電路板112上，並對第一調整層114a進行烘烤。接著，以網版印刷厚度D2之第二層油墨，以形成第二調整層114b於位於光學調整區LA內的第一調整層114a上，並對第二調整層114b進行烘烤。 That is to say, in the present embodiment, the light adjustment layer 114 having the height difference is formed inside and outside the optical adjustment area LA by means of the secondary ink coating, instead of the conventional method of attaching the reflection sheet to the circuit board 112. The manner of secondary ink coating includes the following steps. First, the first layer of ink of the thickness D1 is screen-printed to form the first adjustment layer 114a on the circuit board 112, and the first adjustment layer 114a is baked. Next, the second layer of ink of the thickness D2 is screen-printed to form the second adjustment layer 114b on the first adjustment layer 114a located in the optical adjustment area LA, and the second adjustment layer 114b is baked.
二次油墨塗佈的方式可使層與層之間的接合性佳，不需以黏著劑貼合，因此可減少習知反射片貼合製程。此外，油墨可耐高溫，符合焊錫回焊溫度(約180~260℃)的要求，在高溫環境下使用不易變質，因此可避免習知反射片的耐熱性較差，在高溫環境下使用容易剝離或造成雙面膠的黏性變差。 The secondary ink coating method can improve the bonding property between the layers, and does not need to be adhered with an adhesive, so that the conventional reflective sheet bonding process can be reduced. In addition, the ink can withstand high temperature and meet the requirements of solder reflow temperature (about 180~260 °C). It is not easy to be deteriorated in high temperature environment. Therefore, it can avoid the poor heat resistance of the conventional reflective sheet, and it is easy to peel or use in high temperature environment. The viscosity of the double-sided tape is deteriorated.
由上述可知，光調整層114以油墨塗佈於電路板112上，耐熱溫度高(例如大於200℃)，不僅材料成本較反射片低、減少反射片貼合製程、接合度及可靠度較佳，且塗佈的厚度可透過調整油墨黏度而自由變化，因此只要增加油墨塗佈的高度，即可減少光行進於發光元件116、光學透鏡118與第二調整層114b之間的光程距離，進而調整光線路徑、光量及/或光色，以提昇二次光學效果。進一步說，增厚的油墨除了可縮短發光元件116之出光面與第二調整層114b之間的高度差，亦可縮短由出光面出射 的光線被光學透鏡118反射至第二調整層114b的光程距離以及自第二調整層114b再次反射至光學透鏡118的光程距離。 As can be seen from the above, the light adjustment layer 114 is coated on the circuit board 112 by ink, and has a high heat resistance temperature (for example, more than 200 ° C), which is not only lower in material cost than the reflection sheet, but also has better reflection sheet bonding process, bonding degree, and reliability. And the thickness of the coating can be freely changed by adjusting the viscosity of the ink. Therefore, as long as the height of the ink coating is increased, the optical path distance between the light-emitting element 116 and the optical lens 118 and the second adjustment layer 114b can be reduced. Then adjust the light path, amount of light and / or light color to enhance the secondary optical effect. Further, the thickened ink can shorten the height difference between the light-emitting surface of the light-emitting element 116 and the second adjustment layer 114b, and can also be shortened by the light-emitting surface. The light path reflected by the optical lens 118 to the second adjustment layer 114b and the optical path distance from the second adjustment layer 114b to the optical lens 118 again.
在一實施例中，第一調整層114a的厚度大於第二調整層114b的厚度，即D1>D2，但本發明不以此為限。第一調整層114a的厚度介於15~30微米之間，第二調整層114b的厚度介於25~100微米之間。亦即，光調整層114於光學調整區LA內的第一厚度(對應厚度D1+D2)可介於40~130微米之間，而光調整層114於光學調整區LA外的第二厚度(對應厚度D1)可介於15~30微米之間。 In an embodiment, the thickness of the first adjustment layer 114a is greater than the thickness of the second adjustment layer 114b, that is, D1>D2, but the invention is not limited thereto. The thickness of the first adjustment layer 114a is between 15 and 30 microns, and the thickness of the second adjustment layer 114b is between 25 and 100 microns. That is, the first thickness (corresponding thickness D1+D2) of the light adjustment layer 114 in the optical adjustment area LA may be between 40 and 130 micrometers, and the second thickness of the light adjustment layer 114 outside the optical adjustment area LA ( The corresponding thickness D1) can be between 15 and 30 microns.
在一實施例中，第一調整層114a與第二調整層114b皆為白色油墨，用以增加反射光量，且第一調整層114a與第二調整層114b較佳為反射率大於90%的白色油墨，以減少反射光之損耗率。在另一實施例中，第二調整層114b可為非白色油墨，例如藍色油墨、黑色油墨或灰色油墨等。藍色油墨可與螢光粉激發後之黃光混光以產生白光，黑色油墨可吸收反射光，以減少發光元件116的中心光強，灰色油墨的反光效果介於白色油墨與黑色油墨之間，藉以調整反射光量。因此，可根據上述內容選擇不同油墨材料的第二調整層114b來調整發光模組110之反射光頻譜。 In one embodiment, the first adjustment layer 114a and the second adjustment layer 114b are both white inks for increasing the amount of reflected light, and the first adjustment layer 114a and the second adjustment layer 114b are preferably white having a reflectance greater than 90%. Ink to reduce the loss rate of reflected light. In another embodiment, the second adjustment layer 114b can be a non-white ink, such as a blue ink, a black ink, or a gray ink. The blue ink can be mixed with the yellow light after the phosphor powder is excited to generate white light, and the black ink can absorb the reflected light to reduce the central light intensity of the light-emitting element 116. The reflective effect of the gray ink is between the white ink and the black ink. In order to adjust the amount of reflected light. Therefore, the second adjustment layer 114b of different ink materials can be selected according to the above content to adjust the reflected light spectrum of the light-emitting module 110.
請參照第2及3圖，光學調整區LA的形狀可為圓形、矩形或不規則形，其大小大致上與光學透鏡118的面積及形狀相關。光學調整區LA的面積可大於或等於光學透鏡118覆蓋於電路板112上的面積。也就是說，第一調整層114a主要用以調 整光學調整區LA外的反射光，第二調整層114b主要用以調整光學透鏡118覆蓋區域內的反射光，並藉由具有高度差的第一調整層114a與第二調整層114b來減少光行進於發光元件116、光學透鏡118與第二調整層114b三者之間的光程距離，進而調整光線路徑、光量及/或光色。 Referring to FIGS. 2 and 3, the shape of the optical adjustment area LA may be circular, rectangular or irregular, and its size is substantially related to the area and shape of the optical lens 118. The area of the optical adjustment area LA may be greater than or equal to the area of the optical lens 118 overlying the circuit board 112. That is to say, the first adjustment layer 114a is mainly used to adjust The second adjustment layer 114b is mainly used to adjust the reflected light in the coverage area of the optical lens 118, and reduces the light by the first adjustment layer 114a and the second adjustment layer 114b having the height difference. The optical path distance between the light-emitting element 116, the optical lens 118, and the second adjustment layer 114b is further adjusted to adjust the light path, the amount of light, and/or the color of light.
另外，電路板112於該光學調整區LA內設有多個電性接點113，例如兩個，用以電性連接發光元件116之電極117。此外，光學透鏡118具有多個固定件119，例如是3個由光學透鏡118的底部往電路板112延伸之突出部。電路板112對應於此些固定件119之位置設有多個固定接點115，此些固定件119貫穿該光學調整層114而固定於相對應之固定接點115上。因此，發光元件116被容置在光學透鏡118以及光學調整層114所圍成之空間內，且固定件119還可以黏膠固定在固定接點115上。 In addition, the circuit board 112 is provided with a plurality of electrical contacts 113, for example two, in the optical adjustment area LA for electrically connecting the electrodes 117 of the light-emitting elements 116. Further, the optical lens 118 has a plurality of fixing members 119, for example, three projections extending from the bottom of the optical lens 118 toward the circuit board 112. The circuit board 112 is provided with a plurality of fixed contacts 115 corresponding to the positions of the fixing members 119. The fixing members 119 are fixed to the corresponding fixed contacts 115 through the optical adjusting layer 114. Therefore, the light-emitting element 116 is accommodated in the space enclosed by the optical lens 118 and the optical adjustment layer 114, and the fixing member 119 can also be adhesively fixed on the fixed contact 115.
本實施例之發光模組110雖未繪示螢光層或波長轉換層，但可想而知，發光元件116可藉由塗佈在光學透鏡118內壁的螢光層或覆蓋在發光元件116周圍之螢光層來改變其發光光譜，例如以藍光波長或紫外光波長的光線照射黃色或紅色螢光層後，可發出黃光波長或紅光波長的光線。當紅光、藍光及綠光混合之後，可產生全波段的白光，以改善發光光譜的色均勻度。 Although the light-emitting module 110 of the present embodiment does not show a phosphor layer or a wavelength conversion layer, it is conceivable that the light-emitting element 116 can be coated on the inner surface of the optical lens 118 or covered by the light-emitting element 116. The surrounding phosphor layer changes its luminescence spectrum. For example, when the yellow or red luminescent layer is irradiated with light of a blue wavelength or an ultraviolet wavelength, light of a yellow wavelength or a red wavelength can be emitted. When red, blue, and green light are mixed, a full range of white light can be produced to improve the color uniformity of the luminescence spectrum.
請參照第4圖，其繪示依照本發明一實施例之發光模組110的示意圖。第4圖為第1圖之單一發光單元106沿著I-I 線的剖面圖。有關電路板112、發光元件116、光學透鏡118等構件，已於第一實施例中詳細介紹，相同的元件以相同的元件符號表示，在此不再贅述。 Please refer to FIG. 4 , which is a schematic diagram of a light emitting module 110 according to an embodiment of the invention. Figure 4 is a single illumination unit 106 of Figure 1 along the I-I A cross-sectional view of the line. The components of the circuit board 112, the light-emitting element 116, the optical lens 118, and the like have been described in detail in the first embodiment, and the same components are denoted by the same reference numerals and will not be described again.
本實施例之發光模組111不同之處在於：光調整層124包括一第一調整層124a以及一第二調整層124b。第一調整層124a具有一厚度E1(對應於第一實施例之厚度D1)，第二調整層124b具有一厚度E2(對應於第一實施例之厚度D1+D2)，厚度E2大於厚度E1。亦即，光調整層124係由不同厚度的第一調整層124a與第二調整層124b所組成，以使光調整層124具有高度差(即，光調整層124具有第一厚度以及第二厚度)。 The illumination module 111 of the embodiment is different in that the light adjustment layer 124 includes a first adjustment layer 124a and a second adjustment layer 124b. The first adjustment layer 124a has a thickness E1 (corresponding to the thickness D1 of the first embodiment), and the second adjustment layer 124b has a thickness E2 (corresponding to the thickness D1+D2 of the first embodiment), and the thickness E2 is greater than the thickness E1. That is, the light adjustment layer 124 is composed of the first adjustment layer 124a and the second adjustment layer 124b of different thicknesses such that the light adjustment layer 124 has a height difference (ie, the light adjustment layer 124 has the first thickness and the second thickness). ).
請參照第4圖，第一調整層124a位於電路板112之光學調整區LA外，第二調整層124b位於光學調整區LA內，且第一調整層124a與第二調整層124b不相重疊。本實施例可利用二次油墨塗佈的方式於光學調整區LA內外形成有高度差的光調整層124，以取代習知在電路板上貼附反射片的做法。 Referring to FIG. 4, the first adjustment layer 124a is located outside the optical adjustment area LA of the circuit board 112, the second adjustment layer 124b is located in the optical adjustment area LA, and the first adjustment layer 124a and the second adjustment layer 124b do not overlap. In this embodiment, a light-adjusting layer 124 having a height difference is formed inside and outside the optical adjustment area LA by means of secondary ink coating, instead of conventionally attaching a reflective sheet on a circuit board.
二次油墨塗佈的方式包括下列步驟。首先，以網版印刷厚度E1之第一油墨，以形成第一調整層124a於光學調整區LA外，並對第一調整層124a進行烘烤。接著，以網版印刷厚度大於厚度E1之第二油墨，以形成第二調整層124b於光學調整區LA內，並對第二調整層124b進行烘烤。在一實施例中，光調整層124於光學調整區LA內的第一厚度(對應厚度E2)可介於40~130微米之間，而光調整層124於光學調整區LA外的第二厚 度(對應厚度E1)可介於15~30微米之間。 The manner of secondary ink coating includes the following steps. First, the first ink of the thickness E1 is screen-printed to form the first adjustment layer 124a outside the optical adjustment area LA, and the first adjustment layer 124a is baked. Next, the second ink having a thickness greater than the thickness E1 is screen-printed to form the second adjustment layer 124b in the optical adjustment area LA, and the second adjustment layer 124b is baked. In an embodiment, the first thickness (corresponding to the thickness E2) of the light adjustment layer 124 in the optical adjustment area LA may be between 40 and 130 micrometers, and the second thickness of the light adjustment layer 124 outside the optical adjustment area LA. The degree (corresponding to the thickness E1) can be between 15 and 30 microns.
因此，第一調整層124a主要用以調整光學調整區LA外的反射光，第二調整層124b主要用以調整光學透鏡118覆蓋區域內的反射光，並藉由具有高度差的第一調整層124a與第二調整層124b來減少光行進於發光元件116、光學透鏡118與第二調整層124b三者之間的光程距離，進而調整光線路徑、光量及/或光色。 Therefore, the first adjustment layer 124a is mainly used to adjust the reflected light outside the optical adjustment area LA, and the second adjustment layer 124b is mainly used to adjust the reflected light in the coverage area of the optical lens 118, and the first adjustment layer has a height difference. The 124a and the second adjustment layer 124b reduce the optical path distance between the light-emitting element 116, the optical lens 118, and the second adjustment layer 124b, thereby adjusting the light path, the amount of light, and/or the color of light.
本發明上述實施例所揭露之發光模組，係利用耐熱溫度高(例如大於200℃)之油墨做為光調整層，不僅材料成本較反射片低、減少反射片貼合製程、接合度及可靠度較佳，且塗佈的厚度可透過調整油墨黏度而自由變化，因此只要增加反射油墨塗佈的高度，即可減少光行進於發光元件、光學透鏡與光調整層之間的光程距離，進而調整光線路徑、光量及/或光色，以提昇二次光學效果。 The light-emitting module disclosed in the above embodiments of the present invention uses an ink having a high heat-resisting temperature (for example, greater than 200 ° C) as a light-adjusting layer, which not only has a lower material cost than the reflective sheet, but also reduces the reflective sheet bonding process, the bonding degree, and the reliability. The degree is better, and the thickness of the coating can be freely changed by adjusting the viscosity of the ink. Therefore, as long as the height of the reflective ink coating is increased, the optical path distance between the light-emitting element, the optical lens and the light-adjusting layer can be reduced. Then adjust the light path, amount of light and / or light color to enhance the secondary optical effect.
綜上所述，雖然本發明已以較佳實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
110‧‧‧發光模組 110‧‧‧Lighting module
112‧‧‧電路板 112‧‧‧Circuit board
113‧‧‧電極 113‧‧‧Electrode
114‧‧‧光調整層 114‧‧‧Light adjustment layer
114a‧‧‧第一調整層 114a‧‧‧First adjustment layer
114b‧‧‧第二調整層 114b‧‧‧Second adjustment layer
116‧‧‧發光元件 116‧‧‧Lighting elements
117‧‧‧電極 117‧‧‧electrode
118‧‧‧光學透鏡 118‧‧‧ optical lens
119‧‧‧固定件 119‧‧‧Fixed parts
D1、D2‧‧‧厚度 D1, D2‧‧‧ thickness
LA‧‧‧光學調整區 LA‧‧‧Optical adjustment area
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| CN107489891A (en) * | 2016-06-12 | 2017-12-19 | 欧司朗股份有限公司 | Light emitting module and its manufacture method |
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| US11515456B2 (en) * | 2019-02-21 | 2022-11-29 | Innolux Corporation | LED with light adjusting layer extending past the LED |
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| CN114299826B (en) * | 2022-01-19 | 2023-12-26 | 深圳市奥视微科技有限公司 | Display module, display equipment and optical path adjusting method of display module |
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